WO2019000743A1 - Élément de refroidissement, substrat, constituant de groupe de résine, et imprimante 3d à durcissement à la lumière - Google Patents

Élément de refroidissement, substrat, constituant de groupe de résine, et imprimante 3d à durcissement à la lumière Download PDF

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Publication number
WO2019000743A1
WO2019000743A1 PCT/CN2017/108558 CN2017108558W WO2019000743A1 WO 2019000743 A1 WO2019000743 A1 WO 2019000743A1 CN 2017108558 W CN2017108558 W CN 2017108558W WO 2019000743 A1 WO2019000743 A1 WO 2019000743A1
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WIPO (PCT)
Prior art keywords
cooling
temperature resistant
high temperature
transparent medium
resistant transparent
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PCT/CN2017/108558
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English (en)
Chinese (zh)
Inventor
许蓓蓓
李厚民
朱凯强
王翊坤
刘振亮
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北京金达雷科技有限公司
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Publication of WO2019000743A1 publication Critical patent/WO2019000743A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor

Definitions

  • the present disclosure relates to the field of 3D printing, and in particular to a cooling substrate, a cooling assembly, a display assembly, a resin pool assembly, a 3D printer.
  • rapid prototyping technology can be divided into various categories according to the materials used, molding methods, etc., among which photocuring rapid prototyping is more common.
  • the principle of photocuring is: using a photosensitive resin (UV) in a fluid state to form a polymerization reaction under illumination, and irradiating the light source according to the cross-sectional shape of the object to be molded to solidify the resin in a fluid state.
  • the photo-curing 3D printer transmits the cross-sectional pattern of the 3D printing object layer by layer to the LCD screen through a data transmission device, and then illuminates the LCD screen with light of a corresponding wavelength, so that the liquid resin above the LCD screen follows the pattern.
  • the curing is layer by layer, eventually forming the specified 3D printed object.
  • the temperature of the resin in the resin pool is raised and distributed in a stepwise manner, and the closer to the bottom of the resin pool, the higher the temperature. In general, the maximum temperature at the bottom of the resin pool will exceed 120°.
  • the polymer pool bottom is usually made of polymer oxygen permeable membrane. The polymer oxygen permeable membrane will wrinkle and deform under the high temperature environment exceeding 120°, which makes the resin pool not be used normally, which will eventually lead to failure of photocuring and damage of the resin pool. This increases the cost of use.
  • a cooling function device for enhancing heat dissipation may be disposed under the LCD panel.
  • a flow path through which a coolant flows can be formed by laying a coolant pipe or providing a groove on a cooling substrate, so that heat on the cooling object can be carried away.
  • the cooling component is exposed to the illumination emitted by the LED light source and the heat released during the operation of the 3D printer, resulting in a cooling group.
  • the piece itself will also be deformed by temperature changes based on the principle of thermal expansion and contraction.
  • the cooling assembly will undergo significant deformation under the influence of high temperature, not only can the heat-dissipating object be well adhered to the heat-dissipating effect, but also the large deformation of the surface will change the light that the light source transmits to the LCD through the cooling component. Affects light-cured print quality and print accuracy.
  • the present disclosure provides a cooling assembly for a photocuring 3D printer, comprising: a cooling substrate, a first high temperature resistant transparent medium, and a second high temperature resistant transparent medium; wherein the cooling substrate The upper surface is provided with a first high temperature resistant transparent medium, and the lower surface of the cooling substrate is provided with a second high temperature resistant transparent medium; the cooling substrate has a continuous hollow structure, so that the cooling substrate and the first A flow path for the coolant to flow is formed between a high temperature resistant light transmitting medium and the second high temperature resistant light transmitting medium.
  • both side walls of the hollow structure respectively extend obliquely from the upper surface of the cooling substrate toward the lower surface.
  • a cross section of the hollow structure is formed as a trapezoidal hollow, and an opening diameter of the trapezoidal hollow on the upper surface of the cooling substrate is larger than a diameter of opening on the lower surface of the cooling substrate.
  • the side wall of the hollow structure has an inclination angle ⁇ of 10° to 30°.
  • the first high temperature resistant transparent medium and the second high temperature resistant transparent medium are made of glass.
  • the first high temperature resistant transparent medium has a thickness of 0.3 mm to 2 mm
  • the second high temperature resistant transparent medium has a thickness of 3 mm to 8 mm.
  • the first high temperature resistant transparent medium has the same thermal expansion coefficient as the second high temperature resistant transparent medium.
  • the first high temperature resistant transparent medium and the second high temperature resistant transparent medium are respectively bonded to the cooling substrate.
  • a cooling liquid inlet flow path cover and a cooling liquid outlet flow path cover communicating with the flow path are disposed on the cooling substrate, and the cooling liquid inlet flow path cover is in communication with an inlet conduit, the cooling The liquid outlet runner cover is in communication with the outlet conduit.
