JPH03129896A - Cooling device - Google Patents
Cooling deviceInfo
- Publication number
- JPH03129896A JPH03129896A JP26970689A JP26970689A JPH03129896A JP H03129896 A JPH03129896 A JP H03129896A JP 26970689 A JP26970689 A JP 26970689A JP 26970689 A JP26970689 A JP 26970689A JP H03129896 A JPH03129896 A JP H03129896A
- Authority
- JP
- Japan
- Prior art keywords
- coolant
- refrigerant liquid
- cooling device
- cooling
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 49
- 239000007788 liquid Substances 0.000 claims description 95
- 239000003507 refrigerant Substances 0.000 claims description 90
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 4
- 239000002826 coolant Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract 1
- 230000001603 reducing effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
プリント板等に搭載された発熱体を浸漬冷却方式によっ
て冷却する冷却装置に関し、
冷却効率の良好な浸漬型冷却装置の提供を目的とし、
一方の端部に冷媒液吸入開口部を有し、他方の端部に冷
媒液放出開口部を有してなる循環パイプと、この循環パ
イプを表裏面に貫通させる形で装着してなる冷媒液貯溜
容器とによって冷媒液循環部を構成すると共に、この冷
媒液循環部を、前記冷媒液吸入開口部が冷媒液中に浸漬
され、前記冷媒液放出開口部と冷媒液貯溜容器が冷媒液
から露出する形で冷却槽内に配置された構成になってい
る。[Detailed Description of the Invention] [Summary] Regarding a cooling device that cools a heating element mounted on a printed board etc. by an immersion cooling method, the present invention aims to provide an immersion type cooling device with good cooling efficiency. A circulation pipe having a refrigerant suction opening at one end and a refrigerant discharge opening at the other end, and a refrigerant storage container fitted with this circulation pipe so as to penetrate the front and back surfaces. A refrigerant liquid circulation unit is configured, and the refrigerant liquid circulation unit is cooled in such a manner that the refrigerant liquid suction opening is immersed in the refrigerant liquid, and the refrigerant liquid discharge opening and the refrigerant liquid storage container are exposed from the refrigerant liquid. It is arranged in a tank.
本発明はプリント板等に搭載された集積回路装置等の発
熱体を浸漬冷却方式によって冷却する冷却装置に関する
。The present invention relates to a cooling device for cooling a heat generating element such as an integrated circuit device mounted on a printed board or the like using an immersion cooling method.
第２図は従来の冷却装置の構成を示す模式的側断面図で
ある。FIG. 2 is a schematic side sectional view showing the configuration of a conventional cooling device.
従来の冷却装置は、第２図に示すように、冷媒液ｌＯ中
に浸漬状態で配置された液冷却パイプ５５と、冷媒液ｌ
Ｏに対して非接触状態で配置された凝縮器７０を装備し
てなる冷却槽５０と、配管３０を介してこれら液冷却パ
イプ５５と凝縮器７０に接続された放熱モジュール６０
とによって構成されている。この放熱モジュール６０は
、放熱バイブロ１とファン６２とポンプ６３を装備し、
前記液冷却パイプ５５および凝縮器７０を通過すること
によって温度が上昇した冷却液を冷却する装置である。As shown in FIG. 2, the conventional cooling device includes a liquid cooling pipe 55 that is immersed in the refrigerant liquid lO, and a liquid cooling pipe 55 that is immersed in the refrigerant liquid L.
A cooling tank 50 equipped with a condenser 70 arranged in a non-contact state with respect to O, and a heat dissipation module 60 connected to the liquid cooling pipe 55 and the condenser 70 via the piping 30.
It is composed of. This heat radiation module 60 is equipped with a heat radiation vibro 1, a fan 62, and a pump 63,
This device cools the coolant whose temperature has increased by passing through the liquid cooling pipe 55 and the condenser 70.
