WO2019000600A1 - 掩膜板 - Google Patents

掩膜板 Download PDF

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Publication number
WO2019000600A1
WO2019000600A1 PCT/CN2017/097225 CN2017097225W WO2019000600A1 WO 2019000600 A1 WO2019000600 A1 WO 2019000600A1 CN 2017097225 W CN2017097225 W CN 2017097225W WO 2019000600 A1 WO2019000600 A1 WO 2019000600A1
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WO
WIPO (PCT)
Prior art keywords
mask
sub
hole
outer frame
disposed
Prior art date
Application number
PCT/CN2017/097225
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English (en)
French (fr)
Inventor
裴龙
宋春来
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US15/577,314 priority Critical patent/US10317792B2/en
Publication of WO2019000600A1 publication Critical patent/WO2019000600A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of liquid crystal display, and more particularly to a mask.
  • OLED Organic Light Emitting Display
  • the size of OLED displays and the size of glass substrates are constantly increasing, which requires the size of the mask to be continuously increased.
  • the mask used for evaporation is used.
  • Most of the diaphragms are in the form of strip-shaped sub-masks. In general, when the strip-shaped sub-mask is soldered on the bottom frame, the welding position is likely to be uneven, which results in poor color mixing of the prepared OLED, which leads to poor product preparation.
  • the present invention provides a mask comprising an outer frame and a plurality of sub-masks, the outer frame being a hollow structure including a first side, a second side, a third side, and a fourth side, The first side is parallel and spaced apart from the second side, the third side and the fourth side are parallel and spaced apart, and the third side and the fourth side extend along the first direction.
  • the first side and the second side extend in the second direction, and opposite ends of the third side are respectively connected to one end of the first side and one end of the second side, and the fourth side is opposite The two ends are respectively connected to one end of the first side away from the fourth side and one end of the second side away from the fourth side, and the sub-mask is used for selectively blocking illumination when preparing pixels Material
  • the sub-mask extends in a first direction and a plurality of the sub-masks are arranged in a second direction Columns, opposite ends of the sub-mask are respectively disposed on the first side and the second side, and the sub-mask can reciprocate in the first direction or the second direction.
  • the sub-mask in the mask provided by the present invention can reciprocate in the first direction or the second direction, thereby adjusting the sub-mask in the first direction compared to the bottom frame. Or a position in the second direction, thereby improving the poor color mixing caused by the positional deviation of the sub-mask in the first direction and the second direction of the outer frame when the pixel is prepared by evaporating the luminescent material technical problem.
  • FIG. 1 is a schematic structural view of a mask according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a sub-mask according to a preferred embodiment of the present invention.
  • FIG 3 is a cross-sectional structural view of two adjacent bottom frames in accordance with a preferred embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a mask according to a preferred embodiment of the present invention.
  • the mask 1 includes an outer frame 10 and a plurality of sub-masks 20.
  • the outer frame 1 is a hollow structure, and the outer frame 1 includes a first side 101, a second side 102, a third side 103, and a fourth side 104.
  • the first side 101 is parallel to and spaced apart from the second side 102.
  • the third side 103 and the fourth side 104 are parallel and spaced apart.
  • the third side 103 and the fourth side 104 extend along the first direction D1, and the first side 101 and the second side 102 extend along the second direction D2.
  • the opposite ends of the third side 103 are respectively connected to one end of the first side 101 and one end of the second side 102.
  • the opposite ends of the fourth side 104 are respectively connected to the first side 101 away from the One end of the fourth side 104 and the second side 102 are away from each other One end of the fourth side 104 is described.
  • the sub-mask 20 is used to selectively block the luminescent material when the pixels are prepared.
  • the sub-mask 20 extends in the first direction D1 and a plurality of the sub-masks 20 are arranged in the second direction D2.
  • the opposite ends of the sub-mask 20 are respectively disposed on the first side 101 and the second side 102.
  • the sub-mask 20 may reciprocate in the first direction D1 or the second direction D2.
  • FIG. 2 is a schematic structural view of a sub-mask according to a preferred embodiment of the present invention.
