WO2018181507A1 - Mold set for manufacturing optical element - Google Patents

Mold set for manufacturing optical element Download PDF

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Publication number
WO2018181507A1
WO2018181507A1 PCT/JP2018/012830 JP2018012830W WO2018181507A1 WO 2018181507 A1 WO2018181507 A1 WO 2018181507A1 JP 2018012830 W JP2018012830 W JP 2018012830W WO 2018181507 A1 WO2018181507 A1 WO 2018181507A1
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WO
WIPO (PCT)
Prior art keywords
mold
optical element
regulating member
amount regulating
molding material
Prior art date
Application number
PCT/JP2018/012830
Other languages
French (fr)
Japanese (ja)
Inventor
大吾 平田
生典 廣瀬
Original Assignee
オリンパス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Publication of WO2018181507A1 publication Critical patent/WO2018181507A1/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06—Construction of plunger or mould
    • C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses

Definitions

  • the present invention relates to a mold set for manufacturing an optical element.
  • a mold comprising a pair of molds, a cylindrical sleeve for positioning the mold, and a cylindrical press amount regulating member disposed on the outer periphery of the sleeve
  • a circulation type molding method using a set is known.
  • the mold set is sequentially conveyed onto a plurality of heater plates heated to different temperatures, and the molding material is gradually deformed into a desired shape by pressing the molding material in the mold set.
  • Patent Document 1 discloses a method of sequentially performing first to third heat treatment, main press treatment, cooling press treatment, and cooling treatment on a mold set. ing.
  • Patent Document 2 proposes a mold set configured such that the upper mold and the molding material are not in contact with each other when the mold set is assembled.
  • Patent Document 3 proposes a mold set configured such that an upper mold and a molding material are not in contact with each other by supporting the upper mold with a pin inserted into a sleeve.
  • the mold set in Patent Document 2 has a problem that since the shape of the molding material is limited to the menis shape, the shape of the moldable optical element is also limited.
  • the mold set in Patent Document 3 has a complicated configuration, and requires additional work such as pulling out the pins and collecting the pins after pulling out, which complicates the manufacturing process. is there.
  • the present invention has been made in view of the above, and it is possible to manufacture an optical element with a simple process using a molding material of an arbitrary shape, and the molding material before heat treatment with a simple configuration.
  • An object of the present invention is to provide a mold set for manufacturing an optical element capable of suppressing the generation of scratches.
  • an optical element manufacturing mold set includes a first mold and a second mold having optical creation surfaces facing each other, and the first mold A mold set for manufacturing an optical element, comprising: a cylindrical sleeve provided around one mold and the second mold; and a cylindrical press amount regulating member provided around the sleeve.
  • the first mold has a main body portion inserted into the sleeve, and a flange portion protruding outward from the inner peripheral surface of the sleeve, and the press amount regulating member includes the flange portion. And holding the holding part in contact with the flange part to lock the flange part when the optical element manufacturing mold set is not heated.
  • the optical creation surfaces of the second mold are separated from each other.
  • the holding part is separated from the flange part to release the locking of the flange part, and the first mold and the It is characterized by enabling relative movement of the second mold.
  • the optical element manufacturing mold set according to the present invention is the above invention, wherein the press amount regulating member is expanded in diameter by thermal expansion in a state where the optical element manufacturing mold set is heated.
  • the holding portion is separated from the flange portion.
  • the press amount regulating member is made of a material having a larger linear expansion coefficient than the first mold, the second mold, and the sleeve. It is configured.
  • the optical element manufacturing mold set according to the present invention is characterized in that, in the above invention, the contact portions of the flange portion and the holding portion are each tapered.
  • the optical element manufacturing mold set according to the present invention is characterized in that, in the above-described invention, the holding portion is formed of a flange portion protruding inward from an inner peripheral surface of the breath amount regulating member.
  • the optical creation surfaces of the first mold and the second mold are kept apart from each other.
  • the occurrence of scratches on the molding material before the heat treatment can be suppressed.
  • since the upper die is held using the press amount regulating member it is possible to suppress the occurrence of scratches on the molding material with a simple configuration without requiring a significant improvement. .
  • FIG. 1 is a cross-sectional view illustrating a configuration of a main part of a molding apparatus including an optical element manufacturing mold set according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the optical element manufacturing mold set according to Embodiment 1 of the present invention cut along the pressing direction.
  • FIG. 3 is a cross-sectional view of the optical element manufacturing mold set according to Embodiment 2 of the present invention cut along the pressing direction.
  • FIG. 4 is a cross-sectional view showing a state when the optical element manufacturing mold set according to Embodiment 2 of the present invention is heated on the heating stage.
  • FIG. 5 is a cross-sectional view showing a state when the optical element manufacturing mold set according to the second embodiment of the present invention is cooled in the cooling stage.
  • FIG. 6A is a plan view showing a configuration of an optical element manufacturing mold set according to Embodiment 3 of the present invention.
  • 6B is a cross-sectional view taken along the line AA in FIG. 6A.
  • FIG. 7A is a plan view showing a state in which the upper mold of the optical element manufacturing mold set according to Embodiment 3 of the present invention is rotated.
  • FIG. 7B is a cross-sectional view taken along the line AA in FIG. 7A.
  • FIG. 8 is a cross-sectional view showing a state where a molding material is pressed by the optical element manufacturing mold set according to Embodiment 3 of the present invention.
  • the molding apparatus 1 is for molding an optical element (for example, a glass lens) O by press-molding a heat-softened molding material (for example, a glass material) M.
  • the molding apparatus 1 mainly includes a mold set for manufacturing an optical element (hereinafter referred to as “mold set”) 10, a replacement chamber 20, and a molding chamber 30.
  • the replacement chamber 20 includes a chamber 21 that houses the mold set 10.
  • the chamber 21 is lowered as shown in FIG. 1 with respect to the mold set 10 transported by a transport arm (not shown). Then, the inside of the mold set 10 is replaced with a nitrogen atmosphere by evacuating the chamber 21 and introducing an inert gas (nitrogen). Thereafter, the chamber 21 is raised, and the mold set 10 is transported to the molding chamber 30 by a transport arm (not shown).
  • the molding chamber 30 includes a heating stage 31, a press stage 32, and a cooling stage 33.
  • the heating stage 31 the molding material M is softened by heating the molding material M in the mold set 10 by the heaters 36 provided on the upper plate 34 and the lower plate 35.
  • the molding material M being heated is pressed (temporary press).
  • the press stage 32 the molding material M in the mold set 10 is pressed (main press) while the molding material M is heated by the heater 36.
  • the cooling stage 33 the molding material M after pressing is cooled by lowering the heating temperature of the heater.
  • the cooling stage 33 after the molding material M being cooled is pressed (cooling press), the molding material M is cooled to a temperature at which it can be taken out.
  • the mold set 10 is discharged from the molding chamber 30, and after the molded optical element O is collected from the mold set 10, a new molding material M is placed in the mold set 10 and the next molding is performed. .
  • a pressurizing cylinder 38 for pressurizing the mold set 10 via a shaft 37 is provided on each upper plate 34 in the heating stage 31, the press stage 32, and the cooling stage 33.
  • the molding chamber 30 includes an inlet shutter 301 that opens and closes when the mold set 10 is introduced from the replacement chamber 20 into the molding chamber 30, and an outlet shutter 302 that opens and closes when the mold set 10 is discharged from the molding chamber 30. I have.
  • the mold set 10 includes an upper mold (first mold) 11, a lower mold (second mold) 12, a sleeve 13, and a press amount regulating member 14. Yes.
  • the upper mold 11 and the lower mold 12 are each formed in a stepped cylindrical shape (convex shape), and are arranged so that the optical creation surfaces 111 and 121 face each other. These optical creation surfaces 111 and 121 are surfaces for creating an optical functional surface of the optical element O.
  • the optical creation surfaces 111 and 121 face each other with the molding material M in between.
  • the upper mold 11 includes a main body part 112, a main body part 112, and a flange part 113.
  • the main body 112 is a portion of the upper mold 11 that is accommodated (inserted) in the sleeve 13 and is formed in a columnar shape.
  • the optical creation surface 111 described above is formed at the end of the main body 112 on the lower mold 12 side.
  • the flange portion 113 is a portion of the upper mold 11 that is not accommodated in the sleeve 13 and is formed in an inverted trapezoidal shape.
  • the flange portion 113 is formed integrally with the main body portion 112, and is provided on the upper mold 11 on the opposite side of the optical creation surface 111. Further, the flange portion 113 protrudes outward from the inner peripheral surface 13 a of the sleeve 13. Further, the upper base of the trapezoidal flange portion 113 constitutes the upper surface 11 a of the upper mold 11.
  • the taper part 113a which consists of a taper-shaped surface is provided in the side surface of the flange part 113. As shown in FIG. The taper portion 113a is in contact with the taper portion 14b of the press amount regulating member 14 when the die is assembled as shown in FIG. 2, that is, when the die set 10 is not heated, and is engaged by the taper portion 14b. It has been stopped. Further, the taper portion 113a is inclined in the pressing direction from the lower mold 12 to the upper mold 11 and from the center of the upper mold 11 to the radially outer side.
  • the sleeve 13 is for supporting the upper die 11 and the lower die 12 and positioning them.
  • the sleeve 13 is formed in a cylindrical shape, and is provided around the upper mold 11 and the lower mold 12. The sleeve 13 is fitted to the lower mold 12.
  • the press amount regulating member 14 is for regulating the press amount of the upper die 11 by the pressure cylinder 38.
  • the press amount regulating member 14 is formed in a cylindrical shape, and is provided around the upper die 11, the lower die 12, and the sleeve 13. A predetermined clearance is formed between the inner peripheral surface 14 a of the press amount regulating member 14 and the outer peripheral surface 13 b of the sleeve 13. As shown in FIG. 1, when the pressing material 32 is pressed against the molding material M in the mold set 10 on the press stage 32, the pressing amount regulating member 14 is pressed against the lower surface of the upper plate 34, thereby reducing the pressing amount. regulate.
  • the press amount regulating member 14 is provided with a tapered portion (holding portion) 14b formed of a tapered surface on the inner peripheral surface 14a side.
  • the taper portion 14b is formed from the upper surface 14c to the inner peripheral surface 14a of the press amount regulating member 14, and in the state when the die is assembled as shown in FIG. 2, that is, the die set 10 is not heated. 11 is in contact with the tapered portion 113a of the flange portion 113.
  • the contact part of the taper part 113a of the flange part 113 and the taper part 14b of the press amount control member 14 is each formed in the taper shape.
  • the taper portion 14 b is inclined in the direction from the upper die 11 to the lower die 12 in the pressing direction and in the direction from the radially outer side of the press amount regulating member 14 toward the center. Details of the angles and lengths of the tapered portions 113a and 14b will be described later.
  • the mold set 10 is not yet conveyed to the heating stage 31, and the mold set 10 is not heated (for example, the mold set 10).
  • the taper portion 14 b is brought into contact with the taper portion 113 a of the flange portion 113 of the upper die 11 to lock the flange portion 113, and the upper die 11 and the lower die 12.
  • the optical creation surfaces 111 and 121 are kept apart.
  • the press amount regulating member 14 is configured so that the taper portion 14 b is connected to the flange portion of the upper die 11 when the die set 10 is conveyed to the heating stage 31 and the die set 10 is heated.
  • the flange 113 is released from being separated from the taper portion 113a of the 113, and the upper die 11 and the lower die 12 can be moved relatively close to each other.
  • the press amount regulating member 14 is made of a material having a larger linear expansion coefficient than the upper die 11, the lower die 12 and the sleeve 13.
  • the press amount regulating member 14 is made of SUS316 or the like having a larger linear expansion coefficient.
  • the press amount regulating member 14 is made of a material having a larger linear expansion coefficient than the upper die 11, the lower die 12, and the sleeve 13, so that when the die set 10 is heated by the heating stage 31, The inner and outer diameters of the amount regulating member 14 are expanded by thermal expansion, and the tapered portion 14 b is separated from the tapered portion 113 a of the flange portion 113 of the upper mold 11.
  • the molding material M is disposed on the optical creation surface 121 of the lower mold 12.
  • the molding material M for example, “S-BAL42” which is a glass material can be used. Further, the molding material M can be of any shape. Subsequently, the press amount regulating member 14 is inserted into the outer peripheral side of the sleeve 13, and the main body 112 of the upper mold 11 is inserted into the sleeve 13.
  • the taper portion 113a of the flange portion 113 and the taper portion 14b of the press amount regulating member 14 come into contact with each other.
  • the contact between the taper portion 113a and the taper portion 14b causes the center axis of the optical creation surface 111 of the upper mold 11 and the inner diameter of the press amount regulating member 14 to be
  • the central axis is coaxial and the two central axes coincide on the same axis.
  • the upper mold 11 and the lower mold 12 are also positioned by the sleeve 13 so that the central axes thereof coincide with each other, the central axes of all the members constituting the mold set 10 coincide with each other.
  • the optical creation surfaces 111 and 121 of the upper mold 11 and the lower mold 12 are separated from each other by a predetermined distance, and the optical of the upper mold 11 The state where the creation surface 111 and the molding material M are separated from each other by a predetermined distance is maintained.
  • the mold set 10 is transported to the replacement chamber 20 of the molding apparatus 1 by a transport arm (not shown).
  • Heating process In the heating step, as shown in FIG. 1, in the heating stage 31, the mold set 10 is sandwiched between the upper plate 34 and the lower plate 35 heated to, for example, 600 ° C., and the molding material M is heated.
  • the upper die 11 immediately after being conveyed to the heating stage 31 is supported by the taper portion 14b of the press amount regulating member 14, it is in a non-contact state with the molding material M.
  • the temperature of the mold set 10 reaches, for example, around 439 ° C., as shown in FIG. 1, the inner and outer diameters of the press amount regulating member 14 are expanded by thermal expansion. Then, the contact between the taper portion 113a of the flange portion 113 of the upper mold 11 and the taper portion 14b of the press amount regulating member 14 is released, and the upper mold 11 is not held. That is, the state in which the movement of the upper mold 11 is regulated by the taper portion 14 b of the press amount regulating member 14 is released, and the molding material M can be pressed by the upper mold 11.
  • the temperature at which the upper mold 11 is not held (hereinafter referred to as “holding release temperature”) can be set in consideration of the re-holding temperature of the upper mold 11 described later. It can be set higher than ⁇ 100 ° C. or near the transition point (Tg) of the molding material M.
  • the holding release temperature of the upper mold 11 is set to 439 ° C., which is higher than the strain point of the molding material M ⁇ 100 ° C. More specifically, the above-described holding release temperature indicates a temperature when the upper mold 11 is in an unheld state and the upper mold 11 first contacts the molding material M.
  • the upper mold 11 that has not been held moves toward the lower mold 12 as shown in FIG. At that time, the upper die 11 gradually descends along the taper portion 14 b of the press amount regulating member 14 and slowly contacts the molding material M. Therefore, the scratch of the molding material M due to the contact with the upper mold 11 is very slight, or the generation of the scratch itself is suppressed.
