WO2019026462A1 - Camera module and method for manufacturing camera module - Google Patents

Camera module and method for manufacturing camera module Download PDF

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Publication number
WO2019026462A1
WO2019026462A1 PCT/JP2018/023845 JP2018023845W WO2019026462A1 WO 2019026462 A1 WO2019026462 A1 WO 2019026462A1 JP 2018023845 W JP2018023845 W JP 2018023845W WO 2019026462 A1 WO2019026462 A1 WO 2019026462A1
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Prior art keywords
housing
pedestal
camera module
substrate
mounting
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PCT/JP2018/023845
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French (fr)
Japanese (ja)
Inventor
好範 谷田
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シャープ株式会社
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Publication of WO2019026462A1 publication Critical patent/WO2019026462A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

Definitions

  • the present invention relates to a camera module provided in a thin terminal device such as a smartphone or a tablet to perform imaging, and a method of manufacturing the camera module.
  • a camera is mounted on the above-mentioned thin terminal device, and the performance of the camera module is advanced.
  • a camera module used in a thin terminal device such as a smartphone or a tablet has a structure in which an imaging device such as a CCD and a CMOS, a substrate, and a housing including a lens are integrated.
  • the camera module 90 includes a substrate 12, an imaging device 14 mounted on the upper surface of the substrate 12, and a housing 18 including a lens 16.
  • the imaging device 14 is fixed to the upper surface of the substrate 12 via the die bonding paste 28, and the housing 18 is fixed to the upper surface of the substrate 12 via the housing adhesive 30.
  • the substrate 12 has a flat plate shape, but in many cases is made of resin and is composed of a plurality of layers, the substrate 12 may be warped. .
  • the substrate 12 since a circuit is disposed on the upper surface of the substrate 12, unevenness is generated on the upper surface of the substrate 12.
  • the thickness of the die bonding paste 28 applied to the upper surface of the substrate 12 and the thickness of the casing adhesive 30 may be uneven.
  • the imaging device 14 and the lens 16 may be inclined and mounted on the upper surface of the substrate 12, and the imaging device 14 and the lens 16 may not be parallel to each other.
  • the positions of the imaging device 14 and the housing 18 mounted on the substrate 12 are adjusted while viewing the output image based on the output signal from the imaging device 14 There is a method called active alignment (AA, Active Alignment).
  • AA Active Alignment
  • An object of the present invention is to provide a camera module and a method for manufacturing a camera module that can assemble an imaging device and a lens with high accuracy and a simple structure without adding cost and labor.
  • a camera module includes a housing provided on a substrate for holding a lens, and the substrate for receiving light transmitted through the lens.
  • a camera module comprising: an imaging device provided; and a pedestal provided on the substrate to mount the housing and the imaging device, the pedestal comprising a flat member. is there.
  • a manufacturing method of a camera module concerning one mode of the present invention mounts an image sensor for receiving light which penetrated a lens on a pedestal provided on a substrate. Element mounting process, And a housing mounting step of mounting a housing holding the lens on the pedestal.
  • a camera module and a method for manufacturing a camera module that can assemble an imaging device and a lens with high accuracy and a simple structure without increasing cost and labor.
  • FIG. 3 is a cross-sectional view along a plane X-X ′ shown in FIG. 2 of a camera module according to an embodiment of the present invention. It is a plane sectional view of a camera module concerning an embodiment of the present invention. It is a top view of a pedestal in a camera module concerning an embodiment of the present invention. It is sectional drawing of the conventional camera module.
  • FIGS. 1 to 3 An embodiment of the present invention will be described in detail based on FIGS. 1 to 3.
  • FIG. 1 is a cross-sectional view along a plane XX ′ shown in FIG. 2 of a camera module 10 according to an embodiment of the present invention
  • FIG. 2 is a plan cross section of the camera module 10 according to an embodiment of the present invention
  • FIG. 3 is a plan view of the pedestal 20 in the camera module 10 according to the embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the plane YY ′ shown in FIG.
  • a flat pedestal 20 is attached to the upper surface of a substrate 12 composed of a plurality of layers. Then, a housing 18 provided with the imaging device 14 and the lens 16 is mounted on the top surface of the pedestal 20 in a state of being in contact with the pedestal 20.
  • the pedestal 20 has three frame portions 31 whose outer sides are formed in a substantially quadrilateral frame shape, and three square shapes projecting inward from the frame portion 31 for mounting the imaging device 14. It has an imaging element contact portion 32 (imaging element mounting portion), and three square housing contact portions 34 (housing portion mounting portions) projecting outward from the frame portion 31 for mounting the housing 18.
  • the surface of the image sensor contact portion 32 serves as a reference surface of the image sensor 14.
  • the surface of the housing contact portion 34 serves as a reference surface of the housing 18 and the lens 16.
  • the pedestal 20 is a single metal (stainless steel) plate.
  • the frame portion 31 is formed in a frame shape so that eight electrode terminals 40 formed on the upper surface of the substrate 12 are exposed.
  • the exposed electrode terminal 40 and the imaging element 14 are electrically connected based on wire bonding by the wire 36.
  • the wire 36 is a gold wire, and electrically connects the electrode terminal 40 and the imaging device 14.
  • a so-called wire bonding method is applied.
  • Imaging device 14 As shown in FIG. 1 and FIG. 2, the imaging device 14 is mounted on three imaging device contact portions 32 formed on the pedestal 20. Thus, the imaging device 14 is in contact with the pedestal 20 at a position corresponding to the three apexes of the triangle.
  • a die bond paste 28 (first adhesive) is present between the substrate 12 and a portion of the lower surface of the imaging device 14 that is not in contact with the imaging device contact portion 32.
  • the imaging device 14 is fixed to the substrate 12 by the die bonding paste 28.
  • the thickness of the die bonding paste 28 is about 20 to 30 ⁇ m.
  • the imaging element 14 receives the light collected on the lens 16 held by the housing 18 and having passed through the IR cut glass 26, and outputs the light as an electrical signal through the wire 36 and the electrode terminal 40.
