WO2019058469A1 - Electronic device - Google Patents

Abstract

Provided is an electronic device in which a container 110 contains a refrigerant COO sealed therein which has thermal conductivity and experiences a phase change between a liquid-phase refrigerant LP-COO and a gas-phase refrigerant GP-COO. A rectification plate 141 extends from an outer peripheral portion of each of a plurality of heating bodies 130 toward a first container inner surface 115 of the container. In order to receive heat from each of the plurality of heating bodies, a heat receiving region is set for each of the plurality of heating bodies. The heat receiving region has an area which is set to increase in accordance with an increase in the amount of heat generated from each of the plurality of heating bodies. The heat receiving region is a region enclosed by an enclosing line which is set along a projected line that appears on the first container inner surface when the end side of the rectification plate on the first container inner surface side is projected in a direction perpendicular to the first container inner surface among inner surfaces of the container. In this way, even when the plurality of heating bodies have different amounts of heat generation, each of the plurality of heating bodies can be efficiently cooled using a simple configuration.

Description

Electronic device

The present invention relates to an electronic device, for example, an electronic device for cooling a heating element immersed in liquid phase refrigerant or the like.

In recent years, dust and dirt are deposited on electronic devices (for example, base stations and servers of mobile phones, etc.) installed in places where dust and dirt and the like are often contained in the air (for example, coastal areas and factories). A sealed structure is employed to prevent the like from entering the electronic device. For this reason, heat is easily accumulated inside the electronic device in which the sealed structure is adopted, and it is necessary to efficiently dissipate the heat of the heating element in the electronic device.

As one of such closed structure cooling techniques, a heating element is immersed in a liquid phase refrigerant stored in a container (casing), and the heating element is generated using a refrigerant that changes phase to liquid phase refrigerant and gas phase refrigerant. Patent Document 1 discloses a technique for cooling the air.

In the technology described in Patent Document 1, a sealed container is configured by bonding a ceramic circuit board and a heat dissipation member. In addition, liquid phase refrigerant is stored in the container. The plurality of heating elements are immersed in the liquid phase refrigerant stored in the container. When the heat generating body generates heat, the liquid phase refrigerant in the container is changed in phase to a gas phase refrigerant by the heat of the heat generating body on the surface of the heat generating body. The heat (latent heat) generated by this phase change dissipates the heat generated by the heating element. Thereby, the heating element is cooled. The gas phase refrigerant rises in the container along the vertical direction, and when it is cooled by coming into contact with the inner wall surface of the container, it changes in phase again to a liquid phase refrigerant. This liquid-phase refrigerant descends in the container along the vertical direction, and is again used to cool the heating element. As described above, in the technique described in Patent Document 1, the heat-generating body is cooled by circulating the liquid-phase refrigerant and the gas-phase refrigerant that undergo phase change in the container.

Here, in the invention described in Patent Document 1, the partition walls (fins) extend downward in the vertical direction from the inner surface of the upper wall of the container (the inner surface of the heat dissipation member) among the plurality of heat generating members, It is provided. Thus, by providing the partition between the plurality of heating elements, the gas-phase refrigerant generated by the heat generation of each of the plurality of heating elements is surrounded by the partition and the inner wall of the container. Can be cooled separately.

Japanese Utility Model Publication No. 57-154158

However, in the technique described in Patent Document 1, the partition wall is provided in accordance with the size of the plurality of heating elements disposed in the container. Therefore, when the sizes of the plurality of heating elements are equal to each other, the surface area where the gas phase refrigerant generated by the heat of each of the plurality of heating elements contacts the container and the partition is approximately the same.

For example, in the technology described in Patent Document 1, when the calorific value of each of the plurality of heating elements is different, the heat contained in the gas-phase refrigerant produced by the heating element having a larger calorific value is air produced by the heating element having a smaller calorific value It will be more than the amount of heat contained in the phase refrigerant. On the other hand, as described above, in Patent Document 1, when the sizes of the plurality of heating elements are equal to each other, the respective gas phase refrigerants generated by the heat of the plurality of heating elements have the same surface area in contact with the container and the partition wall. is there.

Therefore, if the surface area of each gas phase refrigerant in contact with the container and the partition is set to the same area according to the amount of heat contained in the gas phase refrigerant generated by the small heat generating element, the air generated by the large heat generating element The phase refrigerant is not sufficiently cooled.

In addition, if the surface area of each gas phase refrigerant in contact with the container and the partition is set to the same area according to the amount of heat contained in the gas phase refrigerant generated by the heating element with a large calorific value, the area according to the heating element with a small calorific value The container is larger than when set. At this time, the gas-phase refrigerant generated by the heat generating element with a small heat generation amount is cooled with a surface area larger than necessary. Thus, when the surface area is set to match the heating element with a large calorific value, the container becomes larger than necessary.

As described above, when a plurality of heating elements having different amounts of heat generation are applied to the technique described in Patent Document 1, the plurality of heat generating elements can not be efficiently cooled according to the respective amounts of heat generation.

Further, in the technology described in Patent Document 1, since the partition wall is provided on the inner wall of the container, the container can be rebuilt if it is necessary to change the size of the heating element and the arrangement position of the heating element in the container. There was a problem of having to

The present invention has been made in view of the above problems, and it is an object of the present invention to provide an electron which can efficiently cool each of a plurality of heating elements with a simple configuration even if the amount of heat generation differs among the plurality of heating elements. It is providing a device.

The electronic device according to the present invention has a heat conductivity, a container for sealing a refrigerant that changes in phase between a liquid phase refrigerant and a gas phase refrigerant, and a first one of the inner surfaces of the container. A first main surface facing the inner surface of the container, the substrate provided in the container, the first heat generating member outer surface, the first heat generating member outer surface and the first container inner surface The plurality of heating elements attached to the first main surface so as to face each other and immersed in the liquid phase refrigerant, and the outer peripheral portions of the plurality of heating elements are directed toward the inner surface side of the first container And one or more straightening vanes provided so as to extend, wherein an end side of the one or more straightening vanes on the first vessel inner face side of the one or more straightening vanes is disposed on the first vessel inner face An enclosure set along one or more projection lines appearing on the inner surface of the first container when projected in a direction perpendicular to the above An area of each of the heat receiving areas which is an area surrounded by a line and is an area set for each of the plurality of heating elements to receive the heat of each of the plurality of heating elements is It is set to increase as the amount of heat generation of each heating element increases.

According to the electronic device of the present invention, each of the plurality of heating elements can be efficiently cooled with a simple configuration even if the amount of heat generation differs among the plurality of heating elements.

It is a front transparent view which shows the structure of the electronic device in the 1st Embodiment of this invention. FIG. 2 is a side transparent view showing the configuration of the electronic device according to the first embodiment of the present invention. It is a figure which shows a heat receiving area. It is a figure for demonstrating the baffle plate in the 1st modification of the electronic device in the 1st Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 2nd modification in the 1st Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 2nd Embodiment of this invention. It is a figure showing a straightening member. It is a figure for demonstrating the 1st modification of the electronic device in the 2nd Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 3rd Embodiment of this invention. It is a figure which shows a rectification member. It is a front transparent view which shows the structure of the electronic device in the 4th Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 5th Embodiment of this invention. It is a side permeation | transmission figure which shows the structure of the electronic device in the 5th Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 1st modification in the 5th Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 6th Embodiment of this invention. It is a front transparent view which shows the structure of the electronic device in the 7th Embodiment of this invention. It is a side transparent view which shows the structure of the electronic device in the 7th Embodiment of this invention. It is a figure which shows a heat receiving area.

First Embodiment
The electronic device 100 according to the first embodiment will be described based on the drawings. FIG. 1 is a front transparent view showing the configuration of the electronic device 100. As shown in FIG. FIG. 2 is a transparent side view showing the configuration of the electronic device 100. As shown in FIG. Specifically, FIG. 2 is a transparent view when the electronic device 100 is viewed in the direction of arrow a1 in FIG. Moreover, FIG. 3 is a figure which shows heat receiving area | region S1, S2, and S3 which are mentioned later. For example, the electronic device 100 can be used as a communication device such as a mobile phone base station or a server. In addition, the vertical direction G is shown in FIG.1 and FIG.2 for convenience of explanation.

The configuration of the electronic device 100 will be described. As shown in FIGS. 1 and 2, the electronic device 100 includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, and a plurality of rectifying plates 141a to 141c. In the following description, when it is not necessary to distinguish each of the plurality of heating elements 130a to 130c, each of the plurality of heating elements 130a to 130c is referred to as a heating element 130. Further, in the following description, when it is not necessary to distinguish each of the plurality of flow straightening plates 141a to 141c, each of the plurality of flow straightening plates 141a to 141c is referred to as a flow straightening plate 141.

The container 110 will be described. As shown in FIGS. 1 and 2, the container 110 is formed in a rectangular shape. The inside of the container 110 is hollow. In addition, inside the container 110, the substrate 120, the heating element 130, and the current plate 141 are disposed. Further, inside the container 110, a refrigerant described later (Coolant: hereinafter referred to as COO) is sealed. The container 110 has thermal conductivity. For example, as a material of the container 110, a heat conductive member such as stainless steel or aluminum alloy can be used.

As shown in FIGS. 1 and 2, the inner surface of the container 110 includes a first container inner surface 115. The first container inner surface 115 will be described. As shown in FIGS. 1 and 2, the first container inner surface 115 is one of the inner surfaces of the container 110. More specifically, the first container inner surface 115 refers to the inner surface of the upper plate of the container 110 (the upper plate in the vertical direction G in FIGS. 1 and 2). Further, heat receiving areas A1 to A3 described later are set on the first container inner surface 115. The details of the heat receiving areas A1 to A3 will be described later. In the following description, when it is not necessary to distinguish the heat receiving areas A1 to A3, the heat receiving areas A1 to A3 are collectively referred to as the heat receiving area A.

The container 110 is provided with a lid. The lid is a plate that constitutes one surface of the container 110 (for example, the first container inner surface 115) and is removable. Here, it is assumed that the container 110 is completed by combining the lid and the container 110 main body. The lid is fixed to the main body of the container 110 by, for example, screwing. At this time, a rubber-like packing or the like is interposed between the lid and the container 110 main body. Thus, the refrigerant COO can be prevented from leaking from between the lid and the container 110 main body.

The details of the refrigerant COO will be described. In this refrigerant COO, a material which changes its phase between a liquid-phase refrigerant (Liquid-Phase Coolant: hereinafter referred to as LP-COO) and a gas-phase refrigerant (Gas-Phase Coolant: hereinafter referred to as GP-COO) Is used. As shown in FIG. 1 and FIG. 2, the refrigerant COO is confined in a sealed state in the container 110. More specifically, the inside of the container 110 is always maintained at the saturated vapor pressure of the refrigerant by injecting the liquid phase refrigerant LP-COO into the container 110 and thereafter evacuating. 1 and 2 show a gas phase refrigerant GP-COO and a liquid phase refrigerant LP-COO enclosed in a container 110. The gas phase refrigerant GP-COO is located in the gas phase space formed above the liquid surface of the liquid phase refrigerant LP-COO. In addition, bubbles of the gas phase refrigerant GP-COO are generated around the heat generating body 130 by the phase change of the liquid phase refrigerant LP-COO to the gas phase refrigerant GP-COO by the heat of the heat generating body 130 described later. The refrigerant COO includes all liquid phase refrigerant LP-COO and all gas phase refrigerant GP-COO in the container 110.

