WO2019044058A1 - Card and method for manufacturing same - Google Patents

Card and method for manufacturing same Download PDF

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Publication number
WO2019044058A1
WO2019044058A1 PCT/JP2018/019476 JP2018019476W WO2019044058A1 WO 2019044058 A1 WO2019044058 A1 WO 2019044058A1 JP 2018019476 W JP2018019476 W JP 2018019476W WO 2019044058 A1 WO2019044058 A1 WO 2019044058A1
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WO
WIPO (PCT)
Prior art keywords
card
decorative piece
adhesive layer
substrate
transfer sheet
Prior art date
Application number
PCT/JP2018/019476
Other languages
French (fr)
Japanese (ja)
Inventor
伸夫 窪▲崎▼
忠壮 谷口
充康 奥田
俊介 坂本
深田　泰秀
晶允 ▲斉▼藤
Original Assignee
Ｎｉｓｓｈａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｎｉｓｓｈａ株式会社 filed Critical Ｎｉｓｓｈａ株式会社
Publication of WO2019044058A1 publication Critical patent/WO2019044058A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D15/00—Printed matter of special format or style not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/46—Associating two or more layers using pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer

Definitions

  • the present invention relates to a card and a method of manufacturing the same.
  • a pressing method using a heat press and a cooling press is known.
  • the decorative piece 13 is embedded in the card base 12 by heat pressing (see FIG. 8A).
  • the pressure is released (see FIG. 8 (b)), and a cooling press is performed (see FIG. 8 (c)).
  • the decorative piece 13 can be easily embedded.
  • curd base material produced by heat press can be suppressed by carrying out cooling press.
  • the present invention has been made to solve the problems as described above, and it is an object of the present invention to provide a card having no offset of decorative pieces and a method of manufacturing the same.
  • the manufacturing method of the card of the present invention is Prepare a card base on which a decorative piece is placed, and a transfer sheet on which an adhesive layer adhering only to the card base is formed on a base sheet, and the face on which the decorative piece of the card base is placed And a placement step of placing the face of the transfer sheet on which the adhesive layer is formed facing each other, An embedding step of embedding the decorative piece in the card substrate by heat pressing the card substrate and the transfer sheet; A release step for releasing the pressure by the heat press; A cooling press step of cooling and pressing the card substrate and the transfer sheet; And a peeling step of peeling the base sheet from the card base material.
  • the adhesive layer transferred to the decorative piece may be removed after the peeling step.
  • the transfer sheet may have a pattern layer formed between the base sheet and the adhesive layer.
  • an adhesive layer may be formed between the decorative piece and the card substrate.
  • the surface of the card base and the surface of the decorative piece may be flush.
  • the material of the decorative piece may be metal.
  • At least the surface of the decorative piece may be chromium and the adhesive layer may be an acrylic resin.
  • the card of the present invention is Card base material, Decorative pieces embedded in the surface of the card substrate, And at least an adhesive layer formed only on the card substrate.
  • the card of the present invention is Card base material, Decorative pieces embedded in the surface of the card substrate, An adhesive layer formed only on the card substrate, And at least a graphic layer formed only on the adhesive layer.
  • the surface of the card base and the surface of the decorative piece may be flush.
  • the method for producing a card of the present invention prepares a card base on which a decorative piece is placed, and a transfer sheet having at least an adhesive layer formed on the base sheet and adhered to the card only. Placement step of arranging the face on which the decorative piece is placed and the face on which the adhesive layer of the transfer sheet is formed facing each other, and thermally pressing the card base and the transfer sheet to the card base.
  • the card of the present invention is configured to include at least a card base, a decorative piece embedded in the surface of the card base, and an adhesive layer formed only on the card base. Also, the card of the present invention comprises a card substrate, a decorative piece embedded on the surface of the card substrate, an adhesive layer formed only on the card substrate, and a pattern formed only on the adhesive layer. It was configured to include at least a layer. Therefore, the card of the present invention is one in which the decorative pieces do not shift.
  • a card base 1 on which a decorative piece 2 is placed, and a transfer sheet 3 having at least an adhesive layer 5 adhered only to the card base 1 on a base sheet 4 Providing the card substrate 1 and the surface on which the decorative piece 2 of the card substrate 1 is placed, and the surface on which the adhesive layer 5 of the transfer sheet 3 is formed, the card substrate 1 and the transfer sheet A process of embedding the decorative piece 2 in the card substrate 1 by heat-pressing 3 and a releasing process of releasing the pressure by the heat press, and a cooling press process of cooling-pressing the card substrate 1 and the transfer sheet 3 And a peeling step of peeling the base sheet 4 from the card base 1 (see FIG. 1).
  • a card base 1 on which the decorative piece 2 is placed and a transfer sheet 3 having at least an adhesive layer 5 adhered only to the card base 1 on the base sheet 4 are prepared.
  • the surface of the material 1 on which the decorative piece 2 is placed and the surface of the transfer sheet 3 on which the adhesive layer 5 is formed are arranged to face each other (see FIG. 1A).
  • the material of the card substrate 1 examples include thermoplastic resins such as polypropylene resin, polyethylene resin, polyamide resin, acrylic resin, olefin resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, and ABS resin. Resins and laminates of these, as well as paper can be used. Preferably, it is a polyvinyl chloride resin (PVC).
  • PVC polyvinyl chloride resin
  • the surface of the card substrate 1 on which the decorative piece 2 is placed may have irregularities.
  • the material of the decorative piece 2 may have a strength that can withstand the pressure of the heat press and a heat resistance that can withstand the heat, and metals, resins, composite materials of these, and the like can be used.
  • the decorative piece 2 can be of any shape. For example, shapes such as corporate logos, product names, numbers, letters, symbols, etc.
  • a card in which the adhesive layer 5 is not laminated on the decorative piece 2 of the card can be obtained. Therefore, when a metal is used as the material of the decorative piece 2, the texture such as glossiness and texture of the metal is utilized. You can get a card.
  • the transfer sheet 3 has at least an adhesive layer 5 formed on a base sheet 4.
  • the base sheet 4 peels from the card substrate 1 after the cooling press.
  • the material of the base sheet 4 include thermoplastic resins such as polypropylene resin, polyethylene resin, polyamide resin, acrylic resin, olefin resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, and ABS resin. And these laminates can be used.
  • the transfer sheet 3 may have the pattern layer 6 formed between the base sheet 4 and the adhesive layer 5 (see FIG. 2A).
  • the decorative layer of the card can be improved by the pattern layer 6.
  • the pattern layer 6 may be formed on the entire surface, or may be formed in any pattern.
  • the pattern layer 6 is formed on the base sheet 4 by a common printing method such as gravure printing, screen printing or offset printing, a coating method such as gravure coating, roll coating or die coating, or a transfer method. can do.
  • the material of the pattern layer 6 includes, for example, a resin such as an acrylic resin, a vinyl chloride vinyl acetate copolymer resin, a thermoplastic urethane resin, a polyester resin, and a pigment or a dye to be added to the resin.
  • the pattern layer 6 may be, for example, a metal thin film layer formed by depositing a metal using a vacuum deposition method or a sputtering method, or may be formed by applying an etching method to the metal thin film layer .
  • the pattern layer 6 may have a metallic design using, for example, an aluminum paste or a mirror ink.
  • the pattern layer 6 can be formed, for example, with a thickness of several hundred nm to several tens of ⁇ m.
  • the pattern layer 6 may give the card a matte texture after peeling off the base sheet.
