WO2019000538A1 - 扬声器模组以及电子设备 - Google Patents

扬声器模组以及电子设备 Download PDF

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Publication number
WO2019000538A1
WO2019000538A1 PCT/CN2017/094742 CN2017094742W WO2019000538A1 WO 2019000538 A1 WO2019000538 A1 WO 2019000538A1 CN 2017094742 W CN2017094742 W CN 2017094742W WO 2019000538 A1 WO2019000538 A1 WO 2019000538A1
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WIPO (PCT)
Prior art keywords
cavity
speaker module
resonant cavity
speaker
disposed
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PCT/CN2017/094742
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English (en)
French (fr)
Inventor
霍新祥
韩丹
杨赟
刘旭东
孙志军
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歌尔科技有限公司
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Application filed by 歌尔科技有限公司 filed Critical 歌尔科技有限公司
Publication of WO2019000538A1 publication Critical patent/WO2019000538A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present application relates to the field of electroacoustic conversion technology, and more particularly, to a speaker module and an electronic device.
  • the speaker module Due to the presence of the front cavity and the reinforcement, the speaker module generally has a front cavity resonance peak and a dome resonance peak, which causes the FR to become uneven in the high frequency band.
  • a resonant cavity is usually provided in the front acoustic cavity to adjust the high frequency effect of the FR.
  • the quality factor (Q value) of this method is too high, which causes the high frequency adjustment of the FR to fail to achieve the desired effect, and the high frequency effect of the speaker module is poor.
  • An object of the present application is to provide a new technical solution for a speaker module.
  • a speaker module comprises a module housing and a speaker unit, the module housing has a cavity therein, and the diaphragm of the speaker unit separates the cavity into a front acoustic cavity and a rear acoustic cavity, the front acoustic cavity Communicating with the sounding hole of the module housing, the module housing further includes a resonant cavity, wherein the resonant cavity communicates with the front acoustic cavity through a communication hole, and a grid is disposed in the communication hole, the grid The grid is configured to form a plurality of channels for communicating the resonant cavity and the front acoustic cavity.
  • the channel is linear or wavy.
  • the resonant cavity is disposed adjacent to a rear acoustic cavity of the module housing.
  • the module housing includes a middle case and an upper case, the upper case has a flat structure, and the upper case is closed on the middle case to form the cavity; the resonant cavity
  • the chamber wall includes a top wall, a bottom wall and a side wall, the top wall, the bottom wall and the side wall being enclosed together to close the harmonic a vibrating chamber, the bottom wall is disposed opposite to the top wall, the bottom wall and the side wall are disposed on the middle shell, and the communication hole is disposed on the side wall, the upper shell A part of it serves as the top wall.
  • the top wall, the bottom wall and the middle case are integrally formed.
  • the middle case further includes a partition between the front acoustic cavity and the rear acoustic cavity, the resonant cavity is disposed on the partition, and a part of the partition serves as the resonant cavity a side wall, a gap for connecting the resonant cavity and the front acoustic cavity is disposed on the partition, the grille is disposed in the notch, and the upper shell is covered on the partition So that the gap forms the communication hole.
  • the grid is integrally formed with the separator.
  • the grille is integrally formed with the upper casing.
  • the grid comprises a plurality of vertical plates, a plurality of the vertical plates are arranged side by side, wherein a part of the vertical plates are integrally formed with the upper casing, and another part of the vertical plates is integrally formed with the partition plate. .
  • an electronic device includes the speaker module provided by the present application.
  • the acoustic resistance of the communication hole is increased by providing a grid in the communication hole of the resonant cavity.
  • the acoustic resistance is the resistance of the vibrating airflow into and out of the communication hole.
  • the quality factor (Q value) of the speaker module is lowered, so that the FR of the speaker module becomes gentle in the high frequency band.
  • the noise of the speaker module in the high frequency band is reduced, and the sound effect of the speaker module is improved.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
  • FIG. 2 is a schematic structural view of a speaker module without an upper casing according to an embodiment of the present application.
  • Figure 3 is a partial enlarged view of a portion A in Figure 2 .
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
  • 2 is a schematic structural view of a speaker module without an upper casing according to an embodiment of the present application.
