WO2018223429A1 - 一种阵列基板的导电胶涂布方法、涂胶装置及涂胶系统 - Google Patents

一种阵列基板的导电胶涂布方法、涂胶装置及涂胶系统 Download PDF

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Publication number
WO2018223429A1
WO2018223429A1 PCT/CN2017/089668 CN2017089668W WO2018223429A1 WO 2018223429 A1 WO2018223429 A1 WO 2018223429A1 CN 2017089668 W CN2017089668 W CN 2017089668W WO 2018223429 A1 WO2018223429 A1 WO 2018223429A1
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WIPO (PCT)
Prior art keywords
striker
conductive paste
array substrate
container
flowable conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/089668
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English (en)
French (fr)
Inventor
简重光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to US15/848,699 priority Critical patent/US20180355222A1/en
Publication of WO2018223429A1 publication Critical patent/WO2018223429A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B05C5/0229—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet the valve being a gate valve or a sliding valve
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Definitions

  • the present application relates to the field of manufacturing technology, and in particular, to a conductive paste coating method for an array substrate, a glue application device, and a glue application system.
  • Conductive adhesives used in panel manufacturers such as ACF (Anisotropic Conductive) Film, anisotropic conductive film), is a packaged product after processing by the supplier.
  • the ACF adhesive of the finished product needs to be processed through raw material adjustment, dispensing, cutting, etc., and finally packaged and transported to the market.
  • the panel factory buys back the ACF glue of the finished package from the market, and uses the ACF glue to bond the array substrate and the driving IC system, which makes the cost of the ACF glue high, resulting in high cost of the panel. .
  • the application provides a conductive adhesive coating method, a glue coating device and a glue coating system for an array substrate, which can reduce the production cost of the conductive adhesive, thereby reducing the cost of the panel.
  • an embodiment of the present application provides a glue application device, the glue application device comprising:
  • a container for holding a flowable conductive paste a side wall of the container is provided with a feed port, and a bottom of the container is provided with a discharge port;
  • the striker is located in the container, the top of the striker is connected to the driving device, and the striker is reciprocated up and down under the action of the driving device, and the striker and the discharge port are in conflict with each other
  • the discharge port is clogged, and the flowable conductive paste flows out from the discharge port when the striker does not interfere with the discharge port.
  • the container includes an upper portion and a lower portion, the upper portion is cylindrical, and the lower portion is in the shape of a funnel.
  • the striker includes a needle post and a needle, the needle being tapered.
  • the diameter of the needle string is equal to the diameter of the upper inner wall of the container.
  • the feed port is located at an upper portion of the container, and the top of the striker is higher than the feed port when the striker is in the first position.
  • the flowable conductive paste flowing out of the discharge port is coated onto the array substrate in a predetermined direction.
  • an embodiment of the present application provides a glue application system including a glue application device and a mobile device.
  • the glue application device comprises:
  • a container for holding a flowable conductive paste a side wall of the container is provided with a feed port, and a bottom of the container is provided with a discharge port;
  • the striker is located in the container, the top of the striker is connected to the driving device, and the striker is reciprocated up and down under the action of the driving device, and the striker and the discharge port are in conflict with each other
  • the discharge port is blocked, and the flowable conductive paste flows out from the discharge port when the striker and the discharge port are not in contact with each other;
  • the moving device is configured to cause the glue application device to apply the flowable conductive adhesive on the array substrate in a predetermined direction.
  • an embodiment of the present application provides a method for coating a conductive paste of an array substrate, the method comprising:
  • the flowable conductive paste is extruded from the gumming device, and the flowable conductive paste is coated on the array substrate in a predetermined direction.
  • the method further includes coating the array substrate by ultraviolet rays.
  • the flowable conductive paste is dried and cured.
  • the coating the flowable conductive paste on the array substrate in a predetermined direction comprises:
  • the array substrate is moved in a direction opposite to the predetermined direction to apply the flowable conductive paste to the array substrate.
  • the glue application device comprises: a driving device; and a container for holding the flowable conductive adhesive, the side wall of the container a feeding port is provided, the bottom of the container is provided with a discharge opening; the striker is located in the container, and the striker is driven by the driving device to reciprocate between the first position and the second position Moving, when the striker is in the first position, the striker blocks the discharge port, and when the striker is in the second position, the striker is detached from the discharge port to make the flowable conductive adhesive available The discharge port flows out.
