WO2019019235A1 - 触控式oled显示面板以及显示装置 - Google Patents

触控式oled显示面板以及显示装置 Download PDF

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Publication number
WO2019019235A1
WO2019019235A1 PCT/CN2017/098138 CN2017098138W WO2019019235A1 WO 2019019235 A1 WO2019019235 A1 WO 2019019235A1 CN 2017098138 W CN2017098138 W CN 2017098138W WO 2019019235 A1 WO2019019235 A1 WO 2019019235A1
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Prior art keywords
touch
trace
signal
array substrate
structure layer
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Ceased
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PCT/CN2017/098138
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English (en)
French (fr)
Inventor
叶剑
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US15/578,277 priority Critical patent/US10516014B2/en
Publication of WO2019019235A1 publication Critical patent/WO2019019235A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a touch-sensitive OLED display panel, and to a display device including the touch-sensitive OLED display panel.
  • OLEDs are display devices molded by organic materials, which have the advantages of low operating voltage, fast response, high luminous efficiency, wide viewing angle and wide operating temperature. Conducive to the thin and light, low power and surface design of the display device.
  • the OLED display panel and the touch panel are separately formed, and then stacked together to form a complete touch display device, which will result in the overall thickness of the OLED device.
  • the increase is not conducive to the thin and light design of the product.
  • touch electrodes disposed in an array are prepared directly in the OLED display panel.
  • the touch electrodes and the array substrate are located in different structural layers, and the display signal traces (data lines and scan lines) on the array substrate are provided with a bonding area, and the signal is displayed.
  • the line is connected to the display driver chip on the main board through a flexible circuit board (FPC) in the connection area of the cable; the touch signal trace (Tx/Rx) corresponding to the touch electrode is provided with another connection area,
  • the control signal trace is connected to the touch drive chip on the main board through another flexible circuit board in the connection area of the trace.
  • the array substrate and the touch layer are respectively provided with a wiring connection area, and two bonding circuit processes are required to connect two flexible circuit boards, respectively, and the signal lines and touch signals are respectively displayed.
  • the wire is connected to the corresponding driver chip on the motherboard.
  • the present invention provides a touch-sensitive OLED display panel in which a touch structure layer is disposed in an OLED display panel to reduce the overall thickness of the OLED display device.
  • the signal routing channel is set, so that the touch signal trace and the display signal trace can share a single trace connection area, and only one flexible circuit board can be used to connect the touch signal trace and the display signal trace to the main board. Drive on the chip.
  • a touch-sensitive OLED display panel includes an array substrate, a light-emitting structure layer disposed on the array substrate, and an encapsulation film layer encapsulating the light-emitting structure layer on the array substrate, where the package film layer is located a sidewall of the light-emitting structure layer, wherein the first surface of the package film layer is provided with a touch structure layer, and the sidewall is provided with a first layer connecting the touch structure layer and the array substrate a via OLED display panel is further provided with a trace soldering region; the first via hole is configured as a signal trace channel, and the touch structure layer is guided by the first via hole
  • the touch signal traces in the array and the display signal traces in the array substrate are simultaneously connected to the trace connection area to share the trace connection area.
  • the trace connection region is disposed on the first surface of the encapsulation film layer, the touch signal trace is connected to the trace connection region on the first surface, and the display signal is traced Extending through the first via to the first surface and to the trace connection region.
  • the trace connection area is disposed on the array substrate, the display signal trace is connected to the trace connection area in the array substrate, and the touch signal trace passes the first pass A hole extends onto the array substrate and is connected to the trace connection region.
  • the side wall is further provided with a second through hole, the second through hole communicates with the first through hole and the outer wall of the side wall, and the wire connecting area is disposed on the outer wall of the side wall
  • the touch signal trace extends through the first via and the second via to an outer wall of the sidewall and is connected to the trace connection region, and the display signal trace passes through the first A via and the second via extend to an outer wall of the sidewall and are connected to the trace connection region.