As the refrigerant COO, for example, hydrofluorocarbon (HFC: Hydro Fluorocarbon) or hydrofluoroether (HFE: Hydro Fluoroether) can be used as a low boiling point refrigerant.

The substrate 120 will be described. As shown in FIGS. 1 and 2, the substrate 120 includes a first major surface 125. The first main surface 125 is a surface that faces the first container inner surface 115 among surfaces constituting the outer shape of the substrate 120. The substrate 120 is provided in the container 110. For example, the substrate 120 is disposed on a rib (not shown) in the container 110 and fixed in the container 110 by screwing or the like. Further, referring to FIGS. 1 and 2, a plurality of heating elements 130a to 130c are attached to the first major surface 125.

The substrate 120 is, for example, a printed wiring board. The printed wiring board is configured by laminating a plurality of insulating substrate and conductor wiring. In addition, conductive pads for mounting electronic components are formed on the front and back surfaces of the printed wiring board. The electronic component is fixed to the pad by soldering. For example, glass epoxy resin is used as a material of the substrate of the insulator. The conductor wiring and the pad are formed of, for example, a copper foil.

The heating element 130 will be described. As shown in FIG. 1, each of the plurality of heating elements 130a, 130b, 130c includes a first heating element outer surface 131a, 131b, 131c. In the following description, when it is not necessary to distinguish each of the first heating element outer surfaces 131a, 131b, and 131c, each of the first heating element outer surfaces 131a, 131b, and 131c is used as the first heating element outer surface 131. It is called. The outer peripheral shape of the first heat generating body outer surface 131 is a square shape. Irregularities may be formed on the first heat generating body outer surface. A plurality of heating elements 130 are attached to the substrate 120. More specifically, the plurality of heating elements 130 are attached to the substrate 120 such that the first heating element outer surface 131 and the first container inner surface 115 face each other. For example, referring to FIGS. 1 and 2, the plurality of heating elements 130a, 130b and 130c are attached to the first major surface 125 by soldering or the like. Also, the plurality of heating elements 130a, 130b and 130c are immersed in the liquid phase refrigerant LP-COO. The calorific value of each of the plurality of heating elements 130a, 130b and 130c may be the same or different.

The heating element 130 is an electronic component that emits heat when operated, and is, for example, a central processing unit (CPU) or an integrated circuit (MCM). The heating element 130 is a cooling target of the electronic device 100.

The rectifying plate 141 will be described. The straightening vane 141 is a flat plate. The baffle plate 141 is provided so as to extend from the outer peripheral portion of each of the plurality of heat generating members 130 toward the first container inner surface 115 side. Specifically, for example, as shown in FIG. 1, the first container is provided from both ends of each heating element 130 in a direction parallel to the first main surface 125 of the substrate 120 as shown in FIG. It is provided to extend toward the inner surface 115 side. The rectifying plate 141 is attached to the heating element 130 by, for example, an adhesive. Further, the current plate 141 is disposed along the outer periphery of the first heat generating body outer surface 131. More specifically, the straightening vanes 141 are disposed along at least sides of the outer periphery of the first heat generating body outer surface 131 facing each other. Further, the straightening vane 141 has rigidity to such an extent that it does not bend due to the flow of the refrigerant COO. The rectifying plate 141 is an example of a first rectifying plate.

Preferably, as shown in FIGS. 1 and 2, each of the flow control plates 141 has an end portion on the first container inner surface 115 side (the upper plate in the vertical direction G in FIGS. 1 and 2) It is disposed close to the one container inner surface 115. The end on the first container inner surface 115 side of the rectifying plate 141 is disposed close to the first container inner surface 115, for example, from the end on the first container inner surface 115 side of the rectifying plate 141. The shortest length to the inner surface 115 of the container is a few mm to a few cm.

Examples of the material of the rectifying plate 141 include resin materials (for example, acrylonitrile butadiene styrene (referred to as Acrylonitrile Butadiene Styrene) copolymer synthetic resin (referred to as ABS resin)) and metal materials (for example, aluminum and aluminum alloy). Used.

By using a heat conductive member such as a metal material for the rectifying plate 141, the rectifying plate 141 can receive the heat of the heating element 130 and transfer it to the liquid phase refrigerant LP-COO.

Here, the details of the heat receiving areas A1 to A3 will be described. FIG. 3 is a view showing a plurality of heat receiving areas A1 to A3 set on the first container inner surface 115. As shown in FIG. More specifically, FIG. 3 is a view showing the heat receiving areas A1, A2 and A3 on the first container inner surface 115. As shown in FIG. As shown in FIG. 3, each of the heat receiving areas A1 to A3 is an area set on the first container inner surface 115. Further, each of the plurality of heat receiving areas A1 to A3 is provided separately from each other. Each of the heat receiving areas A1 to A3 has an end on the first container inner surface 115 side of the rectifying plate 141 provided on the same heating element 130 among the inner surfaces of the container 110 perpendicular to the first container inner surface 115 It is the area | region enclosed by the encircling line set along the one or more projection lines which appear on the 1st container inner surface 115, when it projects in a certain direction.

The heat receiving area A1 will be specifically described with reference to FIG. The side C1 and the side C2 are projected in the direction perpendicular to the first container inner surface 115 of the end side on the first container inner surface 115 side of each of the pair of rectifying plates 141a provided on the same heating element 130a. It is a projection line that appears on the first container inner surface 115 at the same time. Further, M1 and M2 indicate the end of the side C1. N1 and N2 indicate the end of the side C2. The connecting line D1 is a line connecting M1 and N1, and the connecting line D2 is a line connecting M2 and N2.

Here, as shown in FIG. 3, the heat receiving area A1 is an area surrounded by the sides C1 and C2 and the connecting lines D1 and D2. That is, when the heat receiving area A1 is projected in the direction perpendicular to the first container inner surface 115, the end side on the first container inner surface 115 side of each of the pair of flow straightening plates 141a provided in the heating element 130a. It is a region inside the figure formed by connecting the projection lines (sides C1, C2) appearing on the first container inner surface 115 with M1, M2, N1, N2 at the shortest distance. In other words, the heat receiving area A1 projects the end side of each of the pair of flow straightening plates 141a provided on the heating element 130a on the first container inner surface 115 side in a direction perpendicular to the first container inner surface 115 It is an area sandwiched between projection lines (sides C1 and C2) appearing on the first container inner surface 115 at the time. The heat receiving areas A2 and A3 are also set similarly to the heat receiving area A1.

As described above, in the heat receiving area A, the end side on the first container inner surface 115 side of each of the plurality of rectifying plates 141 provided in the heating element 130 is projected in the direction perpendicular to the first container inner surface 115 It is an area inside the figure formed by connecting the projection lines (sides C1 and C2) appearing on the first container inner surface 115 at the shortest distance. Further, in other words, the heat receiving area A projects the end side on the first container inner surface 115 side of each of the pair of flow straightening plates 141 provided in the heating element 130 in the direction perpendicular to the first container inner surface 115 It is an area sandwiched between projection lines (sides C1 and C2) appearing on the first container inner surface 115 at the time.

In any of the setting examples of the heat receiving area A described here, of the inner surface of the container 110, the end side on the first container inner surface 115 side of the rectifying plate 141 provided on the same heating element 130 is the first container An area surrounded by an encircling line (a line connecting M 1, M 2, N 1, N 2) set along a projection line appearing on the first container inner surface 115 when projected in a direction perpendicular to the inner surface 115 It is an example.

Each heat receiving area A is an area set for each of the plurality of heating elements 130 in order to receive the heat of each of the plurality of heating elements 130. The heat receiving areas A1, A2 and A3 shown in FIG. 3 are set to receive the heat of the heating elements 130a, 130b and 130c, respectively.

Further, the areas S1, S2 and S3 of the heat receiving areas A1, A2 and A3 are set in accordance with the amounts of heat generation of the plurality of heating elements 130a, 130b and 130c, respectively. For example, the area of the heat receiving region S1 is set to be larger as the amount of heat generation of the heating element 130a shown in FIG. 3 is larger. On the other hand, the smaller the calorific value of the heat generating body 130a, the smaller the area of the heat receiving region S1. The details of the setting of the area of the heat receiving area will be described in the description of the method of assembling the electronic device 100 described later.

The configuration of the electronic device 100 has been described above.

Next, a method of manufacturing the electronic device 100 will be described using FIGS. 1 to 3.

First, the container 110, the substrate 120, the plurality of heating elements 130a to 130c, the pair of rectifying plates 141a to 141c, and the refrigerant COO are prepared. Before the manufacturing of the electronic device 100, the substrate 120, the heat generating members 130a to 130c, and the pair of flow regulating plates 141a to 141c are not disposed inside the container 110. Further, the refrigerant COO is not enclosed in the container 110. As shown in FIG. 1, it is assumed that the heating elements 130a to 130c are attached to the substrate 120 by soldering or the like. Further, it is assumed that the calorific value of each of the heating elements 130a to 130c in a unit time is previously determined for each heating element 130. For example, the calorific value of the heating element 130 is the calorific value at the rating of the heating element 130 (hereinafter referred to as the rated calorific value).

Next, a mounting procedure (first manufacturing procedure) will be described in which the pair of rectifying plates 141 is attached to the heating element 130 and the rectifying plate 141 fixes the substrate 120 attached to the heating element 130 to the container. As shown in FIG. 3, the pair of flow straightening plates 141 are attached to the outer peripheral portion of the heat generating body 130 by adhesion with an adhesive or the like.

Under the present circumstances, the direction attached to each heat generating body 130 of a pair of flow straightening plates 141 is determined based on the emitted-heat amount of the heat generating body 130 as follows. The calorific value of the heating elements 130a, 130b and 130c is H1, H2 and H3. Further, the areas of the heat receiving areas A1, A2 and A3 are S1, S2 and S3. In the following description, when it is not necessary to distinguish the areas S1, S2, and S3, each of the areas S1, S2, and S3 is referred to as S. At this time, the ratio of the areas S1, S2 and S3 is set to be equal to the ratio of H1, H2 and H3. That is, the area of each of the heat receiving regions A1, A2 and A3 is set so that H1: H2: H3 = S1: S2: S3. In other words, the relationship between the calorific value of each of the plurality of heating elements 130 and the area of each of the plurality of heat receiving regions A is a linear proportional relationship. Thus, the area of each of the plurality of heat receiving areas A is set to increase in accordance with the increase in the amount of heat generation of each of the plurality of heat generating members 130.

Note that the actual heat receiving area area (SA) was determined from the ratio to the above-mentioned heat generation amount due to the displacement of the mounting angle of the straightening vane 141, the deviation of the length of the straightening vane 141 from the design value, etc. It may fluctuate from the area (S) of the heat receiving area. At this time, the value of SA is preferably 90 to 110% of the value of S. That is, the relationship between the area (SA) of the heat receiving area and the area (S) of the heat receiving area determined from the ratio of the actual heat receiving area to the area of the heat receiving area It is preferable that it is a real number between

Here, it is assumed that the length of the width of the rectifying plates 141a to 141c (the length of the rectifying plate 141 in the direction perpendicular to the vertical direction G in FIG. 2) is equal. In this case, as shown in FIG. 3, the lengths of the projection lines corresponding to the flow regulating plates 141a to 141c provided in each of the heating elements 130a to 130c are equal to one another. Therefore, if the areas S1, S2 and S3 of the thermal areas A1, A2 and A3 are determined, L1, L2 and L3 (the distance between the projection line of the pair of rectifying plates 141 and the first container inner surface 115 shown in FIG. The length of) is decided. As a result, in accordance with L1, L2 and L3, the mounting direction of the pair of rectifying plates 141a to 141c with respect to the heating element 130 can be determined. More specifically, the angles (referred to as attachment angles) at which each of the pair of current plates 141a to 141c is attached to each of the heat generating members 130a to 130c can be determined in accordance with L1, L2, and L3.

