WO2018229250A1

WO2018229250A1 - Method and system for producing an electrical component, and computer program

Info

Publication number: WO2018229250A1
Application number: PCT/EP2018/065948
Authority: WO
Inventors: Marc Christopher Wurz; Daniel Klaas; Hans Jürgen Maier
Original assignee: Gottfried Wilhelm Leibniz Universität Hannover
Priority date: 2017-06-15
Filing date: 2018-06-15
Publication date: 2018-12-20
Also published as: DE102017113212B3; EP3638825A1

Abstract

The invention relates to a method for producing an electrical component with at least one electrical characteristic variable of the electrical component in a predefined tolerance range, wherein the electrical component is formed by depositing a material on a substrate, wherein respective values of the electrical characteristic variable are captured continuously or at discrete times by means of measurements over the course of the deposition process, and at least one parameter of the deposition process is influenced on the basis of one, more or all captured values until the electrical characteristic variable is in the predefined tolerance range. The invention also relates to a system for producing an electrical component by means of such a method and to a computer program for carrying out such a method.

Description

Method and installation for the production of an electrical component and computer program

The invention relates to a method for producing an electrical component having at least one electrical parameter of the electrical component, which is in a predetermined tolerance range, wherein the electrical component is formed by depositing a material on a substrate. The invention also relates to a system for producing an electrical component by means of such a method and to a computer program for carrying out such a method.

Electrical components, such. As resistors or sensors are manufactured in modern manufacturing processes by depositing a material on a substrate. The deposition process used for this purpose may, for. As a CVD process (chemical vapor deposition) or PVD process (physical vapor deposition), whereby other methods of vapor deposition or other deposition methods can be used. In this way, for example, strain sensors or pressure sensors are produced, wherein the sensors may each have a bridge circuit of individual electrical components. In order to be able to ensure precise measuring operations with such sensors, the individual electrical components, ie the resistors, must meet certain tolerances. Especially in bridge circuits, the bridge must be balanced. Such a balancing process currently takes place after production of the electrical component on the substrate, ie after completion of the deposition process. This adjustment process is also called trimming. The trimming is z. B. manually by removal of surface layers of the components (mechanical removal) or carried out by laser ablation. This will damage oxidation or protective layers. This procedure has some disadvantages. The electrical components produced must be protected, eg. B. from oxidation or other Damage. In addition, such a trim process associated with a significant time and cost (in particular personnel costs), or with the purchase of expensive equipment, eg. B. laser systems. The invention has for its object to provide an improved method for producing an electrical component, in which the aforementioned disadvantages are avoided. Furthermore, a device advantageous for this purpose and a computer program for carrying out the method should be specified.

In the method mentioned in the introduction, this object is achieved in that in the course of the deposition process, respective values of the electrical parameter are detected by measurements continuously or at discrete points in time and one, several or all detected values influence at least one parameter of the deposition process, e.g. by the deposition is temporarily interrupted until the electrical characteristic is in the specified tolerance range. This can e.g. be automatically controlled and / or regulated by an electronic control device. In the present invention, compliance with the predetermined tolerance range is thus integrated directly into the deposition process of the electrical component and is not carried out by trimming in hindsight. In this way, the aforementioned disadvantages can be avoided, in particular the post-processing by persons or special installations. This speeds up the manufacturing process and saves costs.

In the process according to the invention, protective coatings for encapsulating the system can be applied directly during the production without a vacuum fracture. Furthermore, multi-layer systems can be trimmed, which is not possible with a laser.

In the method according to the invention thus ensuring that the electrical parameter of the electrical component is within the specified tolerance range, at least before completion of the deposition process. This is achieved by the feedback of the information gained from the measured values, ie by the measurements, in the production process for influencing the parameter of the deposition process. In this sense, the present invention also in the sense a control are performed, with the control objective to produce the same component with the desired electrical characteristic by influencing the deposition process. In this sense, the term control, as far as it is used in this application, also covers a regulation. The mentioned control device can accordingly also be used as a control device. For the measurements, the component can be contacted permanently or not permanently, ie intermittently.

If a plurality of electrical components are produced in the deposition process, then the method according to the invention can be carried out separately or jointly for each electrical component.

The deposition process may in particular be carried out at a reduced pressure relative to the ambient pressure (atmospheric pressure), e.g. In a vacuum.

The specified tolerance range can be a value range from a minimum value to a maximum value, the tolerance range can also be defined as a single value. The electrical characteristic can z. B. be an ohmic resistance value, an impedance, a capacitance, an inductance or other electrical characteristic.