  • the heating step after the upper mold 11 comes into contact with the molding material M as described above, a temporary press is performed to press the molding material M while continuing heating until the mold set 10 reaches 600 ° C.
  • the mold set 10 is transported to the press stage 32 by a transport arm (not shown).
  • pressing process In the pressing step, as shown in FIG. 1, in the press stage 32, for example, a main press is performed in which the mold set 10 is sandwiched between the upper plate 34 and the lower plate 35 heated to 620 ° C. and the molding material M is pressed. In this step, pressing is performed until the lower surface of the upper plate 34 comes into contact with the upper surface 14c of the pressing amount regulating member 14. When the pressing of the molding material M is completed, the mold set 10 is transported to the cooling stage 33 by a transport arm (not shown).
  • the molding material M is cooled in the cooling stage 33.
  • a cooling press for pressing the molding material M by the pressing member 39 provided on the upper plate 34 is performed while cooling the molding material M.
  • the cooling press is performed in order to improve the accuracy of the optical element O after molding.
  • the inner and outer diameters of the press amount regulating member 14 are reduced by heat shrinkage.
  • type 11 and the taper part 14b of the press amount regulation member 14 contact again.
  • the taper portion 113a of the flange portion 113 moves along the taper portion 14b of the press amount regulating member 14, whereby the upper die 11 moves away from the lower die 12, and the upper die 11 is moved.
  • the contact with the molding material M are released.
  • the temperature when the upper die 11 is again held and the contact between the upper die 11 and the molding material M is released is defined as “re-holding temperature”.
  • the mold set 10 is discharged from the molding chamber 30 by a transfer arm (not shown).
  • the upper die 11 is removed from the die set 10 after discharge, and the optical element O is taken out.
  • the optical element O is continuously manufactured, after the upper mold 11 is removed and a new molding material M is placed on the lower mold 12 and the mold assembling process is performed, the above-described replacement process to the extracting process are repeated. .
  • d1 [ ⁇ 1 + ⁇ 1 (t2-z) ⁇ / ⁇ 1 + ⁇ 2 (t2-z) ⁇ ] * [e / ⁇ 2 (b2-b1) ⁇ ] ⁇ [e / ⁇ 2 (b2-b1) ⁇ ] (1) c> b1-b2 (2) c> k (3) g1> d1 (4) fi> 0 (5)
  • values other than the re-holding temperature t2 of the upper mold 11 and the distances b1 and b2 between the upper mold 11 and the lower mold 12 before and after molding are values that have been previously determined or set. Accordingly, after determining the re-holding temperature t2 of the upper die 11 and the distances b1 and b2 between the upper die 11 and the lower die 12 before and after molding, the taper is based on the above equations (1) to (5).
  • the taper angle d1 and taper length c of the portion 113a and the taper angle g1 and taper length f of the taper portion 14b are set.
  • the mold set 10 when the mold set 10 is not heated, such as when the mold is assembled, the optical creation surfaces 111 and 121 of the upper mold 11 and the lower mold 12 are separated from each other. Therefore, generation
  • the mold set 10 it is possible to suppress the generation of scratches on the molding material M having an arbitrary shape without being influenced by the shape of the molding material M, and to manufacture the optical element O by a simple process. can do. Further, according to the mold set 10, the upper mold 11 is held using the press amount regulating member 14, so that no significant improvement or the like is required, and the occurrence of scratches on the molding material M is suppressed with a simple configuration. can do.
  • FIG. 3 A configuration of a mold set 10A according to Embodiment 2 of the present invention will be described with reference to FIGS.
  • the mold set 10 ⁇ / b> A has the same configuration as the mold set 10 according to Embodiment 1 except for the upper mold 11 ⁇ / b> A and the press amount regulating member 14 ⁇ / b> A.
  • the upper mold 11A includes a main body portion 112A and a flange portion 113A.
  • the main body portion 112A is formed in a columnar shape, and a flange portion 113A is provided on a part of the side peripheral surface 112a.
  • the lower side of the flange portion 113 ⁇ / b> A is a portion accommodated in the sleeve 13
  • the upper side of the flange portion 113 ⁇ / b> A is a portion not accommodated in the sleeve 13.
  • the upper surface of the main body 112A constitutes the upper surface 11a of the upper mold 11A.
  • the flange portion 113A is formed in a protruding shape along the side peripheral surface 112a of the main body portion 112A, and protrudes from the side peripheral surface 112a of the main body portion 112A.
  • the flange portion 113 ⁇ / b> A protrudes outward from the inner peripheral surface 13 a of the sleeve 13.
  • a tapered portion 113Aa made of a tapered surface is provided on the side surface of the flange portion 113A.
  • the taper portion 113Aa is in contact with the taper portion 141a of the flange portion 141 of the press amount regulating member 14A when the die is assembled as shown in FIG. 3, that is, when the die set 10A is not heated. It is locked by the portion 141a.
  • the press amount regulating member 14A is provided with a flange portion (holding portion) 141 on the inner peripheral surface 14a.
  • the flange portion 141 protrudes inward from the inner peripheral surface 14a of the press amount regulating member 14A.
  • the taper part 141a which consists of a taper-shaped surface is provided in the side surface of the flange part 141. As shown in FIG. The taper portion 141a is in contact with the taper portion 113Aa of the flange portion 113A of the upper die 11A in the state when the die is assembled as shown in FIG. 3, that is, in the state where the die set 10A is not heated. Thus, the contact portions between the taper portion 113Aa of the flange portion 113A and the taper portion 141a of the flange portion 141 are each formed in a tapered shape. Details of the angles of the tapered portions 113Aa and 141a will be described later.
  • the press amount regulating member 14A having such a configuration is such that the die set 10A is not yet conveyed to the heating stage 31, and the taper portion 141a is connected to the flange of the upper die 11A when the die set 10A is not heated.
  • the flange portion 113A is brought into contact with the taper portion 113Aa of the portion 113A, and the optical creation surfaces 111 and 121 of the upper mold 11A and the lower mold 12 are held apart.
  • the press amount regulating member 14A has the taper portion 141a separated from the taper portion 113Aa of the flange portion 113A of the upper die 11A when the die set 10A is conveyed to the heating stage 31 and the die set 10A is heated.
  • the locking of the flange portion 113A is released, and the upper die 11A and the lower die 12 can be moved relatively close to each other.
  • the press amount regulating member 14A is made of a material having a larger linear expansion coefficient than the upper die 11A, the lower die 12 and the sleeve 13, like the press amount regulating member 14 described above.
  • the inner and outer diameters of the press amount regulating member 14A are expanded by thermal expansion, and the taper part 141a of the flange part 141 is the taper of the flange part 113A of the upper mold 11A. Separated from the portion 113Aa.
  • FIG. 10A the operation of the mold set 10A according to the present embodiment will be described with reference to FIGS. 1 and 3 to 5.
  • FIG. 10A the operation of the mold set 10A will be described in the description of the method for manufacturing the optical element O using the molding apparatus 1 including the mold set 10A.
  • the mold assembling process, the replacing process, the heating process, the pressing process, the cooling process, and the removing process are performed in this order.
  • the die assembly process, the replacement process, and the pressing process in the present embodiment are the same as those in the first embodiment, description thereof is omitted.
  • Heating process In the heating process, in the heating stage 31, the mold set 10A is sandwiched between the upper plate 34 and the lower plate 35 heated to, for example, 600 ° C., and the molding material M is heated.
  • the upper die 11A immediately after being transported to the heating stage 31 is supported by the taper portion 141a of the flange portion 141 of the press amount regulating member 14A, and therefore is not in contact with the molding material M.
  • the temperature of the mold set 10A reaches, for example, around 540 ° C.
  • the inner and outer diameters of the press amount regulating member 14A are expanded by thermal expansion.
  • the contact between the taper portion 113Aa of the flange portion 113A of the upper die 11A and the taper portion 141a of the flange portion 141 is released, and the upper die 11A is not held. That is, the state in which the movement of the upper mold 11A is restricted by the taper part 141a of the flange part 141 is released, and the molding material M can be pressed by the upper mold 11A.
  • the holding release temperature of the upper mold 11A is set to a temperature higher than that in the first embodiment.
  • the holding release temperature of the upper die 11A can be set according to the design of the tapered portions 113Aa and 141a, and can be set, for example, higher than the strain point of the molding material M. Further, the holding release temperature of the upper mold 11A is set so that the viscosity of the molding material M is suppressed in order to suppress scratches on the molding material M when the upper mold 11A released from holding falls and contacts the molding material M. May be set in the vicinity of the transition point (Tg) at which the value rapidly decreases. In the present embodiment, as an example, the holding release temperature of the upper mold 11 is set to 540 ° C., which is the strain point of the molding material M (“S-BAL42”).
  • the upper die 11 ⁇ / b> A that has not been held falls toward the lower die 12 and comes into contact with the molding material M.
  • the molding material M is heated to a temperature equal to or higher than the strain point, the upper mold 11A comes into contact with the molding material M having a lower viscosity than that of the first embodiment. Therefore, in the present embodiment, as compared with the first embodiment, the scratch of the molding material M due to the contact of the upper mold 11A becomes even lighter or the generation of the scratch itself is suppressed.
  • the heating step as described above, after the upper mold 11A comes into contact with the molding material M, temporary pressing is performed to press the molding material M while continuing heating until the mold set 10A reaches 600 ° C.
  • the mold set 10A is transported to the press stage 32 by a transport arm (not shown).
  • the inner and outer diameters of the press amount regulating member 14A are reduced by heat shrinkage.
  • this embodiment differs from the first embodiment in that the taper portion 113Aa of the flange portion 113A of the upper mold 11A and the taper portion 141a of the flange portion 141 are again provided even if the pressing amount regulating member 14A is reduced in diameter. There is no contact, and the upper mold 11A is not held again.
  • the contact between the upper mold 11A and the molding material M is not released, so the state of the cooling press is maintained up to a temperature at which it can be taken out (for example, 100 ° C.).
  • a pressing pressure can be applied to the molding material M. Therefore, the accuracy of the shape of the optical element O can be further improved.
  • the mold set 10A is discharged from the molding chamber 30 by a transfer arm (not shown).
  • the press amount regulating member 14A is first removed from the die set 10A after being discharged, then the upper die 11A is removed, and the optical element O is taken out. And when manufacturing the optical element O continuously, after carrying out the die assembly process by placing a new molding material M on the lower die 12 with the press amount regulating member 14A and the upper die 11A removed, the above-described replacement Repeat the process to the removal process.
  • values other than the holding release temperature t3 of the upper mold 11A and the distance b3 between the upper mold 11A and the molding material M before molding are values that have been previously determined or set. Therefore, after determining the holding release temperature t3 of the upper mold 11A and the distance b3 between the upper mold 11A and the molding material M before molding, the taper portion 113Aa of the tapered portion 113Aa is based on the above formulas (6) and (7).
  • the taper angle d2 and the taper angle g2 of the taper part 141a are set.
  • the molding material M having an arbitrary shape can be molded as in the first embodiment, and scratches on the molding material M before the heat treatment can be performed with a simple configuration. Can be suppressed.
  • the holding release temperature of the upper mold 11A is set in consideration of the re-holding temperature. There is no need to do. Therefore, in the mold set 10A, the holding release temperature of the upper mold 11A can be set to a temperature higher than that in the first embodiment. Therefore, when the mold set 10A is heated, the upper mold 11A comes into contact with the molding material M having a lower viscosity than that of the first embodiment, so that generation of scratches on the molding material M is further suppressed.
  • the upper mold 11B includes a main body portion 112B and a flange portion 113B.
  • the main body portion 112B is a portion of the upper mold 11B that is accommodated in the sleeve 13, and is formed in a columnar shape.
  • the flange 113B is provided continuously in the pressing direction of the molding material M from the end of the main body 112B (the end opposite to the lower mold 12) in the upper mold 11B. Further, the flange portion 113 ⁇ / b> B protrudes outward from the inner peripheral surface 13 a of the sleeve 13.
  • the upper surface of the flange portion 113B constitutes the upper surface 11a of the upper mold 11B.
  • a pair of holding pins 114 are provided on the side surface of the flange portion 113B.
  • the holding pin 114 extends outward in the radial direction of the upper die 11B and protrudes outside the press amount regulating member 14B. Further, as will be described later, the holding pin 114 is in contact with and locked by the upper surface 14c of the press amount regulating member 14B before the molding material M is pressed.
  • the press amount regulating member 14B is provided with a pair of groove portions 142 having a predetermined depth along the pressing direction from the upper surface 14c.
  • the width of the groove 142 is formed to be equal to or larger than the diameter of the holding pin 114 of the upper mold 11B.
  • the holding pin 114 of the upper die 11B is brought into contact with the upper surface 14c to lock the holding pin 114.
  • the optical creation surfaces 111 and 121 of the upper mold 11B and the lower mold 12 are maintained in a separated state.
  • the press amount regulating member 14B drops the holding pin 114 into the groove 142 and locks the holding pin 114 as shown in FIGS. 7A and 7B.
  • the upper mold 11B and the lower mold 12 can be moved relatively close to each other.
  • the press amount regulating member 14B may be made of a material having a linear expansion coefficient larger than that of the upper die 11B, the lower die 12 and the sleeve 13, similarly to the press amount regulating member 14, or the upper die 11B.
  • the lower mold 12 and the sleeve 13 may be made of the same material.
  • FIG. 10B the operation of the mold set 10B according to the present embodiment will be described with reference to FIGS. 1 and 6A to 8.
  • FIG. 10B the operation of the mold set 10B will be described while describing a method for manufacturing the optical element O using the molding apparatus 1 including the mold set 10B.
  • the mold assembling process, the replacing process, the heating process, the pressing process, the cooling process, and the removing process are performed in this order.
  • the mold assembling process, the replacing process, the cooling process, and the removing process in the present embodiment are the same as those in the first embodiment, and thus the description thereof is omitted.
  • Heating process In the heating process, in the heating stage 31, for example, the mold set 10B is sandwiched between the upper plate 34 and the lower plate 35 heated to 600 ° C., and the molding material M is heated.
  • the upper die 11B conveyed to the heating stage 31 is supported by the upper surface 14c of the press amount regulating member 14B by the holding pins 114, it is in a non-contact state with the molding material M.
  • the heating temperature in the heating stage 31 may be set to be higher than the strain point of the molding material M, for example, or may be set near the transition point (Tg) of the molding material M. In the present embodiment, as an example, the heating temperature in the heating stage 31 is set to 600 ° C. In the heating step, when the heating of the mold set 10B is completed, the mold set 10B is transported to the press stage 32 by a transport arm (not shown).
  • a main press is performed in which the mold set 10B is sandwiched between the upper plate 34 and the lower plate 35 heated to, for example, 620 ° C., and the molding material M is pressed on the press stage 32.
  • the protruding pin 40 is protruded with respect to the holding pin 114 of the upper die 11B, and the holding pin 114 of the upper die 11B is pushed out.
  • the upper mold 11B is rotated.
  • the holding pin 114 is dropped into the groove 142 of the press amount regulating member 14B.
  • the upper mold 11B is not held, and the molding material M can be pressed by the upper mold 11B.
