WO2019071586A1 - Deep ultraviolet led light-emitting structure and light-emitting device - Google Patents
Deep ultraviolet led light-emitting structure and light-emitting device Download PDFInfo
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- WO2019071586A1 WO2019071586A1 PCT/CN2017/106120 CN2017106120W WO2019071586A1 WO 2019071586 A1 WO2019071586 A1 WO 2019071586A1 CN 2017106120 W CN2017106120 W CN 2017106120W WO 2019071586 A1 WO2019071586 A1 WO 2019071586A1
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- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 15
- 229910002704 AlGaN Inorganic materials 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
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- the present invention relates to the field of semiconductor technology, and in particular, to a deep ultraviolet LED light emitting structure and a deep ultraviolet LED light emitting device.
- the deep ultraviolet LED refers to an LED having an emission wavelength of 280 nm or less.
- LED is mostly made of a semiconductor material of AlGaN.
- the crystal quality of AlGaN is poor, and good doping and ohmic contact cannot be achieved, resulting in low efficiency of deep ultraviolet LED illumination of AlGaN materials.
- the light emitted from the P-type AlGaN side of the ultraviolet LED light-emitting device of the prior art does not form an effective output, resulting in low optical power.
- An object of the present invention is to provide a deep ultraviolet LED light emitting structure and a deep ultraviolet LED light emitting device having the above light emitting structure, in view of the above drawbacks of the prior art.
- the object of the present invention can be achieved by the following technical measures:
- the present invention provides a deep ultraviolet LED light emitting structure comprising a first semiconductor layer, a reflective layer including at least one reflective unit, an active layer and a second semiconductor layer, which are sequentially stacked; the reflective unit includes a plurality of a first refractive layer and a plurality of second refractive layers, wherein the first refractive layer and the second refractive layer are alternately stacked, and the refractive index of the first refractive layer is greater than the refractive index of the second refractive layer.
- the reflective layer comprises a plurality of spaced apart reflective columns, each reflective column comprising a reflective unit or a plurality of reflective units arranged in a stack.
- the upper surface of the first refractive layer is a flat surface
- the lower surface is a concave curved surface
- the upper surface of the second refractive layer is a convex curved surface matching the concave curved surface
- the lower surface is a flat surface
- the second refractive layer has an arcuate cross section, and the intermediate thicknesses of the first refractive layer and the second refractive layer are respectively a first thickness and a second thickness, and the first thickness is (center wavelength + 2) ⁇
- the refractive index of a refractive layer is 4.15
- the second thickness is (center wavelength + 2) ⁇ refractive index of the second refractive layer / 4.15.
- the first refractive layer and the second refractive layer are each provided with a plurality of spaced protrusions, and the protrusions in the adjacent two refractive layers are staggered.
- the reflective layer or the reflective pillar comprises a first reflective unit and a second reflective unit that are vertically staggered, the refractive index of the first reflective unit being greater than the refractive index of the second reflective unit;
- the first reflection The unit includes a plurality of first sub-refractive layers and a plurality of second sub-refractive layers, wherein the first sub-refractive layer and the second sub-refractive layer are alternately stacked;
- the second reflective unit includes a plurality of third sub-refractive layers and a fourth sub-refracting layer, wherein the third sub-refracting layer and the fourth sub-refracting layer are alternately stacked.
- a difference between a refractive index of the first reflective unit and a refractive index of the second reflective unit is 0.15 to 0.35; the first sub-refractive layer, the second sub-refracting layer, the third sub-refracting layer, and fourth sub-refractive layer by Al X Ga 1-X N materials, different sub-refractive layer Al X Ga 1-X N X values of different materials, where, 0 ⁇ X ⁇ 1.
- a difference between a refractive index of the first reflective unit and a refractive index of the second reflective unit is 0.15 to 0.35; and the first sub-refractive layer and the third sub-refractive layer respectively have different Al values
- the X Ga 1-X N material is made of 0 ⁇ X ⁇ 1, and the second sub-refractive layer and the fourth sub-refractive layer are made of an AIN material.
- the light emitting structure further includes a substrate, a third semiconductor layer disposed between the reflective layer and the active layer, and a buffer layer disposed between the substrate and the second semiconductor layer,
- the first semiconductor layer is a P-type GaN layer
- the second semiconductor layer is an N-type AlGaN layer
- the third semiconductor layer is a P-type AlGaN layer
- the buffer layer is an AIN layer
- the active layer is grown An active layer of an AlGaN superlattice structure.
- the invention also provides a deep ultraviolet LED light emitting device, comprising:
- a second electrode disposed on the second semiconductor layer of the light emitting structure.
- the light emitting device further includes a substrate connected to both the first electrode and the second electrode, and the first surface of the substrate is provided with an insulating layer.
- the first region of the first surface of the substrate is formed with a first conductive layer
- the second region of the first surface of the substrate is formed with a second conductive layer
- the first electrode and the second electrode respectively pass through the first region
- a conductive layer and a second conductive layer are connected to the substrate.
- the deep ultraviolet LED light emitting structure and the light emitting device of the invention improve the structure of the reflective layer, form a more effective output, and improve the optical power.
- FIG. 1 is a schematic structural view of a deep ultraviolet LED light emitting structure according to a first embodiment of the present invention.
- FIG. 2 is a schematic structural view of a deep ultraviolet LED light emitting structure according to a second embodiment of the present invention.
- FIG 3 is a schematic view showing the structure of a reflective layer of a first preferred embodiment of the light-emitting structure of the present invention.
