WO2019048192A1 - Dispositif transformateur planaire et procédé de fabrication d'un dispositif transformateur planaire - Google Patents

Dispositif transformateur planaire et procédé de fabrication d'un dispositif transformateur planaire Download PDF

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Publication number
WO2019048192A1
WO2019048192A1 PCT/EP2018/071961 EP2018071961W WO2019048192A1 WO 2019048192 A1 WO2019048192 A1 WO 2019048192A1 EP 2018071961 W EP2018071961 W EP 2018071961W WO 2019048192 A1 WO2019048192 A1 WO 2019048192A1
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WO
WIPO (PCT)
Prior art keywords
outer board
motherboard
secondary winding
board
primary winding
Prior art date
Application number
PCT/EP2018/071961
Other languages
German (de)
English (en)
Inventor
Thomas Bosch
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Publication of WO2019048192A1 publication Critical patent/WO2019048192A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit

Definitions

  • the present approach relates to a planar transformer device and a method of manufacturing a planar transformer device according to the main claims.
  • Galvanic isolation transformers are typically manufactured with copper wire windings on both the primary and secondary sides around a ferrite core. Another possibility is the use of planar transformers, which windings are realized within the circuit board.
  • disadvantages of conventional standard transformers for example, a poor heat dissipation, a partially complex manufacturing process and a complex realization of the creepage distances and creeping be mentioned.
  • high AC losses can occur due to insufficient nesting of the primary and secondary windings.
  • planar transformers have some drawbacks, such as a need for a high number of layers of the circuit board to achieve high copper content for the current carrying capacity or the fulfillment of high demands on creepage distances when a high voltage potential is applied to a primary winding (ie corresponding Isolation distances are maintained).
  • the present invention provides a planar transformer device having the following features: a multilayer motherboard having at least a motherboard portion of a primary winding and a motherboard portion of a secondary winding; and
  • At least one multilayer outer board having at least one outer board portion of the primary winding and an outer board portion of the secondary winding
  • the base board portion of the primary winding is electrically conductively connected to the outer board portion of the primary winding and the base board portion of a secondary winding is electrically connected to the outer board portion of the secondary winding and wherein the outer board has a main surface facing the motherboard which is smaller , as a main surface of the motherboard facing the outer board.
  • a multilayer printed circuit board can be understood as meaning a printed circuit board in which there are electrically conductive paths in at least two planes which are separated from one another by an insulating layer.
  • a circuit board Under a motherboard, a circuit board can be understood, which is extended flat and, for example, further electronic components such as integrated circuits, resistors, capacitors or the like, which are electrically contacted, for example, to the circuit board by means of a solder joint.
  • An outer circuit board can be understood, for example, as a circuit board which is applied to a region of the motherboard, for example adhesively bonded or otherwise mechanically connected in this area, for example by means of a riveted connection or a screw connection.
  • the approach presented here is based on the recognition that by using the outer board, which has a smaller main surface than the motherboard, a possibility is provided to arrange this outer board in that area of the motherboard in which a transformer is to be realized. In this way it can be avoided that the motherboard must be equipped with a high number of layers, only to a small portion of this board sufficient space or a sufficient number of layers to realize the Accommodate primary windings and secondary winding of a transformer.
  • the outer board to be mounted separately can now be intentionally provided for "increasing" the number of layers of the motherboard in that area of the motherboard in which the transformer in the form of the planar transformer is to be realized
  • the outer board to be mounted separately can now be intentionally provided for "increasing" the number of layers of the motherboard in that area of the motherboard in which the transformer in the form of the planar transformer is to be realized
  • only the ones where a transformer is to be realized in a cost-effective and integrated form of the planar transformer can be achieved by attaching the outer board to make the realization of this planar transformer advantageous increase of board layers efficiently and inexpensively.
  • a multilayer second outer board may be provided which has at least a second outer board portion of the primary winding and a second outer board portion of a secondary winding, wherein the motherboard between the first and second outer board is arranged.