前記冷却槽５０は、冷媒液１０中に浸漬状態で配置され
た液冷却パイプ５５の下方にプリント板４０を配置し、
当該プリント板４０に搭載された発熱体８から放散され
る熱によって温度上昇した冷媒液１０を液冷却パイプ５
５によって冷却すると共に、冷媒液１０の蒸発によって
生成された冷媒蒸気１１を凝縮器７０によって液化する
構成になっている。The cooling tank 50 has a printed board 40 disposed below a liquid cooling pipe 55 that is immersed in the refrigerant liquid 10,
The refrigerant liquid 10 whose temperature has increased due to the heat dissipated from the heating element 8 mounted on the printed board 40 is transferred to the liquid cooling pipe 5.
5, and the refrigerant vapor 11 generated by evaporation of the refrigerant liquid 10 is liquefied by the condenser 70.
従来の冷却装置は上述の如く、冷却槽５０の中に液冷−
パイプ５５と凝縮器７０という二つの冷却モジュールが
配置されていることから配管３ｏが複雑化するという欠
点があり、また、冷媒液ｌｏ中に液冷却パイプ５５が配
置されていることから高温度の冷媒液と低温度の冷媒液
がうまく混合せず、冷媒液全体の液温が高くなってしま
う欠点があった。As mentioned above, the conventional cooling device has liquid cooling in the cooling tank 50.
Since two cooling modules, the pipe 55 and the condenser 70, are arranged, there is a drawback that the piping 3o becomes complicated.Also, since the liquid cooling pipe 55 is arranged in the refrigerant liquid lo, high temperature There was a drawback that the refrigerant liquid and the low-temperature refrigerant liquid did not mix well, resulting in an increase in the temperature of the entire refrigerant liquid.
本発明はこれらの問題点を解決するためになされたもの
で、冷媒液の対流作用を活性化する循環パイプと、加熱
された冷媒液（冷媒液の蒸気１１を含む冷媒液）が本来
の液温に戻るまでこれを一時的に貯溜する貯溜容器１５
を設けた構成になっている。The present invention was made in order to solve these problems, and includes a circulation pipe that activates the convection action of the refrigerant liquid, and a heated refrigerant liquid (refrigerant liquid containing vapor 11 of the refrigerant liquid) that is converted into the original liquid. A storage container 15 that temporarily stores this until it returns to temperature.
It is configured with the following.
本発明による冷却装置は第１図に示すように、一方の端
部に冷媒液吸入開口部（以下吸入開口部と称する）１を
有し、他方の端部に冷媒液放出開口部（以下放出開口部
と称する）２を有してなる循環パイプ５と、この循環パ
イプ５を表裏面に貫通させる形で装着してなる冷媒液貯
溜容器１５と、によって冷媒液循環部２０を構成すると
共に、この冷媒液循環部２０を、前記冷媒液吸入開口部
１のみが冷媒液１０中に浸漬された形で、そして前記冷
媒液放出開口部２と冷媒液貯溜容器１５とが冷媒液１０
から露出する形で冷却槽５０内に配置された構成になっ
ている。As shown in FIG. 1, the cooling device according to the present invention has a refrigerant liquid suction opening (hereinafter referred to as suction opening) 1 at one end, and a refrigerant liquid discharge opening (hereinafter referred to as discharge opening) at the other end. A refrigerant liquid circulation unit 20 is constituted by a circulation pipe 5 having an opening (referred to as an opening) 2, and a refrigerant liquid storage container 15 fitted with the circulation pipe 5 so as to pass through the front and back surfaces, and This refrigerant liquid circulation part 20 is configured such that only the refrigerant liquid suction opening 1 is immersed in the refrigerant liquid 10, and the refrigerant liquid discharge opening 2 and the refrigerant liquid storage container 15 are immersed in the refrigerant liquid 10.
It is arranged in the cooling tank 50 so as to be exposed from the inside.
