WO2019031534A1 - Rf tag antenna and rf tag - Google Patents

Rf tag antenna and rf tag Download PDF

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Publication number
WO2019031534A1
WO2019031534A1 PCT/JP2018/029700 JP2018029700W WO2019031534A1 WO 2019031534 A1 WO2019031534 A1 WO 2019031534A1 JP 2018029700 W JP2018029700 W JP 2018029700W WO 2019031534 A1 WO2019031534 A1 WO 2019031534A1
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WO
WIPO (PCT)
Prior art keywords
antenna
tag
antenna unit
unit
chip
Prior art date
Application number
PCT/JP2018/029700
Other languages
French (fr)
Japanese (ja)
Inventor
詩朗 杉村
Original Assignee
株式会社フェニックスソリューション
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Publication date
Application filed by 株式会社フェニックスソリューション filed Critical 株式会社フェニックスソリューション
Priority to JP2019535693A priority Critical patent/JPWO2019031534A1/en
Publication of WO2019031534A1 publication Critical patent/WO2019031534A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength

Definitions

  • the present invention relates to a low-profile RF tag antenna and an RF tag.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2016-173747
  • an RFID tag that can suppress a decrease in communication performance when in contact with or in proximity to a conductor or a high dielectric, and can achieve both thinning and cost reduction Is disclosed.
  • the RFID tag described in Patent Document 1 includes a stacked body including one conductive layer as an intermediate layer, an antenna provided on the stacked body, and an IC chip connected to the antenna, and one conductive layer includes It has at least one structure including a neck portion.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2016-58062 discloses an RFID tag that prevents a semiconductor chip from breaking.
  • the base material, the semiconductor chip mounted on the base material, and the semiconductor chip are covered, and the folding line starting point of the folding line is released from the semiconductor chip when it is folded. And an island-like reinforcing material for reinforcing the base material.
  • Patent Document 3 Japanese Patent Laid-Open No. 2014-222423 discloses a package with an RFID tag capable of performing wireless communication in the UHF band without causing a decrease in communication distance and an increase in size.
  • the RFID tag-attached package including the package to which the RFID tag is attached and in which the package is enclosed, the package functions as an antenna for communication of the RFID tag.
  • the RFID tag has an IC chip and two conductive members individually connected to two electrodes of the IC chip, and the two conductive One of the members is attached to the surface of the sheet via the insulating member so that at least a part thereof is located on one side of the slit with respect to the width direction of the slit, the other of the two conductive members is at least a part of the slit Is attached to the surface of the sheet via the insulating member so as to be located on the other side of the slit with respect to the width direction of the Once cut along the imaginary line including the line in which the RFID tag becomes poor communication.
  • Patent Document 4 Japanese Patent Laid-Open No. 2008-107947 discloses an RFID tag that transmits and receives data without contact with an external data read / write device, the RFID tag being a package made of aluminum foil and a metal-deposited film. The RFID tag is disclosed that does not malfunction even if the RFID tag is attached to a material or attached to a large cardboard or the like.
  • an RFID chip that transmits and receives data contactlessly with an external data read / write device, an IC chip and an IC chip used to transmit and receive data at least contactlessly with the support.
  • the inlet formed with the conductive wire and the antenna used for transmission and reception are separately formed, and by adhering the inlet and the antenna, the conductive wire and the antenna are connected by capacitor coupling.
  • Patent Document 5 Japanese Unexamined Patent Publication No. 2011-2218378 discloses a wireless communication tag which can prohibit communication outside the management area.
  • the semiconductor chip is mounted and electrically connected to the semiconductor chip.
  • An antenna module having a tag having a power receiving unit, an antenna unit for receiving radio waves from a communication device, and a feeding unit electrically connected to the antenna unit, and having a configuration that can be attached to and detached from the tag.
  • the power reception unit and the power supply unit are electrically connected to be in a communicable state with the communication device.
  • Patent Document 6 Japanese Patent Application Laid-Open No. 2012-70076 discloses an RF-ID media which sufficiently achieves the effect of the booster antenna in the RF-ID media using the booster antenna.
  • a second antenna is formed on a second base substrate on a first base substrate on which a first antenna in which current flows by an electromagnetic wave from the outside is formed.
  • the RF-ID media on which an inlet formed is mounted and on which an IC chip connected to the second antenna is mounted, and the current flows to the second antenna by electromagnetic induction by the current flowing to the first antenna
  • the second antenna consists of two spiral antenna parts whose outer peripheral end is connected to the IC chip and wound in the same direction and the inner peripheral end is opened, and the first antenna is When the inlet is mounted on one of the base substrates, two unequal regions are formed along the overlapping portion of the outer peripheral portion of each of the two antenna portions including the region between the two antenna portions. And has a current path in which a current flows by electromagnetic waves in the opposite direction of the spiral for na section.
  • Patent Document 7 Japanese Patent Application Laid-Open No. 2008-117165 relates to an RFID tag in which even if the RFID tags are overlapped, a reading failure due to the interference of radio waves does not occur, and a spacer is not necessary between the RFID tags to be overlapped. It is disclosed.
  • the wireless communication tag described in Patent Document 7 is an IC tag including an IC chip operated by a wireless wave and an antenna formed of a metal film layer formed on a base of an insulator,
  • the antenna includes a slit for impedance matching, one first antenna on which the IC chip is mounted, and at least one second antenna on which the IC chip is not mounted, and the first antenna and the at least one first antenna The two antennas are capacitively coupled.
  • Patent Document 8 Japanese Patent Application Laid-Open No. 2013-54751 discloses an RFID information medium capable of appropriate communication with a reading device (or reading and writing device) and easily miniaturized.
  • the RFID information medium described in Patent Document 8 is an RFID information medium that performs data communication without contact with an external reader, and includes a main body having an insulating member, an antenna member provided in the main body, and a main body. And an optical change device whose color or image changes depending on visual observation, the conductor having a layer of a conductive material, the layer of the conductive material being a member for an antenna Partially overlapping in the thickness direction of the main body, the optical change device comprises a conductive reflective layer or a conductive transparent layer, and the reflective layer or transparent layer of the optical change device comprises a conductive material Is also used as a layer of
  • An object of the present invention is to provide an RF tag capable of receiving an omnidirectional radio wave by making an inductance constant and attaching a separable inlet to an antenna unit.
  • the inlet including the IC chip and the inductor pattern and the antenna unit used to transmit and receive data transmitted from the reader are separately formed, and the inlet is attached to the antenna unit. And a capacitor is formed to communicate with the reader.
  • the sticking member becomes a capacitor and forms a resonant circuit.
  • transmission and reception can be performed as an RF tag.
  • the impedance of the inductance can be made constant.
  • the inlet has a shape lacking a part of the annular circuit part, and IC chips are provided at both ends of the part lacking the part. It may be arranged to be bridged.
  • the inductance pattern can be determined by the annular shape.
  • an insulating layer made of foam may be provided between the inlet and the antenna portion.
  • the capacitor capacity can be determined by providing an insulating layer made of foam between the inlet and the antenna portion.
  • the thickness of the insulating layer made of foam can be set to 0.5 mm or more and 3 mm or less, the sensitivity of the RF tag can be improved.
  • a part of the antenna portion can be overlapped with a shape in which a part of the annular circuit portion of the inlet is missing. It may be of any shape.
  • the RF tag can be efficiently formed.
  • the antenna unit may be a flat plate antenna.
  • the antenna unit is formed of a flat plate antenna, thinning of the RF tag can be realized.
  • the width of the antenna unit may have a ratio of ⁇ to ⁇ with respect to the width of the inductor pattern.
  • the shift can be absorbed when the inlet is attached to the antenna unit.
  • the capacitance of the capacitor may be in the range of 2 PF or more and 3 PF or less.
  • the RF tag according to the seventh invention is any of the RF tags according to the first aspect to the sixth invention, wherein the antenna unit is any of a bag, a box, a film for wrapping a product, and a seal attached to a product. May be formed.
  • the antenna unit can form an RF tag on a bag, a box, a film for packaging a product, and a seal attached to the product, so that data communication can be reliably performed.
  • FIG. 4 is a schematic view showing an example of an AA cross section of the RF tag of FIG. 3; It is a figure which shows an example of the equivalent circuit of RF tag of FIG. It is a RF tag which shows the other example which sticks an attachment part and an antenna part. It is a schematic diagram which shows the other example of an antenna part. It is a schematic diagram which shows the other example of an antenna part. It is a schematic diagram which shows the other example of an antenna part. It is a schematic diagram which shows the other example of an antenna part. It is a schematic diagram which shows the other example of an antenna part. It is a schematic diagram which shows the other example of an antenna part.
  • FIG. 1 is a schematic view showing an example of a plane of an RF tag 100 according to the present embodiment.
  • FIG. 2 is a schematic plan view showing an example of the attachment unit 200 of the RF tag 100
  • FIG. 3 is a schematic plan view showing an example of the antenna unit 300 of the RF tag 100.
  • FIG. 4 is a schematic view showing an example of an AA cross section of the RF tag 100 of FIG.
  • the RF tag 100 mainly includes an attachment unit 200 and an antenna unit 300.
  • the attachment unit 200 is formed of a separate member from the antenna unit 300.
