WO2019010605A1 - Systèmes de refroidissement pour nœud informatique - Google Patents

Systèmes de refroidissement pour nœud informatique Download PDF

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Publication number
WO2019010605A1
WO2019010605A1 PCT/CN2017/092359 CN2017092359W WO2019010605A1 WO 2019010605 A1 WO2019010605 A1 WO 2019010605A1 CN 2017092359 W CN2017092359 W CN 2017092359W WO 2019010605 A1 WO2019010605 A1 WO 2019010605A1
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WO
WIPO (PCT)
Prior art keywords
plate
heat source
coolant
bend feature
socket
Prior art date
Application number
PCT/CN2017/092359
Other languages
English (en)
Inventor
Liguang DU
Dong Wang
Xinglong XU
Russell S. Aoki
Ralph W. Jensen
Original Assignee
Intel Corporation
Tate, Alan W.
Steinbrecher, Robin A.
Liao, Wei
CHEN, Na
YING, Guoliang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corporation, Tate, Alan W., Steinbrecher, Robin A., Liao, Wei, CHEN, Na, YING, Guoliang filed Critical Intel Corporation
Priority to PCT/CN2017/092359 priority Critical patent/WO2019010605A1/fr
Publication of WO2019010605A1 publication Critical patent/WO2019010605A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source

Definitions

  • the present disclosure relates to the field of coolant systems for computing nodes. More particularly, the present disclosure relates to the coolant tube and heat spreader apparatuses for cooling heat sources within computing nodes.
  • computing nodes such as, but not limited to, compute nodes, networking nodes and storage nodes
  • components within the computing nodes are producing greater amounts of heat and are being compacted into tighter areas.
  • pitch distances between dual in-line memory modules (DIMMs) have decreased and heat produced by the DIMMs has increased
  • legacy coolant systems that rely on air cooling have become inadequate to properly cool the DIMMs during normal operation of the DIMMs.
  • Figure 1 illustrates a side view of an example heat spreader coupled to a heat source, according to various embodiments.
  • Figure 2 illustrates a perspective view of an example first plate that may be utilized in the heat spreader of Figure 1, according to various embodiments.
  • Figure 3 illustrates a perspective view of an example second plate that may be utilized in the heat spreader of Figure 1, according to various embodiments.
  • Figure 4 illustrates a perspective view of an example coolant tube assembly, according to various embodiments.
  • Figure 5 illustrates an example profile for a coolant tube of the coolant tube assembly of Figure 4, according to various embodiments.
  • Figure 6 illustrates a perspective view of an example heat source layout, according to various embodiments.
  • Figure 7 illustrates an end view of the example heat source layout of Figure 6, according to various embodiments.
  • Figure 8 illustrates a perspective view of an example flexible coolant tube, according to various embodiments.
  • Figure 9 illustrates a top view of an example flexible coolant tube in an expanded state, according to various embodiments.
  • Figure 10 illustrates a top view of the example flexible coolant tube of Figure 9 in an unexpanded state, according to various embodiments.
  • Figure 11 illustrates a perspective view of an example coolant assembly, according to various embodiments.
  • Figure 12 illustrates an end view of the example coolant assembly of Figure 11, according to various embodiments.
  • Figure 13 illustrates another end view of the example coolant assembly of Figure 11, according to various embodiments.
  • Figure 14 illustrates another end view of the example coolant assembly, according to various embodiments.
  • Figure 15 illustrates a perspective view of an example coolant tube, according to various embodiments.
  • Figure 16a illustrates an example profile of a portion of the coolant tube of Figure 15, according to various embodiments.
  • Figure 16b illustrates an example profile of another second portion of the coolant tube of Figure 15, according to various embodiments.
  • Figure 17 illustrates a perspective view of an example coolant tube assembly, according to various embodiments.
  • Figure 18 illustrates a perspective view of an example heat spreader coupled to a heat source, according to various embodiments.
  • Figure 19 illustrates a perspective view of an example coolant system arrangement, according to various embodiments.
  • Figure 20 illustrates a side view of an example coolant assembly arrangement, according to various embodiments.
  • Figure 21 illustrates an example coolant system, according to various embodiments.
  • Figure 22 illustrates an example computing device that may employ the apparatuses and/or methods described herein.
  • Figure 23 illustrates an example computing node arrangement, according to various embodiments.
  • a heat spreader for a heat source may include a first plate to be coupled to a first side of the heat source, wherein a portion of the first plate is to extend along the first side of the heat source and contact at least a portion of the first side of the heat source.
  • the first plate may include a bend feature located at a side of the portion of the first plate, wherein a first portion of the bend feature of the first plate is to extend away from the heat source and a second portion of the bend feature of the first plate is to extend toward the heat source.
  • the heat spreader may further include a secondplate to be coupled to a second side of the heat source, the second side of the heat source being opposite to the first side of the heat source, wherein a portion of the second plate is to extend along the second side of the heat source and contact at least a portion of the second side of the heat source.
  • the second plate may include a bend feature located at a side of the portion of the second plate, wherein a first portion of the bend feature of the second plate is to extend away from the heat source and a second portion of the bend feature of the second plate is to extend toward the heat source.
  • the phrase “A and/or B” means (A) , (B) , or (A and B) .
  • phrase “A, B, and/or C” means (A) , (B) , (C) , (A and B) , (A and C) , (B and C) , or (A, B and C) .
  • circuitry may refer to, be part of, or include an Application Specific Integrated Circuit (ASIC) , an electronic circuit, a processor (shared, dedicated, or group) and/or memory (shared, dedicated, or group) that execute one or more software or firmware programs, a combinational logic circuit, and/or other suitable components that provide the described functionality.
  • ASIC Application Specific Integrated Circuit
  • FIG. 1 illustrates a side view of an example heat spreader 102 coupled to a heat source 104, according to various embodiments.
  • the heat source 104 may be a component of a computing node. Further, the heat source 104 may be a daughter board or located on a daughter board that may be coupled to a printed circuit board (PCB) of the computing node, such as being coupled via a socket.
  • the heat source 104 may be an in-line memory module (IMM) , such as a single in-line memory module (SIMM) and/or a dual in-line memory module (DIMM) .
  • IMM in-line memory module
  • SIMM single in-line memory module
  • DIMM dual in-line memory module
  • the heat spreader 102 may include a first plate 106 coupled to a first side of the heat source 104 and a second plate (not shown; see second plate 300 (Fig. 3) ) coupled to a second side of the heat source 104 opposite to the first side of the heat source.
  • the second plate may be a mirror image of the first plate 106, or may be similar to the first plate 106 with different cutouts, recesses, and/or extrusions corresponding to components of the heat source 104.
  • the first plate 106 and the second plate may be formed of a thermal conductive, rigid material.
  • the first plate 106 and the second plate may be formed of aluminum, copper, steel, alloys thereof, or some combination thereof. While a few materials are mentioned herein, it is to be understood that the first plate 106 and the second plate may be formed of any thermal conductive, rigid material utilized for heat spreaders and/or heat sinks known to one having ordinary skill in the art.
  • a portion 110 of the first plate 106 may extend along the first side of the heat source 104 and may contact at least a portion of the first side of the heat source 104. Further, a portion (not shown; see the portion 302 of the second plate 300 (Fig. 3) ) of the second plate may extend along the second side of the heat source 104 and may contact at least a portion of the second side of the heat source 104. For example, in embodiments where the heat source 104 is a daughter board and/or an IMM, the first plate 106 may contact one or more components on the first side of the heat source 104 and the second plate may contact one or more components on the second side of the heat source 104.
  • the first plate 106 and/or the second plate may be thermally coupled to the heat source 104 via the contact of the first plate 106 with the heat source 104 and/or the contact of the second plate with the heat source 104. Accordingly, as the heat source 104 produces heat, the heat may be transferred to the first plate 106 and/or the second plate.
  • the portion 110 of the first plate 106 that extends along the first side of the heat source 104 may include one or more cutouts, recesses, and/or extrusions corresponding to components located on the first side of the heat source 104.
  • the portion of the second plate that extends along the second side of the heat source 104 may include one or more cutouts, recesses, and/or extrusions corresponding to components located on the second side of the heat source 104.
  • the portion 110 of the first plate 106 that extends along the first side of the heat source 104 may be flat with the exception of cutouts, recesses, and/or extrusions corresponding to components located on the first side of the heat source 104.
  • the portion of the second plate that extends along the second side of the heat source 104 may also be flat with the exception of cutouts, recesses, and/or extrusions corresponding to components located on the second side of the heat source 104.
  • the first plate 106 may include a bend feature 112 located at a side of the portion 110 of the first plate 106.
  • the bend feature 112 may be located between the PCB to which the heat source 104 is coupled and the portion 110 of the first plate 106 when the heat source 104 is coupled to the PCB.
  • the bend feature 112 may include a first portion 114 and a second portion 116.
  • the first portion 114 of the bend feature 112 may be located at the side of the portion 110 of the first plate 106.
  • the second portion 116 of the bend feature 112 maybe located at a side of the first portion 114 of the bend feature 112 opposite to the portion 110 of the first plate 106.
  • the first portion 114 of the bend feature 112 may extend away from the heat source 104.
  • the portion 110 of the first plate 106 may extend along the first side of the heat source 104 and the first portion 114 of the bend feature 112 may deviate from the extension of the portion 110 of the first plate 106 away from the heat source 104.
  • the first portion 114 of the bend feature 112 may deviate from the portion 110 of the first plate 106 by between 0 degrees and 90 degrees away from the heat source 104.
  • the second portion 116 of the bend feature 112 may extend toward the heat source 104.
  • the first portion 114 of the bend feature 112 may extend away from the heat source 104 and the second portion 116 of the bend feature 112 may deviate from the extension of the first portion 114 of the bend feature 112 toward the heat source 104.
  • the second portion 116 of the bend feature 112 may deviate from the first portion 114 of the bend feature 112 by between 0 degrees and 90 degrees toward the heat source 104.
  • an amount of deviation of the first portion 114 of the bend feature 112 from the portion 110 of the first plate 106 is less than an amount of deviation of the second portion 116 of the bend feature 112 from the first portion 114 of the bend feature 112.
  • a length of the first portion 114 of the bend feature 112 that extends away from the heat source 104 may be less than a length of the second portion 116 of the bend feature 112 that extends toward the heat source 104.
  • the second plate may include a bend feature (not shown; see the bend feature 316 (Fig. 3) ) located at a side of the portion of the second plate that extends along the second side of the heat source 104.
  • the bend feature of the second plate may include one or more of the features of the bend feature 112 of the first plate 106.
  • the bend feature of the second plate may be located between the PCB to which the heat source 104 is coupled and the portion of the second plate that extends along the second side of the heat source 104 when the heat source 104 is coupled to the PCB.
  • the bend feature may include a first portion (not shown; see the first portion 322 (Fig.
  • the first portion of the bend feature may be located at the side of the portion of the second plate that extends along the second side of the heat source 104.
  • the second portion of the bend feature may be located at a side of the first portion of the bend feature opposite to the portion of the second plate that extends along the second side of the heat source 104.
  • the first portion of the bend feature of the second plate may extend away from the heat source 104.
  • the portion of the second plate may extend along the second side of the heat source 104 and the first portion of the bend feature may deviate from the extension of the portion of the second plate away from the heat source 104.
  • the first portion of the bend feature may deviate from the portion of the second plate that extends along the second side of the heat source 104 by between 0 degrees and 90 degrees away from the heat source 104.
  • the second portion of the bend feature of the second plate may extend toward the heat source 104.
  • the first portion of the bend feature may extend away from the heat source 104 and the second portion of the bend feature may deviate from the extension of the first portion of the bend feature toward the heat source 104.
  • the second portion of the bend feature may deviate from the first portion of the bend feature by between 0 degrees and 90 degrees toward the heat source 104.
  • an amount of deviation of the first portion of the bend feature from the portion of the first plate 106 that extends along the second side of the heat source 104 is less than an amount of deviation of the second portion of the bend feature from the first portion of the bend feature.
  • a length of the first portion of the bend feature that extends away from the heat source 104 may be less than a length of the second portion of the bend feature that extends toward the heat source 104.
  • the heat spreader 102 may further include one or more clips 108 that couple the first plate 106 and/or the second plate to the heat source 104.
  • the clips 108 may apply pressure to the first plate 106 and/or the second plate of the heat spreader 102 toward the heat source 104, thereby pressing the first plate 106 against the first side of the heat source 104 and/or the second plate of the heat spreader 102 against the second side of the heat source 104.
  • the clips 108 may interact with one or more extrusions 118 of the first plate 106 and/or one or more extrusions of the second plate, wherein the interaction may limit movement of the first plate 106 and/or the second plate relative to the clips 108.
  • While the illustrated embodiment shows the clips 108 coupling the first plate 106 and/or the second plate to the heat source 104, it is to be understood that other means of coupling the first plate 106 and/or the second plate to the heat source 104 known to one having ordinary skill in the art may be utilized, including, but not limited to, epoxy between the plates and the heat source 104, and/or having a portion of the heat spreader 102 extending around the heat source 104 that generates a force that presses the first plate 106 and/or the second plate against the heat source 104.
  • Figure 2 illustrates a perspective view of an example first plate 200 that may be utilized in the heat spreader 102 of Figure 1, according to various embodiments.
  • the first plate 200 may include one or more of the features of the first plate 106 (Fig. 1) .
  • the first plate 200 may be formed of any of the same materials as the first plate 106 may be formed.
  • the first plate 200 may include a portion 202 that is to extend along a side of a heat source when the first plate 200 is coupled to the heat source.
  • the portion 202 may include one or more of the features of the first portion 114 (Fig. 1) . Further, the portion 202 may contact at least a portion of the heat source when the first plate 200 is coupled to the heat source.
  • the portion 202 may include a first side portion 204, a second side portion 206, and a center portion 208 located intermediate to the first side portion 204 and the second side portion 206.
  • the first side portion 204 and the second side portion 206 may be located on a first plane, wherein the first side portion 204 and the second side portion 206 may extend along a side of a heat source when the first plate 200 is coupled to the heat source.
  • the center portion 208 may be extruded from the first side portion 204 and the second side portion 206 and may be located on a second plane.
  • the center portion 208 may be located a certain distance away from the heat source when the first plate 200 is coupled to the heat source due to the extrusion. In other embodiments, the center portion 208 may contact a component of the heat source that extends farther out than the portion of the heat source that the first side portion 204 and the second side portion 206 contact.
  • the first side portion 204 may include a cutout 210.
  • the cutout 210 may correspond to one or more components of a heat source to which the first plate 200 is to be coupled.
  • the cutout 210 may correspond to a keep-out zone of the one or more components of the heat source.
  • the keep-out zone may include an area that maypresent a risk of a short or other failure of the one or more components if the first plate 200 was to be located within the keep-out zone.
  • the one or more components of the heat source to which the cutout 210 may correspond may extend farther than other components that the first side portion 204 is to contact, wherein the cutout 210 provides space for the one or more components to extend through the first side portion 204.
  • the cutout 210 may be omitted from the first plate 200. Further, in other embodiments, one or more cutouts (such as cutout 210) may be formed in the first side portion 204, the second side portion 206, the center portion 208, or some combination thereof.
  • the first side portion 204 may include a first extrusion 212 and the second side portion 206 may include a second extrusion 214.
  • the first extrusion 212 may be extruded from the first side portion 204 and the second extrusion 214 may be extruded from the second side portion 206.
  • the first extrusion 212 and/or the second extrusion 214 may be utilized for aligning the first plate 200 with a heat source to which the first plate 200 is to be coupled.
  • the first extrusion 212 may align with a first alignment feature formed on the heat source and/or the second extrusion 214 may align with a second alignment feature formed on the heat source.
  • first extrusion 212 and/or the second extrusion 214 may be omitted from the first plate 200.
  • one or more extrusions (such as the first extrusion 212 and/or the second extrusion 214) may be formed within the first side portion 204, the second side portion 206, the center portion 208, or some combination thereof.
  • the first side portion 204 may include a third extrusion 216 and the second side portion 206 may include a fourth extrusion 218.
  • the third extrusion 216 may be extruded from the first side portion 204 and the fourth extrusion 218 may be extruded from the second side portion 206.
  • the third extrusion 216 and the fourth extrusion 218 may interact with one or more clips (such as the clips 108 (Fig. 1) ) to maintain a position of the first plate 200 against a heat source to which the first plate 200 may be coupled.
  • the third extrusion 216 and/or the fourth extrusion 218 may be omitted from the first plate 200.
  • one or more extrusions (such as the third extrusion 216 and/or the fourth extrusion 218) may be formed within the first side portion 204, the second side portion 206, the center portion 208, or some combination thereof.
  • the portion 202 may be a continuous sheet that extends along a single plane, with the exception of cutouts (such as the cutout 210) and/or extrusions (such as the first extrusion 212, the second extrusion 214, the third extrusion 216, and/or the fourth extrusion 218) , rather than including the extruded center portion 208 as shown in the illustrated embodiment.
  • cutouts such as the cutout 210
  • extrusions such as the first extrusion 212, the second extrusion 214, the third extrusion 216, and/or the fourth extrusion 218) , rather than including the extruded center portion 208 as shown in the illustrated embodiment.
  • a majority of the portion 202 may be flat.
  • the first plate 200 may further include a bend feature 220.
  • the bend feature 220 may be located at a side of the portion 202.
  • the bend feature 220 may extend along the side of the portion 202 for an entirety of the length of the portion 202. In other embodiments, the bend feature 220 may extend along the side of the portion 202 for less than the entirety of the length of the portion 202.