According to an advantageous embodiment of the invention, it is provided that the electrical parameter is an absolute characteristic of the electrical component or a relative characteristic which is determined in relation to a parameter of a further electrical component. In particular, in electrical components forming parts of a bridge circuit, a relative characteristic is advantageous, for. As a resistance ratio, since it does not depend so much on the exact compliance of the individual values of the components in the adjustment of a bridge circuit in some applications.

According to an advantageous embodiment of the invention, it is provided that the at least one influenced parameter of the deposition process, the specific Ab- is the rate of deposition of the material to be deposited in the surface area of the substrate in which the component is produced. This has the advantage that the deposition of the one specific electrical component can be influenced in a targeted manner. Thus, it is not the deposition rate which is influenced in a general way, but with reference to a specific surface area of the substrate in which the component is produced. This can be z. Example, by controlling a Abscheidequelle, which provides the material to be deposited, done, for example, by temporarily switching off the Abscheidequelle. The deposition source can, for. B. may be a target, as z. B. is used during sputtering.

According to an advantageous development of the invention, it is provided that the at least one influenced parameter of the deposition process is influenced by at least one mechanically and / or electrically adjustable adjustment part in a deposition chamber in which the deposition process is carried out and / or by introducing a trim gas into the deposition chamber , This has the advantage that the parameters of the deposition process can be influenced by the adjustable adjustment part, in such a way that the specific deposition rate of the material to be deposited in the surface region of the substrate can also be influenced by adjusting the adjustable adjustment part in this way, that, when the desired reduction in the deposition rate, the electrical component to be produced or the surface area of the substrate provided for this purpose is completely or partially covered and, if the deposition rate is increased as desired, the coverage is reduced or completely eliminated. The adjustment part thus has the function of an adjustable aperture. The adjusting part may be a rotatable and / or linearly adjustable component. The adjustment part can be, for example, a component which can be rotated about a rotation axis and which is rotated essentially parallel to the surface of the substrate. The adjustment part then has one or more recesses which can be placed by rotational adjustment of the adjustment part over different surface areas of the substrate depending on the desired deposition rate of the surface area.

By means of such a rotating diaphragm, an additional adaptation of the layer homogeneity of the deposited material layer on the substrate is possible by specific definition of the rotational speed of the diaphragm. In particular, it is advantageous an aperture with S-shaped recess, which has special advantages for a uniform deposition. In general, the shape of the panel or its recess can be adapted to the respective rotational speed and the required layer homogeneity. The electrically adjustable adjusting part can also be designed like an iris.

Alternatively or additionally, e.g. controlled by the control device, a trim gas are introduced into the deposition chamber and thereby the deposition process can be influenced.

According to an advantageous development of the invention, it is provided that the measurement of the electrical parameter takes place during the deposition process without interrupting the deposition of the material to be deposited or the deposition of the material to be deposited for measuring the electrical characteristic is at least temporarily interrupted and then continued. When measuring the electrical parameter without interrupting the deposition, a particularly precise, at least almost continuous, determination of the values of the electrical parameter is possible, so that the influencing of the parameter of the deposition process can be carried out very precisely in real time.

In certain constellations, however, the deposition of the material to be deposited may be a disturbance for the measurement, i. H. the measurement can be undesirably falsified thereby. This can be z. As in RF sputtering or deposition processes in the plasma be the case. In such cases, it may be advantageous to temporarily interrupt the deposition for the measurement of the electrical parameter, to carry out the measurement and then to resume the deposition.

In particular, in the case that the measurement of the electrical characteristic can be performed only at discrete points in time of the deposition of the material to be deposited, the manufacturing method according to the invention can be carried out in the manner of an iterative process, such that after a period of deposition of the material to be deposited Measurement is carried out, the one or more determined values of the electrical characteristic then for the Implementation of the further deposition are used, and the separation is then continued with such influenced parameters of the deposition process until after a certain period of time, a further measurement is performed and the process is repeated. In such a case, the iterative method can be carried out in such a way that the electrical parameter of the component is brought to the predetermined tolerance range in the manner of a successive approximation, similar to analog-to-digital converters.

If the measurement of the electrical parameter is carried out only at discrete times when the deposition is interrupted, then the electrical contacting of the electrical component for carrying out the measurement can only be performed temporarily and interrupted again during the further deposition. There are various possibilities for contacting the component to carry out the measurements:

For a component with two terminals, e.g. a resistor, just two measuring points can be connected, e.g. over measuring tips. It is also possible to perform a 4-point measurement (for example van der Pauw method)

- Four-wire measurement with, for example, 4-wire connection technology to reduce the influence of contact and lead resistances

- or 5-wire or 6-wire connection technology Is used for the production of the electrical component by means of the deposition

Mask used, which is arranged between the deposition source of the material to be deposited and the substrate, so contacts can be arranged for the contacting of the electrical component in the mask or on a support member of the mask, for. B. by being fixed therein or integrated directly into it.