  • the housing 18 is formed in a substantially cylindrical shape that opens toward the substrate 12.
  • the housing 18 is provided with a lens barrel 24 for holding the lens 16 and a cylindrical sensor cover 22 arranged to support the lens barrel 24 and cover the imaging device 14.
  • An IR cut glass 26 is provided on the sensor cover 22 so as to face the imaging device 14.
  • the lens 16 is disposed at a position where the light transmitted through the lens 16 passes through the IR cut glass 26 and enters the imaging device 14.
  • the IR cut glass 26 is a plate-like filter for blocking the infrared light collected by the lens 16 so as not to reach the imaging device 14.
  • the sensor cover 22 of the housing 18 is mounted on the three housing contact portions 34 formed on the pedestal 20.
  • the housing 18 abuts on the pedestal 20 at a position corresponding to the three apexes of the triangle.
  • a housing adhesive 30 (second adhesive) is present between the substrate 12 and a portion of the end face of the sensor cover 22 which is not in contact with the housing contact portion 34 of the pedestal 20.
  • the housing 18 is fixed to the substrate 12 by the housing adhesive 30.
  • the lens 16 is fixed to the lens barrel 24.
  • the lens 16 is disposed to face the imaging device 14.
  • An IR cut glass 26 is disposed between the lens 16 and the imaging device 14 so as to face the lens 16 and the imaging device 14.
  • the lens 16 actually consists of a plurality of lenses, it is illustrated as a single lens of a simplified shape in order to avoid the troublesome appearance of the drawing.
  • the substrate 12 is a flat plate made of resin composed of a plurality of layers.
  • a circuit is disposed on the top surface of the substrate 12.
  • the circuit includes an electrode terminal 40 and a mounting component 38 such as a chip component.
  • the mounting component 38 includes a DSP (Digital Signal Processor) that processes a signal from the imaging device 14.
  • DSP Digital Signal Processor
  • the imaging device 14 and the housing 18 are mounted in contact with the pedestal 20 on the top surface of the pedestal 20 attached to the substrate 12.
  • the substrate 12 is not affected by the warpage of the substrate 12.
  • the imaging device 14 can be mounted on the substrate 12 so that the imaging device 14 and the lens 16 provided on the housing 18 are parallel, and so-called piece due to the focal distance between the imaging device 14 and the lens 16 shifting.
  • the blur is less likely to occur at the manufacturing stage.
  • the imaging device 14 and the housing 18 may be inclined and fixed to the pedestal 20, respectively.
  • the focal distance between the imaging device 14 and the lens 16 may be shifted, which may cause so-called one-sided blurring.
  • the pedestal 20 is in contact with the imaging device 14 at three imaging device abutment portions 32.
  • the imaging device 14 can be mounted most stably on the upper surface of the pedestal 20.
  • the pedestal 20 is in contact with the housing 18 at three housing contact portions 34.
  • the housing 18 can be mounted most stably on the upper surface of the pedestal 20.
  • the pedestal 20 is preferably made of a uniform material, and is preferably one piece.
  • the flatness of the pedestal 20 can be further ensured. Moreover, the flatness of the pedestal 20 can be further secured by the pedestal 20 being a single piece.
  • the imaging device 14 and the housing 18 are in contact with the pedestal 20 at three locations, respectively.
  • the present invention is not limited to three locations. be able to.
  • contact may be made at two to four places.
  • the shapes of the imaging element contact portion 32 and the housing contact portion 34 are each square as shown in FIGS. 2 and 3, but the shape is not limited to a square and may be round. Shape, triangle shape, square shape, etc. can be selected suitably.
  • the pedestal 20 is made of metal (made of stainless steel), but is not limited to the metal, and the pedestal can be provided as long as it can ensure the flatness of the pedestal 20. About the material which comprises 20, it can select suitably.
  • the pedestal 20 is frame-shaped as shown in FIG. 3, the present invention is not limited to this, and the flatness of the flat pedestal 20 can be secured. If it is, about the shape of pedestal 20, it can choose suitably.
  • the frame portion 31 of the pedestal 20 is formed in a frame shape so that the eight electrode terminals 40 formed on the upper surface of the substrate 12 are exposed. If the eight electrode terminals 40 formed on the upper surface of the substrate 12 are formed to be exposed, the shape of the frame portion 31 can be appropriately selected.
  • the frame portion 31 may be formed in a slit shape.
  • the flatness of the pedestal 20 can be further maintained.
  • the camera module 10 according to aspect 1 of the present invention is provided on the casing 12 provided on the substrate 12 for holding the lens 16 and provided on the substrate 12 for receiving light transmitted through the lens 16.
  • a camera comprising: an imaging device 14; a pedestal 20 provided on the substrate 12 for mounting the casing 18 and the imaging device 14; the pedestal comprising a flat member It is a module.
  • the imaging device and the housing for holding the lens are mounted on the same pedestal. Therefore, it is possible to assemble the imaging device and the lens with high accuracy with a simple structure.
  • the pedestal 20 protrudes inward from the frame 31 for mounting the frame 31 formed in a frame shape and the imaging device 14
  • a plurality of imaging element mounting portions (imaging element contact portions 32) to be mounted, and a plurality of housing mounting portions (housing contact portions 34) projecting outward from the frame portion 31 for mounting the housing 18 May be
  • the imaging device and the housing can be mounted on the same pedestal with a simple structure.
  • the imaging element 14 contacts the imaging element mounting portion (imaging element contact portion 32), and the substrate 12 and the first adhesive (die bond) Even if the casing 18 is adhered via the paste 28) and the casing 18 abuts on the casing mounting portion (the casing contact portion 34) and is adhered via the substrate 12 and the second adhesive (the casing adhesive 30) Good.
  • the plurality of imaging element mounting portions are disposed at positions corresponding to three apexes of a triangle. It may be three image sensor mounting parts.
