WO2018196689A1 - Multi-wavelength hybrid integrated light emitting array - Google Patents
Multi-wavelength hybrid integrated light emitting array Download PDFInfo
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- WO2018196689A1 WO2018196689A1 PCT/CN2018/083892 CN2018083892W WO2018196689A1 WO 2018196689 A1 WO2018196689 A1 WO 2018196689A1 CN 2018083892 W CN2018083892 W CN 2018083892W WO 2018196689 A1 WO2018196689 A1 WO 2018196689A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
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- the present invention relates to the field of semiconductor integration technologies, and in particular, to a multi-wavelength hybrid integrated light emitting array.
- the high-speed multi-wavelength hybrid integrated light-emitting array is the core component of the high-speed optical transmission network.
- a common multi-wavelength laser emitting array is constructed such that an InP (indium phosphide)-based DFB (Distributed Feedback Laser) produces a multi-wavelength laser that is split into a lithium niobate via a Y-type optical waveguide on a silicon substrate.
- the optical waveguide is modulated and then intensity modulated by combining the silicon-based Y-waveguides.
- Silicon-based optical waveguides are ideal materials for optical waveguides due to their low loss and their refractive index can be adjusted by doping.
- the active optoelectronic devices are mostly III-V semiconductor materials, the integration between the optical devices of different materials has a certain optical loss, and the preparation process is complicated.
- the size of the silicon-based Y-type optical waveguide is large, which is a challenge for photonic integration technology.
- It is an object of the present invention to provide a multi-wavelength hybrid integrated light emitting array comprising a plurality of light processing units, each of the light processing units comprising:
- An active optical device for emitting laser light comprising a first substrate, the first substrate being a III-V semiconductor material;
- a split beam optical waveguide for splitting the laser beam into a split beam laser comprising a second substrate, the material of the second substrate being the same as the first substrate.
- the III-V semiconductor material comprises indium phosphide.
- each of the light processing units further includes:
- a combined optical waveguide is coupled to the parallel optical waveguide for combining the phase-modulated beam splitting lasers to form a combined laser.
- it also includes:
- An arrayed waveguide grating is used to combine a plurality of combined beam lasers emitted by a plurality of light processing units into a multi-wavelength laser.
- the substrate material of the combined optical waveguide is the same as the material of the first substrate.
- the active optical device further includes:
- a first upper waveguide layer is located on the grating layer.
- the grating layer on one side of the beam splitting optical waveguide is coated with an anti-reflection film, and the other side of the grating layer is plated with a high reflective film.
- the split optical waveguide further includes:
- a second upper waveguide layer is located on the core layer.
- the width of the optical waveguide composed of the first buffer layer, the active layer, and the first upper waveguide layer becomes smaller as the forbidden band width of the core layer becomes larger.
- the parallel optical waveguide material is lithium niobate.
- the active optical devices are mostly III-V semiconductor materials, so the split-beam optical waveguide using the III-V semiconductor material as the base can greatly simplify the preparation process of the light-emitting array and improve the yield;
- the same III-V semiconductor material is used between the active optical device and the passive splitting optical waveguide, the optical loss due to the coupling of different materials can be greatly reduced, which is beneficial to the reduction of the power consumption of the optical transmitting array;
- the silicon-based splitting optical waveguide has less loss due to materials, the size of the silicon-based splitting waveguide is large, and the size of the multi-wavelength laser emitting array can be greatly reduced after using the InP-based splitting optical waveguide;
- the combined optical waveguide also uses a III-V semiconductor material, which can be well integrated with the latter InP-based AWG (array waveguide grating), and the loss, preparation process and size of the optical integrated emission array are improved;
- the phase-modulated parallel optical waveguide is made of lithium niobate, and the modulation bandwidth of the light-emitting array can reach several tens of gigahertz.
- FIG. 1 is a schematic structural diagram of a multi-wavelength hybrid integrated light emitting array according to an embodiment of the present invention
- FIG. 2 is a schematic diagram of an active optical device and a split optical waveguide according to an embodiment of the present invention.
- the multi-wavelength laser emitting array is mainly composed of an InP (indium phosphide)-based DFB laser, a silicon-based Y-beam splitting optical waveguide, a modulator, and a silicon-based Y-type combined optical waveguide.
- InP indium phosphide
- the loss of the silicon-based optical waveguide is small, and its refractive index can be adjusted by doping, it is an ideal material for the optical waveguide.
- the active optoelectronic devices are mostly III-V semiconductor materials, the integration between the optical devices of different materials has a certain optical loss, and the preparation process is complicated.
- the size of the silicon-based Y-type optical waveguide is large, which is a challenge for photonic integration technology.
- the present invention provides a multi-wavelength hybrid integrated light emitting array in which both the active optical device and the passive splitting optical waveguide use the same III-V semiconductor material as the substrate.
- the present invention also employs a plurality of active optical devices that can emit lasers of different wavelengths to form a hybrid integration of multi-wavelength lasers.
