WO2018181768A1 - Adhesive sheet - Google Patents

Adhesive sheet Download PDF

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Publication number
WO2018181768A1
WO2018181768A1 PCT/JP2018/013355 JP2018013355W WO2018181768A1 WO 2018181768 A1 WO2018181768 A1 WO 2018181768A1 JP 2018013355 W JP2018013355 W JP 2018013355W WO 2018181768 A1 WO2018181768 A1 WO 2018181768A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
resin
coating film
adhesive layer
Prior art date
Application number
PCT/JP2018/013355
Other languages
French (fr)
Japanese (ja)
Inventor
高志 阿久津
揮一郎 加藤
晃司 土渕
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to CN201880022513.9A priority Critical patent/CN110506089B/en
Priority to KR1020197027701A priority patent/KR102573604B1/en
Priority to JP2019510155A priority patent/JP6764525B2/en
Publication of WO2018181768A1 publication Critical patent/WO2018181768A1/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive sheet.
  • the pressure-sensitive adhesive sheet may be used not only for semi-permanent fixing of members but also for temporary fixing for temporarily fixing building materials, interior materials, electronic parts and the like. Such a pressure-sensitive adhesive sheet for temporarily fixing is required to satisfy both adhesiveness at the time of use and peelability after use.
  • a heat-peelable pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer containing thermally expandable particles is provided on a base material is known as a pressure-sensitive adhesive sheet for temporary fixing that satisfies the above-described requirements.
  • the heat-peelable pressure-sensitive adhesive sheet has a feature that the adhesive force is reduced by foaming or expanding the thermally expandable particles by heating, and can be easily peeled off from the adherend. For this reason, it is used as a temporary fixing means, a recycling label, etc. during the manufacturing process of the electronic component.
  • Patent Document 1 discloses a heat-peelable pressure-sensitive adhesive sheet in which a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres is provided on at least one side of a substrate, and the thickness of the heat-expandable pressure-sensitive adhesive layer The center line average roughness of the surface of the thermally expandable adhesive layer before heating is set to 0.4 ⁇ m or less by adjusting the maximum particle size of the thermally expandable microspheres added to the adhesive layer.
  • a heat-peelable pressure-sensitive adhesive sheet for temporary fixing at the time of cutting an electronic component is disclosed.
  • the heat-peelable pressure-sensitive adhesive sheet described in Patent Document 1 can secure an effective contact area with the pressure-sensitive adhesive sheet by suppressing the surface roughness of the heat-expandable pressure-sensitive adhesive layer, and prevents the occurrence of adhesive defects such as chip jumping. There is a statement that it can be done.
  • the conventional heat-peelable pressure-sensitive adhesive sheet expands the pressure-sensitive adhesive layer containing the thermally expandable particles by foaming or expanding the thermally expandable particles by heating. Due to the expansion of the pressure-sensitive adhesive layer, the surface of the pressure-sensitive adhesive layer in contact with the adherend is deformed into an uneven shape, and the adhesion area between the pressure-sensitive adhesive layer and the adherend is reduced. As a result, the adhesive force by the pressure-sensitive adhesive layer is reduced, and the pressure-sensitive adhesive sheet can be easily peeled off from the adherend.
  • the heat-expandable particles are foamed or expanded by heating, destruction inside the pressure-sensitive adhesive layer containing the heat-expandable particles, that is, cohesive failure of the pressure-sensitive adhesive layer is likely to occur.
  • the heat-peelable pressure-sensitive adhesive sheet described in Patent Document 1 suppresses the surface roughness of the heat-expandable pressure-sensitive adhesive layer from the viewpoint of improving adhesiveness at the time of temporary fixing. It is designed to reduce the particle size of the thermally expandable microspheres to be added. However, if the particle size of the heat-expandable microspheres is too small, the surface roughness becomes small, resulting in poor interfacial adhesion and concern about adhesive residue on the adherend surface after heat peeling.
  • the present invention has been made in view of the above problems, and has little adhesive residue on the adherend surface after heat peeling, and has good interface adhesion between the substrate and the pressure-sensitive adhesive layer. It aims at providing the adhesive sheet which is excellent in the adhesiveness at the time of temporary fixing, and heat peelability.
  • the present inventors have found that the above problem can be solved by including a thermally expandable particle in a base material and forming a laminate including the base material and the pressure-sensitive adhesive layer by a specific method.
  • the present invention has been completed.
  • a pressure-sensitive adhesive sheet having a laminate in which a pressure-sensitive adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly laminated in this order,
  • the laminate is A coating film (x1 ′) comprising a composition (x1) containing an adhesive resin, which is a forming material of the pressure-sensitive adhesive layer (X1);
  • a coating film (y ′) comprising a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y), Are laminated
  • the laminate further includes an adhesive layer (X2), and the adhesive layer (X1), the thermally expandable substrate (Y), and the adhesive layer (X2) are directly laminated in this order.
  • the laminate is A coating film (x1 ′) comprising a composition (x1) containing an adhesive resin, which is a forming material of the pressure-sensitive adhesive layer (X1);
  • a coating film (y ′) comprising a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y),
  • a coating film (x2 ′) comprising a composition (x2) containing an adhesive resin, which is a material for forming the adhesive layer (X2);
  • the coated sheets (x1 ′), (y ′) and (x2 ′) are simultaneously dried to form the pressure-sensitive adhesive sheet according to [6] above.
  • the pressure-sensitive adhesive sheet according to any one of [1] to [7], wherein the thermally expandable particles have an average particle diameter before expansion at 23 ° C. of 3 to 100 ⁇ m.
  • the pressure-sensitive adhesive sheet of the present invention has little adhesive residue on the adherend surface after heat peeling, has good interface adhesion between the base material and the pressure-sensitive adhesive layer, and is excellent in adhesion and heat peelability during temporary fixing. .
  • the “active ingredient” refers to a component excluding a diluent solvent among components contained in a target composition.
  • the mass average molecular weight (Mw) is a value in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically a value measured based on the method described in the examples.
  • (meth) acrylic acid indicates both “acrylic acid” and “methacrylic acid”, and the same applies to other similar terms.
  • the lower limit value and upper limit value which were described in steps can be combined independently, respectively. For example, from the description “preferably 10 to 90, more preferably 30 to 60”, “preferable lower limit (10)” and “more preferable upper limit (60)” are combined to obtain “10 to 60”. You can also.
  • the pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a laminate in which a pressure-sensitive adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly laminated in this order.
  • the laminate is a material for forming the pressure-sensitive adhesive layer (X1), and is a coating film (x1 ′) made of a composition (x1) containing a pressure-sensitive resin and a thermally expandable substrate (Y).
  • the coating film (y ′) made of the composition (y) containing the resin and the heat-expandable particles, in this order, the coating film (x1 ′) and the coating film (y ′) It was formed by drying at the same time.
  • the aforementioned “direct lamination” refers to a configuration in which a layer and a layer are in direct contact with each other without any other layer between the two layers. That is, in the present invention, the pressure-sensitive adhesive layer (X1) and the thermally expandable base material (Y) are in direct contact with no other layer interposed therebetween.
  • the heat-expandable particles in the heat-expandable substrate (Y) are expanded by heating, and irregularities are formed on the surface of the heat-expandable substrate (Y).
  • the pressure-sensitive adhesive layer (X1) laminated on the irregularities is also pushed up, and irregularities are also formed on the surface of the pressure-sensitive adhesive layer (X1).
  • the contact area between the adherend and the surface of the pressure-sensitive adhesive layer (X1) is reduced, and the adherend and pressure-sensitive adhesive layer (X1).
  • the pressure-sensitive adhesive sheet can be easily peeled off with a slight force from the adherend adhered to the surface of the pressure-sensitive adhesive layer (X1).
  • the heat-expandable particles are not included in the pressure-sensitive adhesive layer (X1) but in the heat-expandable base material (Y), thereby suppressing cohesive failure of the pressure-sensitive adhesive layer (X1) due to heating. can do. Thereby, the adhesive residue on the adherend surface after heat peeling can be reduced.
  • the interface adhesiveness of an adhesive layer (X1) and a thermally expansible base material (Y) is made high. Can do. Thereby, even if the thermally expansible particle
  • FIG.1 and FIG.2 is a cross-sectional schematic diagram which shows an example of a structure of the adhesive sheet of this invention.
  • a pressure-sensitive adhesive layer (X1) 12 and a thermally expandable substrate (Y) 11 are directly laminated in this order.
  • the adhesive sheet 1a which has the laminated body 10 currently used is mentioned.
  • FIG. 2A As a specific configuration of the pressure-sensitive adhesive sheet of another aspect of the present invention, as shown in FIG. 2A, a pressure-sensitive adhesive layer (X1) 121, a thermally expandable substrate (Y) 11, and a pressure-sensitive adhesive layer
  • the double-sided pressure-sensitive adhesive sheet 2a having the laminate 10 in which (X2) 122 is directly laminated in this order is exemplified.
  • a release material 131 is further provided on the surface of the pressure-sensitive adhesive layer (X1) 121, and further peeled on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer (X2) 122. It is good also as a structure which has the material 132.
  • FIG. 2A a pressure-sensitive adhesive layer (X1) 121, a thermally expandable substrate (Y) 11, and a pressure-sensitive adhesive layer
  • the double-sided pressure-sensitive adhesive sheet 2a having the laminate 10 in which (X2) 122 is directly laminated in this order is exemplified.
  • a release material 131 is
  • the peeling force when peeling the release material 131 from the pressure-sensitive adhesive layer (X1) 121 and the peeling time when peeling the peeling material 132 from the pressure-sensitive adhesive layer (X2) 122 are removed.
  • the force is approximately the same, when the two release materials are pulled outward to be peeled off, a phenomenon may occur in which the pressure-sensitive adhesive layer is divided and peeled off along with the two release materials. From the viewpoint of suppressing such a phenomenon, it is preferable to use two types of release materials designed so that the two release materials 131 and 132 have different release forces from the adhesive layer attached to each other.
  • one surface of the pressure-sensitive adhesive layer (X1) 121 and the pressure-sensitive adhesive layer (X2) 122 is peeled off on both surfaces.
  • a double-sided pressure-sensitive adhesive sheet having a configuration in which materials are laminated in a roll shape may be used.
  • the laminate of the pressure-sensitive adhesive sheet of the present invention is a laminate in which the pressure-sensitive adhesive layer (X1) and the non-adhesive thermally expandable substrate (Y) are directly laminated in this order, and the pressure-sensitive adhesive layer (X1 ), A coating film (x1 ′) made of a composition (x1) containing an adhesive resin, and a composition containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y).
  • the coating film (y ′) made of the product (y) is directly laminated in this order, and then the coating film (x1 ′) and the coating film (y ′) are dried at the same time.
  • the coating film (x1 ′) and the coating film (y ′) are dried “simultaneously” to form a laminate, the coating film (x1 ′) and the coating film (y ′) are “separated”. Compared with the method of drying and forming a laminated body, the interface adhesiveness of an adhesive layer (X1) and a thermally expansible base material (Y) can be improved.
  • a mixed layer of the coating film is formed in the vicinity of the interface, and the molecular chains of the resins contained in each composition are intertwined, so that the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate ( It is considered that the interfacial adhesion with Y) is improved.
  • a composition (x1) containing an adhesive resin is applied onto a release-treated surface of a release material such as a release film to form a coating film (x1 ′), and the coating film (x1 ′) is dried to form an adhesive layer.
  • (X1) is formed.
  • a coating (y ′) is formed by applying a composition (y) containing a resin and thermally expandable particles on a release-treated surface of a release material such as a release film prepared separately. ') Is dried to form a thermally expandable substrate (Y). Then, the surface which is not in contact with the release material of the pressure-sensitive adhesive layer (X1) and the surface which is not in contact with the release material of the thermally expandable base material (Y) are bonded together to form a laminate.
  • the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) are formed separately, the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) is low.
  • the laminate of the pressure-sensitive adhesive sheet of one embodiment of the present invention is preferably a composition (x1) that is a material for forming the pressure-sensitive adhesive layer (X1) and a material that is a material for forming the thermally expandable substrate (Y).
  • (Y) is applied at the same time, and the coating film (x1 ′) and the coating film (y ′) are directly laminated in this order, and then the coating film (x1 ′) and the coating film (y ′) are simultaneously dried. Is formed.
  • the composition (x1) and the composition (y) it becomes difficult to form a dry film of the thin film on the surface of the coating film as compared with the case of sequentially applying each composition. Interfacial adhesion between X1) and the thermally expandable substrate (Y) can be further increased.
  • the laminate of the pressure-sensitive adhesive sheet of one embodiment of the present invention further includes a pressure-sensitive adhesive layer (X2), and the pressure-sensitive adhesive layer (X1), the thermally expandable substrate (Y), and the pressure-sensitive adhesive layer (X2) are in this order. It is good also as a structure laminated
  • an adhesive layer (X2) is a layer formed from the composition (x2) containing adhesive resin.
  • Examples of a method for forming a laminate further including the above-mentioned pressure-sensitive adhesive layer (X2) include, for example, a method in which the composition (x2) is heated and melted and extrusion-laminated on the expandable substrate (Y), or a composition ( There is a method in which x2) is applied on the expandable substrate (Y) to form a coating film (x2 ′), and the coating film (x2 ′) is dried to form. Further, for example, the pressure-sensitive adhesive layer (X2) prepared in advance by a method such as extrusion molding or drying the coating film (x2 ′) may be directly pasted on the expandable substrate (Y).
  • the laminate further comprising the pressure-sensitive adhesive layer (X2) is preferably a coating film (x1 ′) made of a composition (x1) containing a pressure-sensitive resin, which is a material for forming the pressure-sensitive adhesive layer (X1).
  • a coating material (y ′) composed of a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable base material (Y), and an adhesive material which is a forming material of the adhesive layer (X2)
  • the coating film (x2 ′) composed of the composition (x2) containing the conductive resin is directly laminated in this order, and then the coating films (x1 ′), (y ′) and (x2 ′) are simultaneously dried. It is a thing.
  • the laminate further including the pressure-sensitive adhesive layer (X2) is more preferably a composition (x1) which is a material for forming the pressure-sensitive adhesive layer (X1) and a material for forming the heat-expandable base material (Y).
  • the composition (y) and the composition (x2), which is a material for forming the pressure-sensitive adhesive layer (X2), are applied simultaneously, and the coating films (x1 ′), (y ′), and (x2 ′) are applied in this order. After the direct lamination, the coating films (x1 ′), (y ′) and (x2 ′) are dried at the same time.
  • the interfacial adhesion between the thermally expandable base material (Y) and the pressure-sensitive adhesive layer (X2) can be further improved for the reason described above. it can.
  • the laminated body which an adhesive sheet has is specified by the manufacturing method as mentioned above, the situation which must specify by such a manufacturing method exists.
  • the interface between the pressure-sensitive adhesive layer (X1) and the heat-expandable substrate (Y) as an evaluation based on objective physical property values, for example, the pressure-sensitive adhesive layer (X1) and heat in a cross section cut in the thickness direction of the laminate
  • a method for measuring the roughness of the interface by observing the interface with the expandable substrate (Y) using an electron microscope or the like can be considered.
  • the roughness of the interface is very small, it cannot be measured accurately, and the difference in the roughness state depending on the region to be observed is very large.
  • the adhesive layer (X1) and the thermally expandable material can be obtained using an electron microscope or the like. Even if it is attempted to observe the interface with the substrate (Y), the interface may become unclear, and the roughness measurement itself may be difficult in the first place. Furthermore, when the laminate is cut in the thickness direction in order to obtain a cross section of the laminate, the laminate is formed of a resin, and thus the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate There is also a situation that the shape of the interface with (Y) collapses and the state of the interface cannot be accurately evaluated.
  • the laminate that the pressure-sensitive adhesive sheet has is specified by the manufacturing method as described above.
  • a laminated body is the structure by which the adhesive layer (X1), the thermally expansible base material (Y), and the adhesive layer (X2) are directly laminated
  • the “coating film” is a film formed from a composition as a forming material by a known coating method, and the residual ratio of volatile components such as a solvent contained in the film is This refers to those in a state of 10 to 100% by mass with respect to 100% by mass of the total amount of volatile components contained in the composition before coating. That is, in the present invention, the coating films (x1 ′), (y ′), and (x2 ′) contain a certain amount of a volatile component such as a solvent. By drying these coating films, the volatile components are removed, and the pressure-sensitive adhesive layer (X1), the thermally expandable substrate (Y), and the pressure-sensitive adhesive layer (X2) are formed.
  • the thickness of the laminate of the pressure-sensitive adhesive sheet of the present invention is preferably 10 to 150 ⁇ m, more preferably 15 to 125 ⁇ m, still more preferably 20 to 100 ⁇ m, and still more preferably 25 to 75 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer (X1) of the pressure-sensitive adhesive sheet of the present invention is based on the viewpoint of developing an excellent pressure-sensitive adhesive force, and the expansion of the heat-expandable particles in the heat-expandable substrate (Y) by heat treatment. From the viewpoint of easily forming irregularities on the surface of the pressure-sensitive adhesive layer (X1), the thickness is preferably 1 to 60 ⁇ m, more preferably 2 to 50 ⁇ m, still more preferably 3 to 40 ⁇ m, and still more preferably 5 to 30 ⁇ m.
  • the thickness of the heat-expandable base material (Y) of the pressure-sensitive adhesive sheet of the present invention is preferably 5 to 140 ⁇ m, more preferably 9 to 110 ⁇ m, still more preferably 13 to 80 ⁇ m, and still more preferably 17 to 50 ⁇ m.
  • the laminated body which the adhesive sheet of 1 aspect of this invention further contains an adhesive layer (X2)
  • the viewpoint which expresses the outstanding adhesive force, and the thermal expansion in the thermally expansible base material (Y) by heat processing From the viewpoint of easily forming irregularities on the surface of the pressure-sensitive adhesive layer (X2) due to the expansion of the adhesive particles, it is preferably 1 to 60 ⁇ m, more preferably 2 to 50 ⁇ m, still more preferably 3 to 40 ⁇ m, still more preferably 5 to 30 ⁇ m.
  • the thickness of the laminate is a value measured using a constant pressure thickness measuring instrument based on JIS K6783, Z1702, and Z1709, and specifically measured based on the method described in the examples. Means the value.
  • the thickness of each layer constituting the laminate may be measured by the same method as the thickness of the laminate described above. For example, a cross section of the laminate cut in the thickness direction is observed with a scanning electron microscope. Then, the ratio of the thickness of each layer may be measured and calculated from the thickness of the laminate measured by the method described above.
  • the ratio of the thickness of the heat-expandable base material (Y) and the thickness of the pressure-sensitive adhesive layer (X1) at 23 ° C. is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1.0 or more, and still more preferably 3.0 or more, from the viewpoint of preventing positional displacement of the object.
  • it is preferably 20 or less, more preferably 15 or less, still more preferably 10 or less, and even more preferably 5 or less. .
  • the ratio of the thickness of a thermally expansible base material (Y) and the thickness of an adhesive layer (X2) in 23 degreeC is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1.0 or more, and still more. Preferably, it is 3.0 or more, preferably 20 or less, more preferably 15 or less, still more preferably 10 or less, and still more preferably 5 or less.
  • the laminate of the pressure-sensitive adhesive sheet of the present invention has a mixed layer between the two coating films in the drying process of the coating film, and the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) And the interface between the thermally expandable base material (Y) and the pressure-sensitive adhesive layer (X2) may become so unclear that they disappear.
  • a mixed layer is formed between the two coating films and between the formed layers, for example, as described above, the cross section of the laminate cut in the thickness direction is observed with a scanning electron microscope to determine the thickness of each layer.
  • the intermediate point in the thickness direction of the mixed layer may be measured on the assumption that an interface exists on a plane parallel to the surface of the pressure-sensitive adhesive layer (X1) opposite to the thermally expandable substrate (Y). .
  • the heat-expandable substrate (Y) of the pressure-sensitive adhesive sheet of the present invention is a layer formed by drying a coating film (y ′) made of a composition (y) containing a resin and heat-expandable particles, It is an adhesive substrate.
  • a coating film (y ′) made of a composition (y) containing a resin and heat-expandable particles, It is an adhesive substrate.
  • whether or not the non-adhesive substrate is determined if the probe tack value measured in accordance with JIS Z0237: 1991 is less than 50 mN / 5 mm ⁇ with respect to the surface of the target substrate.
  • the said base material is judged as a "non-adhesive base material".
  • the probe tack value on the surface of the thermally expandable substrate (Y) is usually less than 50 mN / 5 mm ⁇ , preferably less than 30 mN / 5 mm ⁇ , more preferably less than 10 mN / 5 mm ⁇ , and even more preferably 5 mN / 5 mm ⁇ . Is less than.
  • the specific measuring method of the probe tack value in the surface of a thermally expansible base material (Y) is based on the method as described in an Example.
  • the heat-expandable substrate (Y) that the pressure-sensitive adhesive sheet of the present invention has is preferably a non-adhesive substrate that satisfies the following requirement (1).
  • the storage elastic modulus E ′ (t) of the thermally expandable substrate (Y) at the expansion start temperature (t) of the thermally expandable particles is 1.0 ⁇ 10 7 Pa or less.
  • the storage elastic modulus E ′ of the thermally expandable substrate (Y) at a predetermined temperature means a value measured by the method described in the examples.
  • the heat-expandable particles in the heat-expandable substrate (Y) are heated to a temperature equal to or higher than the expansion start temperature (t) of the heat-expandable particles. Expands and irregularities are formed on the surface of the heat-expandable substrate (Y), and the pressure-sensitive adhesive layer (X1) laminated on the irregularities is also pushed up to form irregularities on the adhesive surface. And by forming unevenness on the adhesive surface of the pressure-sensitive adhesive layer (X1), the contact area between the adherend and the adhesive surface is reduced, and a space is created between the adherend and the adhesive surface.
  • the pressure-sensitive adhesive sheet can be easily peeled off from the adherend with a slight force.
  • the storage elastic modulus E ′ (t) of the thermally expandable substrate at the expansion start temperature (t) of the thermally expandable particles is defined. It can also be said that the index indicates the rigidity of the thermally expandable substrate immediately before expansion. That is, according to the study by the present inventors, the storage elastic modulus E ′ (t) of the thermally expandable substrate (Y) at the expansion start temperature (t) of the thermally expandable particles is 1.0 ⁇ 10 7 Pa. With the following, when heating to a temperature equal to or higher than the expansion start temperature (t) and trying to expand the thermally expandable particles, the expansion is not suppressed and the surface of the thermally expandable substrate (Y) is not suppressed. The unevenness
  • stacked can fully be formed.
  • the storage elastic modulus E ′ (t) defined by the requirement (1) of the thermally expandable substrate (Y) used in one embodiment of the present invention is preferably 9.0 ⁇ 10 6 Pa or less, more preferably. Is 8.0 ⁇ 10 6 Pa or less, more preferably 6.0 ⁇ 10 6 Pa or less, and still more preferably 4.0 ⁇ 10 6 Pa or less. Further, from the viewpoint of suppressing the flow of the expanded thermally expandable particles, improving the shape maintaining property of the unevenness formed on the adhesive surface of the pressure-sensitive adhesive layer (X1), and further improving the peelability, the thermally expandable group.
  • the storage elastic modulus E ′ (t) defined by the requirement (1) of the material (Y) is preferably 1.0 ⁇ 10 3 Pa or more, more preferably 1.0 ⁇ 10 4 Pa or more, and still more preferably 1. 0 ⁇ 10 5 Pa or more.
  • the storage elastic modulus E ′ (23) of the thermally expandable substrate (Y) at 23 ° C. is 1.0 ⁇ 10 6 Pa or more.
  • the heat-expandable base material (Y) that satisfies the above requirement (2), it is possible to prevent positional deviation when attaching an object such as a semiconductor chip. Moreover, when a target object is stuck, excessive sinking into the pressure-sensitive adhesive layer can also be prevented.
  • the storage elastic modulus E ′ (23) of the thermally expandable substrate (Y) defined by the requirement (2) is preferably 5.0 ⁇ 10 6 to 5.0 ⁇ 10 12 Pa, more preferably Is 1.0 ⁇ 10 7 to 1.0 ⁇ 10 12 Pa, more preferably 5.0 ⁇ 10 7 to 1.0 ⁇ 10 11 Pa, and still more preferably 1.0 ⁇ 10 8 to 1.0 ⁇ 10 10. 10 Pa.
  • the composition (y), which is a material for forming the thermally expandable substrate (Y), contains a resin and thermally expandable particles.
  • it contains the additive for the substrate contained in the substrate which the diluting solvent and / or the general adhesive sheet has as needed. Also good.
  • Thermally expandable particles As the heat-expandable particles used in the present invention, known heat-expandable particles can be used, and are appropriately selected according to the use of the pressure-sensitive adhesive sheet.
  • the thermally expandable particle is a microencapsulated foaming agent composed of an outer shell made of a thermoplastic resin and an encapsulated component encapsulated in the outer shell and vaporized when heated to a predetermined temperature. It is preferable.
  • thermoplastic resin constituting the outer shell of the microencapsulated foaming agent examples include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.
  • Examples of the inclusion component contained in the outer shell include propane, butane, pentane, hexane, heptane, octane, nonane, decane, isobutane, isopentane, isohexane, isoheptane, isooctane, isononane, isodecane, cyclopropane, cyclobutane, cyclopentane.
  • the average particle diameter of the thermally expandable particles before expansion at 23 ° C. used in one embodiment of the present invention is preferably 3 to 100 ⁇ m, more preferably 4 to 70 ⁇ m, still more preferably 6 to 60 ⁇ m, still more preferably 10 to 50 ⁇ m.
  • the average particle diameter before expansion of the thermally expandable particles is the volume-median particle diameter (D 50 ), and is a laser diffraction particle size distribution measuring device (for example, product name “Mastersizer 3000” manufactured by Malvern).
  • the cumulative volume frequency calculated from the smaller particle diameter of the heat-expandable particles before expansion means a particle diameter corresponding to 50%.
  • the 90% particle diameter (D 90 ) before expansion at 23 ° C. of the thermally expandable particles used in one embodiment of the present invention is preferably 10 to 150 ⁇ m, more preferably 20 to 100 ⁇ m, still more preferably 25 to 90 ⁇ m, More preferably, it is 30 to 80 ⁇ m.
  • the 90% particle diameter (D 90 ) before expansion of the thermally expandable particles is the expansion measured by using a laser diffraction particle size distribution measuring apparatus (for example, product name “Mastersizer 3000” manufactured by Malvern). In the particle distribution of the previous thermally expandable particles, it means a particle diameter corresponding to 90% of the cumulative volume frequency calculated from the smaller particle diameter of the thermally expandable particles before expansion.
  • the thermally expandable particles used in the present invention are preferably particles having an expansion start temperature (t) adjusted to 120 to 250 ° C.
  • the expansion start temperature (t) of the thermally expandable particles can be adjusted by appropriately selecting the type of inclusion component.
  • the expansion start temperature (t) of the thermally expandable particles means a value measured based on the following method. [Measurement method of expansion start temperature (t) of thermally expandable particles] To an aluminum cup having a diameter of 6.0 mm (inner diameter 5.65 mm) and a depth of 4.8 mm, 0.5 mg of thermally expandable particles to be measured is added, and an aluminum lid (diameter 5.6 mm, thickness 0. 1 mm) is prepared.
  • the height of the sample is measured from the upper part of the aluminum lid while a force of 0.01 N is applied to the sample by a pressurizer. Then, in a state where a force of 0.01 N is applied by the pressurizer, heating is performed from 20 ° C. to 300 ° C. at a rate of temperature increase of 10 ° C./min, and the amount of displacement of the pressurizer in the vertical direction is measured.
  • the displacement start temperature be the expansion start temperature (t).
  • the volume expansion coefficient of the thermally expandable particles used in one embodiment of the present invention by heating at an expansion start temperature (t) or higher is preferably 1.5 to 100 times, more preferably 2 to 80 times, and still more preferably 2. It is 5 to 60 times, more preferably 3 to 40 times.
  • the content of the heat-expandable particles is preferably 1 to 40% by mass, more preferably 5 to 35% by mass, still more preferably 10 to 10% by mass with respect to the total amount (100% by mass) of the active ingredients in the composition (y). 30% by mass, and still more preferably 15 to 25% by mass.
  • the resin contained in the composition (y) may be a polymer that can form a non-adhesive thermally expandable substrate (Y).
  • non-adhesive resin may be sufficient and adhesive resin may be sufficient. That is, even if the resin contained in the composition (y) is an adhesive resin, the adhesive resin is polymerized with the polymerizable compound in the process of forming the thermally expandable substrate (Y) from the composition (y). It is sufficient that the resin obtained by the reaction becomes a non-adhesive resin and the thermally expandable substrate (Y) containing the resin becomes non-adhesive.
  • the mass average molecular weight (Mw) of the resin contained in the composition (y) is preferably 1,000 to 1,000,000, more preferably 1,000 to 700,000, and still more preferably 1,000 to 500,000. Further, when the resin is a copolymer having two or more kinds of structural units, the form of the copolymer is not particularly limited, and any of a block copolymer, a random copolymer, and a graft copolymer It may be.
  • the content of the resin is preferably 50 to 99% by mass, more preferably 60 to 95% by mass, and still more preferably 65 to 90% by mass with respect to the total amount (100% by mass) of the active ingredients of the composition (y). %, More preferably 70 to 85% by mass.
  • the resin contained in the resin composition (y) includes one or more selected from acrylic urethane resins and olefin resins. Is preferred.
  • the following resin (U1) is preferable.
  • An acrylic urethane resin (U1) obtained by polymerizing a urethane prepolymer (UP) and a vinyl compound containing a (meth) acrylic acid ester.
  • the acrylic urethane-based resin (U1) has a structural unit derived from a vinyl compound containing a (meth) acrylic acid ester at both ends of the linear urethane prepolymer while having the main chain of the linear urethane prepolymer as a skeleton. is there.
  • the acrylic urethane resin (U1) since the site derived from the linear urethane polymer is interposed between the acrylic sites in the main chain skeleton, the distance between the crosslinking points becomes long, and the molecular structure thereof is a two-dimensional structure (network structure). It is easy to become.
  • the urethane prepolymer of the main chain is linear, the stretching effect is high when an external force is applied.
  • the side chain of the structural unit derived from the vinyl compound containing (meth) acrylic acid ester is easily entangled with the adhesive resin contained in the adhesive layer (X1) and the adhesive resin contained in the adhesive layer (X2). It has a structure. Therefore, the acrylic urethane-based resin (U1) is thermally expandable when the adhesiveness between the adhesive layer (X1) and the thermally expandable substrate (Y) and the adhesive layer (X2) are present. It is thought that it can contribute to the improvement of the interfacial adhesion between the base material (Y) and the adhesive layer (X2).
  • urethane prepolymer (UP) serving as the main chain of the acrylic urethane resin (U1) include a reaction product of a polyol and a polyvalent isocyanate.
  • the urethane prepolymer (UP) is preferably obtained by further performing a chain extension reaction using a chain extender.
  • Examples of the polyol used as a raw material for the urethane prepolymer (UP) include alkylene type polyols, ether type polyols, ester type polyols, ester amide type polyols, ester / ether type polyols, and carbonate type polyols. These polyols may be used independently and may use 2 or more types together.
  • the polyol used in one embodiment of the present invention is preferably a diol, more preferably an ester diol, an alkylene diol, and a carbonate diol, and even more preferably an ester diol and a carbonate diol.
  • ester type diols include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, One or more selected from diols such as alkylene glycols such as diethylene glycol and dipropylene glycol; phthalic acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, 4,4-diphenyldicarboxylic acid, diphenylmethane-4 , 4'-dicarboxylic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, het acid, maleic acid, fumaric acid, itaconic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarbox
  • alkylene type diol examples include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, And alkylene glycols such as diethylene glycol and dipropylene glycol; polyalkylene glycols such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyalkylene glycols such as polytetramethylene glycol; and the like.
  • alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol
  • ethylene glycol, propylene glycol And alkylene glycols such as diethylene glycol and dipropylene glycol
  • Examples of the carbonate type diol include 1,4-tetramethylene carbonate diol, 1,5-pentamethylene carbonate diol, 1,6-hexamethylene carbonate diol, 1,2-propylene carbonate diol, and 1,3-propylene carbonate diol. 2,2-dimethylpropylene carbonate diol, 1,7-heptamethylene carbonate diol, 1,8-octamethylene carbonate diol, 1,4-cyclohexane carbonate diol, and the like.
  • polyvalent isocyanate used as a raw material for the urethane prepolymer (UP) examples include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates. These polyvalent isocyanates may be used alone or in combination of two or more. These polyisocyanates may be a trimethylolpropane adduct type modified product, a burette type modified product reacted with water, or an isocyanurate type modified product containing an isocyanurate ring.
  • the polyisocyanate used in one embodiment of the present invention is preferably diisocyanate, and 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2,6 More preferred is at least one selected from tolylene diisocyanate (2,6-TDI), hexamethylene diisocyanate (HMDI), and alicyclic diisocyanate.
  • MDI 4,4′-diphenylmethane diisocyanate
  • 2,4-TDI 2,4-tolylene diisocyanate
  • 2,6 More preferred is at least one selected from tolylene diisocyanate (2,6-TDI), hexamethylene diisocyanate (HMDI), and alicyclic diisocyanate.
  • alicyclic diisocyanate examples include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (isophorone diisocyanate, IPDI), 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane.
  • IPDI isophorone diisocyanate
  • Examples include diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, and isophorone diisocyanate (IPDI) is preferred.
  • the urethane prepolymer (UP) serving as the main chain of the acrylic urethane resin (U1) is a reaction product of a diol and a diisocyanate, and is a straight chain having ethylenically unsaturated groups at both ends.
  • a urethane prepolymer is preferred.
  • an NCO group at the end of the linear urethane prepolymer obtained by reacting a diol and a diisocyanate compound, and a hydroxyalkyl (meth) acrylate And a method of reacting with.
  • hydroxyalkyl (meth) acrylate examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxy Examples thereof include butyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.
  • the (meth) acrylic acid ester is preferably one or more selected from alkyl (meth) acrylates and hydroxyalkyl (meth) acrylates, and more preferably used in combination with alkyl (meth) acrylates and hydroxyalkyl (meth) acrylates.
  • the proportion of hydroxyalkyl (meth) acrylate to 100 parts by mass of alkyl (meth) acrylate is preferably 0.1 to 100 parts by mass, The amount is preferably 0.5 to 30 parts by mass, more preferably 1.0 to 20 parts by mass, and still more preferably 1.5 to 10 parts by mass.
  • the carbon number of the alkyl group of the alkyl (meth) acrylate is preferably 1 to 24, more preferably 1 to 12, still more preferably 1 to 8, and still more preferably 1 to 3.
  • hydroxyalkyl (meth) acrylate the same thing as the hydroxyalkyl (meth) acrylate used in order to introduce
  • vinyl compounds other than (meth) acrylic acid esters include aromatic hydrocarbon vinyl compounds such as styrene, ⁇ -methylstyrene, and vinyl toluene; vinyl ethers such as methyl vinyl ether and ethyl vinyl ether; vinyl acetate and vinyl propionate.
  • Polar group-containing monomers such as (meth) acrylonitrile, N-vinylpyrrolidone, (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, and meta (acrylamide). These may be used alone or in combination of two or more.
  • the content of the (meth) acrylic acid ester in the vinyl compound is preferably 40 to 100% by mass, more preferably 65 to 100% by mass, and still more preferably based on the total amount (100% by mass) of the vinyl compound. It is 80 to 100% by mass, more preferably 90 to 100% by mass.
  • the total content of alkyl (meth) acrylate and hydroxyalkyl (meth) acrylate in the vinyl compound is preferably 40 to 100% by mass, more preferably 65 to 100% by mass with respect to the total amount (100% by mass) of the vinyl compound.
  • the amount is 100% by mass, more preferably 80 to 100% by mass, and still more preferably 90 to 100% by mass.
  • the acrylic urethane-based resin (U1) used in one embodiment of the present invention is obtained by mixing a urethane prepolymer (UP) and a vinyl compound containing a (meth) acrylic acid ester and polymerizing both.
  • the polymerization is preferably performed by adding a radical initiator.
  • the content ratio of the structural unit (u11) derived from the urethane prepolymer (UP) and the structural unit (u12) derived from the vinyl compound [(u11 ) / (U12)] is preferably 10/90 to 80/20, more preferably 20/80 to 70/30, still more preferably 30/70 to 60/40, and still more preferably 35 by mass ratio. / 65 to 55/45.
  • the olefin resin suitable as the resin contained in the composition (y) is a polymer having at least a structural unit derived from an olefin monomer.
  • the olefin monomer is preferably an ⁇ -olefin having 2 to 8 carbon atoms, and specifically includes ethylene, propylene, butylene, isobutylene, 1-hexene and the like. Among these, ethylene and propylene are preferable.
  • olefinic resins for example, ultra low density polyethylene (VLDPE, density: 880 kg / m 3 or more 910 kg / m less than 3), low density polyethylene (LDPE, density: 910 kg / m 3 or more 915 kg / m less than 3 ), Medium density polyethylene (MDPE, density: 915 kg / m 3 or more and less than 942 kg / m 3 ), high density polyethylene (HDPE, density: 942 kg / m 3 or more), linear low density polyethylene, etc .; polypropylene resin (PP); polybutene resin (PB); ethylene-propylene copolymer; olefin elastomer (TPO); poly (4-methyl-1-pentene) (PMP); ethylene-vinyl acetate copolymer (EVA); ethylene -Vinyl alcohol copolymer (EVOH); ethylene-propylene Olefinic terpolymers such as-(5-ethylid)
  • the olefin resin may be a modified olefin resin further modified by one or more selected from acid modification, hydroxyl group modification, and acrylic modification.