  • a cooling substrate for a photocuring 3D printer cooling assembly having a continuous hollow structure.
  • both side walls of the hollow structure respectively extend obliquely from an upper surface of the cooling substrate toward a lower surface of the cooling substrate.
  • a cross section of the hollow structure is formed as a trapezoidal hollow, and an opening diameter of the trapezoidal hollow on the upper surface of the cooling substrate is larger than a diameter of opening on the lower surface of the cooling substrate.
  • the side wall of the hollow structure has an inclination angle ⁇ of 10° to 30°.
  • a display assembly including an LCD panel and the above-disclosed cooling substrate, the LCD panel being disposed on an upper surface of the cooling substrate such that the cooling substrate is on the LCD panel and A flow path for the coolant to flow is formed between the second high temperature resistant transparent medium.
  • a display assembly comprising an LCD panel and the above-disclosed cooling assembly, the LCD screen being disposed on an upper surface of the first high temperature resistant transparent medium or the second high temperature resistant The lower surface of the light transmissive medium.
  • a resin pool assembly for a photocuring 3D printer comprising: a cell body for accommodating a resin material and having a light transmissive bottom, and a detachable mounting of the cell body a mount; wherein the display assembly disclosed above is disposed between the pool body and the mount.
  • a photocurable 3D printer comprising the above-disclosed resin pool assembly, and a cooling system for providing a cooling liquid, the cooling system being coupled to the cooling substrate.
  • the beneficial effects of the present technology are: on the one hand, the continuous hollowing is formed on the cooling substrate, and the thickness of the cooling substrate is uniform compared to the groove structure in the prior art, so as to avoid a large thickness due to uneven thickness of the cooling substrate after being heated. Obvious bending deformation; on the other hand, the cooling assembly is further provided with a high-temperature resistant transparent medium on the upper and lower surfaces of the cooling substrate, and the continuous hollowing together forms a flow path for the cooling liquid to flow, which can well dissipate heat for the printer. The effect is to ensure the normal and efficient operation of the 3D printer.
  • FIG. 1 is a schematic longitudinal sectional structural view of a cooling substrate provided by the present disclosure
  • FIG 2 is a light path diagram of an embodiment in which the hollow side wall of the cooling substrate is perpendicular to the surface of the substrate (the circled portion represents a shadow, and no light passes through);
  • FIG. 3 is an optical path diagram of an embodiment in which a hollow sidewall of a cooling substrate is inclined to a surface of a substrate;
  • FIG. 4 is a schematic structural diagram of a display assembly according to an embodiment of the present disclosure.
  • Figure 5 is an enlarged view of the portion of Figure 4A;
  • FIG. 6 is a schematic cross-sectional view of a cooling substrate provided by the present disclosure.
  • Figure 7 is a longitudinal cross-sectional view of a display assembly provided with an inlet conduit and an outlet conduit provided by the present disclosure
  • Figure 8 is a longitudinal sectional view of the resin pool assembly provided in the present disclosure (including the structure below the pool body);
  • Figure 9 is a bottom plan view of a cooling assembly in which a coolant conduit is installed in an embodiment provided by the present disclosure
  • FIG. 10 is an exploded perspective view of a display assembly provided by the present disclosure.
  • Figure 11 is a schematic exploded view of the resin pool assembly (without resin cell body) provided by the present disclosure.
  • FIG. 12 is a schematic view showing the installation state of the resin pool assembly provided by the present disclosure.
  • orientation words such as “up, down, left, and right” are generally used to refer to the upper, lower, left, and right in the drawings, and the cross section is along.
  • a section formed by cutting from left to right, the longitudinal section is a section cut along the upper and lower sides, and "inside and outside” means the inside and outside with respect to the outer contour of the corresponding component.
  • FIGS. 4 and 5 are schematic views of a display assembly of an embodiment of the present invention, and the structure of the embodiment of the cooling assembly of the present disclosure is specifically described with reference to the drawings.
  • the present disclosure provides a cooling assembly for a photocuring 3D printer, including the disclosed cooling substrate 3, a first high temperature resistant transparent medium 4, and a second high temperature resistant transparent medium 9; wherein the upper surface 31 of the cooling substrate is provided with The first high temperature resistant transparent medium 4 is disposed, and the lower surface 32 of the cooling substrate 3 is provided with a second high temperature resistant transparent medium 9.
  • the cooling substrate 3 itself has continuous hollowing, so that a flow path 3a through which the cooling liquid flows is formed between the cooling substrate 3 and the first high temperature resistant light transmitting medium 4 and the second high temperature resistant light transmitting medium 9.
  • the cooling component has better heat dissipation capability, and can also reduce large deformation caused by high temperature, and ensure normal and efficient operation of the printer.