  • the sub-mask 20 includes a bottom frame 201 and a sub-mask 202.
  • the bottom frame 201 has a hollow structure.
  • the bottom frame 201 is a long hollow frame structure.
  • the sub-mask 202 is provided with a plurality of spaced apart openings 202a for passing the luminescent material when the pixels are prepared. Between the adjacent openings 202a is a solid structural portion for shielding the luminescent material when the pixels are prepared.
  • the sub-mask 202 is disposed on the bottom frame 201, and the bottom frame 201 is unobstructed to the opening 202a in the sub-mask 202.
  • the bottom frame 201 is provided with a first scale line 201a and a second scale line 201b.
  • the first scale line 201a is disposed corresponding to the first side 101
  • the second scale line 201b is disposed corresponding to the second side 102.
  • the first side 101 is provided with a first reference scale line 101a
  • the second side 102 is provided with a second reference scale line 102a.
  • the mask 1 further includes a first top wire 30 and a second top wire 40.
  • the first side 101 defines a first through hole 101b corresponding to the sub-mask 20, and one end of the first through hole 101b is disposed adjacent to one end of the sub-mask 20.
  • the first top wire 30 is disposed in the first through hole 101b, and the first top wire 30 is movable in the first through hole 101b in the first direction D1.
  • the second side 102 is provided with a second through hole 102b corresponding to the sub-mask 20, and one end of the second through hole 102b is disposed adjacent to the other end of the sub-mask 20.
  • the second top wire 40 is disposed in the second through hole 102b, and the second top wire 40 is movable in the first through hole D1 in the first direction D1 or in the first direction The direction of movement.
  • the first top wire 30 and the second top wire 40 cooperate to move the sub-mask 20 in the first direction D1 or in the opposite direction of the first direction D1 to achieve The adjustment of the position of the sub-mask 20 in the first direction D1.
  • the first top wire 30 is along the first direction in the first through hole 101b.
  • D1 moves the distance d1
  • the sub-mask 20 is along the first
  • a direction D1 moves the distance d1, thereby adjusting the position of the sub-mask 20 in the first direction D1 compared to the outer frame 10.
  • the second top wire 40 is along the second through hole 102b.
  • Moving the distance d2 in a direction opposite to a direction D1 moving the first top wire 30 in the first through hole 101b in a direction opposite to the first direction D1 by the distance d2, thereby causing the child
  • the mask 20 is moved by the distance d2 in a direction similar to the first direction D1, thereby adjusting the position of the sub-mask 20 in the first direction D1 compared to the outer frame 10. It can be understood that when a plurality of sub-masks 20 need to be adjusted in the opposite direction of the first direction D1, each of the sub-masks 20 can be individually adjusted as described above.
  • the number of the first through holes 101b corresponding to each of the sub-masks 20 on the first side 101 is two, and correspondingly, each of the first through holes 101b corresponds to one first top wire 30.
  • the two first through holes 101b are respectively disposed on two sides of one end of the sub-mask 20 .
  • the number of the second through holes 102b on the second side 102 corresponding to each of the sub-masks 20 is two, and correspondingly, each of the second through holes 102b corresponds to one second top wire 40, two The second through holes 102b are respectively disposed on two sides of one end of the sub-mask 20 .
  • the number of the first through holes 101b corresponding to each of the sub-masks 20 on the first side 101 is two, and each of the first through holes 101b is engaged with a first top wire 30, and
  • the number of the second through holes 102b corresponding to each of the sub-masks 20 on the second side 102 is two, and each of the second through holes 102b is engaged with a second top wire 40, so that the sub-mask is adjusted.
  • the mask 1 of the present invention is mated with the first through hole 101b by the first top wire 30 described above and the second top wire 40 is engaged with the second through hole 102b, thereby adjusting the Sub mask
  • the sub-mask 20 may be coarsely adjusted and fine-tuned in the second direction D2 or in the opposite direction of the second direction D2 to adjust the sub-mask in comparison with the outer frame.
