WO2018235688A1 - Curable composition, semi-cured product, cured product, optical member, lens and compound - Google Patents

Curable composition, semi-cured product, cured product, optical member, lens and compound Download PDF

Info

Publication number
WO2018235688A1
WO2018235688A1 PCT/JP2018/022517 JP2018022517W WO2018235688A1 WO 2018235688 A1 WO2018235688 A1 WO 2018235688A1 JP 2018022517 W JP2018022517 W JP 2018022517W WO 2018235688 A1 WO2018235688 A1 WO 2018235688A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
meth
substituent
curable composition
general formula
Prior art date
Application number
PCT/JP2018/022517
Other languages
French (fr)
Japanese (ja)
Inventor
貴文 中山
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Priority to JP2019525475A priority Critical patent/JP6887017B2/en
Publication of WO2018235688A1 publication Critical patent/WO2018235688A1/en
Priority to US16/715,952 priority patent/US10954183B2/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54Acrylic acid esters; Methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/604Polycarboxylic acid esters, the acid moiety containing more than two carboxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041Lenses

Definitions

  • the present invention relates to a curable composition, a semi-cured product obtained by curing the curable composition, and a cured product, an optical member and a lens including the cured product, and a compound used for the curable composition.
  • glass materials have been used for optical members of imaging modules such as cameras, video cameras, cellular phones with cameras, video phones, and door phones with cameras.
  • Glass materials have various optical properties and have been preferably used because they are excellent in environmental resistance, but they have the disadvantage that they are not easy to reduce in weight and size and have poor processability and productivity.
  • a resin cured product can be mass-produced and is excellent in processability, and has recently been used for various optical members.
  • the optical member used for the imaging module With the miniaturization of the imaging module.
  • the problem of chromatic aberration arises.
  • the Abbe number (vd) and the partial dispersion ratio ( ⁇ g, F) can be obtained by adding various additives to the curable composition to change the characteristics after curing. It is considered to make adjustments to correct the chromatic aberration.
  • Patent Document 1 describes a compound capable of providing an optical member having a high Abbe number ( ⁇ d) and a high partial dispersion ratio ( ⁇ g, F).
  • This compound has a 4,4'-bis (aryl) diphenyl sulfone skeleton, and after containing the compound itself in a matrix polymer or polymerizing or copolymerizing the compound, it is suitable for the production of a complex lens, etc. The use is described.
  • compounds having a skeleton similar to that of the 4,4'-bis (aryl) diphenyl sulfone skeleton their refractive index characteristics and applications to optical members have hardly been studied.
  • Patent Document 2 discloses a compound having a 4,4'-bis (piperazino) dibenzophenone skeleton, but this document only describes the usefulness as a photopolymerization initiator, None is mentioned about the usefulness as a compound for optical members.
  • a curable composition containing a compound represented by the following general formula (1) containing a compound represented by the following general formula (1).
  • R 1 to R 10 each independently represent a hydrogen atom or a substituent
  • At least one of R 1 to R 5 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent
  • At least one of R 6 to R 10 is a substituted or unsubstituted aryl group or a substituted or unsubstituted heteroaryl group.
  • R 1 and R 2 , R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 respectively They may be bonded to each other to form a linking group necessary to form a cyclic structure.
  • the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  • At least one of R 6 to R 10 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent
  • R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 each independently represent a hydrogen atom or a substituent other than an aryl group and a heteroaryl group
  • R 11 to R 20 each independently represent a hydrogen atom or a substituent
  • At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
  • R 1 and R 2 , R 4 and R 5 , R 6 and R 7 , R 9 and R 10 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 And R 17 , R 17 and R 18 , R 18 and R 19 , and R 19 and R 20 may be bonded to each other to form a linking group necessary to form a cyclic structure.
  • the molecule represented by the general formula (3) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  • Ac represents a (meth) acryloyloxy group
  • L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent
  • L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups
  • L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent
  • m1 represents an integer of 0 to 10
  • a plurality of L 1 s may be the same or different
  • a plurality of L 2 s may be the same or different May be
  • m2 represents 0 or 1
  • * represents a bonding site of a substituent containing a (meth) acryloyloxy group.
  • the substituent containing a (meth) acryloyloxy group is (meth) acryloyloxyalkoxy group, (meth) acryloyloxyalkoxyalkyl group, (meth) acryloyloxyalkoxycarbonylalkyl group, (meth) acryloyloxyalkoxycarbonylacyloxy
  • the curable composition as described in [8] which is a group or (meth) acryloyl oxy alkoxy carbonyl acyloxy alkyl group.
  • an optical member having good refractive index characteristics and excellent wet heat durability is provided. be able to.
  • a numerical range represented using “to” means a range including numerical values described before and after “to” as the lower limit value and the upper limit value.
  • the notations not describing substitution and non-substitution include those having no substituent and those having a substituent. That is, unless it is described as "unsubstituted", it includes those having no substituent and those having a substituent.
  • the "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • the carbon number of a group means the total carbon number including the carbon number of the substituent substituted to the group.
  • the carbon number of an alkyl group it means the total carbon number including the carbon number of the substituent substituted to the alkyl group.
  • “(meth) acrylate” represents acrylate and methacrylate
  • “(meth) acryloyloxy” represents acryloyloxy and methacryloyloxy.
  • the “substituent” means a monovalent atom or monovalent atomic group other than a hydrogen atom.
  • Preferred substituents include halogen atoms, hydroxyl groups, alkyl groups, alkenyl groups, alkoxy groups, alkylthio groups, acyl groups, acyloxy groups, alkoxycarbonyl groups, aryl groups, heteroaryl groups, aryloxy groups, heteroaryloxy groups, and aryl groups. Examples thereof include an oxycarbonyl group, a heteroaryloxycarbonyl group, an arylthio group, a heteroarylthio group, a cyano group and an amino group.
  • a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group can be mentioned.
  • the "halogen atom” is preferably a fluorine atom, a chlorine atom, a bromine atom or an iodine atom.
  • the "alkyl group” may be linear, branched or cyclic. In addition, two or more of the linear portion, the branched portion, and the cyclic portion may be mixed. Preferred are linear or branched alkyl groups.
  • the carbon number of the alkyl group can be, for example, 1 or more, 2 or more, 4 or more, 6 or more. Moreover, carbon number can be 30 or less, 20 or less, and 10 or less.
  • alkyl group examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, Examples thereof include 2-ethylhexyl group, cyclopentyl group, cyclohexyl group and cycloheptyl group.
  • the "alkenyl group” may be linear, branched or cyclic. In addition, two or more of the linear portion, the branched portion, and the cyclic portion may be mixed.
  • the carbon number of the alkenyl group can be, for example, 2 or more, 4 or more, 6 or more. Moreover, carbon number can be 30 or less, 20 or less, and 10 or less.
  • Specific examples of the alkenyl group include ethenyl group, n-propenyl group, isopropenyl group, n-butenyl group, isobutenyl group, t-butenyl group, n-pentenyl group, isopentenyl group, n-hexenyl group, isohexenyl group, Examples thereof include 2-ethylhexenyl group, cyclopentenyl group, cyclohexenyl group and cycloheptenyl group.
  • acyl group is a generic term for alkylcarbonyl group, arylcarbonyl group and heteroarylcarbonyl group.
  • acyloxy group is a generic term for an alkylcarbonyloxy group, an arylcarbonyloxy group and a heteroarylcarbonyloxy group.
  • the “aryl group” may be a group consisting of only one aromatic hydrocarbon ring or a group in which one or more rings are condensed to an aromatic hydrocarbon ring.
  • it is a group in which one or more rings are fused to an aromatic hydrocarbon ring, at least one of the aromatic hydrocarbon ring, the aliphatic hydrocarbon ring and the non-aromatic heterocycle is fused to the aromatic hydrocarbon ring Can be adopted.
  • the carbon number of the aryl group can be, for example, 6 or more and 10 or more. Moreover, carbon number can be 30 or less, 18 or less, 14 or less, 10 or less.
  • the aryl group examples include phenyl group, 1-naphthyl group and 2-naphthyl group.
  • the "heteroaryl group” may be a group consisting of only one heteroaromatic ring or a group in which one or more rings are condensed to a heteroaromatic ring.
  • it is a group in which one or more rings are fused to a heteroaromatic ring, at least one of an aromatic hydrocarbon ring, a heteroaromatic ring, an aliphatic hydrocarbon ring and a nonaromatic heterocycle is an aromatic hydrocarbon ring And the condensed group can be adopted.
  • the ring skeleton forming atom number of the heteroaryl group can be, for example, 5 or more, 6 or more, 9 or more, 10 or more. In addition, the number of ring skeleton-forming atoms can be 30 or less, 18 or less, 14 or less, or 11 or less.
  • the heteroaryl group may be a group bonded via a hetero atom or a group bonded via a carbon atom constituting a heteroaromatic ring.
  • a hetero atom which comprises the ring frame of the hetero aromatic ring of heteroaryl group a nitrogen atom, an oxygen atom, and a sulfur atom can be mentioned, for example.
  • heteroaryl group examples include 2-pyridyl group, 3-pyridyl group, 4-pyridyl group, 2-pyrimidyl group, 4-pyrimidyl group, 5-pyrimidyl group and triazinyl group.
  • the "amino group” in the present specification includes a dialkylamino group and a diarylamino group. Two alkyl groups constituting a dialkylamino group may be bonded to each other to form a cyclic structure, and two aryl groups constituting a diarylamino group may be bonded to each other to form a cyclic structure.
  • alkyl part of "alkoxy group” in the present specification Description and specific example of the alkyl part of "alkoxy group” in the present specification, description and specific example of the alkyl part of "alkylthio group” in the present specification, when “acyl group” in the present specification is an alkylcarbonyl group Description and specific examples of the alkyl moiety (a moiety obtained by removing a carbonyl group from an acyl group), an alkyl moiety (a moiety obtained by removing a carbonyloxy group from an acyl group) when the "acyloxy group” in the specification is an alkylcarbonyloxy group Description and specific examples, Description and specific examples of the alkyl part (the part which removed the oxycarbonyl group from the alkoxycarbonyl group) in the specification of this specification, the "amino group” in this specification is a dialkylamino group See the description and examples of alkyl groups above for each alkyl moiety at any given time.
  • heteroaryl moiety (the moiety obtained by removing a carbonyl group from an acyl group) when the "acyl group” in the present specification is a heteroarylcarbonyl group
  • the "acyloxy group” in the present specification is a heteroarylcarbonyloxy
  • Description and specific examples of a heteroaryl moiety (a moiety obtained by removing a carbonyloxy group from an acyl group) when it is a group
  • Description and illustrative examples of a heteroaryl part of the "heteroaryloxy group” in the present specification Description and specific examples of the heteroaryl part of the “heteroaryloxycarbonyl group” (the part in which the oxycarbonyl group has been removed from the heteroaryloxycarbonyl group)
  • description and specific examples of the heteroaryl part of the “heteroarylthio group” in the present specification For examples, see the descriptions and examples of heteroaryl groups above.
  • Rukoto can.
  • n- described before a chain substituent is an abbreviation for normal (straight chain)
  • t- is an abbreviation for tertiary.
  • monomer is a concept that is distinguished from oligomers and polymers, and refers to a monomer having a weight average molecular weight of 1,000 or less.
  • “refractive index (nd)”, “Abbe number ( ⁇ d)” and “partial dispersion ratio ( ⁇ g, F)” refer to a Calnew precision refractometer (Model No. KPR-2000, manufactured by Shimadzu Corporation). It is the value measured using. For the details of the measurement procedure, the descriptions in Examples 1 to 3 can be referred to.
  • the “refractive index (nd)” in the present specification is a refractive index at a wavelength of 587.56 nm.
  • “Abbe number ((nu) d)” and “partial dispersion ratio ((theta) g, F)” are values calculated by the following formula from the refractive index measurement value in a different wavelength.
  • d d (nd-1) / (nF-nC) ⁇ g
  • F (ng-nF) / (nF-nC)
  • nd represents a refractive index at a wavelength of 587.56 nm
  • nF represents a refractive index at a wavelength of 486.13 nm
  • nC represents a refractive index at a wavelength of 656.27 nm
  • ng represents a refractive index at a wavelength of 435.83 nm.
  • R 1 to R 10 each independently represent a hydrogen atom or a substituent.
  • at least one of R 1 to R 5 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent is there.
  • at least one of R 6 to R 10 is a substituted or unsubstituted aryl group or a substituted or unsubstituted heteroaryl group.
  • R 1 and R 2 , R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 Each may be bonded to each other to form a linking group necessary to form a cyclic structure.
  • the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  • the “aryl group substituted with a substituent containing a (meth) acryloyloxy group” taken by at least one of R 1 to R 5 or the “heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group” is It is an aryl group or heteroaryl group having at least one substituent containing one or more (meth) acryloyloxy groups.
  • it is an aryl group or heteroaryl group having at least one substituent containing one (meth) acryloyloxy group, more preferably one or two substituents containing one (meth) acryloyloxy group Or an aryl or heteroaryl group having one or more substituents, more preferably an aryl or heteroaryl group having one substituent containing one (meth) acryloyloxy group.
  • the aryl group or heteroaryl group may have a substituent other than the substituent including a (meth) acryloyloxy group.
  • Preferred examples of such a substituent include a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group.
  • R 1 to R 5 are “aryl groups substituted with a substituent containing a (meth) acryloyloxy group” or “hetero substituted with a substituent containing a (meth) acryloyloxy group” It is a case where it is “aryl group”, more preferably, one or two of R 1 to R 5 is “an aryl group substituted with a substituent including a (meth) acryloyloxy group”, more preferably This is the case where one of R 1 to R 5 is “an aryl group substituted by a substituent containing a (meth) acryloyloxy group”.
  • At least one of R 2 to R 4 is substituted with “an aryl group substituted with a (meth) acryloyloxy group-containing substituent” or a “(meth) acryloyloxy group-containing substituent It is preferable that it is "heteroaryl group”.
  • at least one of R 2 and R 4 is a “aryl group substituted with a (meth) acryloyloxy group-containing substituent” or a “heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent” If it is, it is preferable because the solubility is further improved.
  • R 1 to R 5 other than “aryl group substituted with a substituent containing a (meth) acryloyloxy group” or “heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group” are other than these It is a substituent or a hydrogen atom.
  • the number of substituents other than these is preferably 0 to 2 of R 1 to R 5 and may be, for example, 0 or 1.
  • the “aryl group” that can be taken by R 6 to R 10 may be an aryl group substituted with a substituent that includes a (meth) acryloyloxy group. In that case, it may be the same as or different from the “aryl group substituted with a substituent containing a (meth) acryloyloxy group” represented by any of R 1 to R 5 . Preferred is when it is the same group. Further, the "heteroaryl group” that can be taken by R 6 to R 10 may be a heteroaryl group substituted with a substituent including a (meth) acryloyloxy group.
  • R 7 to R 9 is preferably an aryl group, for example, at least one of R 7 and R 9 is an aryl group, or R 8 is an aryl group The case can be mentioned. If at least one of R 7 and R 9 is an aryl group, the solubility tends to further increase, which is preferable.
  • Ac represents a (meth) acryloyloxy group
  • L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent
  • L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups
  • L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent
  • m1 represents an integer of 0 to 10
  • a plurality of L 1 s may be the same or different
  • a plurality of L 2 s may be the same or different May be
  • m2 represents 0 or 1
  • * represents a bonding site of a substituent containing a (meth) acryloyloxy group.
  • Formula number of carbon atoms of the alkylene group L 1 can take the (4) is preferably from 2 to 6, 2 to 5 and more preferable.
  • ethylene group, 1-methylethylene group, 2-methylethylene group, n-propylene group, 2-methylpropylene group, 2,2-dimethylpropylene group and n-butylene group can be mentioned.
  • an alkylene group is described with the atom to be bonded to L 2 as the 1-position.
  • L 1 is a branched alkylene group, it is preferable in that the solubility is further improved.
  • m1 is preferably 1 to 5, more preferably 1 to 3, and may be 1 or 2. When m is 2 or more, a plurality of L 1 may be the same or different, but are preferably the same.
  • L 2 may also be the same or different, they are preferably the same.
  • the carbon number of the alkylene group that L 3 in the general formula (4) can be is preferably 1 to 6, and more preferably 1 to 3.
  • methylene group, ethylene group, 1-methylethylene group, 2-methylethylene group, n-propylene group can be mentioned.
  • the alkylene group is described with the atom bonded to L 3 or the atom on the * mark side of General Formula (4) as the first position.
  • m2 may be either 0 or 1, but when it is 1, the alkylene groups represented by L 1 and L 3 may be the same or different.
  • the following can be mentioned as specific examples of the linking group that L 2 of General Formula (4) can be.
  • each linking group indicates the bonding position to L 1
  • the ** mark on the right side indicates the bonding position to L 3 when m 2 is 1
  • m is 2 or more, a plurality of L 2 may be the same or different.
  • Examples of “substituent containing (meth) acryloyloxy group” include (meth) acryloyloxyalkoxy group, (meth) acryloyloxyalkoxyalkyl group, (meth) acryloyloxyalkoxycarbonylalkyl group, (meth) acryloyloxyalkoxycarbonyl An acyloxy group or a (meth) acryloyloxy alkoxycarbonyl acyloxyalkyl group can be mentioned.
  • the chain length of the “substituent containing (meth) acryloyloxy group” is preferably 7 to 20, and more preferably 8 to 15. By increasing the chain length to the preferred range, the solubility of the compound can be improved.
  • the position at which the “substituent containing a (meth) acryloyloxy group” is bonded to the aryl group or the heteroaryl group may be any position of these aryl groups or heteroaryl groups, but any one of positions 3 to 5 Preferably it is one or more.
  • the “aryl group substituted with a substituent containing a (meth) acryloyloxy group” or the “heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group” is bonded to benzophenone 1 It is written as an atom of rank.
  • the number of “substituents containing (meth) acryloyloxy group” in the compound represented by the general formula (1) is preferably 2 or more, more preferably 2 to 4, and still more preferably 2 or 3.
  • R 1 to R 10 are not the above-mentioned “aryl group substituted by a substituent containing a (meth) acryloyloxy group” or “heteroaryl group substituted by a substituent containing a (meth) acryloyloxy group” It may be a group.
  • aryl group substituted by a substituent containing a (meth) acryloyloxy group or “heteroaryl group substituted by a substituent containing a (meth) acryloyloxy group” It may be a group.
  • a substituent which does not contain a (meth) acryloyloxy group can be mentioned.
  • a hydroxyl group, an alkyl group, an alkoxy group, and an alkylthio group can be mentioned as a preferable thing in such a substituent.
  • an alkyl group or a group represented by the following general formula (5) can be mentioned.
  • T represents a hydrogen atom, a hydroxyl group or a halogen atom
  • L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent
  • L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups
  • L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent
  • m1 represents an integer of 0 to 10
  • a plurality of L 1 s may be the same or different
  • a plurality of L 2 s may be the same or different
  • May be m2 represents 0 or 1, and when T is a hydrogen atom and m1 is 0, m2 is 1; * Indicates a bonding site of the substituent represented by the general formula (5).
  • R 1 and R 2 in general formula (1), R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 And R 10 may be bonded to each other to form a linking group necessary to form a cyclic structure.
  • the cyclic structure formed may be an aromatic ring or a non-aromatic ring.
  • the cyclic structure to be formed may be a cyclic structure in which a ring skeleton forming atom is formed only of carbon atoms, or may be a cyclic structure including a hetero atom as a ring skeleton forming atom.
  • a cyclic structure in which the ring skeleton-forming atom is composed only of carbon atoms.
  • a benzene ring, a pyridine ring, a pyrimidine ring and a cyclohexene ring can be mentioned. These rings may be substituted by a substituent.
  • the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  • the compound represented by the general formula (1) has a conjugated system containing a benzophenone structure.
  • the number of atoms constituting one conjugated system including the benzophenone structure is preferably 24 to 38, more preferably 24 to 34, 34 is more preferable, and 26 to 32 is even more preferable.
  • By appropriately controlling the number of atoms constituting one conjugated system including the benzophenone structure it is possible to avoid the decrease in the solubility and the coloring of the compound.
  • 1 to 7 hetero atoms are preferably contained, and 1 to 5 hetero atoms are more preferably contained, for example, 1 to 3 It is also possible to include.
  • Symmetry The compounds represented by the general formula (1) are bonded to the left and right even if they are symmetrical compounds in which the groups bonded to the left and right of the carbonyl group described in the center of the general formula (1) are the same It may be an asymmetric compound in which the groups are different. Symmetrical compounds have the advantage of ease of synthesis.
  • the compound represented by the general formula (1) is preferably a compound represented by the following general formula (2).
  • R a and R b each independently represent a substituent other than an aryl group and a heteroaryl group
  • n1 and n2 each independently represent an integer of 0 to 4.
  • n1 is 2 or more
  • plural Ras may be the same or different
  • n2 is 2 or more
  • the plurality of R b may be the same or different
  • R 11 to R 20 each independently represent a hydrogen atom or a substituent
  • At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
  • the molecule represented by the general formula (2) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  • the compound represented by the general formula (2) is a compound having a structure in which one substituted phenyl group is substituted on each benzene ring of benzophenone.
  • the substitution position of the substituted phenyl group may be any position of the benzene ring of benzophenone.
  • Each benzene ring of benzophenone may be substituted with R a and R b which are substituents other than the aryl group and the heteroaryl group.
  • Substitution number n2 of substituents which n1 and R b in R a are each preferably independently 0-2, may be 0 or 1.
  • substitution position of the substituted phenyl group to each benzene ring of benzophenone is preferably either 3 to 5 or 3 'to 5', but the substitution position of R a and R b is 2 to 6 or 2 It may be any of the '6' positions.
  • R a and R b are not particularly limited as long as they are substituents other than an aryl group and a heteroaryl group, but preferably a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group can be mentioned, more preferably And examples thereof include an alkyl group and an alkoxy group.
  • substituents which Ra and Rb can take the group quoted as a specific example of the group represented with the said General formula (5) can be illustrated.
  • R 11 to R 15 At least one of R 11 to R 15 is a “substituent containing (meth) acryloyloxy group”.
  • the “substituent containing (meth) acryloyloxy group” is preferably any one or more of R 12 to R 14 .
  • R 12 it is preferable in that the solubility is good.
  • the remaining R 11 to R 15 other than the “substituent containing a (meth) acryloyloxy group” is a substituent other than the “substituent containing a (meth) acryloyloxy group” or a hydrogen atom.
  • R 11 to R 15 the number of substituents other than “a substituent containing a (meth) acryloyloxy group” is preferably 0 to 2, and may be 0 or 1.
  • a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group are preferable, and it is also preferable that these groups be substituted by an alkoxy group, an alkoxy alkylene oxy group, or a group having an alkylene oxy repeating unit.
  • R 11 to R 15 R 11 and R 15 are preferably hydrogen atoms.
  • R 16 to R 20 each independently represent a hydrogen atom or a substituent. At least one of R 16 to R 20 is preferably a substituent, and the substituent may be “a substituent containing a (meth) acryloyloxy group”, and at least one is a “(meth) acryloyloxy group” It is preferable that it is "a substituent containing The “substituent containing a (meth) acryloyloxy group” represented by at least one of R 16 to R 20 and the “substituent containing a (meth) acryloyloxy group” represented by at least one of R 11 to R 15 are the same. Although they may be different, they are preferably the same.
  • the number of substituents other than “a substituent containing a (meth) acryloyloxy group” that can be taken by R 16 to R 20 is preferably 0 to 2, and may be, for example, 0 or 1.
  • the carbon number of substituents other than “a substituent containing a (meth) acryloyloxy group” is preferably 1 to 10.
  • a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group are preferable, and it is also preferable that these groups be substituted by an alkoxy group, an alkoxy alkylene oxy group, or a group having an alkylene oxy repeating unit. .
  • R 16 to R 20 R 16 and R 20 are preferably hydrogen atoms.
  • the compounds represented by the general formula (1) include compounds represented by the following general formula (3).
  • R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 each independently represent a hydrogen atom or a substituent other than an aryl group and a heteroaryl group
  • R 11 to R 20 each independently represent a hydrogen atom or a substituent
  • At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
  • R 1 and R 2 , R 4 and R 5 , R 6 and R 7 , R 9 and R 10 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 And R 17 , R 17 and R 18 , R 18 and R 19 , and R 19 and R 20 may be bonded to each other to form a linking group necessary to form a cyclic structure.
  • the molecule represented by the general formula (3) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  • the compound represented by the general formula (3) is a compound having a structure in which a substituted phenyl group is substituted at the 4-position and 4'-position of benzophenone.
  • Descriptions and specific examples of R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 in the general formula (3) are the descriptions of R a and R b in the general formula (2) And specific examples can be referred to.
  • R 11 to R 20 in the general formula (3) the corresponding description of the general formula (2) can be referred to.
  • the corresponding description of the general formula (1) can be referred to.
  • the compounds represented by the general formula (1) can be synthesized by appropriately combining known synthetic methods. For example, a compound in which a halogen atom is substituted with a hydroxyphenyl group can be synthesized first by selecting benzophenone having a halogen atom-substituted position as a position to introduce a substituent as a starting material and reacting with benzophenone. .
  • the hydroxyl group of the synthesized compound is reacted with a hydroxyalkyl halide to convert the hydroxyl group to a hydroxyalkoxy group, and further reacted with an acryloyl halide to give an acryloyl group at the terminal, which is represented by the general formula (1)
  • Compounds can be synthesized. Each of these steps is a well-known synthesis reaction, and the reaction conditions and the like can be appropriately adjusted and optimized within a generally known range.
  • Examples 1 to 3 can be referred to.
  • the compound represented by the general formula (1) exhibits excellent refractive index properties without curing. That is, the compound represented by the general formula (1) exhibits a high refractive index (nd), a low Abbe number ( ⁇ d), a high partial dispersion ratio ( ⁇ g, F), and a compound for an optical member without curing the compound. It is also possible to use as.
