WO2019035396A1 - Étiquette rf et dispositif d'étiquette rf - Google Patents

Étiquette rf et dispositif d'étiquette rf Download PDF

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Publication number
WO2019035396A1
WO2019035396A1 PCT/JP2018/029705 JP2018029705W WO2019035396A1 WO 2019035396 A1 WO2019035396 A1 WO 2019035396A1 JP 2018029705 W JP2018029705 W JP 2018029705W WO 2019035396 A1 WO2019035396 A1 WO 2019035396A1
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WO
WIPO (PCT)
Prior art keywords
tag
chip
antenna
antenna unit
tag according
Prior art date
Application number
PCT/JP2018/029705
Other languages
English (en)
Japanese (ja)
Inventor
詩朗 杉村
Original Assignee
株式会社フェニックスソリューション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社フェニックスソリューション filed Critical 株式会社フェニックスソリューション
Priority to JP2019536747A priority Critical patent/JP7133228B2/ja
Publication of WO2019035396A1 publication Critical patent/WO2019035396A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present invention relates to an RF tag and an RF tag device.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2016-173747
  • an RFID tag that can suppress a decrease in communication performance when in contact with or in proximity to a conductor or a high dielectric, and can achieve both thinning and cost reduction Is disclosed.
  • the RFID tag described in Patent Document 1 includes a stacked body including one conductive layer as an intermediate layer, an antenna provided on the stacked body, and an IC chip connected to the antenna, and one conductive layer includes It has at least one structure including a neck portion.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2016-58062 discloses an RFID tag that prevents a semiconductor chip from breaking.
  • the base material, the semiconductor chip mounted on the base material, and the semiconductor chip are covered, and the folding line starting point of the folding line is released from the semiconductor chip when it is folded. And an island-like reinforcing material for reinforcing the base material.
  • Patent Document 3 Japanese Patent Laid-Open No. 2014-222423 discloses a package with an RFID tag capable of performing wireless communication in the UHF band without causing a decrease in communication distance and an increase in size.
  • the RFID tag-attached package including the package to which the RFID tag is attached and in which the package is enclosed, the package functions as an antenna for communication of the RFID tag.
  • the RFID tag has an IC chip and two conductive members individually connected to two electrodes of the IC chip, and the two conductive One of the members is attached to the surface of the sheet via the insulating member so that at least a part thereof is located on one side of the slit with respect to the width direction of the slit, the other of the two conductive members is at least a part of the slit Is attached to the surface of the sheet via the insulating member so as to be located on the other side of the slit with respect to the width direction of the Once cut along the imaginary line including the line in which the RFID tag becomes poor communication.
  • Patent Document 4 Japanese Patent Laid-Open No. 2008-107947 discloses an RFID tag that transmits and receives data without contact with an external data read / write device, the RFID tag being a package made of aluminum foil and a metal-deposited film. The RFID tag is disclosed that does not malfunction even if the RFID tag is attached to a material or attached to a large cardboard or the like.
  • an RFID chip that transmits and receives data contactlessly with an external data read / write device, an IC chip and an IC chip used to transmit and receive data at least contactlessly with the support.
  • the inlet formed with the conductive wire and the antenna used for transmission and reception are separately formed, and by adhering the inlet and the antenna, the conductive wire and the antenna are connected by capacitor coupling.
  • Patent Document 5 Japanese Unexamined Patent Publication No. 2011-2218378 discloses a wireless communication tag which can prohibit communication outside the management area.
  • the semiconductor chip is mounted and electrically connected to the semiconductor chip.
  • An antenna module having a tag having a power receiving unit, an antenna unit for receiving radio waves from a communication device, and a feeding unit electrically connected to the antenna unit, and having a configuration that can be attached to and detached from the tag.
  • the power reception unit and the power supply unit are electrically connected to be in a communicable state with the communication device.
  • Patent Document 6 Japanese Patent Application Laid-Open No. 2012-70076 discloses an RF-ID media which sufficiently achieves the effect of the booster antenna in the RF-ID media using the booster antenna.
  • a second antenna is formed on a second base substrate on a first base substrate on which a first antenna in which current flows by an electromagnetic wave from the outside is formed.
  • the RF-ID media on which an inlet formed is mounted and on which an IC chip connected to the second antenna is mounted, and the current flows to the second antenna by electromagnetic induction by the current flowing to the first antenna