  • Figure 3 is a partial enlarged view of a portion A in Figure 2 .
  • a speaker module includes a module housing and a speaker unit.
  • the speaker unit is a moving coil type unit.
  • the interior of the module housing has a cavity.
  • the speaker unit is disposed within the cavity.
  • the diaphragm 14 of the speaker unit separates the cavity into a front acoustic cavity 15 and a rear acoustic cavity 16.
  • the rear sound chamber 16 is used to adjust the low frequency effect of the speaker module.
  • the front sound chamber 15 communicates with the sound hole 13 of the module housing.
  • the sound is emitted by the sound hole 13.
  • the sound hole 13 is located at the side of the speaker module. This method is suitable for electronic devices that require lateral mounting of the speaker module.
  • the module housing also includes a resonant cavity 10.
  • the resonant cavity 10 communicates with the front acoustic cavity 15 through the communication hole 18.
  • a grille is provided in the communication hole 18.
  • the grid is configured to form a plurality of passages for connecting the resonant cavity 10 and the front acoustic cavity 15.
  • the grid includes a plurality of risers 19 arranged side by side.
  • a passage is formed between the plurality of risers, or a passage is formed between the riser 19 and the wall of the communication hole 18.
  • the grille includes a plurality of vertical plates 19 arranged side by side and a horizontal plate at a set angle with the vertical plates 19, and the horizontal plates are disposed to intersect the vertical plates 19.
  • a passage is formed between the vertical plate 19 and the horizontal plate, or a passage is formed between the vertical plate 19 and the horizontal wall of the horizontal hole and the communication hole 18.
  • the acoustic resistance of the communication hole 18 is increased by providing the grid in the communication hole 18 of the cavity 10.
  • the acoustic resistance is the resistance of the vibrating airflow into and out of the communication hole 18.
  • the quality factor (Q value) of the speaker module is lowered, so that the FR of the speaker module becomes gentle in the high frequency band.
  • the noise of the speaker module in the high frequency band is reduced, and the sound effect of the speaker module is improved.
  • the channels are linear or wavy.
  • Straight channels are easy to make.
  • the wavy linear passage has a larger surface area, thereby increasing the viscous resistance of the passage, which further increases the acoustic resistance of the communication hole 18.
  • the resonant cavity 10 is disposed adjacent to the rear acoustic cavity 16 of the module housing.
  • the cavity 10 is isolated from the rear acoustic cavity 16 of the module housing by the cavity wall. In this way, the resonant cavity 10 does not occupy the space outside the module housing, and conforms to the trend of thinning and miniaturization of electronic devices.
  • the resonant cavity 10 is disposed within the space enclosed by the front acoustic cavity 15.
  • a communication hole 18 is provided in the cavity wall of the cavity 10.
  • a grille is provided in the communication hole 18. In this way, the quality factor of the speaker module can also be reduced, and the high frequency effect of the speaker module can be improved.
  • the module housing includes a middle case 12 and an upper case 11.
  • the upper case 11 has a flat structure.
  • the middle casing 12 includes a side portion and a bottom portion, and the two are combined into an open structure.
  • the upper casing 11 is covered in the middle casing 12 Open the end to close the cavity.
  • the cavity wall of the resonant cavity 10 includes a top wall, a bottom wall 22, and side walls 20.
  • the top wall, bottom wall 22 and side wall 20 are enclosed to enclose the resonant cavity 10.
  • the bottom wall 22 is disposed opposite the top wall.
  • the bottom wall 22 and the side wall 20 are disposed on the middle case 12.
  • the communication hole 18 is provided on the side wall 20.
  • a part of the upper casing 11 serves as a top wall.
  • the speaker unit is first mounted in position, and then the upper case 11 is covered on the middle case 12, thereby facilitating assembly of the speaker module.
  • a portion of the upper casing 11 serves as a top wall of the resonant cavity 10 without separately providing a top wall, and the upper casing 11 covers the intermediate casing 12 while forming the front and rear acoustic chambers 15, 16 and the resonant cavity 10. This saves the raw materials and simplifies the assembly steps of the module housing.
