WO2019033307A1

WO2019033307A1 - Waste liquid storage device and wet etching system

Info

Publication number: WO2019033307A1
Application number: PCT/CN2017/097696
Authority: WO
Inventors: 徐蕊; 曹飞; 钟仁聪
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2017-08-16
Filing date: 2017-08-16
Publication date: 2019-02-21
Also published as: CN110770177A

Abstract

A waste liquid storage device (10) and a wet etching system having the waste liquid storage device (10), for storing a waste liquid (20) generated by wet etching. The waste liquid (20) comprises a first solute (22) and a second solute (24), and the second solute (24) is a catalyst for an exothermic oxidation reaction of the first solute (22). The waste liquid storage device (10) comprises a first liquid storage tank (11) and a first conduit (12) for connecting an external complexant solution source (30) with the first liquid storage tank (11). The first liquid storage tank (11) is used for storing the waste liquid (20), the first conduit (12) is used for channeling a complexant (32) to the first liquid storage tank (11), and the complexant (32) is used to inhibit the catalytic ability of the second solute (24) for reaction of the first solute (22). The wet etching system (100) comprises a wet etching machine (40) for etching workpieces and generating the waste liquid (20), and the waste liquid storage device (10).

Description

Waste liquid storage device and wet etching system

Technical field

The present invention relates to wet etching techniques, and more particularly to a wet etching waste liquid storage device and a wet etching system.

Background technique

Part of the solute in the wet etching waste liquid may undergo an oxidation reaction to release heat. To prevent contamination, the waste storage device is generally sealed when storing waste liquid. Therefore, if the waste liquid accumulation and storage time in the waste liquid storage device is too long, the heat released by the oxidation reaction may cause the temperature to be too high and there is a safety hazard.

Summary of the invention

In view of this, embodiments of the present invention are required to provide a wet etching waste liquid storage device and a wet etching system.

A waste liquid storage device according to an embodiment of the present invention is for storing waste liquid generated by wet etching. The waste liquid includes a first solute and a second solute, and the second solute is a catalyst for the exothermic oxidation reaction of the first solute. The waste liquid storage device includes:

a first liquid storage tank for storing the waste liquid; and

Connecting an external source of complexing agent solution to a first line of the first liquid storage tank, the first line for directing the complexing agent to the first liquid storage tank, the network A mixture is used to inhibit the catalytic ability of the second solute to react with the first solute.

In certain embodiments, the first solute comprises H ₂ O ₂ ;

The second solute includes copper ions and molybdenum ions;

The complexing agent comprises an ethylenediaminetetraacetic acid solution.

In some embodiments, the complexing agent has an acidity, and the pH of the waste liquid is acidic after the complexing agent and the second solute are complexed.

In some embodiments, the waste liquid storage device includes a second conduit connecting the wet etching machine to the first liquid storage tank, the second conduit for generating the wet etching machine The waste liquid is directed to the first liquid storage tank.

In some embodiments, the waste liquid storage device includes a first detection device coupled to the second conduit for sampling to detect a concentration of the second solutes.

In some embodiments, the first detecting device detects the second solute concentration when the second line has the waste liquid flowing in and detects the second solute concentration again at a predetermined time.

In some embodiments, the waste liquid storage device comprises:

a first valve disposed on the first conduit; and

a first controller connecting the first detecting device and the first valve, the first controller controlling an opening degree of the first valve according to the concentration to stably suppress the second solute to the first The catalytic ability of a solute reaction.

In some embodiments, the waste liquid storage device comprises:

An early warning device for signaling an early warning; and

a second detecting device connected to the early warning device, wherein the second detecting device is configured to detect a temperature of the waste liquid in the first liquid storage tank, and the early warning device is higher than a first preset temperature An early warning signal is issued.

In some embodiments, the waste liquid storage device includes a third line connecting the external ice water source to the first liquid storage tank, the third line for guiding the ice water to the The first liquid storage tank is used to reduce the temperature of the waste liquid.

In some embodiments, the waste liquid storage device comprises:

a second valve disposed in the third conduit; and

a second controller connecting the second valve and the second detecting device, the second controller for controlling the opening and closing of the second valve to control whether the third pipe flows out of the ice water.

In some embodiments, the second controller controls the second valve to open when the temperature is higher than the first preset temperature to control the third line to flow out the ice water to the The first liquid storage tank.