  • the pattern layer giving a matte texture is pressed using a transfer sheet in which the pattern layer is formed on the uneven surface of the substrate sheet 4 on which fine asperities are formed, and then the substrate sheet is peeled off or particles are formed inside the pattern layer. It can be obtained by incorporating it.
  • the transfer sheet 3 may have the protective layer 7 further formed on the base sheet 4 (see FIG. 3A).
  • the protective layer 7 is a layer which becomes the outermost surface of the card after peeling off the base sheet 4.
  • thermoplastic resin such as acrylic resin, polystyrene resin, polyamide resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, coumarone indene resin, etc. is used. be able to.
  • the protective layer is formed of such a thermoplastic resin, it is possible to give the card chemical resistance and the like.
  • a photocurable resin such as an ultraviolet curable resin, a radiation curable resin such as an electron beam curable resin, and a thermosetting resin.
  • resins include urethane acrylate resins, cyanoacrylate resins, epoxy acrylate resins, polyester acrylate resins, and resins obtained by adding an additive such as isocyanate to these resins.
  • a method of forming the protective layer 7 a usual printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method, a roll coating method, or a die coating method can be used.
  • the protective layer is formed of the above-mentioned curable resin, physical properties such as durability and wear resistance can be given to the card.
  • a release layer (not shown) may be laminated on the base sheet 1 in order to further improve the release property of the base sheet 1.
  • the release layer is peeled off together with the base sheet 1 when the base sheet 1 is peeled off.
  • the adhesive layer 5 a material having a property of adhering only to the card substrate 1 is used.
  • the transfer sheet 3 on which such an adhesive layer 5 is formed when the transfer sheet 3 is peeled off from the card substrate 1 after the cooling press, the adhesive layer on the decorative piece 2 does not adhere to the decorative piece 2 and this portion The adhesive layer is peeled off together with the base sheet 4 (see FIG. 1 (e)). That is, in this case, since the adhesive layer is neither transferred nor adhered to the decorative piece, it is possible to easily obtain a card in which the decorative piece is exposed.
  • the adhesive layer 5 not adhered to the decorative piece 2 and the pattern layer 6 corresponding to the area where the adhesive layer is formed are peeled off together with the base sheet 4. (See FIG. 2 (b)).
  • the protective layer 7 is further formed on the transfer sheet 3, the adhesive layer 5 which is not adhered to the decorative piece 2 and the pattern layer 6 and the protective layer 7 corresponding to the area where the adhesive layer is formed are It peels with the base sheet 4 (refer FIG.3 (b)).
  • a heat-sensitive or pressure-sensitive resin can be appropriately selected and used.
  • acrylic resin polystyrene resin, polyamide resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, coumarone indene resin and the like. These resins are appropriately selected depending on the material of the decorative piece 2. If the material of the decorative piece 2 is at least the surface of chromium, the material of the adhesive layer 5 may be an acrylic resin. By doing so, the adhesive layer 5 does not adhere to the decorative piece 2 after peeling off the transfer sheet, so it is possible to obtain a card utilizing the texture of chromium.
  • the thickness of the adhesive layer can be 0.1 ⁇ m to 50 ⁇ m.
  • a usual printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method, a roll coating method, or a die coating method can be used.
  • a coating method such as a gravure coating method, a roll coating method, or a die coating method.
  • An anchor layer (not shown) may be provided between the layers described above in order to improve adhesion.
  • the drying temperature at the time of forming each of the above layers can be, for example, 50 ° C. to 200 ° C.
  • the embedding step is a step of embedding the decorative piece 2 in the card substrate 1 by heat-pressing the card substrate 1 and the transfer sheet 3 (see FIG. 1B).
  • the heat press is performed, for example, by a press including the upper mold 10 and the lower mold 11.
  • the card base 1 and the transfer sheet 3 are integrated by the heat press.
  • the upper mold 10 and the lower mold 11 each have a heating mechanism, and the heating temperature can be set freely.
  • the heating temperature can be, for example, 50 ° C. to 300 ° C. for the upper mold 10 and 50 ° C. to 300 ° C. for the lower mold 11.
  • the upper mold and the lower mold may be at the same temperature or at different temperatures. When the temperature is the same, warpage due to heat pressing can be less likely to occur. Further, the pressure applied by the heat press can be 0.01 MPa to 2 MPa depending on the degree of softening of the card base and the embedding amount of the decorative piece.
  • the temperatures of the upper and lower molds are different, for example, when the card base is formed by laminating different materials, warpage of the card base due to the difference in the thermal contraction rate between the materials is suppressed. be able to.
  • the embedded amount of the decorative piece may be such that the surface of the card substrate and the surface of the decorative piece are flush (Fig. 1 (e), Fig. 2 (b), Fig. 3 (b), and Fig. 4 (f), see FIG. 5 (b)).
  • the surface of the decorative piece 2 includes a curved surface
  • the top of the curved surface t is embedded so as to be flush with the surface of the card substrate 1 (see FIG. 6A). If the decorative piece is embedded so that the surface of the card substrate and the surface of the decorative piece are flush, no step is formed on the surface to which the adhesive layer of the transfer sheet adheres, and the pressure of the heat press is the card substrate and the transfer sheet And the adhesive layer firmly adheres the card substrate and the transfer sheet.
  • the thickness of the adhesive layer or the pattern layer is as thin as several hundred nm to several tens ⁇ m. Therefore, even if the surface of the card substrate and the surface of the decorative piece are flush, it is possible to obtain a card which hardly senses a difference in level when touched.
  • the adhesive layer 8 may be formed between the decorative piece 2 and the card base 1 (see FIG. 5A). That is, the decorative piece 2 may be attached in advance to the surface of the card substrate 1.
  • the adhesive layer includes an adhesive layer and an adhesive layer. Therefore, the decorative piece may be completely fixed to the card base material, or the decorative piece may be peeled off from the card base material and may be pasted again.
  • the adhesive layer is formed, the decorative piece embedded in the card substrate by the heat press can be more firmly fixed to the card substrate 1 (see FIG. 5 (b)).
  • the decorative piece is adhered to a predetermined position of the card substrate in advance, it is possible to more reliably prevent the decorative piece from being shifted by the cooling press process.
  • the releasing step is a step of releasing the pressure by the heat press (see FIG. 1 (c)).
  • the pressure is released by moving the upper mold 10 to the upper side of the drawing and the lower mold 11 to the lower side of the drawing.
  • distortion occurs in the integrated card base 1 and the transfer sheet 3 due to heat contraction.
  • the pressure may be released by moving either the upper mold or the lower mold.
  • the cooling pressing step is a step of cooling and pressing the card base 1 and the transfer sheet 3 (see FIG. 1 (d)).
  • the cooling press is performed, for example, by a press including the upper mold 10 and the lower mold 11 as in the heat press. The same mold as in the heat press may be used, or a different mold from the heat press may be used.
  • the cooling press can correct the distortion caused by the heat press in the embedding process.
  • the temperature at the time of the cold pressing may be lower than the temperature at the hot pressing, and may be, for example, 4 ° C. to 50 ° C.
  • the pressure applied by the cooling press can be set to 0.01 MPa to 3 MPa according to the degree of softening of the card substrate after the hot pressing.
  • the card substrate 1 and the transfer sheet 3 are firmly adhered by the adhesive layer 5 of the transfer sheet 3. Since the adhesive layer 5 is in close contact with the decorative piece 2 and the decorative piece 2 is sandwiched between the firmly adhered card substrate 1 and the transfer sheet 3, the decorative piece 2 is required to be predetermined even by a cooling press. It becomes difficult to shift from the position.
  • the peeling step is a step of peeling the base sheet 4 from the card base 1.
  • the adhesive layer 5 adheres only on the card base 1 (see FIG. 1 (e)).