  • the touch control layer includes a touch driving electrode and a touch sensing electrode, and the touch driving electrode and the touch sensing electrode are connected to the touch signal traces in a one-to-one correspondence.
  • the touch driving electrode and the touch sensing electrode are disposed in different structural layers, and an insulating layer is disposed between the touch driving electrode and the touch sensing electrode.
  • the light emitting structure layer comprises an anode, an organic light emitting layer and a cathode which are sequentially disposed on the array substrate.
  • the present invention also provides a display device comprising the touch-sensitive OLED display panel as described above.
  • FIG. 1 is a schematic structural diagram of a touch-sensitive OLED display panel according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of a touch structure layer in Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of a touch-sensitive OLED display panel according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic structural diagram of a touch structure layer in Embodiment 2 of the present invention.
  • FIG. 6 is a schematic structural diagram of a display device according to Embodiment 4 of the present invention.
  • the touch-sensitive OLED display panel includes an array substrate 1 , a light-emitting structure layer 2 , and a package film layer 3 .
  • the array substrate 1 is a thin film transistor array substrate, which may be a rigid glass substrate or a flexible substrate, wherein the array is arranged with a plurality of thin film transistors.
  • the light emitting structure layer 2 includes a plurality of organic electroluminescent pixel structures including an anode 21, an organic light emitting layer 22, and a cathode 23 which are sequentially disposed on the array substrate 1.
  • the encapsulating film layer 3 is used for encapsulating the light emitting structure layer 2 on the array substrate 1 to protect against water and dust.
  • the encapsulating film layer 3 includes sidewalls located around the light emitting structure layer 2 . 31.
  • the display substrate 1 is provided with a display signal trace 11 for transmitting a display signal, and the display signal trace 11 is, for example, a data line, a scan line, or the like.
  • the first surface of the encapsulating film layer 3 is provided with a touch structure layer 4
  • the touch structure layer 4 is further provided with a glass cover 5 .
  • a polarizer is further disposed between the touch structure layer 4 and the cover glass 5 for improving the contrast of the display panel.
  • the touch structure layer 4 is provided with a touch electrode and a touch signal trace 41 for transmitting a touch signal.
  • the touch structure layer 4 is directly formed on the package film layer 3 by a patterning process, that is, the touch structure layer 4 is disposed in the OLED display panel, thereby reducing the overall OLED display device.
  • the thickness is advantageous for realizing lightening and thinning of the OLED display device.
  • a first via 301 is formed in the sidewall 31 of the package film layer 3 to connect the touch structure layer 4 and the array substrate 1 .
  • the aperture 301 is configured as a signal routing channel.
  • a bonding area 6 is disposed on the first surface of the encapsulating film layer 3, and the touch signal traces 41 in the touch structure layer 4 are directly connected on the first surface.
  • the display signal trace 11 in the array substrate 1 extends through the first via 301 to the first surface and is connected to the trace connection region 6. .
  • the touch signal traces 41 and the display signal traces 11 in different structural layers are finally extended to the same structural layer under the guidance of the first via holes 301, sharing the same trace connection region. 6.
  • the touch driving electrode Tx and the touch sensing electrode Rx are connected to the touch signal trace 41 in a one-to-one correspondence, that is, each touch driving electrode Tx is connected with a touch signal trace 41.
  • a touch signal trace 41 is also connected to each of the touch sensing electrodes Rx.
  • the trace connection region 6 is disposed on the array substrate 1, and the display signal trace 11 in the array substrate 1 is in the The array substrate 1 is directly connected to the trace connection region 6.
  • the touch signal traces 41 in the touch structure layer 4 are extended to the array substrate 1 through the guiding of the first via 301. And connected to the trace connection area 6. Therefore, the touch signal traces 41 and the display signal traces 11 in different structural layers are finally guided to the same structural layer under the guidance of the first via 301, sharing the same walking. Line connection area 6.
  • the touch driving chip 71 and the display driving chip 72 of the driving module 7 are connected to the wiring connecting region 6 on the array substrate 1 through the flexible wiring board 8.