Then, while adjusting the attachment angles of the pair of rectifying plates 141a to 141c to the heating elements 130a to 130c in accordance with L1, L2 and L3, each of the pair of rectifying plates 141a to 141c is adjusted to each of the heating elements 130a to 130c. Attach to At this time, on the first container inner surface 115, the pair of flow regulating plates 141a to 141c are attached to the heating elements 130a to 130c while adjusting the attachment angle so that each of the regions A1 to A3 does not overlap. After that, the substrate 120 having the rectifying plate 141 attached to the heating element 130 is fixed in the container 110 by screwing or the like. Then, the container 110 is covered. Thereby, the inside of the container 110 becomes an enclosed space.

Next, the sealing procedure (second manufacturing procedure) of the refrigerant COO will be described. The lid of the container 110 is formed with a hole for injecting the refrigerant COO (not shown). The liquid phase refrigerant LP-COO is injected into the inside of the container 110 through the hole for injecting the refrigerant COO in the container 110. At this time, the liquid phase refrigerant LP-COO is injected into the container 110 until the heating element 130 is immersed in the refrigerant LP-COO. Next, the liquid phase refrigerant LP-COO is injected into the container 110 and then evacuated using a pump (not shown) or the like to maintain the inside of the container 110 always at the saturated vapor pressure of the refrigerant. Then, the hole for injecting the refrigerant COO is closed. Thus, the refrigerant COO is sealed in the container 110. Further, the pressure in the container 110 becomes equal to the saturated vapor pressure of the refrigerant COO, and the boiling point of the refrigerant COO sealed in the container 110 becomes around room temperature.

Through the above steps, as shown in FIG. 1, the refrigerant COO, the substrate 120, the plurality of heating elements 130a to 130c, and the rectifying plates 141a to 141c are disposed in the container 110.

The method of manufacturing the electronic device 100 has been described above.

Next, the operation of the electronic device 100 will be described using FIGS. 1 to 3. In the description of the method of cooling the electronic device 100, the refrigerant COO, the substrate 120, the plurality of heating elements 130a to 130c, and the plurality of heating elements 130a to 130c and in the container 110 as shown in FIGS. It is assumed that the rectifying plates 141a to 141c are disposed.

When the electronic device 100 is activated, the heating element 130 starts operating. Thereby, the heating element 130 generates heat. When the heating element 130 generates heat, the heat of the heating element 130 is transferred to the liquid phase refrigerant LP-COO. Due to the heat from each of the heat generating members 130a to 130c, a part of the liquid-phase refrigerant LP-COO in contact with each of the heat generating members 130a to 130c undergoes a phase change to a gas phase refrigerant GP-COO. In this manner, latent heat exchange is performed around the surface of the heat generating element 130, and as shown in FIG. 1, the bubbles of the gas phase refrigerant GP-COO are generated. Note that FIG. 2 does not show the bubbles of the gas phase refrigerant GP-COO for the convenience of drawing display. The heat (latent heat) generated by this phase change dissipates the heat generated by the heating element 130. Thereby, the heating element 130 is cooled.

The bubbles of the gas phase refrigerant GP-COO are generated in the vicinity of the heating element 130 and then go upward in the vertical direction G, pass through the liquid surface of the liquid phase refrigerant LP-COO, and go further upward in the vertical direction G . In addition, since the hydraulic pressure decreases as the water surface is approached, the bubbles increase as the water surface is approached. Then, when the gas-phase refrigerant GP-COO which has undergone a phase change from the liquid-phase refrigerant LP-COO by the heat of the heating element 130 is cooled by coming into contact with the inner wall surface of the container 110, the phase is changed again to the liquid-phase refrigerant LP-COO. Change. The liquid-phase refrigerant LP-COO descends in the container 110 downward in the vertical direction G, accumulates on the lower side of the container 110 in the vertical direction G, and is used again to cool the heating element 130.

Here, as shown in FIG. 1, a pair of rectifying plates 141 a, 141 b and 141 c are attached to the respective heating elements 130 a, 130 b and 130 c. Therefore, the gas-phase refrigerant GP-COO changed in phase from the liquid-phase refrigerant LP-COO by the heat of the heating elements 130a, 130b, 130c is applied to the pair of rectifying plates 141a, 141b, 141c provided for each heating element 130. Ascend in the sandwiched space. For example, the gas-phase refrigerant GP-COO generated on the surface of the heating element 130a ascends in the space sandwiched by the pair of flow straightening plates 141a. The same applies to the gas-phase refrigerant GP-COO generated on the surfaces of the heating elements 130b and 130c.

Here, the heat receiving areas A1, A2 and A3 are areas surrounded by the encircling lines set along the projection lines of the pair of rectifying plates 141a, 141b and 141c and the first container inner surface 115 as described above. .

For this reason, the gas phase refrigerant GP-COO generated in each of the plurality of heating elements 130a, 130b and 130c rises in the space sandwiched by the pair of rectifying plates 141a, 141b and 141c, and then receives the heat receiving area A1. , A2 and A3 respectively.

Thus, the heat generated in each of the heating elements 130 is transferred to the vessel 110 within the range of each of the heat receiving areas A and is cooled. For example, the gas-phase refrigerant GP-COO containing the heat generated by the heating element 130a is transferred to the vessel 110 and cooled within the range of the heat receiving area A1.

The gas phase refrigerant GP-COO generated in each of the plurality of heat generating members 130 is phase-changed to liquid phase refrigerant LP-COO by being cooled by the container 110 as described above. Then, the phase-changed liquid-phase refrigerant LP-COO descends in the direction in which the liquid-phase refrigerant LP-COO is stored (downward in the vertical direction G in FIGS. 1 and 2), and the heating element 130 again Used for cooling.

The operation of the electronic device 100 has been described above.

In the description of the heat receiving area A of the electronic device 100, the outer peripheral shape of the first heat generating body outer surface 131 is square.

On the other hand, the outer peripheral shape of the first heat generating body outer surface 131 may be a circle, an ellipse, or a convex polygon other than a square. In this case, the straightening vane 141 may be disposed along the entire circumference of the outer periphery of the first heat generating body outer surface 131. The heat receiving area A at this time is an area inside the figure surrounded by the projection line. The shape of the heat receiving area A is a shape similar to the outer peripheral shape of the first heat generating body outer surface 131. For example, when the outer peripheral shape of the first heat generating body outer surface 131 of the heat generating body 130 is elliptical, the shape of the heat receiving region A corresponding to the heat generating body 130 is similar to the outer peripheral shape of the first heat generating body outer surface 131 It is elliptical.

On the other hand, for example, when the figure enclosed by the projection line does not fit inside the first container inner surface 115, a part of the shape similar to the outer peripheral shape of the first heat generating member outer surface 131 is deformed, It deforms so as to fit on the first container inner surface 115. In this case, the heat receiving area A may have the same area as the figure surrounded by the projection line, and may not have a shape similar to the outer peripheral shape of the first heat generating body outer surface 131. That is, the heat receiving area A may have the same area as the figure surrounded by the projection line, and may have a shape whose aspect ratio is different from the shape of the first heat generating body outer surface 131.

In addition, when the outer peripheral shape of the first heat generating body outer surface 131 is a circle, an oval, or a convex polygonal shape other than a quadrangle, the flow straightening plates 141 are plural and the outer periphery of the first heat generating body outer surface 131 It may be provided along only a part. In this case, the plurality of straightening vanes 141 are provided along 50% or more of the outer circumference of the first heat generating body outer surface 131, and the outer circumference of the gap between any two straightening vanes 141 adjacent on the outer circumference. It is necessary to be arranged so that the lengths measured along are substantially equal to each other. For example, when the outer peripheral shape of the first heat generating body outer surface 131 is a regular hexagonal shape, each of the three first straightening vanes 141 is spaced apart from each other by one side of the regular hexagon. Above, provided on each of the three sides of the regular hexagon. That is, on the outer periphery of the regular hexagon, the side provided with the straightening vane 141 and the side not provided with the straightening vane 141 are alternately set.

When a plurality of rectifying plates 141 are provided along only a part of the outer periphery of the first heat generating body outer surface 131, the respective projection lines do not intersect, so the area surrounded by the respective projection lines is Not formed. In this case, as described above, the heat receiving area A can be the area formed inside the figure obtained by connecting the ends of the projection lines by the shortest distance. In this case, for example, when the projection line is a plurality of arcs having the same center point and radius, the heat receiving area A is an area inside the figure formed by connecting the ends of the arcs at the shortest distance. , Heat receiving area A. At this time, when the area inside the figure formed by connecting the ends of the plurality of arcs at the shortest distance and the area inside the circle including the plurality of arcs approximate each other (for example, the difference value between both areas) Is within 5% of the area inside the circle), the heat receiving area A can be the area inside the circle including a plurality of arcs. Although the case where the projection line is a plurality of arcs has been described here, similar approximation is possible even if the projection line is a partial curve of an ellipse.

As described above, the electronic device 100 according to the first embodiment of the present invention includes the container 110, the substrate 120, the plurality of heating elements 130, and the rectifying plate 141. The container 110 has thermal conductivity, and encloses the refrigerant COO which changes phase between the liquid phase refrigerant LP-COO and the gas phase refrigerant GP-COO. The first substrate 120 has a first major surface 125 facing the first container inner surface 115 which is one of the inner surfaces of the container 110. In addition, the first substrate 120 is provided in the container 110. Each of the plurality of heating elements 130 has a first heating element outer surface 131. The plurality of heat generating members 130 are attached to the first main surface 125 so that the first heat generating member outer surface 131 and the first container inner surface 115 face each other, and are immersed in the liquid phase refrigerant LP-COO. The baffle plate 141 is provided so as to extend from the outer peripheral portion of each of the plurality of heat generating members 130 toward the first container inner surface 115 side. Further, the number of the straightening vanes 141 is one or more. In addition, the area of each of the heat receiving areas, which is an area set for each of the plurality of heating elements 130 in order to receive the heat of each of the plurality of heating elements 130, increases the calorific value of each of the plurality of heating elements 130 It is set to increase according to. Further, the heat receiving area is the first when the end side of the one or more flow straightening plates 141 on the first container inner surface 115 side of the inner surface of the container 110 is projected in the direction perpendicular to the first container inner surface 115. Is an area surrounded by an encircling line set along a projection line appearing on the inner surface 115 of the container.

Thus, the area of each of the heat receiving areas A, which is an area set for each of the plurality of heating elements 130 in order to receive the heat of each of the plurality of heating elements 130 It is set to increase as the amount of heat generation increases. Therefore, according to each calorific value of a plurality of heating elements 130, a plurality of heat receiving areas A can be set. Thereby, the area of each of the plurality of heat receiving areas A can be set so that the heat generated by each heating element 130 can be received without excess or deficiency. Therefore, the total area of the plurality of heat receiving areas A can be adjusted to the necessary minimum. Therefore, since the area of the container inner surface 115 can be set to the necessary minimum, the size of the container 110 can be adjusted to the minimum required size.