この冷却装置は、吸入開口部ｌのみを冷媒液１０中に浸
漬してなる循環パイプ５と、前記冷媒液１０に対して非
接触で配置された冷媒液貯溜容器１５とによって構成さ
れた冷媒液循環部２０を装備していることから、冷媒液
１０の対流作用が効率化され。This cooling device consists of a circulation pipe 5 in which only a suction opening 1 is immersed in a refrigerant liquid 10, and a refrigerant liquid storage container 15 disposed in a non-contact manner with respect to the refrigerant liquid 10. Equipped with the circulation section 20, the convection action of the refrigerant liquid 10 is made more efficient.
かつ高温度の冷媒液と低温度の冷媒液とが互いに混ざり
合うことが無いので、装置の冷却効率が著しく向上する
。Moreover, since the high-temperature refrigerant liquid and the low-temperature refrigerant liquid do not mix with each other, the cooling efficiency of the device is significantly improved.
以下実施例図に基づいて本発明の詳細な説明する。 EMBODIMENT OF THE INVENTION The present invention will be described in detail below based on embodiment figures.
第１図（ａ）と（ｂ）は本発明の一実施例を示す図であ
って、（ａ）は全体構成を示す模式的要部側断面図、世
）はその１Ａ″部分（点線で囲んだ部分）の拡大図であ
るが、これらの図において前記第２図と同一部分にはそ
れぞれ同一符号を付している。FIGS. 1(a) and 1(b) are views showing one embodiment of the present invention, in which (a) is a schematic side sectional view of the main part showing the overall configuration, and FIG. 2 is an enlarged view of the encircled portion), in which the same parts as in FIG. 2 are designated by the same reference numerals.
第１図（ａ）と（ｂ）に示すように、この冷却装置は、
一方の端部に吸入開口部１を有し、他方の端部に放出開
口部２を有してなる複数個の循環パイプ５と、この循環
パイプ５をそれぞれ表裏面に貫通させる形で装備してな
る冷媒液貯溜容器１５とによって冷媒液循環部２０を構
成すると共に、この冷媒液循環部２０を、前記吸入開口
部１が冷媒液１０内に浸漬され、かつ前記放出開口部２
と冷媒液貯溜容器（以下貯溜容器と称する） １５が冷
媒液１０と非接触状態となる形で冷却槽５０内に配置し
た構成になっている。As shown in FIGS. 1(a) and (b), this cooling device
A plurality of circulation pipes 5 each having a suction opening 1 at one end and a discharge opening 2 at the other end are installed so as to pass through each of the front and back surfaces. The refrigerant liquid storage container 15 constitutes a refrigerant liquid circulation section 20, and the refrigerant liquid circulation section 20 is configured such that the suction opening 1 is immersed in the refrigerant liquid 10 and the discharge opening 2
and a refrigerant liquid storage container (hereinafter referred to as storage container) 15 are arranged in the cooling tank 50 so as not to be in contact with the refrigerant liquid 10.
前記循環パイプ５は、一方の端部（下がねの端部）に冷
媒液１０を吸入するラッパ（ｌ１１１３ｆｔ、）型の吸
入開口部１が形成され、他方の端部（上がわの端部）に
は冷媒液１０を放出する放出開口部２が形成されている
。この循環パイプ５は、例えば金属管等を用いて製作さ
れるが、その外周面を断熱材等で覆うようにすれば、冷
媒液１０の対流はより活性化される。The circulation pipe 5 has a wrapper-shaped suction opening 1 for sucking the refrigerant liquid 10 at one end (the lower end), and the other end (the upper end) A discharge opening 2 for discharging the refrigerant liquid 10 is formed in the part). This circulation pipe 5 is manufactured using, for example, a metal pipe, and if its outer peripheral surface is covered with a heat insulating material or the like, the convection of the refrigerant liquid 10 is further activated.
