TWM563352U - Apparatus for imprinting - Google Patents

Abstract

The present invention relates to an imprint apparatus comprising: a transfer portion that transports a film-shaped mold having a pattern formed on a surface in one direction and the other direction; and a surface reforming portion that utilizes plasma to process by means of the transfer portion a surface of the transferred pattern; a joint portion that bonds the mold and the substrate such that a pattern of the plasma-treated mold can be stamped on the substrate; and a separation portion that separates the bonded mold and the substrate. Therefore, the present invention uses a plasma to reform a mold having a patterned film shape on the surface, and presses a pattern on the substrate to separate the substrate and the mold, thereby providing plasma treatment, reforming, and re-processing on the surface of the pattern. When the pattern is used, the pattern printing time on the substrate is shortened, and the printing performance is improved.

Description

Imprinting device

The present invention relates to an imprint apparatus, and more particularly to an imprint apparatus for printing on a wafer by using a mold having a patterned film shape formed on its surface.

The nanoimprint lithography process is a technique for economically and efficiently producing a nano-structure, which is a spin-coating or dispensing resin on a substrate, and is pressed on the substrate. A technique in which a patterned mold is formed on a surface of a resin to transfer a pattern.

The nanoimprint lithography process can be roughly classified into a thermal-type and an ultraviolet ray irradiation method.

The heating process is called hot embossing or thermal imprint lithography. The mold is heated in contact with the substrate on which the polymer layer is formed, and provides fluidity and pressure to the polymer layer. A method of forming a desired pattern in a polymer layer. Such a heating step has a problem that it is difficult to arrange a plurality of layers due to thermal deformation, and in order to imprint a resin having a large viscosity, a high pressure is required, and thus the pattern is easily broken.

The nanoimprint lithography process of the ultraviolet irradiation method developed to improve the problem of the heating process can be carried out at a normal temperature and a low pressure as a method of using a low-viscosity photocurable resin and ultraviolet rays required for curing. The process is thus suitable for multilayering and mass production.

In the conventional nanoimprint lithography process of the ultraviolet irradiation method, first, after applying the ultraviolet curable resin to the substrate, the resin for curing is filled between the patterns of the mold by pressing with a mold. At this time, since the viscosity is low, the mold patterns can be easily filled with the resin even at a relatively low pressure. Then, if the UV light source sensitizes the resin through a transparent mold, the resin hardens. Then, if the mold is removed, the residual layer is left between the patterns, and is removed by oxygen ashing or the like to complete the process.

In the conventional ultraviolet irradiation method, the self-assembled monomolecular film is applied to the surface of the mold to improve the mold release property, and there is a problem that the coating treatment time is long and the product productivity is lowered.

Further, when another coating treatment is performed on the mold, the price competitiveness is low, and the formed coating layer is caught when the substrate is separated from the mold, and there is a drawback that it is difficult to reuse the mold.

Further, since the reusability of the mold is lowered, the mold should be transferred only in one direction, so that the productivity is lowered, the resin coating process and the like are performed in another place and equipment, and the continuous process cannot be realized, so that the working space is large and the working time is required. Long question.

Further, when the pattern is damaged when it is transferred to the substrate, there is a problem that it cannot be reused. When the pattern formed on the surface of the mold is repeatedly processed by the plasma, there is a problem that the plasma is not uniform in the pattern processing, and the position of the mold is applied at the time of pressing. There is a problem that the pattern cannot be normally transferred to the substrate due to the force of the mold.

[Prior Art Literature]

[Patent Literature]

(Patent Document 1) Republic of Korea Authorized Patent No. 10-0747877 (August 08, 2007)

(Patent Document 2) Republic of Korea Authorized Patent No. 10-0763669 (October 04, 2007)

(Patent Document 3) Republic of Korea Authorized Patent No. 10-1413346 (June 27, 2014)

Technical problem solved

This work was developed to eliminate the above-mentioned problems. The purpose of the present invention is to provide an imprint apparatus that performs plasma processing and reforming on the surface of the pattern to shorten the pattern on the substrate while reusing the pattern. Printing time to improve printing performance.

Further, another object of the present invention is to provide an imprint apparatus capable of improving the runningability of a mold and improving the supply while facilitating the transfer and reverse transfer of a film-shaped mold by the forward rotation and the reverse rotation of the transfer portion. Performance and discharge performance.

Further, another object of the present invention is to provide an imprint apparatus capable of easily grasping a running state of a mold that travels and moving, and capable of reducing a loss of a subsequent process due to a running failure.

Further, another object of the present invention is to provide an imprint apparatus which arranges the upper and lower positions of the mold, and which can uniformly maintain the tension of the mold and improve the traveling movement performance while performing plasma uniform processing on the pattern.

Further, another object of the present invention is to provide an imprint apparatus capable of easily performing tension adjustment of a mold in accordance with a rotation speed control of a supply roller and a discharge roller based on a control unit.

Further, another object of the present invention is to provide an imprint apparatus capable of improving plasma processing performance while improving plasma processing performance.

Further, another object of the present invention is to provide an imprint apparatus capable of hardening a mold punched on a substrate while improving the adhesion of the pattern while facilitating bonding between the substrate and the mold.