  • the conductive adhesive is not required to be obtained by dispensing, cutting, packaging, transporting, etc., and the conductive adhesive is commonly used on the market, and then the conductive adhesive is bonded on the array substrate, but the raw material is directly modulated by the raw material.
  • the fluid conductive adhesive is directly coated on the array substrate, which saves multiple processes and reduces costs.
  • FIG. 1 is a schematic flow chart of a method for coating a conductive paste of an array substrate according to an embodiment of the present application
  • FIG. 2 is another schematic flowchart of a method for coating a conductive paste of an array substrate according to an embodiment of the present application
  • FIG. 3 is a schematic structural view of a glue application device according to an embodiment of the present application.
  • FIG. 4 is a schematic structural view of a glue applying device with a striker in a first position according to an embodiment of the present application
  • FIG. 5 is a schematic structural view of a glue applying device provided with a striker in a second position according to an embodiment of the present application.
  • FIG. 1 is a schematic diagram of a method for coating a conductive paste of an array substrate according to an embodiment of the present application.
  • the method includes the following steps S101-S102:
  • the conductive adhesive may be selected from ACF.
  • the raw materials of the ACF are resin, conductive particles and a curing agent, and these raw materials are mixed and adjusted to prepare a desired flowable conductive adhesive.
  • ACF isotropic Conductive Film, anisotropic conductive film
  • ACF adhesive of the finished product needs to be processed, adjusted, and cut into the market.
  • Gluing on the display panel is generally performed by using the ACF adhesive-bonded array substrate and the driver IC system of the packaged product. This process makes the cost of the ACF glue high, resulting in high cost of the panel.
  • the raw material of the ACF (conductive adhesive) is mixed and prepared into a required flowable conductive adhesive, and the conductive adhesive is a newly prepared conductive adhesive, which has fluidity without being subjected to a dispensing process or the like.
  • These flowable conductive pastes are loaded into the gumming device, and the conductive paste is applied to corresponding regions on the array substrate.
  • the flowable conductive paste is extruded from the gumming device, and the flowable conductive paste is coated on the array substrate in a predetermined direction.
  • the array substrate is coated along the direction parallel to the scan lines or data lines on the array substrate.
  • step S102 is specifically: moving the glue application device in a predetermined direction to apply the flowable conductive adhesive to the array substrate.
  • the step S102 specifically includes: moving the array substrate in a direction opposite to the preset direction to apply the flowable conductive paste to the array substrate.
  • the flowable conductive paste can be applied to a place required by the array substrate by moving the array substrate or moving the glue coating device.
  • the conductive paste coating method of the array substrate of the embodiment of the present application directly coats the conductive paste which is still fluid by the raw material modulation on the array substrate, thereby saving a plurality of processes and reducing the cost.
  • FIG. 2 illustrates a method for coating a conductive paste of an array substrate according to an embodiment of the present application.
  • the method includes the following steps S101-S103:
  • the flowable conductive paste is extruded from the gumming device, and the flowable conductive paste is coated on the array substrate in a predetermined direction.
  • the conductive adhesive is ACF, and the resin, the conductive particles and the curing agent are mixed and prepared into a conductive adhesive.
  • the conductive adhesive is a newly prepared conductive adhesive.
  • the flowable conductive adhesive is loaded into the coating device, and the conductive adhesive is advanced. The direction is applied to corresponding regions on the array substrate, for example, the array substrate is coated along the direction parallel to the scan lines or data lines on the array substrate.
  • step S102 is specifically: moving the glue application device in a predetermined direction to apply the flowable conductive adhesive to the array substrate.
  • the step S102 specifically includes: moving the array substrate in a direction opposite to the preset direction to apply the flowable conductive paste to the array substrate.
  • the flowable conductive paste can be coated on the array substrate by moving the array substrate or the mobile gluing device.
  • the flowable conductive adhesive After the flowable conductive adhesive is applied on the array substrate, the flowable conductive adhesive needs to be dried and cured, so that the array substrate is bonded to the driving circuit of the display panel, and the flowable conductive adhesive can be dried and cured by ultraviolet rays.
  • the ultraviolet light can be suspended above the array substrate, facing the place where the conductive paste on the array substrate is required, so that the conductive adhesive can be quickly dried and cured.
  • the flowable conductive adhesive is dried and cured by ultraviolet rays.
