WO2018218933A1 - 芯片复位装置 - Google Patents

芯片复位装置 Download PDF

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Publication number
WO2018218933A1
WO2018218933A1 PCT/CN2017/116814 CN2017116814W WO2018218933A1 WO 2018218933 A1 WO2018218933 A1 WO 2018218933A1 CN 2017116814 W CN2017116814 W CN 2017116814W WO 2018218933 A1 WO2018218933 A1 WO 2018218933A1
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unit
comparison
signal
chip
reset
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PCT/CN2017/116814
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English (en)
French (fr)
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杨湛
毛宏程
王波
段维虎
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广州众诺电子技术有限公司
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Publication of WO2018218933A1 publication Critical patent/WO2018218933A1/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern

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  • the utility model relates to the technical field of printing consumables, in particular to a chip resetting device.
  • the chip In the field of image forming equipment such as printers, copies, fax machines, and all-in-ones, when the toner or ink in the toner cartridge or ink cartridge is consumed, the chip is usually recognized as being consumed by the imaging device. It cannot be used again by the imaging device. If the expensive chip that is mounted on the toner cartridge or the ink cartridge is discarded, it will cause unnecessary waste.
  • the present invention provides a chip reset device with high reset efficiency, including a single chip microcomputer, a modulation unit, a resonance unit, a demodulation unit, a filtering unit, and an shaping unit; the modulation unit and the shaping unit are both The single chip is connected; the modulation unit, the resonance unit, the demodulation unit, the filtering unit, and the shaping unit are connected in series;
  • the shaping unit includes an amplification module and a comparison module; the amplification module is connected to the filtering unit; and the comparison module is connected to the amplification module.
  • the amplification module comprises an amplifier and an amplification element for controlling the amplification factor, the amplification element being connected to the amplifier.
  • the amplifying element comprises a first resistor and a second resistor; the first resistor comprises a first connecting end and a second connecting end; the second resistor comprises a third connecting end and a fourth connecting end; The first connection end is connected to the amplifying element; the third connection end is connected to the second connection end and the amplifying element; and the fourth connection end is grounded.
  • the amplifier is connected to a filtering unit.
  • the first connection end is connected to the comparison module.
  • the comparison module comprises a comparison element and a calculation element for controlling the comparison parameter; the calculation element is connected to the comparison element.
  • the computing element includes a third resistor and a fourth resistor; the third resistor includes a fifth connection end and a sixth connection end; the fourth resistor includes a seventh connection end and an eighth connection end; The fifth connection end is connected to the comparison element; the seventh connection end is connected to the sixth connection end and the comparison element; and the eighth connection end is grounded.
  • the comparison element is connected to a filtering unit.
  • the comparison module is connected to the amplification module.
  • an antenna is further included, the antenna being coupled to the resonance module.
  • the chip to be reset After the chip reset device of the present invention sends the data to be reset to the chip to be reset, the chip to be reset generates a reset signal, and the reset signal is sent.
  • the resonant circuit sends a reset signal to the demodulation unit, and the demodulation unit demodulates the reset signal into a demodulated signal, and then filters the demodulated signal through the filtering unit to adjust the effective amplitude of the demodulated signal, and the amplification module of the shaping unit
  • the filtered demodulated signal is amplified to increase the amplitude of the demodulated signal, so that the weak demodulated signal can be amplified to the normal signal amplitude, but since the amplified signal is amplified by the weak signal, the signal amplitude is jagged.
  • the signal amplitude cannot be unified height. If the amplified signal is directly analyzed by the MCU, it will not be received because the amplitude of the individual signals is not uniform. Therefore, the comparison of the amplified signals by the comparison module can make the amplitude of the data signal uniform. To achieve the required amplitude of the single-chip microcomputer, the single-chip microcomputer can analyze all the signals, thereby improving the sensitivity of the chip reset device to the chip recognition, and the reset efficiency is greatly improved.
  • FIG. 1 is a schematic diagram of a chip reset device module in an embodiment of the present invention
  • FIG. 2 is a circuit diagram of a chip reset device in an embodiment of the present invention.
  • 3 is a signal pattern of a resonance unit output according to an embodiment of the present invention.