  • the first high temperature resistant transparent medium 4 and the second high temperature resistant transparent medium 9 may be made of glass, and the glass material can cool the substrate 3 while having good light transmittance.
  • the hollow structure is sealed to form a closed flow path for normal flow of the coolant.
  • the high-temperature resistant light-transmissive medium can also be a light-transmitting plate formed by a COC (Cyclic olefin copolymer) plate, that is, a cyclic olefin copolymer, which has good chemical stability, high rigidity and high strength. High temperature resistance and high transparency.
  • the thickness of the first high temperature resistant transparent medium 4 may be smaller than the thickness of the second high temperature resistant transparent medium 9.
  • the first high temperature resistant transparent medium 4 is mainly used for sealing the hollow portion of the cooling substrate on the upper surface 31, and the first high temperature resistant transparent medium 4 will directly contact the object to be cooled, a glass having a small thickness can be used.
  • the film is used to ensure the sealing while enhancing the cooling effect.
  • the second high-temperature resistant transparent medium 9 also seals the hollow of the cooling substrate on the lower surface to form the flow path 3a.
  • the thickness is one.
  • the glass plate also has the effect of avoiding large deformation of the cooling substrate 3.
  • the cooling substrate in the present disclosure may be deformed by thermal expansion and contraction based on its structural characteristics.
  • the second high temperature resistant transparent medium 9 is made of a thicker glass plate, it is based on its own high flexural modulus. Therefore, after the above-mentioned high-temperature resistant transparent medium 9 is added, the high-strength connection between the high-temperature transparent medium 9 and the cooling substrate 3 makes it possible to cool the substrate 3 by its own rigidity, and the cooling substrate 3 can be further reduced due to temperature changes. Deformation.
  • the first high temperature resistant transparent medium 4 may have a thickness of 0.3 mm to 2 mm, which functions as a seal while having a lighter weight and reducing the weight of the cooling assembly.
  • the thickness of the second high-temperature resistant transparent medium 9 may be from 3 mm to 8 mm, which in addition to sealing the hollow structure of the cooling substrate 3, additionally provides sufficient rigid support for the cooling substrate 3.
  • the second high temperature resistant transparent medium may also be a glass film.
  • the first high temperature resistant transparent medium may be a glass plate; or the first high temperature resistant transparent medium and the second The high temperature resistant transparent medium is a glass film; or the first high temperature resistant transparent medium and the second high temperature resistant transparent medium are glass plates, and when the glass plate is used, the first high temperature resistant transparent medium and the second high temperature resistant Whether the light-transmissive medium uses a glass plate of the same thickness, or which glass plate is thicker, the present disclosure is not limited. As long as it is capable of transmitting light and does not affect the quality of print molding.
  • the first high temperature resistant transparent medium 4 and the second high temperature resistant transparent medium 9 have the same coefficient of thermal expansion, or a similar coefficient of thermal expansion. That is, the deformation rates of the thermal expansion and contraction of the above two high-temperature resistant transparent media are the same, so that the deformation rates of the two are not affected by the high temperature, and the deformation of the cooling component itself is relatively obvious.
  • the first high temperature resistant transparent medium 4 and the second high temperature resistant transparent medium 9 are respectively bonded to the cooling substrate 3, so that the cooling assembly is easily replaced as a whole.
  • other separate components such as screwing may be used in view of the separate replacement of the substrate and the high temperature resistant light transmissive media, with the aid of tools such as screws or rivets.
  • the first high-temperature resistant transparent medium 4 and the second high-temperature resistant transparent medium 9 may be connected to the cooling substrate by an external clamping force. Therefore, the present disclosure is not limited to the specific connection method employed.
  • FIG. 1 is a schematic structural view of a cooling substrate 3 in the cooling assembly of the disclosed photocuring 3D printer.
  • the cooling substrate 3 has a continuous hollow structure, and the hollow structure has the same thickness of the portion of the cooling substrate 3 other than the hollow.
  • the cooling substrate used in the disclosed cooling assembly is expanded to the same extent or similar to each other after being heated, so that the cooling substrate 3 can be prevented from being deformed, and the flatness of the surface can be ensured, so that the surface can be better fitted.
  • Cooling objects such as, for example, LCD screens
  • the side wall 10 of the hollow structure is entirely inclined to the upper surface of the cooling substrate (also inclined to the lower surface).
  • the sidewalls 10 of the hollowed out structure may be perpendicular or approximately perpendicular to the upper and lower surfaces of the cooling substrate 3.
  • FIG. 2 is an optical path diagram of an embodiment in which the hollow side wall of the cooling substrate is perpendicular to the surface of the substrate
  • FIG. 3 is an optical path diagram of an embodiment in which the hollow side wall of the cooling substrate is inclined to the surface of the substrate.