  • an acid-modified olefin resin obtained by subjecting an olefin resin to acid modification a modified polymer obtained by graft polymerization of the above-mentioned unmodified olefin resin with an unsaturated carboxylic acid or its anhydride.
  • unsaturated carboxylic acid or anhydride thereof include maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, tetrahydrophthalic acid, aconitic acid, (meth) acrylic acid, maleic anhydride, itaconic anhydride.
  • Glutaconic anhydride citraconic anhydride, aconitic anhydride, norbornene dicarboxylic anhydride, tetrahydrophthalic anhydride, and the like.
  • unsaturated carboxylic acid or its anhydride may be used independently and may use 2 or more types together.
  • an acrylic modified olefin resin obtained by subjecting an olefin resin to acrylic modification a modification obtained by graft polymerization of an alkyl (meth) acrylate as a side chain to the above-mentioned unmodified olefin resin as a main chain.
  • a polymer is mentioned.
  • the number of carbon atoms in the alkyl group of the alkyl (meth) acrylate is preferably 1-20, more preferably 1-16, and still more preferably 1-12.
  • said alkyl (meth) acrylate the same thing as the compound which can be selected as a below-mentioned monomer (a1 ') is mentioned, for example.
  • Examples of the hydroxyl group-modified olefin resin obtained by subjecting an olefin resin to hydroxyl group modification include a modified polymer obtained by graft polymerization of a hydroxyl group-containing compound to the above-mentioned unmodified olefin resin, which is the main chain.
  • Examples of the hydroxyl group-containing compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl.
  • Examples thereof include hydroxyalkyl (meth) acrylates such as (meth) acrylate and 4-hydroxybutyl (meth) acrylate; unsaturated alcohols such as vinyl alcohol and allyl alcohol.
  • the composition (y) may contain a resin other than the acrylic urethane-based resin and the olefin-based resin as long as the effects of the present invention are not impaired.
  • Such resins include vinyl resins such as polyvinyl chloride, polyvinylidene chloride, and polyvinyl alcohol; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polystyrene; acrylonitrile-butadiene-styrene copolymer Polycarbonate; Polyurethane not applicable to acrylic urethane resin; Polysulfone; Polyetheretherketone; Polyethersulfone; Polyphenylene sulfide; Polyimide resin such as polyetherimide and polyimide; Polyamide resin; Acrylic resin; Fluorine resin etc. are mentioned.
  • vinyl resins such as polyvinyl chloride, polyvinylidene chloride, and polyvinyl alcohol
  • polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate
  • polystyrene acrylonitrile-butadiene-styren
  • the content ratio of the resin other than the acrylic urethane-based resin and the olefin-based resin in the composition (y) is preferably small.
  • the content of the resin other than the acrylic urethane-based resin and the olefin-based resin is preferably less than 30 parts by weight, more preferably less than 20 parts by weight with respect to 100 parts by weight of the total amount of the resin contained in the composition (y). More preferably, it is less than 10 mass parts, More preferably, it is less than 5 mass parts, More preferably, it is less than 1 mass part.
  • the composition (y) contains an acrylic urethane resin
  • a crosslinking agent the isocyanate type compound as a crosslinking agent is preferable, for example.
  • various isocyanate compounds can be used as long as they react with the functional group of the acrylic urethane resin to form a crosslinked structure.
  • the isocyanate compound is preferably a polyisocyanate compound having two or more isocyanate groups per molecule.
  • polyisocyanate compound examples include diisocyanate compounds, triisocyanate compounds, tetraisocyanate compounds, pentaisocyanate compounds, hexaisocyanate compounds, and the like. More specifically, aromatic polyisocyanate compounds such as tolylene diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate; dicyclohexylmethane-4,4-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene Examples thereof include alicyclic isocyanate compounds such as diisocyanate and hydrogenated xylylene diisocyanate; aliphatic isocyanate compounds such as pentamethylene diisocyanate, hexamethylene diisocyanate, heptamethylene diisocyanate, trimethylhexamethylene diisocyan
  • biuret bodies isocyanurate bodies of these isocyanate compounds, adduct bodies that are reaction products of these isocyanate compounds with non-aromatic low-molecular active hydrogen-containing compounds such as ethylene glycol, trimethylolpropane, castor oil, etc. Modified products can also be used.
  • isocyanate compounds aliphatic isocyanate compounds are preferable, aliphatic diisocyanate compounds are more preferable, and pentamethylene diisocyanate, hexamethylene diisocyanate, and heptamethylene diisocyanate are still more preferable.
  • the isocyanate compound may be used alone or in combination of two or more.
  • the content ratio of the acrylic urethane resin and the isocyanate compound as a crosslinking agent is an isocyanate system as a crosslinking agent with respect to a total of 100 parts by mass of the acrylic urethane resin as a solid content ratio.
  • the compound is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, and still more preferably 3 to 15 parts by mass.
  • the composition (y) when the composition (y) contains an acrylic urethane resin and the crosslinking agent, the composition (y) further preferably contains a catalyst together with the crosslinking agent.
  • a metal catalyst is preferable, and a metal catalyst excluding a tin compound having a butyl group is more preferable.
  • the metal catalyst include a tin catalyst, a bismuth catalyst, a titanium catalyst, a vanadium catalyst, a zirconium catalyst, an aluminum catalyst, and a nickel catalyst.
  • a tin-based catalyst or a bismuth-based catalyst is preferable, and a tin-based catalyst or a bismuth-based catalyst excluding a tin-based compound having a butyl group is more preferable.
  • the tin-based catalyst is an organometallic compound of tin, and includes compounds having a structure such as alkoxide, carboxylate, chelate, etc., preferably acetylacetone complex, acetylacetonate, octylic acid compound or naphthenic acid of these metals Compounds and the like.
  • the bismuth catalyst, titanium catalyst, vanadium catalyst, zirconium catalyst, aluminum catalyst, or nickel catalyst is an organometallic compound of bismuth, titanium, vanadium, zirconium, aluminum, or nickel, respectively.
  • compounds having a structure such as alkoxide, carboxylate, chelate and the like can be mentioned, and preferred examples thereof include acetylacetone complexes, acetylacetonates, octylic acid compounds and naphthenic acid compounds of these metals.
  • metal acetylacetone complex examples include acetylacetone tin, acetylacetone titanium, acetylacetone vanadium, acetylacetone zirconium, acetylacetone aluminum, and acetylacetone nickel.
  • acetylacetonate examples include tin acetylacetonate, bismuth acetylacetonate, titanium acetylacetonate, vanadium acetylacetonate, zirconium acetylacetonate, aluminum acetylacetonate, nickel acetylacetonate and the like.
  • octylic acid compound examples include bismuth 2-ethylhexylate, nickel 2-ethylhexylate, zirconium 2-ethylhexylate, tin 2-ethylhexylate and the like.
  • naphthenic acid compound examples include bismuth naphthenate, nickel naphthenate, zirconium naphthenate, tin naphthenate, and the like.
  • RxSn (L) (4-X) (wherein R is an alkyl group having 1 to 25 carbon atoms, preferably an alkyl group having 1 to 3 or 5 to 25 carbon atoms, or It is an aryl group, L is an organic group other than an alkyl group and an aryl group, or an inorganic group, and x is 1, 2 or 4).
  • the alkyl group of R is more preferably an alkyl group having 5 to 25 carbon atoms, further preferably an alkyl group having 5 to 20 carbon atoms, and the aryl group of R is The number of carbon atoms is not particularly limited, but an aryl group having 6 to 20 carbon atoms is preferable. When two or more R are present in one molecule, each R may be the same or different.
  • L is preferably an aliphatic carboxylic acid, aromatic carboxylic acid or aromatic sulfonic acid having 2 to 20 carbon atoms, more preferably an aliphatic carboxylic acid having 2 to 20 carbon atoms.
  • Examples of the aliphatic carboxylic acid having 2 to 20 carbon atoms include an aliphatic monocarboxylic acid having 2 to 20 carbon atoms and an aliphatic dicarboxylic acid having 2 to 20 carbon atoms.
  • each L may be the same or different.
  • the catalyst may be used alone or in combination of two or more.
  • the content ratio of the acrylic urethane resin and the catalyst is preferably 0.001 to 5 parts by mass in terms of solid content of the catalyst with respect to 100 parts by mass in total of the acrylic urethane resin.
  • the amount is preferably 0.01 to 3 parts by mass, more preferably 0.1 to 2 parts by mass.
  • the composition (y) used in one embodiment of the present invention may contain a base material additive contained in a base material included in a general pressure-sensitive adhesive sheet as long as the effects of the present invention are not impaired.
  • base material additives include ultraviolet absorbers, light stabilizers, antioxidants, antistatic agents, slip agents, antiblocking agents, and colorants. These base material additives may be used alone or in combination of two or more.
  • the content of each additive for base materials is the total amount of resin selected from the group consisting of acrylurethane resins and olefin resins contained in the composition (y). The amount is preferably 0.0001 to 20 parts by mass, more preferably 0.001 to 10 parts by mass with respect to 100 parts by mass.
  • the composition (y) may contain water or an organic solvent as a diluent solvent together with the various active ingredients described above, and may be in the form of a solution.
  • organic solvent include toluene, xylene, ethyl acetate, butyl acetate, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropyl alcohol, tert-butanol, s-butanol, acetylacetone, cyclohexanone, n-hexane, and cyclohexane.
  • these dilution solvents may be used independently and may be used in combination of 2 or more type.
  • the active ingredient concentration of the composition (y) is preferably independently 0.1 to 60% by mass, more preferably 0. It is 5 to 50% by mass, more preferably 1.0 to 40% by mass.
  • the pressure-sensitive adhesive layer (X1) of the pressure-sensitive adhesive sheet of the present invention is a layer formed by drying a coating film (x1 ′) made of a composition (x1) containing a pressure-sensitive adhesive resin, and has pressure-sensitive adhesiveness.
  • the adhesive force on the adhesive surface of the adhesive layer (X1) at 23 ° C. before expansion of the thermally expandable particles is preferably 0.1 to 10.0 N / 25 mm, more preferably 0.
  • the range is from 0.2 to 8.0 N / 25 mm, more preferably from 0.4 to 6.0 N / 25 mm, still more preferably from 0.5 to 4.0 N / 25 mm.
  • the said adhesive force is 0.1 N / 25mm or more, to-be-adhered bodies, such as a semiconductor chip, can fully be fixed.
  • the said adhesive force is 10.0 N / 25mm or less, it can peel easily by slight force by heating to the expansion start temperature (t) at the time of peeling.
  • said adhesive force means the value measured by the method as described in an Example.
  • the composition (x1) that is a material for forming the pressure-sensitive adhesive layer (X1) contains a pressure-sensitive adhesive resin.
  • components other than adhesive resin contained in a composition (x1) can be suitably adjusted according to the use application of the adhesive sheet of this invention.
  • the composition (x1) may further contain a tackifier and / or a cross-linking agent from the viewpoint of obtaining a pressure-sensitive adhesive sheet with improved adhesive strength.
  • And / or an adhesive additive used in a diluting solvent and / or a general adhesive used in a diluting solvent and / or a general adhesive.
  • the heat-expandable base material (Y) contains heat-expandable particles
  • the pressure-sensitive adhesive sheet of the present invention exhibits heat peelability, so that the composition (x1) that is the pressure-sensitive adhesive layer (X1) forming material is used. It is not necessary to include thermally expandable particles.
  • the composition (x1) may contain a small amount of thermally expandable particles within a range not impairing the effects of the present invention, and the content of thermally expandable particles is determined by the composition (x1). ) Is preferably 0 to 50% by weight, more preferably 0 to 20% by weight, still more preferably 0 to 10% by weight, based on the total amount of active ingredients (100% by weight).
  • the mass average molecular weight (Mw) of the adhesive resin is preferably 10,000 to 2,000,000, more preferably 20,000 to 1,500,000, and even more preferably 30,000 to 1,000,000 from the viewpoint of improving the adhesive strength.
  • the adhesive resin contained in the composition (x1) include rubber resins such as acrylic resins, urethane resins, polyisobutylene resins, polyester resins, and olefins that satisfy the adhesive force as the above-mentioned adhesive resins. Resin, silicone resin, polyvinyl ether resin and the like. These adhesive resins may be used alone or in combination of two or more.
  • these adhesive resins are copolymers having two or more kinds of structural units, the form of the copolymer is not particularly limited, and a block copolymer, a random copolymer, and a graft copolymer are not limited. Any of polymers may be used.
  • these pressure-sensitive adhesive resins are UV non-curable pressure-sensitive adhesives having no polymerizable functional group. A resin is preferred.
  • the content of the adhesive resin in the composition (x1) is preferably 30 to 99.99% by mass, more preferably 40 to 99%, based on the total amount (100% by mass) of the active ingredients of the composition (x1). .95% by mass, more preferably 50 to 99.90% by mass, still more preferably 55 to 99.80% by mass, and still more preferably 60 to 99.50% by mass.
  • the pressure-sensitive resin contained in the composition (x1) is an acrylic resin. It is preferable to contain.
  • the content ratio of the acrylic resin in the adhesive resin is preferably from 30 to the total amount (100% by mass) of the adhesive resin contained in the composition (x1) from the viewpoint of further improving the interfacial adhesion.
  • the amount is 100% by mass, more preferably 50 to 100% by mass, still more preferably 70 to 100% by mass, and still more preferably 85 to 100% by mass.
  • the mass average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 1,500,000, more preferably 200,000 to 1,300,000, still more preferably 350,000 to 1,200,000, still more preferably 500,000 to 1,100,000. .
  • an acrylic polymer having a structural unit (a1) derived from alkyl (meth) acrylate (a1 ′) (hereinafter also referred to as “monomer (a1 ′)”).
  • (A0) is preferred, and the acrylic copolymer having the structural unit (a2) derived from the functional group-containing monomer (a2 ′) (hereinafter also referred to as “monomer (a2 ′)”) together with the structural unit (a1).
  • A1 is more preferable.
  • the number of carbon atoms of the alkyl group contained in the monomer (a1 ′) is preferably 1 to 24, more preferably 1 to 12, still more preferably 1 to 8, and still more preferably 4 to 6 from the viewpoint of improving adhesive properties. It is.
  • the alkyl group contained in the monomer (a1 ′) may be a linear alkyl group or a branched alkyl group.
  • Examples of the monomer (a1 ′) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, tridecyl ( Examples include meth) acrylate and stearyl (meth) acrylate. These monomers (a1 ′) may be used alone or in combination of two or more.
  • methyl (meth) acrylate, butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate are preferable, and methyl (meth) acrylate and butyl (meth) acrylate are more preferable.
  • the content of the structural unit (a1) is preferably 50 to 100% by weight, more preferably based on the total structural unit (100% by weight) of the acrylic polymer (A0) or the acrylic copolymer (A1). It is 60 to 99.9% by mass, more preferably 70 to 99.5% by mass, and still more preferably 80 to 99.0% by mass.
  • the functional group possessed by the monomer (a2 ′) refers to a functional group capable of reacting with a crosslinking agent that may be contained in the composition (x1) described later to serve as a crosslinking starting point or a functional group having a crosslinking accelerating effect.
  • a crosslinking agent that may be contained in the composition (x1) described later to serve as a crosslinking starting point or a functional group having a crosslinking accelerating effect.
  • Carboxy group, amino group, epoxy group and the like examples of the monomer (a2 ′) include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer. These monomers (a2 ′) may be used alone or in combination of two or more.
  • a hydroxyl group-containing monomer and a carboxy group-containing monomer are preferable.
  • hydroxyl group-containing monomer examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl (meth) )
  • hydroxyalkyl (meth) acrylates such as 4-hydroxybutyl (meth) acrylate; and unsaturated alcohols such as vinyl alcohol and allyl alcohol.
  • carboxy group-containing monomer examples include ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid; ethylenically unsaturated dicarboxylic acids such as fumaric acid, itaconic acid, maleic acid and citraconic acid, and anhydrides thereof.
  • the monomer (a2 ′) 2-hydroxyethyl (meth) acrylate is preferable.
  • the content of the structural unit (a2) is preferably 0.1 to 40% by weight, more preferably 0.3 to 30%, based on the entire structural unit (100% by weight) of the acrylic copolymer (A1). % By mass, more preferably 0.5 to 20% by mass, still more preferably 0.7 to 10% by mass.
  • the acrylic copolymer (A1) may further have a structural unit (a3) derived from another monomer (a3 ′) other than the monomers (a1 ′) and (a2 ′).
  • the content of the structural units (a1) and (a2) is preferably 70 with respect to the total structural units (100% by mass) of the acrylic copolymer (A1).
  • To 100% by mass more preferably 80 to 100% by mass, still more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass.
  • olefins such as ethylene, propylene and isobutylene; halogenated olefins such as vinyl chloride and vinylidene chloride; diene monomers such as butadiene, isoprene and chloroprene; cyclohexyl (meth) acrylate, It has a cyclic structure such as benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, imide (meth) acrylate, etc.
  • (Meth) acrylate styrene, ⁇ -methylstyrene, vinyl toluene, vinyl formate, vinyl acetate, acrylonitrile, (meth) acrylamide, (meth) acrylonitrile, (meth) acryloyl mole Phosphorus, N- vinylpyrrolidone and the like.
  • vinyl acetate is preferable.
  • the urethane resin that can be used as the adhesive resin is not particularly limited as long as it is a polymer having at least one of a urethane bond and a urea bond in at least one of the main chain and the side chain.
  • Specific examples of the urethane resin include a urethane prepolymer (UX) obtained by reacting a polyol and a polyvalent isocyanate compound.
  • the urethane prepolymer (UX) may be obtained by further subjecting to a chain extension reaction using a chain extender.
  • the mass average molecular weight (Mw) of the urethane resin is preferably 10,000 to 200,000, more preferably 12,000 to 150,000, still more preferably 15,000 to 100,000, and still more preferably 20,000 to 70,000.
  • polyol used as a raw material for the urethane-based prepolymer (UX) examples include polyol compounds such as alkylene type polyols, polyether type polyols, polyester type polyols, polyester amide type polyols, polyester / polyether type polyols, and polycarbonate type polyols. Although it is mentioned, if it is a polyol, it will not specifically limit, Bifunctional diol and a trifunctional triol may be sufficient. These polyols may be used alone or in combination of two or more. Among these polyols, diols are preferable and alkylene type diols are more preferable from the viewpoints of availability, reactivity, and the like.
  • alkylene type diol examples include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, And alkylene glycols such as diethylene glycol and dipropylene glycol; polyalkylene glycols such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyalkylene glycols such as polytetramethylene glycol; and the like.
  • glycols having a mass average molecular weight (Mw) of 1,000 to 3,000 are preferred from the viewpoint of suppressing gelation when the reaction with a chain extender is performed.
  • Examples of the polyvalent isocyanate compound that is a raw material for the urethane prepolymer (UX) include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.
  • aromatic polyisocyanate include 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2 , 6-Tolylene diisocyanate (2,6-TDI), 4,4′-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4 ′ -Diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, 1,4-tetramethylxylylene di
  • aliphatic polyisocyanate examples include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HMDI), pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, and dodeca.
  • HMDI hexamethylene diisocyanate
  • pentamethylene diisocyanate 1,2-propylene diisocyanate
  • 2,3-butylene diisocyanate 1,3-butylene diisocyanate
  • dodeca examples include methylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.
  • Examples of the alicyclic polyisocyanate include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (IPDI: isophorone diisocyanate), 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4- Cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatemethyl) cyclohexane, 1,4-bis (isocyanate) Methyl) cyclohexane and the like.
  • IPDI isophorone diisocyanate
  • 1,3-cyclopentane diisocyanate 1,3-cyclohexane diisocyanate
  • these polyisocyanate compounds may be a trimethylolpropane adduct modified product of the polyisocyanate, a burette modified product reacted with water, or an isocyanurate modified product containing an isocyanurate ring.
  • polyvalent isocyanate compounds 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2, from the viewpoint of obtaining a urethane polymer having excellent adhesive properties.
  • MDI 4,4′-diphenylmethane diisocyanate
  • 2,4-TDI 2,4-tolylene diisocyanate
  • One or more selected from 6-tolylene diisocyanate (2,6-TDI), hexamethylene diisocyanate (HMDI), 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (IPDI) and modified products thereof are preferable. From the viewpoint of weather resistance, at least one selected from HMDI, IPDI, and modified products thereof is more preferable.
  • the isocyanate group content (NCO%) in the urethane prepolymer (UX) is preferably 0.5 to 12% by mass, more preferably 1 to 4 in a value measured according to JIS K1603-1: 2007. % By mass.
  • chain extender a compound having at least one of hydroxyl group and amino group, or a compound having at least three of hydroxyl group and amino group is preferable.
  • the compound having at least one of a hydroxyl group and an amino group is preferably at least one compound selected from the group consisting of aliphatic diols, aliphatic diamines, alkanolamines, bisphenols, and aromatic diamines.
  • aliphatic diol examples include alkanediols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, and 1,7-heptanediol.
  • Alkylene glycols such as ethylene glycol, propylene glycol, diethylene glycol and dipropylene glycol;
  • the aliphatic diamine include ethylenediamine, 1,3-propanediamine, 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, and the like.
  • the alkanolamine include monoethanolamine, monopropanolamine, isopropanolamine and the like.
  • Examples of bisphenol include bisphenol A and the like.
  • aromatic diamine include diphenylmethanediamine, tolylenediamine, xylylenediamine, and the like.
  • Examples of the compound having at least three hydroxyl groups and amino groups include polyols such as trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol; 1-amino-2,3-propanediol, 1-methyl And amino alcohols such as amino-2,3-propanediol and N- (2-hydroxypropylethanolamine); ethylene oxide or propylene oxide adducts of tetramethylxylylenediamine;
  • the polyisobutylene resin (hereinafter also referred to as “PIB resin”) that can be used as an adhesive resin is not particularly limited as long as it has a polyisobutylene skeleton in at least one of a main chain and a side chain.
  • the mass average molecular weight (Mw) of the PIB resin is preferably 20,000 or more, more preferably 30,000 to 1,000,000, still more preferably 50,000 to 800,000, and still more preferably 70,000 to 600,000.
  • PIB resin examples include polyisobutylene which is a homopolymer of isobutylene, a copolymer of isobutylene and isoprene, a copolymer of isobutylene and n-butene, a copolymer of isobutylene and butadiene, and these copolymers.
  • examples thereof include halogenated butyl rubber that has been brominated or chlorinated.
  • the structural unit composed of isobutylene is contained in the largest amount among all the structural units.
  • the content of the structural unit composed of isobutylene is preferably 80 to 100% by mass, more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass with respect to all the structural units (100% by mass) of the PIB resin. %.
  • These PIB-based resins may be used alone or in combination of two or more.
  • PIB-type resin when using PIB-type resin, it is preferable to use together PIB-type resin with a high mass average molecular weight (Mw) and PIB-type resin with a low mass average molecular weight (Mw). More specifically, a PIB resin (p1) having a mass average molecular weight (Mw) of 270,000 to 600,000 (hereinafter also referred to as “PIB resin (p1)”), and a mass average molecular weight (Mw) of 5 It is preferable to use 10,000 to 250,000 PIB resin (p2) (hereinafter also referred to as “PIB resin (p2)”) in combination.
  • the durability and weather resistance of the pressure-sensitive adhesive layer to be formed can be improved, and the adhesive strength can also be improved.
  • a PIB resin (p2) having a low mass average molecular weight (Mw) it can be well compatible with the PIB resin (p1), and the PIB resin (p1) can be appropriately plasticized.
  • the wettability of the pressure-sensitive adhesive layer to the adherend can be improved, and the physical properties of adhesive, flexibility and the like can be improved.
  • the mass average molecular weight (Mw) of the PIB resin (p1) is preferably 270,000 to 600,000, more preferably 290,000 to 480,000, still more preferably 310,000 to 450,000, and even more preferably 320,000 to 400,000. It is.
  • the mass average molecular weight (Mw) of the PIB resin (p2) is preferably 50,000 to 250,000, more preferably 80,000 to 230,000, still more preferably 140,000 to 220,000, and still more preferably 180,000 to 210,000. It is.
  • the content ratio of the PIB resin (p2) to 100 parts by mass of the PIB resin (p1) is preferably 5 to 55 parts by mass, more preferably 6 to 40 parts by mass, still more preferably 7 to 30 parts by mass, and even more.
  • the amount is preferably 8 to 20 parts by mass.
  • the olefin resin that can be used as the adhesive resin is not particularly limited as long as it is a polymer having a structural unit derived from an olefin compound such as ethylene or propylene.
  • the said olefin resin may be used independently and may be used in combination of 2 or more type.
  • the olefin-based resin examples include polyethylenes such as low density polyethylene, medium density polyethylene, high density polyethylene, and linear low density polyethylene, polypropylene, copolymers of ethylene and propylene, ethylene and other ⁇ - Copolymers of olefins, copolymers of propylene and other ⁇ -olefins, copolymers of ethylene, propylene and other ⁇ -olefins, copolymers of ethylene and other ethylenically unsaturated monomers Examples thereof include ethylene (vinyl-vinyl acetate copolymer, ethylene-alkyl (meth) acrylate copolymer, etc.) and the like.
  • Examples of the ⁇ -olefin include 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4-methyl-1-pentene, 4-methyl-1-hexene and the like.
  • Examples of the ethylenically unsaturated monomer include vinyl acetate, alkyl (meth) acrylate, vinyl alcohol, and the like.
  • the composition (x1) further contains a tackifier from the viewpoint of obtaining a pressure-sensitive adhesive sheet with improved adhesive strength.
  • the “tackifier” is a component that assists in improving the adhesive strength of the adhesive resin, and refers to an oligomer having a mass average molecular weight (Mw) of less than 10,000. It is a distinction.
  • the weight average molecular weight (Mw) of the tackifier is preferably 400 to 10,000, more preferably 500 to 8,000, and still more preferably 800 to 5,000.
  • tackifiers include rosin resins such as rosin resins, rosin ester resins, and rosin-modified phenol resins; hydrogenated rosin resins obtained by hydrogenating these rosin resins; terpene resins, aromatic modified terpene resins, and terpene phenols.
  • Terpene resins such as epoxy resins; hydrogenated terpene resins obtained by hydrogenating these terpene resins; styrene obtained by copolymerizing a styrene monomer such as ⁇ -methylstyrene or ⁇ -methylstyrene with an aliphatic monomer Hydrogenated styrene resins obtained by hydrogenating these styrene resins; C5 systems obtained by copolymerizing C5 fractions such as pentene, isoprene, piperine, 1,3-pentadiene generated by thermal decomposition of petroleum naphtha Petroleum resin and hydrogenated petroleum resin of this C5 petroleum resin; indene and vinyli produced by thermal decomposition of petroleum naphtha And C9 petroleum resins obtained by copolymerizing C9 fractions such as toluene and hydrogenated petroleum resins.
  • These tackifiers may be used alone or in combination of two or more different softening points and structures.
  • the softening point of the tackifier is preferably 60 to 170 ° C, more preferably 65 to 160 ° C, and still more preferably 70 to 150 ° C.
  • the “softening point” of the tackifier means a value measured according to JIS K2531.
  • the weighted average of the softening point of these several tackifier belongs to the said range.
  • the content of the tackifier in the composition (x1) is preferably 0.01 to 65% by mass, more preferably 0.00%, based on the total amount (100% by mass) of the active ingredients in the composition (x1). It is 05 to 55% by mass, more preferably 0.1 to 50% by mass, still more preferably 0.5 to 45% by mass, and still more preferably 1.0 to 40% by mass.
  • the total content of the adhesive resin and the tackifier in the composition (x1) is preferably 70% by mass or more, more preferably based on the total amount (100% by mass) of the active ingredients in the composition (x1). Is 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and still more preferably 95% by mass or more.
  • the composition (x1) further contains a crosslinking agent together with the above-mentioned pressure-sensitive adhesive resin having a functional group such as an acrylic copolymer having the structural units (a1) and (a2). It is preferable to do.
  • the said crosslinking agent reacts with the functional group which the said adhesive resin has, and bridge
  • cross-linking agent examples include tolylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, and the like, and adducts thereof; epoxy cross-linking agents such as ethylene glycol glycidyl ether; hexa [1- (2- Methyl) -aziridinyl] triphosphatriazine and other aziridine crosslinkers; aluminum chelates and other chelate crosslinkers; and the like.
  • These cross-linking agents may be used alone or in combination of two or more.
  • an isocyanate-based crosslinking agent is preferable from the viewpoints of increasing cohesive force and improving adhesive force, and availability.
  • the content of the cross-linking agent is appropriately adjusted depending on the number of functional groups of the adhesive resin.
  • the amount is preferably 0.01 to 10 parts by mass, more preferably 0.03 to 7 parts by mass, and still more preferably 0.05 to 5 parts by mass.
  • the composition (x1) contains an additive for pressure-sensitive adhesives used for general pressure-sensitive adhesives other than the above-described tackifier and cross-linking agent as long as the effects of the present invention are not impaired. You may do it.
  • the adhesive additive include an antioxidant, a softening agent (plasticizer), a rust inhibitor, a pigment, a dye, a retarder, a catalyst, and an ultraviolet absorber. These pressure-sensitive adhesive additives may be used alone or in combination of two or more. When these pressure-sensitive adhesive additives are contained, the content of each pressure-sensitive adhesive additive is preferably independently 0.0001 to 20 parts by mass, more preferably 100 parts by mass of the adhesive resin. 0.001 to 10 parts by mass.
  • the composition (x1) may contain water or an organic solvent as a diluent solvent together with the various active ingredients described above, and may be in the form of a solution.
  • an organic solvent the same thing as the organic solvent used when preparing the above-mentioned composition (y) in the form of a solution is mentioned.
  • the dilution solvent contained in a composition (x1) may be used independently, and may be used in combination of 2 or more type.
  • the active ingredient concentration of the composition (x1) is preferably 0.1 to 60% by mass, more preferably 0.5 to 50% by mass. %, More preferably 1.0 to 45% by mass.
  • the pressure-sensitive adhesive layer (X2) included in the pressure-sensitive adhesive sheet of one embodiment of the present invention is a layer formed from a composition (x2) containing a pressure-sensitive adhesive resin, and has pressure-sensitive adhesiveness. Suitable physical properties of the pressure-sensitive adhesive layer (X2) are the same as those of the pressure-sensitive adhesive layer (X1). Moreover, about the composition (x2) which is a forming material of an adhesive layer (X2), the thing similar to the composition (x1) which is a forming material of an adhesive layer (X1) can be used.
  • release material As the release materials 13, 131, and 132 included in the pressure-sensitive adhesive sheet of one embodiment of the present invention, a release sheet that has been subjected to a double-sided release process, a release sheet that has been subjected to a single-sided release process, and the like are used. The thing etc. which apply
  • the two release materials 131 and the release material 132 that sandwich the laminate are preferably adjusted so that the difference in the release force is different.
  • Examples of the base material for the release material include papers such as high-quality paper, glassine paper, and kraft paper; polyester resin films such as polyethylene terephthalate resin, polybutylene terephthalate resin, and polyethylene naphthalate resin; and olefins such as polypropylene resin and polyethylene resin.
  • a plastic film such as a resin film;
  • release agent examples include silicone-based resins, olefin-based resins, isoprene-based resins, rubber-based elastomers such as butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins.
  • the thickness of the release material is not particularly limited, but is preferably 10 to 200 ⁇ m, more preferably 25 to 170 ⁇ m, and still more preferably 35 to 80 ⁇ m.
  • the manufacturing method of the adhesive sheet of this invention is a method including the following process (1A) and (2A). Since the manufacturing method of the adhesive sheet of this invention can reduce the number of processes at the time of manufacturing an adhesive sheet compared with the conventional manufacturing method, it can improve productivity.
  • Step (1A) A step of directly laminating a coating film (x1 ′) made of the composition (x1) and a coating film (y ′) made of the composition (y) in this order.
  • steps (1A) and (2A) will be described.
  • the coating film (x1 ′) and the coating film (y ′) for example, after the coating film (x1 ′) is formed, the coating film (x1 ′) is coated on the coating film (x1 ′).
  • ') May be sequentially formed, but from the viewpoint of productivity and interfacial adhesion, the composition (x1) and the composition (y) are simultaneously applied to form the coating film (x1') and the coating film ( A method of simultaneously forming y ′) is preferred.
  • the coater used for coating the composition (x1) and the composition (y) when sequentially forming the coating film (x1 ′) and the coating film (y ′) for example, a spin coater, a spray coater, a bar coater, Examples include knife coaters, roll coaters, knife roll coaters, blade coaters, gravure coaters, curtain coaters, and die coaters.
  • Examples of the coater used when the composition (x1) and the composition (y) are simultaneously applied include a multilayer coater, and specifically, a multilayer curtain coater, a multilayer die coater, and the like. Among these, a multilayer die coater is preferable from the viewpoint of operability.
  • a composition (x1) and a composition (y) contain a dilution solvent each independently further from a viewpoint of making each coating film easy to form and improving productivity.
  • a dilution solvent the above-mentioned dilution solvent demonstrated in the column of the adhesive sheet can be used.
  • blending a dilution solvent with each composition is as having mentioned above in the column of the adhesive sheet.
  • this process (1A) after forming the coating film of 1 layer or more of a coating film (x1 ') and a coating film (y'), before the process (2A) mentioned later, the hardening reaction of the said coating film is carried out.
  • the drying temperature at the time of performing the pre-drying treatment is usually appropriately set within a temperature range in which the formed coating film does not cure, but preferably in step (2A). Below the drying temperature.
  • the specific drying temperature indicated by the phrase “below the drying temperature in step (2A)” is preferably 10 to 45 ° C., more preferably 10 to 34 ° C., and further preferably 15 to 30 ° C.
  • the coating film (x1 ′) and the coating film (y ′) are simultaneously dried to form the laminate.
  • a mixed layer is formed at the interface between the coating film (x1 ′) and the coating film (y ′), and the adhesive resin in the coating film (x1 ′) and the resin in the coating film (y ′) are separated. It is thought that the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) is improved by drying and curing in an intertwined state.
  • the drying temperature of the coating film in the step (2A) is preferably 60 to 150 ° C, more preferably 70 to 145 ° C, still more preferably 80 to 140 ° C, and still more preferably 90 to 135 ° C.
  • the manufacturing method of this invention is the adhesive of a thermally expansible base material (Y). If it is a method further including the process of forming an adhesive layer (X2) on the surface on the opposite side to a layer (X1), it will not specifically limit.
  • the manufacturing method of the following embodiment (A) and the manufacturing method of embodiment (B) are mentioned, and the viewpoint of the interfacial adhesion between the productivity and the thermally expandable substrate (Y) and the pressure-sensitive adhesive layer (X2). To the embodiment (B) is more preferable.
  • the manufacturing method of the embodiment (A) includes any of the following steps (3A-1) to (3A-4) in addition to the steps (1A) and (2A) described above.
  • Step (3A-1) A step of heat-melting the composition (x2) containing an adhesive resin and extrusion laminating it on the surface of the thermally expandable substrate (Y) obtained in the step (2A).
  • Step (3A-2) Forming a coating film (x2 ′) composed of a composition (x2) containing an adhesive resin on the surface of the thermally expandable substrate (Y) obtained in step (2A) And drying the coating film (x2 ′).
  • Step (3A-3) The composition (x2) containing the adhesive resin is heated and melted, and the pressure-sensitive adhesive layer (X2) is prepared in advance on the release-treated surface of the release material by extrusion molding. The step of directly sticking the pressure-sensitive adhesive layer (X2) formed on the release material onto the surface of the thermally expandable substrate (Y) obtained in (1).
  • Step (3A-4) A composition (x2) containing an adhesive resin is applied to the release treatment surface of the release material to form a coating film (x2 ′), and the coating film (x2 ′) is dried. The pressure-sensitive adhesive layer (X2) is formed in advance, and the pressure-sensitive adhesive layer (X2) formed on the release material is directly formed on the surface of the thermally expandable substrate (Y) obtained in the step (2A). The process of sticking.
  • Examples of the method for forming the coating film (x2 ′) in the steps (3A-2) and (3A-4) include spin coater, spray coater, bar coater, knife coater, roll coater, knife roll coater, blade coater, and gravure coater. , Curtain coater, die coater and the like.
  • the composition (x2) further contains the aforementioned dilution solvent.
  • blending a dilution solvent with a composition (x2) is also as above-mentioned.
  • the drying temperature of the coating film (x2 ′) in the steps (3A-2) and (3A-4) is preferably 60 to 150 ° C., more preferably 70 to 145 ° C., still more preferably 80 to 140 ° C., and still more The temperature is preferably 90 to 135 ° C.
  • the step (3A-2) is preferable from the viewpoint of productivity and interfacial adhesion between the thermally expandable substrate (Y) and the pressure-sensitive adhesive layer (X2). .
  • the manufacturing method of embodiment (B) includes the following steps (1B) and (2B).
  • steps (1B) and (2B) will be described.
  • the coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′) for example, after forming the coating film (x1 ′), the coating film (x1 A sequential formation method may be used in which a coating film (y ') is formed on') and a coating film (x2 ') is further formed on the coating film (y').
  • the composition It is preferable to apply x1), the composition (y), and the composition (x2) at the same time to form the coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′) at the same time.
  • each coater mentioned above etc. are mentioned, for example.
  • coat at least 3 layers simultaneously is mentioned.
  • a multilayer curtain coater, a multilayer die coater, etc. are mentioned.
  • a multilayer die coater capable of simultaneously applying three or more layers is preferable.
  • the composition (x2), the composition (y), and the composition (x1) each independently further contain a dilution solvent.
  • a dilution solvent the above-mentioned dilution solvent demonstrated in the column of the adhesive sheet can be used.