  • a second outer board can be used to further increase the number of layers in the area of the motherboard in which the transformer is to be formed in the planar transformer device and, on the other hand, to dispose of the available space as far as possible by arranging the second outer board on an opposite side of the motherboard can be exploited efficiently because the possibility of "increasing the number of layers" of the motherboard is not realized only on one side of the motherboard.
  • a particularly favorable insulation effect, in particular when applying a high-voltage potential to the primary winding has an embodiment of the approach proposed here, in which the at least one outer board section of the secondary winding is closer to a main surface of the outer board facing away from the main board than the at least one outer board Part of the primary winding.
  • a sequence of the layers associated with the primary winding or the layers associated with the secondary winding in the outer board may correspond to a sequence of the layers in the second outer board assigned to the primary winding or the layers associated with the secondary winding or may correspond mirror-inverted.
  • the motherboard has at least one motherboard section of a further secondary winding and the outer board has at least one outer board section of the further secondary winding, wherein the at least one motherboard section of the further secondary winding and the at least one Outdoor board section of the other secondary winding are electrically connected together.
  • Such an embodiment of the approach proposed here offers the advantage of being able to tap a further voltage independent of the secondary winding on the planar transformer device already by the formation of the corresponding further secondary winding which is integrated in the motherboard and the outer board.
  • primary side contact connections can be arranged on a first side of the at least one outer board or motherboard and primary side contact connections on one of the first side opposite. overlying second side of the at least one outer board or the motherboard may be arranged.
  • a core element is provided, in particular the ferrite, wherein the core element at least partially surrounds the motherboard and the outer board as a housing, in particular wherein the core element, the motherboard, the outer board and the second outer board embraces.
  • a core element can be understood, for example, an element which acts as a yoke of a transformer unit for the bundling of magnetic field lines and is arranged through at least one turn of the primary winding and the secondary winding.
  • Such an embodiment offers the advantage of particularly efficient focusing of the electromagnetic field induced by the primary winding, so that the efficiency of such a planar trans-frictional device can be increased.
  • the multilayer motherboard having at least the motherboard subsection of the primary winding and the motherboard subsection of the secondary winding
  • the multilayer outer board having at least the outer board portion of the primary winding and the outer board portion of the secondary winding;
  • the motherboard subsection of the primary winding is electrically conductively connected to the outer board subsection of the primary winding and that the motherboard subsection of the secondary winding is electrically conductively connected to the outer board subsection of the secondary winding, and the outer board has a main surface facing the motherboard, the smaller is, as the outer board facing main surface of the motherboard.
  • a device can be provided which is set up to execute the steps of a variant of the method presented here in corresponding units.
  • a device may be an electrical device that processes electrical signals, such as sensor signals, and outputs control signals in response thereto.
  • the device may have one or more suitable interfaces, which may be formed in hardware and / or software.
  • the interfaces may be part of an integrated circuit in which functions of the device are implemented.
  • the interfaces may also be their own integrated circuits or at least partially consist of discrete components.
  • the interfaces may be software modules that are present, for example, on a microcontroller in addition to other software modules.
  • a computer program product with program code which can be stored on a machine-readable carrier such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above if the program product is installed on a computer or a device is also of advantage is performed.
  • 1 is a cross-sectional view of a planar transformer device according to an embodiment of the present invention
  • 2 shows schematic cross-sectional views through various circuit boards, as can be used in embodiments of the planar transformer device presented here;
  • FIG. 3 shows different partial representations, in which the sequence of different windings to assigned layers is shown in a respective cross-sectional representation of a planar transformer device
  • FIG. 4 shows two schematic partial representations in cross-sectional view (upper partial view) and in a supervisory view (lower partial view), which is the overall structure of a planar transformer device according to an embodiment of the approach presented here;
  • FIG. 5 shows a flow chart of an exemplary embodiment of a method for producing a planar transformer device according to an embodiment variant presented here.
  • FIG. 6 shows a block diagram of a device for producing a planar transformer device according to an embodiment variant presented here.
