WO2018169201A1 - Imprint device and imprint method - Google Patents

Imprint device and imprint method Download PDF

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Publication number
WO2018169201A1
WO2018169201A1 PCT/KR2018/001076 KR2018001076W WO2018169201A1 WO 2018169201 A1 WO2018169201 A1 WO 2018169201A1 KR 2018001076 W KR2018001076 W KR 2018001076W WO 2018169201 A1 WO2018169201 A1 WO 2018169201A1
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WO
WIPO (PCT)
Prior art keywords
mold
substrate
roll
pattern
separating
Prior art date
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PCT/KR2018/001076
Other languages
French (fr)
Korean (ko)
Inventor
구자붕
이남식
구황섭
김현제
정희석
Original Assignee
주식회사 기가레인
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Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Publication of WO2018169201A1 publication Critical patent/WO2018169201A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Definitions

  • the present invention relates to an imprint apparatus and an imprint method, and more particularly, to an imprint apparatus and an imprint method for printing on a wafer using a film-shaped mold having a pattern formed on the surface.
  • the nanoimprint lithography process is an economical and effective technique for fabricating nano-structures, in which spin-coating or dispensing of resin on a substrate and patterning on the surface of the resin It is a technique of transferring a pattern by pressing a mold.
  • Nanoimprint lithography processes can be broadly classified into thermal-type and ultraviolet irradiation methods.
  • the heated process called hot embossing or thermal imprint lithography, is brought into contact with the mold and the substrate on which the polymer layer is formed. This is how you create the pattern you want on the floor.
  • Such a heating process has a problem that it is difficult to align the multilayer by thermal deformation, and there is a problem in that the pattern is easily broken because high pressure is required to imprint a resin having a high viscosity.
  • the ultraviolet irradiation nanoimprint lithography process developed to improve the problems of such a heating process is a method of using a low viscosity photocurable resin and ultraviolet rays to cure it, and since the process can be performed at room temperature and low pressure, And suitable for mass production.
  • the conventional ultraviolet irradiation nanoimprint lithography process first coating the ultraviolet curing resin on the substrate, and then pressed using a mold, the curing resin is filled between the patterns of the mold. At this time, since the viscosity is low, it is easy to fill the mold pattern between the resin even at low pressure. Thereafter, when the UV light source exposes the resin through the transparent mold, the resin is cured. Subsequently, when the mold is peeled off, a residual layer remains between the patterns, which are removed by oxygen ashing or the like to complete the process.
  • the self-assembled monomolecular film may be coated on the mold surface to improve releasability, but the coating process takes a long time, and there is a problem in that the productivity of the product is lowered.
  • Patent Document 1 Republic of Korea Patent No. 10-0747877 (08 August 2007)
  • Patent Document 2 Republic of Korea Patent No. 10-0763669 (October 04, 2007)
  • Patent Document 3 Republic of Korea Patent No. 10-1413346 (June 27, 2014)
  • the present invention has been made to solve the above-mentioned conventional problems, an imprint apparatus that can improve the printing performance by reducing the printing time of the pattern on the substrate at the same time to reuse the pattern by modifying the surface of the pattern by plasma treatment And an imprint method.
  • the present invention provides an imprint apparatus and an imprint method that can facilitate the transfer and reverse transfer of the film-shaped mold by the forward rotation and the reverse rotation of the transfer unit and at the same time improve the running performance of the mold to improve the supply performance and discharge performance. Another purpose is to provide.
  • another object of the present invention is to provide an imprint apparatus and an imprint method capable of easily grasping a running state of a traveling mold while reducing a loss of a subsequent process due to poor driving.
  • Another object of the present invention is to provide an imprint apparatus and an imprint method capable of improving driving movement performance by aligning the upper and lower positions of a mold to uniformly process plasma in a pattern and maintaining a constant tension of the mold. do.
  • another object of the present invention is to provide an imprint apparatus and an imprint method capable of facilitating tension control of a mold by controlling the rotational speed of the supply roll and the discharge roll by the controller.
  • Another object of the present invention is to provide an imprint apparatus and an imprint method capable of improving plasma processing performance and improving plasma processing defects.
  • another object of the present invention is to provide an imprint apparatus and an imprint method for facilitating bonding between a substrate and a mold, and at the same time, curing a mold stamped on the substrate to improve the adhesion performance of the pattern.
  • another object of the present invention is to provide an imprint apparatus and an imprint method capable of facilitating separation between the substrate and the mold and at the same time improving the separation running performance of the mold.
  • the transfer unit for transferring the film-shaped mold having a pattern formed on the surface in one direction and the other direction;
  • a surface modification unit for treating the surface of the pattern transferred by the transfer unit with plasma;
  • a coupling part for coupling the mold and the substrate so that the pattern of the plasma-treated mold can be stamped onto the substrate;
  • a separating part separating the bonded mold and the substrate.
  • the transfer unit of the present invention the supply roll for winding the mold in one direction to feed the feed and the transfer in the other direction by winding the mold; And it characterized in that it comprises a discharge roll winding the mold in one direction to feed the feed and to the reverse direction by winding the mold in the other direction.
  • At least one of the supply roll and the coupling portion of the present invention and between the discharge roll and the separation portion characterized in that it comprises a position measuring means for detecting the position of the center or side end of the mold.
  • the position measuring means of the present invention is characterized in that it is interlocked with the position correction means for correcting the position of the center or side end of the mold.
  • At least one of the supply roll and the coupling portion of the present invention and between the discharge roll and the separation portion characterized in that it comprises a tension measuring means for measuring the tension of the mold.
  • the tension measuring means of the present invention is characterized in that it is interlocked with a control unit for controlling the rotational speed of the supply roll and the discharge roll.
  • the surface modification part of the present invention includes a plasma generating part to which a high frequency is applied, and a distance between the mold and the plasma generating part is 1 to 10 mm, and when the pattern surface of the mold is treated with plasma, the mold is 5 to 100 mm. It is characterized in that the transfer to / s.
  • the surface modification of the present invention is characterized in that it further comprises a gas supply for supplying a gas containing at least one of argon, oxygen and nitrogen.
  • Said gas supply part of this invention is provided along the width direction of the said mold, It is characterized by the above-mentioned.
  • the gas supply part of the present invention is characterized by supplying gas at a rate of 1 to 50 L / min.
  • the coupling portion of the present invention is the chamber in and out is maintained in a vacuum state; Support means installed on an inner lower layer of the chamber to support a substrate; Elevating means for elevating the substrate to a lower portion of the supporting means to pressurize and mold the mold; And curing means installed on the inner upper layer of the chamber to cure the stamped substrate.
  • the coupling part of the present invention characterized in that it further comprises a fixing means for fixing the front and rear mold located inside the chamber outside the chamber.
  • the separation unit of the present invention the stamping means for fixing the substrate bonded to the mold stamped in the coupling portion; Shanghai moving means installed in the lower portion of the suction means for moving the substrate up and down; Separating means for separating the mold from the substrate stamped at the bonding portion; And a front and rear movement means installed on one side of the separation means to advance the separation means forward and backward.
  • the separating means of the present invention the first separation roll for separating the mold from the substrate; And a second separation roll which is installed on the first separation roll and guides the mold separated therefrom.
  • the discharge roll and the separating portion of the present invention characterized in that it comprises a dancer roll for adjusting the tension of the mold is changed as the separating means is moved by the front and rear movement means.
  • the present invention provides a supply step of transferring the film-shaped mold having a pattern formed on the surface in one direction; A surface modification step of plasma treating a surface of the mold to be transferred; Combining the mold with the substrate such that a pattern of the plasma treated mold can be stamped onto the substrate; A separation step of separating the bonded mold and the substrate; And a discharging step of discharging and discharging the separated mold.
  • It is characterized in that it further comprises; repeating the step of repeating the surface modification step, the bonding step and the separation step in sequence by transferring the mold separated in the separation step of the present invention in the other direction.
  • the present invention is to modify the film-shaped mold having a pattern formed on the surface with a plasma to stamp the pattern on the substrate and to separate the substrate and the mold, thereby modifying the surface of the pattern by plasma treatment to reuse the pattern It provides an effect of improving the printing performance by shortening the printing time of the pattern on the substrate.
  • the forward and reverse rotation of the transfer portion facilitates the transfer and reverse transfer of the film-shaped mold, and at the same time improve the running performance of the mold to improve the supply performance and discharge performance It can be effective.
  • the position detecting means for detecting the traveling position of the mold around the supply roll or the discharge roll it is possible to easily determine the running state of the mold to move the travel and at the same time reduce the loss of the subsequent process due to poor driving. Provide the effect.
  • the tension measuring means is interlocked with the control unit for controlling the rotational speed of the supply roll and the discharge roll, thereby providing an effect that can easily control the tension of the mold by controlling the rotational speed of the supply roll and the discharge roll by the control unit.
  • the chamber, the support means, the lifting means, the hardening means and the fixing means as a coupling portion, to facilitate the bonding between the substrate and the mold and at the same time harden the mold stamped on the substrate to improve the adhesion performance of the pattern Provide effect.
  • FIG. 1 is a block diagram showing an imprint apparatus according to an embodiment of the present invention.
  • FIG. 2 is a state diagram showing a surface modification of the imprint apparatus according to an embodiment of the present invention.
  • FIG. 3 is a block diagram showing an imprint method according to an embodiment of the present invention.
  • first transfer unit 20 second transfer unit
  • FIG. 1 is a block diagram showing an imprint apparatus according to an embodiment of the present invention
  • Figure 2 is a block diagram showing a surface modification of the imprint apparatus according to an embodiment of the present invention
  • Figure 3 is an embodiment of the present invention It is a block diagram which shows the imprint method by this.
  • the imprint apparatus includes a transfer part 10, 20, a surface modification part 30, a coupling part 40, and a separation part 50. It is an imprint apparatus which prints a pattern on the board
  • the transfer units 10 and 20 are transfer means for transferring the film-shaped mold F having a pattern formed on its surface in one direction and the other direction, and include the first transfer unit 10 provided upstream and the second transfer unit 20 provided downstream. )
  • the first conveying part 10 is a conveying means for supplying and conveying the mold in one direction and winding the mold in the other direction, and feeding the mold in the other direction.
  • the feed roll 11, the first position measuring means 12, and the guide roll 13 are provided.
  • the feed roll 11 is a roll member which feeds and transfers the mold in one direction and winds the mold in the other direction, and is connected to a rotation driving means capable of controlling forward and reverse rotation, such as a servo motor.
  • the mold is recommended and wound by the rotation control.
  • the first position measuring means 12 is a measuring means for detecting the position of the center or side end portion of the mold that is installed and moved between the supply roll 11 and the engaging portion 30, such measurement means EPC (Edge It is of course possible to use a position control sensor.
  • first position measuring means 12 is preferably interlocked with the position correcting means for correcting the position of the center or side end portion of the mold traveling between the first conveying portion 10 and the second conveying portion 20. .
  • the guide roll 13 is a guide means provided downstream of the first position measuring means 12, and is installed to move up and down and move forward and backward to guide the mold in the advancing direction.