Further, another object of the present invention is to provide an imprint apparatus capable of improving the separation running performance of the mold while easily separating the substrate from the mold.

Technical solutions

The present invention, which is intended to achieve the above object, is characterized by comprising: a transfer portion that transfers a film-shaped mold having a pattern formed on a surface in one direction and the other direction; and a surface reforming portion that utilizes plasma to process a surface of the pattern transferred to the transfer portion; a joint portion that bonds the mold to the substrate such that a pattern of the plasma-treated mold can be stamped on the substrate; and a separation portion The bonded mold is separated from the substrate.

Wherein the transfer portion of the present invention comprises: a supply roller that unwinds in one direction, supplies and transfers the mold, takes up and reverses the mold in other directions, and discharges the roller, which is wound in one direction, The supply is transferred to the mold, unwinded in other directions, and the mold is reversely transferred.

Wherein at least one of the supply roller and the joint portion between the present creation and the discharge roller and the separation portion includes a position detecting a position of a center or a side end portion of the mold measuring equipment. Among them, the position measuring device of the present invention and the position correcting device that corrects the position of the center or side end portion of the mold are linked.

Wherein at least one of the supply roller and the joint portion of the present invention and between the discharge roller and the separation portion includes a tension measuring device that measures the tension of the mold. The tension measuring device of the present invention and the control unit for controlling the rotational speed of the supply roller and the discharge roller are linked.

Wherein the surface reforming portion includes a plasma generating portion that is connected to a high frequency, and an interval between the mold and the plasma generating portion is 1 ∼ 10 mm when the pattern surface of the mold is treated with plasma At the time, the mold was transferred at 5 ∼ 100 mm/s.

Wherein, the surface reforming portion of the present invention further includes a gas supply portion that supplies one or more gases including argon gas, oxygen gas, and nitrogen gas. Wherein the gas supply portion of the present creation is installed along the width direction of the mold. Among them, the gas supply portion of the present invention supplies gas at a speed of 1 ∼ 50 L/min.

Wherein the joint portion of the present invention comprises: a chamber for the mold to enter and exit to maintain a vacuum state; a supporting device mounted on the inner lower layer of the chamber to support the substrate; and a lifting device at the support a lower portion of the apparatus for lifting and lowering the substrate, pressurizing and stamping the mold, and a hardening device mounted on an inner upper layer of the chamber to harden the stamped substrate. Wherein, the joint portion of the present invention further comprises a fixing device, and the fixing device fixes the front and rear sides of the mold inside the chamber outside the chamber.

Wherein the separation portion of the present invention includes: an adsorption device that fixes a substrate that is stamped and bonded to the mold at the joint portion; and an upper and lower moving device that is mounted to a lower portion of the adsorption device to move the substrate up and down a separation device that separates the mold from a substrate stamped at the joint; and a front and rear moving device that is mounted to one of the separation devices to advance and retreat the separation device.

Wherein the separation apparatus of the present invention comprises: a first separation roller that separates the mold from the substrate; and a second separation roller that is mounted on an upper portion of the first separation roller, the separated The mold is guided.

Therein, between the discharge roller of the present creation and the separation portion, an adjustment roller is provided, which adjusts the tension of the mold which is changed as the separation device moves by means of the front-rear movement device.

Further, the present invention is characterized by comprising: a supply step of transferring and supplying a film-shaped mold having a pattern formed on a surface in one direction; and a surface reforming step of performing plasma treatment on the surface of the transferred mold; Combining the mold and the substrate, so that the pattern of the plasma-treated mold can be stamped on the substrate; the separating step of separating the mold and the substrate; and transferring the separated mold The discharge step of the discharge.

The method further includes moving the mold separated in the separating step of the present creation in another direction, and repeating the step of repeating the surface reforming step, the combining step, and the separating step.

This creative effect

In summary, the present invention uses a plasma to reform a mold having a patterned film shape on the surface, presses a pattern on the substrate, separates the substrate and the mold, thereby providing plasma treatment on the surface of the pattern, and When the pattern is used again, the pattern printing time on the substrate is shortened, and the printing performance is improved.

In addition, the transfer unit is provided with a supply roller and a discharge roller, and is capable of facilitating the transfer and reverse transfer of the mold of the film shape by the positive rotation and the reverse rotation of the transfer unit, thereby improving the running property of the mold and improving the mold. Supply performance and discharge performance.

Further, a position detecting device that detects the traveling position of the mold is attached to the periphery of the supply roller or the discharge roller, thereby providing an effect of being able to easily grasp the running state of the running mold while reducing the subsequent process loss due to the running failure. .

In addition, a tension measuring device for measuring the tension of the mold is included on the outer circumference of the supply roller and the discharge roller, thereby providing an upper and lower position capable of arranging the mold, and while maintaining plasma uniformity of the pattern, the tension of the mold is maintained and the traveling performance is improved. Effect.

Further, the tension measuring device and the control unit that controls the rotational speeds of the supply roller and the discharge roller are linked to each other, thereby providing an effect of easily adjusting the tension of the mold in accordance with the rotational speed control of the supply roller and the discharge roller by the control unit.