  • the vertically disposed side walls 10 completely block the incident light, which causes the light intensity on the side wall 10 region to be significantly lower than that in other regions, and the significant difference in light intensity will be directly reflected on the printed article.
  • the surface of the printed product will have a relatively obvious strip-like texture, which is caused by the shadow generated by blocking the light. Therefore, in order to prevent the vertical side wall 10 from blocking the incident light, affecting the printing accuracy and quality, as shown in FIG. 3, in another embodiment, the side walls of the hollow structure are respectively inclined from the upper surface of the cooling substrate 3 toward the lower surface. . That is, the side walls 10 of the hollow structure are not perpendicular to the surface of the cooling substrate 3, but have a certain angle.
  • the side wall 10 is formed as an inclined wall compared to the surface of the cooling substrate 3.
  • the inclined wall can function to split the incident light, and the incident blocked by the side wall is greatly reduced. The light, therefore, does not cause a large loss of light, and can ensure the smoothness of the surface of the printed product.
  • the coolant flowing through the flow path formed by the hollow structure has substantially the same refractive index as the cooling substrate, and the "substantially equal" means that the refractive index of the cooling liquid is equal to the refractive index of the cooling substrate 3, but is constant
  • the refractive index of the coolant in the acceptable range may also be slightly larger or slightly smaller than the refractive index of the cooling substrate 3. Therefore, in the case where the refractive indices are not completely uniform, the spectroscopic effect of the oblique wall is particularly important, and the transmission is well ensured.
  • the light that cools the substrate is relatively uniform distributed.
  • the inclination directions of the side walls 10 may be uniform or inconsistent.
  • the cross section of the hollow structure may be formed into a parallelogram, and a trapezoid or other irregular shape mentioned in the following embodiments, as long as It can be used as a splitting effect.
  • the cross section of the hollow structure is formed into a trapezoidal hollow, and the opening diameter of the trapezoidal hollow on the upper surface 31 of the cooling substrate 3 is larger than The opening diameter of the lower surface 32 of the substrate 3 is cooled. That is, since the upper surface of the cooling substrate is closer to the object to be cooled than the lower surface of the cooling substrate. Therefore, increasing the diameter of the upper opening is more conducive to enhancing the cooling effect to ensure that the coolant can quickly remove the heat generated by the curing reaction.
  • the trapezoidal hollow may be an isosceles trapezoid in the embodiment, or may be an isosceles trapezoid.
  • the cross section of the hollow structure may be formed into other irregular shapes, for example, the sidewall may be oriented from the upper surface.
  • the lower surface is curved and extended to have the above-described better heat dissipation effect as long as the upper surface opening is larger than the lower opening.
  • the inclination of the side wall of the hollow structure may also be formed at an upper surface opening of the cooling substrate that is less than or equal to the lower surface opening.
  • the inclination angle ⁇ of the side wall of the hollow structure is 10° to 30°.
  • the inclination angle ⁇ is an angle between the hollow side wall and a perpendicular perpendicular to the surface of the cooling substrate 3 as shown in FIG.
  • a cooling liquid inlet flow path cover 3b and a cooling liquid outlet flow path cover 3c communicating with the flow path 3a are provided on the cooling substrate 3, and the coolant inlet flow path cover 3b and the inlet pipe 7 are provided.
  • the coolant outlet runner cover 3c is in communication with the outlet conduit 8.
  • one end of the inlet duct 7 and the outlet duct 8 may be connected to the cooling substrate 3 through the pipe joint and the coolant inlet flow path cover 3b and the coolant outlet flow path cover 3c, respectively.
  • the other ends of the inlet duct 7 and the outlet duct 8 may be connected to the above-described cooling system through a pipe joint, thereby realizing that the cooling system supplies cooling liquid to the flow path 3a, and collects the refluxed cooling liquid for recycling.
  • the second high-temperature resistant transparent medium 9 is formed to respectively avoid the inlet duct. 7 and the escape port 91 of the outlet conduit 8.
  • the escape port 91 is formed by cutting off the two corners of the second high-temperature resistant transparent medium 9, and the installation position is reserved for the coolant inlet flow path cover 3b and the coolant outlet flow path cover 3c, thereby allowing cooling Liquid through the coolant inlet stream
  • the duct cover 3b and the coolant outlet runner cover 3c smoothly flow in and out from the inlet duct 7 and the outlet duct 8, so that the coolant is normally circulated in the flow path 3a of the cooling substrate 3.
  • the shape of the flow path 3a is a serpent shape extending from one end of the cooling substrate 3 to the other end of the cooling substrate 3. It can be understood that this design can make the flow path 3a fill the cooling substrate 3 as much as possible, thereby increasing the heat dissipation area and improving the cooling efficiency.
  • other flow passages 3a may be used depending on the actual application, and the disclosure is not listed one by one.
  • the present disclosure can be applied to various cooling forms, for example, it can be applied to liquid cooling or gas cooling.
  • the present disclosure employs liquid cooling to improve cooling efficiency.
