JP6209981B2 - Wireless communication device and article provided with the wireless communication device - Google Patents

Wireless communication device and article provided with the wireless communication device Download PDF

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JP6209981B2
JP6209981B2 JP2014015482A JP2014015482A JP6209981B2 JP 6209981 B2 JP6209981 B2 JP 6209981B2 JP 2014015482 A JP2014015482 A JP 2014015482A JP 2014015482 A JP2014015482 A JP 2014015482A JP 6209981 B2 JP6209981 B2 JP 6209981B2
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inductance element
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JP2015142318A (en
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加藤 登
登 加藤
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株式会社村田製作所
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Description

  The present invention relates to a wireless communication device, and more particularly to a wireless communication device used in an RFID (Radio Frequency Identification) system and an article provided with the wireless communication device.

  In recent years, as an article management system, a reader / writer that generates an induction electromagnetic field and an IC tag (hereinafter referred to as a wireless communication device) that stores predetermined information attached to the article are communicated in a non-contact manner, and the information is transmitted. A communicating RFID system has been developed. As a wireless communication device used in the RFID system, for example, a device described in Patent Document 1 is known.

  The device described in Patent Document 1 includes a wireless IC chip, a feeder circuit board, and a radiation plate. The feeder circuit board is flexible, and the radiation plate and its supporting substrate (carrier film) are also flexible. Therefore, this device is easy to stick on a curved surface of an article or a soft surface of an article, and is easy to handle.

  In the device, the frequency of the transmission / reception signal is determined by the resonance frequency of the power feeding circuit. Therefore, when the flexible power supply circuit board is curved according to the shape of the article to be attached, the resonance frequency of the power supply circuit may fluctuate. Note that if the feeder circuit board is downsized, the shape of the feeder circuit board itself is less affected by the shape of the article even if it is flexible. However, there is a limit to downsizing the power supply circuit board, and even if it can be downsized, there is a problem in mounting on the radiation plate. That is, it is difficult to mount a small object on a large object with high accuracy and efficiency.

Japanese Patent No. 4123306

  An object of the present invention is to provide a wireless communication device and an article that can mount a wireless communication module including a wireless IC chip and a power feeding circuit on a radiation conductor with high accuracy and can prevent fluctuations in communication characteristics as much as possible. It is to provide.

The wireless communication device according to the first aspect of the present invention is:
A wireless communication module comprising: a wireless IC chip having a rewiring layer; and a power feeding circuit having a predetermined resonance frequency and provided in the rewiring layer and connected to the wireless IC chip;
A flexible substrate having a first connection electrode and a second connection electrode each having a substantially strip-like shape in which the wireless communication module is mounted, one end of which is connected to the power feeding circuit and the other end is an open end;
A first radiating conductor that is attached to the substrate, has one end connected to the other end of the first connection electrode, and transmits and receives a radio signal having a communication frequency corresponding to the resonance frequency of the feeder circuit;
A second radiation conductor for transmitting and receiving a radio signal having a communication frequency corresponding to the resonance frequency of the power supply circuit, the substrate being attached, one end connected to the other end of the second connection electrode;
Equipped with a,
The power supply circuit has one end connected to the wireless IC chip and the other end connected to one end of the first connection electrode; one end connected to the wireless IC chip; A second inductance element connected to one end of the two connection electrodes; a third inductance element connected at one end to the one end of the first connection electrode and the first inductance element; and an end as one end of the second connection electrode; A fourth inductance element connected to the second inductance element and having the other end connected to the other end of the third inductance element,
The outer edge of the wireless IC chip and the outer edge of the redistribution layer coincide with each other in plan view .

  An article according to a second aspect of the present invention includes the wireless communication device.