  • the flowable conductive adhesive coated on the array substrate may be dried and cured by other means, as long as the flowable The conductive adhesive can be dried and solidified.
  • the conductive adhesive coating method of the array substrate of the embodiment of the present invention does not need to pass the conductive adhesive through the steps of dispensing, cutting, packaging, transporting, etc. to obtain the conductive adhesive commonly used in the market, and then bonding the conductive adhesive on the array substrate. Instead, the conductive paste which is still fluidized by the raw material modulation is directly coated on the array substrate, which can save multiple processes and reduce costs.
  • FIG. 3 is a glue application device according to an embodiment of the present application.
  • the glue application device includes a driving device (shown in the drawing), a container 100, and a striker 200.
  • a flow conductive adhesive a side wall of the container 100 is provided with a feed port 102, a bottom of the container 100 is provided with a discharge port 104, the striker 200 is located in the container 100, and the striker 200 is driven by the drive
  • the device is driven to reciprocate between a first position and a second position, wherein the striker 200 blocks the discharge opening 104 when the striker 200 is in the first position, and the striker 200 is in the second position
  • the striker 200 is detached from the discharge port 104 to allow the flowable conductive paste to flow out of the discharge port 104.
  • the flowable conductive paste is a flowable ACF (Anisotropic Conductive) Film).
  • the existing conductive adhesives such as ACF (isotropic conductive film) are packaged products processed by the supplier.
  • the ACF adhesive of the finished package needs to be processed through raw material adjustment, dispensing, cutting, etc.
  • Packing and shipping to the market, glue coating on the display panel is generally an ACF adhesive bonding array substrate and a driving IC system using the packaged product. This process makes the cost of the ACF glue high, resulting in high cost of the panel.
  • a raw material filled with ACF (conductive adhesive) is mixed and prepared into a required flowable conductive adhesive, and the conductive adhesive is applied to a corresponding region on the array substrate.
  • ACF conductive adhesive
  • the present invention does not need to be made into a conductive adhesive by a process such as dispensing and packaging, and can be glued by a glue coating device, which saves various instruments or devices required for the conductive adhesive manufacturing process and saves cost.
  • the striker 200 is reciprocated up and down under the driving of the driving device, and the driving device controls the frequency at which the striker 200 moves up and down, thereby controlling the amount of glue.
  • the striker 200 when the striker 200 is in the first position, the striker 200 blocks the discharge port 104, and the flowable conductive adhesive cannot flow out.
  • the striker 200 when the striker 200 is in the second position, the striker 200 is detached from the discharge port 104 so that the flowable conductive paste can flow out from the discharge port 104, and the discharge port 104 Below is the position where the array substrate needs to be glued.
  • the second position is a position at which the flowable conductive adhesive can flow out of the discharge port 104 at the lowest position or higher
  • FIG. 5 is only one embodiment of the present application.
  • the container 100 includes an upper portion 101 and a lower portion 103, the upper portion 101 is cylindrical, and the lower portion 103 is in the shape of a funnel.
  • the striker 200 includes a needle post and a needle, the needle being tapered.
  • the diameter of the needle string is equal to the diameter of the inner wall of the upper portion 101 of the container 100.
  • the inlet port 102 is located at an upper portion 101 of the container 100, and the top of the striker 200 is higher than the inlet port 102 when the striker 200 is in the first position.
  • the top of the striker 200 is higher than the feed port 102, and the flowable conductive adhesive can be ensured to flow into the space defined by the striker 200 and the container 100, and the upper portion of the container 100
  • the inner walls of 101 have the same diameter, so that the striker 200 becomes a seal above the container 100, preventing the conductive paste from being contaminated.
  • the diameter of the needle string is equal to the diameter of the inner wall of the upper portion 101 of the container 100, and when the striker 200 is in the first position, the top of the striker 200 is higher than the feed port 102, and the conductive glue is not from the discharge port. When the 104 is out, the feed port 102 is not fed.
  • the conductive adhesive which is still fluidized by the raw material is directly coated on the array substrate, which can save the device required for multiple processes and reduce the cost.
  • the embodiment of the present application further provides a glue application system including a moving device and a glue application device.
  • the moving device is configured to cause the glue application device to apply the flowable conductive adhesive on the array substrate in a predetermined direction.
  • the moving device is specifically configured to be connected to the glue application device, move the glue application device in a preset direction, or be used to receive the array substrate and move the array substrate in a direction opposite to a preset direction.