  • Figure 5 is a diagram of the signal pattern at the time of resetting the reset device.
  • the embodiment provides a chip reset device, which includes a single chip microcomputer 1, a modulation unit 2, a resonance unit 3, a demodulation unit 4, a filtering unit 5, and an shaping unit. 6.
  • the modulation unit 2 and the shaping unit 6 are both connected to the single chip microcomputer 1.
  • the modulating unit 2, the resonating unit 3, the demodulating unit 4, the filtering unit 5, and the shaping unit 6 are connected in series.
  • the modulation unit 2 is used to transmit the data of the single chip 1 to the resonance unit 3 and is transmitted by the resonance unit 3 to the chip to be reset.
  • the chip to be reset returns a reset signal after receiving the data, and transmits the reset signal to the resonance unit 3.
  • the single chip 1 can be STM8 series, STM32 series, MSP430 series, AT89 series and STC12 series, etc.
  • the resonance unit 3 receives a reset signal from a chip to be reset, and the demodulation unit 4 mediates the reset signal transmitted by the resonance unit 3 and removes the carrier to form a baseband signal.
  • the demodulation unit transmits the baseband signal to the filtering unit 5, and the filtering unit 5 removes the clutter to form a flat baseband signal.
  • the filtering unit 5 will remove the clutter and then transmit it to the shaping unit 6 for amplification and shaping.
  • the filtering unit 5 transmits the baseband signal after the removal of the clutter to the amplification module 61 for amplification to a predetermined multiple, and transmits the amplified baseband signal to the comparison module 62.
  • the comparison module 62 After receiving the amplified baseband signal, the comparison module 62 compares the baseband signals and adjusts the signal greater than the threshold to a preset value. The comparison module 62 sends the adjusted baseband signal to the microcontroller 1 to complete the data reset of the chip to be reset.
  • the chip reset device of the embodiment may further include an antenna 7, and the antenna 7 is connected to the resonance module.
  • the antenna 7 is a way for the chip to be reset to communicate with the chip reset device.
  • the chip to be reset can be exchanged with the chip reset device via the antenna 7. After the data of the single chip 1 passes through the modulating unit 2 and the resonating unit 3, it can be sent to the chip to be reset through the antenna 7.
  • the chip to be reset can also send data to the resonating unit 3 through the antenna 7, and then pass through the adjusting unit and the shaping unit 6. After processing, it is sent to the microcontroller 1.
  • the shaping unit 6 includes an amplification module 61 and a comparison module 62.
  • the comparison module 62 is connected to the amplification module 61.
  • the amplification module 61 is connected to the filtering unit 5.
  • the amplification module 61 is configured to amplify the baseband after being processed by the filtering unit 5 to a predetermined multiple.
  • the amplification module 61 includes an amplifier 611 and an amplification element 612 for controlling the amplification factor, and the amplification element 612 is connected to the amplifier 611.
  • the amplifier 611 can be one of the TLC 2272, LMV 358, TLV 2262 A, or TLC 2202 A, or the like, or other similar amplifier 611.
  • the amplifying element 612 includes a first resistor 6121 and a second resistor 6122.
  • the first resistor 6121 includes a first connection end 6121a and a second connection end 6121b.
  • the second resistor 6122 includes a third connection end 6122a and a fourth connection end 6122b.
  • the first connection end 6121a is connected to the amplification element 612.
  • the third connecting end 6122a is connected to the second connecting end 6121b and the amplifying element 612.
  • the fourth connection end 6122b is grounded.
  • the amplification factor can be calculated by the first resistor 6121 and the second resistor 6122.
  • the magnification is 2.
  • the amplifier 611 is connected to the filtering unit 5.
  • the first connection end 6121a is connected to the comparison module 62.
  • the comparison module 62 is connected to the amplification module 61, and the comparison module 62 is configured to adjust the baseband information amplified by the amplification module 61 according to the comparison parameter.
  • the comparison module 62 includes a comparison component 621 and a computing component 622 for controlling comparison parameters.
  • the computing component 622 is coupled to the comparison component 621.
  • the computing component 622 includes a third resistor 6221 and a fourth resistor 6222; a comparison parameter can be calculated by the third resistor 6221 and the fourth resistor 6222.