- the high-reflection film is a reflection film having a high reflectance, in general, the reflectance of the high-reflection film is 90% or more, and most of the incident light or almost all of the incident light can be reflected back. Therefore, the present invention is to make the grating structure. Other light energy outside of the selected mode is reflected back to convert to lasing mode energy, thereby enhancing the emitted laser energy, increasing the efficiency of the multi-wavelength hybrid integrated light emitting array.
- FIG. 1 is a schematic structural diagram of a multi-wavelength hybrid integrated light emitting array according to an embodiment of the present invention.
- an embodiment of the present invention provides a multi-wavelength hybrid integrated light emitting array, including multiple optical processing units, each of which The optical processing unit includes an active optical device 1, a split optical waveguide 2, a parallel optical waveguide 3, a traveling wave electrode 4, a combined optical waveguide 5, and an AWG 6.
- the active optical device 1 emits laser light;
- the split optical waveguide 2 receives the laser light emitted by the active optical device 1 and splits the same, obtains a split laser and transmits the split laser to the parallel optical waveguide 3;
- the waveguide 3 changes its phase in combination with the modulation voltage supplied from the traveling wave electrode 4.
- the combined optical waveguide 5 receives the split laser and combines it to form a combined laser.
- the multi-beam combined laser emitted by the plurality of cells is emitted to the AWG (array beam grating) 6, and the AWG6 combines the multi-beam combined laser to obtain a multi-wavelength laser, and the multi-beam laser is passed through an optical fiber. transmission.
- the active optical device 1 such as a DFB (Distributed Feedback Laser) active region, includes a first substrate, and the first substrate material is a III-V semiconductor.
- the material of the first substrate is the same as the material of the second substrate of the splitting optical waveguide 2, and the active optical device 1 and the split optical waveguide 2 (the Y-beam splitting optical waveguide which can select the deep-ridge optical waveguide structure) pass The active-passive-end coupling method is coupled. Because the substrate materials are the same, the optical loss caused by the coupling of different materials can be greatly reduced, which is beneficial to the reduction of power consumption of the light-emitting array. At the same time, the III-V semiconductor material is used.
- the splitting optical waveguide 2 as a substrate can greatly simplify the preparation process of the light emitting array and improve the yield. Since indium phosphide is the most common and is the most widely used in the art, the III-V semiconductor in the embodiment of the present invention selects indium phosphide, and in other embodiments, it can also be GaAs (gallium arsenide) or GaN. Other III-V compounds such as (GaN).
- the combined optical waveguide 5 also selects an InP-based Y-type optical waveguide having a deep ridge type optical waveguide structure identical to the split optical waveguide, and the deep ridge type optical waveguide structure has polarization independent and small bending
- the advantage of radius helps to reduce size and increase integration.
- the material of the parallel optical waveguide can be lithium niobate, which has a good electrooptic effect, a short response time, and a wide transparent wavelength range, and is an ideal modulation material.
- the splitting optical waveguide splits a laser beam into two laser beams
- the present invention provides a pair of parallel optical waveguides, three traveling wave electrodes placed in parallel with the parallel optical waveguides, and two parallel optical waves for each two traveling wave electrodes.
- the waveguide provides a modulation voltage, and different modulation voltages are applied to the parallel optical waveguide, which can change the refractive index of the lithium niobate, so that the phase of the original phase-convergent beam splitting laser also changes accordingly.
- a combined laser is formed, and the intensity of the combined laser is also changed accordingly. For example, if the phases of the two beam splitting lasers are 180° out of phase, the intensity of the combined laser is 0; if the phase of the two beam splitting lasers does not change, the intensity of the combined laser does not change. This achieves modulation of the combined laser intensity.
- the combined optical waveguide 5 in the present embodiment is also an InP substrate.
- the active optical device 1 includes:
- a first substrate 11, in the embodiment of the present invention, the material of the first substrate 11 is InP (may be other III-V semiconductors).
- a first buffer layer 12 is disposed on the first substrate 11.
- an InP semiconductor material is also selected.
- a grating layer 14 is disposed on the active layer 13, wherein the grating layer 14 can be fabricated by holographic interference exposure, two-beam interferometry or nanoimprinting.
- the grating layer on the side of the beam splitting optical waveguide ie, the grating layer along the optical path direction
- the grating layer on the side of the beam splitting optical waveguide is coated with an anti-reflection film in the grating layer.
- the other side is coated with a high-reflection film with a reflectivity of 90% or more, which can reflect most of the incident light or almost all of the incident light, while reflecting other light energy outside the selected mode of the grating structure.
- the energy is injected to enhance the emitted laser energy.
- a first upper waveguide layer 15 is located on the grating layer 14 and is a lattice matched InP waveguide layer.
- the beam splitting optical waveguide 2 comprises:
- the material of the second substrate 21 should be identical to the first substrate 11, and thus InP is used.
- the active optical device 1 and the split optical waveguide 2 can share the same substrate. ;
- a second buffer layer 22 is disposed on the second substrate 21, and the second buffer layer 22 may also be selected from the same material as the first buffer layer 12, or the split optical waveguide 2 may be shared with the active optical device 1.