  • the Abbe number (dd) of the compound represented by the general formula (1) is not particularly limited, the Abbe number of the film formed by dissolving the compound in an appropriate solvent such as propylene glycol monomethyl ether acetate is It is preferably 25 or less, more preferably 20 or less, still more preferably 19 or less, and particularly preferably 18 or less.
  • the partial dispersion ratio ( ⁇ g, F) of the compound represented by the general formula (1) is not particularly limited, but the Abbe number of the film formed by dissolving the compound in an appropriate solvent is the partial dispersion
  • the ratio ( ⁇ g, F) is preferably 0.70 or more, more preferably 0.73 or more, and still more preferably 0.77 or more.
  • a compound When using as a compound for optical members, without hardening the compound represented by General formula (1), a compound can be disperse
  • the matrix polymer the materials described in paragraph 0098 of JP 2012-167019 A, which is incorporated herein by reference as part of the present specification, can be used. These materials may be used alone or in combination of two or more.
  • the content of the compound is preferably 1 to 70% by mass, and more preferably 5 to 50% by mass.
  • the compound represented by the curable composition general formula (1) By curing the compound represented by the curable composition general formula (1), it is possible to form a cured product excellent in refractive index characteristics and also excellent in wet heat stability. In the case of curing, it is preferable to prepare a curable composition containing the compound represented by the general formula (1) and cure it.
  • the content of the compound represented by the general formula (1) in the curable composition is preferably 1 to 99% by mass, and preferably 10 to 90% by mass, based on the total mass of the curable composition. More preferably, it is 20 to 80% by mass.
  • the curable composition can contain various components in addition to the compound represented by the general formula (1).
  • (meth) acrylate monomers other than the compound represented by General formula (1), a polymerization control agent, and a polymerization initiator can be preferably contained.
  • the polymerization initiator it is preferable to use at least one selected from a photo radical polymerization initiator and a thermal radical polymerization initiator.
  • the curable composition can also contain a polymer having a radically polymerizable group in the side chain.
  • the (meth) acrylate monomer that can be used in the curable composition of the present invention may be a polyfunctional (meth) acrylate monomer having two or more (meth) acryloyl groups in the molecule, and It may be a monofunctional (meth) acrylate monomer having two (meth) acryloyl groups.
  • Specific examples of the (meth) acrylate monomer include the (meth) acrylate monomers described in paragraphs 0037 to 0046 of JP 2012-107191 A, which are incorporated herein by reference as a part of this specification.
  • Examples of (meth) acrylate monomers that can be preferably used in the present invention include monofunctional (meth) acrylate monomers having an aromatic ring represented by monomer 1 (phenoxyethyl acrylate) or monomer 2 (benzyl acrylate), and monomer 3 Bifunctional (meth) acrylate monomer having an aliphatic ring represented by (tricyclodecane dimethanol diacrylate), monofunctional (meth) acrylate monomer having an aliphatic ring represented by monomer 4 (dicyclopentanyl acrylate) Can be mentioned.
  • the molecular weight of the (meth) acrylate monomer is preferably 100 to 500.
  • the content of the (meth) acrylate monomer is preferably 1 to 80% by mass with respect to the total mass of the curable composition, It is more preferably 2 to 50% by mass, and still more preferably 3 to 40% by mass.
  • a compound having a function of controlling the polymerization of the polymerizable component of the curable composition can be used as a polymerization control agent.
  • a preferable polymerization control agent for example, a non-conjugated vinylidene group-containing compound can be adopted.
  • the non-conjugated vinylidene group-containing compound the compounds described in paragraphs 0016 to 0033 of JP 2012-107191 A, which are incorporated herein by reference as a part of this specification, can be used.
  • the molecular weight of the non-conjugated vinylidene group-containing compound is preferably 100 to 400, more preferably 120 to 350, and particularly preferably 130 to 300.
  • the acquisition method of a nonconjugated vinylidene group containing compound You may obtain commercially and may manufacture synthetically. When obtained commercially, for example, ⁇ -caryophyllene (manufactured by Inoue Perfume Manufacturing Co., Ltd.) or (+)-Limonen (manufactured by Tokyo Chemical Industry Co., Ltd.) can be preferably used.
  • the curable composition of the present invention contains a non-conjugated vinylidene group-containing compound
  • the content of the non-conjugated vinylidene group-containing compound is 0.5 to 30% by mass based on the total mass of the curable composition. Is preferable, 1 to 25% by mass is more preferable, and 2 to 20% by mass is more preferable.
  • thermal radical polymerization initiator As a thermal radical polymerization initiator which can be used for the curable composition of the present invention, for example, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) cyclohexane, 2, 2-di (4,4-di- (t-butylperoxy) cyclohexyl) propane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butyl peroxy laurate , Dicumyl peroxide, di-t-butyl peroxide, t-butylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, cumene hydroperoxide, t-butyl hydroperoxide, t-Butylperoxy-2-e
  • the curable composition of the present invention preferably contains a hydroperoxide compound as a thermal radical polymerization initiator.
  • the hydroperoxide compound is a peroxide and is a compound having a peroxy group.
  • one oxygen atom of a peroxy group (—O—O—) is substituted with a hydrogen atom, and includes a hydroperoxide group (—O—O—H).
  • the hydroperoxide compound having a hydroperoxide group in the molecule has the effect of promoting chain transfer during polymerization of the non-conjugated vinylidene group-containing compound, and the controllability of the three-dimensional structure when the curable composition cures is more It is possible to improve and impart deformability to the semi-cured product.
  • thermal radical polymerization initiator it is preferable to contain a hydroperoxide compound and other thermal radical polymerization initiators.
  • thermal radical polymerization initiators non-hydroperoxide compounds can be mentioned.
  • the hydroperoxide compound generally contains a non-hydroperoxide compound having a low thermal polymerization initiation temperature, since the temperature for initiating the thermal radical polymerization is generally high.
  • non-hydroperoxide compound t-butylperoxy-2-ethylhexanoate (manufactured by Nippon Oil and Fats Co., Ltd., Perbutyl O), t-butylperoxy-2-ethylhexyl carbonate (manufactured by Nippon Oil and Fats Co., Ltd., Perbutyl E) It is preferable to use a peroxyester compound such as
  • the content of the thermal radical polymerization initiator is preferably 0.01 to 10% by mass, and more preferably 0.05 to 5.0% by mass, based on the total mass of the curable composition. More preferably, it is 0.05 to 2.0% by mass.
  • radical photopolymerization initiator As a radical photopolymerization initiator which can be used for the curable composition of the present invention, for example, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,6-dimethylbenzoyl) ) -2,4,4-trimethylpentyl phosphine oxide, bis (2,4,6-trimethyl benzoyl) -2,4,4-trimethylpentyl phosphine oxide, bis (2,6-dichloro benzoyl) -2,4 , 4-trimethylpentyl phosphine oxide, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane- 1-one, 1,2-diphenylethanedione, methylphenylglyoxyl , 1- [4- (2
  • IRGACURE 184 (1-hydroxycyclohexyl phenyl ketone), IRGACURE 819 (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide), IRGACURE 651, manufactured by BASF AG, as a photo radical polymerization initiator.
  • IRGACURE 184 (1-hydroxycyclohexyl phenyl ketone
  • IRGACURE 819 bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide
  • IRGACURE 651 manufactured by BASF AG
  • UV polymerization initiator 2,2-dimethoxy-1,2-diphenylethane-1-one
  • 2-Methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one can be preferably used.
  • the content of the photoradical polymerization initiator is preferably 0.01 to 5.0% by mass, and more preferably 0.05 to 1.0% by mass, based on the total mass of the curable composition. Preferably, it is more preferably 0.05 to 0.5% by mass.
  • a curable composition contains both an optical radical polymerization initiator and a thermal radical polymerization initiator, and in this case, the total content of an optical radical polymerization initiator and a thermal radical polymerization initiator is a curable composition. 0.01 to 10% by mass, preferably 0.05 to 5.0% by mass, and more preferably 0.05 to 3.0% by mass with respect to the total mass of More preferable.
  • the polymer having a radically polymerizable group in the side chain functions to increase the viscosity of the curable composition, and thus functions as a thickener or a thickening polymer. Therefore, it is possible to adjust the viscosity of the curable composition within a desired range by adding an appropriate amount of a polymer having a radically polymerizable group in the side chain to the curable composition.
  • the polymer having a radically polymerizable group in the side chain may be a homopolymer or a copolymer.
  • the polymer having a radically polymerizable group in the side chain is preferably a copolymer.
  • the polymer having a radically polymerizable group in the side chain is a copolymer, at least one of the copolymer components may have a radically polymerizable group.
  • the polymer which has a radically polymerizable group in a side chain is a copolymer, it contains the monomer unit which has a radically polymerizable group in a side chain, and the monomer unit which has an aryl group in a side chain. It is more preferable that it is a copolymer.
  • a (meth) acrylate group a vinyl group, a styryl group, an allyl group etc.
  • the polymer having a radically polymerizable group in the side chain preferably contains 5 to 100% by mass, and more preferably 10 to 90% by mass of repeating units having a radically polymerizable group. And 20 to 80% by mass is more preferable.
  • the polymer having a radically polymerizable group in a side chain preferably used in the present invention will be listed, but the polymer having a radically polymerizable group in a side chain is not limited to the following structure .
  • Ra and Rb each independently represent hydrogen or a methyl group.
  • several Ra in one polymer may be the same or different.
  • n represents an integer of 0 to 10, preferably 0 to 2, and more preferably 0 or 1.
  • the molecular weight (weight average molecular weight) of the polymer having a radically polymerizable group in the side chain is preferably 1,000 to 10,000,000, and more preferably 5,000 to 300,000. More preferably, it is 2,000 to 200,000.
  • the glass transition temperature of the polymer having a radically polymerizable group in the side chain is preferably 50 to 400 ° C., more preferably 70 to 350 ° C., and still more preferably 100 to 300 ° C. .
  • the content of the polymer having a radically polymerizable group in the side chain is preferably 40% by mass or less, more preferably 30% by mass or less, based on the total mass of the curable composition. It is further preferable that the content is less than or equal to%. In addition, 0 mass% may be sufficient as content of the polymer which has a radically polymerizable group in a side chain, and the aspect which does not add the polymer which has a radically polymerizable group in a side chain is also preferable.
  • the curable composition may contain additives such as polymers, monomers, dispersants, plasticizers, heat stabilizers, and mold release agents other than the components described above unless it is not against the spirit of the present invention.
  • the viscosity of the curable composition of the present invention is preferably 20,000 mPa ⁇ s or less, more preferably 15,000 mPa ⁇ s or less, and still more preferably 13,000 mPa ⁇ s or less. It is particularly preferable that the viscosity is not more than 1,000 mPa ⁇ s.
  • the viscosity of the curable composition is preferably 2,000 mPa ⁇ s or more, more preferably 3,000 mPa ⁇ s or more, and still more preferably 4,000 mPa ⁇ s or more, 5, It is particularly preferable that the viscosity is at least 000 mPa ⁇ s.
  • a cured product can be produced by curing the curable composition of the present invention. At the time of producing a cured product, at least one of the step of photocuring and the step of thermally curing is performed. In addition, when producing a cured product, a step of forming a semi-cured product by irradiating the curable composition with light or heating the curable composition and irradiating the resulting semi-cured product with light Alternatively, it is preferable to sequentially perform the steps of forming a cured product by heating the semi-cured product.
  • the step of forming the semi-cured product first includes a transfer step.
  • the transfer step is a step of pressing a mold against the curable composition described above.
  • the other mold is pressed against the curable composition injected into one of the pair of molds to push and spread the curable composition.
  • cured material is what the chromium nitride process was given. As a result, good mold releasability can be obtained in the subsequent mold release step, and the manufacturing efficiency of the optical member can be enhanced.
  • Examples of the chromium nitride treatment include a method of forming a chromium nitride film on the surface of a mold.
  • a method of forming a chromium nitride film on the surface of a mold for example, there are a CVD (Chemical Vapor Deposition) method and a PVD (Physical Vapor Deposition) method.
  • the CVD method is a method of forming a chromium nitride film on the surface of a substrate by reacting a source gas containing chromium and a source gas containing nitrogen at a high temperature.
  • the PVD method is a method (arc vacuum deposition method) of forming a chromium nitride film on a substrate surface using arc discharge.
  • a cathode (evaporation source) made of, for example, chromium is disposed in a vacuum vessel, and arc discharge is caused between the cathode and the wall of the vacuum vessel through a trigger to evaporate the cathode.
  • metal ionization is performed by arc plasma, a negative voltage is applied to the substrate, and the reaction gas, for example, nitrogen gas, is put into a vacuum vessel at several tens mTorr (1.33 Pa) to ionize the metal and the reaction gas. It is a method of making it react on the surface of to make a film of a compound.
  • the chromium nitride treatment of the mold surface in the present specification is carried out by the above-mentioned CVD method or PVD method.
  • the mold is generally combined with two molds and can be heated while pressurizing the contents, and when a composition of low viscosity is injected into the mold, the mold clearance is obtained. Cause a leak.
  • the curable composition injected into the mold preferably has a viscosity of a certain level or more.
  • a polymer having the above-described radical polymerizable group in the side chain may be added to the curable composition.
  • a step of forming a semi-cured product is performed.
  • the semi-cured product is obtained by semi-curing the curable composition injected into the mold.
  • light irradiation or heating is performed.
  • such a process can also be referred to as a semi-curing process.
  • the step of forming the semi-cured product at least one of light irradiation and heating is performed on the curable composition of the present invention to obtain a half of complex viscosity of 10 5 to 10 8 mPa ⁇ s at 25 ° C. and 10 Hz frequency. It is preferable to form a cured product.
  • the term "semi-cured product” refers to a product obtained by polymerizing the curable composition, not completely solid, and having a certain degree of fluidity.
  • the complex viscosity of the polymer of the curable composition at 10 ° C. and a frequency of 10 Hz is 10 5 to 10 8 mPa ⁇ s
  • the polymer is a semi-cured product. That is, up to less than 1.0 ⁇ 10 9 mPa ⁇ s can be regarded as a semi-cured product as the upper limit value of the complex viscosity at 25 ° C. and a frequency of 10 Hz.
  • the "cured product” is a product obtained by curing the curable composition by polymerization and means a product in a completely solid state.
  • the light used for light irradiation is preferably ultraviolet light or visible light, and more preferably ultraviolet light.
  • the atmosphere at the time of light irradiation is preferably air or an inert gas replacement atmosphere, and more preferably an atmosphere purged with nitrogen until the oxygen concentration is 1% or less.
  • the heating and semi-curing step when the heating and semi-curing step is provided, the heating and semi-curing should be carried out so that the complex viscosity at 25 ° C. and frequency 10 Hz of the semi-cured product after heating is 10 5 to 10 8 mPa ⁇ s. preferable.
  • the present invention may relate to a semi-cured product produced by the method described above.
  • a semi-cured product can be preferably used in the method for producing a cured product described later.
  • the preferred range of the complex viscosity of the semi-cured product is the same as the preferred range of the complex viscosity of the semi-cured product in the step of forming the semi-cured product described above.
  • the photo radical polymerization initiator may be consumed and may not be contained at all, and the photo radical polymerization initiator may remain.
  • the glass transition temperature of the semi-cured product is preferably ⁇ 150 to 0 ° C., more preferably ⁇ 50 to 0 ° C., and particularly preferably ⁇ 20 to 0 ° C.
  • the step of forming the cured product includes a polymerization step of obtaining the cured product by putting the semi-cured product in a mold and deforming under pressure, heating and thermally polymerizing, or photopolymerization by light irradiation. Is preferred. Such a process can also be referred to herein as a curing process.
  • the conditions for light irradiation and the heating conditions in the step of forming a cured product are the same as the conditions in the above-described semi-curing step.
  • the mold used in the polymerization step is also referred to as a thermoforming mold.
  • a thermoforming mold is preferably configured to be capable of heating while pressing the contents while combining two molds.
  • a thermoforming molding die for example, the one described in JP-A-2009-126011 can be used.
  • die is what chromium nitride process was given.
  • the semi-cured product placed in the mold is pressure-deformed and heated to thermally polymerize to obtain a cured product.
  • pressure deformation and heating may be performed simultaneously, heating may be performed after pressure deformation, and pressure deformation may be performed after heating. Among them, pressure deformation and heating may be performed. It is preferable to carry out simultaneously. Moreover, it is also preferable to perform heating at a higher temperature after the pressurization is stabilized after simultaneously performing the pressure deformation and the heating.
  • the semi-cured product is cured by heating at a temperature of 150 ° C. or higher to obtain a cured product.
  • the heating temperature is 150 ° C. or higher, preferably 160 to 270 ° C., more preferably 165 to 250 ° C., and still more preferably 170 to 230 ° C.
  • the pressure in the pressure deformation is preferably 0.098 MPa to 9.8 MPa, more preferably 0.294 MPa to 4.9 MPa, and particularly preferably 0.294 MPa to 2.94 MPa.
  • the thermal polymerization time is preferably 30 to 1000 seconds, more preferably 30 to 500 seconds, and particularly preferably 60 to 300 seconds.
  • the atmosphere at the time of thermal polymerization is preferably air or an inert gas-substituted atmosphere, and more preferably an atmosphere purged with nitrogen to an oxygen concentration of 1% or less.
  • a release step is provided.
  • thermal polymerization is performed in the curing step, it is preferable to separate the mold from the cured product in a temperature range of 150 to 250 ° C. in the release step.
  • the temperature in the release step within the above range, the mold can be easily separated from the cured product, and the production efficiency can be enhanced.
  • the composition of the present invention is not limited to this, and can be changed suitably in the range which does not deviate from the present invention.
  • the mold used in the transfer step and the semi-curing step may be used as it is in the curing step, and after performing the semi-curing step, the mold is pulled away from the semi-cured product It may be moved to a (thermoforming mold) to carry out a curing step.
  • a (thermoforming mold) it is preferable that the above-described chromium treatment is applied to the mold used in the semi-curing step and the curing step.
  • the curable composition in the mold may be irradiated with light and heated.
  • the semi-cured product preferably has a complex viscosity of 10 5 to 10 8 mPa ⁇ s at 25 ° C. and a frequency of 10 Hz.
  • the cured product of the present invention obtained by curing the curable composition containing the compound represented by the general formula (1) has excellent refractive index characteristics and wet heat durability. That is, the cured product of the present invention has a high refractive index (nd), a low Abbe number (vd), and a high partial dispersion ratio ( ⁇ g, F).
  • the Abbe number ( ⁇ d) of the cured product of the present invention is not particularly limited, but is preferably 30 or less, more preferably 27 or less, still more preferably 25 or less, and 23 or less. Being particularly preferred. By keeping the Abbe number (vd) low, it is possible to correct chromatic aberration over a wide wavelength range.
  • the partial dispersion ratio ( ⁇ g, F) of the cured product of the present invention is also not particularly limited, but is preferably 0.68 or more, more preferably 0.70 or more, and 0.72 It is more preferable that it is more than. By increasing the partial dispersion ratio ( ⁇ g, F), it is possible to effectively correct the chromatic aberration particularly at a short wavelength.
  • the cured product of the present invention is also excellent in wet heat durability. Therefore, it can be effectively used for a lens etc. which may be used under high temperature and high humidity.
  • the cured product of the present invention preferably has a maximum thickness of 0.1 to 10 mm.
  • the maximum thickness is more preferably 0.1 to 5 mm, particularly preferably 0.15 to 3 mm.
  • the cured product of the present invention preferably has a maximum diameter of 1 to 1000 mm.
  • the maximum diameter is more preferably 2 to 200 mm, particularly preferably 2.5 to 100 mm.
  • the present invention also relates to an optical member containing the above-mentioned cured product.
  • the cured product of the present invention is a molded product having excellent optical properties, and thus is preferably used for an optical member.
  • the type of the optical member of the present invention is not particularly limited. In particular, it can be suitably used as an optical member utilizing the excellent optical properties of the curable composition, in particular, an optical member transmitting light (so-called passive optical member).
  • optical functional device for example, various display devices (liquid crystal display, plasma display, etc.), various projector devices (OHP (Overhead projector), liquid crystal projector, etc.), optical fiber communication devices (optical waveguide, An optical amplifier etc.), a camera, an imaging device such as a video, etc. are exemplified.
  • display devices liquid crystal display, plasma display, etc.
  • projector devices OHP (Overhead projector), liquid crystal projector, etc.
  • optical fiber communication devices optical waveguide, An optical amplifier etc.
  • a camera an imaging device such as a video, etc.
  • a passive optical member used for an optical function apparatus a lens, a prism, a prism sheet, a panel (plate-shaped molded object), a film, an optical waveguide (film shape, fiber shape etc.), an optical disk, sealing of LED is mentioned, for example.
  • An agent etc. are illustrated.
  • Such a passive optical member may be provided with an optional coating layer, for example, a protective layer for preventing mechanical damage to the coated surface due to friction or abrasion, an undesirable wavelength of an inorganic particle, a base material, etc.
  • a light absorption layer that absorbs light a transmission shielding layer that suppresses or prevents transmission of reactive low molecules such as moisture and oxygen gas, an antiglare layer, an antireflective layer, a low refractive index layer, etc. It may be provided.
  • the optional covering layer include a transparent conductive film or a gas barrier film formed of an inorganic oxide coating layer, a gas barrier film or a hard coat film formed of an organic coating layer, and the like.
  • a coating method for forming a coating layer well-known coating methods, such as a vacuum evaporation method, CVD method, sputtering method, a dip coating method, a spin coat method, can be used.
  • the optical member using the cured product of the present invention is particularly preferably used for a lens substrate.
  • a lens substrate produced using the curable composition of the present invention has a low Abbe number, and preferably has high refractive index, light transmittance, and light weight, and is excellent in optical properties. Moreover, it is possible to adjust the refractive index of a lens base material arbitrarily by adjusting the kind of monomer which comprises a curable composition suitably.
  • "lens substrate” means a single member capable of exhibiting a lens function. A film or a member can be provided on the surface or the periphery of the lens base according to the use environment or application of the lens.
  • a protective film, an antireflective film, a hard coat film or the like can be formed on the surface of the lens substrate. Moreover, it can be set as the composite lens laminated
  • these films, frames, and the like are members added to the lens base material, and are distinguished from the lens base material itself referred to in the present specification.
  • the lens substrate When the lens substrate is used as a lens, the lens substrate itself may be used alone as a lens, or the above-described film or frame, or any other lens substrate may be added and used as a lens.
  • the type and shape of the lens using the lens substrate are not particularly limited.
  • the lens substrate is preferably used for an imaging lens such as a mobile phone or a digital camera, a television, an imaging lens such as a video camera, and an in-vehicle lens or an endoscope lens.
  • the reaction mixture was diluted with ethyl acetate, washed with water, saturated aqueous sodium hydrogen carbonate solution and saturated brine in this order, and the organic layer was dried over magnesium sulfate. After magnesium sulfate was removed by filtration, the residue was purified by silica gel column chromatography using hexane / ethyl acetate as a developing solvent to obtain 15.0 g of compound A-17.
  • the 1 H-NMR (Nuclear Magnetic Resonance) data of Compound A-17 were as follows.
  • Comparative example 1 A compound having the following structure was synthesized by the method described in JP-A-2014-43565. This was taken as comparative compound 1.
  • This evaluation substrate is processed into a V-shape, and the refractive index (nF), Abbe number (dd) and partial dispersion ratio ( ⁇ g, F) of each sample are measured by a Carnew precision refractometer (manufactured by Shimadzu Corporation, model number) It measured using KPR-2000). The measurement was performed three times for each sample, and the average value was taken as the measurement result. The results are shown in Table 1.
  • the compounding quantity of each component described in Table 2 is represented by mass%.
  • the details of the photopolymerization initiator and the thermal polymerization initiator described in Table 2 are as follows. Irgacure 819 (manufactured by BASF) Bis (2,4,6-trimethyl benzoyl) phenyl phosphine oxide Perbutyl O (manufactured by NOF Corporation) t-Butylperoxy 2-ethylhexanoate Park Mill H-80 (manufactured by NOF Corporation) Cumene hydroperoxide
  • Examples 1 to 4 are preferable because the refractive index (nF) is equal to or higher than that of Comparative Example 1, the Abbe number ( ⁇ ⁇ d) is low, and the partial dispersion ratio ( ⁇ g, F) is high. It was confirmed to have the characteristics. As shown in Table 2, in Examples 5 to 8, it was confirmed that the wet heat durability was remarkably improved as compared with Comparative Example 2. Further, in comparison between Examples 7 and 8 and Comparative Example 2 in which the amount of copolymerized monomer is the same, Examples 7 and 8 have equal or higher refractive index (nF) and lower Abbe number ( ⁇ d), It was confirmed that the partial dispersion ratio ( ⁇ g, F) is high and that it has desirable characteristics.
  • Example 9 Production of Composite Lens 200 mg of the curable composition obtained in Example 7 in a mold having a surface treated with chromium nitride (the surface in contact with the curable composition has an aspheric shape)
  • a transparent glass lens (glass material BK-7, diameter 33 mm, center thickness 3 mm, surface in contact with the curable composition) so as to cover all the surfaces of the curable composition on the side not in contact with the molding die.
  • a convex lens having a radius of curvature of 44.3 mm and a radius of curvature of the surface not in contact with the curable composition of 330.9 mm was placed on the surface, and the curable composition was spread so as to have a diameter of 30 mm.