  • the RF tag 100 is formed by sticking the attachment unit 200 to the antenna unit 300 with the adhesive layer 400 (see FIG. 4).
  • the antenna unit 300 is made of a conductive member.
  • the antenna unit 300 includes a first area 310, a second area 320 and a third area 330.
  • the first region 310 and the third region 330 have a rectangular shape having a longitudinal direction, and have substantially the same shape.
  • the first area 310 and the third area 330 are arranged in parallel.
  • the second member 320 is formed to communicate the ends of the first area 310 and the third area 330.
  • the width of the first area 310 and the third area 330 is T1
  • the width of the second area 320 is T2.
  • the first region 310, the second region 320, and the third region 330 of the antenna unit 300 are made of a metal thin film of aluminum.
  • the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
  • the antenna unit 300 is formed by a method such as etching or pattern printing.
  • the attachment unit 200 includes an IC chip 500 and a circuit 210 that forms an inductor pattern L.
  • the circuit 210 has a shape having a cutaway portion in which a part of the substantially annular circuit portion 211 is cut out. That is, specifically, it consists of C shape of an alphabet character.
  • the circuit unit 211 is formed of a side 211 a, a side 211 b, a side 211 c, a side 211 d, and a side 211 e.
  • the circuit 210 has been described in the case where a part of the circuit portion 211 is cut out, the present invention is not limited to this and an insulating portion may be formed.
  • the circuit 210 is made of a metal thin film of aluminum.
  • the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
  • the circuit 210 is formed by a technique such as etching or pattern printing.
  • an IC chip 500 is provided to bridge the cutaway portion of the circuit 210 of the attachment unit 200.
  • the impedance of the inductor pattern L can be made constant due to the internal area S of the circuit unit 211.
  • the IC chip 500 operates based on the radio wave of the reading device received by the antenna unit 300 of the RF tag 100. Specifically, the IC chip 500 according to the present embodiment first rectifies a part of the carrier wave transmitted from the reader to generate a power supply voltage necessary for the IC chip 500 itself to operate. Then, the IC chip 500 operates the non-volatile memory in which the control logic circuit in the IC chip 500, the unique information of the product, and the like are stored by the generated power supply voltage.
  • the IC chip 500 operates a communication circuit and the like for transmitting and receiving data to and from the reader.
  • a sheet member may be provided on a portion of the attachment unit 200 where the adhesive layer 400 is not provided, for example, the surface opposite to the surface on which the adhesive layer 400 is provided.
  • the sheet member one or more insulating materials or resins such as polyethylene terephthalate, polyimide, polyvinyl chloride, etc. may be used mainly, and other insulating film processing may be used. As a result, the attachment unit 200 can be protected.
  • the thickness of the sheet member is preferably several micrometers or more and several hundred micrometers or less, and more preferably several tens micrometers or so.
  • the attachment unit 200 is attached to the antenna unit 300 via the adhesive layer 400 (see FIG. 4).
  • a capacitor capacitor, capacitance
  • Adhesive layer 400 in the present embodiment shown in FIG. 1 is made of double-sided tape.
  • the adhesive layer 400 is provided on the attachment portion 200.
  • the adhesive layer 400 is made of a double-sided tape.
  • the present invention is not limited to this, and other adhesive layers may be formed or an adhesive may be applied.
  • the double-sided tape may be a part of the entire surface of the circuit unit 211 of the attachment unit 200 instead of the entire surface.
  • the double-sided adhesive tape is exemplified because the attachment unit 200 of the RF tag 100 is attached to the antenna unit 300 as described later, so the peeling sheet of the double-sided adhesive tape can be easily peeled off. It is because sticking is possible.
  • the width T1 of the first region 310 of the antenna unit 300 be formed at least one time and at most four times the width T211 of the circuit unit 211 of the attachment unit 200. Further, it is desirable that the width T2 of the second region 320 of the antenna unit 300 be formed to be 1 to 4 times the width T212 of the circuit unit 211 of the attachment unit 200. Further, the width T 213 of the circuit portion 211 of the attachment portion 200 is desirably formed to be 1 to 4 times the width T 212 of the circuit portion 211 of the attachment portion 200.
  • (Equivalent circuit) 5 is a view showing an example of an equivalent circuit of the RF tag 100 of FIG.
  • the equivalent circuit of the RF tag 100 includes an inductor pattern L, a capacitor C, and an IC chip 500.
  • the inductor pattern L, the capacitor C, and the IC chip 500 constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.
  • the resonant frequency f [Hz] of this resonant circuit is given by equation (1).
  • the value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
  • L a inductor pattern L of the inductance
  • C a the capacitance of the capacitor C
  • C b mean the equivalent capacitance of the IC chip 500.
  • some IC chips 500 include a capacitor inside, and the IC chip 500 has a floating capacitance. Therefore, when setting the resonance frequency f of the resonant circuit, it is preferable to consider the equivalent capacitance C b of the IC chip 500. That is, the resonant circuit, the inductance of the inductor pattern L, and preferably having a capacitance, and the IC chip 500 inside the equivalent capacitance C b was considered set resonant frequency f of the capacitor 240.
  • C b for example, a capacitance value published as one of specification specifications of an IC chip to be used can be used.
  • the resonance frequency f of the resonant circuit it is possible to accurately set the radio frequency band. As a result, the reading performance of the RF tag 100 can be further improved. Further, the power supply voltage generated by the IC chip 500 can be further increased.
  • FIG. 6 is an RF tag 100 a showing another example of attaching the attachment unit 200 and the antenna unit 300.
  • FIG. 6 it may be adhered in a state where it is rotated 180 degrees with respect to the adhered state of the RF tag 100 shown in FIG.
  • FIG. 7 is a schematic view showing another example of the antenna unit 300. As shown in FIG.
  • the antenna unit 300 b has a first area 310 b instead of the first area 310.
  • the letter L shape of the alphabet is formed by the second area 320 and the third area 330, and the end of the first area 310b and the third area 330 are connected by the fourth area 340.
  • FIG. 8 is a schematic view showing another example of the antenna unit 300. As shown in FIG.
  • the antenna unit 300c illustrated in FIG. 8 is an example of an L-shaped antenna.
  • the antenna unit 300 c has a fourth region 340 instead of the second region 320 of the antenna unit 300.
  • the antenna unit 300 c connects the first region 310 and the third region 330 by the fourth region 340.
  • FIG. 9 is a schematic view showing another example of the antenna unit 300
  • FIG. 10 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300d of FIG.
  • the antenna unit 300 d illustrated in FIG. 9 is an example of a loop antenna or a folded antenna.
  • the antenna unit 300 d includes a first region 310, a second region 320, a third region 330, a fifth region 350, and regions 361, 362, and 363 of the antenna unit 300.
  • the attachment unit 200 is attached to the regions 361, 362, and 363.
  • FIG. 11 is a schematic view showing another example of the antenna unit 300
  • FIG. 12 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300e of FIG.
  • the antenna unit 300 e illustrated in FIG. 11 is an example of a dipole antenna.
  • the antenna unit 300 e has a first area 310, a third area 330, and areas 371 and 372 of the antenna unit 300.
  • the attachment unit 200 is attached to the areas 371 and 372 and the third area 330.
  • FIG. 13 is a schematic view showing another example of the antenna unit 300
  • FIG. 14 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300f of FIG.
  • the antenna unit 300 f illustrated in FIG. 13 is an example of a branch feed transmission line type antenna (SHUNT FED ANTENNA).
  • the antenna unit 300 f has a first area 310, a second area 320, a third area 330, and a fifth area 350 of the antenna unit 300.
  • the attachment unit 200 is attached to a part of the first area 310, a part of the third area, and the second area 320.
  • FIG. 15 is a schematic view showing another example of the antenna unit 300
  • FIG. 16 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300g of FIG.
  • the antenna unit 300g illustrated in FIG. 15 is an example of a monopole antenna.
  • the antenna unit 300 g has a first area 310, a second area 320, a third area 330, and a sixth area 380 of the antenna unit 300.
  • the attachment unit 200 is attached to a part of the first area 310, a part of the third area, and the second area 320.
  • FIG. 17 is a schematic view showing an example of use of the RF tag 100. As shown in FIG.
  • the antenna unit 300 may be formed in the package of the bag 900.
  • the antenna unit 300 may be formed by using an aluminum vapor deposition film, and the aluminum vapor deposition may be added to the outer layer of the film to form the antenna unit 300.
  • the aluminum deposited film portion can be used as an antenna.
  • the attachment unit 200 can be attached to the antenna unit 300 to easily form the RF tag 100.
  • the attachment unit 200 may be attached to the antenna unit 300 after forming the bag 900, but the bag 900 is usually formed.
  • the attachment portion 200 may be attached to a flat film before being cut. That is, the antenna portion 300 is formed at the free end portion of the film forming the bag 900 (at a position near the seal portion), and the attachment portion 200 is attached to the antenna portion 300.
  • the bag 900 may be formed from the film with this attachment. When the film is heat sealed, the antenna portion is formed at a position separated from the sealing portion, for example, at a position separated from the sealing portion to a degree in the range of 5 mm or more and 30 mm or less so that the attachment does not deteriorate Is desirable.
