WO2019069926A1

WO2019069926A1 - Surface-shape measuring device, surface-shape measuring method, structural-member manufacturing system, structural member manufacturing method, and surface-shape measuring program

Info

Publication number: WO2019069926A1
Application number: PCT/JP2018/036887
Authority: WO
Inventors: 宮脇　崇
Original assignee: 株式会社ニコン
Priority date: 2017-10-06
Filing date: 2018-10-02
Publication date: 2019-04-11
Also published as: JPWO2019069926A1; JP7120247B2

Abstract

[Problem] To further simplify the configuration of a surface-shape measuring device. [Solution] A surface-shape measuring device 100 (device) that measures the surface shape of an object to be measured W is provided with: a θZ stage 14 (stage) that is rotatable about a Z axis (first axis) while supporting the object to be measured W; an optical unit 20 (measuring unit) that is disposed so as to face the θZ stage 14, that is rotatable about an X axis (second axis) orthogonal to the Z axis, and that detects the distance to a measurement point P on the object to be measured W and/or the inclination of the surface of the object to be measured W at the measurement point P; and a control unit 50 (controlling unit) that rotates the θZ stage 14 about the Z axis and rotates the optical unit 20 about the X axis on the basis of reference shape data of the object to be measured W, obtained in advance, such that a reference axis S of the optical unit 20 makes a predetermined angle with the tangential plane of a reference shape of the object to be measured W at the measurement point P.

Description

Surface shape measuring apparatus, surface shape measuring method, structure manufacturing system, structure manufacturing method, and surface shape measuring program

The present invention relates to a surface shape measuring device, a surface shape measuring method, a structure manufacturing system, a structure manufacturing method, and a surface shape measuring program.

DESCRIPTION OF RELATED ART As a surface shape measuring device which measures the surface shape of to-be-measured object non-contactingly, the surface shape measuring device using a laser length measuring device is known (refer the patent document 1).

Japanese Patent Application Laid-Open No. 11-51624

According to a first aspect of the present invention, an apparatus for measuring the surface shape of an object to be measured, which is supported by the object to be measured and which is rotatable about a first axis, and is disposed opposite to the stage A measurement unit that is rotatable about a second axis orthogonal to the first axis and detects the distance to the measurement point of the measurement object and / or the inclination of the surface of the measurement object at the measurement point; Based on the reference shape data of the measured object, the stage is placed around the first axis such that the reference axis of the measuring unit is at a predetermined angle with respect to the tangent plane of the reference shape of the measured object at the measurement point. There is provided a surface shape measuring apparatus, comprising: a control unit that rotates and rotates the measuring unit about a second axis.

According to a second aspect of the present invention, there is provided an apparatus for measuring the surface shape of an object to be measured, the stage being capable of supporting the object to be measured and being rotatable about a first axis, and disposed opposite the stage And a measurement unit that is rotatable about a second axis orthogonal to the first axis and that detects the distance to the measurement point of the measurement object and / or the inclination of the surface of the measurement object at the measurement point The surface shape measuring apparatus is provided, wherein the second axis is arranged to pass through the measurement point of the object to be measured.

According to a third aspect of the present invention, there is provided a method of measuring the surface shape of an object to be measured, the stage supporting the object to be measured based on reference shape data of the object to be measured acquired in advance, the first axis A measuring unit that rotates around, measures the distance to the measurement point of the object to be measured, and / or detects the inclination of the surface of the object at the measurement point Rotating around a second axis orthogonal to the first axis such that the reference axis of the measurement unit is at a predetermined angle with respect to the tangent plane of the reference shape of the object at A measurement method is provided.

According to the fourth aspect of the present invention, a design device for producing reference shape data regarding the shape of a structure, a molding device for molding a structure based on the reference shape data, and measurement of the surface shape of the molded structure A structure manufacturing system is provided that includes the surface shape measurement device described above, and an inspection device that compares measurement data regarding the surface shape of the structure obtained by the surface shape measurement device with reference shape data.

According to a fifth aspect of the present invention, there is provided a method of preparing reference shape data on a shape of a structure, forming a structure based on the reference shape data, and measuring a surface shape of the formed structure. A method of manufacturing a structure is provided, comprising: measuring the surface shape of the surface shape; and comparing measurement data on the surface shape of the structure obtained by the surface shape measuring method with reference shape data.

According to the sixth aspect of the present invention, a stage included in a surface shape measuring apparatus for measuring the surface shape of an object to be measured, based on reference shape data of the object to be measured acquired in advance, is a stage for supporting the object A process of rotating the first axis about the first axis, a distance between the object and the measuring point, and / or a measuring unit for detecting the inclination of the surface of the object at the measuring point A process of rotating around a second axis orthogonal to the first axis such that the reference axis of the measurement unit is at a predetermined angle with respect to the tangent plane of the reference shape of the object at the measurement point A surface shape measurement program to be executed is provided.

It is a perspective view which shows typically an example of the surface shape measuring apparatus which concerns on 1st Embodiment. It is a perspective view expanding and showing an example of an optical unit of a surface shape measuring device, and a head stage unit. It is a figure which shows an example of the outline | summary of an optical unit. It is a figure which shows an example of the control unit (control part) of a surface shape measuring apparatus by a functional block. It is a figure explaining the concept for measuring surface shape. It is a figure explaining using a two-dimensional angle from spherical coordinates to measure surface shape. It is a figure which shows an example which moves probe light along the measurement point of a to-be-measured object. It is a figure which shows the other example which moves probe light along the measurement point of a to-be-measured object. It is a figure which shows the other example which moves probe light along the measurement point of a to-be-measured object. It is a figure which shows an example which calculates surface shape. (A) is a figure explaining the measurement principle of a distance detector, (B) is a figure explaining the measurement principle of an angle detector. (A) is a figure explaining the 1st probe light in a distance detector, (B) is a figure explaining the 2nd probe light in an angle detector. It is a figure which shows the other example of an angle detector. It is a figure which shows typically an example of operation | movement of the surface shape measuring apparatus at the time of measuring surface shape. It is a figure explaining the inclination detection of Z stage around Y-axis. It is a figure explaining the inclination detection of Z stage around an X-axis. It is a figure which shows typically the other example of an optical unit. It is a figure showing an example of the surface shape measuring device concerning a 2nd embodiment. It is a figure showing an example of a structure manufacturing system concerning an embodiment by a functional block. It is a flowchart which shows an example of the structure manufacturing method which concerns on embodiment.

In the surface shape measuring apparatus described in Patent Document 1 described above, the case where the measured portion is a rotationally symmetric object rotationally symmetric about the Z-axis is described. However, even when the object to be measured is not rotationally symmetrical like a free-form surface, a surface shape measuring device capable of measuring the surface shape of the object to be measured with high accuracy is required while simplifying the device configuration. In the present embodiment, it is possible to measure the surface shape of the object to be measured with high accuracy while simplifying the apparatus configuration even if the object is not rotationally symmetrical.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following description. Further, in the drawings, in order to explain the embodiment, the scale is appropriately changed and expressed such that a part is described in a large or emphasized manner. In each drawing of the drawings, directions in the drawings may be described using an XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is taken as an XY plane. One direction along the XY plane is described as an X direction, and a direction orthogonal to the X direction is described as a Y direction. Also, the direction perpendicular to the XY plane is referred to as the Z direction. The Z direction is the vertical direction. In each of the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the − direction.

First Embodiment
A surface shape measuring apparatus 100 according to a first embodiment will be described with reference to the drawings. The surface shape measuring apparatus 100 according to the present embodiment positions the plurality of measurement target points Pi of the object to be measured W sequentially on the measurement points P based on the reference shape data of the object to be measured W. By irradiating the probe light toward the measurement point P with the reference axis S of the optical unit (measurement unit) 20 at a predetermined angle with respect to the tangent plane of the reference shape of W, the position at the measurement point P ( Measuring the distance to the measurement point P) and / or the inclination of the surface of the measurement object W at the measurement point P, and calculating the deviation from the reference shape for each measurement object point Pi of the measurement object W The surface shape of the object to be measured W is measured by this method. Deviation with respect to the reference shape is performed, for example, by measuring the positional deviation and the angular deviation, respectively, using two probe lights. The reference shape data is three-dimensional design data indicating the surface shape of the workpiece W, and is generated in advance. The measurement point P is one point defined on a three-dimensional coordinate where the probe light always passes regardless of the orientation of the optical unit 20. Further, the measurement target points Pi of the object to be measured W are points to be measured on the surface (measurement surface WS) of the reference shape of the object to be measured W, and plural points exist on the surface to be measured of the object to be measured W Do. In the present specification, the measurement target point Pi of the object to be measured W positioned at the measurement point P is simply referred to as “measurement point P of the object to be measured W” or “measurement target point Pi (measurement point P)”. There is a case. Further, the surface shape measuring method according to the present embodiment is implemented by the surface shape measuring device 100 or the surface shape measuring device 200 described later.

FIG. 1: is a perspective view which shows typically an example of the surface shape measuring apparatus 100 which concerns on 1st Embodiment. As shown in FIG. 1, the surface shape measuring apparatus 100 includes a work stage unit 10, an optical unit 20, a head stage unit 30, and a control unit 50.

The work stage unit 10 can hold the object W and move the object W in the X-axis, Y-axis, and Z-axis directions. The work stage unit 10 can position the measurement target point Pi of the object to be measured W on the measurement point P. The optical unit 20 positions the measurement target point Pi of the object to be measured W at the measurement point P, and the probe light at the measurement point P (refer to the first probe light PL1 and the second probe light PL2 in FIG. When collectively referring to the light PL1 and the second probe light PL2, the light PL1 and the second probe light PL2 are simply referred to as probe light, and the reflected light from the measurement target point Pi (measurement point P) is received and the measurement target point Pi (measurement point P) Position (coordinate value or the distance from the reference position to the measurement point P) and the angle of the surface (the measurement surface WS shown in FIG. 3) of the object W at the measurement point P are measured. The head stage unit 30 supports the optical unit 20 and rotates the optical unit 20 around the second rotation axis (second axis) A2X parallel to the X axis so as to direct the optical unit 20 to the measurement point P. . The optical unit 20 is configured such that the probe light always passes the measurement point P at any rotational position, and the measurement target point Pi of the object to be measured W is positioned at the measurement point P, thereby making the measurement possible. The probe light is irradiated to the measurement target point Pi of the object W. The control unit 50 controls the operations of the work stage unit 10, the optical unit 20, the head stage unit 30, and the like based on the operation of the operator or a preset procedure. Each part will be described below.