Abstract

The present invention addresses the problem of developing: a compound which enables the achievement of an optical member that has good refractive index characteristics and high wet heat durability; and a curable composition. The present invention relates to: a compound represented by general formula (1); a curable composition which contains this compound; a semi-cured product; a cured product; an optical member; and a lens. In the formula, at least one of R1-R5 moieties represents a heteroaryl group or an aryl group that is substituted by a substituent containing a (meth)acryloyloxy group; and at least one of R6-R10 moieties represents an aryl group or a heteroaryl group. AA General formula (1)

Description

硬化性組成物、半硬化物、硬化物、光学部材、レンズ及び化合物Curable composition, semi-cured product, cured product, optical member, lens and compound
 本発明は、硬化性組成物、その硬化性組成物を硬化させた半硬化物及び硬化物、その硬化物を含む光学部材及びレンズ、並びに硬化性組成物に用いられる化合物に関する。 The present invention relates to a curable composition, a semi-cured product obtained by curing the curable composition, and a cured product, an optical member and a lens including the cured product, and a compound used for the curable composition.
 従来、カメラ、ビデオカメラあるいはカメラ付携帯電話、テレビ電話あるいはカメラ付ドアホンなどの撮像モジュールの光学部材にはガラス材料が用いられていた。ガラス材料は様々な光学特性を備えており、環境耐性に優れるため好ましく用いられてきたが、軽量化や小型化が容易ではなく、加工性や生産性が悪いという欠点を有していた。これに対し、樹脂硬化物は、大量生産が可能であり、加工性にも優れているため、近年、様々な光学部材に用いられるようになってきている。 Conventionally, glass materials have been used for optical members of imaging modules such as cameras, video cameras, cellular phones with cameras, video phones, and door phones with cameras. Glass materials have various optical properties and have been preferably used because they are excellent in environmental resistance, but they have the disadvantage that they are not easy to reduce in weight and size and have poor processability and productivity. On the other hand, a resin cured product can be mass-produced and is excellent in processability, and has recently been used for various optical members.
 近年、撮像モジュールの小型化に伴い、撮像モジュールに用いられる光学部材を小型化することが求められているが、光学部材を小型化していくと、色収差の問題が生じる。このため、樹脂硬化物を用いた光学部材においては、硬化性組成物に種々の添加物を加えて硬化後の特性を変えることで、アッベ数(νd)や部分分散比(θg,F)を調整して色収差の補正を行うことが検討されている。 In recent years, it has been required to miniaturize the optical member used for the imaging module with the miniaturization of the imaging module. However, as the optical member is miniaturized, the problem of chromatic aberration arises. For this reason, in the optical member using the resin cured product, the Abbe number (vd) and the partial dispersion ratio (θg, F) can be obtained by adding various additives to the curable composition to change the characteristics after curing. It is considered to make adjustments to correct the chromatic aberration.
 特許文献1には、アッベ数(νd)と部分分散比(θg,F)がともに高い光学部材を提供することができる化合物が記載されている。この化合物は、4,4’-ビス(アリール)ジフェニルスルホン骨格を有するものであり、化合物そのものをマトリックスポリマーに含有させたり、化合物を重合又は共重合させたりしたうえで、複合レンズの製造等に用いることが記載されている。
 一方、4,4’-ビス(アリール)ジフェニルスルホン骨格と類似の骨格を有する化合物については、その屈折率特性や光学部材への応用がほとんど検討されていない。例えば、特許文献2には、4,4’-ビス(ピペラジノ)ジベンゾフェノン骨格を有する化合物が開示されているが、この文献には光重合開始剤としての有用性が記載されているだけで、光学部材用の化合物としての有用性についてはまったく触れられていない。
Patent Document 1 describes a compound capable of providing an optical member having a high Abbe number (νd) and a high partial dispersion ratio (θg, F). This compound has a 4,4'-bis (aryl) diphenyl sulfone skeleton, and after containing the compound itself in a matrix polymer or polymerizing or copolymerizing the compound, it is suitable for the production of a complex lens, etc. The use is described.
On the other hand, for compounds having a skeleton similar to that of the 4,4'-bis (aryl) diphenyl sulfone skeleton, their refractive index characteristics and applications to optical members have hardly been studied. For example, Patent Document 2 discloses a compound having a 4,4'-bis (piperazino) dibenzophenone skeleton, but this document only describes the usefulness as a photopolymerization initiator, Nothing is mentioned about the usefulness as a compound for optical members.
特開2012-167019号公報JP, 2012-167019, A WO2016/111923号公報WO 2016/111923
 本発明者らが特許文献1に記載される光学部材を追試したところ、高温高湿下に置かれたときの湿熱耐久性に課題があることが見いだされた。レンズは装着する素子や機器によっては、高温高湿下で使用されることがあるため、湿熱耐久性に課題があることはレンズの用途に大きな制約が生じることを意味する。また、特許文献2に記載の類似化合物についても、その構造から、湿熱耐久性に課題があり、屈折率特性も劣ることが予測される。
 このような従来技術の課題を解決するために、本発明者らは優れた屈折率特性を有していながら湿熱耐久性にも優れた光学部材を開発することと、そのような光学部材を提供しうる化合物と硬化性組成物を開発することを目的として鋭意検討を進めた。
When the present inventors re-tested the optical member described in Patent Document 1, it was found that there is a problem in wet heat durability when placed under high temperature and high humidity. Since the lens may be used under high temperature and high humidity depending on the element or device to be attached, the problem of the wet heat durability means that the application of the lens is greatly restricted. Moreover, also about the similar compound of patent document 2, it has a subject in wet heat durability from the structure, and it is estimated that a refractive index characteristic is also inferior.
In order to solve such problems of the prior art, the present inventors have developed an optical member having excellent refractive index characteristics and also excellent in wet heat durability, and providing such an optical member. We have made intensive studies to develop possible compounds and curable compositions.
 鋭意検討を進めた結果、本発明者らは、ビス(アリール)ベンゾフェノン骨格を有する化合物を用いれば、湿熱耐久性に優れているうえに、屈折率特性も良好な光学部材を提供できることを見いだした。その結果、上記の課題を解決するための具体的手段として以下の発明を提供するに至った。 As a result of intensive studies, the present inventors have found that use of a compound having a bis (aryl) benzophenone skeleton can provide an optical member having excellent wet heat durability and good refractive index characteristics. . As a result, the following invention has been provided as a specific means for solving the above problems.
[1] 下記一般式(1)で表される化合物を含む、硬化性組成物。
Figure JPOXMLDOC01-appb-C000006
一般式(1)において、
 R~R10は、各々独立に、水素原子又は置換基を表し、
 R~Rの少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基、又は、(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基であり、
 R~R10の少なくとも1つは、置換もしくは無置換のアリール基、又は、置換もしくは無置換のヘテロアリール基である。
 RとR、RとR、RとR、RとR、RとR、RとR、RとR、RとR10は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(1)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
[2] R~R10の少なくとも1つが、(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基、又は、(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基である、[1]に記載の硬化性組成物。
[3] 化合物が下記一般式(2)で表される、[1]に記載の硬化性組成物。
Figure JPOXMLDOC01-appb-C000007
一般式(2)において、
 R及びRは、各々独立に、アリール基及びヘテロアリール基以外の置換基を表し、
 n1及びn2は、各々独立に0~4の整数を表し、n1が2以上であるとき、複数のRは同一であっても異なっていてもよく、また、n2が2以上であるとき、複数のRは同一であっても異なっていてもよく、
 R11~R20は、各々独立に、水素原子又は置換基を表し、
 R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
 R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのR、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのRは、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(2)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
[4] 化合物が下記一般式(3)で表される、[1]に記載の硬化性組成物。
Figure JPOXMLDOC01-appb-C000008
一般式(3)において、
 R、R、R、R、R、R、R及びR10は、各々独立に、水素原子を表すか、あるいは、アリール基及びヘテロアリール基以外の置換基を表し、
 R11~R20は、各々独立に、水素原子又は置換基を表し、
 R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
 RとR、RとR、RとR、RとR10、R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(3)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
[5] R12が(メタ)アクリロイルオキシ基を含む置換基である、[3]又は[4]に記載の硬化性組成物。
[6] R16~R20の少なくとも1つが、(メタ)アクリロイルオキシ基を含む置換基である、[3]~[5]のいずれかに記載の硬化性組成物。
[7] R11、R15、R16及びR20が水素原子である、[3]~[6]のいずれかに記載の硬化性組成物。
[8] (メタ)アクリロイルオキシ基を含む置換基が下記一般式(4)で表される、[1]~[7]のいずれかに記載の硬化性組成物。
Figure JPOXMLDOC01-appb-C000009
一般式(4)において、
 Acは、(メタ)アクリロイルオキシ基を表し、
 Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
 Lは、カルボニル基、エーテル基、チオカルボニル基、チオエーテル基、又は、これらの基を組み合わせた連結基を表し、
 Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
 m1は0~10のいずれかの整数を表し、m1が2以上であるとき、複数のLは同一であっても異なっていてもよく、また、複数のLも同一であっても異なっていてもよく、
 m2は0又は1を表し、
 *は、(メタ)アクリロイルオキシ基を含む置換基の結合部位を示す。
[9] (メタ)アクリロイルオキシ基を含む置換基が、(メタ)アクリロイルオキシアルコキシ基、(メタ)アクリロイルオキシアルコキシアルキル基、(メタ)アクリロイルオキシアルコキシカルボニルアルキル基、(メタ)アクリロイルオキシアルコキシカルボニルアシルオキシ基、又は、(メタ)アクリロイルオキシアルコキシカルボニルアシルオキシアルキル基である、[8]に記載の硬化性組成物。
[10] 化合物が、分子中に(メタ)アクリロイルオキシ基を含む置換基を2つ以上含む、[1]~[9]のいずれかに記載の硬化性組成物。
[11] 化合物が、分子中に芳香環が2つ以上縮合した多環構造を含まない、[1]~[10]のいずれかに記載の硬化性組成物。
[12] 硬化性組成物が、光ラジカル重合開始剤及び熱ラジカル重合開始剤から選択される少なくとも1種を含有する、[1]~[11]のいずれかに記載の硬化性組成物。
[13] [1]~[12]のいずれかに記載の硬化性組成物の半硬化物。
[14] [1]~[12]のいずれかに記載の硬化性組成物の硬化物。
[15] [14]に記載の硬化物を含む光学部材。
[16] [14]に記載の硬化物を含むレンズ。
[17] 上記一般式(2)で表される化合物。
[1] A curable composition containing a compound represented by the following general formula (1).
Figure JPOXMLDOC01-appb-C000006
In the general formula (1),
R 1 to R 10 each independently represent a hydrogen atom or a substituent,
At least one of R 1 to R 5 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent,
At least one of R 6 to R 10 is a substituted or unsubstituted aryl group or a substituted or unsubstituted heteroaryl group.
R 1 and R 2 , R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 respectively They may be bonded to each other to form a linking group necessary to form a cyclic structure. However, the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed.
[2] At least one of R 6 to R 10 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent The curable composition as described in [1].
[3] The curable composition according to [1], wherein the compound is represented by the following general formula (2).
Figure JPOXMLDOC01-appb-C000007
In the general formula (2),
R a and R b each independently represent a substituent other than an aryl group and a heteroaryl group,
n1 and n2 each independently represent an integer of 0 to 4. When n1 is 2 or more, plural Ras may be the same or different, and when n2 is 2 or more, The plurality of R b may be the same or different,
R 11 to R 20 each independently represent a hydrogen atom or a substituent,
At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 and R 17 , R 17 and R 18 , R 18 and R 19 , R 19 and R 20 , benzene ring Two R a each bonded to an adjacent ring skeleton-forming atom and two R b each bonded to an adjacent ring skeleton-forming atom of a benzene ring to each other to form a cyclic structure It may form a linking group. However, the molecule represented by the general formula (2) does not include a polycyclic structure in which three or more aromatic rings are condensed.
[4] The curable composition according to [1], wherein the compound is represented by the following general formula (3).
Figure JPOXMLDOC01-appb-C000008
In the general formula (3),
R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 each independently represent a hydrogen atom or a substituent other than an aryl group and a heteroaryl group,
R 11 to R 20 each independently represent a hydrogen atom or a substituent,
At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
R 1 and R 2 , R 4 and R 5 , R 6 and R 7 , R 9 and R 10 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 And R 17 , R 17 and R 18 , R 18 and R 19 , and R 19 and R 20 may be bonded to each other to form a linking group necessary to form a cyclic structure. However, the molecule represented by the general formula (3) does not include a polycyclic structure in which three or more aromatic rings are condensed.
[5] The curable composition according to [3] or [4], wherein R 12 is a substituent containing a (meth) acryloyloxy group.
[6] The curable composition according to any one of [3] to [5], wherein at least one of R 16 to R 20 is a substituent containing a (meth) acryloyloxy group.
[7] The curable composition according to any one of [3] to [6], wherein R 11 , R 15 , R 16 and R 20 are hydrogen atoms.
[8] The curable composition according to any one of [1] to [7], wherein the substituent containing a (meth) acryloyloxy group is represented by the following general formula (4).
Figure JPOXMLDOC01-appb-C000009
In the general formula (4),
Ac represents a (meth) acryloyloxy group,
L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups,
L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
m1 represents an integer of 0 to 10, and when m1 is 2 or more, a plurality of L 1 s may be the same or different, and a plurality of L 2 s may be the same or different May be
m2 represents 0 or 1;
* Represents a bonding site of a substituent containing a (meth) acryloyloxy group.
[9] The substituent containing a (meth) acryloyloxy group is (meth) acryloyloxyalkoxy group, (meth) acryloyloxyalkoxyalkyl group, (meth) acryloyloxyalkoxycarbonylalkyl group, (meth) acryloyloxyalkoxycarbonylacyloxy The curable composition as described in [8] which is a group or (meth) acryloyl oxy alkoxy carbonyl acyloxy alkyl group.
[10] The curable composition according to any one of [1] to [9], wherein the compound contains two or more substituents containing a (meth) acryloyloxy group in the molecule.
[11] The curable composition according to any one of [1] to [10], wherein the compound does not contain a polycyclic structure in which two or more aromatic rings are condensed in the molecule.
[12] The curable composition according to any one of [1] to [11], wherein the curable composition contains at least one selected from a photo radical polymerization initiator and a thermal radical polymerization initiator.
[13] A semi-cured product of the curable composition according to any one of [1] to [12].
[14] A cured product of the curable composition as described in any one of [1] to [12].
[15] An optical member comprising the cured product according to [14].
[16] A lens comprising the cured product according to [14].
[17] A compound represented by the above general formula (2).
 一般式(1)で表される化合物や一般式(1)で表される化合物を含む硬化性組成物を用いれば、屈折率特性が良好で、湿熱耐久性に優れている光学部材を提供することができる。 By using a curable composition containing a compound represented by the general formula (1) or a compound represented by the general formula (1), an optical member having good refractive index characteristics and excellent wet heat durability is provided. be able to.
 以下において、本発明について詳細に説明する。以下に記載する構成要件の説明は、代表的な実施形態や具体例に基づいてなされることがあるが、本発明はそのような実施形態に限定されない。 Hereinafter, the present invention will be described in detail. The description of the configuration requirements described below may be made based on typical embodiments and specific examples, but the present invention is not limited to such embodiments.
用語の説明
 まず、本明細書において用いられている用語や記号について説明する。
 本明細書において「~」を用いて表される数値範囲は「~」の前後に記載される数値を下限値及び上限値として含む範囲を意味する。
 本明細書における基の表記において、置換及び無置換を記していない表記は、置換基を有さないものと共に置換基を有するものをも包含する。すなわち、「無置換の」と記されていない限り、置換基を有さないものと共に置換基を有するものをも包含する。例えば、「アルキル基」とは、置換基を有さないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含する。また、基の炭素数が記されているとき、その炭素数は、基に置換している置換基の炭素数も含めた総炭素数を意味する。例えばアルキル基の炭素数が記されている場合は、そのアルキル基に置換している置換基の炭素数も含めた総炭素数を意味する。
 本明細書において「(メタ)アクリレート」はアクリレート及びメタクリレートを表し、「(メタ)アクリロイルオキシ」はアクリロイルオキシ及びメタクリロイルオキシを表す。
 本明細書において「置換基」は、水素原子以外の1価の原子又は1価の原子団を意味する。好ましい置換基として、ハロゲン原子、ヒドロキシル基、アルキル基、アルケニル基、アルコキシ基、アルキルチオ基、アシル基、アシルオキシ基、アルコキシカルボニル基、アリール基、ヘテロアリール基、アリールオキシ基、ヘテロアリールオキシ基、アリールオキシカルボニル基、ヘテロアリールオキシカルボニル基、アリールチオ基、ヘテロアリールチオ基、シアノ基、アミノ基を挙げることができる。より好ましい置換基として、ヒドロキシル基、アルキル基、アルコキシ基、アルキルチオ基を挙げることができる。
 本明細書において「ハロゲン原子」は、フッ素原子、塩素原子、臭素原子又はヨウ素原子であることが好ましい。
 本明細書において「アルキル基」は、直鎖状、分枝状、環状のいずれであってもよい。また、直鎖部分と分枝部分と環状部分のうちの2種以上が混在していてもよい。好ましいのは、直鎖状又は分枝状のアルキル基である。アルキル基の炭素数は、例えば1以上、2以上、4以上、6以上とすることができる。また、炭素数は30以下、20以下、10以下とすることができる。アルキル基の具体例として、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基、t-ブチル基、n-ペンチル基、イソペンチル基、n-ヘキシル基、イソヘキシル基、2-エチルヘキシル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基を挙げることができる。
 本明細書において「アルケニル基」は、直鎖状、分枝状、環状のいずれであってもよい。また、直鎖部分と分枝部分と環状部分のうちの2種以上が混在していてもよい。好ましいのは、直鎖状又は分枝状のアルケニル基である。アルケニル基の炭素数は、例えば2以上、4以上、6以上とすることができる。また、炭素数は30以下、20以下、10以下とすることができる。アルケニル基の具体例として、エテニル基、n-プロペニル基、イソプロペニル基、n-ブテニル基、イソブテニル基、t-ブテニル基、n-ペンテニル基、イソペンテニル基、n-ヘキセニル基、イソヘキセニル基、2-エチルヘキセニル基、シクロペンテニル基、シクロヘキセニル基、シクロヘプテニル基を挙げることができる。
 本明細書において「アシル基」は、アルキルカルボニル基、アリールカルボニル基及びヘテロアリールカルボニル基の総称である。
 本明細書において「アシルオキシ基」は、アルキルカルボニルオキシ基、アリールカルボニルオキシ基及びヘテロアリールカルボニルオキシ基の総称である。
Explanation of Terms First, terms and symbols used in the present specification will be described.
In the present specification, a numerical range represented using “to” means a range including numerical values described before and after “to” as the lower limit value and the upper limit value.
In the notation of groups in the present specification, the notations not describing substitution and non-substitution include those having no substituent and those having a substituent. That is, unless it is described as "unsubstituted", it includes those having no substituent and those having a substituent. For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). Moreover, when the carbon number of a group is described, the carbon number means the total carbon number including the carbon number of the substituent substituted to the group. For example, when the carbon number of an alkyl group is described, it means the total carbon number including the carbon number of the substituent substituted to the alkyl group.
In the present specification, “(meth) acrylate” represents acrylate and methacrylate, and “(meth) acryloyloxy” represents acryloyloxy and methacryloyloxy.
In the present specification, the “substituent” means a monovalent atom or monovalent atomic group other than a hydrogen atom. Preferred substituents include halogen atoms, hydroxyl groups, alkyl groups, alkenyl groups, alkoxy groups, alkylthio groups, acyl groups, acyloxy groups, alkoxycarbonyl groups, aryl groups, heteroaryl groups, aryloxy groups, heteroaryloxy groups, and aryl groups. Examples thereof include an oxycarbonyl group, a heteroaryloxycarbonyl group, an arylthio group, a heteroarylthio group, a cyano group and an amino group. As a more preferable substituent, a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group can be mentioned.
In the present specification, the "halogen atom" is preferably a fluorine atom, a chlorine atom, a bromine atom or an iodine atom.
In the present specification, the "alkyl group" may be linear, branched or cyclic. In addition, two or more of the linear portion, the branched portion, and the cyclic portion may be mixed. Preferred are linear or branched alkyl groups. The carbon number of the alkyl group can be, for example, 1 or more, 2 or more, 4 or more, 6 or more. Moreover, carbon number can be 30 or less, 20 or less, and 10 or less. Specific examples of the alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, Examples thereof include 2-ethylhexyl group, cyclopentyl group, cyclohexyl group and cycloheptyl group.
In the present specification, the "alkenyl group" may be linear, branched or cyclic. In addition, two or more of the linear portion, the branched portion, and the cyclic portion may be mixed. Preferred are linear or branched alkenyl groups. The carbon number of the alkenyl group can be, for example, 2 or more, 4 or more, 6 or more. Moreover, carbon number can be 30 or less, 20 or less, and 10 or less. Specific examples of the alkenyl group include ethenyl group, n-propenyl group, isopropenyl group, n-butenyl group, isobutenyl group, t-butenyl group, n-pentenyl group, isopentenyl group, n-hexenyl group, isohexenyl group, Examples thereof include 2-ethylhexenyl group, cyclopentenyl group, cyclohexenyl group and cycloheptenyl group.
As used herein, "acyl group" is a generic term for alkylcarbonyl group, arylcarbonyl group and heteroarylcarbonyl group.
In the present specification, the "acyloxy group" is a generic term for an alkylcarbonyloxy group, an arylcarbonyloxy group and a heteroarylcarbonyloxy group.
 本明細書において「アリール基」は、芳香族炭化水素環1つだけからなる基であってもよいし、芳香族炭化水素環に1つ以上の環が縮合した基であってもよい。芳香族炭化水素環に1つ以上の環が縮合した基である場合は、芳香族炭化水素環、脂肪族炭化水素環及び非芳香族複素環のうちの1以上が芳香族炭化水素環に縮合した基を採用することができる。アリール基の炭素数は、例えば6以上、10以上とすることができる。また、炭素数は30以下、18以下、14以下、10以下とすることができる。アリール基の具体例として、フェニル基、1-ナフチル基、2-ナフチル基を挙げることができる。
 本明細書において「ヘテロアリール基」は、複素芳香環1つだけからなる基であってもよいし、複素芳香環に1つ以上の環が縮合した基であってもよい。複素芳香環に1つ以上の環が縮合した基である場合は、芳香族炭化水素環、複素芳香環、脂肪族炭化水素環及び非芳香族複素環のうちの1以上が芳香族炭化水素環に縮合した基を採用することができる。ヘテロアリール基の環骨格形成原子数は、例えば5以上、6以上、9以上、10以上とすることができる。また、環骨格形成原子数は30以下、18以下、14以下、11以下とすることができる。ヘテロアリール基は、ヘテロ原子を介して結合する基であっても複素芳香環を構成する炭素原子を介して結合する基であってもよい。ヘテロアリール基の複素芳香環の環骨格を構成するヘテロ原子として、例えば窒素原子、酸素原子、硫黄原子を挙げることができる。ヘテロアリール基の具体例として、2-ピリジル基、3-ピリジル基、4-ピリジル基、2-ピリミジル基、4-ピリミジル基、5-ピリミジル基、トリアジニル基を挙げることができる。
 本明細書における「アミノ基」は、ジアルキルアミノ基、ジアリールアミノ基を含む。ジアルキルアミノ基を構成する2つのアルキル基は互いに結合して環状構造を形成していてもよく、ジアリールアミノ基を構成する2つのアリール基は互いに結合して環状構造を形成していてもよい。
In the present specification, the “aryl group” may be a group consisting of only one aromatic hydrocarbon ring or a group in which one or more rings are condensed to an aromatic hydrocarbon ring. When it is a group in which one or more rings are fused to an aromatic hydrocarbon ring, at least one of the aromatic hydrocarbon ring, the aliphatic hydrocarbon ring and the non-aromatic heterocycle is fused to the aromatic hydrocarbon ring Can be adopted. The carbon number of the aryl group can be, for example, 6 or more and 10 or more. Moreover, carbon number can be 30 or less, 18 or less, 14 or less, 10 or less. Specific examples of the aryl group include phenyl group, 1-naphthyl group and 2-naphthyl group.
In the present specification, the "heteroaryl group" may be a group consisting of only one heteroaromatic ring or a group in which one or more rings are condensed to a heteroaromatic ring. When it is a group in which one or more rings are fused to a heteroaromatic ring, at least one of an aromatic hydrocarbon ring, a heteroaromatic ring, an aliphatic hydrocarbon ring and a nonaromatic heterocycle is an aromatic hydrocarbon ring And the condensed group can be adopted. The ring skeleton forming atom number of the heteroaryl group can be, for example, 5 or more, 6 or more, 9 or more, 10 or more. In addition, the number of ring skeleton-forming atoms can be 30 or less, 18 or less, 14 or less, or 11 or less. The heteroaryl group may be a group bonded via a hetero atom or a group bonded via a carbon atom constituting a heteroaromatic ring. As a hetero atom which comprises the ring frame of the hetero aromatic ring of heteroaryl group, a nitrogen atom, an oxygen atom, and a sulfur atom can be mentioned, for example. Specific examples of the heteroaryl group include 2-pyridyl group, 3-pyridyl group, 4-pyridyl group, 2-pyrimidyl group, 4-pyrimidyl group, 5-pyrimidyl group and triazinyl group.
The "amino group" in the present specification includes a dialkylamino group and a diarylamino group. Two alkyl groups constituting a dialkylamino group may be bonded to each other to form a cyclic structure, and two aryl groups constituting a diarylamino group may be bonded to each other to form a cyclic structure.
 本明細書における「アルコキシ基」のアルキル部分の説明と具体例、本明細書における「アルキルチオ基」のアルキル部分の説明と具体例、本明細書における「アシル基」がアルキルカルボニル基であるときのアルキル部分(アシル基からカルボニル基を除いた部分)の説明と具体例、本明細書における「アシルオキシ基」がアルキルカルボニルオキシ基であるときのアルキル部分(アシル基からカルボニルオキシ基を除いた部分)の説明と具体例、本明細書における「アルコキシカルボニル基」のアルキル部分(アルコキシカルボニル基からオキシカルボニル基を除いた部分)の説明と具体例、本明細書における「アミノ基」がジアルキルアミノ基であるときの各アルキル部分については、上記のアルキル基の説明と具体例を参照することができる。
 本明細書における「アシル基」がアリールカルボニル基であるときのアリール部分(アシル基からカルボニル基を除いた部分)の説明と具体例、本明細書における「アシルオキシ基」がアリールカルボニルオキシ基であるときのアリール部分(アシル基からカルボニルオキシ基を除いた部分)の説明と具体例、「アリールオキシ基」のアリール部分の説明と具体例、「アリールオキシカルボニル基」のアリール部分(アリールオキシカルボニル基からオキシカルボニル基を除いた部分)の説明と具体例、本明細書における「アリールチオ基」のアリール部分の説明と具体例、本明細書における「アミノ基」がジアリールアミノ基であるときの各アリール部分については、上記のアリール基の説明と具体例を参照することができる。
 本明細書における「アシル基」がヘテロアリールカルボニル基であるときのヘテロアリール部分(アシル基からカルボニル基を除いた部分)の説明と具体例、本明細書における「アシルオキシ基」がヘテロアリールカルボニルオキシ基であるときのヘテロアリール部分(アシル基からカルボニルオキシ基を除いた部分)の説明と具体例、本明細書における「ヘテロアリールオキシ基」のヘテロアリール部分の説明と具体例、本明細書における「ヘテロアリールオキシカルボニル基」のヘテロアリール部分(ヘテロアリールオキシカルボニル基からオキシカルボニル基を除いた部分)の説明と具体例、本明細書における「ヘテロアリールチオ基」のヘテロアリール部分の説明と具体例については、上記のヘテロアリール基の説明と具体例を参照することができる。
 本明細書において鎖状置換基の前に記載される「n-」はnormal(直鎖)の略であり、「t-」はtertiaryの略である。
 本明細書において「モノマー」は、オリゴマー及びポリマーとは区別される概念であり、重量平均分子量が1,000以下の単量体をいう。
Description and specific example of the alkyl part of "alkoxy group" in the present specification, description and specific example of the alkyl part of "alkylthio group" in the present specification, when "acyl group" in the present specification is an alkylcarbonyl group Description and specific examples of the alkyl moiety (a moiety obtained by removing a carbonyl group from an acyl group), an alkyl moiety (a moiety obtained by removing a carbonyloxy group from an acyl group) when the "acyloxy group" in the specification is an alkylcarbonyloxy group Description and specific examples, Description and specific examples of the alkyl part (the part which removed the oxycarbonyl group from the alkoxycarbonyl group) in the specification of this specification, the "amino group" in this specification is a dialkylamino group See the description and examples of alkyl groups above for each alkyl moiety at any given time. It can be.
Description and specific examples of the aryl moiety (a moiety obtained by removing a carbonyl group from an acyl group) when the "acyl group" in the present specification is an arylcarbonyl group, the "acyloxy group" in the present specification is an arylcarbonyloxy group Description and specific example of an aryl moiety (a moiety obtained by removing a carbonyloxy group from an acyl group), Description and specific examples of an aryl moiety of an "aryloxy group", an aryl moiety (aryloxycarbonyl group) of an "aryloxycarbonyl group" And the specific examples thereof, the description and specific examples of the aryl moiety of the “arylthio group” in the present specification, and the respective aryls when the “amino group” in the present specification is a diarylamino group For the part, reference can be made to the description and examples of the aryl group described above.
The description and specific examples of the heteroaryl moiety (the moiety obtained by removing a carbonyl group from an acyl group) when the "acyl group" in the present specification is a heteroarylcarbonyl group, the "acyloxy group" in the present specification is a heteroarylcarbonyloxy Description and specific examples of a heteroaryl moiety (a moiety obtained by removing a carbonyloxy group from an acyl group) when it is a group, Description and illustrative examples of a heteroaryl part of the "heteroaryloxy group" in the present specification, Description and specific examples of the heteroaryl part of the “heteroaryloxycarbonyl group” (the part in which the oxycarbonyl group has been removed from the heteroaryloxycarbonyl group), description and specific examples of the heteroaryl part of the “heteroarylthio group” in the present specification For examples, see the descriptions and examples of heteroaryl groups above. Rukoto can.