  • only one trace connection region 6 needs to be disposed, and the connection between the touch signal and the display signal can be simultaneously realized by one bonding process, and the number of flexible circuit boards is reduced.
  • touch signal traces 41 are extended on the array substrate 1 , they should be arranged offset from the display signal traces 11 , that is, the touch signals are taken away.
  • the line 41 and the display signal trace 11 are insulated from each other.
  • the touch driving electrode Tx and the touch sensing electrode Rx in the touch structure layer 4 are disposed in different structural layers (differential layer structure setting), An insulating layer 42 is disposed between the touch driving electrode Tx and the touch sensing electrode Rx.
  • the structure of the touch structure layer 4 of the present embodiment may also adopt the manner of the same layer structure as in Embodiment 1.
  • the touch structure layer 4 can also adopt the manner in which the different layer structure is disposed in this embodiment.
  • connection area 6 is disposed on the outer wall of the side wall 31 of the encapsulating film layer 3, and the side wall 31 is further A second via 302 is provided, and the second via 302 communicates with the first via 301 and the outer wall of the spacer 31.
  • the display signal traces 11 in the array substrate 1 are guided by the first via holes 301 and the second via holes 302 to the outer wall of the side wall 31 and connected to the trace connection.
  • the touch signal traces 41 in the touch structure layer 4 are also guided to the outer walls of the side walls 31 under the guidance of the first via holes 301 and the second via holes 302. Connected to the trace connection area 6.
  • the touch signal trace 41 and the display signal trace 11 located in different structural layers are finally extended to the same structural layer under the guidance of the first via 301 and the second via 302.
  • the same routing connection area 6 is shared.
  • the touch driving chip 71 and the display driving chip 72 of the driving module 7 are connected to the wiring connecting region 6 on the outer wall of the side wall 31 through the flexible wiring board 8.
  • only one trace connection region 6 needs to be disposed, and the connection between the touch signal and the display signal can be simultaneously realized by one bonding process, and the number of flexible circuit boards is reduced.
  • the touch signal trace 41 and the display signal trace 11 are arranged at a position offset from each other in the first via 301 and the second via 302, that is, The touch signal trace 41 and the display signal trace 11 are insulated from each other.
  • the present embodiment provides a display device.
  • the display device includes a driving unit 200 and a display panel 100 .
  • the driving unit 200 provides a driving signal to the display panel 100 to enable the display panel 100 .
  • the display panel 100 adopts the present invention as implemented above.
  • the touch OLED display panel provided by the example.
  • the touch-sensitive OLED display panel provided by the embodiment of the present invention firstly sets the touch structure layer in the OLED display panel to reduce the overall thickness of the OLED display device.
  • a first via hole connecting the touch structure layer and the array substrate is disposed in the package film layer, and the first via hole is disposed as a signal trace channel, and the touch in the touch structure layer is guided by the first via hole.