  • the upper case 11 and the middle case 12 are connected by an adhesive to seal the front and rear acoustic chambers 15, 16 and the resonant cavity 10, or the upper case 11 and the middle case 12 are connected by laser welding. . Both of these methods provide a good sealing effect.
  • the top wall, bottom wall 22 of the cavity 10 and the middle case 12 are integrally formed.
  • the bottom wall 22 and the side wall 20 are formed adjacent to the rear acoustic cavity 16 by injection molding, and the bottom wall 22 and the side wall 20 are joined together. In this way, the arrangement of the resonant cavity 10 becomes easy, and the connection strength between the bottom wall 22, the side wall 20, and the middle case 12 is high.
  • the middle casing 12 further includes a partition 21 between the front acoustic chamber 15 and the rear acoustic chamber 16.
  • the resonant cavity 10 is disposed on the spacer 21.
  • a portion of the spacer 21 serves as the side wall 20 of the resonant cavity 10.
  • a notch 18 for connecting the resonant cavity 10 and the front acoustic cavity 15 is provided on the partition 21.
  • the upper case 11 is covered on the partition 21 so that the notch 18 forms the communication hole 18.
  • the resonant cavity 10 is disposed on a side of the partition 21 adjacent to the rear acoustic cavity 16.
  • the notches 18 extend through both sides of the partition 21.
  • the riser 19 is parallel to the side wall 20 of the notch 18. In this way, the arrangement of the communication holes 18 becomes easy.
  • the grid and the partition 21 are integrally formed.
  • the grille includes one or more risers 19.
  • the vertical plate 19 and the separator 21 are integrally molded by injection molding. In this way, the installation of the grille becomes easy.
  • the partition 21 and the middle casing 12 are integrally molded by injection molding.
  • the grille is integrally formed with the middle case 12. In this way, the processing steps of the grid are further simplified.
  • the grille and the upper casing 11 are integrally formed.
  • the riser 19 is integrally formed with the upper casing 11 during the injection molding process.
  • the vertical plate 19 is inserted into the cavity 10 to assemble the grid in place. This approach also simplifies the installation steps of the grid.
  • the grid comprises a plurality of risers 19.
  • a plurality of vertical plates 19 are juxtaposed, wherein a part of the vertical plates 19 and the upper casing 11 are integrally formed, and the other partial vertical plates 19 and the partition plate 21 are integrally formed.
  • the partition 21 and the middle casing 12 are integrally formed.
  • a person skilled in the art can set the forming manner of the vertical plate 19 according to actual needs.
  • the resonant cavity 10 and the grid located within the resonant cavity 10 are disposed on the upper casing 11.
  • An installation space is reserved at a position of the middle casing 12 near the rear sound chamber 16. The cavity 10 is positioned into the installation space after the upper case 11 is closed.
  • the cavity 10 and the grid form a unitary structure with the upper casing 11. If the grid or cavity 10 fails, simply replace the unitary structure.
  • an electronic device is provided.
  • the electronic device can be, but is not limited to, a mobile phone, a game machine, a computer, a walkie-talkie, a smart watch, and the like.
  • the electronic device includes the speaker module provided by the present application.