  • the second antenna consists of two spiral antenna parts whose outer peripheral end is connected to the IC chip and wound in the same direction and the inner peripheral end is opened, and the first antenna is When the inlet is mounted on one of the base substrates, two unequal regions are formed along the overlapping portion of the outer peripheral portion of each of the two antenna portions including the region between the two antenna portions. And has a current path in which a current flows by electromagnetic waves in the opposite direction of the spiral for na section.
  • Patent Document 7 Japanese Patent Application Laid-Open No. 2008-117165 relates to an RFID tag in which even if the RFID tags are overlapped, a reading failure due to the interference of radio waves does not occur, and a spacer is not necessary between the RFID tags to be overlapped. It is disclosed.
  • the wireless communication tag described in Patent Document 7 is an IC tag including an IC chip operated by a wireless wave and an antenna formed of a metal film layer formed on a base of an insulator,
  • the antenna includes a slit for impedance matching, one first antenna on which the IC chip is mounted, and at least one second antenna on which the IC chip is not mounted, and the first antenna and the at least one first antenna The two antennas are capacitively coupled.
  • Patent Document 8 Japanese Patent Application Laid-Open No. 2013-54751 discloses an RFID information medium capable of appropriate communication with a reading device (or reading and writing device) and easily miniaturized.
  • the RFID information medium described in Patent Document 8 is an RFID information medium that performs data communication without contact with an external reader, and includes a main body having an insulating member, an antenna member provided in the main body, and a main body. And an optical change device whose color or image changes depending on visual observation, the conductor having a layer of a conductive material, the layer of the conductive material being a member for an antenna Partially overlapping in the thickness direction of the main body, the optical change device comprises a conductive reflective layer or a conductive transparent layer, and the reflective layer or transparent layer of the optical change device comprises a conductive material Is also used as a layer of
  • the main object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to goods.
  • Another object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to products, dramatically improve communication sensitivity, and receive nondirectional radio waves. .
  • the RF tag is formed by joining an inlet portion including an IC chip and an inductor pattern, and an antenna portion used to transmit and receive data transmitted from a reader, and the capacitance inside the IC chip;
  • the inductor pattern forms a resonant circuit to communicate with the reader.
  • the inlet portion and the antenna portion are formed by bonding, and the resonance circuit is formed by the capacitance inside the IC chip and the inductor pattern.
  • miniaturization of the RF tag can be realized.
  • the peripheral distance of the antenna unit is one of ⁇ / 4, ⁇ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength ⁇ of the wave number of the UHF band RFID frequency. It may be designed to correspond to
  • the peripheral distance of the antenna unit is designed to correspond to any one of ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8 with respect to wavelength ⁇ , and as a result, the communication sensitivity is increased. While dramatically improving, it is possible to receive nondirectional radio waves.
  • an adhesive layer may be formed on the antenna portion.
  • the RF tag since the adhesive layer is formed in the antenna portion, the RF tag can be easily attached to the adherend member such as a bag via the adhesive layer. Moreover, when it attaches to a conductor member via an adhesive agent, the said conductor member can be used as an antenna.
  • the inlet portion may have a non-conductive layer formed on the same side as the adhesive layer.
  • the inlet portion has the non-conductive layer on the same side as the adhesive layer, even when the RF tag is attached to the conductor member, the electrical short circuit in the inlet portion can be prevented.
  • the RF tag according to the fifth invention is the RF tag according to the fourth invention, wherein the inlet portion may be covered by a non-conductive layer.
  • the inlet portion is included in the non-conductive layer, the RF tag can be attached regardless of the front and back of the RF tag.
  • an electrical short circuit at the inlet can be prevented.
  • the nonconductive layer may be made of a foamed resin.
  • the non-conductive layer is made of a foamed resin
  • the durability can be enhanced and shock absorption can be realized.
  • the foamed resin is preferably made of expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
  • An RF tag device comprises the RF tag according to any one of claims 1 to 6, a bag, a box, a film for packaging goods, a resin sheet, an aluminum thin film, a seal applied to goods.
  • An RF tag is attached to one of a bag, a box, a film for packaging a product, a resin sheet, an aluminum thin film, and a seal applied to the product.