The work stage unit 10 is provided on a base 80 as a base. The base 80 is made of, for example, metal, natural stone, resin, wood or the like, and is disposed on a floor surface or a desk. In addition, a caster etc. may be provided in the lower surface side of the base 80, and the surface shape measuring apparatus 100 may be movable on a floor surface etc. As shown in FIG. 1, the work stage unit 10 includes an X stage 11, a Y stage 12, a Z stage 13, a θZ stage (stage) 14, and a tilt adjustment mechanism 15.

The arrangement of the X stage 11, the Y stage 12, the Z stage 13, the θZ stage 14, and the tilt adjustment mechanism 15 in the vertical direction is not limited to the configuration shown in FIG. 1 and can be arbitrarily arranged. Further, for example, when one stage can be moved along the XY plane by a planar motor or the like, the X stage 11 and the Y stage 12 may be realized by one stage. The X-stage 11 is provided movably in the X-axis direction with respect to the base 80 so as to move the object W in the X-axis direction. The X stage 11 moves in the X axis direction by driving an X axis driving device (not shown) along a guide in the X axis direction (not shown) provided on the base 80, for example. For example, a linear motor may be used as the X-axis drive device, and any drive device such as a ball screw mechanism or a rack and pinion mechanism using an electric rotary motor may be used. The X-axis drive is disposed, for example, on the base 80.

The Y stage 12 is provided movably in the Y axis direction with respect to the X stage 11 (base 80) so as to move the object W in the Y axis direction. The Y stage 12 moves in the Y axis direction by driving a Y axis driving device (not shown) along a guide in the Y axis direction (not shown) provided on the X stage 11, for example. For example, a linear motor may be used as the Y-axis drive device, and any drive device such as a ball screw mechanism or a rack and pinion mechanism using an electric rotary motor may be used. The Y-axis drive device is disposed, for example, on the X stage 11.

The Z stage 13 is provided movably in the Z axis direction with respect to the Y stage 12 (base 80) so as to move the object W in the Z axis direction. The Z stage 13 moves in the Z axis direction by driving a Z axis driving device (not shown) along a guide in the Z axis direction (not shown) provided on the Y stage 12, for example. As the Z-axis drive device, for example, a linear motor may be used, or any drive device such as a ball screw mechanism or a rack and pinion mechanism using an electric rotary motor may be used. The Z-axis driving device is disposed, for example, on the Y stage 12.

The θZ stage 14 is rotatably provided with respect to the Z stage 13 (base 80) so as to rotate the object W around a first rotation axis (first axis) A1Z parallel to the Z axis direction. . The θZ stage 14 is rotatably supported by, for example, a bearing (not shown) provided on the Y stage 12 and rotates about the axis of the first rotation axis A1Z by driving a Z axis rotating device (not shown). . As the Z-axis rotation device, any rotation device such as, for example, an electric rotation motor and a reduction gear is used. The Z-axis rotation device is disposed, for example, on the Z stage 13. The θZ stage 14 is moved by the X stage 11, Y stage 12 and Z stage 13 in the direction along the XY plane (first plane) perpendicular to the first rotation axis A1Z, and in the first rotation axis A1Z direction. It is possible to move

The tilt adjustment mechanism 15 includes a holding unit (not shown) for holding the object W on the top surface. The holder holds the object W at a predetermined position by, for example, vacuum suction. In addition, about the structure which hold | maintains the to-be-measured object W, another arbitrary mechanism is applicable. The tilt adjusting mechanism 15 finely adjusts the angles around the X axis and the Y axis of the object W so that the object W is aligned with a predetermined plane (for example, the XY plane) as a reference. The tilt adjustment mechanism 15 can finely adjust the angle of the object W to be measured with respect to the optical unit 20. For example, a parallel link mechanism is applied to the tilt adjustment mechanism 15, and by tilting an actuator such as a piezoelectric element, the holding unit holding the object W is tilted about one or both of the X axis and the Y axis. Is possible.

Note that whether or not the tilt adjustment mechanism 15 is provided is optional, and the tilt adjustment mechanism 15 may not be provided. Further, the drive of each of the above-described X-axis drive device, Y-axis drive device, Z-axis drive device, Z-axis rotation device, and actuator is controlled by the control unit 50. The control unit 50 will be described later.

The surface shape measuring apparatus 100, as shown in FIG. 1, includes an interferometer unit 40A to detect the position of the Z stage 13 holding the object W (the amount of movement of the object W from the reference position). , An interferometer unit 40B, and an interferometer unit 40C. The interferometer unit 40A detects the position of the Z stage 13 in the X-axis direction, and is disposed apart from the Z stage 13 in the + X-axis direction. The interferometer unit 40A is fixed to the upper end of the first frame 81 which rises from above the base 80. The interferometer unit 40A includes

X interferometers

41, 42, 46 in order to detect the position of the Z stage 13 in the X axis direction (see FIG. 3). In FIG. 1, the X interferometer 46 is omitted.

The X interferometers 41, 42, 46 of the interferometer unit 40A emit detection light (laser light) toward the movable mirror 61 provided on the Z stage 13 and receive reflected light from the movable mirror 61. Thus, the distance to the movable mirror 61 (the position of the Z stage 13 in the X-axis direction) is detected. The moving mirror 61 is disposed on the + X side on the Z stage 13 and provided so that the reflecting surface is parallel to or substantially parallel to the YZ plane.

The X interferometer 41 is set such that the optical axis of the detection light is parallel to the X axis direction and passes through the measurement point P. The X interferometer 42 is arranged such that the optical axis of the detection light is parallel to the X axis direction, and is separated from the X interferometer 41 by a predetermined distance (for example, the distance LA shown in FIG. 15) in the + Z direction. Therefore, the two detection lights emitted from the

X interferometers

41 and 42 are incident on the moving mirror 61 in a parallel state separated in the Z-axis direction. The X interferometer 42 may be used to detect the angle around the Y axis of the Z stage 13 or may be used as a backup of the X interferometer 41. In addition, the X interferometer 46 is disposed apart from the X interferometer 41 in the Y axis direction, and the optical axis of the detection light is parallel to the X axis direction. The X interferometer 46 is used to detect the rotation angle around the Z axis of the Z stage 13 by measuring the distance to the moving mirror 62. The detection of the position of the Z stage 13 using the X interferometers 41, 42 and 46 will be described later.

Interferometer unit 40 B detects the position of Z stage 13 in the Y-axis direction, and is arranged separately from Z stage 13 in the + Y-axis direction. The interferometer unit 40B is fixed to the upper end of the second frame 82 which rises from above the base 80. The interferometer unit 40B includes

Y interferometers

43 and 44 in order to detect the position of the Z stage 13 in the Y-axis direction.

The Y interferometers 43 and 44 of the interferometer unit 40 B emit detection light (laser light) toward the movable mirror 62 provided on the Z stage 13, and receive reflected light from the movable mirror 61, The distance to the movable mirror 62 (the position of the Z stage 13 in the Y-axis direction) is detected. The movable mirror 62 is disposed on the + Y side on the Z stage 13 and provided so that the reflecting surface is parallel or almost parallel to the XZ plane.

The Y interferometer 43 is set so that the optical axis of the detection light is parallel to the Y-axis direction and passes through the measurement point P. The Y interferometer 44 is arranged such that the optical axis of the detection light is parallel to the Y axis direction and is separated from the Y interferometer 43 by a predetermined distance (for example, refer to the distance LB shown in FIG. 16) in the + Z direction. Therefore, the two detection lights emitted from the

Y interferometers

43 and 44 enter the moving mirror 62 in a parallel state separated in the Z-axis direction. The Y interferometer 44 may be used to detect an angle around the X axis of the Z stage 13 or may be used as a backup of the Y interferometer 43. The detection of the position of the Z stage 13 using the

Y interferometers

43 and 44 will be described later.

The interferometer unit 40C detects the position of the Z stage 13 in the Z-axis direction, and is provided below the Z stage 13, for example, on the base 80. The interferometer unit 40C includes a Z interferometer 45 in order to detect the position of the Z stage 13 in the Z axis direction. The Z interferometer 45 of the interferometer unit 40C emits detection light (laser light) toward a movable mirror (not shown) provided on the Z stage 13 and receives reflected light from the movable mirror. The position of the Z stage 13 in the Z axis direction is detected. A movable mirror (not shown) is disposed, for example, on the lower surface of the Z stage 13 and provided so that the reflecting surface is parallel or substantially parallel to the XY plane. In the Z interferometer 45, the optical axis of the detection light is parallel to the Z axis direction. The detection light from the Z interferometer 45 may be set to pass through the measurement point P.

When X interferometers 41, 42, 46,

Y interferometers

43, 44, and Z interferometer 45 detect the position (or the distance to movable mirror 61) of each

movable mirror

61, 62 etc., the position is indicated. A signal is output to the control unit 50. The X interferometers 41, 42, 46 and the Y interferometers 43, 44 are the moving position of the Z stage 13 (θZ stage 14) in the direction along the XY plane (first plane) and / or the first It is a position detection unit that detects the rotational position around the rotation axis A1Z.

The optical unit 20 includes a distance detector 21 and an angle detector 22. The distance detector 21 irradiates the first probe light PL1 (see FIG. 3 etc.) as the probe light toward the measurement point P of the object to be measured W, and the first reflected light RL1 (see FIG. 3) reflected at the measurement point P. 3), and measure the distance to the measurement point P. The angle detector 22 irradiates the second probe light PL2 (see FIG. 3 etc.) as the probe light toward the measurement point P of the object to be measured W, and the second reflected light RL2 (see FIG. 3) reflected at the measurement point P. 3) is received to measure the angle of the measurement surface WS at the measurement point P. The angle of the measurement surface WS indicates the angle between a predetermined reference surface (for example, the XY plane) and the measurement surface WS. The optical unit 20 is supported by the head stage unit 30. Details of the optical unit 20 will be described later.