  • the electronic device has the characteristics of good high frequency effect.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

一种扬声器模组以及电子设备。扬声器模组包括模组壳体和扬声器单体，模组壳体的内部具有腔体，扬声器单体的振膜（14）将腔体分隔为前声腔（15）和后声腔（16），前声腔（15）与模组壳体的出声孔（13）连通，模组壳体还包括谐振腔（10），谐振腔（10）通过连通孔（18）与前声腔（15）连通，在连通孔（18）内设置有格栅，格栅被构造为形成多个用于连通谐振腔（10）和前声腔（15）的通道。解决了现有的扬声器模组的品质因子偏高的技术问题。该扬声器模组用于电子设备中。

Description

扬声器模组以及电子设备 技术领域
本申请涉及电声转换技术领域，更具体地，本申请涉及一种扬声器模组以及电子设备。
背景技术
扬声器模组频率响应曲线(FR)在高频段越平坦越则发声效果越好。由于前声腔和补强部的存在，扬声器模组一般存在前声腔谐振峰与球顶(Dome)谐振峰，从而导致FR在高频段变得不平坦。为了解决该技术问题，通常在前声腔设置谐振腔，来调节FR的高频效果。然而，这种方式的品质因子(Q值)偏高，导致FR的高频调节不能达到理想的效果，扬声器模组的高频效果差。
申请内容
本申请的一个目的是提供一种扬声器模组的新技术方案。
根据本申请的一个方面，提供一种扬声器模组。该模组包括模组壳体和扬声器单体，所述模组壳体的内部具有腔体，所述扬声器单体的振膜将所述腔体分隔为前声腔和后声腔，所述前声腔与模组壳体的出声孔连通，所述模组壳体还包括谐振腔，所述谐振腔通过连通孔与所述前声腔连通，在所述连通孔内设置有格栅，所述格栅被构造为形成多个用于连通所述谐振腔和所述前声腔的通道。
可选地，所述通道为直线形或者波浪线形。
可选地，所述谐振腔与所述模组壳体的后声腔比邻设置。
可选地，所述模组壳体包括中壳和上壳，所述上壳呈扁平结构，所述上壳盖合在所述中壳上，以形成所述腔体；所述谐振腔的腔壁包括顶壁、底壁和侧壁，所述顶壁、所述底壁和所述侧壁围合在一起，以封闭所述谐 振腔，所述底壁与所述顶壁相对设置，所述底壁和所述侧壁被设置在所述中壳上，所述连通孔被设置在所述侧壁上，所述上壳的一部分作为所述顶壁。
可选地，所述顶壁、所述底壁与所述中壳是一体成型的。
可选地，所述中壳还包括位于所述前声腔和所述后声腔之间的隔板，所述谐振腔被设置在所述隔板上，所述隔板的一部分作为所述谐振腔的侧壁，在所述隔板上设置有用于连通所述谐振腔与所述前声腔的缺口，在所述缺口内设置有所述格栅，所述上壳盖合在所述隔板上，以使所述缺口形成所述连通孔。
可选地，所述格栅与所述隔板是一体成型的。
可选地，所述格栅与所述上壳是一体成型的。
可选地，所述格栅包括多个立板，多个所述立板并列设置，其中一部分立板与所述上壳是一体成型的，另一部分立板与所述隔板是一体成型的。
根据本申请的另一个方面，提供了一种电子设备。该电子设备包括本申请提供的所述扬声器模组。
本申请的一个技术效果在于，在本申请实施例中，通过在谐振腔的连通孔内设置格栅，增大了连通孔的声阻。声阻即振动气流进、出连通孔的阻力。
此外，通过在连通孔内设置格栅，降低了扬声器模组的品质因子(Q值)，使得该扬声器模组的FR在高频段变得平缓。
此外，通过在连通孔内设置格栅，降低了扬声器模组在高频段的杂音，提高了扬声器模组的声音效果。
通过以下参照附图对本申请的示例性实施例的详细描述，本申请的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本申请的实施例，并且连同说明书一起用于解释本申请的原理。
图1是根据本申请的一个实施例的扬声器模组的分解图。
图2是根据本申请的一个实施例的未安装上壳的扬声器模组的结构示意图。
图3是图2中A处的局部放大图。
附图标记说明：
10：谐振腔；11：上壳；12：中壳；13：出声孔；14：振膜；15：前声腔；16：后声腔；18：连通孔；19：立板；20：侧壁；21：隔板；22：底壁。
具体实施方式