In some embodiments, after the second valve is opened, the second controller closes the second valve to control the third tube when the temperature of the waste liquid decreases to a second preset temperature. The road stops flowing the ice water to the first liquid storage tank.

In some embodiments, the waste liquid storage device includes a fourth line connecting the first liquid storage tank and the second liquid storage tank, and the fourth pipeline is disposed in the first liquid storage tank The bottom of the waste liquid accumulates, the fourth line is for guiding the waste liquid in the first liquid storage tank to the second liquid storage tank.

In some embodiments, the fourth conduit is provided with a first water pump for withdrawing the waste liquid from the first liquid storage tank to the second liquid storage tank.

In the wet etching system of the embodiment of the present invention, the wet etching system includes:

a wet etching machine for etching a workpiece and generating waste liquid;

The waste liquid storage device according to any of the above embodiments.

In certain embodiments, the wet etching system includes the second liquid storage tank, and the second liquid storage tank is for storing the waste liquid cleaned by the waste liquid storage device.

In certain embodiments, the second reservoir includes a third detection device for detecting the temperature of the waste liquid in the second reservoir.

In some embodiments, the second liquid storage tank is provided with a fifth pipeline connected to the outside, and the fifth pipeline is provided A bottom portion of the waste liquid accumulated in the second liquid storage tank, the fifth line for guiding the waste liquid in the second liquid storage tank to the outside.

In some embodiments, the fifth line is provided with a second water pump for withdrawing the waste liquid from the second liquid storage tank to the outside.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic view showing the structure of a wet etching system according to an embodiment of the present invention.

Detailed ways

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1, a waste liquid storage device 10 according to an embodiment of the present invention is configured to store waste liquid 20 generated by wet etching. The waste liquid 20 includes a first solute 22 and a second solute 24, and the second solute 24 is a catalyst for the exothermic oxidation reaction of the first solute 22. The waste liquid storage device 10 includes a first liquid storage tank 11 and a source of complexing agent solution 30 connected to the outside The first line 12 with the first reservoir tank 11. The first liquid storage tank 11 is for storing the waste liquid 20. The first line 12 is used to direct the complexing agent 32 to the first liquid storage tank 11, and the complexing agent 32 is used to inhibit the catalytic ability of the second solute 24 to the first solute 22.

The waste liquid storage device 10 of the embodiment of the present invention can be used to store the waste liquid 20 generated by wet etching (for example, the etching waste liquid generated by wet etching to form a patterned copper wire layer in a thin film transistor high-quality wire process). The waste liquid 20 has a first solute 22 capable of undergoing a slow oxidation reaction and releasing heat, and a second solute 24 capable of catalyzing the oxidation reaction of the first solute 22. Generally, the first liquid storage tank 11 is used to store the waste liquid 20 to form a relatively closed waste liquid storage space, which can prevent the waste liquid 20 from polluting the environment. However, since the first solute 22 undergoes an oxidation reaction and releases heat, the accumulation and storage time of the waste liquid 20 may cause the temperature of the waste liquid storage device 10 to rise, which poses a safety hazard.

Therefore, the waste liquid storage device 10 of the embodiment of the present invention uses a manner of complexing the second solute 24 to suppress the catalytic ability of the second solute 24 to the first solute 22, so that the oxidation reaction of the first solute 22 becomes slow, to some extent. The temperature rise of the waste storage device 10 can be controlled.

Of course, in other embodiments, the solute in the waste liquid 20 is not limited to the embodiment discussed above, but may be a reaction between the first solute 22 and the second solute 24 in the waste liquid 20 or otherwise, releasing heat to make the waste liquid The temperature of the storage device 10 rises.

The wet etch system 100 of an embodiment of the present invention includes a wet etch machine 40 and a waste liquid storage device 10, that is, in some embodiments, the waste liquid storage device 10 can be applied to the wet etch system 100. The wet etching machine 40 is used to etch a workpiece (for example, wet etching in a thin film transistor high quality wire process to form a patterned copper wire layer) and to generate waste liquid 20. Part of the solute in the waste liquid 20 produced by the etching may undergo an oxidation reaction to release heat. The waste liquid storage device 10 can solve the problem that the heat is released during the storage of the waste liquid 20 so that the temperature rises and there is a safety hazard. As such, the wet etch system 100 can operate safely.