  • the upper die 11B in the unheld state falls toward the lower die 12 and contacts the molding material M as shown in FIG. 7B.
  • the upper mold 11B comes into contact with the molding material M having a lower viscosity than that of the second embodiment. Therefore, in the present embodiment, as compared with the second embodiment, the scratch of the molding material M due to the contact of the upper mold 11B becomes even lighter or the generation of the scratch itself is suppressed.
  • the main press is performed after the upper mold 11 ⁇ / b> B is not held, and pressing is performed until the lower surface of the upper plate 34 comes into contact with the upper surface 14 c of the press amount regulating member 14 ⁇ / b> B.
  • the mold set 10B is transported to the cooling stage 33 by a transport arm (not shown).
  • the molding material M having an arbitrary shape can be molded as in the first and second embodiments, and scratches on the molding material M before the heat treatment are generated. Can be suppressed.
  • the mold set 10B does not release the holding of the upper molds 11 and 11A due to the difference in thermal expansion of the press amount regulating members 14 and 14A as in the first and second embodiments, but the holding pins 114 of the upper mold 11B. Is released into the groove 142 of the press amount regulating member 14B to release the holding of the upper die 11B, so that the heating conditions in the heating step can be freely set. Therefore, the upper mold 11B can be brought into contact with the molding material M having a lower viscosity than those of the first and second embodiments, and the generation of scratches on the molding material M is further suppressed.
  • optical element manufacturing mold set according to the present invention has been described in detail with reference to the embodiments for carrying out the invention.
  • the gist of the present invention is not limited to these descriptions, and the claims are described. Should be interpreted widely. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.
  • the flange portions 113 and 113A of the upper molds 11 and 11A are continuously formed over the entire circumference of the side peripheral surface 112a of the main body portions 112 and 112A. It may be intermittently formed on a part of the side peripheral surface 112a of 112A.
  • the flange portion 141 of the press amount restricting member 14A is continuously formed over the entire circumference of the inner peripheral surface 14a of the press amount restricting member 14A. You may form intermittently in a part of surrounding surface 14a.
  • the press amount regulating members 14 and 14A are made of a material having a linear expansion coefficient larger than that of the upper molds 11 and 11A, the lower mold 12 and the sleeve 13, but the upper molds 11 and 11A.
  • the lower mold 12, the sleeve 13, and the press amount regulating members 14, 14A may all be made of a material having the same linear expansion coefficient. In this case, for example, in the heating step, only the press amount restricting members 14 and 14A are intensively heated to give a difference in thermal expansion amount between the press amount restricting members 14 and 14A and the other members, Release the upper mold 11, 11A.
  • Molding device 10A, 10B Optical element manufacturing mold set (mold set) 11, 11A, 11B Upper mold (first mold) 11a upper surface 111 optical creation surface 112, 112A, 112B main body part 112a side peripheral surface 113, 113A, 113B flange part 113a, 113Aa taper part 114 holding pin 12 lower mold (second mold) 121 Optical creation surface 13 Sleeve 13a Inner peripheral surface 13b Outer peripheral surface 14, 14A, 14B Press amount regulating member 14a Inner peripheral surface 14b Tapered portion (holding portion) 14c upper surface 141 flange part (holding part) 141a Taper part 142 Groove part 20 Replacement chamber 21 Chamber 30 Molding chamber 301 Entrance shutter 302 Exit shutter 31 Heating stage 32 Press stage 33 Cooling stage 34 Upper plate 35 Lower plate 36 Heater 37 Shaft 38 Pressure cylinder 40 Extrusion pin M Molding material O Optical element

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Abstract

A mold set 10 comprises an upper mold 11, a lower mold 12, a sleeve 13, and a pressing amount regulating member 14. The upper mold 11 includes a body part 112 and a flange part 113 that protrudes further outward than an inner peripheral surface 13a of the sleeve 13. In a state where the mold 10 is not being heated, a tapered part 14b of the pressing amount regulating member 14 is made to contact the flange part 113 and lock the flange part 113 in place, and the pressing amount regulating member 14 maintains a state in which optical formation surfaces 111, 121 of the upper mold 11 and the lower mold 12 are separated from each other. In a state where the mold set 10 is being heated, the tapered part 14b of the pressing amount regulating member 14 is made to separate from the flange part 113 and release locking of the flange part 113, and the upper mold 11 and the lower mold 12 can be moved closer relative to each other.

Description

光学素子製造用型セットOptical element manufacturing mold set
　本発明は、光学素子製造用型セットに関する。 The present invention relates to a mold set for manufacturing an optical element.
　ガラスレンズ等の光学素子の成形方法の一つとして、一対の金型と、金型の位置決めを行う筒状のスリーブと、スリーブの外周に配置された筒状のプレス量規制部材とを備える型セットを用いた循環式の成形方法が知られている。この成形方法では、異なる温度に加熱された複数のヒータプレート上に型セットを順次搬送し、型セット内の成形素材を押圧することにより、当該成形素材を所望の形状へと徐々に変形させる。 As one method of molding optical elements such as glass lenses, a mold comprising a pair of molds, a cylindrical sleeve for positioning the mold, and a cylindrical press amount regulating member disposed on the outer periphery of the sleeve A circulation type molding method using a set is known. In this molding method, the mold set is sequentially conveyed onto a plurality of heater plates heated to different temperatures, and the molding material is gradually deformed into a desired shape by pressing the molding material in the mold set.
　このような循環式の成形方法として、例えば特許文献１には、型セットに対して第１～第３の加熱処理、メインプレス処理、冷却プレス処理および冷却処理を順番に実施する方法が開示されている。 As such a cyclic molding method, for example, Patent Document 1 discloses a method of sequentially performing first to third heat treatment, main press treatment, cooling press treatment, and cooling treatment on a mold set. ing.
　ここで、特許文献１における成形方法では、成形素材を型セット内に配置した際に、上型の自重によって成形素材が下型の方向に押し付けられるため、成形素材における、上型との接触部にキズが形成されてしまうという問題がある。なお、型セットの上型のサイズおよび重量は、成形する光学素子のサイズに応じて大きくなるため、成形する光学素子のサイズが大きい程、前記したキズ発生の問題は顕著となる。 Here, in the molding method in Patent Document 1, when the molding material is placed in the mold set, the molding material is pressed in the direction of the lower mold by the weight of the upper mold, so the contact portion with the upper mold in the molding material There is a problem that scratches are formed. In addition, since the size and weight of the upper mold of the mold set increase according to the size of the optical element to be molded, the larger the size of the optical element to be molded, the more prominent the problem of occurrence of scratches.
　このような問題を解決するために、例えば特許文献２では、型セットを組み付けた状態において、上型と成形素材とが非接触となるように構成した型セットが提案されている。また、例えば特許文献３では、スリーブに挿入したピンで上型を支持することにより、上型と成形素材とが非接触となるように構成した型セットが提案されている。 In order to solve such a problem, for example, Patent Document 2 proposes a mold set configured such that the upper mold and the molding material are not in contact with each other when the mold set is assembled. For example, Patent Document 3 proposes a mold set configured such that an upper mold and a molding material are not in contact with each other by supporting the upper mold with a pin inserted into a sleeve.
特開２０１５－１９３４９８号公報JP2015-193498A 特開２０１２－１５８４９０号公報JP 2012-158490 A 特開２０１２－１８０２５２号公報JP 2012-180252 A
　しかしながら、特許文献２における型セットは、成形素材の形状がメニス形状に限定されるため、成形可能な光学素子の形状も限定されてしまうという問題がある。また、特許文献３における型セットは、型セットの構成が複雑になり、また、ピンの引き抜きや引き抜き後のピンの回収等の作業が別途必要となるため、製造工程が複雑になるという問題がある。 However, the mold set in Patent Document 2 has a problem that since the shape of the molding material is limited to the menis shape, the shape of the moldable optical element is also limited. In addition, the mold set in Patent Document 3 has a complicated configuration, and requires additional work such as pulling out the pins and collecting the pins after pulling out, which complicates the manufacturing process. is there.
　本発明は、上記に鑑みてなされたものであって、任意の形状の成形素材を用いて、簡易な工程で光学素子を製造することができ、かつ、簡易な構成によって加熱処理前における成形素材へのキズの発生を抑制することができる光学素子製造用型セットを提供することを目的とする。 The present invention has been made in view of the above, and it is possible to manufacture an optical element with a simple process using a molding material of an arbitrary shape, and the molding material before heat treatment with a simple configuration. An object of the present invention is to provide a mold set for manufacturing an optical element capable of suppressing the generation of scratches.
　上述した課題を解決し、目的を達成するために、本発明に係る光学素子製造用型セットは、互いに対向する光学創生面を有する第一の金型および第二の金型と、前記第一の金型および前記第二の金型の周囲に設けられた筒状のスリーブと、前記スリーブの周囲に設けられた筒状のプレス量規制部材と、を備える光学素子製造用型セットであって、前記第一の金型は、前記スリーブに挿入された本体部と、前記スリーブの内周面よりも外側に突出したフランジ部と、を有し、前記プレス量規制部材は、前記フランジ部と接触可能な保持部を有し、前記光学素子製造用型セットが加熱されていない状態では、前記保持部を前記フランジ部に接触させて前記フランジ部を係止し、前記第一の金型および前記第二の金型のそれぞれの光学創生面が離間した状態を保持し、前記光学素子製造用型セットが加熱されている状態では、前記保持部を前記フランジ部から離間させて前記フランジ部の係止を解除し、前記第一の金型および前記第二の金型の相対的な近接動を可能とすることを特徴とする。 In order to solve the above-described problems and achieve the object, an optical element manufacturing mold set according to the present invention includes a first mold and a second mold having optical creation surfaces facing each other, and the first mold A mold set for manufacturing an optical element, comprising: a cylindrical sleeve provided around one mold and the second mold; and a cylindrical press amount regulating member provided around the sleeve. The first mold has a main body portion inserted into the sleeve, and a flange portion protruding outward from the inner peripheral surface of the sleeve, and the press amount regulating member includes the flange portion. And holding the holding part in contact with the flange part to lock the flange part when the optical element manufacturing mold set is not heated. And the optical creation surfaces of the second mold are separated from each other. In the state where the optical element manufacturing mold set is heated, the holding part is separated from the flange part to release the locking of the flange part, and the first mold and the It is characterized by enabling relative movement of the second mold.
　また、本発明に係る光学素子製造用型セットは、上記発明において、前記プレス量規制部材は、前記光学素子製造用型セットが加熱されている状態において、熱膨張によって拡径することにより、前記保持部を前記フランジ部から離間させることを特徴とする。 Further, the optical element manufacturing mold set according to the present invention is the above invention, wherein the press amount regulating member is expanded in diameter by thermal expansion in a state where the optical element manufacturing mold set is heated. The holding portion is separated from the flange portion.
　また、本発明に係る光学素子製造用型セットは、上記発明において、前記プレス量規制部材は、前記第一の金型、前記第二の金型および前記スリーブよりも線膨張係数が大きい材料で構成されていることを特徴とする。 In the optical element manufacturing mold set according to the present invention, in the above invention, the press amount regulating member is made of a material having a larger linear expansion coefficient than the first mold, the second mold, and the sleeve. It is configured.
　また、本発明に係る光学素子製造用型セットは、上記発明において、前記フランジ部および前記保持部の接触部は、それぞれテーパ状であることを特徴とする。 The optical element manufacturing mold set according to the present invention is characterized in that, in the above invention, the contact portions of the flange portion and the holding portion are each tapered.
　また、本発明に係る光学素子製造用型セットは、上記発明において、前記保持部は、前記ブレス量規制部材の内周面よりも内側に突出したフランジ部からなることを特徴とする。 The optical element manufacturing mold set according to the present invention is characterized in that, in the above-described invention, the holding portion is formed of a flange portion protruding inward from an inner peripheral surface of the breath amount regulating member.
　本発明によれば、型組み付け時等の、型セットが加熱されていない状態では、第一の金型および第二の金型のそれぞれの光学創生面が離間した状態が保持されているため、加熱処理前における成形素材へのキズの発生を抑制することができる。また、本発明によれば、任意の形状の成形素材へのキズの発生を抑制し、かつ簡易な工程で光学素子を製造することができる。さらに、本発明によれば、プレス量規制部材を利用して上型を保持するため、大幅な改良等を必要とせず、簡易な構成によって、成形素材へのキズの発生を抑制することができる。 According to the present invention, when the mold set is not heated, such as when the mold is assembled, the optical creation surfaces of the first mold and the second mold are kept apart from each other. The occurrence of scratches on the molding material before the heat treatment can be suppressed. Further, according to the present invention, it is possible to suppress the generation of scratches on a molding material having an arbitrary shape and to manufacture an optical element with a simple process. Furthermore, according to the present invention, since the upper die is held using the press amount regulating member, it is possible to suppress the occurrence of scratches on the molding material with a simple configuration without requiring a significant improvement. .
図１は、本発明の実施の形態に係る光学素子製造用型セットを備える成形装置の要部の構成を示す断面図である。FIG. 1 is a cross-sectional view illustrating a configuration of a main part of a molding apparatus including an optical element manufacturing mold set according to an embodiment of the present invention. 図２は、本発明の実施の形態１に係る光学素子製造用型セットを、押圧方向に沿って切断した断面図である。FIG. 2 is a cross-sectional view of the optical element manufacturing mold set according to Embodiment 1 of the present invention cut along the pressing direction. 図３は、本発明の実施の形態２に係る光学素子製造用型セットを、押圧方向に沿って切断した断面図である。FIG. 3 is a cross-sectional view of the optical element manufacturing mold set according to Embodiment 2 of the present invention cut along the pressing direction. 図４は、本発明の実施の形態２に係る光学素子製造用型セットを加熱ステージにおいて加熱している際の状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state when the optical element manufacturing mold set according to Embodiment 2 of the present invention is heated on the heating stage. 図５は、本発明の実施の形態２に係る光学素子製造用型セットを、冷却ステージにおいて冷却している際の状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state when the optical element manufacturing mold set according to the second embodiment of the present invention is cooled in the cooling stage. 図６Ａは、本発明の実施の形態３に係る光学素子製造用型セットの構成を示す平面図である。FIG. 6A is a plan view showing a configuration of an optical element manufacturing mold set according to Embodiment 3 of the present invention. 図６Ｂは、図６ＡのＡ－Ａ断面図である。6B is a cross-sectional view taken along the line AA in FIG. 6A. 図７Ａは、本発明の実施の形態３に係る光学素子製造用型セットの上型を回転させた状態を示す平面図である。FIG. 7A is a plan view showing a state in which the upper mold of the optical element manufacturing mold set according to Embodiment 3 of the present invention is rotated. 図７Ｂは、図７ＡのＡ－Ａ断面図である。FIG. 7B is a cross-sectional view taken along the line AA in FIG. 7A. 図８は、本発明の実施の形態３に係る光学素子製造用型セットによって、成形素材を押圧している際の状態を示す断面図である。FIG. 8 is a cross-sectional view showing a state where a molding material is pressed by the optical element manufacturing mold set according to Embodiment 3 of the present invention.