  • the bend feature 220 may include discrete portions, such as a first side portion 222 of the bend feature 220, a second side portion 224 of the bend feature 220, and a center portion 226 of the bend feature 220 shown in the illustrated embodiment. In other embodiments, the bend feature 220 may be a single continuous piece.
  • the bend feature 220 may include a first portion 228 and a second portion 230.
  • the first portion 228 of the bend feature 220 may be located at the side of the portion 202 of the first plate 200.
  • the first portion 228 of the bend feature 220 may extend away from a heat source when the first plate 200 is coupled to the heat source.
  • the first portion 228 of the bend feature 220 may deviate from an extension of the portion 202 of the first plate 200.
  • the first portion 228 of the bend feature 220 may deviate by between 0 degrees and 90 degrees from the portion 202 of the first plate 200.
  • An amount of deviation of the first portion 228 of the bend feature 220 within the center portion 226 of the bend feature 220 may be different than an amount of deviation of the first portion 228 of the bend feature 220 within the first side portion 222 and the second side portion 224 due to the extrusion of the center portion 208 of the portion 202.
  • the amount of deviation of the first portion 228 within the center portion 226, the first side portion 222, and the second side portion 224 may be selected such that a side of the first portion 228 of the bend feature 220, opposite to the side of the first portion 228 located along the portion 202 of the first plate 200, is aligned along an entire length of the bend feature 220.
  • the amount of deviation of the first portion 228 of the bend feature 220 may be uniform for the first side portion 222, the second side portion 224, and the center portion 226.
  • the second portion 230 of the bend feature 220 may be located at a side of the first portion 228 of the bend feature 220 that is opposite to the portion 202 of the first plate 200. Further, the second portion 230 may be located at a side of the first plate 200.
  • the second portion 230 of the bend feature 220 may extend toward a heat source when the first plate 200 is coupled to the heat source. A distance perpendicular to the portion 202 of the first plate 200 traversed by the second portion 230 of the bend feature 220 toward the heat source may be less than a distance perpendicular to the portion 202 of the first plate 200 traversed by the first portion 228 of the bend feature 220 away from the heat source. Accordingly, the second portion 230 of the bend feature 220 may not extend to a plane on which the portion 202 of the first plate 200 extends.
  • the second portion 230 of the bend feature 220 may deviate from an extension of the first portion 228 of the bend feature 220.
  • the second portion 230 of the bend feature 220 may deviate by between 0 degrees and 90 degrees from the first portion 228 of the bend feature 220.
  • the second portion 230 of the bend feature 220 may deviate by between 0 and 180 degrees from the first portion 228 of the bend feature 220.
  • an amount of deviation of the first portion 228 of the bend feature 220 from the portion 202 of the first plate 200 may be less than an amount of deviation of the second portion 230 of the bend feature 220 from the first portion 228 of the bend feature 220.
  • the second portion 230 of the bend feature 220 may have a uniform slope for an entirety of a length of the second portion 230 of the bend feature 220.
  • the slope of the second portion 230 of the bend feature 220 may be uniform for the first side portion 222, the second side portion 224, and the center portion 226 of the bend feature 220.
  • the second portion 230 of the bend feature 220 may be curved, wherein a change in the slope of the second portion 230 of the bend feature 220 may be uniform for an entirety of the length of the second portion 230 of the bend feature 220.
  • Figure 3 illustrates a perspective view of an example second plate 300 that may be utilized in the heat spreader 102 of Figure 1, according to various embodiments.
  • the second plate 300 may include one or more of t he features of t he second plate described in relation to Figure 1.
  • the second plate 300 may be formed of any of the same materials as the second plate may be formed, as described in relation to Figure 1.
  • the second plate may include one or more of the features of the first plate 200 (Fig. 2) .
  • the second plate 300 may include a portion 302 that is to extend along a side of a heat source when the second plate 300 is coupled to the heat source.
  • the portion 302 may include one or more of the features of the second plate described in relation to Figure 1.
  • the side of the heat source that the second plate 300 is to extend along may be opposite to the side of the heat source that the first plate 200 is to extend along. Further, the portion 302 may contact at least a portion of the heat source when the second plate 300 is coupled to the heat source.
  • the portion 302 may include a first side portion 304 and a second side portion 306.
  • the first side portion 304 may be located on a first plane, wherein the first side portion 304 is to extend along a side of a heat source when the second plate 300 is coupled to the heat source.
  • the second side portion 306 may be extruded from the first side portion 304 and may be located on a second plane.
  • the second side portion 306 may be located a certain distance away from the heat source when the second plate 300 is coupled to the heat source due to the extrusion. In other embodiments, the second side portion 306 may contact a component of the heat source that extends farther out than the portion of the heat source that the first side portion 304 contacts.
  • the first side portion 304 may include a first extrusion 308, a second extrusion 310, and a third extrusion 312.
  • the first extrusion 308, the second extrusion 310, and the third extrusion 312 may be extruded from the first side portion 304.
  • the first extrusion 308, the second extrusion 310, and/or the third extrusion 312 may be utilized for aligning the second plate 300 with a heat source to which the second plate 300 is to be coupled.
  • first extrusion 308 may align with a first alignment feature formed on the heat source
  • second extrusion 310 may align with a second alignment feature formed on the heat source
  • third extrusion 312 may align with a third alignment feature formed on the heat source.
  • first extrusion 308, the second extrusion 310, and/or the third extrusion 312 may be omitted from the second plate 300.
  • one or more extrusions (such as the first extrusion 308, the second extrusion 310, and/or the third extrusion 312) may be formed within the first side portion 304, the second side portion 306, or some combination thereof.
  • the second side portion 306 may include a recessed portion 314.
  • the recessed portion 314 may be recessed into the second side portion 306.
  • the recessed portion 314 may be recessed to contact a component of a heat source when the second plate 300 is coupled to the heat source.
  • the second side portion 306 may be located a certain distance from the heat source and the recessed portion 314 may be recessed to contact a portion of the heat source when the second plate 300 is coupled to the heat source.
  • the recessed portion 314 may be omitted from the second plate 300.
  • one or more recessed portions (such as the recessed portion 314) may be formed within the first side portion 304, the second side portion 306, or some combination thereof.
  • the portion 302 may be a continuous sheet that extends along a single plane, with the exception of extrusions (such as the first extrusion 308, the second extrusion 310, and/or the third extrusion 312) and/or recessed portions (such as the recessed portion 314) , rather than including the extruded second side portion 306 as shown in the illustrated embodiment.
  • a majority of the portion 302 may be flat.
  • the second plate 300 may further include a bend feature 316.
  • the bend feature 316 may include one or more of the features of the bend feature 220 (Fig. 2) .
  • the bend feature 316 may be located at a side of the portion 302.
  • the bend feature 316 may extend along the side of the portion 302 for an entirety of the length of the portion 302. In other embodiments, the bend feature 316 may extend along the side of the portion 302 for less than the entirety of the length of the portion 302.
  • the bend feature 316 may include discrete portions, such as a first side portion 318 of the bend feature 316 and a second side portion 320 of the bend feature 316 shown in the illustrated embodiment. In other embodiments, the bend feature 316 may be a single continuous piece.
  • the bend feature 316 may include a first portion 322 and a second portion 324.
  • the first portion 322 of the bend feature 316 may be located at the side of the portion 302 of the second plate 300.
  • the first portion 322 of the bend feature 316 may extend away from a heat source when the second plate 300 is coupled to the heat source.
  • the first portion 322 of the bend feature 316 may deviate from an extension of the portion 302 of the second plate 300.
  • the first portion 322 of the bend feature 316 may deviate by between 0 degrees and 90 degrees from the portion 302 of the second plate 300.
  • An amount of deviation of the first portion 322 of the bend feature 316 within the first side portion 318 may be different than an amount of deviation of the first portion 322 of the bend feature 316 within the second side portion 320 due to the extrusion of the second side portion 306 of the portion 302.
  • the amount of deviation of the first portion 322 within the first side portion 318 may be selected such that a side of the first portion 322 of the bend feature 316, opposite to the side of the first portion 322 located along the portion 302 of the second plate 300, is aligned along an entire length of the bend feature 316.
  • the amount of deviation of the first portion 322 of the bend feature 316 may be uniform for the first side portion 318 and the second side portion 320.
  • the second portion 324 of the bend feature 316 may be located at a side of the first portion 322 of the bend feature 316 that is opposite to the portion 302 of the second plate 300. Further, the second portion 324 may be located at a side of the second plate 300. The second portion 324 of the bend feature 316 may extend toward a heat source when the second plate 300 is coupled to the heat source. A distance perpendicular to the portion 302 of the second plate 300 traversed by the second portion 324 of the bend feature 316 toward the heat source may be less than a distance perpendicular to the portion 302 of the second plate 300 traversed by the first portion 322 of the bend feature 316 away from the heat source. Accordingly, the second portion 324 of the bend feature 316 may not extend to a plane on which the portion 302 of the second plate 300 extends.
  • the second portion 324 of the bend feature 316 may deviate from an extension of the first portion 322 of the bend feature 316.
  • the second portion 324 of the bend feature 316 may deviate by between 0 degrees and 90 degrees from the first portion 322 of the bend feature 316.
  • the second portion 324 of the bend feature 316 may deviate by between 0 and 180 degrees from the first portion 322 of the bend feature 316.
  • an amount of deviation of the first portion 322 of the bend feature 316 from the portion 302 of the second plate 300 may be less than an amount of deviation of the second portion 324 of the bend feature 316 from the first portion 322 of the bend feature 316.
  • the second portion 324 of the bend feature 316 may have a uniform slope for an entirety of a length of the second portion 324 of the bend feature 316.
  • the slope of the second portion 324 of the bend feature 316 may be uniform for the first side portion 318 and the second side portion 320 of the bend feature 316.
  • the second portion 324 of the bend feature 316 may be curved, wherein a change in the slope of the second portion 324 of the bend feature 316 may be uniform for an entirety of the length of the second portion 324 of the bend feature 316.
  • the first plate 200 and the second plate 300 are examples of some embodiments that may be utilized in the heat spreader 102 of Figure 1.
  • the heat spreader 102 may include two of the first plates 200 with each coupled to opposing sides of the heat source 104 (Fig. 1) or two of the second plates 300 with each coupled to opposing sides of the heat source 104.
  • the first plate 200 may include one or more of the features of the second plate 300 (such as the recessed portion 314) and/or the second plate 300 may include one or more of the features of the first plate 200 (such as the cutout 210 (Fig. 2) ) .
  • the heat spreader 102 may include plates that include one or more of the features of the first plate 200, the second plate 300, or some combination thereof.
  • FIG 4 illustrates a perspective view of an example coolant tube assembly 400, according to various embodiments.
  • the coolant tube assembly 400 may include one or more coolant tubes 402.
  • the coolant tube assembly 400 may include five coolant tubes 402.
  • the coolant tubes 402 may be formed of a material known by one having ordinary skill in the art to be utilized for coolant tubes, such as copper, aluminum, steel, alloys thereof, or some combination thereof.
  • the coolant tubes 402 may be rigid or semi-rigid.
  • Each of the coolant tubes 402 may include a cavity formed in a center of the coolant tube 402 that extends from a first end of the coolant tube 402 to a second end of the coolant tube 402.
  • a pump of a coolant system (not shown; see the pump 2102 (Fig. 21) ) may be coupled to each of the coolant tubes 402 and may circulate coolant through each of the cavities formed in the coolant tubes 402.
  • the coolant may be a liquid coolant, a vapor coolant, or some combination thereof.
  • a shape of the coolant tubes 402 is discussed in relation to Figure 5.
  • the coolant tube assembly 400 may further include an inlet block 404 and an outlet block 406.
  • the inlet block 404 may be coupled to a first end of the coolant tubes 402 and the outlet block 406 may be coupled to a second end of the coolant tubes 402, the second end being located opposite to the first end. Further, the inlet block 404 and the outlet block 406 may couple to the coolant system that may circulate the coolant through the coolant tubes 402.
  • the inlet block 404 and the outlet block 406 may further be coupled to a PCB and may maintain positions of the coolant tubes 402 relative to the PCB.
  • the inlet block 404 may include a cavity 408 formed in the inlet block 404.
  • the cavity 408 may extend through the inlet block 404.
  • An end of the cavity 408 may be coupled to the coolant system to receive the coolant to be circulated through the coolant tubes 402 from the coolant system.
  • the cavity 408 of the inlet block 404 may be coupled to the cavities of each of the coolant tubes 402 to direct the coolant into the cavities of the coolant tubes 402.
  • the outlet block 406 may include a cavity 410 formed in the outlet block 406.
  • the cavity 410 may extend through the outlet block 406.
  • An end of the cavity 410 may be coupled to the coolant system to direct the coolant to be circulated through the coolant tubes 402 to the coolant system.
  • the cavity 410 of the outlet block 406 may be coupled to the cavities of each of the coolant tubes 402 to receive the coolant from the cavities of the coolant tubes 402.
  • the inlet block 404 and/or the outlet block 406 may be omitted.
  • the coolant system may be coupled directly to each of the cavities formed in the coolant tubes 402 to circulate the coolant through the cavities of the coolant tubes 402.
  • the coolant tubes 402 may be directly coupled to the PCB and/or may be coupled to the PCB via another means of mounting the coolant tubes 402 to the PCB (such as via fasteners and/or via standoffs) .
  • FIG 5 illustrates an example profile 500 for a coolant tube of the coolant tube assembly 400 of Figure 4, according to various embodiments.
  • Each of the coolant tubes 402 (Fig. 4) may have the profile 500.
  • the profile 500 may extend for an entire length of each of the coolant tubes, or some portion thereof.
  • the profile 500 may include a base 502.
  • the base 502 may extend parallel to a PCB when a coolant tube having the profile 500 is coupled to the PCB.
  • the base 502 may extend for a width of the profile 500.
  • the width of the profile 500 may be between 1.5 mm and 3 mm. In some embodiments, the width of the profile 500 may be between 2.3 mm and 2.5 mm.
  • the profile 500 may further include a first side 504 and a second side 506 coupled to the base 502.
  • the first side 504 may be coupled to one end of the base 502 and the second side 506 may be coupled to an opposing end of the base 502.
  • the first side 504 and the second side 506 may extend perpendicular to the base 502.
  • the first side 504 and the second side 506 may extend, from the base 502, away from the PCB when a coolant tube having the profile 500 is coupled to the PCB.
  • the profile 500 may further include a top portion 508.
  • the top portion 508 may be coupled to the first side 504 and the second side 506.
  • the top portion 508 may be coupled to an end of the first side 504 opposite from the base 502 and may be coupled to an end of the second side 506 opposite from the base 502.
  • the top portion 508 may include a first sloped portion 510 and a second sloped portion 512.
  • the first sloped portion 510 may be coupled to the first side 504 and may slope toward the second side 506.
  • the second sloped portion 512 may be coupled to the second side 506 and may slope toward the first side 504.
  • a slope of the first sloped portion 510 may be between 0 degrees and 90 degrees toward the second side 506, the slope being measured relative to a plane of which the base 502 extends upon.
  • a slope of the second sloped portion 512 may be between 0 degrees and 90 degrees toward the first side 504, the slope being measured relative to the plane.
  • the degree of the slope of the first sloped portion 510 toward the second side 506 may be equal to the degree of the slope of the second sloped portion 512 toward the first side 504.
  • the first sloped portion 510 and the second sloped portion 512 may meet at approximately a center of the profile (within 5 millimeters (mm) ) and may be coupled to each other.
  • first sloped portion 510 and the second sloped portion 512 may be curved. In these embodiments, a rate of change of the slope of the first sloped portion 510 may be equal to a rate of change of the slope of the second sloped portion 512. In some embodiments, the rate of change of the slope of the first sloped portion 510 and the rate of change of the slope of the second sloped portion 512 may be constant.
  • a cavity 514 may be formed within the profile 500 and may be encircled by the base 502, the first side 504, the second side 506, first sloped portion 510, and the second sloped portion 512.
  • the cavity 514 may extend through an entire length of the portion having the profile 500.
  • the cavity 514 may be representative of the cavity described in relation to the coolant tubes 402 through which the coolant system may circulate the coolant.
  • FIG. 6 illustrates a perspective view of an example heat source layout 600, according to various embodiments.
  • the heat source layout 600 may include one or more heat sources 602.
  • the heat sources 602 may include one or more of the features of the heat source 104 (Fig. 1) .
  • One or more sockets 604 may couple the heat sources 602 to a PCB 606.
  • a first one of the sockets 604 may couple a first one of the heat sources 602 to the PCB 606, a second one of the sockets 604 may couple a second one of the heat sources 602 to the PCB 606, and so forth for a one-to-one ratio of the sockets 604 to the heat sources 602.
  • the heat sources 602 may be coupled to the PCB 606 via other means, such as soldering of the heat sources 602 to the PCB 606, coupling of the heat sources 602 to the PCB 606 via fasteners, coupling ofheat sources 602 to the PCB 606 via epoxy, or some combination thereof.
  • the heat sources 602 may extend approximately perpendicularly (within five degrees) to the PCB 606.
  • the heat source layout 600 may further include one or more heat spreaders 608 coupled to the heat sources 602.
  • the heat spreaders 608 may include one or more of the features of the heat spreader 102 (Fig. 1) , including that the heat spreaders 608 may utilize the first plate 200 (Fig. 2) , the second plate 300 (Fig. 3) , or some combination thereof.
  • a first one of the heat spreaders 608 may be coupled to a first one of the heat sources 602, a second one of the heat spreaders 608 may be coupled to a second one of the heat sources 602, and so forth for a one-to-one ratio of the heat spreaders 608 to the heat sources 602.
  • the heat source layout 600 may further include a coolant tube assembly 610.