  • an exemplary embodiment comprises a "and / or" link between a first feature and a second feature, then this is to be read so that the embodiment according to one embodiment, both the first feature and the second feature and according to another embodiment either only first feature or only the second feature.
  • the planar transformation Magnetizer 100 includes a motherboard 105, which has a plurality of layers 1 10, in which conductive structures 1 15, for example in the form of conductor tracks are formed. These conductive structures 15 are internally connected to connecting sections 120, so that a plurality of sections of windings, which form parts of a transformer 125, are formed in the motherboard 105.
  • a first group of conductive structures 15 may be interconnected by interconnect sections 120 to one motherboard subsection 130 of a primary winding, while a second group of conductive structures 15 are interconnected by other interconnect sections 120 to a motherboard subsection 135 of a secondary winding.
  • 10 insulating layers 140 are disposed between the individual conductive structures 1 15 on the layers 1, so that stacking of the individual conductive structures 1 15 in the Motherboard 105 is enabled.
  • the planar transformer device 100 comprises a multilayer outer board 145 which likewise has, for example, a plurality of electrically insulated layers 1 10 analogous to the motherboard 105, in which electrically conductive structures 1 15, for example likewise again in the form of printed conductors, are arranged. These conductive structures 15 are likewise electrically connected to one another again by means of connecting sections 120 such that, in turn, sections of the primary winding and the secondary winding are also formed in the outer board 145. For example, in the outer board 145, an outer board portion 150 of the primary winding and an outer board portion 155 of the secondary winding are provided.
  • a connecting element 160 for example, the base board section 130 of the primary winding is now electrically conductively connected to the outer board section 150, so that a primary winding of the transformer 125 of the planar transformer device 100 is thereby formed.
  • the base plate section 135 of the secondary winding can be electrically conductively connected to the outer board section 155 of the secondary winding, so that a secondary winding of the transformer 125 of the planar transformer can be connected.
  • Matorvoriques 100 is formed.
  • a core element 170 is provided, which in particular has ferrite and wherein the core element 170 at least partially surrounds the motherboard 105 and the outer board 145 as a housing. In this way, in particular, an efficient guidance of a magnetic flux through the core element 170 can be achieved.
  • the outer board 145 is designed such that it is smaller than the motherboard 105.
  • the outer board 145 has a main surface 175 facing the motherboard 105, which is smaller than a main surface 180 of the motherboard 105 facing the outer board 145.
  • material for the production of the outer board 145 can be saved, since only in the area 185 In which the transformer 125 of the planar transformer device 100 is to be formed, an increased number of layers is required and, outside this area 185, for example, an electrical circuit, not shown in FIG. 1, can be designed or implemented, for the realization of which a smaller number of layers 10 Motherboard 105 is sufficient.
  • the provision of the outer board 145 specifically serves to locally elevate layers 110 to realize a corresponding interlocking structure of portions of the primary winding and secondary winding of the transformer 125.
  • the planar transformer device 100 comprises a multilayer second outer board 145 'which likewise has, for example, analogously to the motherboard 105 a plurality of electrically insulated layers 1 10 in which electrically conductive structures 11 , For example, again in the form of tracks, are arranged. These conductive structures 1 15 are also electrically connected to each other again by means of connecting portions 120, which in turn Subsections of the primary winding and the secondary winding are also formed in the outer board 145. For example, a second outer board section 150 'of the primary winding and a second outer board section 155' of the secondary winding are provided in the second outer board 145 '.
  • the base board section 130 of the primary winding is electrically conductively connected to the second outer board section 150', so that the primary winding of the transformer 125 of the planar transformer device 100 is further improved.
  • the base plate section 135 of the secondary winding can be electrically conductively connected to the second outer board section 155' of the secondary winding, so that a secondary winding of the transformer 125 of the planar transformer device 100 is further improved.
  • the second outer board 145 ' is also smaller in its direction of extension than the motherboard 105 with the motherboard 105 between the outer board 145 and the second outer board 145' is arranged.
  • the second outer board 145 ' also has a main surface 175' facing the motherboard 105, which is smaller than a second main surface 180 'of the motherboard 105 facing the second outer board 145'.