- the same buffer layer, that is, the first buffer layer 12 and the second buffer layer 22 are the same buffer layer.
- a core layer 23 is disposed on the second buffer layer 22, and the core layer 23 is an InGaAsP core layer; the second upper waveguide layer 24 is an undoped or semi-insulating InP to reduce material absorption loss.
- a second upper waveguide layer 24 is disposed on the core layer 23.
- the first buffer layer 12, the active layer 13, and the first upper waveguide layer 15 constitute an optical waveguide, and the width of the optical waveguide conforms to the InGaAsP core layer.
- the forbidden band width is different, and the smaller the forbidden band width of the selected core layer is, the width of the optical waveguide is larger when the polarization is independent, and the lithography process tolerance is large.
- the multi-wavelength hybrid integrated light-emitting array provided by the invention can greatly simplify the preparation process of the light-emitting array, improve the yield, reduce the power consumption of the light-emitting array, and the modulation bandwidth can reach several tens of gigahertz, and can be greatly reduced.
- the size of the multi-wavelength laser emitting array has greatly improved its preparation process and size.
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Abstract
Disclosed is a multi-wavelength hybrid integrated light emitting array, comprising a plurality of light processing units, wherein each of the light processing units comprises: an active optical device (1), including a first substrate (11), with the material of the first substrate being an III-V group semiconductor material and same being used for emitting laser, and a beam splitting optical waveguide (2), including a second substrate (21), with the material of the second substrate being the same as that of the first substrate, and being used for splitting the laser to form beam split laser. The substrates of the active optical device and the beam splitting optical waveguide are the same III-V group semiconductor material, so that optical loss caused by coupling of different materials is reduced, the power consumption of the light emitting array is favorably reduced, and moreover, the preparation process and the size of the multi-wavelength hybrid integrated light emitting array are improved.
Description
本发明涉及半导体集成技术领域,尤其涉及一种多波长混合集成光发射阵列。The present invention relates to the field of semiconductor integration technologies, and in particular, to a multi-wavelength hybrid integrated light emitting array.
光子集成相较于分立的功能光器件,大大缩小了光模块的尺寸和功耗,是未来实现大容量、低功耗光网络所必须依赖的关键技术。而高速多波长混合集成光发射阵列更是高速光传输网络的核心部件。常见的多波长激光发射阵列的构成为,InP(磷化铟)基DFB(分布式反馈激光器)产生多波长的激光,激光经硅基上的Y型光波导分束后进入铌酸锂的平行光波导进行调制,而后再经硅基Y波导合束后实现强度调制。硅基光波导由于损耗较小,且其折射率可以通过掺杂进行调解,是一种理想的光波导的材料。但是由于有源光电子器件多为III-V族半导体材料,不同材料的光器件之间的集成存在一定的光损耗,且制备工艺复杂。此外,硅基Y型光波导的尺寸较大,是光子集成技术面临的一个挑战。Compared with discrete functional optical devices, photonic integration greatly reduces the size and power consumption of optical modules, and is a key technology that must be relied upon to realize high-capacity, low-power optical networks in the future. The high-speed multi-wavelength hybrid integrated light-emitting array is the core component of the high-speed optical transmission network. A common multi-wavelength laser emitting array is constructed such that an InP (indium phosphide)-based DFB (Distributed Feedback Laser) produces a multi-wavelength laser that is split into a lithium niobate via a Y-type optical waveguide on a silicon substrate. The optical waveguide is modulated and then intensity modulated by combining the silicon-based Y-waveguides. Silicon-based optical waveguides are ideal materials for optical waveguides due to their low loss and their refractive index can be adjusted by doping. However, since the active optoelectronic devices are mostly III-V semiconductor materials, the integration between the optical devices of different materials has a certain optical loss, and the preparation process is complicated. In addition, the size of the silicon-based Y-type optical waveguide is large, which is a challenge for photonic integration technology.
发明内容Summary of the invention
本发明的目的在于提供一种多波长混合集成光发射阵列,包括多个光处理单元,每个光处理单元包括:It is an object of the present invention to provide a multi-wavelength hybrid integrated light emitting array comprising a plurality of light processing units, each of the light processing units comprising:
一有源光器件,用于发射激光,包含第一衬底,所述第一衬底为III-V族半导体材料;An active optical device for emitting laser light, comprising a first substrate, the first substrate being a III-V semiconductor material;
一分束光波导,用于将所述激光分束形成分束激光,包含第二衬底,第二衬底的材料与第一衬底相同。A split beam optical waveguide for splitting the laser beam into a split beam laser, comprising a second substrate, the material of the second substrate being the same as the first substrate.
可选地,所述III-V族半导体材料包括磷化铟。Optionally, the III-V semiconductor material comprises indium phosphide.