  • the glue application device comprises a driving device, a container for holding a flowable conductive adhesive, a side wall of the container provided with a feed inlet, and a bottom of the container is provided with a discharge port, the striker Located in the container, the striker is driven by the driving device to reciprocate between a first position and a second position, and when the striker is in the first position, the striker blocks the discharge opening, When the striker is in the second position, the striker is disengaged from the discharge port to allow the flowable conductive paste to flow out of the discharge port.
  • the striker reciprocates up and down between the first position and the second position under the driving of the driving device, and the driving device controls the frequency of the up and down movement of the striker, thereby controlling the amount of glue.
  • the striker When the striker is in the first position, the striker blocks the discharge port, and the flowable conductive adhesive cannot flow out.
  • the striker When the striker is in the second position, the striker is disengaged from the discharge port so that the flowable conductive paste can flow out from the discharge port, and the lower side of the discharge port faces the position where the array substrate needs to be glued.
  • the second position is a position at which the flowable conductive paste can flow from the discharge port to the lowest position or higher.
  • the container includes an upper portion and a lower portion, the upper portion is cylindrical, and the lower portion is in the shape of a funnel.
  • the striker includes a needle post and a needle, the needle being tapered.
  • the diameter of the needle string is equal to the diameter of the upper inner wall of the container.
  • the feed port is located at an upper portion of the container, and the top of the striker is higher than the feed port when the striker is in the first position.