また、貯溜容器１５は、この循環パイプ５を表裏に貫通
させる形で装備すると共に、上方に向かって拡開した皿
型形成部１６を装備している。この皿型形成部１６は、
前記循環パイプ５の吸入開口部ｌから吸入されて放出開
口部２から放出される冷媒液の蒸気１１を含む高温度の
冷媒液１０が充分冷却されるまでこれを一時的に貯溜す
る部分であって、この中で充分に冷却された冷媒液１０
は、その量が増加するとその緑から外へ溢れ出して元の
冷媒液１０と混合される。なお、この冷媒液１０は、凝
縮器７０によって充分に冷却されているので、冷却槽５
０内の冷媒液ｌＯの温度がそのために上昇するようなこ
とはない。Further, the storage container 15 is equipped with the circulation pipe 5 passing through it from the front and back, and is also equipped with a dish-shaped forming part 16 that expands upward. This dish-shaped forming part 16 is
This section temporarily stores the high-temperature refrigerant liquid 10 containing vapor 11 of the refrigerant liquid sucked in through the suction opening l of the circulation pipe 5 and released from the discharge opening 2 until it is sufficiently cooled. In this, the refrigerant liquid 10 is sufficiently cooled.
As its amount increases, it overflows from the green and mixes with the original refrigerant liquid 10. Note that since this refrigerant liquid 10 has been sufficiently cooled by the condenser 70, the cooling tank 5
Therefore, the temperature of the refrigerant liquid IO in 0 does not rise.
以下第１図（ａｌと（ｂ）を用いて本発明による冷却装
置の動作を説明する。The operation of the cooling device according to the present invention will be described below with reference to FIGS. 1 (al) and (b).
■、冷却槽５０内の冷媒液１０中に浸漬状態で配置され
た発熱体８の真上に吸入開口部１を位置決めした形で冷
媒液循環部２０を配置する。この時、プリント板４０と
冷媒液循環部２０はそれぞれ図示されない保持具を使用
して所定位置に位置決めされる。(2) The refrigerant liquid circulation unit 20 is arranged with the suction opening 1 positioned directly above the heating element 8 which is immersed in the refrigerant liquid 10 in the cooling tank 50. At this time, the printed circuit board 40 and the refrigerant liquid circulation section 20 are each positioned at a predetermined position using a holder (not shown).
■０発熱体８の発熱によって当該各発熱体８の真上の温
度が特に高温度になる。その結果、各発熱体８の真上に
位置している冷媒液１０の一部は気化し、冷媒蒸気１１
となって周辺部の冷媒液１０と共に循環パイプ５の中を
上昇する。なお、この対流は流れの中に前述の如く冷媒
液の蒸気１１を含んでいるために冷媒液１０の液面より
も高位置まで持ち上げられる。そして、その液体部分は
冷媒液貯溜容器１５内に、また気化した部分１１は冷却
槽５０の上部空間に充満する。(2) The temperature directly above each heating element 8 becomes particularly high due to the heat generated by the heating element 8. As a result, a part of the refrigerant liquid 10 located directly above each heating element 8 is vaporized, and the refrigerant vapor 11
The refrigerant liquid 10 rises in the circulation pipe 5 together with the refrigerant liquid 10 in the surrounding area. Note that this convection flow contains the refrigerant liquid vapor 11 in the flow as described above, so that the refrigerant liquid 10 is lifted to a higher position than the liquid level. The liquid portion fills the refrigerant liquid storage container 15, and the vaporized portion 11 fills the upper space of the cooling tank 50.
■、その後、凝縮器７０によって液化されて冷媒液貯溜
容器１５内に貯溜された冷媒液１０は、その量が増える
とそこから溢れて元の冷媒液１０に吸収される。(2) Thereafter, when the amount of the refrigerant liquid 10 liquefied by the condenser 70 and stored in the refrigerant liquid storage container 15 increases, it overflows and is absorbed into the original refrigerant liquid 10.
上述の如く、本発明による冷却装置は、循環パイプ５に
よる対流の促進効果と、冷媒液貯溜容器１５による冷媒
液の温度差圧縮効果とが相乗的に発揮される構成になっ
ている。As described above, the cooling device according to the present invention is configured such that the effect of promoting convection by the circulation pipe 5 and the effect of compressing the temperature difference of the refrigerant liquid by the refrigerant liquid storage container 15 are synergistically exhibited.