In the present specification, "n-" described before a chain substituent is an abbreviation for normal (straight chain), and "t-" is an abbreviation for tertiary.
In the present specification, “monomer” is a concept that is distinguished from oligomers and polymers, and refers to a monomer having a weight average molecular weight of 1,000 or less.
 本明細書における「屈折率(nd)」、「アッベ数(νd)」及び「部分分散比(θg,F)」は、カルニュー精密屈折計(株式会社島津デバイス製造製、型番KPR-2000)を用いて測定した値である。測定手順の詳細については実施例1~3の記載を参照することができる。本明細書における「屈折率(nd)」は、波長587.56nmにおける屈折率である。また、「アッベ数(νd)」及び「部分分散比(θg,F)」は、異なる波長における屈折率測定値から下記式により算出される値である。
  νd=(nd-1)/(nF-nC)
  θg,F=(ng-nF)/(nF-nC)
ここで、ndは波長587.56nmにおける屈折率、nFは波長486.13nmにおける屈折率、nCは波長656.27nmにおける屈折率、ngは波長435.83nmにおける屈折率を表す。
In the present specification, “refractive index (nd)”, “Abbe number (νd)” and “partial dispersion ratio (θg, F)” refer to a Calnew precision refractometer (Model No. KPR-2000, manufactured by Shimadzu Corporation). It is the value measured using. For the details of the measurement procedure, the descriptions in Examples 1 to 3 can be referred to. The “refractive index (nd)” in the present specification is a refractive index at a wavelength of 587.56 nm. Moreover, "Abbe number ((nu) d)" and "partial dispersion ratio ((theta) g, F)" are values calculated by the following formula from the refractive index measurement value in a different wavelength.
d d = (nd-1) / (nF-nC)
θg, F = (ng-nF) / (nF-nC)
Here, nd represents a refractive index at a wavelength of 587.56 nm, nF represents a refractive index at a wavelength of 486.13 nm, nC represents a refractive index at a wavelength of 656.27 nm, and ng represents a refractive index at a wavelength of 435.83 nm.
一般式(1)で表される化合物
(定義)
 下記一般式(1)で表される化合物について、詳細に説明する。
Figure JPOXMLDOC01-appb-C000010
Compound (Definition) Represented by General Formula (1 )
The compound represented by the following general formula (1) will be described in detail.
Figure JPOXMLDOC01-appb-C000010
 一般式(1)において、R~R10は、各々独立に、水素原子又は置換基を表す。ただし、R~Rの少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基、又は、(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基である。また、R~R10の少なくとも1つは、置換もしくは無置換のアリール基、又は、置換もしくは無置換のヘテロアリール基である。
 ここでRとR、RとR、RとR、RとR、RとR、RとR、RとR、RとR10は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(1)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
In the general formula (1), R 1 to R 10 each independently represent a hydrogen atom or a substituent. Provided that at least one of R 1 to R 5 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent is there. In addition, at least one of R 6 to R 10 is a substituted or unsubstituted aryl group or a substituted or unsubstituted heteroaryl group.
Here, R 1 and R 2 , R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 Each may be bonded to each other to form a linking group necessary to form a cyclic structure. However, the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed.
(R~Rの説明)
 R~Rの少なくとも1つがとる「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」又は「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」は、1つ以上の(メタ)アクリロイルオキシ基を含む置換基を少なくとも1つ有するアリール基又はヘテロアリール基である。好ましくは、1つの(メタ)アクリロイルオキシ基を含む置換基を少なくとも1つ有するアリール基又はヘテロアリール基であり、より好ましくは、1つの(メタ)アクリロイルオキシ基を含む置換基を1つ又は2つ有するアリール基又はヘテロアリール基であり、さらに好ましくは、1つの(メタ)アクリロイルオキシ基を含む置換基を1つ有するアリール基又はヘテロアリール基である。アリール基又はヘテロアリール基は、(メタ)アクリロイルオキシ基を含む置換基以外の置換基を有していてもよい。そのような置換基として好ましいものとして、ヒドロキシル基、アルキル基、アルコキシ基、アルキルチオ基を挙げることができる。
 好ましいのは、R~Rの1つ又は2つが「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」又は「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」である場合であり、より好ましくはR~Rの1つ又は2つが「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」である場合であり、さらに好ましくはR~Rの1つが「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」である場合である。
 R~Rの中では、R~Rの少なくとも1つが「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」又は「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」であることが好ましい。特に、R及びRの少なくとも1つが「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」又は「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」であれば、溶解性が一段と良好になるため好ましい。
 「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」又は「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」以外のR~Rは、これら以外の置換基であるか水素原子である。これら以外の置換基の数は、R~Rのうちの0~2つであることが好ましく、例えば0又は1つであってもよい。
(Description of R 1 to R 5 )
The “aryl group substituted with a substituent containing a (meth) acryloyloxy group” taken by at least one of R 1 to R 5 or the “heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group” is It is an aryl group or heteroaryl group having at least one substituent containing one or more (meth) acryloyloxy groups. Preferably, it is an aryl group or heteroaryl group having at least one substituent containing one (meth) acryloyloxy group, more preferably one or two substituents containing one (meth) acryloyloxy group Or an aryl or heteroaryl group having one or more substituents, more preferably an aryl or heteroaryl group having one substituent containing one (meth) acryloyloxy group. The aryl group or heteroaryl group may have a substituent other than the substituent including a (meth) acryloyloxy group. Preferred examples of such a substituent include a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group.
Preferably, one or two of R 1 to R 5 are “aryl groups substituted with a substituent containing a (meth) acryloyloxy group” or “hetero substituted with a substituent containing a (meth) acryloyloxy group” It is a case where it is “aryl group”, more preferably, one or two of R 1 to R 5 is “an aryl group substituted with a substituent including a (meth) acryloyloxy group”, more preferably This is the case where one of R 1 to R 5 is “an aryl group substituted by a substituent containing a (meth) acryloyloxy group”.
Among R 1 to R 5 , at least one of R 2 to R 4 is substituted with “an aryl group substituted with a (meth) acryloyloxy group-containing substituent” or a “(meth) acryloyloxy group-containing substituent It is preferable that it is "heteroaryl group". In particular, at least one of R 2 and R 4 is a “aryl group substituted with a (meth) acryloyloxy group-containing substituent” or a “heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent” If it is, it is preferable because the solubility is further improved.
R 1 to R 5 other than “aryl group substituted with a substituent containing a (meth) acryloyloxy group” or “heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group” are other than these It is a substituent or a hydrogen atom. The number of substituents other than these is preferably 0 to 2 of R 1 to R 5 and may be, for example, 0 or 1.
(R~R10の説明)
 R~R10がとりうる「アリール基」は、(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基であってもよい。その場合は、R~Rのいずれかが表す「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」と同じ基であってもよいし、異なる基であってもよい。好ましいのは、同じ基である場合である。
 また、R~R10がとりうる「ヘテロアリール基」は、(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基であってもよい。その場合は、R~Rのいずれかが表す「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」と同じ基であってもよいし、異なる基であってもよい。好ましいのは、同じ基である場合である。
 R~R10の中では、R~Rの少なくとも1つがアリール基であることが好ましく、例えばR及びRの少なくとも1つがアリール基である場合や、Rがアリール基である場合を挙げることができる。R及びRの少なくとも1つがアリール基であれば、溶解性が一段と高まる傾向があるため好ましい。
(Description of R 6 to R 10 )
The “aryl group” that can be taken by R 6 to R 10 may be an aryl group substituted with a substituent that includes a (meth) acryloyloxy group. In that case, it may be the same as or different from the “aryl group substituted with a substituent containing a (meth) acryloyloxy group” represented by any of R 1 to R 5 . Preferred is when it is the same group.
Further, the "heteroaryl group" that can be taken by R 6 to R 10 may be a heteroaryl group substituted with a substituent including a (meth) acryloyloxy group. In that case, it may be the same group as “a heteroaryl group substituted by a substituent containing a (meth) acryloyloxy group” represented by any of R 1 to R 5 , or may be a different group . Preferred is when it is the same group.
Among R 6 to R 10 , at least one of R 7 to R 9 is preferably an aryl group, for example, at least one of R 7 and R 9 is an aryl group, or R 8 is an aryl group The case can be mentioned. If at least one of R 7 and R 9 is an aryl group, the solubility tends to further increase, which is preferable.
((メタ)アクリロイルオキシ基を含む置換基)
 R~R10がとりうる「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」や「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」における「(メタ)アクリロイルオキシ基を含む置換基」は、(メタ)アクリロイルオキシ基を含むものであれば良いが、特に下記一般式(4)で表される基であることが好ましい。
Figure JPOXMLDOC01-appb-C000011
(Substituent containing (meth) acryloyloxy group)
“(Meta) in“ aryl group substituted with a substituent containing a (meth) acryloyloxy group ”that can be taken by R 1 to R 10 or“ heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group ” The substituent containing an acryloyloxy group may be a group containing a (meth) acryloyloxy group, but is particularly preferably a group represented by the following general formula (4).
Figure JPOXMLDOC01-appb-C000011
一般式(4)において、
 Acは、(メタ)アクリロイルオキシ基を表し、
 Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
 Lは、カルボニル基、エーテル基、チオカルボニル基、チオエーテル基、又は、これらの基を組み合わせた連結基を表し、
 Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
 m1は0~10のいずれかの整数を表し、m1が2以上であるとき、複数のLは同一であっても異なっていてもよく、また、複数のLも同一であっても異なっていてもよく、
 m2は0又は1を表し、
 *は、(メタ)アクリロイルオキシ基を含む置換基の結合部位を示す。
In the general formula (4),
Ac represents a (meth) acryloyloxy group,
L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups,
L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
m1 represents an integer of 0 to 10, and when m1 is 2 or more, a plurality of L 1 s may be the same or different, and a plurality of L 2 s may be the same or different May be
m2 represents 0 or 1;
* Represents a bonding site of a substituent containing a (meth) acryloyloxy group.
 一般式(4)のLがとりうるアルキレン基の炭素数は、2~6が好ましく、2~5がより好ましい。例えば、エチレン基、1-メチルエチレン基、2-メチルエチレン基、n-プロピレン基、2-メチルプロピレン基、2,2-ジメチルプロピレン基、n-ブチレン基を挙げることができる。なお、ここではLに結合する側の原子を1位としてアルキレン基を記している。Lが分枝アルキレン基であれば、溶解性が一段と良好になる点で好ましい。
 m1は1~5であることが好ましく、1~3であることがより好ましく、1又は2であってもよい。mが2以上であるとき、複数のLは同一であっても異なっていてもよいが同一であることが好ましい。また、複数のLも同一であっても異なっていてもよいが同一であることが好ましい。
 一般式(4)のLがとりうるアルキレン基の炭素数は、1~6が好ましく、1~3がより好ましい。例えば、メチレン基、エチレン基、1-メチルエチレン基、2-メチルエチレン基、n-プロピレン基を挙げることができる。なお、ここではLに結合する側又は一般式(4)の*印側の原子を1位としてアルキレン基を記している。
 m2は0又は1のいずれであってもよいが、1であるとき、LとLが表すアルキレン基は同一であっても異なっていてもよい。
 一般式(4)のLがとりうる連結基の具体例として、以下のものを挙げることができる。各連結基の左側の**印はLへの結合位置を示し、右側の**印はm2が1であるときはLへの結合位置を示し、m2が0であるときは一般式(4)の*と同義である。
 mが2以上であるとき、複数のLは同一であっても異なっていてもよい。
Figure JPOXMLDOC01-appb-C000012
Formula number of carbon atoms of the alkylene group L 1 can take the (4) is preferably from 2 to 6, 2 to 5 and more preferable. For example, ethylene group, 1-methylethylene group, 2-methylethylene group, n-propylene group, 2-methylpropylene group, 2,2-dimethylpropylene group and n-butylene group can be mentioned. Here, an alkylene group is described with the atom to be bonded to L 2 as the 1-position. If L 1 is a branched alkylene group, it is preferable in that the solubility is further improved.
m1 is preferably 1 to 5, more preferably 1 to 3, and may be 1 or 2. When m is 2 or more, a plurality of L 1 may be the same or different, but are preferably the same. Moreover, although several L 2 may also be the same or different, they are preferably the same.
The carbon number of the alkylene group that L 3 in the general formula (4) can be is preferably 1 to 6, and more preferably 1 to 3. For example, methylene group, ethylene group, 1-methylethylene group, 2-methylethylene group, n-propylene group can be mentioned. Here, the alkylene group is described with the atom bonded to L 3 or the atom on the * mark side of General Formula (4) as the first position.
m2 may be either 0 or 1, but when it is 1, the alkylene groups represented by L 1 and L 3 may be the same or different.
The following can be mentioned as specific examples of the linking group that L 2 of General Formula (4) can be. The ** mark on the left side of each linking group indicates the bonding position to L 1 , the ** mark on the right side indicates the bonding position to L 3 when m 2 is 1 and the general formula when m 2 is 0 It is synonymous with * of (4).
When m is 2 or more, a plurality of L 2 may be the same or different.
Figure JPOXMLDOC01-appb-C000012
  「(メタ)アクリロイルオキシ基を含む置換基」の例として、(メタ)アクリロイルオキシアルコキシ基、(メタ)アクリロイルオキシアルコキシアルキル基、(メタ)アクリロイルオキシアルコキシカルボニルアルキル基、(メタ)アクリロイルオキシアルコキシカルボニルアシルオキシ基、又は、(メタ)アクリロイルオキシアルコキシカルボニルアシルオキシアルキル基を挙げることができる。
 「(メタ)アクリロイルオキシ基を含む置換基」の鎖長は、7~20であることが好ましく、8~15であることがより好ましい。鎖長を好ましい範囲にまで長くすることによって、化合物の溶解性を良好にすることができる。
 「(メタ)アクリロイルオキシ基を含む置換基」がアリール基やヘテロアリール基に結合する位置は、これらのアリール基やヘテロアリール基のいずれの位置であってもよいが、3~5位のいずれか1つ以上であることが好ましい。なお、ここでは「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」や「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」がベンゾフェノンへ結合する原子を1位の原子として記している。
 一般式(1)で表される化合物における「(メタ)アクリロイルオキシ基を含む置換基」の数は、2以上であることが好ましく、2~4がより好ましく、2又は3がさらに好ましい。
Examples of “substituent containing (meth) acryloyloxy group” include (meth) acryloyloxyalkoxy group, (meth) acryloyloxyalkoxyalkyl group, (meth) acryloyloxyalkoxycarbonylalkyl group, (meth) acryloyloxyalkoxycarbonyl An acyloxy group or a (meth) acryloyloxy alkoxycarbonyl acyloxyalkyl group can be mentioned.
The chain length of the “substituent containing (meth) acryloyloxy group” is preferably 7 to 20, and more preferably 8 to 15. By increasing the chain length to the preferred range, the solubility of the compound can be improved.
The position at which the “substituent containing a (meth) acryloyloxy group” is bonded to the aryl group or the heteroaryl group may be any position of these aryl groups or heteroaryl groups, but any one of positions 3 to 5 Preferably it is one or more. In addition, here, the “aryl group substituted with a substituent containing a (meth) acryloyloxy group” or the “heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group” is bonded to benzophenone 1 It is written as an atom of rank.
The number of “substituents containing (meth) acryloyloxy group” in the compound represented by the general formula (1) is preferably 2 or more, more preferably 2 to 4, and still more preferably 2 or 3.
 以下に「(メタ)アクリロイルオキシ基を含む置換基」の具体例を挙げる。ただし、本発明で採用することができる「(メタ)アクリロイルオキシ基を含む置換基」はこれらの具体例によって限定的に解釈されることはない。なお、以下の構造におけるRは水素原子またはメチル基を表し、*印はアリール基又はヘテロアリール基への結合位置を表す。
Figure JPOXMLDOC01-appb-C000013
Specific examples of the “substituent containing a (meth) acryloyloxy group” will be given below. However, the “substituent containing a (meth) acryloyloxy group” that can be adopted in the present invention is not limitedly interpreted by these specific examples. In the following structures, R represents a hydrogen atom or a methyl group, and the symbol * represents a bonding position to an aryl group or a heteroaryl group.
Figure JPOXMLDOC01-appb-C000013
 本願における下記の表記:
Figure JPOXMLDOC01-appb-C000014
は、以下のいずれかの構造を示すものである。すなわち、オキシエチレンオキシ基を構成するいずれか一方の炭素原子にメチル基が結合した構造を示すものである。
Figure JPOXMLDOC01-appb-C000015
The following notation in the present application:
Figure JPOXMLDOC01-appb-C000014
Indicates one of the following structures. That is, it shows a structure in which a methyl group is bonded to any one carbon atom constituting an oxyethyleneoxy group.
Figure JPOXMLDOC01-appb-C000015
((メタ)アクリロイルオキシ基を含まない置換基)
 R~R10は、上記の「(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基」や「(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基」ではない置換基であってもよい。そのような置換基として、(メタ)アクリロイルオキシ基を含まない置換基を挙げることができる。また、そのような置換基の中で好ましいものとして、ヒドロキシル基、アルキル基、アルコキシ基、アルキルチオ基を挙げることができる。別の観点から規定すると、好ましい置換基として、アルキル基又は下記の一般式(5)で表される基を挙げることができる。
Figure JPOXMLDOC01-appb-C000016
(Substituent which does not contain (meth) acryloyloxy group)
R 1 to R 10 are not the above-mentioned “aryl group substituted by a substituent containing a (meth) acryloyloxy group” or “heteroaryl group substituted by a substituent containing a (meth) acryloyloxy group” It may be a group. As such substituent, a substituent which does not contain a (meth) acryloyloxy group can be mentioned. Moreover, a hydroxyl group, an alkyl group, an alkoxy group, and an alkylthio group can be mentioned as a preferable thing in such a substituent. From another viewpoint, as a preferable substituent, an alkyl group or a group represented by the following general formula (5) can be mentioned.
Figure JPOXMLDOC01-appb-C000016
一般式(5)において、
 Tは、水素原子、ヒドロキシル基、又は、ハロゲン原子を表し、
 Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
 Lは、カルボニル基、エーテル基、チオカルボニル基、チオエーテル基、又は、これらの基を組み合わせた連結基を表し、
 Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
 m1は0~10のいずれかの整数を表し、m1が2以上であるとき、複数のLは同一であっても異なっていてもよく、また、複数のLも同一であっても異なっていてもよく、
 m2は0又は1を表し、Tが水素原子でm1が0であるとき、m2は1であり、
 *は、一般式(5)で表される置換基の結合部位を示す。
In the general formula (5),
T represents a hydrogen atom, a hydroxyl group or a halogen atom,
L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups,
L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
m1 represents an integer of 0 to 10, and when m1 is 2 or more, a plurality of L 1 s may be the same or different, and a plurality of L 2 s may be the same or different May be
m2 represents 0 or 1, and when T is a hydrogen atom and m1 is 0, m2 is 1;
* Indicates a bonding site of the substituent represented by the general formula (5).
 一般式(5)におけるL、L、L、m1,m2の説明と具体例については、一般式(4)における対応する記載を参照することができる。
 一般式(5)で表される基の具体例として、以下の基を挙げることができる。ただし、本発明で採用することができる基は、以下の具体例によって限定的に解釈されることはない。
   HO-*
   CHO-*
   CHCHO-*
   HOCHCHO-*
   CHOCHCHO-*
   CHS-*
   CHCHS-*
For the description and specific examples of L 1 , L 2 , L 3 , m 1 and m 2 in the general formula (5), the corresponding description in the general formula (4) can be referred to.
The following groups can be mentioned as specific examples of the group represented by the general formula (5). However, the groups that can be adopted in the present invention are not limitedly interpreted by the following specific examples.
HO- *
CH 3 O- *
CH 3 CH 2 O- *
HOCH 2 CH 2 O- *
CH 3 OCH 2 CH 2 O- *
CH 3 S- *
CH 3 CH 2 S- *
(環状構造の形成)
 一般式(1)におけるRとR、RとR、RとR、RとR、RとR、RとR、RとR、RとR10は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。形成される環状構造は芳香環であっても非芳香環であってもよい。また、形成される環状構造は、環骨格形成原子が炭素原子のみからなる環状構造であってもよいし、環骨格形成原子としてヘテロ原子を含む環状構造であってもよい。好ましいのは、環骨格形成原子が炭素原子のみからなる環状構造である。形成される環状構造の例として、ベンゼン環、ピリジン環、ピリミジン環、シクロヘキセン環を挙げることができる。これらの環は置換基で置換されていてもよい。ただし、一般式(1)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。また、好ましいのは、R~R10のうちのいずれの2つも互いに結合して環状構造を形成していない場合である。
(Formation of annular structure)
R 1 and R 2 in general formula (1), R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 And R 10 may be bonded to each other to form a linking group necessary to form a cyclic structure. The cyclic structure formed may be an aromatic ring or a non-aromatic ring. In addition, the cyclic structure to be formed may be a cyclic structure in which a ring skeleton forming atom is formed only of carbon atoms, or may be a cyclic structure including a hetero atom as a ring skeleton forming atom. Preferred is a cyclic structure in which the ring skeleton-forming atom is composed only of carbon atoms. As an example of the cyclic structure formed, a benzene ring, a pyridine ring, a pyrimidine ring and a cyclohexene ring can be mentioned. These rings may be substituted by a substituent. However, the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed. In addition, it is preferable that any two of R 1 to R 10 are not bonded to each other to form a cyclic structure.
(共役系)
 一般式(1)で表される化合物は、ベンゾフェノン構造を含む共役系を有する。ベンゾフェノン構造を含む1つの共役系を構成する原子数(共役系のπ電子を有する共役系構成原子数)は、24~38であることが好ましく、24~34であることがより好ましく、26~34であることがさらに好ましく、26~32であることがさらにより好ましい。ベンゾフェノン構造を含む1つの共役系を構成する原子数を適切に制御することにより、化合物の溶解性低下と着色を回避することができる。ベンゾフェノン構造を含む1つの共役系を構成する原子の中には、ヘテロ原子が1~7つ含まれていることが好ましく、1~5つ含まれていることがより好ましく、例えば1~3つ含むことも可能である。
(Conjugated system)
The compound represented by the general formula (1) has a conjugated system containing a benzophenone structure. The number of atoms constituting one conjugated system including the benzophenone structure (the number of conjugated system constituent atoms having π electron of the conjugated system) is preferably 24 to 38, more preferably 24 to 34, 34 is more preferable, and 26 to 32 is even more preferable. By appropriately controlling the number of atoms constituting one conjugated system including the benzophenone structure, it is possible to avoid the decrease in the solubility and the coloring of the compound. Among atoms constituting one conjugated system including a benzophenone structure, 1 to 7 hetero atoms are preferably contained, and 1 to 5 hetero atoms are more preferably contained, for example, 1 to 3 It is also possible to include.
(対称性)
 一般式(1)で表される化合物は、一般式(1)の中央に記載されるカルボニル基の左右に結合している基が同じである対称化合物であっても、左右に結合している基が異なる非対称化合物であってもよい。対称化合物であれば、合成が容易であるという利点がある。
(Symmetry)
The compounds represented by the general formula (1) are bonded to the left and right even if they are symmetrical compounds in which the groups bonded to the left and right of the carbonyl group described in the center of the general formula (1) are the same It may be an asymmetric compound in which the groups are different. Symmetrical compounds have the advantage of ease of synthesis.
一般式(2)で表される化合物
(定義)
 一般式(1)で表される化合物は、下記一般式(2)で表される化合物であることが好ましい。
Figure JPOXMLDOC01-appb-C000017
一般式(2)において、
 R及びRは、各々独立に、アリール基及びヘテロアリール基以外の置換基を表し、
 n1及びn2は、各々独立に0~4の整数を表し、n1が2以上であるとき、複数のRは同一であっても異なっていてもよく、また、n2が2以上であるとき、複数のRは同一であっても異なっていてもよく、
 R11~R20は、各々独立に、水素原子又は置換基を表し、
 R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
 R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのR、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのRは、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(2)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
Compound (Definition) Represented by General Formula (2 )
The compound represented by the general formula (1) is preferably a compound represented by the following general formula (2).
Figure JPOXMLDOC01-appb-C000017
In the general formula (2),
R a and R b each independently represent a substituent other than an aryl group and a heteroaryl group,
n1 and n2 each independently represent an integer of 0 to 4. When n1 is 2 or more, plural Ras may be the same or different, and when n2 is 2 or more, The plurality of R b may be the same or different,
R 11 to R 20 each independently represent a hydrogen atom or a substituent,
At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 and R 17 , R 17 and R 18 , R 18 and R 19 , R 19 and R 20 , benzene ring Two R a each bonded to an adjacent ring skeleton-forming atom and two R b each bonded to an adjacent ring skeleton-forming atom of a benzene ring to each other to form a cyclic structure It may form a linking group. However, the molecule represented by the general formula (2) does not include a polycyclic structure in which three or more aromatic rings are condensed.
(ベンゾフェノンの置換基)
 一般式(2)で表される化合物は、ベンゾフェノンの各ベンゼン環にそれぞれ1つずつ置換フェニル基が置換している構造を持つ化合物である。置換フェニル基の置換位置は、ベンゾフェノンのベンゼン環のいずれの位置であってもよい。ベンゾフェノンの各ベンゼン環には、アリール基及びヘテロアリール基以外の置換基であるR及びRがそれぞれ置換していてもよい。Rの置換数n1とRの置換数n2は、各々独立に0~2であることが好ましく、0又は1であってもよい。ベンゾフェノンの各ベンゼン環に対する置換フェニル基の置換位置は、3~5位又は3’~5’位のいずれかであることが好ましいが、RとRの置換位置は2~6位又は2’~6’位のいずれであってもよい。
(Substituent of benzophenone)
The compound represented by the general formula (2) is a compound having a structure in which one substituted phenyl group is substituted on each benzene ring of benzophenone. The substitution position of the substituted phenyl group may be any position of the benzene ring of benzophenone. Each benzene ring of benzophenone may be substituted with R a and R b which are substituents other than the aryl group and the heteroaryl group. Substitution number n2 of substituents which n1 and R b in R a are each preferably independently 0-2, may be 0 or 1. The substitution position of the substituted phenyl group to each benzene ring of benzophenone is preferably either 3 to 5 or 3 'to 5', but the substitution position of R a and R b is 2 to 6 or 2 It may be any of the '6' positions.
(Ra、Rの説明)
 Ra及びRは、アリール基及びヘテロアリール基以外の置換基であれば特に制限されるものではないが、好ましくはヒドロキシル基、アルキル基、アルコキシ基、アルキルチオ基を挙げることができ、より好ましくはアルキル基、アルコキシ基を挙げることができる。Ra及びRがとりうる置換基の具体例として、上記一般式(5)で表される基の具体例として挙げた基を例示することができる。
(Description of R a and R b )
R a and R b are not particularly limited as long as they are substituents other than an aryl group and a heteroaryl group, but preferably a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group can be mentioned, more preferably And examples thereof include an alkyl group and an alkoxy group. As a specific example of the substituent which Ra and Rb can take, the group quoted as a specific example of the group represented with the said General formula (5) can be illustrated.
(R11~R15の説明)
 R11~R15の少なくとも1つは、「(メタ)アクリロイルオキシ基を含む置換基」である。「(メタ)アクリロイルオキシ基を含む置換基」は、R12~R14のいずれか1つ以上であることが好ましい。R12であるときは、溶解性が良好になる点で好ましい。「(メタ)アクリロイルオキシ基を含む置換基」以外の残りのR11~R15は、「(メタ)アクリロイルオキシ基を含む置換基」以外の置換基か水素原子である。R11~R15のうち、「(メタ)アクリロイルオキシ基を含む置換基」以外の置換基の数は0~2であることが好ましく、0又は1であってもよい。具体的な置換基としては、ヒドロキシル基、アルキル基、アルコキシ基、アルキルチオ基が好ましく、これらの基はアルコキシ基、アルコキシアルキレンオキシ基、あるいはアルキレンオキシ繰り返し単位を有する基で置換されていることも好ましい。なお、R11~R15のうちR11及びR15は水素原子であることが好ましい。
(Description of R 11 to R 15 )
At least one of R 11 to R 15 is a “substituent containing (meth) acryloyloxy group”. The “substituent containing (meth) acryloyloxy group” is preferably any one or more of R 12 to R 14 . When R 12 is used, it is preferable in that the solubility is good. The remaining R 11 to R 15 other than the “substituent containing a (meth) acryloyloxy group” is a substituent other than the “substituent containing a (meth) acryloyloxy group” or a hydrogen atom. Of R 11 to R 15 , the number of substituents other than “a substituent containing a (meth) acryloyloxy group” is preferably 0 to 2, and may be 0 or 1. As a specific substituent, a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group are preferable, and it is also preferable that these groups be substituted by an alkoxy group, an alkoxy alkylene oxy group, or a group having an alkylene oxy repeating unit. . Among R 11 to R 15 , R 11 and R 15 are preferably hydrogen atoms.
(R16~R20の説明)
 R16~R20は、各々独立に水素原子又は置換基を表す。R16~R20の少なくとも1つは置換基であることが好ましく、その置換基は「(メタ)アクリロイルオキシ基を含む置換基」であってもよく、少なくとも1つが「(メタ)アクリロイルオキシ基を含む置換基」であることが好ましい。R16~R20の少なくとも1つが表す「(メタ)アクリロイルオキシ基を含む置換基」と、R11~R15の少なくとも1つが表す「(メタ)アクリロイルオキシ基を含む置換基」は同一であっても異なっていてもよいが、同一であることが好ましい。R16~R20がとりうる「(メタ)アクリロイルオキシ基を含む置換基」以外の置換基の数は0~2であることが好ましく、例えば0又は1であってもよい。「(メタ)アクリロイルオキシ基を含む置換基」以外の置換基の炭素数は1~10が好ましい。具体的な置換基としては、ヒドロキシル基、アルキル基、アルコキシ基、アルキルチオ基が好ましく、これらの基はアルコキシ基、アルコキシアルキレンオキシ基、あるいはアルキレンオキシ繰り返し単位を有する基で置換されていることも好ましい。なお、R16~R20のうちR16及びR20は水素原子であることが好ましい。