As described above, in the technique described in Patent Document 1, when the sizes of the plurality of heating elements are equal to each other, the surface area where each gas phase refrigerant generated by the heat of each of the plurality of heating elements contacts the container and the partition It is the same. In this case, the surface area of each of the gas phase refrigerants generated from the plurality of heating elements in contact with the container and the partition is set to the same area according to the amount of heat contained in the gas phase refrigerant generated by the small heating element. There is a problem that the gas phase refrigerant generated by the large heating element is not sufficiently cooled. In addition, if the surface area of each gas phase refrigerant in contact with the container and the partition is set to the same area according to the amount of heat contained in the gas phase refrigerant generated by the heating element with a large calorific value, the area according to the heating element with a small calorific value The container will be larger than in the case of setting. At this time, the gas-phase refrigerant generated by the heat generating element with a small heat generation amount is cooled with a surface area larger than necessary. As described above, when each of the surface areas is set according to the heating element having a large calorific value, there is a problem that the container becomes larger than necessary.

On the other hand, in the electronic device 100 according to the first embodiment of the present invention, since each of the plurality of heat receiving areas A can be set according to each amount of heat generation of the plurality of heat generating members 130 The area of the heat receiving area A set in the body 130 can be set smaller for each heating element 130 according to the amount of heat generation. Conversely, the area of the heat receiving area A set for the heating element 130 with a large amount of heat can be set large for each heating element 130 according to the amount of heat generation.

That is, even if the plurality of heating elements 130 includes the heating element 130 having a large amount of heat and the heating element 130 having a small amount of heat, the heat receiving region A can be set for each heating element 130. Therefore, as described above, the area of the first container inner surface 115 in which the heat receiving area A is set can be set to the necessary minimum. As a result, the size of the container 110 can be adjusted to the necessary minimum size.

As described above, in the electronic device 100, the plurality of heat receiving regions A can be set respectively in accordance with the respective calorific values of the plurality of heating elements 130, and the area of the first container inner surface 115 is set to the necessary minimum. As it is possible, the size of the container 110 can be adjusted to the necessary minimum size. Therefore, the plurality of heating elements 130 can be efficiently cooled with the container 110 of the minimum necessary size.

Further, the current plate 141 is provided so as to extend from the outer peripheral portion of each of the plurality of heat generating members 130 toward the first container inner surface 115 side. That is, the current plate 141 is provided to the heat generating body 130. In the technique described in Patent Document 1, the configuration (partition wall) related to the rectifying plate 141 is provided to the configuration (heat dissipation member) related to the container 110. For this reason, unless the structure (heat dissipation member) related to the container 110 is reworked, the arrangement place and the like of the heating element on the ceramic circuit board can not be changed. On the other hand, in the electronic device 100 according to the first embodiment of the present invention, the rectifying plate 141 is provided to the heating element 130. Therefore, the arrangement location and the like of the heating element 130 on the substrate 120 can be changed without recreating the container 110. For this reason, compared with the technique of patent document 1, it can be set as a simple structure.

As described above, according to the electronic device 100 according to the first embodiment of the present invention, the electronic device 100 has a plurality of heating elements 130 with a simple configuration even if the amount of heat generation differs among the plurality of heating elements 130. Can be cooled efficiently.

In the electronic device 100 according to the first embodiment of the present invention, the plurality of heat receiving areas are provided apart from one another.

Thereby, the heat contained in the specific heat receiving area is suppressed from moving to the adjacent heat receiving area. Therefore, the amount of heat contained in each of the plurality of heat receiving regions corresponds to the amount of heat generation of each of the plurality of heat generating members 130. As a result, the electronic device 100 can cool each of the plurality of heating elements 130 more efficiently.

In the electronic device 100 according to the first embodiment of the present invention, the end on the first container inner surface 115 side of at least a part of the one or more rectifying plates 141 is disposed close to the first container inner surface 115 Ru. Here, the end on the first container inner surface 115 side of the rectifying plate 141 being disposed close to the first container inner surface 115 means, for example, the end portion on the first container inner surface 115 side of the rectifying plate 141 And the first container inner surface 115 has a shortest length of several mm to several cm.

As a result, the gas-phase refrigerant GP-COO generated from the heating element 130 flows along the rectifying plate 141 to a position closer to the first container inner surface 115. For this reason, the gas phase refrigerant GP-COO generated from the heating element 130 more reliably contacts the heat receiving region set on the first container inner surface 115. Therefore, the amount of heat contained in each of the plurality of heat receiving regions corresponds to the amount of heat generation of each of the plurality of heat generating members 130. As a result, the electronic device 100 can cool each of the plurality of heating elements 130 more efficiently.

First Modified Example of First Embodiment
Next, an electronic device 100A according to a first modified example of the first embodiment of the present invention will be described. FIG. 4 is a diagram for explaining the electronic device 100A.

The electronic device 100A includes a container 110, a substrate 120, a plurality of heating elements 130a, 130b, and 130c, and a plurality of rectifying plates 141a, 141b, and 141c.

First, the configuration of the electronic device 100A and the electronic device 100 will be compared. In the electronic device 100, the plurality of straightening vanes 141 have the rigidity to such an extent that they do not bend due to the flow of the refrigerant COO. On the other hand, the electronic device 100A is different from the electronic device 100 in that the plurality of straightening vanes 141 are formed of elastic members and have elasticity so as to be bent by the flow of the refrigerant COO. The above is the description of the configuration of the electronic device 100A.

Further, the method of manufacturing the electronic device 100A is equivalent to the method of manufacturing the electronic device 100.

Also, the operation of the electronic device 100A is equivalent to the operation of the electronic device 100. However, in the electronic device 100A, the operation is different when the gas-phase refrigerant GP-COO generated in the vicinity of the heating element 130 ascends the inside of the pair of rectifying plates 141. Specifically, as shown in FIG. 4, in the vicinity of the pair of straightening vanes 141, each of the pair of straightening vanes 141 is a bubble or liquid phase of gas-phase refrigerant GP-COO generated in the vicinity of the heating element 130. By the flow of the refrigerant LP-COO, it is pushed from the central part of the heating element 130 toward the outer peripheral part. Thereby, each of the pair of flow straightening plates 141 is bent in the direction of the arrow p1 in FIG. 4 (the direction from the central portion of the heat generating member 130 toward the outer peripheral portion of the heat generating member 130). As a result, the length L of the interval of the straightening vanes 141 provided on the same heat generating body 130 is further increased by the amount of deflection of the straightening vanes 141 (α shown in FIG. 4). That is, the flow straightening plate 141 can be bent in the direction to widen the heat receiving region A according to the amount of air bubbles of the gas phase refrigerant GP-COO. Under the present circumstances, even if the length L of the space | interval of the baffle plate 141 provided in the same heat generating body 130 becomes long by (alpha) by bending the baffle plate 141, each of several heat receiving area A mutually overlaps. It is set not to. The amount of bubbles of the gas-phase refrigerant GP-COO increases as the amount of heat generation of the heating element 130 increases. Further, as the amount of bubbles of the gas phase refrigerant GP-COO increases, the force of the bubbles of the gas phase refrigerant GP-COO and the flow of the liquid phase refrigerant LP-COO acting on the rectifying plate 141 increases. That is, as the amount of heat generation of the heating element 130 increases, the force of the gas phase refrigerant GP-COO acting on the rectifying plate 141 increases, and the above-mentioned α becomes longer.

As described above, in the electronic device 100A, the rectifying plate 141 is formed of an elastic member. For this reason, it is possible to bend the straightening vane 141 in the direction to widen the heat receiving region A according to the bubble amount of the gas phase refrigerant GP-COO. As a result, the heat receiving region A can be expanded according to the amount of bubbles of the gas phase refrigerant GP-COO.

Second Modification of First Embodiment
Next, an electronic device 100B according to a second modified example of the first embodiment of the present invention will be described. FIG. 5 is a schematic view showing the configuration of the electronic device 100B. In FIG. 5, the components equivalent to the components shown in FIGS. 1 to 4 are given the same reference numerals as the symbols shown in FIGS. 1 to 4.

As shown in FIG. 5, the electronic device 100B includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, and a plurality of rectifying plates 141a to 141c.

Here, the electronic device 100B and the electronic device 100 are compared. In the electronic device 100, the rectifying plate 141 is directly attached to the heating element 130. On the other hand, in the electronic device 100 </ b> B, the rectifying plate 141 is different from the electronic device 100 in that the rectifying plate 141 is attached to the heating element 130 via the base portion 142.

As shown in FIG. 5, the electronic device 100B includes rectifying members 140a to 140c having rectifying plates 141a to 141c and base portions 142a to 142c. In the following description, the rectifying members 140a to 140c are referred to as the rectifying member 140 when it is not necessary to distinguish them. Further, when it is not necessary to distinguish the base portions 142a to 142c, the base portions 142a to 142c are referred to as the base portion 142.

The base portion 142 will be described. As shown in FIG. 5, the base portion 142 is provided on a surface of the outer surface of the heating element 130 facing the first container inner surface 115. The base portion 142 is fixed on the heating element 130 by, for example, an adhesive. Further, a rectifying plate 141 is attached to the base portion 142. For example, the straightening vane 141 is fixed to the base portion 142 by an adhesive. In addition, the base portion 142 may be integrally formed with the one or more rectifying plates 141. Also, preferably, the base portion 142 may have thermal conductivity. Thus, the heat of the heating element 130 can be received by the base portion 142 to cool it.

For the base portion 142, for example, a resin material (for example, an ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used.

In the electronic device 100, the rectifying plate 141 is directly fixed to the heating element 130 with an adhesive, but in the electronic device 100B, the base portion 142 of the rectifying member 140 is fixed to the heating element 130 with an adhesive.

Also, the operation of the electronic device 100B is similar to the operation of the electronic device 100.

As described above, in the electronic device 100 </ b> B, since the pair of rectifying plates 141 is attached to one base portion 142, the number of parts can be reduced.

Second Embodiment
Next, an electronic device 200 according to a second embodiment of the present invention will be described. FIG. 6 is a front transparent view showing the configuration of the electronic device 200. As shown in FIG. Moreover, FIG. 7 is a figure which shows the structure of 140 A of flow adjustment members mentioned later.

As shown in FIG. 6, the electronic device 200 includes a container 110, a substrate 120, a plurality of heating elements 130a, 130b, 130c, and a plurality of rectifying members 140Aa, 140Ab, 140Ac.

The electronic device 100 </ b> B and the electronic device 200 are compared with reference to FIGS. 5, 6 and 7. In the electronic device 200, the rectifying members 140a to 140c include rectifying plates 141a to 141c and base portions 142a to 142c. On the other hand, in the electronic device 200, the rectifying members 140Aa to 140Ac include rectifying plates 141a to 141c, base portions 142a to 142c, and hinges 143a to 143c. The rectifying plates 141a to 141c are connected to the base portions 142a to 142c via the hinges 143a to 143c. The electronic device 100B and the electronic device 200 are different from each other in these points.