- FIG. 4 is a schematic view showing the structure of a reflective layer of a second preferred embodiment of the light-emitting structure of the present invention.
- Figure 5 is a schematic view showing the structure of a reflective layer of a third preferred embodiment of the light-emitting structure of the present invention.
- FIG. 6 is a schematic structural view of a preferred embodiment of a reflective layer in a deep ultraviolet LED light emitting structure according to a second embodiment of the present invention.
- Fig. 7 is a schematic structural view of a deep ultraviolet LED light emitting device according to a first embodiment of the present invention.
- Fig. 8 is a schematic structural view of a deep ultraviolet LED light emitting device according to a second embodiment of the present invention.
- the embodiment of the present invention provides a deep ultraviolet LED light emitting structure 100.
- the light emitting structure 100 includes a first semiconductor layer 31, a reflective layer 32, an active layer 33, and a first layer stacked in this order from bottom to top.
- the light emitting structure further includes a substrate 37, a third semiconductor layer 35 disposed between the active layer 33 and the reflective layer 32, and a buffer layer 36 disposed between the substrate 37 and the second semiconductor layer 34.
- the first semiconductor layer 31 is a P-type GaN layer
- the second semiconductor layer 34 is an N-type AlGaN layer
- the third semiconductor layer 35 is a P-type AlGaN layer
- the buffer layer 36 is an AIN layer.
- the second semiconductor layer 34 and the buffer layer 36 have the same area
- the third semiconductor layer 35 and the active layer 33 have the same area
- the active layer 33 is an active layer in which an AlGaN superlattice structure is grown.
- the reflective layer 32 is continuously disposed between the first semiconductor 31 and the active layer 33.
- the reflective layer 32 is discontinuously disposed between the first semiconductor 31 and the active layer 33, forming a plurality of cutouts, and the reflective layer 32 includes a plurality of spaced apart reflective pillars 32'.
- Each of the reflective pillars 32' includes a reflective unit or a plurality of reflective units arranged in a stack.
- the reflective layer 32 is composed of a reflective unit 32a including a plurality of first refractive layers 301 and a plurality of second refractive layers 302, first refractive layers 301 and The two refractive layers 302 are alternately stacked, and the refractive index of the first refractive layer 301 is greater than the refractive index of the second refractive layer 302.
- the lower surface of the first refractive layer 301 is a concave curved surface
- the upper surface of the second refractive layer 302 is a convex curved surface that cooperates with the concave curved surface.
- the second refractive layer 302 has an arcuate cross section, and the intermediate thicknesses of the first refractive layer 301 and the second refractive layer 302 are a first thickness h1 and a second thickness h2, respectively.
- the first thickness h1 is the thickness of the thinnest portion of the first refractive layer 301, extending from the upper surface of the first refractive layer 301 to the curved vertex of the lower surface;
- the second thickness h2 is the thickness of the thickest portion of the second refractive layer 302, from the first The curved vertex of the upper surface of the second refractive layer 302 extends to the lower surface.
- the first refractive layer 301 and the second refraction layer 302 are made of Al X Ga 1-X N material, the first refractive layer 301 and the material 1-X N X Al X Ga value 302 different from the second refractive layer, wherein , 0 ⁇ X ⁇ 1.
- the thickness of the reflecting unit 32a is 1 ⁇ m or less, and the total number of layers of the two refractive layers is 2 to 18 layers.
- the first thickness h1 is (center wavelength + 2) ⁇ the refractive index of the first refractive layer / 4.15
- the second thickness h2 is (center wavelength + 2) ⁇ the refractive index of the second refractive layer / 4.15, which can achieve 99.9% near the center wavelength.
- the reflection greatly improves the light-emitting efficiency of the bottom surface and improves the emission efficiency of the deep ultraviolet light.
- Each of the reflecting columns 32' may also adopt the structure shown in Fig. 3, and each of the reflecting columns 32' is a reflecting unit 32a.
- the reflective layer 32 is composed of a reflective unit 32b including a plurality of first refractive layers 301' and a plurality of second refractive layers 302', the first refractive layer 301
- the 'and the second refractive layer 302' are alternately stacked, and the first refractive layer 301' and the second refractive layer 302' are internally provided with a plurality of spaced-apart protrusions 303.
- the protrusions 303 in the adjacent two refractive layers are staggered, and the refractive index of the first refractive layer 301' is larger than the refractive index of the second refractive layer 302'.
- the protrusions 303 are preferably hemispherical, and the protrusions 303 are preferably made of an aluminum nitride (AlN) material, which achieves both electrical conductivity and reflection, and the reflectance of such a structure can reach 92%.
- AlN aluminum nitride
- Each of the reflecting columns 32' may also adopt the structure shown in Fig. 4, and each of the reflecting columns 32' is a reflecting unit 32b.
- the reflective layer 32 is composed of a plurality of vertically stacked reflective units, and the reflective layer 32 includes a first reflective unit 32c and a second reflective unit 32d which are vertically staggered and stacked, the first reflection
- the refractive index of the unit 32c is greater than the refractive index of the second reflective unit 32d
- the first reflective unit 32c includes a plurality of first sub-refractive layers 401 and a plurality of second sub-refracting layers 402, wherein the first sub-refracting layer 401 and the second The sub-refracting layers 402 are alternately stacked
- the second reflecting unit 32d includes a plurality of third sub-refracting layers 403 and a plurality of fourth sub-refracting layers 404, wherein the third sub-refracting layer 403 and the fourth sub-refracting layer 404 are alternately stacked.