  • the antenna part 300 is applicable to the seal
  • the antenna portion 300 may be formed of silver, copper, gold, aluminum, tin, lead, iron, mercury, an alloy thereof, or the like.
  • an aluminum vapor deposition film is also formed on the outside at the time of manufacture, and printing is performed except for the antenna unit 300 to expose the antenna unit 300. Good.
  • the insulating layer is formed of the adhesive layer 400 in this embodiment, the present invention is not limited to this.
  • Other insulating materials such as expanded polystyrene, polyethylene, polyimide, thin foam (borer), etc. may be used.
  • An insulating layer such as foam or material may be provided.
  • the antenna part 300 was formed from the 1st area
  • the adhesive layer 400 becomes a capacitor to form a resonant circuit.
  • the RF tag 100 can transmit and receive with the reader.
  • the inductor pattern L is formed on the attachment portion 200, the impedance of the inductance can be made constant.
  • the inductance pattern may be determined by the circuit portion 211. it can.
  • the antenna unit 300 is a flat plate antenna, thinning of the RF tag 100 can be realized.
  • the antenna unit 300 can form an RF tag on a bag, a box, a film for wrapping a product, or a seal attached to a product, data communication can be reliably performed.
  • the RF tag 100 corresponds to an "RF tag”
  • the IC chip 500 corresponds to an "IC chip”
  • the inductor pattern L corresponds to an "inductor pattern”
  • the attachment unit 200 is an "inlet”.
  • the antenna unit 300 corresponds to an “antenna unit”
  • the circuit unit 211 corresponds to “a shape devoid of a part of an annular shape”
  • the adhesive layer 400 corresponds to an “insulating layer made of foam”.
  • the bag 900 corresponds to “any one of a bag, a box, a film for packaging a product, and a seal attached to a product”.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

[Problem] To provide an RF tag with which inductance can be made constant, and non-directional radio waves can be received by adhering a separable inlet to an antenna part. [Solution] In an RF tag 100, the following are separately formed: an attachment part 200 which comprises an IC chip 500 and an inductor pattern; and an antenna part 300 which is used for transmitting/receiving data transmitted from a reading device. The attachment part 200 is adhered to the antenna part 300 to form a capacitor with which communication with the reading device is performed.

Description

RFタグ用アンテナおよびRFタグRF tag antenna and RF tag
 本発明は、低背なRFタグ用アンテナおよびRFタグに関する。 The present invention relates to a low-profile RF tag antenna and an RF tag.
 例えば、特許文献1(特開2016-173747号公報)には、導電体や高誘電体に接触もしくは近接したときの通信性の低下を抑制でき、かつ薄型化と低コスト化を両立できるRFIDタグについて開示されている。 For example, in Patent Document 1 (Japanese Patent Application Laid-Open No. 2016-173747), an RFID tag that can suppress a decrease in communication performance when in contact with or in proximity to a conductor or a high dielectric, and can achieve both thinning and cost reduction Is disclosed.
 特許文献1記載のRFIDタグは、一の導電層を中間層として含む積層体と、積層体上に設けられたアンテナと、アンテナに接続されたICチップと、を備え、一の導電層は、括れ部を含む構造を少なくとも1つ有するものである。 The RFID tag described in Patent Document 1 includes a stacked body including one conductive layer as an intermediate layer, an antenna provided on the stacked body, and an IC chip connected to the antenna, and one conductive layer includes It has at least one structure including a neck portion.
 特許文献2(特開2016-58062号公報)には、半導体チップが割れるのを防止するRFIDタグについて開示されている。 Patent Document 2 (Japanese Patent Application Laid-Open No. 2016-58062) discloses an RFID tag that prevents a semiconductor chip from breaking.
 特許文献2記載のRFIDタグにおいては、基材と、基材の上に搭載された半導体チップと、半導体チップを覆うと共に、折り曲げたときにできる折り曲げ線が半導体チップから外れるように折り曲げ線の起点となる凹みを側部に備え、かつ、基材を補強する島状の補強材と、を有するものである。 In the RFID tag described in Patent Document 2, the base material, the semiconductor chip mounted on the base material, and the semiconductor chip are covered, and the folding line starting point of the folding line is released from the semiconductor chip when it is folded. And an island-like reinforcing material for reinforcing the base material.
 特許文献3(特開2014-222423号公報)には、交信距離の低下及び大型化を招くことなく、UHF帯での無線通信が可能なRFIDタグ付き包装体について開示されている。 Patent Document 3 (Japanese Patent Laid-Open No. 2014-222423) discloses a package with an RFID tag capable of performing wireless communication in the UHF band without causing a decrease in communication distance and an increase in size.
 特許文献3記載のRFIDタグ付き包装体においては、RFIDタグが取り付けられ、被包装物が封入される包装体を備えるRFIDタグ付き包装体において、包装体は、RFIDタグの通信用のアンテナとして機能する、スリットが形成された導電層を含むシートを有し、RFIDタグは、ICチップと、該ICチップの2つの電極に個別に接続された2つの導電部材と、を有し、2つの導電部材の一方は、少なくとも一部がスリットの幅方向に関してスリットの一側に位置するようにシートの表面に絶縁部材を介して取り付けられており、2つの導電部材の他方は、少なくとも一部がスリットの幅方向に関してスリットの他側に位置するようにシートの表面に絶縁部材を介して取り付けられており、包装体には、切断線が設けられ、切断線を含む仮想線に沿って切断されるとRFIDタグが通信不良になるものである。 In the RFID tag-equipped package described in Patent Document 3, the RFID tag-attached package including the package to which the RFID tag is attached and in which the package is enclosed, the package functions as an antenna for communication of the RFID tag. The RFID tag has an IC chip and two conductive members individually connected to two electrodes of the IC chip, and the two conductive One of the members is attached to the surface of the sheet via the insulating member so that at least a part thereof is located on one side of the slit with respect to the width direction of the slit, the other of the two conductive members is at least a part of the slit Is attached to the surface of the sheet via the insulating member so as to be located on the other side of the slit with respect to the width direction of the Once cut along the imaginary line including the line in which the RFID tag becomes poor communication.
 特許文献4(特開2008―107947号公報)には、外部にあるデータ読み書き装置との間で、非接触でデータの送受信を行うRFIDタグにおいて、RFIDタグをアルミ箔,金属蒸着フィルムからなる包材にRFIDタグを貼っても、大きな段ボール等に貼っても、誤作動しないRFIDタグについて開示されている。 Patent Document 4 (Japanese Patent Laid-Open No. 2008-107947) discloses an RFID tag that transmits and receives data without contact with an external data read / write device, the RFID tag being a package made of aluminum foil and a metal-deposited film. The RFID tag is disclosed that does not malfunction even if the RFID tag is attached to a material or attached to a large cardboard or the like.
 特許文献4記載のRFIDタグにおいては、外部にあるデータ読み書き装置との間で、非接触でデータの送受信を行うRFIDタグにおいて、支持体に少なくとも非接触でデータの送受信に用いるICチップとICチップにつながれた導線とが形成されたインレットと、送受信に用いるアンテナとが分離して形成され、インレットとアンテナとを貼着することによって、導線とアンテナとがコンデンサー結合でつながるものである。 In the RFID tag described in Patent Document 4, an RFID chip that transmits and receives data contactlessly with an external data read / write device, an IC chip and an IC chip used to transmit and receive data at least contactlessly with the support. The inlet formed with the conductive wire and the antenna used for transmission and reception are separately formed, and by adhering the inlet and the antenna, the conductive wire and the antenna are connected by capacitor coupling.
 特許文献5(特開2011-221838号公報)には、管理領域外においては通信を禁止できる無線通信用タグについて開示されている。 Patent Document 5 (Japanese Unexamined Patent Publication No. 2011-221838) discloses a wireless communication tag which can prohibit communication outside the management area.
 特許文献5記載の無線通信用タグにおいては、外部の通信装置との通信動作を行う半導体チップを有する無線通信用タグにおいて、半導体チップが搭載されるとともに、該半導体チップと電気的に接続された受電部を有するタグと、通信装置からの電波を受信するアンテナ部と、該アンテナ部と電気的に接続された給電部と、を有するとともに、タグと着脱可能な構成を備えたアンテナモジュールと、を備え、タグがアンテナモジュールと接続されたときに、受電部と給電部とが電気的に接続することにより、通信装置と通信可能な状態となるものである。 In the tag for wireless communication described in Patent Document 5, in the tag for wireless communication having a semiconductor chip performing a communication operation with an external communication device, the semiconductor chip is mounted and electrically connected to the semiconductor chip. An antenna module having a tag having a power receiving unit, an antenna unit for receiving radio waves from a communication device, and a feeding unit electrically connected to the antenna unit, and having a configuration that can be attached to and detached from the tag. When the tag is connected to the antenna module, the power reception unit and the power supply unit are electrically connected to be in a communicable state with the communication device.
 特許文献6(特開2012-70076号公報)には、ブースターアンテナを用いたRF-IDメディアにおいてブースターアンテナによる効果を十分に得るRF-IDメディアについて開示されている。 Patent Document 6 (Japanese Patent Application Laid-Open No. 2012-70076) discloses an RF-ID media which sufficiently achieves the effect of the booster antenna in the RF-ID media using the booster antenna.