  • the top of the striker is higher than the feed port, which can ensure that the flowable conductive adhesive flows into the space defined by the striker and the container, and the upper inner wall of the container has the same diameter, so that The striker becomes a seal over the container to prevent contamination of the conductive paste.
  • the diameter of the needle string is equal to the diameter of the upper inner wall of the container, and when the striker is in the first position, the top of the striker is higher than the feed port, and when the conductive glue does not flow out from the discharge port, the feed is fed. The mouth is not fed.
  • the gumming system further includes a curing device for irradiating the flowable conductive paste coated on the array substrate with ultraviolet rays to dry and cure the flowable conductive paste.
  • the conductive adhesive which is still fluidized by the raw material is directly coated on the array substrate, which can save the device required for multiple processes and reduce the cost.

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  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

一种阵列基板的导电胶涂布方法、涂胶装置及涂胶系统。涂胶装置包括：驱动装置；容器（100），用于盛放可流动导电胶，容器的侧壁设有进料口（102），容器的底部设置有出料口（104）；撞针（200），位于容器内，撞针由驱动装置驱动而可在第一位置和第二位置之间往复运动，撞针位于第一位置时，撞针堵塞出料口，撞针位于第二位置时，撞针从出料口脱离以使可流动导电胶可从出料口流出。

Description

一种阵列基板的导电胶涂布方法、涂胶装置及涂胶系统
技术领域
本申请涉及生产制造技术领域，尤其涉及一种阵列基板的导电胶涂布方法、涂胶装置及涂胶系统。
背景技术
目前面板厂所用导电胶，例如ACF（Anisotropic Conductive Film，异方性导电胶膜），都是供应商加工后之卷装成品，这种卷装成品的ACF胶需要经过原料调胶、点胶封装、裁剪等工序，最后打包和运输至市场上，面板厂在从市场上买回这种卷装成品的ACF胶，用这种卷装成品的ACF胶粘结阵列基板和驱动IC系统，此过程使得ACF胶的成本高，导致面板的成本高。
发明内容
本申请提供了一种阵列基板的导电胶涂布方法、涂胶装置及涂胶系统，能够降低导电胶的生产成本，从而降低面板的成本。
第一方面，本申请实施例提供了一种涂胶装置，该涂胶装置包括：
驱动装置；
容器，用于盛放可流动导电胶，所述容器的侧壁设有进料口，所述容器的底部设置有出料口；
撞针，所述撞针位于所述容器内，所述撞针的顶部连接所述驱动装置，所述撞针在所述驱动装置的作用下做上下往复运动，所述撞针与所述出料口抵触将所述出料口堵塞，所述撞针与所述出料口未抵触时所述可流动导电胶从所述出料口流出。
所述容器包括上部和下部，所述上部为筒状，所述下部为漏斗形状。
所述撞针包括针柱和针头，所述针头为锥形。
所述针柱的直径与所述容器的上部内壁的直径相等。
所述进料口位于所述容器的上部，所述撞针位于第一位置时，所述撞针的顶部高于所述进料口。
从所述出料口流出的所述可流动导电胶按预设方向涂布至阵列基板上。
第二方面，本申请实施例提供了一种涂胶系统，该涂胶系统包括涂胶装置和移动装置，
所述涂胶装置包括：
驱动装置；
容器，用于盛放可流动导电胶，所述容器的侧壁设有进料口，所述容器的底部设置有出料口；
撞针，所述撞针位于所述容器内，所述撞针的顶部连接所述驱动装置，所述撞针在所述驱动装置的作用下做上下往复运动，所述撞针与所述出料口抵触将所述出料口堵塞，所述撞针与所述出料口未抵触时所述可流动导电胶从所述出料口流出；
所述移动装置用于使所述涂胶装置将可流动导电胶沿预设方向涂布在阵列基板上。
第三方面，本申请实施例提供了一种阵列基板的导电胶涂布方法，该方法包括：