  • blending a dilution solvent with each composition is as having mentioned above in the column of the adhesive sheet.
  • this process (1B) after forming the coating film of 1 layer or more of a coating film (x1 '), a coating film (y'), and a coating film (x2 '), before the process (2B), You may perform the predrying process of the grade which does not advance the hardening reaction of a coating film. For example, a pre-drying treatment may be performed each time a coating film (x1 ′), a coating film (y ′), and a coating film (x2 ′) are formed. After the two-layer coating film of the coating film (y ′) is formed, the two layers may be pre-dried simultaneously, and then the coating film (x2 ′) may be formed.
  • the drying temperature at the time of performing the pre-drying treatment is usually appropriately set within a temperature range in which the formed coating film does not proceed, but preferably in the step (2B). Below the drying temperature.
  • the specific drying temperature indicated by the phrase “below the drying temperature in step (2B)” is preferably 10 to 45 ° C., more preferably 10 to 34 ° C., and further preferably 15 to 30 ° C.
  • the coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′) are simultaneously dried to form the laminate.
  • a mixed layer is formed at the interface between the coating film (x1 ′) and the coating film (y ′), and the adhesive resin in the coating film (x1 ′) and the resin in the coating film (y ′) are separated.
  • a mixed layer is formed at the interface with the resin, and the resin in the coating film (y ′) and the adhesive resin in the coating film (x2 ′) are dried and cured in a state where they are entangled with each other. ) And the pressure-sensitive adhesive layer (X2) are considered to be improved.
  • the drying temperature of the coating film in the step (2B) is preferably 60 to 150 ° C, more preferably 70 to 145 ° C, still more preferably 80 to 140 ° C, and still more preferably 90 to 135 ° C.
  • the pressure-sensitive adhesive sheet of the present invention is useful as a temporary fixing means for an object during the manufacturing process of building materials, interior materials, electronic components, and the like, and is preferably used as a temporary fixing means for a semiconductor chip during the manufacturing process of a semiconductor device.
  • a semiconductor package (FOWLP (Fan out Wafer) in which a rewiring layer is provided on the surface of a semiconductor chip sealed with a sealing resin, and solder balls and the semiconductor chip are electrically connected via the rewiring layer. It can be suitably used as a temporary fixing means at the time of manufacturing (called Level Package).
  • ⁇ Thickness of laminate> It was measured using a constant pressure thickness measuring instrument (model number: “PG-02J”, standard: conforming to JIS K6783, Z1702, Z1709) manufactured by Teclock Co., Ltd. Specifically, after measuring the total thickness of the pressure-sensitive adhesive sheet to be measured, a value obtained by subtracting the thickness of the release material measured in advance was defined as “the thickness of the laminate”.
  • the particle distribution of the thermally expandable particles before expansion at 23 ° C. was measured using a laser diffraction particle size distribution measuring apparatus (for example, product name “Mastersizer 3000” manufactured by Malvern).
  • the particle diameters corresponding to 50% and 90% of the cumulative volume frequency calculated from the smaller particle diameter of the particle distribution are expressed as “average particle diameter (D 50 ) of thermally expandable particles” and “thermally expandable particles”, respectively.
  • Laminate sample (heavy release film / thermally expandable substrate / light release film) so that the thickness of the heat expandable substrate to be measured is 20 ⁇ m in a state of being sandwiched between the later described heavy release film and light release film It was created.
  • the prepared sample was cut into a square with a side of 10 mm and then allowed to stand for 24 hours in an environment of 23 ° C. and 50% RH (relative humidity) to remove the light release film and the heavy release film as a test sample. Then, in an environment of 23 ° C.
  • the probe tack value on the surface of the test sample is calculated.
  • a tacking tester manufactured by Nippon Special Instrument Co., Ltd., product name “NTS-4800”
  • NTS-4800 50% RH (relative humidity)
  • the probe tack value on the surface of the test sample is calculated.
  • ⁇ Storage elastic modulus E 'of thermally expandable substrate> The thermal expansible substrate to be measured was 5 mm long ⁇ 30 mm wide ⁇ 200 ⁇ m thick, and the sample from which the release material was removed was used as a test sample. Using a dynamic viscoelasticity measuring apparatus (TA Instruments, product name “DMAQ800”), a test start temperature of 0 ° C., a test end temperature of 300 ° C., a temperature increase rate of 3 ° C./min, a frequency of 1 Hz, and an amplitude of 20 ⁇ m Under the conditions, the storage elastic modulus E ′ of the test sample at a predetermined temperature was measured.
  • DMAQ800 dynamic viscoelasticity measuring apparatus
  • the adhesive strength after heating at a temperature equal to or higher than the expansion start temperature was also measured at a pulling rate of 300 mm / min by a 180 ° peeling method based on JIS Z0237: 2000.
  • the adhesive force was set to 0 (N / 25mm).
  • Acrylic copolymer (i): having a structural unit derived from a raw material monomer consisting of 2-ethylhexyl acrylate (2EHA) / 2-hydroxyethyl acrylate (HEA) 80.0 / 20.0 (mass ratio), A solution containing an acrylic copolymer having a Mw of 600,000. Diluting solvent: ethyl acetate, solid content concentration: 40% by mass.
  • Acrylic copolymer (ii): n-butyl acrylate (BA) / methyl methacrylate (MMA) / 2-hydroxyethyl acrylate (HEA) / acrylic acid 86.0 / 8.0 / 5.0 / 1.
  • Heavy release film manufactured by Lintec Corporation, product name “SP-PET382150”, a polyethylene terephthalate (PET) film provided with a release agent layer formed from a silicone release agent on one side, thickness: 38 ⁇ m.
  • Light release film manufactured by Lintec Co., Ltd., product name “SP-PET381031”, a PET film provided with a release agent layer formed from a silicone release agent on one side, thickness: 38 ⁇ m.
  • composition (x1) The isocyanate-based crosslinking agent (i) 5.0 parts by mass (solid content ratio) is blended with 100 parts by mass of the solid content of the acrylic copolymer (i), which is an adhesive resin, and diluted with toluene. It stirred uniformly and the composition (x1) of solid content concentration (active ingredient density
  • composition (x2) The isocyanate-based crosslinking agent (i) 0.8 parts by mass (solid content ratio) is blended with 100 parts by mass of the acrylic copolymer (ii), which is an adhesive resin, and diluted with toluene, It stirred uniformly and the composition (x2) of 25 mass% of solid content concentration (active ingredient density
  • composition (y) With respect to 100 parts by mass of the solid content of the solution of the acrylic urethane resin obtained in (2) above, 6.3 parts by mass of the isocyanate-based crosslinking agent (i) (solid content ratio) ), 1.4 parts by weight (solid content ratio) of dioctyltin bis (2-ethylhexanoate) as a catalyst, and the thermally expandable particles (i) are diluted with toluene, stirred uniformly, A composition (y) having a solid content concentration (active ingredient concentration) of 30% by mass was prepared. In addition, content of the thermally expansible particle (i) with respect to the whole quantity (100 mass%) of the active ingredient in the obtained composition (y) was 20 mass%.
  • Example 1 Formation of coating film On the release agent layer of the heavy release film as a release material, the composition (x1) prepared in Production Example 1, the composition (y) prepared in Production Example 3, and Production Example 2 The composition (x2) prepared in (1) was simultaneously applied in this order using a multilayer die coater (width: 250 mm), and the coating film (x1 ′), coating film (y ′) and coating film (x2 ′) were formed. They were formed simultaneously in this order.
  • (2) Drying treatment The formed coating film (x1 ′), coating film (y ′) and coating film (x2 ′) are simultaneously dried at a drying temperature of 125 ° C. for 60 seconds, and sequentially from the release agent layer of the heavy release film.
  • a layered body in which the layer (X1), the layer (Y), and the layer (X2) were directly stacked was formed. And the release agent layer of the light release film was laminated
  • Example 2 The composition (x1), the composition (y), and the composition (x2) were formed so that the thicknesses of the layer (X1), the layer (Y), and the layer (X2) were as shown in Table 1, respectively.
  • a pressure-sensitive adhesive sheet of Example 2 was obtained using the same method as Example 1 except that the coating amount was changed.
  • a coating film (x1 ′) composed of the composition (x1) prepared in Production Example 1 is formed and dried at a drying temperature of 110 ° C. for 120 seconds, and the layer (X1 ) Was formed.
  • the coating film (y ') which consists of a composition (y) prepared by manufacture example 3 is formed on the release agent layer of the light release film prepared separately from the release film on layer (X1), and drying temperature It was dried at 110 ° C. for 120 seconds to form a layer (Y).
  • a coating film (x2 ′) is formed and dried at a drying temperature of 110 ° C. for 120 seconds, Layer (X2) was formed. Then, the layer (Y) is laminated on the surface of the exposed layer (X1), the light release film on the layer (Y) is removed, and the layer (Y) is exposed on the surface. (X2) was laminated
  • the thickness of the laminated body which the adhesive sheet produced in the Example and the comparative example has, and the thickness of the layer (X1), layer (Y), and layer (X2) which comprise the said laminated body are used for the above-mentioned method. Measured in conformity. The measurement results are shown in Table 1.
  • the pressure-sensitive adhesive sheets of Examples 1 and 2 have good interfacial adhesion, and further have good adhesive strength before heating, but to the extent that they cannot be measured after heating at or above the expansion start temperature. Since the adhesive force was lowered, it was proved that the film could be easily peeled with a slight force during peeling.

Abstract

Provided is an adhesive sheet comprising a layered body in which an adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly layered in this order. The layered body is formed by directly layering, in this order, a material for forming the adhesive layer (X1), namely, a coating film (x1') comprising a composition (x1) containing an adhesive resin, and a material for forming the thermally expandable substrate (Y), namely, a coating film (y') comprising a composition (y) containing a resin and thermally expandable particles, then simultaneously drying the coating film (x1') and the coating film (y'). The adhesive sheet leaves little adhesive residue on the surface of an adherend after being heated and peeled off, has good interfacial adhesion between the substrate and the adhesive layer, and exhibits excellent adhesion during temporary fixing and excellent peelability when heated.

Description

粘着シートAdhesive sheet
 本発明は粘着シートに関する。 The present invention relates to an adhesive sheet.
 粘着シートは、部材を半永久的に固定する用途だけでなく、建材、内装材、電子部品等を加工する際にこれらを仮固定するための仮固定用途に使用される場合がある。このような仮固定用途の粘着シートには、使用時の接着性と、使用後の剥離性との両立が要求される。
 従来、上述の要求を満たす仮固定用途の粘着シートとして、基材上に熱膨張性粒子を含む粘着剤層を設けた加熱剥離型粘着シートが知られている。加熱剥離型粘着シートは、加熱により熱膨張性粒子を発泡又は膨張させることで接着力が低下し、被着体より容易に剥離できるという特徴を有する。そのため、電子部品の製造工程時における仮固定手段やリサイクル用ラベル等として用いられている。
The pressure-sensitive adhesive sheet may be used not only for semi-permanent fixing of members but also for temporary fixing for temporarily fixing building materials, interior materials, electronic parts and the like. Such a pressure-sensitive adhesive sheet for temporarily fixing is required to satisfy both adhesiveness at the time of use and peelability after use.
Conventionally, a heat-peelable pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer containing thermally expandable particles is provided on a base material is known as a pressure-sensitive adhesive sheet for temporary fixing that satisfies the above-described requirements. The heat-peelable pressure-sensitive adhesive sheet has a feature that the adhesive force is reduced by foaming or expanding the thermally expandable particles by heating, and can be easily peeled off from the adherend. For this reason, it is used as a temporary fixing means, a recycling label, etc. during the manufacturing process of the electronic component.
 例えば、特許文献1には、基材の少なくとも片側に熱膨張性微小球を含有する熱膨張性粘着層が設けられた加熱剥離型粘着シートであって、熱膨張性粘着層の厚さに対して該粘着層に添加する熱膨張性微小球の最大粒径を調整することにより、加熱前の熱膨張性粘着層表面の中心線平均粗さを0.4μm以下に設定したことを特徴とする電子部品切断時の仮固定用加熱剥離型粘着シートが開示されている。
 近年、電子部品の小型化が進むにつれて、粘着シートと被着体との接着面積が小さくなっており、チップ飛び等の接着不具合の発生してしまう場合があった。特許文献1に記載される加熱剥離型粘着シートは、熱膨張性粘着層の表面粗さを小さく抑えることで粘着シートとの有効な接触面積を確保でき、チップ飛び等の接着不具合の発生を防止できる旨の記載がある。
For example, Patent Document 1 discloses a heat-peelable pressure-sensitive adhesive sheet in which a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres is provided on at least one side of a substrate, and the thickness of the heat-expandable pressure-sensitive adhesive layer The center line average roughness of the surface of the thermally expandable adhesive layer before heating is set to 0.4 μm or less by adjusting the maximum particle size of the thermally expandable microspheres added to the adhesive layer. A heat-peelable pressure-sensitive adhesive sheet for temporary fixing at the time of cutting an electronic component is disclosed.
In recent years, as electronic components have been miniaturized, the adhesion area between the pressure-sensitive adhesive sheet and the adherend has been reduced, and there have been cases where adhesion defects such as chip skipping have occurred. The heat-peelable pressure-sensitive adhesive sheet described in Patent Document 1 can secure an effective contact area with the pressure-sensitive adhesive sheet by suppressing the surface roughness of the heat-expandable pressure-sensitive adhesive layer, and prevents the occurrence of adhesive defects such as chip jumping. There is a statement that it can be done.
特許第3594853号公報Japanese Patent No. 3594853
 従来の加熱剥離型粘着シートは、加熱により熱膨張性粒子を発泡又は膨張させることにより、当該熱膨張性粒子を含む粘着剤層が膨張する。この粘着剤層の膨張により、被着体と接触している粘着剤層の表面が凹凸状に変形して、粘着剤層と被着体との接着面積が減少する。その結果、粘着剤層による接着力が減少し、粘着シートを容易に被着体から剥離することができる。
 しかしながら、加熱により熱膨張性粒子が発泡又は膨張した際に、当該熱膨張性粒子を含む粘着剤層の内部での破壊、即ち、粘着剤層の凝集破壊が起こりやすい。その結果、加熱剥離後の被着体表面に粘着剤が残るという問題(所謂、糊残り)が懸念される。
 また、基材と粘着剤層の間の密着性が悪い場合には、加熱によって熱膨張性粘着層を膨張させた際に、基材と粘着剤層の間での望まない剥離を引き起こす可能性もある。
The conventional heat-peelable pressure-sensitive adhesive sheet expands the pressure-sensitive adhesive layer containing the thermally expandable particles by foaming or expanding the thermally expandable particles by heating. Due to the expansion of the pressure-sensitive adhesive layer, the surface of the pressure-sensitive adhesive layer in contact with the adherend is deformed into an uneven shape, and the adhesion area between the pressure-sensitive adhesive layer and the adherend is reduced. As a result, the adhesive force by the pressure-sensitive adhesive layer is reduced, and the pressure-sensitive adhesive sheet can be easily peeled off from the adherend.
However, when the heat-expandable particles are foamed or expanded by heating, destruction inside the pressure-sensitive adhesive layer containing the heat-expandable particles, that is, cohesive failure of the pressure-sensitive adhesive layer is likely to occur. As a result, there is a concern that the adhesive remains on the adherend surface after heat peeling (so-called adhesive residue).
In addition, when the adhesion between the base material and the pressure-sensitive adhesive layer is poor, when the heat-expandable pressure-sensitive adhesive layer is expanded by heating, it may cause undesired peeling between the base material and the pressure-sensitive adhesive layer. There is also.
 さらに、特許文献1に記載される加熱剥離型粘着シートは、仮固定時の接着性を向上させる観点から熱膨張性粘着層の表面粗さを小さく抑えており、そのために熱膨張性粘着層に添加する熱膨張性微小球の粒径を小さくする設計としている。しかしながら、熱膨張性微小球の粒径を小さくし過ぎると、表面粗さが小さくなることにより、界面密着性が悪くなり、加熱剥離後の被着体表面の糊残りが懸念される。 Furthermore, the heat-peelable pressure-sensitive adhesive sheet described in Patent Document 1 suppresses the surface roughness of the heat-expandable pressure-sensitive adhesive layer from the viewpoint of improving adhesiveness at the time of temporary fixing. It is designed to reduce the particle size of the thermally expandable microspheres to be added. However, if the particle size of the heat-expandable microspheres is too small, the surface roughness becomes small, resulting in poor interfacial adhesion and concern about adhesive residue on the adherend surface after heat peeling.
 本発明は、上記のような問題点に鑑みてなされたものであって、加熱剥離後の被着体表面の糊残りが少なく、基材と粘着剤層の間の界面密着性が良好であり、仮固定時の接着性及び加熱剥離性に優れる粘着シートを提供することを目的とする。 The present invention has been made in view of the above problems, and has little adhesive residue on the adherend surface after heat peeling, and has good interface adhesion between the substrate and the pressure-sensitive adhesive layer. It aims at providing the adhesive sheet which is excellent in the adhesiveness at the time of temporary fixing, and heat peelability.
 本発明者らは、基材に熱膨張性粒子を含ませ、かつ、当該基材と粘着剤層とを含む積層体を特定の方法で形成することにより、上記課題を解決し得ることを見出し、本発明を完成させた。 The present inventors have found that the above problem can be solved by including a thermally expandable particle in a base material and forming a laminate including the base material and the pressure-sensitive adhesive layer by a specific method. The present invention has been completed.
 すなわち、本発明は、下記[1]~[8]を提供するものである。
[1]粘着剤層(X1)及び非粘着性である熱膨張性基材(Y)がこの順で直接積層されている積層体を有する粘着シートであって、
 前記積層体が、
  粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、
  熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、
をこの順で直接積層した後、塗膜(x1’)及び塗膜(y’)を同時に乾燥して形成されたものである、粘着シート。
[2]熱膨張性基材(Y)が、下記要件(1)を満たす、上記[1]に記載の粘着シート。
・要件(1):前記熱膨張性粒子の膨張開始温度(t)における、熱膨張性基材(Y)の貯蔵弾性率E’(t)が、1.0×10Pa以下である。
[3]熱膨張性基材(Y)が、下記要件(2)を満たす、上記[1]又は[2]に記載の粘着シート。
・要件(2):23℃における、熱膨張性基材(Y)の貯蔵弾性率E’(23)が、1.0×10Pa以上である。
[4]熱膨張性基材(Y)の厚さが5~140μmである、上記[1]~[3]のいずれかに記載の粘着シート。
[5]熱膨張性基材(Y)の表面におけるプローブタックの値が、50mN/5mmφ未満である、上記[1]~[4]のいずれかに記載の粘着シート。
[6]前記積層体が粘着剤層(X2)を更に含み、粘着剤層(X1)、熱膨張性基材(Y)、及び粘着剤層(X2)がこの順で直接積層されている、上記[1]~[5]のいずれに記載の粘着シート。
[7]前記積層体が、
  粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、
  熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、
  粘着剤層(X2)の形成材料である、粘着性樹脂を含む組成物(x2)からなる塗膜(x2’)と、
をこの順で直接積層した後、塗膜(x1’)、(y’)及び(x2’)を同時に乾燥して形成されたものである、上記[6]に記載の粘着シート。
[8]前記熱膨張性粒子の23℃における膨張前の平均粒子径が、3~100μmである、上記[1]~[7]のいずれかに記載の粘着シート。
That is, the present invention provides the following [1] to [8].
[1] A pressure-sensitive adhesive sheet having a laminate in which a pressure-sensitive adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly laminated in this order,
The laminate is
A coating film (x1 ′) comprising a composition (x1) containing an adhesive resin, which is a forming material of the pressure-sensitive adhesive layer (X1);
A coating film (y ′) comprising a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y),
Are laminated | stacked directly in this order, Then, a coating sheet (x1 ') and a coating film (y') are dried simultaneously, and the adhesive sheet is formed.
[2] The pressure-sensitive adhesive sheet according to [1], wherein the thermally expandable substrate (Y) satisfies the following requirement (1).
Requirement (1): The storage elastic modulus E ′ (t) of the thermally expandable substrate (Y) at the expansion start temperature (t) of the thermally expandable particles is 1.0 × 10 7 Pa or less.
[3] The pressure-sensitive adhesive sheet according to [1] or [2], wherein the thermally expandable substrate (Y) satisfies the following requirement (2).
Requirement (2): The storage elastic modulus E ′ (23) of the thermally expandable substrate (Y) at 23 ° C. is 1.0 × 10 6 Pa or more.
[4] The pressure-sensitive adhesive sheet according to any one of [1] to [3] above, wherein the thickness of the thermally expandable substrate (Y) is 5 to 140 μm.
[5] The pressure-sensitive adhesive sheet according to any one of the above [1] to [4], wherein the probe tack value on the surface of the thermally expandable substrate (Y) is less than 50 mN / 5 mmφ.
[6] The laminate further includes an adhesive layer (X2), and the adhesive layer (X1), the thermally expandable substrate (Y), and the adhesive layer (X2) are directly laminated in this order. The pressure-sensitive adhesive sheet according to any one of [1] to [5] above.
[7] The laminate is
A coating film (x1 ′) comprising a composition (x1) containing an adhesive resin, which is a forming material of the pressure-sensitive adhesive layer (X1);
A coating film (y ′) comprising a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y),
A coating film (x2 ′) comprising a composition (x2) containing an adhesive resin, which is a material for forming the adhesive layer (X2);
Are directly laminated in this order, and then the coated sheets (x1 ′), (y ′) and (x2 ′) are simultaneously dried to form the pressure-sensitive adhesive sheet according to [6] above.
[8] The pressure-sensitive adhesive sheet according to any one of [1] to [7], wherein the thermally expandable particles have an average particle diameter before expansion at 23 ° C. of 3 to 100 μm.
 本発明の粘着シートは、加熱剥離後の被着体表面の糊残りが少なく、基材と粘着剤層の間の界面密着性が良好であり、仮固定時の接着性及び加熱剥離性に優れる。 The pressure-sensitive adhesive sheet of the present invention has little adhesive residue on the adherend surface after heat peeling, has good interface adhesion between the base material and the pressure-sensitive adhesive layer, and is excellent in adhesion and heat peelability during temporary fixing. .
本発明の粘着シートの構成の一例を示す、粘着シートの断面模式図である。It is a cross-sectional schematic diagram of an adhesive sheet which shows an example of a structure of the adhesive sheet of this invention. 本発明の粘着シートの構成の一例を示す、両面粘着シートの断面模式図である。It is a cross-sectional schematic diagram of a double-sided pressure-sensitive adhesive sheet showing an example of the configuration of the pressure-sensitive adhesive sheet of the present invention.
 本発明において、「有効成分」とは、対象となる組成物に含まれる成分のうち、希釈溶媒を除いた成分を指す。
 また、質量平均分子量(Mw)は、ゲルパーミエーションクロマトグラフィー(GPC)法で測定される標準ポリスチレン換算の値であり、具体的には実施例に記載の方法に基づいて測定した値である。
In the present invention, the “active ingredient” refers to a component excluding a diluent solvent among components contained in a target composition.
The mass average molecular weight (Mw) is a value in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically a value measured based on the method described in the examples.
 本発明において、例えば、「(メタ)アクリル酸」とは、「アクリル酸」と「メタクリル酸」の双方を示し、他の類似用語も同様である。
 また、好ましい数値範囲(例えば、含有量等の範囲)について、段階的に記載された下限値及び上限値は、それぞれ独立して組み合わせることができる。例えば、「好ましくは10~90、より好ましくは30~60」という記載から、「好ましい下限値(10)」と「より好ましい上限値(60)」とを組み合わせて、「10~60」とすることもできる。
In the present invention, for example, “(meth) acrylic acid” indicates both “acrylic acid” and “methacrylic acid”, and the same applies to other similar terms.
Moreover, about the preferable numerical range (for example, range of content etc.), the lower limit value and upper limit value which were described in steps can be combined independently, respectively. For example, from the description “preferably 10 to 90, more preferably 30 to 60”, “preferable lower limit (10)” and “more preferable upper limit (60)” are combined to obtain “10 to 60”. You can also.
≪粘着シート≫
 本発明の粘着シートについて説明する。
 本発明の粘着シートは、粘着剤層(X1)及び非粘着性である熱膨張性基材(Y)がこの順で直接積層されている積層体を有する粘着シートである。ここで、前記積層体は、粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、をこの順で直接積層した後、塗膜(x1’)及び塗膜(y’)を同時に乾燥して形成されたものである。
 ここで、前述の「直接積層」とは、層と層とが、当該2つの層の間に他の層を介さずに、直接接触している構成を指す。即ち、本発明において、粘着剤層(X1)と熱膨張性基材(Y)とは、その間に他の層を介さずに、直接接触している。
≪Adhesive sheet≫
The pressure-sensitive adhesive sheet of the present invention will be described.
The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a laminate in which a pressure-sensitive adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly laminated in this order. Here, the laminate is a material for forming the pressure-sensitive adhesive layer (X1), and is a coating film (x1 ′) made of a composition (x1) containing a pressure-sensitive resin and a thermally expandable substrate (Y). After directly laminating the coating film (y ′) made of the composition (y) containing the resin and the heat-expandable particles, in this order, the coating film (x1 ′) and the coating film (y ′) It was formed by drying at the same time.
Here, the aforementioned “direct lamination” refers to a configuration in which a layer and a layer are in direct contact with each other without any other layer between the two layers. That is, in the present invention, the pressure-sensitive adhesive layer (X1) and the thermally expandable base material (Y) are in direct contact with no other layer interposed therebetween.
 本発明の粘着シートを被着体から剥離する際には、加熱により熱膨張性基材(Y)中の熱膨張性粒子が膨張し、熱膨張性基材(Y)の表面に凹凸が形成されると共に、その凹凸上に積層している粘着剤層(X1)も押し上げられ、粘着剤層(X1)の表面にも凹凸が形成される。そして、粘着剤層(X1)の表面に凹凸が形成されることで、被着体と粘着剤層(X1)の表面との接触面積が減少すると共に、被着体と粘着剤層(X1)の表面との間に空間が生じる。その結果、粘着剤層(X1)の表面に貼付した被着体から粘着シートをわずかな力で容易に剥離することができる。
 本発明の粘着シートにおいては、熱膨張性粒子を粘着剤層(X1)にではなく、熱膨張性基材(Y)中に含めることで、加熱による粘着剤層(X1)の凝集破壊を抑制することができる。これにより、加熱剥離後の被着体表面の糊残りを少なくすることができる。
 また、本発明の粘着シートにおいては積層体を上述のように特定の方法で形成しているため、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性が高くすることができる。これにより、熱膨張性基材(Y)中の熱膨張性粒子が膨張して、熱膨張性基材(Y)の表面に凹凸が形成されても、粘着剤層(X1)と熱膨張性基材(Y)との間での望まない剥離を抑制することができ、上述したように、粘着剤層(X1)の表面にも凹凸が形成される。
When the pressure-sensitive adhesive sheet of the present invention is peeled off from the adherend, the heat-expandable particles in the heat-expandable substrate (Y) are expanded by heating, and irregularities are formed on the surface of the heat-expandable substrate (Y). At the same time, the pressure-sensitive adhesive layer (X1) laminated on the irregularities is also pushed up, and irregularities are also formed on the surface of the pressure-sensitive adhesive layer (X1). And by forming unevenness on the surface of the pressure-sensitive adhesive layer (X1), the contact area between the adherend and the surface of the pressure-sensitive adhesive layer (X1) is reduced, and the adherend and pressure-sensitive adhesive layer (X1). There is a space between the surface of As a result, the pressure-sensitive adhesive sheet can be easily peeled off with a slight force from the adherend adhered to the surface of the pressure-sensitive adhesive layer (X1).
In the pressure-sensitive adhesive sheet of the present invention, the heat-expandable particles are not included in the pressure-sensitive adhesive layer (X1) but in the heat-expandable base material (Y), thereby suppressing cohesive failure of the pressure-sensitive adhesive layer (X1) due to heating. can do. Thereby, the adhesive residue on the adherend surface after heat peeling can be reduced.
Moreover, in the adhesive sheet of this invention, since the laminated body is formed by the specific method as mentioned above, the interface adhesiveness of an adhesive layer (X1) and a thermally expansible base material (Y) is made high. Can do. Thereby, even if the thermally expansible particle | grains in a thermally expansible base material (Y) expand | swell and an unevenness | corrugation is formed in the surface of a thermally expansible base material (Y), an adhesive layer (X1) and thermal expansibility Undesirable peeling from the base material (Y) can be suppressed, and as described above, irregularities are also formed on the surface of the pressure-sensitive adhesive layer (X1).
 図1及び図2は、本発明の粘着シートの構成の一例を示す断面模式図である。
 本発明の一態様の粘着シートの具体的な構成として、例えば、図1(a)に示すような、粘着剤層(X1)12及び熱膨張性基材(Y)11がこの順で直接積層されている積層体10を有する粘着シート1aが挙げられる。また、図1(b)に示す粘着シート1bのように、粘着剤層(X1)12の表面上に、さらに剥離材13を有する構成としてもよい。
FIG.1 and FIG.2 is a cross-sectional schematic diagram which shows an example of a structure of the adhesive sheet of this invention.
As a specific configuration of the pressure-sensitive adhesive sheet of one embodiment of the present invention, for example, as shown in FIG. 1A, a pressure-sensitive adhesive layer (X1) 12 and a thermally expandable substrate (Y) 11 are directly laminated in this order. The adhesive sheet 1a which has the laminated body 10 currently used is mentioned. Moreover, it is good also as a structure which has the peeling material 13 further on the surface of adhesive layer (X1) 12, like the adhesive sheet 1b shown in FIG.1 (b).
 本発明の別の一態様の粘着シートの具体的な構成としては、図2(a)に示すような、粘着剤層(X1)121、熱膨張性基材(Y)11、及び粘着剤層(X2)122がこの順で直接積層されている積層体10を有する両面粘着シート2aが挙げられる。また、図2(b)に示す両面粘着シート2bのように、粘着剤層(X1)121の表面上にさらに剥離材131を有し、粘着剤層(X2)122の粘着表面上にさらに剥離材132を有する構成としてもよい。
 なお、図2(b)に示す両面粘着シート2bにおいて、剥離材131を粘着剤層(X1)121から剥がす際の剥離力と、剥離材132を粘着剤層(X2)122から剥がす際の剥離力とが同程度である場合、双方の剥離材を外側へ引っ張って剥がそうとすると、粘着剤層が、2つの剥離材に伴って分断されて引き剥がされるという現象が生じることがある。
 このような現象を抑制する観点から、2つの剥離材131、132は、互いに貼付される粘着剤層からの剥離力が異なるように設計された2種の剥離材を用いることが好ましい。
As a specific configuration of the pressure-sensitive adhesive sheet of another aspect of the present invention, as shown in FIG. 2A, a pressure-sensitive adhesive layer (X1) 121, a thermally expandable substrate (Y) 11, and a pressure-sensitive adhesive layer The double-sided pressure-sensitive adhesive sheet 2a having the laminate 10 in which (X2) 122 is directly laminated in this order is exemplified. Moreover, like the double-sided pressure-sensitive adhesive sheet 2b shown in FIG. 2 (b), a release material 131 is further provided on the surface of the pressure-sensitive adhesive layer (X1) 121, and further peeled on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer (X2) 122. It is good also as a structure which has the material 132. FIG.
In addition, in the double-sided pressure-sensitive adhesive sheet 2b shown in FIG. 2 (b), the peeling force when peeling the release material 131 from the pressure-sensitive adhesive layer (X1) 121 and the peeling time when peeling the peeling material 132 from the pressure-sensitive adhesive layer (X2) 122 are removed. When the force is approximately the same, when the two release materials are pulled outward to be peeled off, a phenomenon may occur in which the pressure-sensitive adhesive layer is divided and peeled off along with the two release materials.
From the viewpoint of suppressing such a phenomenon, it is preferable to use two types of release materials designed so that the two release materials 131 and 132 have different release forces from the adhesive layer attached to each other.
 その他の粘着シートとしては、図2(a)に示す両面粘着シート2aにおいて、粘着剤層(X1)121及び粘着剤層(X2)122の一方の表面に、両面に剥離処理が施された剥離材が積層したものを、ロール状に巻いた構成を有する両面粘着シートであってもよい。 As another pressure-sensitive adhesive sheet, in the double-sided pressure-sensitive adhesive sheet 2a shown in FIG. 2 (a), one surface of the pressure-sensitive adhesive layer (X1) 121 and the pressure-sensitive adhesive layer (X2) 122 is peeled off on both surfaces. A double-sided pressure-sensitive adhesive sheet having a configuration in which materials are laminated in a roll shape may be used.
<積層体>
 本発明の粘着シートが有する積層体は、粘着剤層(X1)及び非粘着性である熱膨張性基材(Y)がこの順で直接積層されている積層体であり、粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、をこの順で直接積層した後、塗膜(x1’)及び塗膜(y’)を同時に乾燥して形成されたものである。
 本発明においては、塗膜(x1’)及び塗膜(y’)を「同時に」乾燥して積層体を形成しているため、塗膜(x1’)と塗膜(y’)を「別々に」乾燥して積層体を形成する方法と比較して、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性を高めることができる。
 粘着剤層(X1)の形成材料である組成物(x1)からなる塗膜(x1’)と、熱膨張性基材(Y)の形成材料である組成物(y)からなる塗膜(y’)とを同時に乾燥する過程で、界面付近で塗膜の混層が生じつつ、互いの組成物に含まれる樹脂の分子鎖が絡み合うことで、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性が向上するものと考えられる。
<Laminated body>
The laminate of the pressure-sensitive adhesive sheet of the present invention is a laminate in which the pressure-sensitive adhesive layer (X1) and the non-adhesive thermally expandable substrate (Y) are directly laminated in this order, and the pressure-sensitive adhesive layer (X1 ), A coating film (x1 ′) made of a composition (x1) containing an adhesive resin, and a composition containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y). The coating film (y ′) made of the product (y) is directly laminated in this order, and then the coating film (x1 ′) and the coating film (y ′) are dried at the same time.
In the present invention, since the coating film (x1 ′) and the coating film (y ′) are dried “simultaneously” to form a laminate, the coating film (x1 ′) and the coating film (y ′) are “separated”. Compared with the method of drying and forming a laminated body, the interface adhesiveness of an adhesive layer (X1) and a thermally expansible base material (Y) can be improved.
A coating film (x1 ′) made of the composition (x1) which is a forming material of the pressure-sensitive adhesive layer (X1) and a coating film (y) which is a forming material of the thermally expandable substrate (Y) (y) In the process of simultaneously drying '), a mixed layer of the coating film is formed in the vicinity of the interface, and the molecular chains of the resins contained in each composition are intertwined, so that the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate ( It is considered that the interfacial adhesion with Y) is improved.
 塗膜(x1’)と塗膜(y’)を「別々に」乾燥して積層体を形成する方法の一例としては、以下の方法が挙げられる。
 剥離フィルム等の剥離材の剥離処理面上に粘着性樹脂を含む組成物(x1)を塗布して塗膜(x1’)を形成し、その塗膜(x1’)を乾燥させて粘着剤層(X1)を形成する。また、別に用意した剥離フィルム等の剥離材の剥離処理面上に、樹脂及び熱膨張性粒子を含む組成物(y)を塗布して塗膜(y’)を形成し、その塗膜(y’)を乾燥させて熱膨張性基材(Y)を形成する。その後、粘着剤層(X1)の剥離材と接していない面と、熱膨張性基材(Y)の剥離材と接していない面と、を張り合わせて積層体を形成する。
The following method is mentioned as an example of the method of drying a coating film (x1 ') and a coating film (y') "separately", and forming a laminated body.
A composition (x1) containing an adhesive resin is applied onto a release-treated surface of a release material such as a release film to form a coating film (x1 ′), and the coating film (x1 ′) is dried to form an adhesive layer. (X1) is formed. In addition, a coating (y ′) is formed by applying a composition (y) containing a resin and thermally expandable particles on a release-treated surface of a release material such as a release film prepared separately. ') Is dried to form a thermally expandable substrate (Y). Then, the surface which is not in contact with the release material of the pressure-sensitive adhesive layer (X1) and the surface which is not in contact with the release material of the thermally expandable base material (Y) are bonded together to form a laminate.
 上述のような、塗膜(x1’)と塗膜(y’)を「別々に」乾燥して積層体を形成する方法では、粘着剤層(X1)と熱膨張性基材(Y)とが、別々に形成されたものであるため、粘着剤層(X1)と熱膨張性基材(Y)との界面密着力が低い。 In the method of forming the laminate by drying the coating film (x1 ′) and the coating film (y ′) “separately” as described above, the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) However, since they are formed separately, the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) is low.
 本発明の一態様の粘着シートが有する積層体は、好ましくは、粘着剤層(X1)の形成材料である組成物(x1)と、熱膨張性基材(Y)の形成材料である組成物(y)とを同時に塗布して、塗膜(x1’)と塗膜(y’)とをこの順で直接積層した後、塗膜(x1’)及び塗膜(y’)を同時に乾燥して形成されたものである。組成物(x1)と組成物(y)とを同時に塗布することで、各組成物を逐次塗布する場合と比べて、塗膜表面に薄膜の乾燥皮膜が形成されにくくなるため、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性をより高めることができる。 The laminate of the pressure-sensitive adhesive sheet of one embodiment of the present invention is preferably a composition (x1) that is a material for forming the pressure-sensitive adhesive layer (X1) and a material that is a material for forming the thermally expandable substrate (Y). (Y) is applied at the same time, and the coating film (x1 ′) and the coating film (y ′) are directly laminated in this order, and then the coating film (x1 ′) and the coating film (y ′) are simultaneously dried. Is formed. By applying the composition (x1) and the composition (y) at the same time, it becomes difficult to form a dry film of the thin film on the surface of the coating film as compared with the case of sequentially applying each composition. Interfacial adhesion between X1) and the thermally expandable substrate (Y) can be further increased.