  • the decorative piece can be exposed by the peeling process.
  • the adhesive layer 5 may be in a state where it is not adhered but transferred on the decorative piece 2 (see FIG. 4E).
  • the adhesive layer 5 transferred onto the decorative piece 2 may be removed to produce the card of the present invention (see FIG. 4 (f)).
  • Examples of the removal method include a method using an adhesive tape, air blow, cloth wiping, water washing, solvent washing and the like. In the case of FIG.
  • the decorative piece since the adhesive layer is transferred on the decorative piece but not adhered, the decorative piece can be easily exposed by the removal method described above. Even when the transfer sheet 3 includes other layers such as the pattern layer 6 and the protective layer 7, the adhesive layer, the pattern layer, and the protective layer laminated on the decorative piece are removed by the above method. (See FIG. 2 (b), FIG. 3 (b)).
  • the decorative piece is embedded so that the surface of the card base and the surface of the decorative piece are flush with each other, but the surface of the decorative piece may be embedded so as to protrude from the surface of the card base 7 (a)).
  • it can be embedded in this way by adjusting the pressure of the heat press and the cooling press.
  • the surface of the adhesive layer 5 may be flush with the surface of the decorative piece 2 (see FIG. 7 (b)).
  • Such a card can be obtained by embedding the decorative piece 2 leaving the thickness of the adhesive layer 5. In this way, the card surface can be smoothed.
  • the decorative piece may be embedded leaving a thickness obtained by adding the thickness of these layers and the thickness of the adhesive layer.
  • the surface of the decorative piece 2 may protrude from the surface of the adhesive layer 5 (see FIG. 7C).
  • a card can be obtained by embedding the decorative piece 2 so as to exceed the thickness of the adhesive layer 5.
  • a step is formed on the card surface, it is possible to obtain a card having a three-dimensional effect on the decorative piece.
  • what is necessary is just to embed a decoration piece so that the thickness which added the thickness of these layers and the thickness of an adhesion layer may be exceeded, when using the transfer sheet 3 in which the pattern layer 6 and the protective layer 7 were formed.
  • the card of the present invention can be obtained.
  • Card base 2 Decorative piece 3: Transfer sheet 4: Base sheet 5: Adhesive layer 6: Pattern layer 7: Protective layer 8: Adhesive layer 9: Card 10: Upper type 11: Lower type 12: Card base 13: Decoration piece 14: Card

Abstract

[Problem] To provide a card without misalignment of a decorative piece and a method for manufacturing the same. [Solution] This method for manufacturing a card is provided with: an arrangement step for preparing a card substrate on which a decorative piece is placed and a transfer sheet in which at least an adhesive layer attached only to the card substrate is formed on a substrate sheet, and for arranging a decorative piece-placed surface of the card substrate and an adhesive layer-formed surface of the transfer sheet so as to face each other; an embedding step for embedding the decorative piece into the card substrate by heat pressing the card substrate and the transfer sheet; a release step for releasing a pressure caused by the heat pressing; a cold press step for cold pressing the card substrate and the transfer sheet; and a peeling step for peeling the substrate sheet from the card substrate. The card is provided with at least: a card substrate; a decorative piece embedded in the surface of the card substrate; and an adhesive layer formed only on the card substrate.

Description

カードとその製造方法Card and its manufacturing method
　本発明は、カードとその製造方法に関する。 The present invention relates to a card and a method of manufacturing the same.
　装飾片を有するカードを製造する方法として、熱プレスと冷却プレスとを用いたプレス加工法が知られている。この方法では、まず熱プレスによって装飾片１３をカード基材１２に埋め込む（図８（ａ）参照）。次に、圧力を解放して（図８（ｂ）参照）、冷却プレスをする（図８（ｃ）参照）。この方法では、熱プレスの熱でカード基材が軟化するため、装飾片１３を容易に埋め込むことができる。また、冷却プレスすることで、熱プレスによって生じたカード基材の歪みを抑えることができる。 As a method of manufacturing a card having a decorative piece, a pressing method using a heat press and a cooling press is known. In this method, first, the decorative piece 13 is embedded in the card base 12 by heat pressing (see FIG. 8A). Next, the pressure is released (see FIG. 8 (b)), and a cooling press is performed (see FIG. 8 (c)). In this method, since the card substrate is softened by the heat of the hot press, the decorative piece 13 can be easily embedded. Moreover, distortion of the card | curd base material produced by heat press can be suppressed by carrying out cooling press.
特開２０１４－１００８０２号公報JP, 2014-100802, A
　しかし、従来のカードの製造方法では、歪みが生じたカード基材を冷却プレスで伸ばして歪みを矯正する際にカード基材の伸びに引っ張られて、装飾片が本来の埋め込み位置からずれ量ｌだけずれてしまう（図８（ｄ）参照）という問題があった。 However, in the conventional card manufacturing method, when the distorted card substrate is stretched by a cooling press to correct the distortion, it is pulled by the elongation of the card substrate, and the decorative piece deviates from the original embedding position. There is a problem that only the shift (see FIG. 8D) occurs.
　本発明は上記のような課題を解決するためになされたものであり、装飾片のずれがないカードとその製造方法を提供することを目的とする。 The present invention has been made to solve the problems as described above, and it is an object of the present invention to provide a card having no offset of decorative pieces and a method of manufacturing the same.
　以下に、課題を解決するための手段として複数の態様を説明する。これら態様は必要に応じて任意に組み合わせることができる。 Below, a plurality of modes are explained as a means to solve a subject. These aspects can be arbitrarily combined as needed.
　本発明のカードの製造方法は、
　装飾片が載置されたカード基材と、基体シートの上にカード基材にのみ接着する接着層が少なくとも形成された転写シートとを用意し、カード基材の装飾片が載置された面と、転写シートの接着層が形成された面とを対向させて配置する配置工程と、
　カード基材と転写シートとを熱プレスすることにより装飾片をカード基材に埋め込む埋込工程と、
　熱プレスによる圧力を解放する解放工程と、
　カード基材と転写シートとを冷却プレスする冷却プレス工程と、
　基体シートをカード基材から剥離する剥離工程と
を備えたものである。 The manufacturing method of the card of the present invention is
Prepare a card base on which a decorative piece is placed, and a transfer sheet on which an adhesive layer adhering only to the card base is formed on a base sheet, and the face on which the decorative piece of the card base is placed And a placement step of placing the face of the transfer sheet on which the adhesive layer is formed facing each other,
An embedding step of embedding the decorative piece in the card substrate by heat pressing the card substrate and the transfer sheet;
A release step for releasing the pressure by the heat press;
A cooling press step of cooling and pressing the card substrate and the transfer sheet;
And a peeling step of peeling the base sheet from the card base material.
　また、剥離工程の後に装飾片に転写された接着層を除去するものであってもよい。 In addition, the adhesive layer transferred to the decorative piece may be removed after the peeling step.
　また、転写シートは、基体シートと接着層との間に図柄層が形成されたものであってもよい。 In addition, the transfer sheet may have a pattern layer formed between the base sheet and the adhesive layer.
　また、装飾片とカード基材との間に接着剤層が形成されたものであってもよい。 In addition, an adhesive layer may be formed between the decorative piece and the card substrate.
　また、カード基材の表面と装飾片の表面とが面一であってもよい。 In addition, the surface of the card base and the surface of the decorative piece may be flush.
　また、装飾片の材料が金属であってもよい。 Also, the material of the decorative piece may be metal.
　また、装飾片の少なくとも表面がクロムであり接着層がアクリル系樹脂であってもよい。 In addition, at least the surface of the decorative piece may be chromium and the adhesive layer may be an acrylic resin.