- a difference between a refractive index of the first reflective unit 32c and a refractive index of the second reflective unit 32d is 0.15 to 0.35;
- the first sub-refractive layer 401, the second sub-refracting layer 402, and the third sub-refracting layer 403 and fourth sub-refractive layer 404 are made of Al X Ga 1-X N material, Al X Ga 1-X N different sub-refractive material layers different value X, where, 0 ⁇ X ⁇ 1.
- each of the first reflective unit 32c and the second reflective unit 32d is a superlattice structure layer, and the reflectance can reach 99.96%.
- each of the reflecting columns 32' may also adopt the structure shown in Fig. 5.
- each of the reflecting columns 32' includes a first reflecting unit 32c and a second reflecting unit 32d which are vertically staggered and stacked.
- the embodiment of the present invention further provides a deep ultraviolet LED light emitting device 200.
- the light emitting device 200 includes a substrate 10 , a first electrode 201 , a second electrode 202 , and a light emitting structure 100 . Please refer to the above for the structure, and I will not repeat them here.
- the first electrode 201 is disposed on the first semiconductor layer 31, and the second electrode 202 is disposed on the second semiconductor layer 34.
- the first surface of the substrate 10 is provided with an insulating layer 101, the first region of the first surface of the substrate 10 is formed with a first conductive layer 38a, and the second region of the first surface of the substrate 10 is formed with a second conductive layer 38b.
- the first electrode 201 and the second electrode 202 are connected to the substrate 10 through the first conductive layer 38a and the second conductive layer 38b, respectively.
- the other side of the first electrode 201 is connected to the first semiconductor layer 31, and the other end of the second electrode 202 is connected to the second semiconductor layer 34 via the isolation layer 36.
- the first electrode 201 is a positive electrode and the second electrode 202 is a negative electrode.
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Abstract
A deep ultraviolet LED light-emitting structure and a deep ultraviolet LED light-emitting device. The light-emitting device comprises a first electrode, a second electrode, and a light-emitting structure having a reflecting layer. The deep ultraviolet LED light-emitting structure and the deep ultraviolet LED light-emitting device improve the structure of the reflecting layer, thereby improving optical power.
Description
本发明涉及半导体技术领域,具体涉及一种深紫外LED发光结构以及一种深紫外LED发光器件。The present invention relates to the field of semiconductor technology, and in particular, to a deep ultraviolet LED light emitting structure and a deep ultraviolet LED light emitting device.
深紫外LED是指发光波长为280nm以下的LED,目前这种LED大都采用AlGaN的半导体材料制成。但是AlGaN的晶体质量较差,不能实现很好地掺杂以及欧姆接触,导致AlGaN材料的深紫外LED发光效率低下。The deep ultraviolet LED refers to an LED having an emission wavelength of 280 nm or less. Currently, such an LED is mostly made of a semiconductor material of AlGaN. However, the crystal quality of AlGaN is poor, and good doping and ohmic contact cannot be achieved, resulting in low efficiency of deep ultraviolet LED illumination of AlGaN materials.
现有技术中的紫外LED发光器件从P型AlGaN侧出射的光并不能形成有效输出,导致光功率低下。The light emitted from the P-type AlGaN side of the ultraviolet LED light-emitting device of the prior art does not form an effective output, resulting in low optical power.
鉴于此,克服以上现有技术中的缺陷,提供一种新的深紫外LED发光结构以及一种新的深紫外LED发光器件成为本领域亟待解决的技术问题。In view of the above, in order to overcome the defects in the prior art, it is a technical problem to be solved in the art to provide a new deep ultraviolet LED light emitting structure and a new deep ultraviolet LED light emitting device.
发明内容Summary of the invention
本发明的目的在于针对现有技术的上述缺陷,提供一种深紫外LED发光结构以及一种具有上述发光结构的深紫外LED发光器件。SUMMARY OF THE INVENTION An object of the present invention is to provide a deep ultraviolet LED light emitting structure and a deep ultraviolet LED light emitting device having the above light emitting structure, in view of the above drawbacks of the prior art.
本发明的目的可通过以下的技术措施来实现:The object of the present invention can be achieved by the following technical measures:
本发明提供了一种深紫外LED发光结构,该发光结构包括依次层叠设置的第一半导体层、包括至少一个反射单元的反射层、有源层和第二半导体层;所述反射单元包括多个第一折射层和多个第二折射层,其中,第一折射层和第二折射层交错堆叠,第一折射层的折射率大于第二折射层的折射率。The present invention provides a deep ultraviolet LED light emitting structure comprising a first semiconductor layer, a reflective layer including at least one reflective unit, an active layer and a second semiconductor layer, which are sequentially stacked; the reflective unit includes a plurality of a first refractive layer and a plurality of second refractive layers, wherein the first refractive layer and the second refractive layer are alternately stacked, and the refractive index of the first refractive layer is greater than the refractive index of the second refractive layer.
优选地,所述反射层包括多个间隔排列的反射柱,每个反射柱包括一个反射单元或多个层叠设置的反射单元。Preferably, the reflective layer comprises a plurality of spaced apart reflective columns, each reflective column comprising a reflective unit or a plurality of reflective units arranged in a stack.
优选地,所述第一折射层的上表面为平面、下表面为凹弧形面,所述第二折射层的上表面为与凹弧形面相配合的凸弧形面、下表面为平面。Preferably, the upper surface of the first refractive layer is a flat surface, and the lower surface is a concave curved surface, and the upper surface of the second refractive layer is a convex curved surface matching the concave curved surface, and the lower surface is a flat surface.