According to an advantageous development of the invention, it is provided that first of all connection contacts of the electrical component to be produced are generated on the substrate, and then the electrical component is deposited with electrical connection to the connection contacts by the deposition process. This has the Advantage that the electrical component for the measurements carried out during the deposition process can be particularly easily contacted electrically, in particular without attaching measuring contacts directly to the component, since this already the connection contacts are available.

As a result, the method according to the invention can be further improved and the results made even more precise.

According to an advantageous embodiment of the invention, it is provided that the electrical component is formed by the deposited material passes through a mask on the substrate, wherein on and / or in the mask electrical contact elements and / or electrical connection lines are arranged and the measurement of electrical Characteristic under at least partial use of the electrical contact elements and / or electrical connection cables is performed. In this way, the electrical component during the deposition process can be contacted very easily for the measurements. The electrical contact elements and / or connection lines can be arranged, for example, on the surface side of the mask facing the substrate, or arranged on the surface side facing away from the substrate, or in the mask itself. Combinations of these arrangement possibilities are advantageously possible.

According to an advantageous development of the invention, it is provided that a sensor, an actuator or a part thereof is produced as an electrical component, e.g. a capacitive actuator or its functional layer. The electrical component may also be a part of such a sensor. The inventive method, the measurement accuracy of such sensors can be improved. The sensor can z. B. a strain gauge, a pressure sensor, a temperature sensor, an AMR sensor o- an eddy current sensor. The sensor may comprise a bridge circuit formed from the electrical component or a plurality of such electrical components, for. B. a half bridge or a full bridge. The bridge circuit can, for. B. as

Wheatstone Bridge, be designed as Vienna Bridge, Vienna-Robinson Bridge or as Schering Bridge. According to an advantageous embodiment of the invention, it is provided that the deposition of the material to be deposited for measuring the electrical parameter is interrupted, then a waiting time is waited and only then the measurement of the electrical parameter is performed. This has the advantage that the measurement, adjusted by transition effects, such as heating and cooling effects, can be performed and can be done accordingly more accurately. The waiting time must be determined according to the nature of the process. The waiting time may be, for example, at least one second or at least ten seconds. According to an advantageous development of the invention, it is provided that the deposition rate of the deposited material is automatically determined on the basis of the measurement of a value of the electrical parameter or the measurements of a plurality of values of the electrical parameter. With the knowledge of the deposition rate, the inventive method can be further refined. The deposition rate is a characteristic of the precipitator that characterizes the amount of deposited material per unit of time.

According to an advantageous development of the invention, it is provided that, on the basis of the automatically determined deposition rate, a time for the next measurement of the electrical parameter is determined. In this way, the method can automatically adapt to the respective process parameters of the deposition plant. As a result, even more targeted and faster generation of electrical components is possible. Between the measurements of the electrical parameter, the deposition process can be continued.

According to an advantageous development of the invention, due to the automatically determined deposition rate, the actual deposition rate for the further deposition process is automatically changed to a desired deposition rate, ie a target value, eg increased or decreased. This has the advantage that during the further deposition process, the component can be specifically iteratively approximated to the target value. The object mentioned at the outset is further achieved by a system for producing an electrical component, the system being suitable for carrying out a method according to one of the preceding claims, having the following features: a) a separating device having a deposition chamber for carrying out the deposition process of the material to be deposited the substrate, b) a measuring device for measuring the at least one electrical parameter of the electrical component to be produced by the deposition process during the deposition process,