FIG. 2 is an enlarged perspective view showing an example of the optical unit 20 and the head stage unit 30 in the surface shape measuring apparatus 100. As shown in FIG. As shown in FIGS. 1 and 2, the head stage unit 30 includes a θX stage (second axis rotation stage) 31 that rotates the optical unit 20 around the second rotation axis A2X. The θX stage 31 is disposed on the + X side of the third frame 83 rising from above the base 80, and is rotatably provided around the axis of the second rotation axis A2X. An arm portion 32 is provided on a surface on the + X side of the θX stage 31 at a position away from the second rotation axis A2X (a position decentered from the second rotation axis A2X). The arm portion 32 is provided to extend from the θX stage 31 in the + X axis direction.

The optical unit 20 is attached to the tip portion on the + X side of the arm portion 32. As the θX stage 31 rotates around the axis of the second rotation axis A2X, the optical unit 20 orbits around the axis of the second rotation axis A2X with the probe light directed to the measurement point P. That is, the optical unit 20 is controlled by the stage control unit 54 of the control unit 50 described later, and rotates with one degree of freedom of rotation around the second rotation axis A2X. The length of the arm portion 32 in the X-axis direction is set to a length that allows the optical unit 20 to be disposed above the measurement point P + Z-axis. The arm unit 32 may include an adjustment unit capable of adjusting the position of the optical unit 20 in the X-axis direction.

Further, on the + X side surface of the θX stage 31, a weight 31a is provided at a position facing the arm portion 32 across the second rotation axis A2X. The weight 31 a is, for example, the same as or substantially the same as the weight of the arm 32 and the optical unit 20. The weight 31a allows the θX stage 31 to rotate smoothly. Note that whether or not the weight 31 a is provided on the θX stage 31 is optional, and the weight 31 a may not be provided. Also, a plurality of weights 31a may be provided.

FIG. 3 is a view showing an example of an outline of the optical unit 20. As shown in FIG. The optical unit 20 is set such that the distance between the reference position G of the optical unit 20 and the measurement point P is a predetermined distance D, as shown in FIG. Further, since the second rotation axis A2X passes through the measurement point P, in the optical unit 20, the distance between the reference position G and the second rotation axis A2X is the predetermined distance D. And, at any rotational position, the probe light is always set to pass through the measurement point P. The reference position G of the optical unit 20 may be set to the center position or the barycentric position of the optical unit 20, or may be set to other than these. The optical unit 20 includes a distance detector 21 and an angle detector 22 as shown in FIG.

The distance detector 21 includes an irradiation unit 21A that emits the first probe light PL1, and a detection unit 21B that receives the first reflected light RL1 that the first probe light PL1 reflects at the measurement point P. The irradiation unit 21A emits the first probe light PL1 such that the optical axis of the first probe light PL1 overlaps the measurement point P in a state of being inclined from the Z-axis direction. The detection unit 21B is disposed in a state of being inclined symmetrically with the irradiation unit 21A about the Z-axis direction.

Further, similarly to the distance detector 21, the angle detector 22 detects the irradiation unit 22A that emits the second probe light PL2 and the second reflected light RL2 that is reflected by the second probe light PL2 at the measurement point P. And a unit 22B. In FIG. 3, since the irradiation unit 22A and the detection unit 22B overlap with each other,

reference numerals

22A and 22B are written in parentheses of reference numeral 22. Although not shown in FIG. 3, the irradiating unit 22A emits the second probe light PL2 such that the optical axis of the second probe light PL2 overlaps the measurement point P in a state of being inclined from the Z-axis direction. The detection unit 22B is disposed in a state of being inclined symmetrically with the irradiation unit 22A centering on the Z-axis direction.

The optical axis of the first probe light PL1 and the optical axis of the second probe light PL2 intersect at the measurement point P. That is, the state in which the optical axis of the first probe light PL1 intersects the optical axis of the second probe light PL2 at the measurement point P (second rotation axis A2X) separated from the reference position G of the optical unit 20 by the predetermined distance D It has become. In the probe light irradiated from the optical unit 20 to the measurement point P, the first probe light PL1 of the distance detector 21 and the second probe light PL2 of the angle detector 22 overlap, and these are combined. There is. The optical unit 20 is not limited to the configuration shown in FIG. The optical unit 20 is applicable to any configuration capable of measuring the distance to the measurement point P and the angle of the measurement surface WS at the measurement point P.

In addition, since the optical axis of the first probe light PL1 and the optical axis of the second probe light PL2 intersect at the second rotation axis A2X, even when the optical unit 20 is rotated by rotating the θX stage 31, the first The optical axis of the probe light PL1 and the optical axis of the second probe light PL2 do not change in that they intersect at the second rotation axis A2X. Therefore, the distance between the measurement point P and the optical unit 20 can be easily controlled by setting the measurement point P on the second rotation axis A2X.

The control unit 50 controls the operation of each part of the surface shape measuring apparatus 100 such that the probe light (first probe light PL1 and second probe light PL2) emitted from the optical unit 20 is irradiated to the measurement point P.

FIG. 4 is a diagram showing an example of a control unit (control unit) 50 of the surface shape measuring apparatus 100 by functional blocks. As shown in FIG. 4, the control unit 50 includes an operation unit 51, a storage unit 52, an operation unit 53, a stage control unit 54, a measurement control unit 55, and an I / O unit 56.

The operation unit 51 is an interface for the operator to operate an operation in each part of the surface shape measuring apparatus 100. The operation unit 51 is a liquid crystal display panel that displays information such as a measurement program and / or a measurement result, a keyboard that inputs numerical and / or character information, a mouse, a touch panel, various switches, and further CD (Compact Disk), USB ( A reader / writer capable of reading and writing reference shape data of the measurement surface WS recorded on a recording medium such as a Universal Serial Bus memory or the like, measurement results from the optical unit 20, and the like are provided. The surface shape measuring apparatus 100 can perform measurement of the surface shape corresponding to the type of the measurement surface WS and the measurement pattern in an interactive manner by such an operation unit 51.

The storage unit 52 is configured of a plurality of storage elements such as a read only memory (ROM) and a random access memory (RAM). The ROM stores in advance a control program for controlling the operation of each part of the surface shape measuring apparatus 100, a type of the object to be measured W, a measurement program corresponding to a measurement pattern, and the like. When the type of the object to be measured W and the measurement pattern are selected and set in the operation unit 51, the control unit 50 incorporates the corresponding measurement program into the control program. The RAM is reference shape data of the measurement surface WS of the object to be measured W read via the reader / writer or the I / O unit 56 of the operation unit 51, a reference at the measurement point P on the measurement line set in the measurement program. Inclination angle, distance data of each measurement point P output from distance detector 21 during execution of measurement program, angle of measurement surface WS at each measurement point P output from angle detector 22 during execution of measurement program Temporarily store data etc.

The arithmetic unit 53 includes a central processing unit (CPU), a shift register, and the like, and performs various arithmetic processing based on the control program and measurement program stored in advance in the storage unit 52. The stage control unit 54, measurement control A command signal is output to the unit 55 and the like to control the operation of the work stage unit 10, the optical unit 20, and the head stage unit 30. The stage control unit 54 controls operations of the X stage 11, the Y stage 12, the Z stage 13, the θZ stage 14, the tilt adjustment mechanism 15, and the θX stage 31 based on a command signal output from the computing unit 53.

The measurement control unit 55 outputs a measurement control signal to the distance detector 21 and the angle detector 22 of the optical unit 20 based on the command signal output from the calculation unit 53, and controls the shape measurement of the measurement surface WS. The I / O unit 56 exchanges signals with the outside.

FIG. 5 is a view for explaining the concept of measuring the surface shape by the surface shape measuring apparatus 100. As shown in FIG. In FIG. 5, the measurement surface WS of the object to be measured W is simplified and shown in a planar shape, but actually, it has an uneven shape by a free curved surface. When the direction perpendicular to the tangent plane is indicated by an arrow at any point on the measurement surface WS of such an object to be measured W, the directions of the arrows at the respective points are apart. For example, in the case of pointing the optical unit 20 to the measurement point P of the object W to be measured, the surface shape measuring apparatus as an example rotates the optical unit 20 around both the X axis and the Y axis to measure the object It is general to direct the optical unit 20 to the measurement point P of W. As described above, the configuration in which the optical unit 20 is rotated about the X axis and the Y axis supports the optical unit 20 with two stages, which tends to cause an error in the irradiation position of the probe light, and is a troublesome operation It becomes.

On the other hand, when the optical unit 20 is directed to the measurement point P of the object W to be measured, the surface shape measuring apparatus 100 according to the present embodiment rotates the object W around the Z axis by the θZ stage 14 as shown in FIG. By rotating the optical unit 20 around the X axis by the θX stage 31, the optical unit 20 can be accurately directed to the measurement point P of the object W to be measured.

FIG. 6 is a diagram for explaining the use of a two-dimensional angle from spherical coordinates to measure the surface shape of the object W to be measured. Representing three-dimensional coordinates in spherical coordinates allows arbitrary points to be represented in two dimensions. As shown in FIG. 6, considering the spherical coordinates (r, θ, φ) of the measurement point at which the rotation angle around the X axis is θ, the rotation angle around the Z axis is φ, and the distance r from the origin is The X coordinate of a point can be expressed as x = r cos φ cos θ. Also, the Y coordinate of this measurement point can be expressed as y = r cos φ sin θ. The Z coordinate of this measurement point can be expressed as z = r cos θ.

From the X, Y, and Z coordinates, as shown in FIG. 6, three expressions of angles θx, θy, and θz are possible. The angle θx can be expressed using the angle θy and the angle θz. The angle θy can be expressed using the angle θx and the angle θz. Further, the angle θz can be expressed using the angle θx and the angle θy. That is, it is possible to express the remaining angle by two angles among the angles θx, θy, and θz. Therefore, it is possible to direct the optical unit 20 to the measurement point P by controlling any two angles.

In the present embodiment, the angle θx and the angle θz are used. That is, the control unit 50 controls the rotation angle of the θX stage 31 of the head stage unit 30 so as to become the angle θx, and the rotation angle of the θZ stage 14 of the work stage unit 10 so as to become the angle θz. Control.