可选地,每个光处理单元还包括:Optionally, each of the light processing units further includes:
一对平行光波导,与所述分束光波导相连,用于改变所述分束激光的相位;a pair of parallel optical waveguides connected to the split optical waveguide for changing a phase of the split laser;
三个行波电极,用于为所述平行光波导提供调制电压;Three traveling wave electrodes for providing a modulation voltage for the parallel optical waveguide;
一合束光波导,与所述平行光波导相连,用于将相位调制后的分束激光进行合束,形成合束激光。A combined optical waveguide is coupled to the parallel optical waveguide for combining the phase-modulated beam splitting lasers to form a combined laser.
可选地,还包括:Optionally, it also includes:
阵列波导光栅,用于将多个光处理单元发射的多束合束激光,复合成一束多波长激光。An arrayed waveguide grating is used to combine a plurality of combined beam lasers emitted by a plurality of light processing units into a multi-wavelength laser.
可选地,所述合束光波导的衬底材料与第一衬底的材料相同。Optionally, the substrate material of the combined optical waveguide is the same as the material of the first substrate.
可选地,所述有源光器件还包括:Optionally, the active optical device further includes:
一第一缓冲层,位于所述第一衬底上;a first buffer layer on the first substrate;
一有源层,位于所述第一缓冲层上;An active layer on the first buffer layer;
一光栅层,位于所述有源层上;a grating layer on the active layer;
一第一上波导层,位于所述光栅层上。A first upper waveguide layer is located on the grating layer.
可选地,分束光波导一侧的光栅层镀有增透膜,光栅层的另一侧镀有高反膜。Optionally, the grating layer on one side of the beam splitting optical waveguide is coated with an anti-reflection film, and the other side of the grating layer is plated with a high reflective film.
可选地,所述分束光波导还包括:Optionally, the split optical waveguide further includes:
一第二缓冲层,位于所述第二衬底上;a second buffer layer on the second substrate;
一芯层,位于所述第二缓冲层上;a core layer on the second buffer layer;
一第二上波导层,位于所述芯层上。A second upper waveguide layer is located on the core layer.
可选地,由所述第一缓冲层、有源层、第一上波导层构成的光波导的宽度,随着所述芯层的禁带宽度的变大而变小。Alternatively, the width of the optical waveguide composed of the first buffer layer, the active layer, and the first upper waveguide layer becomes smaller as the forbidden band width of the core layer becomes larger.
可选地,所述平行光波导材料为铌酸锂。Optionally, the parallel optical waveguide material is lithium niobate.
有源光器件多是III-V族半导体材料,因此采用III-V族半导体材料为基底的分束光波导可以大大简化光发射阵列的制备工艺,提高成品率;The active optical devices are mostly III-V semiconductor materials, so the split-beam optical waveguide using the III-V semiconductor material as the base can greatly simplify the preparation process of the light-emitting array and improve the yield;
由于有源光器件和无源分束光波导之间采用相同的III-V族半导体材料,所以由于不同材料耦合造成的光损耗可以大大减少,有利于光发射阵列功耗的降低;Since the same III-V semiconductor material is used between the active optical device and the passive splitting optical waveguide, the optical loss due to the coupling of different materials can be greatly reduced, which is beneficial to the reduction of the power consumption of the optical transmitting array;
硅基分束光波导虽然材料造成的损耗较小,但是硅基分束波导的尺寸很大,采用InP基分束光波导之后,可以大大缩小多波长激光发射阵列的尺寸;Although the silicon-based splitting optical waveguide has less loss due to materials, the size of the silicon-based splitting waveguide is large, and the size of the multi-wavelength laser emitting array can be greatly reduced after using the InP-based splitting optical waveguide;
合束光波导同样采用III-V族半导体材料,这样可以与后面的InP基的AWG(阵列波导光栅)很好的集成,对于光集成发射阵列的损耗,制备工艺和尺寸等都有改善;The combined optical waveguide also uses a III-V semiconductor material, which can be well integrated with the latter InP-based AWG (array waveguide grating), and the loss, preparation process and size of the optical integrated emission array are improved;
调制器中,相位调制的平行光波导的材料采用铌酸锂,光发射阵列单 路的调制带宽可以达到数十吉赫兹。In the modulator, the phase-modulated parallel optical waveguide is made of lithium niobate, and the modulation bandwidth of the light-emitting array can reach several tens of gigahertz.
图1为本发明实施例的多波长混合集成光发射阵列的结构示意图;1 is a schematic structural diagram of a multi-wavelength hybrid integrated light emitting array according to an embodiment of the present invention;
图2为本发明实施例的有源光器件和分束光波导示意图。2 is a schematic diagram of an active optical device and a split optical waveguide according to an embodiment of the present invention.