 本発明の一態様の粘着シートが有する積層体は、粘着剤層(X2)を更に含み、粘着剤層(X1)、熱膨張性基材(Y)、及び粘着剤層(X2)がこの順で直接積層されている構成としてもよい。なお、粘着剤層(X2)は粘着性樹脂を含む組成物(x2)から形成された層である。
 上述の粘着剤層(X2)を更に含む積層体を形成する方法としては、例えば、組成物(x2)を加熱溶融して膨張性基材(Y)上に押出ラミネートする方法や、組成物(x2)を膨張性基材(Y)上に塗布して塗膜(x2’)を形成し、その塗膜(x2’)を乾燥して形成する方法が挙げられる。また、例えば、押出成形又は塗膜(x2’)を乾燥させる等の方法により予め作成した粘着剤層(X2)を、膨張性基材(Y)上に直接貼付してもよい。
The laminate of the pressure-sensitive adhesive sheet of one embodiment of the present invention further includes a pressure-sensitive adhesive layer (X2), and the pressure-sensitive adhesive layer (X1), the thermally expandable substrate (Y), and the pressure-sensitive adhesive layer (X2) are in this order. It is good also as a structure laminated | stacked directly by. In addition, an adhesive layer (X2) is a layer formed from the composition (x2) containing adhesive resin.
Examples of a method for forming a laminate further including the above-mentioned pressure-sensitive adhesive layer (X2) include, for example, a method in which the composition (x2) is heated and melted and extrusion-laminated on the expandable substrate (Y), or a composition ( There is a method in which x2) is applied on the expandable substrate (Y) to form a coating film (x2 ′), and the coating film (x2 ′) is dried to form. Further, for example, the pressure-sensitive adhesive layer (X2) prepared in advance by a method such as extrusion molding or drying the coating film (x2 ′) may be directly pasted on the expandable substrate (Y).
 上述の粘着剤層(X2)を更に含む積層体は、好ましくは、粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、粘着剤層(X2)の形成材料である、粘着性樹脂を含む組成物(x2)からなる塗膜(x2’)とをこの順で直接積層した後、塗膜(x1’)、(y’)及び(x2’)を同時に乾燥して形成されたものである。
 粘着剤層(X2)を更に含む積層体をこのように形成することで、上述した理由により、熱膨張性基材(Y)と粘着剤層(X2)との界面密着性も高めることができる。
The laminate further comprising the pressure-sensitive adhesive layer (X2) is preferably a coating film (x1 ′) made of a composition (x1) containing a pressure-sensitive resin, which is a material for forming the pressure-sensitive adhesive layer (X1). A coating material (y ′) composed of a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable base material (Y), and an adhesive material which is a forming material of the adhesive layer (X2) The coating film (x2 ′) composed of the composition (x2) containing the conductive resin is directly laminated in this order, and then the coating films (x1 ′), (y ′) and (x2 ′) are simultaneously dried. It is a thing.
By forming the laminate further including the pressure-sensitive adhesive layer (X2) in this manner, the interfacial adhesion between the thermally expandable base material (Y) and the pressure-sensitive adhesive layer (X2) can also be improved for the reason described above. .
 上述の粘着剤層(X2)を更に含む積層体は、より好ましくは、粘着剤層(X1)の形成材料である組成物(x1)と、熱膨張性基材(Y)の形成材料である組成物(y)と、粘着剤層(X2)の形成材料である組成物(x2)とを同時に塗布して、塗膜(x1’)、(y’)及び(x2’)をこの順で直接積層した後、塗膜(x1’)、(y’)及び(x2’)を同時に乾燥して形成されたものである。
 粘着剤層(X2)を更に含む積層体をこのように形成することで、上述した理由により、熱膨張性基材(Y)と粘着剤層(X2)との界面密着性もより高めることができる。
The laminate further including the pressure-sensitive adhesive layer (X2) is more preferably a composition (x1) which is a material for forming the pressure-sensitive adhesive layer (X1) and a material for forming the heat-expandable base material (Y). The composition (y) and the composition (x2), which is a material for forming the pressure-sensitive adhesive layer (X2), are applied simultaneously, and the coating films (x1 ′), (y ′), and (x2 ′) are applied in this order. After the direct lamination, the coating films (x1 ′), (y ′) and (x2 ′) are dried at the same time.
By forming the laminated body further including the pressure-sensitive adhesive layer (X2) in this manner, the interfacial adhesion between the thermally expandable base material (Y) and the pressure-sensitive adhesive layer (X2) can be further improved for the reason described above. it can.
 なお、本発明において、粘着シートが有する積層体を、前述のとおり製造方法にて特定しているが、そのような製造方法による特定をせざるを得ない事情が存在する。
 粘着剤層(X1)と熱膨張性基材(Y)との界面について、客観的な物性値による評価として、例えば、積層体の厚さ方向に切断した断面における粘着剤層(X1)と熱膨張性基材(Y)との界面を、電子顕微鏡等を用いて観察することで、界面の粗さを測定する方法が考えられる。しかしながら、当該界面の粗さは、微少であるため、正確に測定することができず、また、観察する領域による粗さの状態の相違が非常に大きい。そのため、界面の粗さ等の特定の物性値による評価が極めて難しい。
 また、粘着剤層(X1)に含まれる粘着性樹脂や、熱膨張性基材(Y)に含まれる樹脂の種類によっては、電子顕微鏡等を用いて、粘着剤層(X1)と熱膨張性基材(Y)との界面を観察しようとしても、界面が不明瞭となり、そもそも粗さの測定自体が困難となる場合がある。
 さらに、積層体の断面を得るために、積層体を厚さ方向に切断する際に、当該積層体は樹脂から形成されているものであるため、粘着剤層(X1)と熱膨張性基材(Y)との界面の形状が崩れてしまい、当該界面の状態を正確に評価できないという事情も存在する。
 このような事情から、本発明においては、粘着シートが有する積層体を、上述のとおり製造方法にて特定している。
 なお、積層体が、粘着剤層(X1)、熱膨張性基材(Y)、及び粘着剤層(X2)がこの順で直接積層されている構成であって、塗膜(x1’)と(y’)と(x2’)とをこの順で直接積層した後、塗膜(x1’)、(y’)及び(x2’)を同時に乾燥して形成されたものである場合についても、粘着剤層(X1)と熱膨張性基材(Y)との界面及び熱膨張性基材(Y)と粘着剤層(X2)との界面について、上記と同様の事情が存在し、そのような製造方法による特定をせざるを得ない。
In addition, in this invention, although the laminated body which an adhesive sheet has is specified by the manufacturing method as mentioned above, the situation which must specify by such a manufacturing method exists.
Regarding the interface between the pressure-sensitive adhesive layer (X1) and the heat-expandable substrate (Y), as an evaluation based on objective physical property values, for example, the pressure-sensitive adhesive layer (X1) and heat in a cross section cut in the thickness direction of the laminate A method for measuring the roughness of the interface by observing the interface with the expandable substrate (Y) using an electron microscope or the like can be considered. However, since the roughness of the interface is very small, it cannot be measured accurately, and the difference in the roughness state depending on the region to be observed is very large. Therefore, it is extremely difficult to evaluate with specific physical property values such as interface roughness.
Further, depending on the type of the adhesive resin contained in the adhesive layer (X1) and the resin contained in the thermally expandable substrate (Y), the adhesive layer (X1) and the thermally expandable material can be obtained using an electron microscope or the like. Even if it is attempted to observe the interface with the substrate (Y), the interface may become unclear, and the roughness measurement itself may be difficult in the first place.
Furthermore, when the laminate is cut in the thickness direction in order to obtain a cross section of the laminate, the laminate is formed of a resin, and thus the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate There is also a situation that the shape of the interface with (Y) collapses and the state of the interface cannot be accurately evaluated.
From such circumstances, in the present invention, the laminate that the pressure-sensitive adhesive sheet has is specified by the manufacturing method as described above.
In addition, a laminated body is the structure by which the adhesive layer (X1), the thermally expansible base material (Y), and the adhesive layer (X2) are directly laminated | stacked in this order, Comprising: With coating film (x1 ') Even when (y ′) and (x2 ′) are directly laminated in this order, and the coating films (x1 ′), (y ′) and (x2 ′) are simultaneously dried, Regarding the interface between the pressure-sensitive adhesive layer (X1) and the heat-expandable base material (Y) and the interface between the heat-expandable base material (Y) and the pressure-sensitive adhesive layer (X2), the same circumstances as described above exist, and as such It must be specified by a simple manufacturing method.
 なお、本発明において、「塗膜」とは、公知の塗布方法によって、形成材料である組成物から形成された膜であって、当該膜中に含まれる溶媒等の揮発成分の残存率が、塗布前の当該組成物中に含まれる揮発成分の全量100質量%に対して、10~100質量%となる状態のものを指す。
 つまり、本発明において、塗膜(x1’)、(y’)及び(x2’)には、溶媒等の揮発成分が一定量含まれている。これら塗膜を乾燥することで、揮発成分を除去し、粘着剤層(X1)、熱膨張性基材(Y)及び粘着剤層(X2)が形成される。
In the present invention, the “coating film” is a film formed from a composition as a forming material by a known coating method, and the residual ratio of volatile components such as a solvent contained in the film is This refers to those in a state of 10 to 100% by mass with respect to 100% by mass of the total amount of volatile components contained in the composition before coating.
That is, in the present invention, the coating films (x1 ′), (y ′), and (x2 ′) contain a certain amount of a volatile component such as a solvent. By drying these coating films, the volatile components are removed, and the pressure-sensitive adhesive layer (X1), the thermally expandable substrate (Y), and the pressure-sensitive adhesive layer (X2) are formed.
 なお、塗膜(x1’)、(y’)及び(x2’)を形成する方法、及び形成した塗膜の乾燥条件については、それぞれ、後述の「粘着シートの製造方法」の項目に記載のとおりである。 In addition, about the method of forming a coating film (x1 '), (y'), and (x2 '), and the drying conditions of the formed coating film, respectively, it describes in the item of the below-mentioned "manufacturing method of an adhesive sheet". It is as follows.
 本発明の粘着シートが有する積層体の厚さとしては、好ましくは10~150μm、より好ましくは15~125μm、更に好ましくは20~100μm、より更に好ましくは25~75μmである。 The thickness of the laminate of the pressure-sensitive adhesive sheet of the present invention is preferably 10 to 150 μm, more preferably 15 to 125 μm, still more preferably 20 to 100 μm, and still more preferably 25 to 75 μm.
 本発明の粘着シートが有する粘着剤層(X1)の厚さは、優れた粘着力を発現させる観点、及び、加熱処理による熱膨張性基材(Y)中の熱膨張性粒子の膨張により、粘着剤層(X1)の表面に凹凸を形成し易くする観点から、好ましくは1~60μm、より好ましくは2~50μm、更に好ましくは3~40μm、より更に好ましくは5~30μmである。 The thickness of the pressure-sensitive adhesive layer (X1) of the pressure-sensitive adhesive sheet of the present invention is based on the viewpoint of developing an excellent pressure-sensitive adhesive force, and the expansion of the heat-expandable particles in the heat-expandable substrate (Y) by heat treatment. From the viewpoint of easily forming irregularities on the surface of the pressure-sensitive adhesive layer (X1), the thickness is preferably 1 to 60 μm, more preferably 2 to 50 μm, still more preferably 3 to 40 μm, and still more preferably 5 to 30 μm.
 本発明の粘着シートが有する熱膨張性基材(Y)の厚さは、好ましくは5~140μm、より好ましくは9~110μm、更に好ましくは13~80μm、より更に好ましくは17~50μmである。 The thickness of the heat-expandable base material (Y) of the pressure-sensitive adhesive sheet of the present invention is preferably 5 to 140 μm, more preferably 9 to 110 μm, still more preferably 13 to 80 μm, and still more preferably 17 to 50 μm.
 本発明の一態様の粘着シートが有する積層体が粘着剤層(X2)を更に含む場合、優れた粘着力を発現させる観点、及び、加熱処理による熱膨張性基材(Y)中の熱膨張性粒子の膨張により、粘着剤層(X2)の表面に凹凸を形成し易くする観点から、好ましくは1~60μm、より好ましくは2~50μm、更に好ましくは3~40μm、より更に好ましくは5~30μmである。 When the laminated body which the adhesive sheet of 1 aspect of this invention further contains an adhesive layer (X2), the viewpoint which expresses the outstanding adhesive force, and the thermal expansion in the thermally expansible base material (Y) by heat processing From the viewpoint of easily forming irregularities on the surface of the pressure-sensitive adhesive layer (X2) due to the expansion of the adhesive particles, it is preferably 1 to 60 μm, more preferably 2 to 50 μm, still more preferably 3 to 40 μm, still more preferably 5 to 30 μm.
 本明細書において、積層体の厚さはJIS K6783、Z1702、Z1709に準拠した定圧厚さ測定器を用いて測定された値であって、具体的には実施例に記載の方法に基づいて測定された値を意味する。
 また、積層体を構成する各層の厚さは、前述の積層体の厚さと同じ方法で測定してもよく、また、例えば、積層体を厚さ方向に切断した断面を走査型電子顕微鏡で観察して、各層の厚さの比をそれぞれ測定し、前述の方法で測定した積層体の厚さから算出してもよい。
In the present specification, the thickness of the laminate is a value measured using a constant pressure thickness measuring instrument based on JIS K6783, Z1702, and Z1709, and specifically measured based on the method described in the examples. Means the value.
The thickness of each layer constituting the laminate may be measured by the same method as the thickness of the laminate described above. For example, a cross section of the laminate cut in the thickness direction is observed with a scanning electron microscope. Then, the ratio of the thickness of each layer may be measured and calculated from the thickness of the laminate measured by the method described above.
 本発明の粘着シートが有する積層体において、23℃における、熱膨張性基材(Y)の厚さと粘着剤層(X1)の厚さとの比(熱膨張性基材(Y)/粘着剤層(X1))としては、対象物の位置ズレを防止する観点から、好ましくは0.2以上、より好ましくは0.5以上、更に好ましくは1.0以上、より更に好ましくは3.0以上であり、また、剥離する際に、わずかな力で容易に剥離し得る粘着シートとする観点から、好ましくは20以下、より好ましくは15以下、更に好ましくは10以下、より更に好ましくは5以下である。
 本発明の一態様の粘着シートが有する積層体が粘着剤層(X2)を更に含む場合、23℃における、熱膨張性基材(Y)の厚さと粘着剤層(X2)の厚さとの比(熱膨張性基材(Y)/粘着剤層(X2))としても、同様の観点から、好ましくは0.2以上、より好ましくは0.5以上、更に好ましくは1.0以上、より更に好ましくは3.0以上であり、また、好ましくは20以下、より好ましくは15以下、更に好ましくは10以下、より更に好ましくは5以下である。
In the laminate of the pressure-sensitive adhesive sheet of the present invention, the ratio of the thickness of the heat-expandable base material (Y) and the thickness of the pressure-sensitive adhesive layer (X1) at 23 ° C. (heat-expandable base material (Y) / pressure-sensitive adhesive layer) (X1)) is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1.0 or more, and still more preferably 3.0 or more, from the viewpoint of preventing positional displacement of the object. In addition, from the viewpoint of forming a pressure-sensitive adhesive sheet that can be easily peeled with a slight force when peeling, it is preferably 20 or less, more preferably 15 or less, still more preferably 10 or less, and even more preferably 5 or less. .
When the laminated body which the adhesive sheet of 1 aspect of this invention further contains an adhesive layer (X2), the ratio of the thickness of a thermally expansible base material (Y) and the thickness of an adhesive layer (X2) in 23 degreeC From the same viewpoint, the (thermally expandable substrate (Y) / adhesive layer (X2)) is preferably 0.2 or more, more preferably 0.5 or more, still more preferably 1.0 or more, and still more. Preferably, it is 3.0 or more, preferably 20 or less, more preferably 15 or less, still more preferably 10 or less, and still more preferably 5 or less.
 なお、本発明の粘着シートが有する前記積層体は、前述のとおり、塗膜の乾燥過程で2つの塗膜間で混層が生じ、粘着剤層(X1)と熱膨張性基材(Y)との界面、及び、熱膨張性基材(Y)と粘着剤層(X2)との界面が、消失する程に不明瞭となる場合がある。
 2つの塗膜間及び形成された層の間に混層が生じている場合、例えば、前述したように、積層体を厚さ方向に切断した断面を走査型電子顕微鏡で観察して、各層の厚さの比をそれぞれ測定する場合であって、粘着剤層(X1)と熱膨張性基材(Y)との間に混層が生じている場合であれば、当該混層の厚さ方向の中間点を通りかつ粘着剤層(X1)の熱膨張性基材(Y)とは反対側の表面と平行な面に界面が存在するものと仮定して、各層の厚さ比を測定してもよい。
In addition, as described above, the laminate of the pressure-sensitive adhesive sheet of the present invention has a mixed layer between the two coating films in the drying process of the coating film, and the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) And the interface between the thermally expandable base material (Y) and the pressure-sensitive adhesive layer (X2) may become so unclear that they disappear.
When a mixed layer is formed between the two coating films and between the formed layers, for example, as described above, the cross section of the laminate cut in the thickness direction is observed with a scanning electron microscope to determine the thickness of each layer. When the thickness ratio is measured and a mixed layer is formed between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y), the intermediate point in the thickness direction of the mixed layer The thickness ratio of each layer may be measured on the assumption that an interface exists on a plane parallel to the surface of the pressure-sensitive adhesive layer (X1) opposite to the thermally expandable substrate (Y). .
〔熱膨張性基材(Y)〕
 本発明の粘着シートが有する熱膨張性基材(Y)は、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)を乾燥させて形成された層であり、非粘着性の基材である。
 本発明において、非粘着性の基材か否かの判断は、対象となる基材の表面に対して、JIS Z0237:1991に準拠して測定したプローブタック値が50mN/5mmφ未満であれば、当該基材を「非粘着性の基材」と判断する。
 ここで、熱膨張性基材(Y)の表面におけるプローブタック値は、通常は50mN/5mmφ未満であるが、好ましくは30mN/5mmφ未満、より好ましくは10mN/5mmφ未満、更に好ましくは5mN/5mmφ未満である。
 なお、熱膨張性基材(Y)の表面におけるプローブタック値の具体的な測定方法は、実施例に記載の方法による。
[Thermo-expandable substrate (Y)]
The heat-expandable substrate (Y) of the pressure-sensitive adhesive sheet of the present invention is a layer formed by drying a coating film (y ′) made of a composition (y) containing a resin and heat-expandable particles, It is an adhesive substrate.
In the present invention, whether or not the non-adhesive substrate is determined if the probe tack value measured in accordance with JIS Z0237: 1991 is less than 50 mN / 5 mmφ with respect to the surface of the target substrate. The said base material is judged as a "non-adhesive base material".
Here, the probe tack value on the surface of the thermally expandable substrate (Y) is usually less than 50 mN / 5 mmφ, preferably less than 30 mN / 5 mmφ, more preferably less than 10 mN / 5 mmφ, and even more preferably 5 mN / 5 mmφ. Is less than.
In addition, the specific measuring method of the probe tack value in the surface of a thermally expansible base material (Y) is based on the method as described in an Example.
 本発明の粘着シートが有する熱膨張性基材(Y)は、非粘着性の基材であって、下記要件(1)を満たすものが好ましい。
・要件(1):前記熱膨張性粒子の膨張開始温度(t)における、熱膨張性基材(Y)の貯蔵弾性率E’(t)が、1.0×10Pa以下である。
 なお、本明細書において、所定の温度における熱膨張性基材(Y)の貯蔵弾性率E’は、実施例に記載の方法により測定された値を意味する。
 上記要件(1)は、粘着シートの剥離時における、熱膨張性基材(Y)の貯蔵弾性率E’を規定したものである。
 本発明の粘着シートを被着体から剥離する際には、熱膨張性粒子の膨張開始温度(t)以上の温度まで加熱することで、熱膨張性基材(Y)中の熱膨張性粒子が膨張し、熱膨張性基材(Y)の表面に凹凸が形成されると共に、その凹凸上に積層している粘着剤層(X1)も押し上げられ、粘着表面にも凹凸を形成させる。
 そして、粘着剤層(X1)の粘着表面に凹凸を形成させることで、被着体と粘着表面との接触面積が減少すると共に、被着体と粘着表面との間に空間が生じることで、被着体から粘着シートをわずかな力で容易に剥離することができる。
The heat-expandable substrate (Y) that the pressure-sensitive adhesive sheet of the present invention has is preferably a non-adhesive substrate that satisfies the following requirement (1).
Requirement (1): The storage elastic modulus E ′ (t) of the thermally expandable substrate (Y) at the expansion start temperature (t) of the thermally expandable particles is 1.0 × 10 7 Pa or less.
In the present specification, the storage elastic modulus E ′ of the thermally expandable substrate (Y) at a predetermined temperature means a value measured by the method described in the examples.
The said requirement (1) prescribes | regulates the storage elastic modulus E 'of a thermally expansible base material (Y) at the time of peeling of an adhesive sheet.
When the pressure-sensitive adhesive sheet of the present invention is peeled from the adherend, the heat-expandable particles in the heat-expandable substrate (Y) are heated to a temperature equal to or higher than the expansion start temperature (t) of the heat-expandable particles. Expands and irregularities are formed on the surface of the heat-expandable substrate (Y), and the pressure-sensitive adhesive layer (X1) laminated on the irregularities is also pushed up to form irregularities on the adhesive surface.
And by forming unevenness on the adhesive surface of the pressure-sensitive adhesive layer (X1), the contact area between the adherend and the adhesive surface is reduced, and a space is created between the adherend and the adhesive surface. The pressure-sensitive adhesive sheet can be easily peeled off from the adherend with a slight force.
 ところで、粘着シートの剥離性を向上させるには、膨張開始温度(t)以上の温度まで加熱した際に、粘着剤層(X1)の粘着表面に凹凸が形成され易くする必要がある。そのためには、熱膨張性基材(Y)に含まれる熱膨張性粒子が膨張し易く調整されている必要がある。 Incidentally, in order to improve the peelability of the pressure-sensitive adhesive sheet, it is necessary to make it easy to form irregularities on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer (X1) when heated to a temperature equal to or higher than the expansion start temperature (t). For that purpose, it is necessary that the heat-expandable particles contained in the heat-expandable base material (Y) are adjusted so as to easily expand.
 上記要件(1)では、熱膨張性粒子の膨張開始温度(t)における、熱膨張性基材の貯蔵弾性率E’(t)を規定しているが、当該規定は、熱膨張性粒子が膨張する直前の熱膨張性基材の剛性を示す指標ともいえる。
 つまり、本発明者らの検討によれば、熱膨張性粒子の膨張開始温度(t)における、熱膨張性基材(Y)の貯蔵弾性率E’(t)が1.0×10Pa以下とすることで、膨張開始温度(t)以上の温度まで加熱して熱膨張性粒子の膨張しようとした場合、膨張が抑制されることなく、熱膨張性基材(Y)の表面上に積層している粘着剤層(X1)の粘着表面の凹凸を十分に形成できる。
In the above requirement (1), the storage elastic modulus E ′ (t) of the thermally expandable substrate at the expansion start temperature (t) of the thermally expandable particles is defined. It can also be said that the index indicates the rigidity of the thermally expandable substrate immediately before expansion.
That is, according to the study by the present inventors, the storage elastic modulus E ′ (t) of the thermally expandable substrate (Y) at the expansion start temperature (t) of the thermally expandable particles is 1.0 × 10 7 Pa. With the following, when heating to a temperature equal to or higher than the expansion start temperature (t) and trying to expand the thermally expandable particles, the expansion is not suppressed and the surface of the thermally expandable substrate (Y) is not suppressed. The unevenness | corrugation of the adhesion surface of the adhesive layer (X1) laminated | stacked can fully be formed.
 本発明の一態様で用いる熱膨張性基材(Y)の要件(1)で規定する貯蔵弾性率E’(t)は、上記観点から、好ましくは9.0×10Pa以下、より好ましくは8.0×10Pa以下、更に好ましくは6.0×10Pa以下、より更に好ましくは4.0×10Pa以下である。
 また、膨張した熱膨張性粒子の流動を抑制し、粘着剤層(X1)の粘着表面に形成される凹凸の形状維持性を向上させ、剥離性をより向上させる観点から、当該熱膨張性基材(Y)の要件(1)で規定する貯蔵弾性率E’(t)は、好ましくは1.0×10Pa以上、より好ましくは1.0×10Pa以上、更に好ましくは1.0×10Pa以上である。
From the above viewpoint, the storage elastic modulus E ′ (t) defined by the requirement (1) of the thermally expandable substrate (Y) used in one embodiment of the present invention is preferably 9.0 × 10 6 Pa or less, more preferably. Is 8.0 × 10 6 Pa or less, more preferably 6.0 × 10 6 Pa or less, and still more preferably 4.0 × 10 6 Pa or less.
Further, from the viewpoint of suppressing the flow of the expanded thermally expandable particles, improving the shape maintaining property of the unevenness formed on the adhesive surface of the pressure-sensitive adhesive layer (X1), and further improving the peelability, the thermally expandable group. The storage elastic modulus E ′ (t) defined by the requirement (1) of the material (Y) is preferably 1.0 × 10 3 Pa or more, more preferably 1.0 × 10 4 Pa or more, and still more preferably 1. 0 × 10 5 Pa or more.
 また、本発明の一態様の粘着シートが有する熱膨張性基材(Y)は、さらに下記要件(2)を満たすものであることが好ましい。
・要件(2):23℃における、熱膨張性基材(Y)の貯蔵弾性率E’(23)が、1.0×10Pa以上である。
Moreover, it is preferable that the thermally expansible base material (Y) which the adhesive sheet of 1 aspect of this invention has further satisfy | fills the following requirements (2).
Requirement (2): The storage elastic modulus E ′ (23) of the thermally expandable substrate (Y) at 23 ° C. is 1.0 × 10 6 Pa or more.
 上記要件(2)を満たす熱膨張性基材(Y)を用いることで、半導体チップ等の対象物を貼付する際の位置ズレを防止することができる。また、対象物を貼付する際に、粘着剤層への過度な沈み込みを防止することもできる。 By using the heat-expandable base material (Y) that satisfies the above requirement (2), it is possible to prevent positional deviation when attaching an object such as a semiconductor chip. Moreover, when a target object is stuck, excessive sinking into the pressure-sensitive adhesive layer can also be prevented.
 上記観点から、上記要件(2)で規定する熱膨張性基材(Y)の貯蔵弾性率E’(23)は、好ましくは5.0×10~5.0×1012Pa、より好ましくは1.0×10~1.0×1012Pa、更に好ましくは5.0×10~1.0×1011Pa、より更に好ましくは1.0×10~1.0×1010Paである。 From the above viewpoint, the storage elastic modulus E ′ (23) of the thermally expandable substrate (Y) defined by the requirement (2) is preferably 5.0 × 10 6 to 5.0 × 10 12 Pa, more preferably Is 1.0 × 10 7 to 1.0 × 10 12 Pa, more preferably 5.0 × 10 7 to 1.0 × 10 11 Pa, and still more preferably 1.0 × 10 8 to 1.0 × 10 10. 10 Pa.
 熱膨張性基材(Y)の形成材料である組成物(y)は、樹脂及び熱膨張性粒子を含む。なお、本発明の一態様において、本発明の効果を損なわない範囲で、必要に応じて、希釈溶媒及び/又は一般的な粘着シートが有する基材に含まれる基材用添加剤を含有してもよい。 The composition (y), which is a material for forming the thermally expandable substrate (Y), contains a resin and thermally expandable particles. In addition, in one mode of the present invention, in the range which does not impair the effect of the present invention, it contains the additive for the substrate contained in the substrate which the diluting solvent and / or the general adhesive sheet has as needed. Also good.
(熱膨張性粒子)
 本発明で用いる熱膨張性粒子としては、公知の熱膨張性粒子を使用することができ、粘着シートの用途に応じて適宜選択される。
 熱膨張性粒子は、熱可塑性樹脂から構成された外殻と、当該外殻に内包され、且つ所定の温度まで加熱されると気化する内包成分とから構成される、マイクロカプセル化発泡剤であることが好ましい。
 マイクロカプセル化発泡剤の外殻を構成する熱可塑性樹脂としては、例えば、塩化ビニリデン-アクリロニトリル共重合体、ポリビニルアルコール、ポリビニルブチラール、ポリメチルメタクリレート、ポリアクリロニトリル、ポリ塩化ビニリデン、ポリスルホン等が挙げられる。
(Thermally expandable particles)
As the heat-expandable particles used in the present invention, known heat-expandable particles can be used, and are appropriately selected according to the use of the pressure-sensitive adhesive sheet.
The thermally expandable particle is a microencapsulated foaming agent composed of an outer shell made of a thermoplastic resin and an encapsulated component encapsulated in the outer shell and vaporized when heated to a predetermined temperature. It is preferable.
Examples of the thermoplastic resin constituting the outer shell of the microencapsulated foaming agent include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.
 外殻に内包された内包成分としては、例えば、プロパン、ブタン、ペンタン、ヘキサン、ヘプタン、オクタン、ノナン、デカン、イソブタン、イソペンタン、イソヘキサン、イソヘプタン、イソオクタン、イソノナン、イソデカン、シクロプロパン、シクロブタン、シクロペンタン、シクロヘキサン、シクロヘプタン、シクロオクタン、ネオペンタン、ドデカン、イソドデカン、シクロトリデカン、ヘキシルシクロヘキサン、トリデカン、テトラデカン、ペンタデカン、ヘキサデカン、ヘプタデカン、オクタデカン、ナノデカン、イソトリデカン、4-メチルドデカン、イソテトラデカン、イソペンタデカン、イソヘキサデカン、2,2,4,4,6,8,8-ヘプタメチルノナン、イソヘプタデカン、イソオクタデカン、イソナノデカン、2,6,10,14-テトラメチルペンタデカン、シクロトリデカン、ヘプチルシクロヘキサン、n-オクチルシクロヘキサン、シクロペンタデカン、ノニルシクロヘキサン、デシルシクロヘキサン、ペンタデシルシクロヘキサン、ヘキサデシルシクロヘキサン、ヘプタデシルシクロヘキサン、オクタデシルシクロヘキサン等が挙げられる。
 これらの内包成分は、単独で用いてもよく、2種以上を併用してもよい。
Examples of the inclusion component contained in the outer shell include propane, butane, pentane, hexane, heptane, octane, nonane, decane, isobutane, isopentane, isohexane, isoheptane, isooctane, isononane, isodecane, cyclopropane, cyclobutane, cyclopentane. , Cyclohexane, cycloheptane, cyclooctane, neopentane, dodecane, isododecane, cyclotridecane, hexylcyclohexane, tridecane, tetradecane, pentadecane, hexadecane, heptadecane, octadecane, nanodecane, isotridecane, 4-methyldodecane, isotetradecane, isopentadecane, iso Hexadecane, 2,2,4,4,6,8,8-heptamethylnonane, isoheptadecane, isooctadecane, isonanodecane, , 6,10,14-tetramethylpentadecane, cyclotridecane, heptylcyclohexane, n-octylcyclohexane, cyclopentadecane, nonylcyclohexane, decylcyclohexane, pentadecylcyclohexane, hexadecylcyclohexane, heptadecylcyclohexane, octadecylcyclohexane, etc. .
These encapsulated components may be used alone or in combination of two or more.
 本発明の一態様で用いる、熱膨張性粒子の23℃における膨張前の平均粒子径は、好ましくは3~100μm、より好ましくは4~70μm、更に好ましくは6~60μm、より更に好ましくは10~50μmである。
 なお、熱膨張性粒子の膨張前の平均粒子径とは、体積中位粒子径(D50)であり、レーザ回折式粒度分布測定装置(例えば、Malvern社製、製品名「マスターサイザー3000」)を用いて測定した、膨張前の熱膨張性粒子の粒子分布において、膨張前の熱膨張性粒子の粒子径の小さい方から計算した累積体積頻度が50%に相当する粒子径を意味する。
The average particle diameter of the thermally expandable particles before expansion at 23 ° C. used in one embodiment of the present invention is preferably 3 to 100 μm, more preferably 4 to 70 μm, still more preferably 6 to 60 μm, still more preferably 10 to 50 μm.
The average particle diameter before expansion of the thermally expandable particles is the volume-median particle diameter (D 50 ), and is a laser diffraction particle size distribution measuring device (for example, product name “Mastersizer 3000” manufactured by Malvern). In the particle distribution of the heat-expandable particles before expansion measured by means of a particle diameter, the cumulative volume frequency calculated from the smaller particle diameter of the heat-expandable particles before expansion means a particle diameter corresponding to 50%.
 本発明の一態様で用いる、熱膨張性粒子の23℃における膨張前の90%粒子径(D90)としては、好ましくは10~150μm、より好ましくは20~100μm、更に好ましくは25~90μm、より更に好ましくは30~80μmである。
 なお、熱膨張性粒子の膨張前の90%粒子径(D90)とは、レーザ回折式粒度分布測定装置(例えば、Malvern社製、製品名「マスターサイザー3000」)を用いて測定した、膨張前の熱膨張性粒子の粒子分布において、膨張前の熱膨張性粒子の粒子径の小さい方から計算した累積体積頻度が90%に相当する粒径を意味する。
The 90% particle diameter (D 90 ) before expansion at 23 ° C. of the thermally expandable particles used in one embodiment of the present invention is preferably 10 to 150 μm, more preferably 20 to 100 μm, still more preferably 25 to 90 μm, More preferably, it is 30 to 80 μm.
The 90% particle diameter (D 90 ) before expansion of the thermally expandable particles is the expansion measured by using a laser diffraction particle size distribution measuring apparatus (for example, product name “Mastersizer 3000” manufactured by Malvern). In the particle distribution of the previous thermally expandable particles, it means a particle diameter corresponding to 90% of the cumulative volume frequency calculated from the smaller particle diameter of the thermally expandable particles before expansion.
 本発明で用いる熱膨張性粒子は、膨張開始温度(t)が120~250℃に調整された粒子であることが好ましい。熱膨張性粒子の膨張開始温度(t)は、内包成分の種類を適宜選択することで調整可能である。
 なお、本明細書において、熱膨張性粒子の膨張開始温度(t)は、以下の方法に基づき測定された値を意味する。
[熱膨張性粒子の膨張開始温度(t)の測定法]
 直径6.0mm(内径5.65mm)、深さ4.8mmのアルミカップに、測定対象となる熱膨張性粒子0.5mgを加え、その上からアルミ蓋(直径5.6mm、厚さ0.1mm)をのせた試料を作製する。
 動的粘弾性測定装置を用いて、その試料にアルミ蓋上部から、加圧子により0.01Nの力を加えた状態で、試料の高さを測定する。そして、加圧子により0.01Nの力を加えた状態で、20℃から300℃まで10℃/minの昇温速度で加熱し、加圧子の垂直方向における変位量を測定し、正方向への変位開始温度を膨張開始温度(t)とする。
The thermally expandable particles used in the present invention are preferably particles having an expansion start temperature (t) adjusted to 120 to 250 ° C. The expansion start temperature (t) of the thermally expandable particles can be adjusted by appropriately selecting the type of inclusion component.
In the present specification, the expansion start temperature (t) of the thermally expandable particles means a value measured based on the following method.
[Measurement method of expansion start temperature (t) of thermally expandable particles]
To an aluminum cup having a diameter of 6.0 mm (inner diameter 5.65 mm) and a depth of 4.8 mm, 0.5 mg of thermally expandable particles to be measured is added, and an aluminum lid (diameter 5.6 mm, thickness 0. 1 mm) is prepared.
Using a dynamic viscoelasticity measuring device, the height of the sample is measured from the upper part of the aluminum lid while a force of 0.01 N is applied to the sample by a pressurizer. Then, in a state where a force of 0.01 N is applied by the pressurizer, heating is performed from 20 ° C. to 300 ° C. at a rate of temperature increase of 10 ° C./min, and the amount of displacement of the pressurizer in the vertical direction is measured. Let the displacement start temperature be the expansion start temperature (t).
 本発明の一態様で用いる熱膨張性粒子の膨張開始温度(t)以上の加熱による体積最大膨張率は、好ましくは1.5~100倍、より好ましくは2~80倍、更に好ましくは2.5~60倍、より更に好ましくは3~40倍である。 The volume expansion coefficient of the thermally expandable particles used in one embodiment of the present invention by heating at an expansion start temperature (t) or higher is preferably 1.5 to 100 times, more preferably 2 to 80 times, and still more preferably 2. It is 5 to 60 times, more preferably 3 to 40 times.
 熱膨張性粒子の含有量は、組成物(y)の有効成分の全量(100質量%)に対して、好ましくは1~40質量%、より好ましくは5~35質量%、更に好ましくは10~30質量%、より更に好ましくは15~25質量%である。 The content of the heat-expandable particles is preferably 1 to 40% by mass, more preferably 5 to 35% by mass, still more preferably 10 to 10% by mass with respect to the total amount (100% by mass) of the active ingredients in the composition (y). 30% by mass, and still more preferably 15 to 25% by mass.
(樹脂)
 組成物(y)に含まれる樹脂としては、非粘着性の熱膨張性基材(Y)を形成可能な重合体であればよい。
 なお、組成物(y)に含まれる樹脂としては、非粘着性樹脂であってもよく、粘着性樹脂であってもよい。
 つまり、組成物(y)に含まれる樹脂が粘着性樹脂であっても、組成物(y)から熱膨張性基材(Y)を形成する過程において、当該粘着性樹脂が重合性化合物と重合反応し、得られる樹脂が非粘着性樹脂となり、当該樹脂を含む熱膨張性基材(Y)が非粘着性となればよい。
(resin)
The resin contained in the composition (y) may be a polymer that can form a non-adhesive thermally expandable substrate (Y).