FIGS. 7 to 9 are explanatory views illustrating movement patterns on the object W when the probe light from the optical unit 20 and the object W are moved relative to each other and the probe light is moved along the measurement line. It is. FIGS. 7 to 9 schematically show the measurement object W held by the tilt adjustment mechanism 15 as viewed from above, and a measurement line along which the probe light moves on the measurement surface of the measurement object W is shown. It is indicated by L1 to L6.

FIG. 7 shows a movement pattern of probe light (measurement point P in the case where a workpiece W having a circular or substantially circular surface shape in plan view is measured, such as a meniscus lens or an aspheric lens. Measurement route) is shown. The stage control unit 54 is configured to rotate the θX stage 31 in the head stage unit 30, move the X stage 11 of the work stage unit 10, move the Y stage 12 and Z stage 13, and rotate the θZ stage 14. Is controlled to move the measurement surface WS in the movement pattern shown in FIG. As described above, the control unit 50 controls the rotation angle of the θX stage 31 and the rotation angle of the θZ stage 14 to control the measurement points P at the measurement points P aligned with each measurement target point Pi in the movement pattern. The optical unit 20 is properly directed to the surface. The aspect which aims the optical unit 20 with respect to the measurement point P is mentioned later. Further, the control unit 50 controls the X stage 11 and the like of the work stage unit 10 so that each measurement point P is positioned on the second rotation axis A2X.

In FIG. 7, the stage control unit 54 moves the probe light along the linear measurement line L1 from the state where the probe light is irradiated to the start point SP on the measurement surface WS of the object to be measured W. The measurement control unit 55 sequentially positions each measurement target point Pi on the measurement line L1 as the measurement point P, thereby the distance at each measurement target point Pi (measurement point P) and the angle of the measurement surface WS by the optical unit 20. Let me measure. Subsequently, as shown in FIG. 7, the stage control unit 54 rotates the θZ stage 14 by a predetermined angle (for example, clockwise) to move the probe light along the linear measurement line L2. The measurement control unit 55 causes the optical unit 20 to measure the distance at each measurement target point Pi (measurement point P) on the measurement line L2 and the angle of the measurement surface WS, as in the measurement line L1.

Subsequently, the stage control unit 54 rotates the θZ stage 14 by a predetermined angle to move the probe light along the linear measurement line L3. The measurement control unit 55 causes the optical unit 20 to measure the distance at each measurement target point Pi (measurement point P) on the measurement line L3 and the angle of the measurement surface WS, as in the measurement lines L1 and L2. The control unit 50 can obtain distance and angle measurement data for the entire measurement surface WS of the object W by repeating measurement of distance and angle along a plurality of measurement lines. In the case shown in FIG. 7, it is possible to obtain data obtained by measuring the entire measurement surface of the object W in the form of a line in the radial direction.

In addition, although the measurement data of the distance in each measurement point P and the angle of the measurement surface WS are obtained by the optical unit 20 in the above, it is not limited to this method. For example, the control unit 50 is adjusted to each measurement target point Pi while controlling to keep the distance D (see FIG. 3) constant from the optical unit 20 to each measurement target point Pi in each measurement line L1 etc. A method may be used in which angle data of the measurement surface WS is acquired by the optical unit 20 at the measurement point P.

FIG. 8 shows the case where the measurement surface WS of the object W is circular in plan view, but the measurement surface is non-circular in shape such as rectangular, elliptical or oblong in plan view. An example of a movement pattern of probe light suitable for measuring an object W (for example, a cylindrical lens or the like) is shown. As shown in FIG. 8, the stage control unit 54 moves the probe light along the linear measurement line L1 from the state where the probe light is irradiated to the start point SP on the measurement surface WS of the object to be measured W. The measurement control unit 55 causes the optical unit 20 to measure the distance at each measurement target point Pi (measurement point P) on the measurement line L1 and the angle of the measurement surface WS.

Subsequently, as shown in FIG. 8, the stage control unit 54 operates the X stage 11 or the like of the work stage unit 10 to shift the object W in the −X direction by a predetermined amount, thereby linearly forming the probe light. It moves along the measurement line L4 of. The measurement control unit 55 causes the optical unit 20 to measure the distance at each measurement target point Pi (measurement point P) on the measurement line L4 and the angle of the measurement surface WS as in the measurement line L1. Subsequently, the stage control unit 54 operates the X stage 11 or the like of the work stage unit 10 to further shift the object W in the −X direction by a predetermined amount, and the probe light is along the linear measurement line L5. Move. The measurement control unit 55 causes the optical unit 20 to measure the distance at each measurement target point Pi (measurement point P) on the measurement line L5 and the angle of the measurement surface WS, as in the measurement lines L1 and L4.

The control unit 50 can obtain distance and angle measurement data for the entire measurement surface WS of the object W by repeating measurement of distance and angle along a plurality of measurement lines. In the case shown in FIG. 8, it is possible to obtain data obtained by measuring the entire measurement surface of the object W in parallel lines. Also in the case shown in FIG. 8, in the same manner as described above, the control unit 50 controls to keep the distance D from the optical unit 20 to each measurement target point Pi constant at each measurement line L1 etc. The angle data of the measurement surface WS may be acquired by the optical unit 20 at the measurement point P where each measurement target point Pi is positioned.

Similar to FIG. 7, FIG. 9 shows an example of the movement pattern of the probe light in the case where the measurement object W having a circular or substantially circular surface shape in plan view is measured, as in FIG. 7. As shown in FIG. 9, the stage control unit 54 moves the probe light along the spiral measurement line L6 from the state where the probe light is irradiated to the start point SP on the measurement surface WS of the object to be measured W. The measurement control unit 55 causes the optical unit 20 to measure the distance at each measurement target point Pi (measurement point P) on the measurement line L6 and the angle of the measurement surface WS. The control unit 50 can obtain measurement data of the spiral distance and angle for the entire measurement surface WS of the object W by measuring the distance and angle along the spiral measurement line L6.

In addition, in FIG. 9, although the measurement line L6 is set spirally toward the outer side from the center of the measurement surface WS, it is not limited to this, for example, a spiral measurement line is set toward the center from the outer side It may be done. In the case shown in FIG. 9 as well, in the same manner as described above, the control unit 50 performs control while maintaining the distance D from the optical unit 20 to each measurement point P constant in the measurement line L6. Angle data of the measurement surface WS may be acquired by the optical unit 20 at the point P.

The distance between each measurement target point Pi (measurement point P) and the angle of the measurement surface WS in the measurement line L1 and the like are measured at the measurement point P by the first probe light PL1 and the second probe light PL2 emitted from the optical unit 20. It is calculated | required by reflecting and each 1st reflected light RL1 and 2nd reflected light RL2 being light-received by the optical unit 20. FIG. The stage control unit 54 of the control unit 50 measures, based on the reference shape data of the object to be measured W stored in advance in the storage unit 52 (see FIG. 4), each measurement target point Pi along the measurement line L1 etc. The movement position of X stage 11, Y stage 12, and Z stage 13 of work stage unit 10 is controlled to position target point Pi at measurement point P arranged on second rotation axis A2X, and The rotation angle of the θX stage 31 and the rotation angle of the θZ stage 14 are controlled so that the optical unit 20 is properly directed to the tangent plane at the measurement point P. The stage control unit 54 may simultaneously control the movement position of the X stage 11, the Y stage 12, and the Z stage 13, and control the rotation angle of the θX stage 31 and the rotation angle of the θZ stage 14. Each may be performed independently.

The measurement control unit 55 (see FIG. 4) of the control unit 50 controls the optical unit 20 to sequentially measure the distance of each measurement target point Pi and the angle of the measurement surface WS along the measurement line L1 and the like. The calculation unit 53 of the control unit 50 calculates the shape of the measurement surface WS of the object to be measured W from the distance detected for each measurement target point Pi and the angle of the measurement surface WS. The arithmetic unit 53 (see FIG. 4) of the control unit 50 extracts, for example, the difference in the angle of the measurement surface WS at the measurement point P with respect to the reference shape data stored in the storage unit 52. The surface shape of the measurement surface WS may be calculated by arithmetic processing of the data of (1) using a known method such as integration processing or fitting processing.

An example of calculating the surface shape will be described. FIG. 10 is a diagram showing an example of calculating the surface shape of the object W to be measured. The optical unit 20 moves from the left side to the right side of the drawing in FIG. 10 along the measurement line L1 or the like in the Y direction described above, and performs measurement at predetermined sampling intervals L. A point set by a predetermined sampling interval L is a measurement target point Pi of the object to be measured W. In FIG. 10, assuming that the number of times of sampling is n, surface shapes of the measurement surface WS in the n = i-th measurement and the n = i + 1-th measurement are shown. The surface shape of the object to be measured W is a free-form surface, the normals measured at each measurement target point are directed in the three-dimensional direction, but in FIG. The angle change of the measurement surface WS along the measurement line is indicated by extracting the inclination of the angle. In addition, by extracting the inclination of an arbitrary direction (for example, a direction perpendicular to the measurement line) component at each measurement target point Pi instead of the measurement line, the surface shape along the arbitrary direction of the measurement surface WS can be obtained. It can be calculated.

As shown in FIG. 10, when the inclination of the tangential plane WA at the measurement target point Pi is measured as the inclination angle αi (rad) by the angle detector 22 in the n = i-th measurement, the inclination angle αi has a small angle In this case, the displacement amount in the X direction (vertical direction, depth direction) up to the n = i-th measurement target point Pi is tan (αi / L), and is approximated as the displacement amount Lαi. Therefore, if the coordinate in the X direction of the n = i'th time (the measurement target point Pi) is f (i), the coordinate in the X direction of the n = i + 1'th coordinate f (i + 1), ie, the measurement target point Pi + 1 is f (I) It is calculated as + Lαi. The surface shape of the entire measurement surface WS of the object to be measured W is calculated by performing the calculation of the surface shape along the measurement line L1 and the like in a plurality of measurement lines.

FIG. 11A is a diagram for explaining the principle of measuring the distance to the measurement target point Pi (the measurement point P) by the distance detector 21. FIG. 11B shows the measurement point P by the angle detector 22. It is a figure explaining the principle which measures the angle of measurement side WS in. FIG. 11 shows a state in which the first probe light PL1 of the distance detector 21 and the second probe light PL2 of the angle detector 22 are made incident on the measurement surface WS extending horizontally in the XY direction.