  • the core element 170 is still attached in such a way that, in addition to the motherboard 105 and the outer board 145, it also surrounds the second outer board 145 'at least partially as a housing. In this way, in particular, an efficient guidance of a magnetic flux through the core element 170 can be achieved.
  • the outer board and / or second outer board conductive structures are introduced, which are connected to a second secondary winding.
  • the secondary winding and the second secondary winding can either be independent of one another, for example electrically insulated, or the second secondary winding can be connected as a series connection of the secondary winding, so that, for example, the secondary winding and the second secondary winding have a common point of application.
  • a winding ratio of primary winding to secondary winding to second secondary winding of, for example, 12: 1: 1 (at a Number of 6 layers on the outer board and the second outer board respectively), 14: 1: 1 (also with a number of 6 layers on the outer board and the second outer board respectively) or 16: 1: 1 (with a number of 8 layers on the outer board or the second outer board) can be realized.
  • exemplary embodiments of such embodiments of the planar transformer device are only described textually in FIG.
  • FIG. 2 shows a schematic cross-sectional illustration through various circuit boards, as they can be used in exemplary embodiments of the planar transformer device 100 presented here.
  • the left cross-sectional view of FIG. 2 shows a structure of the motherboard 105 with individual layers 1 10, which are assigned to the individual windings trainees transformer of Planartransformatorvorraum 100.
  • a nomenclature has been used in the left cross-sectional view from FIG. 2, in which the designation Prim is an assignment of the corresponding layer 110 to the primary winding, designation Sek1 an assignment the corresponding position 1 10 to the (first) secondary winding and the name Sek2 represents an assignment of the corresponding position 1 10 to the second secondary winding.
  • the motherboard 105 is composed of the stacked sequence of 16 layers 1 10, which are assigned to the windings as follows: Sek1, Prim, Prim, Sek2, Sek2, Prim, Prim, Sek1, Sek1 , Prim, Prim, Sec2, Sec2, Prim, Prim, Sec1. It can thus be seen that in the base plate 105 shown in the left cross-sectional representation of FIG. 2, two adjacent layers of a winding, for example the primary winding, the second secondary winding or the (first) secondary winding are assigned to the lowest layer.
  • the outer board 145 and the second outer board 145 'can each have a 6-layer structure, the sequence of the individual layers being defined by the nomenclature Sek1, Prim, Sek2, Sek1, Prim and Sek2 can be specified, as shown in detail in the Figure 2 in the position 200.
  • Both the outer board 145 and the second outer board 145 'can be constructed in such a way that the sequence Sek1, Prim, Sek2 of layers assigned to individual windings is repeated at least once.
  • the outer board 145 and / or the second outer board 145 'adjacent layers 1 10 associated with different windings can be very efficient, avoid creepage distances of currents and realize a good electrical insulation.
  • the 6-layer outer board 145 or the 6-layer second outer board 145 ' has a winding ratio of 12: 1: 1 another assignment of the layers 1 to 10 windings, as shown in FIG is shown in more detail at the position 210.
  • the layers 1 10 of the outer board 145 and the second outer board 145 ' are assigned to the different windings in the following sequence: Sek1, Sek2, Prim, Prim, Sek1, Sek2.
  • the inner adjacent layers 1 10 can be assigned to the primary winding, so that the primary winding can be designed for a high current density and a resulting from current flow in the primary winding electric field can very efficiently overcouple in the secondary winding and the second secondary winding.
  • the 6-layer outer board 145 and the 6-layered second outer board 145 'at a winding ratio of 14: 1: 1 have a different assignment of the layers 1 10 to windings, as shown in FIG Position 220 is shown in more detail.
  • the two inner, the primary winding associated layers 1 10 are now configured such that they, for example, not a turn, but form one and a half turns. As a result, two additional turns of the primary winding can then be realized with appropriate design of both outer boards, although both outer boards 145 and 145 'are each only 6-layered.
  • the construction of the outer board 145 or the second outer board 145 'shown at the position 230 in FIG. 2 now likewise comprises two adjacent layers 110 which are assigned to a common winding, namely here the primary winding and where now one (now mirrored) repetition of the sequence of an assignment of layers to corresponding windings in each of the outer board 145 or 145 'is realized.
  • an outer layer of the respective outer boards 145 and 145 'of the (first) secondary winding Sek1 assigned so that the above-mentioned advantages in terms of efficient electrical insulation, the avoidance of high leakage currents can be realized.
  • FIG. 3 shows, in different partial representations, the sequence of layers assigned to different windings in a respective cross-sectional illustration of a planar transformer device 100, which results when the motherboard 105 is connected to an outer board 145 and a second outer board 145 ', the second outer board 145' being on one of the outer board 145 opposite side is arranged.