In addition, as resin contained in a composition (y), non-adhesive resin may be sufficient and adhesive resin may be sufficient.
That is, even if the resin contained in the composition (y) is an adhesive resin, the adhesive resin is polymerized with the polymerizable compound in the process of forming the thermally expandable substrate (Y) from the composition (y). It is sufficient that the resin obtained by the reaction becomes a non-adhesive resin and the thermally expandable substrate (Y) containing the resin becomes non-adhesive.
 組成物(y)に含まれる前記樹脂の質量平均分子量(Mw)としては、好ましくは1000~100万、より好ましくは1000~70万、更に好ましくは1000~50万である。
 また、当該樹脂が2種以上の構成単位を有する共重合体である場合、当該共重合体の形態は、特に限定されず、ブロック共重合体、ランダム共重合体、及びグラフト共重合体のいずれであってもよい。
The mass average molecular weight (Mw) of the resin contained in the composition (y) is preferably 1,000 to 1,000,000, more preferably 1,000 to 700,000, and still more preferably 1,000 to 500,000.
Further, when the resin is a copolymer having two or more kinds of structural units, the form of the copolymer is not particularly limited, and any of a block copolymer, a random copolymer, and a graft copolymer It may be.
 前記樹脂の含有量は、組成物(y)の有効成分の全量(100質量%)に対して、好ましくは50~99質量%、より好ましくは60~95質量%、更に好ましくは65~90質量%、より更に好ましくは70~85質量%である。 The content of the resin is preferably 50 to 99% by mass, more preferably 60 to 95% by mass, and still more preferably 65 to 90% by mass with respect to the total amount (100% by mass) of the active ingredients of the composition (y). %, More preferably 70 to 85% by mass.
 なお、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性を、及び粘着剤層(X2)が存在する場合には、熱膨張性基材(Y)と粘着剤層(X2)との界面との界面密着性を、より向上させる観点から、樹脂組成物(y)に含まれる前記樹脂としては、アクリルウレタン系樹脂及びオレフィン系樹脂から選ばれる1種以上を含むことが好ましい。
 また、上記アクリルウレタン系樹脂としては、以下の樹脂(U1)が好ましい。
・ウレタンプレポリマー(UP)と、(メタ)アクリル酸エステルを含むビニル化合物とを重合してなるアクリルウレタン系樹脂(U1)。
It should be noted that the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the heat-expandable base material (Y) and, if the pressure-sensitive adhesive layer (X2) is present, the heat-expandable base material (Y) and the pressure-sensitive adhesive layer From the viewpoint of further improving the interfacial adhesion with the interface with (X2), the resin contained in the resin composition (y) includes one or more selected from acrylic urethane resins and olefin resins. Is preferred.
Moreover, as said acrylic urethane type resin, the following resin (U1) is preferable.
An acrylic urethane resin (U1) obtained by polymerizing a urethane prepolymer (UP) and a vinyl compound containing a (meth) acrylic acid ester.
 アクリルウレタン系樹脂(U1)は、直鎖ウレタンプレポリマーの主鎖を骨格としつつ、直鎖ウレタンプレポリマーの両末端に(メタ)アクリル酸エステルを含むビニル化合物に由来する構成単位を有するものである。
 アクリルウレタン系樹脂(U1)は、主鎖骨格におけるアクリル部位間に直鎖ウレタンポリマーに由来する部位が介されるため、架橋点間距離が長くなり、その分子構造が二次元的構造(網状構造)となり易い。
 また、主鎖のウレタンプレポリマーが直鎖状であるため、外力がかかった時に延伸効果が高い。
 更に、(メタ)アクリル酸エステルを含むビニル化合物に由来する構成単位の側鎖が、粘着剤層(X1)に含まれる粘着性樹脂及び粘着剤層(X2)に含まれる粘着性樹脂と絡み易い構造を有している。
 そのために、アクリルウレタン系樹脂(U1)は、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性、及び粘着剤層(X2)が存在する場合には、熱膨張性基材(Y)と粘着剤層(X2)との界面との界面密着性、の向上に寄与し得ると考えられる。
The acrylic urethane-based resin (U1) has a structural unit derived from a vinyl compound containing a (meth) acrylic acid ester at both ends of the linear urethane prepolymer while having the main chain of the linear urethane prepolymer as a skeleton. is there.
In the acrylic urethane resin (U1), since the site derived from the linear urethane polymer is interposed between the acrylic sites in the main chain skeleton, the distance between the crosslinking points becomes long, and the molecular structure thereof is a two-dimensional structure (network structure). It is easy to become.
Moreover, since the urethane prepolymer of the main chain is linear, the stretching effect is high when an external force is applied.
Furthermore, the side chain of the structural unit derived from the vinyl compound containing (meth) acrylic acid ester is easily entangled with the adhesive resin contained in the adhesive layer (X1) and the adhesive resin contained in the adhesive layer (X2). It has a structure.
Therefore, the acrylic urethane-based resin (U1) is thermally expandable when the adhesiveness between the adhesive layer (X1) and the thermally expandable substrate (Y) and the adhesive layer (X2) are present. It is thought that it can contribute to the improvement of the interfacial adhesion between the base material (Y) and the adhesive layer (X2).
{アクリルウレタン系樹脂(U1)}
 アクリルウレタン系樹脂(U1)の主鎖となるウレタンプレポリマー(UP)としては、ポリオールと多価イソシアネートとの反応物が挙げられる。
 なお、ウレタンプレポリマー(UP)は、更に鎖延長剤を用いた鎖延長反応を施して得られたものであることが好ましい。
{Acrylic urethane-based resin (U1)}
Examples of the urethane prepolymer (UP) serving as the main chain of the acrylic urethane resin (U1) include a reaction product of a polyol and a polyvalent isocyanate.
The urethane prepolymer (UP) is preferably obtained by further performing a chain extension reaction using a chain extender.
 ウレタンプレポリマー(UP)の原料となるポリオールとしては、例えば、アルキレン型ポリオール、エーテル型ポリオール、エステル型ポリオール、エステルアミド型ポリオール、エステル・エーテル型ポリオール、カーボネート型ポリオール等が挙げられる。
 これらのポリオールは、単独で用いてもよく、2種以上を併用してもよい。
 本発明の一態様で用いるポリオールとしては、ジオールが好ましく、エステル型ジオール、アルキレン型ジオール及びカーボネート型ジオールがより好ましく、エステル型ジオール、カーボネート型ジオールが更に好ましい。
Examples of the polyol used as a raw material for the urethane prepolymer (UP) include alkylene type polyols, ether type polyols, ester type polyols, ester amide type polyols, ester / ether type polyols, and carbonate type polyols.
These polyols may be used independently and may use 2 or more types together.
The polyol used in one embodiment of the present invention is preferably a diol, more preferably an ester diol, an alkylene diol, and a carbonate diol, and even more preferably an ester diol and a carbonate diol.
 エステル型ジオールとしては、例えば、1,3-プロパンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、ネオペンチルグリコール、1,6-ヘキサンジオール等のアルカンジオール;エチレングリコール、プロピレングリコール、ジエチレングリコール、ジプロピレングリコール等のアルキレングリコール;等のジオール類から選択される1種又は2種以上と、フタル酸、イソフタル酸、テレフタル酸、ナフタレンジカルボン酸、4,4-ジフェニルジカルボン酸、ジフェニルメタン-4,4'-ジカルボン酸、コハク酸、アジピン酸、アゼライン酸、セバシン酸、ヘット酸、マレイン酸、フマル酸、イタコン酸、シクロヘキサン-1,3-ジカルボン酸、シクロヘキサン-1,4-ジカルボン酸、ヘキサヒドロフタル酸、ヘキサヒドロイソフタル酸、ヘキサヒドロテレフタル酸、メチルヘキサヒドロフタル酸等のジカルボン酸及びこれらの無水物から選択される1種又は2種以上と、の縮重合体が挙げられる。
 具体的には、ポリエチレンアジペートジオール、ポリブチレンアジペートジオール、ポリヘキサメチレンアジペートジオール、ポリヘキサメチレンイソフタレートジオール、ポリネオペンチルアジペートジオール、ポリエチレンプロピレンアジペートジオール、ポリエチレンブチレンアジペートジオール、ポリブチレンヘキサメチレンアジペートジオール、ポリジエチレンアジペートジオール、ポリ(ポリテトラメチレンエーテル)アジペートジオール、ポリ(3-メチルペンチレンアジペート)ジオール、ポリエチレンアゼレートジオール、ポリエチレンセバケートジオール、ポリブチレンアゼレートジオール、ポリブチレンセバケートジオール及びポリネオペンチルテレフタレートジオール等が挙げられる。
Examples of ester type diols include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, One or more selected from diols such as alkylene glycols such as diethylene glycol and dipropylene glycol; phthalic acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, 4,4-diphenyldicarboxylic acid, diphenylmethane-4 , 4'-dicarboxylic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, het acid, maleic acid, fumaric acid, itaconic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, hexa Hydrophthalic acid, Examples thereof include condensation polymers of one or more selected from dicarboxylic acids such as hexahydroisophthalic acid, hexahydroterephthalic acid, and methylhexahydrophthalic acid, and anhydrides thereof.
Specifically, polyethylene adipate diol, polybutylene adipate diol, polyhexamethylene adipate diol, polyhexamethylene isophthalate diol, polyneopentyl adipate diol, polyethylene propylene adipate diol, polyethylene butylene adipate diol, polybutylene hexamethylene adipate diol, Polydiethylene adipate diol, poly (polytetramethylene ether) adipate diol, poly (3-methylpentylene adipate) diol, polyethylene azelate diol, polyethylene sebacate diol, polybutylene azelate diol, polybutylene sebacate diol and polyneo Examples thereof include pentyl terephthalate diol.
 アルキレン型ジオールとしては、例えば、1,3-プロパンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、ネオペンチルグリコール、1,6-ヘキサンジオール等のアルカンジオール;エチレングリコール、プロピレングリコール、ジエチレングリコール、ジプロピレングリコール等のアルキレングリコール;ポリエチレングリコール、ポリプロピレングリコール、ポリブチレングリコール等のポリアルキレングリコール;ポリテトラメチレングリコール等のポリオキシアルキレングリコール;等が挙げられる。 Examples of the alkylene type diol include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, And alkylene glycols such as diethylene glycol and dipropylene glycol; polyalkylene glycols such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyalkylene glycols such as polytetramethylene glycol; and the like.
 カーボネート型ジオールとしては、例えば、1,4-テトラメチレンカーボネートジオール、1,5-ペンタメチレンカーボネートジオール、1,6-ヘキサメチレンカーボネートジオール、1,2-プロピレンカーボネートジオール、1,3-プロピレンカーボネートジオール、2,2-ジメチルプロピレンカーボネートジオール、1,7-ヘプタメチレンカーボネートジオール、1,8-オクタメチレンカーボネートジオール、1,4-シクロヘキサンカーボネートジオール等が挙げられる。 Examples of the carbonate type diol include 1,4-tetramethylene carbonate diol, 1,5-pentamethylene carbonate diol, 1,6-hexamethylene carbonate diol, 1,2-propylene carbonate diol, and 1,3-propylene carbonate diol. 2,2-dimethylpropylene carbonate diol, 1,7-heptamethylene carbonate diol, 1,8-octamethylene carbonate diol, 1,4-cyclohexane carbonate diol, and the like.
 ウレタンプレポリマー(UP)の原料となる多価イソシアネートとしては、芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環式ポリイソシアネート等が挙げられる。
 これらの多価イソシアネートは、単独で用いてもよく、2種以上を併用してもよい。
 また、これらの多価イソシアネートは、トリメチロールプロパンアダクト型変性体、水と反応させたビュウレット型変性体、イソシアヌレート環を含有させたイソシアヌレート型変性体であってもよい。
Examples of the polyvalent isocyanate used as a raw material for the urethane prepolymer (UP) include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.
These polyvalent isocyanates may be used alone or in combination of two or more.
These polyisocyanates may be a trimethylolpropane adduct type modified product, a burette type modified product reacted with water, or an isocyanurate type modified product containing an isocyanurate ring.
 これらの中でも、本発明の一態様で用いる多価イソシアネートとしては、ジイソシアネートが好ましく、4,4’-ジフェニルメタンジイソシアネート(MDI)、2,4-トリレンジイソシアネート(2,4-TDI)、2,6-トリレンジイソシアネート(2,6-TDI)、ヘキサメチレンジイソシアネート(HMDI)、及び脂環式ジイソシアネートから選ばれる1種以上がより好ましい。 Among these, the polyisocyanate used in one embodiment of the present invention is preferably diisocyanate, and 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2,6 More preferred is at least one selected from tolylene diisocyanate (2,6-TDI), hexamethylene diisocyanate (HMDI), and alicyclic diisocyanate.
 脂環式ジイソシアネートとしては、例えば、3-イソシアネートメチル-3,5,5-トリメチルシクロヘキシルイソシアネート(イソホロンジイソシアネート、IPDI)、1,3-シクロペンタンジイソシアネート、1,3-シクロヘキサンジイソシアネート、1,4-シクロヘキサンジイソシアネート、メチル-2,4-シクロヘキサンジイソシアネート、メチル-2,6-シクロヘキサンジイソシアネート等が挙げられるが、イソホロンジイソシアネート(IPDI)が好ましい。 Examples of the alicyclic diisocyanate include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (isophorone diisocyanate, IPDI), 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane. Examples include diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, and isophorone diisocyanate (IPDI) is preferred.
 本発明の一態様において、アクリルウレタン系樹脂(U1)の主鎖となるウレタンプレポリマー(UP)としては、ジオールとジイソシアネートとの反応物であり、両末端にエチレン性不飽和基を有する直鎖ウレタンプレポリマーが好ましい。
 当該直鎖ウレタンプレポリマーの両末端にエチレン性不飽和基を導入する方法としては、ジオールとジイソシアネート化合物とを反応してなる直鎖ウレタンプレポリマーの末端のNCO基と、ヒドロキシアルキル(メタ)アクリレートとを反応させる方法が挙げられる。
In one embodiment of the present invention, the urethane prepolymer (UP) serving as the main chain of the acrylic urethane resin (U1) is a reaction product of a diol and a diisocyanate, and is a straight chain having ethylenically unsaturated groups at both ends. A urethane prepolymer is preferred.
As a method for introducing an ethylenically unsaturated group into both ends of the linear urethane prepolymer, an NCO group at the end of the linear urethane prepolymer obtained by reacting a diol and a diisocyanate compound, and a hydroxyalkyl (meth) acrylate And a method of reacting with.
 ヒドロキシアルキル(メタ)アクリレートとしては、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、3-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート等が挙げられる。 Examples of the hydroxyalkyl (meth) acrylate include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxy Examples thereof include butyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate.
 アクリルウレタン系樹脂(U1)の側鎖となる、ビニル化合物としては、少なくとも(メタ)アクリル酸エステルを含む。
 (メタ)アクリル酸エステルとしては、アルキル(メタ)アクリレート及びヒドロキシアルキル(メタ)アクリレートから選ばれる1種以上が好ましく、アルキル(メタ)アクリレート及びヒドロキシアルキル(メタ)アクリレートを併用することがより好ましい。
As a vinyl compound used as the side chain of acrylic urethane resin (U1), at least (meth) acrylic acid ester is included.
The (meth) acrylic acid ester is preferably one or more selected from alkyl (meth) acrylates and hydroxyalkyl (meth) acrylates, and more preferably used in combination with alkyl (meth) acrylates and hydroxyalkyl (meth) acrylates.
 アルキル(メタ)アクリレート及びヒドロキシアルキル(メタ)アクリレートを併用する場合、アルキル(メタ)アクリレート100質量部に対する、ヒドロキシアルキル(メタ)アクリレートの配合割合としては、好ましくは0.1~100質量部、より好ましくは0.5~30質量部、更に好ましくは1.0~20質量部、より更に好ましくは1.5~10質量部である。 When alkyl (meth) acrylate and hydroxyalkyl (meth) acrylate are used in combination, the proportion of hydroxyalkyl (meth) acrylate to 100 parts by mass of alkyl (meth) acrylate is preferably 0.1 to 100 parts by mass, The amount is preferably 0.5 to 30 parts by mass, more preferably 1.0 to 20 parts by mass, and still more preferably 1.5 to 10 parts by mass.
 当該アルキル(メタ)アクリレートが有するアルキル基の炭素数としては、好ましくは1~24、より好ましくは1~12、更に好ましくは1~8、より更に好ましくは1~3である。 The carbon number of the alkyl group of the alkyl (meth) acrylate is preferably 1 to 24, more preferably 1 to 12, still more preferably 1 to 8, and still more preferably 1 to 3.
 また、ヒドロキシアルキル(メタ)アクリレートとしては、上述の直鎖ウレタンプレポリマーの両末端にエチレン性不飽和基を導入するために用いられるヒドロキシアルキル(メタ)アクリレートと同じものが挙げられる。 Moreover, as hydroxyalkyl (meth) acrylate, the same thing as the hydroxyalkyl (meth) acrylate used in order to introduce | transduce an ethylenically unsaturated group into the both ends of the above-mentioned linear urethane prepolymer is mentioned.
 (メタ)アクリル酸エステル以外のビニル化合物としては、例えば、スチレン、α-メチルスチレン、ビニルトルエン等の芳香族炭化水素系ビニル化合物;メチルビニルエーテル、エチルビニルエーテル等のビニルエーテル類;酢酸ビニル、プロピオン酸ビニル、(メタ)アクリロニトリル、N-ビニルピロリドン、(メタ)アクリル酸、マレイン酸、フマル酸、イタコン酸、メタ(アクリルアミド)等の極性基含有モノマー;等が挙げられる。
 これらは単独で用いてもよく、2種以上を併用してもよい。
Examples of vinyl compounds other than (meth) acrylic acid esters include aromatic hydrocarbon vinyl compounds such as styrene, α-methylstyrene, and vinyl toluene; vinyl ethers such as methyl vinyl ether and ethyl vinyl ether; vinyl acetate and vinyl propionate. Polar group-containing monomers such as (meth) acrylonitrile, N-vinylpyrrolidone, (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, and meta (acrylamide).
These may be used alone or in combination of two or more.
 ビニル化合物中の(メタ)アクリル酸エステルの含有量としては、当該ビニル化合物の全量(100質量%)に対して、好ましくは40~100質量%、より好ましくは65~100質量%、更に好ましくは80~100質量%、より更に好ましくは90~100質量%である。 The content of the (meth) acrylic acid ester in the vinyl compound is preferably 40 to 100% by mass, more preferably 65 to 100% by mass, and still more preferably based on the total amount (100% by mass) of the vinyl compound. It is 80 to 100% by mass, more preferably 90 to 100% by mass.
 ビニル化合物中のアルキル(メタ)アクリレート及びヒドロキシアルキル(メタ)アクリレートの合計含有量としては、当該ビニル化合物の全量(100質量%)に対して、好ましくは40~100質量%、より好ましくは65~100質量%、更に好ましくは80~100質量%、より更に好ましくは90~100質量%である。 The total content of alkyl (meth) acrylate and hydroxyalkyl (meth) acrylate in the vinyl compound is preferably 40 to 100% by mass, more preferably 65 to 100% by mass with respect to the total amount (100% by mass) of the vinyl compound. The amount is 100% by mass, more preferably 80 to 100% by mass, and still more preferably 90 to 100% by mass.
 本発明の一態様で用いるアクリルウレタン系樹脂(U1)は、ウレタンプレポリマー(UP)と、(メタ)アクリル酸エステルを含むビニル化合物とを混合し、両者を重合することで得られる。
 当該重合においては、さらにラジカル開始剤を加えて行うことが好ましい。
The acrylic urethane-based resin (U1) used in one embodiment of the present invention is obtained by mixing a urethane prepolymer (UP) and a vinyl compound containing a (meth) acrylic acid ester and polymerizing both.
The polymerization is preferably performed by adding a radical initiator.
 本発明の一態様で用いるアクリルウレタン系樹脂(U1)において、ウレタンプレポリマー(UP)に由来の構成単位(u11)と、ビニル化合物に由来する構成単位(u12)との含有量比〔(u11)/(u12)〕としては、質量比で、好ましくは10/90~80/20、より好ましくは20/80~70/30、更に好ましくは30/70~60/40、より更に好ましくは35/65~55/45である。 In the acrylic urethane resin (U1) used in one embodiment of the present invention, the content ratio of the structural unit (u11) derived from the urethane prepolymer (UP) and the structural unit (u12) derived from the vinyl compound [(u11 ) / (U12)] is preferably 10/90 to 80/20, more preferably 20/80 to 70/30, still more preferably 30/70 to 60/40, and still more preferably 35 by mass ratio. / 65 to 55/45.
{オレフィン系樹脂}
 組成物(y)に含まれる樹脂として好適な、オレフィン系樹脂としては、オレフィンモノマーに由来の構成単位を少なくとも有する重合体である。
 上記オレフィンモノマーとしては、炭素数2~8のα-オレフィンが好ましく、具体的には、エチレン、プロピレン、ブチレン、イソブチレン、1-ヘキセン等が挙げられる。
 これらの中でも、エチレン及びプロピレンが好ましい。
{Olefin resin}
The olefin resin suitable as the resin contained in the composition (y) is a polymer having at least a structural unit derived from an olefin monomer.
The olefin monomer is preferably an α-olefin having 2 to 8 carbon atoms, and specifically includes ethylene, propylene, butylene, isobutylene, 1-hexene and the like.
Among these, ethylene and propylene are preferable.
 具体的なオレフィン系樹脂としては、例えば、超低密度ポリエチレン(VLDPE、密度:880kg/m以上910kg/m未満)、低密度ポリエチレン(LDPE、密度:910kg/m以上915kg/m未満)、中密度ポリエチレン(MDPE、密度:915kg/m以上942kg/m未満)、高密度ポリエチレン(HDPE、密度:942kg/m以上)、直鎖状低密度ポリエチレン等のポリエチレン樹脂;ポリプロピレン樹脂(PP);ポリブテン樹脂(PB);エチレン-プロピレン共重合体;オレフィン系エラストマー(TPO);ポリ(4-メチル-1-ペンテン)(PMP);エチレン-酢酸ビニル共重合体(EVA);エチレン-ビニルアルコール共重合体(EVOH);エチレン-プロピレン-(5-エチリデン-2-ノルボルネン)等のオレフィン系三元共重合体;等が挙げられる。 Specific olefinic resins, for example, ultra low density polyethylene (VLDPE, density: 880 kg / m 3 or more 910 kg / m less than 3), low density polyethylene (LDPE, density: 910 kg / m 3 or more 915 kg / m less than 3 ), Medium density polyethylene (MDPE, density: 915 kg / m 3 or more and less than 942 kg / m 3 ), high density polyethylene (HDPE, density: 942 kg / m 3 or more), linear low density polyethylene, etc .; polypropylene resin (PP); polybutene resin (PB); ethylene-propylene copolymer; olefin elastomer (TPO); poly (4-methyl-1-pentene) (PMP); ethylene-vinyl acetate copolymer (EVA); ethylene -Vinyl alcohol copolymer (EVOH); ethylene-propylene Olefinic terpolymers such as-(5-ethylidene-2-norbornene); and the like.
 本発明の一態様において、オレフィン系樹脂は、さらに酸変性、水酸基変性、及びアクリル変性から選ばれる1種以上の変性を施した変性オレフィン系樹脂であってもよい。 In one embodiment of the present invention, the olefin resin may be a modified olefin resin further modified by one or more selected from acid modification, hydroxyl group modification, and acrylic modification.
 例えば、オレフィン系樹脂に対して酸変性を施してなる酸変性オレフィン系樹脂としては、上述の無変性のオレフィン系樹脂に、不飽和カルボン酸又はその無水物を、グラフト重合させてなる変性重合体が挙げられる。
 上記の不飽和カルボン酸又はその無水物としては、例えば、マレイン酸、フマル酸、イタコン酸、シトラコン酸、グルタコン酸、テトラヒドロフタル酸、アコニット酸、(メタ)アクリル酸、無水マレイン酸、無水イタコン酸、無水グルタコン酸、無水シトラコン酸、無水アコニット酸、ノルボルネンジカルボン酸無水物、テトラヒドロフタル酸無水物等が挙げられる。
 なお、不飽和カルボン酸又はその無水物は、単独で用いてもよく、2種以上を併用してもよい。
For example, as an acid-modified olefin resin obtained by subjecting an olefin resin to acid modification, a modified polymer obtained by graft polymerization of the above-mentioned unmodified olefin resin with an unsaturated carboxylic acid or its anhydride. Is mentioned.
Examples of the unsaturated carboxylic acid or anhydride thereof include maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, tetrahydrophthalic acid, aconitic acid, (meth) acrylic acid, maleic anhydride, itaconic anhydride. , Glutaconic anhydride, citraconic anhydride, aconitic anhydride, norbornene dicarboxylic anhydride, tetrahydrophthalic anhydride, and the like.
In addition, unsaturated carboxylic acid or its anhydride may be used independently and may use 2 or more types together.
 オレフィン系樹脂に対してアクリル変性を施してなるアクリル変性オレフィン系樹脂としては、主鎖である上述の無変性のオレフィン系樹脂に、側鎖として、アルキル(メタ)アクリレートをグラフト重合させてなる変性重合体が挙げられる。
 上記のアルキル(メタ)アクリレートが有するアルキル基の炭素数としては、好ましくは1~20、より好ましくは1~16、更に好ましくは1~12である。
 上記のアルキル(メタ)アクリレートとしては、例えば、後述のモノマー(a1’)として選択可能な化合物と同じものが挙げられる。
As an acrylic modified olefin resin obtained by subjecting an olefin resin to acrylic modification, a modification obtained by graft polymerization of an alkyl (meth) acrylate as a side chain to the above-mentioned unmodified olefin resin as a main chain. A polymer is mentioned.
The number of carbon atoms in the alkyl group of the alkyl (meth) acrylate is preferably 1-20, more preferably 1-16, and still more preferably 1-12.
As said alkyl (meth) acrylate, the same thing as the compound which can be selected as a below-mentioned monomer (a1 ') is mentioned, for example.
 オレフィン系樹脂に対して水酸基変性を施してなる水酸基変性オレフィン系樹脂としては、主鎖である上述の無変性のオレフィン系樹脂に、水酸基含有化合物をグラフト重合させてなる変性重合体が挙げられる。
 上記の水酸基含有化合物としては、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、3-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート等のヒドロキシアルキル(メタ)アクリレート類;ビニルアルコール、アリルアルコール等の不飽和アルコール類等が挙げられる。
Examples of the hydroxyl group-modified olefin resin obtained by subjecting an olefin resin to hydroxyl group modification include a modified polymer obtained by graft polymerization of a hydroxyl group-containing compound to the above-mentioned unmodified olefin resin, which is the main chain.
Examples of the hydroxyl group-containing compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl. Examples thereof include hydroxyalkyl (meth) acrylates such as (meth) acrylate and 4-hydroxybutyl (meth) acrylate; unsaturated alcohols such as vinyl alcohol and allyl alcohol.
{アクリルウレタン系樹脂及びオレフィン系樹脂以外の樹脂}
 本発明の一態様において、組成物(y)には、本発明の効果を損なわない範囲で、アクリルウレタン系樹脂及びオレフィン系樹脂以外の樹脂を含有してもよい。
 そのような樹脂としては、例えば、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリビニルアルコール等のビニル系樹脂;ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル系樹脂;ポリスチレン;アクリロニトリル-ブタジエン-スチレン共重合体;三酢酸セルロース;ポリカーボネート;アクリルウレタン系樹脂には該当しないポリウレタン;ポリスルホン;ポリエーテルエーテルケトン;ポリエーテルスルホン;ポリフェニレンスルフィド;ポリエーテルイミド、ポリイミド等のポリイミド系樹脂;ポリアミド系樹脂;アクリル樹脂;フッ素系樹脂等が挙げられる。
{Resin other than acrylic urethane resin and olefin resin}
In one embodiment of the present invention, the composition (y) may contain a resin other than the acrylic urethane-based resin and the olefin-based resin as long as the effects of the present invention are not impaired.
Examples of such resins include vinyl resins such as polyvinyl chloride, polyvinylidene chloride, and polyvinyl alcohol; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polystyrene; acrylonitrile-butadiene-styrene copolymer Polycarbonate; Polyurethane not applicable to acrylic urethane resin; Polysulfone; Polyetheretherketone; Polyethersulfone; Polyphenylene sulfide; Polyimide resin such as polyetherimide and polyimide; Polyamide resin; Acrylic resin; Fluorine resin etc. are mentioned.
 ただし、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性をより向上させる観点、及び粘着剤層(X2)が存在する場合には、熱膨張性基材(Y)と粘着剤層(X2)との界面との界面密着性をより向上させる観点から、組成物(y)中のアクリルウレタン系樹脂及びオレフィン系樹脂以外の樹脂の含有割合は、少ない方が好ましい。
 アクリルウレタン系樹脂及びオレフィン系樹脂以外の樹脂の含有割合としては、組成物(y)中に含まれる樹脂の全量100質量部に対して、好ましくは30質量部未満、より好ましくは20質量部未満、より好ましくは10質量部未満、更に好ましくは5質量部未満、より更に好ましくは1質量部未満である。
However, the viewpoint of further improving the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the heat-expandable base material (Y), and when the pressure-sensitive adhesive layer (X2) is present, the heat-expandable base material (Y) From the viewpoint of further improving the interfacial adhesion with the interface between the adhesive layer and the pressure-sensitive adhesive layer (X2), the content ratio of the resin other than the acrylic urethane-based resin and the olefin-based resin in the composition (y) is preferably small.
The content of the resin other than the acrylic urethane-based resin and the olefin-based resin is preferably less than 30 parts by weight, more preferably less than 20 parts by weight with respect to 100 parts by weight of the total amount of the resin contained in the composition (y). More preferably, it is less than 10 mass parts, More preferably, it is less than 5 mass parts, More preferably, it is less than 1 mass part.
(架橋剤)
 本発明の一態様において、組成物(y)がアクリルウレタン系樹脂を含む場合、アクリルウレタン系樹脂を架橋するため、更に、架橋剤を含有することがより好ましい。
 当該架橋剤としては、例えば、架橋剤としてのイソシアネート系化合物が好ましい。
 架橋剤としてのイソシアネート系化合物は、前記アクリルウレタン系樹脂の官能基と反応して、架橋構造を形成するものであれば、種々のイソシアネート系化合物を用いることができる。
 当該イソシアネート系化合物としては、1分子当たりイソシアネート基を2個以上有するポリイソシアネート化合物が好ましい。
(Crosslinking agent)
In one aspect of the present invention, when the composition (y) contains an acrylic urethane resin, it is more preferable to further contain a crosslinking agent in order to crosslink the acrylic urethane resin.
As the said crosslinking agent, the isocyanate type compound as a crosslinking agent is preferable, for example.
As the isocyanate compound as the crosslinking agent, various isocyanate compounds can be used as long as they react with the functional group of the acrylic urethane resin to form a crosslinked structure.
The isocyanate compound is preferably a polyisocyanate compound having two or more isocyanate groups per molecule.
 ポリイソシアネート化合物としては、例えば、ジイソシアネート化合物、トリイソシアネート化合物、テトライソシアネート化合物、ペンタイソシアネート化合物、ヘキサイソシアネート化合物等が挙げられる。より具体的には、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、キシリレンジイソシアネート等の芳香族ポリイソシアネート化合物;ジシクロヘキシルメタン-4,4-ジイソシアネート、ビシクロヘプタントリイソシアネート、シクロペンチレンジイソシアネート、シクロヘキシレンジイソシアネート、メチルシクロヘキシレンジイソシアネート、水添キシリレンジイソシアネート等の脂環式イソシアネート化合物;ペンタメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ヘプタメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、リジンジイソシアネート等の脂肪族イソシアネート化合物等が挙げられる。
 また、これらのイソシアネート化合物のビウレット体、イソシアヌレート体や、これらのイソシアネート化合物とエチレングリコール、トリメチロールプロパン、ひまし油等の非芳香族性低分子活性水素含有化合物との反応物であるアダクト体等の変性体も用いることができる。
Examples of the polyisocyanate compound include diisocyanate compounds, triisocyanate compounds, tetraisocyanate compounds, pentaisocyanate compounds, hexaisocyanate compounds, and the like. More specifically, aromatic polyisocyanate compounds such as tolylene diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate; dicyclohexylmethane-4,4-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene Examples thereof include alicyclic isocyanate compounds such as diisocyanate and hydrogenated xylylene diisocyanate; aliphatic isocyanate compounds such as pentamethylene diisocyanate, hexamethylene diisocyanate, heptamethylene diisocyanate, trimethylhexamethylene diisocyanate, and lysine diisocyanate.
In addition, biuret bodies, isocyanurate bodies of these isocyanate compounds, adduct bodies that are reaction products of these isocyanate compounds with non-aromatic low-molecular active hydrogen-containing compounds such as ethylene glycol, trimethylolpropane, castor oil, etc. Modified products can also be used.
 これらのイソシアネート系化合物のうち、脂肪族イソシアネート化合物が好ましく、脂肪族ジイソシアネート化合物がより好ましく、ペンタメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ヘプタメチレンジイソシアネートが更に好ましい。
 組成物(y)中、イソシアネート系化合物は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい
Of these isocyanate compounds, aliphatic isocyanate compounds are preferable, aliphatic diisocyanate compounds are more preferable, and pentamethylene diisocyanate, hexamethylene diisocyanate, and heptamethylene diisocyanate are still more preferable.
In the composition (y), the isocyanate compound may be used alone or in combination of two or more.
 組成物(y)中、前記アクリルウレタン系樹脂と、架橋剤としてのイソシアネート系化合物との含有割合は、固形分比で前記アクリルウレタン系樹脂の合計100質量部に対し、架橋剤としてのイソシアネート系化合物が好ましくは1~30質量部、より好ましくは2~20質量部、更に好ましくは3~15質量部である。 In the composition (y), the content ratio of the acrylic urethane resin and the isocyanate compound as a crosslinking agent is an isocyanate system as a crosslinking agent with respect to a total of 100 parts by mass of the acrylic urethane resin as a solid content ratio. The compound is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, and still more preferably 3 to 15 parts by mass.
(触媒)
 本発明の一態様において、組成物(y)がアクリルウレタン系樹脂及び前記架橋剤を含む場合、組成物(y)は、更に、前記架橋剤と共に、触媒を含有することが更に好ましい。
 当該触媒としては、金属系触媒が好ましく、ブチル基を有するスズ系化合物を除く金属系触媒がより好ましい。
 当該金属系触媒としては、例えば、スズ系触媒、ビスマス系触媒、チタン系触媒、バナジウム系触媒、ジルコニウム系触媒、アルミニウム系触媒、ニッケル系触媒等が挙げられる。この中では、好ましくはスズ系触媒又はビスマス系触媒であり、より好ましくはブチル基を有するスズ系化合物を除くスズ系触媒又はビスマス系触媒である。
(catalyst)
In one embodiment of the present invention, when the composition (y) contains an acrylic urethane resin and the crosslinking agent, the composition (y) further preferably contains a catalyst together with the crosslinking agent.
As the catalyst, a metal catalyst is preferable, and a metal catalyst excluding a tin compound having a butyl group is more preferable.
Examples of the metal catalyst include a tin catalyst, a bismuth catalyst, a titanium catalyst, a vanadium catalyst, a zirconium catalyst, an aluminum catalyst, and a nickel catalyst. Among these, a tin-based catalyst or a bismuth-based catalyst is preferable, and a tin-based catalyst or a bismuth-based catalyst excluding a tin-based compound having a butyl group is more preferable.
 スズ系触媒は、スズの有機金属化合物であって、アルコキシド、カルボキシラート、キレート等の構造を有する化合物が挙げられ、好ましくは、それらの金属のアセチルアセトン錯体、アセチルアセトネート、オクチル酸化合物又はナフテン酸化合物等が挙げられる。
 また、同様に、ビスマス系触媒、チタン系触媒、バナジウム系触媒、ジルコニウム系触媒、アルミニウム系触媒、又はニッケル系触媒は、それぞれ、ビスマス、チタン、バナジウム、ジルコニウム、アルミニウム、又はニッケルの有機金属化合物であって、アルコキシド、カルボキシラート、キレート等の構造を有する化合物が挙げられ、好ましくは、それらの金属のアセチルアセトン錯体、アセチルアセトネート、オクチル酸化合物又はナフテン酸化合物等が挙げられる。
The tin-based catalyst is an organometallic compound of tin, and includes compounds having a structure such as alkoxide, carboxylate, chelate, etc., preferably acetylacetone complex, acetylacetonate, octylic acid compound or naphthenic acid of these metals Compounds and the like.
Similarly, the bismuth catalyst, titanium catalyst, vanadium catalyst, zirconium catalyst, aluminum catalyst, or nickel catalyst is an organometallic compound of bismuth, titanium, vanadium, zirconium, aluminum, or nickel, respectively. In addition, compounds having a structure such as alkoxide, carboxylate, chelate and the like can be mentioned, and preferred examples thereof include acetylacetone complexes, acetylacetonates, octylic acid compounds and naphthenic acid compounds of these metals.