  In the wireless communication device, a power supply circuit is provided in a rewiring layer of a wireless IC chip to constitute a wireless communication module, and this module is mounted on a flexible substrate having connection electrodes, and this substrate further emits radiation. It is affixed to the conductor. Since the power feeding circuit is provided in the rewiring layer having almost the same area as the wireless IC chip, the module is configured to be considerably small. This small module is mounted on a larger flexible substrate, and the flexible substrate is attached to a larger radiation conductor. Therefore, the module can be accurately and easily mounted on the connection electrode, and the connection electrode can be accurately and easily mounted on the radiation conductor. In addition, since a power supply circuit having a large influence on communication characteristics is provided in the rewiring layer (which has a small area) of the wireless IC chip, the rewiring layer is formed on the surface shape of the article to which the wireless communication device is attached. There is no possibility that the frequency of the power feeding circuit fluctuates without being affected.

  According to the present invention, a wireless communication module including a wireless IC chip and a power feeding circuit can be accurately and easily mounted on a radiation conductor, and fluctuations in communication characteristics can be prevented as much as possible.

It is the perspective view which shows goods, and the one part enlarged view. The wireless communication device which is 1st Example is shown, (A) is a top view, (B) is sectional drawing. FIG. 2 is an equivalent circuit diagram showing a wireless IC chip and a power feeding circuit constituting the wireless communication device. It is explanatory drawing which shows the rewiring layer provided in the said radio | wireless IC chip for every layer. It is sectional drawing which shows the mounting mode to the articles | goods of the radio | wireless communication device which is 1st Example. It is sectional drawing which shows the radio | wireless communication device which is 2nd Example. It is sectional drawing which shows the mounting form to the articles | goods of the radio | wireless communication device which is 2nd Example. It is explanatory drawing which shows the effect | action of the inductance element provided in the rewiring layer, (A) shows an Example and (B) shows a comparative example.

  Embodiments of a wireless communication device and an article according to the present invention will be described below with reference to the accompanying drawings. Note that parts and portions common to each embodiment described below are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 shows a packaging box 1 as an article. The packaging box 1 is made of corrugated cardboard, and a wireless communication device 11 is provided on a part of the surface, that is, the lower left portion on the front side in FIG. As shown in FIGS. 2A and 2B, the wireless communication device 11 includes a wireless communication module 20 and a flexible substrate (hereinafter referred to as a carrier film 30) including a pair of connection electrodes 31A and 31B. The radiating conductors 41A and 41B (see FIG. 1) function as UHF band RFID tags.

  As shown in FIG. 3, the wireless communication module 20 has a wireless IC chip 21 having a rewiring layer 22 and a power supply having a predetermined resonance frequency and provided in the rewiring layer 22 and connected to the wireless IC chip 21. The circuit 29 is provided and mounted on the carrier film 30. Each of the pair of connection electrodes 31A and 31B has a substantially band shape, one end is connected to the power feeding circuit 29 (connection portions P3 and P4), and the other end is an open end. The radiation conductors 41A and 41B are directly patterned on the surface of the packaging box 1, and the carrier film 30 is adhered thereto. Specifically, one end of each of the radiation conductors 41A and 41B is connected to the other open end of the connection electrodes 31A and 31B, and a dipole antenna that transmits and receives a radio signal having a communication frequency corresponding to the resonance frequency of the power feeding circuit 29. Function as.

  Note that the connection relationship between the connection electrodes 31A and 31B and the radiation conductors 41A and 41B is any of direct electrical connection, connection via a capacitor, connection via a magnetic field, or connection via an electromagnetic field. It may be.

  The wireless IC chip 21 is a semiconductor integrated circuit element for processing a UHF band RFID signal. Necessary information is stored in the wireless IC chip 21 and information can be rewritten. As shown in FIG. 3, the power feeding circuit 29 includes coil-shaped inductance elements L1, L2, L3, and L4 that are adjacently disposed in a plan view. The inductance elements L1 and L2 are connected in series with the inductance elements L3 and L4, respectively, the elements L1 and L2, the elements L3 and L4 have the same magnetic field, the elements L1 and L3, and the elements L2 and L4 have the same magnetic field. is there. One ends of the inductance elements L1 and L2 are connected to the input / output terminals of the wireless IC chip 21 (connection portions P1 and P2). Connection portions of the inductance elements L1 and L3 and connection portions of the inductance elements L2 and L4 are connected to one ends of the connection electrodes 31A and 31B, respectively (connection portions P3 and P4).