  • the position in the second direction wherein, when the sub-mask 20 is coarsely adjusted in the second direction D2, the moving width of the sub-mask 20 is greater than when the sub-mask 20 is fine-tuned in the second direction D2.
  • the amplitude of the movement of the sub-mask 20; when the sub-mask 20 is coarsely adjusted in the opposite direction of the second direction D2, the sub-mask 20 moves more than the sub-mask 20 The magnitude of the movement when fine adjustment is made in the opposite direction of the second direction D2.
  • the first mask 101 is provided with a first groove 101c corresponding to the sub-mask 101, and the first groove 101c is disposed along the second direction D2.
  • a second groove 102c is defined in the second side 102 corresponding to the sub-mask 20, and the second groove 102c is disposed along the second direction D2.
  • the mask 1 further includes a first positioning pin 50 and a second positioning pin 60 corresponding to the sub-mask 20. The first positioning pin 50 moves within the first groove 101c and the second positioning pin 60 moves within the second groove 102c such that the sub-mask 20 is in the second direction D2 or the second direction D2 moves in the opposite direction to achieve coarse adjustment of the sub-mask 20 in the second direction D2 compared to the outer frame 10.
  • a first reference tick line is disposed on the first positioning pin 50, and a second reference tick line is disposed on the second positioning pin 60.
  • a first scale line is disposed on the bottom frame 201 corresponding to the first side 101, and a second scale line is disposed on the bottom frame 201 corresponding to the second side 102. And adjusting a relative positional relationship between the first reference tick mark and the second tick mark, and adjusting a relative positional relationship between the second reference tick mark and the second tick mark to achieve the The sub-mask 20 is fine-tuned in the second direction D2 compared to the outer frame 10.
  • the first edge 101 is provided with a first positioning hole 101d corresponding to the sub-mask 20, and the second side 102 is provided with a second positioning hole 102d corresponding to the sub-mask 20.
  • the sub-mask 202 is disposed adjacent to the first side 101 to form a first alignment hole 202b, and the sub-mask 202 is disposed adjacent to the second side 102 to form a second alignment hole 202c.
  • Figure 1 shows the first positioning hole 101d and the first alignment hole In the case where 202b coincides, the second positioning hole 102d overlaps with the second alignment hole 202c.
  • the first positioning hole 101d and the first alignment hole 202b serve as a reference when the outer frame 10 and the sub-mask 20 are fixed, and the second positioning hole 102d and the second alignment hole 202c serves as a reference when the outer frame 10 is fixed to the sub-mask 20 .
  • the mask 1 of the present invention can perform coarse adjustment and fine adjustment in the second direction D2, thereby adjusting the sub-mask 20 compared to the outer frame 10 in the
  • the position of the second direction D2 further improves the technical problem of poor color mixing caused by the positional deviation of the sub-mask 20 in the second direction D2 when the pixel is prepared by vapor-depositing the luminescent material.
  • the mask 1 of the present invention can adjust the position of the sub-mask 20 in the first direction D1 compared to the outer frame 10, and the sub-mask can be adjusted.
  • the plate 20 is at a position in the second direction D2 of the outer frame 10, thereby improving the sub-mask 20 when the pixel is prepared by evaporating the luminescent material compared to the outer frame in the first direction.
  • the opening 202a is rectangular, the long side of the opening 202 is parallel to the second direction D2, and the short side of the opening 202 is parallel to the first direction D1.
  • the first direction D1 is an X direction
  • the second direction D2 is a Y direction
  • the first direction D1 is a Y direction
  • the second direction D2 is the X direction
  • FIG. 3 is a cross-sectional structural diagram of two adjacent bottom frames according to a preferred embodiment of the present invention.
  • the bottom frame 201 includes a shielding portion 201c for blocking a partial gap between the two bottom frames 201 when the two adjacent bottom frames 201 are mounted on the outer frame 10 to prevent the luminescent material. Product defects caused by evaporation of the gap between the adjacent two sub-masks 20 onto the product.