将可流动导电胶装入涂胶装置；
从所述涂胶装置压出所述可流动导电胶，将所述可流动导电胶沿预设方向涂布在阵列基板上。
所述从所述涂胶装置压出所述可流动导电胶，将所述可流动导电胶沿预设方向涂布在阵列基板上之后，还包括，通过紫外线将涂布在所述阵列基板上的所述可流动导电胶干燥固化。
所述将所述可流动导电胶沿预设方向涂布在阵列基板上包括：
将所述涂胶装置按预设方向移动，使所述可流动导电胶涂布至所述阵列基板上；或
将所述阵列基板按与所述预设方向相反的方向移动，使所述可流动导电胶涂布至所述阵列基板上。
本申请实施例提供的阵列基板的导电胶涂布方法、涂胶装置及涂胶系统，所述涂胶装置包括：驱动装置；容器，用于盛放可流动导电胶，所述容器的侧壁设有进料口，所述容器的底部设置有出料口；撞针，所述撞针位于所述容器内，所述撞针由所述驱动装置驱动而可在第一位置和第二位置之间往复运动，所述撞针位于第一位置时，所述撞针堵塞所述出料口，所述撞针位于第二位置时，所述撞针从所述出料口脱离以使所述可流动导电胶可从所述出料口流出。本申请实施例不需要将导电胶经过点胶封装、裁剪、打包、运输等的工序得到市面上常见的导电胶，再将导电胶粘结在阵列基板上，而是直接将通过原材料调制仍然具有流动性的导电胶直接涂布在阵列基板上，可节省多道工序，降低成本。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种阵列基板的导电胶涂布方法的流程示意图；
图2为本申请实施例提供的一种阵列基板的导电胶涂布方法的另一流程示意图；
图3为本申请实施例提供的一种涂胶装置的结构示意图；
图4为本申请实施例提供的撞针在第一位置的涂胶装置的结构示意图
图5为本申请实施例中提供的撞针在第二位置的涂胶装置的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应当理解，当在本说明书和所附权利要求书中使用时，术语“包括”和“包含”指示所描述特征、整体、步骤、操作、元素和/或组件的存在，但并不排除一个或多个其它特征、整体、步骤、操作、元素、组件和/或其集合的存在或添加。
请参照图1，图1为本申请实施例提供的一种阵列基板的导电胶涂布方法，该方法包括以下步骤S101-S102：
S101、将可流动导电胶装入涂胶装置。
进一步地，导电胶可选为ACF，ACF的原料为树脂、导电颗粒和固化剂，将这些原料混合可调制成所需的可流动导电胶。
现有的ACF（Anisotropic Conductive Film，异方性导电胶膜）都是供应商加工后之卷装成品，这种卷装成品的ACF胶需要经过原料调胶、点胶封装、裁剪等工序，最后打包和运输至市场上，在显示面板涂胶是一般是利用这种卷装成品的ACF胶粘结阵列基板和驱动IC系统，此过程使得ACF胶的成本高，导致面板的成本高。
而在本申请实施例中，将ACF（导电胶）的原料混合调制成所需要的可流动导电胶，这导电胶为刚调制而成的导电胶，不经过点胶封装等工艺，具有流动性，将这些可流动导电胶装入涂胶装置，将导电胶涂布到阵列基板上的对应区域。
S102、从所述涂胶装置压出所述可流动导电胶，将所述可流动导电胶沿预设方向涂布在阵列基板上。
例如，沿阵列基板上平行于扫描线或数据线的方向涂布阵列基板。
进一步地，所述步骤S102具体为：将所述涂胶装置按预设方向移动，使所述可流动导电胶涂布至所述阵列基板上。
或者，所述步骤S102具体包括：将所述阵列基板按与所述预设方向相反的方向移动，使所述可流动导电胶涂布至所述阵列基板上。
在本申请实施例中，可通过移动阵列基板或移动涂胶装置将可流动导电胶涂布在阵列基板所需要的地方上。
本申请实施例的阵列基板的导电胶涂布方法直接将通过原材料调制仍然具有流动性的导电胶直接涂布在阵列基板上，可节省多道工序，降低成本。
请参照图2，图2为本申请实施例提供的一种阵列基板的导电胶涂布方法，该方法包括以下步骤S101-S103：
S101、将可流动导电胶装入涂胶装置。
S102、从所述涂胶装置压出所述可流动导电胶，将所述可流动导电胶沿预设方向涂布在阵列基板上。
所述导电胶为ACF，将树脂、导电颗粒和固化剂混合调制成导电胶，这导电胶为刚调制而成的导电胶，将这些可流动导电胶装入涂胶装置，将导电胶沿预设方向涂布到阵列基板上的对应区域，例如，沿阵列基板上平行于扫描线或数据线的方向涂布阵列基板。
进一步地，所述步骤S102具体为：将所述涂胶装置按预设方向移动，使所述可流动导电胶涂布至所述阵列基板上。
或者，所述步骤S102具体包括：将所述阵列基板按与所述预设方向相反的方向移动，使所述可流动导电胶涂布至所述阵列基板上。
在本申请实施例中，可通过移动阵列基板或移动涂胶装置将可流动导电胶涂布在阵列基板所需要的地方。
S103、通过紫外线将涂布在所述阵列基板上的所述可流动导电胶干燥固化。
在阵列基板上涂上可流动导电胶后需要将可流动导电胶干燥固化，以便阵列基板与显示面板的驱动电路进行粘结，通过紫外线可以将可流动导电胶干燥固化。
紫外线可悬挂于阵列基板的上方，正对着阵列基板上需要图上导电胶的地方，以便可以快速地干燥固化导电胶。