  • the tension measuring means 14 is a measuring means provided between the supply roll 11 and the engaging portion 30, and measures the tension of the traveling mold, and the tension measuring means includes the supply roll 11 and the discharge roll 21. It is preferable to interlock with the control unit for controlling the rotational speed of h).
  • the second conveying unit 20 is a conveying means for supplying and conveying the mold in one direction and winding the mold in the other direction, and transporting the mold.
  • the second conveying unit 20 includes a discharge roll 21, a second position measuring means 22, and a second tension measurement. Means (23).
  • the discharge roll 21 is a roll member which feeds and transfers the mold in one direction and winds the mold in the other direction, and is connected to a rotation driving means capable of controlling forward and reverse rotation, such as a servo motor.
  • the mold is recommended and wound by the rotation control.
  • the second position measuring means 22 is a measuring means for detecting the position of the center or side end portion of the mold that is installed and moved between the discharge roll 21 and the separating part 50.
  • Such measuring means is EPC (Edge). It is of course possible to use a position control sensor.
  • the second position measuring means 22 is preferably interlocked with the position correction means for correcting the position of the center or side end portion of the mold traveling between the first conveying portion 10 and the second conveying portion 20. .
  • the tension adjusting means 23 is a tension means provided between the discharge roll 21 and the separating part 50, and adjusts the tension of the mold to move and the tension adjusting means includes a supply roll 11 and a discharge roll ( It is preferable to interlock with the control unit 60 for controlling the rotational speed of 21.
  • the surface modification part 30 is a surface modification means which processes the pattern surface of the mold conveyed by the conveyance part with plasma, and consists of the plasma generation part 31 and the gas supply parts 32, 33, 34. As shown in FIG.
  • Plasma generator 31 the plasma generating means to which high frequency is applied, the distance between the mold and the plasma generator 31 is 1 to 10mm, when the pattern surface of the mold is treated with plasma, the mold is 5 to 100mm / s It is preferably controlled by the control unit 60 to be conveyed.
  • control unit 60 includes a matching unit 61 for sufficiently matching the impedance of the high frequency load to the transmission line impedance so that the high frequency is applied from the plasma generating unit 31 to enable plasma processing, and the high frequency providing the high frequency load. It consists of a power supply 62, a matching unit 61, and a commercial power supply 63 of 220V for supplying power to the high frequency power supply.
  • the gas supply unit is a gas supply means for supplying a gas containing at least one of argon, oxygen, and nitrogen, which is provided along the width direction of the mold, and preferably supplies the gas at a rate of 1 to 50 L / min. It consists of a reservoir 32, a pressure regulator 33 and a flow regulator 34.
  • the gas storage tank 32 is gas storage means for storing one gas of argon, oxygen, and nitrogen, respectively, and in this embodiment, includes an argon storage tank 32a for storing argon and an oxygen storage tank 32b for storing oxygen. have.
  • the pressure regulator 33 is a pressure regulating means for regulating the gas pressure of one of argon, oxygen and nitrogen, respectively.
  • the argon pressure regulator 33a for adjusting the pressure of argon and oxygen for adjusting the pressure of oxygen. It consists of a pressure regulator 33b.
  • the pressure regulator is preferably to measure and control the pressure by using a two-gauge regulator to adjust the gas pressure of argon, oxygen and nitrogen, respectively.
  • the flow regulator 34 is a flow regulating means for regulating the gas flow rate of one of argon, oxygen and nitrogen, respectively.
  • the argon flow regulator 32a for adjusting the argon flow rate and the oxygen for adjusting the flow rate of oxygen. It consists of a flow regulator 32b.
  • MFC mass flow controller
  • Coupling portion 40 is a coupling means for coupling the mold (F) and the substrate (W) so that the pattern of the plasma-treated mold can be stamped on the substrate, the chamber 41, the support means 42, the lifting means ( 43), the gear box 44, the drive means 45, the hardening means 46, the weighing means 47 and the fixing means (48).
  • the chamber 41 is a vacuum space in which the mold is moved in and out and is maintained in a vacuum state.
  • the chamber 41 provides a vacuum space for joining the mold F and the substrate W so that the pattern of the mold can be stamped onto the substrate. .
  • the support means 42 is provided in the lower layer of the inside of the chamber 41 and supports the board
  • the support means 42 adsorb
  • the elevating means 43 is provided on the lower portion of the supporting means 42 and is an elevating means for elevating and stamping the substrate W by pressing the lower portion of the mold F.
  • the elevating means 43 is provided with an elevating driving force in an up and down direction like a bellows. It expands and contracts up and down.
  • the gear box 44 is installed at the lower part of the elevating means 43 and transmits the elevating driving force.
  • the gear box 44 receives the elevating driving force from the driving means 45 and transmits the elevating driving force to the elevating means 43.
  • the driving means 45 is a power source for providing the elevating driving force to the elevating means 43, and is connected to one of the gear boxes 44 to provide the elevating driving force to the elevating means 43 via the gear box 44. have.
  • the hardening means 46 is a hardening means installed on the inner upper layer of the chamber 41 to harden the stamped substrate, and is made of a heating member such as an LED UV lamp to harden the stamped pattern on the upper surface of the substrate.
  • the load measuring means 47 is a measuring means provided on the upper part of the hardening means 46.
  • the load measuring means 47 measures a load such as a load cell so as to measure the pressing force when the substrate W is raised by the elevating means 43. Done.
  • Fixing means 48 is a fixing means for fixing the front and rear of the mold (F) located inside the chamber 41 from the outside of the chamber 41, and prevents the movement or movement of the mold pattern when stamping the pattern on the substrate Gripper member such as gripper is used to
  • Separation unit 50 is a separation means for separating the mold (F) and the substrate (W) coupled in the coupling portion 40, the adsorption means 51, shandong movement means 52, separation means 53, 54 And back and forth movement means (55).
  • Adsorption means 51 is a fixing means for fixing the substrate bonded to the mold stamped in the coupling portion 40, the substrate is fixed by an adsorption force equal to a negative pressure, such as an adsorption chuck to separate the substrate from the mold.
  • the shank moving means 52 is provided below the suction means 51 to move the substrate up and down, and is moved up and down using a linear moving member such as a linear motor or a hydraulic cylinder.
  • Separation means (53, 54) is a means for separating the mold from the substrate stamped in the coupling portion 40, the first separation roll 53 for separating the mold from the substrate by rolling, and the first separation roll ( The second separation roll 54 is installed on the upper portion of the 53 to guide the separated mold.
  • the first separation roll 53 is a roll member installed below the separation means, and is rolled on the upper part of the mold to separate the mold stamped on the upper part of the mold and transferred upward to the second separation roll 54. .
  • the second separation roll 54 is a guide roll that guides the mold separated by being installed on the first separation roll 53 and guides the mold separated by the first separation roll 53 downstream.
  • the forward and backward movement means 55 is a movement means provided on one side of the separation means to advance the separation means forward and backward, and reciprocates back and forth using a linear movement member such as a linear motor or a hydraulic cylinder.
  • the dancer roll as the tension adjusting means 23 for measuring and adjusting the tension of the mold changed as the separation means moves by the front and rear movement means 55.
  • the dancer roll as the tension adjusting means 23 for measuring and adjusting the tension of the mold changed as the separation means moves by the front and rear movement means 55.
  • the mold supply step S10 the surface modification step S20, the bonding step S30, the separation step S40, and the repeating step S50.
  • a discharging step (S60) the pattern is printed on the substrate (W) using a film-shaped mold (F) having a pattern formed on its surface.
  • the mold supply step S10 is a step of feeding and feeding a film-shaped mold having a pattern formed on a surface in one direction.
  • the mold-feeding step S10 is carried out in one direction by the film-shaped mold in the first conveying part 10 and in the second conveying part 20.
  • the film mold is wound up in one direction to supply the mold.
  • the diameter of the discharge roll 21 is measured to calculate the moving distance of the mold, and the mold is transferred by the predetermined moving distance to supply the mold to the operation position of the surface modification unit 30.
  • Surface modification step (S20) is a step of surface modification of the surface of the mold to be transferred by plasma treatment, surface modification by the plasma treatment to modify the surface of the mold transferred to the surface modification unit 30 by the transfer unit .
  • Joining step (S30) is a step of joining the mold and the substrate so that the pattern of the plasma-treated mold can be stamped on the substrate, the support means in which the substrate is adsorbed at the same time while transferring the mold in the other direction by the reverse rotation of the transfer unit ( 42) is raised to combine the mode and the substrate to stamp and harden by the hardening means 46.
  • Separation step (S40) is a step of separating the mold and the substrate bonded in the bonding step (S30), by transporting the mold bonded to the substrate in one direction by the forward rotation of the transfer portion while fixing the substrate by the adsorption means (51) The mode and the substrate are separated from each other by rolling the separating means.
  • the repetition step (S50) is a step of repeating the mold reforming step (S20), the coupling step (S30) and the separation step (S40) sequentially by transferring the mold separated in the separation step (S40) in another direction, The mold is transferred back to the surface modification unit 30 by reverse rotation to the transfer unit, and the previous processing steps are repeated a plurality of times or five times.
  • Discharge step (S60) is a step of transporting and discharging the separated mold, the mold separated in the separation step (S40) after the final repetition step is transferred to the discharge roll 21 by the forward rotation of the transfer unit is wound up and discharged here Done.
  • the present invention by modifying a film-shaped mold having a pattern formed on the surface with a plasma to stamp the pattern on the substrate and separating the substrate and the mold, the surface of the pattern is modified by plasma treatment to reuse the pattern. It provides an effect of improving the printing performance by shortening the printing time of the pattern on the substrate.
  • the forward and reverse rotation of the transfer portion facilitates the transfer and reverse transfer of the film-shaped mold, and at the same time improve the running performance of the mold to improve the supply performance and discharge performance It can be effective.
  • the position detecting means for detecting the traveling position of the mold around the supply roll or the discharge roll it is possible to easily determine the running state of the mold to move the travel and at the same time reduce the loss of the subsequent process due to poor driving. Provide the effect.
  • the tension measuring means is interlocked with the control unit for controlling the rotational speed of the supply roll and the discharge roll, thereby providing an effect that can easily control the tension of the mold by controlling the rotational speed of the supply roll and the discharge roll by the control unit.
  • the chamber, the support means, the lifting means, the hardening means and the fixing means as a coupling portion, to facilitate the bonding between the substrate and the mold and at the same time harden the mold stamped on the substrate to improve the adhesion performance of the pattern Provide effect.
  • an imprint apparatus and an imprint method for printing onto a wafer using a film-shaped mold having a pattern formed on its surface are provided.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention relates to an imprint device and an imprint method. The imprint device comprises: a transfer part for transferring a film-shaped mold in one or another direction, the film-shaped mold having a pattern formed on the surface thereof; a surface modification part for plasma-treating the surface of the pattern transferred by the transfer part; a coupling part for coupling the mold to a substrate such that the plasma-treated pattern of the mold can be stamped on the substrate; and a separation part for separating the mold and the substrate which have been coupled to each other. In the present invention, the film-shaped mold having a pattern formed on the surface thereof is modified with plasma, the pattern is stamped on the substrate, and the substrate and the mold are separated from each other. Therefore, the present invention provides an advantageous effect in that surface modification of the pattern through plasma treatment allows the reuse of the pattern and the reduction of a time taken to print the pattern on a substrate, thereby improving printing performance.