　本発明のカードは、
　カード基材と、
　カード基材の表面に埋め込まれた装飾片と、
　カード基材の上のみに形成された接着層と
を少なくとも備えたものである。 The card of the present invention is
Card base material,
Decorative pieces embedded in the surface of the card substrate,
And at least an adhesive layer formed only on the card substrate.
　また、本発明のカードは、
　カード基材と、
　カード基材の表面に埋め込まれた装飾片と、
　カード基材の上のみに形成された接着層と、
　接着層の上のみに形成された図柄層と
を少なくとも備えたものである。 Also, the card of the present invention is
Card base material,
Decorative pieces embedded in the surface of the card substrate,
An adhesive layer formed only on the card substrate,
And at least a graphic layer formed only on the adhesive layer.
　また、カード基材の表面と装飾片の表面とが面一であってもよい。 In addition, the surface of the card base and the surface of the decorative piece may be flush.
　本発明のカードの製造方法は、装飾片が載置されたカード基材と、基体シートの上にカード基材にのみ接着する接着層が少なくとも形成された転写シートとを用意し、カード基材の装飾片が載置された面と、転写シートの接着層が形成された面とを対向させて配置する配置工程と、カード基材と転写シートとを熱プレスすることにより装飾片をカード基材に埋め込む埋込工程と、熱プレスによる圧力を解放する解放工程と、カード基材と転写シートとを冷却プレスする冷却プレス工程と、基体シートをカード基材から剥離する剥離工程とを備えるように構成した。 The method for producing a card of the present invention prepares a card base on which a decorative piece is placed, and a transfer sheet having at least an adhesive layer formed on the base sheet and adhered to the card only. Placement step of arranging the face on which the decorative piece is placed and the face on which the adhesive layer of the transfer sheet is formed facing each other, and thermally pressing the card base and the transfer sheet to the card base The embedding step of embedding in the material, the releasing step of releasing the pressure by the heat press, the cooling pressing step of cooling pressing the card base and the transfer sheet, and the peeling step of peeling the base sheet from the card base Configured.
　したがって、本発明のカードの製造方法によれば、装飾片のずれがないカードを得ることができる。 Therefore, according to the method of manufacturing a card of the present invention, it is possible to obtain a card having no offset of decorative pieces.
　本発明のカードは、カード基材と、カード基材の表面に埋め込まれた装飾片と、カード基材の上のみに形成された接着層とを少なくとも備えるように構成した。
　また、本発明のカードは、カード基材と、カード基材の表面に埋め込まれた装飾片と、カード基材の上のみに形成された接着層と、接着層の上のみに形成された図柄層とを少なくとも備えるように構成した。
　したがって、本発明のカードは装飾片のずれがないものである。 The card of the present invention is configured to include at least a card base, a decorative piece embedded in the surface of the card base, and an adhesive layer formed only on the card base.
Also, the card of the present invention comprises a card substrate, a decorative piece embedded on the surface of the card substrate, an adhesive layer formed only on the card substrate, and a pattern formed only on the adhesive layer. It was configured to include at least a layer.
Therefore, the card of the present invention is one in which the decorative pieces do not shift.
カードの製造方法の実施形態の一例を示す断面図である。It is a sectional view showing an example of an embodiment of a manufacturing method of a card. カードの製造方法の実施形態の一例を示す断面図である。It is a sectional view showing an example of an embodiment of a manufacturing method of a card. カードの製造方法の実施形態の一例を示す断面図である。It is a sectional view showing an example of an embodiment of a manufacturing method of a card. カードの製造方法の実施形態の一例を示す断面図である。It is a sectional view showing an example of an embodiment of a manufacturing method of a card. カードの製造方法の実施形態の一例を示す断面図である。It is a sectional view showing an example of an embodiment of a manufacturing method of a card. カードの実施形態の一例を示す断面図である。It is a sectional view showing an example of an embodiment of a card. カードの製造方法の変形例を示す断面図である。It is sectional drawing which shows the modification of the manufacturing method of a card | curd. 従来のカードの製造方法の一例を示す断面図である。It is sectional drawing which shows an example of the manufacturing method of the conventional card | curd.
　以下、本発明のカードとその製造方法について、図面を参照しながら実施形態の一例を説明する。 Hereinafter, an example of an embodiment is explained about a card of the present invention, and its manufacturing method, referring to drawings.
　本実施形態のカードの製造方法は、装飾片２が載置されたカード基材１と、基体シート４の上にカード基材１にのみ接着する接着層５が少なくとも形成された転写シート３とを用意し、カード基材１の装飾片２が載置された面と、転写シート３の接着層５が形成された面とを対向させて配置する配置工程と、カード基材１と転写シート３とを熱プレスすることにより装飾片２をカード基材１に埋め込む埋込工程と、熱プレスによる圧力を解放する解放工程と、カード基材１と転写シート３とを冷却プレスする冷却プレス工程と、基体シート４をカード基材１から剥離する剥離工程とを備えたものである（図１参照）。 In the card manufacturing method of the present embodiment, a card base 1 on which a decorative piece 2 is placed, and a transfer sheet 3 having at least an adhesive layer 5 adhered only to the card base 1 on a base sheet 4 Providing the card substrate 1 and the surface on which the decorative piece 2 of the card substrate 1 is placed, and the surface on which the adhesive layer 5 of the transfer sheet 3 is formed, the card substrate 1 and the transfer sheet A process of embedding the decorative piece 2 in the card substrate 1 by heat-pressing 3 and a releasing process of releasing the pressure by the heat press, and a cooling press process of cooling-pressing the card substrate 1 and the transfer sheet 3 And a peeling step of peeling the base sheet 4 from the card base 1 (see FIG. 1).
（配置工程）
　配置工程は、装飾片２が載置されたカード基材１と、基体シート４の上にカード基材１にのみ接着する接着層５が少なくとも形成された転写シート３とを用意し、カード基材１の装飾片２が載置された面と、転写シート３の接着層５が形成された面とを対向させて配置する工程である（図１（ａ）参照）。 (Placement process)
In the disposing step, a card base 1 on which the decorative piece 2 is placed and a transfer sheet 3 having at least an adhesive layer 5 adhered only to the card base 1 on the base sheet 4 are prepared. In this step, the surface of the material 1 on which the decorative piece 2 is placed and the surface of the transfer sheet 3 on which the adhesive layer 5 is formed are arranged to face each other (see FIG. 1A).
　カード基材１の材料としては、たとえば、ポリプロピレン系樹脂、ポリエチレン系樹脂、ポリアミド系樹脂、アクリル系樹脂、オレフィン系樹脂、ポリエステル系樹脂、塩ビ系樹脂、ポリカーボネート系樹脂、ＡＢＳ系樹脂などの熱可塑性樹脂およびこれらの積層品、ならびに紙を用いることができる。好ましくは、ポリ塩化ビニル樹脂（ＰＶＣ）である。なお、カード基材１の装飾片２を載置する面には凹凸があってもよい。 Examples of the material of the card substrate 1 include thermoplastic resins such as polypropylene resin, polyethylene resin, polyamide resin, acrylic resin, olefin resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, and ABS resin. Resins and laminates of these, as well as paper can be used. Preferably, it is a polyvinyl chloride resin (PVC). The surface of the card substrate 1 on which the decorative piece 2 is placed may have irregularities.