  • the camera module 10 according to aspect 5 of the present invention is the camera module 10 according to any one of the aspects 2 to 4, wherein the plurality of housing mounting portions (housing contact portion 34) are located at positions corresponding to three apexes of a triangle. It may be three housings arranged respectively.
  • an image pick-up element and an electrode terminal can be electrically connected inside the frame part of a base.
  • the pedestal 20 may be a metal plate.
  • the flatness of the pedestal can be secured.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The present invention provides, without extra cost and trouble, a camera module, which has a simple structure and can be accurately assembled. The camera module is provided with: a housing (18) that is provided on a substrate (12) for the purpose of holding a lens (16); an image pickup element (14) that is provided on the substrate (12) for the purpose of receiving light passed through the lens (16); and a base (20) that is provided on the substrate (12) for the purpose of mounting the housing (18) and the image pickup element (14).

Description

カメラモジュール及びカメラモジュールの製造方法Camera module and method of manufacturing camera module
　本発明は、スマートフォンやタブレットなど薄型の端末機器に設けられて撮像を行うカメラモジュール及びカメラモジュールの製造方法に関する。 The present invention relates to a camera module provided in a thin terminal device such as a smartphone or a tablet to perform imaging, and a method of manufacturing the camera module.
　昨今、スマートフォンやタブレットなど薄型の端末機器が世の中に多数出回っている。 In recent years, many thin terminal devices such as smartphones and tablets are in the market.
　上記の薄型の端末機器には、カメラが搭載されており、カメラモジュールの高性能化が進んでいる。 A camera is mounted on the above-mentioned thin terminal device, and the performance of the camera module is advanced.
　スマートフォンやタブレットなど薄型の端末機器に使用されているカメラモジュールは、ＣＣＤ、及びＣＭＯＳ等の撮像素子、基板、レンズを備える筺体が一体となった構造となっている。 A camera module used in a thin terminal device such as a smartphone or a tablet has a structure in which an imaging device such as a CCD and a CMOS, a substrate, and a housing including a lens are integrated.
　これらカメラモジュールの構造の一例を、図４に示す。カメラモジュール９０は、図４に示すように、基板１２、基板１２の上面に搭載された撮像素子１４、及びレンズ１６を備える筺体１８を備えている。 An example of the structure of these camera modules is shown in FIG. As shown in FIG. 4, the camera module 90 includes a substrate 12, an imaging device 14 mounted on the upper surface of the substrate 12, and a housing 18 including a lens 16.
　カメラモジュール９０においては、撮像素子１４は、ダイボンドペースト２８を介して基板１２の上面に固定されており、筺体１８は、筺体接着剤３０を介して、基板１２の上面に固定されている。 In the camera module 90, the imaging device 14 is fixed to the upper surface of the substrate 12 via the die bonding paste 28, and the housing 18 is fixed to the upper surface of the substrate 12 via the housing adhesive 30.
日本国特許公開公報「特開2013－192207号公報（2013年9月26日公開）」Japanese Patent Laid-Open Publication No. 2013-192207 (September 26, 2013 published)
　しかしながら、上述のカメラモジュール９０においては、基板１２は、平板状であるが、多くの場合、樹脂製であり、また、複数の層から構成されているため、基板１２が反ってしまう場合がある。また、基板１２の上面には、回路が配置されているため、基板１２の上面には凹凸が生じる。 However, in the camera module 90 described above, the substrate 12 has a flat plate shape, but in many cases is made of resin and is composed of a plurality of layers, the substrate 12 may be warped. . In addition, since a circuit is disposed on the upper surface of the substrate 12, unevenness is generated on the upper surface of the substrate 12.
　さらに、基板１２の上面に塗布されたダイボンドペースト２８、及び筺体接着剤３０の厚みが不均一である場合がある。 In addition, the thickness of the die bonding paste 28 applied to the upper surface of the substrate 12 and the thickness of the casing adhesive 30 may be uneven.
　これらのことから、撮像素子１４及びレンズ１６が、基板１２の上面に傾いて搭載され、撮像素子１４とレンズ１６とが、互いに平行にならない場合がある。 From these things, the imaging device 14 and the lens 16 may be inclined and mounted on the upper surface of the substrate 12, and the imaging device 14 and the lens 16 may not be parallel to each other.
　このため、撮像素子１４の撮像面において、レンズ１６の焦点位置からズレてしまう領域が生じ、いわゆる片ボケを引き起こす虞がある。 For this reason, in the imaging surface of the imaging device 14, an area shifted from the focal position of the lens 16 is generated, which may cause so-called single blurring.
　一方で、撮像素子１４及び筺体１８を、基板１２に搭載する方法として、撮像素子１４からの出力信号に基づく出力画像を見ながら、基板１２に搭載する撮像素子１４及び筺体１８の位置を調整するアクティブアライメント（ＡＡ、Active Alignment）という方法がある。 On the other hand, as a method of mounting the imaging device 14 and the housing 18 on the substrate 12, the positions of the imaging device 14 and the housing 18 mounted on the substrate 12 are adjusted while viewing the output image based on the output signal from the imaging device 14 There is a method called active alignment (AA, Active Alignment).
　しかし、この方法では、特定の専用設備を必要とし、接着樹脂なども特殊な材料を使用しなければならないため、コストと手間がかかるという問題がある。 However, this method requires a special dedicated equipment, and it is necessary to use a special material such as an adhesive resin, which causes a problem of cost and labor.
　本発明の一態様は、コストと手間をかけることなく、簡易な構造で、精度よく撮像素子とレンズとを組み立てることができるカメラモジュール及びカメラモジュールの製造方法を提供することを目的とする。 An object of the present invention is to provide a camera module and a method for manufacturing a camera module that can assemble an imaging device and a lens with high accuracy and a simple structure without adding cost and labor.