优选地,所述第二折射层的截面呈弓形,所述第一折射层和第二折射层的中间厚度分别为第一厚度和第二厚度,第一厚度为(中心波长+2)×第一折射层折射率/4.15,第二厚度为(中心波长+2)×第二折射层折射率/4.15。Preferably, the second refractive layer has an arcuate cross section, and the intermediate thicknesses of the first refractive layer and the second refractive layer are respectively a first thickness and a second thickness, and the first thickness is (center wavelength + 2) × The refractive index of a refractive layer is 4.15, and the second thickness is (center wavelength + 2) × refractive index of the second refractive layer / 4.15.
优选地,所述第一折射层和所述第二折射层内部均设有多个间隔排列的凸起,相邻两个折射层中的凸起交错排列。
Preferably, the first refractive layer and the second refractive layer are each provided with a plurality of spaced protrusions, and the protrusions in the adjacent two refractive layers are staggered.
优选地,所述反射层或反射柱包括纵向交错堆叠的第一反射单元和第二反射单元,所述第一反射单元的折射率大于所述第二反射单元的折射率;所述第一反射单元包括多个第一子折射层和多个第二子折射层,其中,第一子折射层和第二子折射层交错堆叠;所述第二反射单元包括多个第三子折射层和多个第四子折射层,其中,第三子折射层和第四子折射层交错堆叠。Preferably, the reflective layer or the reflective pillar comprises a first reflective unit and a second reflective unit that are vertically staggered, the refractive index of the first reflective unit being greater than the refractive index of the second reflective unit; the first reflection The unit includes a plurality of first sub-refractive layers and a plurality of second sub-refractive layers, wherein the first sub-refractive layer and the second sub-refractive layer are alternately stacked; the second reflective unit includes a plurality of third sub-refractive layers and a fourth sub-refracting layer, wherein the third sub-refracting layer and the fourth sub-refracting layer are alternately stacked.
优选地,所述第一反射单元的折射率与所述第二反射单元的折射率的差值为0.15~0.35;所述第一子折射层、第二子折射层、第三子折射层和第四子折射层均由AlXGa1-XN材料制成,不同子折射层的AlXGa1-XN材料中X数值不同,其中,0<X<1。Preferably, a difference between a refractive index of the first reflective unit and a refractive index of the second reflective unit is 0.15 to 0.35; the first sub-refractive layer, the second sub-refracting layer, the third sub-refracting layer, and fourth sub-refractive layer by Al X Ga 1-X N materials, different sub-refractive layer Al X Ga 1-X N X values of different materials, where, 0 <X <1.
优选地,所述第一反射单元的折射率与所述第二反射单元的折射率的差值为0.15~0.35;所述第一子折射层和第三子折射层分别由X数值不同的AlXGa1-XN材料制成,其中,0<X<1,所述第二子折射层和第四子折射层由AIN材料制成。Preferably, a difference between a refractive index of the first reflective unit and a refractive index of the second reflective unit is 0.15 to 0.35; and the first sub-refractive layer and the third sub-refractive layer respectively have different Al values The X Ga 1-X N material is made of 0<X<1, and the second sub-refractive layer and the fourth sub-refractive layer are made of an AIN material.
优选地,所述发光结构还包括衬底、设于反射层和有源层之间的第三半导体层、以及设于所述衬底和所述第二半导体层之间的缓冲层,所述第一半导体层为P型GaN层,所述第二半导体层为N型AlGaN层,所述第三半导体层为P型AlGaN层,所述缓冲层为AIN层,所述有源层为生长有AlGaN超晶格结构的有源层。Preferably, the light emitting structure further includes a substrate, a third semiconductor layer disposed between the reflective layer and the active layer, and a buffer layer disposed between the substrate and the second semiconductor layer, The first semiconductor layer is a P-type GaN layer, the second semiconductor layer is an N-type AlGaN layer, the third semiconductor layer is a P-type AlGaN layer, the buffer layer is an AIN layer, and the active layer is grown An active layer of an AlGaN superlattice structure.
本发明还提供了一种深紫外LED发光器件,包括:The invention also provides a deep ultraviolet LED light emitting device, comprising:
上述的深紫外LED发光结构;The above deep ultraviolet LED light emitting structure;
设于所述发光结构的第一半导体层的第一电极;和a first electrode disposed on the first semiconductor layer of the light emitting structure; and
设于所述发光结构的第二半导体层的第二电极。a second electrode disposed on the second semiconductor layer of the light emitting structure.
优选地,所述发光器件还包括与第一电极和第二电极均连接的基板,所述基板第一表面设有绝缘层。Preferably, the light emitting device further includes a substrate connected to both the first electrode and the second electrode, and the first surface of the substrate is provided with an insulating layer.
优选地,所述基板第一表面的第一区域形成有第一导电层,所述基板第一表面的第二区域形成有第二导电层,所述第一电极和第二电极分别通过第一导电层和第二导电层与所述基板连接。Preferably, the first region of the first surface of the substrate is formed with a first conductive layer, the second region of the first surface of the substrate is formed with a second conductive layer, and the first electrode and the second electrode respectively pass through the first region A conductive layer and a second conductive layer are connected to the substrate.
本发明的深紫外LED发光结构以及发光器件对反射层的结构进行了改进,形成了更有效的输出,提高了光功率。The deep ultraviolet LED light emitting structure and the light emitting device of the invention improve the structure of the reflective layer, form a more effective output, and improve the optical power.