　以下、本発明に係る光学素子製造用型セットの実施の形態について、図面を参照しながら説明する。なお、本発明は以下の実施の形態に限定されるものではなく、以下の実施の形態における構成要素には、当業者が置換可能かつ容易なもの、あるいは実質的に同一のものも含まれる。 Hereinafter, embodiments of an optical element manufacturing mold set according to the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments, and constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same.
［成形装置の構成］
　成形装置１は、図１に示すように、加熱軟化させた成形素材（例えばガラス素材）Ｍをプレス成形することにより光学素子（例えばガラスレンズ）Ｏを成形するものである。成形装置１は、光学素子製造用型セット（以下、「型セット」という）１０と、置換室２０と、成形室３０と、を主に備えている。 [Configuration of molding equipment]
As shown in FIG. 1, the molding apparatus 1 is for molding an optical element (for example, a glass lens) O by press-molding a heat-softened molding material (for example, a glass material) M. The molding apparatus 1 mainly includes a mold set for manufacturing an optical element (hereinafter referred to as “mold set”) 10, a replacement chamber 20, and a molding chamber 30.
　置換室２０は、型セット１０を収容するチャンバ２１を備えている。この置換室２０では、図示しない搬送アームによって搬送された型セット１０に対して、図１に示すようにチャンバ２１を下降させる。そして、チャンバ２１内を真空引きし、不活性ガス（窒素）を導入することにより、型セット１０の内部の雰囲気を窒素雰囲気に置換する。その後、チャンバ２１を上昇させ、図示しない搬送アームによって型セット１０を成形室３０に搬送する。 The replacement chamber 20 includes a chamber 21 that houses the mold set 10. In the replacement chamber 20, the chamber 21 is lowered as shown in FIG. 1 with respect to the mold set 10 transported by a transport arm (not shown). Then, the inside of the mold set 10 is replaced with a nitrogen atmosphere by evacuating the chamber 21 and introducing an inert gas (nitrogen). Thereafter, the chamber 21 is raised, and the mold set 10 is transported to the molding chamber 30 by a transport arm (not shown).
　成形室３０は、加熱ステージ３１と、プレスステージ３２と、冷却ステージ３３と、を備えている。加熱ステージ３１では、上プレート３４および下プレート３５に設けられたヒータ３６によって、型セット１０内の成形素材Ｍを加熱することにより、成形素材Ｍを軟化させる。また、加熱ステージ３１では、加熱中の成形素材Ｍを押圧（仮プレス）する。プレスステージ３２では、ヒータ３６によって成形素材Ｍを加熱しつつ、型セット１０内の成形素材Ｍを押圧（本プレス）する。また、冷却ステージ３３では、ヒータ３６の加熱温度を低下させることにより、プレス後の成形素材Ｍを冷却する。なお、冷却ステージ３３では、冷却中の成形素材Ｍを押圧（冷却プレス）した後、当該成形素材Ｍを取り出し可能な温度まで冷却する。その後、型セット１０は成形室３０から排出され、型セット１０から成形後の光学素子Ｏが回収された後、型セット１０内に新たな成形素材Ｍが配置され、次の成形が実施される。 The molding chamber 30 includes a heating stage 31, a press stage 32, and a cooling stage 33. In the heating stage 31, the molding material M is softened by heating the molding material M in the mold set 10 by the heaters 36 provided on the upper plate 34 and the lower plate 35. Moreover, in the heating stage 31, the molding material M being heated is pressed (temporary press). In the press stage 32, the molding material M in the mold set 10 is pressed (main press) while the molding material M is heated by the heater 36. Moreover, in the cooling stage 33, the molding material M after pressing is cooled by lowering the heating temperature of the heater. In the cooling stage 33, after the molding material M being cooled is pressed (cooling press), the molding material M is cooled to a temperature at which it can be taken out. Thereafter, the mold set 10 is discharged from the molding chamber 30, and after the molded optical element O is collected from the mold set 10, a new molding material M is placed in the mold set 10 and the next molding is performed. .
　加熱ステージ３１、プレスステージ３２および冷却ステージ３３におけるそれぞれの上プレート３４には、シャフト３７を介して、型セット１０を加圧するための加圧シリンダ３８が設けられている。また、成形室３０は、型セット１０を置換室２０から成形室３０に導入する際に開閉する入口シャッター３０１と、型セット１０を成形室３０から排出する際に開閉する出口シャッター３０２と、を備えている。 A pressurizing cylinder 38 for pressurizing the mold set 10 via a shaft 37 is provided on each upper plate 34 in the heating stage 31, the press stage 32, and the cooling stage 33. The molding chamber 30 includes an inlet shutter 301 that opens and closes when the mold set 10 is introduced from the replacement chamber 20 into the molding chamber 30, and an outlet shutter 302 that opens and closes when the mold set 10 is discharged from the molding chamber 30. I have.
［型セットの構成（実施の形態１）］
　本発明の実施の形態１に係る型セット１０の構成について、図１および図２を参照しながら説明する。型セット１０は、図２に示すように、上型（第一の金型）１１と、下型（第二の金型）１２と、スリーブ１３と、プレス量規制部材１４と、を備えている。 [Configuration of Mold Set (Embodiment 1)]
The configuration of the mold set 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. As shown in FIG. 2, the mold set 10 includes an upper mold (first mold) 11, a lower mold (second mold) 12, a sleeve 13, and a press amount regulating member 14. Yes.
　上型１１および下型１２は、それぞれ段付きの円柱形状（凸状）に形成されており、それぞれの光学創生面１１１，１２１が対向するように配置されている。これらの光学創生面１１１，１２１は、光学素子Ｏの光学機能面を創生するための面である。上型１１および下型１２は、図１に示すように成形装置１内に搬送された際に、成形素材Ｍを挟んで互いの光学創生面１１１，１２１が対向する状態となる。 The upper mold 11 and the lower mold 12 are each formed in a stepped cylindrical shape (convex shape), and are arranged so that the optical creation surfaces 111 and 121 face each other. These optical creation surfaces 111 and 121 are surfaces for creating an optical functional surface of the optical element O. When the upper mold 11 and the lower mold 12 are conveyed into the molding apparatus 1 as shown in FIG. 1, the optical creation surfaces 111 and 121 face each other with the molding material M in between.
　上型１１は、本体部１１２と、本体部１１２とフランジ部１１３と、を備えている。本体部１１２は、上型１１のうち、スリーブ１３に収容（挿入）される部分であり、円柱状に形成されている。前記した光学創生面１１１は、この本体部１１２の下型１２側の端部に形成されている。 The upper mold 11 includes a main body part 112, a main body part 112, and a flange part 113. The main body 112 is a portion of the upper mold 11 that is accommodated (inserted) in the sleeve 13 and is formed in a columnar shape. The optical creation surface 111 described above is formed at the end of the main body 112 on the lower mold 12 side.
　フランジ部１１３は、上型１１のうち、スリーブ１３に収容されない部分であり、逆台形状に形成されている。フランジ部１１３は、本体部１１２と一体的に形成されており、上型１１において、光学創生面１１１の反対側に設けられている。また、フランジ部１１３は、スリーブ１３の内周面１３ａよりも外側に突出している。また、台形状のフランジ部１１３の上底は、上型１１の上面１１ａを構成している。 The flange portion 113 is a portion of the upper mold 11 that is not accommodated in the sleeve 13 and is formed in an inverted trapezoidal shape. The flange portion 113 is formed integrally with the main body portion 112, and is provided on the upper mold 11 on the opposite side of the optical creation surface 111. Further, the flange portion 113 protrudes outward from the inner peripheral surface 13 a of the sleeve 13. Further, the upper base of the trapezoidal flange portion 113 constitutes the upper surface 11 a of the upper mold 11.
　フランジ部１１３の側面には、テーパ状の面からなるテーパ部１１３ａが設けられている。このテーパ部１１３ａは、図２のような型組み付け時の状態、すなわち型セット１０が加熱されていない状態では、プレス量規制部材１４のテーパ部１４ｂと接触しており、当該テーパ部１４ｂによって係止されている。また、テーパ部１１３ａは、押圧方向において下型１２から上型１１に向かう方向、かつ、上型１１の中心から径方向外側に向かう方向に傾斜している。 The taper part 113a which consists of a taper-shaped surface is provided in the side surface of the flange part 113. As shown in FIG. The taper portion 113a is in contact with the taper portion 14b of the press amount regulating member 14 when the die is assembled as shown in FIG. 2, that is, when the die set 10 is not heated, and is engaged by the taper portion 14b. It has been stopped. Further, the taper portion 113a is inclined in the pressing direction from the lower mold 12 to the upper mold 11 and from the center of the upper mold 11 to the radially outer side.
　スリーブ１３は、上型１１および下型１２を支持し、かつ両者の位置決めを行うためのものである。スリーブ１３は、円筒状に形成されており、上型１１および下型１２の周囲に設けられている。また、スリーブ１３は、下型１２に嵌合されている。 The sleeve 13 is for supporting the upper die 11 and the lower die 12 and positioning them. The sleeve 13 is formed in a cylindrical shape, and is provided around the upper mold 11 and the lower mold 12. The sleeve 13 is fitted to the lower mold 12.
　プレス量規制部材１４は、加圧シリンダ３８による上型１１のプレス量を規制するためのものである。プレス量規制部材１４は、筒状に形成されており、上型１１、下型１２およびスリーブ１３の周囲に設けられている。プレス量規制部材１４の内周面１４ａと、スリーブ１３の外周面１３ｂとの間には、所定のクリアランスが形成されている。プレス量規制部材１４は、図１に示すように、プレスステージ３２において型セット１０内の成形素材Ｍを押圧した際に、その上面１４ｃが上プレート３４の下面に当て付くことにより、プレス量を規制する。 The press amount regulating member 14 is for regulating the press amount of the upper die 11 by the pressure cylinder 38. The press amount regulating member 14 is formed in a cylindrical shape, and is provided around the upper die 11, the lower die 12, and the sleeve 13. A predetermined clearance is formed between the inner peripheral surface 14 a of the press amount regulating member 14 and the outer peripheral surface 13 b of the sleeve 13. As shown in FIG. 1, when the pressing material 32 is pressed against the molding material M in the mold set 10 on the press stage 32, the pressing amount regulating member 14 is pressed against the lower surface of the upper plate 34, thereby reducing the pressing amount. regulate.
　プレス量規制部材１４は、図２に示すように、内周面１４ａの側にテーパ状の面からなるテーパ部（保持部）１４ｂが設けられている。このテーパ部１４ｂは、プレス量規制部材１４の上面１４ｃから内周面１４ａにかけて形成されており、図２のような型組み付け時の状態、すなわち型セット１０が加熱されていない状態において、上型１１のフランジ部１１３のテーパ部１１３ａと接触している。このように、フランジ部１１３のテーパ部１１３ａと、プレス量規制部材１４のテーパ部１４ｂとの接触部は、それぞれテーパ状に形成されている。また、テーパ部１４ｂは、押圧方向において上型１１から下型１２に向かう方向、かつ、プレス量規制部材１４の径方向外側から中心に向かう方向に傾斜している。なお、テーパ部１１３ａ，１４ｂの角度および長さ等の詳細については後記する。 As shown in FIG. 2, the press amount regulating member 14 is provided with a tapered portion (holding portion) 14b formed of a tapered surface on the inner peripheral surface 14a side. The taper portion 14b is formed from the upper surface 14c to the inner peripheral surface 14a of the press amount regulating member 14, and in the state when the die is assembled as shown in FIG. 2, that is, the die set 10 is not heated. 11 is in contact with the tapered portion 113a of the flange portion 113. Thus, the contact part of the taper part 113a of the flange part 113 and the taper part 14b of the press amount control member 14 is each formed in the taper shape. Further, the taper portion 14 b is inclined in the direction from the upper die 11 to the lower die 12 in the pressing direction and in the direction from the radially outer side of the press amount regulating member 14 toward the center. Details of the angles and lengths of the tapered portions 113a and 14b will be described later.
　このような構成を備えるプレス量規制部材１４は、図１に示すように、型セット１０が加熱ステージ３１にまだ搬送されておらず、当該型セット１０が加熱されていない状態（例えば型セット１０が置換室２０内にある状態）では、テーパ部１４ｂを、上型１１のフランジ部１１３のテーパ部１１３ａに接触させて当該フランジ部１１３を係止し、上型１１および下型１２のそれぞれの光学創生面１１１，１２１が離間した状態を保持している。 In the press amount regulating member 14 having such a configuration, as shown in FIG. 1, the mold set 10 is not yet conveyed to the heating stage 31, and the mold set 10 is not heated (for example, the mold set 10). In the replacement chamber 20), the taper portion 14 b is brought into contact with the taper portion 113 a of the flange portion 113 of the upper die 11 to lock the flange portion 113, and the upper die 11 and the lower die 12. The optical creation surfaces 111 and 121 are kept apart.
　一方、プレス量規制部材１４は、図１に示すように、型セット１０が加熱ステージ３１に搬送され、当該型セット１０が加熱されている状態では、テーパ部１４ｂを、上型１１のフランジ部１１３のテーパ部１１３ａから離間させてフランジ部１１３の係止を解除し、上型１１および下型１２の相対的な近接動を可能とする。 On the other hand, as shown in FIG. 1, the press amount regulating member 14 is configured so that the taper portion 14 b is connected to the flange portion of the upper die 11 when the die set 10 is conveyed to the heating stage 31 and the die set 10 is heated. The flange 113 is released from being separated from the taper portion 113a of the 113, and the upper die 11 and the lower die 12 can be moved relatively close to each other.
　ここで、プレス量規制部材１４は、上型１１、下型１２およびスリーブ１３よりも線膨張係数が大きい材料で構成されている。例えば上型１１、下型１２およびスリーブ１３が超硬合金で構成されている場合、プレス量規制部材１４は、これよりも線膨張係数が大きいＳＵＳ３１６等で構成する。このように、プレス量規制部材１４を上型１１、下型１２およびスリーブ１３よりも線膨張係数が大きい材料で構成することにより、型セット１０が加熱ステージ３１で加熱されている状態では、プレス量規制部材１４の内外径が熱膨張により拡径し、テーパ部１４ｂが上型１１のフランジ部１１３のテーパ部１１３ａから離間する。 Here, the press amount regulating member 14 is made of a material having a larger linear expansion coefficient than the upper die 11, the lower die 12 and the sleeve 13. For example, when the upper die 11, the lower die 12, and the sleeve 13 are made of cemented carbide, the press amount regulating member 14 is made of SUS316 or the like having a larger linear expansion coefficient. As described above, the press amount regulating member 14 is made of a material having a larger linear expansion coefficient than the upper die 11, the lower die 12, and the sleeve 13, so that when the die set 10 is heated by the heating stage 31, The inner and outer diameters of the amount regulating member 14 are expanded by thermal expansion, and the tapered portion 14 b is separated from the tapered portion 113 a of the flange portion 113 of the upper mold 11.