 金属のアセチルアセトン錯体の具体例としては、アセチルアセトンスズ、アセチルアセトンチタン、アセチルアセトンバナジウム、アセチルアセトンジルコニウム、アセチルアセトンアルミニウム、アセチルアセトンニッケル等が挙げられる。
 アセチルアセトネートの具体例としては、スズアセチルアセトネート、ビスマスアセチルアセトネート、チタンアセチルアセトネート、バナジウムアセチルアセトネート、ジルコニウムアセチルアセトネート、アルミニウムアセチルアセトネート、ニッケルアセチルアセトネート等が挙げられる。
 オクチル酸化合物の具体例としては、2-エチルヘキシル酸ビスマス、2-エチルヘキシル酸ニッケル、2-エチルヘキシル酸ジルコニウム、2-エチルヘキシル酸スズ等が挙げられる。
 ナフテン酸化合物の具体例としては、ナフテン酸ビスマス、ナフテン酸ニッケル、ナフテン酸ジルコニウム、ナフテン酸スズ等が挙げられる。
Specific examples of the metal acetylacetone complex include acetylacetone tin, acetylacetone titanium, acetylacetone vanadium, acetylacetone zirconium, acetylacetone aluminum, and acetylacetone nickel.
Specific examples of acetylacetonate include tin acetylacetonate, bismuth acetylacetonate, titanium acetylacetonate, vanadium acetylacetonate, zirconium acetylacetonate, aluminum acetylacetonate, nickel acetylacetonate and the like.
Specific examples of the octylic acid compound include bismuth 2-ethylhexylate, nickel 2-ethylhexylate, zirconium 2-ethylhexylate, tin 2-ethylhexylate and the like.
Specific examples of the naphthenic acid compound include bismuth naphthenate, nickel naphthenate, zirconium naphthenate, tin naphthenate, and the like.
 スズ系触媒としては、一般式RxSn(L)(4-X)(該一般式中、Rは炭素数1~25のアルキル基、好ましくは炭素数1~3若しくは5~25のアルキル基、又はアリール基であり、Lはアルキル基及びアリール基以外の有機基、又は無機基であり、xは1、2又は4である。)で表されるスズ化合物が好ましい。 As the tin-based catalyst, general formula RxSn (L) (4-X) (wherein R is an alkyl group having 1 to 25 carbon atoms, preferably an alkyl group having 1 to 3 or 5 to 25 carbon atoms, or It is an aryl group, L is an organic group other than an alkyl group and an aryl group, or an inorganic group, and x is 1, 2 or 4).
 前記一般式RxSn(L)(4-X)において、Rのアルキル基は、炭素数5~25のアルキル基がより好ましく、炭素数5~20のアルキル基が更に好ましく、Rのアリール基は、炭素数は特に制限ないが、炭素数6~20のアリール基が好ましい。1分子中にRが2以上の複数存在する場合は、それぞれのRは同一であってもよいし、異なっていてもよい。
 また、Lは、炭素数2~20の脂肪族カルボン酸、芳香族カルボン酸、芳香族スルホン酸が好ましく、炭素数2~20の脂肪族カルボン酸がより好ましい。炭素数2~20の脂肪族カルボン酸としては、炭素数2~20の脂肪族モノカルボン酸、炭素数2~20の脂肪族ジカルボン酸等が挙げられる。1分子中にLが2以上の複数存在する場合は、それぞれのLは同一であってもよいし、異なっていてもよい。
In the general formula RxSn (L) (4-X) , the alkyl group of R is more preferably an alkyl group having 5 to 25 carbon atoms, further preferably an alkyl group having 5 to 20 carbon atoms, and the aryl group of R is The number of carbon atoms is not particularly limited, but an aryl group having 6 to 20 carbon atoms is preferable. When two or more R are present in one molecule, each R may be the same or different.
L is preferably an aliphatic carboxylic acid, aromatic carboxylic acid or aromatic sulfonic acid having 2 to 20 carbon atoms, more preferably an aliphatic carboxylic acid having 2 to 20 carbon atoms. Examples of the aliphatic carboxylic acid having 2 to 20 carbon atoms include an aliphatic monocarboxylic acid having 2 to 20 carbon atoms and an aliphatic dicarboxylic acid having 2 to 20 carbon atoms. When two or more L are present in one molecule, each L may be the same or different.
 組成物(y)中、前記触媒は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 組成物(y)中、前記アクリルウレタン系樹脂と触媒との含有割合は、前記アクリルウレタン系樹脂の合計100質量部に対し、触媒が固形分換算で好ましくは0.001~5質量部、より好ましくは0.01~3質量部、更に好ましくは0.1~2質量部である。
In the composition (y), the catalyst may be used alone or in combination of two or more.
In the composition (y), the content ratio of the acrylic urethane resin and the catalyst is preferably 0.001 to 5 parts by mass in terms of solid content of the catalyst with respect to 100 parts by mass in total of the acrylic urethane resin. The amount is preferably 0.01 to 3 parts by mass, more preferably 0.1 to 2 parts by mass.
(基材用添加剤)
 本発明の一態様で用いる組成物(y)は、本発明の効果を損なわない範囲で、一般的な粘着シートが有する基材に含まれる基材用添加剤を含有してもよい。
 そのような基材用添加剤としては、例えば、紫外線吸収剤、光安定剤、酸化防止剤、帯電防止剤、スリップ剤、アンチブロッキング剤、着色剤等が挙げられる。
 なお、これらの基材用添加剤は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 これらの基材用添加剤を含有する場合、それぞれの基材用添加剤の含有量は、組成物(y)中に含まれるアクリルウレタン系樹脂及びオレフィン系樹脂からなる群から選ばれる樹脂の全量100質量部に対して、好ましくは0.0001~20質量部、より好ましくは0.001~10質量部である。
(Substrate additive)
The composition (y) used in one embodiment of the present invention may contain a base material additive contained in a base material included in a general pressure-sensitive adhesive sheet as long as the effects of the present invention are not impaired.
Examples of such base material additives include ultraviolet absorbers, light stabilizers, antioxidants, antistatic agents, slip agents, antiblocking agents, and colorants.
These base material additives may be used alone or in combination of two or more.
When these additives for base materials are contained, the content of each additive for base materials is the total amount of resin selected from the group consisting of acrylurethane resins and olefin resins contained in the composition (y). The amount is preferably 0.0001 to 20 parts by mass, more preferably 0.001 to 10 parts by mass with respect to 100 parts by mass.
(希釈溶媒)
 本発明の一態様において、組成物(y)は、前述の各種有効成分と共に、希釈溶媒として、水や有機溶媒を含有し、溶液の形態としてもよい。
 有機溶媒としては、例えば、トルエン、キシレン、酢酸エチル、酢酸ブチル、メチルエチルケトン、ジエチルケトン、メチルイソブチルケトン、メタノール、エタノール、イソプロピルアルコール、tert-ブタノール、s-ブタノール、アセチルアセトン、シクロヘキサノン、n-ヘキサン、シクロヘキサン等が挙げられる。
 なお、これらの希釈溶媒は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
(Diluted solvent)
In one embodiment of the present invention, the composition (y) may contain water or an organic solvent as a diluent solvent together with the various active ingredients described above, and may be in the form of a solution.
Examples of the organic solvent include toluene, xylene, ethyl acetate, butyl acetate, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropyl alcohol, tert-butanol, s-butanol, acetylacetone, cyclohexanone, n-hexane, and cyclohexane. Etc.
In addition, these dilution solvents may be used independently and may be used in combination of 2 or more type.
 組成物(y)が希釈溶媒を含有して溶液の形態である場合、組成物(y)の有効成分濃度としては、それぞれ独立に、好ましくは0.1~60質量%、より好ましくは0.5~50質量%、更に好ましくは1.0~40質量%である。 When the composition (y) is in the form of a solution containing a diluting solvent, the active ingredient concentration of the composition (y) is preferably independently 0.1 to 60% by mass, more preferably 0. It is 5 to 50% by mass, more preferably 1.0 to 40% by mass.
〔粘着剤層(X1)〕
 本発明の粘着シートが有する粘着剤層(X1)は、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)を乾燥させて形成された層であり、粘着性を有する。
[Adhesive layer (X1)]
The pressure-sensitive adhesive layer (X1) of the pressure-sensitive adhesive sheet of the present invention is a layer formed by drying a coating film (x1 ′) made of a composition (x1) containing a pressure-sensitive adhesive resin, and has pressure-sensitive adhesiveness.
 本発明の一態様において、熱膨張性粒子の膨張前の23℃での粘着剤層(X1)の粘着表面における粘着力としては、好ましくは0.1~10.0N/25mm、より好ましくは0.2~8.0N/25mm、更に好ましくは0.4~6.0N/25mm、より更に好ましくは0.5~4.0N/25mmである。
 当該粘着力が0.1N/25mm以上であれば、半導体チップ等の被着体を十分に固定することができる。
 一方、当該粘着力が10.0N/25mm以下であれば、剥離時に、膨張開始温度(t)まで加熱することで、わずかな力で容易に剥離することができる。
 なお、上記の粘着力は、実施例に記載の方法により測定された値を意味する。
In one embodiment of the present invention, the adhesive force on the adhesive surface of the adhesive layer (X1) at 23 ° C. before expansion of the thermally expandable particles is preferably 0.1 to 10.0 N / 25 mm, more preferably 0. The range is from 0.2 to 8.0 N / 25 mm, more preferably from 0.4 to 6.0 N / 25 mm, still more preferably from 0.5 to 4.0 N / 25 mm.
If the said adhesive force is 0.1 N / 25mm or more, to-be-adhered bodies, such as a semiconductor chip, can fully be fixed.
On the other hand, if the said adhesive force is 10.0 N / 25mm or less, it can peel easily by slight force by heating to the expansion start temperature (t) at the time of peeling.
In addition, said adhesive force means the value measured by the method as described in an Example.
 粘着剤層(X1)の形成材料である組成物(x1)は、粘着性樹脂を含む。なお、本発明の一態様において、組成物(x1)に含まれる粘着性樹脂以外の成分は、本発明の粘着シートの使用用途に応じて、適宜調整可能である。
 例えば、本発明の一態様において、粘着力をより向上させた粘着シートとする観点から、組成物(x1)は、更に粘着付与剤及び/又は架橋剤を含有してもよく、これら以外にも、希釈溶媒及び/又は一般的な粘着剤に使用される粘着剤用添加剤を含有してもよい。
 なお、本発明の粘着シートは、熱膨張性基材(Y)が熱膨張性粒子を含むことで、加熱剥離性を奏するため、粘着剤層(X1)形成材料である組成物(x1)が熱膨張性粒子を含む必要はない。ただし、加熱剥離性を補助する目的で、本発明の効果を損なわない範囲で、組成物(x1)が熱膨張性粒子を少量含んでもよく、熱膨張性粒子の含有量は、組成物(x1)の有効成分の全量(100質量%)に対して、好ましくは0~50質量%、より好ましくは0~20質量%、更に好ましくは0~10質量%である。
The composition (x1) that is a material for forming the pressure-sensitive adhesive layer (X1) contains a pressure-sensitive adhesive resin. In addition, in 1 aspect of this invention, components other than adhesive resin contained in a composition (x1) can be suitably adjusted according to the use application of the adhesive sheet of this invention.
For example, in one embodiment of the present invention, the composition (x1) may further contain a tackifier and / or a cross-linking agent from the viewpoint of obtaining a pressure-sensitive adhesive sheet with improved adhesive strength. , And / or an adhesive additive used in a diluting solvent and / or a general adhesive.
In addition, since the heat-expandable base material (Y) contains heat-expandable particles, the pressure-sensitive adhesive sheet of the present invention exhibits heat peelability, so that the composition (x1) that is the pressure-sensitive adhesive layer (X1) forming material is used. It is not necessary to include thermally expandable particles. However, for the purpose of assisting heat peelability, the composition (x1) may contain a small amount of thermally expandable particles within a range not impairing the effects of the present invention, and the content of thermally expandable particles is determined by the composition (x1). ) Is preferably 0 to 50% by weight, more preferably 0 to 20% by weight, still more preferably 0 to 10% by weight, based on the total amount of active ingredients (100% by weight).
(粘着性樹脂)
 粘着性樹脂の質量平均分子量(Mw)としては、粘着力の向上の観点から、好ましくは1万~200万、より好ましくは2万~150万、更に好ましくは3万~100万である。
 組成物(x1)に含まれる粘着性樹脂としては、例えば、前述の粘着性樹脂としての粘着力を満たすアクリル系樹脂、ウレタン系樹脂、ポリイソブチレン系樹脂等のゴム系樹脂、ポリエステル系樹脂、オレフィン系樹脂、シリコーン系樹脂、ポリビニルエーテル系樹脂等が挙げられる。
 これらの粘着性樹脂は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 また、これらの粘着性樹脂が、2種以上の構成単位を有する共重合体である場合、当該共重合体の形態は、特に限定されず、ブロック共重合体、ランダム共重合体、及びグラフト共重合体のいずれであってもよい。
 更に、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性をより向上させる観点から、これらの粘着性樹脂は、重合性官能基を有さない紫外線非硬化型粘着性樹脂であることが好ましい。
(Adhesive resin)
The mass average molecular weight (Mw) of the adhesive resin is preferably 10,000 to 2,000,000, more preferably 20,000 to 1,500,000, and even more preferably 30,000 to 1,000,000 from the viewpoint of improving the adhesive strength.
Examples of the adhesive resin contained in the composition (x1) include rubber resins such as acrylic resins, urethane resins, polyisobutylene resins, polyester resins, and olefins that satisfy the adhesive force as the above-mentioned adhesive resins. Resin, silicone resin, polyvinyl ether resin and the like.
These adhesive resins may be used alone or in combination of two or more.
In addition, when these adhesive resins are copolymers having two or more kinds of structural units, the form of the copolymer is not particularly limited, and a block copolymer, a random copolymer, and a graft copolymer are not limited. Any of polymers may be used.
Furthermore, from the viewpoint of further improving the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y), these pressure-sensitive adhesive resins are UV non-curable pressure-sensitive adhesives having no polymerizable functional group. A resin is preferred.
 組成物(x1)中の粘着性樹脂の含有量は、組成物(x1)の有効成分の全量(100質量%)に対して、好ましくは30~99.99質量%、より好ましくは40~99.95質量%、より好ましくは50~99.90質量%、更に好ましくは55~99.80質量%、より更に好ましくは60~99.50質量%である。 The content of the adhesive resin in the composition (x1) is preferably 30 to 99.99% by mass, more preferably 40 to 99%, based on the total amount (100% by mass) of the active ingredients of the composition (x1). .95% by mass, more preferably 50 to 99.90% by mass, still more preferably 55 to 99.80% by mass, and still more preferably 60 to 99.50% by mass.
{アクリル系樹脂}
 本発明の一態様において、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性をより向上させる観点から、組成物(x1)に含まれる粘着性樹脂が、アクリル系樹脂を含むことが好ましい。
 粘着性樹脂中のアクリル系樹脂の含有割合としては、界面密着性をより向上させる観点から、組成物(x1)に含まれる粘着性樹脂の全量(100質量%)に対して、好ましくは30~100質量%、より好ましくは50~100質量%、更に好ましくは70~100質量%、より更に好ましくは85~100質量%である。
{Acrylic resin}
In one embodiment of the present invention, from the viewpoint of further improving the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable base material (Y), the pressure-sensitive resin contained in the composition (x1) is an acrylic resin. It is preferable to contain.
The content ratio of the acrylic resin in the adhesive resin is preferably from 30 to the total amount (100% by mass) of the adhesive resin contained in the composition (x1) from the viewpoint of further improving the interfacial adhesion. The amount is 100% by mass, more preferably 50 to 100% by mass, still more preferably 70 to 100% by mass, and still more preferably 85 to 100% by mass.
 粘着性樹脂として使用し得る、アクリル系樹脂としては、例えば、直鎖又は分岐鎖のアルキル基を有するアルキル(メタ)アクリレートに由来する構成単位を含む重合体、環状構造を有する(メタ)アクリレートに由来する構成単位を含む重合体等が挙げられる。 Examples of acrylic resins that can be used as adhesive resins include polymers containing structural units derived from alkyl (meth) acrylates having linear or branched alkyl groups, and (meth) acrylates having a cyclic structure. Examples thereof include a polymer containing a derived structural unit.
 アクリル系樹脂の質量平均分子量(Mw)としては、好ましくは10万~150万、より好ましくは20万~130万、更に好ましくは35万~120万、より更に好ましくは50万~110万である。 The mass average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 1,500,000, more preferably 200,000 to 1,300,000, still more preferably 350,000 to 1,200,000, still more preferably 500,000 to 1,100,000. .
 本発明の一態様で用いるアクリル系樹脂としては、アルキル(メタ)アクリレート(a1’)(以下、「モノマー(a1’)」ともいう。)に由来する構成単位(a1)を有するアクリル系重合体(A0)が好ましく、構成単位(a1)と共に、官能基含有モノマー(a2’)(以下、「モノマー(a2’)」ともいう。)に由来する構成単位(a2)を有するアクリル系共重合体(A1)がより好ましい。 As an acrylic resin used in one embodiment of the present invention, an acrylic polymer having a structural unit (a1) derived from alkyl (meth) acrylate (a1 ′) (hereinafter also referred to as “monomer (a1 ′)”). (A0) is preferred, and the acrylic copolymer having the structural unit (a2) derived from the functional group-containing monomer (a2 ′) (hereinafter also referred to as “monomer (a2 ′)”) together with the structural unit (a1). (A1) is more preferable.
 モノマー(a1’)が有するアルキル基の炭素数としては、粘着特性の向上の観点から、好ましくは1~24、より好ましくは1~12、更に好ましくは1~8、より更に好ましくは4~6である。
 なお、モノマー(a1’)が有するアルキル基は、直鎖アルキル基であってもよく、分岐鎖アルキル基であってもよい。
The number of carbon atoms of the alkyl group contained in the monomer (a1 ′) is preferably 1 to 24, more preferably 1 to 12, still more preferably 1 to 8, and still more preferably 4 to 6 from the viewpoint of improving adhesive properties. It is.
The alkyl group contained in the monomer (a1 ′) may be a linear alkyl group or a branched alkyl group.
 モノマー(a1’)としては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、ラウリル(メタ)アクリレート、トリデシル(メタ)アクリレート、ステアリル(メタ)アクリレート等が挙げられる。
 これらのモノマー(a1’)は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 モノマー(a1’)としては、メチル(メタ)アクリレート、ブチル(メタ)アクリレート及び2-エチルヘキシル(メタ)アクリレートが好ましく、メチル(メタ)アクリレート及びブチル(メタ)アクリレートがより好ましい。
Examples of the monomer (a1 ′) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, tridecyl ( Examples include meth) acrylate and stearyl (meth) acrylate.
These monomers (a1 ′) may be used alone or in combination of two or more.
As the monomer (a1 ′), methyl (meth) acrylate, butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate are preferable, and methyl (meth) acrylate and butyl (meth) acrylate are more preferable.
 構成単位(a1)の含有量は、アクリル系重合体(A0)又はアクリル系共重合体(A1)の全構成単位(100質量%)に対して、好ましくは50~100質量%、より好ましくは60~99.9質量%、更に好ましくは70~99.5質量%、より更に好ましくは80~99.0質量%である。 The content of the structural unit (a1) is preferably 50 to 100% by weight, more preferably based on the total structural unit (100% by weight) of the acrylic polymer (A0) or the acrylic copolymer (A1). It is 60 to 99.9% by mass, more preferably 70 to 99.5% by mass, and still more preferably 80 to 99.0% by mass.
 モノマー(a2’)が有する官能基は、後述の組成物(x1)が含有してもよい架橋剤と反応し、架橋起点となり得る官能基又は架橋促進効果を有する官能基を指し、例えば、水酸基、カルボキシ基、アミノ基、エポキシ基等が挙げられる。
 つまり、モノマー(a2’)としては、例えば、水酸基含有モノマー、カルボキシ基含有モノマー、アミノ基含有モノマー、エポキシ基含有モノマー等が挙げられる。
 これらのモノマー(a2’)は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 モノマー(a2’)としては、水酸基含有モノマー及びカルボキシ基含有モノマーが好ましい。
The functional group possessed by the monomer (a2 ′) refers to a functional group capable of reacting with a crosslinking agent that may be contained in the composition (x1) described later to serve as a crosslinking starting point or a functional group having a crosslinking accelerating effect. , Carboxy group, amino group, epoxy group and the like.
That is, examples of the monomer (a2 ′) include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer.
These monomers (a2 ′) may be used alone or in combination of two or more.
As the monomer (a2 ′), a hydroxyl group-containing monomer and a carboxy group-containing monomer are preferable.
 水酸基含有モノマーとしては、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、3-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート等のヒドロキシアルキル(メタ)アクリレート類;ビニルアルコール、アリルアルコール等の不飽和アルコール類等が挙げられる。 Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl (meth) ) And hydroxyalkyl (meth) acrylates such as 4-hydroxybutyl (meth) acrylate; and unsaturated alcohols such as vinyl alcohol and allyl alcohol.
 カルボキシ基含有モノマーとしては、例えば、(メタ)アクリル酸、クロトン酸等のエチレン性不飽和モノカルボン酸;フマル酸、イタコン酸、マレイン酸、シトラコン酸等のエチレン性不飽和ジカルボン酸及びその無水物;2-(アクリロイルオキシ)エチルサクシネート、2-カルボキシエチル(メタ)アクリレート等が挙げられる。
 モノマー(a2’)としては、2-ヒドロキシエチル(メタ)アクリレートが好ましい。
Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid; ethylenically unsaturated dicarboxylic acids such as fumaric acid, itaconic acid, maleic acid and citraconic acid, and anhydrides thereof. 2- (acryloyloxy) ethyl succinate, 2-carboxyethyl (meth) acrylate and the like.
As the monomer (a2 ′), 2-hydroxyethyl (meth) acrylate is preferable.
 構成単位(a2)の含有量は、前記アクリル系共重合体(A1)の全構成単位(100質量%)に対して、好ましくは0.1~40質量%、より好ましくは0.3~30質量%、更に好ましくは0.5~20質量%、より更に好ましくは0.7~10質量%である。 The content of the structural unit (a2) is preferably 0.1 to 40% by weight, more preferably 0.3 to 30%, based on the entire structural unit (100% by weight) of the acrylic copolymer (A1). % By mass, more preferably 0.5 to 20% by mass, still more preferably 0.7 to 10% by mass.
 アクリル系共重合体(A1)は、更にモノマー(a1’)及び(a2’)以外の他のモノマー(a3’)に由来の構成単位(a3)を有していてもよい。
 なお、アクリル系共重合体(A1)において、構成単位(a1)及び(a2)の含有量は、アクリル系共重合体(A1)の全構成単位(100質量%)に対して、好ましくは70~100質量%、より好ましくは80~100質量%、更に好ましくは90~100質量%、より更に好ましくは95~100質量%である。
The acrylic copolymer (A1) may further have a structural unit (a3) derived from another monomer (a3 ′) other than the monomers (a1 ′) and (a2 ′).
In the acrylic copolymer (A1), the content of the structural units (a1) and (a2) is preferably 70 with respect to the total structural units (100% by mass) of the acrylic copolymer (A1). To 100% by mass, more preferably 80 to 100% by mass, still more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass.
 モノマー(a3’)としては、例えば、エチレン、プロピレン、イソブチレン等のオレフィン類;塩化ビニル、ビニリデンクロリド等のハロゲン化オレフィン類;ブタジエン、イソプレン、クロロプレン等のジエン系モノマー類;シクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、イミド(メタ)アクリレート等の環状構造を有する(メタ)アクリレート;スチレン、α-メチルスチレン、ビニルトルエン、ギ酸ビニル、酢酸ビニル、アクリロニトリル、(メタ)アクリルアミド、(メタ)アクリロニトリル、(メタ)アクリロイルモルホリン、N-ビニルピロリドン等が挙げられる。
 モノマー(a3’)としては、酢酸ビニルが好ましい。
As the monomer (a3 ′), for example, olefins such as ethylene, propylene and isobutylene; halogenated olefins such as vinyl chloride and vinylidene chloride; diene monomers such as butadiene, isoprene and chloroprene; cyclohexyl (meth) acrylate, It has a cyclic structure such as benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, imide (meth) acrylate, etc. (Meth) acrylate; styrene, α-methylstyrene, vinyl toluene, vinyl formate, vinyl acetate, acrylonitrile, (meth) acrylamide, (meth) acrylonitrile, (meth) acryloyl mole Phosphorus, N- vinylpyrrolidone and the like.
As the monomer (a3 ′), vinyl acetate is preferable.
{ウレタン系樹脂}
 粘着性樹脂として使用し得る、ウレタン系樹脂としては、主鎖及び側鎖の少なくとも一方に、ウレタン結合及び尿素結合の1つ以上を有する重合体であれば、特に制限されない。
 具体的なウレタン系樹脂としては、例えば、ポリオールと多価イソシアネート化合物とを反応して得られるウレタン系プレポリマー(UX)等が挙げられる。
 なお、ウレタン系プレポリマー(UX)は、更に鎖延長剤を用いた鎖延長反応を施して得られたものであってもよい。
{Urethane resin}
The urethane resin that can be used as the adhesive resin is not particularly limited as long as it is a polymer having at least one of a urethane bond and a urea bond in at least one of the main chain and the side chain.
Specific examples of the urethane resin include a urethane prepolymer (UX) obtained by reacting a polyol and a polyvalent isocyanate compound.
The urethane prepolymer (UX) may be obtained by further subjecting to a chain extension reaction using a chain extender.
 ウレタン系樹脂の質量平均分子量(Mw)としては、好ましくは1万~20万、より好ましくは1.2万~15万、更に好ましくは1.5万~10万、より更に好ましくは2万~7万である。 The mass average molecular weight (Mw) of the urethane resin is preferably 10,000 to 200,000, more preferably 12,000 to 150,000, still more preferably 15,000 to 100,000, and still more preferably 20,000 to 70,000.
 ウレタン系プレポリマー(UX)の原料となるポリオールとしては、例えば、アルキレン型ポリオール、ポリエーテル型ポリオール、ポリエステル型ポリオール、ポリエステルアミド型ポリオール、ポリエステル・ポリエーテル型ポリオール、ポリカーボネート型ポリオール等のポリオール化合物が挙げられるが、ポリオールであれば特に限定はされず、2官能のジオール、3官能のトリオールであってもよい。
 これらのポリオールは、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 これらのポリオールの中でも、入手の容易性、反応性等の観点から、ジオールが好ましく、アルキレン型ジオールがより好ましい。
Examples of the polyol used as a raw material for the urethane-based prepolymer (UX) include polyol compounds such as alkylene type polyols, polyether type polyols, polyester type polyols, polyester amide type polyols, polyester / polyether type polyols, and polycarbonate type polyols. Although it is mentioned, if it is a polyol, it will not specifically limit, Bifunctional diol and a trifunctional triol may be sufficient.
These polyols may be used alone or in combination of two or more.
Among these polyols, diols are preferable and alkylene type diols are more preferable from the viewpoints of availability, reactivity, and the like.
 アルキレン型ジオールとしては、例えば、1,3-プロパンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、ネオペンチルグリコール、1,6-ヘキサンジオール等のアルカンジオール;エチレングリコール、プロピレングリコール、ジエチレングリコール、ジプロピレングリコール等のアルキレングリコール;ポリエチレングリコール、ポリプロピレングリコール、ポリブチレングリコール等のポリアルキレングリコール;ポリテトラメチレングリコール等のポリオキシアルキレングリコール;等が挙げられる。
 これらのアルキレン型ジオールの中でも、更に鎖延長剤との反応を行う際にゲル化を抑制する観点から、質量平均分子量(Mw)が1,000~3,000のグリコールが好ましい。
Examples of the alkylene type diol include alkane diols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol; ethylene glycol, propylene glycol, And alkylene glycols such as diethylene glycol and dipropylene glycol; polyalkylene glycols such as polyethylene glycol, polypropylene glycol, and polybutylene glycol; polyoxyalkylene glycols such as polytetramethylene glycol; and the like.
Among these alkylene diols, glycols having a mass average molecular weight (Mw) of 1,000 to 3,000 are preferred from the viewpoint of suppressing gelation when the reaction with a chain extender is performed.
 ウレタン系プレポリマー(UX)の原料となる多価イソシアネート化合物としては、芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環式ポリイソシアネート等が挙げられる。
 芳香族ポリイソシアネートとしては、例えば、1,3-フェニレンジイソシアネート、1,4-フェニレンジイソシアネート、4,4’-ジフェニルメタンジイソシアネート(MDI)、2,4-トリレンジイソシアネート(2,4-TDI)、2,6-トリレンジイソシアネート(2,6-TDI)、4,4’-トルイジンジイソシアネート、2,4,6-トリイソシアネートトルエン、1,3,5-トリイソシアネートベンゼン、ジアニシジンジイソシアネート、4,4’-ジフェニルエーテルジイソシアネート、4,4’,4”-トリフェニルメタントリイソシアネート、1,4-テトラメチルキシリレンジイソシアネート、1,3-テトラメチルキシリレンジイソシアネート等が挙げられる。
 脂肪族ポリイソシアネートとしては、例えば、トリメチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート(HMDI)、ペンタメチレンジイソシアネート、1,2-プロピレンジイソシアネート、2,3-ブチレンジイソシアネート、1,3-ブチレンジイソシアネート、ドデカメチレンジイソシアネート、2,4,4-トリメチルヘキサメチレンジイソシアネート等が挙げられる。
 脂環式ポリイソシアネートとしては、例えば、3-イソシアネートメチル-3,5,5-トリメチルシクロヘキシルイソシアネート(IPDI:イソホロンジイソシアネート)、1,3-シクロペンタンジイソシアネート、1,3-シクロヘキサンジイソシアネート、1,4-シクロヘキサンジイソシアネート、メチル-2,4-シクロヘキサンジイソシアネート、メチル-2,6-シクロヘキサンジイソシアネート、4,4’-メチレンビス(シクロヘキシルイソシアネート)、1,4-ビス(イソシアネートメチル)シクロヘキサン、1,4-ビス(イソシアネートメチル)シクロヘキサン等が挙げられる。
 なお、これらの多価イソシアネート化合物は、前記ポリイソシアネートのトリメチロールプロパンアダクト型変性体、水と反応させたビュウレット型変性体、イソシアヌレート環を含有させたイソシアヌレート型変性体であってもよい。
Examples of the polyvalent isocyanate compound that is a raw material for the urethane prepolymer (UX) include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.
Examples of the aromatic polyisocyanate include 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2 , 6-Tolylene diisocyanate (2,6-TDI), 4,4′-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4 ′ -Diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, 1,4-tetramethylxylylene diisocyanate, 1,3-tetramethylxylylene diisocyanate and the like.
Examples of the aliphatic polyisocyanate include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HMDI), pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, and dodeca. Examples include methylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.
Examples of the alicyclic polyisocyanate include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (IPDI: isophorone diisocyanate), 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4- Cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatemethyl) cyclohexane, 1,4-bis (isocyanate) Methyl) cyclohexane and the like.
In addition, these polyisocyanate compounds may be a trimethylolpropane adduct modified product of the polyisocyanate, a burette modified product reacted with water, or an isocyanurate modified product containing an isocyanurate ring.
 これらの多価イソシアネート化合物の中でも、粘着物性に優れたウレタン系ポリマーを得る観点から、4,4’-ジフェニルメタンジイソシアネート(MDI)、2,4-トリレンジイソシアネート(2,4-TDI)、2,6-トリレンジイソシアネート(2,6-TDI)、ヘキサメチレンジイソシアネート(HMDI)、3-イソシアネートメチル-3,5,5-トリメチルシクロヘキシルイソシアネート(IPDI)及びこれらの変性体から選ばれる1種以上が好ましく、耐候性の観点から、HMDI、IPDI及びこれらの変性体から選ばれる1種以上がより好ましい。 Among these polyvalent isocyanate compounds, 4,4′-diphenylmethane diisocyanate (MDI), 2,4-tolylene diisocyanate (2,4-TDI), 2, from the viewpoint of obtaining a urethane polymer having excellent adhesive properties. One or more selected from 6-tolylene diisocyanate (2,6-TDI), hexamethylene diisocyanate (HMDI), 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (IPDI) and modified products thereof are preferable. From the viewpoint of weather resistance, at least one selected from HMDI, IPDI, and modified products thereof is more preferable.
 ウレタン系プレポリマー(UX)中のイソシアネート基含有量(NCO%)は、JIS K1603-1:2007に準じて測定された値において、好ましくは0.5~12質量%、より好ましくは1~4質量%である。 The isocyanate group content (NCO%) in the urethane prepolymer (UX) is preferably 0.5 to 12% by mass, more preferably 1 to 4 in a value measured according to JIS K1603-1: 2007. % By mass.
 鎖延長剤としては、水酸基及びアミノ基の少なくとも一方を2つ有する化合物、又は、水酸基及びアミノ基の少なくとも一方を3つ以上有する化合物が好ましい。 As the chain extender, a compound having at least one of hydroxyl group and amino group, or a compound having at least three of hydroxyl group and amino group is preferable.
 水酸基及びアミノ基の少なくとも一方を2つ有する化合物としては、脂肪族ジオール、脂肪族ジアミン、アルカノールアミン、ビスフェノール、芳香族ジアミンからなる群より選ばれる少なくとも1種の化合物が好ましい。
 脂肪族ジオールとしては、例えば、1,3-プロパンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、ネオペンチルグリコール、1,6-ヘキサンジオール、1,7-ヘプタンジオール等のアルカンジオール;エチレングリコール、プロピレングリコール、ジエチレングリコール、ジプロピレングリコール等のアルキレングリコール;等が挙げられる。
 脂肪族ジアミンとしては、例えば、エチレンジアミン、1,3-プロパンジアミン、1,4-ブタンジアミン、1,5-ペンタンジアミン、1,6-ヘキサンジアミン等が挙げられる。
 アルカノールアミンとしては、例えば、モノエタノールアミン、モノプロパノールアミン、イソプロパノールアミン等が挙げられる。
 ビスフェノールとしては、例えば、ビスフェノールA等が挙げられる。
 芳香族ジアミンとしては、例えば、ジフェニルメタンジアミン、トリレンジアミン、キシリレンジアミン等が挙げられる。
The compound having at least one of a hydroxyl group and an amino group is preferably at least one compound selected from the group consisting of aliphatic diols, aliphatic diamines, alkanolamines, bisphenols, and aromatic diamines.
Examples of the aliphatic diol include alkanediols such as 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, and 1,7-heptanediol. Alkylene glycols such as ethylene glycol, propylene glycol, diethylene glycol and dipropylene glycol;
Examples of the aliphatic diamine include ethylenediamine, 1,3-propanediamine, 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, and the like.
Examples of the alkanolamine include monoethanolamine, monopropanolamine, isopropanolamine and the like.
Examples of bisphenol include bisphenol A and the like.
Examples of the aromatic diamine include diphenylmethanediamine, tolylenediamine, xylylenediamine, and the like.
 水酸基及びアミノ基の少なくとも一方を3つ以上有する化合物としては、例えば、トリメチロールプロパン、ジトリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール等のポリオール;1-アミノ-2,3-プロパンジオール、1-メチルアミノ-2,3-プロパンジオール、N-(2-ヒドロキシプロピルエタノールアミン)等のアミノアルコール;テトラメチルキシリレンジアミンのエチレンオキシド又はプロピレンオキシド付加物;等が挙げられる。 Examples of the compound having at least three hydroxyl groups and amino groups include polyols such as trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol; 1-amino-2,3-propanediol, 1-methyl And amino alcohols such as amino-2,3-propanediol and N- (2-hydroxypropylethanolamine); ethylene oxide or propylene oxide adducts of tetramethylxylylenediamine;
{ポリイソブチレン系樹脂}
 粘着性樹脂として使用し得る、ポリイソブチレン系樹脂(以下、「PIB系樹脂」ともいう。)は、主鎖及び側鎖の少なくとも一方にポリイソブチレン骨格を有する樹脂であれば、特に制限はされない。
{Polyisobutylene resin}
The polyisobutylene resin (hereinafter also referred to as “PIB resin”) that can be used as an adhesive resin is not particularly limited as long as it has a polyisobutylene skeleton in at least one of a main chain and a side chain.
 PIB系樹脂の質量平均分子量(Mw)としては、好ましくは2万以上、より好ましくは3万~100万、更に好ましくは5万~80万、より更に好ましくは7万~60万である。 The mass average molecular weight (Mw) of the PIB resin is preferably 20,000 or more, more preferably 30,000 to 1,000,000, still more preferably 50,000 to 800,000, and still more preferably 70,000 to 600,000.
 PIB系樹脂としては、例えば、イソブチレンの単独重合体であるポリイソブチレン、イソブチレンとイソプレンの共重合体、イソブチレンとn-ブテンの共重合体、イソブチレンとブタジエンの共重合体、及びこれら共重合体を臭素化又は塩素化等したハロゲン化ブチルゴム等が挙げられる。 Examples of the PIB resin include polyisobutylene which is a homopolymer of isobutylene, a copolymer of isobutylene and isoprene, a copolymer of isobutylene and n-butene, a copolymer of isobutylene and butadiene, and these copolymers. Examples thereof include halogenated butyl rubber that has been brominated or chlorinated.
 なお、PIB系樹脂が共重合体である場合、イソブチレンからなる構成単位が、全構成単位の中で一番多く含まれているものとする。
 イソブチレンからなる構成単位の含有量は、PIB系樹脂の全構成単位(100質量%)に対して、好ましくは80~100質量%、より好ましくは90~100質量%、更に好ましくは95~100質量%である。
 これらのPIB系樹脂は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
When the PIB-based resin is a copolymer, it is assumed that the structural unit composed of isobutylene is contained in the largest amount among all the structural units.
The content of the structural unit composed of isobutylene is preferably 80 to 100% by mass, more preferably 90 to 100% by mass, and still more preferably 95 to 100% by mass with respect to all the structural units (100% by mass) of the PIB resin. %.
These PIB-based resins may be used alone or in combination of two or more.