  • the third resistor 6221 includes a fifth connection end 6221a and a sixth connection end 6221b.
  • the fourth resistor 6222 includes a seventh connection end 6222a and an eighth connection end 6222b.
  • the fifth connection end 6221a is connected to the comparison component 621.
  • the seventh connecting end 6222a is connected to the sixth connecting end 6221b and the comparing element 621; the eighth connecting end 6222b is grounded.
  • the comparison component 621 can adjust the baseband signal whose voltage value is greater than the comparison parameter N to a predetermined voltage. For example, when the VCC voltage value of the comparison component 621 is 3.3V, the resistance of the third resistor 6221 is equal to the resistance of the fourth resistor 6222.
  • the comparison parameter N 1.65V, when the voltage value of the baseband signal is greater than 1.65V, the comparison element 621 modifies the corresponding baseband signal to 3.3V, and when the voltage value of the baseband signal is less than 1.65V, the comparison element 621 is complained.
  • the corresponding baseband signal is modulated to 0V.
  • the comparison element 621 is connected to the filter unit 5.
  • the amplified baseband signal can be adjusted by the comparison module 62, so that the jagged baseband signals become neat and regular, thereby ensuring that the single chip 1 can better identify the chip that ensures that the data can be better reset by the reset value.
  • the comparison element 621 can be LM339, LM393, LM324, A comparator or other similar comparator of CA139, CA239, CA339, LM2901, LM3302.
  • the reset signal in the prior art is prone to loss, thereby causing the reset device to recognize that the sensitivity of the chip to be reset is not high.
  • the demodulation signal is filtered by the filtering unit to adjust the effective amplitude of the demodulated signal, and the filtered demodulated signal is amplified by the amplifying module of the shaping unit, so that the amplitude of the demodulated signal is improved.
  • the weak demodulated signal can be amplified to the normal signal amplitude, but since the amplified signal is amplified by the weak signal, there is a jaggedness of the signal amplitude (the signal amplitude cannot be uniform height), and if the amplified signal is directly
  • the data analysis by the single-chip microcomputer will not be received because the amplitude of the individual signals is not uniform. Therefore, by comparing the amplified signals with the comparison module, the amplitude of the data signal can be uniformly unified to the required amplitude of the single-chip microcomputer, so that the single-chip microcomputer can analyze all the signals, thereby The sensitivity of the chip reset device to the chip identification is improved, so that the reset efficiency is greatly improved.
  • the chip reset device of the present invention sends the data to be reset to the chip to be reset, and after the reset signal of the chip to be reset passes through the resonance unit, it sequentially passes through the demodulation unit 4, the filtering unit 5, and the shaping unit. 6 Forming a new baseband signal, so that the single-chip microcomputer 1 of the reset device can better identify the baseband signal, and decode the baseband signal to complete the new data reset to be reset, so that the original chip after use can be reused.
  • the shaping unit 6 first amplifies the baseband signal through the amplification module 61, and then sorts the baseband signal through the comparison module 62, thereby effectively improving the sensitivity of the reset device reset chip, thereby improving the efficiency of the chip reset.