The distance detector 21 includes a light source 211, a condensing lens 212, a condensing lens 213, and a light detector 214. The light source 211 and the condenser lens 212 correspond to the irradiation unit 21A shown in FIG. The condenser lens 213 and the light detector 214 correspond to the detection unit 21B shown in FIG. The irradiation unit 21A (light source 211 and condensing lens 212) and the detection unit 21B (condensing lens 213 and light detector 214) are provided with a relative angle with the reference axis S defined. The reference axis S is, for example, a symmetry axis between the optical axis of the irradiation light from the irradiation unit 21A and the optical axis of the reflected light reflected at the measurement point P. The light source 211 generates the first probe light PL1. The light source 211 is a laser light source whose oscillation wavelength, light output, beam diameter and the like are stabilized. For example, a fiber laser, a distributed feedback laser, or the like is used. The light source 211 includes a collimator at an output unit, and outputs the first probe light PL1 as a parallel light beam. The condensing lens 212 condenses the first probe light PL <b> 1 generated by the light source 211 and irradiates the measurement surface WS of the object to be measured W (measurement target point Pi, measurement point P).

The condensing lens 213 condenses the first reflected light RL1 reflected by the measurement surface WS (the measurement target point Pi, the measurement point P). The light detector 214 is a detector for detecting the position of the first reflected light RL1 and measuring the distance to the measurement surface WS, and may be, for example, a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). Or an image sensor such as an organic photodiode.

The angle detector 22 includes a light source 221, a condensing lens 222, a collimating lens 223, and a light detector 224. The light source 221 and the condenser lens 222 correspond to the irradiation unit 22A shown in FIG. The collimator lens 223 and the light detector 224 correspond to the detection unit 22B shown in FIG. The irradiation unit 22A (light source 221 and condenser lens 222) and the detection unit 22B (collimator lens 223 and light detector 224) are provided at a relative angle with the reference axis S. The reference axis S is, for example, an axis of symmetry between the optical axis of the irradiation light from the irradiation unit 22A and the optical axis of the reflected light reflected at the measurement point P. The light source 221 generates a second probe light PL2. The light source 221 is a laser light source whose oscillation wavelength, light output, beam diameter and the like are stabilized. For example, a fiber laser, a distributed feedback laser, etc. are used. The light source 221 includes a collimator at an output unit, and outputs the second probe light PL2 as a parallel light flux. The condensing lens 222 condenses the second probe light PL2 generated by the light source 221 and irradiates it on the measurement surface WS (measurement target point Pi, measurement point P) of the object W to be measured.

The collimating lens 223 converts the second reflected light RL2 reflected by the measurement surface WS (the measurement target point Pi, the measurement point P) into a parallel light flux. The photodetector 224 is a detector for detecting the position of the second reflected light RL2 to measure the angle of the measurement surface WS, and, for example, an image sensor such as a CCD or CMOS or an organic photodiode is used. .

The first probe light PL1 emitted from the distance detector 21 is collected by the collecting lens 212 and enters the measurement surface WS, and the first reflected light RL1 is collected by the collecting lens 213 and the light detector Incident on 214. Therefore, the incident position of the first reflected light RL1 to the light detector 214 does not change even if the angle of the measurement surface WS changes. However, when the measurement surface WS changes in the Z-axis direction, the incident position of the first reflected light RL1 on the light detector 214 changes. Therefore, the control unit 50 measures the measurement surface WS (the measurement target point from the reference position G of the optical unit 20 even when the angle of the measurement surface WS changes by the signal output from the light detector 214). The distance to Pi, measurement point P) can be calculated.

In addition, the second probe light PL2 emitted from the angle detector 22 is condensed by the condensing lens 222 and is incident on the measurement surface WS, and the second reflected light RL2 is collimated by the collimate lens 223 and becomes light The light is incident on the detector 224. The incident position of the second reflected light RL2 hardly (largely) changes even if the position of the measurement surface WS in the Z-axis direction changes. However, when the angle of the measurement surface WS changes, the incident position of the second reflected light RL2 to the light detector 224 changes. Therefore, the control unit 50 measures the measurement surface WS (the measurement target WS shown in FIG. 14 even if the position of the measurement surface WS in the Z-axis direction changes slightly due to the signal output from the light detector 224). The angle of the tangent plane WA) at the point Pi can be calculated.

In FIG. 11, reference symbol S denotes a virtual optical axis, which is a reference axis of the optical unit 20. The reference axis S is a virtual optical axis of probe light emitted from the optical unit 20. An intersection point of the reference axis S and the measurement surface WS is a measurement point P. The optical unit 20 is controlled by the control unit 50 such that the reference axis S is at a predetermined angle with respect to the tangent plane of the reference shape of the object W at the measurement point P. In the present embodiment, to direct the optical unit 20 to the measurement point P is, for example, optical so that the reference axis S passes the measurement point P and the reference axis S is perpendicular to the tangent plane of the measurement point P. It means arranging the unit 20. However, the reference axis S may not be perpendicular to the tangent plane of the reference shape of the workpiece W at the measurement point P, as long as the angle is determined in advance. The reference axis S may be set to pass through the reference position G (see FIG. 3) of the optical unit 20. The first probe light PL1 and the first reflected light RL1 are symmetrical with respect to the reference axis S. Further, the second probe light PL2 and the second reflected light RL2 are symmetrical with respect to the reference axis S.

The distance detector 21 and the angle detector 22 are set such that the incident surface of the first probe light PL1 of the distance detector 21 and the incident surface of the second probe light PL2 of the angle detector 22 are orthogonal (or intersected) It is done. The distance detector 21 is set so that the incident surface of the first probe light PL1 is along the YZ plane including the measurement point P. The angle detector 22 is set so that the incident surface of the second probe light PL2 is orthogonal to the YZ plane and along the XZ plane including the measurement point P. The arrangement of the distance detector 21 and the angle detector 22 will be described with reference to FIG.

FIG. 12A is a diagram for explaining the first probe light PL1 and the first reflected light RL1 in the distance detector 21. FIG. 12B is a view for explaining the second probe light PL2 and the second probe light in the angle detector 22. It is a figure explaining reflected light RL2. As shown in FIG. 12A, the distance detector 21 is set so that the incident surface of the first probe light PL1 is along the YZ plane including the measurement point P. The YZ plane is a plane orthogonal to the X axis. Further, as shown in FIG. 12B, the angle detector 22 is set so that the incident surface of the second probe light PL2 is along the XZ plane including the measurement point P. The XZ plane is a plane including the X axis.

The optical unit 20 includes a distance detector 21 disposed along the YZ plane and an angle detector 22 disposed along the XZ plane. The first probe light PL1 along the YZ plane and the second probe light PL2 along the XZ plane intersect at the measurement point P on the second rotation axis A2X. That is, the optical unit 20 is adjusted so that the first probe light PL1 and the second probe light PL2 intersect at a measurement position separated by a predetermined distance D from the reference position G of the optical unit 20. Thereby, the optical unit 20 causes the first probe light PL1 and the second probe light PL2 to overlap, and irradiates the measurement light with the probe light obtained by combining these.

The measurement line L1 and the like of the probe light are set in the Y-axis direction. Therefore, the first probe light PL1 of the distance detector 21 is irradiated to the YZ plane along the measurement line L1 and the like. On the other hand, the second probe light PL2 of the angle detector 22 is irradiated on the XZ plane orthogonal to the measurement line L1 and the like. However, the present invention is not limited to such a setting. For example, the first probe light PL1 of the distance detector 21 may be irradiated in the XZ plane orthogonal to the measurement line L1 etc., or the second probe light of the angle detector 22 PL2 may be irradiated to the YZ plane along the measurement line L1 and the like. In addition, the incident surface of the first probe light PL1 and the incident surface of the second probe light PL2 may not be orthogonal to each other.

Further, as shown in FIG. 12, the reference axis S of the optical unit 20 is parallel to the Z-axis direction. The reference axis S coincides with a line where the YZ plane in which the distance detector 21 is disposed and the XZ plane in which the angle detector 22 is disposed.

FIG. 13 is a diagram showing another example of the angle detector. The angle detector 122 shown in FIG. 13 includes a light source 221, an optical fiber 225, a collimator 226, a condenser lens 222A, a mirror 227, an aperture 228, and a light detector 224. The light source 221 and the light detector 224 are the same as those shown in FIG. The optical fiber 225 guides the second probe light generated by the light source 221. The collimator 226 is provided at the output end of the optical fiber 225, and emits the second probe light as a parallel beam. Condenser lens 222A condenses the 2nd probe light PL2 of parallel light flux, and irradiates it on measurement surface WS (measurement point P). The mirror 227 reflects the second reflected light RL2 which has been collimated by being reflected by the measurement surface WS and transmitted again through the condenser lens 222A in a predetermined direction. The aperture 228 removes, for example, the second back surface reflected light reflected from the back surface of the object W to be measured.

The angle detector 122 transmits the second probe light PL2 irradiated to the measurement surface WS and the second reflected light RL2 reflected by the measurement surface WS by transmitting the same condensing lens 222A, as shown in FIG. The collimator lens 223 shown in FIG. 12 (b) is omitted. Thus, the optical unit 20 can miniaturize the angle detector 122 formed along the XZ plane, so that the whole can be configured compact. Further, since the angle detector 122 has the aperture 228 for removing the second back surface reflected light reflected by the back surface of the object to be measured W just before the light detector 224, the thickness of the object to be measured W is temporarily thin. In the case or the case where the incident angle of the second probe light PL2 is small, it is possible to efficiently remove the second back surface reflected light.

The condensing lens 222A of the angle detector 122 may have a focal length f2 of about 80 to 160 mm, and for example, an achromatic lens of f2 = 120 mm can be used. Further, the incident angle θ2 (see FIG. 12B) of the second probe light PL2 on the measurement surface WS may be about 3 to 8 °, and is set, for example, to θ2 = 5 °. The same applies to the condenser lens 222 of the angle detector 22.