The wireless communication module 20 is configured as an IC package, more specifically, a WL-CSP (Wafer Level Chip Size Package). For the wireless IC chip 21 having a thickness of 100 to 150 μm, the rewiring layer 22 includes, for example, The thickness is 100 μm. The rewiring layer 22 is typically formed by a thin film microfabrication process (etching, photolithography). The conductor pattern forming the inductance element L1, L2, L3, L4 in the re-wiring layer 22 is, for example, copper, the interlayer insulating layer (layer) is such as polyimide organic material, of 5~10μm an inorganic material such as SiO 2 It is formed with a thickness.

  Specifically, the redistribution layer 22 has a stacked structure of the first layer 23A to the sixth layer 23F shown in FIG. A sixth layer 23F having routing conductors 24A and 24B is formed on the active layer surface of the wireless IC chip 21, and a fifth layer 23E having routing conductors 24C and 24D is formed thereon. Further, the fourth conductor 23D, the third layer 23C, and the second layer 23B are formed in this order in a state where the loop conductors 25A, 25B, 25C, 25D, 25E, and 25F are adjacent to each other in plan view. Part of the loop-shaped conductors 25A and 25B forms inductance elements L1 and L2. The loop conductors 25A, 25C, and 25E form an inductance element L3, and the loop conductors 25B, 25D, and 25F form an inductance element L4. A first layer 23A having terminal electrodes 26A and 26B as a final layer is formed.

  The terminal electrodes 26A and 26B are connected to one ends of the connection electrodes 31A and 31B, and are connected to the loop conductors 25A and 25B forming the elements L1 and L2 via the interlayer conductors. The loop conductors 25A and 25B are connected to the input / output terminals of the wireless IC chip 21 at the connection portions P1 and P2 through the lead conductors 24A to 24D and the interlayer conductors. One ends of the loop conductors 25C to 25F forming the elements L3 and L4 are connected to the loop conductors 25A and 25B forming the elements L1 and L2 by the fourth layer 24D, and the other ends are connected to each other by the second layer 23B. (Connection portion 27).

  As shown in FIG. 2B, the wireless communication module 20 having the above configuration is connected to one end of the connection electrodes 31A and 31B on the carrier film 30 via the solder 32, and is connected to the connection electrodes 31A and 31B. Is covered with a resist layer 33 including the solder 32 to constitute the wireless communication device 11 as the first embodiment. As shown in FIG. 5, in the wireless communication device 11, a carrier film 30 is attached to one end of the radiation conductors 41 </ b> A and 41 </ b> B patterned on the surface of the packaging box 1 via an adhesive layer 42.

  Accordingly, the connection electrodes 31A and 31B and the radiation conductors 41A and 41B are capacitively coupled via the adhesive layer 42 and the carrier film 30. A high-frequency signal (for example, UHF frequency band) radiated from a reader / writer (not shown) is received by the radiating conductors 41A and 41B, and the power feeding circuit 29 is connected via the connection electrodes 31A and 31B capacitively coupled to the radiating conductors 41A and 41B. And the radio IC chip 21 is supplied only with a received signal in a predetermined frequency band. That is, the radiation conductor 41A, the connection electrode 31A, the inductance element L3, the inductance element L4, the connection electrode 31B, and the radiation conductor 41B constitute an antenna having an electrical length λ / 2. A signal current flowing through the antenna is supplied to the wireless IC chip 21 via a power feeding circuit 29 configured by a loop unit including inductance elements L1, L2, L3, and L4. On the other hand, the wireless IC chip 21 extracts predetermined energy from the received signal, matches information stored in the memory using this energy as a driving source, to a predetermined frequency by the power feeding circuit 29, and passes through the connection electrodes 31A and 31B. Transmission signals are transmitted to the radiation conductors 41A and 41B, and transmitted from the radiation conductors 41A and 41B to the reader / writer.