图1是本发明第一实施例的深紫外LED发光结构的结构示意图。1 is a schematic structural view of a deep ultraviolet LED light emitting structure according to a first embodiment of the present invention.
图2是本发明第二实施例的深紫外LED发光结构的结构示意图。2 is a schematic structural view of a deep ultraviolet LED light emitting structure according to a second embodiment of the present invention.
图3是本发明发光结构中第一优选实施方式的反射层的结构示意图。
3 is a schematic view showing the structure of a reflective layer of a first preferred embodiment of the light-emitting structure of the present invention.
图4是本发明发光结构中第二优选实施方式的反射层的结构示意图。4 is a schematic view showing the structure of a reflective layer of a second preferred embodiment of the light-emitting structure of the present invention.
图5是本发明发光结构中第三优选实施方式的反射层的结构示意图。Figure 5 is a schematic view showing the structure of a reflective layer of a third preferred embodiment of the light-emitting structure of the present invention.
图6是本发明第二实施例的深紫外LED发光结构中反射层优选实施方式的结构示意图。6 is a schematic structural view of a preferred embodiment of a reflective layer in a deep ultraviolet LED light emitting structure according to a second embodiment of the present invention.
图7是本发明第一实施例的深紫外LED发光器件的结构示意图。Fig. 7 is a schematic structural view of a deep ultraviolet LED light emitting device according to a first embodiment of the present invention.
图8是本发明第二实施例的深紫外LED发光器件的结构示意图。Fig. 8 is a schematic structural view of a deep ultraviolet LED light emitting device according to a second embodiment of the present invention.
为了使本发明的目的、技术方案及优点更加清楚明白,下面结合附图和具体实施例对本发明作进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
为了使本揭示内容的叙述更加详尽与完备,下文针对本发明的实施方式与具体实施例提出了说明性的描述;但这并非实施或运用本发明具体实施例的唯一形式。实施方式中涵盖了多个具体实施例的特征以及用以建构与操作这些具体实施例的方法步骤与其顺序。然而,亦可利用其它具体实施例来达成相同或均等的功能与步骤顺序。The description of the embodiments of the present invention is intended to be illustrative and not restrictive The features of various specific embodiments, as well as the method steps and sequences thereof, are constructed and manipulated in the embodiments. However, other specific embodiments may be utilized to achieve the same or equivalent functions and sequence of steps.
本发明实施例提供了一种深紫外LED发光结构100,请参阅图1所示,该发光结构100包括:从下至上依次层叠的第一半导体层31、反射层32、有源层33和第二半导体层34,其中,反射层32包括至少一个反射单元。The embodiment of the present invention provides a deep ultraviolet LED light emitting structure 100. Referring to FIG. 1 , the light emitting structure 100 includes a first semiconductor layer 31, a reflective layer 32, an active layer 33, and a first layer stacked in this order from bottom to top. A second semiconductor layer 34, wherein the reflective layer 32 comprises at least one reflective unit.
进一步地,发光结构还包括衬底37、设于有源层33和反射层32之间的第三半导体层35、以及设于衬底37和第二半导体层34之间的缓冲层36。更进一步地,第一半导体层31为P型GaN层,第二半导体层34为N型AlGaN层,第三半导体层35为P型AlGaN层,缓冲层36为AIN层。第二半导体层34和缓冲层36面积相同,第三半导体层35和有源层33面积相同,有源层33为生长有AlGaN超晶格结构的有源层。Further, the light emitting structure further includes a substrate 37, a third semiconductor layer 35 disposed between the active layer 33 and the reflective layer 32, and a buffer layer 36 disposed between the substrate 37 and the second semiconductor layer 34. Further, the first semiconductor layer 31 is a P-type GaN layer, the second semiconductor layer 34 is an N-type AlGaN layer, the third semiconductor layer 35 is a P-type AlGaN layer, and the buffer layer 36 is an AIN layer. The second semiconductor layer 34 and the buffer layer 36 have the same area, the third semiconductor layer 35 and the active layer 33 have the same area, and the active layer 33 is an active layer in which an AlGaN superlattice structure is grown.
在图1所示的优选实施方式中,反射层32在第一半导体31和有源层33之间连续设置。In the preferred embodiment shown in FIG. 1, the reflective layer 32 is continuously disposed between the first semiconductor 31 and the active layer 33.
在图2所示的优选实施方式中,反射层32在第一半导体31和有源层33之间非连续设置,形成了若干挖空部,反射层32包括多个间隔排列的反射柱32’,每个反射柱32’包括一个反射单元或多个层叠设置的反射单元。In the preferred embodiment shown in FIG. 2, the reflective layer 32 is discontinuously disposed between the first semiconductor 31 and the active layer 33, forming a plurality of cutouts, and the reflective layer 32 includes a plurality of spaced apart reflective pillars 32'. Each of the reflective pillars 32' includes a reflective unit or a plurality of reflective units arranged in a stack.