c) a control device to which the detected values of the electrical parameter are supplied by the measuring device, wherein the control device is adapted to emit a control signal to the separator on the basis of one, several or all of the detected values of the electrical characteristic, by at least one parameter of the deposition process to influence. This also makes it possible to realize the advantages explained above. The system can be set up in particular for carrying out a method of the type explained above. For this purpose, the control device can have a computer and a computer program which is set up to carry out such a method when the computer program is executed on the computer of the control device. By the control signal delivered to the separation device, for example, the deposition rate of the deposition source and / or the adjustable adjustment part, which will be explained later, and / or the trim gas fed in via a gas inlet can be influenced. The computer may be, for example, a microprocessor, a microcontroller, an FPGA or a comparable element, possibly also an arrangement of several such elements. The control device may, for example, have a programmable logic controller. The control device can also be part of the existing system or of the deposition device, for example a PC of the coating system, which is extended by the computer program for carrying out a method of the type described above. The control device can also be a separate device. Another advantage of the invention is the realizable size of the electrical component. The system parts and parts groups required for carrying out the method, in particular the separation device with the deposition chamber, can be made comparatively small, for. B. in the form of a mobile Abscheideein- direction, so that a mobile use is possible. In addition, a retrofitting of conventional systems for carrying out the method according to the invention is possible in a favorable manner. The mobile system can z. B. be designed according to DE 10 2014 004 323 A1. In combination with a mobile separator z. B. arbitrarily dimensioned objects, which then form the substrate to be coated with one or more electrical components by the deposition process. In this case, the object to be coated (substrate) can be significantly larger than the separating device, if it is temporarily fixed to it via seals sealed.

According to an advantageous development of the invention, it is provided that the separation device has at least one mechanically and / or electrically adjustable adjustment part in the deposition chamber for influencing the at least one parameter of the deposition process, which is controllable by the control device, and / or at least one gas inlet for a trim gas for influencing the at least one parameter of the deposition process, which is controllable by the control device. In this way, the previously explained advantages can also be achieved, which have been explained with respect to the mechanically and / or electrically adjustable adjusting part in the deposition chamber, for example in the form of a rotating diaphragm. If, alternatively or additionally, the deposition process is influenced by a trim gas, this can be done via at least one gas inlet, wherein the feeding of the trim gas can be controlled by the control device, for example by one or more electrically controllable valves. For example, there may be various nozzles or gas inlets, eg, on the wall of the deposition chamber, eg, different nozzles or gas inlets may be disposed radially about the surface of the substrate to be coated. As a trim gas, for example, a noble gas can be used, for example, argon. Depending on the separation process carried out, other gases may also be advantageous, for example oxygen. The invention is also suitable for retrofitting existing systems or separation devices. It is then at least the measuring device for measuring the at least one electrical characteristic and the control device to complete. The control device can then in particular have a computer program which is set up to carry out the method according to the invention. Furthermore, the deposition chamber must be supplemented accordingly so that the at least one parameter of the deposition process can be influenced, for example by at least one mechanically and / or electrically adjustable adjustment part and / or the at least one gas inlet for a trim gas. The aforementioned object is further achieved by a computer program configured to carry out a method of the type described above, when the computer program is executed on a computer, for. The computer program may comprise the control of the motor, the evaluation of the resistors and a control circuit constructed therefrom, which in turn is controlled by an algorithm / processing instruction and thus masters the challenge, to adjust the individual resistors as well as the bridge voltage.

The invention will be explained in more detail below on the basis of exemplary embodiments using drawings.

Show it

Figure 1 shows an electrical assembly with several electrical components in

Top view and

2 shows an enlarged detail of the electrical assembly according to

Figure 1 and

Figure 3 shows a system for producing an electrical component and

Figure 4 shows a shutter mechanism and Figure 5 shows another embodiment of a shutter mechanism and

Figures 6 to 10 variants of the electrical contacting of the component during the

Separation process and

Figure 1 1 two more types of contacting the component during the deposition process and

FIG. 12 shows another way of contacting the component during the deposition process.

In the figures, like reference numerals are used for corresponding elements.

FIG. 1 shows an electrical module 1 which has a substrate 2 on which electrically conductive structures are deposited. The electrically conductive structures comprise four electrical components 3, which are shown here as respective ohmic resistors in meandering form. The components 3 are electrically connected via conductor tracks 4 with contact pads 5. The interconnects 4, together with the contact pads 5, form terminal contacts of the respective electrical component 3. By appropriate interconnection of these connection contacts 4, 5, for example, a bridge circuit with four resistors can be formed, as e.g. is used for strain gauges or pressure sensors.

FIG. 2 shows the central region of FIG. 1 with the four electrical components 3 in an enlarged view. The electrical components 3 are additionally assigned designations R1, R2, R3 and R4, which are also used in FIGS. 4 and 5 below.

FIG. 3 shows a system for producing an electrical component by means of a deposition process, eg as described above. The plant has a separation device 16 with a deposition chamber 6, for example in the form of a sputtering plant. In the deposition chamber 6, a deposition source 7, for example a target, is present, through which the deposited material, from which the electrical components 3 are formed on the substrate 2, is eliminated. The deposition source 7 is located as recognizable at one end of the deposition chamber 6, for example at the top. At the other end, eg below, is the substrate 2. Above the substrate 2 is a mask 8, which has the corresponding recesses in order to produce the electrical components 3 in the configuration indicated in FIG. 2 by the deposition process in the deposition chamber 6 ie a kind of negative of the components to be produced. In this respect, the mask 8 is also shown by the figure 1 at the same time.