A specific waste storage device 10 can be coupled to a wet etching machine 40.

Of course, in other embodiments, the number of wet etching machines 40 connected to the waste liquid storage device 10 is not limited to one, and the amount of the waste liquid 20 and the capacity of the waste liquid storage device 10 can be generated according to each wet etching machine 40. Size change.

In certain embodiments, the first solute 22 comprises H ₂ O ₂ . The second solute 24 includes copper ions and molybdenum ions. Complexing agent 32 comprises an ethylenediaminetetraacetic acid solution.

It can be understood that the wet etching is used for wet etching in the high-quality wire process of the thin film transistor to form a patterned copper wire layer, and the waste liquid 20 generated includes the first solute 22H ₂ O ₂ , the second solute 24 copper ion and molybdenum ion, and an additive. The first solute 22H ₂ O ₂ will spontaneously undergo a slow oxidation reaction and release heat. The second solute 24 copper ion and molybdenum ion catalyze the oxidation of the first solute 22H ₂ O _{2 to} accelerate the rate of heat release. The complexing agent 32 ethylenediaminetetraacetic acid can complex with the second solute 24 copper ion and molybdenum ion. The complexing agent 32 directs the complexing agent 32 to the first liquid storage tank 11 by connecting the first conduit 12 of the external complexing agent solution source 30, and the complexing agent 32 and the second solute 24 undergo a complexation reaction. The secondary solute 24 is reduced, inhibiting the catalytic ability of the second solute 24 to react with the first solute 22.

In some embodiments, the pH of the complexing agent 32 is acidic, and the pH of the waste liquid 20 is acidic after the complexing agent 32 and the second solute 24 are complexed.

It can be understood that the wet etching is used in the thin-film transistor high-quality wire process to form a patterned copper wire layer by wet etching, and the first solute 22H ₂ O ₂ in the waste liquid 20 generated is slowly oxidized by itself in an acidic environment, and is alkaline. The rate of reaction in the environment is accelerated. Therefore, when the complexing agent 32 is added, the complexing agent 32 should be kept acidic and the waste liquid 20 should be acidic after the reaction, so that the pH of the waste liquid 20 is favorable for the slow oxidation reaction of the first solute 22H ₂ O _{2 to} avoid excessive release of heat.

Of course, in other embodiments, the pH of the complexing agent 32 is not limited to the embodiments discussed above, and the pH of the complexing agent 32 can be adjusted according to the requirements of the solute chemistry in the waste liquid 20 to inhibit the waste liquid 20 from releasing heat.

In certain embodiments, the waste storage device 10 includes a second conduit 13 that connects the wet etching station 40 to the first reservoir 11. The second line 13 is for guiding the waste liquid 20 generated by the wet etching machine 40 to the first liquid storage tank 12.

It can be understood that the waste liquid 20 will be generated after the wet etching machine 40 finishes etching the workpiece, and the waste liquid 20 is guided to the first liquid storage tank 11 through the second line 13 and stored in the first liquid storage tank 11.

In certain embodiments, the waste storage device 10 includes a first detection device 14. The first detecting device 14 is connected to the second conduit 13. The first detecting means 14 is for sampling to detect the concentration of the second solute 24.

It can be understood that the complexing agent 32 is added to the first liquid storage tank 11 to complex the second solute 24, and the second solute 24 reacts with the complexing agent 32 after the waste liquid 20 enters the first liquid storage tank 11, and is detected. The concentration of the second solute 24 in the first reservoir tank 11 is not sufficient to calculate the amount of the added complexing agent 32. Therefore, the first detecting device 14 and the second conduit 13 are connected, and the concentration of the second solute 24 that has not entered the first liquid storage tank 11 is sampled to facilitate calculation and control of the complexing agent 32 added to the first liquid storage tank 11. the amount.

Specifically, the first detecting device 14 can detect the concentration of the second solution 24 by the complexometric titration method, and the complexing agent 32 can be used in the same manner as the complexing agent 32 added to the first liquid storage tank 11 by the complexometric titration. The amount of the complexing agent 32 and the amount of the sampling waste liquid 20 give the concentration of the second solute 24, and the method is simple.

Of course, in other embodiments, the first detecting device 14 is not limited to detecting the concentration of the second solute 24 using complexometric titration, and an appropriate detecting method such as an atomic absorption method and other solution concentration detecting methods may be selected according to requirements.