  • the control signal traces and the display signal traces in the array substrate can share a single trace connection area, and only one flexible circuit board can be used to connect the touch signal trace and the display signal trace to the driver chip of the motherboard.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种触控式OLED显示面板及包含其的显示装置，触控式OLED显示面板包括：阵列基板（1）、设置在阵列基板（1）上的发光结构层（2）、将发光结构层（2）封装在阵列基板（1）上的封装薄膜层（3）；封装薄膜层（3）包括位于发光结构层（2）四周的侧墙（31），其中，封装薄膜层（3）的第一表面上设置有触控结构层（4），侧墙（31）中设置有连通触控结构层（4）和阵列基板（1）的第一过孔（301）；触控式OLED显示面板还设置有走线连接区（6）；第一过孔（301）被设置为信号走线通道，通过第一过孔（301）的引导，触控结构层（4）中的触控信号走线（41）和阵列基板（1）中的显示信号走线（11）同时连接到走线连接区（6），共用走线连接区（6）。

Description

触控式OLED显示面板以及显示装置 技术领域
本发明涉及显示器技术领域，尤其涉及一种触控式OLED显示面板，还涉及包含该触控式OLED显示面板的显示装置。
背景技术
有机电致发光显示面板(Organic light-emitting diodes，OLED)是一种利用有机材料封装成型的显示器件，其具有工作电压低、响应速度快、发光效率高、视角广和工作温度广等优点，利于显示器件的轻薄化、低功耗和曲面设计。
在OLED显示面板与触控面板整合的技术上，一般采用OLED显示面板与触控面板单独制成后，再叠加贴合在一起形成完整的触控显示装置，这种结构会导致OLED装置整体厚度增加，不利于产品的轻薄化设计。
为了改善厚度较大的问题，现有的一些触控式的OLED显示面板中，直接在OLED显示面板中制备形成阵列设置的触控电极。在这种OLED显示面板中，触控电极和阵列基板位于不同的结构层，阵列基板上的显示信号走线(数据线和扫描线)设置有一个走线连接区(bonding area)，显示信号走线在该走线连接区通过一个柔性线路板(FPC)连接到主板上的显示驱动芯片；触控电极对应的触控信号走线(Tx/Rx)则设置有另一个走线连接区，触控信号走线在该走线连接区通过另一个柔性线路板连接到主板上的触控驱动芯片。
在以上的触控式的OLED显示面板中，阵列基板和触控层分别设置有走线连接区，需要使用两次bonding工艺连接两个柔性线路板，分别将显示信号走线和触控信号走线连接至主板上对应的驱动芯片。
因此，现有技术还有待于改进和发展。
发明内容
鉴于现有技术存在的不足，本发明提供了一种触控式OLED显示面板，将触控结构层设置在OLED显示面板中，减小OLED显示装置整体厚度；另外通 过设置信号走线通道，由此触控信号走线和显示信号走线可以共用一个走线连接区，仅需要一个柔性线路板就可以将触控信号走线和显示信号走线连接到主板的驱动芯片上。
为了达到上述的目的，本发明采用了如下的技术方案：
一种触控式OLED显示面板，包括阵列基板、设置在所述阵列基板上的发光结构层、将所述发光结构层封装在所述阵列基板上的封装薄膜层，所述封装薄膜层包括位于所述发光结构层四周的侧墙，其中，所述封装薄膜层的第一表面上设置有触控结构层，所述侧墙中设置有连通所述触控结构层和所述阵列基板的第一过孔，所述触控式OLED显示面板还设置有走线焊接区；所述第一过孔被设置为信号走线通道，通过所述第一过孔的引导，所述触控结构层中的触控信号走线和所述阵列基板中的显示信号走线同时连接到所述走线连接区，共用所述走线连接区。