Description

임프린트 장치 및 임프린트 방법Imprint Device and Imprint Method
본 발명은 임프린트 장치 및 임프린트 방법에 관한 것으로서, 보다 상세하게는 표면에 패턴이 형성된 필름 형상의 몰드를 이용하여 웨이퍼 상에 프린팅하는 임프린트 장치 및 임프린트 방법에 관한 것이다.The present invention relates to an imprint apparatus and an imprint method, and more particularly, to an imprint apparatus and an imprint method for printing on a wafer using a film-shaped mold having a pattern formed on the surface.
나노임프린트 리소그래피 공정은 경제적이고 효과적으로 나노 구조물(nano-structure)을 제작할 수 있는 기술로서, 기재(substrate) 위에 레진을 스핀코팅(spin-coating) 또는 디스펜싱(dispensing)하고, 레진 표면에 패턴이 형성된 몰드를 눌러서 패턴을 전사(transfer)하는 기술이다.The nanoimprint lithography process is an economical and effective technique for fabricating nano-structures, in which spin-coating or dispensing of resin on a substrate and patterning on the surface of the resin It is a technique of transferring a pattern by pressing a mold.
나노임프린트 리소그래피 공정은 크게 가열식(thermal-type)과 자외선 조사 방식으로 나눌 수 있다.Nanoimprint lithography processes can be broadly classified into thermal-type and ultraviolet irradiation methods.
가열식 공정은 열전사(Hot Embossing) 또는 서멀 임프린트 리소그래피(Thermal Imprint Lithography)라고 불리며, 몰드와 고분자층이 형성되어 있는 기재를 접촉시킨 후, 열을 가해서 고분자층에 유동성을 제공하고, 압력을 가해 고분자층에 원하는 패턴을 만들어 내는 방법이다. 이러한 가열식 공정은 열변형에 의해 다층 정렬이 어렵다는 문제점이 있으며, 점도가 큰 레진을 임프린트 하기 위해 높은 압력이 필요하기 때문에 패턴이 깨지기 쉬운 문제점이 있다.The heated process, called hot embossing or thermal imprint lithography, is brought into contact with the mold and the substrate on which the polymer layer is formed. This is how you create the pattern you want on the floor. Such a heating process has a problem that it is difficult to align the multilayer by thermal deformation, and there is a problem in that the pattern is easily broken because high pressure is required to imprint a resin having a high viscosity.
이러한 가열식 공정의 문제점을 개선하기 위해 개발된 자외선 조사 방식의 나노임프린트 리소그래피 공정은, 저점성 광경화성 수지와 이를 경화하기 위한 자외선을 사용하는 방법으로서, 상온 저압으로 공정을 실행시킬 수 있기 때문에, 다층화 및 대량 생산에 적합하다.The ultraviolet irradiation nanoimprint lithography process developed to improve the problems of such a heating process is a method of using a low viscosity photocurable resin and ultraviolet rays to cure it, and since the process can be performed at room temperature and low pressure, And suitable for mass production.
종래 자외선 조사 방식의 나노임프린트 리소그래피 공정은, 먼저 기판 위에 자외선 경화용 레진을 코팅한 후, 몰드를 이용하여 누르면, 경화용 레진이 몰드의 패턴 사이를 채우게 된다. 이때, 점도가 낮기 때문에 낮은 압력에서도 쉽게 몰드 패턴 사이를 레진으로 채울 수 있다. 이후, UV 광원이 투명한 몰드를 통해서 레진을 감광시키면, 레진이 경화된다. 이후에 몰드를 떼어내면, 패턴 사이에 잔여층이 남게 되는데, 이를 산소 애싱 등을 통해 제거하여 공정을 완료한다.In the conventional ultraviolet irradiation nanoimprint lithography process, first coating the ultraviolet curing resin on the substrate, and then pressed using a mold, the curing resin is filled between the patterns of the mold. At this time, since the viscosity is low, it is easy to fill the mold pattern between the resin even at low pressure. Thereafter, when the UV light source exposes the resin through the transparent mold, the resin is cured. Subsequently, when the mold is peeled off, a residual layer remains between the patterns, which are removed by oxygen ashing or the like to complete the process.
상기한 종래의 자외선 조사 방식의 공정에서는, 자기조립 단분자막을 몰드 표면에 코팅하여 이형성을 개선하기도 하는데, 코팅 처리 시간이 오래 걸리고, 제품의 생산성이 저하되는 문제점이 존재한다.In the conventional UV irradiation process, the self-assembled monomolecular film may be coated on the mold surface to improve releasability, but the coating process takes a long time, and there is a problem in that the productivity of the product is lowered.
또한, 몰드에 별도의 코팅 처리를 하는 경우, 가격 경쟁력이 저하되고, 별도의 형성된 코팅층이 기판과 몰드 분리 시 묻어나게 되어 몰드를 재사용하기 어렵다는 단점이 존재한다.In addition, when a separate coating treatment on the mold, the price competitiveness is lowered, there is a disadvantage that the separate formed coating layer is buried when separating the substrate and the mold, it is difficult to reuse the mold.
나아가, 몰드의 재사용성 저하로, 몰드는 일 방향으로만 이송해야 하므로, 생산성이 저하되고, 레진 코팅 과정 등은 별도의 장소 및 장비에서 이루어져 연속적인 공정이 불가능하므로, 작업 공간이 많이 소요되며, 작업 시간이 많이 소요되는 문제점이 있었다. Furthermore, due to the reduced reusability of the mold, the mold must be transported in one direction only, so productivity is reduced, and the resin coating process is performed in a separate place and equipment, and thus a continuous process is impossible, which requires a lot of work space. There was a problem that takes a lot of work.
또한, 패턴은 기판에 전사 시 손상되므로 재사용이 불가능하다는 문제점이 있었고, 플라즈마로 몰드의 표면에 형성된 패턴을 반복 처리시 패턴에 플라즈마가 불균일하게 처리되는 문제가 있었고, 스탬핑 시 몰드에 가해지는 힘에 의해 몰드의 위치가 변동되어 기판에 패턴이 제대로 전사되지 않는다는 문제점도 있었다.In addition, there was a problem that the pattern is damaged when transferred to the substrate, so it cannot be reused, and when the pattern formed on the surface of the mold is repeatedly processed by plasma, there is a problem that the plasma is unevenly processed on the pattern. There is also a problem that the position of the mold is changed and the pattern is not properly transferred to the substrate.
<선행기술문헌><Preceding technical literature>
(특허문헌 1) 대한민국 등록특허 제10-0747877호 (2007년08월08일)(Patent Document 1) Republic of Korea Patent No. 10-0747877 (08 August 2007)
(특허문헌 2) 대한민국 등록특허 제10-0763669호 (2007년10월04일)(Patent Document 2) Republic of Korea Patent No. 10-0763669 (October 04, 2007)
(특허문헌 3) 대한민국 등록특허 제10-1413346호 (2014년06월27일)(Patent Document 3) Republic of Korea Patent No. 10-1413346 (June 27, 2014)
본 발명은 상기와 같은 종래의 문제점을 해소하기 위해 안출한 것으로서, 패턴의 표면을 플라즈마 처리하여 개질해서 패턴을 재사용하는 동시에 기판상에 패턴의 프린팅 시간을 단축시켜 프린팅성능을 향상시킬 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 그 목적으로 한다.The present invention has been made to solve the above-mentioned conventional problems, an imprint apparatus that can improve the printing performance by reducing the printing time of the pattern on the substrate at the same time to reuse the pattern by modifying the surface of the pattern by plasma treatment And an imprint method.
또한, 본 발명은 이송부의 정회전 및 역회전에 의해 필름 형상의 몰드의 이송 및 역이송을 용이하게 하는 동시에 몰드의 주행성을 향상시켜 공급성능 및 배출성능을 향상시킬 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.In addition, the present invention provides an imprint apparatus and an imprint method that can facilitate the transfer and reverse transfer of the film-shaped mold by the forward rotation and the reverse rotation of the transfer unit and at the same time improve the running performance of the mold to improve the supply performance and discharge performance. Another purpose is to provide.
또한, 본 발명은 주행이동하는 몰드의 주행상태를 용이하게 파악할 수 있는 동시에 주행불량으로 인한 후속공정의 손실을 절감할 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.In addition, another object of the present invention is to provide an imprint apparatus and an imprint method capable of easily grasping a running state of a traveling mold while reducing a loss of a subsequent process due to poor driving.
또한, 본 발명은 몰드의 상하 위치를 정렬하여 패턴에 플라즈마가 균일하게 처리되는 동시에 몰드의 장력을 일정하게 유지하여 주행이동 성능을 향상시킬 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.Another object of the present invention is to provide an imprint apparatus and an imprint method capable of improving driving movement performance by aligning the upper and lower positions of a mold to uniformly process plasma in a pattern and maintaining a constant tension of the mold. do.
또한, 본 발명은 제어부에 의한 공급롤 및 배출롤의 회전 속도 제어에 의해 몰드의 장력조절을 용이하게 할 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.In addition, another object of the present invention is to provide an imprint apparatus and an imprint method capable of facilitating tension control of a mold by controlling the rotational speed of the supply roll and the discharge roll by the controller.
또한, 본 발명은 플라즈마의 처리성능을 향상시키는 동시에 플라즈마 처리불량을 향상시킬 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.Another object of the present invention is to provide an imprint apparatus and an imprint method capable of improving plasma processing performance and improving plasma processing defects.
또한, 본 발명은 기판과 몰드 사이의 결합을 용이하게 하는 동시에 기판에 스탬핑된 몰드를 경화시켜 패턴의 부착성능을 향상시킬 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.In addition, another object of the present invention is to provide an imprint apparatus and an imprint method for facilitating bonding between a substrate and a mold, and at the same time, curing a mold stamped on the substrate to improve the adhesion performance of the pattern.
또한, 본 발명은 기판과 몰드 사이의 분리를 용이하게 하는 동시에 몰드의 분리 주행성능을 향상시킬 수 있는 임프린트 장치 및 임프린트 방법을 제공하는 것을 또 다른 목적으로 한다.In addition, another object of the present invention is to provide an imprint apparatus and an imprint method capable of facilitating separation between the substrate and the mold and at the same time improving the separation running performance of the mold.
상기와 같은 목적을 달성하기 위한 본 발명은, 표면에 패턴이 형성된 필름 형상의 몰드를 일방향 및 타방향으로 이송시키는 이송부; 상기 이송부에 의해 이송되는 상기 패턴의 표면을 플라즈마로 처리하는 표면 개질부; 플라즈마 처리된 상기 몰드의 패턴이 기판에 스탬핑될 수 있도록 상기 몰드와 상기 기판을 결합시키는 결합부; 및 결합된 상기 몰드와 상기 기판을 분리하는 분리부;를 포함하는 것을 특징으로 한다.The present invention for achieving the above object, the transfer unit for transferring the film-shaped mold having a pattern formed on the surface in one direction and the other direction; A surface modification unit for treating the surface of the pattern transferred by the transfer unit with plasma; A coupling part for coupling the mold and the substrate so that the pattern of the plasma-treated mold can be stamped onto the substrate; And a separating part separating the bonded mold and the substrate.