［型セットの作用（実施の形態１）］
　以下、本実施の形態に係る型セット１０の作用について、図１および図２を参照しながら説明する。なお、以下では、型セット１０を備える成形装置１を用いた光学素子Ｏの製造方法の説明の中で、型セット１０の作用について説明する。光学素子Ｏの製造方法では、型組み付け工程と、置換工程と、加熱工程と、押圧工程と、冷却工程と、取り出し工程をこの順番で行う。 [Operation of mold set (Embodiment 1)]
Hereinafter, the operation of the mold set 10 according to the present embodiment will be described with reference to FIGS. 1 and 2. Hereinafter, the operation of the mold set 10 will be described in the description of the method for manufacturing the optical element O using the molding apparatus 1 including the mold set 10. In the manufacturing method of the optical element O, the mold assembling process, the replacing process, the heating process, the pressing process, the cooling process, and the removing process are performed in this order.
（型組み付け工程）
　型組み付け工程では、図２に示すように、下型１２にスリーブ１３を嵌合した後、下型１２の光学創生面１２１上に成形素材Ｍを配置する。なお、成形素材Ｍとしては、例えばガラス素材である「Ｓ－ＢＡＬ４２」を用いることができる。また、成形素材Ｍは、任意の形状のものを用いることができる。続いて、スリーブ１３の外周側にプレス量規制部材１４を挿入し、スリーブ１３に上型１１の本体部１１２を挿入する。 (Mold assembly process)
In the mold assembling step, as shown in FIG. 2, after the sleeve 13 is fitted to the lower mold 12, the molding material M is disposed on the optical creation surface 121 of the lower mold 12. As the molding material M, for example, “S-BAL42” which is a glass material can be used. Further, the molding material M can be of any shape. Subsequently, the press amount regulating member 14 is inserted into the outer peripheral side of the sleeve 13, and the main body 112 of the upper mold 11 is inserted into the sleeve 13.
　ここで、スリーブ１３内に上型１１の本体部１１２を挿入していくと、フランジ部１１３のテーパ部１１３ａとプレス量規制部材１４のテーパ部１４ｂとが接触する。その際、テーパ部１１３ａおよびテーパ部１４ｂは、それぞれテーパ状に形成されているため、両者が接触することにより、上型１１の光学創生面１１１の中心軸とプレス量規制部材１４の内径の中心軸とが同軸上に寄り、２つの中心軸が同軸上で一致する。また、上型１１および下型１２も、スリーブ１３によって中心軸が一致するように位置決めされているため、型セット１０を構成する全ての部材の中心軸が一致した状態となる。 Here, when the main body portion 112 of the upper mold 11 is inserted into the sleeve 13, the taper portion 113a of the flange portion 113 and the taper portion 14b of the press amount regulating member 14 come into contact with each other. At that time, since the taper portion 113a and the taper portion 14b are respectively formed in a taper shape, the contact between the taper portion 113a and the taper portion 14b causes the center axis of the optical creation surface 111 of the upper mold 11 and the inner diameter of the press amount regulating member 14 to be The central axis is coaxial and the two central axes coincide on the same axis. Further, since the upper mold 11 and the lower mold 12 are also positioned by the sleeve 13 so that the central axes thereof coincide with each other, the central axes of all the members constituting the mold set 10 coincide with each other.
　型組み付け工程の完了時は、図２に示すように、上型１１および下型１２のそれぞれの光学創生面１１１，１２１が所定の距離をおいて離間しており、かつ上型１１の光学創生面１１１と成形素材Ｍとが所定の距離をおいて離間した状態が保持されている。そして、型セット１０の組み付けおよび成形素材Ｍの配置が完了すると、図示しない搬送アームによって、型セット１０を成形装置１の置換室２０に搬送する。 When the mold assembling process is completed, as shown in FIG. 2, the optical creation surfaces 111 and 121 of the upper mold 11 and the lower mold 12 are separated from each other by a predetermined distance, and the optical of the upper mold 11 The state where the creation surface 111 and the molding material M are separated from each other by a predetermined distance is maintained. When the assembly of the mold set 10 and the placement of the molding material M are completed, the mold set 10 is transported to the replacement chamber 20 of the molding apparatus 1 by a transport arm (not shown).
（置換工程）
　置換工程では、図１に示すように、置換室２０において、型セット１０の内部の雰囲気を窒素雰囲気に置換する。そして、図示しない搬送アームによって、型セット１０を成形室３０の加熱ステージ３１に搬送する。 (Replacement process)
In the replacement step, as shown in FIG. 1, the atmosphere inside the mold set 10 is replaced with a nitrogen atmosphere in the replacement chamber 20. Then, the mold set 10 is transported to the heating stage 31 of the molding chamber 30 by a transport arm (not shown).
（加熱工程）
　加熱工程では、図１に示すように、加熱ステージ３１において、例えば６００℃に加熱された上プレート３４および下プレート３５によって型セット１０を挟み、成形素材Ｍを加熱する。ここで、加熱ステージ３１に搬送された直後の上型１１は、プレス量規制部材１４のテーパ部１４ｂによって支持されているため、成形素材Ｍとは非接触の状態である。 (Heating process)
In the heating step, as shown in FIG. 1, in the heating stage 31, the mold set 10 is sandwiched between the upper plate 34 and the lower plate 35 heated to, for example, 600 ° C., and the molding material M is heated. Here, since the upper die 11 immediately after being conveyed to the heating stage 31 is supported by the taper portion 14b of the press amount regulating member 14, it is in a non-contact state with the molding material M.
　一方、型セット１０の温度が、例えば４３９℃付近に達すると、図１に示すように、熱膨張によってプレス量規制部材１４の内外径が拡径する。そして、上型１１のフランジ部１１３のテーパ部１１３ａとプレス量規制部材１４のテーパ部１４ｂとの接触が解除され、上型１１が未保持状態となる。すなわち、プレス量規制部材１４のテーパ部１４ｂによって上型１１の移動が規制されていた状態が解除され、当該上型１１によって成形素材Ｍを押圧可能な状態となる。 On the other hand, when the temperature of the mold set 10 reaches, for example, around 439 ° C., as shown in FIG. 1, the inner and outer diameters of the press amount regulating member 14 are expanded by thermal expansion. Then, the contact between the taper portion 113a of the flange portion 113 of the upper mold 11 and the taper portion 14b of the press amount regulating member 14 is released, and the upper mold 11 is not held. That is, the state in which the movement of the upper mold 11 is regulated by the taper portion 14 b of the press amount regulating member 14 is released, and the molding material M can be pressed by the upper mold 11.
　なお、上型１１が未保持状態となる温度（以下、「保持解除温度」という）は、後記する上型１１の再保持温度を考慮して設定することができ、例えば成形素材Ｍの歪点－１００℃より高く設定、あるいは成形素材Ｍの転移点（Ｔｇ）付近に設定することができる。本実施の形態では、一例として、上型１１の保持解除温度を、成形素材Ｍの歪点－１００℃より高い、４３９℃に設定している。なお、前記した保持解除温度は、より具体的には、上型１１が未保持状態となり、かつ上型１１が成形素材Ｍに最初に接触した際の温度のことを示している。 Note that the temperature at which the upper mold 11 is not held (hereinafter referred to as “holding release temperature”) can be set in consideration of the re-holding temperature of the upper mold 11 described later. It can be set higher than −100 ° C. or near the transition point (Tg) of the molding material M. In the present embodiment, as an example, the holding release temperature of the upper mold 11 is set to 439 ° C., which is higher than the strain point of the molding material M −100 ° C. More specifically, the above-described holding release temperature indicates a temperature when the upper mold 11 is in an unheld state and the upper mold 11 first contacts the molding material M.
　未保持状態となった上型１１は、図１に示すように下型１２に向かって移動し、成形素材Ｍに接触する。その際、上型１１は、プレス量規制部材１４のテーパ部１４ｂに沿って徐々に降下し、成形素材Ｍに対してゆっくりと接触する。そのため、上型１１の接触による成形素材Ｍのキズは、非常に軽微なものとなるか、あるいはキズ自体の発生が抑制される。 The upper mold 11 that has not been held moves toward the lower mold 12 as shown in FIG. At that time, the upper die 11 gradually descends along the taper portion 14 b of the press amount regulating member 14 and slowly contacts the molding material M. Therefore, the scratch of the molding material M due to the contact with the upper mold 11 is very slight, or the generation of the scratch itself is suppressed.
　加熱工程では、前記したように上型１１が成形素材Ｍに接触した後、型セット１０が６００℃になるまで加熱を継続しつつ、成形素材Ｍを押圧する仮プレスを実施する。そして、型セット１０の加熱が完了すると、図示しない搬送アームによって、型セット１０をプレスステージ３２に搬送する。 In the heating step, after the upper mold 11 comes into contact with the molding material M as described above, a temporary press is performed to press the molding material M while continuing heating until the mold set 10 reaches 600 ° C. When the heating of the mold set 10 is completed, the mold set 10 is transported to the press stage 32 by a transport arm (not shown).
（押圧工程）
　押圧工程では、図１に示すように、プレスステージ３２において、例えば６２０℃に加熱された上プレート３４および下プレート３５によって型セット１０を挟み、成形素材Ｍを押圧する本プレスを実施する。本工程では、上プレート３４の下面がプレス量規制部材１４の上面１４ｃに当て付くまで押圧を行う。そして、成形素材Ｍの押圧が完了すると、図示しない搬送アームによって、型セット１０を冷却ステージ３３に搬送する。 (Pressing process)
In the pressing step, as shown in FIG. 1, in the press stage 32, for example, a main press is performed in which the mold set 10 is sandwiched between the upper plate 34 and the lower plate 35 heated to 620 ° C. and the molding material M is pressed. In this step, pressing is performed until the lower surface of the upper plate 34 comes into contact with the upper surface 14c of the pressing amount regulating member 14. When the pressing of the molding material M is completed, the mold set 10 is transported to the cooling stage 33 by a transport arm (not shown).
（冷却工程）
　冷却工程では、図１に示すように、冷却ステージ３３において、成形素材Ｍを冷却する。本工程では、成形素材Ｍを冷却しつつ、上プレート３４に設けられた押圧部材３９によって成形素材Ｍを押圧する冷却プレスを実施する。なお、冷却プレスは、成形後の光学素子Ｏの精度を向上させるために実施されるものである。 (Cooling process)
In the cooling process, as shown in FIG. 1, the molding material M is cooled in the cooling stage 33. In this step, a cooling press for pressing the molding material M by the pressing member 39 provided on the upper plate 34 is performed while cooling the molding material M. The cooling press is performed in order to improve the accuracy of the optical element O after molding.
　冷却工程では、型セット１０が例えば４５０℃まで冷却されると、熱収縮によってプレス量規制部材１４の内外径が縮径する。そして、上型１１のフランジ部１１３のテーパ部１１３ａとプレス量規制部材１４のテーパ部１４ｂとが再び接触する。また、更に冷却を継続すると、フランジ部１１３のテーパ部１１３ａがプレス量規制部材１４のテーパ部１４ｂに沿って移動することにより、上型１１が下型１２から離れる方向に移動し、上型１１と成形素材Ｍとの接触が解除される。なお、このように、上型１１が再び保持状態となり、かつ上型１１と成形素材Ｍとの接触が解除された際の温度のことを、「再保持温度」と定義する。 In the cooling process, when the die set 10 is cooled to, for example, 450 ° C., the inner and outer diameters of the press amount regulating member 14 are reduced by heat shrinkage. And the taper part 113a of the flange part 113 of the upper mold | type 11 and the taper part 14b of the press amount regulation member 14 contact again. When the cooling is further continued, the taper portion 113a of the flange portion 113 moves along the taper portion 14b of the press amount regulating member 14, whereby the upper die 11 moves away from the lower die 12, and the upper die 11 is moved. And the contact with the molding material M are released. In addition, the temperature when the upper die 11 is again held and the contact between the upper die 11 and the molding material M is released is defined as “re-holding temperature”.
　冷却工程では、取り出し可能な温度（例えば１００℃）まで成形素材Ｍを冷却した後、図示しない搬送アームによって、型セット１０を成形室３０から排出する。 In the cooling step, after the molding material M is cooled to a temperature at which it can be taken out (for example, 100 ° C.), the mold set 10 is discharged from the molding chamber 30 by a transfer arm (not shown).
（取り出し工程）
　取り出し工程では、排出後の型セット１０から上型１１を取り外し、光学素子Ｏを取り出す。そして、光学素子Ｏを引き続き製造する場合は、上型１１を取り外した状態で新たな成形素材Ｍを下型１２に配置して型組み付け工程を実施した後、前記した置換工程～取り出し工程を繰り返す。 (Removal process)
In the take-out step, the upper die 11 is removed from the die set 10 after discharge, and the optical element O is taken out. When the optical element O is continuously manufactured, after the upper mold 11 is removed and a new molding material M is placed on the lower mold 12 and the mold assembling process is performed, the above-described replacement process to the extracting process are repeated. .
［テーパ部の設定方法（実施の形態１）］
　以下、本実施の形態に型セット１０におけるテーパ部１１３ａ，１４ｂの設定方法について説明する。図２に示した上型１１のフランジ部１１３のテーパ部１１３ａのテーパ角ｄ１およびテーパ長ｃ、プレス量規制部材１４のテーパ部１４ｂのテーパ角ｇ１およびテーパ長ｆは、以下の式（１）～式（５）に基づいて設定する。 [Taper Setting Method (Embodiment 1)]
Hereinafter, a method for setting the tapered portions 113a and 14b in the mold set 10 according to the present embodiment will be described. The taper angle d1 and taper length c of the taper portion 113a of the flange portion 113 of the upper mold 11 shown in FIG. Set based on Equation (5).
　ｄ１＝［｛１＋α１（ｔ２－ｚ）｝／｛１＋α２（ｔ２－ｚ）｝］＊［ｅ／｛２（ｂ２－ｂ１）｝］－［ｅ／｛２（ｂ２－ｂ１）｝］　・・・（１）
　ｃ＞ｂ１－ｂ２　・・・（２）
　ｃ＞ｋ　・・・（３）
　ｇ１＞ｄ１　・・・（４）
　ｆ－ｉ＞０　・・・（５） d1 = [{1 + α1 (t2-z)} / {1 + α2 (t2-z)}] * [e / {2 (b2-b1)}] − [e / {2 (b2-b1)}] (1)
c> b1-b2 (2)
c> k (3)
g1> d1 (4)
fi> 0 (5)
　ここで、上記の式（１）～式（５）における各パラメータの意味は以下の通りである。
　ｚ：室内環境温度
　ｔ２：上型１１の再保持温度
　ｂ１：成形前における上型１１および下型１２間の距離（図２参照）
　ｂ２：成形後における上型１１および下型１２間の距離（図２参照）
　ｅ：常温時における上型１１の外径（図２参照）
　α１：上型１１、下型１２およびスリーブ１３の線膨張係数
　α２：プレス量規制部材１４の線膨張係数
　ｉ：冷却プレスのプレス量
　ｋ：成形素材Ｍの厚さ Here, the meaning of each parameter in the above formulas (1) to (5) is as follows.
z: Indoor environment temperature t2: Re-holding temperature of upper mold 11 b1: Distance between upper mold 11 and lower mold 12 before molding (see FIG. 2)
b2: Distance between upper mold 11 and lower mold 12 after molding (see FIG. 2)
e: outer diameter of the upper die 11 at normal temperature (see FIG. 2)
α1: Linear expansion coefficient of upper mold 11, lower mold 12 and sleeve 13 α2: Linear expansion coefficient of press amount regulating member 14 i: Press amount of cooling press k: Thickness of molding material M
　上記のパラメータのうち、上型１１の再保持温度ｔ２、成形前後の上型１１および下型１２間の距離ｂ１，ｂ２以外は、予め判明または設定されている値である。従って、上型１１の再保持温度ｔ２と、成形前後の上型１１および下型１２間の距離ｂ１，ｂ２とを決定した上で、上記式（１）～式（５）に基づいて、テーパ部１１３ａのテーパ角ｄ１およびテーパ長ｃと、テーパ部１４ｂのテーパ角ｇ１およびテーパ長ｆとを設定する。 Of the above parameters, values other than the re-holding temperature t2 of the upper mold 11 and the distances b1 and b2 between the upper mold 11 and the lower mold 12 before and after molding are values that have been previously determined or set. Accordingly, after determining the re-holding temperature t2 of the upper die 11 and the distances b1 and b2 between the upper die 11 and the lower die 12 before and after molding, the taper is based on the above equations (1) to (5). The taper angle d1 and taper length c of the portion 113a and the taper angle g1 and taper length f of the taper portion 14b are set.