(Description of R 16 to R 20 )
R 16 to R 20 each independently represent a hydrogen atom or a substituent. At least one of R 16 to R 20 is preferably a substituent, and the substituent may be “a substituent containing a (meth) acryloyloxy group”, and at least one is a “(meth) acryloyloxy group” It is preferable that it is "a substituent containing The “substituent containing a (meth) acryloyloxy group” represented by at least one of R 16 to R 20 and the “substituent containing a (meth) acryloyloxy group” represented by at least one of R 11 to R 15 are the same. Although they may be different, they are preferably the same. The number of substituents other than “a substituent containing a (meth) acryloyloxy group” that can be taken by R 16 to R 20 is preferably 0 to 2, and may be, for example, 0 or 1. The carbon number of substituents other than “a substituent containing a (meth) acryloyloxy group” is preferably 1 to 10. As a specific substituent, a hydroxyl group, an alkyl group, an alkoxy group and an alkylthio group are preferable, and it is also preferable that these groups be substituted by an alkoxy group, an alkoxy alkylene oxy group, or a group having an alkylene oxy repeating unit. . Among R 16 to R 20 , R 16 and R 20 are preferably hydrogen atoms.
 R11~R20がとりうる「(メタ)アクリロイルオキシ基を含む置換基」の説明と具体例、R11とR12等が互いに結合して形成しうる環状構造の説明と具体例については、一般式(1)の説明中の対応する記載を参照することができる。 Descriptions and specific examples of “substituents containing (meth) acryloyloxy group” that can be taken by R 11 to R 20 , and descriptions and specific examples of cyclic structures that can be formed by combining R 11 and R 12 with each other, The corresponding description in the description of the general formula (1) can be referred to.
一般式(3)で表される化合物
(定義)
 一般式(1)で表される化合物には、下記一般式(3)で表される化合物が含まれる。
Figure JPOXMLDOC01-appb-C000018
一般式(3)において、
 R、R、R、R、R、R、R及びR10は、各々独立に、水素原子を表すか、あるいは、アリール基及びヘテロアリール基以外の置換基を表し、
 R11~R20は、各々独立に、水素原子又は置換基を表し、
 R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
 RとR、RとR、RとR、RとR10、R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(3)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
Compound (Definition) Represented by General Formula (3 )
The compounds represented by the general formula (1) include compounds represented by the following general formula (3).
Figure JPOXMLDOC01-appb-C000018
In the general formula (3),
R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 each independently represent a hydrogen atom or a substituent other than an aryl group and a heteroaryl group,
R 11 to R 20 each independently represent a hydrogen atom or a substituent,
At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
R 1 and R 2 , R 4 and R 5 , R 6 and R 7 , R 9 and R 10 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 And R 17 , R 17 and R 18 , R 18 and R 19 , and R 19 and R 20 may be bonded to each other to form a linking group necessary to form a cyclic structure. However, the molecule represented by the general formula (3) does not include a polycyclic structure in which three or more aromatic rings are condensed.
(説明)
 一般式(3)で表される化合物は、ベンゾフェノンの4位と4’位に置換フェニル基が置換している構造を持つ化合物である。一般式(3)のR、R、R、R、R、R、R及びR10の説明と具体例については、一般式(2)のR及びRの説明と具体例を参照することができる。一般式(3)のR11~R20の説明と具体例については、一般式(2)の対応する記載を参照することができる。また、RとR等が互いに結合して形成しうる環状構造の説明と具体例については、一般式(1)の対応する記載を参照することができる。
(Description)
The compound represented by the general formula (3) is a compound having a structure in which a substituted phenyl group is substituted at the 4-position and 4'-position of benzophenone. Descriptions and specific examples of R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 in the general formula (3) are the descriptions of R a and R b in the general formula (2) And specific examples can be referred to. For the description and specific examples of R 11 to R 20 in the general formula (3), the corresponding description of the general formula (2) can be referred to. Further, for the description and specific examples of the cyclic structure which may be formed by bonding R 1 and R 2 to each other, the corresponding description of the general formula (1) can be referred to.
具体例
 以下に一般式(1)で表される化合物の具体例を挙げる。ただし、本発明で採用することができる一般式(1)で表される化合物は、これらの具体例によって限定的に解釈されることはない。Meはメチル基を表す。
Specific Examples Specific examples of the compound represented by the general formula (1) are given below. However, the compound represented by General formula (1) which can be employ | adopted by this invention is not limitedly interpreted by these examples. Me represents a methyl group.
Figure JPOXMLDOC01-appb-C000019
Figure JPOXMLDOC01-appb-C000019
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000022
Figure JPOXMLDOC01-appb-C000022
合成法
 一般式(1)で表される化合物は、公知の合成法を適宜組み合わせて用いることにより合成することができる。
 例えば、置換基を導入したい位置がハロゲン原子で置換されたベンゾフェノンを出発物質として選択し、ヒドロキシフェニルボロン酸と反応させることにより、ハロゲン原子をヒドロキシフェニル基で置換した化合物をまず合成することができる。次いで、合成した化合物のヒドロキシル基にヒドロキシアルキルハライドを反応させてヒドロキシル基をヒドロキシアルコキシ基に変換し、さらにアクリロイルハライドを反応させることによって、末端にアクリロイル基を導入した一般式(1)で表される化合物を合成することができる。これらの各工程は、いずれも周知の合成反応であり、その反応条件等は一般に知られている範囲内で適宜調整して最適化することができる。
 一般式(1)で表される化合物の具体的な合成手順については、後述の実施例1~3を参照することができる。
Synthetic Methods The compounds represented by the general formula (1) can be synthesized by appropriately combining known synthetic methods.
For example, a compound in which a halogen atom is substituted with a hydroxyphenyl group can be synthesized first by selecting benzophenone having a halogen atom-substituted position as a position to introduce a substituent as a starting material and reacting with benzophenone. . Next, the hydroxyl group of the synthesized compound is reacted with a hydroxyalkyl halide to convert the hydroxyl group to a hydroxyalkoxy group, and further reacted with an acryloyl halide to give an acryloyl group at the terminal, which is represented by the general formula (1) Compounds can be synthesized. Each of these steps is a well-known synthesis reaction, and the reaction conditions and the like can be appropriately adjusted and optimized within a generally known range.
For specific synthetic procedures of the compound represented by the general formula (1), the following Examples 1 to 3 can be referred to.
化合物の特性
 一般式(1)で表される化合物は、硬化させなくても優れた屈折率特性を示す。すなわち、一般式(1)で表される化合物は、高い屈折率(nd)、低いアッベ数(νd)、高い部分分散比(θg,F)を示し、化合物を硬化させずに光学部材用化合物として用いることも可能である。
 一般式(1)で表される化合物のアッベ数(νd)は特に限定されるものではないが、化合物をプロピレングリコールモノメチルエーテルアセテート等の適切な溶剤に溶解させて塗布形成した膜のアッベ数は25以下であることが好ましく、20以下であることがより好ましく、19以下であることがさらに好ましく、18以下であることが特に好ましい。アッベ数(νd)を低く抑えることにより、広い波長領域にわたって色収差の補正を行うことができる。
 また、一般式(1)で表される化合物の部分分散比(θg,F)も特に限定されるものではないが、化合物を適切な溶剤に溶解させて塗布形成した膜のアッベ数は部分分散比(θg,F)が0.70以上であることが好ましく、0.73以上であることがより好ましく、0.77以上であることがさらに好ましい。部分分散比(θg,F)を高くすることにより、特に短波長における色収差の補正を効果的に行うことができる。
Properties of Compound The compound represented by the general formula (1) exhibits excellent refractive index properties without curing. That is, the compound represented by the general formula (1) exhibits a high refractive index (nd), a low Abbe number (νd), a high partial dispersion ratio (θg, F), and a compound for an optical member without curing the compound. It is also possible to use as.
Although the Abbe number (dd) of the compound represented by the general formula (1) is not particularly limited, the Abbe number of the film formed by dissolving the compound in an appropriate solvent such as propylene glycol monomethyl ether acetate is It is preferably 25 or less, more preferably 20 or less, still more preferably 19 or less, and particularly preferably 18 or less. By keeping the Abbe number (vd) low, it is possible to correct chromatic aberration over a wide wavelength range.
Also, the partial dispersion ratio (θg, F) of the compound represented by the general formula (1) is not particularly limited, but the Abbe number of the film formed by dissolving the compound in an appropriate solvent is the partial dispersion The ratio (θg, F) is preferably 0.70 or more, more preferably 0.73 or more, and still more preferably 0.77 or more. By increasing the partial dispersion ratio (θg, F), it is possible to effectively correct the chromatic aberration particularly at a short wavelength.
 一般式(1)で表される化合物を硬化させずに光学部材用化合物として用いる場合は、マトリックスポリマーに化合物を分散させて用いることができる。マトリックスポリマーとしては、本明細書の一部としてここに引用する特開2012-167019号公報の段落0098に記載される材料を用いることができる。これらの材料は単独で用いてもよいし、2種以上を混合して用いてもよい。マトリックスポリマーを選択する際には、一般式(1)で表される化合物との相溶性を考慮して選択することが好ましい。マトリックスポリマーに化合物を分散させて用いる場合、化合物の含有量は全体の1~70質量%とすることが好ましく、5~50質量%とすることがより好ましい。 When using as a compound for optical members, without hardening the compound represented by General formula (1), a compound can be disperse | distributed to matrix polymer and it can be used. As the matrix polymer, the materials described in paragraph 0098 of JP 2012-167019 A, which is incorporated herein by reference as part of the present specification, can be used. These materials may be used alone or in combination of two or more. When selecting a matrix polymer, it is preferable to select in consideration of the compatibility with the compound represented by the general formula (1). When the compound is dispersed in the matrix polymer, the content of the compound is preferably 1 to 70% by mass, and more preferably 5 to 50% by mass.
硬化性組成物
 一般式(1)で表される化合物は硬化させることにより、屈折率特性に優れるとともに湿熱安定性に優れた硬化物を形成することができる。硬化させる場合は、一般式(1)で表される化合物を含む硬化性組成物を調製しておき、それを硬化させることが好ましい。
 硬化性組成物における一般式(1)で表される化合物の含有量は、硬化性組成物の全質量に対して1~99質量%であることが好ましく、10~90質量%であることがより好ましく、20~80質量%であることがさらに好ましい。
 硬化性組成物には、一般式(1)で表される化合物の他に、種々の成分を含有させることができる。例えば、一般式(1)で表される化合物以外の(メタ)アクリレートモノマー、重合制御剤、重合開始剤を好ましく含有させることができる。重合開始剤としては、光ラジカル重合開始剤及び熱ラジカル重合開始剤から選択される少なくとも1種を用いることが好ましい。また、硬化性組成物には、ラジカル重合性基を側鎖に有する重合体を含有させることも可能である。これらの成分について、以下において詳しく説明する。
By curing the compound represented by the curable composition general formula (1), it is possible to form a cured product excellent in refractive index characteristics and also excellent in wet heat stability. In the case of curing, it is preferable to prepare a curable composition containing the compound represented by the general formula (1) and cure it.
The content of the compound represented by the general formula (1) in the curable composition is preferably 1 to 99% by mass, and preferably 10 to 90% by mass, based on the total mass of the curable composition. More preferably, it is 20 to 80% by mass.
The curable composition can contain various components in addition to the compound represented by the general formula (1). For example, (meth) acrylate monomers other than the compound represented by General formula (1), a polymerization control agent, and a polymerization initiator can be preferably contained. As the polymerization initiator, it is preferable to use at least one selected from a photo radical polymerization initiator and a thermal radical polymerization initiator. The curable composition can also contain a polymer having a radically polymerizable group in the side chain. These components are described in detail below.
((メタ)アクリレートモノマー)
 本発明の硬化性組成物に用いることができる(メタ)アクリレートモノマーは、分子中に2つ以上の(メタ)アクリロイル基を有する多官能(メタ)アクリレートモノマーであってもよく、分子中に1つの(メタ)アクリロイル基を有する単官能(メタ)アクリレートモノマーであってもよい。
 (メタ)アクリレートモノマーの具体例としては、本明細書の一部としてここに引用する特開2012-107191号公報の段落0037~0046に記載の(メタ)アクリレートモノマーが挙げられる。
((Meth) acrylate monomer)
The (meth) acrylate monomer that can be used in the curable composition of the present invention may be a polyfunctional (meth) acrylate monomer having two or more (meth) acryloyl groups in the molecule, and It may be a monofunctional (meth) acrylate monomer having two (meth) acryloyl groups.
Specific examples of the (meth) acrylate monomer include the (meth) acrylate monomers described in paragraphs 0037 to 0046 of JP 2012-107191 A, which are incorporated herein by reference as a part of this specification.
 本発明で好ましく用いることができる(メタ)アクリレートモノマーとしては、例えば、モノマー1(フェノキシエチルアクリレート)又はモノマー2(ベンジルアクリレート)で表わされる芳香環を有する単官能(メタ)アクリレートモノマーや、モノマー3(トリシクロデカンジメタノールジアクリレート)で表される脂肪族環を有する二官能(メタ)アクリレートモノマー、モノマー4(ジシクロペンタニルアクリレート)で表わされる脂肪族環を有する単官能(メタ)アクリレートモノマーを挙げることができる。(メタ)アクリレートモノマーの分子量は100~500であることが好ましい。 Examples of (meth) acrylate monomers that can be preferably used in the present invention include monofunctional (meth) acrylate monomers having an aromatic ring represented by monomer 1 (phenoxyethyl acrylate) or monomer 2 (benzyl acrylate), and monomer 3 Bifunctional (meth) acrylate monomer having an aliphatic ring represented by (tricyclodecane dimethanol diacrylate), monofunctional (meth) acrylate monomer having an aliphatic ring represented by monomer 4 (dicyclopentanyl acrylate) Can be mentioned. The molecular weight of the (meth) acrylate monomer is preferably 100 to 500.
Figure JPOXMLDOC01-appb-C000023
Figure JPOXMLDOC01-appb-C000023
Figure JPOXMLDOC01-appb-C000024
Figure JPOXMLDOC01-appb-C000024
 (メタ)アクリレートモノマーの入手方法については特に制限は無く、商業的に入手してもよく、合成により製造してもよい。商業的に入手する場合は、例えば、ビスコート#192 PEA(モノマー1)(大阪有機化学工業株式会社製)、ビスコート#160 BZA(モノマー2)(大阪有機化学工業株式会社製)、A-DCP(モノマー3)(新中村化学工業株式会社製)、FA-513AS(モノマー4)(日立化成工業株式会社製)を好ましく用いることができる。 There is no restriction | limiting in particular about the acquisition method of a (meth) acrylate monomer, You may obtain commercially and may manufacture synthetically. When obtained commercially, for example, Biscoat # 192 PEA (Monomer 1) (Osaka Organic Chemical Industry Ltd.), Biscoat # 160 BZA (Monomer 2) (Osaka Organic Chemical Industry Ltd.), A-DCP Monomer 3) (manufactured by Shin-Nakamura Chemical Co., Ltd.) and FA-513AS (monomer 4) (manufactured by Hitachi Chemical Co., Ltd.) can be preferably used.
 本発明の硬化性組成物が(メタ)アクリレートモノマーを含有する場合、(メタ)アクリレートモノマーの含有量は、硬化性組成物の全質量に対して、1~80質量%であることが好ましく、2~50質量%であることがより好ましく、3~40質量%であることがさらに好ましい。 When the curable composition of the present invention contains a (meth) acrylate monomer, the content of the (meth) acrylate monomer is preferably 1 to 80% by mass with respect to the total mass of the curable composition, It is more preferably 2 to 50% by mass, and still more preferably 3 to 40% by mass.
(重合制御剤)
 本発明の硬化性組成物には、重合制御剤として、硬化性組成物の重合性成分の重合を制御する機能を有する化合物を用いることができる。好ましい重合制御剤として、例えば非共役ビニリデン基含有化合物を採用することができる。非共役ビニリデン基含有化合物としては、本明細書の一部としてここに引用する特開2012-107191号公報の段落0016~0033に記載の化合物を用いることができる。非共役ビニリデン基含有化合物の分子量は、100~400であることが好ましく、120~350であることがより好ましく、130~300であることが特に好ましい。非共役ビニリデン基含有化合物の入手方法については特に制限は無く、商業的に入手してもよく、合成により製造してもよい。商業的に入手する場合は、例えば、β-カリオフィレン(株式会社井上香料製造所製)や(+)-リモネン(東京化成工業株式会社製)などを好ましく用いることができる。
 本発明の硬化性組成物が非共役ビニリデン基含有化合物を含有する場合、非共役ビニリデン基含有化合物の含有量は、硬化性組成物の全質量に対して、0.5~30質量%であることが好ましく、1~25質量%であることがより好ましく、2~20質量%であることがさらに好ましい。
(Polymerization control agent)
In the curable composition of the present invention, a compound having a function of controlling the polymerization of the polymerizable component of the curable composition can be used as a polymerization control agent. As a preferable polymerization control agent, for example, a non-conjugated vinylidene group-containing compound can be adopted. As the non-conjugated vinylidene group-containing compound, the compounds described in paragraphs 0016 to 0033 of JP 2012-107191 A, which are incorporated herein by reference as a part of this specification, can be used. The molecular weight of the non-conjugated vinylidene group-containing compound is preferably 100 to 400, more preferably 120 to 350, and particularly preferably 130 to 300. There is no restriction | limiting in particular about the acquisition method of a nonconjugated vinylidene group containing compound, You may obtain commercially and may manufacture synthetically. When obtained commercially, for example, β-caryophyllene (manufactured by Inoue Perfume Manufacturing Co., Ltd.) or (+)-Limonen (manufactured by Tokyo Chemical Industry Co., Ltd.) can be preferably used.
When the curable composition of the present invention contains a non-conjugated vinylidene group-containing compound, the content of the non-conjugated vinylidene group-containing compound is 0.5 to 30% by mass based on the total mass of the curable composition. Is preferable, 1 to 25% by mass is more preferable, and 2 to 20% by mass is more preferable.
(熱ラジカル重合開始剤)
 本発明の硬化性組成物に用いることができる熱ラジカル重合開始剤としては、例えば、1,1-ジ(t-ヘキシルペルオキシ)シクロヘキサン、1,1-ジ(t-ブチルペルオキシ)シクロヘキサン、2,2-ジ(4,4-ジ-(t-ブチルペルオキシ)シクロヘキシル)プロパン、t-ヘキシルペルオキシイソプロピルモノカーボネート、t-ブチルペルオキシ-3,5,5-トリメチルヘキサノエート、t-ブチルペルオキシラウレート、ジクミルパーオキサイド、ジ-t-ブチルパーオキサイド、t-ブチルペルオキシ-2-エチルヘキサノエート、t-ヘキシルペルオキシ-2-エチルヘキサノエート、クメンハイドロパーオキサイド、t-ブチルハイドロパーオキサイド、t-ブチルパーオキシ-2-エチルヘキシル、2,3-ジメチル-2,3-ジフェニルブタン等を挙げることができる。
(Thermal radical polymerization initiator)
As a thermal radical polymerization initiator which can be used for the curable composition of the present invention, for example, 1,1-di (t-hexylperoxy) cyclohexane, 1,1-di (t-butylperoxy) cyclohexane, 2, 2-di (4,4-di- (t-butylperoxy) cyclohexyl) propane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butyl peroxy laurate , Dicumyl peroxide, di-t-butyl peroxide, t-butylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, cumene hydroperoxide, t-butyl hydroperoxide, t-Butylperoxy-2-ethylhexyl, 2,3-di Mention may be made of a chill-2,3-diphenyl butane and the like.
 中でも、本発明の硬化性組成物は、熱ラジカル重合開始剤として、ハイドロパーオキサイド化合物を含むことが好ましい。ハイドロパーオキサイド化合物は、過酸化物であり、ペルオキシ基を有する化合物である。なお、ハイドロパーオキサイド化合物においては、ペルオキシ基(-O-O-)の一方の酸素原子には水素原子が置換しており、ハイドロパーオキサイド基(-O-O-H)を含む。分子内にハイドロパーオキサイド基を有するハイドロパーオキサイド化合物は非共役ビニリデン基含有化合物の重合中の連鎖移動を促進する効果があり、硬化性組成物が硬化する際の3次元構造のコントロール性がより向上し、半硬化物に変形性を付与することができる。 Among them, the curable composition of the present invention preferably contains a hydroperoxide compound as a thermal radical polymerization initiator. The hydroperoxide compound is a peroxide and is a compound having a peroxy group. In the hydroperoxide compound, one oxygen atom of a peroxy group (—O—O—) is substituted with a hydrogen atom, and includes a hydroperoxide group (—O—O—H). The hydroperoxide compound having a hydroperoxide group in the molecule has the effect of promoting chain transfer during polymerization of the non-conjugated vinylidene group-containing compound, and the controllability of the three-dimensional structure when the curable composition cures is more It is possible to improve and impart deformability to the semi-cured product.
 ハイドロパーオキサイド化合物の入手方法については特に制限は無く、商業的に入手してもよく、合成により製造してもよい。商業的に入手する場合は、例えば、日本油脂株式会社製のパークミルH-80(クメンハイドロパーオキサイド)等を用いることができる。 There is no restriction | limiting in particular about the acquisition method of a hydroperoxide compound, You may obtain commercially and may manufacture synthetically. When commercially obtained, for example, Park Mill H-80 (cumene hydroperoxide) manufactured by NOF Corporation can be used.
 熱ラジカル重合開始剤としては、ハイドロパーオキサイド化合物と、他の熱ラジカル重合開始剤を含むことが好ましい。他の熱ラジカル重合開始剤としては、非ハイドロパーオキサイド化合物を挙げることができる。ハイドロパーオキサイド化合物は熱ラジカル重合を開始する温度が一般に高いため、熱重合開始温度の低い非ハイドロパーオキサイド化合物を共に含むことが好ましい。非ハイドロパーオキサイド化合物としては、t-ブチルペルオキシ-2-エチルヘキサノエート(日本油脂株式会社製、パーブチルO)、t-ブチルパーオキシ-2-エチルヘキシルカーボネート(日本油脂株式会社製、パーブチルE)等のパーオキシエステル系化合物を用いることが好ましい。 As a thermal radical polymerization initiator, it is preferable to contain a hydroperoxide compound and other thermal radical polymerization initiators. As other thermal radical polymerization initiators, non-hydroperoxide compounds can be mentioned. The hydroperoxide compound generally contains a non-hydroperoxide compound having a low thermal polymerization initiation temperature, since the temperature for initiating the thermal radical polymerization is generally high. As the non-hydroperoxide compound, t-butylperoxy-2-ethylhexanoate (manufactured by Nippon Oil and Fats Co., Ltd., Perbutyl O), t-butylperoxy-2-ethylhexyl carbonate (manufactured by Nippon Oil and Fats Co., Ltd., Perbutyl E) It is preferable to use a peroxyester compound such as
 熱ラジカル重合開始剤の含有量は、硬化性組成物の全質量に対して、0.01~10質量%であることが好ましく、0.05~5.0質量%であることがより好ましく、0.05~2.0質量%であることがさらに好ましい。
 熱ラジカル重合開始剤を含む硬化性組成物を熱重合することにより、耐熱性が高い硬化物を成形することができる。
The content of the thermal radical polymerization initiator is preferably 0.01 to 10% by mass, and more preferably 0.05 to 5.0% by mass, based on the total mass of the curable composition. More preferably, it is 0.05 to 2.0% by mass.
By thermally polymerizing a curable composition containing a thermal radical polymerization initiator, a cured product having high heat resistance can be formed.
(光ラジカル重合開始剤)
 本発明の硬化性組成物に用いることができる光ラジカル重合開始剤として、例えば、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,6-ジメチルベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,4,6-トリメチルベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,6-ジクロルベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、1-フェニル-2-ヒドロキシ-2-メチルプロパン-1-オン、1-ヒドロキシシクロヘキシルフェニルケトン、1-(4-イソプロピルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、1,2-ジフェニルエタンジオン、メチルフェニルグリオキシレート、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒロドキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]フェニル}-2-メチル-プロパン-1-オン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、2,4,6-トリメチルベンゾイル-ジフェニル-ホスフィンオキサイド、ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド等を挙げることができる。
(Photo radical polymerization initiator)
As a radical photopolymerization initiator which can be used for the curable composition of the present invention, for example, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,6-dimethylbenzoyl) ) -2,4,4-trimethylpentyl phosphine oxide, bis (2,4,6-trimethyl benzoyl) -2,4,4-trimethylpentyl phosphine oxide, bis (2,6-dichloro benzoyl) -2,4 , 4-trimethylpentyl phosphine oxide, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane- 1-one, 1,2-diphenylethanedione, methylphenylglyoxyl , 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-) 2-Methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1- (4-methylthiophenyl) ) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis Examples include (2,4,6-trimethylbenzoyl) -phenyl phosphine oxide and the like.
 中でも、本発明では、光ラジカル重合開始剤として、BASF社製、イルガキュア184(1-ヒドロキシシクロヘキシルフェニルケトン)、イルガキュア819(ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド)、イルガキュア651(2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン)、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オンを好ましく用いることができる。 Among them, in the present invention, IRGACURE 184 (1-hydroxycyclohexyl phenyl ketone), IRGACURE 819 (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide), IRGACURE 651, manufactured by BASF AG, as a photo radical polymerization initiator. (2,2-dimethoxy-1,2-diphenylethane-1-one), 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-Methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one can be preferably used.
 光ラジカル重合開始剤の含有量は、硬化性組成物の全質量に対して、0.01~5.0質量%であることが好ましく、0.05~1.0質量%であることがより好ましく、0.05~0.5質量%であることがさらに好ましい。
 なお、硬化性組成物は、光ラジカル重合開始剤と熱ラジカル重合開始剤の両方を含むことが好ましく、この場合、光ラジカル重合開始剤と熱ラジカル重合開始剤の合計含有量は、硬化性組成物の全質量に対して、0.01~10質量%であることが好ましく、0.05~5.0質量%であることがより好ましく、0.05~3.0質量%であることがさらに好ましい。
The content of the photoradical polymerization initiator is preferably 0.01 to 5.0% by mass, and more preferably 0.05 to 1.0% by mass, based on the total mass of the curable composition. Preferably, it is more preferably 0.05 to 0.5% by mass.
In addition, it is preferable that a curable composition contains both an optical radical polymerization initiator and a thermal radical polymerization initiator, and in this case, the total content of an optical radical polymerization initiator and a thermal radical polymerization initiator is a curable composition. 0.01 to 10% by mass, preferably 0.05 to 5.0% by mass, and more preferably 0.05 to 3.0% by mass with respect to the total mass of More preferable.
(ラジカル重合性基を側鎖に有する重合体)
 ラジカル重合性基を側鎖に有する重合体は硬化性組成物の粘度を高める働きをするため、増粘剤もしくは増粘ポリマーとして機能する。このため、ラジカル重合性基を側鎖に有する重合体を硬化性組成物に適量添加することにより、硬化性組成物の粘度を所望の範囲内に調整することが可能である。
(Polymer having a radically polymerizable group in the side chain)
The polymer having a radically polymerizable group in the side chain functions to increase the viscosity of the curable composition, and thus functions as a thickener or a thickening polymer. Therefore, it is possible to adjust the viscosity of the curable composition within a desired range by adding an appropriate amount of a polymer having a radically polymerizable group in the side chain to the curable composition.
 ラジカル重合性基を側鎖に有する重合体は、単独重合体であってもよく、共重合体であってもよい。中でも、ラジカル重合性基を側鎖に有する重合体は共重合体であることが好ましい。ラジカル重合性基を側鎖に有する重合体が共重合体である場合は、少なくとも一方の共重合成分がラジカル重合性基を有していればよい。また、ラジカル重合性基を側鎖に有する重合体が共重合体である場合は、側鎖にラジカル重合性基を有する単量体単位と、側鎖にアリール基を有する単量体単位を含む共重合体であることがより好ましい。 The polymer having a radically polymerizable group in the side chain may be a homopolymer or a copolymer. Among them, the polymer having a radically polymerizable group in the side chain is preferably a copolymer. When the polymer having a radically polymerizable group in the side chain is a copolymer, at least one of the copolymer components may have a radically polymerizable group. Moreover, when the polymer which has a radically polymerizable group in a side chain is a copolymer, it contains the monomer unit which has a radically polymerizable group in a side chain, and the monomer unit which has an aryl group in a side chain. It is more preferable that it is a copolymer.
 ラジカル重合性基としては、(メタ)アクリレート基、ビニル基、スチリル基、アリル基等を挙げることができる。ラジカル重合性基を側鎖に有する重合体には、ラジカル重合性基を有する繰り返し単位が、5~100質量%含まれていることが好ましく、10~90質量%含まれていることがより好ましく、20~80質量%含まれていることがさらに好ましい。 As a radically polymerizable group, a (meth) acrylate group, a vinyl group, a styryl group, an allyl group etc. can be mentioned. The polymer having a radically polymerizable group in the side chain preferably contains 5 to 100% by mass, and more preferably 10 to 90% by mass of repeating units having a radically polymerizable group. And 20 to 80% by mass is more preferable.
 以下において、本発明に好ましく用いられるラジカル重合性基を側鎖に有する重合体の具体例を列挙するが、ラジカル重合性基を側鎖に有する重合体は以下の構造に限定されるものではない。
 以下の構造式において、Ra及びRbは、それぞれ独立に、水素又はメチル基を表す。なお、1つのポリマー中における複数のRaは同一であっても、異なっていてもよい。また、nは0~10の整数を表し、0~2であることが好ましく、0又は1であることがより好ましい。
In the following, specific examples of the polymer having a radically polymerizable group in a side chain preferably used in the present invention will be listed, but the polymer having a radically polymerizable group in a side chain is not limited to the following structure .
In the following structural formulas, Ra and Rb each independently represent hydrogen or a methyl group. In addition, several Ra in one polymer may be the same or different. In addition, n represents an integer of 0 to 10, preferably 0 to 2, and more preferably 0 or 1.
Figure JPOXMLDOC01-appb-C000025
Figure JPOXMLDOC01-appb-C000025
Figure JPOXMLDOC01-appb-C000026
 