본 발명의 상기 이송부는, 상기 몰드를 일방향으로 권해하여 공급이송하고 상기 몰드를 타방향으로 권취하여 역이송하는 공급롤; 및 상기 몰드를 일방향으로 권취하여 공급이송하고 상기 몰드를 타방향으로 권해하여 역이송하는 배출롤을 포함하는 것을 특징으로 한다.The transfer unit of the present invention, the supply roll for winding the mold in one direction to feed the feed and the transfer in the other direction by winding the mold; And it characterized in that it comprises a discharge roll winding the mold in one direction to feed the feed and to the reverse direction by winding the mold in the other direction.
본 발명의 상기 공급롤과 상기 결합부 사이 및 상기 배출롤과 상기 분리부 사이 중 적어도 어느 하나에는, 상기 몰드의 중앙 또는 측단부의 위치를 검출하는 위치측정수단을 포함하는 것을 특징으로 한다. 본 발명의 상기 위치측정수단은 상기 몰드의 중앙 또는 측단부의 위치를 보정하는 위치보정수단과 연동되는 것을 특징으로 한다.At least one of the supply roll and the coupling portion of the present invention and between the discharge roll and the separation portion, characterized in that it comprises a position measuring means for detecting the position of the center or side end of the mold. The position measuring means of the present invention is characterized in that it is interlocked with the position correction means for correcting the position of the center or side end of the mold.
본 발명의 상기 공급롤과 상기 결합부 사이 및 상기 배출롤과 상기 분리부 사이 중 적어도 어느 하나에는, 상기 몰드의 장력을 측정하는 장력측정수단을 포함하는 것을 특징으로 한다. 본 발명의 상기 장력측정수단은 상기 공급롤 및 상기 배출롤의 회전 속도를 제어하는 제어부와 연동되는 것을 특징으로 한다.At least one of the supply roll and the coupling portion of the present invention and between the discharge roll and the separation portion, characterized in that it comprises a tension measuring means for measuring the tension of the mold. The tension measuring means of the present invention is characterized in that it is interlocked with a control unit for controlling the rotational speed of the supply roll and the discharge roll.
본 발명의 상기 표면 개질부는, 고주파가 인가되는 플라즈마 발생부를 포함하고, 상기 몰드와 상기 플라즈마 발생부 사이의 간격은 1∼10mm이고, 상기 몰드의 패턴 표면을 플라즈마로 처리 시 상기 몰드는 5∼100mm/s로 이송되는 것을 특징으로 한다.The surface modification part of the present invention includes a plasma generating part to which a high frequency is applied, and a distance between the mold and the plasma generating part is 1 to 10 mm, and when the pattern surface of the mold is treated with plasma, the mold is 5 to 100 mm. It is characterized in that the transfer to / s.
본 발명의 상기 표면 개질부는, 아르곤, 산소 및 질소 중 하나 이상을 포함하는 가스를 공급하는 가스 공급부를 더 포함하는 것을 특징으로 한다. 본 발명의 상기 가스 공급부는, 상기 몰드의 폭 방향을 따라 설치되는 것을 특징으로 한다. 본 발명의 상기 가스 공급부는, 1∼50L/min의 속도로 가스를 공급하는 것을 특징으로 한다.The surface modification of the present invention is characterized in that it further comprises a gas supply for supplying a gas containing at least one of argon, oxygen and nitrogen. Said gas supply part of this invention is provided along the width direction of the said mold, It is characterized by the above-mentioned. The gas supply part of the present invention is characterized by supplying gas at a rate of 1 to 50 L / min.
본 발명의 상기 결합부는, 상기 몰드가 진출입되며 진공상태로 유지되는 챔버; 상기 챔버의 내부 하층에 설치되어 기판를 지지하는 지지수단; 상기 지지수단의 하부에 상기 기판을 승강시켜 상기 몰드를 가압하여 스탬핑하는 승강수단; 및 상기 챔버의 내부 상층에 설치되어 스템핑된 상기 기판을 경화시키는 경화수단을 포함하는 것을 특징으로 한다. 본 발명의 상기 결합부는, 상기 챔버 외부에서 상기 챔버 내부에 위치한 몰드 전후방을 고정시키는 고정수단을 더 포함하는 것을 특징으로 한다.The coupling portion of the present invention, the mold is the chamber in and out is maintained in a vacuum state; Support means installed on an inner lower layer of the chamber to support a substrate; Elevating means for elevating the substrate to a lower portion of the supporting means to pressurize and mold the mold; And curing means installed on the inner upper layer of the chamber to cure the stamped substrate. The coupling part of the present invention, characterized in that it further comprises a fixing means for fixing the front and rear mold located inside the chamber outside the chamber.
본 발명의 상기 분리부는, 상기 결합부에서 스탬핑되어 몰드와 결합된 기판을 고정시키는 흡착수단; 상기 흡착수단의 하부에 설치되어 상기 기판을 상하로 이동시키는 상하이동수단; 상기 결합부에서 스탬핑된 기판으로부터 상기 몰드를 분리하는 분리수단; 및 상기 분리수단의 일방에 설치되어 상기 분리수단을 전후진시키는 전후이동수단을 포함하는 것을 특징으로 한다.The separation unit of the present invention, the stamping means for fixing the substrate bonded to the mold stamped in the coupling portion; Shanghai moving means installed in the lower portion of the suction means for moving the substrate up and down; Separating means for separating the mold from the substrate stamped at the bonding portion; And a front and rear movement means installed on one side of the separation means to advance the separation means forward and backward.
본 발명의 상기 분리수단은, 상기 몰드를 상기 기판으로부터 분리시키는 제1 분리롤; 및 상기 제1 분리롤의 상부에 설치되어 분리된 상기 몰드를 가이드하는 제2 분리롤을 포함하는 것을 특징으로 한다.The separating means of the present invention, the first separation roll for separating the mold from the substrate; And a second separation roll which is installed on the first separation roll and guides the mold separated therefrom.
본 발명의 상기 배출롤과 상기 분리부의 사이에는, 상기 전후이동수단에 의해 상기 분리수단이 이동함에 따라 변경되는 상기 몰드의 장력을 조절하는 댄서롤을 포함하는 것을 특징으로 한다.Between the discharge roll and the separating portion of the present invention, characterized in that it comprises a dancer roll for adjusting the tension of the mold is changed as the separating means is moved by the front and rear movement means.
또한, 본 발명은 표면에 패턴이 형성된 필름 형상의 몰드를 일방향으로 이송시켜 공급하는 공급 단계; 이송되는 상기 몰드의 표면을 플라즈마 처리하는 표면 개질 단계; 플라즈마 처리된 상기 몰드의 패턴이 기판에 스탬핑될 수 있도록 상기 몰드와 상기 기판을 결합시키는 결합 단계; 결합된 상기 몰드와 상기 기판을 분리하는 분리 단계; 및 분리된 상기 몰드를 이송하여 배출하는 배출단계;를 포함하는 것을 특징으로 한다.In addition, the present invention provides a supply step of transferring the film-shaped mold having a pattern formed on the surface in one direction; A surface modification step of plasma treating a surface of the mold to be transferred; Combining the mold with the substrate such that a pattern of the plasma treated mold can be stamped onto the substrate; A separation step of separating the bonded mold and the substrate; And a discharging step of discharging and discharging the separated mold.
본 발명의 상기 분리 단계에서 분리된 상기 몰드를 타방향으로 이송시켜 상기 표면 개질 단계, 상기 결합 단계 및 상기 분리 단계를 순차적으로 복수회 반복하는 반복 단계;를 더 포함하는 것을 특징으로 한다.It is characterized in that it further comprises; repeating the step of repeating the surface modification step, the bonding step and the separation step in sequence by transferring the mold separated in the separation step of the present invention in the other direction.
이상에서 살펴본 바와 같이, 본 발명은 표면에 패턴이 형성된 필름 형상의 몰드를 플라즈로 개질해서 기판에 패턴을 스탬핑하고 기판과 몰드를 분리함으로써, 패턴의 표면을 플라즈마 처리하여 개질해서 패턴을 재사용하는 동시에 기판상에 패턴의 프린팅 시간을 단축시켜 프린팅성능을 향상시킬 수 있는 효과를 제공한다.As described above, the present invention is to modify the film-shaped mold having a pattern formed on the surface with a plasma to stamp the pattern on the substrate and to separate the substrate and the mold, thereby modifying the surface of the pattern by plasma treatment to reuse the pattern It provides an effect of improving the printing performance by shortening the printing time of the pattern on the substrate.
또한, 이송부로서 공급롤과 배출롤을 구비함으로써, 이송부의 정회전 및 역회전에 의해 필름 형상의 몰드의 이송 및 역이송을 용이하게 하는 동시에 몰드의 주행성을 향상시켜 공급성능 및 배출성능을 향상시킬 수 있는 효과를 제공한다.In addition, by providing the feed roll and the discharge roll as the transfer portion, the forward and reverse rotation of the transfer portion facilitates the transfer and reverse transfer of the film-shaped mold, and at the same time improve the running performance of the mold to improve the supply performance and discharge performance It can be effective.
또한, 공급롤이나 배출롤의 주변에 몰드의 주행위치를 검출하는 위치검출수단을 설치함으로써, 주행이동하는 몰드의 주행상태를 용이하게 파악할 수 있는 동시에 주행불량으로 인한 후속공정의 손실을 절감할 수 있는 효과를 제공한다.In addition, by providing the position detecting means for detecting the traveling position of the mold around the supply roll or the discharge roll, it is possible to easily determine the running state of the mold to move the travel and at the same time reduce the loss of the subsequent process due to poor driving. Provide the effect.
또한, 공급롤과 배출롤의 둘레에 몰드의 장력을 측정하는 장력측정수단을 포함함으로써, 몰드의 상하 위치를 정렬하여 패턴에 플라즈마가 균일하게 처리되는 동시에 몰드의 장력을 일정하게 유지하여 주행이동 성능을 향상시킬 수 있는 효과를 제공한다.In addition, by including a tension measuring means for measuring the tension of the mold around the supply roll and the discharge roll, by aligning the upper and lower positions of the mold, the plasma is uniformly processed in the pattern, while maintaining the tension of the mold constant travel performance Provides the effect to improve.
또한, 장력측정수단이 공급롤 및 배출롤의 회전 속도를 제어하는 제어부와 연동됨으로써, 제어부에 의한 공급롤 및 배출롤의 회전 속도 제어에 의해 몰드의 장력조절을 용이하게 할 수 있는 효과를 제공한다.In addition, the tension measuring means is interlocked with the control unit for controlling the rotational speed of the supply roll and the discharge roll, thereby providing an effect that can easily control the tension of the mold by controlling the rotational speed of the supply roll and the discharge roll by the control unit. .