  In the wireless communication device 11, a power feeding circuit 29 is provided on the rewiring layer 22 of the wireless IC chip 21 to constitute a wireless communication module 20, and the module 20 is provided on a carrier film 30 having connection electrodes 31 </ b> A and 31 </ b> B. Further, the film 30 is attached to an article (packaging box 1) provided with radiation conductors 41A and 41B. Since the power feeding circuit 29 is provided in the rewiring layer 22 having substantially the same area as the wireless IC chip 21, the module 20 is configured to be considerably small. The small module 20 is coupled to connection electrodes 31A and 31B provided on a slightly larger carrier film 30, and the carrier film 30 having the connection electrodes 31A and 31B further includes radiation conductors 41A and 41B larger than the connection electrodes 31A and 31B. Affixed to the article. Therefore, the module 20 can be mounted accurately and easily on the connection electrodes 31A and 31B, and the connection electrodes 31A and 31B can be mounted accurately and easily on the radiation conductors 41A and 41B. In particular, the wireless communication device 11 used in the UHF band needs to mount the wireless IC chip 21 on the radiation conductors 41A and 41B with higher accuracy than the device used in the HF band. In the wireless communication device 11, the wireless IC chip 21 can be mounted with high accuracy as described above.

  Further, since the power feeding circuit 29 having a great influence on the communication characteristics is built in the rewiring layer 22 (which has a very small area) of the wireless IC chip 21, the surface shape of the article to which the wireless communication device 11 is attached, The redistribution layer 22 is not affected by the relative dielectric constant and the like, and there is no possibility that the frequency of the power feeding circuit 29 fluctuates.

  Here, the structural features of the inductance elements arranged in the rewiring layer 22 will be described. 8A and 8B schematically show a coil-shaped inductance element L inside the redistribution layer 22, and two inductance elements L are provided as in the comparative example shown in FIG. If it is formed so as to straddle the connection electrodes 31A and 31B, a capacitor C3 is formed between the connection electrodes 31A and 31B in addition to the originally required capacitors C1 and C2. Since the radiating conductors 41A and 41B function as an antenna using the open potential difference between both ends, if the capacitor C3 is formed, the electric field radiated into the air is reduced.

  On the other hand, in this embodiment, as shown in FIG. 8A, the inductance element L is disposed adjacent to each other in plan view so as not to straddle the two connection electrodes 31A and 31B. As a result, the capacitor C3 is hardly formed between the connection electrodes 31A and 31B, and the reduction of the electric field radiated into the air can be prevented.

  As shown in FIG. 4, the terminal electrodes 26A and 26B connected to the inductance elements L1, L3, L2 and L4 are formed narrow so as not to substantially block the coil openings of the inductance elements L1 to L4. In addition, a lead-out portion (interlayer conductor 28) is formed in the inner area of the coil. In order to form a coil pattern having a large L value and a high Q value, a large area for forming the coil pattern is required, but the rewiring layer 22 is very small. In order to form a coil pattern having as large an area as possible on the rewiring layer 22 having a small area, it is possible to provide a lead-out portion to the connection electrodes 31A and 31B in the inner area of the coil. The terminal electrodes 26A and 26B are preferably arranged so as not to overlap all the coil openings (inner diameter regions) of the inductance elements L1 to L4, but are arranged so as not to overlap at least the coil central axes of the inductance elements L1 to L4. do it.

  In addition, in the rewiring layer 22, the fifth layer 23E and the sixth layer 23F are disposed, and the inductance elements L1 to L4 are formed in the second layer 23B, the third layer 23C, and the fourth layer 23D. Yes. That is, the inductance elements L1 to L4 are separated as much as possible from the active layer surface of the wireless IC chip 21 by the presence of the fifth layer 23E and the sixth layer 23F, so that the Q value of the coil can be prevented from becoming small. That is, it is preferable that the coil patterns constituting the inductance elements L1 to L4 are offset from the mounting surface.