 また、PIB系樹脂を用いる場合、質量平均分子量(Mw)が高いPIB系樹脂と、質量平均分子量(Mw)が低いPIB系樹脂とを併用することが好ましい。
 より具体的には、質量平均分子量(Mw)が27万~60万のPIB系樹脂(p1)(以下、「PIB系樹脂(p1)」ともいう。)と、質量平均分子量(Mw)が5万~25万のPIB系樹脂(p2)(以下、「PIB系樹脂(p2)」ともいう。)とを併用することが好ましい。
 質量平均分子量(Mw)の高いPIB系樹脂(p1)を用いることで、形成される粘着剤層の耐久性及び耐候性を向上させると共に、粘着力を向上させることもできる。
 また、質量平均分子量(Mw)の低いPIB系樹脂(p2)を用いることで、PIB系樹脂(p1)と良好に相溶して、適度にPIB系樹脂(p1)を可塑化させることができ、粘着剤層の被着体に対する濡れ性を高め、粘着物性、柔軟性等を向上させることができる。
Moreover, when using PIB-type resin, it is preferable to use together PIB-type resin with a high mass average molecular weight (Mw) and PIB-type resin with a low mass average molecular weight (Mw).
More specifically, a PIB resin (p1) having a mass average molecular weight (Mw) of 270,000 to 600,000 (hereinafter also referred to as “PIB resin (p1)”), and a mass average molecular weight (Mw) of 5 It is preferable to use 10,000 to 250,000 PIB resin (p2) (hereinafter also referred to as “PIB resin (p2)”) in combination.
By using the PIB resin (p1) having a high mass average molecular weight (Mw), the durability and weather resistance of the pressure-sensitive adhesive layer to be formed can be improved, and the adhesive strength can also be improved.
Further, by using a PIB resin (p2) having a low mass average molecular weight (Mw), it can be well compatible with the PIB resin (p1), and the PIB resin (p1) can be appropriately plasticized. The wettability of the pressure-sensitive adhesive layer to the adherend can be improved, and the physical properties of adhesive, flexibility and the like can be improved.
 PIB系樹脂(p1)の質量平均分子量(Mw)は、好ましくは27万~60万、より好ましくは29万~48万、更に好ましくは31万~45万、より更に好ましくは32万~40万である。
 PIB系樹脂(p2)の質量平均分子量(Mw)は、好ましくは5万~25万、より好ましくは8万~23万、更に好ましくは14万~22万、より更に好ましくは18万~21万である。
The mass average molecular weight (Mw) of the PIB resin (p1) is preferably 270,000 to 600,000, more preferably 290,000 to 480,000, still more preferably 310,000 to 450,000, and even more preferably 320,000 to 400,000. It is.
The mass average molecular weight (Mw) of the PIB resin (p2) is preferably 50,000 to 250,000, more preferably 80,000 to 230,000, still more preferably 140,000 to 220,000, and still more preferably 180,000 to 210,000. It is.
 PIB系樹脂(p1)100質量部に対する、PIB系樹脂(p2)の含有割合は、好ましくは5~55質量部、より好ましくは6~40質量部、更に好ましくは7~30質量部、より更に好ましくは8~20質量部である。 The content ratio of the PIB resin (p2) to 100 parts by mass of the PIB resin (p1) is preferably 5 to 55 parts by mass, more preferably 6 to 40 parts by mass, still more preferably 7 to 30 parts by mass, and even more. The amount is preferably 8 to 20 parts by mass.
{オレフィン系樹脂}
 粘着性樹脂として使用し得る、オレフィン系樹脂は、エチレン、プロピレン等のオレフィン化合物に由来する構成単位を有する重合体であれば、特に制限はされない。
 当該オレフィン系樹脂は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 具体的なオレフィン系樹脂としては、例えば、低密度ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、及び線状低密度ポリエチレン等のポリエチレン、ポリプロピレン、エチレンとプロピレンとの共重合体、エチレンと他のα-オレフィンとの共重合体、プロピレンと他のα-オレフィンとの共重合体、エチレンとプロピレンと他のα-オレフィンとの共重合体、エチレンと他のエチレン性不飽和単量体との共重合体(エチレン-酢酸ビニル共重合体、エチレン-アルキル(メタ)アクリレート共重合体等)等が挙げられる。
 前記のα-オレフィンとしては、例えば、1-ブテン、1-ペンテン、1-ヘキセン、1-ヘプテン、1-オクテン、4-メチル-1-ペンテン、4-メチル-1-ヘキセン等が挙げられる。
 前記のエチレン性不飽和単量体としては、例えば、酢酸ビニル、アルキル(メタ)アクリレート、ビニルアルコール等が挙げられる。
{Olefin resin}
The olefin resin that can be used as the adhesive resin is not particularly limited as long as it is a polymer having a structural unit derived from an olefin compound such as ethylene or propylene.
The said olefin resin may be used independently and may be used in combination of 2 or more type.
Specific examples of the olefin-based resin include polyethylenes such as low density polyethylene, medium density polyethylene, high density polyethylene, and linear low density polyethylene, polypropylene, copolymers of ethylene and propylene, ethylene and other α- Copolymers of olefins, copolymers of propylene and other α-olefins, copolymers of ethylene, propylene and other α-olefins, copolymers of ethylene and other ethylenically unsaturated monomers Examples thereof include ethylene (vinyl-vinyl acetate copolymer, ethylene-alkyl (meth) acrylate copolymer, etc.) and the like.
Examples of the α-olefin include 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4-methyl-1-pentene, 4-methyl-1-hexene and the like.
Examples of the ethylenically unsaturated monomer include vinyl acetate, alkyl (meth) acrylate, vinyl alcohol, and the like.
(粘着付与剤)
 本発明の一態様において、粘着力をより向上させた粘着シートとする観点から、組成物(x1)は、更に粘着付与剤を含有することが好ましい。
 ここで、「粘着付与剤」とは、粘着性樹脂の粘着力を補助的に向上させる成分であって、質量平均分子量(Mw)が1万未満のオリゴマーを指し、前述の粘着性樹脂とは区別されるものである。
 粘着付与剤の質量平均分子量(Mw)は、好ましくは400~10,000、より好ましくは500~8,000、更に好ましくは800~5,000である。
(Tackifier)
In one embodiment of the present invention, it is preferable that the composition (x1) further contains a tackifier from the viewpoint of obtaining a pressure-sensitive adhesive sheet with improved adhesive strength.
Here, the “tackifier” is a component that assists in improving the adhesive strength of the adhesive resin, and refers to an oligomer having a mass average molecular weight (Mw) of less than 10,000. It is a distinction.
The weight average molecular weight (Mw) of the tackifier is preferably 400 to 10,000, more preferably 500 to 8,000, and still more preferably 800 to 5,000.
 粘着付与剤としては、例えば、ロジン樹脂、ロジンエステル樹脂、ロジン変性フェノール樹脂等のロジン系樹脂;これらロジン系樹脂を水素化した水素化ロジン系樹脂;テルペン樹脂、芳香族変性テルペン樹脂、テルペンフェノール系樹脂等のテルペン系樹脂;これらテルペン系樹脂を水素化した水素化テルペン系樹脂;α-メチルスチレン又はβ-メチルスチレン等のスチレン系モノマーと脂肪族系モノマーとを共重合して得られるスチレン系樹脂;これらスチレン系樹脂を水素化した水素化スチレン系樹脂;石油ナフサの熱分解で生成するペンテン、イソプレン、ピペリン、1,3-ペンタジエン等のC5留分を共重合して得られるC5系石油樹脂及びこのC5系石油樹脂の水素化石油樹脂;石油ナフサの熱分解で生成するインデン、ビニルトルエン等のC9留分を共重合して得られるC9系石油樹脂及びこのC9系石油樹脂を水素化石油樹脂;等が挙げられる。
 これらの粘着付与剤は、単独で用いてもよく、軟化点や構造が異なる2種以上を組み合わせて用いてもよい。
Examples of tackifiers include rosin resins such as rosin resins, rosin ester resins, and rosin-modified phenol resins; hydrogenated rosin resins obtained by hydrogenating these rosin resins; terpene resins, aromatic modified terpene resins, and terpene phenols. Terpene resins such as epoxy resins; hydrogenated terpene resins obtained by hydrogenating these terpene resins; styrene obtained by copolymerizing a styrene monomer such as α-methylstyrene or β-methylstyrene with an aliphatic monomer Hydrogenated styrene resins obtained by hydrogenating these styrene resins; C5 systems obtained by copolymerizing C5 fractions such as pentene, isoprene, piperine, 1,3-pentadiene generated by thermal decomposition of petroleum naphtha Petroleum resin and hydrogenated petroleum resin of this C5 petroleum resin; indene and vinyli produced by thermal decomposition of petroleum naphtha And C9 petroleum resins obtained by copolymerizing C9 fractions such as toluene and hydrogenated petroleum resins.
These tackifiers may be used alone or in combination of two or more different softening points and structures.
 粘着付与剤の軟化点は、好ましくは60~170℃、より好ましくは65~160℃、更に好ましくは70~150℃である。
 なお、本明細書において、粘着付与剤の「軟化点」は、JIS K2531に準拠して測定した値を意味する。
 また、2種以上の複数の粘着付与剤を用いる場合、それら複数の粘着付与剤の軟化点の加重平均が、前記範囲に属することが好ましい。
The softening point of the tackifier is preferably 60 to 170 ° C, more preferably 65 to 160 ° C, and still more preferably 70 to 150 ° C.
In the present specification, the “softening point” of the tackifier means a value measured according to JIS K2531.
Moreover, when using 2 or more types of several tackifier, it is preferable that the weighted average of the softening point of these several tackifier belongs to the said range.
 組成物(x1)中の粘着付与剤の含有量は、組成物(x1)中の有効成分の全量(100質量%)に対して、好ましくは0.01~65質量%、より好ましくは0.05~55質量%、更に好ましくは0.1~50質量%、より更に好ましくは0.5~45質量%、より更に好ましくは1.0~40質量%である。 The content of the tackifier in the composition (x1) is preferably 0.01 to 65% by mass, more preferably 0.00%, based on the total amount (100% by mass) of the active ingredients in the composition (x1). It is 05 to 55% by mass, more preferably 0.1 to 50% by mass, still more preferably 0.5 to 45% by mass, and still more preferably 1.0 to 40% by mass.
 なお、組成物(x1)中の粘着性樹脂及び粘着付与剤の合計含有量は、組成物(x1)の有効成分の全量(100質量%)に対して、好ましくは70質量%以上、より好ましくは80質量%以上、更に好ましくは85質量%以上、より更に好ましくは90質量%以上、より更に好ましくは95質量%以上である。 In addition, the total content of the adhesive resin and the tackifier in the composition (x1) is preferably 70% by mass or more, more preferably based on the total amount (100% by mass) of the active ingredients in the composition (x1). Is 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and still more preferably 95% by mass or more.
(架橋剤)
 本発明の一態様において、組成物(x1)は、前述の構成単位(a1)及び(a2)を有するアクリル系共重合体等の前述の官能基を有する粘着性樹脂と共に、更に架橋剤を含有することが好ましい。
 当該架橋剤は、当該粘着性樹脂が有する官能基と反応して、樹脂同士を架橋するものである。
(Crosslinking agent)
In one embodiment of the present invention, the composition (x1) further contains a crosslinking agent together with the above-mentioned pressure-sensitive adhesive resin having a functional group such as an acrylic copolymer having the structural units (a1) and (a2). It is preferable to do.
The said crosslinking agent reacts with the functional group which the said adhesive resin has, and bridge | crosslinks resin.
 架橋剤としては、例えば、トリレンジイソシアネート、キシリレンジイソシアネート、ヘキサメチレンジイソシアネート等、及びそれらのアダクト体等のイソシアネート系架橋剤;エチレングリコールグリシジルエーテル等のエポキシ系架橋剤;ヘキサ〔1-(2-メチル)-アジリジニル〕トリフオスファトリアジン等のアジリジン系架橋剤;アルミニウムキレート等のキレート系架橋剤;等が挙げられる。
 これらの架橋剤は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。これらの架橋剤の中でも、凝集力を高めて粘着力を向上させる観点、及び入手し易さ等の観点から、イソシアネート系架橋剤が好ましい。
Examples of the cross-linking agent include tolylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, and the like, and adducts thereof; epoxy cross-linking agents such as ethylene glycol glycidyl ether; hexa [1- (2- Methyl) -aziridinyl] triphosphatriazine and other aziridine crosslinkers; aluminum chelates and other chelate crosslinkers; and the like.
These cross-linking agents may be used alone or in combination of two or more. Among these crosslinking agents, an isocyanate-based crosslinking agent is preferable from the viewpoints of increasing cohesive force and improving adhesive force, and availability.
 架橋剤の含有量は、粘着性樹脂が有する官能基の数により適宜調整されるものであるが、例えば、前記アクリル系共重合体等の前述の官能基を有する粘着性樹脂100質量部に対して、好ましくは0.01~10質量部、より好ましくは0.03~7質量部、更に好ましくは0.05~5質量部である。 The content of the cross-linking agent is appropriately adjusted depending on the number of functional groups of the adhesive resin. For example, with respect to 100 parts by mass of the adhesive resin having the above-described functional groups such as the acrylic copolymer. The amount is preferably 0.01 to 10 parts by mass, more preferably 0.03 to 7 parts by mass, and still more preferably 0.05 to 5 parts by mass.
(粘着剤用添加剤)
 本発明の一態様において、組成物(x1)は、本発明の効果を損なわない範囲で、前述の粘着付与剤及び架橋剤以外の一般的な粘着剤に使用される粘着剤用添加剤を含有していてもよい。
 当該粘着剤用添加剤としては、例えば、酸化防止剤、軟化剤(可塑剤)、防錆剤、顔料、染料、遅延剤、触媒、紫外線吸収剤等が挙げられる。
 なお、これらの粘着剤用添加剤は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
 これらの粘着剤用添加剤を含有する場合、各粘着剤用添加剤の含有量は、それぞれ独立に、粘着性樹脂100質量部に対して、好ましくは0.0001~20質量部、より好ましくは0.001~10質量部である。
(Adhesive additive)
In one aspect of the present invention, the composition (x1) contains an additive for pressure-sensitive adhesives used for general pressure-sensitive adhesives other than the above-described tackifier and cross-linking agent as long as the effects of the present invention are not impaired. You may do it.
Examples of the adhesive additive include an antioxidant, a softening agent (plasticizer), a rust inhibitor, a pigment, a dye, a retarder, a catalyst, and an ultraviolet absorber.
These pressure-sensitive adhesive additives may be used alone or in combination of two or more.
When these pressure-sensitive adhesive additives are contained, the content of each pressure-sensitive adhesive additive is preferably independently 0.0001 to 20 parts by mass, more preferably 100 parts by mass of the adhesive resin. 0.001 to 10 parts by mass.
(希釈溶媒)
 本発明の一態様において、組成物(x1)は、前述の各種有効成分と共に、希釈溶媒として、水や有機溶媒を含有し、溶液の形態としてもよい。
 有機溶媒としては、前述の組成物(y)を溶液の形態に調製する際に使用する有機溶媒と同じものが挙げられる。
 なお、組成物(x1)中に含まれる希釈溶媒は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
(Diluted solvent)
In one embodiment of the present invention, the composition (x1) may contain water or an organic solvent as a diluent solvent together with the various active ingredients described above, and may be in the form of a solution.
As an organic solvent, the same thing as the organic solvent used when preparing the above-mentioned composition (y) in the form of a solution is mentioned.
In addition, the dilution solvent contained in a composition (x1) may be used independently, and may be used in combination of 2 or more type.
 組成物(x1)が希釈溶媒を含有して溶液の形態である場合、組成物(x1)の有効成分濃度としては、好ましくは0.1~60質量%、より好ましくは0.5~50質量%、更に好ましくは1.0~45質量%である。 When the composition (x1) is in the form of a solution containing a diluting solvent, the active ingredient concentration of the composition (x1) is preferably 0.1 to 60% by mass, more preferably 0.5 to 50% by mass. %, More preferably 1.0 to 45% by mass.
〔粘着剤層(X2)〕
 本発明の一態様の粘着シートが有する粘着剤層(X2)は、粘着性樹脂を含む組成物(x2)から形成された層であり、粘着性を有する。
 粘着剤層(X2)の好適な物性については、粘着剤層(X1)のそれと同様である。
 また、粘着剤層(X2)の形成材料である組成物(x2)についても、粘着剤層(X1)の形成材料である組成物(x1)と同様のものを用いることができる。
[Adhesive layer (X2)]
The pressure-sensitive adhesive layer (X2) included in the pressure-sensitive adhesive sheet of one embodiment of the present invention is a layer formed from a composition (x2) containing a pressure-sensitive adhesive resin, and has pressure-sensitive adhesiveness.
Suitable physical properties of the pressure-sensitive adhesive layer (X2) are the same as those of the pressure-sensitive adhesive layer (X1).
Moreover, about the composition (x2) which is a forming material of an adhesive layer (X2), the thing similar to the composition (x1) which is a forming material of an adhesive layer (X1) can be used.
〔剥離材〕
 本発明の一態様の粘着シートが有する剥離材13、131、132としては、両面剥離処理をされた剥離シートや、片面剥離処理された剥離シート等が用いられ、剥離材用の基材上に剥離剤を塗布したもの等が挙げられる。
 本発明の一態様の粘着シートにおいて、積層体を挟持する2枚の剥離材131及び剥離材132は、剥離力の差が異なるように調整されたものであることが好ましい。
[Release material]
As the release materials 13, 131, and 132 included in the pressure-sensitive adhesive sheet of one embodiment of the present invention, a release sheet that has been subjected to a double-sided release process, a release sheet that has been subjected to a single-sided release process, and the like are used. The thing etc. which apply | coated the release agent are mentioned.
In the pressure-sensitive adhesive sheet of one embodiment of the present invention, the two release materials 131 and the release material 132 that sandwich the laminate are preferably adjusted so that the difference in the release force is different.
 剥離材用基材としては、例えば、上質紙、グラシン紙、クラフト紙等の紙類;ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンナフタレート樹脂等のポリエステル樹脂フィルム、ポリプロピレン樹脂、ポリエチレン樹脂等のオレフィン樹脂フィルム等のプラスチックフィルム;等が挙げられる。 Examples of the base material for the release material include papers such as high-quality paper, glassine paper, and kraft paper; polyester resin films such as polyethylene terephthalate resin, polybutylene terephthalate resin, and polyethylene naphthalate resin; and olefins such as polypropylene resin and polyethylene resin. A plastic film such as a resin film;
 剥離剤としては、例えば、シリコーン系樹脂、オレフィン系樹脂、イソプレン系樹脂、ブタジエン系樹脂等のゴム系エラストマー、長鎖アルキル系樹脂、アルキド系樹脂、フッ素系樹脂等が挙げられる。 Examples of the release agent include silicone-based resins, olefin-based resins, isoprene-based resins, rubber-based elastomers such as butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins.
 剥離材の厚さは、特に制限ないが、好ましくは10~200μm、より好ましくは25~170μm、更に好ましくは35~80μmである。 The thickness of the release material is not particularly limited, but is preferably 10 to 200 μm, more preferably 25 to 170 μm, and still more preferably 35 to 80 μm.
≪粘着シートの製造方法≫
 本発明の粘着シートの製造方法は、下記工程(1A)及び(2A)を含む方法であることが好ましい。
 本発明の粘着シートの製造方法は、従来の製造方法と比べて、粘着シートを製造する際の工程数を低減し得るため、生産性を向上させることができる。
・工程(1A):組成物(x1)からなる塗膜(x1’)と、組成物(y)からなる塗膜(y’)とをこの順で直接積層して形成する工程。
・工程(2A):塗膜(x1’)及び塗膜(y’)を同時に乾燥させて、粘着剤層(X1)及び熱膨張性基材(Y)がこの順で直接積層されている積層体を形成する工程。
 以下、工程(1A)及び(2A)について説明する。
≪Method for manufacturing adhesive sheet≫
It is preferable that the manufacturing method of the adhesive sheet of this invention is a method including the following process (1A) and (2A).
Since the manufacturing method of the adhesive sheet of this invention can reduce the number of processes at the time of manufacturing an adhesive sheet compared with the conventional manufacturing method, it can improve productivity.
Step (1A): A step of directly laminating a coating film (x1 ′) made of the composition (x1) and a coating film (y ′) made of the composition (y) in this order.
Step (2A): Laminate in which the coating film (x1 ′) and the coating film (y ′) are simultaneously dried, and the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) are directly laminated in this order. Forming the body.
Hereinafter, steps (1A) and (2A) will be described.
 工程(1A)において、塗膜(x1’)及び塗膜(y’)の形成方法としては、例えば、塗膜(x1’)を形成した後、塗膜(x1’)上に塗膜(y’)を形成するといった逐次形成する方法でもよいが、生産性及び界面密着性の観点から、組成物(x1)及び組成物(y)を同時に塗布し、塗膜(x1’)及び塗膜(y’)を同時に形成する方法が好ましい。
 なお、取扱性の観点から、塗膜(x1’)又は塗膜(y’)は、剥離材の剥離処理面上に形成することが好ましい。
In the step (1A), as a method for forming the coating film (x1 ′) and the coating film (y ′), for example, after the coating film (x1 ′) is formed, the coating film (x1 ′) is coated on the coating film (x1 ′). ') May be sequentially formed, but from the viewpoint of productivity and interfacial adhesion, the composition (x1) and the composition (y) are simultaneously applied to form the coating film (x1') and the coating film ( A method of simultaneously forming y ′) is preferred.
In addition, from a viewpoint of handleability, it is preferable to form the coating film (x1 ′) or the coating film (y ′) on the release treatment surface of the release material.
 塗膜(x1’)及び塗膜(y’)を逐次形成する際に、組成物(x1)及び組成物(y)の塗布に用いるコーターとしては、例えば、スピンコーター、スプレーコーター、バーコーター、ナイフコーター、ロールコーター、ナイフロールコーター、ブレードコーター、グラビアコーター、カーテンコーター、ダイコーター等が挙げられる。 As the coater used for coating the composition (x1) and the composition (y) when sequentially forming the coating film (x1 ′) and the coating film (y ′), for example, a spin coater, a spray coater, a bar coater, Examples include knife coaters, roll coaters, knife roll coaters, blade coaters, gravure coaters, curtain coaters, and die coaters.
 組成物(x1)及び組成物(y)を同時に塗布する際に用いるコーターとしては、多層コーターが挙げられ、具体的には、多層カーテンコーター、多層ダイコーター等が挙げられる。これらの中でも、操作性の観点から、多層ダイコーターが好ましい。 Examples of the coater used when the composition (x1) and the composition (y) are simultaneously applied include a multilayer coater, and specifically, a multilayer curtain coater, a multilayer die coater, and the like. Among these, a multilayer die coater is preferable from the viewpoint of operability.
 なお、各塗膜を形成し易くし、生産性を向上させる観点から、組成物(x1)、組成物(y)が、それぞれ独立に、更に希釈溶媒を含有することが好ましい。
 希釈溶媒としては、粘着シートの欄で説明した前述の希釈溶媒が使用できる。
 また、各組成物に希釈溶媒を配合して得られる溶液の有効成分濃度は、粘着シートの欄で前述したとおりである。
In addition, it is preferable that a composition (x1) and a composition (y) contain a dilution solvent each independently further from a viewpoint of making each coating film easy to form and improving productivity.
As a dilution solvent, the above-mentioned dilution solvent demonstrated in the column of the adhesive sheet can be used.
Moreover, the active ingredient density | concentration of the solution obtained by mix | blending a dilution solvent with each composition is as having mentioned above in the column of the adhesive sheet.
 なお、本工程(1A)において、塗膜(x1’)及び塗膜(y’)の1層以上の塗膜を形成後に、後述する工程(2A)の前に、当該塗膜の硬化反応が進行しない程度のプレ乾燥処理を施してもよい。
 例えば、塗膜(x1’)及び塗膜(y’)の各塗膜の形成ごとに、その都度プレ乾燥処理を行ってもよく、塗膜(x1’)及び塗膜(y’)の2層の塗膜を形成後に、当該2層に同時にプレ乾燥処理を行ってもよい。プレ乾燥を行なう場合、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性をより良好とする観点からは、塗膜(x1’)及び塗膜(y’)の2層の塗膜を形成後に、当該2層を同時にプレ乾燥処理する方が好ましい。
 本工程(1A)における、プレ乾燥処理を行う際の乾燥温度としては、通常は、形成した塗膜の硬化が進行しない程度の温度範囲で適宜設定されるが、好ましくは工程(2A)での乾燥温度未満である。
 「工程(2A)での乾燥温度未満」との規定が示す具体的な乾燥温度としては、好ましくは10~45℃、より好ましくは10~34℃、更に好ましくは15~30℃である。
In addition, in this process (1A), after forming the coating film of 1 layer or more of a coating film (x1 ') and a coating film (y'), before the process (2A) mentioned later, the hardening reaction of the said coating film is carried out. You may give the predrying process of the grade which does not advance.
For example, a pre-drying treatment may be performed each time the coating film (x1 ′) and the coating film (y ′) are formed, and the coating film (x1 ′) and the coating film (y ′) 2 You may perform a predrying process simultaneously to the said 2 layer after forming the coating film of a layer. When pre-drying is performed, from the viewpoint of improving the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y), the coating film (x1 ′) and the coating film (y ′) 2 It is preferable to pre-dry the two layers simultaneously after forming the coating film of the layers.
In this step (1A), the drying temperature at the time of performing the pre-drying treatment is usually appropriately set within a temperature range in which the formed coating film does not cure, but preferably in step (2A). Below the drying temperature.
The specific drying temperature indicated by the phrase “below the drying temperature in step (2A)” is preferably 10 to 45 ° C., more preferably 10 to 34 ° C., and further preferably 15 to 30 ° C.
 工程(2A)において、塗膜(x1’)及び塗膜(y’)を同時に乾燥させて前記積層体を形成する。
 この乾燥過程において、塗膜(x1’)と塗膜(y’)との界面で、混層が生じ、塗膜(x1’)中の粘着性樹脂と塗膜(y’)中の樹脂とが絡み合う状態で乾燥して硬化することで、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性が向上するものと考えられる。
In the step (2A), the coating film (x1 ′) and the coating film (y ′) are simultaneously dried to form the laminate.
In this drying process, a mixed layer is formed at the interface between the coating film (x1 ′) and the coating film (y ′), and the adhesive resin in the coating film (x1 ′) and the resin in the coating film (y ′) are separated. It is thought that the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) is improved by drying and curing in an intertwined state.
 工程(2A)における塗膜の乾燥温度としては、好ましくは60~150℃、より好ましくは70~145℃、更に好ましくは80~140℃、より更に好ましくは90~135℃である。 The drying temperature of the coating film in the step (2A) is preferably 60 to 150 ° C, more preferably 70 to 145 ° C, still more preferably 80 to 140 ° C, and still more preferably 90 to 135 ° C.
 本発明の一態様の粘着シートである粘着剤層(X2)を更に含む積層体を有する粘着シートを製造する場合には、本発明の製造方法は、熱膨張性基材(Y)の粘着剤層(X1)とは反対側の表面上に粘着剤層(X2)を形成する工程を更に含む方法であれば、特に限定されない。例えば、以下の実施形態(A)の製造方法及び実施形態(B)の製造方法が挙げられ、生産性及び熱膨張性基材(Y)と粘着剤層(X2)との界面密着性の観点から実施形態(B)の製造方法の方が好ましい。 When manufacturing the adhesive sheet which has a laminated body which further contains the adhesive layer (X2) which is an adhesive sheet of 1 aspect of this invention, the manufacturing method of this invention is the adhesive of a thermally expansible base material (Y). If it is a method further including the process of forming an adhesive layer (X2) on the surface on the opposite side to a layer (X1), it will not specifically limit. For example, the manufacturing method of the following embodiment (A) and the manufacturing method of embodiment (B) are mentioned, and the viewpoint of the interfacial adhesion between the productivity and the thermally expandable substrate (Y) and the pressure-sensitive adhesive layer (X2). To the embodiment (B) is more preferable.
 実施形態(A)の製造方法は、前述の工程(1A)及び(2A)に加えて、下記の工程(3A-1)~(3A-4)のいずれかを含む。
・工程(3A-1):粘着性樹脂を含む組成物(x2)を加熱溶融して、工程(2A)で得られた熱膨張性基材(Y)の前記表面上に押出ラミネートする工程。
・工程(3A-2):粘着性樹脂を含む組成物(x2)からなる塗膜(x2’)を、工程(2A)で得られた熱膨張性基材(Y)の前記表面上に形成し、その塗膜(x2’)を乾燥する工程。
・工程(3A-3):粘着性樹脂を含む組成物(x2)を加熱溶融して、剥離材の剥離処理面上に、押出成形により粘着剤層(X2)を予め作成し、工程(2A)で得られた熱膨張性基材(Y)の前記表面上に、該剥離材上に形成した粘着剤層(X2)を直接貼付する工程。
・工程(3A-4):剥離材の剥離処理面上に、粘着性樹脂を含む組成物(x2)を塗布して塗膜(x2’)を形成し、その塗膜(x2’)を乾燥させて粘着剤層(X2)を予め形成し、工程(2A)で得られた熱膨張性基材(Y)の前記表面上に、該剥離材上に形成した粘着剤層(X2)を直接貼付する工程。
The manufacturing method of the embodiment (A) includes any of the following steps (3A-1) to (3A-4) in addition to the steps (1A) and (2A) described above.
Step (3A-1): A step of heat-melting the composition (x2) containing an adhesive resin and extrusion laminating it on the surface of the thermally expandable substrate (Y) obtained in the step (2A).
Step (3A-2): Forming a coating film (x2 ′) composed of a composition (x2) containing an adhesive resin on the surface of the thermally expandable substrate (Y) obtained in step (2A) And drying the coating film (x2 ′).
Step (3A-3): The composition (x2) containing the adhesive resin is heated and melted, and the pressure-sensitive adhesive layer (X2) is prepared in advance on the release-treated surface of the release material by extrusion molding. The step of directly sticking the pressure-sensitive adhesive layer (X2) formed on the release material onto the surface of the thermally expandable substrate (Y) obtained in (1).
Step (3A-4): A composition (x2) containing an adhesive resin is applied to the release treatment surface of the release material to form a coating film (x2 ′), and the coating film (x2 ′) is dried. The pressure-sensitive adhesive layer (X2) is formed in advance, and the pressure-sensitive adhesive layer (X2) formed on the release material is directly formed on the surface of the thermally expandable substrate (Y) obtained in the step (2A). The process of sticking.
 工程(3A-2)及び(3A-4)における塗膜(x2’)の形成方法は、例えば、スピンコーター、スプレーコーター、バーコーター、ナイフコーター、ロールコーター、ナイフロールコーター、ブレードコーター、グラビアコーター、カーテンコーター、ダイコーター等が挙げられる。
 また、塗膜(x2’)を形成し易くし、生産性を向上させる観点から、組成物(x2)が、更に前述の希釈溶媒を含有することが好ましい。また、組成物(x2)に希釈溶媒を配合して得られる溶液の有効成分濃度も、前述のとおりである。
Examples of the method for forming the coating film (x2 ′) in the steps (3A-2) and (3A-4) include spin coater, spray coater, bar coater, knife coater, roll coater, knife roll coater, blade coater, and gravure coater. , Curtain coater, die coater and the like.
Moreover, from the viewpoint of facilitating the formation of the coating film (x2 ′) and improving the productivity, it is preferable that the composition (x2) further contains the aforementioned dilution solvent. Moreover, the active ingredient density | concentration of the solution obtained by mix | blending a dilution solvent with a composition (x2) is also as above-mentioned.
 工程(3A-2)及び(3A-4)における塗膜(x2’)の乾燥温度としては、好ましくは60~150℃、より好ましくは70~145℃、更に好ましくは80~140℃、より更に好ましくは90~135℃である。 The drying temperature of the coating film (x2 ′) in the steps (3A-2) and (3A-4) is preferably 60 to 150 ° C., more preferably 70 to 145 ° C., still more preferably 80 to 140 ° C., and still more The temperature is preferably 90 to 135 ° C.
 工程(3A-1)~(3A-4)の中では、生産性及び熱膨張性基材(Y)と粘着剤層(X2)との界面密着性の観点から工程(3A-2)が好ましい。 Among the steps (3A-1) to (3A-4), the step (3A-2) is preferable from the viewpoint of productivity and interfacial adhesion between the thermally expandable substrate (Y) and the pressure-sensitive adhesive layer (X2). .
 実施形態(B)の製造方法は、下記工程(1B)及び(2B)を含む。
・工程(1B):組成物(x1)からなる塗膜(x1’)と、組成物(y)からなる塗膜(y’)と、組成物(x2)からなる塗膜(x2’)とをこの順で直接積層して形成する工程。
・工程(2B):塗膜(x1’)、塗膜(y’)、及び塗膜(x2’)を同時に乾燥させて、粘着剤層(X1)、熱膨張性基材(Y)、及び粘着剤層(X2)がこの順で直接積層されている積層体を形成する工程。
 以下、工程(1B)及び(2B)について説明する。
The manufacturing method of embodiment (B) includes the following steps (1B) and (2B).
Step (1B): a coating film (x1 ′) composed of the composition (x1), a coating film (y ′) composed of the composition (y), and a coating film (x2 ′) composed of the composition (x2) A process of directly stacking layers in this order.
Step (2B): The coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′) are simultaneously dried, and the pressure-sensitive adhesive layer (X1), the thermally expandable substrate (Y), and The process of forming the laminated body by which the adhesive layer (X2) is directly laminated | stacked in this order.
Hereinafter, steps (1B) and (2B) will be described.
 工程(1B)において、塗膜(x1’)、塗膜(y’)、及び塗膜(x2’)の形成方法としては、例えば、塗膜(x1’)を形成した後、塗膜(x1’)上に塗膜(y’)を形成し、更に塗膜(y’)上に塗膜(x2’)を形成するといった逐次形成する方法でもよいが、生産性の観点から、組成物(x1)、組成物(y)、及び組成物(x2)を同時に塗布し、塗膜(x1’)、塗膜(y’)、及び塗膜(x2’)を同時に形成する方法が好ましい。
 なお、取扱性の観点から、塗膜(x1’)又は塗膜(x2’)は、剥離材の剥離処理面上に形成することが好ましい。
In the step (1B), as a method for forming the coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′), for example, after forming the coating film (x1 ′), the coating film (x1 A sequential formation method may be used in which a coating film (y ') is formed on') and a coating film (x2 ') is further formed on the coating film (y'). From the viewpoint of productivity, the composition ( It is preferable to apply x1), the composition (y), and the composition (x2) at the same time to form the coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′) at the same time.
In addition, it is preferable to form a coating film (x1 ') or a coating film (x2') on the peeling process surface of a peeling material from a viewpoint of handleability.
 各塗膜を逐次形成する際に用いるコーターとしては、例えば、前述した各コーター等が挙げられる。
 また、組成物(x1)、組成物(y)、及び組成物(x2)を同時に塗布する際に用いるコーターとしては、少なくとも3層以上同時に塗布可能な多層コーターが挙げられる。具体的には、多層カーテンコーター、多層ダイコーター等が挙げられる。これらの中でも、操作性の観点から、3層以上同時に塗布可能な多層ダイコーターが好ましい。
As a coater used when forming each coating film sequentially, each coater mentioned above etc. are mentioned, for example.
Moreover, as a coater used when apply | coating a composition (x1), a composition (y), and a composition (x2) simultaneously, the multilayer coater which can apply | coat at least 3 layers simultaneously is mentioned. Specifically, a multilayer curtain coater, a multilayer die coater, etc. are mentioned. Among these, from the viewpoint of operability, a multilayer die coater capable of simultaneously applying three or more layers is preferable.
 なお、各塗膜を形成し易くし、生産性を向上させる観点から、組成物(x2)、組成物(y)、及び組成物(x1)が、それぞれ独立に、更に希釈溶媒を含有することが好ましい。
 希釈溶媒としては、粘着シートの欄で説明した前述の希釈溶媒が使用できる。
 また、各組成物に希釈溶媒を配合して得られる溶液の有効成分濃度は、粘着シートの欄で前述したとおりである。
In addition, from the viewpoint of facilitating formation of each coating film and improving productivity, the composition (x2), the composition (y), and the composition (x1) each independently further contain a dilution solvent. Is preferred.
As a dilution solvent, the above-mentioned dilution solvent demonstrated in the column of the adhesive sheet can be used.
Moreover, the active ingredient density | concentration of the solution obtained by mix | blending a dilution solvent with each composition is as having mentioned above in the column of the adhesive sheet.
 なお、本工程(1B)において、塗膜(x1’)、塗膜(y’)、及び塗膜(x2’)の1層以上の塗膜を形成後に、工程(2B)の前に、当該塗膜の硬化反応が進行しない程度のプレ乾燥処理を施してもよい。
 例えば、塗膜(x1’)、塗膜(y’)、及び塗膜(x2’)の各塗膜の形成ごとに、その都度プレ乾燥処理を行ってもよく、塗膜(x1’)及び塗膜(y’)の2層の塗膜を形成後に、当該2層に同時にプレ乾燥処理を行った後、塗膜(x2’)を形成してもよい。プレ乾燥を行なう場合、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性をより良好とする観点からは、塗膜(x1’)及び塗膜(y’)の2層の塗膜を形成後に、当該2層を同時にプレ乾燥処理する方が好ましい。
 本工程(1B)における、プレ乾燥処理を行う際の乾燥温度としては、通常は、形成した塗膜の硬化が進行しない程度の温度範囲で適宜設定されるが、好ましくは工程(2B)での乾燥温度未満である。
 「工程(2B)での乾燥温度未満」との規定が示す具体的な乾燥温度としては、好ましくは10~45℃、より好ましくは10~34℃、更に好ましくは15~30℃である。
In addition, in this process (1B), after forming the coating film of 1 layer or more of a coating film (x1 '), a coating film (y'), and a coating film (x2 '), before the process (2B), You may perform the predrying process of the grade which does not advance the hardening reaction of a coating film.