또한, 표면 개질부에서 고주파가 인가되는 플라즈마 발생부를 포함하고 몰드와 플라즈마 발생부 사이의 간격과 몰드의 이송속도를 소정값으로 한정함으로써, 플라즈마의 처리성능을 향상시키는 동시에 플라즈마 처리불량을 향상시킬 수 있는 효과를 제공한다.In addition, by including a plasma generation unit to which a high frequency is applied at the surface modification unit and limiting the distance between the mold and the plasma generation unit and the transfer speed of the mold to a predetermined value, it is possible to improve plasma processing performance and improve plasma processing defects. Provide the effect.
또한, 결합부로서 챔버, 지지수단, 승강수단, 경화수단 및 고정수단을 포함함으로써, 기판과 몰드 사이의 결합을 용이하게 하는 동시에 기판에 스탬핑된 몰드를 경화시켜 패턴의 부착성능을 향상시킬 수 있는 효과를 제공한다.In addition, by including the chamber, the support means, the lifting means, the hardening means and the fixing means as a coupling portion, to facilitate the bonding between the substrate and the mold and at the same time harden the mold stamped on the substrate to improve the adhesion performance of the pattern Provide effect.
또한, 분리부로서 흡착수단, 상하이동수단, 분리수단 및 전후이동수단을 포함함으로써, 기판과 몰드 사이의 분리를 용이하게 하는 동시에 몰드의 분리 주행성능을 향상시킬 수 있는 효과를 제공한다.In addition, by including a suction unit, a moving unit, a separating unit and a forward and backward moving unit as the separation unit, it is possible to facilitate separation between the substrate and the mold and at the same time improve the separation running performance of the mold.
도 1은 본 발명의 일 실시예에 의한 임프린트 장치를 나타내는 구성도.1 is a block diagram showing an imprint apparatus according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 의한 임프린트 장치의 표면 개질부를 나타내는 상태도.2 is a state diagram showing a surface modification of the imprint apparatus according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 의한 임프린트 방법을 나타내는 구성도.3 is a block diagram showing an imprint method according to an embodiment of the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
10: 제1 이송부 20: 제2 이송부10: first transfer unit 20: second transfer unit
30: 표면 개질부 40: 결합부30: surface modification 40: bonding
50: 분리부 60: 제어부50: separation unit 60: control unit
이하, 첨부도면을 참조하여 본 발명의 바람직한 일 실시예를 더욱 상세히 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
도 1은 본 발명의 일 실시예에 의한 임프린트 장치를 나타내는 구성도이고, 도 2는 본 발명의 일 실시예에 의한 임프린트 장치의 표면 개질부를 나타내는 구성도이고, 도 3은 본 발명의 일 실시예에 의한 임프린트 방법을 나타내는 구성도이다.1 is a block diagram showing an imprint apparatus according to an embodiment of the present invention, Figure 2 is a block diagram showing a surface modification of the imprint apparatus according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention It is a block diagram which shows the imprint method by this.
도 1 및 도 2에 나타낸 바와 같이, 본 실시예에 따른 임프린트 장치는, 이송부(10, 20), 표면 개질부(30), 결합부(40) 및 분리부(50)를 포함하여 이루어져, 표면에 패턴이 형성된 필름 형상의 몰드(F)를 이용하여 기판(W) 상에 패턴을 프린트하는 임프린트 장치이다.1 and 2, the imprint apparatus according to the present embodiment includes a transfer part 10, 20, a surface modification part 30, a coupling part 40, and a separation part 50. It is an imprint apparatus which prints a pattern on the board | substrate W using the film-form mold F in which the pattern was formed.
이송부(10, 20)는, 표면에 패턴이 형성된 필름 형상의 몰드(F)를 일방향 및 타방향으로 이송시키는 이송수단으로서, 상류에 설치된 제1 이송부(10)와 하류에 설치된 제2 이송부(20)로 이루어져 있다.The transfer units 10 and 20 are transfer means for transferring the film-shaped mold F having a pattern formed on its surface in one direction and the other direction, and include the first transfer unit 10 provided upstream and the second transfer unit 20 provided downstream. )
제1 이송부(10)는, 몰드를 일방향으로 권해하여 공급이송하고 몰드를 타방향으로 권취하여 역이송하는 이송수단으로서, 공급롤(11), 제1 위치측정수단(12), 가이드롤(13) 및 장력측정수단(14)으로 이루어져 있다.The first conveying part 10 is a conveying means for supplying and conveying the mold in one direction and winding the mold in the other direction, and feeding the mold in the other direction. The feed roll 11, the first position measuring means 12, and the guide roll 13 are provided. ) And tension measuring means (14).
공급롤(11)은, 몰드를 일방향으로 권해하여 공급이송하고 몰드를 타방향으로 권취하여 역이송하는 롤부재으로서, 서보모터 등과 같은 정회전 및 역회전을 제어할 수 있는 회전구동수단에 연결되어 회전제어에 의해 몰드를 권해 및 권취하게 된다The feed roll 11 is a roll member which feeds and transfers the mold in one direction and winds the mold in the other direction, and is connected to a rotation driving means capable of controlling forward and reverse rotation, such as a servo motor. The mold is recommended and wound by the rotation control.
제1 위치측정수단(12)은, 공급롤(11)과 결합부(30) 사이에 설치되어 이동하는 몰드의 중앙 또는 측단부의 위치를 검출하는 측정수단으로서, 이러한 측정수단으로는 EPC(Edge Position Control) 센서를 사용하는 것이 가능함은 물론이다.The first position measuring means 12 is a measuring means for detecting the position of the center or side end portion of the mold that is installed and moved between the supply roll 11 and the engaging portion 30, such measurement means EPC (Edge It is of course possible to use a position control sensor.
또한, 이러한 제1 위치측정수단(12)은 제1 이송부(10)와 제2 이송부(20) 사이를 주행이동하는 몰드의 중앙 또는 측단부의 위치를 보정하는 위치보정수단과 연동되는 것이 바람직하다.In addition, the first position measuring means 12 is preferably interlocked with the position correcting means for correcting the position of the center or side end portion of the mold traveling between the first conveying portion 10 and the second conveying portion 20. .
가이드롤(13)은, 제1 위치측정수단(12)의 하류에 설치된 가이드수단으로서, 상하방향으로 승강하게 설치되는 동시에 전후진하도록 설치되어 몰드를 진행방향으로 가이드하게 된다.The guide roll 13 is a guide means provided downstream of the first position measuring means 12, and is installed to move up and down and move forward and backward to guide the mold in the advancing direction.
장력측정수단(14)은, 공급롤(11)과 결합부(30) 사이에 설치된 측정수단으로서, 주행 이동하는 몰드의 장력을 측정하며 이러한 장력측정수단은 공급롤(11) 및 배출롤(21)의 회전 속도를 제어하는 제어부와 연동되는 것이 바람직하다.The tension measuring means 14 is a measuring means provided between the supply roll 11 and the engaging portion 30, and measures the tension of the traveling mold, and the tension measuring means includes the supply roll 11 and the discharge roll 21. It is preferable to interlock with the control unit for controlling the rotational speed of h).
제2 이송부(20)는, 몰드를 일방향으로 권해하여 공급이송하고 몰드를 타방향으로 권취하여 역이송하는 이송수단으로서, 배출롤(21), 제2 위치측정수단(22) 및 제2 장력측정수단(23)으로 이루어져 있다.The second conveying unit 20 is a conveying means for supplying and conveying the mold in one direction and winding the mold in the other direction, and transporting the mold. The second conveying unit 20 includes a discharge roll 21, a second position measuring means 22, and a second tension measurement. Means (23).
배출롤(21)은, 몰드를 일방향으로 권해하여 공급이송하고 몰드를 타방향으로 권취하여 역이송하는 롤부재로서, 서보모터 등과 같은 정회전 및 역회전을 제어할 수 있는 회전구동수단에 연결되어 회전제어에 의해 몰드를 권해 및 권취하게 된다The discharge roll 21 is a roll member which feeds and transfers the mold in one direction and winds the mold in the other direction, and is connected to a rotation driving means capable of controlling forward and reverse rotation, such as a servo motor. The mold is recommended and wound by the rotation control.
제2 위치측정수단(22)은, 배출롤(21)과 분리부(50) 사이에 설치되어 이동하는 몰드의 중앙 또는 측단부의 위치를 검출하는 측정수단으로서, 이러한 측정수단으로는 EPC(Edge Position Control) 센서를 사용하는 것이 가능함은 물론이다.The second position measuring means 22 is a measuring means for detecting the position of the center or side end portion of the mold that is installed and moved between the discharge roll 21 and the separating part 50. Such measuring means is EPC (Edge). It is of course possible to use a position control sensor.
또한, 이러한 제2 위치측정수단(22)은 제1 이송부(10)와 제2 이송부(20) 사이를 주행이동하는 몰드의 중앙 또는 측단부의 위치를 보정하는 위치보정수단과 연동되는 것이 바람직하다.In addition, the second position measuring means 22 is preferably interlocked with the position correction means for correcting the position of the center or side end portion of the mold traveling between the first conveying portion 10 and the second conveying portion 20. .
장력조절수단(23)은, 배출롤(21)과 분리부(50) 사이에 설치된 장력수단으로서, 주행 이동하는 몰드의 장력을 조절하게 되며 이러한 장력조절수단은 공급롤(11) 및 배출롤(21)의 회전 속도를 제어하는 제어부(60)와 연동되는 것이 바람직하다.The tension adjusting means 23 is a tension means provided between the discharge roll 21 and the separating part 50, and adjusts the tension of the mold to move and the tension adjusting means includes a supply roll 11 and a discharge roll ( It is preferable to interlock with the control unit 60 for controlling the rotational speed of 21.
표면 개질부(30)는, 이송부에 의해 이송되는 몰드의 패턴 표면을 플라즈마로 처리하는 표면개질수단으로서, 플라즈마 발생부(31) 및 가스공급부(32, 33, 34)로 이루어져 있다.The surface modification part 30 is a surface modification means which processes the pattern surface of the mold conveyed by the conveyance part with plasma, and consists of the plasma generation part 31 and the gas supply parts 32, 33, 34. As shown in FIG.
플라즈마 발생부(31), 고주파가 인가되는 플라즈마 발생수단으로서, 몰드와 플라즈마 발생부(31) 사이의 간격은 1∼10mm이고, 몰드의 패턴 표면을 플라즈마로 처리 시 몰드는 5∼100mm/s로 이송되도록 제어부(60)에 의해 제어되는 것이 바람직하다. Plasma generator 31, the plasma generating means to which high frequency is applied, the distance between the mold and the plasma generator 31 is 1 to 10mm, when the pattern surface of the mold is treated with plasma, the mold is 5 to 100mm / s It is preferably controlled by the control unit 60 to be conveyed.