  • the cooling substrate in the cooling assembly of the present disclosure may be coupled to a cooling system of a photocuring 3D printer, which may include components such as a pump, a heat sink, a fan, etc., for pumping coolant into the cooling assembly. .
  • a photocuring 3D printer which may include components such as a pump, a heat sink, a fan, etc.
  • the present disclosure also provides a display assembly including an LCD panel 2 and a cooling substrate according to the above disclosure, wherein the lower surface 32 of the cooling substrate 3 is further provided with a second high temperature resistant transparent medium 9 for continuous hollowing of the cooling substrate 3.
  • the structure is formed as a closed flow path 3a through which the cooling liquid flows.
  • the LCD screen 2 may be disposed on the upper surface 31 of the cooling substrate 3, for example, the LCD screen 2 may be adhered to the periphery of the cooling substrate.
  • the intermediate position of the LCD panel 2 and the cooling substrate 3 can form a flow path 3a through which the cooling liquid flows.
  • the flow path 3a can also be applied to the flow of the cooling gas.
  • a display assembly in another embodiment, includes an LCD panel and the cooling assembly disclosed above.
  • the upper surface of the cooling substrate 3 is also provided with a first high temperature resistant light transmissive medium 4, i.e., the cooling assembly disclosed above.
  • the first high-temperature resistant transparent medium 4 is located between the LCD panel 2 and the cooling substrate 3 and forms a flow path 3a for the cooling liquid to flow therethrough.
  • the first high-temperature resistant transparent medium 4 does not need to be fixedly connected to the LCD panel 2, but needs to be sealedly mounted with the cooling substrate 3, so that a flow path for the coolant to flow between the first high-temperature resistant transparent medium 4 and the cooling substrate 3 is formed. 3a to achieve cooling.
  • the LCD panel 2 may be disposed above the first high temperature resistant transparent medium 4 or below the second high temperature resistant transparent medium 9 due to the provision of the first high temperature resistant transparent medium 4.
  • the cooling component is located. Between the LCD screen and the 3D printer light source, that is, the LCD screen 2 is disposed above the first high temperature resistant transparent medium 4.
  • the cooling substrate 3 is responsible for dissipating heat for the 3D printer, in particular, dissipating heat to the LCD screen, and the photo-curing 3D printer transmits the cross-sectional pattern of the 3D printing object layer by layer to the LCD screen through the data transmission device, and illuminates the LCD through the light.
  • the screen causes the liquid resin to cure in a layer by layer pattern to form a specified 3D printed object.
  • the present disclosure also provides a resin pool assembly for a photocuring 3D printer, including a cell body 1 for accommodating a resin material and having a light transmissive bottom, and for detachable mounting.
  • the mount 5 may include a return mounting portion 51 and a support sidewall 52 fixed under the retrofit mounting portion 51.
  • the return mounting portion 51 is matched to the size of the frame 11 of the pool body 1, and the support side wall 52 supports the entire resin pool assembly.
  • the pool body 1 and the return mounting portion 51 of the mount 5 are detachably connected by the lock 6.
  • the display assembly disclosed above may be disposed between the cell body 1 and the mounting seat 5 (may be the first display component disclosed above, or may be the second display component disclosed above), such that the light source emits a corresponding wavelength.
  • the light illuminates the LCD panel 2, and the LCD panel 2 illuminates the light to cure the resin pool material in the cell body 1.
  • the display assembly disclosed above is provided with a cooling assembly for heat dissipation below the LCD panel 2. Due to the arrangement of the cooling components, the heat dissipation capability of the resin components is increased, and in the 3D printing process, the time for curing each layer of the resin is significantly improved, and the working efficiency of the 3D printing is improved.
  • the cooling assembly is located below the LCD panel 2 and is fixed to the mount 5.
  • the return mounting portion 51 is formed with a step portion inside, and the periphery of the cooling assembly can be fixed to the step portion of the mount 5 by bolts or the like, the LCD panel 2 disposed above the cooling assembly, the LCD screen 2 can be connected to the cooling assembly by bonding, or a fastener or other connecting member can be used for the connection.
  • the first high temperature resistant transparent medium 4 is located below the LCD screen 2, then no It is necessary to be fixedly connected to the LCD panel 2, wherein the cooling assembly is also fixed on the return mounting portion 51 of the mounting seat 5, and the first high temperature resistant transparent medium 4 is located below the LCD panel 2 and fixedly mounted to the cooling substrate 3.
  • the LCD panel 2 does not need to be fixed by using an adhesive, and the corrosion of the LCD panel 2 by the adhesive in long-term use can be avoided, and the service life of the LCD panel 2 is prolonged.
  • the present disclosure also provides a photocurable 3D printer comprising the above disclosed resin cell assembly, and a cooling system for providing a cooling liquid, the cooling system being coupled to the cooling substrate.
  • the cooling system provides cooling liquid for the cooling substrate to realize the cooling of the resin pool assembly, and the cooling assembly itself has high deformation resistance, which can well ensure the normal and efficient operation of the 3D printer.