Above the mask 8 is an adjustment part in the form of a diaphragm 9, which is thus arranged in the direction of movement of the deposited material from the deposition source 7 to the substrate 2 in front of the mask 8. The diaphragm 9 thus at least partially shields the material transport from the deposition source 7 to the substrate 2 with respect to the mask 8. The aperture 9 is controllable, e.g. by mechanical and / or electrical adjustment.

The separation device 16 is connected to a measuring device 10. About the measuring device 10, the electrical characteristics of one or more of the components 3 can be detected during the deposition process. The values of the electrical parameter or characteristic quantities detected by the measuring device are fed to a control device 11. The control device 11 has a computer, e.g. a microprocessor or microcontroller. Furthermore, the control device 11 has a computer program which is executed by the computer in order to carry out the method according to the invention. As a result, the control device is set up to emit a control signal to the separating device 16 on the basis of the values of the electrical parameter detected and supplied by the measuring device 10. This control signal influences at least one parameter of the deposition process. For example, the control device 1 1 can influence the deposition rate at the deposition source 7 by the control signal. Alternatively or additionally, the control device 1 1 can control the position and position of the diaphragm 9 via the control signal.

In this way, controlled by the control of the control device 1 1 and by the measurements on the measuring device 10 of the entire deposition process be performed and the electrical components 3 thus at the end of the deposition process equal to the desired electrical characteristics, ie the parameters in the specified tolerance range, are provided. The control device 1 1 may issue a warning signal when the deposition process is completed, ie when the electrical components 3 each have the desired electrical characteristic. The control device 1 1 may further be adapted to switch off the deposition of the deposition source 7 at the end of the deposition process.

In FIG. 4, the mask 8 with the respective window-like recesses 13 for the individual components R1, R2, R3, R4 is shown in plan view in the illustration a. Figures b and c show the mask 8, which is then partially covered by the aperture 9. As can be seen, the aperture 9 is provided with an approximately quarter-circle-shaped recess. Via an electrically controllable actuator 12, the shutter 9 can be rotated and placed in a desired position, e.g. in the position shown in Figure c. In this position in Figure c, material for making the resistor R3 can be deposited on the substrate 2 from the deposition source 7. This can e.g. purposefully take place when the measurements have been made by the measuring device 10 that the resistors R1, R2, R4 have already reached the desired electrical characteristic, i. the desired resistance value in the specified tolerance range, but the resistance of the resistor R3 is still too large. In this case, additional material for the component R3 is deposited on the substrate 2 through the recess of the diaphragm 9 and the mask 8, whereby the resistance value of the resistor R3 is reduced by an increase in layer thickness. This is done until the resistance value is within the specified tolerance range. Since substantially no material in the region of the resistors R1, R2, R4 is deposited by the shading by means of the diaphragm 9, their resistance values do not change.

At the beginning of the deposition process, ie until a certain required minimum thickness of the layer of deposited material is produced on the substrate 2, the diaphragm 9 can be rotated, for example, continuously, so that first all the resistors R1 to R4 are deposited. While a rotatable (ie rotatable) aperture 9 is described with reference to FIGS. 3 and 4, FIG. 5 shows that a diaphragm arrangement can also be realized by linearly displaceable diaphragm blades 9. These can be displaced via an electric actuator 12 so that optionally one, several or all of the electrical components 3 or their surface areas on the substrate 2 are covered by a diaphragm blade 9 or are not covered.

There are a variety of ways to perform the electrical contacting of the component 3 on the substrate 2 for the measurements during the deposition process. FIG. 6 shows, by way of example, the case that the connection contacts 5 (or also conductor tracks 4) are electrically contacted via extendable contact tips 14. However, this requires that the terminals 4, 5 are made in advance, i. before the actual component 3 is generated by the deposition process.