　以上説明したような型セット１０によれば、型組み付け時等の、型セット１０が加熱されていない状態では、上型１１および下型１２のそれぞれの光学創生面１１１，１２１が離間した状態が保持されているため、加熱処理前における成形素材Ｍへのキズの発生を抑制することができる。また、型セット１０によれば、成形素材Ｍの形状に左右されることなく、任意の形状の成形素材Ｍへのキズの発生を抑制することができ、かつ簡易な工程で光学素子Ｏを製造することができる。さらに、型セット１０によれば、プレス量規制部材１４を利用して上型１１を保持するため、大幅な改良等を必要とせず、簡易な構成によって、成形素材Ｍへのキズの発生を抑制することができる。 According to the mold set 10 as described above, when the mold set 10 is not heated, such as when the mold is assembled, the optical creation surfaces 111 and 121 of the upper mold 11 and the lower mold 12 are separated from each other. Therefore, generation | occurrence | production of the damage | wound to the molding raw material M before heat processing can be suppressed. In addition, according to the mold set 10, it is possible to suppress the generation of scratches on the molding material M having an arbitrary shape without being influenced by the shape of the molding material M, and to manufacture the optical element O by a simple process. can do. Further, according to the mold set 10, the upper mold 11 is held using the press amount regulating member 14, so that no significant improvement or the like is required, and the occurrence of scratches on the molding material M is suppressed with a simple configuration. can do.
［型セットの構成（実施の形態２）］
　本発明の実施の形態２に係る型セット１０Ａの構成について、図１および図３を参照しながら説明する。型セット１０Ａは、図３に示すように、上型１１Ａおよびプレス量規制部材１４Ａ以外は、実施の形態１に係る型セット１０と同様の構成を備えている。 [Configuration of Mold Set (Embodiment 2)]
A configuration of a mold set 10A according to Embodiment 2 of the present invention will be described with reference to FIGS. As shown in FIG. 3, the mold set 10 </ b> A has the same configuration as the mold set 10 according to Embodiment 1 except for the upper mold 11 </ b> A and the press amount regulating member 14 </ b> A.
　上型１１Ａは、本体部１１２Ａと、フランジ部１１３Ａと、を備えている。本体部１１２Ａは、円柱状に形成されており、側周面１１２ａの一部にフランジ部１１３Ａが設けられている。本体部１１２Ａのうち、フランジ部１１３Ａの下側はスリーブ１３に収容される部分であり、フランジ部１１３Ａの上側はスリーブ１３に収容されない部分である。また、本体部１１２Ａの上面は、上型１１Ａの上面１１ａを構成している。 The upper mold 11A includes a main body portion 112A and a flange portion 113A. The main body portion 112A is formed in a columnar shape, and a flange portion 113A is provided on a part of the side peripheral surface 112a. Of the main body portion 112 </ b> A, the lower side of the flange portion 113 </ b> A is a portion accommodated in the sleeve 13, and the upper side of the flange portion 113 </ b> A is a portion not accommodated in the sleeve 13. The upper surface of the main body 112A constitutes the upper surface 11a of the upper mold 11A.
　フランジ部１１３Ａは、本体部１１２Ａの側周面１１２ａに沿って突起状に形成されており、本体部１１２Ａの側周面１１２ａから突出している。また、フランジ部１１３Ａは、スリーブ１３の内周面１３ａよりも外側に突出している。 The flange portion 113A is formed in a protruding shape along the side peripheral surface 112a of the main body portion 112A, and protrudes from the side peripheral surface 112a of the main body portion 112A. The flange portion 113 </ b> A protrudes outward from the inner peripheral surface 13 a of the sleeve 13.
　フランジ部１１３Ａの側面には、テーパ状の面からなるテーパ部１１３Ａａが設けられている。このテーパ部１１３Ａａは、図３のような型組み付け時の状態、すなわち型セット１０Ａが加熱されていない状態では、プレス量規制部材１４Ａのフランジ部１４１のテーパ部１４１ａと接触しており、当該テーパ部１４１ａによって係止されている。 A tapered portion 113Aa made of a tapered surface is provided on the side surface of the flange portion 113A. The taper portion 113Aa is in contact with the taper portion 141a of the flange portion 141 of the press amount regulating member 14A when the die is assembled as shown in FIG. 3, that is, when the die set 10A is not heated. It is locked by the portion 141a.
　プレス量規制部材１４Ａは、内周面１４ａにフランジ部（保持部）１４１が設けられている。このフランジ部１４１は、プレス量規制部材１４Ａの内周面１４ａよりも内側に突出している。 The press amount regulating member 14A is provided with a flange portion (holding portion) 141 on the inner peripheral surface 14a. The flange portion 141 protrudes inward from the inner peripheral surface 14a of the press amount regulating member 14A.
　フランジ部１４１の側面には、テーパ状の面からなるテーパ部１４１ａが設けられている。このテーパ部１４１ａは、図３のような型組み付け時の状態、すなわち型セット１０Ａが加熱されていない状態において、上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａと接触している。このように、フランジ部１１３Ａのテーパ部１１３Ａａと、フランジ部１４１のテーパ部１４１ａとの接触部は、それぞれテーパ状に形成されている。なお、テーパ部１１３Ａａ，１４１ａの角度等の詳細については後記する。 The taper part 141a which consists of a taper-shaped surface is provided in the side surface of the flange part 141. As shown in FIG. The taper portion 141a is in contact with the taper portion 113Aa of the flange portion 113A of the upper die 11A in the state when the die is assembled as shown in FIG. 3, that is, in the state where the die set 10A is not heated. Thus, the contact portions between the taper portion 113Aa of the flange portion 113A and the taper portion 141a of the flange portion 141 are each formed in a tapered shape. Details of the angles of the tapered portions 113Aa and 141a will be described later.
　このような構成を備えるプレス量規制部材１４Ａは、型セット１０Ａが加熱ステージ３１にまだ搬送されておらず、当該型セット１０Ａが加熱されていない状態では、テーパ部１４１ａを、上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａに接触させて当該フランジ部１１３Ａを係止し、上型１１Ａおよび下型１２のそれぞれの光学創生面１１１，１２１が離間した状態を保持する。 The press amount regulating member 14A having such a configuration is such that the die set 10A is not yet conveyed to the heating stage 31, and the taper portion 141a is connected to the flange of the upper die 11A when the die set 10A is not heated. The flange portion 113A is brought into contact with the taper portion 113Aa of the portion 113A, and the optical creation surfaces 111 and 121 of the upper mold 11A and the lower mold 12 are held apart.
　一方、プレス量規制部材１４Ａは、型セット１０Ａが加熱ステージ３１に搬送され、当該型セット１０Ａが加熱されている状態では、テーパ部１４１ａを、上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａから離間させてフランジ部１１３Ａの係止を解除し、上型１１Ａおよび下型１２の相対的な近接動を可能とする。 On the other hand, the press amount regulating member 14A has the taper portion 141a separated from the taper portion 113Aa of the flange portion 113A of the upper die 11A when the die set 10A is conveyed to the heating stage 31 and the die set 10A is heated. Thus, the locking of the flange portion 113A is released, and the upper die 11A and the lower die 12 can be moved relatively close to each other.
　ここで、プレス量規制部材１４Ａは、前記したプレス量規制部材１４と同様に、上型１１Ａ、下型１２およびスリーブ１３よりも線膨張係数が大きい材料で構成されている。そして、型セット１０Ａが加熱ステージ３１で加熱されている状態では、プレス量規制部材１４Ａの内外径が熱膨張により拡径し、フランジ部１４１のテーパ部１４１ａが上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａから離間する。 Here, the press amount regulating member 14A is made of a material having a larger linear expansion coefficient than the upper die 11A, the lower die 12 and the sleeve 13, like the press amount regulating member 14 described above. In a state where the mold set 10A is heated by the heating stage 31, the inner and outer diameters of the press amount regulating member 14A are expanded by thermal expansion, and the taper part 141a of the flange part 141 is the taper of the flange part 113A of the upper mold 11A. Separated from the portion 113Aa.
［型セットの作用（実施の形態２）］
　以下、本実施の形態に係る型セット１０Ａの作用について、図１、図３～図５を参照しながら説明する。なお、以下では、型セット１０Ａを備える成形装置１を用いた光学素子Ｏの製造方法の説明の中で型セット１０Ａの作用について説明する。光学素子Ｏの製造方法では、型組み付け工程と、置換工程と、加熱工程と、押圧工程と、冷却工程と、取り出し工程をこの順番で行う。なお、本実施の形態における型組み付け工程、置換工程および押圧工程は実施の形態１と同様であるため、説明を省略する。 [Operation of mold set (Embodiment 2)]
Hereinafter, the operation of the mold set 10A according to the present embodiment will be described with reference to FIGS. 1 and 3 to 5. FIG. Hereinafter, the operation of the mold set 10A will be described in the description of the method for manufacturing the optical element O using the molding apparatus 1 including the mold set 10A. In the manufacturing method of the optical element O, the mold assembling process, the replacing process, the heating process, the pressing process, the cooling process, and the removing process are performed in this order. In addition, since the die assembly process, the replacement process, and the pressing process in the present embodiment are the same as those in the first embodiment, description thereof is omitted.
（加熱工程）
　加熱工程では、加熱ステージ３１において、例えば６００℃に加熱された上プレート３４および下プレート３５によって型セット１０Ａを挟み、成形素材Ｍを加熱する。ここで、加熱ステージ３１に搬送された直後の上型１１Ａは、プレス量規制部材１４Ａのフランジ部１４１のテーパ部１４１ａによって支持されているため、成形素材Ｍとは非接触の状態である。 (Heating process)
In the heating process, in the heating stage 31, the mold set 10A is sandwiched between the upper plate 34 and the lower plate 35 heated to, for example, 600 ° C., and the molding material M is heated. Here, the upper die 11A immediately after being transported to the heating stage 31 is supported by the taper portion 141a of the flange portion 141 of the press amount regulating member 14A, and therefore is not in contact with the molding material M.
　一方、型セット１０Ａの温度が、例えば５４０℃付近に達すると、熱膨張によってプレス量規制部材１４Ａの内外径が拡径する。そして、上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａとフランジ部１４１のテーパ部１４１ａとの接触が解除され、上型１１Ａが未保持状態となる。すなわち、フランジ部１４１のテーパ部１４１ａによって上型１１Ａの移動が規制されていた状態が解除され、当該上型１１Ａによって成形素材Ｍを押圧可能な状態となる。 On the other hand, when the temperature of the mold set 10A reaches, for example, around 540 ° C., the inner and outer diameters of the press amount regulating member 14A are expanded by thermal expansion. Then, the contact between the taper portion 113Aa of the flange portion 113A of the upper die 11A and the taper portion 141a of the flange portion 141 is released, and the upper die 11A is not held. That is, the state in which the movement of the upper mold 11A is restricted by the taper part 141a of the flange part 141 is released, and the molding material M can be pressed by the upper mold 11A.
　なお、上型１１Ａの保持解除温度は、実施の形態１よりも高い温度に設定する。上型１１Ａの保持解除温度は、テーパ部１１３Ａａ，１４１ａの設計に応じて設定することができ、例えば成形素材Ｍの歪点以上に設定することができる。また、上型１１Ａの保持解除温度は、保持が解除された上型１１Ａが落下して成形素材Ｍと接触した際に、当該成形素材Ｍへのキズを抑制するために、成形素材Ｍの粘度が急激に低くなる転移点（Ｔｇ）付近に設定してもよい。本実施の形態では、一例として、上型１１の保持解除温度を、成形素材Ｍ（「Ｓ－ＢＡＬ４２」）の歪点である５４０℃に設定している。 The holding release temperature of the upper mold 11A is set to a temperature higher than that in the first embodiment. The holding release temperature of the upper die 11A can be set according to the design of the tapered portions 113Aa and 141a, and can be set, for example, higher than the strain point of the molding material M. Further, the holding release temperature of the upper mold 11A is set so that the viscosity of the molding material M is suppressed in order to suppress scratches on the molding material M when the upper mold 11A released from holding falls and contacts the molding material M. May be set in the vicinity of the transition point (Tg) at which the value rapidly decreases. In the present embodiment, as an example, the holding release temperature of the upper mold 11 is set to 540 ° C., which is the strain point of the molding material M (“S-BAL42”).
　未保持状態となった上型１１Ａは、図４に示すように、下型１２に向かって落下し、成形素材Ｍに接触する。その際、成形素材Ｍが歪点以上の温度まで加熱されているため、上型１１Ａは、実施の形態１よりも更に粘度が低い状態の成形素材Ｍに接触する。そのため、本実施の形態では、実施の形態１と比較して、上型１１Ａの接触による成形素材Ｍのキズが、より一層軽微なものとなるか、あるいはキズ自体の発生が抑制される。 As shown in FIG. 4, the upper die 11 </ b> A that has not been held falls toward the lower die 12 and comes into contact with the molding material M. At that time, since the molding material M is heated to a temperature equal to or higher than the strain point, the upper mold 11A comes into contact with the molding material M having a lower viscosity than that of the first embodiment. Therefore, in the present embodiment, as compared with the first embodiment, the scratch of the molding material M due to the contact of the upper mold 11A becomes even lighter or the generation of the scratch itself is suppressed.
　加熱工程では、前記したように上型１１Ａが成形素材Ｍに接触した後、型セット１０Ａが６００℃になるまで加熱を継続しつつ、成形素材Ｍを押圧する仮プレスを実施する。そして、型セット１０Ａの加熱が完了すると、図示しない搬送アームによって、型セット１０Ａをプレスステージ３２に搬送する。 In the heating step, as described above, after the upper mold 11A comes into contact with the molding material M, temporary pressing is performed to press the molding material M while continuing heating until the mold set 10A reaches 600 ° C. When the heating of the mold set 10A is completed, the mold set 10A is transported to the press stage 32 by a transport arm (not shown).