　装飾片２の材料としては、熱プレスの圧力に耐え得る強度と、熱に耐え得る耐熱性とを有していればよく、金属、樹脂およびこれらの複合材などを用いることができる。装飾片２は任意の形状とすることができる。たとえば、企業のロゴ、商品名、数字、文字、記号などの形状である。なお、本発明の製造方法ではカードの装飾片２上に接着層５が積層されないカードを得られるため、装飾片２の材料として金属を用いると、金属の持つ光沢感や肌合いといった質感を活かしたカードを得ることができる。 The material of the decorative piece 2 may have a strength that can withstand the pressure of the heat press and a heat resistance that can withstand the heat, and metals, resins, composite materials of these, and the like can be used. The decorative piece 2 can be of any shape. For example, shapes such as corporate logos, product names, numbers, letters, symbols, etc. In the manufacturing method of the present invention, a card in which the adhesive layer 5 is not laminated on the decorative piece 2 of the card can be obtained. Therefore, when a metal is used as the material of the decorative piece 2, the texture such as glossiness and texture of the metal is utilized. You can get a card.
　転写シート３は、基体シート４の上に接着層５が少なくとも形成されている。基体シート４は、冷却プレス後にカード基材１から剥離するものである。基体シート４の材料としては、たとえば、ポリプロピレン系樹脂、ポリエチレン系樹脂、ポリアミド系樹脂、アクリル系樹脂、オレフィン系樹脂、ポリエステル系樹脂、塩ビ系樹脂、ポリカーボネート系樹脂、ＡＢＳ系樹脂などの熱可塑性樹脂およびこれらの積層品を用いることができる。 The transfer sheet 3 has at least an adhesive layer 5 formed on a base sheet 4. The base sheet 4 peels from the card substrate 1 after the cooling press. Examples of the material of the base sheet 4 include thermoplastic resins such as polypropylene resin, polyethylene resin, polyamide resin, acrylic resin, olefin resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, and ABS resin. And these laminates can be used.
　なお、転写シート３は、基体シート４と接着層５との間に図柄層６が形成されたものであってもよい（図２（ａ）参照）。図柄層６によって、カードの装飾性を向上させることができる。図柄層６は全面に形成してもよく、任意のパターンで形成してもよい。図柄層６は、基体シート４に、グラビア印刷法、スクリーン印刷法、オフセット印刷法などの通常の印刷法や、グラビアコート法、ロールコート法、ダイコート法などのコート法、または転写法などによって形成することができる。図柄層６の材料は、たとえば、アクリル系樹脂、塩化ビニル酢酸ビニル共重合樹脂、熱可塑性ウレタン系樹脂、ポリエステル系樹脂などの樹脂と、樹脂に添加される顔料または染料を含むものである。また、図柄層６は、たとえば、真空蒸着法またはスパッタリング法を使って金属を蒸着して形成した金属薄膜層であってもよく、また金属薄膜層にエッチング法を適用して形成してもよい。図柄層６は、たとえば、アルミペーストまたはミラーインキを使用して金属調意匠が施されたものであってもよい。図柄層６は、たとえば、数百ｎｍ～数十μｍの厚さで形成することができる。なお、図柄層６は、基体シートを剥離後にカードにマットな質感を与えるものであってもよい。マットな質感を与える図柄層は、微細な凹凸が形成された基体シート４の凹凸面に図柄層を形成した転写シートを用いてプレスした後に基体シートを剥離し、または図柄層の内部に粒子を含有させることによって、得ることができる。 The transfer sheet 3 may have the pattern layer 6 formed between the base sheet 4 and the adhesive layer 5 (see FIG. 2A). The decorative layer of the card can be improved by the pattern layer 6. The pattern layer 6 may be formed on the entire surface, or may be formed in any pattern. The pattern layer 6 is formed on the base sheet 4 by a common printing method such as gravure printing, screen printing or offset printing, a coating method such as gravure coating, roll coating or die coating, or a transfer method. can do. The material of the pattern layer 6 includes, for example, a resin such as an acrylic resin, a vinyl chloride vinyl acetate copolymer resin, a thermoplastic urethane resin, a polyester resin, and a pigment or a dye to be added to the resin. Further, the pattern layer 6 may be, for example, a metal thin film layer formed by depositing a metal using a vacuum deposition method or a sputtering method, or may be formed by applying an etching method to the metal thin film layer . The pattern layer 6 may have a metallic design using, for example, an aluminum paste or a mirror ink. The pattern layer 6 can be formed, for example, with a thickness of several hundred nm to several tens of μm. The pattern layer 6 may give the card a matte texture after peeling off the base sheet. The pattern layer giving a matte texture is pressed using a transfer sheet in which the pattern layer is formed on the uneven surface of the substrate sheet 4 on which fine asperities are formed, and then the substrate sheet is peeled off or particles are formed inside the pattern layer. It can be obtained by incorporating it.
　なお、転写シート３は、基体シート４の上に保護層７がさらに形成されたものであってもよい（図３（ａ）参照）。保護層７は、基体シート４を剥離後にカードの最表面となる層である。保護層の材料としては、アクリル系樹脂、ポリスチレン系樹脂、ポリアミド系樹脂、塩素化ポリオレフィン樹脂、塩素化エチレン‐酢酸ビニル共重合体樹脂、環化ゴム、クマロンインデン樹脂などの熱可塑性樹脂を用いることができる。このような熱可塑性樹脂で保護層を形成すると、カードに耐薬品性などを与えることができる。また、他の材料としては、紫外線硬化性樹脂などの光硬化性樹脂、電子線硬化性樹脂などの放射線硬化性樹脂、熱硬化性樹脂のいずれかを含んで形成することができる。このような樹脂としては、ウレタンアクリレート系樹脂、シアノアクリレート系樹脂、エポキシアクリレート系樹脂、ポリエステルアクリレート系樹脂、これらの樹脂にイソシアネートなどの添加剤を加えた樹脂などを挙げることができる。保護層７の形成方法としては、グラビア印刷法、スクリーン印刷法、オフセット印刷法などの通常の印刷法や、グラビアコート法、ロールコート法、ダイコート法などのコート法を用いることができる。上記硬化性樹脂で保護層を形成すると、カードに耐久性や耐摩耗性といった物性を与えることができる。 The transfer sheet 3 may have the protective layer 7 further formed on the base sheet 4 (see FIG. 3A). The protective layer 7 is a layer which becomes the outermost surface of the card after peeling off the base sheet 4. As a material of the protective layer, thermoplastic resin such as acrylic resin, polystyrene resin, polyamide resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, coumarone indene resin, etc. is used. be able to. When the protective layer is formed of such a thermoplastic resin, it is possible to give the card chemical resistance and the like. In addition, as another material, it can be formed including any of a photocurable resin such as an ultraviolet curable resin, a radiation curable resin such as an electron beam curable resin, and a thermosetting resin. Examples of such resins include urethane acrylate resins, cyanoacrylate resins, epoxy acrylate resins, polyester acrylate resins, and resins obtained by adding an additive such as isocyanate to these resins. As a method of forming the protective layer 7, a usual printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method, a roll coating method, or a die coating method can be used. When the protective layer is formed of the above-mentioned curable resin, physical properties such as durability and wear resistance can be given to the card.
　なお、基体シート１の離型性をより高めるために、基体シート１の上に離型層（図示せず）を積層してもよい。離型層は、基体シート１を剥離した際に、基体シート１とともに剥離される。 A release layer (not shown) may be laminated on the base sheet 1 in order to further improve the release property of the base sheet 1. The release layer is peeled off together with the base sheet 1 when the base sheet 1 is peeled off.