The condensing lens 212 of the distance detector 21 can set the focal distance f1 in the same range as the condensing lens 222A. The focal length f1 is not shown. The condensing lens 212 can use, for example, an achromatic lens having a focal length f1 of 120 mm, which is the same as the focal length f2 of the condensing lens 222A. In this case, the distance detector 21 can transmit the first probe light PL1 irradiated to the measurement surface WS and the first reflected light RL1 reflected by the measurement surface WS through the same condensing lens, as shown in FIG. a) and the condensing lens 213 shown to Fig.12 (a) can be abbreviate | omitted.

In addition, the focal point adjustment of the distance detector 21 (angle detector 22) is performed by transmitting the first probe light PL1 and the first reflected light RL1 (the second probe light PL2 and the second reflected light RL2) through the same condensing lens. Work can be shared. Further, by using the same focusing lens 222A in the distance detector 21 and the angle detector 22, the focal depths of the first probe light PL1 and the second probe light PL2 focused on the measurement point P are the same or It becomes almost the same, and the influence of an error component etc. based on the difference in depth of focus can be eliminated. The incidence angle θ1 of the first probe light PL1 on the measurement surface WS is preferably about 5 to 30 °, and is set, for example, to θ1 = 25 °.

The range to which the probe light is irradiated at the measurement point P is, for example, a circular or substantially circular spot having a diameter of about 200 μm. The distance detector 21 measures the average positional displacement of this spot. The angle detector 22 detects an angle around the average X axis or Y axis of this spot.

FIG. 14 is a view schematically showing an example of the operation of the surface shape measuring apparatus 100 when measuring the surface shape of the object W to be measured. When the control unit 50 measures the distance and angle of each measurement point P, the measurement point P passes through the second rotation axis A2X based on the reference shape data stored in the storage unit 52, and the measurement point Control the operations of X stage 11, Y stage 12, Z stage 13, θZ stage 14, and θX stage 31 such that the normal line in the tangent plane of P coincides with reference axis S passing through reference position G of optical unit 20. . In FIG. 14, the surface shape of the object to be measured W is simplified and shown as an elliptical shape in the YZ cross section, but actually, it has minute unevenness due to a free curved surface.

As shown by the alternate long and short dash line in FIG. 14, when the measurement target point Pi substantially at the center of the object W is positioned at the measurement point P on the second rotation axis A2X, the measurement target point Pi (measurement point P) The tangent plane WA0 is substantially parallel to the XY plane, and the normal is approximately parallel to the Z-axis direction. The control unit 50 aligns the reference axis S with the normal based on the reference shape data, and the θZ stage 14 and the distance Z from the measurement target point Pi (measurement point P) to the reference position G. The rotation angle of the θX stage 31 is controlled, and the movement positions of the X stage 11, the Y stage 12, and the Z stage 13 are controlled.

Further, as shown by the solid line in FIG. 14, when the measurement target point Pi separated from the center of the object to be measured W is positioned at the measurement point P on the second rotation axis A2X, the measurement target point Pi (measurement point P ) Is inclined from the XY plane, and its normal is inclined from the Z-axis direction. The control unit 50 aligns the reference axis S with the normal based on the reference shape data, and the rotation angles of the θZ stage 14 and the θX stage 31 so that the distance D from the measurement point P to the reference position G becomes And control the moving positions of the X stage 11, the Y stage 12, and the Z stage 13.

The control unit 50 aligns the reference axis S with the normal to the measurement surface, and allows the measurement point P to pass through the second rotation axis A2X, so that the X stage 11, Y stage 12, Z stage 13, θZ stage 14 and the θX stage 31 are controlled as follows. In the following description, the drawings relating to the functional blocks in FIG. 4 will be referred to as appropriate. First, the calculation unit 53 of the control unit 50 calculates the tangent plane WA of each measurement target point Pi along the measurement line L1 and the like from the reference shape data of the measurement surface WS stored in the storage unit 52, and the tangent plane WA The angle around the X axis and the angle around the Y axis (hereinafter referred to as the inclination angle of the measurement target point Pi) are calculated.

Next, the calculation unit 53 calculates movement amounts of the X stage 11, the Y stage 12, and the Z stage 13 for positioning each measurement target point Pi in the measurement line L1 and the like as the measurement point P, and the calculated measurement. From the inclination angle of the target point Pi, the normal of the measurement target point Pi (tangent plane WA) coincides with the reference axis S, and the probe light of the optical unit 20 passes through the measurement target point Pi (measurement point P) The amounts of rotation of the θZ stage 14 and the θX stage 31 are calculated. Next, the stage control unit 54 generates drive signals based on the movement amount and rotation amount of each stage calculated by the operation unit 53, and the X stage 11, Y stage 12, Z stage 13, θZ stage 14, and θX stage A drive signal is output to 31 to move the object W and the optical unit 20 relative to each other. The stage control unit 54 may control each stage at the same time, or may independently control each different period.

Subsequently, based on the measurement control signal output from the measurement control unit 55, the distance detector 21 of the optical unit 20 applies the first probe light PL1 to the object to be measured W. At the same time or almost simultaneously, the angle detector 22 of the optical unit 20 irradiates the second probe light PL2 to the object to be measured W based on the measurement control signal output from the measurement control unit 55. In the optical unit 20, the first probe light PL1 and the second probe light PL2 are irradiated to the measurement target point Pi (measurement point P). The optical unit 20 measures the distance of the measurement target point Pi (the measurement point P) and the angle of the measurement surface WS at the measurement target point Pi by receiving the first reflected light RL1 and the second reflected light RL2.

As described above, the control unit 50 calculates the surface shape of the object W from the measurement results of the distance at each measurement target point Pi and the angle of the measurement surface WS. In the optical unit 20, the distance between the reference position G of the optical unit 20 and the second rotation axis A2X is constant. Therefore, by arranging the measurement point P on the second rotation axis A2X, the distance between the reference position G and the measurement point P is set to be constant as the distance D. In the above, the measurement point P and the reference position G are controlled to be the distance D based on the reference shape data, but the present invention is not limited to this. For example, the control unit 50 uses the output of the distance detector 21 to control the X stage 11 or the like so that the distance D is actually at each measurement point P, and the angle of the measurement surface WS at each measurement target point Pi May be controlled by the angle detector 22.

The above description is premised that the workpiece W is properly (horizontally) held by the work stage unit 10. The tilt adjustment mechanism 15 of the work stage unit 10 can be adjusted so that the object to be measured W is properly held. Further, the position of the object to be measured W is recognized by detecting the distance to the moving

mirrors

61 and 62 of the Z stage 13 by the X interferometers 41, 42 and 46 and the

Y interferometers

43 and 44. Therefore, when the Z stage 13 (or the X stage 11 and the Y stage 12 on which the Z stage 13 is mounted) is inclined, the X interferometer 41 or the like can not detect the accurate position of the object W to be measured.

FIG. 15 is a diagram for explaining the detection of the tilt of the Z stage 13 around the Y axis. FIG. 16 is a diagram for explaining the detection of the tilt of the Z stage 13 around the X axis. In FIG. 15, a method of calculating the angle around the Y axis from the distances detected by the

X interferometers

41 and 42 will be described. The X interferometers 41 and 42 function as an inclination detection unit that detects the inclination of the Z stage 13 (θZ stage 14) around the Y axis with respect to the XY plane (first plane) perpendicular to the first rotation axis A1Z. The X interferometer 41 emits detection light in parallel with the X-axis direction (along the XY plane) to the movable mirror 61, and receives the reflected light reflected by the movable mirror 61. Based on the result of interference between the reflected light and the reference light, the distance to the moving mirror 61 (the position in the X-axis direction) is detected. Similarly, the X interferometer 42 detects the distance to the movable mirror 61 (the position in the X-axis direction). The X interferometer 41 is disposed such that the optical axis of the detection light coincides with or substantially coincides with the second rotation axis A2X. That is, the X interferometer 41 is disposed such that the optical axis of the detection light passes in the XY plane including the measurement point P. Therefore, by using this X interferometer 41, the position (distance) in the X axis direction can be detected (measured) without the occurrence of Abbe error.

FIG. 15A shows the Z stage 13 in a horizontal state parallel to the XY plane. That is, the Z stage 13 is in a state in which the angle around the Y axis is 0 °. In this state, the detection results output from the

X interferometers

41 and 42 have the same value. FIG. 15B shows a state in which the Z stage 13 is rotated about the Y axis from the XY plane. That is, the Z stage 13 is in a state of being inclined about the Y axis by an angle θ3 °. In this state, the value output from the X interferometer 41 differs from the value output from the X interferometer. In the example shown in FIG. 15B, the value output from the X interferometer 42 is output from the X interferometer 41, where the distance LA from the optical axis of the X interferometer 41 to the optical axis of the X interferometer 42 is Is longer by LA tan θ3 than the value

The control unit 50 calculates that the Z stage 13 is inclined by θ3 ° around the Y axis based on LAtan θ3 which is the difference between the values output from the

X interferometers

41 and 42. The control unit 50 calculates the displacement in the X axis direction at the measurement point P since the Z stage 13 is inclined by θ3 ° around the Y axis, and uses the displacement as the offset amount in the X axis direction to move the X stage 11 Control.

The X interferometer 46 (see FIG. 4) is disposed away from the X interferometer 41 in the Y-axis direction. By comparing the value output from the X interferometer 46 with the value output from the X interferometer 41, it is possible to calculate the amount of rotation around the Z axis of the Z stage 13 as described above. The control unit 50 can control the amount of rotation of the θZ stage 14 using this amount of rotation as an offset amount.

In FIG. 16, as in FIG. 15, a method of calculating the angle around the X axis from the distances detected by the

Y interferometers

43 and 44 will be described. The Y interferometers 43 and 44 function as an inclination detection unit that detects the inclination of the Z stage 13 (θZ stage 14) around the X axis with respect to the XY plane (first plane) perpendicular to the first rotation axis A1Z. The Y interferometer 43 emits detection light in parallel with the Y-axis direction (along the XY plane) to the movable mirror 62, and receives the reflected light reflected by the movable mirror 62. Based on the result of interference between the reflected light and the reference light, the distance to the movable mirror 62 (the position in the Y-axis direction) is detected. Similarly, the Y interferometer 44 detects the distance to the moving mirror 62 (the position in the Y-axis direction).