其中，所述走线连接区设置在所述封装薄膜层的第一表面上，所述触控信号走线在所述第一表面上连接至所述走线连接区，所述显示信号走线通过所述第一过孔延伸至所述第一表面上并连接至所述走线连接区。
其中，所述走线连接区设置在所述阵列基板上，所述显示信号走线在所述阵列基板中连接至所述走线连接区，所述触控信号走线通过所述第一过孔延伸至所述阵列基板上并连接至所述走线连接区。
其中，所述侧墙中还设置有第二过孔，所述第二过孔连通所述第一过孔和所述侧墙的外壁，所述走线连接区设置在所述侧墙的外壁上；所述触控信号走线通过所述第一过孔和所述第二过孔延伸至侧墙的外壁上并连接至所述走线连接区，所述显示信号走线通过所述第一过孔和所述第二过孔延伸至侧墙的外壁上并连接至所述走线连接区。
其中，所述触控结构层包括触控驱动电极和触控感应电极，所述触控驱动电极和所述触控感应电极与所述触控信号走线一一对应地连接。
其中，所述触控驱动电极和所述触控感应电极相互绝缘地设置在同一结构层中。
其中，所述触控驱动电极和所述触控感应电极设置在不同的结构层中，所述触控驱动电极和所述触控感应电极之间设置有绝缘层。
其中，所述发光结构层包括依次设置在所述阵列基板上的阳极、有机发光层和阴极。
其中，所述触控式OLED显示面板还包括驱动模块，所述驱动模块包括触控驱动芯片和显示驱动芯片，所述触控驱动芯片和所述显示驱动芯片通过一柔性线路板连接到所述走线连接区，所述柔性线路板在所述走线连接区与所述触控信号走线和所述显示信号走线电性连接；所述触控驱动芯片与所述触控信号走线信号连通，所述显示驱动芯片与所述显示信号走线信号连通。
本发明还提供了一种显示装置，其包括如上所述的触控式OLED显示面板。
相比于现有技术，本发明实施例提供的触控式OLED显示面板，首先是将触控结构层设置在OLED显示面板中，减小OLED显示装置整体厚度。另外，在封装薄膜层中设置有连通触控结构层和阵列基板的第一过孔，第一过孔被设置为信号走线通道，通过第一过孔的引导，触控结构层中的触控信号走线和阵列基板中的显示信号走线可以共用一个走线连接区，仅需要一个柔性线路板就可以将触控信号走线和显示信号走线连接到主板的驱动芯片上。通过减少bonding工艺的次数，提高面板中信号走线连接的稳定性；通过减少使用柔性线路板的数量，节省其所占用的空间，有利于OLED显示面板轻薄化和窄边框的发展。
附图说明
图1是本发明实施例1提供的触控式OLED显示面板的结构示意图；
图2是本发明实施例1中的触控结构层的结构示意图；
图3是本发明实施例2提供的触控式OLED显示面板的结构示意图；
图4是本发明实施例2中的触控结构层的结构示意图；
图5是本发明实施例3提供的触控式OLED显示面板的结构示意图；
图6是本发明实施例4提供的显示装置的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明 并不限于这些实施方式。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。
实施例1
本实施例提供了一种触控式OLED显示面板，如图1所示，所述触控式OLED显示面板包括阵列基板1、发光结构层2和封装薄膜层3。所述阵列基板1报薄膜晶体管阵列基板，其可以是刚性的玻璃基板也可以是柔性基板，其中阵列排布有多个薄膜晶体管。所述发光结构层2中包含多个有机电致发光像素结构，其包括依次设置在所述阵列基板1上的阳极21、有机发光层22和阴极23。所述封装薄膜层3用于将所述发光结构层2封装在所述阵列基板1上，起到防水防尘的作用，所述封装薄膜层3包括位于所述发光结构层2四周的侧墙31。其中，所述阵列基板1中设置有用于传输显示信号的显示信号走线11，所述显示信号走线11例如是数据线、扫描线等。