또한, 이러한 제어부(60)는, 플라즈마 발생부(31)에서 고주파가 인가되어 플라즈마 처리가 가능하도록 고주파부하의 임피던스를 전송로 임피던스에 충분히 정합시키는 정합기(61)와, 고주파부하를 제공하는 고주파전원(62)와, 정합기(61) 및 고주파전원에 전원을 제공하는 220V의 상용전원(63)으로 이루어져 있다.In addition, the control unit 60 includes a matching unit 61 for sufficiently matching the impedance of the high frequency load to the transmission line impedance so that the high frequency is applied from the plasma generating unit 31 to enable plasma processing, and the high frequency providing the high frequency load. It consists of a power supply 62, a matching unit 61, and a commercial power supply 63 of 220V for supplying power to the high frequency power supply.
가스공급부는, 아르곤, 산소 및 질소 중 하나 이상을 포함하는 가스를 공급하는 가스공급수단으로서, 몰드의 폭 방향을 따라 설치되며, 1∼50L/min의 속도로 가스를 공급하는 것이 바람직하고, 가스저장조(32), 압력조절기(33) 및 유량조절기(34)로 이루어져 있다.The gas supply unit is a gas supply means for supplying a gas containing at least one of argon, oxygen, and nitrogen, which is provided along the width direction of the mold, and preferably supplies the gas at a rate of 1 to 50 L / min. It consists of a reservoir 32, a pressure regulator 33 and a flow regulator 34.
가스저장조(32)는, 아르곤, 산소 및 질소 중 하나의 가스를 각각 저장하는 가스저장수단으로서, 본 실시예에서는 아르곤을 저장하는 아르곤 저장조(32a)와 산소를 저장하는 산소 저장조(32b)로 이루어져 있다.The gas storage tank 32 is gas storage means for storing one gas of argon, oxygen, and nitrogen, respectively, and in this embodiment, includes an argon storage tank 32a for storing argon and an oxygen storage tank 32b for storing oxygen. have.
압력조절기(33)는, 아르곤, 산소 및 질소 중 하나의 가스압력을 각각 조절하는 압력조절수단으로서, 본 실시예에서는 아르곤의 압력을 조절하는 아르곤 압력조절기(33a)와 산소의 압력을 조절하는 산소 압력조절기(33b)로 이루어져 있다.The pressure regulator 33 is a pressure regulating means for regulating the gas pressure of one of argon, oxygen and nitrogen, respectively. In this embodiment, the argon pressure regulator 33a for adjusting the pressure of argon and oxygen for adjusting the pressure of oxygen. It consists of a pressure regulator 33b.
이러한 압력조절기로는 아르곤, 산소 및 질소의 가스압력을 각각 조절하도록 2상 압력조절기(2 Gauge Regulator)를 사용하여 압력을 측정 및 제어하게 되는 것이 바람직하다.The pressure regulator is preferably to measure and control the pressure by using a two-gauge regulator to adjust the gas pressure of argon, oxygen and nitrogen, respectively.
유량조절기(34)는, 아르곤, 산소 및 질소 중 하나의 가스유량을 각각 조절하는 유량조절수단으로서, 본 실시예에서는 아르곤의 유량을 조절하는 아르곤 유량조절기(32a)와 산소의 유량을 조절하는 산소 유량조절기(32b)로 이루어져 있다.The flow regulator 34 is a flow regulating means for regulating the gas flow rate of one of argon, oxygen and nitrogen, respectively. In this embodiment, the argon flow regulator 32a for adjusting the argon flow rate and the oxygen for adjusting the flow rate of oxygen. It consists of a flow regulator 32b.
이러한 유량조절기로는 아르곤, 산소 및 질소의 가스유량을 각각 조절하도록 MFC(Mass Flow Controller)를 사용하여, 압력과 온도에 의한 편차에 따라 변하지 않는 질량을 이용하여 유량을 측정 및 제어하게 되는 것이 바람직하다.As such a flow regulator, it is preferable to use a mass flow controller (MFC) to control gas flow rates of argon, oxygen, and nitrogen, respectively, and to measure and control the flow rate by using a mass that does not change according to the variation due to pressure and temperature. Do.
결합부(40)는, 플라즈마 처리된 몰드의 패턴이 기판에 스탬핑될 수 있도록 몰드(F)와 기판(W)을 결합시키는 결합수단으로서, 챔버(41), 지지수단(42), 승강수단(43), 기어박스(44), 구동수단(45), 경화수단(46), 무게측정수단(47) 및 고정수단(48)으로 이루어져 있다.Coupling portion 40 is a coupling means for coupling the mold (F) and the substrate (W) so that the pattern of the plasma-treated mold can be stamped on the substrate, the chamber 41, the support means 42, the lifting means ( 43), the gear box 44, the drive means 45, the hardening means 46, the weighing means 47 and the fixing means (48).
챔버(41)는, 몰드가 진출입되며 진공상태로 유지되는 진공공간으로서, 몰드의 패턴이 기판에 스탬핑될 수 있도록 몰드(F)와 기판(W)을 결합시키는 진공상태의 결합공간을 제공하게 된다.The chamber 41 is a vacuum space in which the mold is moved in and out and is maintained in a vacuum state. The chamber 41 provides a vacuum space for joining the mold F and the substrate W so that the pattern of the mold can be stamped onto the substrate. .
지지수단(42)은, 챔버(41)의 내부 하층에 설치되어 기판(W)를 지지하는 지지수단으로서, 흡착척 등과 같이 음압에 의한 흡착력에 의해 기판을 흡착하여 지지하게 된다.The support means 42 is provided in the lower layer of the inside of the chamber 41 and supports the board | substrate W. The support means 42 adsorb | sucks and supports a board | substrate by the adsorption force by a negative pressure, such as a suction chuck.
승강수단(43)은, 지지수단(42)의 하부에 설치되어 기판(W)을 승강시켜 몰드(F)의 하부에 가압하여 스탬핑하는 승강수단으로서, 벨로우즈와 같이 상하방향으로 승강구동력을 제공받아 상하로 신축하여 승강하게 된다.The elevating means 43 is provided on the lower portion of the supporting means 42 and is an elevating means for elevating and stamping the substrate W by pressing the lower portion of the mold F. The elevating means 43 is provided with an elevating driving force in an up and down direction like a bellows. It expands and contracts up and down.
기어박스(44)는, 승강수단(43)의 하부에 설치되어 승강구동력을 전달하는 전달 부재로서, 구동수단(45)으로부터 승강구동력을 전달받아 승강수단(43)으로 전달하게 된다.The gear box 44 is installed at the lower part of the elevating means 43 and transmits the elevating driving force. The gear box 44 receives the elevating driving force from the driving means 45 and transmits the elevating driving force to the elevating means 43.
구동수단(45)은, 승강수단(43)에 승강구동력을 제공하는 동력원으로서, 기어박스(44)를 개재해서 승강수단(43)에 승강구동력을 제공하도록 기어박스(44)의 일방에 연결되어 있다.The driving means 45 is a power source for providing the elevating driving force to the elevating means 43, and is connected to one of the gear boxes 44 to provide the elevating driving force to the elevating means 43 via the gear box 44. have.
경화수단(46)은, 챔버(41)의 내부 상층에 설치되어 스템핑된 기판을 경화시키는 경화수단으로서, LED UV램프 등과 같은 가열부재로 이루어져 기판의 상부에 스탬핑된 패턴을 경화시키게 된다.The hardening means 46 is a hardening means installed on the inner upper layer of the chamber 41 to harden the stamped substrate, and is made of a heating member such as an LED UV lamp to harden the stamped pattern on the upper surface of the substrate.
*하중측정수단(47)은, 경화수단(46)의 상부에 설치된 측정수단으로서, 승강수단(43)에 의해 기판(W)이 상승한 경우에 압압력을 측정하도록 로드셀 등과 같이 하중을 하중을 측정하게 된다.* The load measuring means 47 is a measuring means provided on the upper part of the hardening means 46. The load measuring means 47 measures a load such as a load cell so as to measure the pressing force when the substrate W is raised by the elevating means 43. Done.
고정수단(48)은, 챔버(41)의 외부에서 챔버(41)의 내부에 위치한 몰드(F)의 전후방을 고정시키는 고정수단으로서, 기판 상에 패턴의 스탬핑시 몰드 패턴의 요동이나 이동을 방지하도록 그립퍼 등과 같은 집게부재를 사용하게 된다.Fixing means 48 is a fixing means for fixing the front and rear of the mold (F) located inside the chamber 41 from the outside of the chamber 41, and prevents the movement or movement of the mold pattern when stamping the pattern on the substrate Gripper member such as gripper is used to
분리부(50)는, 결합부(40)에서 결합된 몰드(F)와 기판(W)을 분리하는 분리수단으로서, 흡착수단(51), 상하이동수단(52), 분리수단(53, 54) 및 전후이동수단(55)으로 이루어져 있다. Separation unit 50 is a separation means for separating the mold (F) and the substrate (W) coupled in the coupling portion 40, the adsorption means 51, shandong movement means 52, separation means 53, 54 And back and forth movement means (55).
흡착수단(51)은, 결합부(40)에서 스탬핑되어 몰드와 결합된 기판을 고정시키는 고정수단으로서, 몰드와 기판을 분리하기 위해 기판을 흡착척 등과 같이 음압에 이한 흡착력에 의해 고정시키게 된다Adsorption means 51 is a fixing means for fixing the substrate bonded to the mold stamped in the coupling portion 40, the substrate is fixed by an adsorption force equal to a negative pressure, such as an adsorption chuck to separate the substrate from the mold.
상하이동수단(52)은, 흡착수단(51)의 하부에 설치되어 기판을 상하로 이동시키는 이동수단으로서, 리니어모터나 유공압 실린더 등과 같은 선형이동부재를 사용하여 상하로 승강이동시키게 된다.The shank moving means 52 is provided below the suction means 51 to move the substrate up and down, and is moved up and down using a linear moving member such as a linear motor or a hydraulic cylinder.
분리수단(53, 54)은, 결합부(40)에서 스탬핑된 기판으로부터 몰드를 분리하는 수단으로서, 롤링에 의해 몰드를 기판으로부터 분리시키는 제1 분리롤(53)과, 이 제1 분리롤(53)의 상부에 설치되어 분리된 몰드를 가이드하는 제2 분리롤(54)로 이루어져 있다.Separation means (53, 54) is a means for separating the mold from the substrate stamped in the coupling portion 40, the first separation roll 53 for separating the mold from the substrate by rolling, and the first separation roll ( The second separation roll 54 is installed on the upper portion of the 53 to guide the separated mold.
제1 분리롤(53)은, 분리수단의 하부에 설치된 롤부재로서, 몰드의 상부에서 롤링하여 기판에 상부에 스탬핑된 몰드를 분리하여 상방으로 이송하여 제2 분리롤(54)로 전달하게 된다.The first separation roll 53 is a roll member installed below the separation means, and is rolled on the upper part of the mold to separate the mold stamped on the upper part of the mold and transferred upward to the second separation roll 54. .
제2 분리롤(54)은, 제1 분리롤(53)의 상부에 설치되어 분리된 몰드를 가이드하는 가이드롤로서, 제1 분리롤(53)에 의해 분리된 몰드를 하류로 가이드하게 된다.The second separation roll 54 is a guide roll that guides the mold separated by being installed on the first separation roll 53 and guides the mold separated by the first separation roll 53 downstream.