FIG. 16A shows the Z stage 13 in a horizontal state parallel to the XY plane. That is, the Z stage 13 is in a state in which the angle around the X axis is 0 °. In this state, the detection results output from the

Y interferometers

43 and 44 have the same value. FIG. 16B shows a state in which the Z stage 13 is rotated about the X axis from the XY plane. That is, the Z stage 13 is in a state of being inclined about the X axis by an angle θ4 °. In this state, the value output from the Y interferometer 43 and the value output from the Y interferometer 44 differ. In the case of the example shown in FIG. 16B, the value output from the Y interferometer 44 is output from the Y interferometer 43, where the distance LB from the optical axis of the Y interferometer 43 to the optical axis of the Y interferometer 44 is Is longer by LB tan θ 4 than the value

The control unit 50 calculates that the Z stage 13 is inclined by θ4 ° around the X axis based on LB tan θ4 which is a difference between values output from the

Y interferometers

43 and 44. The control unit 50 calculates the displacement in the Y axis direction at the measurement point P since the Z stage 13 is inclined by θ4 ° around the X axis, and uses the displacement as the offset amount in the Y axis direction to move the Y stage 12 Control.

In the present embodiment, even when the optical unit 20 orbits by the θX stage 31, the probe light is set to be irradiated toward the measurement point P on the second rotation axis A2X. Furthermore, the X interferometer 41 is set so that the optical axis of the detection light passes the measurement point P along the second rotation axis A2X, and the Y interferometer 43 has the optical axis of the detection light the measurement point P It is set to pass through. With this configuration, occurrence of Abbe error can be suppressed, and the desired position of the object to be measured W can be accurately positioned as the measurement point P.

In the embodiment described above, the configuration in which the optical unit 20 separately arranges the distance detector 21 and the angle detector 22 is described as an example, but the present invention is not limited to this configuration. For example, the optical unit 20 may perform distance detection and angle detection using one light source. FIG. 17 is a view schematically showing another example of the optical unit. The optical unit 20A shown in FIG. 17 includes a light source 301, a condensing lens 302, a collimator lens 303, a half mirror 304, a condensing lens 305, a light detector 306 for detecting a distance, and light for detecting an angle. And a detector 307.

The light source 301 generates a probe light PL3. The probe light PL3 is irradiated along the YZ plane, and irradiated to the measurement surface WS (measurement point P). The light source 301 is a laser light source whose oscillation wavelength, light output, beam diameter and the like are stabilized. For example, a fiber laser, a distributed feedback laser, etc. are used. The light source 301 includes a collimator at an output unit, and outputs a probe light PL3 as a parallel light flux. The condenser lens 302 condenses the probe light PL3 generated by the light source 301 and irradiates the measurement surface WS (measurement point P) of the object W.

The collimating lens 303 converts the reflected light RL3 reflected by the measurement surface WS into a parallel light flux. The half mirror 304 reflects a part of the reflected light RL3 that has been collimated by the collimator lens 303, and transmits the remaining part. The condensing lens 305 condenses the reflected light (first reflected light) RL31 reflected by the half mirror 304. The light detector 306 for distance detection is a detector for receiving the reflected light RL31 condensed by the condensing lens 305 and detecting the position of the reflected light RL31 to measure the distance to the measurement surface WS. . As the light detector 306, for example, an image sensor such as a CCD or a CMOS or an organic photodiode is used.

The light detector 307 for angle detection receives the reflected light (second reflected light) RL32 transmitted through the half mirror 304 and detects the position of the reflected light RL32 to measure the angle of the measurement surface WS. As the light detector 307, for example, an image sensor such as a CCD or a CMOS, or an organic photodiode is used. The incident position of the reflected light RL31 on the light detector 306 does not change even if the angle of the measurement surface WS changes, but changes if the position of the measurement surface WS in the Z-axis direction changes. On the other hand, the incident position of the reflected light RL32 in the light detector 307 hardly changes even if the position of the measurement surface WS in the Z-axis direction changes, but changes when the angle of the measurement surface WS changes. Therefore, the control unit 50 can calculate the distance to the measurement surface WS and the angle of the measurement surface WS based on the signals output from the

light detectors

306 and 307.

As described above, according to the surface shape measuring apparatus 100 of the present embodiment, the control unit (control unit) 50 directs the optical unit 20 to the measurement point P based on the reference shape data of the measured object W acquired in advance. As described above, since the optical unit 20 is rotated around the X axis by the θX stage 31 and the object W is rotated around the Z axis by the θZ stage 14, the optical unit 20 is rotated by one θX stage 31. The optical unit 20 can be accurately directed to the measurement point P of the object W, whereby the surface shape of the object W can be measured accurately.

Further, in the present embodiment, since the optical unit 20 is rotated only around the X axis, for example, the apparatus configuration is simplified as compared with a configuration in which the optical unit 20 is rotated around both the X axis and the Y axis. It is possible to reduce the cause of measurement errors.

Second Embodiment
A surface shape measuring apparatus 200 according to a second embodiment will be described with reference to the drawings. FIG. 18 is a view showing an example of the surface shape measuring apparatus 200 according to the second embodiment. In the first embodiment described above, the work stage unit 10 is provided with the θZ stage 14. However, in the surface shape measuring apparatus 200, the work stage unit 10 does not have the θZ stage 14, and the head stage unit 30 is provided with the θZ stage 40. . In the following description, the same or equivalent components as or to those of the embodiment described above are designated by the same reference numerals, and the description will be omitted or simplified. Further, in FIG. 18, the description of the tilt adjustment mechanism 15, the interferometer unit 40A, and the like, and the control unit 50 is omitted.

The surface shape measuring apparatus 200 includes the θZ stage 40 rotatable about the axis of the first rotation axis A1Z on the lower surface side (surface on the -Z side) of the upper frame 84 supported by the base 80 or another portion. There is. The first rotation axis A1Z is set to pass through the measurement point P. The upper frame 84 is provided above the head stage unit 30 (a position away from the + Z axis direction). The θZ stage 40 is rotated by a Z-axis rotating device (not shown). As the Z-axis rotation device, any rotation device such as, for example, an electric rotation motor and a reduction gear is used. The Z-axis rotation device is disposed, for example, on the upper frame 84. Also, the Z-axis rotation device is controlled by the control unit 50 (see FIG. 1).

A horizontal member 85 is attached to the lower surface side and the outer peripheral portion of the θZ stage 40 so as to extend in the radial direction of the θZ stage 40. The third frame 83A is attached to the lower surface of the horizontal member 85 on the -X side, and is provided to extend downward. The third frame 83A is disposed apart from the base 80. The head stage unit 30 is formed on the + X side of the third frame 83A. The second rotation axis A2X of the θX stage 31 is set to pass through the measurement point P, as in the first embodiment.

In the present embodiment, by rotating the θX stage 31 and the θZ stage 40, the direction of the optical unit 20 can be aligned with the measurement point P of the object W to be measured. Therefore, the control unit 50 controls the rotational angles of the θX stage 31 and the θZ stage 40, the X stage 11 of the work stage unit 10, and the like to measure the measurement line L1 etc. (FIG. 7 etc.). The probe light from the optical unit 20 can be accurately directed to each measurement point P along the reference).

In the present embodiment, even when the optical unit 20 is circulated by the θX stage 31 and the θZ stage 40, the probe light is set to be irradiated toward the measurement point P on the second rotation axis A2X. Further, the X interferometer 41 and the Y interferometer 43 which are not shown in FIG. 18 are set so that both detection lights pass through the measurement point P, respectively. With this configuration, as in the first embodiment, the occurrence of Abbe error can be suppressed, and the desired position of the object to be measured W can be accurately positioned as the measurement point P.

[Structure manufacturing system]
FIG. 19 is a diagram showing an example of a structure manufacturing system according to the embodiment by functional blocks. As shown in FIG. 19, the structure manufacturing system 400 includes the surface

shape measuring apparatus

100, 200, the designing apparatus 410, the molding apparatus 420, the control apparatus 430 (inspection apparatus), and the repair apparatus 440 described above.

The design device 410 produces design information on the shape of the structure. Then, the design device 410 transmits the created design information to the molding device 420 and the control device 430. Here, the design information is information indicating the coordinates of each position of the structure. Moreover, a measurement object is a structure.

The shaping device 420 shapes the structure based on the design information transmitted from the design device 410. The forming process of the forming apparatus 420 includes casting, forging, or cutting. The surface

shape measuring apparatus

100, 200 measures the three-dimensional shape of the structure (the object to be measured W) produced by the forming apparatus 420, that is, the coordinates of the surface of the structure. In the surface

shape measuring apparatus

100, 200, the design information produced by the design apparatus 410 is transmitted, and stored in the storage unit 52 (see FIG. 4) as reference shape data. The surface

shape measuring apparatus

100, 200 transmits, to the control device 430, information (hereinafter referred to as shape information) indicating coordinates measured for the structure.

The control device 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores design information transmitted from the design device 410. The inspection unit 432 reads the design information from the coordinate storage unit 431. Further, the inspection unit 432 compares the design information read from the coordinate storage unit 431 with the shape information transmitted from the surface shape measuring apparatus 100. Then, based on the comparison result, the inspection unit 432 inspects whether or not the structure is formed according to the design information.

Further, the inspection unit 432 determines whether the structure formed by the forming device 420 is non-defective. Whether or not the structure is non-defective is determined based on, for example, whether or not the error between the design information and the shape information is within a predetermined threshold range. Then, when the structure is not shaped as the design information, the inspection unit 432 determines whether or not the structure can be repaired as the design information. If it is determined that the repair can be performed, the inspection unit 432 calculates the defective portion and the amount of repair based on the comparison result. Then, the inspection unit 432 transmits, to the repair device 440, information indicating a defective portion (hereinafter, referred to as defective portion information) and information indicating a repair amount (hereinafter, referred to as repair amount information).

The repair device 440 processes the defective portion of the structure based on the defective portion information and the repair amount information transmitted from the control device 430.

[Method of manufacturing structure]
FIG. 20 is a flowchart showing processing by the structure manufacturing system 400, and shows an example of an embodiment of a structure manufacturing method. As shown in FIG. 20, the design device 410 produces design information on the shape of the structure (step S01). The design device 410 transmits the created design information to the molding device 420 and the control device 430. Control device 430 receives the design information transmitted from design device 410. Then, the control device 430 stores the received design information in the coordinate storage unit 431.