在图3所示的第一种优选实施方式中,反射层32由一个反射单元构成,反射单元32a包括多个第一折射层301和多个第二折射层302,第一折射层301和第二折射层302交错堆叠,第一折射层301的折射率大于第二折射层302的折射率。为了更有利于光的反射,
第一折射层301的下表面为凹弧形面,第二折射层302的上表面为与凹弧形面相配合的凸弧形面。进一步地,第二折射层302的截面呈弓形,第一折射层301和第二折射层302的中间厚度分别为第一厚度h1和第二厚度h2。第一厚度h1为第一折射层301最薄处的厚度,从第一折射层301上表面延伸至下表面弧形顶点;第二厚度h2是第二折射层302最厚处的厚度,从第二折射层302上表面弧形顶点延伸至下表面。第一折射层301和第二折射层302均由AlXGa1-XN材料制成,第一折射层301和第二折射层302的AlXGa1-XN材料中X数值不同,其中,0<X<1。在本实施方式中,反射单元32a的厚度小于等于1μm,两种折射层的总层数为2~18层。第一厚度h1为(中心波长+2)×第一折射层折射率/4.15,第二厚度h2为(中心波长+2)×第二折射层折射率/4.15,可以实现中心波长附近99.9%的反射,大大地提高了底面出光效率,提高了深紫外光线的出射效率。In the first preferred embodiment shown in FIG. 3, the reflective layer 32 is composed of a reflective unit 32a including a plurality of first refractive layers 301 and a plurality of second refractive layers 302, first refractive layers 301 and The two refractive layers 302 are alternately stacked, and the refractive index of the first refractive layer 301 is greater than the refractive index of the second refractive layer 302. In order to facilitate the reflection of light, the lower surface of the first refractive layer 301 is a concave curved surface, and the upper surface of the second refractive layer 302 is a convex curved surface that cooperates with the concave curved surface. Further, the second refractive layer 302 has an arcuate cross section, and the intermediate thicknesses of the first refractive layer 301 and the second refractive layer 302 are a first thickness h1 and a second thickness h2, respectively. The first thickness h1 is the thickness of the thinnest portion of the first refractive layer 301, extending from the upper surface of the first refractive layer 301 to the curved vertex of the lower surface; the second thickness h2 is the thickness of the thickest portion of the second refractive layer 302, from the first The curved vertex of the upper surface of the second refractive layer 302 extends to the lower surface. The first refractive layer 301 and the second refraction layer 302 are made of Al X Ga 1-X N material, the first refractive layer 301 and the material 1-X N X Al X Ga value 302 different from the second refractive layer, wherein , 0 < X < 1. In the present embodiment, the thickness of the reflecting unit 32a is 1 μm or less, and the total number of layers of the two refractive layers is 2 to 18 layers. The first thickness h1 is (center wavelength + 2) × the refractive index of the first refractive layer / 4.15, the second thickness h2 is (center wavelength + 2) × the refractive index of the second refractive layer / 4.15, which can achieve 99.9% near the center wavelength. The reflection greatly improves the light-emitting efficiency of the bottom surface and improves the emission efficiency of the deep ultraviolet light.
每一个反射柱32’也可以采用图3所示的结构,每一个反射柱32’为一个反射单元32a。Each of the reflecting columns 32' may also adopt the structure shown in Fig. 3, and each of the reflecting columns 32' is a reflecting unit 32a.
在图4所示的第二种优选实施方式中,反射层32由一个反射单元构成,反射单元32b包括多个第一折射层301’和多个第二折射层302’,第一折射层301’和第二折射层302’交错堆叠,第一折射层301’和第二折射层302’内部均设有多个间隔排列的凸起303。相邻两个折射层中的凸起303交错排列,第一折射层301’的折射率大于第二折射层302’的折射率。凸起303优选为半球形,凸起303优选由氮化铝(AlN)材料制成,既实现了导电又实现了反射,此种结构反射率能够达到92%。In the second preferred embodiment shown in FIG. 4, the reflective layer 32 is composed of a reflective unit 32b including a plurality of first refractive layers 301' and a plurality of second refractive layers 302', the first refractive layer 301 The 'and the second refractive layer 302' are alternately stacked, and the first refractive layer 301' and the second refractive layer 302' are internally provided with a plurality of spaced-apart protrusions 303. The protrusions 303 in the adjacent two refractive layers are staggered, and the refractive index of the first refractive layer 301' is larger than the refractive index of the second refractive layer 302'. The protrusions 303 are preferably hemispherical, and the protrusions 303 are preferably made of an aluminum nitride (AlN) material, which achieves both electrical conductivity and reflection, and the reflectance of such a structure can reach 92%.
每一个反射柱32’也可以采用图4所示的结构,每一个反射柱32’为一个反射单元32b。Each of the reflecting columns 32' may also adopt the structure shown in Fig. 4, and each of the reflecting columns 32' is a reflecting unit 32b.
在图5所示的第三种优选实施方式中,反射层32由多个纵向堆叠的反射单元构成,反射层32包括纵向交错堆叠的第一反射单元32c和第二反射单元32d,第一反射单元32c的折射率大于第二反射单元32d的折射率;第一反射单元32c包括多个第一子折射层401和多个第二子折射层402,其中,第一子折射层401和第二子折射层402交错堆叠;第二反射单元32d包括多个第三子折射层403和多个第四子折射层404,其中,第三子折射层403和第四子折射层404交错堆叠。进一步地,第一反射单元32c的折射率与所述第二反射单元32d的折射率的差值为0.15~0.35;第一子折射层401、第二子折射层402、第三子折射层403和第四子折射层404均由AlXGa1-XN材料制成,不同子折射层的AlXGa1-XN材料中X数值不同,其中,0<X<1。在本实施例中,第一反射单元32c和第二反射单元32d中的每一层均为超晶格结构层,反射率能够达到99.96%。
In the third preferred embodiment shown in FIG. 5, the reflective layer 32 is composed of a plurality of vertically stacked reflective units, and the reflective layer 32 includes a first reflective unit 32c and a second reflective unit 32d which are vertically staggered and stacked, the first reflection The refractive index of the unit 32c is greater than the refractive index of the second reflective unit 32d; the first reflective unit 32c includes a plurality of first sub-refractive layers 401 and a plurality of second sub-refracting layers 402, wherein the first sub-refracting layer 401 and the second The sub-refracting layers 402 are alternately stacked; the second reflecting unit 32d includes a plurality of third sub-refracting layers 403 and a plurality of fourth sub-refracting layers 404, wherein the third sub-refracting layer 403 and the fourth sub-refracting layer 404 are alternately stacked. Further, a difference between a refractive index of the first reflective unit 32c and a refractive index of the second reflective unit 32d is 0.15 to 0.35; the first sub-refractive layer 401, the second sub-refracting layer 402, and the third sub-refracting layer 403 and fourth sub-refractive layer 404 are made of Al X Ga 1-X N material, Al X Ga 1-X N different sub-refractive material layers different value X, where, 0 <X <1. In this embodiment, each of the first reflective unit 32c and the second reflective unit 32d is a superlattice structure layer, and the reflectance can reach 99.96%.