In the following description, when it is not necessary to distinguish the flow regulating members 140Aa to 140Ac, each of the flow regulating members 140Aa to 140Ac is referred to as a flow regulating member 140A. In addition, when the hinges 143a to 143c do not need to be distinguished, each of the hinges 143a to 143c is referred to as a hinge 143.

The hinge 143 will be described. As shown in FIGS. 6 and 7, the hinge 143 is attached between the base portion 142 and the straightening vane 141. The hinge 143 holds the straightening vane 141 such that the straightening vane 141 can rotate around the connection portion between the hinge 143 and the straightening vane 141. More specifically, the hinge 143 connects the straightening vane 141 and the base portion 142 so that the straightening vane 141 can rotate. At this time, the current plate 141 can rotate around the hinge 143. Further, the hinge 143 holds the straightening vane 141 while maintaining the angle of the straightening vane 141 with respect to the base portion 142 when the rotation of the straightening vane 141 is stopped.

As the hinge 143, for example, a hinge of free stop specification can be used. The hinge of a free stop specification means the hinge which can fix and fix the angle between the members connected with the said hinge to arbitrary angles. By using the hinge of this free stop specification, the angle between the current plate 141 and the base portion 142 can be fixed to an arbitrary angle, and the current plate 141 can be held on the base portion 142. As a material of the hinge 143, for example, a metal material (for example, aluminum, aluminum alloy, stainless steel) is used. For the hinge 143, for example, LAMP torque hinge HG-TS type manufactured by Sugatsune Industrial Co., Ltd. can be used as the hinge of the free stop specification.

The electronic device 200 has been described above.

Next, a method of manufacturing the electronic device 200 will be described. First, methods of manufacturing the electronic device 200 and the electronic device 100 will be compared. The method of manufacturing the electronic device 200 is the same as the sealing procedure (second manufacturing procedure) of the refrigerant COO of the electronic device 100. On the other hand, the method of manufacturing the electronic device 200 differs in the method of manufacturing the electronic device 100 and the mounting procedure (first manufacturing procedure).

In the mounting procedure (first manufacturing procedure) of the method of manufacturing the electronic device 100, the pair of rectifying plates 141a to 141c are mounted on the heating elements 130a to 130c.

On the other hand, in the method of manufacturing the electronic device 200, the following procedure (the first modified example of the mounting procedure) is performed instead of the above procedure (the mounting procedure of the rectifying plate 141). In the first modified example of the mounting procedure, first, the flow straightening member 141 prepares the flow straightening member 140A connected to the base portion 142 by the hinge 143. Thereafter, when the end side of the pair of flow straightening plates 141 on the first container inner surface 115 side is projected in the direction perpendicular to the first container inner surface 115, the distance L between the projection lines appearing on the first container inner surface 115 The flow straightener 141 connected to each of the hinges 143 is rotated about the hinges 143 in accordance with the mounting angle set accordingly. As a result, when the end side on the first container inner surface 115 side of each of the pair of flow straightening plates 141 is projected in the direction perpendicular to the first container inner surface 115, it follows the projection line appearing on the first container inner surface 115 The rectifying plate 141 can be set such that the ratio of each of the areas S1 to S3 of the regions A1 to A3 surrounded by the surrounding lines is equal to the ratio of H1, H2 and H3.

For example, it is assumed that the straightening vane 141 at the time when the hinge 143 is attached to the heating element 130 is a straightening vane 141 'shown by a dotted line in FIG. Further, it is assumed that the length of the side D of the heat receiving area A is L shown in FIG. In this case, the flow straightening plate 141 is a projection line that appears on the first container inner surface 115 when the end of the flow straightening plate 141 on the first container inner surface 115 side is projected in the direction perpendicular to the first container inner surface 115. 7 is rotated from the position of the straightening vane 141 ′ shown in FIG. 7 to the position of the straightening vane 141 in the direction of p2 (the direction from the central portion of the heating element 130 toward the outer circumferential portion). Thus, by rotating the straightening vane 141, the distance between the projection lines appearing on the first container inner surface 115 can be changed. As described above, the rectifying plate 141 is rotatably provided centering on the connection portion between the rectifying plate 141 and the hinge 143 so that the area of the heat receiving area can be changed. In addition, although it is shown in FIG. 7 that both the flow straightening plates 141 provided in the heat generating body 130 are rotated, at least one of the flow straightening plates 141 may be rotated.

The method of manufacturing the electronic device 200 has been described above.

Also, the operation of the electronic device 200 is the same as the description of the electronic device 100.

As described above, the electronic device 200 according to the second embodiment of the present invention is provided such that at least a part of one or more rectifying plates can change the area of the heat receiving area A within a predetermined range.

Thereby, even after the rectifying plate 141 is provided on the heat generating member 130, the area of the heat receiving area A can be easily changed. As a result, when the calorific value of the heat generating body 130 changes after the manufacture of the electronic device 200 due to a change in the use mode assumed at the time of the manufacture of the electronic device 200, for example In the electronic device 200, the area of the heat receiving area A can be changed without removing the rectifying plate 141 from the heating element 130.

First Modified Example of Second Embodiment
Next, an electronic device 200A according to a first modified example of the second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a diagram for explaining the electronic device 200A. Moreover, in FIG. 8, the refrigerant | coolant COO is not shown for convenience of drawing preparation.

The electronic device 200A includes a container 110, a substrate 120, a plurality of heating elements 130, and a plurality of flow control members 140.

First, the electronic device 200A and the electronic device 200 are compared. As illustrated in FIG. 8, the electronic device 200 </ b> A differs from the electronic device 200 in that the electronic device 200 </ b> A further includes a temperature measurement unit 151, a drive control unit 152, and a motor 153.

The temperature measurement unit 151 will be described. As shown in FIG. 8, the temperature measurement unit 151 is attached to the heating element 130. In addition, the temperature measurement unit 151 is electrically connected to the drive control unit 152. The temperature measurement unit 151 measures the temperature of the heating element 130, and outputs information indicating the measurement result to the drive control unit 152. In addition, the temperature measurement unit 151 is attached to each of the plurality of heating elements 130. For example, a small temperature sensor or the like can be used for the temperature measurement unit 151.

As shown in FIG. 8, the drive control unit 152 is electrically connected to the temperature measurement unit 151 and the motor 153. The drive control unit 152 is provided outside the container 110. However, the drive control unit 152 may be provided in the container 110. The drive control unit 152 can control the drive of the motor 153. More specifically, the drive control unit 152 controls the drive of the motor 153 based on the information indicating the measurement result from the temperature measurement unit 151. Further, in the drive control unit 152, the rated temperature corresponding to each of the plurality of heating elements 130 is stored in advance. The rated temperature here is a temperature corresponding to the rated calorific value. Specifically, the rated temperature is obtained by dividing the heat capacity of the heat generating body 130 from the rated heat generation amount of the heat generating body 130.

The motor 153 will be described. The motor 153 is electrically connected to the drive control unit 152. Further, the motor 153 is attached to the rectifying member 140A so that the rectifying plate 141 can rotate around the axis of the hinge 143 by driving the motor 153. The motor 153 is molded with, for example, a resin so that the refrigerant COO does not enter the motor 153. The motor 153 rotates the rectifying plate 141 by applying torque to the shaft center of the hinge 143 according to control from the drive control unit 152.

The configuration of the electronic device 200A has been described above.

In the electronic device 200A, for example, after the substrate 120 is fixed in the container 110, the temperature measurement unit 151 and the drive control unit 152 are attached. Further, after fixing the substrate 120 to the container 110, the connection wiring between the temperature measurement unit 151 and the motor 153 and the drive control unit 152 is drawn out from the inside of the container 110, and the temperature measurement unit 151 and the drive control unit 152 Between the drive control unit 152 and the motor 153 are electrically connected. In addition, in order to draw out the connection wiring between the temperature measurement unit 151, the motor 153, and the drive control unit 152 from the inside of the container 110 to the outside, fine holes are formed in the container 110 in advance. This hole is sealed using a sealing member (for example, epoxy resin) before the refrigerant COO is sealed after the temperature measurement unit 151, the motor 153, and the drive control unit 152 are disposed in the container 110.

Next, the operation of the electronic device 200A will be described. The operation of the electronic device 200A is basically the same as that of the electronic device 100 and the electronic device 200. On the other hand, the electronic device 200A is different in that the rectifying plate 141 is rotated by the driving force of the motor 153 during operation.

The rotation operation of the rectifying plate 141 will be described. First, the temperature measurement unit 151 outputs information indicating the temperature (measurement result) of each of the plurality of heating elements 130 to the drive control unit 152 after each of the plurality of heating elements 130 is operated.

The drive control unit 152 rotates the rectifying plate 141 based on the measurement result of the temperature measurement unit 151. That is, first, when the measured temperature of the heating element 130 exceeds each rated temperature, the drive control unit 152 first calculates the value (temperature increase value) of the measured temperature exceeding the rated temperature. The drive control unit 152 multiplies the temperature increase value by the heat capacity of the heating element 130 to calculate the increase amount of the calorific value. The drive control unit 152 resets the area of the heat receiving area based on the sum of the rated heat generation amount and the increase amount of the heat generation amount. The drive control unit 152 rotates the rectifying plate 141 in accordance with the area of the heat receiving area A after resetting. That is, the drive control unit 152 resets the heat receiving area A of the pair of rectifying plates 141 in a direction (p3 in FIG. 8) to widen the distance between the tips of the pair of rectifying plates 141 via the motor 153. Rotate to fit the area. Thereby, the area of the heat receiving area A corresponding to the heating element 130 operating above the rated temperature can be enlarged based on the measurement result of the temperature measuring unit 151. Each of the plurality of heat receiving regions A is set so as not to overlap each other even if the length L of the interval between the straightening plates 141 provided on the same heating element 130 becomes long by rotating the straightening vanes 141. ing.

As a result, the area of the heat receiving region A in contact with the gas-phase refrigerant GP-COO generated from the vicinity of the heat generating element 130 whose heat generation amount has rapidly increased is increased. That is, since the gas phase refrigerant GP-COO generated by the heat of the heating element 130 whose temperature has rapidly risen can be received in the wider heat receiving region A, the gas phase refrigerant GP generated by the heat of the heating element 130 whose temperature is rapidly rising. -COO can be cooled more quickly. The rotation angles at this time are set in advance so as not to overlap each other among the plurality of heat receiving regions A. When the measured temperature of the heating element 130 does not exceed each rated temperature, the drive control unit 152 outputs, to the motor 153, an instruction signal to drive the rectifying plate 141 to return to the original position. The motor 153 rotates the pair of rectifying plates 141 by a predetermined angle in a direction (a reverse direction of p3 in FIG. 8) to narrow the distance between the tip portions of the pair of rectifying plates 141 according to an instruction signal of the drive control unit 152. Let Thereby, the baffle plate 141 returns to the original position. Further, in FIG. 8, the drive control unit 152 is shown to rotate both of the pair of rectifying plates 141, but only one rectifying plate 141 may be rotated.

The operation of the electronic device 200A has been described above.

As described above, the electronic device 200A includes the temperature measurement unit 151 and the drive control unit 152. In addition, the temperature measurement unit 151 measures the temperatures of the plurality of heating elements 130. In addition, the drive control unit 152 rotates at least a part of the one or more rectifying plates 141 around the end on the heating element 130 side. Further, the drive control unit 152 rotates each part of the rectifying plate 141 based on the measurement result of the temperature measurement unit 151.