现在将参照附图来详细描述本申请的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本申请的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本申请及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
图1是根据本申请的一个实施例的扬声器模组的分解图。图2是根据本申请的一个实施例的未安装上壳的扬声器模组的结构示意图。图3是图2中A处的局部放大图。
根据本申请的一个实施例，提供了一种扬声器模组。该模组包括模组壳体和扬声器单体。例如，扬声器单体为动圈式单体。模组壳体的内部具有腔体。扬声器单体被设置在腔体内。扬声器单体的振膜14将腔体分隔为前声腔15和后声腔16。后声腔16用于调节扬声器模组的低频效果。
前声腔15与模组壳体的出声孔13连通。声音由出声孔13发出。例如，出声孔13位于扬声器模组的侧部。这种方式适用于需要将扬声器模组进行侧向安装的电子设备。
模组壳体还包括谐振腔10。谐振腔10通过连通孔18与前声腔15连通。在连通孔18内设置有格栅。格栅被构造为形成多个用于连通谐振腔10和前声腔15的通道。
例如，格栅包括多个并列设置的立板19。在多个立板之间形成通道，或者是在立板19与连通孔18的孔壁之间形成通道。
例如，格栅包括多个并列设置的立板19以及与立板19呈设定角度的横板，横板与立板19交叉设置。在立板19和横板之间形成通道，或者是在立板19和横板与连通孔18的孔壁之间形成通道。
在本申请实施例中，通过在谐振腔10的连通孔18内设置格栅，增大了连通孔18的声阻。声阻即振动气流进、出连通孔18的阻力。
此外，通过在连通孔18内设置格栅，降低了扬声器模组的品质因子(Q值)，使得该扬声器模组的FR在高频段变得平缓。
此外，通过在连通孔18内设置格栅，降低了扬声器模组在高频段的杂音，提高了扬声器模组的声音效果。
优选地，通道为直线形或者波浪线形。直线型的通道容易制作。波浪线形的通道具有更大的表面积，从而增加了通道的粘滞阻力，这使得连通孔18的声阻进一步增加。
在一个例子中，谐振腔10与模组壳体的后声腔16比邻设置。例如，谐振腔10通过腔壁与模组壳体的后声腔16进行隔离。通过这种方式，谐振腔10不占用模组壳体外部的空间，顺应了电子设备轻薄化、小型化的发展趋势。
在其他示例中，谐振腔10被设置在前声腔15包围的空间内。在谐振腔10的腔壁上设置有连通孔18。在连通孔18内设置有格栅。通过这种方式，同样能够降低扬声器模组的品质因子，提高扬声器模组高频效果。
在一个例子中，模组壳体包括中壳12和上壳11。上壳11呈扁平结构。中壳12包括侧部和底部，二者围合成敞开结构。上壳11盖合在中壳12的 敞开端，以封闭腔体。谐振腔10的腔壁包括顶壁、底壁22和侧壁20。顶壁、底壁22和侧壁20围合在一起，以封闭谐振腔10。底壁22与顶壁相对设置。底壁22和侧壁20被设置在中壳12上。连通孔18被设置在侧壁20上。上壳11的一部分作为顶壁。在上壳11与中壳12连接时，上壳11的与谐振腔10相对的部分将谐振腔10封闭。
通过这种方式，在组装时，先将扬声器单体安装到位，然后将上壳11盖合在中壳12上即可，从而使扬声器模组的组装变得容易。
此外，上壳11的一部分作为谐振腔10的顶壁，而不用另外设置顶壁，上壳11盖合在中壳12上同时形成前、后声腔15、16和谐振腔10。这样既节省了原材料，又简化了模组壳体的组装步骤。
例如，上壳11与中壳12之间通过粘结剂连接，以密封前、后声腔15、16和谐振腔10，或者是上壳11与中壳12之间通过激光焊接的方式连接在一起。这两种方式均能起到良好的密封效果。
谐振腔10的顶壁、底壁22与中壳12是一体成型的。例如，采用注塑成型的方式在与后声腔16比邻的位置形成底壁22和侧壁20，并且底壁22和侧壁20连接在一起。通过这种方式，谐振腔10的设置变得容易，并且底壁22、侧壁20与中壳12之间的连接强度高。
优选地，中壳12还包括位于前声腔15和后声腔16之间的隔板21。谐振腔10被设置在隔板21上。隔板21的一部分作为谐振腔10的侧壁20。在隔板21上设置有用于连通谐振腔10与前声腔15的缺口18。上壳11盖合在隔板21上，以使缺口18形成连通孔18。