  • the coolant tube assembly 610 may be mounted to the PCB 606.
  • the coolant tube assembly 610 may include one or more of the features of the coolant tube assembly 400 (Fig. 4) , including that the coolant tube assembly 610 may include one or more coolant tubes.
  • the coolant tubes of the coolant tube assembly 610 may include one or more of the features of the coolant tubes 402 (Fig. 4) of the coolant tube assembly 400 (Fig. 4) .
  • the coolant tube assembly 610 may include coolant tubes located on opposing sides of the heat sources 602.
  • a first one of the coolant tubes may be located on a first side of a first one of the heat sources 602 and a second one of the coolant tubes may be located on a second side (opposite to the first side) of the first one of the heat sources 602
  • the second one of the coolant tubes may be located on a first side of a second one of the heat sources 602 (the second one of the heat sources 602 being located adjacent to the first one of the heat sources 602)
  • a third one of the coolant tubes may be located on a second side (opposite to the first side) of the second one of the heat sources 602, and so forth.
  • each of the heat spreaders 608 may contact the coolant tubes of the coolant tube assembly 610 and may thermally couple the heat spreaders 608 to the coolant tubes.
  • one or more bend features such as the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , and/or the bend feature 316 (Fig. 3) ) of each of the heat spreaders 608 may contact corresponding ones of the coolant tubes.
  • each of the heat spreaders 608 may be thermally coupled to the one of the heat sources 602 to which it is coupled.
  • the heat sources 602 may be thermally coupled to the coolant tubes of the coolant tube assembly 610 via the heat spreaders 608, such that heat generated by the heat sources 602 may be transferred to the coolant tubes.
  • the heat transferred to the coolant tubes from the heat sources 602 may further be transferred to a coolant being circulated through the coolant tubes, wherein the coolant may carry the heat away from the heat sources 602.
  • FIG 7 illustrates an end view of the example heat source layout 600 of Figure 6, according to various embodiments.
  • the heat sources 602 of the heat source layout 600 may include a first heat source 602a and a second heat source 602b.
  • the sockets 604 of the heat source layout 600 may include a first socket 604a and a second socket 604b.
  • the heat spreaders 608 of the heat source layout 600 may include a first heat spreader 608a and a second heat spreader 608b.
  • the coolant tube assembly 610 of the heat source layout 600 may include a first coolant tube 702a, a second coolant tube 702b, and a third coolant tube 702c.
  • the first coolant tube 702a, the second coolant tube 702b, and the third coolant tube 702c may include one or more of the features of the coolant tubes 402 (Fig. 4) , including that the first coolant tube 702a, the second coolant tube 702b, and the third coolant tube 702c may have the profile 500 (Fig. 5) .
  • the second heat source 602b may be located adjacent to the first heat source 602a.
  • the first heat source 602a and the second heat source 602b may be arranged with a certain pitch.
  • the pitch for the first heat source 602a and the second heat source 602b may be between 7 mm and 11 mm.
  • some discrete pitch examples for the first heat source 602a and the second heat source 602b may be 8.636 mm (i.e., 0.34 inches) and 9.398 mm (i.e., 0.37 inches) .
  • the first socket 604a and the second socket 604b may be affixed to the PCB 606 and may be electrically coupled to one or more traces of the PCB 606.
  • the second socket 604b may be located adjacent to the first socket 604a.
  • the first socket 604a may couple the first heat source 602a to the PCB 606 and the second socket 604b may couple the second heat source 602b to the PCB 606.
  • the first socket 604a and the second socket 604b may be positioned based on the pitch for the first heat source 602a and the second heat source 602b.
  • the first coolant tube 702a may be located on a first side of the first socket 604a and a first side of the first heat source 602a. A portion of the first coolant tube 702a may abut the first side of the first socket 604a. In other embodiments, the portion of the first coolant tube 702a may be located at a distance of less than 1 mm away from the first side of the first socket 604a. Further, the first coolant tube 702a may be located above the PCB 606 by a distance ofbetween 0.5 mm and 15 mm, and may be maintained at the distance of an outlet block and/or an inlet block (see the outlet block 406 (Fig. 4) and the inlet block 404 (Fig. 4) for examples of the outlet block and the inlet block) of the coolant tube assembly 610 (Fig. 6) . In other embodiments, the first coolant tube 702a may be located on a surface of the PCB 606.
  • the second coolant tube 702b may be located on a second side of the first socket 604a and a second side of the first heat source 602a, wherein the second side of the first socket 604a and the second side of the first heat source 602a are opposite to the first side of the first socket 604a and the first side of the first heat source 602a, respectively.
  • a portion of the second coolant tube 702b may abut the second side of the first socket 604a.
  • the portion of the second coolant tube 702b may be located at a distance of less than 1 mm away from the second side of the first socket 604a.
  • the second coolant tube 702b may be located above the PCB 606 by a distance ofbetween 0.5 mm and 15 mm, and may be maintained at the distance of an outlet block and/or an inlet block of the coolant tube assembly 610 (Fig. 6) . In other embodiments, the second coolant tube 702b may be located on a surface of the PCB 606.
  • the second coolant tube 702b may be located on a first side of the second socket 604b and a first side of the second heat source 602b.
  • the second coolant tube 702b may abut, or be within 1 mm, of both the second side of the first socket 604a and the first side of the second socket 604b.
  • the second coolant tube 702b may have a width approximately equal (within 2 mm) to a distance between the first socket 604a and the second socket 604b.
  • the width of the second coolant tube 702b may be between 1.5 mm and 3 mm. In some embodiments, the width of the second coolant tube 702b may be between 2.3 mm and 2.5 mm.
  • the third coolant tube 702c may be located on a second side of the second socket 604b and a second side of the second heat source 602b, wherein the second side of the second socket 604b and the second side of the second heat source 602b are opposite to the first side of the second socket 604b and the first side of the second heat source 602b, respectively.
  • a portion of the third coolant tube 702c may abut the second side of the second socket 604b.
  • the portion of the third coolant tube 702c may be located at a distance of less than 1 mm away from the second side of the second socket 604b.
  • the third coolant tube 702c may be located above the PCB 606 by a distance of between 0.5 mm and 15 mm, and may be maintained at the distance of an outlet block and/or an inlet block of the coolant tube assembly 610 (Fig. 6) . In other embodiments, the third coolant tube 702c may be located on a surface of the PCB 606.
  • the first heat spreader 608a may be coupled to the first heat source 602a.
  • the first heat spreader 608a may include a first plate 704 and a second plate 706 that are coupled to the first heat source 602a via a clip 708.
  • the first plate 704 and the second plate 706 each may include one or more of the features of the first plate 106 (Fig. 1) , the first plate 200 (Fig. 2) , the second plate 300 (Fig. 3) , or some combination thereof.
  • the first plate 704 may include a portion 710 that extends along, and contacts at least a portion of, the first side of the first heat source 602a and a bend feature 712.
  • the bend feature 712 may include one or more of the features of the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , the bend feature 316 (Fig. 3) , or some combination thereof.
  • a portion 714 of the bend feature 712 may abut a sloped portion 716 of the first coolant tube 702a and may thermally couple the first heat spreader 608a to the first coolant tube 702a.
  • the slope of the portion 714 may correspond (i.e., approximately equal to, within 5 degrees) to a slope of the sloped portion 716 such that the portion 714 may extend along the sloped portion 716.
  • the portion 714 may be pressed against the sloped portion 716 due to a mating force between the first heat source 602a and the first socket 604a.
  • a thermal interface material such as thermal grease, a thermal pad, or other similar other thermal interface materials may be located between the portion 714 and the sloped portion 716 to facilitate heat transfer between the first heat spreader 608a and the first coolant tube 702a.
  • the second plate 706 may include a portion 718 that extends along, and contacts at least a portion of, second side of the first heat source 602a and a bend feature 720.
  • the bend feature 720 may include one or more of the features of the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , the bend feature 316 (Fig. 3) , or some combination thereof.
  • the second side of the first heat source 602a may be located opposite to the first side of the first heat source 602a.
  • the bend feature 720 may include one or more of the features of the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , the bend feature 316 (Fig. 3) , or some combination thereof.
  • a portion 722 of the bend feature 720 may abut a sloped portion 724 of the second coolant tube 702b and may thermally couple the first heat spreader 608a to the second coolant tube 702b.
  • the slope of the portion 722 may correspond (i.e., approximately equal to, within 5 degrees) to a slope of the first sloped portion 724 such that the portion 722 may extend along the first sloped portion 724.
  • the portion 722 may be pressed against the first sloped portion 724 due to a mating force between the first heat source 602a and the first socket 604a.
  • a thermal interface material such as thermal grease, a thermal pad, or other similar other thermal interface materials may be located between the portion 722 and the first sloped portion 724 to facilitate heat transfer between the first heat spreader 608a and the second coolant tube 702b.
  • the second heat spreader 608b may be coupled to the second heat source 602b.
  • the second heat spreader 608b may include a first plate 726 and a second plate 728 that are coupled to the second heat source 602b via a clip 730.
  • the first plate 726 and the second plate 728 each may include one or more of the features of the first plate 106 (Fig. 1) , the first plate 200 (Fig. 2) , the second plate 300 (Fig. 3) , or some combination thereof.
  • the first plate 726 may include a portion 732 that extends along, and contacts at least a portion of, the first side of the second heat source 602b and a bend feature 734.
  • the bend feature 734 may include one or more of the features of the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , the bend feature 316 (Fig. 3) , or some combination thereof.
  • a portion 736 of the bend feature 734 may abut a second sloped portion 738 of the second coolant tube 702b and may thermally couple the second heat spreader 608b to the second coolant tube 702b.
  • the slope of the portion 736 may correspond (i.e., approximately equal to, within 5 degrees) to a slope of the second sloped portion 738 such that the portion 736 may extend along the second sloped portion 738.
  • the portion 736 may be pressed against the second sloped portion 738 due to a mating force between the second heat source 602b and the second socket 604b.
  • a thermal interface material such as thermal grease, a thermal pad, or other similar other thermal interface materials may be located between the portion 736 and the second sloped portion 738 to facilitate heat transfer between the second heat spreader 608b and the second coolant tube 702b.
  • the second plate 728 may include a portion 740 that extends along, and contacts at least a portion of, second side of the second heat source 602b and a bend feature 742.
  • the bend feature 742 may include one or more of the features of the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , the bend feature 316 (Fig. 3) , or some combination thereof.
  • the second side of the second heat source 602b may be located opposite to the first side of the second heat source 602b.
  • the bend feature 742 may include one or more of the features of the bend feature 112 (Fig. 1) , the bend feature 220 (Fig. 2) , the bend feature 316 (Fig. 3) , or some combination thereof.
  • a portion 744 of the bend feature 742 may abut a sloped portion 746 of the third coolant tube 702c and may thermally couple the second heat spreader 608b to the third coolant tube 702c.
  • the slope of the portion 744 may correspond (i.e., approximately equal to, within 5 degrees) to a slope of the sloped portion 746 such that the portion 744 may extend along the sloped portion 746.
  • the portion 744 may be pressed against the sloped portion 746 due to a mating force between the second heat source 602b and the second socket 604b.
  • a thermal interface material such as thermal grease, a thermal pad, or other similar other thermal interface materials may be located between the portion 744 and the sloped portion 746 to facilitate heat transfer between the second heat spreader 608b and the third coolant tube 702c.
  • FIG 8 illustrates a perspective view of an example flexible coolant tube 800, according to various embodiments.
  • the flexible coolant tube 800 may include a first plate 802 (illustrated transparently to show other features) and a second plate 804.
  • the first plate 802 and the second plate 804 may be formed of a rigid, thermally conductive material.
  • the rigid, thermally conductive material may include aluminum, copper, steel, alloys thereof, or some combination thereof. While a few materials are mentioned herein, it is to be understood that the first plate 802 and the second plate 804 may be formed of any thermal conductive, rigid material utilized for coolant tubes known to one having ordinary skill in the art.
  • the flexible coolant tube 800 may further include a bladder 806.
  • the bladder 806 may be affixed at a first side of the bladder 806 to the first plate 802 and at the second side of the bladder 806 to the second plate 804.
  • the bladder 806 may be formed of a flexible, impermeable material.
  • the flexible, impermeable material may include polyethylene, polyvinyl chloride, polyurethane, polysulfone, ethylene vinyl acetate, or some combination thereof. While a few materials are mentioned herein, it is to be understood that the bladder 806 may be formed of any flexible, impermeable material utilized for bladders known to one having ordinary skill in the art.
  • the bladder 806 may be rectangular in shape.
  • the bladder 806 may have six sides, where the first plate 802 may be affixed to one of the sides of the bladder 806 and the second plate 804 may be affixed to an opposing side of the bladder 806.
  • the first plate 802 and the second plate 806 may be affixed to the bladder 806 by a thermally conductive material, such as thermal epoxy.
  • the bladder 806 may be rectangular in shape, however, the bladder 806 may have four sides with two opposing sides of the rectangular shape not being enclosed by the bladder 806 (i.e., the two opposing sides forming two openings in the bladder) .
  • the opposing edges of the four sides may be affixed to the first plate 802 and the second plate 804, respectively, wherein the first plate 802 encloses a first one of the two opposing sides not enclosed by the bladder 806 and the second plate 804 encloses a second one of the two opposing sides not enclosed by the bladder 806. Accordingly, the four sides of the bladder 806, the first plate 802, and the second plate 804 form a completed rectangular shape with a cavity enclosed by the bladder 806, the first plate 802, and the second plate 804.
  • the bladder 806 may be any shape with two opposing sides to which the first plate 802 and the second plate 804 may be affixed.
  • the bladder 806 may have an oval profile that extends between two opposing, flat sides, wherein the first plate 802 may be affixed to one of the flat sides and the second plate 804 may be affixed to the opposing one of the flat sides.
  • the bladder 806 may include an inlet 808 and an outlet 810.
  • the inlet 808 may be coupled to a coolant system and may allow the coolant system to pump coolant into the bladder 806.
  • the coolant may be liquid coolant (such as water and/or oil) , vapor coolant, or some combination thereof.
  • the outlet 810 may be coupled to the coolant system and may allow the coolant system to remove coolant from the bladder. Further, the inlet 808 and the outlet 810 may allow the coolant system to circulate the coolant through the bladder 806.
  • the first plate 802 may include a first portion 812 that extends beyond a portion of the first plate 802 that is affixed to, and/or abuts, the bladder 806. Further, the first plate 802 may include a second portion 814 that extends beyond the portion of the first plate 802 that is affixed to, and/or abuts, the bladder 806. The first portion 812 may extend beyond the bladder 806 in a first direction and the second portion 814 may extend beyond the bladder 806 in a second direction, wherein the second direction is opposite to the first direction. In some embodiments, the first portion 812 and the second portion 814 may extend in the same direction or in different directions that are not opposite. Further, in some embodiments, the first portion 812 and/or the second portion 814 may be omitted.
  • the first portion 812 may include a first aperture 816 formed through the first plate 802.
  • the first aperture 816 may receive a guide rod (not shown; see guide rod 1118 (Fig. 11) ) that may at least partially maintain a position of the first plate 802 in at least one direction.
  • the first aperture 816 may be omitted.
  • the first portion 812 may further include a first cutout 818.
  • the first cutout 818 may avoid interference with other objects when the flexible coolant tube 800 is placed within a system. In some embodiments, the first cutout 818 may be omitted.
  • the second portion 814 may include a second aperture 820 formed through the first plate 802.
  • the second aperture 820 may receive a guide rod (not shown; see guide rod 1118 (Fig. 11) ) that may at least partially maintain a position of the first plate 802 in at least one direction.
  • the second aperture 820 may be omitted.
  • the second portion 814 may further include a first cutout 822.
  • the first cutout 822 may avoid interference with other objects when the flexible coolant tube 800 is placed within a system. In some embodiments, the first cutout 822 may be omitted.
  • the second plate 804 may be identical to the first plate 802.
  • the second plate 804 may include a third aperture formed through the second plate 804 that may align with the first aperture 816 and a fourth aperture formed through the second plate 804 that may align with the second aperture 820.
  • FIG 9 illustrates a top view of an example flexible coolant tube 902 in an expanded state, according to various embodiments.
  • the flexible coolant tube 902 may include one or more of the features of the flexible coolant tube 800 (Fig. 8) .
  • the flexible coolant tube 902 may include a first plate 904 and a second plate 906, which may include one or more of the features of the first plate 802 (Fig. 8) and the second plate 804 (Fig. 8) , respectively.
  • the flexible coolant tube 900 may include a bladder 908, which may include one or more of the features of the bladder 806 (Fig. 8) .
  • the flexible coolant tube 902 is illustrated between a first heat source 910 and a second heat source 912.
  • the first heat source 910 and the second heat source 912 may include one or more of the features of the heat source 104 (Fig. 1) .
  • the first plate 904 may contact at least a portion of the first heat source 910 and the second plate 906 may contact at least a portion of the second heat source 912 when the flexible coolant tube 902 is in an expanded state.
  • the first plate 904 may be thermally coupled to the first heat source 910 when the first plate 904 is in contact with the first heat source 910 and the second plate 906 may be thermally coupled to the second heat source 912 when the second plate 906 is in contact with the second heat source 912.
  • a thermal interface material (such as thermal grease, a thermal pad, or other similar other thermal interface materials) may be located between the first plate 904 and the first heat source 910 and/or between the second plate 906 and the second heat source 912 to facilitate heat transfer.
  • the bladder 908 may be filled or may be filled to a point where force applied to the first plate 904 and/or the second plate 906 is equal to a predetermined amount, wherein the force causes the first plate 904 and the second plate 906 to be urged away from each other.