FIG. 7 shows a variant of the electrical contacting in which the contact elements 15 for the measurements are fastened to the surface side of the mask 8 facing the substrate 2. These contact elements 15 may, for example, be electrically insulated from the mask 8. The contact elements 15 can then contact either the connection contacts 4, 5 or the component 3 directly. In this case, through-contacts 19 can be present in the mask 8, through which electrical connections to the contact elements 15 are provided through the mask 8. FIG. 8 shows a variant in which the connection contacts 15 for the measurements are integrated directly in the mask 8, for example on the inside of the recess 13. In this way, electrical contacting of the component 3 during the deposition process can also take place if no electrical connection contacts 4, 5 are present. Thus, the deposited material can be deposited directly on the substrate 2 between the contact elements 15 through the recess 13, so that the electrical contacting of the component 3 with the contact elements 15 is thereby simultaneously produced in the deposition process. On the top of the mask 8 leads may be for contacting the contact elements 15. The contact elements 15 can be made partially or almost completely isolated. The contacts 15 may, for example, be designed geometrically such that By using, for example, a step-like taper in, for example, the direction of the substrate, an electrical connection to the remaining deposited material, which is not part of the desired sensor structure, is prevented (similar to Figure 11, where the undercut U prevents an electrical connection).

The contact tips 14 and / or contact elements 15 may be formed as spring-loaded contacts.

A further advantageous possibility of the electrical contacting of the component during the deposition process for carrying out the measurements is explained with reference to FIGS. 9 and 10. FIG. 9 shows a lateral sectional view, FIG. 10 shows the mask 8 used in plan view. As can be seen, the mask 8 has the openings 13, e.g. in meandering form. The region of the openings 13 is connected in each case via connection lines 17 with contact surfaces 18. The terminal leads 17 and the pads 18 are attached directly to the mask 8, e.g. on the surface facing away from the substrate 2 applied. For example, the leads 17 and / or pads 18 may also be deposited on the mask 8 by a deposition process, e.g. be sputtered. The electrical contacting for the measurements is then carried out by connecting the contact tips 14 to the contact surfaces 18. The contact tips 14 may in particular be sprung, i. as spring contacts. The transition point between the connection lines 17 to the openings 13 may additionally comprise contact elements 15 in the sense of plated-through holes, similar to FIG. 8 or FIG. 7 (part 19).

In some places, e.g. in the region of the leads 17, an insulating layer can additionally be applied so that an electrical contact is provided only at the desired location. FIG. 11 again shows a view similar to FIGS. 6 to 9

Substrate 2 in side view. Also shown is the mask 8 with the opening 13. On the mask 8, a mask receptacle 20 is placed, which holds the mask 8 and is used for electrical contacting of the component 3 to be deposited. In an inner recess of the mask holder 20 is the aperture 9, for example in the form of a rotating aperture, as described with reference to FIG 4. The diaphragm 9 can be arranged on a rotating diaphragm receptacle 90.

For the electrical contacting of the component 3 to be deposited, spring pins 21, which form a resilient contact with a conductor layer 23 located between the mask receptacle 20 and the mask 8, are inserted into the mask receptacle 20. The spring pins 21 are also connected to leads 22. To the supply lines 22, a measuring device for detecting the values of the parameter of the component 3 can be connected. In the mask 8 there are plated-through holes 19 which form the electrical connection from the conductor layers 23 to connection contacts, for example, 91, 5 and 29, respectively. The plated-through holes can, for example, be made insulated from the mask material or other components. On the conductor layers 23 insulation layers may be present. The connection contacts 5 can be deposited in advance with a further mask on the substrate. An insulating layer 25 may be present between the underside of the mask 8 and the connection contacts 5, for example a Si 3 N ₄ layer. Furthermore, a sacrificial layer 26 can be located below the insulation layer 25, for example a layer of S1O2. The insulation layer 25 and the sacrificial layer 26 are part of the mask 8. Furthermore, an additional conductive contact 91 of, for example, gold or gold alloys may be located on the underside of the plated-through hole 19 (see FIG. 11) and / or the sacrificial layer 26. On the substrate 2, an insulating layer 24 may be located.

The arrows 28 characterize the material flow of the deposited material. The deposited material arrives on the substrate 2 through the aperture 9 and the opening 13 and is deposited there as a layer 27. From the layer 27, the component 3 is formed. The deposited material may also attach to the insides of the opening 13 and other elements.