  • the shielding portion 201c is a rectangular strip, the length of the shielding portion 201c is equal to the length of the bottom frame 201, and one long side portion of the shielding portion 201c is disposed on the bottom frame. Partially highlighted.
  • the long side of the shielding portion 201c protrudes longer than the gap formed when the adjacent two sub-masks 20 are mounted on the outer frame 10 to install the adjacent two sub-masks 20
  • the gap formed on the outer frame 10 is shielded.
  • the shielding portion 201c is integrally formed with the bottom frame 201.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种掩膜板（1），包括外框（10）及多个子掩膜板（20），外框（10）为中空结构，包括第一边（101）、第二边（102）、第三边（103）及第四边（104），第一边（101）与第二边（102）平行且间隔设置，第三边（103）及第四边（104）平行且间隔设置，第三边（103）及第四边（104）沿第一方向（D1）延伸，第一边（101）及第二边（102）沿第二方向（D2）延伸，第三边（103）相对的两端分别连接第一边（101）的一端以及第二边（102）的一端，第四边（104）相对的两端分别连接第一边（101）远离第三边（103）的一端以及第二边（102）远离第三边（103）的一端，子掩膜板（20）用于选择性的遮挡制备像素时的发光材料，子掩膜板（20）沿第一方向（D1）延伸且多个子掩膜板（20）沿第二方向（D2）排列，子掩膜板（20）的相对的两端分别设置在第一边（101）及第二边（102）上，子掩膜板（20）可沿第一方向（D1）或第二方向（D2）往复运动。

Description

掩膜板
本发明要求2017年6月30日递交的发明名称为“掩膜板”的申请号201710526094.X的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及液晶显示领域，尤其涉及一种掩膜板。
背景技术
液晶显示器作为一种常用的电子设备在人们的日常生活中得到了广泛的应用。有机发光二极管显示器(Organic Light Emitting Display，OLED)由于具有生产成本便宜，自身发光无需背光源等优点而得到广泛的应用。而OLED在制备的时候需要使用掩膜板来达到对玻璃基板上的发光像素的区域蒸镀发光材料。随着OLED技术的发展，OLED显示器的尺寸以及玻璃基板的尺寸都在不断的增加，这就要求掩膜板的尺寸也要不断增加，为了保证掩膜板的制作精度，蒸镀所使用的掩膜板大都采用条状子掩膜板的形式。一般而言，条状子掩膜板焊接在底框上的时候容易出现焊接位置焊偏等，从而导致制备出来的OLED混色不良，进而导致制备出的产品不良。
发明内容
本发明提供一种掩膜板，所述掩膜板包括外框及多个子掩膜板，所述外框为中空结构，包括第一边、第二边、第三边及第四边，所述第一边与所述第二边平行且间隔设置，所述第三边及所述第四边平行且间隔设置，所述第三边及所述第四边沿所述第一方向延伸，所述第一边及所述第二边沿所述第二方向延伸，所述第三边相对的两端分别连接所述第一边的一端以及所述第二边的一端，所述第四边相对的两端分别连接所述第一边远离所述第四边的一端以及所述第二边远离所述第四边的一端，所述子掩膜板用于选择性的遮挡制备像素时的发光材料，所述子掩膜板沿第一方向延伸且多个所述子掩膜板沿第二方向排 列，所述子掩膜板的相对的两端分别设置在所述第一边及第二边上，所述子掩膜板可沿所述第一方向或所述第二方向往复运动。