本实施例中，如图1所示，所述封装薄膜层3的第一表面上设置有触控结构层4，所述触控结构层4上还设置有玻璃盖板5。在另外一些优选的实施例中，所述触控结构层4和所述玻璃盖板5之间还设置有偏光片，用于提高显示面板的对比度。其中，所述触控结构层4中设置有触控电极和用于传输触控信号的触控信号走线41。进一步地，所述触控结构层4是通过图形化工艺直接制备形成在所述封装薄膜层3上，即，触控结构层4是设置在OLED显示面板中，由此减小OLED显示装置整体厚度，有利于实现OLED显示装置的轻薄化。
本实施例中，如图1所示，所述封装薄膜层3的侧墙31中设置有连通所述触控结构层4和所述阵列基板1的第一过孔301，所述第一过孔301被设置为信号走线通道。具体地，所述封装薄膜层3的第一表面上设置有走线连接区(bonding area)6，所述触控结构层4中的触控信号走线41在所述第一表面上直接连接至所述走线连接区6，所述阵列基板1中的显示信号走线11则通过所述第一过孔301的引导延伸至所述第一表面上并连接至所述走线连接区6。位于不同结构层中的所述触控信号走线41和所述显示信号走线11，在所述第一过孔301的引导下，最终延伸至同一结构层中，共用同一个走线连接区6。
其中，需要说明的是，所述显示信号走线11延伸至所述第一表面上之后， 其应当是与所述触控信号走线41相互错位排布的，即所述触控信号走线41和所述显示信号走线11之间是相互绝缘的。
进一步地，如图1所示，所述触控式OLED显示面板还包括驱动模块7，所述驱动模块7包括触控驱动芯片71和显示驱动芯片72，所述触控驱动芯片71和所述显示驱动芯片72通过一柔性线路板8连接到所述走线连接区6，所述柔性线路板8在所述走线连接区6与所述触控信号走线41和所述显示信号走线11电性连接。其中，所述触控驱动芯片71与所述触控信号走线41信号连通，所述显示驱动芯片72与所述显示信号走线11信号连通。
以上实施例提供的触控式OLED显示面板，仅需要设置一个走线连接区61，通过一次bonding工艺就可以同时实现触控信号和显示信号的连接，减少柔性线路板的使用数量。
如前所述，所述触控结构层4是通过图形化工艺直接制备形成在所述封装薄膜层3上。具体到本实施例中，如图2所示，所述触控结构层4中包括触控驱动电极Tx和触控感应电极Rx，所述触控驱动电极Tx和所述触控感应电极Rx相互绝缘地设置在同一结构层(同层结构设置)中。具体可以是先制备一层导电材料层，然后通过构图工艺，将导电材料层刻蚀形成图形化的触控驱动电极Tx和触控感应电极Rx。其中，所述触控驱动电极Tx和所述触控感应电极Rx与所述触控信号走线41一一对应地连接，即每一个触控驱动电极Tx连接有一条触控信号走线41，每一个触控感应电极Rx也连接有一条触控信号走线41。
实施例2
本实施例与实施例1不同的是，如图3所示，本实施例中，走线连接区6设置在所述阵列基板1上，所述阵列基板1中的显示信号走线11在所述阵列基板1中直接连接至所述走线连接区6，所述触控结构层4中的触控信号走线41则通过所述第一过孔301的引导延伸至所述阵列基板1上并连接至所述走线连接区6。由此，位于不同结构层中的所述触控信号走线41和所述显示信号走线11，在所述第一过孔301的引导下，最终延伸至同一结构层中，共用同一个走线连接区6。此时，驱动模块7的触控驱动芯片71和显示驱动芯片72通过柔性线路板8连接到位于阵列基板1上走线连接区6。本实施例中的触控式OLED显示面板，也是仅需要设置一个走线连接区6，通过一次bonding工艺就可以同时实现触控信号和显示信号的连接，减少柔性线路板的使用数量。
其中，需要说明的是，所述触控信号走线41延伸至所述阵列基板1上之后，其应当是与所述显示信号走线11相互错位排布的，即，所述触控信号走线41和所述显示信号走线11之间是相互绝缘的。
另外，在本实施例中，如图4所示，所述触控结构层4中的触控驱动电极Tx和触控感应电极Rx设置在不同的结构层(异层结构设置)中，所述触控驱动电极Tx和所述触控感应电极Rx之间设置有绝缘层42。
需要说明的是，本实施例的触控结构层4的结构，也可以采用如实施例1中的同层结构设置的方式。当然，在实施例1中，触控结构层4也可以采用本实施例中异层结构设置的方式。
实施例3