以上の説明から明らかなように、本発明による冷却装置
は、冷却液の対流を促進する循環パイプと、冷媒液の温
度差を圧縮する冷媒液貯溜容器とによって構成された冷
媒液循環部を装備していることから、従来の冷却装置に
比して冷却効率が著しく高い。As is clear from the above description, the cooling device according to the present invention is equipped with a refrigerant liquid circulation section that includes a circulation pipe that promotes convection of the refrigerant and a refrigerant liquid storage container that compresses the temperature difference in the refrigerant liquid. Because of this, the cooling efficiency is significantly higher than that of conventional cooling devices.
第１図＜ａ）と（ｂ）は本発明の一実施例を示す模式的
要部側断面図とその“Ａ”部分の拡大図、第２図は従来
の冷却装置の構成を示す模式的要部側断面図である。
図において、１は吸入開口部、
２は放出開口部、
５は循環パイプ、
８は発熱体、
１０は冷媒液、
１１は冷媒液の蒸気（冷媒蒸気）、
１５は貯溜容器（冷媒液貯溜容器）、
１６は皿型形成部、
２０は冷媒液循環部、
３０は配管、
４０はプリント板、
５０は冷却槽、
５５は液冷却パイプ、
６０は放熱モジュール
７０は凝縮器、
をそれぞれ示す。
（ＣＩ）
第２図Figures 1 (a) and (b) are a schematic side sectional view of the main part showing an embodiment of the present invention and an enlarged view of the "A" part thereof, and Figure 2 is a schematic diagram showing the configuration of a conventional cooling device. FIG. In the figure, 1 is a suction opening, 2 is a discharge opening, 5 is a circulation pipe, 8 is a heating element, 10 is a refrigerant liquid, 11 is a vapor of the refrigerant liquid (refrigerant vapor), 15 is a storage container (refrigerant liquid storage container) ), 16 is a dish-shaped forming part, 20 is a refrigerant liquid circulation part, 30 is piping, 40 is a printed board, 50 is a cooling tank, 55 is a liquid cooling pipe, 60 is a heat dissipation module 70 is a condenser, respectively. (CI) Figure 2
Claims (1)
漬冷却方式によって冷却する冷却装置であって、一方の
端部に冷媒液吸入開口部（１）を有し、他方の端部に冷
媒液放出開口部（２）を有してなる循環パイプ（５）と
、この循環パイプ（５）を表裏面に貫通させる形で装着
してなる冷媒液貯溜容器（１５）と、によって冷媒液循
環部（２０）を構成すると共に、この冷媒液循環部（２
０）を、前記冷媒液吸入開口部田が冷媒液（１０）中に
浸漬され、前記冷媒液放出開口部（２）と冷媒液貯溜容
器（１５）とが冷媒液（１０）から露出する形で冷却槽
（５０）内に配置してなることを特徴とする冷却装置。This is a cooling device that cools a heating element (8) mounted on a printed board (40) etc. by an immersion cooling method, and has a refrigerant liquid suction opening (1) at one end and a refrigerant liquid suction opening (1) at the other end. A refrigerant liquid is discharged by a circulation pipe (5) having a refrigerant liquid discharge opening (2) and a refrigerant liquid storage container (15) fitted with the circulation pipe (5) so as to pass through the front and back surfaces. This refrigerant liquid circulation section (20) is configured as well as a circulation section (20).