现有技术中,多波长激光发射阵列主要由InP(磷化铟)基DFB激光器、硅基Y型分束光波导、调制器和硅基Y型合束光波导组成。虽然硅基光波导的损耗较小,且其折射率可以通过掺杂进行调解,是一种理想的光波导的材料。但是由于有源光电子器件多为III-V族半导体材料,不同材料的光器件之间的集成存在一定的光损耗,且制备工艺复杂。此外,硅基Y型光波导的尺寸较大,是光子集成技术面临的一个挑战。基于前述技术问题,本发明提供了一种多波长混合集成光发射阵列,有源光器件和无源分束光波导均采用相同的III-V族半导体材料作为衬底。此外,本发明还采用了多个有源光器件,可以发射不同波长的激光,形成多波长激光的混合集成。因为高反膜是反射率较高的反射膜,一般来说,高反膜的反射率大于等于90%,能够将大部分入射光或几乎全部入射光反射回去,因此,本发明为了使光栅结构选定模式之外的其他光能反射回来转换为激射模能量,从而增强发射的激光能量,提高了该多波长混合集成光发射阵列的效率。In the prior art, the multi-wavelength laser emitting array is mainly composed of an InP (indium phosphide)-based DFB laser, a silicon-based Y-beam splitting optical waveguide, a modulator, and a silicon-based Y-type combined optical waveguide. Although the loss of the silicon-based optical waveguide is small, and its refractive index can be adjusted by doping, it is an ideal material for the optical waveguide. However, since the active optoelectronic devices are mostly III-V semiconductor materials, the integration between the optical devices of different materials has a certain optical loss, and the preparation process is complicated. In addition, the size of the silicon-based Y-type optical waveguide is large, which is a challenge for photonic integration technology. Based on the foregoing technical problems, the present invention provides a multi-wavelength hybrid integrated light emitting array in which both the active optical device and the passive splitting optical waveguide use the same III-V semiconductor material as the substrate. In addition, the present invention also employs a plurality of active optical devices that can emit lasers of different wavelengths to form a hybrid integration of multi-wavelength lasers. Since the high-reflection film is a reflection film having a high reflectance, in general, the reflectance of the high-reflection film is 90% or more, and most of the incident light or almost all of the incident light can be reflected back. Therefore, the present invention is to make the grating structure. Other light energy outside of the selected mode is reflected back to convert to lasing mode energy, thereby enhancing the emitted laser energy, increasing the efficiency of the multi-wavelength hybrid integrated light emitting array.
为使本发明的目的、技术方案和优点更加清楚明白,以下结合具体实施例,并参照附图,对本发明作进一步的详细说明。The present invention will be further described in detail below with reference to the specific embodiments of the invention,
图1为本发明实施例的多波长混合集成光发射阵列的结构示意图,如图1所示,本发明实施例提供了一种多波长混合集成光发射阵列,包括多个光处理单元,每个光处理单元包括:有源光器件1、分束光波导2、平行光波导3、行波电极4、合束光波导5和AWG6。其中,有源光器件1发射激光;分束光波导2接收有源光器件1发射的激光,并对其进行分束,得到分束激光并将分束激光传导至平行光波导3;平行光波导3接收分束激光后,结合行波电极4提供的调制电压对其进行相位的改变。合束光波 导5接收分束激光,并对其进行合束处理,形成合束激光。最后将多个单元发射的多束合束激光发射至AWG(阵列波束光栅)6,AWG6对多束合束激光进行复合,得到一束多波长激光,并将该多波束激光通过一根光纤进行传输。1 is a schematic structural diagram of a multi-wavelength hybrid integrated light emitting array according to an embodiment of the present invention. As shown in FIG. 1 , an embodiment of the present invention provides a multi-wavelength hybrid integrated light emitting array, including multiple optical processing units, each of which The optical processing unit includes an active optical device 1, a split optical waveguide 2, a parallel optical waveguide 3, a traveling wave electrode 4, a combined optical waveguide 5, and an AWG 6. Wherein, the active optical device 1 emits laser light; the split optical waveguide 2 receives the laser light emitted by the active optical device 1 and splits the same, obtains a split laser and transmits the split laser to the parallel optical waveguide 3; After receiving the beam splitting laser, the waveguide 3 changes its phase in combination with the modulation voltage supplied from the traveling wave electrode 4. The combined optical waveguide 5 receives the split laser and combines it to form a combined laser. Finally, the multi-beam combined laser emitted by the plurality of cells is emitted to the AWG (array beam grating) 6, and the AWG6 combines the multi-beam combined laser to obtain a multi-wavelength laser, and the multi-beam laser is passed through an optical fiber. transmission.