相较于现有技术，本发明提供的掩膜板中的子掩膜板能够在第一方向或者第二方向往复运动，从而调整了子掩膜板相较于所述底框在第一方向或者第二方向的位置，从而改善了蒸镀发光材料制备像素时所述子掩膜板相较于所述外框在所述第一方向以及所述第二方向的位置偏差导致的混色不良的技术问题。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明一较佳实施例的掩膜板的结构示意图。
图2为本发明一较佳实施例的子掩膜板的结构示意图。
图3为本发明一较佳实施例中两个相邻的底框的剖面结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图1为本发明一较佳实施例的掩膜板的结构示意图。所述掩膜板1包括外框10及多个子掩膜板20。所述外框1为中空结构，所述外框1包括第一边101、第二边102、第三边103及第四边104。所述第一边101与所述第二边102平行且间隔设置，所述第三边103及所述第四边104平行且间隔设置。所述第三边103及所述第四边104沿所述第一方向D1延伸，所述第一边101及所述第二边102沿所述第二方向D2延伸。所述第三边103相对的两端分别连接所述第一边101的一端以及所述第二边102的一端，所述第四边104相对的两端分别连接所述第一边101远离所述第四边104的一端以及所述第二边102远离所 述第四边104的一端。所述子掩膜板20用于选择性的遮挡制备像素时的发光材料，所述子掩膜板20沿第一方向D1延伸且多个所述子掩膜板20沿第二方向D2排列。所述子掩膜板20的相对的两端分别设置在所述第一边101及第二边102上。所述子掩膜板20可沿所述第一方向D1或所述第二方向D2往复运动。
请参阅图2，图2为本发明一较佳实施例的子掩膜板的结构示意图。所述子掩膜板20包括底框201和子掩膜202。所述底框201为中空结构，在本实施方式中，所述底框201为长条状的中空框体结构。所述子掩膜202开设有多个间隔设置的开口202a，所述开口202用于通过制备像素时的发光材料。相邻的开口202a之间为实体结构部分用于遮挡制备像素时的发光材料。所述子掩膜202设置在所述底框201上，且所述底框201对所述子掩膜202中的开口202a无遮挡。所述底框201设置第一刻度线201a及第二刻度线201b。所述第一刻度线201a对应所述第一边101设置，所述第二刻度线201b对应所述第二边102设置。相应地，所述第一边101设置第一基准刻度线101a，所述第二边102上设置第二基准刻度线102a。在所述子掩膜板20安装到所述外框10上时，调整所述第一刻度线201a与所述第一基准刻度线101a在所述第一方向D1上的相对位置关系，以及调整所述第二刻度线201b与所述第二基准刻度线102a在所述第一方向D1上的相对位置关系，以对所述底框201在所述外框10上的位置进行调整。
所述掩膜板1还包括第一顶丝30及第二顶丝40。相应地，所述第一边101对应所述子掩膜板20处开设第一通孔101b，所述第一通孔101b的一端邻近所述子掩膜板20的一端设置。所述第一顶丝30设置在第一通孔101b内，且所述第一顶丝30可在所述第一通孔101b内沿第一方向D1运动。所述第二边102对应所述子掩膜板20处开设有第二通孔102b，所述第二通孔102b的一端邻近所述子掩膜板20的另一端设置。所述第二顶丝40设置在所述第二通孔102b内，且所述第二顶丝40可在所述第二通孔102b内沿第一方向D1运动或者沿所述第一方向相反的方向运动。所述第一顶丝30及所述第二顶丝40相互配合以使所述子掩膜板20沿所述第一方向D1运动或者沿所述第一方向D1相反的方向运动，以实现所述子掩膜板20在所述第一方向D1上位置的调整。