전후이동수단(55)은, 분리수단의 일방에 설치되어 분리수단을 전후진시키는 이동수단으로서, 리니어모터나 유공압 실린더 등과 같은 선형이동부재를 사용하여 전후로 왕복이동시키게 된다.The forward and backward movement means 55 is a movement means provided on one side of the separation means to advance the separation means forward and backward, and reciprocates back and forth using a linear movement member such as a linear motor or a hydraulic cylinder.
특히, 배출롤(21)과 분리부(50)의 사이에는, 전후이동수단(55)에 의해 분리수단이 이동함에 따라 변경되는 몰드의 장력을 측정하여 조절하는 장력조절수단(23)으로서 댄서롤을 사용하는 것도 가능함은 물론이다.In particular, between the discharge roll 21 and the separation unit 50, the dancer roll as the tension adjusting means 23 for measuring and adjusting the tension of the mold changed as the separation means moves by the front and rear movement means 55. Of course it is also possible to use.
이하, 첨부도면을 참조하여 본 실시예의 임프린트 장치를 이용한 임프린트 방법을 더욱 상세히 설명한다. Hereinafter, an imprint method using the imprint apparatus of this embodiment will be described in more detail with reference to the accompanying drawings.
도 1 및 도 3에 나타낸 바와 같이 본 실시예의 임프린트 장치를 이용한 임프린트 방법은, 몰드 공급 단계(S10), 표면 개질 단계(S20), 결합 단계(S30), 분리 단계(S40), 반복 단계(S50) 및 배출 단계(S60)를 포함하여 이루어져, 표면에 패턴이 형성된 필름 형상의 몰드(F)를 이용하여 기판(W) 상에 패턴을 프린트하는 임프린트 방법이다.1 and 3, in the imprinting method using the imprint apparatus of the present embodiment, the mold supply step S10, the surface modification step S20, the bonding step S30, the separation step S40, and the repeating step S50. ) And a discharging step (S60), the pattern is printed on the substrate (W) using a film-shaped mold (F) having a pattern formed on its surface.
몰드 공급 단계(S10)는, 표면에 패턴이 형성된 필름 형상의 몰드를 일방향으로 이송시켜 공급하는 단계로서, 제1 이송부(10)에서 필름 형상의 몰드를 일방향으로 귄해하고 제2 이송부(20)에서 필름 형상의 몰드를 일방향으로 권취해서 몰드를 공급하게 된다.The mold supply step S10 is a step of feeding and feeding a film-shaped mold having a pattern formed on a surface in one direction. The mold-feeding step S10 is carried out in one direction by the film-shaped mold in the first conveying part 10 and in the second conveying part 20. The film mold is wound up in one direction to supply the mold.
이때 배출롤(21)의 직경을 측정하여 몰드의 이동거리를 산출하게 되며, 소정이동거리 만큼 몰드를 이송시켜 몰드를 표면 개질부(30)의 작동위치로 공급하게 된다.At this time, the diameter of the discharge roll 21 is measured to calculate the moving distance of the mold, and the mold is transferred by the predetermined moving distance to supply the mold to the operation position of the surface modification unit 30.
표면 개질 단계(S20)는, 이송되는 몰드의 표면을 플라즈마 처리에 의해 표면 개질하는 단계로서, 이송부에 의해 표면 개질부(30)로 이송된 몰드의 표면을 개질하는 플라즈마 처리에 의해 표면 개질하게 된다.Surface modification step (S20) is a step of surface modification of the surface of the mold to be transferred by plasma treatment, surface modification by the plasma treatment to modify the surface of the mold transferred to the surface modification unit 30 by the transfer unit .
결합 단계(S30)는, 플라즈마 처리된 몰드의 패턴이 기판에 스탬핑될 수 있도록 몰드와 기판을 결합시키는 단계로서, 이송부의 역회전에 의해 몰드를 타방향으로 이송시키는 동시에 기판이 흡착된 지지수단(42)을 상승시켜 모드와 기판을 결합시켜 스탬핑하고 경화수단(46)에 의해 경화시키게 된다.Joining step (S30) is a step of joining the mold and the substrate so that the pattern of the plasma-treated mold can be stamped on the substrate, the support means in which the substrate is adsorbed at the same time while transferring the mold in the other direction by the reverse rotation of the transfer unit ( 42) is raised to combine the mode and the substrate to stamp and harden by the hardening means 46.
분리 단계(S40)는, 결합 단계(S30)에서 결합된 몰드와 기판을 분리하는 단계로서, 이송부의 정회전에 의해 기판이 결합된 몰드를 일방향으로 이송시키는 동시에 기판을 흡착수단(51)에 의해 고정시키고 분리수단의 롤링에 의해 모드와 기판을 서로 분리하게 된다.Separation step (S40) is a step of separating the mold and the substrate bonded in the bonding step (S30), by transporting the mold bonded to the substrate in one direction by the forward rotation of the transfer portion while fixing the substrate by the adsorption means (51) The mode and the substrate are separated from each other by rolling the separating means.
반복 단계(S50)는, 분리 단계(S40)에서 분리된 몰드를 타방향으로 이송시켜 몰드 개질 단계(S20), 결합 단계(S30) 및 분리 단계(S40)를 순차적으로 복수회 반복하는 단계로서, 이송부에 역회전에 의해 몰드를 다시 표면 개질부(30)로 이송하여 이전의 처리단계들을 복수회 또는 5회 반복하게 된다.The repetition step (S50) is a step of repeating the mold reforming step (S20), the coupling step (S30) and the separation step (S40) sequentially by transferring the mold separated in the separation step (S40) in another direction, The mold is transferred back to the surface modification unit 30 by reverse rotation to the transfer unit, and the previous processing steps are repeated a plurality of times or five times.
배출 단계(S60)는, 분리된 몰드를 이송하여 배출하는 단계로서, 최종 반복단계 후 분리 단계(S40)에서 분리된 몰드를 이송부의 정회전에 의해 배출롤(21)로 이송하여 여기에 권취하여 배출하게 된다.Discharge step (S60) is a step of transporting and discharging the separated mold, the mold separated in the separation step (S40) after the final repetition step is transferred to the discharge roll 21 by the forward rotation of the transfer unit is wound up and discharged here Done.
이상 설명한 바와 같이, 본 발명에 따르면 표면에 패턴이 형성된 필름 형상의 몰드를 플라즈로 개질해서 기판에 패턴을 스탬핑하고 기판과 몰드를 분리함으로써, 패턴의 표면을 플라즈마 처리하여 개질해서 패턴을 재사용하는 동시에 기판상에 패턴의 프린팅 시간을 단축시켜 프린팅성능을 향상시킬 수 있는 효과를 제공한다.As described above, according to the present invention, by modifying a film-shaped mold having a pattern formed on the surface with a plasma to stamp the pattern on the substrate and separating the substrate and the mold, the surface of the pattern is modified by plasma treatment to reuse the pattern. It provides an effect of improving the printing performance by shortening the printing time of the pattern on the substrate.
또한, 이송부로서 공급롤과 배출롤을 구비함으로써, 이송부의 정회전 및 역회전에 의해 필름 형상의 몰드의 이송 및 역이송을 용이하게 하는 동시에 몰드의 주행성을 향상시켜 공급성능 및 배출성능을 향상시킬 수 있는 효과를 제공한다.In addition, by providing the feed roll and the discharge roll as the transfer portion, the forward and reverse rotation of the transfer portion facilitates the transfer and reverse transfer of the film-shaped mold, and at the same time improve the running performance of the mold to improve the supply performance and discharge performance It can be effective.
또한, 공급롤이나 배출롤의 주변에 몰드의 주행위치를 검출하는 위치검출수단을 설치함으로써, 주행이동하는 몰드의 주행상태를 용이하게 파악할 수 있는 동시에 주행불량으로 인한 후속공정의 손실을 절감할 수 있는 효과를 제공한다.In addition, by providing the position detecting means for detecting the traveling position of the mold around the supply roll or the discharge roll, it is possible to easily determine the running state of the mold to move the travel and at the same time reduce the loss of the subsequent process due to poor driving. Provide the effect.
또한, 공급롤과 배출롤의 둘레에 몰드의 장력을 측정하는 장력측정수단을 포함함으로써, 몰드의 상하 위치를 정렬하여 패턴에 플라즈마가 균일하게 처리되는 동시에 몰드의 장력을 일정하게 유지하여 주행이동 성능을 향상시킬 수 있는 효과를 제공한다.In addition, by including a tension measuring means for measuring the tension of the mold around the supply roll and the discharge roll, by aligning the upper and lower positions of the mold, the plasma is uniformly processed in the pattern, while maintaining the tension of the mold constant travel performance Provides the effect to improve.
또한, 장력측정수단이 공급롤 및 배출롤의 회전 속도를 제어하는 제어부와 연동됨으로써, 제어부에 의한 공급롤 및 배출롤의 회전 속도 제어에 의해 몰드의 장력조절을 용이하게 할 수 있는 효과를 제공한다.In addition, the tension measuring means is interlocked with the control unit for controlling the rotational speed of the supply roll and the discharge roll, thereby providing an effect that can easily control the tension of the mold by controlling the rotational speed of the supply roll and the discharge roll by the control unit. .
또한, 표면 개질부에서 고주파가 인가되는 플라즈마 발생부를 포함하고 몰드와 플라즈마 발생부 사이의 간격과 몰드의 이송속도를 소정값으로 한정함으로써, 플라즈마의 처리성능을 향상시키는 동시에 플라즈마 처리불량을 향상시킬 수 있는 효과를 제공한다.In addition, by including a plasma generating unit to which a high frequency is applied at the surface modification unit, and limiting the distance between the mold and the plasma generating unit and the transfer speed of the mold to a predetermined value, it is possible to improve plasma processing performance and improve plasma processing defects. Provide the effect.
또한, 결합부로서 챔버, 지지수단, 승강수단, 경화수단 및 고정수단을 포함함으로써, 기판과 몰드 사이의 결합을 용이하게 하는 동시에 기판에 스탬핑된 몰드를 경화시켜 패턴의 부착성능을 향상시킬 수 있는 효과를 제공한다.In addition, by including the chamber, the support means, the lifting means, the hardening means and the fixing means as a coupling portion, to facilitate the bonding between the substrate and the mold and at the same time harden the mold stamped on the substrate to improve the adhesion performance of the pattern Provide effect.
또한, 분리부로서 흡착수단, 상하이동수단, 분리수단 및 전후이동수단을 포함함으로써, 기판과 몰드 사이의 분리를 용이하게 하는 동시에 몰드의 분리 주행성능을 향상시킬 수 있는 효과를 제공한다.In addition, by including a suction unit, a moving unit, a separating unit and a forward and backward moving unit as the separation unit, it is possible to facilitate separation between the substrate and the mold and at the same time improve the separation running performance of the mold.
이상 설명한 본 발명은 그 기술적 사상 또는 주요한 특징으로부터 벗어남이 없이 다른 여러 가지 형태로 실시될 수 있다. 따라서 상기 실시예는 모든 점에서 단순한 예시에 지나지 않으며 한정적으로 해석되어서는 안 된다. The present invention described above can be embodied in many other forms without departing from the spirit or main features thereof. Therefore, the above embodiments are merely examples in all respects and should not be interpreted limitedly.