其中,有源光器件1,例如DFB(分布式反馈激光器)有源区,包含第一衬底,第一衬底材料为III-V族半导体。第一衬底的材料与分束光波导2的第二衬底的材料相同,有源光器件1和分束光波导2(可以选择深脊型光波导结构的Y型分束光波导)通过有源-无源端耦合方法进行耦合,因为二者衬底材料相同,可以大大减少由于不同材料耦合造成的光损耗,有利于光发射阵列功耗的降低,同时,采用III-V族半导体材料为基底的分束光波导2可以大大简化光发射阵列的制备工艺,提高成品率。因为磷化铟最为常见,在本领域中应用最为广泛,因此,本发明实施例中的III-V族半导体选择磷化铟,在其他实施例中,还可以为GaAs(砷化镓)、GaN(氮化镓)等其他III-V族化合物。The active optical device 1, such as a DFB (Distributed Feedback Laser) active region, includes a first substrate, and the first substrate material is a III-V semiconductor. The material of the first substrate is the same as the material of the second substrate of the splitting optical waveguide 2, and the active optical device 1 and the split optical waveguide 2 (the Y-beam splitting optical waveguide which can select the deep-ridge optical waveguide structure) pass The active-passive-end coupling method is coupled. Because the substrate materials are the same, the optical loss caused by the coupling of different materials can be greatly reduced, which is beneficial to the reduction of power consumption of the light-emitting array. At the same time, the III-V semiconductor material is used. The splitting optical waveguide 2 as a substrate can greatly simplify the preparation process of the light emitting array and improve the yield. Since indium phosphide is the most common and is the most widely used in the art, the III-V semiconductor in the embodiment of the present invention selects indium phosphide, and in other embodiments, it can also be GaAs (gallium arsenide) or GaN. Other III-V compounds such as (GaN).
根据本发明的一种实施例,合束光波导5也选择与分束光波导一样的深脊型光波导结构的InP基Y型光波导,深脊型光波导结构具有偏振无关和小的弯曲半径的优点,有利于降低尺寸,提高集成度。According to an embodiment of the present invention, the combined optical waveguide 5 also selects an InP-based Y-type optical waveguide having a deep ridge type optical waveguide structure identical to the split optical waveguide, and the deep ridge type optical waveguide structure has polarization independent and small bending The advantage of radius helps to reduce size and increase integration.
进一步地,平行光波导的材料可以采用铌酸锂,铌酸锂具有良好的电光效应、短的响应时间和较宽的透明波长范围,是理想的调制材料。因为分束光波导将一束激光分束成两束激光,因此,本发明设置一对平行光波导,三个与平行光波导平行放置的行波电极,每两个行波电极对一个平行光波导提供调制电压,且不同的调制电压加载在平行光波导上,可以使得铌酸锂的折射率发生改变,从而使得原本相位一致的分束激光的相位也相应发生变化。相位改变后的分束激光经过合束光波导后,形成合束激光,同时,合束激光的强度也会相应改变。举例来说,两束分束激光的相位相差180°,则其合束激光的强度为0;若两束分束激光的相位不发生改变,则其合束激光的强度也不会改变,以此实现合束激光强度的调制。Further, the material of the parallel optical waveguide can be lithium niobate, which has a good electrooptic effect, a short response time, and a wide transparent wavelength range, and is an ideal modulation material. Since the splitting optical waveguide splits a laser beam into two laser beams, the present invention provides a pair of parallel optical waveguides, three traveling wave electrodes placed in parallel with the parallel optical waveguides, and two parallel optical waves for each two traveling wave electrodes. The waveguide provides a modulation voltage, and different modulation voltages are applied to the parallel optical waveguide, which can change the refractive index of the lithium niobate, so that the phase of the original phase-convergent beam splitting laser also changes accordingly. After the phase-changed beam splitting laser passes through the combined optical waveguide, a combined laser is formed, and the intensity of the combined laser is also changed accordingly. For example, if the phases of the two beam splitting lasers are 180° out of phase, the intensity of the combined laser is 0; if the phase of the two beam splitting lasers does not change, the intensity of the combined laser does not change. This achieves modulation of the combined laser intensity.
进一步地,因为AWG6为InP基AWG,为了与AWG6更好地集成,减少因材料不同导致的光损耗,因此,本实施例中的合束光波导5也为InP衬底。Further, since the AWG 6 is an InP-based AWG, in order to better integrate with the AWG 6 and reduce optical loss due to material difference, the combined optical waveguide 5 in the present embodiment is also an InP substrate.
图2为本发明实施例的有源光器件和分束光波导示意图,如图2所示,有源光器件1包括:2 is a schematic diagram of an active optical device and a split optical waveguide according to an embodiment of the present invention. As shown in FIG. 2, the active optical device 1 includes:
一第一衬底11,在本发明实施例中,第一衬底11的材料为InP(也可以为其他III-V族半导体)。A first substrate 11, in the embodiment of the present invention, the material of the first substrate 11 is InP (may be other III-V semiconductors).
一第一缓冲层12,位于所述第一衬底11上,本发明实施例中,也选择InP半导体材料。A first buffer layer 12 is disposed on the first substrate 11. In the embodiment of the present invention, an InP semiconductor material is also selected.
一有源层13,位于所述第一缓冲层12上,采用晶格匹配材料的应变InGaAsP多量子阱,其中,采用不同的有源层13材料,该有源光器件发射的激光波长也不同,从而实现多波长激光混合集成的目的。An active layer 13 on the first buffer layer 12, using a strained InGaAsP multiple quantum well of a lattice matching material, wherein different active layer 13 materials are used, and the wavelength of the laser emitted by the active optical device is also different In order to achieve the purpose of multi-wavelength laser hybrid integration.