  • FIG. 3 shows in the four cross-sectional representations those sequences of layers which, when the motherboard 105 is assembled with the outer board 145 and the second outer board 145 ', correspond to the representations at the different positions 200, 210, 220 and 230 in FIG Figure 2 result. It can be seen here that the values in the MMF diagrams for the (first) secondary winding Sek1 and the second secondary winding Sek2 mostly move in the (normalized) value from -2 to +2 and thus avoid an excessive magnetic force acting on the individual printed conductors can be, so that a planar transformer device 100 thus constructed is mechanically very stable and durable.
  • FIG. 4 shows in two schematic partial representations in cross-sectional view (upper partial view) and in a top view (lower partial view) of the overall structure of a planar transformer device 100 according to an exemplary embodiment of the approach presented here.
  • the motherboard 105 is significantly larger in a main direction of extent or has a significantly larger main surface 180 than a main surface 175 of the outer board 145 facing the motherboard 105 or a main surface 175 'of the second external board 145' facing the motherboard 105.
  • the core element 170 is still here can be seen in the form of a ferrite core in the figure 4, which forms a housing around a part of the motherboard 105 together with the outer board 145 and the second outer board 145 'in the region of the transformer 125 to be formed.
  • primary side contact terminals 410 for electrically contacting the primary winding on a first side 415 here the outer board 145 and the second outer board 145 '
  • secondary side contact terminals 420 for electrically contacting the (first) secondary winding and / or the second secondary winding on one of the first side 415 opposite second side 425 here the outer board 145 and the second outer board 145 '
  • a symmetrical current flow 430 can take place via the contact connections, in this case the secondary side contact connections 420 and the sinkers 105, 145 and / or 145 '.
  • the approach presented here enables symmetrical loading of the transformer windings by means of a sandwich arrangement of the printed circuit boards or printed circuit boards. Also, a reduction in the number of layers in the entire printed circuit board, that is, the circuit board referred to here as the motherboard 105 can be made possible by a partial increase in the number of layers by stacking printed circuit boards in an area in which the transformer 125 is to be formed. In addition, AC losses are reduced by the nesting of the primary and secondary windings (low values in the MMF diagram (Magnetomotive Force)). Furthermore, a better utilization of the winding window (ie, a higher degree of copper filling) can be achieved.
  • the approach presented here can be created by the fact that the boards to be connected as stacking boards can be connected by means of press-fit technology.
  • the defined layer structure presented here for example, there are no primary winding turns on the outer layers, which results in reduced requirements for clearance and creepage distances.
  • various turns ratios of the transformers can be realized, for example, center-tapped transformers having a turn ratio 12: 1: 1, 14: 1: 1, 16: 1: 1, and also transformers without center tapping and a turn ratio 12 : 1, 14: 1, 16: 1. It can be both transformers with odd Winding ratio be represented, in which case the symmetry in the MMF diagram is no longer given, resulting in this case, then slightly higher AC losses.
  • the clearance and creepage distances only refer to LV potential, i. h., to a voltage ⁇ 100V.
  • variants of the approach presented here can be implemented, which realize different Windungsiererion by different number of layers of printed circuit boards. In this case, both the number of layers of the motherboard and the number of layers of the outer board (s) can be varied. In this way, a plurality of Windungsiererion can then be displayed.
  • FIG. 5 shows a flow chart of an exemplary embodiment of a method 500 for producing a planar transformer device according to an embodiment variant presented here.
  • the method 500 includes a step 510 of providing the multilayer motherboard having at least a motherboard subsection of the primary winding and a motherboard subsection of a secondary winding, a multilayer outer board having at least one outer board subsection of the primary winding, and an outer board subsection of the secondary winding , Furthermore, the method 500 comprises a step 520 of arranging the motherboard and the outer board in such a way that the motherboard Partial portion of the primary winding is electrically conductively connected to the outer board portion of the primary winding and the motherboard portion of a secondary winding is electrically connected to the outer board portion of the secondary winding and the outer board has a main surface facing the motherboard, which is smaller than one of the outer board facing main surface of the motherboard.
  • FIG. 6 shows a block diagram of a device 600 for producing a planar transformer device according to an embodiment variant presented here, the device 600 having a device 610 for providing and a device 620 for arranging.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)