While in the left-hand area the already described contacting takes place by means of the already pre-sputtered terminal contact 5, FIG. 11 shows in the right-hand area an alternative contacting of the component 3 to be deposited by means of a contact tongue 29 which is fastened to the mask 8 or is a part of the mask 8. The contact tongue 29 may be made of gold or a Be gold alloy. Both types of contacting can optionally be used, wherein in each case the same contacting can be used on both sides. The advantage of using a contact tongue 29 arranged on the mask 8 is that layers, such as the connection contacts 5, which are not already precluded, must be present on the substrate 2, which is favorable for the EMC compatibility of the manufactured component. As part of the production of the mask 8, the insulating layer 25 and sacrificial layer 26 can be prepared by, for example, CVD process or PVD process. The contact tongue can be generated, for example, by PVD process, for example sputtering, CVD process or, for example, galvanically. The masking layers necessary for producing the mask 8 for producing the layer structures of the individual layers (for example layer 25 and / or 26 or / and 91 or / and 17) can be produced by means of photolithography and / or laser direct imaging or other conventional methods , The sacrificial layer 26 may be partially removed by wet-chemical means, for example, in the manufacture of the masks 8, thereby forming the gap or undercut denoted by "U" in Figure 11, thus creating a partially free-floating contacting tongue 29. During deposition, this undercut is formed in the absence of a complete coating of the undercut during a coating process, for example due to the geometry of the undercut, a short circuit or an electrical connection to the remaining layer, which does not form the actual sensor structure 3 (for example, those on the mask 8 located) prevented.

The mask 8 is fixed, for example, by means of adhesive on the mask receptacle 20.

The contact tongues 29 can also be produced by the application of a conductive structure, for example a film and / or a substrate, and fixed by, for example, bonding or gluing to, for example, the mask. In this case, the need for a sacrificial layer and / or etching of the sacrificial layer can be dispensed with. The spring pins 21 can be pressed with an outer insulation in the holder 20, for example by an external insulation by means of Teflon tape, or by a Teflon sleeve or other insulating sleeve.

The mask 8 may e.g. be formed of silicon material, e.g. monocrystalline or polycrystalline silicon, silica, silica or other oxides, sub-oxides, of ceramics, steel, aluminum or an alloy, polyamide, e.g. copper-clad, or glass.

The plated-through holes 19 can be produced for example by means of electroplating, CVD process, PVD process, vapor deposition. The structure of the mask 8 can be generated, for example, by reactive ion etching, wet chemical etching, milling, laser machining and similar processes. To produce the plated-through holes, holes can be made in the component to be through-contacted. The holes can be produced for example by reactive ion etching, wet chemical etching, milling, laser machining and similar processes. The holes are germinated, eg by being coated with a catalyst, and then catalytically metallized and then optionally electrolytically reinforced to build up a thicker metal layer. It is also possible to make the vias through solder or feedthroughs for insertion. For example, gold, gold alloys or copper can be used for the electrical through-connection. The mask 8 can be centered over the outside. The mask 8 can be centered, for example, via the mask receptacle 20 by means of integrated contact points. This is particularly advantageous in the case of multiple deposits which are produced on the substrate 2 one above the other. In the embodiment according to FIG. 12, a contacting of the component 3 to be deposited is carried out by inserting the spring pins 21 in the mask receptacle 20 and connecting them to the supply lines 22. The spring pins 21 extend through openings in the mask 8 therethrough. The inside of the opening can be coated with an electrical insulation layer, for example by a PVD process and / or CVD process. The openings can be produced by, for example, reactive ion etching, wet chemical etching, milling, laser machining and similar processes. On the side facing the substrate 2, the spring pins 21 are in electrical contact with the connection contacts 5 (see FIG. For better clarity, the diaphragm 9 and the mask holder 20 are not shown in FIG. On the insulation layer 25 may be a sacrificial layer or further insulating layer. It is also possible to contact a temporary contact made by the spring pins 21 on the substrate 2. The temporary contact can replace or supplement the connection contacts 5. The temporary contact can be fixed to the surface of the substrate or / and on the mask before the deposition, for example by gluing or bonding. For example, thin layers, substrates and / or foils are suitable as material for the temporary contacting. For measuring the resistances in a contacting according to FIG. 12, the

Mask retainer including the mask and all the objects associated with it are moved back a distance from the surface, so that when using the spring pins in combination with the connection contacts 5, the spring pins still remain in contact with the connection contacts 5. The influence of parasitic, unwanted coatings eg of the mask 8 on, for example, the resistance measurement can be prevented by the resulting gap between the mask 8 (or the outermost insulating layer, for example, 25) and the substrate 2. Retraction is also possible using temporary contacts secured to the substrate. The mask holder 20 forms together with the spring pins 21 or others

Through-contacts a contacting unit for carrying out a method of the type described above, wherein the contacting unit is arranged for making electrical contact with the electrical component 3 to be generated for performing a measurement of the electrical characteristic of the electrical component.

The method according to the invention and the components used for the implementation can be applied both to a substrate 2 with a flat surface and to a substrate 2 with a curved surface.