 特許文献6記載のRF-IDメディアにおいては、外部からの電磁波によって電流が流れる第1のアンテナが形成された第1のベース基材上に、第2のベース基材上に第2のアンテナが形成されるとともに該第2のアンテナに接続されたICチップが搭載されてなるインレットが搭載され、第1のアンテナに流れた電流による電磁誘導によって第2のアンテナに電流が流れるRF-IDメディアにおいて、第2のアンテナは、外周端部がICチップに接続され、互いに同一方向に巻回されて内周端部が開放された渦巻き状の2つのアンテナ部からなり、第1のアンテナは、第1のベース基材上にインレットが搭載された場合に2つのアンテナ部間の領域を含む該2つのアンテナ部それぞれの外周部分に沿うまたは重なる領域に、2つのアンテナ部について渦巻き状における反対方向に電磁波による電流が流れる電流経路を有するものである。 In the RF-ID media described in Patent Document 6, a second antenna is formed on a second base substrate on a first base substrate on which a first antenna in which current flows by an electromagnetic wave from the outside is formed. In the RF-ID media on which an inlet formed is mounted and on which an IC chip connected to the second antenna is mounted, and the current flows to the second antenna by electromagnetic induction by the current flowing to the first antenna The second antenna consists of two spiral antenna parts whose outer peripheral end is connected to the IC chip and wound in the same direction and the inner peripheral end is opened, and the first antenna is When the inlet is mounted on one of the base substrates, two unequal regions are formed along the overlapping portion of the outer peripheral portion of each of the two antenna portions including the region between the two antenna portions. And has a current path in which a current flows by electromagnetic waves in the opposite direction of the spiral for na section.
 特許文献7(特開2008-117165号公報)には、RFIDタグを重ね合わせても、電波の干渉による読取不良を発生せず、重ね合わせるRFIDタグの間にスペーサが不要となる、RFIDタグについて開示されている。 Patent Document 7 (Japanese Patent Application Laid-Open No. 2008-117165) relates to an RFID tag in which even if the RFID tags are overlapped, a reading failure due to the interference of radio waves does not occur, and a spacer is not necessary between the RFID tags to be overlapped. It is disclosed.
 特許文献7記載の無線通信用タグにおいては、無線波により作動するICチップと、絶縁体のベース上に形成される金属膜層からなるアンテナと、を含んで構成されるICタグであって、アンテナは、インピーダンスマッチング用のスリット、及びICチップが搭載される1つの第1のアンテナおよび、ICチップが搭載されない少なくとも1つの第2のアンテナを含んでなり、第1のアンテナと少なくとも1つの第2のアンテナとを静電容量結合させたものである。 The wireless communication tag described in Patent Document 7 is an IC tag including an IC chip operated by a wireless wave and an antenna formed of a metal film layer formed on a base of an insulator, The antenna includes a slit for impedance matching, one first antenna on which the IC chip is mounted, and at least one second antenna on which the IC chip is not mounted, and the first antenna and the at least one first antenna The two antennas are capacitively coupled.
 特許文献8(特開2013-54751号公報)には、読み取り装置(または読み書き装置)との適正な通信が可能で、かつ容易に小型化が可能なRFID情報媒体について開示されている。 Patent Document 8 (Japanese Patent Application Laid-Open No. 2013-54751) discloses an RFID information medium capable of appropriate communication with a reading device (or reading and writing device) and easily miniaturized.
 特許文献8記載のRFID情報媒体においては、外部の読み取り装置と非接触でデータ通信を行うRFID情報媒体であって、絶縁部材を有する本体部と、本体部に設けられたアンテナ用部材と、本体部に設けられた導電体と、目視する見方によって色彩や画像が変化する光学変化デバイスと、を備え、導電体は導電性材料の層を有し、該導電性材料の層が、アンテナ用部材に部分的に、本体部の厚さ方向に重ねられており、光学変化デバイスが、導電性の反射層または導電性の透明層を備え、光学変化デバイスの反射層または透明層が、導電性材料の層と兼用されるものである。 The RFID information medium described in Patent Document 8 is an RFID information medium that performs data communication without contact with an external reader, and includes a main body having an insulating member, an antenna member provided in the main body, and a main body. And an optical change device whose color or image changes depending on visual observation, the conductor having a layer of a conductive material, the layer of the conductive material being a member for an antenna Partially overlapping in the thickness direction of the main body, the optical change device comprises a conductive reflective layer or a conductive transparent layer, and the reflective layer or transparent layer of the optical change device comprises a conductive material Is also used as a layer of
特開2016-173747号公報JP, 2016-173747, A 特開2016-58062号公報JP, 2016-58062, A 特開2014-222423号公報JP 2014-222423 A 特開2008―107947号公報JP, 2008-107947, A 特開2011-221838号公報JP 2011-221838 A 特開2012-70076号公報JP, 2012-70076, A 特開2008-117165号公報JP, 2008-117165, A 特開2013-54751号公報JP, 2013-54751, A
 以上の特許文献1乃至8においては、種々のRFタグが開発されているが、主に金属上に貼着した場合、動作しないという問題がある。当該問題をクリアした場合であっても、RFタグ形成において、インダクタンスを一定に保持することができないという問題が生じる。 Although various RF tags are developed in Patent Documents 1 to 8 described above, there is a problem that they do not operate mainly when they are stuck on metal. Even when the problem is cleared, there arises a problem that the inductance can not be kept constant in forming the RF tag.
 本発明の目的は、インダクタンスを一定にすることができ、分離可能なインレットをアンテナ部に貼着することで、無指向性の電波を受信可能なRFタグを提供することである。 An object of the present invention is to provide an RF tag capable of receiving an omnidirectional radio wave by making an inductance constant and attaching a separable inlet to an antenna unit.
(1)
 一局面に従うRFタグは、ICチップおよびインダクタパターンを含むインレットと、読取装置から送信されたデータの送受信に用いるアンテナ部と、が分離して形成され、アンテナ部にインレットが貼着されることにより、コンデンサが形成され読取装置と通信を行うものである。
(1)
In the RF tag according to one aspect, the inlet including the IC chip and the inductor pattern and the antenna unit used to transmit and receive data transmitted from the reader are separately formed, and the inlet is attached to the antenna unit. And a capacitor is formed to communicate with the reader.
 この場合、インレットと、アンテナ部とを貼着することにより、貼着部材がコンデンサとなり、共振回路を形成する。その結果、RFタグとして送受信を行うことができる。
 また、インレットにインダクタパターンを形成しているので、インダクタンスのインピーダンスを一定にすることができる。
In this case, by sticking the inlet and the antenna unit, the sticking member becomes a capacitor and forms a resonant circuit. As a result, transmission and reception can be performed as an RF tag.
Further, since the inductor pattern is formed on the inlet, the impedance of the inductance can be made constant.
(2)
 第2の発明にかかるRFタグは、一局面に従うRFタグにおいて、インレットは、環状形状の回路部のうち一部を欠いた形状からなり、当該一部を欠いた回路部の両端にICチップが架け渡されるよう配設されてもよい。
(2)
In the RF tag according to the second aspect of the present invention, in the RF tag according to one aspect, the inlet has a shape lacking a part of the annular circuit part, and IC chips are provided at both ends of the part lacking the part. It may be arranged to be bridged.
 この場合、環状形状のうち一部を欠いた形状からなり、当該一部を欠いた回路部の両端にICチップが架け渡されるよう配設するので、インダクタンスパターンを環状形状により決定することができる。 In this case, since the IC chip is disposed so as to be bridged over the both ends of the circuit portion lacking the part of the annular shape, the inductance pattern can be determined by the annular shape. .
(3)
 第3の発明にかかるRFタグは、一局面または第2の発明にかかるRFタグにおいて、インレットと、アンテナ部との間に発泡体からなる絶縁層が設けられてもよい。
(3)
In the RF tag according to the third aspect of the present invention, in the RF tag according to the one aspect or the second aspect, an insulating layer made of foam may be provided between the inlet and the antenna portion.
 この場合、インレットとアンテナ部との間に、発泡体からなる絶縁層を設けることにより、コンデンサ容量を決定することができる。特に、発泡体からなる絶縁層の厚みを0.5mm以上3mm以下とすることで、RFタグの感度を向上させることができる。 In this case, the capacitor capacity can be determined by providing an insulating layer made of foam between the inlet and the antenna portion. In particular, by setting the thickness of the insulating layer made of foam to 0.5 mm or more and 3 mm or less, the sensitivity of the RF tag can be improved.
(4)
 第4の発明にかかるRFタグは、一局面から第3の発明にかかるRFタグのいずれかにおいて、アンテナ部の一部は、インレットの環状形状の回路部うち一部を欠いた形状と重畳可能な形状からなってもよい。
(4)
In the RF tag according to the fourth aspect of the present invention, in any of the RF tags according to the first aspect to the third aspect, a part of the antenna portion can be overlapped with a shape in which a part of the annular circuit portion of the inlet is missing. It may be of any shape.
 この場合、アンテナ部の一部が、インレットの環状形状と重畳可能であるので、効率よくRFタグを形成することができる。 In this case, since a part of the antenna portion can be overlapped with the annular shape of the inlet, the RF tag can be efficiently formed.