　上記の課題を解決するために、本発明の一態様に係るカメラモジュールは、レンズを保持するために基板上に設けられた筺体と、前記レンズを透過した光を受光するために前記基板上に設けられた撮像素子と、前記筺体と前記撮像素子とを搭載するために前記基板上に設けられた台座とを備え、前記台座は一枚の平坦な部材からなることを特徴とするカメラモジュールである。 In order to solve the above problems, a camera module according to an aspect of the present invention includes a housing provided on a substrate for holding a lens, and the substrate for receiving light transmitted through the lens. A camera module comprising: an imaging device provided; and a pedestal provided on the substrate to mount the housing and the imaging device, the pedestal comprising a flat member. is there.
　上記の課題を解決するために、本発明の一態様に係るカメラモジュールの製造方法は、レンズを透過した光を受光するための撮像素子を基板の上に設けられた台座の上に搭載する撮像素子搭載工程と、
　前記レンズを保持する筺体を前記台座の上に搭載する筺体搭載工程とを包含することを特徴とする。 In order to solve the above-mentioned subject, a manufacturing method of a camera module concerning one mode of the present invention mounts an image sensor for receiving light which penetrated a lens on a pedestal provided on a substrate. Element mounting process,
And a housing mounting step of mounting a housing holding the lens on the pedestal.
　本発明の一態様によれば、コストと手間をかけることなく、簡易な構造で、精度よく撮像素子とレンズとを組み立てることができるカメラモジュール及びカメラモジュールの製造方法を提供するという効果を奏する。 According to one aspect of the present invention, it is possible to provide a camera module and a method for manufacturing a camera module that can assemble an imaging device and a lens with high accuracy and a simple structure without increasing cost and labor.
本発明の実施形態に係るカメラモジュールの図２に示される面Ｘ－Ｘ’に沿った断面図である。FIG. 3 is a cross-sectional view along a plane X-X ′ shown in FIG. 2 of a camera module according to an embodiment of the present invention. 本発明の実施形態に係るカメラモジュールの平面断面図である。It is a plane sectional view of a camera module concerning an embodiment of the present invention. 本発明の実施形態に係るカメラモジュールにおける台座の平面図である。It is a top view of a pedestal in a camera module concerning an embodiment of the present invention. 従来のカメラモジュールの断面図である。It is sectional drawing of the conventional camera module.
　以下、本発明の実施の形態について、図１～３に基づいて詳細に説明する。 Hereinafter, an embodiment of the present invention will be described in detail based on FIGS. 1 to 3.
　（カメラモジュール１０の基本的構成）
　本発明の実施の形態に係るカメラモジュール１０の基本的構成について、図１～３に基づいて説明する。 (Basic configuration of camera module 10)
The basic configuration of the camera module 10 according to the embodiment of the present invention will be described based on FIGS. 1 to 3. FIG.
　図１は、本発明の実施形態に係るカメラモジュール１０の図２に示される面Ｘ－Ｘ´に沿った断面図であり、図２は、本発明の実施形態に係るカメラモジュール１０の平面断面図である。また、図３は、本発明の実施形態に係るカメラモジュール１０における台座２０の平面図である。なお、図２は図１に示される面Ｙ－Ｙ´に沿った断面図である。 FIG. 1 is a cross-sectional view along a plane XX ′ shown in FIG. 2 of a camera module 10 according to an embodiment of the present invention, and FIG. 2 is a plan cross section of the camera module 10 according to an embodiment of the present invention FIG. FIG. 3 is a plan view of the pedestal 20 in the camera module 10 according to the embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the plane YY ′ shown in FIG.
　図１及び図２に示すように、本実施形態に係るカメラモジュール１０は、複数の層から構成される基板１２の上面に平板状の台座２０が貼り付けられている。そして、台座２０の上面には、撮像素子１４、及びレンズ１６を備える筺体１８が、台座２０に当接した状態で載置されている。 As shown in FIGS. 1 and 2, in the camera module 10 according to the present embodiment, a flat pedestal 20 is attached to the upper surface of a substrate 12 composed of a plurality of layers. Then, a housing 18 provided with the imaging device 14 and the lens 16 is mounted on the top surface of the pedestal 20 in a state of being in contact with the pedestal 20.
　（台座２０）
　図３に示すように、台座２０は、外辺が略四辺形の枠状に形成された枠部３１と、撮像素子１４を搭載するために枠部３１から内側に突出する正方形状の３つの撮像素子当接部３２（撮像素子搭載部）と、筺体１８を搭載するために枠部３１から外側に突出する正方形状の３つの筺体当接部３４（筺体搭載部）とを有する。撮像素子当接部３２の表面は撮像素子１４の基準面となる。筺体当接部３４の表面は筺体１８、レンズ１６の基準面となる。 (Pedestal 20)
As shown in FIG. 3, the pedestal 20 has three frame portions 31 whose outer sides are formed in a substantially quadrilateral frame shape, and three square shapes projecting inward from the frame portion 31 for mounting the imaging device 14. It has an imaging element contact portion 32 (imaging element mounting portion), and three square housing contact portions 34 (housing portion mounting portions) projecting outward from the frame portion 31 for mounting the housing 18. The surface of the image sensor contact portion 32 serves as a reference surface of the image sensor 14. The surface of the housing contact portion 34 serves as a reference surface of the housing 18 and the lens 16.
　本実施形態においては、台座２０は、一枚の金属（ステンレス鋼）板である。 In the present embodiment, the pedestal 20 is a single metal (stainless steel) plate.
　枠部３１は、基板１２の上面に形成された８個の電極端子４０が露出するように枠状に形成される。そして、露出した電極端子４０と、撮像素子１４とは、ワイヤー３６によるワイヤーボンディングに基づいて電気的に接続されている。ワイヤー３６は、金線であり、電極端子４０と、撮像素子１４とを電気的に接続している。このように、本実施形態においては、いわゆるワイヤーボンディング法を適用している。 The frame portion 31 is formed in a frame shape so that eight electrode terminals 40 formed on the upper surface of the substrate 12 are exposed. The exposed electrode terminal 40 and the imaging element 14 are electrically connected based on wire bonding by the wire 36. The wire 36 is a gold wire, and electrically connects the electrode terminal 40 and the imaging device 14. Thus, in the present embodiment, a so-called wire bonding method is applied.