Claims

claims

Method for producing an electrical component (3) having at least one electrical parameter of the electrical component which is within a predetermined tolerance range, wherein the electrical component (3) is formed by depositing a material on a substrate (2), characterized in that During the deposition process, respective values of the electrical parameter are detected continuously or at discrete points in time by measurements and, based on one, several or all detected values, at least one parameter of the deposition process is influenced until the electrical parameter is within the predetermined tolerance range.

Method according to the preceding claim, characterized in that the electrical parameter is an absolute characteristic of the electrical component (3) or a relative characteristic which is determined in relation to a parameter of a further electrical component (3).

Method according to one of the preceding claims, characterized in that the at least one influenced parameter of the deposition process is the specific deposition rate of the material to be deposited in the surface region of the substrate (2) in which the component (3) is produced.

Method according to one of the preceding claims, characterized in that the at least one influenced parameters of the deposition process by at least one mechanically and / or electrically adjustable adjusting part (9) in a deposition chamber (6), in which the deposition process is performed, and / or by initiating a trim gas in the deposition chamber (6) is influenced.

5. The method according to any one of the preceding claims, characterized in that the measurement of the electrical characteristic takes place during the deposition process without interrupting the deposition of the material to be deposited or the deposition of the material to be deposited for measuring the electrical characteristic is at least temporarily interrupted and is continued thereafter.

6. The method according to any one of the preceding claims, characterized in that on the substrate (2) first terminal contacts (4, 5) of the electrical component to be generated (3) are generated and then by the deposition process, the electrical component (3) electrical connection to the terminal contacts (4, 5) is deposited.

7. The method according to any one of the preceding claims, characterized in that the electrical component (3) is formed by the deposited material passes through a mask (8) on the substrate (2), wherein on and / or in the mask (8 ) electrical contact elements (15) and / or electrical connection lines (17) are arranged and the measurement of the electrical parameter under at least partial use of the electrical contact elements (15) and / or electrical connection lines (17) is performed.

8. The method according to any one of the preceding claims, characterized in that as the electrical component (3), a sensor, an actuator or a part thereof is generated.

9. The method according to any one of the preceding claims, characterized in that the deposition of the material to be deposited for measuring the electrical characteristic is interrupted, then a waiting time is waited and only then the measurement of the electrical characteristic is performed.

10. The method according to any one of the preceding claims, characterized in that based on the measurement of a value of the electrical characteristic or the measurements of a plurality of values of the electrical characteristic, the deposition rate of the deposited material is automatically determined.

1 1. Method according to the preceding claim, characterized in that a time for the next measurement of the electrical parameter is determined on the basis of the automatically determined deposition rate.

12. The method according to any one of claims 10 to 1 1, characterized in that due to the automatically determined deposition rate, the actual deposition rate for the further deposition process is automatically changed to a desired deposition rate.

13. Plant for producing an electrical component (3), the plant being suitable for carrying out a method according to one of the preceding claims, having the following features:

a) a separation device (16) having a deposition chamber (6) for carrying out the deposition process of the material to be deposited on the substrate (2),

b) a measuring device (10) for measuring the at least one electrical parameter of the electrical component (3) to be produced by the deposition process during the deposition process,

c) a control device (1 1), the detected values of the electrical

Characteristic of the measuring device (10) are supplied, wherein the control device (1 1) is adapted to give on the basis of one, several or all of the detected values of the electrical characteristic a control signal to the separator (16) to at least one parameter of the deposition process influence.

14. Plant according to the preceding claim, characterized in that the separation device (16) has at least one mechanically and / or electrically adjustable adjusting part (9) in the deposition chamber (6) for influencing the at least one parameter of the deposition process, which is controlled by the control device (16). 1 1) is controllable, and / or at least one gas inlet for a trim gas for influencing the at least one parameter of the deposition process, which is controllable by the control device (1 1).

15. Control device (1 1) of a system according to one of claims 13 to 14, adapted for carrying out a method according to one of claims 1 to 12.

Computer program adapted to carry out a method according to one of claims 1 to 12, when the computer program is stored on a computer of a control device, e.g. a control device (1 1) of a system according to one of claims 13 to 14, is executed.

Contacting unit for carrying out a method according to any one of claims 1 to 12, wherein the contacting unit for electrical contacting of the electrical component to be generated (3) is arranged for performing a measurement of the electrical characteristic of the electrical component.

Contacting unit according to the preceding claim, characterized in that the contacting unit is designed as a mask receptacle (20) or has a mask receptacle, wherein the mask receptacle (20) for receiving and holding a mask used in the deposition process (8) is arranged.