  • the force may be generated by a pressure of the coolant within the bladder 908.
  • the pressure of the coolant within the bladder 908 may be controlled via a rate of coolant being pumped into the bladder 908 via an inlet 914 of the bladder 908 and a rate of coolant being removed from the bladder 908 via an outlet 916 of the bladder 908.
  • the inlet 914 may include one or more of the features of the inlet 808 (Fig. 8) .
  • the outlet 916 may include one or more of the features of the outlet 810 (Fig. 8) .
  • the pressure of the coolant may be maintained by pumping the coolant into the bladder 908 at a same rate that the coolant is being removed from the bladder 908.
  • the pressure of the coolant may be increased by pumping coolant into the bladder 908 at a rate greater than a rate that coolant is being removed from the bladder 908. Further, the pressure of the coolant may be decreased pumping coolant into the bladder 908 at a rate less than a rate that coolant is being removed from the bladder 908.
  • Figure 10 illustrates a top view of the example flexible coolant tube 902 of Figure 9 in an unexpanded state, according to various embodiments.
  • the bladder 908 may be at least partially emptied.
  • the bladder 908 may be emptied by removing coolant from the bladder 908 via an outlet 916 of the bladder 908 while not pumping coolant into the bladder 908 via an inlet 914 of the bladder 908, or pumping coolant into the bladder 908 via the inlet 914 at a slower rate than the coolant is being removed from the bladder 908.
  • the inlet 914 may include one or more of the features of the inlet 808 (Fig. 8) .
  • the outlet 916 may include one or more of the features of the outlet 810 (Fig. 8) .
  • the bladder 908 When the bladder 908 is at partially emptied, the bladder 908 may contract causing the first plate 904 and the second plate 906 to be drawn toward each other.
  • the cavity formed within the bladder 908 may be maintained in a vacuum with the inlet 914 and/or the outlet 916 maintaining the matter within the cavity.
  • the lack of matter within the bladder 908 may draw the first plate 904 and the second plate 906 together.
  • an external force or forces may be applied to the first plate 904 and/or the second plate 906 urging the first plate 904 and the second plate 906 toward each other in addition to, or in lieu of, the force generated by the vacuum.
  • the external force or forces may include a spring extending between the first plate 904 and the second plate 906 urging the first plate 904 and the second plate 906 together, a physical mechanism (such as arms (described below) or springs) that applies a force urging the first plate 904 and the second plate 906 together, or some combination thereof.
  • the flexible material of the bladder 908 may be elastic, such that as the bladder is emptied the flexible material may contract and draw the first plate 904 and the second plate 906 together.
  • a space may be located between the first plate 904 and the first heat source 910, between the second plate 906 and the second heat source 912, or some combination thereof. Due to the space between the first plate 904 and the first heat source 910 and/or the space between the second plate 906 and the second heat source 912, the first plate 904 may not be thermally coupled to the first heat source 910 and/or the second plate 906 may not be thermally coupled to the second heat source 912.
  • FIG 11 illustrates a perspective view of an example coolant assembly 1100, according to various embodiments.
  • the coolant assembly 1100 may be utilized to mount one or more flexible coolant tubes 1114 to a PCB 1102, wherein the flexible coolant tubes 1114 may thermally couple and decouple from one or more heat sources 1116 as the flexible coolant tubes 1114 transition between the expanded state and the unexpanded state.
  • the flexible coolant tubes 1114 may include one or more features of the flexible coolant tube 800 (Fig. 8) and/or the flexible coolant tube 902 (Fig. 9) .
  • the heat sources 1116 may include one or more of the features of the first heat source 910 (Fig. 9) and/or the second heat source 912 (Fig. 9) .
  • the coolant assembly 1100 may include a housing 1104.
  • the housing 1104 may be mounted to the PCB 1102.
  • the housing 1104 may include a first end piece 1106 and a second end piece 1108.
  • the first end piece 1106 and the second end piece 1108 may be located at opposing ends of the housing 1104.
  • the first end piece 1106 may include one or more cams 1110 and/or the second end piece 1108 may include one or more cams 1112.
  • the cams 1110 and/or the cams 1112 may cause a mechanism (such as the first set of arms 1206 (Fig. 12) ) to urge first plates (such as the first plate 802 (Fig. 8) and/or the first plate 904 (Fig. 9) ) and second plates (such as the second plate 804 (Fig. 8) and/or the second plate 906 (Fig. 9) ) of the flexible coolant tubes 1114 together.
  • the cams 1110 and/or the cams 1112 may cause the mechanism to cease urging the first plates and the second plates together.
  • the cams 1110 and/or the cams 1112 may further cause another mechanism (such as the second set of arms 1208 (Fig. 12) ) to urge the first plates and the second plates apart and toward the heat sources 1116 located among flexible coolant tubes 1114.
  • another mechanism such as the second set of arms 1208 (Fig. 12)
  • the housing 1104 may further include one or more guide rods (such as guide rod 1118) .
  • the guide rod 1118 may extend from a side of the first end piece 1106 to an opposing side of the first endpiece 1106.
  • the guide rod 1118 may extend through one or more apertures (such as the first aperture 816 (Fig. 8) and/or the second aperture 820 (Fig. 8) ) formed in the first plates and/or the second plates of the flexible coolant tubes 1114 and may maintain alignment of the flexible coolant tubes 1114 within the housing 1104.
  • the guide rods may be located in different positions within the housing 1104 and may extend from a side of the housing 1104 to an opposing side of the housing 1104.
  • the housing 1104 may further include an inlet 1120 and an outlet (not shown; see outlet 1202 (Fig. 12) ) .
  • the inlet 1120 and the outlet may be coupled to a coolant system.
  • the inlet 1120 may further be coupled to inlets (such as the inlet 808 (Fig. 8) ) of the flexible coolant tubes 1114.
  • the inlet 1120 may receive coolant from the coolant system and direct the coolant into the bladders (such as the bladder 806 (Fig. 8) and/or the bladder 908 (Fig. 9) ) of the flexible coolant tubes 1114 via the inlets of the flexible coolant tubes 1114.
  • the outlet of the housing may further be coupled to outlets (such as the outlet 810 (Fig. 8) ) of the flexible coolant tubes 1114.
  • the outlet of the housing may allow the coolant system to remove coolant from the bladders of the flexible coolant tubes 1114 via the outlets of the flexible coolant tubes 1114.
  • Figure 12 illustrates an end view of the example coolant assembly 1100 of Figure 11, according to various embodiments.
  • the flexible coolant tubes 1114 may include a first flexible coolant tube 1114a, a second coolant tube 1114b, a third flexible coolant tube 1114c, and a fourth flexible coolant tube 1114d.
  • the heat sources 1116 may include a first heat source 1116a, a second heat source 1116b, and a third heat source 1116c.
  • the flexible coolant tubes 1114 and the heat sources 1116 may arranged in an alternating fashion within the housing 1104, such that one of the heat sources 1116 is located between two of the flexible coolant tubes 1114.
  • the first heat source 1116a may be located between the first flexible coolant tube 1114a and the second coolant tube 1114b.
  • the heat sources 1116 maybe coupled to the PCB 1102 via one or more sockets 1214.
  • the sockets 1214 may include one or more of the features of the sockets 604 (Fig. 6) .
  • the sockets 1214 may include a first socket 1214a, a second socket 1214b, and a third socket 1214c.
  • the first heat source 1116a may be installed in the first socket 1214a
  • the second heat source 1116b may be installed in the second socket 1214b
  • the third heat source 1116c may be installed in the third socket 1214c.
  • the housing 1104 may include the inlet 1120 and an outlet 1202.
  • the outlet 1202 may include one or more of the features described in relation to the outlet in Figure 11.
  • the inlet 1120 may be coupled to the second end piece 1108.
  • the outlet 1202 may be coupled to a first end piece (obscured due to view) , wherein the first end piece may be located at an opposite end of the coolant assembly 1100 from the second end piece 1108.
  • the housing 1104 may further include a second guide rod 1204.
  • the second guide rod 1204 may include one or more of the features of the guide rod 1118.
  • the second guide rod 1204 may extend from a side of the second end piece 1108 to an opposing side of the second end piece 1108.
  • the second guide rod 1204 may extend through the aperture formed in the first flexible coolant tube 1114a, the second flexible coolant tube 1114b, the third flexible coolant tube 1114c, and/or the fourth flexible coolant tube 1114d, and may maintain alignment of the first flexible coolant tube 1114a, the second flexible coolant tube 1114b, the third flexible coolant tube 1114c, and/or the fourth flexible coolant tube 1114d.
  • the housing 1104 may further include a first set of arms 1206 and a second set of arms 1208.
  • the first set of arms 1206 and the second set of arms 1208 may be coupled to cams 1112 located within the second endpiece 1108.
  • the first set of arms 1206 and the second set of arms 1208 may be located toward an end of the housing 1104, wherein the first set of arms 1206 and the second set of arms 1208 can contact the first plates and/or the second plates of the flexible coolant tubes 1114 that extend toward the end of the housing 1104, but cannot contact the heat sources 1116 that do not extend far enough toward the end of the housing 1106 to be contacted by the first set of arms 1206 and the second set of arms 1208.
  • the cams 1112 are illustrated in an activated state. While the cams 1112 are in the activated state, the first set of arms 1206 may apply force to the first plates and/or the second plates of the flexible coolant tubes 1114 urging the first plates and the second plates of the flexible coolant tubes 1114 together.
  • a first arm 1206a of the first set of arms 1206 may apply a force to a first plate 1210 of the second flexible coolant tube 1114b and a second arm 1206b of the first set of arms 1206 may apply force to a second plate 1212 of the second flexible coolant tube 1114b that urge the first plate 1210 and the second plate 1212 together.
  • the bladders of the flexible coolant tubes 1114 may be at least partially emptied allowing the bladders to be compressed. While the bladders are compressed, the first plates and the second plates may be located at a distance from each other closer than while the cams 112 are in a deactivated state. Due to the first plates and the second plates being located at the distance while the cams 1112 are in the activated state, the heat sources 1116 may be installed and removed from the sockets 1214 without contact and/or interference between the heat sources 1116 and the flexible coolant tubes 1114 (as illustrated by the first heat source 1116a being removed from the first socket 1214a) .
  • the second set of arms 1208 may not contact the flexible coolant tubes 1114. Accordingly, the second set of arms 1208 may not be applying a force or forces to the flexible coolant tubes 1114 while the cams 1112 are in the activated state.
  • FIG 13 illustrates another end view of the example coolant assembly 1100 of Figure 11, according to various embodiments.
  • the cams 1112 may be in the deactivated state.
  • the first set of arms 1206 may not contact the flexible tubes 1114. Accordingly, the first set of arms 1206 may not be applying a force or forces to the flexible coolant tubes 1114 while the cams 1112 are in the deactivated state.
  • the second set of arms 1208 may apply force to the first plates and/or the second plates of the flexible coolant tubes 1114 urging the first plates and the second plates of the flexible coolant tubes 1114 apart. Further, the force applied to the first plates and/or the second plates of the flexible coolant tubes 1114 may urge the first plates and/or second plates to contact the adjacent heat sources 1116.
  • a first arm 1208a of the second set of arms 1208 may apply force to a first plate 1302 of the second flexible coolant tube 1114b and a second arm 1208b of the second set of arms 1208 may apply force to a second plate 1304 of the second flexible coolant tube 1114b urging the first plate 1302 and the second plate 1304 apart.
  • the first plate 1302 may contact the first heat source 1116a and the second plate 1304 may contact the second heat source 1116b.
  • the second flexible coolant tube 1114b may be thermally coupled to the first heat source 1116a and the second heat source 1116b due to the first plate 1302 contacting the first heat source 1116a and the second plate 1304 contacting the second heat source 1116b.
  • the bladders of the flexible coolant tubes 1114 may be filled or may be filled to a point where force applied to the heat sources 1116 via the first plates and the second plates of the flexible coolant tubes 1114 is equal to a predetermined amount.
  • the force applied to the heat sources 1116 via the first plates and the second plates may be determined based on an amount of pressure of the coolant in the bladder, a contact area of the first plates and second plates with the heat sources 1116, and a force applied the second set of arms 1208.
  • the first end piece 1106 may further include a first set of arms and a second set of arms.
  • the first set of arms of the first end piece 1106 may include one or more of the features of the first set of arms 1206.
  • the second set of arms of the first end piece 1106 may include one or more of the features of the second set of arms 1208.
  • the first set of arms of the first end piece 1106 may operate the same as the first set of arms 1206 with the exception of being based on the activation and deactivation of the cams 1110 rather than the cams 1112.
  • the second set of arms of the first end piece 1106 may operate the same as the second set of arms 1208 with the exception of being based on the activation and deactivation of the cams 1110 rather than the cams 1112.
  • the second set of arms 1208 may be omitted.
  • the first plates and the second plates of the flexible coolant tubes 1114 may be urged apart, and against the heat sources 1116, by the pressure of the coolant within the flexible coolant tubes 1114.
  • the determination of the force applied to one of the heat sources 1116 may omit the force applied by one of the arms term (x*F arm ) from the equation of total force.
  • the cams 1110, the cams 1112, and the second set of arms 1208 may be omitted.
  • the first set of arms 1206 may continuously apply a force or forces to the first plates and the second plates of the flexible coolant tubes.
  • the pressure of the coolant within the flexible coolant tubes 1114 may not overcome the force applied by the first set of arms 1206 and the first plates and second plates of the flexible coolant tubes 1114 may be located in the positions when the cams 1110 and the cams 1112 are activated (as illustrated in Figure 12) .
  • the pressure of the coolant within the flexible coolant tubes 1114 may overcome the force applied by the first set of arms 1206 and the first plates and the second plates of the flexible coolant tubes 1114 may contact the heat sources 1116.
  • the cams 1110, the cams 1112, the first set of arms 1206, and the second set of arms 1208 may be omitted.
  • the first plates and the second plates of the flexible coolant tubes 1114 may be urged together via the bladder of the flexible coolant tubes 1114 being emptied and may be located in the positions when the cams 1110 and the cams 1112 are activated (as illustrated in Figure 12) .
  • the first plates and the second plates of the flexible coolant tubes 1114 may be urged apart when the bladder of the flexible coolant tubes 1114 are filled or filled to a point where force applied to the first plate 904 and/or the second plate 906 is equal to a predetermined amount.
  • Figure 14 illustrates another end view of the example coolant assembly 1400, according to various embodiments.
  • the coolant assembly 1400 may include one or more of the features of the coolant assembly 1100 (Fig. 11) .
  • certain features are shown as transparent or omitted from the illustration to show features that would otherwise be obscured ifthe certain feature were not shown as transparent or omitted.
  • an end piece 1414 (such as the first end piece 1106 and/or the second end piece 1108) is illustrated as being transparent, and a first set of arms (such as the first set of arms 1206) and a second set of arms (such as the second set of arms 1208) are omitted from the illustration.
  • Coolant assembly 1400 may be omitted from the coolant assembly 1400 in some embodiments, or some of the features may be included in the coolant assembly 1400 and others of the features may be omitted from the coolant assembly 1400 in some embodiments.
  • the coolant assembly 1400 may include one or more flexible coolant tubes 1402.
  • the flexible coolant tubes 1402 may include one or more of the features of flexible coolant tube 800 (Fig. 8) , the flexible coolant tube 902 (Fig. 9) , the flexible coolant tubes 1114 (Fig. 11) , or some combination thereof.
  • the flexible coolant tubes 1402 may be located among one or more sockets 1404 mounted to a PCB 1406, wherein a first one of the flexible coolant tubes 1402 is located on a side of one of the sockets 1404 and a second one of the flexible coolant tubes 1402 is located on an opposing side of the one of the sockets 1404 for each socket 1404.
  • the alignment of the flexible coolant tubes 1402 may be at least partially maintained by a guide rod 1408.
  • the coolant assembly 1400 may further include an inlet 1412 and an inlet tube 1410 coupled to the inlet 1412.
  • the inlet 1412 may include one or more of the features of the inlet 1120 (Fig. 11) .
  • the inlet 1412 may be coupled to a coolant system that pumps coolant into the inlet 1412.
  • the inlet tube 1410 may be coupled to the inlet 1412 and may extend into the end piece 1414 from the inlet.
  • the inlet tube 1410 may further include one or more feeder tubes 1416.
  • Each of the feeder tubes 1416 may be coupled to a corresponding bladder of the flexible coolant tubes 1402, wherein there is a one-to-one ratio between the feeder tubes 1416 and the flexible coolant tubes 1402.
  • the coolant received by the inlet 1412 from the coolant system may be fed into the bladders of the flexible coolant tubes 1402 via the inlet tube 1410 and the feeder tubes 1416.
  • the coolant assembly 1400 may further include a second end piece located at an opposite end of the coolant assembly.
  • the second end piece may have a same layout as the end piece 1414.
  • the second end piece may include an outlet (such as the outlet 1202 (Fig. 12) , an outlet tube, and one or more outlet feeder tubes in place of the inlet 1412, the inlet tube 1410, and the feeder tubes 1416, respectively.
  • the outlet, the outlet tube, and the outlet feeder tubes may include the same features as the inlet 1412, the inlet tube 1410, and the feeder tubes 1416, respectively, with the exception of function.
  • the outlet may be coupled to the coolant system and may receive coolant from the flexible coolant tubes 1402, via the outlet feeder tubes and the outlet tube, and feed the coolant back to the coolant system.
  • FIG 15 illustrates a perspective view of an example coolant tube 1500, according to various embodiments.
  • the coolant tube 1500 may be formed of a thermally conductive material.
  • the coolant tube 1500 may be formed of a material known by one having ordinary skill in the art to be utilized for coolant tubes, such as copper, aluminum, steel, alloys thereof, or some combination thereof.