本申请实施例是通过紫外线将可流动导电胶干燥固化，在其他实施例中可以通过其他手段将将涂布在所述阵列基板上的所述可流动导电胶干燥固化，只要能将这些可流动导电胶干燥固化即可。
本申请实施例的阵列基板的导电胶涂布方法，不需要将导电胶经过点胶封装、裁剪、打包、运输等的工序得到市面上常见的导电胶，再将导电胶粘结在阵列基板上，而是直接将通过原材料调制仍然具有流动性的导电胶直接涂布在阵列基板上，可节省多道工序，降低成本。
请参照图3，图3为本申请实施例提供的一种涂胶装置，该涂胶装置包括驱动装置（图中为示出）、容器100以及撞针200，所述容器100用于盛放可流动导电胶，所述容器100的侧壁设有进料口102，所述容器100的底部设置有出料口104，所述撞针200位于所述容器100内，所述撞针200由所述驱动装置驱动而可在第一位置和第二位置之间往复运动，所述撞针200位于第一位置时，所述撞针200堵塞所述出料口104，所述撞针200位于第二位置时，所述撞针200从所述出料口104脱离以使所述可流动导电胶可从所述出料口104流出。
进一步地，所述可流动导电胶为可流动的ACF（Anisotropic Conductive Film）。
现有的导电胶，例如ACF（异方性导电胶膜）都是供应商加工后之卷装成品，这种卷装成品的ACF胶需要经过原料调胶、点胶封装、裁剪等工序，最后打包和运输至市场上，在显示面板涂胶是一般是利用这种卷装成品的ACF胶粘结阵列基板和驱动IC系统，此过程使得ACF胶的成本高，导致面板的成本高。
而在本申请实施例的涂胶装置装入ACF（导电胶）的原料混合调制成所需要的可流动导电胶，将导电胶涂布到阵列基板上的对应区域。本申请不需要经过点胶封装等工艺制作导电胶，通过一个涂胶装置便可以实现涂胶，节省了导电胶制作过程所需要用到的各种仪器或装置，节约成本。
撞针200在驱动装置的驱动下做上下往复运动，驱动装置控制撞针200上下运动的频率，从而控制出胶量。
如图4所示，当撞针200位于第一位置时，所述撞针200堵塞所述出料口104，所述可流动的导电胶无法流出。
如图5所示，当撞针200位于第二位置时，所述撞针200从所述出料口104脱离以使所述可流动导电胶可从所述出料口104流出，出料口104的下方正对阵列基板需要涂胶的位置。
具体地，在本申请具体实施过程，第二位置为能使可流动导电胶从出料口104流出撞针200所在的最低位置或更高的位置，图5仅为本申请的一个实施例。
进一步地，所述容器100包括上部101和下部103，所述上部101为筒状，所述下部103为漏斗形状。
进一步地，所述撞针200包括针柱和针头，所述针头为锥形。
进一步地，所述针柱的直径与所述容器100的上部101内壁的直径相等。
进一步地，所述进料口102位于所述容器100的上部101，所述撞针200位于第一位置时，所述撞针200的顶部高于所述进料口102。
所述撞针200位于第一位置时，所述撞针200的顶部高于所述进料口102，能够保证可流动导电胶流进由撞针200和容器100限制出的空间内，且容器100的上部101内壁的直径相等，使撞针200成为容器100上方的封口，防止导电胶被污染。
针柱的直径与所述容器100的上部101内壁的直径相等，且当撞针200位于第一位置时，所述撞针200的顶部高于所述进料口102，在导电胶不从出料口104流出时，进料口102不进料。
本申请实施例的涂胶装置，直接将通过原材料调制仍然具有流动性的导电胶直接涂布在阵列基板上，可节省多道工序所需的装置，降低成本。
本申请实施例还提供一种涂胶系统，该涂胶系统包括移动装置以及涂胶装置。
所述移动装置用于使涂胶装置将可流动导电胶沿预设方向涂布在阵列基板上。
所述移动装置具体用于与所述涂胶装置连接，按预设方向移动所述涂胶装置，或用于承放阵列基板且按与预设方向相反的方向移动所述阵列基板。
该涂胶装置包括驱动装置、容器以及撞针，所述容器用于盛放可流动导电胶，所述容器的侧壁设有进料口，所述容器的底部设置有出料口，所述撞针位于所述容器内，所述撞针由所述驱动装置驱动而可在第一位置和第二位置之间往复运动，所述撞针位于第一位置时，所述撞针堵塞所述出料口，所述撞针位于第二位置时，所述撞针从所述出料口脱离以使所述可流动导电胶可从所述出料口流出。
撞针在驱动装置的驱动下在第一位置和第二位置之间做上下往复运动，且驱动装置控制撞针上下运动的频率，从而控制出胶量。
当撞针位于第一位置时，所述撞针堵塞所述出料口，所述可流动的导电胶无法流出。
当撞针位于第二位置时，所述撞针从所述出料口脱离以使所述可流动导电胶可从所述出料口流出，出料口的下方正对阵列基板需要涂胶的位置。
具体地，在本申请具体实施过程，第二位置为能使可流动导电胶从出料口流出撞针所在的最低位置或更高的位置。
所述容器包括上部和下部，所述上部为筒状，所述下部为漏斗形状。
所述撞针包括针柱和针头，所述针头为锥形。
所述针柱的直径与所述容器的上部内壁的直径相等。
所述进料口位于所述容器的上部，所述撞针位于第一位置时，所述撞针的顶部高于所述进料口。