Figure JPOXMLDOC01-appb-C000026
 
 ラジカル重合性基を側鎖に有する重合体の分子量(重量平均分子量)は、1,000~10,000,000であることが好ましく、5,000~300,000であることがより好ましく、10,000~200,000であることがさらに好ましい。また、ラジカル重合性基を側鎖に有する重合体のガラス転移温度は、50~400℃であることが好ましく、70~350℃であることがより好ましく、100~300℃であることがさらに好ましい。 The molecular weight (weight average molecular weight) of the polymer having a radically polymerizable group in the side chain is preferably 1,000 to 10,000,000, and more preferably 5,000 to 300,000. More preferably, it is 2,000 to 200,000. The glass transition temperature of the polymer having a radically polymerizable group in the side chain is preferably 50 to 400 ° C., more preferably 70 to 350 ° C., and still more preferably 100 to 300 ° C. .
 ラジカル重合性基を側鎖に有する重合体の含有量は、硬化性組成物の全質量に対して、40質量%以下であることが好ましく、30質量%以下であることがより好ましく、25質量%以下であることがさらに好ましい。なお、ラジカル重合性基を側鎖に有する重合体の含有量は、0質量%であってもよく、ラジカル重合性基を側鎖に有する重合体を添加しない態様も好ましい。 The content of the polymer having a radically polymerizable group in the side chain is preferably 40% by mass or less, more preferably 30% by mass or less, based on the total mass of the curable composition. It is further preferable that the content is less than or equal to%. In addition, 0 mass% may be sufficient as content of the polymer which has a radically polymerizable group in a side chain, and the aspect which does not add the polymer which has a radically polymerizable group in a side chain is also preferable.
(その他の添加剤)
 本発明の趣旨に反しない限りにおいて、硬化性組成物は上述した成分以外のポリマーやモノマー、分散剤、可塑剤、熱安定剤、離型剤等の添加剤を含んでいてもよい。
(Other additives)
The curable composition may contain additives such as polymers, monomers, dispersants, plasticizers, heat stabilizers, and mold release agents other than the components described above unless it is not against the spirit of the present invention.
(粘度)
 本発明の硬化性組成物の粘度は、20,000mPa・s以下であることが好ましく、15,000mPa・s以下であることがより好ましく、13,000mPa・s以下であることがさらに好ましく、10,000mPa・s以下であることが特に好ましい。硬化性組成物の粘度を上記範囲内とすることにより、硬化物を成形する際のハンドリング性を高め、高品質な硬化物を形成することができる。なお、硬化性組成物の粘度は、2,000mPa・s以上であることが好ましく、3,000mPa・s以上であることがより好ましく、4,000mPa・s以上であることがさらに好ましく、5,000mPa・s以上であることが特に好ましい。
(viscosity)
The viscosity of the curable composition of the present invention is preferably 20,000 mPa · s or less, more preferably 15,000 mPa · s or less, and still more preferably 13,000 mPa · s or less. It is particularly preferable that the viscosity is not more than 1,000 mPa · s. By setting the viscosity of the curable composition within the above range, the handleability at the time of molding the cured product can be enhanced, and a high quality cured product can be formed. The viscosity of the curable composition is preferably 2,000 mPa · s or more, more preferably 3,000 mPa · s or more, and still more preferably 4,000 mPa · s or more, 5, It is particularly preferable that the viscosity is at least 000 mPa · s.
硬化物の製造方法
 本発明の硬化性組成物を硬化させることにより硬化物を製造することができる。硬化物を製造する際には、光硬化する工程及び熱硬化する工程のうちの少なくとも一方を行う。また、硬化物を製造する際には、硬化性組成物に光照射するか又は硬化性組成物を加熱することによって半硬化物を形成する工程と、得られた半硬化物に光照射するか又は半硬化物を加熱することによって硬化物を形成する工程を、順に行うことが好ましい。
Method for Producing Cured Product A cured product can be produced by curing the curable composition of the present invention. At the time of producing a cured product, at least one of the step of photocuring and the step of thermally curing is performed. In addition, when producing a cured product, a step of forming a semi-cured product by irradiating the curable composition with light or heating the curable composition and irradiating the resulting semi-cured product with light Alternatively, it is preferable to sequentially perform the steps of forming a cured product by heating the semi-cured product.
(半硬化物を形成する工程)
 半硬化物を形成する工程はまず転写工程を含むことが好ましい。転写工程は、上述した硬化性組成物に金型を押し当てる工程である。転写工程では、一対の金型の一方に注入された硬化性組成物に他方の金型を押し当てて硬化性組成物を押し広げる。
(Step of forming a semi-cured product)
Preferably, the step of forming the semi-cured product first includes a transfer step. The transfer step is a step of pressing a mold against the curable composition described above. In the transfer step, the other mold is pressed against the curable composition injected into one of the pair of molds to push and spread the curable composition.
 硬化物の製造方法で用いる金型は、窒化クロム処理が施されたものであることが好ましい。これにより、後に行う離型工程で良好な金型離型性を得ることができ、光学部材の製造効率を高めることができる。 It is preferable that the metal mold | die used by the manufacturing method of hardened | cured material is what the chromium nitride process was given. As a result, good mold releasability can be obtained in the subsequent mold release step, and the manufacturing efficiency of the optical member can be enhanced.
 窒化クロム処理としては、例えば金型表面に窒化クロム膜を成膜する方法を挙げることができる。金型表面に窒化クロム膜を製膜する方法としては、例えばCVD(Chemical Vapor Deposition)法とPVD(Physical Vapor Deposition)法とがある。CVD法は、クロムを含む原料ガスと窒素を含む原料ガスとを高温で反応させて基体表面に窒化クロム膜を形成する方法である。また、PVD法は、アーク放電を利用して基体表面に窒化クロム膜を形成する方法(アーク式真空蒸着法)である。このアーク式真空蒸着法は、真空容器内に例えばクロムよりなる陰極(蒸発源)を配置し、陰極と真空容器の壁面との間でトリガを介してアーク放電を起こさせ、陰極を蒸発させると同時にアークプラズマによる金属のイオン化を図り、基体に負の電圧をかけておき、かつ真空容器に反応ガス例えば窒素ガスを数10mTorr(1.33Pa)程度入れることにより、イオン化した金属と反応ガスを基体の表面で反応させて化合物の膜を作るという方法である。本明細書における金型表面の窒化クロム処理は、上記CVD法、又はPVD法により実施されている。 Examples of the chromium nitride treatment include a method of forming a chromium nitride film on the surface of a mold. As a method of forming a chromium nitride film on the surface of a mold, for example, there are a CVD (Chemical Vapor Deposition) method and a PVD (Physical Vapor Deposition) method. The CVD method is a method of forming a chromium nitride film on the surface of a substrate by reacting a source gas containing chromium and a source gas containing nitrogen at a high temperature. The PVD method is a method (arc vacuum deposition method) of forming a chromium nitride film on a substrate surface using arc discharge. In this arc-type vacuum evaporation method, a cathode (evaporation source) made of, for example, chromium is disposed in a vacuum vessel, and arc discharge is caused between the cathode and the wall of the vacuum vessel through a trigger to evaporate the cathode. At the same time, metal ionization is performed by arc plasma, a negative voltage is applied to the substrate, and the reaction gas, for example, nitrogen gas, is put into a vacuum vessel at several tens mTorr (1.33 Pa) to ionize the metal and the reaction gas. It is a method of making it react on the surface of to make a film of a compound. The chromium nitride treatment of the mold surface in the present specification is carried out by the above-mentioned CVD method or PVD method.
 ここで、金型は、一般的に2つの金型を組み合わせて内容物に加圧しながら加熱することができるようになっており、金型に低粘度の組成物を注入すると、成形型クリアランスへの漏れの原因となる。このため、金型に注入される硬化性組成物は、一定以上の粘度を有していることが好ましい。硬化性組成物の粘度を調整するために、硬化性組成物に上述したラジカル重合性基を側鎖に有する重合体を添加してもよい。 Here, the mold is generally combined with two molds and can be heated while pressurizing the contents, and when a composition of low viscosity is injected into the mold, the mold clearance is obtained. Cause a leak. For this reason, the curable composition injected into the mold preferably has a viscosity of a certain level or more. In order to adjust the viscosity of the curable composition, a polymer having the above-described radical polymerizable group in the side chain may be added to the curable composition.
 金型を押し当てる工程の後には、半硬化物を形成する工程が行われる。半硬化物は、金型内に注入された硬化性組成物を半硬化することで得られる。半硬化物を形成する工程では、光照射又は加熱を行う。本明細書では、このような工程を半硬化工程と呼ぶこともできる。 After the step of pressing the mold, a step of forming a semi-cured product is performed. The semi-cured product is obtained by semi-curing the curable composition injected into the mold. In the step of forming the semi-cured product, light irradiation or heating is performed. In the present specification, such a process can also be referred to as a semi-curing process.
 半硬化物を形成する工程では、本発明の硬化性組成物に対して光照射及び加熱のうち少なくとも一方を行って、25℃、周波数10Hzにおける複素粘度が10~10mPa・sの半硬化物を形成することが好ましい。 In the step of forming the semi-cured product, at least one of light irradiation and heating is performed on the curable composition of the present invention to obtain a half of complex viscosity of 10 5 to 10 8 mPa · s at 25 ° C. and 10 Hz frequency. It is preferable to form a cured product.
 ここで、本明細書中において「半硬化物」とは、硬化性組成物を重合したものであり、完全に固体となっておらず、ある程度流動性を有する状態の物を意味する。硬化性組成物の重合体の、25℃、周波数10Hzにおける複素粘度が10~10mPa・sである場合、その重合体は半硬化物である。すなわち、25℃、周波数10Hzにおける複素粘度の上限値として1.0×10mPa・s未満の物までを半硬化物とみなせる。一方、「硬化物」とは、硬化性組成物を重合により硬化させたものであり、完全に固体となっている状態の物を意味する。 Here, in the present specification, the term "semi-cured product" refers to a product obtained by polymerizing the curable composition, not completely solid, and having a certain degree of fluidity. When the complex viscosity of the polymer of the curable composition at 10 ° C. and a frequency of 10 Hz is 10 5 to 10 8 mPa · s, the polymer is a semi-cured product. That is, up to less than 1.0 × 10 9 mPa · s can be regarded as a semi-cured product as the upper limit value of the complex viscosity at 25 ° C. and a frequency of 10 Hz. On the other hand, the "cured product" is a product obtained by curing the curable composition by polymerization and means a product in a completely solid state.
 光照射に用いられる光は、紫外線又は可視光線であることが好ましく、紫外線であることがより好ましい。例えばメタルハライドランプ、低圧水銀ランプ、高圧水銀ランプ、超高圧水銀ランプ、殺菌ランプ、キセノンランプ、LED(Light Emitting Diode)光源ランプなどが好適に使用される。光照射時の雰囲気は、空気又は不活性ガス置換雰囲気であることが好ましく、酸素濃度1%以下になるまで窒素置換した雰囲気であることがより好ましい。 The light used for light irradiation is preferably ultraviolet light or visible light, and more preferably ultraviolet light. For example, metal halide lamps, low pressure mercury lamps, high pressure mercury lamps, super high pressure mercury lamps, germicidal lamps, xenon lamps, LED (light emitting diode) light source lamps and the like are suitably used. The atmosphere at the time of light irradiation is preferably air or an inert gas replacement atmosphere, and more preferably an atmosphere purged with nitrogen until the oxygen concentration is 1% or less.
 半硬化工程において、加熱半硬化工程を設ける場合、加熱半硬化は、加熱後の半硬化物の25℃、周波数10Hzにおける複素粘度が、10~10mPa・sとなるように行うことが好ましい。 In the semi-curing step, when the heating and semi-curing step is provided, the heating and semi-curing should be carried out so that the complex viscosity at 25 ° C. and frequency 10 Hz of the semi-cured product after heating is 10 5 to 10 8 mPa · s. preferable.
 本発明は、上述した方法で製造される半硬化物に関するものであってもよい。このような半硬化物は、後述する硬化物の製造方法に好ましく用いることができる。ここで、半硬化物の複素粘度の好ましい範囲は、上述した半硬化物を形成する工程における半硬化物の複素粘度の好ましい範囲と同様である。 The present invention may relate to a semi-cured product produced by the method described above. Such a semi-cured product can be preferably used in the method for producing a cured product described later. Here, the preferred range of the complex viscosity of the semi-cured product is the same as the preferred range of the complex viscosity of the semi-cured product in the step of forming the semi-cured product described above.
 半硬化物には、光照射工程後において、光ラジカル重合開始剤が全て消費されていて全く含まれていなくてもよく、光ラジカル重合開始剤が残留していてもよい。 In the semi-cured product, after the light irradiation step, all of the photo radical polymerization initiator may be consumed and may not be contained at all, and the photo radical polymerization initiator may remain.
 また、半硬化物のガラス転移温度は、-150~0℃であることが好ましく、-50~0℃であることがより好ましく、-20~0℃であることが特に好ましい。 The glass transition temperature of the semi-cured product is preferably −150 to 0 ° C., more preferably −50 to 0 ° C., and particularly preferably −20 to 0 ° C.
(硬化物を形成する工程)
 硬化物を形成する工程は、半硬化物を成形型に入れ加圧変形し、加熱して熱重合させるか、もしくは光照射を行うことで光重合させることにより硬化物を得る重合工程を含むことが好ましい。本明細書では、このような工程を硬化工程と呼ぶこともできる。なお、硬化物を形成する工程における光照射の条件と加熱条件は、上述した半硬化工程における条件と同様である。
(Step of forming a cured product)
The step of forming the cured product includes a polymerization step of obtaining the cured product by putting the semi-cured product in a mold and deforming under pressure, heating and thermally polymerizing, or photopolymerization by light irradiation. Is preferred. Such a process can also be referred to herein as a curing process. The conditions for light irradiation and the heating conditions in the step of forming a cured product are the same as the conditions in the above-described semi-curing step.
 硬化工程が熱重合工程である場合、重合工程で用いられる成形型のことを、熱成形用成形型とも言う。熱成形用成形型は、一般に2つの成形型を組み合わせて内容物に加圧しながら加熱することができる構成となっていることが好ましい。また、硬化物の製造方法では、硬化物を得る熱重合工程において、成形型として金型を用いることがより好ましい。このような熱成形用成形型としては、例えば、特開2009-126011号公報に記載のものを用いることができる。また、金型は、窒化クロム処理が施されたものであることが好ましい。 When the curing step is a thermal polymerization step, the mold used in the polymerization step is also referred to as a thermoforming mold. In general, a thermoforming mold is preferably configured to be capable of heating while pressing the contents while combining two molds. In the method of producing a cured product, it is more preferable to use a mold as a mold in the thermal polymerization step for obtaining the cured product. As such a thermoforming molding die, for example, the one described in JP-A-2009-126011 can be used. Moreover, it is preferable that a metal mold | die is what chromium nitride process was given.
 熱重合工程では、成形型に入れた半硬化物を、加圧変形し、加熱して熱重合させて硬化物を得る。ここで、加圧変形と加熱は同時に行ってもよく、加圧変形した後で加熱を行ってもよく、加熱した後で加圧変形を行ってもよいが、その中でも加圧変形と加熱を同時に行うことが好ましい。また、加圧変形と加熱を同時に行った上で、加圧が安定してからさらに高温に加熱することも好ましい。 In the thermal polymerization step, the semi-cured product placed in the mold is pressure-deformed and heated to thermally polymerize to obtain a cured product. Here, pressure deformation and heating may be performed simultaneously, heating may be performed after pressure deformation, and pressure deformation may be performed after heating. Among them, pressure deformation and heating may be performed. It is preferable to carry out simultaneously. Moreover, it is also preferable to perform heating at a higher temperature after the pressurization is stabilized after simultaneously performing the pressure deformation and the heating.
 熱重合工程では、半硬化物を150℃以上の温度で加熱して硬化させ、硬化物を得る。
 加熱温度は、150℃以上であり、160~270℃であることが好ましく、165~250℃であることがより好ましく、170~230℃であることがさらに好ましい。
 この硬化工程では、加熱を行うとともに加圧変形を行うことが好ましい。これにより金型内面の反転形状を硬化物に精度よく転写することができる。
In the thermal polymerization step, the semi-cured product is cured by heating at a temperature of 150 ° C. or higher to obtain a cured product.
The heating temperature is 150 ° C. or higher, preferably 160 to 270 ° C., more preferably 165 to 250 ° C., and still more preferably 170 to 230 ° C.
In this curing step, it is preferable to perform heating and pressure deformation. This makes it possible to accurately transfer the inverted shape of the inner surface of the mold to the cured product.
 加圧変形における圧力は、0.098MPa~9.8MPaであることが好ましく、0.294MPa~4.9MPaであることがより好ましく、0.294MPa~2.94MPaであることが特に好ましい。
 熱重合の時間は、30~1000秒であることが好ましく、30~500秒であることがより好ましく、60~300秒であることが特に好ましい。熱重合時の雰囲気は、空気又は不活性ガス置換雰囲気であることが好ましく、酸素濃度1%以下になるまで窒素置換した雰囲気であることがより好ましい。
The pressure in the pressure deformation is preferably 0.098 MPa to 9.8 MPa, more preferably 0.294 MPa to 4.9 MPa, and particularly preferably 0.294 MPa to 2.94 MPa.
The thermal polymerization time is preferably 30 to 1000 seconds, more preferably 30 to 500 seconds, and particularly preferably 60 to 300 seconds. The atmosphere at the time of thermal polymerization is preferably air or an inert gas-substituted atmosphere, and more preferably an atmosphere purged with nitrogen to an oxygen concentration of 1% or less.
 硬化工程の後には、離型工程が設けられる。硬化工程で熱重合を行った場合、離型工程では、150~250℃の温度範囲で硬化物から金型を引き離すことが好ましい。離型工程における温度を上記範囲内とすることにより、硬化物から金型を容易に引き離すことができ、製造効率を高めることができる。 After the curing step, a release step is provided. When thermal polymerization is performed in the curing step, it is preferable to separate the mold from the cured product in a temperature range of 150 to 250 ° C. in the release step. By setting the temperature in the release step within the above range, the mold can be easily separated from the cured product, and the production efficiency can be enhanced.
 以上、本発明の硬化物の製造方法の一例について説明したが、本発明の構成はこれに限るものではなく、本発明を逸脱しない範囲で適宜変更が可能である。例えば、転写工程と半硬化工程で用いた金型を、そのまま硬化工程で用いてもよく、半硬化工程を行った後、半硬化物から金型を引き離し、この半硬化物を別の金型(熱成形用成形型)に移動させて硬化工程を行ってもよい。この場合、半硬化工程及び硬化工程で用いる金型には上述したクロム処理が施されていることが好ましい。
 また、半硬化工程で、金型内の硬化性組成物に光照射を行うとともに、加熱を行うようにしてもよい。これにより、所望の硬化度を有する半硬化物を確実に得ることができる。半硬化物は、25℃、周波数10Hzにおける複素粘度が10~10mPa・sであることが好ましい。
As mentioned above, although an example of the manufacturing method of hardened material of the present invention was explained, the composition of the present invention is not limited to this, and can be changed suitably in the range which does not deviate from the present invention. For example, the mold used in the transfer step and the semi-curing step may be used as it is in the curing step, and after performing the semi-curing step, the mold is pulled away from the semi-cured product It may be moved to a (thermoforming mold) to carry out a curing step. In this case, it is preferable that the above-described chromium treatment is applied to the mold used in the semi-curing step and the curing step.
In the semi-curing step, the curable composition in the mold may be irradiated with light and heated. This makes it possible to reliably obtain a semi-cured product having a desired degree of curing. The semi-cured product preferably has a complex viscosity of 10 5 to 10 8 mPa · s at 25 ° C. and a frequency of 10 Hz.
硬化物
 一般式(1)で表される化合物を含む硬化性組成物を硬化させて得られる本発明の硬化物は、優れた屈折率特性と湿熱耐久性を有する。すなわち本発明の硬化物は、高い屈折率(nd)、低いアッベ数(νd)、高い部分分散比(θg,F)を有する。
Cured Product The cured product of the present invention obtained by curing the curable composition containing the compound represented by the general formula (1) has excellent refractive index characteristics and wet heat durability. That is, the cured product of the present invention has a high refractive index (nd), a low Abbe number (vd), and a high partial dispersion ratio (θg, F).
 本発明の硬化物のアッベ数(νd)は特に限定されるものではないが、30以下であることが好ましく、27以下であることがより好ましく、25以下であることがさらに好ましく、23以下であることが特に好ましい。アッベ数(νd)を低く抑えることにより、広い波長領域にわたって色収差の補正を行うことができる。
 また、本発明の硬化物の部分分散比(θg,F)も特に限定されるものではないが、0.68以上であることが好ましく、0.70以上であることがより好ましく、0.72以上であることがさらに好ましい。部分分散比(θg,F)を高くすることにより、特に短波長における色収差の補正を効果的に行うことができる。
The Abbe number (νd) of the cured product of the present invention is not particularly limited, but is preferably 30 or less, more preferably 27 or less, still more preferably 25 or less, and 23 or less. Being particularly preferred. By keeping the Abbe number (vd) low, it is possible to correct chromatic aberration over a wide wavelength range.
The partial dispersion ratio (θg, F) of the cured product of the present invention is also not particularly limited, but is preferably 0.68 or more, more preferably 0.70 or more, and 0.72 It is more preferable that it is more than. By increasing the partial dispersion ratio (θg, F), it is possible to effectively correct the chromatic aberration particularly at a short wavelength.
 本発明の硬化物は、湿熱耐久性にも優れている。したがって、高温高湿下で使用されることがあるレンズ等に効果的に用いることができる。 The cured product of the present invention is also excellent in wet heat durability. Therefore, it can be effectively used for a lens etc. which may be used under high temperature and high humidity.
 本発明の硬化物は、最大厚みが0.1~10mmであることが好ましい。最大厚みは、より好ましくは0.1~5mmであり、特に好ましくは0.15~3mmである。本発明の硬化物は、最大直径が1~1000mmであることが好ましい。最大直径は、より好ましくは2~200mmであり、特に好ましくは2.5~100mmである。 The cured product of the present invention preferably has a maximum thickness of 0.1 to 10 mm. The maximum thickness is more preferably 0.1 to 5 mm, particularly preferably 0.15 to 3 mm. The cured product of the present invention preferably has a maximum diameter of 1 to 1000 mm. The maximum diameter is more preferably 2 to 200 mm, particularly preferably 2.5 to 100 mm.
光学部材
 本発明は、上述した硬化物を含む光学部材に関するものでもある。本発明の硬化物は、光学特性に優れた成形体であるため、光学部材に好ましく用いられる。本発明の光学部材の種類は、特に制限されない。特に、硬化性組成物の優れた光学特性を利用した光学部材、特に光を透過する光学部材(いわゆるパッシブ光学部材)として好適に利用することができる。このような光学部材を備えた光学機能装置としては、例えば、各種ディスプレイ装置(液晶ディスプレイやプラズマディスプレイ等)、各種プロジェクタ装置(OHP(Overhead projector)、液晶プロジェクタ等)、光ファイバー通信装置(光導波路、光増幅器等)、カメラやビデオ等の撮影装置等が例示される。
Optical Member The present invention also relates to an optical member containing the above-mentioned cured product. The cured product of the present invention is a molded product having excellent optical properties, and thus is preferably used for an optical member. The type of the optical member of the present invention is not particularly limited. In particular, it can be suitably used as an optical member utilizing the excellent optical properties of the curable composition, in particular, an optical member transmitting light (so-called passive optical member). As an optical functional device provided with such an optical member, for example, various display devices (liquid crystal display, plasma display, etc.), various projector devices (OHP (Overhead projector), liquid crystal projector, etc.), optical fiber communication devices (optical waveguide, An optical amplifier etc.), a camera, an imaging device such as a video, etc. are exemplified.
 また、光学機能装置に用いられるパッシブ光学部材としては、例えば、レンズ、プリズム、プリズムシート、パネル(板状成形体)、フィルム、光導波路(フィルム状やファイバー状等)、光ディスク、LEDの封止剤等が例示される。このようなパッシブ光学部材には、必要に応じて任意の被覆層、例えば摩擦や摩耗による塗布面の機械的損傷を防止する保護層、無機粒子や基材等の劣化原因となる望ましくない波長の光線を吸収する光線吸収層、水分や酸素ガス等の反応性低分子の透過を抑制あるいは防止する透過遮蔽層、防眩層、反射防止層、低屈折率層等や、任意の付加機能層が設けられてもよい。任意の被覆層の具体例としては、無機酸化物コーティング層からなる透明導電膜やガスバリア膜、有機物コーティング層からなるガスバリア膜やハードコート膜等が挙げられる。コーティング層を形成するためのコーティング法としては、真空蒸着法、CVD法、スパッタリング法、ディップコート法、スピンコート法等公知のコーティング法を用いることができる。 Moreover, as a passive optical member used for an optical function apparatus, a lens, a prism, a prism sheet, a panel (plate-shaped molded object), a film, an optical waveguide (film shape, fiber shape etc.), an optical disk, sealing of LED is mentioned, for example. An agent etc. are illustrated. Such a passive optical member may be provided with an optional coating layer, for example, a protective layer for preventing mechanical damage to the coated surface due to friction or abrasion, an undesirable wavelength of an inorganic particle, a base material, etc. A light absorption layer that absorbs light, a transmission shielding layer that suppresses or prevents transmission of reactive low molecules such as moisture and oxygen gas, an antiglare layer, an antireflective layer, a low refractive index layer, etc. It may be provided. Specific examples of the optional covering layer include a transparent conductive film or a gas barrier film formed of an inorganic oxide coating layer, a gas barrier film or a hard coat film formed of an organic coating layer, and the like. As a coating method for forming a coating layer, well-known coating methods, such as a vacuum evaporation method, CVD method, sputtering method, a dip coating method, a spin coat method, can be used.
 本発明の硬化物を用いた光学部材は、特にレンズ基材に好ましく用いられる。本発明の硬化性組成物を用いて製造されたレンズ基材は低アッベ数を有し、好ましくは、高屈折性、光線透過性、軽量性を併せ持ち、光学特性に優れている。また、硬化性組成物を構成するモノマーの種類を適宜調整することにより、レンズ基材の屈折率を任意に調節することが可能である。
 なお、本明細書中において「レンズ基材」とは、レンズ機能を発揮することができる単一部材を意味する。レンズ基材の表面や周囲には、レンズの使用環境や用途に応じて膜や部材を設けることができる。例えば、レンズ基材の表面には、保護膜、反射防止膜、ハードコート膜等を形成することができる。また、ガラスレンズ基材や、プラスチックレンズ基材に積層させた複合レンズにすることができる。さらにレンズ基材の周囲を基材保持枠などに嵌入して固定することもできる。但し、これらの膜や枠などは、レンズ基材に付加される部材であり、本明細書中でいうレンズ基材そのものとは区別される。