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Abstract

一种芯片复位装置,包括单片机(1)、调制单元(2)、谐振单元(3)、解调单元(4)、滤波单元(5)及整形单元(6);调制单元(2)及整形单元(6)均与单片机(1)连接;调制单元(2)、谐振单元(3)、解调单元(4)、滤波单元(5)及整形单元(6)依次串连;整形单元(6)包括放大模块(61)及比较模块(62);放大模块(61)与滤波单元(5)连接。芯片复位装置通过滤波单元(5)对解调信号进行滤波,调节信号的有效幅度,然后将滤波后的解调信号经过放大模块(61)对解调信号进行放大,使得解调信号幅度提高,如此便可将微弱的解调信号放大到正常信号幅度,再经比较模块(62)对放大信号进行比较后就可以使得数据信号幅度统一达到单片机(1)需要幅度,便可以使单片机(1)将所有信号接收解析,从而提高芯片复位装置对芯片识别的灵敏度,使得复位效率大大提高。

Description

芯片复位装置 技术领域
本实用新型涉及打印耗材技术领域,具体涉及一种芯片复位装置。
背景技术
在打印机、复印件、传真机及多功能一体机等成像设备领域中,当碳粉盒或者墨盒中的碳粉或墨水等消耗完了之后,芯片通常就会被成像设备认定为已经消耗完毕,芯片则不能再次被成像设备使用。若将安装在碳粉盒或者墨盒上且价格不菲的芯片因此丢弃,则会造成不必要浪费。
为了避免浪费,目前已经出现了对使用过的芯片进行复位的装置,然而目前通过复位装置对芯片进行复位时会出现数据丢失的情况,从而导致灵敏度较低。即将芯片放置于复位装置时部分芯片不能被复位装置准确地进行复位操作,进而导致芯片复位的效率降低。
实用新型内容
为解决以上所述问题,本实用新型提供一种复位效率较高的芯片复位装置,包括单片机、调制单元、谐振单元、解调单元、滤波单元及整形单元;所述调制单元及整形单元均与所述单片机连接;所述调制单元、谐振单元、解调单元、滤波单元及整形单元依次串连;所述 整形单元包括放大模块及比较模块;所述放大模块与滤波单元连接;所述比较模块与放大模块连接。
优选地,所述放大模块包括放大器及用于控制放大倍数的放大元件,所述放大元件与放大器连接。
优选地,所述放大元件包括第一电阻及第二电阻;所述第一电阻包括第一连接端与第二连接端;所述第二电阻包括第三连接端与第四连接端;所述第一连接端与放大元件连接;所述第三连接端与第二连接端及放大元件均连接;所述第四连接端接地。
优选地,所述放大器与滤波单元连接。
优选地,所述第一连接端与所述比较模块连接。
优选地,所述比较模块包括比较元件及用于控制比较参数的计算元件;所述计算元件与比较元件连接。
优选地,所述计算元件包括第三电阻及第四电阻;所述第三电阻包括第五连接端与第六连接端;所述第四电阻包括第七连接端与第八连接端;所述第五连接端与比较元件连接;所述第七连接端与第六连接端及比较元件均连接;所述第八连接端接地。
优选地,所述所述比较元件与滤波单元连接。
优选地,所述比较模块与放大模块连接。
优选地,还包括天线,所述天线与谐振模块连接。
本实用新型的有益效果:
与现有技术,本实用新型所述的芯片复位装置将待复位的数据发送至待复位芯片之后,待复位芯片会生成复位信号,并将复位信号发 送至谐振单元。谐振电路将复位信号发送至解调单元,解调单元将复位信号解调成解调信号,然后通过滤波单元对解调信号进行滤波,调节解调信号的有效幅度,通过整形单元的放大模块将滤波后的解调信号进行放大,使得解调信号幅度提高,如此便可将微弱的解调信号放大到正常信号幅度,但由于放大信号是由微弱信号放大的,因此存在信号幅度的参差不齐(信号幅度不能统一高度),若直接对放大后的信号进行单片机解析数据,会因为个别信号的幅度不齐导致接收不到,因此利用比较模块对放大信号进行比较后就可以使得数据信号幅度统一达到单片机需要幅度,便可以使单片机将所有信号接收解析,从而提高芯片复位装置对芯片识别的灵敏度,使得复位效率大大提高。
附图说明
图1为本实用新型的实施例中一种芯片复位装置模块示意图;
图2为本实用新型的实施例中一种芯片复位装置电路图;
图3为本实用新型的实施例中谐振单元输出的一种信号图形;
图4为本实用新型的实施例中整形单元输出的一种信号图形;
图5背景技术中复位装置复位时的信号图形。
具体实施方式
下面,结合附图以及具体实施方式,对本实用新型做进一步描述:
参照图1与图2,本实施例提供一种芯片复位装置,其包括单片机1、调制单元2、谐振单元3、解调单元4、滤波单元5及整形单元 6。所述调制单元2及整形单元6均与所述单片机1连接。所述调制单元2、谐振单元3、解调单元4、滤波单元5及整形单元6依次串连。所述调制单元2用于将单片机1的数据发送至谐振单元3,并由谐振单元3发送至待复位的芯片。待复位的芯片在收到数据之后返回复位信号,并将复位信号发送给谐振单元3。所述单片机1可为STM8系列、STM32系列、MSP430系列、AT89系列及STC12系列等
参照图3,所述谐振单元3接收待复位芯片发出的复位信号,解调单元4将谐振单元3发送的复位信号进行调解之后并去除载波形成基带信号。解调单元将基带信号发送至滤波单元5,通过滤波单元5去除杂波形成平整的基带信号。参照图4,滤波单元5将去除杂波之后发送至整形单元6进行放大并整形。例如滤波单元5将去除杂波之后的基带信号发送至放大模块61进行放大至预定倍数,并将放大后的基带信号发送至比较模块62。比较模块62在接收到放大后的基带信号之后,对基带信号进行比较,并将大于阈值的信号调整至预设值。比较模块62将调整后的基带信号发送至单片机1,从而完成待复位芯片的数据复位。
需要说明的是,参照图2,所述调制单元2可为一种调制电路;谐振单元3可为一种谐振单元;解调单元4可为一种解调电路;滤波单元5可为一种滤波电路。
作为另一较佳实施例,为了实现芯片与复位装置通过无线传输数据,本实施例的芯片复位装置还可以包括天线7,所述天线7与谐振模块连接。天线7是待复位芯片与芯片复位装置交流通信的途径。例 如待复位的芯片可通过天线7实现与芯片复位装置进行数据交换。在单片机1的数据经过调制单元2及谐振单元3之后可通过天线7发送给待复位芯片,待复位的芯片也可通过天线7将数据发送至谐振单元3,然后再通过调节单元及整形单元6处理之后发送给单片机1。
所述整形单元6包括放大模块61及比较模块62。所述比较模块62与放大模块61连接。所述放大模块61与滤波单元5连接。所述放大模块61用于对经过滤波单元5处理之后的基带进行放大至预定倍数。所述放大模块61包括放大器611及用于控制放大倍数的放大元件612,所述放大元件612与放大器611连接。所述放大器611可为TLC2272、LMV358、TLV2262A或者TLC2202A等中的一种放大器,或者其他类似的放大器611。
较佳地,所述放大元件612包括第一电阻6121及第二电阻6122。所述第一电阻6121包括第一连接端6121a与第二连接端6121b。所述第二电阻6122包括第三连接端6122a与第四连接端6122b。所述第一连接端6121a与放大元件612连接。所述第三连接端6122a与第二连接端6121b及放大元件612均连接。所述第四连接端6122b接地。可通过第一电阻6121与第二电阻6122计算得到放大倍数,例如放大倍数M可采用公式M=1+第一电阻6121的阻值/第二电阻6122的阻值。当第一电阻6121的阻值/第二电阻6122的阻值相等时,例如二者的分别为10K时,所述放大倍数为2。经过放大模块61对基带信号放大之后,可以有效的避免当基带信号中的部分高频信号电压值较低时不能被单片机1识别从而导致数据丢失的情况。所述放大器611 与滤波单元5连接。所述第一连接端6121a与所述比较模块62连接。所述比较模块62与放大模块61连接,该比较模块62用于根据比较参数调整经过放大模块61放大后的基带信息。所述比较模块62包括比较元件621及用于控制比较参数的计算元件622。所述计算元件622与比较元件621连接。所述计算元件622包括第三电阻6221及第四电阻6222;可通过第三电阻6221与第四电阻6222计算得到比较参数。所述比较参数N的计算公式可为:N=比较元件621的VCC电压值*(第四电阻6222的阻值/(第三电阻6221的阻值+第四电阻6222的阻值))。所述第三电阻6221包括第五连接端6221a与第六连接端6221b;所述第四电阻6222包括第七连接端6222a与第八连接端6222b;所述第五连接端6221a与比较元件621连接;所述第七连接端6222a与第六连接端6221b及比较元件621均连接;所述第八连接端6222b接地。比较元件621可将电压值大于比较参数N的基带信号调整为预定电压,例如当比较元件621的VCC电压值为3.3V,第三电阻6221的阻值与第四电阻6222的阻值相等,所述比较参数N=1.65V,当基带信号的电压值大于1.65V时,所诉比较元件621将相应的基带信号调制为3.3V,当基带信号的电压值小于1.65V时,所诉比较元件621将相应的基带信号调制为0V。