一光栅层14,位于所述有源层13上,其中,光栅层14可以通过全息干涉曝光法、双光束干涉法或纳米压印法制作出。另外,因为在有源光器件中,存在激光振荡情况,因此,本发明实施例在分束光波导一侧的光栅层(即沿着光路方向的光栅层)镀有增透膜,在光栅层的另一侧镀有高反膜,其反射率大于等于90%,能将大部分入射光或几乎全部入射光反射回去,同时使光栅结构选定模式之外的其他光能反射回来转换为激射模能量,从而增强发射的激光能量。A grating layer 14 is disposed on the active layer 13, wherein the grating layer 14 can be fabricated by holographic interference exposure, two-beam interferometry or nanoimprinting. In addition, since there is a laser oscillation in the active optical device, the grating layer on the side of the beam splitting optical waveguide (ie, the grating layer along the optical path direction) is coated with an anti-reflection film in the grating layer. The other side is coated with a high-reflection film with a reflectivity of 90% or more, which can reflect most of the incident light or almost all of the incident light, while reflecting other light energy outside the selected mode of the grating structure. The energy is injected to enhance the emitted laser energy.
一第一上波导层15,位于所述光栅层14上,为晶格匹配InP波导层。A first upper waveguide layer 15 is located on the grating layer 14 and is a lattice matched InP waveguide layer.
根据本发明的一种实施例,分束光波导2包括:According to an embodiment of the invention, the beam splitting optical waveguide 2 comprises:
一第二衬底21,该第二衬底21的材料应与第一衬底11一致,因此采用InP,在其他实施例中,有源光器件1和分束光波导2可以共用同一衬底;a second substrate 21, the material of the second substrate 21 should be identical to the first substrate 11, and thus InP is used. In other embodiments, the active optical device 1 and the split optical waveguide 2 can share the same substrate. ;
一第二缓冲层22,位于所述第二衬底21上,第二缓冲层22也可以选择和第一缓冲层12相同的材料,或者该分束光波导2可以与有源光器件1共用同一缓冲层,即第一缓冲层12和第二缓冲层22为同一缓冲层。A second buffer layer 22 is disposed on the second substrate 21, and the second buffer layer 22 may also be selected from the same material as the first buffer layer 12, or the split optical waveguide 2 may be shared with the active optical device 1. The same buffer layer, that is, the first buffer layer 12 and the second buffer layer 22 are the same buffer layer.
一芯层23,位于所述第二缓冲层22上,芯层23为InGaAsP芯层;第二上波导层24为非掺杂或半绝缘InP,以减少材料吸收损耗。A core layer 23 is disposed on the second buffer layer 22, and the core layer 23 is an InGaAsP core layer; the second upper waveguide layer 24 is an undoped or semi-insulating InP to reduce material absorption loss.
一第二上波导层24,位于所述芯层23上,第一缓冲层12、有源层13、第一上波导层15构成一个光波导,且该光波导的宽度随着InGaAsP芯层的禁带宽度的不同而不同,选择的芯层的禁带宽度越小,在满足偏振无关时,该光波导的宽度较大,光刻工艺容差较大。a second upper waveguide layer 24 is disposed on the core layer 23. The first buffer layer 12, the active layer 13, and the first upper waveguide layer 15 constitute an optical waveguide, and the width of the optical waveguide conforms to the InGaAsP core layer. The forbidden band width is different, and the smaller the forbidden band width of the selected core layer is, the width of the optical waveguide is larger when the polarization is independent, and the lithography process tolerance is large.
综上,通过本发明提供的多波长混合集成光发射阵列,可以大大简化光发射阵列的制备工艺,提高成品率,降低光发射阵列功耗,调制带宽可以达到数十吉赫兹,同时可以大大缩小多波长激光发射阵列的尺寸,对其制备工艺和尺寸等都有较大的改善。In summary, the multi-wavelength hybrid integrated light-emitting array provided by the invention can greatly simplify the preparation process of the light-emitting array, improve the yield, reduce the power consumption of the light-emitting array, and the modulation bandwidth can reach several tens of gigahertz, and can be greatly reduced. The size of the multi-wavelength laser emitting array has greatly improved its preparation process and size.
以上所述的具体实施例,对本发明的目的、技术方案和有益效果进行了进一步详细说明,所应理解的是,以上所述仅为本发明的具体实施例而已,并不用于限制本发明,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The specific embodiments of the present invention have been described in detail, and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.
Claims (10)
- 一种多波长混合集成光发射阵列,其特征在于,包括多个光处理单元,每个光处理单元包括:A multi-wavelength hybrid integrated light emitting array, comprising: a plurality of light processing units, each light processing unit comprising:一有源光器件,用于发射激光,包含第一衬底,所述第一衬底为III-V族半导体材料;An active optical device for emitting laser light, comprising a first substrate, the first substrate being a III-V semiconductor material;一分束光波导,用于将所述激光分束形成分束激光,包含第二衬底,第二衬底的材料与第一衬底相同。A split beam optical waveguide for splitting the laser beam into a split beam laser, comprising a second substrate, the material of the second substrate being the same as the first substrate.