As described above, in the electronic device 200A, each part of the rectifying plate 141 is rotated based on the measurement result of the temperature measurement unit 151. For this reason, even if the calorific value of the heat generating element 130 changes temporarily temporarily, the area of the heat receiving area can be temporarily changed. As a result, in the electronic device 200A, even when the calorific value of the heating element 130 changes temporarily and rapidly, the plurality of heating elements 130 having different temperatures can be efficiently cooled.

Third Embodiment
Next, an electronic device 300 according to a third embodiment of the present invention will be described. FIG. 9 is a front transparent view showing the configuration of the electronic device 300. As shown in FIG. FIG. 10 is a perspective view showing a configuration of a flow control member 140C described later.

As shown in FIG. 9, the electronic device 300 includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, and a plurality of rectifying members 140Ca to 140Cc. In the following description, when it is not necessary to distinguish the flow regulating members 140Ca to 140Cc, each of the flow regulating members 140Ca to 140Cc is referred to as a flow regulating member 140C.

Here, the electronic device 300 and the electronic device 100 are compared.

The electronic device 300 differs from the electronic device 100 in that it includes rectifying members 140Ca to 140Cc instead of the rectifying plates 141a to 141c.

The rectifying member 140C will be described. FIG. 10 is a perspective view showing the configuration of the rectifying member 140C. As shown in FIG. 10, the straightening member 140C includes a straightening vane 141 and a connection plate 147. The rectifying plate 141 in the electronic device 200 has the same configuration, connection relation, and function as the rectifying plate 141 in the electronic device 100.

The connection plate 147 will be described. The connection plate 147 is an example of a second straightening vane. The connecting plate 147 is provided so as to face each other between the pair of flow regulating plates 141 as shown in FIG. Further, the connecting plate 147 is provided along the outer periphery of the first heat generating body outer surface 131 of the heat generating body 130, and connects the opposite sides of each of the pair of flow straightening plates 141. Further, as shown in FIG. 10, the connection plate 147 is attached to the outer peripheral portion of the heat generating body 130 in the same manner as the flow control plate 141. Specifically, the outer peripheral shape of the heat generating body 130 is, for example, a rectangular shape such as a rectangle or a square.

Here, when the end side of the straightening vane 141 and the connecting plate 147 on the first container inner surface 115 side is projected in the direction perpendicular to the first container inner surface 115, a projection line appears on the first facilitator inner surface 115. And intersect each other to form a quadrangle. The heat receiving area A is the area inside the square. In the heat receiving area A, of the inner surface of the container 110, the end side of the straightening plate 141 provided on the same heat generating member 130 on the first container inner surface 115 side is perpendicular to the first container inner surface 115. It is an example of the area | region enclosed by the encircling line set along the projection line which appears on the 1st facilitator inner surface 115 when it projects.

As the material of the connection plate 147, for example, a resin material (for example, an ABS resin) or a metal material (for example, aluminum or an aluminum alloy) is used as in the case of the rectifying plate 141.

The configuration of the electronic device 300 has been described above.

In addition, in attachment of the baffle plate 141, as shown in FIG. 10, between the end parts of the baffle plate 141 is connected with an adhesive agent by two connection plates 147. After the flow straightening plate 141 and the connection plate 147 were correctly attached to the heating element 130, the flow straightening plate 141 and the connection plate 147 were attached to the heating element 130. The substrate 120 is fixed in the container 110. The subsequent steps are the same as the method of manufacturing the electronic device 100.

The method of manufacturing the electronic device 300 has been described above.

The operation of the electronic device 300 will be described. The operation of the electronic device 300 and the operation of the electronic device 100 are compared. In the operation of the electronic device 100, it has been described that the gas-phase refrigerant GP-COO rises in the space between the pair of rectifying plates 141 after being generated in the vicinity of the heating element 130. On the other hand, in the operation of the electronic device 300, the gas-phase refrigerant GP-COO ascends in the space enclosed by the rectifying plate 141 and the connecting plate 147.

The operation of the electronic device 300 has been described above.

As described above, the electronic device 300 further includes the second rectifying plate (connection plate 147). The second straightening vanes (connection plate 147) are provided so as to face each other between the pair of first straightening vanes (straightening vanes 141), and the outside of each of the pair of first straightening vanes (straightening vanes 141) is provided. Among the peripheries, opposite sides facing in a direction parallel to the pair of projection lines are connected in a direction perpendicular to the pair of projection lines.

In this case, the end side of each of the first straightening vane (straightening vane 141) and the second straightening vane (connection plate 147) on the first container inner surface 115 side is perpendicular to the first container inner face 115. Each of the projection lines appearing on the first facilitator inner surface 115 when projected onto each other intersect each other to form a figure surrounded by the projection lines. At this time, the heat receiving area A is an area inside the figure surrounded by the projection line. In the inner area of the figure surrounded by the projection line, the end of the one or more flow straightening plates 141 on the first container inner surface 115 side of the inner surface of the container 110 is perpendicular to the first container inner surface 115 It is an example of a region surrounded by an encircling line set along one or more projection lines appearing on the first container inner surface 115 when projected in a certain direction.

As described above, of the outer peripheries of the pair of first current plates (current plate 141), the second current plates (connection plate 147) are opposite sides facing each other in the direction parallel to the pair of projection lines. The points are connected in a direction perpendicular to the pair of projection lines. Thus, the gas-phase refrigerant GP-COO ascends in the space enclosed by the rectifying plate 141 and the connecting plate 147. Therefore, compared to the electronic device 100, the gas phase refrigerant GP-COO generated by the heat of each heating element 130 can be prevented from leaking out between the pair of rectifying plates 141. Therefore, the gas-phase refrigerant GP-COO generated from each heating element 130 more reliably contacts each heat receiving area set for each heating element 130 on the first container inner surface 115. Therefore, the amount of heat received by each of the plurality of heat receiving regions is more in accordance with the calorific value of each of the plurality of heating elements 130. As a result, the electronic device 300 can cool each of the plurality of heating elements 130 more efficiently.

Fourth Embodiment
Next, an electronic device 400 according to a fourth embodiment of the present invention will be described. FIG. 11 is a front transparent view showing the configuration of the electronic device 400. As shown in FIG.

The configuration of the electronic device 400 will be described. As shown in FIG. 11, the electronic device 400 includes a container 110, a substrate 120, a plurality of heat generating members 130a to 130c, a plurality of rectifying plates 141a to 141c, and a partition plate 149.

Here, the electronic device 400 and the electronic device 100 are compared using FIG. 1 and FIG. 11. The electronic device 400 is different from the electronic device 100 in that the electronic device 400 further includes a plurality of partition plates 149.

The partition plate 149 will be described. The divider plate 149 is an example of a third straightening vane. The partition plate 149 is a flat plate. However, the partition plate 149 may be formed in a curved shape or a wave shape. As shown in FIG. 11, each of the partition plates 149 is provided between the pair of flow regulating plates 141. The partition plate 149 is provided so as to extend from the surface of the heat generating body 130 toward the first container inner surface 115 side. In FIG. 11, four partition plates 149 are provided between each of the pair of flow straightening plates 141a to 141c. On the other hand, one to three or five or more partition plates 149 may be provided between each of the pair of flow straightening plates 141a to 141c.

The configuration of the electronic device 400 has been described above.

A method of manufacturing the electronic device 400 will be described. The method of manufacturing the electronic device 400 is the same in performing the mounting procedure (first manufacturing procedure) and the sealing procedure (second manufacturing procedure) of the pair of rectifying plates 141 in the method of manufacturing the electronic device 100. On the other hand, in the method of manufacturing the electronic device 400, the method will be described later between the mounting procedure (first manufacturing procedure) and the sealing procedure (second manufacturing procedure) of the pair of rectifying plates 141 in the method of manufacturing the electronic device 100. The mounting procedure of the partition plate 149 is further performed.

In the attachment procedure of the partition plate 149, as shown in FIG. 11, the partition plate 149 is attached between each of the pair of flow guide plates 141 using, for example, an adhesive.

The method of manufacturing the electronic device 400 has been described above.

The operation of the electronic device 400 will be described. In the electronic device 400, the gas-phase refrigerant GP-COO rises in the space sandwiched by the straightening vanes 141 after being generated in the vicinity of the heating element 130, as in the electronic device 100. At this time, in the space sandwiched by the straightening vanes 141, the gas-phase refrigerant GP-COO ascends along the divider plates 149 between the divider plates 149.

The operation of the electronic device 400 has been described above.

As described above, in the electronic device 400 according to the fourth embodiment of the present invention, one or more first rectifying plates are provided with one or more first rectifying plates provided between the pair of first rectifying plates (rectifying plate 141). 3 further includes a baffle plate (partition plate 149).

As described above, the third straightening vane (partition plate 149) is provided between the pair of first straightening vanes (straightening vane 141). Thus, the gas phase refrigerant GP-COO can be raised along the straightening vane 141 and the third straightening vane (partition plate 149). For this reason, the gas-phase refrigerant GP-COO generated from the heating element 130 contacts the heat receiving area set on the first container inner surface 115 more evenly. Therefore, the heat received in each of the plurality of heat receiving regions is uniformly cooled within the heat receiving region without being biased to a partial region of each of the heat receiving regions. As a result, the electronic device 400 can cool each of the plurality of heating elements 130 more efficiently.

Fifth Embodiment
Next, an electronic device 500 according to a fifth embodiment of the present invention will be described. FIG. 12 is a front transparent view showing the configuration of the electronic device 500. As shown in FIG. FIG. 13 is a transparent side view showing the configuration of the electronic device 500. As shown in FIG. Specifically, FIG. 13 is a transparent view when the electronic device 500 is viewed in the direction of arrow a2 in FIG.

The configuration of the electronic device 500 will be described. Referring to FIGS. 12 and 13, the electronic device 500 includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, a plurality of rectifying plates 141a to 141c, and a heat radiating portion 510.

Here, the electronic device 500 and the electronic device 100 are compared using FIG. 1 and FIG. 12. The electronic device 500 is different from the electronic device 100 in that the electronic device 500 further includes a heat dissipation unit 510.

The heat dissipation unit 510 will be described. As shown in FIG. 12 and FIG. 13, the heat dissipation unit 510 is formed in a plate shape. Further, as shown in FIG. 12, the plurality of heat radiation parts 510 are provided on the outer surface corresponding to the first container inner surface 115 of the container 110 at a predetermined interval. The plurality of heat radiation portions 510 are provided at least in the portion corresponding to the plurality of heat receiving areas A of the outer surface of the container 110. In addition, the heat radiating portion 510 may be provided on the entire outer surface of the container 110. The heat radiating portion 510 is a member for radiating the heat received in the plurality of heat receiving areas. For example, fins for heat dissipation can be used for the heat dissipation unit 510. A heat conductive member (for example, aluminum, an aluminum alloy, or the like) is used as a material of the heat dissipation unit 510. The heat dissipation unit 510 may be integrally attached to the container 110 or may be separate from the container 110. When the heat radiating portion 510 is formed separately from the container 110, the heat radiating portion 510 is fixed to the outer surface of the container 110 by, for example, an adhesive.

As described above, the electronic device 500 further includes the heat radiating portion 510 for radiating the heat received in the plurality of heat receiving regions A in the region corresponding to the plurality of heat receiving regions A in the outer surface of the container 110.