(5)
 第5の発明にかかるRFタグは、一局面から第4の発明にかかるRFタグのいずれかにおいて、アンテナ部は、平板アンテナからなってもよい。
(5)
In the RF tag according to the fifth aspect of the present invention, in any of the RF tags according to the first aspect to the fourth aspect, the antenna unit may be a flat plate antenna.
 この場合、アンテナ部は、平板アンテナからなるので、RFタグの薄膜化を実現することができる。 In this case, since the antenna unit is formed of a flat plate antenna, thinning of the RF tag can be realized.
(6)
 第6の発明にかかるRFタグは、一局面から第5の発明にかかるRFタグのいずれかにおいて、アンテナ部の幅は、インダクタパターンの幅に対して比率が〇以上〇以下であってもよい。
(6)
In the RF tag according to the sixth aspect of the present invention, in any of the RF tags according to the first aspect to the fifth aspect, the width of the antenna unit may have a ratio of 〇 to 〇 with respect to the width of the inductor pattern. .
 この場合、アンテナ部の幅は、インダクタパターンの幅に対して比率が〇以上〇以下であるので、インレットをアンテナ部に貼着する場合にずれを吸収することができる。 In this case, since the ratio of the width of the antenna unit to the width of the inductor pattern is 〇 or 〇, the shift can be absorbed when the inlet is attached to the antenna unit.
(7)
 第7の発明にかかるRFタグは、一局面から第6の発明にかかるRFタグのいずれかにおいて、コンデンサの静電容量は、2PF以上3PF以下の範囲内であってもよい。
(7)
In the RF tag according to the seventh invention, in any of the RF tags according to the one aspect to the sixth invention, the capacitance of the capacitor may be in the range of 2 PF or more and 3 PF or less.
 この場合、安定して接続を行うことができる。例えば、インレットと、アンテナ部とを張り付けた場合の接触容量は、ポリエチレンテレフタレート(PET厚み60μm)の場合、1cm平方で20PFの結合容量が得られる。そのため、900MHzで使用する場合、インレットが直列接続されるためのコンデンサの静電容量は、2PF以上あった方が安定して接合することができる。
 なお、望ましくは、1PF以上3PF以下の範囲内であることが望ましく、1.5PF以上2PF以下の範囲内であることがより望ましい。
In this case, stable connection can be made. For example, in the case of polyethylene terephthalate (PET thickness 60 μm), a contact capacity of 20 PF can be obtained in a 1 cm square when the inlet and the antenna unit are attached. Therefore, in the case of using at 900 MHz, when the capacitance of the capacitor for connecting the inlets in series is 2 PF or more, it can be stably joined.
In addition, desirably, it is desirable to be within the range of 1 PF or more and 3 PF or less, and more desirably within the range of 1.5 PF or more and 2 PF or less.
(7)
 第7の発明にかかるRFタグは、一局面から第6の発明にかかるRFタグのいずれかにおいて、アンテナ部は、袋、箱、商品を包装するフィルム、商品に貼着されるシールのいずれかに形成されてもよい。
(7)
The RF tag according to the seventh invention is any of the RF tags according to the first aspect to the sixth invention, wherein the antenna unit is any of a bag, a box, a film for wrapping a product, and a seal attached to a product. May be formed.
 この場合、アンテナ部は、袋、箱、商品を包装するフィルム、商品に貼着されるシールにRFタグを形成することができるので、確実にデータ通信を行うことができる。 In this case, the antenna unit can form an RF tag on a bag, a box, a film for packaging a product, and a seal attached to the product, so that data communication can be reliably performed.
本実施の形態にかかるRFタグの平面の一例を示す模式図である。It is a schematic diagram which shows an example of the plane of RF tag concerning this Embodiment. 本実施の形態にかかるRFタグのアタッチメント部の一例を示す模式的平面図である。It is a schematic plan view which shows an example of the attachment part of RF tag concerning this Embodiment. RFタグのアンテナ部の一例を示す模式的平面図である。It is a schematic plan view which shows an example of the antenna part of RF tag. 図3のRFタグのA-A断面の一例を示す模式図である。FIG. 4 is a schematic view showing an example of an AA cross section of the RF tag of FIG. 3; 図3のRFタグの等価回路の一例を示す図である。It is a figure which shows an example of the equivalent circuit of RF tag of FIG. アタッチメント部およびアンテナ部を貼着する他の例を示すRFタグである。It is a RF tag which shows the other example which sticks an attachment part and an antenna part. アンテナ部の他の例を示す模式図である。It is a schematic diagram which shows the other example of an antenna part. アンテナ部の他の例を示す模式図である。It is a schematic diagram which shows the other example of an antenna part. アンテナ部の他の例を示す模式図である。It is a schematic diagram which shows the other example of an antenna part. アンテナ部にアタッチメント部を貼着したRFタグを示す図である。It is a figure which shows the RF tag which stuck the attachment part to the antenna part. アンテナ部の他の例を示す模式図である。It is a schematic diagram which shows the other example of an antenna part. アンテナ部にアタッチメント部を貼着したRFタグを示す図である。It is a figure which shows the RF tag which stuck the attachment part to the antenna part. アンテナ部の他の例を示す模式図である。It is a schematic diagram which shows the other example of an antenna part. アンテナ部にアタッチメント部を貼着したRFタグを示す図である。It is a figure which shows the RF tag which stuck the attachment part to the antenna part. アンテナ部の他の例を示す模式図である。It is a schematic diagram which shows the other example of an antenna part. アンテナ部にアタッチメント部を貼着したRFタグを示す図である。It is a figure which shows the RF tag which stuck the attachment part to the antenna part. RFタグの使用の一例を示す模式図である。It is a schematic diagram which shows an example of use of RF tag.
 以下、図面を参照しつつ、本発明の実施の形態について説明する。以下の説明では、同一の部品には同一の符号を付す。また、同符号の場合には、それらの名称および機能も同一である。したがって、それらについての詳細な説明は繰り返さないものとする。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same components are denoted by the same reference numerals. Moreover, in the case of the same sign, their names and functions are also the same. Therefore, detailed description about them shall not be repeated.
[本実施の形態]
 図1は、本実施の形態にかかるRFタグ100の平面の一例を示す模式図である。図2は、RFタグ100のアタッチメント部200の一例を示す模式的平面図であり、図3は、RFタグ100のアンテナ部300の一例を示す模式的平面図である。図4は、図3のRFタグ100のA-A断面の一例を示す模式図である。
This Embodiment
FIG. 1 is a schematic view showing an example of a plane of an RF tag 100 according to the present embodiment. FIG. 2 is a schematic plan view showing an example of the attachment unit 200 of the RF tag 100, and FIG. 3 is a schematic plan view showing an example of the antenna unit 300 of the RF tag 100. As shown in FIG. FIG. 4 is a schematic view showing an example of an AA cross section of the RF tag 100 of FIG.
(RFタグ100)
 図1に示すように、RFタグ100は、主にアタッチメント部200およびアンテナ部300からなる。
 また、アタッチメント部200は、アンテナ部300と別部材で形成される。アタッチメント部200を、粘着層400(図4参照)によりアンテナ部300へ貼着することにより、RFタグ100が形成される。
(RF tag 100)
As shown in FIG. 1, the RF tag 100 mainly includes an attachment unit 200 and an antenna unit 300.
In addition, the attachment unit 200 is formed of a separate member from the antenna unit 300. The RF tag 100 is formed by sticking the attachment unit 200 to the antenna unit 300 with the adhesive layer 400 (see FIG. 4).
(アンテナ部300)
 図3に示すように、アンテナ部300は、導電性を有する部材からなる。アンテナ部300は、第1領域310、第2領域320および第3領域330からなる。第1領域310および第3領域330は、長手方向を有する矩形状からなり、ほぼ同形状からなる。第1領域310および第3領域330は並行に配置される。第2部材320は、第1領域310および第3領域330の端部を連通するように、形成される。
(Antenna unit 300)
As shown in FIG. 3, the antenna unit 300 is made of a conductive member. The antenna unit 300 includes a first area 310, a second area 320 and a third area 330. The first region 310 and the third region 330 have a rectangular shape having a longitudinal direction, and have substantially the same shape. The first area 310 and the third area 330 are arranged in parallel. The second member 320 is formed to communicate the ends of the first area 310 and the third area 330.
 本実施の形態においては、第1領域310および第3領域330の幅は、T1からなり、第2領域320の幅は、T2からなる。 In the present embodiment, the width of the first area 310 and the third area 330 is T1, and the width of the second area 320 is T2.
 また、本実施の形態において、アンテナ部300の第1領域310、第2領域320および第3領域330は、アルミニウムの金属薄膜からなる。一般的に本実施の形態における薄膜は3μm以上35μm以下の厚みから形成される。
 アンテナ部300は、エッチングまたはパターン印刷等の手法によって形成される。
Furthermore, in the present embodiment, the first region 310, the second region 320, and the third region 330 of the antenna unit 300 are made of a metal thin film of aluminum. Generally, the thin film in the present embodiment is formed to have a thickness of 3 μm to 35 μm.