In some embodiments, the first detecting device 14 detects the second solution when the second line 13 has the waste liquid 20 flowing in. The concentration of the mass 24 is again detected for the concentration of the second solute 24 at predetermined intervals.

It can be understood that the concentration of the second solute 24 in the waste liquid 20 flowing out of the wet etching machine 40 is not uniform, and the first detecting device 14 detects the amount of the second solute 24 once in a predetermined time so as to be at the concentration of the second solute 24. The amount of the complexing agent 32 added to the first liquid storage tank 11 is adjusted in a timely manner after the change has occurred.

Specifically, the predetermined time may be 30 minutes.

Of course, in other embodiments, the predetermined time may not be limited to 30 minutes, but may be changed according to the amount of the waste liquid 20 and the concentration of the second solute 24.

In certain embodiments, the waste storage device 10 includes a first valve 122 disposed on the first conduit 12 and a first controller 15a coupled to the first detection device 14 and the first valve 122. The first controller 15a controls the opening degree of the first valve 122 in accordance with the concentration of the second solute 24 to stably suppress the catalytic ability of the second solute 24 to react with the first solute 22.

It will be appreciated that the concentration of complexing agent 32 can be set based on empirical values of the concentration of second solute 24. The first detecting means 14 detects the concentration of the second solute 24 and feeds back the concentration of the second solute 24 to the first controller 15a, and the first controller 15a calculates the complexation based on the concentration of the second solute 24 and the concentration of the complexing agent 32. The second solute in the waste liquid 20 is the required amount of the complexing agent 32, and controls the opening degree of the first valve 122 to control the amount of the complexing agent 32 flowing into the first liquid storage tank 11. By controlling the amount of the complexing agent 32 flowing into the first liquid storage tank 11, the catalytic ability of the second solute 24 to react with the first solute 22 can be stably suppressed.

Specifically, the amount of the complexing agent 32 flowing into the first liquid storage tank 11 should be 10% to 20% more than the demand calculated by the first controller 15a according to the concentration of the second solute 24 fed back by the first detecting device 14. In order to have sufficient complexing agent 32 to fully react with the second solute 24, it is also avoided that the complexing agent 32 is added in excess to cause waste.

In some embodiments, the waste storage device 10 includes an early warning device 16 and a second detection device 17 that interfaces with the early warning device 16. The early warning device 16 is used to issue an early warning signal. The second detecting device 17 is for detecting the temperature of the waste liquid 20 in the first liquid storage tank 11. The early warning device 16 issues an early warning signal when the temperature of the waste liquid 20 is higher than the first predetermined temperature.

It can be understood that, in the case where the temperature of the waste liquid 20 is lower than the first preset temperature, there is less possibility that the waste liquid storage device 10 has a safety hazard. In the case where the temperature of the waste liquid 20 is higher than the first preset temperature, there is a high possibility that the waste liquid storage device 10 has a safety hazard. In the case where the waste liquid 20 is excessive and the storage time is too long, the temperature of the waste liquid 20 may be higher than the first preset temperature even if the complexing agent 32 is added. Therefore, the second detecting means 17 is arranged to detect the temperature of the waste liquid 20 and feed back the temperature of the waste liquid 20 to the early warning means 16, and the early warning means 16 issues an early warning signal to cause work when the temperature of the waste liquid 20 is higher than the first preset temperature. The personnel's attention reminds the staff to check whether the waste storage device 10 is normal in order to take measures to reduce the temperature of the waste storage device 10 to avoid a safety accident.

Specifically, the first preset temperature may be 50 degrees Celsius.

Of course, in other embodiments, the first preset temperature may not be limited to 50 degrees Celsius, but may be according to the first The material of the liquid storage tank 11 is changed by the capacity of the first liquid storage tank 11 and the chemical properties (for example, thermal stability) of the solute in the waste liquid 20.

In certain embodiments, the waste storage device 10 includes a third line 18 that connects the external source of ice water 50 to the first reservoir 11. The third line 18 is for guiding the ice water 52 to the first liquid storage tank 11. Ice water 52 is used to lower the temperature of the waste liquid 20.

It can be understood that the ice water 52 has a low temperature and a large specific heat capacity, and is a good cooling material. In the case where the temperature of the waste liquid 20 is still not controlled after the second solute 24 is complexed, the addition of the ice water 52 to the first liquid storage tank 11 can lower the temperature of the waste liquid 20, so that the temperature of the waste liquid storage device 10 is maintained. In the scope of safety.