（冷却工程）
　冷却工程では、冷却ステージ３３において、成形素材Ｍを冷却する。本工程では、成形素材Ｍを冷却しつつ、上プレート３４に設けられた押圧部材３９によって成形素材Ｍを押圧する冷却プレスを実施する。 (Cooling process)
In the cooling process, the molding material M is cooled in the cooling stage 33. In this step, a cooling press for pressing the molding material M by the pressing member 39 provided on the upper plate 34 is performed while cooling the molding material M.
　冷却工程では、型セット１０Ａが例えば４５０℃まで冷却されると、図５に示すように、熱収縮によってプレス量規制部材１４Ａの内外径が縮径する。なお、本実施の形態は、実施の形態１とは異なり、プレス量規制部材１４Ａが縮径しても、上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａとフランジ部１４１のテーパ部１４１ａとが再び接触することはなく、上型１１Ａが再び保持状態となることもない。 In the cooling process, when the mold set 10A is cooled to 450 ° C., for example, as shown in FIG. 5, the inner and outer diameters of the press amount regulating member 14A are reduced by heat shrinkage. Note that this embodiment differs from the first embodiment in that the taper portion 113Aa of the flange portion 113A of the upper mold 11A and the taper portion 141a of the flange portion 141 are again provided even if the pressing amount regulating member 14A is reduced in diameter. There is no contact, and the upper mold 11A is not held again.
　これにより、本実施の形態に係る冷却工程では、上型１１Ａと成形素材Ｍとの接触が解除されることがないため、取り出し可能な温度（例えば１００℃）まで、冷却プレスの状態を維持し、成形素材Ｍにプレス圧を加えることができる。従って、光学素子Ｏの形状の精度をより向上させることができる。 Thereby, in the cooling process according to the present embodiment, the contact between the upper mold 11A and the molding material M is not released, so the state of the cooling press is maintained up to a temperature at which it can be taken out (for example, 100 ° C.). A pressing pressure can be applied to the molding material M. Therefore, the accuracy of the shape of the optical element O can be further improved.
　冷却工程では、取り出し可能な温度まで成形素材Ｍを冷却した後、図示しない搬送アームによって、型セット１０Ａを成形室３０から排出する。 In the cooling process, after the molding material M is cooled to a temperature at which it can be taken out, the mold set 10A is discharged from the molding chamber 30 by a transfer arm (not shown).
（取り出し工程）
　取り出し工程では、排出後の型セット１０Ａからまずプレス量規制部材１４Ａを取り外し、次に上型１１Ａを取り外し、光学素子Ｏを取り出す。そして、光学素子Ｏを引き続き製造する場合は、プレス量規制部材１４Ａおよび上型１１Ａを外した状態で新たな成形素材Ｍを下型１２に配置して型組み付け工程を実施した後、前記した置換工程～取り出し工程を繰り返す。 (Removal process)
In the take-out process, the press amount regulating member 14A is first removed from the die set 10A after being discharged, then the upper die 11A is removed, and the optical element O is taken out. And when manufacturing the optical element O continuously, after carrying out the die assembly process by placing a new molding material M on the lower die 12 with the press amount regulating member 14A and the upper die 11A removed, the above-described replacement Repeat the process to the removal process.
［テーパ部の設定方法（実施の形態２）］
　以下、本実施の形態に型セット１０Ａにおけるテーパ部１１３Ａａ，１４１ａの設定方法について説明する。図３に示した上型１１Ａのフランジ部１１３Ａのテーパ部１１３Ａａのテーパ角ｄ２、プレス量規制部材１４のフランジ部１４１のテーパ部１４１ａのテーパ角ｇ２は、以下の式（６）および式（７）に基づいて設定する。 [Taper Setting Method (Embodiment 2)]
Hereinafter, the setting method of taper part 113Aa, 141a in type | mold set 10A is demonstrated to this Embodiment. The taper angle d2 of the taper portion 113Aa of the flange portion 113A of the upper mold 11A shown in FIG. ).
　ｄ２＝［｛１＋α１（ｔ３－ｚ）｝／｛１＋α２（ｔ３－ｚ）｝］＊｛ｅ／（２＊ｂ３）｝－｛ｅ／（２＊ｂ３）｝　・・・（６）
　ｇ２＞ｄ２　・・・（７） d2 = [{1 + α1 (t3-z)} / {1 + α2 (t3-z)}] * {e / (2 * b3)} − {e / (2 * b3)} (6)
g2> d2 (7)
　ここで、上記の式（６）および式（７）における各パラメータの意味は以下の通りである。
　ｚ：室内環境温度
　ｔ３：上型１１Ａの保持解除温度
　ｂ３：成形前における上型１１Ａと成形素材Ｍとの距離（図３参照）
　ｅ：常温時における上型１１Ａの外径（図３参照）
　α１：上型１１Ａ、下型１２およびスリーブ１３の線膨張係数
　α２：プレス量規制部材１４Ａの線膨張係数 Here, the meaning of each parameter in the above formulas (6) and (7) is as follows.
z: indoor environment temperature t3: holding release temperature of upper mold 11A b3: distance between upper mold 11A and molding material M before molding (see FIG. 3)
e: Outer diameter of upper die 11A at normal temperature (see FIG. 3)
α1: Linear expansion coefficient of upper mold 11A, lower mold 12 and sleeve 13 α2: Linear expansion coefficient of press amount regulating member 14A
　上記のパラメータのうち、上型１１Ａの保持解除温度ｔ３、成形前における上型１１Ａと成形素材Ｍとの距離ｂ３以外は、予め判明または設定されている値である。従って、上型１１Ａの保持解除温度ｔ３と、成形前における上型１１Ａと成形素材Ｍとの距離ｂ３とを決定した上で、上記式（６）および式（７）に基づいてテーパ部１１３Ａａのテーパ角ｄ２と、テーパ部１４１ａのテーパ角ｇ２とを設定する。 Of the above parameters, values other than the holding release temperature t3 of the upper mold 11A and the distance b3 between the upper mold 11A and the molding material M before molding are values that have been previously determined or set. Therefore, after determining the holding release temperature t3 of the upper mold 11A and the distance b3 between the upper mold 11A and the molding material M before molding, the taper portion 113Aa of the tapered portion 113Aa is based on the above formulas (6) and (7). The taper angle d2 and the taper angle g2 of the taper part 141a are set.
　以上説明したような型セット１０Ａによれば、実施の形態１と同様に、任意の形状の成形素材Ｍを成形することができ、かつ、簡易な構成によって加熱処理前における成形素材Ｍへのキズの発生を抑制することができる。 According to the mold set 10A as described above, the molding material M having an arbitrary shape can be molded as in the first embodiment, and scratches on the molding material M before the heat treatment can be performed with a simple configuration. Can be suppressed.
　また、型セット１０Ａは、実施の形態１のように、上型１１Ａがプレス量規制部材１４Ａによって再保持されることがないため、再保持温度を考慮して上型１１Ａの保持解除温度を設定する必要がない。そのため、型セット１０Ａでは、上型１１Ａの保持解除温度を、実施の形態１よりも高い温度に設定することができる。従って、型セット１０Ａの加熱時に、上型１１Ａが、実施の形態１よりも更に粘度の低い状態の成形素材Ｍに接触するため、成形素材Ｍへのキズの発生がより一層抑制される。 Further, in the mold set 10A, since the upper mold 11A is not re-held by the press amount regulating member 14A as in the first embodiment, the holding release temperature of the upper mold 11A is set in consideration of the re-holding temperature. There is no need to do. Therefore, in the mold set 10A, the holding release temperature of the upper mold 11A can be set to a temperature higher than that in the first embodiment. Therefore, when the mold set 10A is heated, the upper mold 11A comes into contact with the molding material M having a lower viscosity than that of the first embodiment, so that generation of scratches on the molding material M is further suppressed.
［型セットの構成（実施の形態３）］
　本発明の実施の形態３に係る型セット１０Ｂの構成について、図６Ａ～図７Ｂを参照しながら説明する。型セット１０Ｂは、図６Ａに示すように、上型１１Ｂおよびプレス量規制部材１４Ｂ以外は、実施の形態１に係る型セット１０と同様の構成を備えている。 [Configuration of mold set (Embodiment 3)]
The configuration of the mold set 10B according to Embodiment 3 of the present invention will be described with reference to FIGS. 6A to 7B. As shown in FIG. 6A, the mold set 10B has the same configuration as the mold set 10 according to Embodiment 1 except for the upper mold 11B and the press amount regulating member 14B.
　上型１１Ｂは、本体部１１２Ｂと、フランジ部１１３Ｂと、を備えている。本体部１１２Ｂは、上型１１Ｂのうち、スリーブ１３に収容される部分であり、円柱状に形成されている。フランジ部１１３Ｂは、上型１１Ｂにおいて、本体部１１２Ｂの端部（下型１２と反対側の端部）から成形素材Ｍの押圧方向に連続して設けられている。また、フランジ部１１３Ｂは、スリーブ１３の内周面１３ａよりも外側に突出している。また、フランジ部１１３Ｂの上面は、上型１１Ｂの上面１１ａを構成している。 The upper mold 11B includes a main body portion 112B and a flange portion 113B. The main body portion 112B is a portion of the upper mold 11B that is accommodated in the sleeve 13, and is formed in a columnar shape. The flange 113B is provided continuously in the pressing direction of the molding material M from the end of the main body 112B (the end opposite to the lower mold 12) in the upper mold 11B. Further, the flange portion 113 </ b> B protrudes outward from the inner peripheral surface 13 a of the sleeve 13. The upper surface of the flange portion 113B constitutes the upper surface 11a of the upper mold 11B.
　フランジ部１１３Ｂの側面には、一対の保持ピン１１４が設けられている。この保持ピン１１４は、上型１１Ｂの径方向外側に向かって延伸しており、プレス量規制部材１４Ｂの外側に突出している。また、保持ピン１１４は、後記するように、成形素材Ｍの押圧前において、プレス量規制部材１４Ｂの上面１４ｃに当接しており、当該上面１４ｃによって係止されている。 A pair of holding pins 114 are provided on the side surface of the flange portion 113B. The holding pin 114 extends outward in the radial direction of the upper die 11B and protrudes outside the press amount regulating member 14B. Further, as will be described later, the holding pin 114 is in contact with and locked by the upper surface 14c of the press amount regulating member 14B before the molding material M is pressed.
　プレス量規制部材１４Ｂは、上面１４ｃから押圧方向に沿って、所定深さの一対の溝部１４２が設けられている。この溝部１４２の幅は、上型１１Ｂの保持ピン１１４の径以上の幅に形成されている。 The press amount regulating member 14B is provided with a pair of groove portions 142 having a predetermined depth along the pressing direction from the upper surface 14c. The width of the groove 142 is formed to be equal to or larger than the diameter of the holding pin 114 of the upper mold 11B.
　このような構成を備えるプレス量規制部材１４Ｂは、型セット１０Ｂがプレスステージ３２にまだ搬送されていない状態では、上面１４ｃに上型１１Ｂの保持ピン１１４を接触させて当該保持ピン１１４を係止し、上型１１Ｂおよび下型１２のそれぞれの光学創生面１１１，１２１が離間した状態を保持する。 In the press amount regulating member 14B having such a configuration, when the die set 10B is not yet conveyed to the press stage 32, the holding pin 114 of the upper die 11B is brought into contact with the upper surface 14c to lock the holding pin 114. In addition, the optical creation surfaces 111 and 121 of the upper mold 11B and the lower mold 12 are maintained in a separated state.
　一方、プレス量規制部材１４Ｂは、型セット１０Ｂがプレスステージ３２に搬送された後は、図７Ａおよび図７Ｂに示すように、溝部１４２に保持ピン１１４を落下させて保持ピン１１４の係止を解除し、上型１１Ｂおよび下型１２の相対的な近接動を可能とする。 On the other hand, after the die set 10B is conveyed to the press stage 32, the press amount regulating member 14B drops the holding pin 114 into the groove 142 and locks the holding pin 114 as shown in FIGS. 7A and 7B. The upper mold 11B and the lower mold 12 can be moved relatively close to each other.
　ここで、プレス量規制部材１４Ｂは、前記したプレス量規制部材１４と同様に、上型１１Ｂ、下型１２およびスリーブ１３よりも線膨張係数が大きい材料で構成してもよく、あるいは上型１１Ｂ、下型１２およびスリーブ１３と同じ材料で構成してもよい。 Here, the press amount regulating member 14B may be made of a material having a linear expansion coefficient larger than that of the upper die 11B, the lower die 12 and the sleeve 13, similarly to the press amount regulating member 14, or the upper die 11B. The lower mold 12 and the sleeve 13 may be made of the same material.
［型セットの作用（実施の形態３）］
　以下、本実施の形態に係る型セット１０Ｂの作用について、図１、図６Ａ～図８を参照しながら説明する。なお、以下では、型セット１０Ｂを備える成形装置１を用いた光学素子Ｏの製造方法を説明しながら、型セット１０Ｂの作用について説明する。光学素子Ｏの製造方法では、型組み付け工程と、置換工程と、加熱工程と、押圧工程と、冷却工程と、取り出し工程をこの順番で行う。なお、本実施の形態における型組み付け工程、置換工程、冷却工程および取り出し工程は実施の形態１と同様であるため、説明を省略する。 [Operation of mold set (Embodiment 3)]
Hereinafter, the operation of the mold set 10B according to the present embodiment will be described with reference to FIGS. 1 and 6A to 8. FIG. In the following, the operation of the mold set 10B will be described while describing a method for manufacturing the optical element O using the molding apparatus 1 including the mold set 10B. In the manufacturing method of the optical element O, the mold assembling process, the replacing process, the heating process, the pressing process, the cooling process, and the removing process are performed in this order. Note that the mold assembling process, the replacing process, the cooling process, and the removing process in the present embodiment are the same as those in the first embodiment, and thus the description thereof is omitted.
（加熱工程）
　加熱工程では、加熱ステージ３１において、例えば６００℃に加熱された上プレート３４および下プレート３５によって型セット１０Ｂを挟み、成形素材Ｍを加熱する。ここで、加熱ステージ３１に搬送された上型１１Ｂは、保持ピン１１４によってプレス量規制部材１４Ｂの上面１４ｃに支持されているため、成形素材Ｍとは非接触の状態である。 (Heating process)
In the heating process, in the heating stage 31, for example, the mold set 10B is sandwiched between the upper plate 34 and the lower plate 35 heated to 600 ° C., and the molding material M is heated. Here, since the upper die 11B conveyed to the heating stage 31 is supported by the upper surface 14c of the press amount regulating member 14B by the holding pins 114, it is in a non-contact state with the molding material M.
　なお、加熱ステージ３１における加熱温度は、例えば成形素材Ｍの歪点以上に設定してもよく、あるいは成形素材Ｍの転移点（Ｔｇ）付近に設定してもよい。本実施の形態では、一例として、加熱ステージ３１における加熱温度を６００℃に設定している。加熱工程では、型セット１０Ｂの加熱が完了すると、図示しない搬送アームによって、型セット１０Ｂをプレスステージ３２に搬送する。 It should be noted that the heating temperature in the heating stage 31 may be set to be higher than the strain point of the molding material M, for example, or may be set near the transition point (Tg) of the molding material M. In the present embodiment, as an example, the heating temperature in the heating stage 31 is set to 600 ° C. In the heating step, when the heating of the mold set 10B is completed, the mold set 10B is transported to the press stage 32 by a transport arm (not shown).