每一个反射柱32’也可以采用图5所示的结构,请参阅图6所示,每一个反射柱32’包括纵向交错堆叠的第一反射单元32c和第二反射单元32d。Each of the reflecting columns 32' may also adopt the structure shown in Fig. 5. Referring to Fig. 6, each of the reflecting columns 32' includes a first reflecting unit 32c and a second reflecting unit 32d which are vertically staggered and stacked.
本发明实施例还提供了深紫外LED发光器件200,请参阅图7和图8所示,该发光器件200包括:基板10、第一电极201、第二电极202和发光结构100,发光结构100的结构请参见上述,在此不进行一一赘述。第一电极201设于第一半导体层31,第二电极202设于第二半导体层34。The embodiment of the present invention further provides a deep ultraviolet LED light emitting device 200. Referring to FIG. 7 and FIG. 8 , the light emitting device 200 includes a substrate 10 , a first electrode 201 , a second electrode 202 , and a light emitting structure 100 . Please refer to the above for the structure, and I will not repeat them here. The first electrode 201 is disposed on the first semiconductor layer 31, and the second electrode 202 is disposed on the second semiconductor layer 34.
其中,基板10的第一表面设有绝缘层101,基板10的第一表面的第一区域形成有第一导电层38a,基板10的第一表面的第二区域形成有第二导电层38b,第一电极201和第二电极202分别通过第一导电层38a和第二导电层38b与基板10连接。第一电极201另一侧与第一半导体层31连接,第二电极202另一端通过隔离层36与第二半导体层34连接。第一电极201为正电极,第二电极202为负电极。The first surface of the substrate 10 is provided with an insulating layer 101, the first region of the first surface of the substrate 10 is formed with a first conductive layer 38a, and the second region of the first surface of the substrate 10 is formed with a second conductive layer 38b. The first electrode 201 and the second electrode 202 are connected to the substrate 10 through the first conductive layer 38a and the second conductive layer 38b, respectively. The other side of the first electrode 201 is connected to the first semiconductor layer 31, and the other end of the second electrode 202 is connected to the second semiconductor layer 34 via the isolation layer 36. The first electrode 201 is a positive electrode and the second electrode 202 is a negative electrode.
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.
Claims (12)
- 一种深紫外LED发光结构,其特征在于,该发光结构包括依次层叠设置的第一半导体层、包括至少一个反射单元的反射层、有源层和第二半导体层;所述反射单元包括多个第一折射层和多个第二折射层,其中,第一折射层和第二折射层交错堆叠,第一折射层的折射率大于第二折射层的折射率。A deep ultraviolet LED light emitting structure, comprising: a first semiconductor layer, a reflective layer including at least one reflective unit, an active layer and a second semiconductor layer, which are sequentially stacked; the reflective unit includes a plurality of a first refractive layer and a plurality of second refractive layers, wherein the first refractive layer and the second refractive layer are alternately stacked, and the refractive index of the first refractive layer is greater than the refractive index of the second refractive layer.
- 根据权利要求1所述的深紫外LED发光结构,其特征在于,所述反射层包括多个间隔排列的反射柱,每个反射柱包括一个反射单元或多个层叠设置的反射单元。The deep ultraviolet LED light emitting structure according to claim 1, wherein the reflective layer comprises a plurality of spaced apart reflective columns, each of the reflective columns comprising a reflective unit or a plurality of reflective units arranged in a stack.
- 根据权利要求1或2所述的深紫外LED发光结构,其特征在于,所述第一折射层的上表面为平面、下表面为凹弧形面,所述第二折射层的上表面为与凹弧形面相配合的凸弧形面、下表面为平面。The deep ultraviolet LED light emitting structure according to claim 1 or 2, wherein the upper surface of the first refractive layer is a flat surface and the lower surface is a concave curved surface, and the upper surface of the second refractive layer is The convex curved surface and the lower surface of the concave curved surface are plane.
- 根据权利要求3所述的深紫外LED发光结构,其特征在于,所述第二折射层的截面呈弓形,所述第一折射层和第二折射层的中间厚度分别为第一厚度和第二厚度,第一厚度为(中心波长+2)×第一折射层折射率/4.15,第二厚度为(中心波长+2)×第二折射层折射率/4.15。The deep ultraviolet LED light emitting structure according to claim 3, wherein the second refractive layer has an arcuate cross section, and the intermediate thicknesses of the first refractive layer and the second refractive layer are respectively a first thickness and a second The thickness, the first thickness is (center wavelength + 2) × the refractive index of the first refractive layer / 4.15, the second thickness is (center wavelength + 2) × the refractive index of the second refractive layer / 4.15.