Abstract

La présente invention concerne un dispositif transformateur planaire (100) comportant une carte mère (105) multicouche, qui comporte au moins une section partielle de carte mère (130) d'un enroulement primaire et une section partielle de carte mère (135) d'un enroulement secondaire. En outre, le dispositif transformateur planaire (100) comprend au moins une carte externe (145) multicouche, qui comporte au moins une section partielle de carte externe (150) de l'enroulement primaire et une section partielle de carte externe (155) de l'enroulement secondaire, la section partielle de carte mère (130) de l'enroulement primaire étant raccordée de manière électriquement conductrice à la section partielle de carte extérieure (150) de l'enroulement primaire et la section partielle de carte mère (135) d'un enroulement secondaire étant raccordée de manière électriquement conductrice à la section partielle de carte extérieure (155) de l'enroulement secondaire et la carte externe (145) comportant une surface principale (175) faisant face à la carte mère (105), qui est inférieure à une surface principale (180) de la carte mère (105) faisant face à la carte externe (145).
PCT/EP2018/071961 2017-09-06 2018-08-14 Dispositif transformateur planaire et procédé de fabrication d'un dispositif transformateur planaire WO2019048192A1 (fr)

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DE102017215637.6 2017-09-06
DE102017215637.6A DE102017215637A1 (de) 2017-09-06 2017-09-06 Planartransformatorvorrichtung und Verfahren zur Herstellung einer Planartransformatorvorrichtung

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6369685B1 (en) * 1997-07-10 2002-04-09 Melcher A.G. Multi-layer planar inductance coil and a method for producing the same
US20040032313A1 (en) * 2002-08-15 2004-02-19 Andrew Ferencz Simplified transformer design for a switching power supply
US20100219926A1 (en) * 2007-06-11 2010-09-02 Willers Michael J Low-profile transformer
US20150062951A1 (en) * 2013-09-03 2015-03-05 Panasonic Corporation Lighting device, light fixture, and vehicle

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080278275A1 (en) * 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
DE102014221568A1 (de) * 2014-10-23 2016-04-28 Siemens Aktiengesellschaft Transformator und Verfahren zum Betrieb eines Transformators

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6369685B1 (en) * 1997-07-10 2002-04-09 Melcher A.G. Multi-layer planar inductance coil and a method for producing the same
US20040032313A1 (en) * 2002-08-15 2004-02-19 Andrew Ferencz Simplified transformer design for a switching power supply
US20100219926A1 (en) * 2007-06-11 2010-09-02 Willers Michael J Low-profile transformer
US20150062951A1 (en) * 2013-09-03 2015-03-05 Panasonic Corporation Lighting device, light fixture, and vehicle

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