（押圧工程）
　押圧工程では、プレスステージ３２において、例えば６２０℃に加熱された上プレート３４および下プレート３５によって型セット１０Ｂを挟み、成形素材Ｍを押圧する本プレスを実施する。本工程では、本プレスの前に、まず図６Ａおよび図７Ａに示すように、上型１１Ｂの保持ピン１１４に対して突き出しピン４０を突き出し、上型１１Ｂの保持ピン１１４を押す出すことにより、上型１１Ｂを回転させる。これにより、図７Ｂに示すように、保持ピン１１４を、プレス量規制部材１４Ｂの溝部１４２に落下させる。これにより、上型１１Ｂが未保持状態となり、当該上型１１Ｂによって成形素材Ｍを押圧可能な状態となる。 (Pressing process)
In the pressing step, a main press is performed in which the mold set 10B is sandwiched between the upper plate 34 and the lower plate 35 heated to, for example, 620 ° C., and the molding material M is pressed on the press stage 32. In this step, before the press, as shown in FIGS. 6A and 7A, first, the protruding pin 40 is protruded with respect to the holding pin 114 of the upper die 11B, and the holding pin 114 of the upper die 11B is pushed out. The upper mold 11B is rotated. As a result, as shown in FIG. 7B, the holding pin 114 is dropped into the groove 142 of the press amount regulating member 14B. As a result, the upper mold 11B is not held, and the molding material M can be pressed by the upper mold 11B.
　未保持状態となった上型１１Ｂは、図７Ｂに示すように、下型１２に向かって落下し、成形素材Ｍに接触する。その際、成形素材Ｍが６２０℃まで加熱されているため、上型１１Ｂは、実施の形態２よりも更に粘度が低い状態の成形素材Ｍに接触する。そのため、本実施の形態では、実施の形態２と比較して、上型１１Ｂの接触による成形素材Ｍのキズが、より一層軽微なものとなるか、あるいはキズ自体の発生が抑制される。 The upper die 11B in the unheld state falls toward the lower die 12 and contacts the molding material M as shown in FIG. 7B. At that time, since the molding material M is heated to 620 ° C., the upper mold 11B comes into contact with the molding material M having a lower viscosity than that of the second embodiment. Therefore, in the present embodiment, as compared with the second embodiment, the scratch of the molding material M due to the contact of the upper mold 11B becomes even lighter or the generation of the scratch itself is suppressed.
　押圧工程では、図８に示すように、上型１１Ｂが未保持状態となった後に本プレスを実施し、上プレート３４の下面がプレス量規制部材１４Ｂの上面１４ｃに当て付くまで押圧を行う。そして、成形素材Ｍの押圧が完了すると、図示しない搬送アームによって、型セット１０Ｂを冷却ステージ３３に搬送する。 In the pressing step, as shown in FIG. 8, the main press is performed after the upper mold 11 </ b> B is not held, and pressing is performed until the lower surface of the upper plate 34 comes into contact with the upper surface 14 c of the press amount regulating member 14 </ b> B. When the pressing of the molding material M is completed, the mold set 10B is transported to the cooling stage 33 by a transport arm (not shown).
　以上説明したような型セット１０Ｂによれば、実施の形態１，２と同様に、任意の形状の成形素材Ｍを成形することができ、かつ、加熱処理前における成形素材Ｍへのキズの発生を抑制することができる。 According to the mold set 10B as described above, the molding material M having an arbitrary shape can be molded as in the first and second embodiments, and scratches on the molding material M before the heat treatment are generated. Can be suppressed.
　また、型セット１０Ｂは、実施の形態１，２のように、プレス量規制部材１４，１４Ａの熱膨張差によって上型１１，１１Ａの保持を解除するのではなく、上型１１Ｂの保持ピン１１４をプレス量規制部材１４Ｂの溝部１４２に落下させることにより上型１１Ｂの保持を解除するため、加熱工程における加熱条件を自由に設定することができる。従って、上型１１Ｂを、実施の形態１，２よりも更に粘度の低い状態の成形素材Ｍに接触させることが可能となり、成形素材Ｍへのキズの発生がより一層抑制される。 Further, the mold set 10B does not release the holding of the upper molds 11 and 11A due to the difference in thermal expansion of the press amount regulating members 14 and 14A as in the first and second embodiments, but the holding pins 114 of the upper mold 11B. Is released into the groove 142 of the press amount regulating member 14B to release the holding of the upper die 11B, so that the heating conditions in the heating step can be freely set. Therefore, the upper mold 11B can be brought into contact with the molding material M having a lower viscosity than those of the first and second embodiments, and the generation of scratches on the molding material M is further suppressed.
　以上、本発明に係る光学素子製造用型セットについて、発明を実施するための形態により具体的に説明したが、本発明の趣旨はこれらの記載に限定されるものではなく、請求の範囲の記載に基づいて広く解釈されなければならない。また、これらの記載に基づいて種々変更、改変等したものも本発明の趣旨に含まれることはいうまでもない。 The optical element manufacturing mold set according to the present invention has been described in detail with reference to the embodiments for carrying out the invention. However, the gist of the present invention is not limited to these descriptions, and the claims are described. Should be interpreted widely. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.
　例えば、型セット１０，１０Ａでは、上型１１，１１Ａのフランジ部１１３，１１３Ａが本体部１１２，１１２Ａの側周面１１２ａの全周に亘って連続的に形成されていたが、本体部１１２，１１２Ａの側周面１１２ａの一部に間欠的に形成されていてもよい。 For example, in the mold sets 10 and 10A, the flange portions 113 and 113A of the upper molds 11 and 11A are continuously formed over the entire circumference of the side peripheral surface 112a of the main body portions 112 and 112A. It may be intermittently formed on a part of the side peripheral surface 112a of 112A.
　また、型セット１０Ａでは、プレス量規制部材１４Ａのフランジ部１４１が、プレス量規制部材１４Ａの内周面１４ａの全周に亘って連続的に形成されていたが、プレス量規制部材１４Ａの内周面１４ａの一部に間欠的に形成されていてもよい。 In the mold set 10A, the flange portion 141 of the press amount restricting member 14A is continuously formed over the entire circumference of the inner peripheral surface 14a of the press amount restricting member 14A. You may form intermittently in a part of surrounding surface 14a.
　また、型セット１０，１０Ａでは、プレス量規制部材１４，１４Ａを、上型１１，１１Ａ、下型１２およびスリーブ１３よりも線膨張係数が大きい材料で構成していたが、上型１１，１１Ａ、下型１２、スリーブ１３、プレス量規制部材１４，１４Ａを、全て線膨張係数が同じ材料で構成してもよい。この場合、例えば加熱工程において、プレス量規制部材１４，１４Ａのみを集中的に加熱することにより、当該プレス量規制部材１４，１４Ａとその他の部材との間に熱膨張量の差を持たせ、上型１１，１１Ａの保持を解除する。 In the mold sets 10 and 10A, the press amount regulating members 14 and 14A are made of a material having a linear expansion coefficient larger than that of the upper molds 11 and 11A, the lower mold 12 and the sleeve 13, but the upper molds 11 and 11A. The lower mold 12, the sleeve 13, and the press amount regulating members 14, 14A may all be made of a material having the same linear expansion coefficient. In this case, for example, in the heating step, only the press amount restricting members 14 and 14A are intensively heated to give a difference in thermal expansion amount between the press amount restricting members 14 and 14A and the other members, Release the upper mold 11, 11A.
　１　成形装置
　１０，１０Ａ，１０Ｂ　光学素子製造用型セット（型セット）
　１１，１１Ａ，１１Ｂ　上型（第一の金型）
　１１ａ　上面
　１１１　光学創生面
　１１２，１１２Ａ，１１２Ｂ　本体部
　１１２ａ　側周面
　１１３，１１３Ａ，１１３Ｂ　フランジ部
　１１３ａ，１１３Ａａ　テーパ部
　１１４　保持ピン
　１２　下型（第二の金型）
　１２１　光学創生面
　１３　スリーブ
　１３ａ　内周面
　１３ｂ　外周面
　１４，１４Ａ，１４Ｂ　プレス量規制部材
　１４ａ　内周面
　１４ｂ　テーパ部（保持部）
　１４ｃ　上面
　１４１　フランジ部（保持部）
　１４１ａ　テーパ部
　１４２　溝部
　２０　置換室
　２１　チャンバ
　３０　成形室
　３０１　入口シャッター
　３０２　出口シャッター
　３１　加熱ステージ
　３２　プレスステージ
　３３　冷却ステージ
　３４　上プレート
　３５　下プレート
　３６　ヒータ
　３７　シャフト
　３８　加圧シリンダ
　４０　突き出しピン
　Ｍ　成形素材
　Ｏ　光学素子 1 Molding device 10, 10A, 10B Optical element manufacturing mold set (mold set)
11, 11A, 11B Upper mold (first mold)
11a upper surface 111 optical creation surface 112, 112A, 112B main body part 112a side peripheral surface 113, 113A, 113B flange part 113a, 113Aa taper part 114 holding pin 12 lower mold (second mold)
121 Optical creation surface 13 Sleeve 13a Inner peripheral surface 13b Outer peripheral surface 14, 14A, 14B Press amount regulating member 14a Inner peripheral surface 14b Tapered portion (holding portion)
14c upper surface 141 flange part (holding part)
141a Taper part 142 Groove part 20 Replacement chamber 21 Chamber 30 Molding chamber 301 Entrance shutter 302 Exit shutter 31 Heating stage 32 Press stage 33 Cooling stage 34 Upper plate 35 Lower plate 36 Heater 37 Shaft 38 Pressure cylinder 40 Extrusion pin M Molding material O Optical element

Claims (5)

  1. 　互いに対向する光学創生面を有する第一の金型および第二の金型と、
    　前記第一の金型および前記第二の金型の周囲に設けられた筒状のスリーブと、
    　前記スリーブの周囲に設けられた筒状のプレス量規制部材と、
    　を備える光学素子製造用型セットであって、
    　前記第一の金型は、
    　前記スリーブに挿入された本体部と、
    　前記スリーブの内周面よりも外側に突出したフランジ部と、
    　を有し、
    　前記プレス量規制部材は、
    　前記フランジ部と接触可能な保持部を有し、
    　前記光学素子製造用型セットが加熱されていない状態では、前記保持部を前記フランジ部に接触させて前記フランジ部を係止し、前記第一の金型および前記第二の金型のそれぞれの光学創生面が離間した状態を保持し、
    　前記光学素子製造用型セットが加熱されている状態では、前記保持部を前記フランジ部から離間させて前記フランジ部の係止を解除し、前記第一の金型および前記第二の金型の相対的な近接動を可能とすることを特徴とする光学素子製造用型セット。     A first mold and a second mold having optical creation surfaces facing each other;
    A cylindrical sleeve provided around the first mold and the second mold;
    A cylindrical press amount regulating member provided around the sleeve;
    An optical element manufacturing mold set comprising:
    The first mold is
    A main body inserted into the sleeve;
    A flange portion protruding outward from the inner peripheral surface of the sleeve;
    Have
    The press amount regulating member is:
    A holding portion that can contact the flange portion;
    In a state where the optical element manufacturing mold set is not heated, the holding portion is brought into contact with the flange portion to lock the flange portion, and the first mold and the second mold are respectively Keep the optical creation surface separated,
    In a state where the mold set for manufacturing an optical element is heated, the holding portion is separated from the flange portion to release the locking of the flange portion, and the first mold and the second mold are A mold set for manufacturing an optical element, characterized in that relative proximity movement is possible.
  2. 　前記プレス量規制部材は、前記光学素子製造用型セットが加熱されている状態において、熱膨張によって拡径することにより、前記保持部を前記フランジ部から離間させることを特徴とする請求項１に記載の光学素子製造用型セット。 The press amount regulating member is configured to separate the holding portion from the flange portion by expanding the diameter by thermal expansion in a state where the optical element manufacturing die set is heated. A mold set for manufacturing an optical element as described.
  3. 　前記プレス量規制部材は、前記第一の金型、前記第二の金型および前記スリーブよりも線膨張係数が大きい材料で構成されていることを特徴とする請求項２に記載の光学素子製造用型セット。 3. The optical element manufacturing according to claim 2, wherein the press amount regulating member is made of a material having a larger linear expansion coefficient than the first mold, the second mold, and the sleeve. Mold set.
  4. 　前記フランジ部および前記保持部の接触部は、それぞれテーパ状であることを特徴とする請求項１から請求項３のいずれか一項に記載の光学素子製造用型セット。 4. The optical element manufacturing mold set according to claim 1, wherein each of the contact portions of the flange portion and the holding portion is tapered.
  5. 　前記保持部は、前記プレス量規制部材の内周面よりも内側に突出したフランジ部からなることを特徴とする請求項１から請求項３のいずれか一項に記載の光学素子製造用型セット。 4. The optical element manufacturing die set according to claim 1, wherein the holding portion includes a flange portion that protrudes inward from an inner peripheral surface of the press amount regulating member. 5. .
PCT/JP2018/012830 2017-03-31 2018-03-28 Mold set for manufacturing optical element WO2018181507A1 (en)

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Citations (6)

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JPH04164829A (en) * 1990-10-30 1992-06-10 Copal Co Ltd Method for forming glass lens and apparatus therefor
JPH11180722A (en) * 1997-12-24 1999-07-06 Olympus Optical Co Ltd Forming device for optical element
JP2011136901A (en) * 2011-02-04 2011-07-14 Olympus Corp Method for manufacturing optical element
JP2012116697A (en) * 2010-11-30 2012-06-21 Asahi Glass Co Ltd Molding die for optical element and method of molding optical element
JP2013028503A (en) * 2011-07-28 2013-02-07 Olympus Corp Method for manufacturing optical element, die set for molding optical element, and apparatus for manufacturing optical element
JP2015193498A (en) * 2014-03-31 2015-11-05 Hoya株式会社 Press molding device for glass molding

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Publication number Priority date Publication date Assignee Title
JPH04164829A (en) * 1990-10-30 1992-06-10 Copal Co Ltd Method for forming glass lens and apparatus therefor
JPH11180722A (en) * 1997-12-24 1999-07-06 Olympus Optical Co Ltd Forming device for optical element
JP2012116697A (en) * 2010-11-30 2012-06-21 Asahi Glass Co Ltd Molding die for optical element and method of molding optical element
JP2011136901A (en) * 2011-02-04 2011-07-14 Olympus Corp Method for manufacturing optical element
JP2013028503A (en) * 2011-07-28 2013-02-07 Olympus Corp Method for manufacturing optical element, die set for molding optical element, and apparatus for manufacturing optical element
JP2015193498A (en) * 2014-03-31 2015-11-05 Hoya株式会社 Press molding device for glass molding

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