　接着層５には、カード基材１にのみ接着する性質を持つ材料を用いる。このような接着層５を形成した転写シート３では、冷却プレス後に転写シート３をカード基材１から剥離すると、装飾片２の上にある接着層は装飾片２には接着せず、この箇所の接着層は基体シート４とともに剥離される（図１（ｅ）参照）。つまり、この場合、接着層は装飾片に転写もされず接着もしないため、装飾片が露出したカードを容易に得ることができる。 For the adhesive layer 5, a material having a property of adhering only to the card substrate 1 is used. In the transfer sheet 3 on which such an adhesive layer 5 is formed, when the transfer sheet 3 is peeled off from the card substrate 1 after the cooling press, the adhesive layer on the decorative piece 2 does not adhere to the decorative piece 2 and this portion The adhesive layer is peeled off together with the base sheet 4 (see FIG. 1 (e)). That is, in this case, since the adhesive layer is neither transferred nor adhered to the decorative piece, it is possible to easily obtain a card in which the decorative piece is exposed.
　転写シート３に図柄層６が形成されている場合は、装飾片２に接着していない接着層５と、その接着層の形成された領域に対応する図柄層６とが、基体シート４とともに剥離される（図２（ｂ）参照）。転写シート３に保護層７がさらに形成されている場合は、装飾片２に接着していない接着層５と、その接着層の形成された領域に対応する図柄層６および保護層７とが、基体シート４とともに剥離される（図３（ｂ）参照）。 When the pattern layer 6 is formed on the transfer sheet 3, the adhesive layer 5 not adhered to the decorative piece 2 and the pattern layer 6 corresponding to the area where the adhesive layer is formed are peeled off together with the base sheet 4. (See FIG. 2 (b)). When the protective layer 7 is further formed on the transfer sheet 3, the adhesive layer 5 which is not adhered to the decorative piece 2 and the pattern layer 6 and the protective layer 7 corresponding to the area where the adhesive layer is formed are It peels with the base sheet 4 (refer FIG.3 (b)).
　接着層５の材料としては、感熱性または感圧性の樹脂を適宜選択して用いることができる。たとえば、アクリル系樹脂、ポリスチレン系樹脂、ポリアミド系樹脂、塩素化ポリオレフィン樹脂、塩素化エチレン‐酢酸ビニル共重合体樹脂、環化ゴム、クマロンインデン樹脂などである。これら樹脂は、装飾片２の材料によって適宜選択する。装飾片２の材料が、少なくともその表面がクロムであれば、接着層５の材料はアクリル系樹脂を選択するとよい。このようにすると、転写シートを剥離した後に接着層５が装飾片２に接着しないため、クロムの持つ質感を活かしたカードを得ることができる。接着層の厚みは、０．１μｍ～５０μｍとすることができる。接着層の形成方法としては、グラビア印刷法、スクリーン印刷法、オフセット印刷法などの通常の印刷法や、グラビアコート法、ロールコート法、ダイコート法などのコート法を用いることができる。接着層が形成されていることにより、カード基材に埋め込まれた装飾片が、後述の冷却プレスによって所定の位置からずれることを抑制することができる。 As the material of the adhesive layer 5, a heat-sensitive or pressure-sensitive resin can be appropriately selected and used. For example, acrylic resin, polystyrene resin, polyamide resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, coumarone indene resin and the like. These resins are appropriately selected depending on the material of the decorative piece 2. If the material of the decorative piece 2 is at least the surface of chromium, the material of the adhesive layer 5 may be an acrylic resin. By doing so, the adhesive layer 5 does not adhere to the decorative piece 2 after peeling off the transfer sheet, so it is possible to obtain a card utilizing the texture of chromium. The thickness of the adhesive layer can be 0.1 μm to 50 μm. As a method of forming the adhesive layer, a usual printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method, a roll coating method, or a die coating method can be used. By forming the adhesive layer, it is possible to suppress that the decorative piece embedded in the card base material is displaced from a predetermined position by a cooling press described later.
　なお、上記した各層の間には、密着性を上げるためにアンカー層（図示せず）があってもよい。また、上記の各層を形成する際の乾燥温度は、たとえば、５０℃～２００℃にすることができる。 An anchor layer (not shown) may be provided between the layers described above in order to improve adhesion. Further, the drying temperature at the time of forming each of the above layers can be, for example, 50 ° C. to 200 ° C.
（埋込工程）
　埋込工程は、カード基材１と転写シート３とを熱プレスすることにより装飾片２をカード基材１に埋め込む工程である（図１（ｂ）参照）。 (Embedding process)
The embedding step is a step of embedding the decorative piece 2 in the card substrate 1 by heat-pressing the card substrate 1 and the transfer sheet 3 (see FIG. 1B).
　熱プレスは、たとえば、上型１０と下型１１とを含むプレス機によって行う。熱プレスによって、カード基材１と転写シート３とが一体となる。上型１０と下型１１は、それぞれ加熱機構を備えており、加熱温度を自由に設定することができる。加熱温度は、たとえば上型１０は５０℃～３００℃とすることができ、下型１１は５０℃～３００℃とすることができる。上型と下型とを同じ温度にしてもよいし、異なる温度にしてもよい。同じ温度にすると、熱プレスによる反りを生じにくくすることができる。また、熱プレスによって加える圧力は、カード基材の軟化具合や装飾片の埋込量に応じて、０．０１ＭＰａ～２ＭＰａとすることができる。また、上型と下型の温度を異ならせれば、たとえば、カード基材が異種材料を積層して形成されている場合に、材料どうしの熱収縮率の違いによるカード基材の反りを抑制することができる。 The heat press is performed, for example, by a press including the upper mold 10 and the lower mold 11. The card base 1 and the transfer sheet 3 are integrated by the heat press. The upper mold 10 and the lower mold 11 each have a heating mechanism, and the heating temperature can be set freely. The heating temperature can be, for example, 50 ° C. to 300 ° C. for the upper mold 10 and 50 ° C. to 300 ° C. for the lower mold 11. The upper mold and the lower mold may be at the same temperature or at different temperatures. When the temperature is the same, warpage due to heat pressing can be less likely to occur. Further, the pressure applied by the heat press can be 0.01 MPa to 2 MPa depending on the degree of softening of the card base and the embedding amount of the decorative piece. In addition, if the temperatures of the upper and lower molds are different, for example, when the card base is formed by laminating different materials, warpage of the card base due to the difference in the thermal contraction rate between the materials is suppressed. be able to.
　装飾片の埋込量は、カード基材の表面と装飾片の表面とが面一になる量であってもよい（図１（ｅ）、図２（ｂ）、図３（ｂ）、図４（ｆ）、図５（ｂ）参照）。装飾片２の表面が曲面を含む場合は、曲面の最頂部ｔとカード基材１の表面とが面一になるように埋め込む（図６（ａ）参照）。カード基材の表面と装飾片の表面とが面一になるように装飾片を埋め込むと、転写シートの接着層が接着する面に段差ができず、熱プレスの圧力がカード基材と転写シートに均等に加わり、接着層によってカード基材と転写シートとをしっかりと接着することができる。また、接着層や図柄層の厚みは数百ｎｍ～数十μｍと薄い。したがって、カード基材の表面と装飾片の表面とが面一であっても、触ったときにほとんど段差が感じられないカードを得ることができる。 The embedded amount of the decorative piece may be such that the surface of the card substrate and the surface of the decorative piece are flush (Fig. 1 (e), Fig. 2 (b), Fig. 3 (b), and Fig. 4 (f), see FIG. 5 (b)). When the surface of the decorative piece 2 includes a curved surface, the top of the curved surface t is embedded so as to be flush with the surface of the card substrate 1 (see FIG. 6A). If the decorative piece is embedded so that the surface of the card substrate and the surface of the decorative piece are flush, no step is formed on the surface to which the adhesive layer of the transfer sheet adheres, and the pressure of the heat press is the card substrate and the transfer sheet And the adhesive layer firmly adheres the card substrate and the transfer sheet. In addition, the thickness of the adhesive layer or the pattern layer is as thin as several hundred nm to several tens μm. Therefore, even if the surface of the card substrate and the surface of the decorative piece are flush, it is possible to obtain a card which hardly senses a difference in level when touched.