  • management can be performed by sticking the miniaturized RF tag on any of a box, a seal, a resin sheet, aluminum, and a packaging film.
  • an RF tag can be easily attached to a product in a product manufacturing plant, a shop, a convenience store, or the like.
  • FIG. 1 is a schematic perspective view showing an example of the RF tag 100 according to the present embodiment as viewed from the front
  • FIG. 2 is a schematic perspective view showing an example of the RF tag 100 as viewed from the back.
  • the RF tag 100 As shown in FIGS. 1 and 2, the RF tag 100 mainly includes an inlet 200 and an antenna 300. In addition, the antenna unit 300 is formed at an end of the inlet unit 200.
  • the antenna unit 300 is made of a conductive material.
  • the antenna unit 300 is made of a metal thin film of aluminum.
  • the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
  • the antenna unit 300 is formed by a method such as etching or pattern printing.
  • the outer peripheral length value of the antenna unit 300 (distance around the antenna unit 300) is the sum of the lengths of the side 301a, the side 301b, the side 301c, the side 301d, and the side 301e.
  • the outer circumference length value is designed to correspond to any one of ⁇ / 4, ⁇ / 2, 3/2, 4/5, and 5/8, when the wavelength ⁇ (lambda) of the UHF band RFID frequency is used. ing.
  • antenna unit 300 has a shape including side 301a, side 301b, side 301c, side 301d, and side 301e.
  • the present invention is not limited to this.
  • a rectangular shape, a star shape, a polygon, or the like is used. It may be of any shape.
  • the inlet portion 200 includes an IC chip 500 and a circuit 210 that forms an inductor pattern L.
  • the circuit 210 has a shape having a cutout portion in which a part of a substantially annular circuit portion is cut out. That is, specifically, it consists of C shape of an alphabet character.
  • the circuit 210 is formed of a side 211 a, a side 211 b, a side 211 c, and a side 211 d. Note that although a case where the circuit 210 is partially cut off has been described, the present invention is not limited to this, and an insulating portion may be formed instead of the cutout portion.
  • the circuit 210 is made of a metal thin film of aluminum.
  • the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
  • the circuit 210 is formed by a technique such as etching or pattern printing.
  • an IC chip 500 is provided so as to bridge the cut-out portion of the circuit 210 of the inlet portion 200.
  • the impedance of the inductor pattern L can be made constant due to the internal area S of the circuit section 210.
  • the IC chip 500 operates based on the radio wave of the reading device received by the antenna unit 300 of the RF tag 100. Specifically, the IC chip 500 according to the present embodiment first rectifies a part of the carrier wave transmitted from the reader to generate a power supply voltage necessary for the IC chip 500 itself to operate. Then, the IC chip 500 operates the non-volatile memory in which the control logic circuit in the IC chip 500, the unique information of the product, and the like are stored by the generated power supply voltage.
  • the IC chip 500 operates a communication circuit and the like for transmitting and receiving data to and from the reader.
  • FIG. 3 is a schematic view showing an example of an AA cross section of the RF tag 100 shown in FIG. 2, and FIG. 4 is a schematic view showing another example of the AA cross section of the RF tag 100.
  • 5 is a schematic view showing still another example of the cross section AA of the RF tag 100, and
  • FIG. 6 is a schematic view showing still another example of the cross section AA of the RF tag 100. As shown in FIG.
  • the adhesive layer 400 in the present embodiment shown in FIG. 2 or 3 is a double-sided tape.
  • the adhesive layer 400 is provided at least on one side of the antenna unit 300.
  • the pressure-sensitive adhesive layer 400 is made of a double-sided tape.
  • the present invention is not limited to this, and another pressure-sensitive adhesive layer may be formed or an adhesive may be applied.
  • the double-sided tape may be a part of the circuit 210 of the inlet portion 200 instead of the entire surface.
  • the double-sided tape is exemplified, as will be described later, when the antenna unit 300 of the RF tag 100 is attached to a product or a seal, the release sheet of the double-sided tape is easily attached by peeling off. Because it is possible to wear.
  • the adhesive layer 400 is provided on one side of the antenna unit 300.
  • the present invention is not limited to this, and as shown in FIG. A sheet member 420 may be provided.
  • the sheet member 420 may be provided only in the inlet portion 200.
  • the sheet member 420 may be provided from the back surface side of the antenna unit 300 and the inlet unit 200 to the front side through the side surface of the inlet unit 200.
  • the sheet member 420 may be mainly made of one or more insulating materials or resins such as polyethylene terephthalate, polyimide, polyvinyl chloride, etc. Even if other insulating film processing is used. Good.
  • the thickness of the sheet member 420 is preferably several micrometers or more and several hundred micrometers or less, and more preferably several tens of micrometers or so.