  In addition to the packaging box 1 such as a cardboard box, the articles on which the wireless communication device 11 is mounted include electrified goods such as personal computers and various measuring devices, household goods such as desks and chairs, and public goods such as street lamps and utility poles. You can choose widely. The packaging box 1 may be a paper label or a seal. If it is the packaging box 1, the pattern printed with Ag etc. on the surface of the box can be used as radiation conductors 41A and 41B. Of course, as the radiation conductors 41A and 41B, an antenna pattern obtained by patterning aluminum foil or copper foil into a predetermined shape on a film such as PET can be used.

  As the carrier film 30, for example, a heat-resistant film such as polyimide can be used. As the connection electrodes 31A and 31B, those obtained by patterning aluminum foil or copper foil laminated on a film into a predetermined shape can be used. Means other than the solder 32 may be used to mount the wireless communication module 20 on the connection electrodes 31A and 31B. For example, Ag nano bonding or ultrasonic bonding may be used. As the adhesive layer 42 for adhering the carrier film 30 to the radiation conductors 41A and 41B, a commonly used insulating adhesive may be used, or an insulating double-sided tape may be used.

  Next, the wireless communication device 12 according to the second embodiment will be described. The wireless communication device 12 uses the wireless IC chip 21 including the rewiring layer 22 shown in the first embodiment. As shown in FIG. 6, the connection portions P3 and P4 of the rewiring layer 22 (FIG. 3). Are connected to the connection electrodes 31A and 31B via the solder 32, the conductive bonding material 34 is provided on the connection electrodes 31A and 31B, and the underfill 35 is provided immediately below the rewiring layer 22. Other configurations are the same as those of the first embodiment.

  As shown in FIG. 7, the wireless communication device 12 joins the conductive bonding material 34 to the radiation conductors 41A and 41B in a state where the wireless communication module 20 faces the radiation conductors 41A and 41B. Therefore, in the second embodiment, the connection electrodes 31A and 31B and the radiation conductors 41A and 41B are directly electrically connected via the conductive bonding material 34. The communication state of the wireless communication device with the reader / writer is basically the same as described in the first embodiment, and the operation and effect thereof are the same as in the first embodiment. In particular, in the second embodiment, since the carrier film 30 is attached to the radiation conductors 41A and 41B so as to be on the outer side, the protection performance of the wireless communication module 20 is improved.

  In addition, since the rewiring layer 22 formed in the wireless communication module 20 contacts the article via the wireless IC chip 21, the rewiring layer 22 becomes less susceptible to stray capacitance due to the article, and the inductance of the rewiring layer 22 The value is also less affected by the metal part of the article.

  As the conductive bonding material 34, a conductive adhesive or a conductive tape can be used.

(Other examples)
The wireless communication device and article according to the present invention are not limited to the above-described embodiments, and can be variously modified within the scope of the gist.

  For example, the detailed structure of the rewiring layer, the shape of the connection electrode and the radiation conductor, and the like are arbitrary. In particular, the radiation conductor is not limited to the meander shape shown in the above embodiment.

  As described above, the present invention is useful for a wireless communication device used in an RFID system. In particular, the wireless communication module can be mounted on a radiation conductor accurately and easily, and fluctuations in communication characteristics can be prevented as much as possible. Are better.

DESCRIPTION OF SYMBOLS 1 ... Packaging box 11, 12 ... Wireless IC device 20 ... Wireless communication module 21 ... Wireless IC chip 22 ... Redistribution layer 29 ... Feeding circuit 30 ... Carrier film 31A, 31B ... Connection electrode 41A, 41B ... Radiation conductor L1-L4 ... Inductance element

Claims (7)