　（撮像素子１４）
　図１及び図２に示すように、撮像素子１４は、台座２０に形成された３つの撮像素子当接部３２の上に載置されている。このように、撮像素子１４は、三角形の３個の頂点に対応する位置で台座２０と当接している。 (Image sensor 14)
As shown in FIG. 1 and FIG. 2, the imaging device 14 is mounted on three imaging device contact portions 32 formed on the pedestal 20. Thus, the imaging device 14 is in contact with the pedestal 20 at a position corresponding to the three apexes of the triangle.
　ここで、撮像素子１４と、台座２０の撮像素子当接部３２との間には、接着剤は存在しない。しかし、撮像素子１４の下面の撮像素子当接部３２と当接していない部分と、基板１２との間には、ダイボンドペースト２８（第１接着剤）が存在する。このダイボンドペースト２８により、撮像素子１４は、基板１２に固定されている。このダイボンドペースト２８の厚みは、２０～３０μｍ程度である。 Here, no adhesive is present between the imaging device 14 and the imaging device contact portion 32 of the pedestal 20. However, a die bond paste 28 (first adhesive) is present between the substrate 12 and a portion of the lower surface of the imaging device 14 that is not in contact with the imaging device contact portion 32. The imaging device 14 is fixed to the substrate 12 by the die bonding paste 28. The thickness of the die bonding paste 28 is about 20 to 30 μm.
　撮像素子１４は、筺体１８に保持されるレンズ１６に集光されてＩＲカットガラス２６を通過した光を受けて、その光をワイヤー３６及び電極端子４０を介して電気信号として出力する。 The imaging element 14 receives the light collected on the lens 16 held by the housing 18 and having passed through the IR cut glass 26, and outputs the light as an electrical signal through the wire 36 and the electrode terminal 40.
　（筺体１８）
　図１及び図２に示すように、筺体１８は、基板１２に向かって開口する略円筒形状に形成される。筺体１８には、レンズ１６を保持するレンズバレル２４と、レンズバレル２４を支持して撮像素子１４を覆うように配置された円筒状のセンサカバー２２とが設けられる。センサカバー２２にはＩＲカットガラス２６が撮像素子１４に対向するように設けられる。レンズ１６は、レンズ１６を透過した光がＩＲカットガラス２６を通って撮像素子１４に入射する位置に配置される。ＩＲカットガラス２６は、レンズ１６によって集光された赤外線が、撮像素子１４に到達しないように遮断するための板状フィルタである。 (Box 18)
As shown in FIGS. 1 and 2, the housing 18 is formed in a substantially cylindrical shape that opens toward the substrate 12. The housing 18 is provided with a lens barrel 24 for holding the lens 16 and a cylindrical sensor cover 22 arranged to support the lens barrel 24 and cover the imaging device 14. An IR cut glass 26 is provided on the sensor cover 22 so as to face the imaging device 14. The lens 16 is disposed at a position where the light transmitted through the lens 16 passes through the IR cut glass 26 and enters the imaging device 14. The IR cut glass 26 is a plate-like filter for blocking the infrared light collected by the lens 16 so as not to reach the imaging device 14.
　筺体１８のセンサカバー２２は、台座２０に形成された３つの筺体当接部３４に搭載されている。このように、筺体１８は、三角形の３個の頂点に対応する位置で台座２０と当接している。 The sensor cover 22 of the housing 18 is mounted on the three housing contact portions 34 formed on the pedestal 20. Thus, the housing 18 abuts on the pedestal 20 at a position corresponding to the three apexes of the triangle.
　また、筺体１８のセンサカバー２２と台座２０の筺体当接部３４との間には、接着剤は存在しない。しかし、センサカバー２２の端面の台座２０の筺体当接部３４と当接していない部分と、基板１２との間には、筺体接着剤３０（第２接着剤）が存在する。この筺体接着剤３０により、筺体１８は、基板１２に固定されている。 Further, no adhesive is present between the sensor cover 22 of the housing 18 and the housing contact portion 34 of the pedestal 20. However, between the substrate 12 and a portion of the end face of the sensor cover 22 which is not in contact with the housing contact portion 34 of the pedestal 20, a housing adhesive 30 (second adhesive) is present. The housing 18 is fixed to the substrate 12 by the housing adhesive 30.
　（レンズ１６）
　図１及び図２に示すように、レンズ１６は、レンズバレル２４に固定されている。そして、レンズ１６は、撮像素子１４と対向して配置されている。レンズ１６と、撮像素子１４との間には、レンズ１６及び撮像素子１４に対向するように、ＩＲカットガラス２６が配置されている。 (Lens 16)
As shown in FIGS. 1 and 2, the lens 16 is fixed to the lens barrel 24. The lens 16 is disposed to face the imaging device 14. An IR cut glass 26 is disposed between the lens 16 and the imaging device 14 so as to face the lens 16 and the imaging device 14.
　レンズ１６は、実際には複数枚のレンズからなるが、図面の見た目の煩わしさを避けるために、単純化した形状の１枚のレンズとして図示している。 Although the lens 16 actually consists of a plurality of lenses, it is illustrated as a single lens of a simplified shape in order to avoid the troublesome appearance of the drawing.
　（基板１２）
　基板１２は、複数の層から構成される樹脂製の平板である。基板１２の上面には、回路が配置されている。回路には、電極端子４０、及びチップ部品等の搭載部品３８が含まれる。 (Substrate 12)
The substrate 12 is a flat plate made of resin composed of a plurality of layers. A circuit is disposed on the top surface of the substrate 12. The circuit includes an electrode terminal 40 and a mounting component 38 such as a chip component.
　（搭載部品）
　搭載部品３８には、撮像素子１４からの信号を処理するＤＳＰ（Digital Signal Processor、デジタルシグナルプロセッサ）が含まれる。 (Installed parts)
The mounting component 38 includes a DSP (Digital Signal Processor) that processes a signal from the imaging device 14.