표면에 패턴이 형성된 필름 형상의 몰드를 이용하여 웨이퍼 상에 프린팅하는 임프린트 장치 및 임프린트 방법을 제공한다.Provided are an imprint apparatus and an imprint method for printing onto a wafer using a film-shaped mold having a pattern formed on its surface.

Claims (17)

  1. 표면에 패턴이 형성된 필름 형상의 몰드를 일방향 및 타방향으로 이송시키는 이송부; A transfer unit for transferring a film-shaped mold having a pattern formed on a surface thereof in one direction and another direction;
    상기 이송부에 의해 이송되는 상기 패턴의 표면을 플라즈마로 처리하는 표면 개질부;A surface modification unit for treating the surface of the pattern transferred by the transfer unit with plasma;
    플라즈마 처리된 상기 몰드의 패턴이 기판에 스탬핑될 수 있도록 상기 몰드와 상기 기판을 결합시키는 결합부; 및A coupling part for coupling the mold and the substrate so that the pattern of the plasma-treated mold can be stamped onto the substrate; And
    결합된 상기 몰드와 상기 기판을 분리하는 분리부;를 포함하는 임프린트 장치.And a separating part separating the bonded mold and the substrate.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 이송부는,The transfer unit,
    상기 몰드를 일방향으로 권해하여 공급이송하고 상기 몰드를 타방향으로 권취하여 역이송하는 공급롤; 및A feed roll for winding and feeding the mold in one direction and winding the mold in the other direction; And
    상기 몰드를 일방향으로 권취하여 공급이송하고 상기 몰드를 타방향으로 권해하여 역이송하는 배출롤;을 포함하는 것을 특징으로 하는 임프린트 장치.And a discharge roll wound around the mold in one direction to supply the feed, and a winding roll in the other direction to reverse transfer the mold.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 공급롤과 상기 결합부 사이 및 상기 배출롤과 상기 분리부 사이 중 적어도 어느 하나에는, 상기 몰드의 중앙 또는 측단부의 위치를 검출하는 위치측정수단을 포함하는 것을 특징으로 하는 임프린트 장치.At least one of the supply roll and the coupling portion and between the discharge roll and the separation portion, the imprint apparatus comprising a position measuring means for detecting the position of the center or side end of the mold.
  4. 청구항 3에 있어서,The method according to claim 3,
    상기 위치측정수단은 상기 몰드의 중앙 또는 측단부의 위치를 보정하는 위치보정수단과 연동되는 것을 특징으로 하는 임프린트 장치.And the position measuring means is interlocked with the position correcting means for correcting the position of the center or side end of the mold.
  5. 청구항 2에 있어서,The method according to claim 2,
    상기 공급롤과 상기 결합부 사이 및 상기 배출롤과 상기 분리부 사이 중 적어도 어느 하나에는, 상기 몰드의 장력을 측정하는 장력측정수단을 포함하는 것을 특징으로 하는 임프린트 장치.At least one of the supply roll and the coupling portion, and between the discharge roll and the separating portion, the imprint apparatus characterized in that it comprises a tension measuring means for measuring the tension of the mold.
  6. 청구항 5에 있어서,The method according to claim 5,
    상기 장력측정수단은 상기 공급롤 및 상기 배출롤의 회전 속도를 제어하는 제어부와 연동되는 것을 특징으로 하는 임프린트 장치.The tension measuring means is an imprint apparatus, characterized in that the interlock with a control unit for controlling the rotational speed of the supply roll and the discharge roll.
  7. 청구항 1에 있어서,The method according to claim 1,
    상기 표면 개질부는, 고주파가 인가되는 플라즈마 발생부를 포함하고,The surface modification unit includes a plasma generation unit to which a high frequency is applied,
    상기 몰드와 상기 플라즈마 발생부 사이의 간격은 1∼10mm이고, 상기 몰드의 패턴 표면을 플라즈마로 처리 시 상기 몰드는 5∼100mm/s로 이송되는 것을 특징으로 임프린트 장치.The interval between the mold and the plasma generating unit is 1 to 10mm, the mold is transferred to the mold at 5 to 100mm / s when the pattern surface of the mold is treated with plasma.
  8. 청구항 7에 있어서,The method according to claim 7,
    상기 표면 개질부는, 아르곤, 산소 및 질소 중 하나 이상을 포함하는 가스를 공급하는 가스 공급부를 더 포함하는 것을 특징으로 하는 임프린트 장치.The surface modification unit further comprises a gas supply unit for supplying a gas containing at least one of argon, oxygen and nitrogen.
  9. 청구항 8에 있어서,The method according to claim 8,
    상기 가스 공급부는, 상기 몰드의 폭 방향을 따라 설치되는 것을 특징으로 하는 임프린트 장치.The gas supply unit, the imprint apparatus, characterized in that provided along the width direction of the mold.
  10. 청구항 8에 있어서,The method according to claim 8,
    상기 가스 공급부는, 1∼50L/min의 속도로 가스를 공급하는 것을 특징으로 하는 임프린트 장치.The gas supply unit supplies a gas at a rate of 1 to 50 L / min.
  11. 청구항 1에 있어서,The method according to claim 1,
    상기 결합부는, The coupling part,
    상기 몰드가 진출입되며 진공상태로 유지되는 챔버; A chamber into which the mold is introduced and exited and maintained in a vacuum state;
    상기 챔버의 내부 하층에 설치되어 기판를 지지하는 지지수단; Support means installed on an inner lower layer of the chamber to support a substrate;
    상기 지지수단의 하부에 상기 기판을 승강시켜 상기 몰드를 가압하여 스탬핑하는 승강수단; 및Elevating means for elevating the substrate to a lower portion of the supporting means to pressurize and mold the mold; And
    상기 챔버의 내부 상층에 설치되어 스템핑된 상기 기판을 경화시키는 경화수단을 포함하는 것을 특징으로 하는 임프린트 장치.And hardening means installed on the inner upper layer of the chamber to cure the stamped substrate.
  12. 청구항 11에 있어서,The method according to claim 11,
    상기 결합부는, 상기 챔버 외부에서 상기 챔버 내부에 위치한 몰드 전후방을 고정시키는 고정수단을 더 포함하는 것을 특징으로 하는 임프린트 장치.The coupling unit, the imprint apparatus further comprises a fixing means for fixing the front and rear of the mold located inside the chamber outside the chamber.
  13. 청구항 1에 있어서,The method according to claim 1,
    상기 분리부는, The separation unit,
    상기 결합부에서 스탬핑되어 몰드와 결합된 기판을 고정시키는 흡착수단;Adsorption means stamped at the coupling part to fix the substrate coupled to the mold;
    상기 흡착수단의 하부에 설치되어 상기 기판을 상하로 이동시키는 상하이동수단;Shanghai moving means installed in the lower portion of the suction means for moving the substrate up and down;
    상기 결합부에서 스탬핑된 기판으로부터 상기 몰드를 분리하는 분리수단; 및Separating means for separating the mold from the substrate stamped at the bonding portion; And
    상기 분리수단의 일방에 설치되어 상기 분리수단을 전후진시키는 전후이동수단;을 포함하는 것을 특징으로 하는 임프린트 장치.And a front and rear movement means installed on one side of the separation means to advance the separation means forward and backward.
  14. 청구항 13에 있어서,The method according to claim 13,
    상기 분리수단은, The separating means,
    상기 몰드를 상기 기판으로부터 분리시키는 제1 분리롤; 및A first separation roll separating the mold from the substrate; And
    상기 제1 분리롤의 상부에 설치되어 분리된 상기 몰드를 가이드하는 제2 분리롤을 포함하는 것을 특징으로 하는 임프린트 장치.And a second separation roll for guiding the mold separated by being installed on the first separation roll.
  15. 청구항 13에 있어서,The method according to claim 13,
    상기 배출롤과 상기 분리부의 사이에는, 상기 전후이동수단에 의해 상기 분리수단이 이동함에 따라 변경되는 상기 몰드의 장력을 조절하는 댄서롤을 포함하는 것을 특징으로 하는 임프린트 장치.And a dancer roll between the discharge roll and the separating part to adjust the tension of the mold changed as the separating means moves by the front and rear moving means.
  16. 표면에 패턴이 형성된 필름 형상의 몰드를 일방향으로 이송시켜 공급하는 공급 단계; A supplying step of transferring the film-shaped mold having a pattern formed on its surface in one direction;
    이송되는 상기 몰드의 표면을 플라즈마 처리하는 표면 개질 단계;A surface modification step of plasma treating a surface of the mold to be transferred;
    플라즈마 처리된 상기 몰드의 패턴이 기판에 스탬핑될 수 있도록 상기 몰드와 상기 기판을 결합시키는 결합 단계; Combining the mold with the substrate such that a pattern of the plasma treated mold can be stamped onto the substrate;
    결합된 상기 몰드와 상기 기판을 분리하는 분리 단계; 및A separation step of separating the bonded mold and the substrate; And
    분리된 상기 몰드를 이송하여 배출하는 배출단계;를 포함하는, 임프린트 방법.And a discharging step of discharging and discharging the separated mold.
  17. 청구항 16에 있어서,The method according to claim 16,
    상기 분리 단계에서 분리된 상기 몰드를 타방향으로 이송시켜 상기 표면 개질 단계, 상기 결합 단계 및 상기 분리 단계를 순차적으로 복수회 반복하는 반복 단계;를 더 포함하는 것을 특징으로 하는 임프린트 방법.And transferring the mold separated in the separating step in the other direction to repeat the surface modification step, the combining step, and the separating step sequentially a plurality of times.
PCT/KR2018/001076 2017-03-15 2018-01-24 Imprint device and imprint method WO2018169201A1 (en)

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KR102206491B1 (en) * 2019-11-04 2021-01-22 주식회사 기가레인 Transfer apparatus and method of manufacturing a transferred wafer using the same
KR102441184B1 (en) * 2020-07-15 2022-09-07 주식회사 기가레인 Transfer device for easy film exchange and film exchange method

Citations (5)

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US20070204953A1 (en) * 2006-02-21 2007-09-06 Ching-Bin Lin Method for forming structured film as molded by tape die
KR20110098093A (en) * 2010-02-26 2011-09-01 주식회사 송산 Apparatus of patterned sheet
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KR20140144716A (en) * 2012-05-08 2014-12-19 아사히 가세이 이-매터리얼즈 가부시키가이샤 Transfer method and thermal nanoimprint device

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JP2004148494A (en) * 2002-10-24 2004-05-27 Hewlett-Packard Development Co Lp Hardening nano-imprinting stamp
US20070204953A1 (en) * 2006-02-21 2007-09-06 Ching-Bin Lin Method for forming structured film as molded by tape die
KR20110098093A (en) * 2010-02-26 2011-09-01 주식회사 송산 Apparatus of patterned sheet
KR20120130246A (en) * 2010-03-08 2012-11-29 도시바 기카이 가부시키가이샤 Apparatus for detecting position of sheet-like mold, transfer apparatus and transfer method
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