  • the coolant tube 1500 may be rigid or semi-rigid.
  • the coolant tube 1500 may include a first portion 1502, a second portion 1504, and a third portion 1506.
  • the first portion 1502 may be located at an end of the coolant tube 1500 and the third portion 1506 may be located at an opposing end of the coolant tube 1500.
  • the second portion 1504 may be located intermediate to the first portion 1502 and the third portion 1506.
  • the second portion 1504 of the coolant tube 1500 may have a T-shaped profile (as described further in relation to Figure 16a) .
  • the second portion 1504 When installed within a computing node, the second portion 1504 may be intended to extend along a side of a socket for mounting a heat source within the computing node.
  • the socket may include one or more of the features of the sockets 604 (Fig. 6) , the sockets 1214 (Fig. 12) , or some combination thereof.
  • the heat source may include one or more of the features of the heat source 104 (Fig. 1) , the heat sources 602 (Fig. 6) , the first heat source 910 (Fig. 9) , the second heat source 912 (Fig. 9) , the heat sources 1116 (Fig. 11) , or some combination thereof.
  • the second portion may extend along the side of the socket between a first retaining clip of the socket and a second retaining clip of the socket.
  • the first retaining clip may be located at a first end of the socket and the second retaining clip may be located at a second end of the socket, the second end of the socket being opposite to the first end of the socket.
  • the first portion 1502 and the third portion 1506 of the coolant tube 1500 may be rectangular-shaped (as described further in relation to Figure 16b) .
  • the first portion 1502 When installed within a computing node, the first portion 1502 may be intended to extend past a first retaining clip of the socket.
  • the first retaining clip may be located at a first end of the socket.
  • the third portion 1506 when installed within a computing node, the third portion 1506 may be intended to extend past a second retaining clip of the socket.
  • the second retaining clip may be located at a second end of the socket, the second end of the socket being opposite to the first end of the socket.
  • the first portion 1502 and the third portion 1506 may circular-shaped or any other shape that may extend past the first retaining clip and the second retaining clip, respectively, without interference.
  • the coolant tube 1500 may further include a cavity (not shown; as described further in relation to Figure 16a and Figure 16b) formed in a center of the coolant tube 1500.
  • the cavity may extend for a length of the coolant tube 1500, including at least a portion of the first portion 1502, the second portion 1504, and the second portion 1506. In some embodiments, the cavity may extend for the entire length of the coolant tube 1500.
  • a shape of the cavity may be different in the second portion 1504 than in the first portion 1502 and the third portion 1506. In other embodiments, the shape of the cavity may be the same for the length of the extension of the cavity.
  • a first aperture 1508 may be formed at a first end of the cavity and a second aperture (not shown due to view angle) may be formed at a second end of the cavity, the second end of the cavity being located opposite to the first end of the cavity.
  • the first aperture 1508 may be formed in a first end of the coolant tube 1500 and the second aperture may be formed in a second end of the coolant tube 1500, the second end of the coolant tube 1500 being located opposite to the first end of the coolant tube 1500.
  • the first aperture 1508 may be coupled to a coolant system and may allow the coolant system to direct coolant into the cavity.
  • the second aperture may be coupled to the coolant system and may allow the coolant system to remove coolant from the cavity. Accordingly, the coolant system may circulate coolant through the cavity.
  • Figure 16a illustrates an example profile 1600 of a portion of the coolant tube 1500 of Figure 15, according to various embodiments.
  • the profile 1600 may be the profile of the second portion 1504 (Fig. 15) of the coolant tube 1500.
  • the profile 1600 may include a shell 1610.
  • the shell 1610 may be formed of a material known by one having ordinary skill in the art to be utilized for coolant tubes, such as copper, aluminum, steel, alloys thereof, or some combination thereof.
  • the shell 1610 may be rigid or semi-rigid.
  • the profile 1600 may be T-shaped.
  • the shell 1610 may form a T-shape.
  • the profile 1600 may include a first profile portion 1602 and a second profile portion 1604.
  • the first profile portion 1602 may extend in a first direction. Further, the first profile portion 1602 may produce a shaft of the T-shape.
  • a width 1606 of the first profile portion 1602 may be selected based on a distance between two sockets of a computing node in which the coolant tube 1500 is intended to be placed between. In particular, the width 1606 of the first profile portion 1602 may be within 1 mm of the distance between the two sockets.
  • the width 1606 of the first profile portion 1602 may be approximately between 2 mm and 5.2 mm (within 100 micrometers ( ⁇ m) ) . Further, in some embodiments, the width 1606 of the first profile portion 1602 may be approximately 2.4 mm (within 100 ⁇ m) .
  • the second profile portion 1604 may be located at an end of the first profile portion 1604 and may extend in a second direction that is perpendicular to the first direction.
  • the first profile portion 1602 may abut the second profile portion 1604 at a center of a length of the second profile portion 1604.
  • the second profile portion 1604 may produce a top of the T-shape.
  • a width 1608 of the second profile portion 1604 may be greater than the width 1606 of the first profile portion 1602.
  • the width 1608 of the second profile portion 1604 may be selected based on a distance between two heat sources when the two heat sources are installed in the two sockets of the computing node. In particular, the width 1608 of the second profile portion 1602 may be within 1 mm of the distance between the two heat sources.
  • the width 1608 of the second profile portion 1604 may be approximately between 4.8 mm and 8 mm (within 100 micrometers ( ⁇ m) ) . Further, in some embodiments, the width 1608 of the second profile portion 1604 may be approximately 5.2 mm (within 100 ⁇ m) .
  • the profile 1600 may further include a cavity 1612 formed in a center of the shell 1610.
  • the cavity 1612 may extend within the first profile portion 1602 and/or the second profile portion 1604.
  • the cavity 1612 may be T-shaped. In other embodiments, the cavity 1612 may be rectangular-shaped. Further, in some embodiments, the cavity 1612 may be rectangular-shaped and extend within the first profile portion 1602.
  • the second portion 1504 of the coolant tube 1500 may have the profile 1600 for substantially an entire length of the second portion 1504 (within 5 mm) .
  • a shape of the cavity 1612 may transition at a first end of the second portion 1504 and a second end of the second portion 1504 to a shape of the cavity of the first portion 1502 (Fig. 15) and the third portion 1506 (Fig. 15) , as described in relation to Figure 16b.
  • a shape of the shell 1610 may make an abrupt transition or a smooth transition at the first end of the second portion 1504 and the second end of the second portion 1504 to a shape of the shell of the first portion 1502 and the third portion 1506, as described in relation to Figure 16b.
  • Figure 16b illustrates an example profile 1650 of another portion of the coolant tube 1500 of Figure 15, according to various embodiments.
  • the profile 1650 may be the profile of the first portion 1502 (Fig. 15) and the third portion 1506 (Fig. 15) of the coolant tube 1500.
  • the profile 1650 may include a shell 1652.
  • the shell 1652 may be formed of a material known by one having ordinary skill in the art to be utilized for coolant tubes, such as copper, aluminum, steel, alloys thereof, or some combination thereof.
  • the shell 1652 may be rigid or semi-rigid.
  • the profile 1650 may be a rectangular-shape.
  • the shell 1652 may form a rectangular shape.
  • a width 1654 of the profile 1650 may be selected based on a distance between two sockets of a computing node in which the coolant tube 1500 is intended to be placed between.
  • the width 1654 of the profile 1600 may be within 1 mm of the distance between the sockets.
  • the width 1654 of the profile 1600 may be approximately between 2 mm and 5.2 mm (within 100 ⁇ m) .
  • the width 1654 of the profile 1650 may be approximately 2.4 mm (within 100 ⁇ m) .
  • the profile 1650 may further include a cavity 1656 formed in a center of the shell 1652.
  • the cavity 1656 may be rectangular-shaped.
  • the first portion 1502 and the third portion 1506 of the coolant tube 1500 may have the profile 1650 for substantially an entire length of the first portion 1502 and the third portion 1506, respectively (within 5 mm) .
  • the profile 1650 may be circular.
  • the shell 1652 may be circular.
  • the cavity 1656 may be circular within the shell 1652.
  • the profile 1650 may be any other shape as long as the width 1654 of the profile 1650 does not exceed the distance between the two sockets of the computing node in which the coolant tube 1500 is intended to be placed between.
  • FIG 17 illustrates a perspective view of an example coolant tube assembly 1700, according to various embodiments.
  • the coolant tube assembly 1700 may include one or more coolant tubes 1702.
  • the coolant tubes 1702 may include one or more of the features of the coolant tube 1500.
  • the coolant tube assembly 1700 may further include a first mounting tube 1704 and a second mounting tube 1706.
  • the coolant tubes 1702 may extend between the first mounting tube 1704 and the second mounting tube 1706.
  • the coolant tubes 1702 may be coupled to the first mounting tube 1704 at a first end of the coolant tubes 1702 and the coolant tubes 1702 may be coupled to the second mounting tube 1706 at a second end of the coolant tubes 1702, the second end of the coolant tubes 1702 being opposite to the first end of the coolant tubes 1702.
  • the first mounting tube 1704 may include a cavity (such as the cavity 1612 (Fig. 16A) and/or the cavity 1656 (Fig. 16B) ) formed within a center of the first mounting tube 1704.
  • the cavity may extend through at least a portion of the length of the first mounting tube 1704.
  • the cavity of the first mounting tube 1704 may be coupled to the cavities within the coolant tubes 1702 via apertures (such as the first aperture 1508 (Fig. 15) ) formed in the first end of the coolant tubes 1702.
  • the first mounting tube 1704 may further include an aperture 1708 formed in the first mounting tube 1704.
  • the aperture 1708 may be coupled to the cavity within the first mounting tube 1704.
  • the aperture 1708 may be coupled to a coolant system and may allow the coolant system to pump coolant into the cavity within the first mounting tube 1704.
  • the first mounting tube 1704 may direct the coolant into the cavities of the coolant tubes 1702.
  • the second mounting tube 1706 may include a cavity (such as the cavity 1612 (Fig. 16A) and/or the cavity 1656 (Fig. 16B) ) formed within a center of the second mounting tube 1706.
  • the cavity may extend through at least a portion of the length of the second mounting tube 1706.
  • the cavity of the second mounting tube 1706 may be coupled to the cavities within the coolant tubes 1702 via apertures (such as the first aperture 1508 (Fig. 15) ) formed in the first end of the coolant tubes 1702.
  • the second mounting tube 1706 may further include an aperture 1710 formed in the second mounting tube 1706.
  • the aperture 1708 may be coupled to the cavity within the second mounting tube 1706.
  • the aperture 1708 may be coupled to a coolant system and may allow the coolant system to remove coolant from the cavity within the second mounting tube 1706.
  • the second mounting tube 1706 may receive coolant from the cavities of the coolant tubes 1702 and provide the coolant to the coolant system when the coolant system removes coolant from the cavity. Accordingly, the coolant system may circulate coolant through the cavities formed within the coolant tubes 1702 via the first mounting tube 1704 and the second mounting tube 1706.
  • Figure 18 illustrates a perspective view of an example heat spreader 1802 coupled to a heat source 1804, according to various embodiments.
  • the heat spreader 1802 may include one or more of the features of the heat spreader 102 (Fig. 1) , the heat spreaders 608 (Fig. 6) , or some combination thereof.
  • the heat source 1804 may include one or more of the features of the heat source 104 (Fig. 1) , the heat sources 602 (Fig. 6) , or some combination thereof.
  • the heat spreader 1802 may include a first plate 1806 and a second plate 1808.
  • the first plate 1806 may be coupled to a first side of the heat source 1804.
  • the first plate 1806 may extend along the first side of the heat source 1804 and may contact at least a portion of the first side of the heat source 1804. Further, the first plate 1806 may be thermally coupled to the heat source 1804 due to the contact between the first plate 1806 and the portion of the first side of the heat source 1804.
  • the second plate 1808 may be coupled to a second side of the heat source 1804, where the second side of the heat source 1804 is located opposite to the first side of the heat source 1804.
  • the second plate 1808 may extend along the second side of the heat source 1804 and may contact at least a portion of the second side of the heat source 1806. Further, the second plate 1808 may be thermally coupled to the heat source 1804 due to the contact between the second plate 1808 and the portion of the second side of the heat source 1804.
  • the first plate 1806 may include an upper portion 1812 and a lower portion 1814.
  • the lower portion 1814 may be located at a side of the first plate 1806 corresponding to a side of the heat source 1804 that is to be inserted into a socket (such as the sockets 604 (Fig. 6) ) of a computing node.
  • the upper portion 1812 may extend from the lower portion 1814 to a side of the first plate 1806 opposite to the lower portion 1814.
  • the upper portion 1812 and the lower portion 1814 may have different thicknesses.
  • the lower portion 1814 may have a uniform thickness.
  • the lower portion 1814 may be designed to extend perpendicularly to the extension of the first plate 1806 to approximately (within 500 ⁇ m) a middle point between the heat source 1804 and an adjacent heat source when the heat source 1804 is installed within a socket of a computing node.
  • the thickness of the lower portion 1814 may be approximately (within 100 ⁇ m) between 1.6 mm and 3 mm. Further, in some embodiments, the thickness of the lower portion 1814 maybe approximately (within 100 ⁇ m) 2.5 mm.
  • the thickness of the lower portion 1814 may vary.
  • the lower portion 1814 may be designed to extend perpendicularly to the extension of the first plate 1806 to approximately (within 500 ⁇ m) a middle point between the heat source 1804 and an adjacent heat source when the heat source 1804 is installed within a socket of a computing node.
  • the thickness of the thickest portion of the lower portion 1814 may be approximately (within 100 ⁇ m) between approximately 1.6 mm and 3 mm. In some embodiments, the thickness of the thickest portion of the lower portion 1814 may be approximately (within 100 ⁇ m) 2.5 mm.
  • a thickness of the upper portion 1812 may vary. A thickness of at least a portion of the upper portion 1812 may be less than the thickness of the lower portion 1814. In particular, a thinnest portion of the upper portion 1812 may be approximately (within 100 ⁇ m) between 0.5 mm and 1.5 mm thick. In some embodiments, the thinnest portion of the upper portion 1812 may be approximately (within 100 ⁇ m) 1 mm thick. The thickest portion of the upper portion 1812 may be equal to or less than the thickness of the lower portion 1814.
  • the thickness of the upper portion 1812 may be uniform. In these embodiments, the thickness of the upper portion 1812 may be less than the thickness of the lower portion 1814. In particular, the thickness of the upper portion 1812 may be approximately (within 100 ⁇ m) between 0.5 mm and 1.5 mm. In some embodiments, the thickness of the upper portion 1812 may be approximately (within 100 ⁇ m) 1 mm.
  • the second plate 1808 may include one or more features of the first plate 1806, including having an upper portion and a lower portion, and having the thicknesses of the upper portion and the lower portion described in relation to the first plate 1806.
  • the second plate 1808 may be the same as the first plate 1806, with the second plate 1808 rotated 180 degrees from the first plate 1806 to couple to the second side of the heat spreader 1802.
  • the second plate 1808 may be equivalent to mirroring the first plate 1806 about the heat source 1804.
  • the heat spreader 1802 may further include one or more clips 1810.
  • the clips 1810 may include one or more of the features of the clips 108 (Fig. 1) .
  • the clips 1810 may couple the first plate 1806 and the second plate 1808 to the heat source 1804.
  • the clips 1810 may apply a force or forces to the first plate 1806 pressing the first plate 1806 against the first side of the heat source 1804.
  • the clips 1810 may apply a force or forces to the second plate 1808 pressing the second plate 1808 against the second side of the heat source 1804.
  • FIG 19 illustrates a perspective view of an example coolant assembly arrangement 1900, according to various embodiments.
  • the coolant assembly arrangement 1900 may include a coolant tube assembly 1902.
  • the coolant tube assembly 1902 may include one or more of the features of the coolant tube assembly 1700 (Fig. 17) .
  • the coolant tube assembly 1902 may be mounted to a PCB 1904 via a first mounting tube 1906 and a second mounting tube 1908.
  • the coolant tube assembly 1902 may include one or more coolant tubes 1910 that extend between the first mounting tube 1906 and the second mounting tube 1908.
  • the coolant assembly arrangement 1900 may further include one or more heat sources 1912.
  • the heat sources 1912 may include one or more of the features of the heat source 104 (Fig. 1) , the heat sources 602 (Fig. 6) , the first heat source 910 (Fig. 9) , the second heat source 912 (Fig. 9) , the heat sources 1116 (Fig. 11) , the heat source 1804 (Fig. 18) , or some combination thereof.
  • the heat sources 1912 may be mounted to the PCB 1904 via one or more sockets 1914.
  • the sockets 1914 may include one or more of the features of the sockets 604 (Fig. 6) . When the heat sources 1912 are installed in the sockets 1914, the heat sources 1914 may be coupled to one or more traces of the PCB 1904.
  • the coolant assembly arrangement 1900 may further include one or more heat spreaders 1916.
  • the heat spreaders 1916 may include one or more of the features of the heat spreader 1802 (Fig. 18) .
  • Each of the heat spreaders 1916 may be coupled to a corresponding one of the heat sources 1912 for a one-to-one ratio of heat spreaders 1916 to heat sources 1912.
  • the heat spreaders 1916 are thermally coupled to the coolant tubes 1910.
  • the lower portions of the heat spreaders 1916 may contact thermal interface material 1918 (such as thermal grease, a thermal pad, or other similar other thermal interface materials) affixed to tops of a T-shaped portion (such as the second portion 1504 (Fig. 15) ) of the coolant tubes 1910.