Next, the forming apparatus 420 forms a structure based on the design information created by the design apparatus 410 (step S02). Then, the surface

shape measuring apparatus

100, 200 measures the three-dimensional shape (the surface shape of the object to be measured W) of the structure formed by the forming device 420 (step S03). Thereafter, the surface shape measuring apparatus 100 200 transmits, to the control device 430, shape information which is a measurement result of the structure. Next, the inspection unit 432 compares the shape information transmitted from the surface shape measuring apparatus 100 with the design information stored in the coordinate storage unit 431, and determines whether the structure is formed according to the design information. Check (step S04).

Next, the inspection unit 432 determines whether the structure is non-defective (step S05). If it is determined that the structure is non-defective (step S05: YES), the process by the structure manufacturing system 400 is ended. On the other hand, when the inspection unit 432 determines that the structure is not good (step S05: NO), the inspection unit 432 determines whether the structure can be repaired (step S06).

When it is determined that the inspection unit 432 can repair the structure (step S06: YES), the inspection unit 432 calculates the defective portion and the amount of repair of the structure based on the comparison result of step S04. Then, the inspection unit 432 transmits the defect site information and the repair amount information to the repair device 440. Repair apparatus 440 performs repair (re-processing) of the structure based on the defect site information and the repair amount information (step S07). Then, the process proceeds to step S03. That is, the process after step S03 is performed again on the structure for which the repair device 440 has performed repair. On the other hand, when the inspection unit 432 determines that the structure can not be repaired (step S06: NO), the process by the structure manufacturing system 400 is ended.

As described above, in the structure manufacturing system 400 and the structure manufacturing method, the inspection unit 432 follows the design information based on the measurement result of the surface shape of the structure (object W) by the surface

shape measuring apparatus

100 and 200. It is determined whether or not a structure has been produced. As a result, it is possible to accurately determine whether or not the structure produced by the forming device 420 is non-defective, and the time of the determination can be shortened. Further, in the above-described structure manufacturing system 400, when it is determined by the inspection unit 432 that the structure is not good, repair of the structure can be performed immediately.

In the structure manufacturing system 400 and the structure manufacturing method described above, instead of the repair device 440 performing the process, the forming device 420 may perform the process again.

As mentioned above, although embodiment was described, it is possible in the range which does not deviate from the meaning of the present invention to add various change or improvement to each embodiment. In addition, one or more of the requirements described in each embodiment may be omitted. Such modifications, improvements and omissions are also included in the technical scope of the present invention. Moreover, it is also possible to apply combining the structure of each embodiment or modification suitably. In addition, the disclosures of all of the published publications and US patents related to the measuring apparatus and the like cited in the respective embodiments and modifications are incorporated as part of the description of the text as far as the laws and regulations permit.

In the above embodiment, the control unit 50 includes, for example, a computer system. The control unit 50 reads the surface shape measurement program stored in the storage unit 52, and executes various processes according to the program. The surface shape measurement program causes the computer to support the θZ stage 13 (stage) for supporting the object W based on the reference shape data of the object W acquired in advance, and the first rotation axis (first axis) A1Z. An optical unit arranged to face the θZ stage 13 to detect the distance to the measurement point P of the object W and / or the inclination of the surface of the object W at the measurement point P. The first rotation axis (first measurement unit) 20 is set such that the reference axis S of the optical unit 20 is at a predetermined angle with respect to the tangent plane WA of the reference shape of the object W at the measurement point P. Axis) A process of rotating around a second rotation axis (second axis) A2X orthogonal to A1Z. The surface shape measurement program may be provided by being recorded on a computer readable storage medium (eg, non-transitory storage medium, non-transitory tangible media).

Also, as used herein, the expressions "match", "parallel", "orthogonal", "vertical", "in plane", etc. include substantially match, parallel, orthogonal, vertical, in plane, etc. It is a meaning. In addition, "substantially" or "approximately" described above is used in a sense including the case that occurs due to manufacturing errors of parts, variations due to assembly, and the like.

100, 200: surface shape measuring device, P: measuring point, Pi: measuring object point, PL1: first probe light, PL2: second probe light, RL1: first Reflected light, RL2: Second reflected light, S: Reference axis, W: Measured object, WA: Tangent surface, WS: Measurement surface (surface shape), 10: Workpiece Stage unit, 11 ... X stage, 12 ... Y stage, 13 ... Z stage, 14 ... θ Z stage (stage), 15 ... Tilt adjustment mechanism, 20, 20A ... Optical unit (Measuring part), 21 ... distance detector, 21A, 22A ... irradiating part, 21B, 22B ... detecting

part

22, 22 ... angle detector, 30 ... head stage unit, 31 ... θX stage (second axis rotation stage), 50 ... control Unit (control unit)

Claims

An apparatus for measuring the surface shape of an object to be measured, wherein
A stage capable of supporting the object to be measured and rotatable about a first axis;
The object to be measured is disposed opposite to the stage and is rotatable about a second axis orthogonal to the first axis, and / or the distance to the measurement point of the object to be measured and / or the object to be measured at the measurement point A measuring unit that detects the inclination of the surface of the
Based on the reference shape data of the object to be measured acquired in advance, the reference axis of the measurement unit is at a predetermined angle with respect to the tangent plane of the reference shape of the object at the measurement point. A control unit configured to rotate the stage about the first axis and rotate the measurement unit about the second axis.
The measurement unit includes an irradiation unit that irradiates the object to be measured with irradiation light, and a detection unit that detects reflected light from the object to be measured.
The surface shape measuring apparatus according to claim 1, wherein a relative angle between the irradiation unit and the detection unit is determined.
The surface shape measuring apparatus according to claim 2, wherein the reference axis is a symmetry axis between an optical axis of the irradiation light and an optical axis of the reflected light.
The surface shape measuring apparatus according to any one of claims 1 to 3, wherein the measurement unit is provided on a second axis rotation stage that rotates around the second axis.
The surface shape measuring apparatus according to claim 4, wherein the measurement unit is provided on the second axis rotation stage away from the second axis.
The surface shape measuring device according to claim 4 or 5, wherein the second axis rotation stage is disposed with the second axis passing through the measurement point.
The surface shape measuring apparatus according to any one of claims 4 to 6, wherein the measurement unit is attached to a tip portion of an arm extending in the direction of the second axis from the second axis rotation stage.
The stage according to any one of claims 1 to 7, wherein movement of the stage in a direction along a first plane perpendicular to the first axis and movement in the first axial direction are possible. Surface shape measuring device.
The surface shape measuring apparatus according to any one of claims 1 to 8, wherein the stage includes a tilt adjusting mechanism that adjusts the tilt of the object to be measured.
The surface shape measuring apparatus according to any one of claims 1 to 9, further comprising: a tilt detection unit that detects a tilt of the stage relative to a first plane perpendicular to the first axis.
The surface shape measuring apparatus according to claim 10, further comprising a position detection unit that detects a movement position of the stage in the direction along the first plane and / or a rotational position about the first axis.
The position detection unit irradiates detection light toward a reflecting mirror provided on the stage, and detects the movement position and / or the rotation position using the detection light reflected by the reflection mirror. The surface shape measuring device as described in 11.
The surface shape measuring apparatus according to claim 12, wherein the position detection unit is disposed such that an optical axis of the detection light passes in the first plane including the measurement point.
The surface shape measurement according to any one of claims 1 to 13, further comprising: a calculation unit that calculates a surface shape of the object based on the reference shape data and a detection result by the measurement unit. apparatus.
The surface shape measuring apparatus according to any one of claims 1 to 14, wherein the control unit rotates the measurement unit in one degree of freedom of rotation only about the second axis.
The control unit controls the rotation and movement of the stage and the rotation of the measurement unit such that the reference axis of the measurement unit is orthogonal to the tangential plane. The surface shape measuring device according to one item.
The control unit controls rotation and movement of the stage such that a plurality of measurement target points on the surface of the object to be measured, which are provided along a predetermined measurement line, are sequentially positioned at the measurement points. The surface shape measuring device according to any one of claims 1 to 16.
An apparatus for measuring the surface shape of an object to be measured, wherein
A stage capable of supporting the object to be measured and rotatable about a first axis;
The object to be measured is disposed opposite to the stage and is rotatable about a second axis orthogonal to the first axis, and / or the distance to the measurement point of the object to be measured and / or the object to be measured at the measurement point A measuring unit for detecting the inclination of the surface of the
The surface shape measuring device, wherein the second axis is disposed to pass through the measurement point of the object to be measured.
The surface shape measuring apparatus according to claim 18, wherein the measurement unit is rotatable around the first axis and the second axis.
A method of measuring the surface shape of an object to be measured, wherein
Based on the reference shape data of the object to be measured acquired in advance,
Rotating the stage supporting the object to be measured about a first axis;
A measurement unit disposed opposite to the stage to detect the distance to the measurement point of the object and / or the inclination of the surface of the object at the measurement point is the measurement point at the measurement point. Rotating around a second axis orthogonal to the first axis such that the reference axis of the measurement unit is at a predetermined angle with respect to the tangent plane of the reference shape of the object to be measured. Shape measurement method.
A design device for producing reference shape data on the shape of a structure;
A forming apparatus for forming the structure based on the reference shape data;
The surface shape measuring device according to any one of claims 1 to 19, which measures the surface shape of the formed structure.
A structure manufacturing system, comprising: an inspection device which compares measurement data on the surface shape of the structure obtained by the surface shape measuring device with the reference shape data.
Generating reference shape data on the shape of the structure;
Shaping the structure based on the reference shape data;
The surface shape measuring method according to claim 20, wherein the surface shape of the molded structure is measured.
Comparing the measurement data on the surface shape of the structure obtained by the surface shape measuring method with the reference shape data.
A computer included in a surface shape measuring device that measures the surface shape of an object to be measured;
Based on the reference shape data of the object to be measured acquired in advance,
A process of rotating a stage supporting the object to be measured about a first axis;
A measurement unit disposed opposite to the stage and detecting the distance to the measurement point of the object and / or the inclination of the surface of the object at the measurement point is the measurement point at the measurement point A process of performing a process of rotating around a second axis orthogonal to the first axis such that the reference axis of the measurement unit is at a predetermined angle with respect to the tangent plane of the reference shape of the object Measurement program.