　以上説明したように、本実施形態のカメラモジュール１０においては、基板１２に貼り付けられた台座２０の上面に、撮像素子１４、及び筺体１８が、台座２０に当接して載置されている。 As described above, in the camera module 10 according to the present embodiment, the imaging device 14 and the housing 18 are mounted in contact with the pedestal 20 on the top surface of the pedestal 20 attached to the substrate 12.
　このため、基板１２が反っていて、台座２０が、基板１２に対して傾いて設けられたとしても、撮像素子１４と、筺体１８に備わるレンズ１６との間の平行度は、台座２０の上面を基準とするので、基板１２の反りの影響を受けることがない。 Therefore, even if the substrate 12 is warped and the pedestal 20 is provided to be inclined with respect to the substrate 12, the parallelism between the imaging device 14 and the lens 16 provided on the housing 18 is the upper surface of the pedestal 20 Therefore, the substrate 12 is not affected by the warpage of the substrate 12.
　これにより、撮像素子１４と、筺体１８に備わるレンズ１６とが平行になるように基板１２上に搭載することができ、撮像素子１４とレンズ１６との間の焦点距離がズレることによる、いわゆる片ボケが製造段階において発生し難い構造となっている。 As a result, the imaging device 14 can be mounted on the substrate 12 so that the imaging device 14 and the lens 16 provided on the housing 18 are parallel, and so-called piece due to the focal distance between the imaging device 14 and the lens 16 shifting. The blur is less likely to occur at the manufacturing stage.
　また、アクティブアライメントのような高価で、設定等が複雑な装置を準備する必要がなく、簡易な構造で、精度よく組み立てることができるカメラモジュールを提供することができる。 In addition, it is possible to provide a camera module that can be assembled with high accuracy and a simple structure without preparing an expensive device such as active alignment and complicated settings.
　また、本実施形態のカメラモジュール１０においては、撮像素子１４及び筺体１８と、台座２０との間には接着剤は存在しないので、接着剤の厚みによる影響を受けることがない。 Further, in the camera module 10 according to the present embodiment, no adhesive is present between the imaging device 14 and the housing 18 and the pedestal 20, and therefore, there is no influence by the thickness of the adhesive.
　すなわち、台座２０の上面に接着剤を塗布する場合に、その接着剤の厚みが不均一であると、撮像素子１４及び筺体１８が、それぞれ、台座２０に対して傾いて固定される虞がある。これにより、撮像素子１４とレンズ１６との間の焦点距離がズレて、いわゆる片ボケを発生する虞がある。 That is, when the adhesive is applied to the upper surface of the pedestal 20, if the thickness of the adhesive is not uniform, the imaging device 14 and the housing 18 may be inclined and fixed to the pedestal 20, respectively. . As a result, the focal distance between the imaging device 14 and the lens 16 may be shifted, which may cause so-called one-sided blurring.
　したがって、撮像素子１４及び筺体１８と、台座２０との間には接着剤は存在しないことにより、撮像素子１４及び筺体１８を、台座２０に対して傾くことなく、台座２０の上に搭載することができる。 Therefore, no adhesive is present between the imaging device 14 and the housing 18, and the pedestal 20, so that the imaging device 14 and the housing 18 are mounted on the pedestal 20 without being inclined with respect to the pedestal 20. Can.
　本実施形態においては、台座２０が、撮像素子１４と、３か所の撮像素子当接部３２で当接している。 In the present embodiment, the pedestal 20 is in contact with the imaging device 14 at three imaging device abutment portions 32.
　これにより、撮像素子１４は、台座２０の上面に最も安定して搭載されることができる。 Thereby, the imaging device 14 can be mounted most stably on the upper surface of the pedestal 20.
　同様に、実施形態においては、台座２０が、筺体１８と、３か所の筺体当接部３４で当接している。 Similarly, in the embodiment, the pedestal 20 is in contact with the housing 18 at three housing contact portions 34.
　これにより、筺体１８は、台座２０の上面に最も安定して搭載されることができる。 Thus, the housing 18 can be mounted most stably on the upper surface of the pedestal 20.
　また、台座２０は、一様な材質により構成されていることが好ましく、また、一枚ものであることが好ましい。 Further, the pedestal 20 is preferably made of a uniform material, and is preferably one piece.
　台座２０が、一様な材質により構成されることにより、台座２０の平坦性をより確保することができる。また、台座２０が、一枚ものであることにより、台座２０の平坦性をより確保することができる。 By forming the pedestal 20 of a uniform material, the flatness of the pedestal 20 can be further ensured. Moreover, the flatness of the pedestal 20 can be further secured by the pedestal 20 being a single piece.
　本実施形態においては、撮像素子１４、及び筺体１８は、それぞれ台座２０と３箇所で当接しているが、３箇所に限定されるものではなく、何箇所で当接するかについては、適宜選択することができる。好ましくは、２箇所～４箇所で当接するとよい。 In the present embodiment, the imaging device 14 and the housing 18 are in contact with the pedestal 20 at three locations, respectively. However, the present invention is not limited to three locations. be able to. Preferably, contact may be made at two to four places.
　本実施形態においては、撮像素子当接部３２、及び筺体当接部３４の形状は、図２及び３に示すように、それぞれ正方形状としたが、正方形状に限定されるものではなく、丸状、三角形状、四角形状等、適宜選択することができる。 In the present embodiment, the shapes of the imaging element contact portion 32 and the housing contact portion 34 are each square as shown in FIGS. 2 and 3, but the shape is not limited to a square and may be round. Shape, triangle shape, square shape, etc. can be selected suitably.
　また、本実施形態においては、台座２０は、金属製（ステンレス鋼製）であるが、金属製に限定されるものではなく、台座２０の平坦性を確保することができるものであれば、台座２０を構成する材料については、適宜選択することができる。 Further, in the present embodiment, the pedestal 20 is made of metal (made of stainless steel), but is not limited to the metal, and the pedestal can be provided as long as it can ensure the flatness of the pedestal 20. About the material which comprises 20, it can select suitably.