  • the lower portions of the heat spreaders 1916 may compress the thermal interface material 1918 when the heat sources 1912 are installed in the sockets 1914.
  • the thermal interface material 1918 may be omitted and the heat spreaders 1916 may contact the coolant tubes 1910 thermally coupling the heat spreaders to the coolant tubes 1910.
  • the heat sources 1912 may be thermally coupled to the coolant tubes 1910 via the heat spreaders 1916, allowing heat to be transferred from the heat sources 1912 to the coolant tubes 1910. Coolant circulated through the coolant tubes 1910 may receive the heat and transfer the heat away from the heat sources 1912.
  • Figure 20 illustrates a side view of the example coolant assembly arrangement 1900 of Figure 19, according to various embodiments.
  • the coolant tubes 1910 may be located at a certain distance above the PCB 1904.
  • the coolant tubes 1910 may be maintained at the certain distance by the first mounting tube 1906 and the second mounting tube 1908.
  • the coolant tubes 1910 may be located on the PCB 1904.
  • the heat sources 1912 may include a first heat source 1912a. Further, the sockets 1914 may include a first socket 1914a. The first socket 1914 may be mounted to the PCB 1908. The first heat source 1912a may be installed in the first socket 1914a. The first heat source 1912a may be coupled with one or more traces of the PCB 1908 via the first socket 1914a.
  • the heat spreaders 1916 may include a first heat spreader 1916a.
  • the first heat spreader 1916a may be coupled to the first heat source 1912a.
  • the first heat spreader 1916a may include a first plate 2002 and a second plate 2004.
  • the first plate 2002 and the second plate 2004 may each include one or more of the features of the first plate 1806 (Fig. 18) .
  • the first plate 2002 may contact at least a portion of a first side of the first heat source 1912a and may be thermally coupled to the first heat source 1912a.
  • the second plate 2004 may contact at least a portion of a second side of the first heat source 1912a, where the second side of the first heat source 1912a is opposite to the first side of the first heat source 1912a.
  • the coolant tubes 1910 may include a first coolant tube 1910a and a second coolant tube 1910b.
  • the first coolant tube 1910a may be located on a first side of the first heat source 1912a.
  • the first coolant tube 1910a may be T-shaped, wherein a shaft portion of the T-shape may be adjacent to the first socket 1914a and the top portion of the T-shape may be adjacent to the first heat source 1912a.
  • the thermal interface material 1918 may be affixed to a top surface of the first coolant tube 1910a. In some embodiments, the thermal interface material 1918 may be omitted.
  • the second coolant tube 1910b may be located on a second side of the first heat source 1912a, the second side of the first heat source 1912a opposite to the first side of the first heat source 1912a.
  • the second coolant tube 1910b may be T-shaped, wherein a shaft portion of the T-shape may be adjacent to the first socket 1914a and the top portion of the T-shape may be adjacent to the first heat source 1912a.
  • the thermal interface material 1918 may be affixed to a top surface of the second coolant tube 1910b. In some embodiments, the thermal interface material 1918 may be omitted.
  • the first plate 2002 may include a lower portion 2006. With the first heat source 1912a installed in the first socket 1914a, a bottom surface of the lower portion 2006 may contact the thermal interface 1918 on the first coolant tube 1910a and may thermally couple the first plate 2002 to the first coolant tube 1910a. The bottom surface of the lower portion 2006 may compress the thermal interface material 1918. In other embodiments, the bottom surface of the lower portion 2006 may contact the thermal interface material 1918 without compressing the thermal interface material 1918. Further, in embodiments where the thermal interface material 1918 is omitted, the bottom surface of the lower portion may contact the first coolant tube 1910a and thermally couple the first plate 2002 to the first coolant 1910a.
  • the first heat source 1912a may be thermally coupled to the first coolant tube 1910a and heat may be transferred from the first heat source 1912a to the first coolant tube 1910a. Coolant circulated through the first coolant tube 1910a may receive the heat and transfer the heat away from the first heat source 1912a.
  • the second plate 2004 may include a lower portion 2008. With the first heat source 1912a installed in the first socket 1914a, a bottom surface of the lower portion 2008 may contact the thermal interface 1918 on the second coolant tube 1910b and may thermally couple the second plate 2004 to the second coolant tube 1910b. The bottom surface of the lower portion 2008 may compress the thermal interface material 1918. In other embodiments, the bottom surface of the lower portion 2008 may contact the thermal interface material 1918 without compressing the thermal interface material 1918. Further, in embodiments where the thermal interface material 1918 is omitted, the bottom surface of the lower portion may contact the second coolant tube 1910b and thermally couple the second plate 2004 to the second coolant 1910b.
  • the first heat source 1912a may be thermally coupled to the second coolant tube 1910b and heat may be transferred from the first heat source 1912a to the second coolant tube 1910b. Coolant circulated through the second coolant tube 1910b may receive the heat and transfer the heat away from the first heat source 1912a.
  • FIG 21 illustrates an example coolant system 2100, according to various embodiments.
  • the coolant system 2100 may include a pump 2102.
  • the pump 2102 may pump coolant through the coolant system 2100.
  • the pump 2102 may include a heat exchanger, which may cool the coolant that passes through the pump 2102.
  • the coolant system 2100 may further include one or more coolant tubes 2104.
  • the coolant tubes 2104 may be coupled to the pump 2102.
  • the pump 2102 may circulate the coolant through the coolant tubes 2104.
  • the coolant system 2100 may include a coolant assembly 2106 thermally coupled to one or more heat sources 2108.
  • the coolant assembly 2106 may include the heat spreaders 608 (Fig. 6) and the coolant tube assembly 610 (Fig. 6) , the coolant assembly 1100 (Fig. 11) , the coolant tube assembly 1902 (Fig. 19) and the heat spreaders 1916 (Fig. 19) , or some combination thereof.
  • the heat sources 2108 may include one or more of the features of the heat sources 104 (Fig. 1) , the heat sources 602 (Fig. 6) , the first heat source 910 (Fig. 9) , the second heat source 912 (Fig. 9) , the heat sources 1116 (Fig. 11) , the heat source 1804 (Fig. 18) , the heat sources 1912 (Fig. 19) , or some combination thereof.
  • the pump 2102 may circulate coolant through the coolant assembly 2106 via the coolant tubes 2104.
  • the coolant assembly 2106 may receive heat from the heat sources 2108 and transfer the heat into the coolant.
  • the coolant may carry the heat received from the coolant assembly with it, causing the heat to be transferred away from the heat sources 2108 and back to the pump 2102.
  • the pump 2102 may cool the coolant prior to circulating the coolant back into the coolant assembly 2106.
  • Figure 22 illustrates an example computer device 2200 that may employ the apparatuses and/or methods described herein (e.g., the heat spreader 102 (Fig. 1) , the coolant tube assembly 400 (Fig. 4) , the heat spreaders 608 (Fig. 6) , the coolant tube assembly 610 (Fig. 6) , the flexible coolant tube 800 (Fig. 8) , the flexible coolant tube 902 (Fig. 9) , the coolant assembly 1100 (Fig. 11) , the coolant assembly 1400 (Fig. 14) , the coolant tube 1500 (Fig. 15) , the coolant tube assembly 1700 (Fig. 17) , the heat spreader 1802 (Fig. 18) , the coolant tube assembly 1902 (Fig.
  • computer device 2200 may include a number of components, such as one or more processor (s) 2204 (one shown) and at least one communication chip 2206.
  • the one or more processor (s) 2204 each may include one or more processor cores.
  • the at least one communication chip 2206 may be physically and electrically coupled to the one or more processor (s) 2204.
  • the communication chip 2206 may be part of the one or more processor (s) 2204.
  • computer device 2200 may include printed circuit board (PCB) 2202.
  • PCB printed circuit board
  • the one or more processor (s) 2204 and communication chip 2206 may be disposed thereon.
  • the various components may be coupled without the employment of PCB 2202.
  • computer device 2200 may include other components that may or may not be physically and electrically coupled to the PCB 2202. These other components include, but are not limited to, memory controller 2226, volatile memory (e.g., dynamic random access memory (DRAM) 2220) , non-volatile memory such as read only memory (ROM) 2224, flash memory 2222, storage device 2254 (e.g., a hard-disk drive (HDD) ) , an I/O controller 2241, a digital signal processor (not shown) , a crypto processor (not shown) , a graphics processor 2230, one or more antenna 2228, a display (not shown) , a touch screen display 2232, a touch screen controller 2246, a battery 2236, an audio codec (not shown) , a video codec (not shown) , a global positioning system (GPS) device 2240, a compass 2242, an accelerometer (not shown) , a gyroscope (not shown) ,
  • volatile memory e
  • the one or more processor (s) 2204, flash memory 2222, and/or storage device 2254 may include associated firmware (not shown) storing programming instructions configured to enable computer device 2200, in response to execution of the programming instructions by one or more processor (s) 2204, to perform any one of a number of applications.
  • these aspects may additionally or alternatively be implemented using hardware separate from the one or more processor (s) 2204, flash memory 2222, or storage device 2254.
  • the computer device 2200 may further include a coolant system 2260.
  • the coolant system 2260 may include the heat spreader 102, the coolant tube assembly 400, the heat spreaders 608, the coolant tube assembly 610, the flexible coolant tube 800, the flexible coolant tube 902, the coolant assembly 1100, the coolant assembly 1400, the coolant tube 1500, the coolant tube assembly 1700, the heat spreader 1802, the coolant tube assembly 1902, the heat spreaders 1916, the coolant system 2100, or some combination thereof.
  • the coolant system 2260 may be coupled to the DRAM 2220 and may cool the DRAM 2220.
  • the coolant system 2260 may be coupled to one or more of the components within the computer device 2200, which may include the DRAM 2220 or may exclude the DRAM 2220. Further, in some embodiments, the computer device 2200 may include multiple coolant systems 2260 that each may be coupled to one or more of the components within the computer device 2200.
  • the communication chips 2206 may enable wired and/or wireless communications for the transfer of data to and from the computer device 2200.
  • wireless and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not.
  • the communication chip 2206 may implement any of a number of wireless standards or protocols, including but not limited to IEEE 802.20, Long Term Evolution (LTE) , LTE Advanced (LTE-A) , General Packet Radio Service (GPRS) , Evolution Data Optimized (Ev-DO) , Evolved High Speed Packet Access (HSPA+) , Evolved High Speed Downlink Packet Access (HSDPA+) , Evolved High Speed Uplink Packet Access (HSUPA+) , Global System for Mobile Communications (GSM) , Enhanced Data rates for GSM Evolution (EDGE) , Code Division Multiple Access (CDMA) , Time Division Multiple Access (TDMA) , Digital Enhanced Cordless Telecommunications (DECT) , Worldwide Interoperability for Microwave Access (WiMAX) , Bluetooth, derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond.
  • IEEE 802.20 Long Term Evolution (LTE) , LTE
  • the computer device 2200 may include a plurality of communication chips 2206.
  • a first communication chip 2206 may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth
  • a second communication chip 2206 may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
  • the computer device 2200 may be a laptop, a netbook, a notebook, an ultrabook, a smartphone, a computer tablet, a personal digital assistant (PDA) , an ultra-mobile PC, a mobile phone, a desktop computer, a server, a printer, a scanner, a monitor, a set-top box, an entertainment control unit (e.g., a gaming console or automotive entertainment unit) , a digital camera, an appliance, a portable music player, or a digital video recorder.
  • the computer device 2200 may be any other electronic device that processes data.
  • FIG. 23 illustrates an example computing node arrangement 2300, according to various embodiments.
  • the computing node 2300 may include a manager 2302 and one or more server nodes, such as server node 2304 and server node 2306.
  • the one or more server nodes may be communicatively coupled to the manager 2302, thereby allowing communication between the between the server nodes and the manager 2302 (as illustrated by communication link 2318 and communication link 2320) .
  • the manager 2302 and each of the server nodes may be referred to as a computing node.
  • server node 2304 and the server node 2306, however, it is to be understood that any of the server nodes within the one or more server nodes may include one or more of the feature of the server node 2304, the server node 2306, or some combination thereof.
  • the manager 2302 may receive an operation 2308 to be performed.
  • the manager 2302 may include one or more communication chips, such as the communication chips 2206 (Fig. 22) .
  • the manager 2302 may wirelessly receive or wiredly receive the operation 2308 from a requesting device via the communication chips.
  • the manager 2302 may separate the operation 2308 into one or more discrete operations and/or data groupings for storage.
  • the server node 2304 may be a server rack.
  • the server node 2304 may include one or more drawers (which may also be referred to as sleds) , such as drawer 2310, drawer 2312, drawer 2314, and drawer 2316.
  • the server node 2304 may be arranged in a pooled-by-node arrangement. In the pooled-by-node arrangement, each of the drawers of the server node 2304 may include one or more components to provide a certain resource type.
  • the resource types may include a network resource type, a storage resource type, and a compute resource type.
  • the drawer 2310, the drawer 2312, the drawer 2314, and the drawer 2316 may each include components to provide a compute resource type.
  • the server node 2304 may be arranged in a pooled-by-drawer arrangement.
  • each of the drawers may include one or more components to provide a certain resource type, but each of the drawers may include components to provide a different resource type than provided by the components within another one of the drawers of the server node 2304.
  • the drawer 2310 may include components to provide a network resource type
  • the drawer 2312 may include components to provide a storage resource type
  • the drawer 2314 may include components to provide a compute resource type.
  • the server node 2304 may be arranged in a heterogeneous arrangement.
  • each of the drawers may include components to provide multiple resource types.
  • Each of the drawers may include components to provide all the resource types or some portion of the resource types.
  • the drawer 2310 may include components to provide a network resource type, components to provide a storage resource type, and components to provide a compute resource type.
  • the server node 2304 may be arranged in a combination of the pooled-by-drawer arrangement and the heterogeneous arrangement. In these embodiments, a first portion of the drawers of the server node 2304 may be arranged in the pooled-by-drawer arrangement and a second portion of the drawers may be arranged in the heterogeneous arrangement.
  • the drawers of the server node 2304 may be interchangeable, such that any of the drawers of the server node 2304 may be removed and replaced by a different drawer.
  • the replacement drawer may have a same arrangement as the drawer removed or may have a different arrangement than the drawer that was removed. Accordingly, the server node 2304 may be transitioned among the pooled-by-node arrangement, the pooled-by-drawer arrangement, the heterogeneous arrangement, or some combination thereof via replacing the drawers of the server node 2304. Further, a malfunctioning drawer may be removed and replaced by a properly functioning drawer to limit downtime of the drawer and allow repair of the malfunctioning drawer without having to take the server node 2304 offline.
  • the server node 2306 may include one or more of the features of the server node 2304.
  • the server node 2306 may have a same arrangement as the server node 2304 or may have a different arrangement than the server node 2304.
  • the server node 2304 may be arranged in a pooled-by-node arrangement and the server node 2306 may be arranged in a pooled-by-drawer arrangement.
  • the resource types may include the network resource type, the storage resource type, and the compute resource type.
  • the network resource type may include one or more components that may provide networking capability.
  • the components included in the network resource type may include one or more I/O controllers (such as the I/O controller 2226 (Fig. 22) ) , one or more communication chips (such as the communication chips (Fig. 22) ) , one or more antennas (such as the antenna 2228 (Fig. 22) ) , or some combination thereof.
  • the components included in the network resource type may include other components that provide networking capability known to one having ordinary skill in the art.
  • the storage resource type may include one or more components that may provide storage capability.
  • the components included in the storage resource type may include one or more memory controllers (such as the memory controller 2226 (Fig. 22) ) , one or more storage devices (such as the storage device 2254) , one or more DRAMs (such as the DRAM 2220 (Fig. 22) ) , one or more flash memories (such as the flash memory 2222 (Fig. 22) ) , one or more ROMs (such as the ROM 2224 (Fig.
  • the components included in the storage resource type may include other components that provide storage capability known to one having ordinary skill in the art.
  • the compute resource type may include one or more components that may provide computing capability.
  • the components included in the compute resource type may include one or more processors (such as the processor 2204 (Fig. 22) ) , one or more graphics processors 2230 (such as the graphics processor 2230 (Fig. 22) ) , one or more digital signal processors, one or more crypto processors, one or more video codecs, one or more audio codecs, or some combination thereof.
  • the components included in the compute resource type may include other components that provide computing capability known to one having ordinary skill in the art.
  • the resource types may include other resource types not described, but would understood to be other resource types that may be provided by a server rack known to one have skill in the art. Further, in some embodiments, the resource types described may be divided into narrower resource types, where each of the narrower resource types may include some portion of the components described above in relation to the network resource type, the storage resource type, and the compute resource type.
  • the manager 2302 may direct each of the discrete operations and/or data groupings for storage to a corresponding drawer of the server node 2304 and/or the server node 2306 that provides the resource type to perform the discrete operation or store the data grouping.
  • the manager 2302 may separate the operation 2308 into a calculation operation and a group of data to be stored.
  • the manager 2302 may direct, via the communication link 2318, the calculation operation to the drawer 2310 of the server node 2304, which may provide the compute resource type, and may direct, via the communication link 2320, the group of data to be stored to drawer 2322 of the server node 2306, which may provide the storage resource type.
  • the manager 2302 may retrieve the results of the discrete operations and/or the data groupings at a time when the results of the operation 2308 are to be returned to the requesting device via the communication chips.
  • the manager 2302 may combine the results of the discrete operations and/or the data groupings to generate the results of the operation 2308 and may return the results of the operation 2308 to the requesting device via the communication chips.
  • the manager 2302 may receive the results of the discrete operations and may direct the results of the discrete operations to a drawer providing the storage resource type for storage. The manager 2302 may then retrieve the results of the discrete operations from the drawer providing the storage resource type at the time when the results of the operation 2308 are to be returned to the requesting device.