0), the refrigerant liquid suction opening field is immersed in the refrigerant liquid (10), and the refrigerant liquid discharge opening (2) and the refrigerant liquid storage container (15) are exposed from the refrigerant liquid (10). A cooling device characterized by being arranged in a cooling tank (50).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26970689A JPH03129896A (en) | 1989-10-16 | 1989-10-16 | Cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26970689A JPH03129896A (en) | 1989-10-16 | 1989-10-16 | Cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03129896A true JPH03129896A (en) | 1991-06-03 |
Family
ID=17476053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26970689A Pending JPH03129896A (en) | 1989-10-16 | 1989-10-16 | Cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03129896A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015232407A (en) * | 2014-06-09 | 2015-12-24 | 株式会社デンソー | Cooling system |
| WO2018173942A1 (en) * | 2017-03-22 | 2018-09-27 | フリージア・マクロス株式会社 | Cooling structure, cooling system, heating device, and structural object |
| JP2018160659A (en) * | 2017-03-22 | 2018-10-11 | フリージア・マクロス株式会社 | Cooling structure, cooling system, heat generation device, and structure |
| JP2018194211A (en) * | 2017-05-16 | 2018-12-06 | 富士通株式会社 | Cooling device, electronic device, and cooling system |
| WO2019058469A1 (en) * | 2017-09-21 | 2019-03-28 | 日本電気株式会社 | Electronic device |
-
1989
- 1989-10-16 JP JP26970689A patent/JPH03129896A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015232407A (en) * | 2014-06-09 | 2015-12-24 | 株式会社デンソー | Cooling system |
| WO2018173942A1 (en) * | 2017-03-22 | 2018-09-27 | フリージア・マクロス株式会社 | Cooling structure, cooling system, heating device, and structural object |
| JP2018160659A (en) * | 2017-03-22 | 2018-10-11 | フリージア・マクロス株式会社 | Cooling structure, cooling system, heat generation device, and structure |
| CN110520980A (en) * | 2017-03-22 | 2019-11-29 | 福利家麦克罗斯株式会社 | Cooling construction body, cooling system, heat generating device and structure |
| US11994351B2 (en) | 2017-03-22 | 2024-05-28 | Beji Sasaki | Cooling structural body, cooling system, heat generator and construction |
| JP2018194211A (en) * | 2017-05-16 | 2018-12-06 | 富士通株式会社 | Cooling device, electronic device, and cooling system |
| WO2019058469A1 (en) * | 2017-09-21 | 2019-03-28 | 日本電気株式会社 | Electronic device |
| JPWO2019058469A1 (en) * | 2017-09-21 | 2020-11-12 | 日本電気株式会社 | Electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3609991A (en) | Cooling system having thermally induced circulation | |
| US6981543B2 (en) | Modular capillary pumped loop cooling system | |
| US4944344A (en) | Hermetically sealed modular electronic cold plate utilizing reflux cooling | |
| EP0200221A2 (en) | Evaporation cooling module for semiconductor devices | |
| JPH03129896A (en) | Cooling device | |
| KR20020093897A (en) | Cooling device for cooling components of the power electronics, said device comprising a micro heat exchanger | |
| JPH02114597A (en) | Method of cooling electronic device | |
| JPH09303979A (en) | Heat pipe | |
| CA3021959C (en) | Cpu cooling system with direct spray cooling | |
| JPH03229493A (en) | Immersion cooling structure | |
| CN116483178A (en) | Computing equipment and cold plate thereof | |
| JPS63120449A (en) | Evaporation and cooling apparatus for integrated circuit element | |
| CN209946778U (en) | Server case and server | |
| JP2874100B2 (en) | Electronic equipment cooling system | |
| JPH02214147A (en) | Cooling apparatus | |
| JPS61131553A (en) | Immersion liquid cooling apparatus | |
| EP3618595B1 (en) | Heat dissipation system for liquid crystal television, and liquid crystal television | |
| CN213904268U (en) | Novel heat dissipation device for database server | |
| CN215222824U (en) | Oil cooling power supply | |
| CN215345564U (en) | High-efficient water-cooling head | |
| JPH0534113Y2 (en) | ||
| JP2746938B2 (en) | Cooling device for power supply circuit board | |
| CN218768038U (en) | Full liquid state oil cooling server machine case | |
| CN213279748U (en) | Self-cooling mobile phone motherboard | |
| CN217476397U (en) | Curing oven with high-efficient cooling performance |