The antenna unit 300 is formed by a method such as etching or pattern printing.
(アタッチメント部200)
 図2に示すように、アタッチメント部200は、ICチップ500およびインダクタパターンLを形成する回路210を含む。
 回路210は、略環状形状の回路部211の一部を切欠いた切り欠き部を有する形状からなる。すなわち、具体的には、アルファベット文字のC形状からなる。
 回路部211は、辺211a、辺211b、辺211c、辺211dおよび辺211eから形成される。
 なお、回路210は、回路部211の一部を切欠く場合について説明したが、これに限定されず、絶縁部を形成してもよい。
(Attachment unit 200)
As shown in FIG. 2, the attachment unit 200 includes an IC chip 500 and a circuit 210 that forms an inductor pattern L.
The circuit 210 has a shape having a cutaway portion in which a part of the substantially annular circuit portion 211 is cut out. That is, specifically, it consists of C shape of an alphabet character.
The circuit unit 211 is formed of a side 211 a, a side 211 b, a side 211 c, a side 211 d, and a side 211 e.
Although the circuit 210 has been described in the case where a part of the circuit portion 211 is cut out, the present invention is not limited to this and an insulating portion may be formed.
 本実施の形態において、回路210は、アルミニウムの金属薄膜からなる。一般的に本実施の形態における薄膜は3μm以上35μm以下の厚みから形成される。
 回路210は、エッチングまたはパターン印刷等の手法によって形成される。
In the present embodiment, the circuit 210 is made of a metal thin film of aluminum. Generally, the thin film in the present embodiment is formed to have a thickness of 3 μm to 35 μm.
The circuit 210 is formed by a technique such as etching or pattern printing.
 また、アタッチメント部200の回路210の切り欠き部を架け渡すように、ICチップ500が設けられる。
 本実施の形態においては、アタッチメント部200においては、回路部211の内部面積Sにより、インダクタパターンLのインピーダンスを一定にすることができる。
In addition, an IC chip 500 is provided to bridge the cutaway portion of the circuit 210 of the attachment unit 200.
In the present embodiment, in the attachment unit 200, the impedance of the inductor pattern L can be made constant due to the internal area S of the circuit unit 211.
 ICチップ500は、RFタグ100のアンテナ部300が受信した読取装置の電波に基づいて動作する。
 具体的に本実施の形態にかかるICチップ500は、まず、読取装置から送信される搬送波の一部を整流して、ICチップ500自身が動作するために必要な電源電圧を生成する。そして、ICチップ500は、生成した電源電圧によって、ICチップ500内の制御用の論理回路、商品の固有情報等が格納された不揮発性メモリを動作させる。
The IC chip 500 operates based on the radio wave of the reading device received by the antenna unit 300 of the RF tag 100.
Specifically, the IC chip 500 according to the present embodiment first rectifies a part of the carrier wave transmitted from the reader to generate a power supply voltage necessary for the IC chip 500 itself to operate. Then, the IC chip 500 operates the non-volatile memory in which the control logic circuit in the IC chip 500, the unique information of the product, and the like are stored by the generated power supply voltage.
 また、ICチップ500は、読取装置との間でデータの送受信を行うための通信回路等を動作させる。
また、アタッチメント部200における粘着層400を設けない部位、例えば、粘着層400を設ける面と逆側の面については、シート部材を設けてもよい。
In addition, the IC chip 500 operates a communication circuit and the like for transmitting and receiving data to and from the reader.
In addition, a sheet member may be provided on a portion of the attachment unit 200 where the adhesive layer 400 is not provided, for example, the surface opposite to the surface on which the adhesive layer 400 is provided.
 シート部材は、主にポリエチレンテレフタレート、ポリイミド、ポリ塩化ビニル等の絶縁性のある素材または樹脂を1種または複数種、他の絶縁被膜処理を用いてもよい。
 その結果、アタッチメント部200を保護することができる。シート部材は、数マイクロメートル以上数百マイクロメートル以下の厚みであることが好ましく、数十マイクロメートル程度の厚みであることがより好ましい。
As the sheet member, one or more insulating materials or resins such as polyethylene terephthalate, polyimide, polyvinyl chloride, etc. may be used mainly, and other insulating film processing may be used.
As a result, the attachment unit 200 can be protected. The thickness of the sheet member is preferably several micrometers or more and several hundred micrometers or less, and more preferably several tens micrometers or so.
 また、上述したように、アンテナ部300に対して粘着層400を介してアタッチメント部200が貼着される(図4参照)。粘着層400を挟持させることにより、コンデンサ(静電容量、キャパシタンス)が形成される。 Further, as described above, the attachment unit 200 is attached to the antenna unit 300 via the adhesive layer 400 (see FIG. 4). By holding the adhesive layer 400, a capacitor (capacitance, capacitance) is formed.
(粘着層400)
 図1に示す本実施の形態における接着層400は、両面テープからなる。接着層400は、アタッチメント部200に設けられる。
 なお、本実施の形態においては、接着層400が両面テープからなることとしているが、これに限定されず、他の接着層の形成または接着剤の塗布等であってもよい。また、両面テープは、アタッチメント部200の回路部211の全面でなく、一部であってもよい。
 本実施の形態において、両面テープを例示したのは、後述するように、RFタグ100のアタッチメント部200は、アンテナ部300に貼着されるため、両面テープの剥離紙を、はがすことにより容易に貼着が可能だからである。
(Adhesive layer 400)
Adhesive layer 400 in the present embodiment shown in FIG. 1 is made of double-sided tape. The adhesive layer 400 is provided on the attachment portion 200.
In the present embodiment, the adhesive layer 400 is made of a double-sided tape. However, the present invention is not limited to this, and other adhesive layers may be formed or an adhesive may be applied. Also, the double-sided tape may be a part of the entire surface of the circuit unit 211 of the attachment unit 200 instead of the entire surface.
In the present embodiment, the double-sided adhesive tape is exemplified because the attachment unit 200 of the RF tag 100 is attached to the antenna unit 300 as described later, so the peeling sheet of the double-sided adhesive tape can be easily peeled off. It is because sticking is possible.
 また、本実施の形態においては、アンテナ部300の第1領域310の幅T1は、アタッチメント部200の回路部211の幅T211の1倍以上4倍以下で形成されることが望ましい。
 また、アンテナ部300の第2領域320の幅T2は、アタッチメント部200の回路部211の幅T212の1倍以上4倍以下で形成されることが望ましい。
 また、アタッチメント部200の回路部211の幅T213は、アタッチメント部200の回路部211の幅T212の1倍以上4倍以下で形成されることが望ましい。
Further, in the present embodiment, it is desirable that the width T1 of the first region 310 of the antenna unit 300 be formed at least one time and at most four times the width T211 of the circuit unit 211 of the attachment unit 200.
Further, it is desirable that the width T2 of the second region 320 of the antenna unit 300 be formed to be 1 to 4 times the width T212 of the circuit unit 211 of the attachment unit 200.
Further, the width T 213 of the circuit portion 211 of the attachment portion 200 is desirably formed to be 1 to 4 times the width T 212 of the circuit portion 211 of the attachment portion 200.
(等価回路)
 また、図5は、図3のRFタグ100の等価回路の一例を示す図である。
 図5に示すように、RFタグ100の等価回路は、インダクタパターンLと、コンデンサCと、ICチップ500とからなる。インダクタパターンL、コンデンサCおよびICチップ500は、読取装置から送信される電波の周波数帯域で共振する共振回路を構成する。
 この共振回路の共振周波数f[Hz]は、式(1)により与えられる。共振周波数fの値は、読取装置から送信される電波の周波数帯域に含まれるように設定される。
(Equivalent circuit)
5 is a view showing an example of an equivalent circuit of the RF tag 100 of FIG.
As shown in FIG. 5, the equivalent circuit of the RF tag 100 includes an inductor pattern L, a capacitor C, and an IC chip 500. The inductor pattern L, the capacitor C, and the IC chip 500 constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.
The resonant frequency f [Hz] of this resonant circuit is given by equation (1). The value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
Figure JPOXMLDOC01-appb-M000001
Figure JPOXMLDOC01-appb-M000001
式(1)において、L:インダクタパターンLのインダクタンス、C:コンデンサCの静電容量、C:ICチップ500内部の等価容量を意味する。 In the formula (1), L a: inductor pattern L of the inductance, C a: the capacitance of the capacitor C, C b: mean the equivalent capacitance of the IC chip 500.
ここで、ICチップ500には、内部にコンデンサを含むものがあり、また、ICチップ500は浮遊容量を有する。そのため、共振回路の共振周波数fを設定する場合、ICチップ500内部の等価容量Cを考慮することが好ましい。
 すなわち、共振回路は、インダクタパターンLのインダクタンス、コンデンサ240の静電容量、およびICチップ500の内部の等価容量Cを考慮して設定された共振周波数fを有することが好ましい。なお、Cとしては、例えば、使用するICチップの仕様諸元の一つとして公表されている静電容量値を用いることができる。
Here, some IC chips 500 include a capacitor inside, and the IC chip 500 has a floating capacitance. Therefore, when setting the resonance frequency f of the resonant circuit, it is preferable to consider the equivalent capacitance C b of the IC chip 500.