The optical member using the cured product of the present invention is particularly preferably used for a lens substrate. A lens substrate produced using the curable composition of the present invention has a low Abbe number, and preferably has high refractive index, light transmittance, and light weight, and is excellent in optical properties. Moreover, it is possible to adjust the refractive index of a lens base material arbitrarily by adjusting the kind of monomer which comprises a curable composition suitably.
In the present specification, "lens substrate" means a single member capable of exhibiting a lens function. A film or a member can be provided on the surface or the periphery of the lens base according to the use environment or application of the lens. For example, a protective film, an antireflective film, a hard coat film or the like can be formed on the surface of the lens substrate. Moreover, it can be set as the composite lens laminated | stacked on the glass lens base material and the plastic lens base material. Furthermore, the periphery of the lens substrate can be inserted into and fixed to a substrate holding frame or the like. However, these films, frames, and the like are members added to the lens base material, and are distinguished from the lens base material itself referred to in the present specification.
 レンズ基材をレンズとして利用するに際しては、レンズ基材そのものを単独でレンズとして用いてもよいし、上述した膜や枠、その他レンズ基材などを付加してレンズとして用いてもよい。レンズ基材を用いたレンズの種類や形状は、特に制限されない。
 レンズ基材は携帯電話やデジタルカメラ等の撮像用レンズやテレビ、ビデオカメラ等の撮映レンズ、さらには車載レンズ、内視鏡レンズに使用されることが好ましい。
When the lens substrate is used as a lens, the lens substrate itself may be used alone as a lens, or the above-described film or frame, or any other lens substrate may be added and used as a lens. The type and shape of the lens using the lens substrate are not particularly limited.
The lens substrate is preferably used for an imaging lens such as a mobile phone or a digital camera, a television, an imaging lens such as a video camera, and an in-vehicle lens or an endoscope lens.
 以下に実施例及び比較例を挙げて本発明の特徴をさらに具体的に説明する。実施例に記載される材料種、材料の使用量、処理内容、処理手順等は、本発明の趣旨を逸脱しない限り適宜変更することができる。したがって、本発明の範囲は以下に示す具体例により限定的に解釈されるべきものではない。 The features of the present invention will be more specifically described below with reference to examples and comparative examples. The kind of material, the amount of use of the material, the treatment contents, the treatment procedure and the like described in the examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as limited by the specific examples shown below.
化合物の合成
(実施例1)化合物A-2の合成
Figure JPOXMLDOC01-appb-C000027
Synthesis of Compound (Example 1) Synthesis of Compound A-2
Figure JPOXMLDOC01-appb-C000027
(1-1)中間体1の合成
 1L三口フラスコに、窒素気流下で4,4‘-ジブロモベンゾフェノンを6.8g、p-ヒドロキシフェニルボロン酸を8.3g、1,4-ジオキサンを200mL、飽和炭酸水素ナトリウム水溶液を100mL加え、室温で30分撹拌した。その後、ビス(ジ-t-ブチル(4-ジメチルアミノフェニル)ホスフィン)ジクロロパラジウム(II) [(AMPHOS)PdCl]を0.6g添加し、90℃で3時間反応を行った。反応の進行をTLC(薄層クロマトグラフィー)により確認したのち、反応溶液を室温まで冷却した。析出した固体をろ過により回収し、テトラヒドロフランに溶解させた。シリカゲルろ過を行い、ろ液にヘキサンを添加して再結晶を行うことにより中間体1を6.7g得た。
(1-1) Synthesis of Intermediate 1 In a 1 L three-necked flask, 6.8 g of 4,4'-dibromobenzophenone, 8.3 g of p-hydroxyphenylboronic acid, and 200 mL of 1,4-dioxane in a nitrogen stream, 100 mL of saturated sodium hydrogencarbonate aqueous solution was added, and it stirred at room temperature for 30 minutes. Thereafter, 0.6 g of bis (di-t-butyl (4-dimethylaminophenyl) phosphine) dichloropalladium (II) [(AMPHOS) 2 PdCl 2 ] was added, and the reaction was carried out at 90 ° C. for 3 hours. After confirming the progress of the reaction by TLC (thin layer chromatography), the reaction solution was cooled to room temperature. The precipitated solid was collected by filtration and dissolved in tetrahydrofuran. The resultant was filtered through silica gel, hexane was added to the filtrate, and recrystallization was performed to obtain 6.7 g of Intermediate 1.
(1-2)中間体2の合成
 200mLの三口フラスコに、ジメチルホルムアミド(DMF)を40mLと、水素化ナトリウム(NaH)を0.48g(油性、60%)加え、氷浴中で10分撹拌した。ここに中間体1を2.0g加え、室温で1時間撹拌したのち、3-ブロモ-1-プロパノールを1.7g添加した。50℃に昇温し、4時間後、水を少量加え反応を停止した。反応液を酢酸エチルで希釈し、水及び飽和食塩水で洗浄後、有機層を硫酸マグネシウムで乾燥した。ろ過により硫酸マグネシウムを除き、ろ液にヘキサンを加えて再結晶を行うことで、中間体2を1.0g得た。
(1-2) Synthesis of Intermediate 2 In a 200 mL three-necked flask, 40 mL of dimethylformamide (DMF) and 0.48 g (oil, 60%) of sodium hydride (NaH) were added and stirred in an ice bath for 10 minutes did. After 2.0 g of Intermediate 1 was added thereto and stirred at room temperature for 1 hour, 1.7 g of 3-bromo-1-propanol was added. The temperature was raised to 50 ° C., and after 4 hours, a small amount of water was added to stop the reaction. The reaction mixture was diluted with ethyl acetate, washed with water and saturated brine, and the organic layer was dried over magnesium sulfate. Magnesium sulfate was removed by filtration, hexane was added to the filtrate, and recrystallization was performed to obtain 1.0 g of Intermediate 2.
(1-3)化合物A-2の合成
 100mLの三口フラスコに、中間体2を1.0g、p-メトキシフェノール(MEHQ)を10mg、テトラヒドロフラン(THF)を10mL及びトリエチルアミン(TEA)を1.6mL加え、氷浴中で10分撹拌した。ここにメタクリル酸クロリドを1.0g加え、室温で4時間反応させたのち少量の水を加え反応を停止した。反応液を酢酸エチルで希釈し、水及び飽和食塩水で洗浄後、有機層を硫酸マグネシウムで乾燥した。ろ過により硫酸マグネシウムを除き、ろ液にヘキサンを加えて再結晶を行うことで、化合物A-2を0.6g得た。化合物A-2のH-NMR(Nuclear Magnetic Resonance)データは下記の通りであった。
H-NMR(300MHz,DMSO-d):δ1.88(s,6H)、2.05-2.15ppm(m,4H)、4.20-4.35ppm(m,4H)、4.50-4.65ppm(m,4H)、5.70ppm(s,2H)、6.05ppm(s,2H)、7.00-7.15ppm(d,2H)、7.25-7.35ppm(d,2H)、7.60-7.80ppm(m,8H)、7.85-8.00ppm(m,4H)
(1-3) Synthesis of Compound A-2 In a 100 mL three-necked flask, 1.0 g of Intermediate 2, 10 mg of p-methoxyphenol (MEHQ), 10 mL of tetrahydrofuran (THF) and 1.6 mL of triethylamine (TEA) in a three-necked flask In addition, it was stirred for 10 minutes in an ice bath. To this was added 1.0 g of methacrylic acid chloride, and allowed to react at room temperature for 4 hours, and then a small amount of water was added to stop the reaction. The reaction mixture was diluted with ethyl acetate, washed with water and saturated brine, and the organic layer was dried over magnesium sulfate. Magnesium sulfate was removed by filtration, hexane was added to the filtrate, and recrystallization was performed to obtain 0.6 g of a compound A-2. The 1 H-NMR (Nuclear Magnetic Resonance) data of Compound A-2 are as follows.
1 H-NMR (300 MHz, DMSO-d 6 ): δ 1.88 (s, 6 H), 2.05-2.15 ppm (m, 4 H), 4.20-4.35 ppm (m, 4 H), 4. 50-4.65 ppm (m, 4 H), 5.70 ppm (s, 2 H), 6.05 ppm (s, 2 H), 7.00-7.15 ppm (d, 2 H), 7.25-7.35 ppm d, 2H), 7.60-7.80 ppm (m, 8 H), 7.85-8.00 ppm (m, 4 H)
(実施例2)化合物A-4の合成
Figure JPOXMLDOC01-appb-C000028
Example 2 Synthesis of Compound A-4
Figure JPOXMLDOC01-appb-C000028
(2-1)化合物Bの合成
 2Lの三口フラスコに2-ヒドロキシエチルアクリレートを100g入れ、さらにトリエチルアミンを132mLと、酢酸ブチルを650mL加えて攪拌した。反応溶液を5℃に保ちつつ、メタンスルホン酸クロリド70mLを1時間かけて滴下した。1時間攪拌後、反応溶液に水500mLを加え、攪拌した後、水層を除去する操作を3回繰り返した。次いで、ジブチルヒドロキシトルエンを30mg加えた後、減圧することで酢酸ブチルを留去し、化合物Bを160g得た。
(2-1) Synthesis of Compound B In a 2 L three-necked flask, 100 g of 2-hydroxyethyl acrylate was added, and 132 mL of triethylamine and 650 mL of butyl acetate were added and stirred. While maintaining the reaction solution at 5 ° C., 70 mL of methanesulfonic acid chloride was added dropwise over 1 hour. After stirring for 1 hour, 500 mL of water was added to the reaction solution, and after stirring, the operation of removing the aqueous layer was repeated three times. Next, 30 mg of dibutyl hydroxytoluene was added, and then butyl acetate was distilled off under reduced pressure to obtain 160 g of compound B.
(2-2)化合物A-4の合成
 500mLの三口フラスコに、中間体1を5.0g、テトラヒドロフラン(THF)を50mL、ニトロベンゼンを0.05mL、炭酸セシウム(CsCO)を13.3g、及びテトラブチルアンモニウムブロマイド(TBAB)を0.4g入れて攪拌した。ここに化合物Bを9.0g加え、80℃に保ちつつ、5時間反応させた。反応液を室温まで冷却したのちに、水300mLを加え、析出した粗結晶をろ過により回収した。粗結晶をテトラヒドロフランに溶解し、メタノールを加え再結晶することで、化合物A-4を6.5g得た。化合物A-4のH-NMR(Nuclear Magnetic Resonance)データは下記の通りであった。
H-NMR(300MHz,DMSO-d):δ4.22-4.38ppm(m,4H)、4.55-4.70ppm(m,4H)、5.80-5.95ppm(d,2H)、6.15-6.30ppm(m,2H)、6.45-6.55ppm(d,2H)、7.00-7.15ppm(d,2H)、7.25-7.35ppm(d,2H)、7.60-7.80ppm(m,8H)、7.85-8.00ppm(m,4H)
(2-2) Synthesis of Compound A-4 In a 500 mL three-necked flask, 5.0 g of Intermediate 1, 50 mL of tetrahydrofuran (THF), 0.05 mL of nitrobenzene, 13.3 g of cesium carbonate (Cs 2 CO 3 ) And 0.4 g of tetrabutylammonium bromide (TBAB) were added and stirred. To this was added 9.0 g of compound B, and the reaction was carried out for 5 hours while maintaining at 80 ° C. After cooling the reaction solution to room temperature, 300 mL of water was added, and the precipitated crude crystals were collected by filtration. The crude crystals were dissolved in tetrahydrofuran, methanol was added and recrystallized to obtain 6.5 g of compound A-4. The 1 H-NMR (Nuclear Magnetic Resonance) data of Compound A-4 were as follows.
1 H-NMR (300 MHz, DMSO-d 6 ): δ 4.22-4.38 ppm (m, 4 H), 4.55-4. 70 ppm (m, 4 H), 5.85-5. 95 ppm (d, 2 H) ), 6.15-6.30 ppm (m, 2 H), 6.45-6. 55 ppm (d, 2 H), 7.00-7. 15 ppm (d, 2 H), 7. 25-7. 35 ppm (d , 2H), 7.60-7.80 ppm (m, 8 H), 7.85-8.00 ppm (m, 4 H)
(実施例3)化合物A-6の合成
Figure JPOXMLDOC01-appb-C000029
Example 3 Synthesis of Compound A-6
Figure JPOXMLDOC01-appb-C000029
(3-1)中間体3の合成
 200mL三口フラスコに、窒素気流下で4,4‘-ジクロロベンゾフェノンを2.0g、3-ヒドロキシメチル-4-メトキシフェニルボロン酸を4.4g、1,4-ジオキサンを40mL、飽和炭酸水素ナトリウム水溶液を40mL加え、室温で30分撹拌した。その後、ビス(ジ-t-ブチル(4-ジメチルアミノフェニル)ホスフィン)ジクロロパラジウム(II)[(AMPHOS)PdCl]を0.2g添加し、90℃で3時間反応を行った。反応の進行をTLC(薄層クロマトグラフィー)により確認したのち、反応溶液を室温まで冷却、水を添加し、析出した固体をろ過により回収した。得られた粗結晶をメタノール中で撹拌し、洗浄することにより中間体3を3.5g得た。
(3-1) Synthesis of Intermediate 3 In a 200 mL three-necked flask, 2.0 g of 4,4′-dichlorobenzophenone under a nitrogen stream, 4.4 g of 3-hydroxymethyl-4-methoxyphenylboronic acid, 1,4 40 mL of dioxane and 40 mL of saturated aqueous sodium hydrogen carbonate solution were added, and stirred at room temperature for 30 minutes. Thereafter, 0.2 g of bis (di-t-butyl (4-dimethylaminophenyl) phosphine) dichloropalladium (II) [(AMPHOS) 2 PdCl 2 ] was added, and the reaction was carried out at 90 ° C. for 3 hours. After confirming the progress of the reaction by TLC (thin layer chromatography), the reaction solution was cooled to room temperature, water was added, and the precipitated solid was collected by filtration. The obtained crude crystals were stirred in methanol and washed to obtain 3.5 g of Intermediate 3.
(3-2)中間体4の合成
 200mL三口フラスコに、窒素気流下で中間体3を3.3gと、テトラヒドロフラン(THF)を60mL入れ、氷浴中で10分撹拌した。ここに三臭化リン(PBr)を7.0g加え、室温で4時間反応させたのち少量の水を加えて反応を停止した。析出した粗結晶をろ過により回収し、メタノール及び酢酸エチルで洗浄することにより中間体4を3.5g得た。
(3-2) Synthesis of Intermediate 4 In a 200 mL three-necked flask, 3.3 g of Intermediate 3 and 60 mL of tetrahydrofuran (THF) were charged under a nitrogen stream, and stirred in an ice bath for 10 minutes. To this was added 7.0 g of phosphorus tribromide (PBr 3 ), allowed to react at room temperature for 4 hours, and then a small amount of water was added to stop the reaction. The precipitated crude crystals were collected by filtration and washed with methanol and ethyl acetate to obtain 3.5 g of Intermediate 4.
(3-3)中間体5の合成
 200mLの三口フラスコに、テトラヒドロフラン(THF)を40mLと、水素化ナトリウム(NaH)を0.56g(油性、60%)加え、氷浴で冷却したのち、2-メチル-1,3-プロパンジオール1.6gのテトラヒドロフラン溶液を3mL加え、室温で撹拌した。1時間後、中間体4を2.5g加え、60℃で3時間反応を行った。室温まで冷却後、反応液を酢酸エチルで希釈し、水及び飽和食塩水で洗浄後、有機層を硫酸マグネシウムで乾燥した。ろ過により硫酸マグネシウムを除き、ろ液にヘキサンを加え再結晶を行うことにより中間体5を2.3g得た。
(3-3) Synthesis of Intermediate 5 In a 200 mL three-necked flask, 40 mL of tetrahydrofuran (THF) and 0.56 g of sodium hydride (NaH) (oil, 60%) were added, and after cooling in an ice bath, 2 3 mL of a tetrahydrofuran solution of 1.6 g of methyl-1,3-propanediol was added and stirred at room temperature. After 1 hour, 2.5 g of Intermediate 4 was added, and the reaction was performed at 60 ° C. for 3 hours. After cooling to room temperature, the reaction mixture was diluted with ethyl acetate, washed with water and saturated brine, and the organic layer was dried over magnesium sulfate. Magnesium sulfate was removed by filtration, hexane was added to the filtrate, and recrystallization was performed to obtain 2.3 g of Intermediate 5.
(3-4)化合物A-6の合成
 100mLの三口フラスコに、中間体5を1.8g、p-メトキシフェノール(MEHQ)を10mg、クロロホルムを20mL及びトリエチルアミン(TEA)を3.0mL加え、氷浴中で10分撹拌した。ここにメタクリル酸クロリドを2.0g加え、室温で4時間反応させたのち少量の水を加え反応を停止した。反応液を酢酸エチルで希釈し、水及び飽和食塩水で洗浄後、有機層を硫酸マグネシウムで乾燥した。ろ過により硫酸マグネシウムを除いたあと、ヘキサン/酢酸エチルを展開溶媒とするシリカゲルカラムクロマトグラフィーにより精製し、化合物A-6を1.3g得た。化合物A-6のH-NMR(Nuclear Magnetic Resonance)データは下記の通りであった。
H-NMR(300MHz,DMSO-d):δ0.92-1.00(d,6H)、1.85(s,6H)、2.10-2.20ppm(m,2H)、3.40-3.50ppm(m,4H)、3.85ppm(s,6H)、4.00-4.20ppm(m,4H)、4.55ppm(s,4H)、5.60ppm(s,2H)、6.00ppm(s,2H)、7.10-7.20ppm(d,2H)、7.65-7.75ppm(m,4H)、7.80-7.90ppm(m,8H)
(3-4) Synthesis of Compound A-6 In a 100 mL three-necked flask, 1.8 g of Intermediate 5, 10 mg of p-methoxyphenol (MEHQ), 20 mL of chloroform and 3.0 mL of triethylamine (TEA) are added, and ice is added Stir in the bath for 10 minutes. After 2.0 g of methacrylic acid chloride was added thereto and allowed to react at room temperature for 4 hours, a small amount of water was added to stop the reaction. The reaction mixture was diluted with ethyl acetate, washed with water and saturated brine, and the organic layer was dried over magnesium sulfate. After magnesium sulfate was removed by filtration, the residue was purified by silica gel column chromatography using hexane / ethyl acetate as a developing solvent to obtain 1.3 g of compound A-6. The 1 H-NMR (Nuclear Magnetic Resonance) data of Compound A-6 were as follows.
1 H-NMR (300 MHz, DMSO-d 6 ): δ 0.92 to 1.00 (d, 6 H), 1.85 (s, 6 H), 2.10 to 2.20 ppm (m, 2 H); 40-3.50 ppm (m, 4 H), 3.85 ppm (s, 6 H), 4.00-4. 20 ppm (m, 4 H), 4.55 ppm (s, 4 H), 5. 60 ppm (s, 2 H) 6.00 ppm (s, 2 H), 7.10-7.20 ppm (d, 2 H), 7.65-7. 75 ppm (m, 4 H), 7. 8-7. 90 ppm (m, 8 H)
(実施例4)化合物A-17の合成
Figure JPOXMLDOC01-appb-C000030
Example 4 Synthesis of Compound A-17
Figure JPOXMLDOC01-appb-C000030
(4-1)中間体6の合成
 アクリル酸ヒドロキシプロピル40g、ジクロロメタン300mL、N,N-ジメチルアミノピリジン3.8g、無水コハク酸33.8g、2,6-ジ-t-ブチル-4-メチルフェノール200mgを混合し、内温を40℃まで加熱した。12時間撹拌した後、室温へと冷却して水300mLを加えて1時間撹拌し、分液を行った。集めた有機層を1mol/Lの塩酸水、飽和食塩水で洗浄した後、無水硫酸ナトリウムで乾燥した。硫酸ナトリウムを濾別して、ロータリーエバポレーターで溶媒を除去し、透明なオイルである中間体6を70g得た。
(4-1) Synthesis of Intermediate 6 40 g of hydroxypropyl acrylate, 300 mL of dichloromethane, 3.8 g of N, N-dimethylaminopyridine, 33.8 g of succinic anhydride, 2,6-di-t-butyl-4-methyl 200 mg of phenol were mixed and the internal temperature was heated to 40.degree. After stirring for 12 hours, the reaction solution was cooled to room temperature, 300 mL of water was added, the mixture was stirred for 1 hour, and liquid separation was performed. The collected organic layer was washed with 1 mol / L hydrochloric acid water and saturated brine and then dried over anhydrous sodium sulfate. The sodium sulfate was filtered off and the solvent was removed on a rotary evaporator to give 70 g of Intermediate 6 which is a clear oil.
(4-2)化合物17の合成
 300mLの三口フラスコに、中間体3を9.1g、中間体6を11.1g、N,N-ジメチルアミノピリジン(DMAP)240mgおよびジクロロメタン100mLを加え、氷浴中で10分撹拌した。ここに1-(3-ジメチルアミノプロピル)-3-エチルカルボジイミド塩酸塩(EDAC・HCl)を9.2g加え、室温で4時間反応させた。反応液を酢酸エチルで希釈し、水、飽和炭酸水素ナトリウム水溶液、飽和食塩水の順で洗浄後、有機層を硫酸マグネシウムで乾燥した。ろ過により硫酸マグネシウムを除いたあと、ヘキサン/酢酸エチルを展開溶媒とするシリカゲルカラムクロマトグラフィーにより精製し、化合物A-17を15.0g得た。化合物A-17のH-NMR(Nuclear Magnetic Resonance)データは下記の通りであった。
H-NMR(300MHz,DMSO-d):δ1.10-1.20(d,6H)、2.56-2.68ppm(m,8H)、3.88ppm(s,6H)、4.00-4.20ppm(m,4H)、5.00-5.10ppm(m,2H)、5.15ppm(s,4H)、5.88-5.96ppm(m,2H)、6.05-6.20ppm(m,2H)、6.25-6.35ppm(m,2H)、7.15-7.25ppm(d,2H)、7.70-7.80ppm(m,4H)、7.80-7.90ppm(m,8H)
(4-2) Synthesis of Compound 17 In a 300 mL three-necked flask, 9.1 g of Intermediate 3, 11.1 g of Intermediate 6, 240 mg of N, N-dimethylaminopyridine (DMAP) and 100 mL of dichloromethane were added, and an ice bath was added. The mixture was stirred for 10 minutes. To this was added 9.2 g of 1- (3-dimethylaminopropyl) -3-ethylcarbodiimide hydrochloride (EDAC.HCl), and allowed to react at room temperature for 4 hours. The reaction mixture was diluted with ethyl acetate, washed with water, saturated aqueous sodium hydrogen carbonate solution and saturated brine in this order, and the organic layer was dried over magnesium sulfate. After magnesium sulfate was removed by filtration, the residue was purified by silica gel column chromatography using hexane / ethyl acetate as a developing solvent to obtain 15.0 g of compound A-17. The 1 H-NMR (Nuclear Magnetic Resonance) data of Compound A-17 were as follows.
1 H-NMR (300 MHz, DMSO-d 6 ): δ 1.10-1.20 (d, 6 H), 2.56-2.68 ppm (m, 8 H), 3.88 ppm (s, 6 H), 4. 00-4.20 ppm (m, 4 H), 5.00-5. 10 ppm (m, 2 H), 5. 15 ppm (s, 4 H), 5. 88-5. 96 ppm (m, 2 H), 6.05- 6.20 ppm (m, 2 H), 6.25-6. 35 ppm (m, 2 H), 7.15-7. 25 ppm (d, 2 H), 7. 7-7. 80 ppm (m, 4 H), 7. 80-7.90 ppm (m, 8 H)
(比較例1)
 特開2014-43565号公報に記載される方法で下記構造を有する化合物を合成した。これを比較化合物1とした。
Figure JPOXMLDOC01-appb-C000031
(Comparative example 1)
A compound having the following structure was synthesized by the method described in JP-A-2014-43565. This was taken as comparative compound 1.
Figure JPOXMLDOC01-appb-C000031
化合物の屈折率特性評価
 実施例1~4及び比較例1で得られた各化合物をプロピレングリコールモノメチルエーテルアセテートに溶解させた。このとき、各化合物の濃度は1~10重量パーセントの範囲内となるように調整した。得られた各溶液をスピンコーティングにより石英基板上に塗布し、80℃のホットプレート上で3時間乾燥させることで、膜厚200~500nmの層を有する光学特性評価用基板を作製した。この評価用基板をV字形状に加工して、各サンプルの屈折率(nF)、アッベ数(νd)及び部分分散比(θg,F)をカルニュー精密屈折計(株式会社島津デバイス製造製:型番KPR-2000)を用いて測定した。測定は各サンプルについて3回行い、平均値を測定結果とした。結果を表1に示す。
Evaluation of Refractive Index Properties of Compounds The compounds obtained in Examples 1 to 4 and Comparative Example 1 were dissolved in propylene glycol monomethyl ether acetate. At this time, the concentration of each compound was adjusted to be in the range of 1 to 10 weight percent. Each solution thus obtained was applied onto a quartz substrate by spin coating and dried on a hot plate at 80 ° C. for 3 hours to produce a substrate for evaluating optical characteristics having a layer having a thickness of 200 to 500 nm. This evaluation substrate is processed into a V-shape, and the refractive index (nF), Abbe number (dd) and partial dispersion ratio (θg, F) of each sample are measured by a Carnew precision refractometer (manufactured by Shimadzu Corporation, model number) It measured using KPR-2000). The measurement was performed three times for each sample, and the average value was taken as the measurement result. The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000032
Figure JPOXMLDOC01-appb-T000032
硬化性組成物の熱硬化と、熱硬化物の屈折率特性評価と湿熱耐久性評価
(実施例5~8、比較例2)硬化性組成物の調製と熱硬化
 表2に記載の組成となるように各成分を添加し、攪拌して均一にし、硬化性組成物を調製した。得られた硬化性組成物を、直径20mm、厚み2mmの透明ガラス型に注入し、酸素濃度1%以下の雰囲気下、200℃に加熱することで熱硬化物を作製した。特性を評価するためにV字形状に加工して、実施例1~4と同じ方法により各サンプルの屈折率(nF)、アッベ数(νd)及び部分分散比(θg,F)を測定した。また、下記の方法にしたがって、各サンプルの湿熱耐久性評価も行った。結果を表2に示す。
Thermosetting of a curable composition, refractive index property evaluation of a thermally cured product, and wet heat durability evaluation (Examples 5 to 8, Comparative Example 2) Preparation of a curable composition and thermal curing The composition shown in Table 2 Each component was added as such, and stirred to be uniform to prepare a curable composition. The resulting curable composition was poured into a transparent glass mold having a diameter of 20 mm and a thickness of 2 mm, and was heated to 200 ° C. in an atmosphere with an oxygen concentration of 1% or less to produce a thermally cured product. In order to evaluate the characteristics, it was processed into a V-shape, and the refractive index (nF), Abbe number (dd) and partial dispersion ratio (θg, F) of each sample were measured by the same method as in Examples 1-4. Moreover, the wet heat durability evaluation of each sample was also performed according to the following method. The results are shown in Table 2.
<湿熱耐久性評価>
 屈折率(nd)を測定した各サンプルを85℃、相対湿度85%に保たれた恒温恒湿槽に入れて24時間保管した後、取り出した。次いで、25℃、相対湿度60%で1時間放置した後、屈折率(nd)を測定し、湿熱試験前後での屈折率の変化量を以下のA~Cの3段階で評価した。
 A:湿熱試験前後で屈折率変化が0.0005以下
 B:湿熱試験前後で屈折率変化が0.0005より大きく、0.001以下
 C:湿熱試験前後で屈折率変化が0.001より大きい
<Damp heat durability evaluation>
Each sample whose refractive index (nd) was measured was put in a thermo-hygrostatic chamber kept at 85 ° C. and 85% relative humidity and stored for 24 hours, and then taken out. Next, after standing at 25 ° C. and relative humidity 60% for 1 hour, the refractive index (nd) was measured, and the change amount of the refractive index before and after the wet heat test was evaluated in three stages of A to C below.
A: Refractive index change is 0.0005 or less before and after wet heat test B: Refractive index change is larger than 0.0005 and less than 0.001 before and after wet heat test C: Refractive index change is larger than 0.001 before and after wet heat test
Figure JPOXMLDOC01-appb-T000033
Figure JPOXMLDOC01-appb-T000033
 表2に記載される各成分の配合量は質量%で表したものである。また、表2に記載される光重合開始剤と熱重合開始剤の詳細は下記の通りである。
 イルガキュア819(BASF社製)
    ビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキサイド
 パーブチルO(日本油脂株式会社製)
   t-ブチルペルオキシ2-エチルヘキサノエート
 パークミルH-80(日本油脂株式会社製)
   クメンヒドロペルオキシド
The compounding quantity of each component described in Table 2 is represented by mass%. The details of the photopolymerization initiator and the thermal polymerization initiator described in Table 2 are as follows.
Irgacure 819 (manufactured by BASF)
Bis (2,4,6-trimethyl benzoyl) phenyl phosphine oxide Perbutyl O (manufactured by NOF Corporation)
t-Butylperoxy 2-ethylhexanoate Park Mill H-80 (manufactured by NOF Corporation)
Cumene hydroperoxide
 表1に示すように、実施例1~4は、比較例1に比べて屈折率(nF)が同等以上で、アッベ数(νd)が低く、部分分散比(θg,F)が高くて好ましい特性を有することが確認された。
 表2に示すように、実施例5~8は、比較例2に比べて湿熱耐久性が格段に改善されていることが確認された。また、共重合モノマー量が同じである実施例7及び8と比較例2との対比では、実施例7及び8の方が屈折率(nF)が同等以上で、アッベ数(νd)が低く、部分分散比(θg,F)が高くて好ましい特性を有することが確認された。
As shown in Table 1, Examples 1 to 4 are preferable because the refractive index (nF) is equal to or higher than that of Comparative Example 1, the Abbe number (高 く d) is low, and the partial dispersion ratio (θg, F) is high. It was confirmed to have the characteristics.
As shown in Table 2, in Examples 5 to 8, it was confirmed that the wet heat durability was remarkably improved as compared with Comparative Example 2. Further, in comparison between Examples 7 and 8 and Comparative Example 2 in which the amount of copolymerized monomer is the same, Examples 7 and 8 have equal or higher refractive index (nF) and lower Abbe number (νd), It was confirmed that the partial dispersion ratio (θg, F) is high and that it has desirable characteristics.
レンズの製造
(実施例9)複合レンズの製造
 表面が窒化クロム処理された成形金型(硬化性組成物と接する面が非球面形状を有する)に実施例7で得た硬化性組成物を200mg注入し、硬化性組成物の成形金型と接していない側のすべての表面上を覆うように透明なガラスレンズ(硝材BK-7、直径33mm、中心厚み3mm、硬化性組成物と接する面の曲率半径=44.3mm、硬化性組成物と接しない面の曲率半径=330.9mmである凸レンズ)を被せて、硬化性組成物の直径が30mmとなるように押し広げた。この状態とした後、ガラスレンズの上方から、Execure3000(HOYA株式会社製)を用いて300mJ/cmの紫外線を照射して硬化性組成物を半硬化させた。次いで、成形金型及びガラスレンズによって挟まれた状態を維持したまま、硬化性組成物に0.196MPa(2kgf/cm)の圧力を印加しながら200℃まで昇温し、さらに硬化させた。ついで、金型温度を180℃に冷却した後、硬化性組成物の硬化物と成形金型とを0.05mm/秒の速度で引き離すことにより、複合レンズを製造した。
 