  1. A wireless communication module comprising: a wireless IC chip having a rewiring layer; and a power feeding circuit having a predetermined resonance frequency and provided in the rewiring layer and connected to the wireless IC chip;
    A flexible substrate having a first connection electrode and a second connection electrode each having a substantially strip-like shape in which the wireless communication module is mounted, one end of which is connected to the power feeding circuit and the other end is an open end;
    A first radiating conductor that is attached to the substrate, has one end connected to the other end of the first connection electrode, and transmits and receives a radio signal having a communication frequency corresponding to the resonance frequency of the feeder circuit;
    A second radiation conductor for transmitting and receiving a radio signal having a communication frequency corresponding to the resonance frequency of the power supply circuit, the substrate being attached, one end connected to the other end of the second connection electrode;
    Equipped with a,
    The power supply circuit has one end connected to the wireless IC chip and the other end connected to one end of the first connection electrode; one end connected to the wireless IC chip; A second inductance element connected to one end of the two connection electrodes; a third inductance element connected at one end to the one end of the first connection electrode and the first inductance element; and an end as one end of the second connection electrode; A fourth inductance element connected to the second inductance element and having the other end connected to the other end of the third inductance element,
    A wireless communication device , wherein an outer edge of the wireless IC chip and an outer edge of the redistribution layer coincide in plan view .
  2. The substrate is attached to the first radiation conductor such that the side opposite to the surface on which the wireless communication module is mounted is on the first radiation conductor side,
    The first connection electrode and the first radiation conductor are connected by capacitive coupling via the substrate;
    The wireless communication device according to claim 1.
  3. The substrate is attached to the first radiation conductor so that the surface on which the module for wireless communication is mounted is on the first radiation conductor side,
    The first connection electrode and the first radiation conductor are connected via a conductive bonding material;
    The wireless communication device according to claim 1.
  4. The first inductance element to the fourth inductance element are coil-shaped,
    The pattern connecting the other end of the first inductance element and the first connection electrode is provided in a region surrounded by the third inductance element, and / or the other end of the second inductance element and the 4. The wireless communication device according to claim 1, wherein the pattern connecting the first connection electrodes is provided in a region surrounded by the fourth inductance element. 5.
  5. The first inductance element and the third inductance element overlap the first connection electrode in plan view,
    The second inductance element and the fourth inductance element overlap the second connection electrode in plan view;
    The wireless communication device according to any one of claims 1 to 4, wherein:
  6. An article comprising a wireless communication device,
    The wireless communication device is:
    A wireless communication module comprising: a wireless IC chip having a rewiring layer; and a power feeding circuit having a predetermined resonance frequency and provided in the rewiring layer and connected to the wireless IC chip;
    A flexible substrate having a first connection electrode and a second connection electrode each having a substantially strip-like shape in which the wireless communication module is mounted, one end of which is connected to the power feeding circuit and the other end is an open end;
    A first radiating conductor that is attached to the substrate, has one end connected to the other end of the first connection electrode, and transmits and receives a radio signal having a communication frequency corresponding to the resonance frequency of the feeder circuit;
    A second radiation conductor for transmitting and receiving a radio signal having a communication frequency corresponding to the resonance frequency of the power supply circuit, the substrate being attached, one end connected to the other end of the second connection electrode;
    Equipped with a,
    The power supply circuit has one end connected to the wireless IC chip and the other end connected to one end of the first connection electrode; one end connected to the wireless IC chip; A second inductance element connected to one end of the two connection electrodes; a third inductance element connected at one end to the one end of the first connection electrode and the first inductance element; and an end as one end of the second connection electrode; A fourth inductance element connected to the second inductance element and having the other end connected to the other end of the third inductance element,
    An article , wherein an outer edge of the wireless IC chip and an outer edge of the redistribution layer coincide with each other in plan view .
  7. The article according to claim 6, wherein the first radiation conductor and the second radiation conductor are formed in an article body.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5809099A (en) * 1998-09-11 2000-04-03 Motorola, Inc. Radio frequency identification tag apparatus and related method
US7298343B2 (en) * 2003-11-04 2007-11-20 Avery Dennison Corporation RFID tag with enhanced readability
WO2010119854A1 (en) * 2009-04-14 2010-10-21 株式会社村田製作所 Component for wireless ic device and wireless ic device

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