所述所述比较元件621与滤波单元5连接。可通过比较模块62对放大后的基带信号进行调整,使得参差不齐的基带信号变的整齐有规律,进而保证单片机1能更好的识别保证数据能更好的被复位值待复位的芯片。优选地,所述比较元件621可为LM339、LM393、LM324、 CA139、CA239、CA339、LM2901、LM3302中的一种比较器或其他类似的比较器。
结合参照图4与图5,现有技术中的复位信号容易出现丢失的情况从而导致复位装置识别待复位芯片的灵敏度不高。而本实用新型的芯片复位装置中通过滤波单元对解调信号进行滤波,调节解调信号的有效幅度,通过整形单元的放大模块将滤波后的解调信号进行放大,使得解调信号幅度提高,如此便可将微弱的解调信号放大到正常信号幅度,但由于放大信号是由微弱信号放大的,因此存在信号幅度的参差不齐(信号幅度不能统一高度),若直接对放大后的信号进行单片机解析数据,会因为个别信号的幅度不齐导致接收不到,因此利用比较模块对放大信号进行比较后就可以使得数据信号幅度统一达到单片机需要幅度,便可以使单片机将所有信号接收解析,从而提高芯片复位装置对芯片识别的灵敏度,使得复位效率大大提高。
综上所述,本实用新型所述的芯片复位装置将待复位的数据发送至待复位芯片之后,待复位芯片返回复位信号经过谐振单元之后,依次经过解调单元4、滤波单元5及整形单元6形成新的基带信号,使得复位装置的单片机1更好的识别基带信号,并对基带信号进行解码之后完成待复位新的数据复位,从而使得使用后的原装芯片可以重复利用。所述整形单元6首先通过放大模块61对基带信号进行放大,然后再通过比较模块62对基带信号进行整理,从而可有效地提高复位装置复位芯片的灵敏度,进而提高芯片复位的效率。
对本领域的技术人员来说,可根据以上描述的技术方案以及构 思,做出其它各种相应的改变以及形变,而所有的这些改变以及形变都应该属于本实用新型权利要求的保护范围之内。
需要说明的是:以上所述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。实施例和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式,除非上下文清楚地表示其他含义。

Claims (10)

  1. 一种芯片复位装置,包括单片机、调制单元、谐振单元、解调单元、滤波单元及整形单元;所述调制单元及整形单元均与所述单片机连接;所述调制单元、谐振单元、解调单元、滤波单元及整形单元依次串连;其特征在于:所述整形单元包括放大模块及比较模块;所述放大模块与滤波单元连接;所述比较模块与放大模块连接。
  2. 根据权利要求1所述的芯片复位装置,其特征在于:所述放大模块包括放大器及用于控制放大倍数的放大元件,所述放大元件与放大器连接。
  3. 根据权利要求2所述的芯片复位装置,其特征在于:所述放大元件包括第一电阻及第二电阻;所述第一电阻包括第一连接端与第二连接端;所述第二电阻包括第三连接端与第四连接端;所述第一连接端与放大元件连接;所述第三连接端与第二连接端及放大元件均连接;所述第四连接端接地。
  4. 根据权利要求2或3所述的芯片复位装置,其特征在于:所述放大器与滤波单元连接。
  5. 根据权利要求3所述的芯片复位装置,其特征在于:所述第一连接端与所述比较模块连接。
  6. 根据权利要求1所述的芯片复位装置,其特征在于:所述比较模块包括比较元件及用于控制比较参数的计算元件;所述计算元件与比较元件连接。
  7. 根据权利要求6所述的芯片复位装置,其特征在于:所述计算元件包括第三电阻及第四电阻;所述第三电阻包括第五连接端与第 六连接端;所述第四电阻包括第七连接端与第八连接端;所述第五连接端与比较元件连接;所述第七连接端与第六连接端及比较元件均连接;所述第八连接端接地。
  8. 根据权利要求7所述的芯片复位装置,其特征在于:所述所述比较元件与滤波单元连接。
  9. 根据权利要求7所述的芯片复位装置,其特征在于:所述比较模块与放大模块连接。
  10. 根据权利要求1-3、5-9任一项所述的芯片复位装置,其特征在于:还包括天线,所述天线与谐振模块连接。
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