本实施例与实施例1不同的是，如图5所示，本实施例中，走线连接区6设置在所述封装薄膜层3的侧墙31的外壁上，所述侧墙31中还设置有第二过孔302，所述第二过孔302连通所述第一过孔301和所述侧墙31的外壁。所述阵列基板1中的显示信号走线11在所述第一过孔301和所述第二过孔302的引导下，延伸至所述侧墙31的外壁上并连接至所述走线连接区6；所述触控结构层4中的触控信号走线41也是在所述第一过孔301和所述第二过孔302的引导下，延伸至所述侧墙31的外壁上并连接至所述走线连接区6。由此，位于不同结构层中的所述触控信号走线41和所述显示信号走线11，在所述第一过孔301和第二过孔302的引导下，最终延伸至同一结构层中，共用同一个走线连接区6。此时，驱动模块7的触控驱动芯片71和显示驱动芯片72通过柔性线路板8连接到位于侧墙31的外壁上的走线连接区6。本实施例中的触控式OLED显示面板，也是仅需要设置一个走线连接区6，通过一次bonding工艺就可以同时实现触控信号和显示信号的连接，减少柔性线路板的使用数量。
其中，需要说明的是，所述所述触控信号走线41和所述显示信号走线11在所述第一过孔301和所述第二过孔302是相互错位排布的，即，所述触控信号走线41和所述显示信号走线11之间是相互绝缘的。
实施例4
本实施例提供了一种显示装置，如图6所示，所述显示装置包括驱动单元200和显示面板100，所述驱动单元200向所述显示面板100提供驱动信号以使所述显示面板100显示画面。其中，所述显示面板100采用了本发明如上实施 例所提供的触控式OLED显示面板。
综上所述，本发明实施例提供的触控式OLED显示面板，首先是将触控结构层设置在OLED显示面板中，减小OLED显示装置整体厚度。另外，在封装薄膜层中设置有连通触控结构层和阵列基板的第一过孔，第一过孔被设置为信号走线通道，通过第一过孔的引导，触控结构层中的触控信号走线和阵列基板中的显示信号走线可以共用一个走线连接区，仅需要一个柔性线路板就可以将触控信号走线和显示信号走线连接到主板的驱动芯片上。通过减少bonding工艺的次数，提高面板中信号走线连接的稳定性；通过减少使用柔性线路板的数量，节省其所占用的空间，有利于OLED显示面板轻薄化和窄边框的发展。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (18)

  1. 一种触控式OLED显示面板，包括阵列基板、设置在所述阵列基板上的发光结构层、将所述发光结构层封装在所述阵列基板上的封装薄膜层，所述封装薄膜层包括位于所述发光结构层四周的侧墙，其中，所述封装薄膜层的第一表面上设置有触控结构层，所述侧墙中设置有连通所述触控结构层和所述阵列基板的第一过孔，所述触控式OLED显示面板还设置有走线焊接区；
    所述第一过孔被设置为信号走线通道，通过所述第一过孔的引导，所述触控结构层中的触控信号走线和所述阵列基板中的显示信号走线同时连接到所述走线连接区，共用所述走线连接区。
  2. 根据权利要求1所述的触控式OLED显示面板，其中，所述走线连接区设置在所述封装薄膜层的第一表面上，所述触控信号走线在所述第一表面上连接至所述走线连接区，所述显示信号走线通过所述第一过孔延伸至所述第一表面上并连接至所述走线连接区。
  3. 根据权利要求1所述的触控式OLED显示面板，其中，所述走线连接区设置在所述阵列基板上，所述显示信号走线在所述阵列基板中连接至所述走线连接区，所述触控信号走线通过所述第一过孔延伸至所述阵列基板上并连接至所述走线连接区。
  4. 根据权利要求1所述的触控式OLED显示面板，其中，所述侧墙中还设置有第二过孔，所述第二过孔连通所述第一过孔和所述侧墙的外壁，所述走线连接区设置在所述侧墙的外壁上；所述触控信号走线通过所述第一过孔和所述第二过孔延伸至侧墙的外壁上并连接至所述走线连接区，所述显示信号走线通过所述第一过孔和所述第二过孔延伸至侧墙的外壁上并连接至所述走线连接区。
  5. 根据权利要求1所述的触控式OLED显示面板，其中，所述触控结构层包括触控驱动电极和触控感应电极，所述触控驱动电极和所述触控感应电极与所述触控信号走线一一对应地连接。