所述撞针位于第一位置时，所述撞针的顶部高于所述进料口，能够保证可流动导电胶流进由撞针和容器限制出的空间内，且容器的上部内壁的直径相等，使撞针成为容器上方的封口，防止导电胶被污染。
针柱的直径与所述容器的上部内壁的直径相等，且当撞针位于第一位置时，所述撞针的顶部高于所述进料口，在导电胶不从出料口流出时，进料口不进料。
所述涂胶系统还包括固化装置，所述固化装置用于向所述涂布在阵列基板上的可流动导电胶照射紫外线，将所述可流动导电胶干燥固化。
本申请实施例的涂胶装置，直接将通过原材料调制仍然具有流动性的导电胶直接涂布在阵列基板上，可节省多道工序所需的装置，降低成本。
需要说明的是，在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详细描述的部分，可以参见其他实施例的相关描述。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种涂胶装置，包括：
    驱动装置；
    容器，用于盛放可流动导电胶，所述容器的侧壁设有进料口，所述容器的底部设置有出料口；
    撞针，所述撞针位于所述容器内，所述撞针由所述驱动装置驱动而可在第一位置和第二位置之间往复运动，所述撞针位于第一位置时，所述撞针堵塞所述出料口，所述撞针位于第二位置时，所述撞针从所述出料口脱离以使所述可流动导电胶可从所述出料口流出。
  2. 根据权利要求1所述的涂胶装置，其中，所述容器包括上部和下部，所述上部为筒状，所述下部为漏斗形状。
  3. 根据权利要求2所述的涂胶装置，其中，所述撞针包括针柱和针头，所述针头为锥形。
  4. 根据权利要求3所述的涂胶装置，其中，所述针柱的直径与所述容器的上部内壁的直径相等。
  5. 根据权利要求2所述的涂胶装置，其中，所述进料口位于所述容器的上部，所述撞针位于第一位置时，所述撞针的顶部高于所述进料口。
  6. 根据权利要求1所述的涂胶装置，其中，从所述出料口流出的所述可流动导电胶按预设方向涂布至阵列基板上。
  7. 一种涂胶系统，包括涂胶装置和移动装置，其中，所述涂胶装置包括：
    驱动装置；
    容器，用于盛放可流动导电胶，所述容器的侧壁设有进料口，所述容器的底部设置有出料口；
    撞针，所述撞针位于所述容器内，所述撞针由所述驱动装置驱动而可在第一位置和第二位置之间往复运动，所述撞针位于第一位置时，所述撞针堵塞所述出料口，所述撞针位于第二位置时，所述撞针从所述出料口脱离以使所述可流动导电胶可从所述出料口流出；
    所述移动装置用于使所述涂胶装置将可流动导电胶沿预设方向涂布在阵列基板上。
  8. 根据权利要求7所述的涂胶系统，其中，所述容器包括上部和下部，所述上部为筒状，所述下部为漏斗形状。
  9. 根据权利要求8所述的涂胶系统，其中，所述撞针包括针柱和针头，所述针头为锥形。
  10. 根据权利要求9所述的涂胶系统，其中，所述针柱的直径与所述容器的上部内壁的直径相等。
  11. 根据权利要求8所述的涂胶系统，其中，所述进料口位于所述容器的上部，所述撞针位于第一位置时，所述撞针的顶部高于所述进料口。
  12. 根据权利要求7所述的涂胶系统，其中，从所述出料口流出的所述可流动导电胶按预设方向涂布至阵列基板上。
  13. 根据权利要求7所述的涂胶系统，其中，所述移动装置与所述涂胶装置连接，用于按预设方向移动所述涂胶装置。
  14. 根据权利要求7所述的涂胶系统，其中，所述移动装置用于承放阵列基板且按与预设方向相反的方向移动所述阵列基板。
  15. 根据权利要求7所述的涂胶系统，其中，还包括固化装置，所述固化装置用于向所述涂布在阵列基板上的可流动导电胶照射紫外线，将所述可流动导电胶干燥固化。
  16. 一种阵列基板的导电胶涂布方法，包括：
    将可流动导电胶装入涂胶装置；
    从所述涂胶装置压出所述可流动导电胶，将所述可流动导电胶沿预设方向涂布在阵列基板上。
  17. 根据权利要求16所述的导电胶涂布方法，其中，所述从所述涂胶装置压出所述可流动导电胶，将所述可流动导电胶沿预设方向涂布在阵列基板上之后，还包括，将涂布在所述阵列基板上的所述可流动导电胶干燥固化。
  18. 根据权利要求16所述的导电胶涂布方法，其中，所述将涂布在所述阵列基板上的所述可流动导电胶干燥固化，包括：
    通过紫外线将涂布在所述阵列基板上的所述可流动导电胶干燥固化。
  19. 根据权利要求16所述的导电胶涂布方法，其中，所述将所述可流动导电胶沿预设方向涂布在阵列基板上包括：
    将所述涂胶装置按预设方向移动，使所述可流动导电胶涂布至所述阵列基板上。
  20. 根据权利要求16所述的导电胶涂布方法，其中，所述将所述可流动导电胶沿预设方向涂布在阵列基板上包括：
    将所述阵列基板按与所述预设方向相反的方向移动，使所述可流动导电胶涂布至所述阵列基板上。
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