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Abstract

La présente invention concerne un substrat de refroidissement, un élément de refroidissement, un composant d'affichage, un constituant de groupe de résine, et une imprimante 3D. L'élément de refroidissement comprend : un substrat de refroidissement (3), un premier milieu transparent résistant aux hautes températures (4), et un second milieu transparent résistant aux hautes températures (9) ; le premier milieu transparent résistant aux hautes températures (4) étant disposé sur une surface supérieure (31) du substrat de refroidissement (3), et le second milieu transparent résistant aux hautes températures (9) étant disposé sur une surface inférieure (32) du substrat de refroidissement (3). Le substrat de refroidissement (3) présente une structure creuse continue, de sorte qu'un canal (3a) utilisé pour que le liquide de refroidissement s'écoule à travers lui est formé entre le substrat de refroidissement (3) et le premier milieu transparent résistant aux hautes températures (4) et le second milieu transparent résistant aux hautes températures (9). L'élément de refroidissement présente une bonne capacité de dissipation thermique, ne se déforme pas facilement après avoir été chauffé, et peut garantir des fonctionnements normaux et une précision d'impression normale de l'imprimante.
PCT/CN2017/108558 2017-06-30 2017-10-31 Élément de refroidissement, substrat, constituant de groupe de résine, et imprimante 3d à durcissement à la lumière WO2019000743A1 (fr)

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CN201710527296.6A CN107175813A (zh) 2017-06-30 2017-06-30 冷却基板、冷却组件、显示组件、树脂池组件、3d打印机
CN201710527296.6 2017-06-30

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Cited By (2)

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CN111112617A (zh) * 2020-01-02 2020-05-08 江苏科技大学 减小激光增材制造过程热输入的底板
CN111168065A (zh) * 2020-01-02 2020-05-19 江苏科技大学 用于激光增材制造的底板

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Publication number Priority date Publication date Assignee Title
CN107175813A (zh) * 2017-06-30 2017-09-19 北京金达雷科技有限公司 冷却基板、冷却组件、显示组件、树脂池组件、3d打印机
CN107510501B (zh) * 2017-10-20 2023-11-24 济南大学 接骨板

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