  6. 根据权利要求5所述的触控式OLED显示面板，其中，所述触控驱动电极和所述触控感应电极相互绝缘地设置在同一结构层中。
  7. 根据权利要求5所述的触控式OLED显示面板，其中，所述触控驱动电 极和所述触控感应电极设置在不同的结构层中，所述触控驱动电极和所述触控感应电极之间设置有绝缘层。
  8. 根据权利要求1所述的触控式OLED显示面板，其中，所述发光结构层包括依次设置在所述阵列基板上的阳极、有机发光层和阴极。
  9. 根据权利要求1所述的触控式OLED显示面板，其中，所述触控式OLED显示面板还包括驱动模块，所述驱动模块包括触控驱动芯片和显示驱动芯片，所述触控驱动芯片和所述显示驱动芯片通过一柔性线路板连接到所述走线连接区，所述柔性线路板在所述走线连接区与所述触控信号走线和所述显示信号走线电性连接；所述触控驱动芯片与所述触控信号走线信号连通，所述显示驱动芯片与所述显示信号走线信号连通。
  10. 一种显示装置，包括触控式OLED显示面板，其中，所述触控式OLED显示面板包括阵列基板、设置在所述阵列基板上的发光结构层、将所述发光结构层封装在所述阵列基板上的封装薄膜层，所述封装薄膜层包括位于所述发光结构层四周的侧墙，所述封装薄膜层的第一表面上设置有触控结构层，所述侧墙中设置有连通所述触控结构层和所述阵列基板的第一过孔，所述触控式OLED显示面板还设置有走线焊接区；
    所述第一过孔被设置为信号走线通道，通过所述第一过孔的引导，所述触控结构层中的触控信号走线和所述阵列基板中的显示信号走线同时连接到所述走线连接区，共用所述走线连接区。
  11. 根据权利要求10所述的显示装置，其中，所述走线连接区设置在所述封装薄膜层的第一表面上，所述触控信号走线在所述第一表面上连接至所述走线连接区，所述显示信号走线通过所述第一过孔延伸至所述第一表面上并连接至所述走线连接区。
  12. 根据权利要求10所述的显示装置，其中，所述走线连接区设置在所述阵列基板上，所述显示信号走线在所述阵列基板中连接至所述走线连接区，所述触控信号走线通过所述第一过孔延伸至所述阵列基板上并连接至所述走线连接区。
  13. 根据权利要求10所述的显示装置，其中，所述侧墙中还设置有第二过孔，所述第二过孔连通所述第一过孔和所述侧墙的外壁，所述走线连接区设置在所述侧墙的外壁上；所述触控信号走线通过所述第一过孔和所述第二过孔延 伸至侧墙的外壁上并连接至所述走线连接区，所述显示信号走线通过所述第一过孔和所述第二过孔延伸至侧墙的外壁上并连接至所述走线连接区。
  14. 根据权利要求10所述的显示装置，其中，所述触控结构层包括触控驱动电极和触控感应电极，所述触控驱动电极和所述触控感应电极与所述触控信号走线一一对应地连接。
  15. 根据权利要求14所述的显示装置，其中，所述触控驱动电极和所述触控感应电极相互绝缘地设置在同一结构层中。
  16. 根据权利要求14所述的显示装置，其中，所述触控驱动电极和所述触控感应电极设置在不同的结构层中，所述触控驱动电极和所述触控感应电极之间设置有绝缘层。
  17. 根据权利要求10所述的显示装置，其中，所述发光结构层包括依次设置在所述阵列基板上的阳极、有机发光层和阴极。
  18. 根据权利要求10所述的显示装置，其中，所述触控式OLED显示面板还包括驱动模块，所述驱动模块包括触控驱动芯片和显示驱动芯片，所述触控驱动芯片和所述显示驱动芯片通过一柔性线路板连接到所述走线连接区，所述柔性线路板在所述走线连接区与所述触控信号走线和所述显示信号走线电性连接；所述触控驱动芯片与所述触控信号走线信号连通，所述显示驱动芯片与所述显示信号走线信号连通。
PCT/CN2017/098138 2017-07-28 2017-08-18 触控式oled显示面板以及显示装置 Ceased WO2019019235A1 (zh)

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