The ice water 52 is connected to the external liquid water source 50 through the third line 18 to direct the ice water 52 to the first liquid storage tank 11, and the low temperature ice water 52 and the waste liquid 20 are mixed so that the temperature of the waste liquid 20 is rapidly lowered.

In certain embodiments, the waste storage device 10 includes a second valve 182 disposed in the third conduit 18 and a second controller 15b coupled to the second valve 182 and the second detection device 17. The second controller 15b is for controlling the opening and closing of the second valve 182 to control whether the third line 18 flows out of the ice water 52.

It can be understood that, in general, the first liquid storage tank 11 does not need to control the temperature of the first liquid storage tank 11 by adding ice water 52, and the second valve 182 is disposed in the third pipeline 18 through the second controller 15b. After the temperature of the waste liquid 20 reaches a certain level, the second valve 182 is controlled to open to add ice water 52 to the first liquid storage tank 11.

In some embodiments, the second controller 15b controls the second valve 182 to open when the temperature of the waste liquid 20 is higher than the first preset temperature to control the third line 18 to flow out of the ice water 52 to the first liquid storage tank 11. .

It can be understood that, in the case where the temperature of the waste liquid 20 is higher than the first preset temperature, there is a high possibility that the waste liquid storage device 10 has a safety hazard. At this time, the second valve 182 is opened to add the ice water 52 to the first liquid storage tank 11, so that the temperature of the waste liquid 20 is rapidly lowered to avoid a safety accident.

In some embodiments, after the second valve 182 is opened, when the temperature of the waste liquid 20 is lowered to the second preset temperature, the second controller 15b closes the second valve 182 to control the third line 18 to stop flowing out of the ice water. 52 to the first liquid storage tank 11.

It can be understood that after the second valve 182 is opened, the waste liquid 20 and the ice water 52 are mixed so that the temperature of the waste liquid 20 is rapidly lowered, in order to save the ice water 52 and to prevent the ice water 52 from being excessively occupied to occupy the storage of the first liquid storage tank 11. In the space, the ice water 52 should be stopped from being added to the first liquid storage tank 11 in time. When there is a certain temperature difference between the second preset temperature and the first preset temperature, and the temperature of the waste liquid 20 is lowered to the second preset temperature, the waste liquid storage device 10 is less likely to have a safety hazard and is in a safe state. It is less likely that the temperature of the waste liquid 20 will rise again to the first preset temperature. At this time, the ice water 52 should be stopped from being added to the first liquid storage tank 11.

Specifically, the first preset temperature may be 45 degrees Celsius.

Of course, in other embodiments, the first preset temperature may not be limited to 45 degrees Celsius, but may be according to the first The material of the liquid storage tank 11 is changed by the capacity of the first liquid storage tank 11 and the chemical properties (for example, thermal stability) of the waste liquid 20.

In certain embodiments, the waste liquid storage device 10 includes a fourth line 19 that connects the first liquid storage tank 11 and the second liquid storage tank 60. The fourth line 19 is disposed at the bottom of the first liquid storage tank 11 where the waste liquid 20 is accumulated. The fourth line 19 is for guiding the waste liquid 20 in the first liquid storage tank 11 to the second liquid storage tank 60.

It can be understood that after the waste liquid 20 in the first liquid storage tank 11 is accumulated to a certain extent, leakage and other safety occur in order to avoid excessive accumulation of waste 20 in the first liquid storage tank 11 exceeding the load of the first liquid storage tank 11. In the event of an accident, it is necessary to clean the waste liquid 20 in the first liquid storage tank 11. When the waste liquid 20 in the first liquid storage tank 11 is cleaned, the waste liquid 20 can be guided out of the first liquid storage tank 11 through the fourth line 19. The fourth line 19 is disposed at the bottom of the first liquid storage tank 11 where the waste liquid 20 accumulates, so that when the first liquid storage tank 11 has the waste liquid 20 accumulated, the fourth line 19 can be kept in contact with the waste liquid 20, which is favorable for emptying. The waste liquid 20 of the first liquid storage tank 11 prevents the waste liquid 20 from remaining in the first liquid storage tank 11.