Thereby, in the electronic device 500, since the heat of the heat generating body 130 can be dissipated using the outer surface of the container 110 and the heat radiating portion 510, heat is received as compared with the case where the heat of the heat generating body 130 is dissipated only from the outer surface of the container 110. The heat received in the region A can be dissipated efficiently. As a result, in the electronic device 500, the plurality of heating elements 130 can be cooled efficiently.

First Modified Example of Fifth Embodiment
Next, an electronic device 500A according to a first modified example of the fifth embodiment of the present invention will be described. FIG. 14 is a front transparent view showing the configuration of the electronic device 500A. In FIG. 14, components equivalent to the components shown in FIG. 1 are given the same reference symbols as the reference symbols shown in FIG. 1.

As shown in FIG. 14, the electronic device 500A includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, a plurality of rectifying plates 141a to 141c, and a cooling unit 520.

The electronic device 500A and the electronic device 100 are compared using FIG. 1 and FIG. The electronic device 500A is different from the electronic device 100 in that the electronic device 500A further includes a cooling unit 520.

The cooling unit 520 will be described. As shown in FIG. 14, the cooling unit 520 is attached to the outer surface of the container 110. More specifically, the cooling unit 520 is attached to the surface of the container 110 corresponding to the first container inner surface 115. In addition, the cooling unit 520 is attached to a portion of the first container inner surface 115 corresponding to at least a plurality of heat receiving areas A. Further, for example, the cooling unit 520 may be attached to all the surfaces constituting the outer shape of the container 110. For the cooling unit 520, for example, a water-cooled heat sink (Kawaso Texel Co., Ltd., model number HS-C60) can be used.

The operation of the electronic device 500A will be described. In the operation of the electronic device 500A, the cooling unit 520 cools a portion corresponding to the heat receiving area via the outer surface of the container 110. The operation of the electronic device 500A has been described above.

As described above, the electronic device 500 </ b> A includes the cooling unit 520 for cooling the heat receiving area A in the area corresponding to the plurality of heat receiving areas A in the outer surface of the container 110.

As described above, the plurality of heat receiving regions A are cooled by the cooling unit 520. For this reason, compared with the case where the heat receiving area A is not cooled, the difference in temperature between the gas phase refrigerant GP-COO and the heat receiving area A becomes large. As a result, the amount of heat transferred from the gas phase refrigerant GP-COO to the heat receiving region A is increased, so the amount of phase change from the gas phase refrigerant GP-COO to the liquid phase refrigerant LP-COO is increased. As a result, the heating element 130 is cooled by more liquid phase refrigerant LP-COO than in the case where the cooling unit 520 is not provided. Therefore, in the electronic device 500A, the plurality of heating elements can be cooled more efficiently.

Sixth Embodiment
Next, an electronic device 600 according to a sixth embodiment of the present invention will be described. FIG. 15 is a front transparent view showing the configuration of the electronic device 600. As shown in FIG. As shown in FIG. 15, the electronic device 600 includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, and a plurality of rectifying plates 141a to 141c.

First, the electronic device 600 and the electronic device 100 are compared using FIG. 1 and FIG. 15. In the electronic device 100, the first main surface 125 of the substrate 120 is provided in a direction perpendicular to the vertical direction G, whereas in the electronic device 600, the first main surface 125 of the substrate 120 is provided. Are provided in a direction parallel to the vertical direction G. The electronic device 600 and the electronic device 100 are different in this point.

In addition, preferably, each of the rectifying plates 141 a, 141 b and 141 c is disposed as close as possible to the first container inner surface 115. Disposed in close proximity means, for example, a state in which the shortest length from the end on the first container inner surface 115 side of the straightening vane 141 to the first container inner surface 115 is several mm to several cm. Show.

Regarding the electronic device 600, as in the electronic device 100, first, the substrate 120, the rectifying plate 141, and the heating element 130 are fixed to the electronic device 100, and the lid is put on. Next, as shown in FIG. 15, the electronic device 600 is mounted so that the first main surface 125 is parallel to the vertical direction G, and the refrigerant COO is supplied from the refrigerant sealing hole (not shown) on the vertically upward side. It encloses in the container 110 and closes this.

The operation of the electronic device 600 will be described. The operation of the electronic device 600 is similar to the operation of the electronic device 100. However, the operation of the electronic device 100 is different from the operation of the electronic device 600 in the following points.

In the description of the operation of the electronic device 100, the bubbles of the gas phase refrigerant GP-COO are generated in the vicinity of the heating element 130, and then move upward in the vertical direction G and pass through the liquid surface of the liquid phase refrigerant LP-COO By going upward in the vertical direction G, it is stated that the heat receiving area A is contacted. On the other hand, in the operation of the electronic device 600, the bubbles of the vapor-phase refrigerant GP-COO are generated in the vicinity of the heating element 130 and then move in the space sandwiched between the pair of rectifying plates 141. Contact. Here, the first main surface 125 and the first main surface 125 are arranged such that the air bubbles can contact the heat receiving area A of the first container inner surface 115 before the air bubbles of the gas phase refrigerant GP-COO move upward in the vertical direction G. The distance of the container inner surface 115 is adjusted.

The operation of the electronic device 600 has been described above.

In the electronic device 600, the first major surface 125 of the substrate 120 is provided in a direction parallel to the vertical direction G. Therefore, the electronic device 600 can be disposed in any direction with respect to the vertical direction G.

Seventh Embodiment
Next, an electronic device 700 according to a seventh embodiment of the present invention will be described. The electronic devices 100, 100 A, 100 B, 100 C, 200, 200 A, 300, 400, 500, 600 are examples of the electronic device 700. FIG. 16 is a front transparent view illustrating the configuration of the electronic device 700. FIG. 17 is a side transparent view illustrating the configuration of the electronic device 700. Specifically, FIG. 17 is an example of a transparent view when the electronic device 700 is viewed in the direction of arrow a4 in FIG. Referring to FIGS. 16 and 17, the electronic device 700 includes a container 110, a substrate 120, a plurality of heating elements 130a to 130c, and a plurality of rectifying plates 141a to 141c. In the following description, when it is not necessary to distinguish each of the plurality of heating elements 130a to 130c, each of the plurality of heating elements 130a to 130c is referred to as a heating element 130. Further, in the following description, when it is not necessary to distinguish each of the plurality of flow straightening plates 141a to 141c, each of the plurality of flow straightening plates 141a to 141c is referred to as a flow straightening plate 141.

The container 110 has thermal conductivity. Further, in the container 110, a refrigerant COO which changes in phase between the liquid phase refrigerant LP-COO and the gas phase refrigerant GP-COO is sealed. Further, as shown in FIGS. 16 and 17, one of the inner surfaces of the container 110 is taken as a first container inner surface 115.

The substrate 120 is provided in the container 110. Also, the substrate 120 has a first major surface 125 facing the first container inner surface 115.

The plurality of heating elements 130 have a first heating element outer surface 131. The outer peripheral shape of the first heat generating body outer surface 131 is a convex polygonal shape, a circular shape or an elliptical shape. In addition, the plurality of heating elements 130 are attached to the first major surface 125 such that the first heating element outer surface 131 faces the first container inner surface 115. Also, the plurality of heating elements 130 are immersed in the liquid phase refrigerant LP-COO.

The one or more rectifying plates 141 are provided so as to extend from the outer peripheral portion of each of the plurality of heat generating members 130 toward the first container inner surface 115 side.

Further, the heat receiving area A is set for each of the plurality of heating elements 130 in order to receive the heat of each of the plurality of heating elements 130. FIG. 18 is a view showing heat receiving areas A1 to A3 as an example of the heat receiving area A. As shown in FIG.

The heat receiving area A is set on the inner surface of the container 110. Specifically, in the heat receiving area A, the end side of the one or more rectifying plates 141 on the first container inner surface 115 side of the inner surface of the container 110 is projected in the direction perpendicular to the first container inner surface 115 It is an area surrounded by an encircling line set along the projection line which appears on the first container inner surface 115 at the time.

The area of each of the heat receiving regions A is set to increase in accordance with the increase in the calorific value of each of the plurality of heating elements 130.

The configuration of the electronic device 700 has been described above.

Note that the manufacturing method and operation of the electronic device 700 conform to the electronic devices 100, 100A, 100B, 200, 200A, 300, 400, 500, and 600.

As described above, the electronic device 700 according to the first embodiment of the present invention includes the container 110, the substrate 120, the plurality of heating elements 130, and the rectifying plate 141. The container 110 has thermal conductivity, and encloses the refrigerant COO which changes phase between the liquid phase refrigerant LP-COO and the gas phase refrigerant GP-COO. The first substrate 120 has a first major surface 125 facing the first container inner surface 115 which is one of the inner surfaces of the container 110. In addition, the first substrate 120 is provided in the container 110. Each of the plurality of heating elements 130 has a first heating element outer surface 131. Further, the plurality of heat generating members 130 are attached to the first main surface 125 so that the first heat generating member outer surface 131 and the first container inner surface 115 face each other, and are immersed in the liquid phase refrigerant LP-COO . The baffle plate 141 is provided so as to extend from the outer peripheral portion of each of the plurality of heat generating members 130 toward the first container inner surface 115 side. Further, the number of the straightening vanes 141 is one or more. In addition, the area of each of the heat receiving areas, which is an area set for each of the plurality of heating elements 130 in order to receive the heat of each of the plurality of heating elements 130, increases the calorific value of each of the plurality of heating elements 130 It is set to increase according to. Further, the heat receiving area is the first when the end side of the one or more flow straightening plates 141 on the first container inner surface 115 side of the inner surface of the container 110 is projected in the direction perpendicular to the first container inner surface 115. Is an area surrounded by an encircling line set along a projection line appearing on the inner surface 115 of the container.

Thus, the area of each of the heat receiving areas A, which is an area set for each of the plurality of heating elements 130 in order to receive the heat of each of the plurality of heating elements 130 It is set to increase as the amount of heat generation increases. Therefore, according to each calorific value of a plurality of heating elements 130, a plurality of heat receiving areas A can be set. Thereby, the area of each of the plurality of heat receiving areas A can be set so that the heat generated by each heating element 130 can be received without excess or deficiency. Therefore, the total area of the plurality of heat receiving areas A can be adjusted to the necessary minimum. Therefore, since the area of the container inner surface 115 can be set to the necessary minimum, the size of the container 110 can be adjusted to the minimum required size.

As described above, in the technique described in Patent Document 1, when the sizes of the plurality of heating elements are equal to each other, the surface area where each gas phase refrigerant generated by the heat of each of the plurality of heating elements contacts the container and the partition It is the same. In this case, the surface area of each of the gas phase refrigerants generated from the plurality of heating elements in contact with the container and the partition is set to the same area according to the amount of heat contained in the gas phase refrigerant generated by the small heating element. There is a problem that the gas phase refrigerant generated by the large heating element is not sufficiently cooled. In addition, if the surface area of each gas phase refrigerant in contact with the container and the partition is set to the same area according to the amount of heat contained in the gas phase refrigerant generated by the heating element with a large calorific value, the area according to the heating element with a small calorific value The container will be larger than in the case of setting. At this time, the gas-phase refrigerant generated by the heat generating element with a small heat generation amount is cooled with a surface area larger than necessary. As described above, when each of the surface areas is set according to the heating element having a large calorific value, there is a problem that the container becomes larger than necessary.