　なお、装飾片２とカード基材１との間に接着剤層８が形成されたものであってもよい（図５（ａ）参照）。つまり、装飾片２をカード基材１の表面にあらかじめ貼ってもよい。接着剤層とは、接着剤の層と粘着剤の層とを含むものとする。したがって、装飾片をカード基材に完全に固定してもよいし、装飾片をカード基材から剥がして再度貼り合わせることができるようにしてもよい。接着剤層を形成すると、熱プレスによってカード基材に埋め込まれた装飾片を、より強固にカード基材１に固定することができる（図５（ｂ）参照）。また、あらかじめカード基材の所定の位置に装飾片を接着しておくため、装飾片が冷却プレス工程によってずれることをより確実に防ぐことができる。 The adhesive layer 8 may be formed between the decorative piece 2 and the card base 1 (see FIG. 5A). That is, the decorative piece 2 may be attached in advance to the surface of the card substrate 1. The adhesive layer includes an adhesive layer and an adhesive layer. Therefore, the decorative piece may be completely fixed to the card base material, or the decorative piece may be peeled off from the card base material and may be pasted again. When the adhesive layer is formed, the decorative piece embedded in the card substrate by the heat press can be more firmly fixed to the card substrate 1 (see FIG. 5 (b)). In addition, since the decorative piece is adhered to a predetermined position of the card substrate in advance, it is possible to more reliably prevent the decorative piece from being shifted by the cooling press process.
（解放工程）
　解放工程は、熱プレスによる圧力を解放する工程である（図１（ｃ）参照）。圧力の解放は、上型１０を図の上側に、下型１１を図の下側に移動することによって行う。解放工程により、一体となったカード基材１と転写シート３には、熱収縮によって歪みが生じる。なお、圧力の解放は、上型または下型のいずれかを移動して行ってもよい。 (Release process)
The releasing step is a step of releasing the pressure by the heat press (see FIG. 1 (c)). The pressure is released by moving the upper mold 10 to the upper side of the drawing and the lower mold 11 to the lower side of the drawing. In the release step, distortion occurs in the integrated card base 1 and the transfer sheet 3 due to heat contraction. The pressure may be released by moving either the upper mold or the lower mold.
（冷却プレス工程）
　冷却プレス工程は、カード基材１と転写シート３とを冷却プレスする工程である（図１（ｄ）参照）。冷却プレスは、たとえば、熱プレス時と同じように上型１０と下型１１とを含むプレス機によって行う。熱プレス時と同じ型を使用してもよいし、熱プレス時とは異なる型を使用してもよい。冷却プレスにより、埋込工程の熱プレスによって生じた歪みを矯正することができる。冷却プレス時の温度は熱プレス時の温度よりも低くし、たとえば、４℃～５０℃とすることができる。また、冷却プレスによって加える圧力は、熱プレス後のカード基材の軟化具合に応じて、０．０１ＭＰａ～３ＭＰａとすることができる。カード基材１と転写シート３は、転写シート３の接着層５によりしっかりと接着している。接着層５は装飾片２に密着しており、装飾片２はしっかり接着したカード基材１と転写シート３との間に挟まれているため、冷却プレスをしても装飾片２が所定の位置からずれにくくなる。 (Cooling press process)
The cooling pressing step is a step of cooling and pressing the card base 1 and the transfer sheet 3 (see FIG. 1 (d)). The cooling press is performed, for example, by a press including the upper mold 10 and the lower mold 11 as in the heat press. The same mold as in the heat press may be used, or a different mold from the heat press may be used. The cooling press can correct the distortion caused by the heat press in the embedding process. The temperature at the time of the cold pressing may be lower than the temperature at the hot pressing, and may be, for example, 4 ° C. to 50 ° C. In addition, the pressure applied by the cooling press can be set to 0.01 MPa to 3 MPa according to the degree of softening of the card substrate after the hot pressing. The card substrate 1 and the transfer sheet 3 are firmly adhered by the adhesive layer 5 of the transfer sheet 3. Since the adhesive layer 5 is in close contact with the decorative piece 2 and the decorative piece 2 is sandwiched between the firmly adhered card substrate 1 and the transfer sheet 3, the decorative piece 2 is required to be predetermined even by a cooling press. It becomes difficult to shift from the position.
（剥離工程）
　剥離工程は、基体シート４をカード基材１から剥離する工程である。基体シート４がカード基材１から剥離されると、カード基材１の上のみに接着層５が接着した状態となる（図１（ｅ）参照）。剥離工程により、装飾片を露出させることができる。また、接着層５は装飾片２の上に接着はしないが転写はされた状態であってもよい（図４（ｅ）参照）。この場合、装飾片２の上に転写された接着層５を除去して、本発明のカードを製造してもよい（図４（ｆ）参照）。除去方法としては、たとえば、粘着テープ、エアブロー、布拭き、水洗浄、溶剤洗浄などによる方法を挙げることができる。図４の場合は、接着層は装飾片上に転写はしているが接着はしていないため、上述した除去方法により容易に装飾片を露出させることができる。なお、転写シート３が図柄層６や保護層７といった他の層を備えている場合であっても、上記の方法によって、装飾片の上に積層された接着層、図柄層、保護層を除去することができる（図２（ｂ）、図３（ｂ）参照）。 (Peeling process)
The peeling step is a step of peeling the base sheet 4 from the card base 1. When the base sheet 4 is peeled from the card base 1, the adhesive layer 5 adheres only on the card base 1 (see FIG. 1 (e)). The decorative piece can be exposed by the peeling process. In addition, the adhesive layer 5 may be in a state where it is not adhered but transferred on the decorative piece 2 (see FIG. 4E). In this case, the adhesive layer 5 transferred onto the decorative piece 2 may be removed to produce the card of the present invention (see FIG. 4 (f)). Examples of the removal method include a method using an adhesive tape, air blow, cloth wiping, water washing, solvent washing and the like. In the case of FIG. 4, since the adhesive layer is transferred on the decorative piece but not adhered, the decorative piece can be easily exposed by the removal method described above. Even when the transfer sheet 3 includes other layers such as the pattern layer 6 and the protective layer 7, the adhesive layer, the pattern layer, and the protective layer laminated on the decorative piece are removed by the above method. (See FIG. 2 (b), FIG. 3 (b)).
＜変形例＞
　上記実施形態においては、カード基材の表面と装飾片の表面とが面一になるように装飾片を埋め込んでいるが、装飾片の表面がカード基材の表面から突出するよう埋め込んでもよい（図７（ａ）参照）。たとえば、熱プレスと冷却プレスの圧力を調整することによって、このように埋め込むことができる。 <Modification>
In the above embodiment, the decorative piece is embedded so that the surface of the card base and the surface of the decorative piece are flush with each other, but the surface of the decorative piece may be embedded so as to protrude from the surface of the card base 7 (a)). For example, it can be embedded in this way by adjusting the pressure of the heat press and the cooling press.