For example, a pre-drying treatment may be performed each time a coating film (x1 ′), a coating film (y ′), and a coating film (x2 ′) are formed. After the two-layer coating film of the coating film (y ′) is formed, the two layers may be pre-dried simultaneously, and then the coating film (x2 ′) may be formed. When pre-drying is performed, from the viewpoint of improving the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y), the coating film (x1 ′) and the coating film (y ′) 2 It is preferable to pre-dry the two layers simultaneously after forming the coating film of the layers.
In the present step (1B), the drying temperature at the time of performing the pre-drying treatment is usually appropriately set within a temperature range in which the formed coating film does not proceed, but preferably in the step (2B). Below the drying temperature.
The specific drying temperature indicated by the phrase “below the drying temperature in step (2B)” is preferably 10 to 45 ° C., more preferably 10 to 34 ° C., and further preferably 15 to 30 ° C.
 工程(2B)において、塗膜(x1’)、塗膜(y’)、及び塗膜(x2’)を同時に乾燥させて前記積層体を形成する。
 この乾燥過程において、塗膜(x1’)と塗膜(y’)との界面で、混層が生じ、塗膜(x1’)中の粘着性樹脂と塗膜(y’)中の樹脂とが絡み合う状態で乾燥して硬化することで、粘着剤層(X1)と熱膨張性基材(Y)との界面密着性が向上し、また、塗膜(y’)と塗膜(x2’)との界面で、混層が生じ、塗膜(y’)中の樹脂と塗膜(x2’)中の粘着性樹脂とが絡み合う状態で乾燥して硬化することで、熱膨張性基材(Y)と粘着剤層(X2)との界面密着性が向上するものと考えられる。
In the step (2B), the coating film (x1 ′), the coating film (y ′), and the coating film (x2 ′) are simultaneously dried to form the laminate.
In this drying process, a mixed layer is formed at the interface between the coating film (x1 ′) and the coating film (y ′), and the adhesive resin in the coating film (x1 ′) and the resin in the coating film (y ′) are separated. By drying and curing in an intertwined state, the interfacial adhesion between the pressure-sensitive adhesive layer (X1) and the thermally expandable substrate (Y) is improved, and the coating film (y ′) and the coating film (x2 ′). A mixed layer is formed at the interface with the resin, and the resin in the coating film (y ′) and the adhesive resin in the coating film (x2 ′) are dried and cured in a state where they are entangled with each other. ) And the pressure-sensitive adhesive layer (X2) are considered to be improved.
 工程(2B)における塗膜の乾燥温度としては、好ましくは60~150℃、より好ましくは70~145℃、更に好ましくは80~140℃、より更に好ましくは90~135℃である。 The drying temperature of the coating film in the step (2B) is preferably 60 to 150 ° C, more preferably 70 to 145 ° C, still more preferably 80 to 140 ° C, and still more preferably 90 to 135 ° C.
≪粘着シートの用途≫
 本発明の粘着シートは、建材、内装材、電子部品等の製造工程時における対象物の仮固定手段として有用であり、半導体装置の製造工程時における半導体チップの仮固定手段として好適に用いることができる。特に、封止樹脂によって封止された半導体チップの表面上に、再配線層を設け、再配線層を介して、はんだボールと半導体チップとを電気的に接続した半導体パッケージ(FOWLP(Fan out Wafer Level Package)と呼ばれる)の製造時における仮固定手段として好適に用いることができる。
≪Use of adhesive sheet≫
The pressure-sensitive adhesive sheet of the present invention is useful as a temporary fixing means for an object during the manufacturing process of building materials, interior materials, electronic components, and the like, and is preferably used as a temporary fixing means for a semiconductor chip during the manufacturing process of a semiconductor device. it can. In particular, a semiconductor package (FOWLP (Fan out Wafer) in which a rewiring layer is provided on the surface of a semiconductor chip sealed with a sealing resin, and solder balls and the semiconductor chip are electrically connected via the rewiring layer. It can be suitably used as a temporary fixing means at the time of manufacturing (called Level Package).
 本発明について、以下の実施例により具体的に説明するが、本発明は以下の実施例に限定されるものではない。なお、以下の製造例及び実施例における物性値は、以下の方法により測定した値である。 The present invention will be specifically described with reference to the following examples, but the present invention is not limited to the following examples. In addition, the physical-property value in the following manufacture examples and Examples is a value measured by the following method.
<質量平均分子量(Mw)>
 ゲル浸透クロマトグラフ装置(東ソー株式会社製、製品名「HLC-8020」)を用いて、下記の条件下で測定し、標準ポリスチレン換算にて測定した値を用いた。
(測定条件)
・カラム:「TSK guard column HXL-L」「TSK gel G2500HXL」「TSK gel G2000HXL」「TSK gel G1000HXL」(いずれも東ソー株式会社製)を順次連結したもの
・カラム温度:40℃
・展開溶媒:テトラヒドロフラン
・流速:1.0mL/分
<Mass average molecular weight (Mw)>
Using a gel permeation chromatograph (product name “HLC-8020” manufactured by Tosoh Corporation), measurement was performed under the following conditions, and values measured in terms of standard polystyrene were used.
(Measurement condition)
Column: “TSK guard column HXL-L”, “TSK gel G2500HXL”, “TSK gel G2000HXL”, and “TSK gel G1000HXL” (both manufactured by Tosoh Corporation) Column temperature: 40 ° C.
・ Developing solvent: Tetrahydrofuran ・ Flow rate: 1.0 mL / min
<積層体の厚さ>
 株式会社テクロック製の定圧厚さ測定器(型番:「PG-02J」、標準規格:JIS K6783、Z1702、Z1709に準拠)を用いて測定した。
 具体的には、測定対象の粘着シートの総厚を測定した上で、予め測定した剥離材の厚みを差し引いた値を「積層体の厚さ」とした。
<Thickness of laminate>
It was measured using a constant pressure thickness measuring instrument (model number: “PG-02J”, standard: conforming to JIS K6783, Z1702, Z1709) manufactured by Teclock Co., Ltd.
Specifically, after measuring the total thickness of the pressure-sensitive adhesive sheet to be measured, a value obtained by subtracting the thickness of the release material measured in advance was defined as “the thickness of the laminate”.
<各層の厚さ>
 走査型電子顕微鏡(日立製作所株式会社製、製品名「S-4700」)を用いて、積層体の厚さ方向における断面を観察し、積層体の厚さに対する、粘着剤層(X1)、熱膨張性基材(Y)及び粘着剤層(X2)のそれぞれの厚さ比を測定した。
 そして、各層の厚さ比に基づき、上述の方法により測定した「積層体の厚さ」の実測値から、各層の厚さを算出した。
<Thickness of each layer>
Using a scanning electron microscope (manufactured by Hitachi, Ltd., product name “S-4700”), the cross section in the thickness direction of the laminate was observed, and the adhesive layer (X1), heat, The thickness ratio of each of the expandable substrate (Y) and the pressure-sensitive adhesive layer (X2) was measured.
And based on the thickness ratio of each layer, the thickness of each layer was computed from the actual value of the "thickness of a laminated body" measured by the above-mentioned method.
<熱膨張性粒子の平均粒子径(D50)、90%粒子径(D90)>
 レーザ回折式粒度分布測定装置(例えば、Malvern社製、製品名「マスターサイザー3000」)を用いて、23℃における膨張前の熱膨張性粒子の粒子分布を測定した。
 そして、粒子分布の粒子径の小さい方から計算した累積体積頻度が50%及び90%に相当する粒子径を、それぞれ「熱膨張性粒子の平均粒子径(D50)」及び「熱膨張性粒子の90%粒子径(D90)とした。
<Average particle diameter (D 50 ) of thermally expandable particles, 90% particle diameter (D 90 )>
The particle distribution of the thermally expandable particles before expansion at 23 ° C. was measured using a laser diffraction particle size distribution measuring apparatus (for example, product name “Mastersizer 3000” manufactured by Malvern).
The particle diameters corresponding to 50% and 90% of the cumulative volume frequency calculated from the smaller particle diameter of the particle distribution are expressed as “average particle diameter (D 50 ) of thermally expandable particles” and “thermally expandable particles”, respectively. 90% particle diameter (D 90 ).
<プローブタック値>
 測定対象となる熱膨張性基材を後述の重剥離フィルムと軽剥離フィルムに挟持された状態で厚さ20μmとなるように積層体サンプル(重剥離フィルム/熱膨張性基材/軽剥離フィルム)を作成した。作成したサンプルを一辺10mmの正方形に切断した後、23℃、50%RH(相対湿度)の環境下で24時間静置し、軽剥離フィルムと重剥離フィルムを除去したものを試験サンプルとした。
 そして、23℃、50%RH(相対湿度)の環境下で、タッキング試験機(日本特殊測器株式会社製,製品名「NTS-4800」)を用いて、試験サンプルの表面におけるプローブタック値を、JIS Z0237:1991に準拠して測定した。
 具体的には、直径5mmのステンレス鋼製のプローブを、1秒間、接触荷重0.98N/cmで試験サンプルの表面に接触させた後、当該プローブを10mm/秒の速度で、試験サンプルの表面から離すのに必要な力を測定した。そして、その測定した値を、その試験サンプルのプローブタック値とした。
<Probe tack value>
Laminate sample (heavy release film / thermally expandable substrate / light release film) so that the thickness of the heat expandable substrate to be measured is 20 μm in a state of being sandwiched between the later described heavy release film and light release film It was created. The prepared sample was cut into a square with a side of 10 mm and then allowed to stand for 24 hours in an environment of 23 ° C. and 50% RH (relative humidity) to remove the light release film and the heavy release film as a test sample.
Then, in an environment of 23 ° C. and 50% RH (relative humidity), using a tacking tester (manufactured by Nippon Special Instrument Co., Ltd., product name “NTS-4800”), the probe tack value on the surface of the test sample is calculated. , Measured according to JIS Z0237: 1991.
Specifically, a stainless steel probe having a diameter of 5 mm is brought into contact with the surface of the test sample at a contact load of 0.98 N / cm 2 for 1 second, and then the probe is moved at a speed of 10 mm / sec. The force required to separate from the surface was measured. And the measured value was made into the probe tack value of the test sample.
<熱膨張性基材の貯蔵弾性率E’>
 測定対象となる熱膨張性基材を縦5mm×横30mm×厚さ200μmの大きさとし、剥離材を除去したものを試験サンプルとした。
 動的粘弾性測定装置(TAインスツルメント社製,製品名「DMAQ800」)を用いて、試験開始温度0℃、試験終了温度300℃、昇温速度3℃/分、振動数1Hz、振幅20μmの条件で、所定の温度における、当該試験サンプルの貯蔵弾性率E’を測定した。
<Storage elastic modulus E 'of thermally expandable substrate>
The thermal expansible substrate to be measured was 5 mm long × 30 mm wide × 200 μm thick, and the sample from which the release material was removed was used as a test sample.
Using a dynamic viscoelasticity measuring apparatus (TA Instruments, product name “DMAQ800”), a test start temperature of 0 ° C., a test end temperature of 300 ° C., a temperature increase rate of 3 ° C./min, a frequency of 1 Hz, and an amplitude of 20 μm Under the conditions, the storage elastic modulus E ′ of the test sample at a predetermined temperature was measured.
<界面密着性>
 実施例及び比較例で製造した粘着シートを、縦50mm×横30mmの大きさに切断した。そして、JIS K5600-5-6に準拠して評価した。
 以下の基準により、粘着剤層(X1)と、熱膨張性基材(Y)との界面、及び粘着剤層(X2)と、熱膨張性基材(Y)との界面の2つの界面における密着性を評価した。
・A:2つの界面共にJIS K5600-5-6による分類が「0(最良)」であった。
・B:少なくともいずれか一方の界面がJIS K5600-5-6による分類が「1」~「4」であった。
・F:少なくともいずれか一方の界面がJIS K5600-5-6による分類が「5(最劣)」であった。
<Interfacial adhesion>
The pressure-sensitive adhesive sheets produced in Examples and Comparative Examples were cut into a size of 50 mm length × 30 mm width. And it evaluated based on JISK5600-5-6.
According to the following criteria, the interface between the adhesive layer (X1) and the thermally expandable substrate (Y) and the interface between the adhesive layer (X2) and the thermally expandable substrate (Y) Adhesion was evaluated.
A: The classification according to JIS K5600-5-6 was “0 (best)” for the two interfaces.
B: At least one of the interfaces was classified into “1” to “4” according to JIS K5600-5-6.
F: At least one of the interfaces was “5 (worst)” according to JIS K5600-5-6.
<加熱前後での粘着シートの粘着力の測定>
 作製した粘着シートの軽剥離フィルムを除去し、表出した粘着剤層(X2)の粘着表面上に、厚さ50μmのポリエチレンテレフタレート(PET)フィルム(東洋紡株式会社製、製品名「コスモシャインA4100」)を積層し、基材付き粘着シートとした。そして、当該粘着シートの重剥離フィルムも除去し、被着体であるステンレス鋼板(SUS304 360番研磨)に貼付し、23℃、50%RH(相対湿度)の環境下で、24時間静置したものを試験サンプルとした。
 そして、上記の試験サンプルを用いて、23℃、50%RH(相対湿度)の環境下で、JIS Z0237:2000に基づき、180°引き剥がし法により、引っ張り速度300mm/分にて、23℃における粘着力を測定した。
 また、上記の試験サンプルをホットプレート上にて、熱膨張性粒子の膨張開始温度(208℃)以上となる240℃で3分間加熱し、標準環境(23℃、50%RH(相対湿度))にて60分間静置した後、JIS Z0237:2000に基づき、180°引き剥がし法により、引っ張り速度300mm/分にて、膨張開始温度以上での加熱後の粘着力も測定した。
 なお、被着体であるステンレス鋼板に貼付することができないほどに粘着力の測定が困難である場合には、「測定不能」とし、その粘着力は0(N/25mm)であるとした。
<Measurement of adhesive strength of adhesive sheet before and after heating>
The light release film of the produced pressure-sensitive adhesive sheet was removed, and a 50 μm thick polyethylene terephthalate (PET) film (product name “COSMO SHINE A4100” manufactured by Toyobo Co., Ltd.) was formed on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer (X2). ) To obtain an adhesive sheet with a substrate. And the heavy peeling film of the said adhesive sheet was also removed, it affixed on the stainless steel plate (SUS304 360th polishing) which is a to-be-adhered body, and left still for 24 hours in the environment of 23 degreeC and 50% RH (relative humidity). This was used as a test sample.
Then, using the above test sample, in an environment of 23 ° C. and 50% RH (relative humidity), in accordance with JIS Z0237: 2000, by a 180 ° peeling method at a pulling speed of 300 mm / min at 23 ° C. The adhesive strength was measured.
In addition, the above test sample is heated on a hot plate for 3 minutes at 240 ° C., which is equal to or higher than the expansion start temperature (208 ° C.) of the thermally expandable particles, and the standard environment (23 ° C., 50% RH (relative humidity)). Then, the adhesive strength after heating at a temperature equal to or higher than the expansion start temperature was also measured at a pulling rate of 300 mm / min by a 180 ° peeling method based on JIS Z0237: 2000.
In addition, when measurement of adhesive force was so difficult that it could not be affixed to the stainless steel plate which is a to-be-adhered body, it was set as "impossible to measure" and the adhesive force was set to 0 (N / 25mm).
 以下の製造例での各層の形成で使用した粘着性樹脂、添加剤、熱膨張性粒子、及び剥離材の詳細は以下のとおりである。 Details of the adhesive resin, additives, thermally expandable particles, and release material used in forming each layer in the following production examples are as follows.
<粘着性樹脂>
・アクリル系共重合体(i):2-エチルヘキシルアクリレート(2EHA)/2-ヒドロキシエチルアクリレート(HEA)=80.0/20.0(質量比)からなる原料モノマーに由来の構成単位を有する、Mw60万のアクリル系共重合体を含む溶液。希釈溶媒:酢酸エチル、固形分濃度:40質量%。
・アクリル系共重合体(ii):n-ブチルアクリレート(BA)/メチルメタクリレート(MMA)/2-ヒドロキシエチルアクリレート(HEA)/アクリル酸=86.0/8.0/5.0/1.0(質量比)からなる原料モノマーに由来の構成単位を有する、Mw60万のアクリル系共重合体を含む溶液。希釈溶媒:酢酸エチル、固形分濃度:40質量%。
<添加剤>
・イソシアネート架橋剤(i):東ソー株式会社製、製品名「コロネートL」、固形分濃度:75質量%。
<熱膨張性粒子>
・熱膨張性粒子(i):株式会社クレハ製、製品名「S2640」、膨張開始温度(t)=208℃、平均粒子径(D50)=24μm、90%粒子径(D90)=49μm。
<剥離材>
・重剥離フィルム:リンテック株式会社製、製品名「SP-PET382150」、ポリエチレンテレフタレート(PET)フィルムの片面に、シリコーン系剥離剤から形成した剥離剤層を設けたもの、厚さ:38μm。
・軽剥離フィルム:リンテック株式会社製、製品名「SP-PET381031」、PETフィルムの片面に、シリコーン系剥離剤から形成した剥離剤層を設けたもの、厚さ:38μm。
<Adhesive resin>
Acrylic copolymer (i): having a structural unit derived from a raw material monomer consisting of 2-ethylhexyl acrylate (2EHA) / 2-hydroxyethyl acrylate (HEA) = 80.0 / 20.0 (mass ratio), A solution containing an acrylic copolymer having a Mw of 600,000. Diluting solvent: ethyl acetate, solid content concentration: 40% by mass.
Acrylic copolymer (ii): n-butyl acrylate (BA) / methyl methacrylate (MMA) / 2-hydroxyethyl acrylate (HEA) / acrylic acid = 86.0 / 8.0 / 5.0 / 1. A solution containing an acrylic copolymer having an Mw of 600,000 having a structural unit derived from a raw material monomer consisting of 0 (mass ratio). Diluting solvent: ethyl acetate, solid content concentration: 40% by mass.
<Additives>
Isocyanate crosslinking agent (i): manufactured by Tosoh Corporation, product name “Coronate L”, solid content concentration: 75 mass%.
<Thermal expandable particles>
Thermally expandable particles (i): manufactured by Kureha Co., Ltd., product name “S2640”, expansion start temperature (t) = 208 ° C., average particle size (D 50 ) = 24 μm, 90% particle size (D 90 ) = 49 μm .
<Release material>
Heavy release film: manufactured by Lintec Corporation, product name “SP-PET382150”, a polyethylene terephthalate (PET) film provided with a release agent layer formed from a silicone release agent on one side, thickness: 38 μm.
Light release film: manufactured by Lintec Co., Ltd., product name “SP-PET381031”, a PET film provided with a release agent layer formed from a silicone release agent on one side, thickness: 38 μm.
製造例1(組成物(x1)の調製)
 粘着性樹脂である、上記アクリル系共重合体(i)の固形分100質量部に、上記イソシアネート系架橋剤(i)5.0質量部(固形分比)を配合し、トルエンで希釈し、均一に撹拌して、固形分濃度(有効成分濃度)25質量%の組成物(x1)を調製した。
Production Example 1 (Preparation of composition (x1))
The isocyanate-based crosslinking agent (i) 5.0 parts by mass (solid content ratio) is blended with 100 parts by mass of the solid content of the acrylic copolymer (i), which is an adhesive resin, and diluted with toluene. It stirred uniformly and the composition (x1) of solid content concentration (active ingredient density | concentration) 25 mass% was prepared.
製造例2(組成物(x2)の調製)
 粘着性樹脂である、上記アクリル系共重合体(ii)の固形分100質量部に、上記イソシアネート系架橋剤(i)0.8質量部(固形分比)を配合し、トルエンで希釈し、均一に撹拌して、固形分濃度(有効成分濃度)25質量%の組成物(x2)を調製した。
Production Example 2 (Preparation of composition (x2))
The isocyanate-based crosslinking agent (i) 0.8 parts by mass (solid content ratio) is blended with 100 parts by mass of the acrylic copolymer (ii), which is an adhesive resin, and diluted with toluene, It stirred uniformly and the composition (x2) of 25 mass% of solid content concentration (active ingredient density | concentration) was prepared.
製造例3(組成物(y)の調製)
(1)ウレタンプレポリマーの合成
 窒素雰囲気下の反応容器内に、質量平均分子量1,000のカーボネート型ジオール100質量部(固形分比)に対して、イソホロンジイソシアネート(IPDI)を、カーボネート型ジオールの水酸基とイソホロンジイソシアネートのイソシアネート基との当量比が1/1となるように配合し、さらにトルエン160質量部を加え、窒素雰囲気下にて、撹拌しながら、イソシアネート基濃度が理論量に到達するまで、80℃で6時間以上反応させた。
 次いで、2-ヒドロキシエチルメタクリレート(2-HEMA)1.44質量部(固形分比)をトルエン30質量部に希釈した溶液を添加して、両末端のイソシアネート基が消滅するまで、更に80℃で6時間反応させ、質量平均分子量2.9万のウレタンプレポリマーを得た。
Production Example 3 (Preparation of composition (y))
(1) Synthesis of urethane prepolymer In a reaction vessel under a nitrogen atmosphere, isophorone diisocyanate (IPDI) is mixed with carbonate type diol with respect to 100 parts by mass (solid content ratio) of carbonate type diol having a mass average molecular weight of 1,000. Mixing so that the equivalent ratio of hydroxyl group to isocyanate group of isophorone diisocyanate is 1/1, adding 160 parts by mass of toluene, until the isocyanate group concentration reaches the theoretical amount while stirring under a nitrogen atmosphere , And reacted at 80 ° C. for 6 hours or more.
Subsequently, a solution obtained by diluting 1.44 parts by mass (solid content ratio) of 2-hydroxyethyl methacrylate (2-HEMA) in 30 parts by mass of toluene is added, and further at 80 ° C. until the isocyanate groups at both ends disappear. The mixture was reacted for 6 hours to obtain a urethane prepolymer having a mass average molecular weight of 29,000.
(2)アクリルウレタン系樹脂の合成
 窒素雰囲気下の反応容器内に、上記(1)で得たウレタンプレポリマー100質量部(固形分比)、メチルメタクリレート(MMA)117質量部(固形分比)、2-ヒドロキシエチルメタクリレート(2-HEMA)5.1質量部(固形分比)、1-チオグリセロール1.1質量部(固形分比)、及びトルエン50質量部を加え、撹拌しながら、105℃まで昇温した。
 そして、反応容器内に、さらにラジカル開始剤(株式会社日本ファインケム製、製品名「ABN-E」)2.2質量部(固形分比)をトルエン210質量部で希釈した溶液を、105℃に維持したまま4時間かけて滴下した。
 滴下終了後、105℃で6時間反応させ、質量平均分子量10.5万のアクリルウレタン系樹脂の溶液を得た。
(2) Synthesis of acrylic urethane-based resin In a reaction vessel under nitrogen atmosphere, 100 parts by mass (solid content ratio) of urethane prepolymer obtained in (1) above and 117 parts by mass (solid content ratio) of methyl methacrylate (MMA) 2-hydroxyethyl methacrylate (2-HEMA) 5.1 parts by mass (solid content ratio), 1-thioglycerol 1.1 parts by mass (solid content ratio), and toluene 50 parts by mass, The temperature was raised to ° C.
Further, a solution obtained by further diluting 2.2 parts by mass (solid content ratio) of radical initiator (manufactured by Nippon Finechem Co., Ltd., product name “ABN-E”) with 210 parts by mass of toluene in a reaction vessel was heated to 105 ° C. It was dripped over 4 hours, maintaining.
After completion of the dropping, the reaction was carried out at 105 ° C. for 6 hours to obtain a solution of an acrylic urethane resin having a mass average molecular weight of 105,000.
(3)組成物(y)の調製
 上記(2)で得たアクリルウレタン系樹脂の溶液の固形分100質量部に対して、上記イソシアネート系架橋剤(i)6.3質量部(固形分比)、触媒としてジオクチルスズビス(2-エチルヘキサノエート)1.4質量部(固形分比)、及び上記熱膨張性粒子(i)を配合し、トルエンで希釈し、均一に撹拌して、固形分濃度(有効成分濃度)30質量%の組成物(y)を調製した。
 なお、得られた組成物(y)中の有効成分の全量(100質量%)に対する、熱膨張性粒子(i)の含有量は20質量%であった。
(3) Preparation of composition (y) With respect to 100 parts by mass of the solid content of the solution of the acrylic urethane resin obtained in (2) above, 6.3 parts by mass of the isocyanate-based crosslinking agent (i) (solid content ratio) ), 1.4 parts by weight (solid content ratio) of dioctyltin bis (2-ethylhexanoate) as a catalyst, and the thermally expandable particles (i) are diluted with toluene, stirred uniformly, A composition (y) having a solid content concentration (active ingredient concentration) of 30% by mass was prepared.
In addition, content of the thermally expansible particle (i) with respect to the whole quantity (100 mass%) of the active ingredient in the obtained composition (y) was 20 mass%.
実施例1
(1)塗膜の形成
 剥離材である重剥離フィルムの剥離剤層上に、製造例1で調製した組成物(x1)、製造例3で調製した組成物(y)、及び、製造例2で調製した組成物(x2)をこの順で、多層ダイコーター(幅:250mm)を用いて、同時塗布し、塗膜(x1’)、塗膜(y’)及び塗膜(x2’)をこの順で同時に形成した。
(2)乾燥処理
 形成した塗膜(x1’)、塗膜(y’)及び塗膜(x2’)を、乾燥温度125℃で60秒間、同時に乾燥させ、重剥離フィルムの剥離剤層から順に、層(X1)、層(Y)及び層(X2)を直接積層した積層体を形成した。
 そして、表出している層(X2)の表面上に、軽剥離フィルムの剥離剤層を積層させ、実施例1の粘着シートを得た。
Example 1
(1) Formation of coating film On the release agent layer of the heavy release film as a release material, the composition (x1) prepared in Production Example 1, the composition (y) prepared in Production Example 3, and Production Example 2 The composition (x2) prepared in (1) was simultaneously applied in this order using a multilayer die coater (width: 250 mm), and the coating film (x1 ′), coating film (y ′) and coating film (x2 ′) were formed. They were formed simultaneously in this order.
(2) Drying treatment The formed coating film (x1 ′), coating film (y ′) and coating film (x2 ′) are simultaneously dried at a drying temperature of 125 ° C. for 60 seconds, and sequentially from the release agent layer of the heavy release film. A layered body in which the layer (X1), the layer (Y), and the layer (X2) were directly stacked was formed.
And the release agent layer of the light release film was laminated | stacked on the surface of the layer (X2) exposed, and the adhesive sheet of Example 1 was obtained.
実施例2
 層(X1)、層(Y)及び層(X2)の厚さが、それぞれ、表1に記載の厚さになるように組成物(x1)、組成物(y)及び組成物(x2)の塗布量を変更したこと以外は、実施例1と同様の方法を用いて、実施例2の粘着シートを得た。
Example 2
The composition (x1), the composition (y), and the composition (x2) were formed so that the thicknesses of the layer (X1), the layer (Y), and the layer (X2) were as shown in Table 1, respectively. A pressure-sensitive adhesive sheet of Example 2 was obtained using the same method as Example 1 except that the coating amount was changed.
比較例1
 剥離材である重剥離フィルムの剥離剤層上に、製造例1で調製した組成物(x1)からなる塗膜(x1’)を形成し、乾燥温度110℃で120秒間乾燥させ、層(X1)を形成した。
 また、層(X1)上の剥離フィルムとは別に用意した軽剥離フィルムの剥離剤層上に、製造例3で調製した組成物(y)からなる塗膜(y’)を形成し、乾燥温度110℃で120秒間乾燥させ、層(Y)を形成した。
 更に、別に用意した軽剥離フィルムの剥離剤層上に、製造例2で調製した組成物(x2)を用いて、塗膜(x2’)を形成し、乾燥温度110℃で120秒間乾燥させ、層(X2)を形成した。
 そして、表出している層(X1)の表面上に、層(Y)を積層し、更に層(Y)上の軽剥離フィルムを除去し、表出した層(Y)の表面上に、層(X2)を積層させ、重剥離フィルム、層(X1)、層(Y)、層(X2)、及び軽剥離フィルムの順で積層された比較例1の粘着シートを得た。
 実施例及び比較例で作製した粘着シートが有する積層体の厚さ、並びに、当該積層体を構成する層(X1)、層(Y)、及び層(X2)の厚さを、前述の方法に準拠して測定した。当該測定結果を表1に示す。
Comparative Example 1
On the release agent layer of the heavy release film as a release material, a coating film (x1 ′) composed of the composition (x1) prepared in Production Example 1 is formed and dried at a drying temperature of 110 ° C. for 120 seconds, and the layer (X1 ) Was formed.
Moreover, the coating film (y ') which consists of a composition (y) prepared by manufacture example 3 is formed on the release agent layer of the light release film prepared separately from the release film on layer (X1), and drying temperature It was dried at 110 ° C. for 120 seconds to form a layer (Y).
Furthermore, on the release agent layer of the light release film prepared separately, using the composition (x2) prepared in Production Example 2, a coating film (x2 ′) is formed and dried at a drying temperature of 110 ° C. for 120 seconds, Layer (X2) was formed.
Then, the layer (Y) is laminated on the surface of the exposed layer (X1), the light release film on the layer (Y) is removed, and the layer (Y) is exposed on the surface. (X2) was laminated | stacked and the adhesive sheet of the comparative example 1 laminated | stacked in order of the heavy release film, the layer (X1), the layer (Y), the layer (X2), and the light release film was obtained.
The thickness of the laminated body which the adhesive sheet produced in the Example and the comparative example has, and the thickness of the layer (X1), layer (Y), and layer (X2) which comprise the said laminated body are used for the above-mentioned method. Measured in conformity. The measurement results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
 表1から、実施例1及び2の粘着シートは、界面密着力が良好であり、さらに、加熱前は良好な粘着力を有するものの、膨張開始温度以上での加熱後は測定不能となる程度まで粘着力が低下していることから、剥離時には、わずかな力で容易に剥離可能であることが裏付けられる結果となった。 From Table 1, the pressure-sensitive adhesive sheets of Examples 1 and 2 have good interfacial adhesion, and further have good adhesive strength before heating, but to the extent that they cannot be measured after heating at or above the expansion start temperature. Since the adhesive force was lowered, it was proved that the film could be easily peeled with a slight force during peeling.
  1a、1b  粘着シート
  2a、2b  両面粘着シート
  10  積層体
  11  熱膨張性基材(Y)
  12、121  粘着剤層(X1)
  122  粘着剤層(X2)
  13、131、132  剥離材
DESCRIPTION OF SYMBOLS 1a, 1b Adhesive sheet 2a, 2b Double-sided adhesive sheet 10 Laminated body 11 Thermally expansible base material (Y)
12, 121 Adhesive layer (X1)
122 Adhesive layer (X2)
13, 131, 132 Release material

Claims (8)

  1.  粘着剤層(X1)及び非粘着性である熱膨張性基材(Y)がこの順で直接積層されている積層体を有する粘着シートであって、
     前記積層体が、
      粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、
      熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、
    をこの順で直接積層した後、塗膜(x1’)及び塗膜(y’)を同時に乾燥して形成されたものである、粘着シート。
    A pressure-sensitive adhesive sheet having a laminate in which a pressure-sensitive adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly laminated in this order,
    The laminate is
    A coating film (x1 ′) comprising a composition (x1) containing an adhesive resin, which is a forming material of the pressure-sensitive adhesive layer (X1);
    A coating film (y ′) comprising a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y),
    Are laminated | stacked directly in this order, Then, a coating sheet (x1 ') and a coating film (y') are dried simultaneously, and the adhesive sheet is formed.
  2.  熱膨張性基材(Y)が、下記要件(1)を満たす、請求項1に記載の粘着シート。
    ・要件(1):前記熱膨張性粒子の膨張開始温度(t)における、熱膨張性基材(Y)の貯蔵弾性率E’(t)が、1.0×10Pa以下である。
    The pressure-sensitive adhesive sheet according to claim 1, wherein the thermally expandable substrate (Y) satisfies the following requirement (1).
    Requirement (1): The storage elastic modulus E ′ (t) of the thermally expandable substrate (Y) at the expansion start temperature (t) of the thermally expandable particles is 1.0 × 10 7 Pa or less.
  3.  熱膨張性基材(Y)が、下記要件(2)を満たす、請求項1又は2に記載の粘着シート。
    ・要件(2):23℃における、熱膨張性基材(Y)の貯蔵弾性率E’(23)が、1.0×10Pa以上である。
    The pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the thermally expandable substrate (Y) satisfies the following requirement (2).
    Requirement (2): The storage elastic modulus E ′ (23) of the thermally expandable substrate (Y) at 23 ° C. is 1.0 × 10 6 Pa or more.
  4.  熱膨張性基材(Y)の厚さが5~140μmである、請求項1~3のいずれかに記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 3, wherein the heat-expandable base material (Y) has a thickness of 5 to 140 µm.
  5.  熱膨張性基材(Y)の表面におけるプローブタックの値が、50mN/5mmφ未満である、請求項1~4のいずれかに記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 4, wherein the value of the probe tack on the surface of the thermally expandable substrate (Y) is less than 50 mN / 5 mmφ.
  6.  前記積層体が粘着剤層(X2)を更に含み、粘着剤層(X1)、熱膨張性基材(Y)、及び粘着剤層(X2)がこの順で直接積層されている、請求項1~5のいずれに記載の粘着シート。 The said laminated body further contains an adhesive layer (X2), and the adhesive layer (X1), the thermally expansible base material (Y), and the adhesive layer (X2) are directly laminated | stacked in this order. 6. The pressure-sensitive adhesive sheet according to any one of 5 to 5.
  7.  前記積層体が、
      粘着剤層(X1)の形成材料である、粘着性樹脂を含む組成物(x1)からなる塗膜(x1’)と、
      熱膨張性基材(Y)の形成材料である、樹脂及び熱膨張性粒子を含む組成物(y)からなる塗膜(y’)と、
      粘着剤層(X2)の形成材料である、粘着性樹脂を含む組成物(x2)からなる塗膜(x2’)と、
    をこの順で直接積層した後、塗膜(x1’)、(y’)及び(x2’)を同時に乾燥して形成されたものである、請求項6に記載の粘着シート。
    The laminate is
    A coating film (x1 ′) comprising a composition (x1) containing an adhesive resin, which is a forming material of the pressure-sensitive adhesive layer (X1);
    A coating film (y ′) comprising a composition (y) containing a resin and thermally expandable particles, which is a forming material of the thermally expandable substrate (Y),
    A coating film (x2 ′) comprising a composition (x2) containing an adhesive resin, which is a material for forming the adhesive layer (X2);
    The pressure-sensitive adhesive sheet according to claim 6, which is formed by directly laminating the films in this order and then simultaneously drying the coating films (x1 ′), (y ′) and (x2 ′).
  8.  前記熱膨張性粒子の23℃における膨張前の平均粒子径が、3~100μmである、請求項1~7のいずれかに記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 7, wherein the thermally expandable particles have an average particle diameter before expansion at 23 ° C of 3 to 100 µm.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002138259A (en) * 2000-11-02 2002-05-14 Nitto Denko Corp Method for manufacturing pressure-sensitive adhesive tape and its equipment
JP2006291137A (en) * 2005-04-14 2006-10-26 Nitto Denko Cs System Kk Pressure sensitive adhesive tape and method for using the same
JP2015120809A (en) * 2013-12-20 2015-07-02 王子ホールディングス株式会社 Double-sided adhesive sheet, double-sided adhesive sheet with peeling sheet, method for producing the same and transparent laminate
WO2015152345A1 (en) * 2014-04-02 2015-10-08 リンテック株式会社 Adhesive sheet and adhesive sheet production method
JP2017002190A (en) * 2015-06-10 2017-01-05 リンテック株式会社 Thermal peeling adhesive sheet

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4651799B2 (en) * 2000-10-18 2011-03-16 日東電工株式会社 Energy ray-curable heat-peelable pressure-sensitive adhesive sheet and method for producing a cut piece using the same
US20090110861A1 (en) * 2007-10-29 2009-04-30 3M Innovative Properties Company Pressure sensitive adhesive article
JP6018839B2 (en) * 2012-08-23 2016-11-02 藤森工業株式会社 Icon sheet manufacturing method
JP6120123B2 (en) * 2014-11-13 2017-04-26 Dic株式会社 Double-sided adhesive tape, article and separation method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002138259A (en) * 2000-11-02 2002-05-14 Nitto Denko Corp Method for manufacturing pressure-sensitive adhesive tape and its equipment
JP2006291137A (en) * 2005-04-14 2006-10-26 Nitto Denko Cs System Kk Pressure sensitive adhesive tape and method for using the same
JP2015120809A (en) * 2013-12-20 2015-07-02 王子ホールディングス株式会社 Double-sided adhesive sheet, double-sided adhesive sheet with peeling sheet, method for producing the same and transparent laminate
WO2015152345A1 (en) * 2014-04-02 2015-10-08 リンテック株式会社 Adhesive sheet and adhesive sheet production method
JP2017002190A (en) * 2015-06-10 2017-01-05 リンテック株式会社 Thermal peeling adhesive sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113613890A (en) * 2019-03-29 2021-11-05 东丽薄膜先端加工股份有限公司 Laminated film
CN113613890B (en) * 2019-03-29 2023-10-24 东丽薄膜先端加工股份有限公司 Laminated film

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CN110506089B (en) 2022-01-18
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TW201842115A (en) 2018-12-01
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