举例而言，当需要将某一个子掩膜板20沿所述第一方向D1运动一定距离d1时，将所述第一顶丝30在所述第一通孔101b中沿所述第一方向D1移动所述距离d1，在将所述第二顶丝40在所述第二通孔102b沿所述第一方向D1移动所述距离d1，进而使得所述子掩膜板20沿所述第一方向D1移动所述距离d1，从而调整了所述子掩膜板20相较于所述外框10在所述第一方向D1的位置。可以理解地，当多个子掩膜板20需要沿所述第一方向D1进行调整时，可以按照上述描述对每一个子掩膜板20分别进行调整。
相应地，当需要将某一个子掩膜板20沿所述第一方向D1相反的方向运动一定距离d2时，将所述第二顶丝40在所述第二通孔102b中沿所述第一方向D1相反的方向移动所述距离d2，将所述第一顶丝30在所述第一通孔101b中沿所述第一方向D1相反的方向移动所述距离d2，进而使得所述子掩膜板20沿所述第一方向D1相仿的方向移动所述距离d2，从而调整了所述子掩膜板20相较于所述外框10在所述第一方向D1的位置。可以理解地，当多个子掩膜板20需要沿所述第一方向D1相反的方向进行调整时，可以按照上述描述对每一个子掩膜板20分别进行调整。
优选地，所述第一边101上对应每个子掩膜板20处开设的第一通孔101b的数目为两个，相应地，每个第一通孔101b与一个第一顶丝30相对应，两个所述第一通孔101b分别对应所述子掩膜板20的一端的两边设置。所述第二边102上对应每个子掩膜板20处开设的第二通孔102b的数目为两个，相应地，每个第二通孔102b与一个第二顶丝40相对应，两个所述第二通孔102b分别对应所述子掩膜板20的一端的两边设置。在所述第一边101上对应每个子掩膜板20开设的第一通孔101b的数目为两个，以及将每个第一通孔101b与一个第一顶丝30配合，且在所述第二边102上对应每个子掩膜板20开设的第二通孔102b的数目为两个，以及将每个第二通孔102b与一个第二顶丝40配合，从而使得调整所述子掩膜板20相较于所述外框10在所述第一方向D1的位置关系时，所述子掩膜板20在所述第一方向D1以及所述第一方向D1相反的方向移动得更加均匀，防止所述子掩膜板20跑偏。
本发明的掩膜板1通过前面描述的所述第一顶丝30与所述第一通孔101b配合以及所述第二顶丝40与所述第二通孔102b配合，从而调整了所述子掩膜 板20相较于所述外框10在所述第一方向D1的位置，进而改善了蒸镀发光材料(所述发光材料可以为但不仅限于为氧化铟锡)制备像素时所述子掩膜板20相较于所述外框10在所述第一方向D1的位置偏差导致的混色不良的技术问题。
所述子掩膜板20可沿所述第二方向D2或者沿所述第二方向D2相反的方向分别进行粗调以及微调，以调整所述子掩膜板相较于所述外框在所述第二方向上的位置。其中，当所述子掩膜板20沿所述第二方向D2进行粗调时所述子掩膜板20的移动幅度大于所述子掩膜板20沿所述第二方向D2进行微调时所述子掩膜板20的移动幅度；当所述子掩膜板20沿所述第二方向D2相反的方向进行粗调时所述子掩膜板20的移动幅度大于所述子掩膜板20沿所述第二方向D2相反的方向进行细调时的移动幅度。
具体地，在本实施方式中，所述第一边101上对应所述子掩膜板20开设有第一凹槽101c，所述第一凹槽101c沿所述第二方向D2设置。所述第二边102上对应所述子掩膜板20开设有第二凹槽102c，所述第二凹槽102c沿所述第二方向D2设置。所述掩膜板1还包括与子掩膜板20对应的第一定位销50及第二定位销60。所述第一定位销50在所述第一凹槽101c内移动且所述第二定位销60在所述第二凹槽102c内移动以使得所述子掩膜板20在所述第二方向D2或者所述第二方向D2相反的方向上移动，以实现所述子掩膜板20相较于所述外框10在所述第二方向D2上进行粗调。
所述第一定位销50上设置第一参考刻度线，所述第二定位销60上设置第二参考刻度线。所述底框201上对应所述第一边101设置第一刻度线，所述底框201上对应所述第二边102设置第二刻度线。通过所述调节第一参考刻度线与所述第二刻度线之间的相对位置关系，以及调节所述第二参考刻度线与所述第二刻度线之间的相对位置关系，以实现所述子掩膜板20相较于所述外框10在所述第二方向D2上的微调。