That is, the resonant circuit, the inductance of the inductor pattern L, and preferably having a capacitance, and the IC chip 500 inside the equivalent capacitance C b was considered set resonant frequency f of the capacitor 240. As C b , for example, a capacitance value published as one of specification specifications of an IC chip to be used can be used.
 上記のように、ICチップ500内部の等価容量Cを考慮することで、共振回路の共振周波数fを、電波の周波数帯域に精度良く設定することができる。その結果、RFタグ100の読み取り性能をさらに向上させることができる。また、ICチップ500が生成する電源電圧をさらに高くすることができる。 As described above, by considering the equivalent capacitance C b of the IC chip 500, the resonance frequency f of the resonant circuit, it is possible to accurately set the radio frequency band. As a result, the reading performance of the RF tag 100 can be further improved. Further, the power supply voltage generated by the IC chip 500 can be further increased.
(RFタグ100の他の例)
 図6は、アタッチメント部200およびアンテナ部300を貼着する他の例を示すRFタグ100aである。
(Another example of the RF tag 100)
FIG. 6 is an RF tag 100 a showing another example of attaching the attachment unit 200 and the antenna unit 300.
 図6に示すように、図3で示したRFタグ100の貼着状態に対して180度回転させた状態で貼着させてもよい。 As shown in FIG. 6, it may be adhered in a state where it is rotated 180 degrees with respect to the adhered state of the RF tag 100 shown in FIG.
(アンテナ部300の他の例)
 図7は、アンテナ部300の他の例を示す模式図である。
(Another example of the antenna unit 300)
FIG. 7 is a schematic view showing another example of the antenna unit 300. As shown in FIG.
 図7に示すように、アンテナ部300bは、第1領域310の代わりに第1領域310bを有する。また、第2領域320および第3領域330によりアルファベットのLの文字形状を形成し、第1領域310bの端部と、第3領域330との間を第4領域340により接続する。 As shown in FIG. 7, the antenna unit 300 b has a first area 310 b instead of the first area 310. Further, the letter L shape of the alphabet is formed by the second area 320 and the third area 330, and the end of the first area 310b and the third area 330 are connected by the fourth area 340.
(アンテナ部300の他の例)
 図8は、アンテナ部300の他の例を示す模式図である。図8に示すアンテナ部300cは、L型アンテナの一例である。
(Another example of the antenna unit 300)
FIG. 8 is a schematic view showing another example of the antenna unit 300. As shown in FIG. The antenna unit 300c illustrated in FIG. 8 is an example of an L-shaped antenna.
 図8に示すように、アンテナ部300cは、アンテナ部300の第2領域320の代わりに第4領域340を有する。
 アンテナ部300cは、第1領域310および第3領域330との間を第4領域340により接続する。
As shown in FIG. 8, the antenna unit 300 c has a fourth region 340 instead of the second region 320 of the antenna unit 300.
The antenna unit 300 c connects the first region 310 and the third region 330 by the fourth region 340.
(アンテナ部300の他の例)
 図9は、アンテナ部300の他の例を示す模式図であり、図10は図9のアンテナ部300dにアタッチメント部200を貼着したRFタグ100を示す図である。図9に示すアンテナ部300dはループ型アンテナ、折り返し型アンテナの一例である。
(Another example of the antenna unit 300)
FIG. 9 is a schematic view showing another example of the antenna unit 300, and FIG. 10 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300d of FIG. The antenna unit 300 d illustrated in FIG. 9 is an example of a loop antenna or a folded antenna.
 図9に示すように、アンテナ部300dは、アンテナ部300の第1領域310、第2領域320、第3領域330、第5領域350および領域361、362、363を有する。
 図10に示すように、領域361、362、363にアタッチメント部200が貼着される。
As shown in FIG. 9, the antenna unit 300 d includes a first region 310, a second region 320, a third region 330, a fifth region 350, and regions 361, 362, and 363 of the antenna unit 300.
As shown in FIG. 10, the attachment unit 200 is attached to the regions 361, 362, and 363.
(アンテナ部300の他の例)
 図11は、アンテナ部300の他の例を示す模式図であり、図12は図11のアンテナ部300eにアタッチメント部200を貼着したRFタグ100を示す図である。図11に示すアンテナ部300eはダイポール型アンテナの一例である。
(Another example of the antenna unit 300)
FIG. 11 is a schematic view showing another example of the antenna unit 300, and FIG. 12 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300e of FIG. The antenna unit 300 e illustrated in FIG. 11 is an example of a dipole antenna.
 図11に示すように、アンテナ部300eは、アンテナ部300の第1領域310、第3領域330および領域371、372を有する。
 図12に示すように、領域371、372、第3領域330にアタッチメント部200が貼着される。
As shown in FIG. 11, the antenna unit 300 e has a first area 310, a third area 330, and areas 371 and 372 of the antenna unit 300.
As shown in FIG. 12, the attachment unit 200 is attached to the areas 371 and 372 and the third area 330.
(アンテナ部300の他の例)
 図13は、アンテナ部300の他の例を示す模式図であり、図14は図13のアンテナ部300fにアタッチメント部200を貼着したRFタグ100を示す図である。図13に示すアンテナ部300fは分岐給電伝送線路型アンテナ(SHUNT FED ANTENNA)の一例である。
(Another example of the antenna unit 300)
FIG. 13 is a schematic view showing another example of the antenna unit 300, and FIG. 14 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300f of FIG. The antenna unit 300 f illustrated in FIG. 13 is an example of a branch feed transmission line type antenna (SHUNT FED ANTENNA).
 図13に示すように、アンテナ部300fは、アンテナ部300の第1領域310、第2領域320、第3領域330および第5領域350を有する。
 図14に示すように、第1領域310の一部、第3領域の一部、第2領域320にアタッチメント部200が貼着される。
As shown in FIG. 13, the antenna unit 300 f has a first area 310, a second area 320, a third area 330, and a fifth area 350 of the antenna unit 300.
As shown in FIG. 14, the attachment unit 200 is attached to a part of the first area 310, a part of the third area, and the second area 320.
(アンテナ部300の他の例)
 図15は、アンテナ部300の他の例を示す模式図であり、図16は図15のアンテナ部300gにアタッチメント部200を貼着したRFタグ100を示す図である。図15に示すアンテナ部300gはモノポール型アンテナの一例である。
(Another example of the antenna unit 300)
FIG. 15 is a schematic view showing another example of the antenna unit 300, and FIG. 16 is a view showing the RF tag 100 in which the attachment unit 200 is attached to the antenna unit 300g of FIG. The antenna unit 300g illustrated in FIG. 15 is an example of a monopole antenna.
 図15に示すように、アンテナ部300gは、アンテナ部300の第1領域310、第2領域320、第3領域330および第6領域380を有する。
 図16に示すように、第1領域310の一部、第3領域の一部、第2領域320にアタッチメント部200が貼着される。
As shown in FIG. 15, the antenna unit 300 g has a first area 310, a second area 320, a third area 330, and a sixth area 380 of the antenna unit 300.
As shown in FIG. 16, the attachment unit 200 is attached to a part of the first area 310, a part of the third area, and the second area 320.
(RFタグ100の使用例)
 図17は、RFタグ100の使用の一例を示す模式図である。
(Example of using RF tag 100)
FIG. 17 is a schematic view showing an example of use of the RF tag 100. As shown in FIG.
 図17に示すように、アンテナ部300は、袋900の包装に形成されてもよい。特に、アルミ蒸着フィルムを利用して、アンテナ部300を形成してもよく、さらに、フィルムの外層にアルミ蒸着を追加し、アンテナ部300を形成してもよい。その結果、アルミ蒸着フィルム部分をアンテナとして利用することができる。
 当然のことながら、図17に示すように、アンテナ部300にアタッチメント部200を貼着させて容易にRFタグ100を形成することができる。
As shown in FIG. 17, the antenna unit 300 may be formed in the package of the bag 900. In particular, the antenna unit 300 may be formed by using an aluminum vapor deposition film, and the aluminum vapor deposition may be added to the outer layer of the film to form the antenna unit 300. As a result, the aluminum deposited film portion can be used as an antenna.
As a matter of course, as shown in FIG. 17, the attachment unit 200 can be attached to the antenna unit 300 to easily form the RF tag 100.
 アンテナ部300にアタッチメント部200を貼着させてRFタグ100を形成するには、袋900の形成した後にそのアンテナ部300にアタッチメント部200を貼着させてもよいが、通常は袋900を形成する前の状態の平坦なフィルムにアタッチメント部200を貼着させてもよい。
 すなわち、袋900を形成するフィルムの遊端部に(シール部の近傍位置に)アンテナ部300を形成しておき、アンテナ部300にアタッチメント部200を、絶縁層を有する接着剤または両面粘着テープなどで貼着させた後、このアタッチメント付きのフィルムから袋900を形成してもよい。フィルムをヒートシールする場合には、シールする際の熱でアタッチメントが劣化しないようシール部から離間した位置、例えば、5mm以上30mm以下の範囲の程度シール部から離した位置にアンテナ部を形成しておくことが望ましい。
In order to attach the attachment unit 200 to the antenna unit 300 to form the RF tag 100, the attachment unit 200 may be attached to the antenna unit 300 after forming the bag 900, but the bag 900 is usually formed. The attachment portion 200 may be attached to a flat film before being cut.