  • an adhesive layer 400 may be provided on the back surface side of the antenna unit 300, and a foam material 450 may be provided on at least the back surface side of the inlet unit 200.
  • the foam material 450 may be foam polystyrene, polyethylene, polyimide, thin foam (borer) or the like, or may be made of an insulation layer such as another foam or material having insulation properties, and any foam material.
  • the electrical conduction in the inlet portion 200 of the RF tag 100 can be protected, and the circuit 210 can be protected.
  • FIG. 7 is a view showing an example of an equivalent circuit of the RF tag 100.
  • the equivalent circuit of the RF tag 100 mainly includes an inductor pattern L, a capacitor Cb, and an IC chip 500.
  • the inductor pattern L, the capacitor Cb, and the IC chip 500 constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.
  • the resonant frequency f [Hz] of this resonant circuit is given by equation (1).
  • the value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
  • L a inductor pattern L of the inductance
  • C b it means the equivalent capacitance of the IC chip 500.
  • the IC chip 500 includes a capacitor inside, and the IC chip 500 has a floating capacitance. Therefore, when setting the resonance frequency f of the resonant circuit, to adjust the equivalent capacitance C b of the IC chip 500, to form a resonant circuit. That is, the resonant circuit preferably having an inductor pattern L the inductance, and the IC chip 500 inside the equivalent capacitance C b was considered set resonant frequency f of the.
  • the resonance frequency f of the resonant circuit it is possible to accurately set the radio frequency band. As a result, the reading performance of the RF tag 100 can be further improved. Further, the power supply voltage generated by the IC chip 500 can be further increased.
  • FIG. 8 is a schematic view showing an example of use of the RF tag 100
  • FIG. 9 is a schematic view showing another example of use of the RF tag 100. As shown in FIG.
  • the RF tag 100 may be formed in the package of the bag 900.
  • the bag 900 is made of an aluminum vapor deposition film will be described.
  • the inlet 200 is attached from the end of the bag 900 to protect the electrical continuity of the circuit on the back of the inlet 200. It is desirable that it be stuck so that
  • FIG. 9 when the RF tag 100 shown in FIG. 4, FIG. 5, FIG. 6 is attached to the bag 900, the electrical conduction of the circuit on the back surface of the inlet portion 200 Because it is protected by the member 450, it may be placed at any position of the bag 900.
  • FIG. 10 is a schematic view showing an example of an equivalent circuit of the RF tag device 110 including the RF tag 100 and the bag 900 shown in FIG.
  • the adhesive layer 400 or the sheet member 420 is interposed between the antenna unit 300 and the aluminum deposition of the bag 900, so that it can function as a capacitor.
  • the aluminum deposited film portion of the outer layer of the bag 900 can be used as an antenna.
  • the bag 900 made of an aluminum vapor deposition film is illustrated, but the present invention is not limited to this, and the RF tag 100 can be attached to a bag, a box, a seal attached to a product, or the like.
  • the inlet portion 200 and the antenna portion 300 are formed by bonding, and the resonance circuit is formed by the capacitance Cb inside the IC chip 500 and the inductor pattern L. It is formed.
  • miniaturization of the RF tag 100 can be realized.
  • the peripheral distance of the antenna unit 300 is designed to correspond to one of ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8 with respect to the wavelength ⁇ , as a result, the communication sensitivity is increased. While dramatically improving, it is possible to receive nondirectional radio waves.
  • the adhesive layer 400 is formed on the antenna unit 300, the RF tag 100 can be easily attached via the adhesive layer 400. Moreover, when it attaches to a conductor member via an adhesive agent, the said conductor member can be used as an antenna.
  • the inlet portion 200 has the sheet member 420 or the foam material 450 on the same side as the adhesive layer 400, it is possible to prevent an electrical short circuit in the inlet portion 200 even when attached to a conductor member. .
  • the foamed resin preferably comprises expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
  • management can be performed by sticking the miniaturized RF tag 100 on any of the bag 900, a box, a seal, a resin sheet, aluminum, and a packaging film.
  • the RF tag 100 can be easily attached to a product in a product manufacturing plant, a store, a convenience store, or the like.
  • the RF tag 100 corresponds to an "RF tag”
  • the RF tag device 110 corresponds to an “RF tag device”
  • the IC chip 500 corresponds to an “IC chip”
  • the inductor pattern L is "inductor”.
  • the inlet portion 200 corresponds to the “inlet portion”
  • the antenna portion 300 corresponds to the “antenna portion”
  • the adhesive layer 400 corresponds to the “adhesive layer”
  • the sheet member 420 or the foam material 450 Corresponds to the "non-conductive layer”
  • the outer peripheral length value of the antenna unit 300 corresponds to the "distance around the antenna unit”
  • the foam material 450 corresponds to the "foam resin”
  • the bag 900 is "bag, box”