  • the manager 2302 may be omitted from the computing node arrangement 2300.
  • one or more drawers of one of the server nodes may perform the operations of the manager 2302.
  • the drawer 2310 of the server node 2304 may perform the operations of the manager 2302 and may direct the discrete operations and/or data groupings to other drawers within the server node 2304 and/or within the server node 2306.
  • the server node with the drawer that performs the operations of the manager 2302 may be communicatively coupled to the other server nodes within the computing node arrangement 2300 (as illustrated by communication link 2324) .
  • One or more of the computing nodes within the computing node arrangement 2300 may employ the apparatuses and/or methods described herein (e.g., the heat spreader 102 (Fig. 1) , the coolant tube assembly 400 (Fig. 4) , the heat spreaders 608 (Fig. 6) , the coolant tube assembly 610 (Fig. 6) , the flexible coolant tube 800 (Fig. 8) , the flexible coolant tube 902 (Fig. 9) , the coolant assembly 1100 (Fig. 11) , the coolant assembly 1400 (Fig. 14) , the coolant tube 1500 (Fig. 15) , the coolant tube assembly 1700 (Fig. 17) , the heat spreader 1802 (Fig. 18) , the coolant tube assembly 1902 (Fig.
  • the apparatuses described herein may be coupled to one or more of the components within one or more of the computing nodes within the computing node arrangement 2300.
  • Example 1 may include a heat spreader for a heat source, comprising a first plate to be coupled to a first side of the heat source, wherein a portion of the first plate is to extend along the first side of the heat source and contact at least a portion of the first side of the heat source, and the first plate includes a bend feature located at a side of the portion of the first plate, wherein a first portion of the bend feature of the first plate is to extend away from the heat source and a second portion of the bend feature of the first plate is to extend toward the heat source.
  • a heat spreader for a heat source comprising a first plate to be coupled to a first side of the heat source, wherein a portion of the first plate is to extend along the first side of the heat source and contact at least a portion of the first side of the heat source, and the first plate includes a bend feature located at a side of the portion of the first plate, wherein a first portion of the bend feature of the first plate is to extend away from the heat source and a second portion of the bend
  • the heat spreader may further include a second plate to be coupled to a second side of the heat source, the second side of the heat source being opposite to the first side of the heat source, wherein a portion of the second plate is to extend along the second side of the heat source and contact at least a portion of the second side of the heat source, and the second plate includes a bend feature located at a side of the portion of the second plate, wherein a first portion of the bend feature of the second plate is to extend away from the heat source and a second portion of the bend feature of the second plate is to extend toward the heat source.
  • Example 2 may include the heat spreader of example 1, wherein the first portion of the bend feature of the first plate is located at the side of the portion of the first plate, the second portion of the bend feature of the first plate is located at a side of the first portion of the bend feature of the first plate being opposite to the portion of the first plate, the first portion of the bend feature of the second plate is located at the side of the portion of the second plate, and the second portion of the bend feature of the second plate is located at a side of the first portion of the bend feature of the second plate being opposite to the portion of the second plate.
  • Example 3 may include the heat spreader of examples 1 or 2, wherein the first portion of the bend feature of the first plate deviates by between 0 degrees and 90 degrees from the portion of the first plate, and the first portion of the bend feature of the second plate deviates by between 0 degrees and 90 degrees from the portion of the second plate.
  • Example 14 may include the heat spreader of examples 1 or 2, wherein the second portion of the bend feature of the first plate deviates by between 0 degrees and 90 degrees from the first portion of the bend feature of the first plate, and the second portion of the bend feature of the second plate deviates by between 0 degrees and 90 degrees from the first portion of the bend feature of the second plate.
  • Example 5 may include the heat spreader of examples 1 or 2, wherein an amount of deviation of the first portion of the bend feature of the first plate from the portion of the first plate is less than an amount of deviation of the second portion of the bend feature of the first plate from the first portion of the bend feature of the first plate, and an amount of deviation of the first portion of the bend feature of the second plate from the portion of the second plate is less than an amount of deviation of the second portion of the bend feature of the second plate from the first portion of the bend feature of the second plate.
  • Example 6 may include the heat spreader of examples 1 or 2, wherein the bend feature of the first plate is to thermally couple with a first coolant tube that is located on a first side of the heat source when the heat is installed in a socket for the heat source, and the bend feature of the second plate is to thermally couple with a second coolant tube that is located on a second side of the heat source when the heat source is installed in the socket.
  • Example 7 may include the heat spreader of example 6, wherein a slope of the second portion of the bend feature of the first plate corresponds to a slope of the first coolant tube, wherein a surface of the second portion of the bend feature of the first plate is to extend along a surface of the first coolant tube when the heat source is installed in the socket, and a slope of the second portion of the bend feature of the second plate corresponds to a slope of the second coolant tube, wherein a surface of the second portion of the bend feature of the second plate is to extend along a surface of the second coolant tube when the heat source is installed in the socket.
  • Example 8 may include the heat spreader of example 7, further comprising a first thermal interface material located on the second surface of the portion of the bend feature of the first plate, wherein the first thermal interface material is to be located between the surface of the portion of the bend feature of the first plate and the surface of the first coolant tube when the heat source is installed in the socket, and a second thermal interface material located on the second surface of the portion of the bend feature of the second plate, wherein the second thermal interface material is to be located between the second surface of the portion of the bend feature of the second plate and the surface of the second coolant tube when the heat source is installed in the socket.
  • Example 9 may include the heat spreader of examples 1 or 2, further comprising a clip that is to couple the first plate to the first side of the heat source and the second plate to the second side of heat source.
  • Example 10 may include the heat spreader of examples 1 or 2, wherein the heat source is an in-line memory module.
  • Example 11 may include the heat spreader of example 10, wherein the in-line memory module is a dual in-line memory module.
  • Example 12 may include a coolant system for a heat source, comprising a heat spreader to be coupled to the heat source, wherein the heat spreader includes a first plate to be coupled to a first side of the heat source, wherein the first plate includes a first bend feature formed toward a side of the first plate, and wherein a first portion of the first bend feature is to extend away from the heat source and a second portion of the first bend feature is to extend toward the heat source when the first plate is coupled to the first side of the heat source, and a second plate to be coupled to a second side of the heat source, the second side of the heat source being opposite to the first side of the heat source, wherein the second plate includes a second bend feature formed toward a side of the second plate, and wherein a first portion of the second bend feature is to extend away from the heat source and a second portion of the second bend feature is to extend toward the heat source when the second plate is coupled to the second side of the heat source.
  • the heat spreader includes a first plate to be coupled to a first
  • the coolant system may further include a first coolant tube to be located on the first side of the heat source when the heat source is installed in a socket for the heat source, wherein the second portion of the first bend feature is to extend along a portion of an outer surface of the first coolant tube when the heat source is installed in the socket and is to thermally couple the first plate to the first coolant tube, and a second coolant tube to be located on the second side of the heat source when the heat source is installed in the socket, wherein the second portion of the second bend feature is to extend along a portion of an outer surface of the second coolant tube when the heat source is installed in the socket and is to thermally couple the second plate to the second coolant tube.
  • Example 13 may include the coolant system of example 12, wherein a portion of the first plate is to extend along the first side of the heat source and contact at least a portion of the first side of the heat source, and a portion of the second plate is to extend along the second side of the heat source and contact at least a portion of the second side of the heat source.
  • Example 14 may include the coolant system of example 13, wherein the first portion of the first bend feature is located intermediate to the portion of the first plate and the second portion of the first bend feature, the second portion of the first bend feature is located at the side of the first plate, the first portion of the second bend feature is located intermediate to the portion of the second plate and the second portion of the second bend feature, and the second portion of the second bend feature is located at the side of the second plate.
  • Example 15 may include the coolant system of example 13, wherein the first portion of the first bend feature deviates by between 0 degrees and 90 degrees from the portion of the first plate, the second portion of the first bend feature deviates by between 0 degrees and 90 degrees from the first portion of the first bend feature, the first portion of the second bend feature deviates by between 0 degrees and 90 degrees from the portion of the second plate, and the second portion of the second bend feature deviates by between 0 degrees and 90 degrees from the first portion of the second bend feature.
  • Example 16 may include the coolant system of example 13, wherein an amount of deviation of the first portion of the first bend feature from the portion of the first plate is less than an amount of deviation of the second portion of the first bend feature from the first portion of the first bend feature, and an amount of deviation of the first portion of the second bend feature from the portion of the second plate is less than an amount of deviation of the second portion of the second bend feature from the first portion of the second bend feature.
  • Example 17 may include the coolant system of any of the examples 12-16, wherein the portion of the outer surface of the first coolant tube is sloped, the portion of the outer surface of the second coolant tube is sloped, a slope of the portion of the outer surface of the first coolant tube is equal to a slope of the second portion of the first bend feature, and a slope of the portion of the outer surface of the second coolant tube is equal to a slope of the second portion of the second bend feature.
  • Example 18 may include the coolant system of any of the examples 12-16, further comprising a first thermal interface material located on the second portion of the first bend feature, wherein the first thermal interface material is to be located between the second portion of the first bend feature and the portion of the outer surface of the first coolant tube when the heat source is installed in the socket, and wherein the first thermal interface material is to facilitate thermal transfer between the first plate and the first coolant tube, and a second thermal interface material located on the second portion of the second bend feature, wherein the second thermal interface material is to be located between the second portion of the second bend feature and the portion of the outer surface of the second coolant tube when the heat source is installed in the socket, and wherein the second thermal interface material is to facilitate thermal transfer between the second plate and the second coolant tube.
  • Example 19 may include the coolant system of any of the examples 12-16, further comprising a first thermal interface material located on the portion of the outer surface of the first coolant tube, wherein the first thermal interface material is to be located between the second portion of the first bend feature and the portion of the outer surface of the first coolant tube when the heat source is installed in the socket, and wherein the first thermal interface material is to facilitate thermal transfer between the first plate and the first coolant tube, and a second thermal interface material located on the portion of the outer surface of the second coolant tube, wherein the second thermal interface material is to be located between the second portion of the second bend feature and the portion of the outer surface of the second coolant tube when the heat source is installed in the socket, and wherein the second thermal interface material is to facilitate thermal transfer between the second plate and the second coolant tube.
  • Example 20 may include the coolant system of any of the examples 12-16, wherein the heat spreader further comprises a clip that is to couple the first plate to the first side of the heat source and the second plate to the second side of the heat source.
  • Example 21 may include the coolant system of any of the examples 12-16, wherein the heat source is an in-line memory module.
  • Example 22 may include the coolant system of any of the examples 12-16, wherein the in-line memory module is a dual in-line memory module.
  • Example 23 may include a computing node, comprising a printed circuit board (PCB) , a socket mounted to the PCB, a heat source installed in the socket, a first coolant tube that extends along a first side of the socket, the first coolant tube coupled to a pump to circulate coolant through the first coolant tube, a second coolant tube that extends along a second side of the socket, the second side of the socket being opposite to the first side of the socket, the second coolant tube coupled to the pump to circulate coolant through the second coolant tube, and a heat spreader coupled to the heat source, wherein the heat spreader includes a first bend feature located on a first side of the heat source and a second bend feature located on a second side of the heat source, the second side of the heat source being opposite to the first side of the heat source, wherein a first portion of the first bend feature extends away from the heat source and a second portion of the first bend feature extends toward the heat source, wherein the second portion of the first bend feature extends along
  • Example 24 may include the computing node of example 23, wherein a first portion of the heat spreader extends along the first side of the heat source and contacts at least a portion of the first side of the heat source, a second portion of the heat spreader extends along the second side of the heat source and contacts at least a portion of the second side of the heat source, the first bend feature is located at a side of the first portion of the heat spreader, and the second bend feature is located at a side of the second portion of the heat spreader.
  • Example 25 may include the computing node of example 24, wherein the first portion of the first bend feature is located at the side of the first portion of the heat spreader, the second portion of the first bend feature is located at an side of the first portion of the first bend feature being opposite to the first portion of the heat spreader, the first portion of the second bend feature is located at the side of the second portion of the heat spreader, and the second portion of the second bend feature is located at a side of the first portion of the second bend feature being opposite to the second portion of the heat spreader.
  • Example 26 may include the computing node of example 25, wherein the first portion of the first bend feature deviates by between 0 and 90 degrees from the first portion of the heat spreader, the second portion of the first bend feature deviates by between 0 and 90 degrees from the first portion of the first bend feature, the first portion of the second bend feature deviates by between 0 and 90 degrees from the second portion of the heat spreader, and the second portion of the second bend feature deviates by between 0 and 90 degrees from the first portion of the second bend feature.
  • Example 27 may include the computing node of example 25, wherein an amount of deviation of the first portion of the first bend feature from the first portion of the heat spreader is less than an amount of deviation of the second portion of the first bend feature from the first portion of the first bend feature, and an amount of deviation of the first portion of the second bend feature from the second portion of the heat spreader is less than an amount of deviation of the second portion of the second bend feature from the second portion of the second bend feature.
  • Example 28 may include the computing node of any of the examples 23-27, wherein a slope of the second portion of the first bend feature is equal to a slope of the portion of the first coolant tube, and a slope of the second portion of the second bend feature is equal to a slope of the portion of the second coolant tube.
  • Example 29 may include the computing node of any of the examples 23-27, further comprising a first thermal interface material located between the first bend feature and the portion of the first coolant tube, wherein the first thermal interface material is to facilitate heat transfer between the heat spreader and the first coolant tube, and a second thermal interface material located between the second bend feature and the portion of the second coolant tube, wherein the second thermal interface material is to facilitate heat transfer between the heat spreader and the second coolant tube.
  • Example 30 may include the computing node of any of the examples 23-27, wherein the computing node is a computer system.
  • Example 31 may include the computing node of any of the examples 23-27, wherein the heat source is an in-line memory module.
  • Example 32 may include the computing node of any of the examples 23-27, wherein the in-line memory module is a dual in-line memory module.
  • Example 33 may include a coolant tube, comprising a first plate that is rigid and thermally-conductive, a second plate that is rigid and thermally-conductive, and a bladder affixed at a first side to the first plate and at a second side to the second plate, the second side being opposite to the first side, the bladder to contract and move the first plate and the second plate toward each other in response to being emptied, and to expand and move the first plate and the second plate away from each other in response to being filled.
  • a coolant tube comprising a first plate that is rigid and thermally-conductive, a second plate that is rigid and thermally-conductive, and a bladder affixed at a first side to the first plate and at a second side to the second plate, the second side being opposite to the first side, the bladder to contract and move the first plate and the second plate toward each other in response to being emptied, and to expand and move the first plate and the second plate away from each other in response to being filled.
  • Example 34 may include the coolant tube of example 33, wherein the bladder includes an inlet formed in a first side of the bladder, the inlet to receive coolant from a coolant system, and an outlet formed in a second side of the bladder, the second side of the bladder being opposite to the first side of the bladder, and the outlet to allow the coolant system to remove coolant from the bladder.
  • Example 35 may include the coolant tube of the examples 33 or 34, wherein a first portion of the first plate and a first portion of the second plate extend beyond the bladder in a first direction, and wherein a second portion of the first plate and a second portion of the second extend beyond the bladder in a second direction, the second direction being opposite to the first direction.
  • Example 36 may include the coolant tube of example 35, wherein a first aperture is formed in the first portion of the first plate and a second aperture is formed in the first portion of the second plate, wherein the first aperture is aligned with the second aperture, wherein a third aperture is formed in the second portion of the first plate and a fourth aperture is formed in the second portion of the second plate, and wherein the third aperture is aligned with the fourth aperture.
  • Example 37 may include the coolant tube of the examples 33 or 34, further comprising a first thermal interface material affixed to a first side of the first plate that is opposite to a second side of the first plate to which the bladder is affixed, and a second thermal interface material affixed to a first side of the second plate that is opposite to a second side of the second plate to which the bladder is affixed.
  • Example 38 may include the coolant tube of the examples 33 or 34, wherein the first plate and the second plate are formed of copper or aluminum.
  • Example 39 may include a coolant assembly, comprising a housing to be installed on a printed circuit board (PCB) and to allow a first socket and a second socket to extend through the housing, the first socket to receive a first heat source and the second socket to receive a second heat source, and a coolant tube coupled to the housing and to be located between the first heat source and the second heat source, wherein the coolant tube includes a first plate that is rigid and thermally-conductive, a second plate that is rigid and thermally-conductive, and a bladder affixed at a first side to the first plate and at a second side to the second plate, the second side being opposite to the first side, the bladder to contract and move the first plate away from the first heat source and the second plate away from the second heat source in response to being emptied, and to expand and press the first plate against the first heat source and the second plate against the second heat source in response to being filled.
  • PCB printed circuit board
  • Example 40 may include the coolant assembly of example 39, wherein the housing includes a guide rod that extends from a first end of the housing to a second end of the housing, the first plate includes a first aperture formed in the first plate and the second plate includes a second aperture formed in the second plate, the first aperture being aligned with the second aperture, and the guide rod extends through the first aperture and the second aperture, and maintains an alignment of the coolant tube.
  • Example 41 may include the coolant assembly of examples 39 or 40, wherein the housing includes an inlet formed in a first end of the housing, the inlet to receive coolant from a coolant system and direct the coolant into the bladder, and an outlet formed in a second end of the housing, the second end of the housing being opposite to the first end of the housing, and the outlet to allow the coolant system to remove the coolant from the bladder.