That is, the antenna portion 300 is formed at the free end portion of the film forming the bag 900 (at a position near the seal portion), and the attachment portion 200 is attached to the antenna portion 300. The bag 900 may be formed from the film with this attachment. When the film is heat sealed, the antenna portion is formed at a position separated from the sealing portion, for example, at a position separated from the sealing portion to a degree in the range of 5 mm or more and 30 mm or less so that the attachment does not deteriorate Is desirable.
 なお、本実施の形態においては、アルミ蒸着フィルムを例示したが、これに限定されず、アンテナ部300は、袋、箱、商品に貼着されるシール等に適用することができる。
 具体的には、銀、銅、金、アルミニウム、スズ、鉛、鉄、水銀、それらの合金等によりアンテナ部300を形成してしてもよい。
 さらに、袋、箱、商品に貼着されるシール等においては、製造時にアルミ蒸着フィルムを外側にも形成し、アンテナ部300以外を印刷処理等し、アンテナ部300を露出させて形成してもよい。
In addition, although the aluminum vapor deposition film was illustrated in this Embodiment, it is not limited to this, The antenna part 300 is applicable to the seal | sticker etc. which are stuck on a bag, a box, goods.
Specifically, the antenna portion 300 may be formed of silver, copper, gold, aluminum, tin, lead, iron, mercury, an alloy thereof, or the like.
Furthermore, in the case of a seal attached to a bag, a box, or a product, an aluminum vapor deposition film is also formed on the outside at the time of manufacture, and printing is performed except for the antenna unit 300 to expose the antenna unit 300. Good.
 なお、本実施の形態においては、絶縁層を粘着層400により形成しているが、これに限定されず、発泡スチロール、ポリエチレン、ポリイミド、薄物発泡体(ボラ―ラ)等、絶縁性を有する他の発泡体または素材等の絶縁層を設けてもよい。 Although the insulating layer is formed of the adhesive layer 400 in this embodiment, the present invention is not limited to this. Other insulating materials such as expanded polystyrene, polyethylene, polyimide, thin foam (borer), etc. may be used. An insulating layer such as foam or material may be provided.
 なお、アンテナ部300は、互いに平行な第1領域310および第3領域330と、第1領域310および第3領域330の端部同士を連続させる第2領域320とから形成したが、第1領域310および第3領域330は非平行であってもよい。 In addition, although the antenna part 300 was formed from the 1st area | region 310 and the 3rd area | region 330 which were parallel mutually, and the 2nd area | region 320 which makes the edge parts of the 1st area | region 310 and the 3rd area 330 continue. 310 and the third region 330 may be non-parallel.
 以上のように、本実施の形態にかかるRFタグ100においては、アタッチメント部200と、アンテナ部300とを貼着することにより、粘着層400がコンデンサとなり、共振回路を形成する。その結果、RFタグ100として読取装置と送受信を行うことができる。
 また、アタッチメント部200にインダクタパターンLを形成しているので、インダクタンスのインピーダンスを一定にすることができる。
As described above, in the RF tag 100 according to the present embodiment, by adhering the attachment unit 200 and the antenna unit 300, the adhesive layer 400 becomes a capacitor to form a resonant circuit. As a result, the RF tag 100 can transmit and receive with the reader.
Further, since the inductor pattern L is formed on the attachment portion 200, the impedance of the inductance can be made constant.
 また、回路部211のうち一部を欠いた形状からなり、当該一部を欠いた形状の両端にICチップ500が架け渡されるよう配設するので、インダクタンスパターンを回路部211により決定することができる。
 また、アンテナ部300は、平板アンテナからなるので、RFタグ100の薄膜化を実現することができる。特に、アンテナ部300は、袋、箱、商品を包装するフィルム、商品に貼着されるシールにRFタグを形成することができるので、確実にデータ通信を行うことができる。
In addition, since the IC chip 500 is disposed so as to be bridged over the both ends of the circuit portion 211 which is partially devoid of the circuit portion 211, the inductance pattern may be determined by the circuit portion 211. it can.
In addition, since the antenna unit 300 is a flat plate antenna, thinning of the RF tag 100 can be realized. In particular, since the antenna unit 300 can form an RF tag on a bag, a box, a film for wrapping a product, or a seal attached to a product, data communication can be reliably performed.
 本発明においては、RFタグ100が、「RFタグ」に相当し、ICチップ500が「ICチップ」に相当し、インダクタパターンLが「インダクタパターン」に相当し、アタッチメント部200が、「インレット」に相当し、アンテナ部300が「アンテナ部」に相当し、回路部211が、「環状形状のうち一部を欠いた形状」に相当し、粘着層400が「発泡体からなる絶縁層」に相当し、袋900が「袋、箱、商品を包装するフィルム、商品に貼着されるシールのいずれか」に相当する。 In the present invention, the RF tag 100 corresponds to an "RF tag", the IC chip 500 corresponds to an "IC chip", the inductor pattern L corresponds to an "inductor pattern", and the attachment unit 200 is an "inlet". The antenna unit 300 corresponds to an “antenna unit”, the circuit unit 211 corresponds to “a shape devoid of a part of an annular shape”, and the adhesive layer 400 corresponds to an “insulating layer made of foam”. Correspondingly, the bag 900 corresponds to “any one of a bag, a box, a film for packaging a product, and a seal attached to a product”.
 本発明の好ましい一実施の形態は上記の通りであるが、本発明はそれだけに制限されない。本発明の精神と範囲から逸脱することのない様々な実施形態が他になされることは理解されよう。さらに、本実施形態において、本発明の構成による作用および効果を述べているが、これら作用および効果は、一例であり、本発明を限定するものではない。 Although a preferred embodiment of the present invention is as described above, the present invention is not limited thereto. It will be understood that various other embodiments may be made without departing from the spirit and scope of the present invention. Furthermore, in the present embodiment, actions and effects according to the configuration of the present invention are described, but these actions and effects are only examples and do not limit the present invention.
 100 RFタグ
 500 ICチップ
 200 アタッチメント部
 300 アンテナ
 211 回路部
 400 粘着層
 900 袋
 
 
 
100 RF tag 500 IC chip 200 attachment unit 300 antenna 211 circuit unit 400 adhesive layer 900 bag

Claims (8)

  1.  ICチップおよびインダクタパターンを含むインレットと、読取装置から送信されたデータの送受信に用いるアンテナ部と、が分離して形成され、
     前記アンテナ部に前記インレットが貼着されることにより、コンデンサが形成され、読取装置と通信を行う、RFタグ。
    An inlet including an IC chip and an inductor pattern, and an antenna unit used to transmit and receive data transmitted from the reader separately;
    An RF tag in which a capacitor is formed by adhering the inlet to the antenna unit, and which communicates with a reader.
  2.  前記インレットは、
     環状形状の回路部のうち一部を欠いた形状からなり、当該一部を欠いた前記回路部の両端にICチップが架け渡されるよう配設された、請求項1記載のRFタグ。
    The inlet is
    The RF tag according to claim 1, wherein the RF chip is formed so as to have a part lacking in an annular circuit part, and an IC chip is provided at both ends of the circuit part lacking in the part.
  3.  前記インレットと、前記アンテナ部との間に発泡体からなる絶縁層が設けられた、請求項1または2に記載のRFタグ。 The RF tag according to claim 1, wherein an insulating layer made of foam is provided between the inlet and the antenna unit.
  4.  前記アンテナ部の一部は、前記インレットの環状形状の回路部のうち一部を欠いた形状と重畳可能な形状からなる、請求項1から3のいずれか1項に記載のRFタグ。 The RF tag according to any one of claims 1 to 3, wherein a part of the antenna part has a shape capable of overlapping with a shape lacking a part of the annular circuit part of the inlet.
  5.  前記アンテナ部は、導電素材アンテナからなる、請求項1乃至4のいずれか1項に記載のRFタグ。 The RF tag according to any one of claims 1 to 4, wherein the antenna unit comprises a conductive material antenna.
  6.  前記アンテナ部の幅は、前記インダクタパターンの幅に対して比率が1対1以上1対4以下である、請求項1乃至5のいずれか1項に記載のRFタグ。 The RF tag according to any one of claims 1 to 5, wherein a width of the antenna unit is in a ratio of 1: 1 to 1: 4 with respect to a width of the inductor pattern.
  7.  前記コンデンサの静電容量は、1PF以上3PF以下の範囲内である、請求項1乃至6のいずれか1項に記載のRFタグ。 The RF tag according to any one of claims 1 to 6, wherein a capacitance of the capacitor is in a range of 1 PF to 3 PF.
  8.  前記アンテナ部は、袋、箱、商品を包装するフィルム、商品に貼着されるシールのいずれかに形成された、請求項1乃至7のいずれか1項に記載のRFタグ。
     
    The RF tag according to any one of claims 1 to 7, wherein the antenna unit is formed in any of a bag, a box, a film for packaging a product, and a seal attached to a product.
PCT/JP2018/029700 2017-08-09 2018-08-08 Rf tag antenna and rf tag WO2019031534A1 (en)

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