Production of Lens (Example 9) Production of Composite Lens 200 mg of the curable composition obtained in Example 7 in a mold having a surface treated with chromium nitride (the surface in contact with the curable composition has an aspheric shape) A transparent glass lens (glass material BK-7, diameter 33 mm, center thickness 3 mm, surface in contact with the curable composition) so as to cover all the surfaces of the curable composition on the side not in contact with the molding die. A convex lens having a radius of curvature of 44.3 mm and a radius of curvature of the surface not in contact with the curable composition of 330.9 mm was placed on the surface, and the curable composition was spread so as to have a diameter of 30 mm. After this state, a 300 mJ / cm 2 ultraviolet ray was irradiated from above the glass lens using Execure 3000 (manufactured by HOYA Co., Ltd.) to semi-cure the curable composition. Next, while maintaining a state of being sandwiched between the molding die and the glass lens, the temperature was raised to 200 ° C. while applying a pressure of 0.196 MPa (2 kgf / cm 2 ) to the curable composition, and the composition was further cured. Then, the mold temperature was cooled to 180 ° C., and the cured product of the curable composition and the mold were pulled apart at a speed of 0.05 mm / sec to produce a composite lens.

Claims (17)

  1.  下記一般式(1)で表される化合物を含む、硬化性組成物。
    Figure JPOXMLDOC01-appb-C000001
    一般式(1)において、
     R~R10は、各々独立に、水素原子又は置換基を表し、
     R~Rの少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基、又は、(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基であり、
     R~R10の少なくとも1つは、置換もしくは無置換のアリール基、又は、置換もしくは無置換のヘテロアリール基である。
     RとR、RとR、RとR、RとR、RとR、RとR、RとR、RとR10は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(1)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
    Curable composition containing the compound represented by following General formula (1).
    Figure JPOXMLDOC01-appb-C000001
    In the general formula (1),
    R 1 to R 10 each independently represent a hydrogen atom or a substituent,
    At least one of R 1 to R 5 is an aryl group substituted with a (meth) acryloyloxy group-containing substituent or a heteroaryl group substituted with a (meth) acryloyloxy group-containing substituent,
    At least one of R 6 to R 10 is a substituted or unsubstituted aryl group or a substituted or unsubstituted heteroaryl group.
    R 1 and R 2 , R 2 and R 3 , R 3 and R 4 , R 4 and R 5 , R 6 and R 7 , R 7 and R 8 , R 8 and R 9 , R 9 and R 10 respectively They may be bonded to each other to form a linking group necessary to form a cyclic structure. However, the molecule represented by the general formula (1) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  2.  R~R10の少なくとも1つが、(メタ)アクリロイルオキシ基を含む置換基で置換されたアリール基、又は、(メタ)アクリロイルオキシ基を含む置換基で置換されたヘテロアリール基である、請求項1に記載の硬化性組成物。 At least one of R 6 to R 10 is an aryl group substituted with a substituent containing a (meth) acryloyloxy group, or a heteroaryl group substituted with a substituent containing a (meth) acryloyloxy group The curable composition according to Item 1.
  3.  前記化合物が下記一般式(2)で表される、請求項1に記載の硬化性組成物。
    Figure JPOXMLDOC01-appb-C000002
    一般式(2)において、
     R及びRは、各々独立に、アリール基及びヘテロアリール基以外の置換基を表し、
     n1及びn2は、各々独立に0~4の整数を表し、n1が2以上であるとき、複数のRは同一であっても異なっていてもよく、また、n2が2以上であるとき、複数のRは同一であっても異なっていてもよく、
     R11~R20は、各々独立に、水素原子又は置換基を表し、
     R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
     R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのR、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのRは、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(2)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
    The curable composition according to claim 1, wherein the compound is represented by the following general formula (2).
    Figure JPOXMLDOC01-appb-C000002
    In the general formula (2),
    R a and R b each independently represent a substituent other than an aryl group and a heteroaryl group,
    n1 and n2 each independently represent an integer of 0 to 4. When n1 is 2 or more, plural Ras may be the same or different, and when n2 is 2 or more, The plurality of R b may be the same or different,
    R 11 to R 20 each independently represent a hydrogen atom or a substituent,
    At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
    R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 and R 17 , R 17 and R 18 , R 18 and R 19 , R 19 and R 20 , benzene ring Two R a each bonded to an adjacent ring skeleton-forming atom and two R b each bonded to an adjacent ring skeleton-forming atom of a benzene ring to each other to form a cyclic structure It may form a linking group. However, the molecule represented by the general formula (2) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  4.  前記化合物が下記一般式(3)で表される、請求項1に記載の硬化性組成物。
    Figure JPOXMLDOC01-appb-C000003
    一般式(3)において、
     R、R、R、R、R、R、R及びR10は、各々独立に、水素原子を表すか、あるいは、アリール基及びヘテロアリール基以外の置換基を表し、
     R11~R20は、各々独立に、水素原子又は置換基を表し、
     R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
     RとR、RとR、RとR、RとR10、R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20は、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(3)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
    The curable composition according to claim 1, wherein the compound is represented by the following general formula (3).
    Figure JPOXMLDOC01-appb-C000003
    In the general formula (3),
    R 1 , R 2 , R 4 , R 5 , R 6 , R 7 , R 9 and R 10 each independently represent a hydrogen atom or a substituent other than an aryl group and a heteroaryl group,
    R 11 to R 20 each independently represent a hydrogen atom or a substituent,
    At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
    R 1 and R 2 , R 4 and R 5 , R 6 and R 7 , R 9 and R 10 , R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 And R 17 , R 17 and R 18 , R 18 and R 19 , and R 19 and R 20 may be bonded to each other to form a linking group necessary to form a cyclic structure. However, the molecule represented by the general formula (3) does not include a polycyclic structure in which three or more aromatic rings are condensed.
  5.  R12が(メタ)アクリロイルオキシ基を含む置換基である、請求項3又は4に記載の硬化性組成物。 R 12 is a substituent containing a (meth) acryloyloxy group, the curable composition according to claim 3 or 4.
  6.  R16~R20の少なくとも1つが、(メタ)アクリロイルオキシ基を含む置換基である、請求項3~5のいずれか1項に記載の硬化性組成物。 The curable composition according to any one of claims 3 to 5, wherein at least one of R 16 to R 20 is a substituent containing a (meth) acryloyloxy group.
  7.  R11、R15、R16及びR20が水素原子である、請求項3~6のいずれか1項に記載の硬化性組成物。 The curable composition according to any one of claims 3 to 6, wherein R 11 , R 15 , R 16 and R 20 are a hydrogen atom.
  8.  前記(メタ)アクリロイルオキシ基を含む置換基が下記一般式(4)で表される、請求項1~7のいずれか1項に記載の硬化性組成物。
    Figure JPOXMLDOC01-appb-C000004
    一般式(4)において、
     Acは、(メタ)アクリロイルオキシ基を表し、
     Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
     Lは、カルボニル基、エーテル基、チオカルボニル基、チオエーテル基、又は、これらの基を組み合わせた連結基を表し、
     Lは、置換基を有してもよい炭素数1~6のアルキレン基を表し、
     m1は0~10のいずれかの整数を表し、m1が2以上であるとき、複数のLは同一であっても異なっていてもよく、また、複数のLも同一であっても異なっていてもよく、
     m2は0又は1を表し、
     *は、(メタ)アクリロイルオキシ基を含む置換基の結合部位を示す。
    The curable composition according to any one of claims 1 to 7, wherein the substituent containing a (meth) acryloyloxy group is represented by the following general formula (4).
    Figure JPOXMLDOC01-appb-C000004
    In the general formula (4),
    Ac represents a (meth) acryloyloxy group,
    L 1 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
    L 2 represents a carbonyl group, an ether group, a thiocarbonyl group, a thioether group, or a linking group combining these groups,
    L 3 represents an alkylene group having 1 to 6 carbon atoms which may have a substituent,
    m1 represents an integer of 0 to 10, and when m1 is 2 or more, a plurality of L 1 s may be the same or different, and a plurality of L 2 s may be the same or different May be
    m2 represents 0 or 1;
    * Represents a bonding site of a substituent containing a (meth) acryloyloxy group.
  9.  前記(メタ)アクリロイルオキシ基を含む置換基が、(メタ)アクリロイルオキシアルコキシ基、(メタ)アクリロイルオキシアルコキシアルキル基、(メタ)アクリロイルオキシアルコキシカルボニルアルキル基、(メタ)アクリロイルオキシアルコキシカルボニルアシルオキシ基、又は、(メタ)アクリロイルオキシアルコキシカルボニルアシルオキシアルキル基である、請求項8に記載の硬化性組成物。 The substituent containing the (meth) acryloyloxy group is a (meth) acryloyloxyalkoxy group, a (meth) acryloyloxyalkoxyalkyl group, a (meth) acryloyloxyalkoxycarbonylalkyl group, a (meth) acryloyloxyalkoxycarbonylacyloxy group, Alternatively, the curable composition according to claim 8, which is a (meth) acryloyloxyalkoxycarbonylacyloxyalkyl group.
  10.  前記化合物が、分子中に前記(メタ)アクリロイルオキシ基を含む置換基を2つ以上含む、請求項1~9のいずれか1項に記載の硬化性組成物。 The curable composition according to any one of claims 1 to 9, wherein the compound contains two or more substituents containing the (meth) acryloyloxy group in the molecule.
  11.  前記化合物が、分子中に芳香環が2つ以上縮合した多環構造を含まない、請求項1~10のいずれか1項に記載の硬化性組成物。 The curable composition according to any one of claims 1 to 10, wherein the compound does not contain a polycyclic structure in which two or more aromatic rings are condensed in the molecule.
  12.  前記硬化性組成物が、光ラジカル重合開始剤及び熱ラジカル重合開始剤から選択される少なくとも1種を含有する、請求項1~11のいずれか1項に記載の硬化性組成物。 The curable composition according to any one of claims 1 to 11, wherein the curable composition contains at least one selected from a photo radical polymerization initiator and a thermal radical polymerization initiator.
  13.  請求項1~12のいずれか1項に記載の硬化性組成物の半硬化物。 A semi-cured product of the curable composition according to any one of claims 1 to 12.
  14.  請求項1~12のいずれか1項に記載の硬化性組成物の硬化物。 A cured product of the curable composition according to any one of claims 1 to 12.
  15.  請求項14に記載の硬化物を含む光学部材。 An optical member comprising the cured product according to claim 14.
  16.  請求項14に記載の硬化物を含むレンズ。 A lens comprising the cured product according to claim 14.
  17.  下記一般式(2)で表される化合物。
    Figure JPOXMLDOC01-appb-C000005
    一般式(2)において、
     R及びRは、各々独立に、アリール基及びヘテロアリール基以外の置換基を表し、
     n1及びn2は、各々独立に0~4の整数を表し、
     R11~R20は、各々独立に、水素原子又は置換基を表し、
     R11~R15の少なくとも1つは、(メタ)アクリロイルオキシ基を含む置換基である。
     R11とR12、R12とR13、R13とR14、R14とR15、R16とR17、R17とR18、R18とR19、R19とR20、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのR、ベンゼン環の隣り合う環骨格形成原子にそれぞれ結合した2つのRは、各々互いに結合して、環状構造を形成するのに必要な連結基を形成してもよい。ただし、一般式(2)で表される分子中に芳香環が3つ以上縮合した多環構造が含まれることはない。
     
     
    The compound represented by following General formula (2).
    Figure JPOXMLDOC01-appb-C000005
    In the general formula (2),
    R a and R b each independently represent a substituent other than an aryl group and a heteroaryl group,
    n1 and n2 each independently represent an integer of 0 to 4;
    R 11 to R 20 each independently represent a hydrogen atom or a substituent,
    At least one of R 11 to R 15 is a substituent containing a (meth) acryloyloxy group.
    R 11 and R 12 , R 12 and R 13 , R 13 and R 14 , R 14 and R 15 , R 16 and R 17 , R 17 and R 18 , R 18 and R 19 , R 19 and R 20 , benzene ring Two R a each bonded to an adjacent ring skeleton-forming atom and two R b each bonded to an adjacent ring skeleton-forming atom of a benzene ring to each other to form a cyclic structure It may form a linking group. However, the molecule represented by the general formula (2) does not include a polycyclic structure in which three or more aromatic rings are condensed.

PCT/JP2018/022517 2017-06-23 2018-06-13 Curable composition, semi-cured product, cured product, optical member, lens and compound WO2018235688A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019525475A JP6887017B2 (en) 2017-06-23 2018-06-13 Curable composition, semi-curable product, cured product, optical member, lens and compound
US16/715,952 US10954183B2 (en) 2017-06-23 2019-12-16 Curable composition, semi-cured product, cured product, optical member, lens, and compound

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017123582 2017-06-23
JP2017-123582 2017-06-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/715,952 Continuation US10954183B2 (en) 2017-06-23 2019-12-16 Curable composition, semi-cured product, cured product, optical member, lens, and compound

Publications (1)

Publication Number Publication Date
WO2018235688A1 true WO2018235688A1 (en) 2018-12-27

Family

ID=64737563

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/022517 WO2018235688A1 (en) 2017-06-23 2018-06-13 Curable composition, semi-cured product, cured product, optical member, lens and compound

Country Status (3)

Country Link
US (1) US10954183B2 (en)
JP (1) JP6887017B2 (en)
WO (1) WO2018235688A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367201A (en) * 1989-04-26 1991-03-22 Nippon Oil & Fats Co Ltd High refractive index optical resin
JPH0534647A (en) * 1991-07-30 1993-02-12 Tokyo Keikaku:Kk Hard contact lens not eluting ultraviolet absorber
JPH0561006A (en) * 1991-09-03 1993-03-12 Tokyo Keikaku:Kk Soft contact lens having high ultraviolet ray absorbing effect
JPH05271316A (en) * 1992-03-27 1993-10-19 Mitsubishi Petrochem Co Ltd Photo-setting composition
JPH08208776A (en) * 1995-02-07 1996-08-13 Nippon Kayaku Co Ltd Resin composition, composition for lens and cured material thereof
JPH0912642A (en) * 1995-06-28 1997-01-14 Ishihara Chem Co Ltd Ultraviolet-absorbing polymer and its production, ultraviolet absorber, and ultraviolet-absorbing glass
JP2008137938A (en) * 2006-12-01 2008-06-19 Toagosei Co Ltd Method for producing (meth)acrylate having thiobisphenol skeleton
JP2014043565A (en) * 2012-07-30 2014-03-13 Canon Inc (meth)acrylate compound, optical composition, molded article, and optical element

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57116728A (en) * 1981-01-14 1982-07-20 High Frequency Heattreat Co Ltd Stress relief heat treatment and suspension device for cold formed coil spring material
JP5061862B2 (en) 2007-11-21 2012-10-31 コニカミノルタアドバンストレイヤー株式会社 Optical device manufacturing method and optical element manufacturing method
JP5825798B2 (en) 2011-02-09 2015-12-02 キヤノン株式会社 Compound for optical element, optical material and optical element
JP5685149B2 (en) 2010-10-25 2015-03-18 富士フイルム株式会社 Semi-cured product, cured product and production method thereof, optical component, cured resin composition
EP3242898A4 (en) 2015-01-05 2018-10-24 IGM Group B.V. Led-curable low migration photoinitiators
WO2016111925A1 (en) * 2015-01-05 2016-07-14 Bolger David V Apparatuses and systems for converting fluid energy to mechanical motion
JP6327408B1 (en) * 2016-08-03 2018-05-23 三菱瓦斯化学株式会社 (Meth) acrylic composition, paint and cured product containing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367201A (en) * 1989-04-26 1991-03-22 Nippon Oil & Fats Co Ltd High refractive index optical resin
JPH0534647A (en) * 1991-07-30 1993-02-12 Tokyo Keikaku:Kk Hard contact lens not eluting ultraviolet absorber
JPH0561006A (en) * 1991-09-03 1993-03-12 Tokyo Keikaku:Kk Soft contact lens having high ultraviolet ray absorbing effect
JPH05271316A (en) * 1992-03-27 1993-10-19 Mitsubishi Petrochem Co Ltd Photo-setting composition
JPH08208776A (en) * 1995-02-07 1996-08-13 Nippon Kayaku Co Ltd Resin composition, composition for lens and cured material thereof
JPH0912642A (en) * 1995-06-28 1997-01-14 Ishihara Chem Co Ltd Ultraviolet-absorbing polymer and its production, ultraviolet absorber, and ultraviolet-absorbing glass
JP2008137938A (en) * 2006-12-01 2008-06-19 Toagosei Co Ltd Method for producing (meth)acrylate having thiobisphenol skeleton
JP2014043565A (en) * 2012-07-30 2014-03-13 Canon Inc (meth)acrylate compound, optical composition, molded article, and optical element

Also Published As

Publication number Publication date
JPWO2018235688A1 (en) 2020-04-09
US10954183B2 (en) 2021-03-23
JP6887017B2 (en) 2021-06-16
US20200115316A1 (en) 2020-04-16

Similar Documents

Publication Publication Date Title
US10370473B2 (en) Compound, curable composition, cured product, optical member, and lens
CN111032704B (en) Cured product, optical component, lens, compound, and curable composition
CN111051363B (en) Compound, curable composition, cured product, optical component, and lens
JP6546986B2 (en) Curable composition, cured product, optical member, lens and compound
JP6743279B2 (en) Curable composition, cured product, optical member and lens
JP7165797B2 (en) Curable composition, cured product, optical member, lens, and compound
US11396613B2 (en) Cured product, optical member, lens, and compound
US10954183B2 (en) Curable composition, semi-cured product, cured product, optical member, lens, and compound
US10604503B2 (en) Curable composition, cured product, optical member, lens, and compound
US11230619B2 (en) Curable composition, cured product, optical member, lens, and method for producing cured product
WO2015022973A1 (en) Curable resin composition, optical component, lens, and method for manufacturing optical component
CN114222769B (en) Curable composition, cured product, optical member, and lens
US20210403438A1 (en) Curable composition, cured product, optical member, lens, and method for manufacturing optical member

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18819585

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019525475

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18819585

Country of ref document: EP

Kind code of ref document: A1