所述第一边101对应所述子掩膜板20设置有第一定位孔101d，所述第二边102对应所述子掩膜板20设置有第二定位孔102d。所述子掩膜202邻近所述第一边101设置第一对位孔202b，所述子掩膜202邻近所述第二边102设置第二对位孔202c。图1示意出的是所述第一定位孔101d与所述第一对位孔 202b重合的情况，所述第二定位孔102d与所述第二对位孔202c重合的情况。所述第一定位孔101d与所述第一对位孔202b作为所述外框10与所述子掩膜板20固定时的基准，所述第二定位孔102d与所述第二对位孔202c作为所述外框10与所述子掩膜板20固定时的基准。
相较于现有技术，本发明的掩膜板1可以在所述第二方向D2上进行粗调以及微调，从而调整了所述子掩膜板20相较于所述外框10在所述第二方向D2的位置，进而改善了蒸镀发光材料制备像素时所述子掩膜板20相较于所述外框10在所述第二方向D2的位置偏差导致的混色不良的技术问题。
通过前面描述的技术手段，本发明的掩膜板1即可以调整所述子掩膜板20相较于所述外框10在所述第一方向D1的位置，又可以调整所述子掩膜板20相较于所述外框10在所述第二方向D2的位置，从而改善了蒸镀发光材料制备像素时所述子掩膜板20相较于所述外框在所述第一方向D1以及所述第二方向D2的位置偏差导致的混色不良的技术问题。
在本实施方式中，所述开口202a为长方形，所述开口202的长边平行于所述第二方向D2，所述开口202的短边平行于所述第一方向D1。
在一实施方式中，所述第一方向D1为X方向，所述第二方向D2为Y方向；或者，在另一实施方式中，所述第一方向D1为Y方向，所述第二方向D2为X方向。
请一并参阅图3，图3为本发明一较佳实施例中两个相邻的底框的剖面结构示意图。所述底框201包括遮挡部201c，所述遮挡部201c用于遮挡相邻的两个底框201安装在所述外框10时，两个底框201之间的部分间隙，以防止发光材料通过相邻的两个子掩膜板20之间的缝隙蒸镀到产品上造成的产品不良。在本实施方式中，所述遮挡部201c为矩形长条，所述遮挡部201c的长度与所述底框201的长度相等，所述遮挡部201c的一条长边部分设置在所述底框上，部分突出出来。优选地，所述遮挡部201c的长边突出出来的长度大于相邻的两个子掩膜板20安装在所述外框10上时形成的间隙，以对相邻的两个子掩膜板20安装在所述外框10上时形成的间隙进行遮挡。优选地，所述遮挡部201c与所述底框201一体成型。
以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本发 明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。

Claims (10)

  1. 一种掩膜板，其中，所述掩膜板包括外框及多个子掩膜板，所述外框为中空结构，包括第一边、第二边、第三边及第四边，所述第一边与所述第二边平行且间隔设置，所述第三边及所述第四边平行且间隔设置，所述第三边及所述第四边沿所述第一方向延伸，所述第一边及所述第二边沿所述第二方向延伸，所述第三边相对的两端分别连接所述第一边的一端以及所述第二边的一端，所述第四边相对的两端分别连接所述第一边远离所述第四边的一端以及所述第二边远离所述第四边的一端，所述子掩膜板用于选择性的遮挡制备像素时的发光材料，所述子掩膜板沿第一方向延伸且多个所述子掩膜板沿第二方向排列，所述子掩膜板的相对的两端分别设置在所述第一边及第二边上，所述子掩膜板可沿所述第一方向或所述第二方向往复运动。
  2. 如权利要求1所述的掩膜板，其中，所述子掩膜板包括底框和子掩膜，所述底框为中空结构，所述子掩膜开设有多个间隔设置的开口，所述子掩膜设置在所述底框上，且所述底框对所述子掩膜中的开口无遮挡，所述底框设置第一刻度线及第二刻度线，所述第一刻度线对应所述第一边设置，所述第二刻度线对应所述第二边设置，且所述第一边设置第一基准刻度线，所述第二边上设置第二基准刻度线，调整所述第一刻度线与所述第一基准刻度线在所述第一方向上的相对位置关系，以及调整所述第二刻度线与所述第二基准刻度线在所述第一方向上的相对位置关系，以对所述底框在所述外框上的位置进行调整。