In certain embodiments, the fourth conduit 19 is provided with a first water pump 192. The first water pump 192 is for withdrawing the waste liquid 20 from the first liquid storage tank 11 to the second liquid storage tank 60.

It can be understood that the setting of the first water pump 192 can quickly withdraw the waste liquid 20 in the first liquid storage tank 11 for the purpose of quickly cleaning the first liquid storage tank 11. And when the interface level of the fourth pipeline 19 and the first liquid storage tank 11 is lower than the interface between the fourth pipeline 19 and the second liquid storage tank 60, the first water pump 192 facilitates emptying of the first liquid storage tank 11 The waste liquid 20 prevents the waste liquid 20 from remaining in the first liquid storage tank 11.

In certain embodiments, the wet etch system 100 includes a second reservoir 60. The second stock solution 60 is used to store the waste liquid 20 cleaned by the waste liquid storage device 10.

It can be understood that after the waste liquid 20 in the waste liquid storage device 10 is accumulated to a certain extent, leakage and other safety accidents occur in order to prevent the waste liquid 20 in the waste liquid storage device 10 from accumulating excessively exceeding the load of the waste liquid storage device 10. The second liquid storage tank 60 can be configured to store the waste liquid 20 cleaned in the waste liquid storage device 10 to reduce the load of the waste liquid storage device 10, which is advantageous for reducing the possibility of a safety hazard of the wet etching system 100.

In certain embodiments, the second reservoir 60 includes a third detection device 62. The third detecting device 62 is for detecting the temperature of the waste liquid 20 in the second liquid storage tank 60.

It will be appreciated that after the waste liquid 20 is transferred to the second liquid storage tank 60, to prevent contamination, the second liquid storage tank 60 generally forms a relatively closed storage space. The third detecting means 62 is arranged to detect the temperature of the waste liquid 20 in the second liquid storage tank 60, and the temperature of the waste liquid 20 in the second liquid storage tank 60 can be controlled accordingly according to the detected temperature condition. It is possible to prevent the waste liquid 20 transferred to the second liquid storage tank 60 from being present in the second solute 24 which is not completely reacted with the complexing agent 32, so that the first solute 22 reacts to release heat, causing the temperature of the second liquid storage tank 60 to be too high, causing Security incident.

In certain embodiments, the second reservoir 60 is provided with a fifth conduit 64 that connects to the exterior. The fifth line 64 is disposed at the bottom of the second liquid storage tank 60 where the waste liquid 20 is accumulated. The fifth line 64 is used to waste the second liquid storage tank 60 The liquid 20 is guided to the outside.

It can be understood that the waste liquid 20 produced by the wet etching (for example, the etching waste generated by the wet etching of the thin film transistor in the high-quality wire process to form the patterned copper wire layer) may pollute the environment. Therefore, it is necessary to treat the waste liquid 20, and the wet etching system 100 cleans the waste liquid 20 in the second liquid storage tank 60 through the fifth line 64 to the outside for processing. When the waste liquid 20 in the second liquid storage tank 60 is cleaned, the fifth line 64 is disposed in the bottom portion of the second liquid storage tank 60 where the waste liquid 20 is accumulated so that the second liquid storage tank 60 can be maintained when the waste liquid 20 is accumulated. The fifth line 64 is in contact with the waste liquid 20, which facilitates emptying of the waste liquid 20 of the fifth liquid storage tank 60, and avoids the waste liquid 20 remaining in the second liquid storage tank 60.

In certain embodiments, the fifth line 64 is provided with a second water pump 642. The second water pump 642 is for extracting the waste liquid 20 from the second liquid storage tank 60 to the outside.

It can be understood that the provision of the second water pump 642 can quickly withdraw the waste liquid 20 in the second liquid storage tank 60 for the purpose of quickly cleaning the second liquid storage tank 60. And when the interface level of the fifth pipeline 64 and the second liquid storage tank 60 is lower than the external interface, the second water pump 642 facilitates emptying the waste liquid 20 in the second liquid storage tank 60, avoiding the second liquid storage tank 60 Waste liquid 20 remains.

In the description of the present specification, reference is made to the terms "some embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific examples", or "some examples", etc. The descriptions of the specific features, structures, materials or features described in connection with the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The embodiments are subject to variations, modifications, substitutions and variations.