- 根据权利要求1所述的多波长混合集成光发射阵列,其特征在于,所述III-V族半导体材料包括磷化铟。The multi-wavelength hybrid integrated light emitting array of claim 1 wherein said III-V semiconductor material comprises indium phosphide.
- 根据权利要求1所述的多波长混合集成光发射阵列,其特征在于,每个光处理单元还包括:The multi-wavelength hybrid integrated light emitting array of claim 1 , wherein each of the light processing units further comprises:一对平行光波导,与所述分束光波导相连,用于改变所述分束激光的相位;a pair of parallel optical waveguides connected to the split optical waveguide for changing a phase of the split laser;三个行波电极,用于为所述平行光波导提供调制电压;Three traveling wave electrodes for providing a modulation voltage for the parallel optical waveguide;一合束光波导,与所述平行光波导相连,用于将相位调制后的分束激光进行合束,形成合束激光。A combined optical waveguide is coupled to the parallel optical waveguide for combining the phase-modulated beam splitting lasers to form a combined laser.
- 根据权利要求3所述的多波长混合集成光发射阵列,其特征在于,还包括:The multi-wavelength hybrid integrated light emitting array of claim 3, further comprising:阵列波导光栅,用于将多个光处理单元发射的多束合束激光,复合成一束多波长激光。An arrayed waveguide grating is used to combine a plurality of combined beam lasers emitted by a plurality of light processing units into a multi-wavelength laser.
- 根据权利要求3所述的多波长混合集成光发射阵列,其特征在于,所述合束光波导的衬底材料与第一衬底的材料相同。The multi-wavelength hybrid integrated light emitting array according to claim 3, wherein the substrate material of the combined optical waveguide is the same as the material of the first substrate.
- 根据权利要求1所述的多波长混合集成光发射阵列,其特征在于,所述有源光器件还包括:The multi-wavelength hybrid integrated light emitting array of claim 1 , wherein the active optical device further comprises:一第一缓冲层,位于所述第一衬底上;a first buffer layer on the first substrate;一有源层,位于所述第一缓冲层上;An active layer on the first buffer layer;一光栅层,位于所述有源层上;a grating layer on the active layer;一第一上波导层,位于所述光栅层上。A first upper waveguide layer is located on the grating layer.
- 根据权利要求6所述的多波长混合集成光发射阵列,其特征在于, 分束光波导一侧的光栅层镀有增透膜,光栅层的另一侧镀有高反膜。The multi-wavelength hybrid integrated light emitting array according to claim 6, wherein the grating layer on one side of the beam splitting optical waveguide is plated with an anti-reflection film, and the other side of the grating layer is plated with a high reflective film.
- 根据权利要求1或7所述的多波长混合集成光发射阵列,其特征在于,所述分束光波导还包括:The multi-wavelength hybrid integrated light emitting array according to claim 1 or 7, wherein the beam splitting optical waveguide further comprises:一第二缓冲层,位于所述第二衬底上;a second buffer layer on the second substrate;一芯层,位于所述第二缓冲层上;a core layer on the second buffer layer;一第二上波导层,位于所述芯层上。A second upper waveguide layer is located on the core layer.
- 根据权利要求8所述的多波长混合集成光发射阵列,其特征在于,由所述第一缓冲层、有源层、第一上波导层构成的光波导的宽度,随着所述芯层的禁带宽度的变大而变小。The multi-wavelength hybrid integrated light emitting array according to claim 8, wherein a width of the optical waveguide composed of the first buffer layer, the active layer, and the first upper waveguide layer is along with the core layer The forbidden band width becomes larger and smaller.
- 根据权利要求3所述的多波长混合集成光发射阵列,其特征在于,所述平行光波导材料为铌酸锂。The multi-wavelength hybrid integrated light emitting array of claim 3 wherein said parallel optical waveguide material is lithium niobate.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080031626A1 (en) * | 2001-10-09 | 2008-02-07 | Infinera Corporation | Photonic Integrated Circuit (PIC) Chips |
CN101485055A (en) * | 2006-06-30 | 2009-07-15 | 英特尔公司 | Transmitter-receiver with integrated modulator array and hybrid bonded multi-wavelength laser array |
CN104009370A (en) * | 2013-02-27 | 2014-08-27 | 精工爱普生株式会社 | Short light pulse generation device, terahertz wave generation device, camera, imaging device |
CN105977787A (en) * | 2015-03-11 | 2016-09-28 | 三菱电机株式会社 | Method for manufacturing optical semiconductor device |
CN106537201A (en) * | 2014-10-06 | 2017-03-22 | 古河电气工业株式会社 | Semiconductor optical integrated element and manufacturing method therefor |
CN107026391A (en) * | 2017-04-27 | 2017-08-08 | 中国科学院半导体研究所 | Multi-wavelength hybrid integrated light emission array |
Family Cites Families (4)
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