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

La présente invention a pour objet de fournir une étiquette RF et un dispositif d'étiquette RF qui peuvent être facilement attachés à un produit. À cet effet, l'invention porte sur une étiquette RF (100) qui est formée en connectant : une unité d'entrée (200) qui comprend une puce à circuit intégré (500) et un motif d'inducteur (L) ; et une unité d'antenne (300) qui est utilisée pour émettre et recevoir des données transmises à partir d'un dispositif de lecture. Un circuit résonnant est formé par la capacité interne de la puce à circuit intégré (500) et un motif d'inducteur (L). L'étiquette RF communique avec le dispositif de lecture.
PCT/JP2018/029705 2017-08-18 2018-08-08 Étiquette rf et dispositif d'étiquette rf WO2019035396A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019536747A JP7133228B2 (ja) 2017-08-18 2018-08-08 Ｒｆタグおよびｒｆタグ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017158049 2017-08-18
JP2017-158049 2017-08-18

Publications (1)

Publication Number Publication Date
WO2019035396A1 true WO2019035396A1 (fr) 2019-02-21

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PCT/JP2018/029705 WO2019035396A1 (fr) 2017-08-18 2018-08-08 Étiquette rf et dispositif d'étiquette rf

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JP (1) JP7133228B2 (fr)
WO (1) WO2019035396A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010092120A (ja) * 2008-10-03 2010-04-22 Toppan Printing Co Ltd 非接触情報媒体及びこれを備えた非接触情報媒体付冊子
WO2013011865A1 (fr) * 2011-07-19 2013-01-24 株式会社村田製作所 Module d'antenne, dispositif d'antenne, étiquette rfid et dispositif terminal de communication
JP2017076340A (ja) * 2015-10-16 2017-04-20 株式会社スマート 線状アンテナｉｃタグとそのシステム及び製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010092120A (ja) * 2008-10-03 2010-04-22 Toppan Printing Co Ltd 非接触情報媒体及びこれを備えた非接触情報媒体付冊子
WO2013011865A1 (fr) * 2011-07-19 2013-01-24 株式会社村田製作所 Module d'antenne, dispositif d'antenne, étiquette rfid et dispositif terminal de communication
JP2017076340A (ja) * 2015-10-16 2017-04-20 株式会社スマート 線状アンテナｉｃタグとそのシステム及び製造方法

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JPWO2019035396A1 (ja) 2020-10-01
JP7133228B2 (ja) 2022-09-08

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