　基体シートを剥離した後に、接着層５の表面と装飾片２の表面とが面一であってもよい（図７（ｂ）参照）。このようなカードは、接着層５の厚み分を残して装飾片２を埋め込むことにより得ることができる。この方法では、カード表面を平滑にすることができる。なお、図柄層６や保護層７が形成された転写シート３を用いる場合は、これらの層の厚みと接着層の厚みとを足した厚み分を残して装飾片を埋め込めばよい。 After peeling off the base sheet, the surface of the adhesive layer 5 may be flush with the surface of the decorative piece 2 (see FIG. 7 (b)). Such a card can be obtained by embedding the decorative piece 2 leaving the thickness of the adhesive layer 5. In this way, the card surface can be smoothed. In the case of using the transfer sheet 3 on which the pattern layer 6 and the protective layer 7 are formed, the decorative piece may be embedded leaving a thickness obtained by adding the thickness of these layers and the thickness of the adhesive layer.
　また、装飾片２の表面が接着層５の表面から突出してもよい（図７（ｃ）参照）。このようなカードは、接着層５の厚みを超えるように装飾片２を埋め込むことにより得ることができる。この方法では、カード表面に段差ができるため、装飾片に立体感があるカードを得ることができる。なお、図柄層６や保護層７が形成された転写シート３を用いる場合は、これらの層の厚みと接着層の厚みとを足した厚みを超えるように装飾片を埋め込めばよい。 In addition, the surface of the decorative piece 2 may protrude from the surface of the adhesive layer 5 (see FIG. 7C). Such a card can be obtained by embedding the decorative piece 2 so as to exceed the thickness of the adhesive layer 5. In this method, since a step is formed on the card surface, it is possible to obtain a card having a three-dimensional effect on the decorative piece. In addition, what is necessary is just to embed a decoration piece so that the thickness which added the thickness of these layers and the thickness of an adhesion layer may be exceeded, when using the transfer sheet 3 in which the pattern layer 6 and the protective layer 7 were formed.
　以上のようにして、本発明のカードを得ることができる。 As described above, the card of the present invention can be obtained.
　　　１　：カード基材
　　　２　：装飾片
　　　３　：転写シート
　　　４　：基体シート
　　　５　：接着層
　　　６　：図柄層
　　　７　：保護層
　　　８　：接着剤層
　　　９　：カード
　　　１０：上型
　　　１１：下型
　　　１２：カード基材
　　　１３：装飾片
　　　１４：カード 1: Card base 2: Decorative piece 3: Transfer sheet 4: Base sheet 5: Adhesive layer 6: Pattern layer 7: Protective layer 8: Adhesive layer 9: Card 10: Upper type 11: Lower type 12: Card base 13: Decoration piece 14: Card

Claims (10)

  1. 　装飾片が載置されたカード基材と、基体シートの上に前記カード基材にのみ接着する接着層が少なくとも形成された転写シートとを用意し、カード基材の前記装飾片が載置された面と、転写シートの前記接着層が形成された面とを対向させて配置する配置工程と、
    　前記カード基材と前記転写シートとを熱プレスすることにより前記装飾片を前記カード基材に埋め込む埋込工程と、
    　前記熱プレスによる圧力を解放する解放工程と、
    　前記カード基材と前記転写シートとを冷却プレスする冷却プレス工程と、
    　前記基体シートを前記カード基材から剥離する剥離工程と
    を備えた、カードの製造方法。     A card base on which a decorative piece is placed and a transfer sheet on which an adhesive layer adhering only to the card base is formed on a base sheet are prepared, and the decorative piece on the card base is placed. Placing the opposite surface of the transfer sheet opposite to the surface on which the adhesive layer is formed,
    Embedding step of embedding the decorative piece in the card substrate by heat pressing the card substrate and the transfer sheet;
    A releasing step of releasing pressure by the heat press;
    A cooling press step of cooling and pressing the card substrate and the transfer sheet;
    And C. a peeling step of peeling the base sheet from the card substrate.
  2. 　前記剥離工程の後に前記装飾片に転写された前記接着層を除去するものである、請求項１に記載のカードの製造方法。 The manufacturing method of the card | curd of Claim 1 which removes the said contact bonding layer transferred to the said decorative piece after the said peeling process.
  3. 　前記転写シートは、前記基体シートと前記接着層との間に図柄層が形成されたものである、請求項１または２のいずれかに記載のカードの製造方法。 The method for manufacturing a card according to any one of claims 1 and 2, wherein the transfer sheet has a graphic layer formed between the base sheet and the adhesive layer.
  4. 　前記装飾片と前記カード基材との間に接着剤層が形成された、請求項１から３のいずれかに記載のカードの製造方法。 The method for producing a card according to any one of claims 1 to 3, wherein an adhesive layer is formed between the decorative piece and the card substrate.
  5. 　前記カード基材の表面と前記装飾片の表面とが面一である、請求項１から４のいずれかに記載のカードの製造方法。 The method for producing a card according to any one of claims 1 to 4, wherein the surface of the card substrate and the surface of the decorative piece are flush.
  6. 　前記装飾片の材料が金属である、請求項１から５のいずれかに記載のカードの製造方法。 The manufacturing method of the card | curd in any one of Claim 1 to 5 whose material of the said decoration piece is a metal.
  7. 　前記装飾片の少なくとも表面がクロムであり前記接着層がアクリル系樹脂である、請求項６に記載のカードの製造方法。 The method for producing a card according to claim 6, wherein at least a surface of the decorative piece is chromium and the adhesive layer is an acrylic resin.
  8. 　カード基材と、
    　前記カード基材の表面に埋め込まれた装飾片と、
    　前記カード基材の上のみに形成された接着層と
    を少なくとも備えた、カード。     Card base material,
    A decorative piece embedded in the surface of the card base material;
    A card comprising at least an adhesive layer formed only on the card substrate.
  9. 　カード基材と、
    　前記カード基材の表面に埋め込まれた装飾片と、
    　前記カード基材の上のみに形成された接着層と、
    　前記接着層の上のみに形成された図柄層と
    を少なくとも備えた、カード。     Card base material,
    A decorative piece embedded in the surface of the card base material;
    An adhesive layer formed only on the card substrate;
    A card comprising at least a graphic layer formed only on the adhesive layer.
  10. 　前記カード基材の表面と前記装飾片の表面とが面一である、請求項８または９のいずれかに記載のカード。 The card according to any one of claims 8 or 9, wherein the surface of the card base and the surface of the decorative piece are flush.
PCT/JP2018/019476 2017-08-31 2018-05-21 Card and method for manufacturing same WO2019044058A1 (en)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JPS58177351A (en) * 1982-04-12 1983-10-18 大日本印刷株式会社 Manufacture of card
US4499126A (en) * 1983-05-11 1985-02-12 Dai Nippon Insatsu Kabushiki Kaisha Plastic relief card having metallic luster
JP2004167765A (en) * 2002-11-19 2004-06-17 Dainippon Printing Co Ltd Card and its china painting method
JP2012171100A (en) * 2011-02-17 2012-09-10 Toppan Printing Co Ltd Card and method for manufacturing card
JP2014100802A (en) * 2012-11-16 2014-06-05 Toppan Printing Co Ltd Card and manufacturing method of the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58177351A (en) * 1982-04-12 1983-10-18 大日本印刷株式会社 Manufacture of card
US4499126A (en) * 1983-05-11 1985-02-12 Dai Nippon Insatsu Kabushiki Kaisha Plastic relief card having metallic luster
JP2004167765A (en) * 2002-11-19 2004-06-17 Dainippon Printing Co Ltd Card and its china painting method
JP2012171100A (en) * 2011-02-17 2012-09-10 Toppan Printing Co Ltd Card and method for manufacturing card
JP2014100802A (en) * 2012-11-16 2014-06-05 Toppan Printing Co Ltd Card and manufacturing method of the same

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