  3. 如权利要求2所述的掩膜板，其中，所述掩膜板包括第一顶丝及第二顶丝，所述第一边对应所述子掩膜板处开设第一通孔，所述第一通孔的一端邻近所述子掩膜板的一端设置，所述第一顶丝设置在第一通孔内，且所述第一顶丝可在所述第一通孔内沿第一方向运动，所述第二边对应所述子掩膜板处开设有第二通孔，所述第二通孔的一端邻近所述子掩膜板的另一端设置，所述第二顶丝设置在所述第二通孔内，且所述第二顶丝可在所述第二通孔内沿第一方向运动或者沿所述第一方向相反的方向运动，所述第一顶丝及所述第二顶丝相互配 合以使所述子掩膜板沿所述第一方向运动或者沿所述第一方向相反的方向运动，以实现所述子掩膜版在所述第一方向上位置的调整。
  4. 如权利要求3所述的掩膜板，其中，所述第一边上对应每个子掩膜板处开设的第一通孔的数目为两个，每个第一通孔与一个第一顶丝相对应，两个所述第一通孔分别对应所述子掩膜板的一端的两边设置，所述第二边上对应每个子掩膜板处开设的第二通孔的数目为两个，每个第二通孔与一个第二顶丝相对应，两个所述第二通孔分别对应所述子掩膜板的一端的两边设置。
  5. 如权利要求4所述的掩膜板，其中，所述子掩膜板可沿所述第二方向或者沿所述第二方向相反的方向分别进行粗调以及微调，以调整所述子掩膜板相较于所述外框在所述第二方向上的位置，其中，所述子掩膜板沿所述第二方向进行粗调时所述子掩膜板的移动幅度大于所述子掩膜板沿所述第二方向进行微调时所述子掩膜板的移动幅度；所述子掩膜板沿所述第二方向相反的方向进行粗调时所述子掩膜板的移动幅度大于所述子掩膜板沿所述第二方向相反的方向进行细调时的移动幅度。
  6. 如权利要求5所述的掩膜板，其中，所述第一边上对应所述子掩膜板开设有第一凹槽，所述第一凹槽沿所述第二方向设置，所述第二边上对应所述子掩膜板开设有第二凹槽，所述第二凹槽沿所述第二方向设置，所述掩膜板还包括与子掩膜板对应的第一定位销及第二定位销，所述第一定位销在所述第一凹槽内移动且所述第二定位销在所述第二凹槽内移动以使得所述子掩膜板在所述第二方向或者所述第二方向相反的方向上移动，以实现所述子掩膜板相较于所述外框在所述第二方向上进行粗调。
  7. 如权利要求6所述的掩膜板，其中，所述第一定位销上设置第一参考刻度线，所述第二定位销上设置第二参考刻度线，所述底框上对应所述第一边设置第一刻度线，所述底框上对应所述第二边设置第二刻度线，通过所述调节第一参考刻度线与所述第二刻度线之间的相对位置关系，以及调节所述第二参考 刻度线与所述第二刻度线之间的相对位置关系，以实现所述子掩膜板相较于所述外框在所述第二方向上的微调。
  8. 如权利要求6所述的掩膜板，其中，所述第一边对应所述子掩膜板设置有第一定位孔，所述第二边对应所述子掩膜板设置有第二定位孔，所述子掩膜邻近所述第一边设置第一对位孔，所述子掩膜邻近所述第二边设置第二对位孔，所述第一定位孔与所述第一对位孔作为所述外框与所述子掩膜板固定时的基准，所述第二定位孔与所述第二对位孔作为所述外框与所述子掩膜板固定时的基准。
  9. 如权利要求1所述的掩膜板，其中，所述第一方向为X方向，所述第二方向为Y方向；或者，所述第一方向为Y方向，所述第二方向为X方向。
  10. 如权利要求2所述的掩膜板，其中，所述底框包括遮挡部，所述遮挡部用于遮挡相邻的两个底框安装在所述外框时，两个底框之间的部分间隙。
PCT/CN2017/097225 2017-06-30 2017-08-11 掩膜板 WO2019000600A1 (zh)

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JP2021175824A (ja) * 2020-03-13 2021-11-04 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法

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