- 根据权利要求1或2所述的深紫外LED发光结构,其特征在于,所述第一折射层和所述第二折射层内部均设有多个间隔排列的凸起,相邻两个折射层中的凸起交错排列。The deep ultraviolet LED light emitting structure according to claim 1 or 2, wherein each of the first refractive layer and the second refractive layer is provided with a plurality of spaced protrusions, and two adjacent refractive layers. The bumps in the middle are staggered.
- 根据权利要求1或2所述的深紫外LED发光结构,其特征在于,所述反射层或反射柱包括纵向交错堆叠的第一反射单元和第二反射单元,所述第一反射单元的折射率大于所述第二反射单元的折射率;所述第一反射单元包括多个第一子折射层和多个第二子折射层,其中,第一子折射层和第二子折射层交错堆叠;所述第二反射单元包括多个第三子折射层和多个第四子折射层,其中,第三子折射层和第四子折射层交错堆叠。The deep ultraviolet LED light emitting structure according to claim 1 or 2, wherein the reflective layer or the reflective pillar comprises a first reflective unit and a second reflective unit which are vertically staggered and stacked, and a refractive index of the first reflective unit The first reflective unit includes a plurality of first sub-refractive layers and a plurality of second sub-refractive layers, wherein the first sub-refractive layer and the second sub-refractive layer are alternately stacked; The second reflective unit includes a plurality of third sub-refractive layers and a plurality of fourth sub-refractive layers, wherein the third sub-refractive layer and the fourth sub-refractive layer are alternately stacked.
- 根据权利要求6所述的深紫外LED发光结构,其特征在于,所述第一反射单元的折射率与所述第二反射单元的折射率的差值为0.15~0.35;所述第一子折射层、第二子折射层、第三子折射层和第四子折射层均由AlXGa1-XN材料制成,不同子折射层的AlXGa1-XN材料中X数值不同,其中,0<X<1。The deep ultraviolet LED light emitting structure according to claim 6, wherein a difference between a refractive index of the first reflecting unit and a refractive index of the second reflecting unit is 0.15 to 0.35; the first sub-refraction layer, the second sub-refractive layer, the third layer and the fourth sub-sub-refractive index layers are made of Al X Ga 1-X N materials, different Al X Ga 1-X N different sub-refractive material layers value of X, Where 0<X<1.
- 根据权利要求6所述的深紫外LED发光结构,其特征在于,所述第一反射单元的折射率与所述第二反射单元的折射率的差值为0.15~0.35;所述第一子折射层和第三子折射层分别由X数值不同的AlXGa1-XN材料制成,其中,0<X<1,所述第二子折射层和第四子折射层由AIN材料制成。The deep ultraviolet LED light emitting structure according to claim 6, wherein a difference between a refractive index of the first reflecting unit and a refractive index of the second reflecting unit is 0.15 to 0.35; the first sub-refraction The layer and the third sub-refractive layer are respectively made of Al X Ga 1-X N materials having different X values, wherein 0<X<1, and the second sub-refractive layer and the fourth sub-refractive layer are made of AIN material .
- 根据权利要求1或2所述的深紫外LED发光结构,其特征在于,所述发光结构还包括衬底、设于反射层和有源层之间的第三半导体层、以及设于所述衬底和所述第二半导体层之间 的缓冲层,所述第一半导体层为P型GaN层,所述第二半导体层为N型AlGaN层,所述第三半导体层为P型AlGaN层,所述缓冲层为AIN层,所述有源层为生长有AlGaN超晶格结构的有源层。The deep ultraviolet LED light emitting structure according to claim 1 or 2, wherein the light emitting structure further comprises a substrate, a third semiconductor layer disposed between the reflective layer and the active layer, and the lining Between the bottom and the second semiconductor layer a buffer layer, the first semiconductor layer is a P-type GaN layer, the second semiconductor layer is an N-type AlGaN layer, the third semiconductor layer is a P-type AlGaN layer, and the buffer layer is an AIN layer, The active layer is an active layer grown with an AlGaN superlattice structure.
- 一种深紫外LED发光器件,其特征在于,该发光器件包括:A deep ultraviolet LED light emitting device, characterized in that the light emitting device comprises:权利要求1至9任一项所述的深紫外LED发光结构;The deep ultraviolet LED light emitting structure according to any one of claims 1 to 9;设于所述发光结构的第一半导体层的第一电极;和a first electrode disposed on the first semiconductor layer of the light emitting structure; and设于所述发光结构的第二半导体层的第二电极。a second electrode disposed on the second semiconductor layer of the light emitting structure.
- 根据权利要求10所述的深紫外LED发光器件,其特征在于,所述发光器件还包括与第一电极和第二电极均连接的基板,所述基板第一表面设有绝缘层。The deep ultraviolet LED lighting device according to claim 10, wherein the light emitting device further comprises a substrate connected to both the first electrode and the second electrode, and the first surface of the substrate is provided with an insulating layer.
- 根据权利要求11所述的深紫外LED发光器件,其特征在于,所述基板第一表面的第一区域形成有第一导电层,所述基板第一表面的第二区域形成有第二导电层,所述第一电极和第二电极分别通过第一导电层和第二导电层与所述基板连接。 The deep ultraviolet LED light emitting device according to claim 11, wherein a first region of the first surface of the substrate is formed with a first conductive layer, and a second region of the first surface of the substrate is formed with a second conductive layer The first electrode and the second electrode are connected to the substrate through a first conductive layer and a second conductive layer, respectively.
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