例如，谐振腔10被设置在隔板21的靠近后声腔16的一侧。缺口18贯穿隔板21的两侧。立板19平行于缺口18的侧壁20。通过这种方式，连通孔18的设置变得容易。
优选地，格栅与隔板21是一体成型的。例如，格栅包括一个或者多个立板19。通过注塑成型的方式将立板19与隔板21一体成型。通过这种方式，格栅的安装变得容易。
特别地，隔板21与中壳12通过注塑的方式一体成型。这样，格栅与中壳12一体成型。这样，进一步简化了格栅的加工步骤。
也可以是，格栅与上壳11是一体成型的。例如，立板19在注塑过程中与上壳11一体成型。在上壳11盖合时，立板19插入谐振腔10中，以将格栅组装到位。这种方式同样能够简化格栅的安装步骤。
还可以是，格栅包括多个立板19。多个立板19并列设置，其中一部分立板19与上壳11是一体成型的，另一部分立板19与隔板21是一体成型的。例如，隔板21与中壳12是一体成型的。在上壳11盖合时，位于上壳11的立板19与位于中壳12的立板19组合在一起，以形成格栅。
本领域技术人员可以根据实际需要设置立板19的成型方式。
在其他示例中，谐振腔10以及位于谐振腔10内的格栅被设置在上壳11上。在中壳12的靠近后声腔16的位置预留有安装空间。在上壳11盖合后谐振腔10被定位到安装空间中。
通过这种方式，谐振腔10和格栅与上壳11形成一体结构。如果格栅或者谐振腔10发生故障，只需更换一体结构即可。
根据本申请的另一个实施例，提供了一种电子设备。电子设备可以是但不局限于手机、游戏机、电脑、对讲机、智能手表等。该电子设备包括本申请提供的扬声器模组。
该电子设备具有高频效果良好的特点。
虽然已经通过示例对本申请的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本申请的范围。本领域的技术人员应该理解，可在不脱离本申请的范围和精神的情况下，对以上实施例进行修改。本申请的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括模组壳体和扬声器单体，所述模组壳体的内部具有腔体，所述扬声器单体的振膜将所述腔体分隔为前声腔和后声腔，所述前声腔与模组壳体的出声孔连通，所述模组壳体还包括谐振腔，所述谐振腔通过连通孔与所述前声腔连通，在所述连通孔内设置有格栅，所述格栅被构造为形成多个用于连通所述谐振腔和所述前声腔的通道。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述通道为直线形或者波浪线形。
  3. 根据权利要求1或2所述的扬声器模组，其特征在于，所述谐振腔与所述模组壳体的后声腔比邻设置。
  4. 根据权利要求1-3中的任意一项所述的扬声器模组，其特征在于，所述模组壳体包括中壳和上壳，所述上壳呈扁平结构，所述上壳盖合在所述中壳上，以形成所述腔体；所述谐振腔的腔壁包括顶壁、底壁和侧壁，所述顶壁、所述底壁和所述侧壁围合在一起，以封闭所述谐振腔，所述底壁与所述顶壁相对设置，所述底壁和所述侧壁被设置在所述中壳上，所述连通孔被设置在所述侧壁上，所述上壳的一部分作为所述顶壁。
  5. 根据权利要求1-4中的任意一项所述的扬声器模组，其特征在于，所述顶壁、所述底壁与所述中壳是一体成型的。
  6. 根据权利要求1-5中的任意一项所述的扬声器模组，其特征在于，所述中壳还包括位于所述前声腔和所述后声腔之间的隔板，所述谐振腔被设置在所述隔板上，所述隔板的一部分作为所述谐振腔的侧壁，在所述隔板上设置有用于连通所述谐振腔与所述前声腔的缺口，在所述缺口内设置 有所述格栅，所述上壳盖合在所述隔板上，以使所述缺口形成所述连通孔。
  7. 根据权利要求1-6中的任意一项所述的扬声器模组，其特征在于，所述格栅与所述隔板是一体成型的。
  8. 根据权利要求1-7中的任意一项所述的扬声器模组，其特征在于，所述格栅与所述上壳是一体成型的。
  9. 根据权利要求1-8中的任意一项所述的扬声器模组，其特征在于，所述格栅包括多个立板，多个所述立板并列设置，其中一部分立板与所述上壳是一体成型的，另一部分立板与所述隔板是一体成型的。
  10. 一种电子设备，其特征在于，包括如权利要求1-9中的任意一项所述的扬声器模组。
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