  • Example 42 may include the coolant assembly of examples 39 or 40, further comprising a first arm coupled to the housing, the first arm to apply force to the first plate, wherein the first arm is to cause the first plate to move away from the first heat source when the bladder is emptied, and a second arm coupled to the housing, the second arm to apply force to the second plate, wherein the second arm is to cause the second plate to move away from the second heat source when the bladder is emptied.
  • Example 43 may include the coolant assembly of examples 39 or 40, further comprising a cam coupled to an exterior of the housing, a first arm coupled to the housing, the first arm to apply force to the first plate in a first direction when the cam is deactivated, wherein the first arm is to cause the first plate to move away from the first heat source when the cam is deactivated, a second arm coupled to the housing, the second arm to apply force to the second plate in a second direction when the cam is deactivated, the second direction being opposite to the first direction, wherein the second arm is to cause the second plate to move away from the second heat source when the cam is deactivated, a third arm coupled to the housing, the third arm to apply force to the first plate in the second direction when the cam is activated, wherein the third arm is to cause the first plate to be pressed against the first heat source when the cam is activated, and a fourth arm coupled to the housing, the fourth arm to apply force to the second plate in the first direction when the cam is activated, wherein the second arm is to cause the second
  • Example 44 may include the coolant assembly of examples 39 or 40, further comprising a first cam coupled to an exterior of the housing, a second cam coupled to the exterior of the housing, a first set of arms coupled to the housing, the first set of arms to apply force to the first plate and the second plate to cause the first plate to move away from the first heat source and the second plate to move away from the second heat source when the first cam is activated, and a second set of arms coupled to the housing, the second set of arms to apply force to the first plate and the second plate to cause the first plate to be pressed against the first heat source and the second plate to be pressed against the second heat source when the second cam is activated.
  • Example 45 may include the coolant assembly of examples 39 or 40, wherein the first heat source is a first in-line memory module (IMM) and the second heat source is a second IMM.
  • IMM in-line memory module
  • Example 46 may include the coolant assembly of example 45, wherein the first IMM is a first dual in-line memory module, and wherein the second IMM is a second dual in-line memory module.
  • Example 47 may include a computing node, comprising a printed circuit board (PCB) , a socket mounted to the PCB, a first heat source installed in the first socket, a second socket mounted to the PCB, a second heat source installed in the second socket, and a coolant assembly mounted to the PCB, comprising a housing coupled to the printed circuit board (PCB) , wherein the first socket with the first heat source extends through the housing and the second socket with the second heat source extends through the housing, and a coolant tube coupled to the housing and located between the first heat source and the second heat source, wherein the coolant tube includes a first plate that is rigid and thermally-conductive, a second plate that is rigid and thermally-conductive, and a bladder affixed at a first side to the first plate and at a second side to the second plate, the second side being opposite to the first side, the bladder to contract and move the first plate away from the first heat source and the second plate away from the second heat source in response being emptied, and to expand and press
  • Example 48 may include the computing node of example 47, wherein the coolant assembly further comprises a guide rod that extends from a first end of the housing to a second end of the housing, the first plate includes a first aperture formed in the first plate and the second plate includes a second aperture formed in the second plate, the first aperture being aligned with the second aperture, and the guide rod extends through the first aperture and the second aperture, and maintains an alignment of the coolant tube.
  • the coolant assembly further comprises a guide rod that extends from a first end of the housing to a second end of the housing, the first plate includes a first aperture formed in the first plate and the second plate includes a second aperture formed in the second plate, the first aperture being aligned with the second aperture, and the guide rod extends through the first aperture and the second aperture, and maintains an alignment of the coolant tube.
  • Example 49 may include the computing node of examples 47 or 48, wherein the coolant assembly further includes an inlet formed in a first end of the housing, the inlet to receive coolant from a coolant system and direct the coolant into the bladder, and an outlet formed in a second end of the housing, the second end of the housing being opposite to the first end of the housing, and the outlet to allow the coolant system to remove the coolant from the bladder.
  • Example 50 may include the computing node of examples 47 or 48, wherein the coolant assembly further includes a first arm coupled to the housing, the first arm to apply force to the first plate, wherein the first arm is to cause the first plate to move away from the first heat source when the bladder is emptied, and a second arm coupled to the housing, the second arm to apply force to the second plate, wherein the second arm is to cause the second plate to move away from the second heat source when the bladder is emptied.
  • Example 51 may include the computing node of examples 47 or 48, wherein the coolant assembly further includes a cam coupled to an exterior of the housing, a first arm coupled to the housing, the first arm to apply force to the first plate in a first direction when the cam is deactivated, wherein the first arm is to cause the first plate to move away from the first heat source when the cam is deactivated, a second arm coupled to the housing, the second arm to apply force to the second plate in a second direction when the cam is deactivated, the second direction being opposite to the first direction, wherein the second arm is to cause the second plate to move away from the second heat source when the cam is deactivated, a third arm coupled to the housing, the third arm to apply force to the first plate in the second direction when the cam is activated, wherein the third arm is to cause the first plate to be pressed against the first heat source when the cam is activated, and a fourth arm coupled to the housing, the fourth arm to apply force to the second plate in the first direction when the cam is activated, wherein the second arm
  • Example 52 may include the computing node of examples 47 or 48, wherein the coolant assembly further includes a first cam coupled to an exterior of the housing, a second cam coupled to the exterior of the housing, a first set of arms coupled to the housing, the first set of arms to apply force to the first plate and the second plate to cause the first plate to move away from the first heat source and the second plate to move away from the second heat source when the first cam is activated, and a second set of arms coupled to the housing, the second set of arms to apply force to the first plate and the second plate to cause the first plate to be pressed against the first heat source and the second plate to be pressed against the second heat source when the second cam is activated.
  • the coolant assembly further includes a first cam coupled to an exterior of the housing, a second cam coupled to the exterior of the housing, a first set of arms coupled to the housing, the first set of arms to apply force to the first plate and the second plate to cause the first plate to move away from the first heat source and the second plate to move away from the second heat source when
  • Example 53 may include the computing node of examples 47 or 48, wherein the computing node is a computer system.
  • Example 54 may include the computing node of examples 47 or 48, wherein the first heat source is a first in-line memory module (IMM) , and wherein the second heat source is a second IMM.
  • IMM in-line memory module
  • Example 55 may include the computing node of example 54, wherein the first IMM is a first dual in-line memory module, and wherein the second IMM is a second dual in-line memory module.
  • Example 56 may include a coolant tube, comprising a shell that is rigid and thermally-conductive, wherein the shell includes a first portion that is to extend past a first retaining clip of a socket located at a first end of the socket, a second portion located at an end of the first portion, wherein the second portion has a T-shaped profile, and wherein the second portion is to extend along a side of the socket between the first retaining clip and a second retaining clip located at a second end of the socket, and a third portion located at an end of the second portion being opposite to the first portion, wherein the third portion is to extend past the second retaining clip.
  • a coolant tube comprising a shell that is rigid and thermally-conductive, wherein the shell includes a first portion that is to extend past a first retaining clip of a socket located at a first end of the socket, a second portion located at an end of the first portion, wherein the second portion has a T-shaped profile, and wherein the second portion is to extend along a side of the
  • the coolant tube may further include a cavity formed at a center of the shell and that extends through an entire length of the shell, wherein the cavity forms a first aperture at a first end of the shell and a second aperture at a second end of the shell being opposite to the first end of the shell.
  • Example 57 may include the coolant tube of example 56, wherein the first portion has a rectangular profile, and the third portion has the rectangular profile.
  • Example 58 may include the coolant tube of examples 56 or 57, wherein the second portion is to extend for an entire length between the first retaining clip and the second retaining clip.
  • Example 59 may include the coolant tube of examples 56 or 57, wherein the T-shaped profile of the second portion includes a first profile portion that extends in a first direction that produces a shaft of the T-shaped profile, and a second profile portion that extends in a second direction perpendicular to the first direction, the second profile portion produces a top of the T-shaped profile, wherein the second profile portion is to be located above the socket, opposite to a printed circuit board on which the socket is mounted.
  • Example 60 may include the coolant tube of example 59, wherein the socket is a first socket and the first socket to receive a first heat source, the first socket is to be located on a first side of the shell, a second socket is to be located on a second side of the shell, the second side being opposite to the first side, and the second socket to receive a second heat source, and the second profile portion extends in the second direction for a distance approximately equal to a distance between the first heat source and the second heat source when the first heat source is installed in the first socket and the second heat source is installed in the second socket.
  • Example 61 may include the coolant tube of example 60, wherein the first heat source is a first in-line memory module (IMM) , and wherein the second heat source is a second IMM.
  • IMM in-line memory module
  • Example 62 may include the coolant tube of example 59, wherein the second profile portion extends in the second direction for a distance approximately between 4.8 millimeters (mm) and 8 mm.
  • Example 63 may include the coolant tube of example 62, wherein a width of the first profile portion, measured in the second direction, is approximately between 2 mm and 5.2 mm.
  • Example 64 may include the coolant tube of example 62, wherein the second profile portion extends in the second direction for a distance of approximately 5.2 mm.
  • Example 65 may include the coolant tube of example 64, wherein a width of the first profile portion, measured in the second direction, is approximately 2.4 mm.
  • Example 66 may include the coolant tube of examples 56 or 57, further comprising a thermal interface material disposed on a top of the T-shaped profile.
  • Example 67 may include the coolant tube of example 66, wherein the thermal interface material is compressible.
  • Example 68 may include the coolant tube of example 66, wherein the thermal interface material is disposed on the second portion of the shell.
  • Example 69 may include the coolant tube of example 66, wherein the socket is to receive a heat source, and wherein the shell is to be thermally coupled to a heat spreader of the heat source via the thermal interface material when the socket receives the heat source.
  • Example 70 may include the coolant tube of example 69, wherein the heat source is an in-line memory module.
  • Example 71 may include the coolant tube of examples 56 or 57, further comprising a first mounting tube coupled to the first end of the shell and to couple the coolant tube to a printed circuit board (PCB) on which the socket is mounted, wherein the first mounting tube includes a feed cavity formed at a center of the first mounting tube and that extends through the first mounting tube, and wherein the feed cavity is coupled to the cavity at the first aperture, and a second mounting tube coupled to the second end of the shell and to further couple the coolant tube to the PCB, wherein the second mounting tube includes a withdrawal cavity formed at a center of the second mounting tube and that extends through the second mounting tube, wherein the withdrawal cavity is coupled to the cavity at the second aperture, and wherein the first mounting tube and the second mounting tube are to maintain the shell at approximately a certain distance above the PCB.
  • PCB printed circuit board
  • Example 72 may include the coolant tube of example 71, wherein the certain distance is equal to a distance for a keep-out zone of a portion of the PCB adjacent to the shell.
  • Example 73 may include the coolant tube of examples 56 or 57, wherein the socket is a socket for an in-line memory module.
  • Example 74 may include the coolant tube of examples 56 or 57, wherein the socket is a socket for a dual in-line memory module.
  • Example 75 may include a computing node, comprising a printed circuit board (PCB) , a socket mounted to the PCB, and a coolant tube, comprising, a shell that is rigid and thermally-conductive, wherein the shell includes a first portion that extends past a first retaining clip of the socket located at a first end of the socket, a second portion located at an end of the first portion, wherein the second portion has a T-shaped profile, and wherein the second portion extends along a side of the socket between the first retaining clip and a second retaining clip located at a second end of the socket, a third portion located at an end of the second portion being opposite to the first portion, wherein the third portion extends past the second retaining clip.
  • PCB printed circuit board
  • the coolant tube may further comprise a cavity formed at a center of the shell and that extends through an entire length of the shell, wherein the cavity forms a first aperture at a first end of the shell and a second aperture at a second end of the shell being opposite to the first end of the shell.
  • Example 76 may include the computing node of example 75, wherein the first portion has a rectangular profile, and the third portion has a rectangular profile.
  • Example 77 may include the computing node of examples 75 or 76, wherein the second portion extends for an entire length between the first retaining clip and the second retaining clip.
  • Example 78 may include the computing node of examples 75 or 76, wherein the T-shaped profile of the second portion includes a first profile portion that extends in a first direction that produces a shaft of the T-shaped profile, and a second profile portion that extends in a second direction perpendicular to the first direction, the second profile portion produces a top of the T-shaped profile, wherein the second profile portion is to be located above the socket, opposite to a printed circuit board on which the socket is mounted.
  • Example 79 may include the computing node of example 78, wherein the socket is a first socket, the first socket located on a first side of the shell, the computing node further comprises a first heat source installed in the first socket, a second socket mounted to the PCB and located on a second side of the shell, the second side being opposite to the first side, and a second heat source installed in the second socket, and the second profile portion extends in the second direction for a distance approximately equal to a distance between the first heat source and the second heat source.
  • Example 80 may include the computing node of example 79, wherein the first heat source is a first in-line memory module, and wherein the second heat source is a second in-line memory module.
  • Example 81 may include the computing node of example 78, wherein the second profile portion extends in the second direction for a distance approximately between 4.8 millimeters (mm) and 8 mm.
  • Example 82 may include the computing node of example 81, wherein a width of the first profile portion, measured in the second direction, is approximately between 2 mm and 5.2 mm.
  • Example 83 may include the computing node of example 81, wherein the second profile portion extends in the second direction for a distance of approximately 5.2 mm.
  • Example 84 may include the computing node of example 83, wherein a width of the first profile portion, measured in the second direction, is approximately 2.4 mm.
  • Example 85 may include the computing node of examples 75 or 76, further comprising a thermal interface material disposed on a top of the T-shaped profile.
  • Example 86 may include the computing node of example 85, wherein the thermal interface material is compressible.
  • Example 87 may include the computing node of example 85, wherein the thermal interface material is disposed on the second portion of the shell.
  • Example 88 may include the computing node of example 85, further comprising a heat source installed in the socket, and wherein the shell is thermally coupled to a heat spreader of the heat source via the thermal interface material.
  • Example 89 may include the computing node of example 88, wherein the heat source is an in-line memory module.
  • Example 90 may include the computing node of examples 75 or 76, further comprising a first mounting tube coupled to the PCB and the first end of the shell, wherein the first mounting tube includes a feed cavity formed at a center of the first mounting tube and that extends through the first mounting tube, and wherein the feed cavity is coupled to the cavity of the coolant tube at the first aperture, and a second mounting tube coupled to the PCB and the second end of the shell, wherein the second mounting tube includes a withdrawal cavity formed at a center of the second mounting tube and that extends through the second mounting tube, wherein the withdrawal cavity is coupled to the cavity of the coolant tube at the second aperture, and wherein the first mounting tube and the second mounting tube are to maintain the shell at approximately a certain distance above the PCB.
  • Example 91 may include the computing node of example 90, wherein the certain distance is equal to a distance for a keep-out zone of a portion of the PCB adjacent to the shell.
  • Example 92 may include the computing node of examples 75 or 76, wherein the computing node is a computer system.
  • Example 93 may include the computing node of examples 75 or 76, wherein the socket is a socket for an in-line memory module.
  • Example 94 may include the computing node of examples 75 or 76, wherein the socket is a socket for a dual in-line memory module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne des appareils, des systèmes et des procédés pour des systèmes de refroidissement. Un dissipateur thermique (102) pour une source de chaleur (104) peut comprendre une première plaque (106), une partie (110) de la première plaque (106) étant destinée à s'étendre le long du premier côté de la source de chaleur (104). La première plaque (106) peut comprendre une caractéristique de courbure (112), une première partie (114) de la caractéristique de courbure (112) étant destinée à s'étendre depuis la source de chaleur (104) et une deuxième partie (116) étant destinée à s'étendre vers la source de chaleur (104). Le dissipateur thermique (102) peut comprendre une deuxième plaque (300), une partie (302) de la deuxième plaque (300) étant destinée à s'étendre le long du deuxième côté de la source de chaleur (104), et la deuxième plaque (300) comprenant une caractéristique de courbure (316), une première partie (322) de la caractéristique de courbure (316) étant destinée à s'étendre depuis la source de chaleur (104) et une deuxième partie (324) étant destinée à s'étendre vers la source de chaleur (104).
PCT/CN2017/092359 2017-07-10 2017-07-10 Systèmes de refroidissement pour nœud informatique WO2019010605A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/CN2017/092359 WO2019010605A1 (fr) 2017-07-10 2017-07-10 Systèmes de refroidissement pour nœud informatique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/092359 WO2019010605A1 (fr) 2017-07-10 2017-07-10 Systèmes de refroidissement pour nœud informatique

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1453861A (zh) * 2002-04-23 2003-11-05 惠普公司 带有侧表面安装风扇的高性能冷却装置
WO2008063121A1 (fr) * 2006-11-20 2008-05-29 Alfa Laval Corporate Ab Échangeur de chaleur à plaque
US20130299146A1 (en) * 2011-04-07 2013-11-14 Alfa Laval Corporate Ab Plate heat exchanger
EP2784812A2 (fr) * 2013-03-26 2014-10-01 GE Energy Power Conversion Technology Ltd Dissipateur thermique à caloduc pour densité de puissance élevée
CN104661494A (zh) * 2013-11-20 2015-05-27 Abb公司 冷却元件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1453861A (zh) * 2002-04-23 2003-11-05 惠普公司 带有侧表面安装风扇的高性能冷却装置
WO2008063121A1 (fr) * 2006-11-20 2008-05-29 Alfa Laval Corporate Ab Échangeur de chaleur à plaque
US20130299146A1 (en) * 2011-04-07 2013-11-14 Alfa Laval Corporate Ab Plate heat exchanger
EP2784812A2 (fr) * 2013-03-26 2014-10-01 GE Energy Power Conversion Technology Ltd Dissipateur thermique à caloduc pour densité de puissance élevée
CN104661494A (zh) * 2013-11-20 2015-05-27 Abb公司 冷却元件

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