　また、本実施形態においては、台座２０は、図３に示したように枠状としたが、これに限定されるものではなく、平板状の台座２０の平坦性を確保することができるものであれば、台座２０の形状については、適宜選択することができる。 Further, in the present embodiment, although the pedestal 20 is frame-shaped as shown in FIG. 3, the present invention is not limited to this, and the flatness of the flat pedestal 20 can be secured. If it is, about the shape of pedestal 20, it can choose suitably.
　また、本実施形態においては、台座２０の枠部３１は、基板１２の上面に形成された８個の電極端子４０が露出するように、枠状に形成されているが、枠部３１は、基板１２の上面に形成された８個の電極端子４０が露出するように形成されているものであれば、枠部３１の形状については、適宜選択することができる。 Further, in the present embodiment, the frame portion 31 of the pedestal 20 is formed in a frame shape so that the eight electrode terminals 40 formed on the upper surface of the substrate 12 are exposed. If the eight electrode terminals 40 formed on the upper surface of the substrate 12 are formed to be exposed, the shape of the frame portion 31 can be appropriately selected.
　例えば、枠部３１は、スリット状に形成されていてもよい。 For example, the frame portion 31 may be formed in a slit shape.
　台座２０にスリットが形成されていることにより、台座２０の平坦性をより保つことができる。 By forming the slits in the pedestal 20, the flatness of the pedestal 20 can be further maintained.
　〔まとめ〕
　本発明の態様１に係るカメラモジュール１０は、レンズ１６を保持するために基板１２上に設けられた筺体１８と、前記レンズ１６を透過した光を受光するために前記基板１２上に設けられた撮像素子１４と、前記筺体１８と前記撮像素子１４とを搭載するために前記基板１２上に設けられた台座２０とを備え、前記台座は一枚の平坦な部材からなることを特徴とするカメラモジュールである。 [Summary]
The camera module 10 according to aspect 1 of the present invention is provided on the casing 12 provided on the substrate 12 for holding the lens 16 and provided on the substrate 12 for receiving light transmitted through the lens 16. A camera comprising: an imaging device 14; a pedestal 20 provided on the substrate 12 for mounting the casing 18 and the imaging device 14; the pedestal comprising a flat member It is a module.
　この特徴によれば、撮像素子とレンズを保持する筺体とが同じ台座上に搭載される。このため、簡易な構造で、精度よく撮像素子とレンズとを組み立てることができる。 According to this feature, the imaging device and the housing for holding the lens are mounted on the same pedestal. Therefore, it is possible to assemble the imaging device and the lens with high accuracy with a simple structure.
　本発明の態様２に係るカメラモジュール１０は、上記態様１において、前記台座２０が、枠状に形成された枠部３１と、前記撮像素子１４を搭載するために前記枠部３１から内側に突出する複数の撮像素子搭載部（撮像素子当接部３２）と、前記筺体１８を搭載するために前記枠部３１から外側に突出する複数の筺体搭載部（筺体当接部３４）とを有してもよい。 In the camera module 10 according to aspect 2 of the present invention, in the aspect 1, the pedestal 20 protrudes inward from the frame 31 for mounting the frame 31 formed in a frame shape and the imaging device 14 A plurality of imaging element mounting portions (imaging element contact portions 32) to be mounted, and a plurality of housing mounting portions (housing contact portions 34) projecting outward from the frame portion 31 for mounting the housing 18 May be
　上記の構成によれば、簡易な構造で、撮像素子と筺体とを同じ台座上に搭載することができる。 According to the above configuration, the imaging device and the housing can be mounted on the same pedestal with a simple structure.
　本発明の態様３に係るカメラモジュール１０は、上記態様２において、前記撮像素子１４が、前記撮像素子搭載部（撮像素子当接部３２）と当接し、前記基板１２と第１接着剤（ダイボンドペースト２８）を介して接着され、前記筺体１８が、前記筺体搭載部（筺体当接部３４）と当接し、前記基板１２と第２接着剤（筺体接着剤３０）を介して接着されてもよい。 In the camera module 10 according to aspect 3 of the present invention, in the above aspect 2, the imaging element 14 contacts the imaging element mounting portion (imaging element contact portion 32), and the substrate 12 and the first adhesive (die bond) Even if the casing 18 is adhered via the paste 28) and the casing 18 abuts on the casing mounting portion (the casing contact portion 34) and is adhered via the substrate 12 and the second adhesive (the casing adhesive 30) Good.
　上記の構成によれば、接着剤の塗布むらによる撮像素子、筺体の搭載傾きの発生を防止することができる。 According to the above configuration, it is possible to prevent the occurrence of the mounting inclination of the imaging device and the housing due to the uneven application of the adhesive.
　本発明の態様４に係るカメラモジュール１０は、上記態様２又は３において、前記複数の撮像素子搭載部（撮像素子当接部３２）が、三角形の３個の頂点に対応する位置にそれぞれ配置された３個の撮像素子搭載部であってもよい。 In the camera module 10 according to aspect 4 of the present invention, in the above aspect 2 or 3, the plurality of imaging element mounting portions (imaging element contact portions 32) are disposed at positions corresponding to three apexes of a triangle. It may be three image sensor mounting parts.
　上記の構成によれば、３点により一つの平面が特定されるため、撮像素子の台座への搭載状態が安定する。 According to the above configuration, since one plane is specified by the three points, the mounting state of the imaging device on the pedestal is stabilized.
　本発明の態様５に係るカメラモジュール１０は、上記態様２～４の何れか１態様において、前記複数の筺体搭載部（筺体当接部３４）が、三角形の３個の頂点に対応する位置にそれぞれ配置された３個の筺体搭載部であってもよい。 The camera module 10 according to aspect 5 of the present invention is the camera module 10 according to any one of the aspects 2 to 4, wherein the plurality of housing mounting portions (housing contact portion 34) are located at positions corresponding to three apexes of a triangle. It may be three housings arranged respectively.