Claims

A waste liquid storage device for storing waste liquid generated by wet etching, wherein the waste liquid comprises a first solute and a second solute, and the second solute is an exothermic oxidation reaction of the first solute Catalyst, the waste liquid storage device comprises:

a first liquid storage tank for storing the waste liquid; and

Connecting an external source of complexing agent solution to a first line of the first liquid storage tank, the first line for directing the complexing agent to the first liquid storage tank, the network A mixture is used to inhibit the catalytic ability of the second solute to react with the first solute.
The waste liquid storage device according to claim 1, wherein the first solute comprises H2O2;

The second solute includes copper ions and molybdenum ions;

The complexing agent comprises an ethylenediaminetetraacetic acid solution.
The waste liquid storage device according to claim 2, wherein the pH of the complexing agent is acidic, and the pH of the waste liquid is acidic after the complexing agent and the second solute are complexed. .
A waste liquid storage device according to claim 1, wherein said waste liquid storage means comprises a second line connecting the wet etching machine to said first liquid storage tank, said second line being used for The waste liquid generated by the wet etching machine is guided to the first liquid storage tank.
The waste liquid storage device according to claim 4, wherein said waste liquid storage device comprises a first detecting device, said first detecting device being connected to said second conduit for sampling and detecting said second The concentration of the solute.
The waste liquid storage device according to claim 5, wherein said first detecting means detects said second solute concentration when said waste liquid flows in said second line, and detects said again at a predetermined time The second solute concentration is described.
The waste liquid storage device according to claim 6, wherein said waste liquid storage device comprises:

a first valve disposed on the first conduit; and

a first controller connecting the first detecting device and the first valve, the first controller controlling an opening degree of the first valve according to the concentration to stably suppress the second solute to the first The catalytic ability of a solute reaction.
The waste liquid storage device according to claim 7, wherein said waste liquid storage device comprises:

An early warning device for signaling an early warning; and

a second detecting device connected to the early warning device, wherein the second detecting device is configured to detect a temperature of the waste liquid in the first liquid storage tank, and the early warning device is higher than a first preset temperature An early warning signal is issued.
A waste liquid storage apparatus according to claim 8, wherein said waste liquid storage means comprises a third line connecting the external ice water source and said first liquid storage tank, said third line being used for The ice water is directed to the first liquid storage tank for reducing the temperature of the waste liquid.
The waste liquid storage device according to claim 9, wherein said waste liquid storage device comprises:

a second valve disposed in the third conduit; and

a second controller connecting the second valve and the second detecting device, the second controller for controlling the opening and closing of the second valve to control whether the third pipe flows out of the ice water.
The waste liquid storage device according to claim 10, wherein said second controller controls said second valve to open to control said third tube when said temperature is higher than said first preset temperature The road flows out of the ice water to the first liquid storage tank.
The waste liquid storage device according to claim 11, wherein after the second valve is opened, when the temperature of the waste liquid is lowered to a second preset temperature, the second controller turns off the first The second valve controls the third line to stop flowing the ice water to the first liquid storage tank.
A waste liquid storage apparatus according to claim 1, wherein said waste liquid storage means comprises a fourth line connecting said first liquid storage tank and said second liquid storage tank, said fourth piping setting In the bottom of the first liquid storage tank where the waste liquid accumulates, the fourth line is used to guide the waste liquid in the first liquid storage tank to the second liquid storage tank.
The waste liquid storage device according to claim 13, wherein said fourth pipe is provided with a first water pump, and said first water pump is for extracting said waste liquid from said first liquid storage tank The second liquid storage tank.
A wet etching system, characterized in that the wet etching system comprises:

a wet etching machine for etching a workpiece and generating waste liquid;

A waste liquid storage device according to any one of claims 1-14.
A wet etching system according to claim 15 wherein said wet etching system includes said second liquid storage tank, said second liquid storage tank being for storing said said waste liquid storage device Waste liquid.
A wet etching system according to claim 16, wherein said second liquid storage tank includes a third detecting means for detecting said waste liquid in said second liquid storage tank temperature.
A wet etching system according to claim 17, wherein said second liquid storage tank is provided with a fifth line connected to the outside, and said fifth line is disposed in said second liquid storage tank The bottom portion of the waste liquid is accumulated, and the fifth line is used to guide the waste liquid in the second liquid storage tank to the outside.
A wet etching system according to claim 18, wherein said fifth line is provided with a second water pump for withdrawing said waste liquid from said second liquid storage tank to the outside .