On the other hand, in the electronic device 700 according to the first embodiment of the present invention, since each of the plurality of heat receiving areas A can be set according to each amount of heat generation of the plurality of heat generating members 130 The area of the heat receiving area A set in the body 130 can be set smaller for each heating element 130 according to the amount of heat generation. Conversely, the area of the heat receiving area A set for the heating element 130 with a large amount of heat can be set large for each heating element 130 according to the amount of heat generation.

That is, even if the plurality of heating elements 130 includes the heating element 130 having a large amount of heat and the heating element 130 having a small amount of heat, the heat receiving region A can be set for each heating element 130. Therefore, as described above, the area of the first container inner surface 115 in which the heat receiving area A is set can be set to the necessary minimum. As a result, the size of the container 110 can be adjusted to the necessary minimum size.

As described above, in the electronic device 700, the plurality of heat receiving regions A can be set respectively in accordance with the respective calorific values of the plurality of heating elements 130, and the area of the first container inner surface 115 is set to the necessary minimum. As it is possible, the size of the container 110 can be adjusted to the necessary minimum size. Therefore, the plurality of heating elements 130 can be efficiently cooled with the container 110 of the minimum necessary size.

Some or all of the above embodiments may be described as in the following appendices, but are not limited to the following.
[Supplementary Note 1]
A container having a thermal conductivity and enclosing a refrigerant that changes in phase between the liquid phase refrigerant and the gas phase refrigerant;
A substrate provided in the container, the substrate having a first main surface facing the first container inner surface which is one of the inner surfaces of the container;
A plurality of first heat generating body outer surfaces, the first heat generating body outer surface and the first container inner surface being attached to the first main surface so as to face each other, and immersed in the liquid phase refrigerant A heating element,
And at least one straightening vane provided to extend from the outer peripheral portion of each of the plurality of heat generating members toward the inner surface of the first container,
Appears on the inner surface of the first container when the end side of the first container inner surface side of the one or more straightening vanes of the inner surface of the container is projected in a direction perpendicular to the inner surface of the first container An area surrounded by an encircling line set along one or more projection lines, the area set for each of the plurality of heating elements to receive heat of each of the plurality of heating elements An electronic device, wherein an area of each of the heat receiving regions is set to increase in accordance with an increase in calorific value of each of the plurality of heat generating members.
[Supplementary Note 2]
The electronic device according to appendix 1, wherein the plurality of heat receiving regions are provided apart from one another.
[Supplementary Note 3]
The electronic device according to Additional remark 1 or 2, wherein at least a part of the one or more straightening vanes is disposed such that an end portion on the inner surface side of the first container is close to an inner surface of the first container.
[Supplementary Note 4]
The electronic device according to any one of appendices 1 to 3, wherein at least a part of the one or more rectifying plates is provided such that the area of the heat receiving area can be changed within a predetermined range.
[Supplementary Note 5]
The electronic device according to claim 4, wherein at least a part of the one or more rectifying plates is held by the heating element so as to be rotatable within a predetermined angle around an end on the heating element side.
[Supplementary Note 6]
A temperature measurement unit that measures the temperatures of the plurality of heating elements;
A drive control unit configured to rotate at least a part of the one or more rectifying plates about an end on the heating element side;
The electronic device according to claim 5, wherein the drive control unit rotates each of a part of the rectifying plate based on a measurement result of the temperature measurement unit.
[Supplementary Note 7]
The one or more rectifying plates extend from both ends of the plurality of heating elements in a direction parallel to the first main surface of the substrate toward the first container inner surface side. 15. The electronic device according to any one of appendices 1 to 6, comprising a pair of provided first flow straighteners.
[Supplementary Note 8]
A second straightening vane, provided along the outer periphery of the first heat generating body outer surface, facing each other between the pair of first straightening vanes, for connecting the opposite sides of each of the pair of first straightening vanes The electronic device according to appendix 7, further comprising:
[Supplementary Note 9]
The electronic device according to Appendix 7 or 8, wherein the one or more rectifying plates further include one or more third rectifying plates provided between the pair of first rectifying plates.
[Supplementary Note 10]
The electronic device according to Additional remark 9, wherein at least one of the one or more third rectifying plates is thermally connected to the heat generating body to dissipate heat of the heat generating body.
[Supplementary Note 11]
The electronic device according to any one of appendices 1 to 10, wherein at least a part of the one or more rectifying plates is thermally connected to the heat generating body to dissipate heat of the heat generating body.
[Supplementary Note 12]
A heat radiating portion for radiating heat received in the plurality of heat receiving regions, or a cooling portion for cooling the heat receiving region is provided in a region corresponding to the plurality of heat receiving regions of the outer surface of the container The electronic device according to any one of appendices 1 to 11.
[Supplementary Note 13]
The electronic device according to any one of appendices 1 to 12, wherein the substrate is provided such that the first main surface is in a direction perpendicular to the vertical direction.
[Supplementary Note 14]
[Claim 13] The electronic device according to supplementary note 13, wherein at least a part of the one or more rectifying plates is arranged such that an end portion on the inner surface side of the first container is disposed on a liquid surface of the liquid phase refrigerant.
[Supplementary Note 15]
The electronic device according to any one of appendices 1 to 12, wherein the substrate is provided such that the first main surface is along the vertical direction.
[Supplementary Note 16]
A base portion provided on a surface of the outer surface of the heating element facing the inner surface of the first container;
The electronic device according to any one of appendices 1 to 15, wherein the one or more rectifying plates are attached to the base portion.
[Supplementary Note 17]
At least a portion of the one or more rectifying plates is a portion of the outer peripheral portion of the first heat generating body outer surface, both ends of the first heat generating body outer surface in a direction parallel to the first main surface of the substrate. The electronic device according to any one of appendices 1 to 16, provided so as to extend from the part side toward the inner surface side of the first container.
[Supplementary Note 18]
At least a portion of the one or more rectifying plates is the first heat generation in the direction parallel to the first main surface of the substrate among the side surfaces of the heating element surrounding the first heating element outer surface The electronic device according to any one of appendices 1 to 16, provided so as to extend from both end sides of the body outer surface toward the inner surface side of the first container.

The present invention has been described above with reference to the embodiments (and examples), but the present invention is not limited to the above embodiments (and examples). The configurations and details of the present invention can be modified in various ways that those skilled in the art can understand within the scope of the present invention.

100, 100A, 100B, 200, 200A, 300, 400, 500, 600, 700 electronic device 110 container 115 first container inner surface 120 substrate 125 first main surface 130, 130a, 130b, 130c heating element 131, 131a, 131b, 131c first heating element outer surface 140, 140a, 140b, 140c, 140Aa, 140Ab, 140Ac, 140B, 140Ca, 140Cb, 140Cc rectifying member 141, 141a, 141b, 141c rectifying plate 142 base portion 143 hinge 147 connecting plate 149 Partition plate 151 Temperature measurement unit 152 Drive control unit 153 Motor 510 Heat dissipation unit 520 Cooling unit

Claims (18)

1. A container having a thermal conductivity and enclosing a refrigerant that changes in phase between the liquid phase refrigerant and the gas phase refrigerant;
   A substrate provided in the container, the substrate having a first main surface facing the first container inner surface which is one of the inner surfaces of the container;
   A plurality of first heat generating body outer surfaces, the first heat generating body outer surface and the first container inner surface being attached to the first main surface so as to face each other, and immersed in the liquid phase refrigerant A heating element,
   And at least one straightening vane provided to extend from the outer peripheral portion of each of the plurality of heat generating members toward the inner surface of the first container,
   Appears on the inner surface of the first container when the end side of the first container inner surface side of the one or more straightening vanes of the inner surface of the container is projected in a direction perpendicular to the inner surface of the first container An area surrounded by an encircling line set along one or more projection lines, the area set for each of the plurality of heating elements to receive heat of each of the plurality of heating elements An electronic device, wherein an area of each of the heat receiving regions is set to increase in accordance with an increase in calorific value of each of the plurality of heat generating members.
2. The electronic device according to claim 1, wherein the plurality of heat receiving areas are provided apart from one another.
3. The electronic device according to claim 1, wherein at least a part of the one or more straightening vanes is disposed such that an end portion on the inner surface side of the first container is close to an inner surface of the first container.
4. The electronic device according to any one of claims 1 to 3, wherein at least a part of the one or more rectifying plates is provided such that the area of the heat receiving area can be changed within a predetermined range.
5. 5. The electronic device according to claim 4, wherein at least a part of the one or more rectifying plates is held by the heating element such that it can rotate within a predetermined angle around an end on the heating element side.
6. A temperature measurement unit that measures the temperatures of the plurality of heating elements;
   A drive control unit configured to rotate at least a part of the one or more rectifying plates about an end on the heating element side;
   The electronic device according to claim 5, wherein the drive control unit rotates each part of the rectifying plate based on a measurement result of the temperature measurement unit.
7. The one or more rectifying plates extend from both ends of the plurality of heating elements in a direction parallel to the first main surface of the substrate toward the first container inner surface side. The electronic device according to any one of claims 1 to 6, which comprises a pair of first rectifying plates provided.
8. A second straightening vane, provided along the outer periphery of the first heat generating body outer surface, facing each other between the pair of first straightening vanes, for connecting the opposite sides of each of the pair of first straightening vanes The electronic device according to claim 7, further comprising:
9. The electronic device according to claim 7, wherein the one or more rectifying plates further include one or more third rectifying plates provided between the pair of first rectifying plates.
10. 10. The electronic device according to claim 9, wherein at least one of the one or more third rectifying plates is thermally connected to the heat generating body to dissipate the heat of the heat generating body.
11. The electronic device according to any one of claims 1 to 10, wherein at least a part of the one or more rectifying plates is thermally connected to the heat generating body to radiate the heat of the heat generating body.
12. A heat radiating portion for radiating heat received in the plurality of heat receiving regions, or a cooling portion for cooling the heat receiving region is provided in a region corresponding to the plurality of heat receiving regions of the outer surface of the container The electronic device according to any one of claims 1 to 11.
13. The electronic device according to any one of claims 1 to 12, wherein the substrate is provided such that the first main surface is in a direction perpendicular to the vertical direction.
14. The electronic device according to claim 13, wherein an end portion of the first container inner surface side of at least a part of the one or more rectifying plates is disposed on a liquid surface of the liquid phase refrigerant.
15. The electronic device according to any one of claims 1 to 12, wherein the substrate is provided such that the first main surface is along the vertical direction.
16. A base portion provided on a surface of the outer surface of the heating element facing the inner surface of the first container;
    The electronic device according to any one of claims 1 to 15, wherein the one or more rectifying plates are attached to the base portion.
17. At least a portion of the one or more rectifying plates is a portion of the outer peripheral portion of the first heat generating body outer surface, both ends of the first heat generating body outer surface in a direction parallel to the first main surface of the substrate. The electronic device according to any one of claims 1 to 16, wherein the electronic device is provided so as to extend from the part side toward the inner surface side of the first container.
18. At least a portion of the one or more rectifying plates is the first heat generation in the direction parallel to the first main surface of the substrate among the side surfaces of the heating element surrounding the first heating element outer surface The electronic device according to any one of claims 1 to 16, wherein the electronic device is provided so as to extend from both end sides of an outer surface of the body toward the inner surface of the first container.

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