　上記の構成によれば、３点により一つの平面が特定されるため、筺体の台座への搭載状態が安定する。 According to the above configuration, since one plane is specified by the three points, the mounting state of the housing on the pedestal is stabilized.
　上記の構成によれば、撮像素子と電極端子とを台座の枠部の内側で電気的に接続することができる。 According to said structure, an image pick-up element and an electrode terminal can be electrically connected inside the frame part of a base.
　本発明の態様６に係るカメラモジュール１０は、上記態様１～５の何れか１態様において、前記台座２０は、金属板であってもよい。 In the camera module 10 according to aspect 6 of the present invention, in any one of the above aspects 1 to 5, the pedestal 20 may be a metal plate.
　上記の構成によれば、台座の平坦性を確保することができる。 According to the above configuration, the flatness of the pedestal can be secured.
　本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。さらに、各実施形態にそれぞれ開示された技術的手段を組み合わせることにより、新しい技術的特徴を形成することができる。 The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.
　１０　カメラモジュール
　１２　基板
　１４　撮像素子
　１６　レンズ
　１８　筺体
　２０　台座
　２８　ダイボンドペースト（第１接着剤） 
　３０　筺体接着剤（第２接着剤）
　３１　枠部
　３２　撮像素子当接部（撮像素子搭載部）
　３４　筺体当接部（筺体搭載部）　４０　電極端子 Reference Signs List 10 camera module 12 substrate 14 imaging device 16 lens 18 housing 20 pedestal 28 die bonding paste (first adhesive)
30 Housing adhesive (second adhesive)
31 frame portion 32 image sensor contact portion (image sensor mounting portion)
34 Housing contact part (housing mounting part) 40 Electrode terminal

Claims (7)

  1. 　レンズを保持するために基板上に設けられた筺体と、
    　前記レンズを透過した光を受光するために前記基板上に設けられた撮像素子と、
    　前記筺体と前記撮像素子とを搭載するために前記基板上に設けられた台座とを備え、
    　前記台座は一枚の平坦な部材からなることを特徴とするカメラモジュール。     A housing provided on the substrate to hold the lens;
    An imaging element provided on the substrate to receive light transmitted through the lens;
    A pedestal provided on the substrate for mounting the housing and the imaging device;
    The camera module characterized in that the pedestal is made of one flat member.
  2. 　前記台座が、
    　枠状に形成された枠部と、
    　前記撮像素子を搭載するために前記枠部から内側に突出する複数の撮像素子搭載部と、
    　前記筺体を搭載するために前記枠部から外側に突出する複数の筺体搭載部とを有する請求項１に記載のカメラモジュール。     The pedestal is
    A frame portion formed in a frame shape,
    A plurality of imaging element mounting portions projecting inward from the frame portion for mounting the imaging element;
    The camera module according to claim 1, further comprising: a plurality of housing mounting portions protruding outward from the frame portion for mounting the housing.
  3. 　前記撮像素子が、前記撮像素子搭載部と当接し、前記基板と第１接着剤を介して接着され、
    　前記筺体が、前記筺体搭載部と当接し、前記基板と第２接着剤を介して接着される請求項２に記載のカメラモジュール。     The image pickup element is in contact with the image pickup element mounting portion, and is bonded to the substrate via the first adhesive.
    The camera module according to claim 2, wherein the housing is in contact with the housing mounting portion and is adhered to the substrate via a second adhesive.
  4. 　前記複数の撮像素子搭載部が、三角形の３個の頂点に対応する位置にそれぞれ配置された３個の撮像素子搭載部である請求項２又は３に記載のカメラモジュール。 The camera module according to claim 2 or 3, wherein the plurality of imaging element mounting portions are three imaging element mounting portions respectively disposed at positions corresponding to three apexes of a triangle.
  5. 　前記複数の筺体搭載部が、三角形の３個の頂点に対応する位置にそれぞれ配置された３個の筺体搭載部である請求項２～４の何れか１項に記載のカメラモジュール。 The camera module according to any one of claims 2 to 4, wherein the plurality of casing mounting portions are three casing mounting portions respectively disposed at positions corresponding to three apexes of a triangle.
  6. 　前記台座は、金属板である請求項１～５の何れか１項に記載のカメラモジュール。 The camera module according to any one of claims 1 to 5, wherein the pedestal is a metal plate.
  7. 　レンズを透過した光を受光するための撮像素子を基板の上に設けられた台座の上に搭載する撮像素子搭載工程と、
    　前記レンズを保持する筺体を前記台座の上に搭載する筺体搭載工程とを包含することを特徴とするカメラモジュールの製造方法。     An imaging element mounting step of mounting an imaging element for receiving light transmitted through the lens on a pedestal provided on the substrate;
    And a housing mounting step of mounting a housing for holding the lens on the pedestal.
PCT/JP2018/023845 2017-08-03 2018-06-22 Camera module and method for manufacturing camera module WO2019026462A1 (en)

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JP2017-150997 2017-08-03
JP2017150997 2017-08-03

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003189195A (en) * 2001-02-28 2003-07-04 Fujitsu Ltd Semiconductor device, imaging semiconductor device, and its manufacturing method
JP2003332549A (en) * 2002-05-17 2003-11-21 Fuji Photo Film Co Ltd Mounting structure and imaging device
JP2004104632A (en) * 2002-09-12 2004-04-02 Minolta Co Ltd Digital camera
JP2007228463A (en) * 2006-02-27 2007-09-06 Matsushita Electric Ind Co Ltd Camera module

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003189195A (en) * 2001-02-28 2003-07-04 Fujitsu Ltd Semiconductor device, imaging semiconductor device, and its manufacturing method
JP2003332549A (en) * 2002-05-17 2003-11-21 Fuji Photo Film Co Ltd Mounting structure and imaging device
JP2004104632A (en) * 2002-09-12 2004-04-02 Minolta Co Ltd Digital camera
JP2007228463A (en) * 2006-02-27 2007-09-06 Matsushita Electric Ind Co Ltd Camera module

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