Further, the surface reforming unit includes a plasma generating unit that is connected to a high frequency, and the interval between the mold and the plasma generating unit and the transfer speed of the mold are limited to a predetermined value, thereby providing plasma processing performance while improving plasma processing performance. Improve the effect of poor plasma processing.

Further, the joint portion includes a chamber, a supporting device, a lifting device, a hardening device, and a fixing device, thereby providing a mold capable of hardening the die pressed to the substrate while improving the pattern adhesion while easily performing bonding between the substrate and the mold. Performance effect.

Further, the separation unit includes an adsorption device, a vertical movement device, a separation device, and a front-rear movement device, thereby providing an effect of facilitating separation between the substrate and the mold while improving the separation performance of the mold.

A preferred embodiment of the present work will now be described in more detail with reference to the drawings.

1 is a view showing a configuration of an imprint apparatus of an embodiment of the present invention, FIG. 2 is a view showing a state of a surface reforming portion of an imprint apparatus of an embodiment of the present invention, and FIG. 3 is a view showing an implementation of the present creation. The composition of the imprint method of the example.

As shown in FIGS. 1 and 2, the imprint apparatus of the present embodiment includes the first transfer unit 10, the second transfer unit 20, the surface reforming unit 30, the joint portion 40, and the separation unit 50, and is used on the surface. A mold F having a patterned film shape is formed, and an imprint apparatus for printing a pattern on the substrate W is formed.

The first transfer unit 10 and the second transfer unit 20 are transfer devices that transfer the film-shaped mold F having a pattern on the surface in one direction and the other direction, and are attached to the upstream first transfer unit 10 and downstream. The second transfer unit 20 is configured.

The first transfer unit 10 is a transfer device that unwinds in one direction, supplies a transfer mold, and winds up in another direction, and reversely feeds the mold, and is composed of a supply roller 11, a first position measuring device 12, a guide roller 13, and a tension measuring device 14. .

The supply roller 11 is a roller member R that is unwound in one direction, supplies a transfer mold, and is taken up in another direction, and reversely transports the mold, and is connected to a rotary drive device M that can control positive and negative rotation, such as a servo motor. Rotary control to unwind and take up the mold.

The first position measuring device 12 serves as a measuring device for detecting the position of the center or side end portion of the detecting mold between the supply roller 11 and the joint portion 30, and the measuring device can of course use EPC (Edge Position Control) Position control) sensor.

Further, preferably, the first position measuring device 12 and the position correcting device are interlocked, and the position correcting device pairs the center or the side end portion of the mold that travels between the first transfer portion 10 and the second transfer portion 20 The position is corrected.

The guide roller 13 is a guide device attached to the downstream of the first position measuring device 12, and is mounted to advance and retreat while moving up and down in the up and down direction to guide the mold in the traveling direction.

The tension measuring device 14 as a measuring device mounted between the supply roller 11 and the joint portion 30, measures the tension of the mold for traveling, preferably the tension measuring device and the control of the rotational speed of the supply roller 11 and the discharge roller 21. Departmental linkage.

The second transfer unit 20 is a transfer device that unwinds in one direction, supplies a transfer mold, and winds up in another direction, and reversely feeds the mold, and is composed of a discharge roller 21, a second position measuring device 22, and a second tension measuring device 23.

The discharge roller 21 is a roller member R that is unwound in one direction, supplies a transfer mold, and is taken up in another direction, and reversely transports the mold, and is connected to a rotary drive device M that can control positive and negative rotation, such as a servo motor. Rotary control to unwind and take up the mold.

The second position measuring device 22 is a measuring device that is mounted between the discharge roller 21 and the separating portion 50 to detect the position of the center or side end portion of the moving mold. This measuring device can of course use EPC (Edge Position Control). sensor.

Further, preferably, the second position measuring device 22 is interlocked with the position correcting device for the center or side end portion of the mold that travels between the first transfer portion 10 and the second transfer portion 20 The position is corrected.

The tension adjusting device 23 serves as a tension device mounted between the discharge roller 21 and the separating portion 50, and adjusts the tension of the traveling moving mold, preferably such a tension adjusting device and controls the rotation speed of the supply roller 11 and the discharge roller 21. Department 60 linkage.

The surface reforming unit 30 serves as a surface reforming apparatus for processing the surface of the mold pattern by the transfer unit by plasma processing, a gas storage tank 32 of the plasma generating unit 31 and the gas supply unit, a pressure regulator 33, and a flow regulator. 34 constitutes.

The plasma generating portion 31 serves as a plasma generating device that is connected to the high frequency, and the interval between the mold and the plasma generating portion 31 is 1 ∼ 10 mm. When the pattern surface of the mold is treated with plasma, the mold is preferably The control unit 60 controls to transfer at 5 ∼ 100 mm/s.

Further, such a control unit 60 is composed of a matching unit 61, a high-frequency power source 62, and a common power source 63 of 220V, and the matching unit 61 sufficiently matches the impedance of the high-frequency load and the impedance of the transmission path so as to be connected to the plasma generating unit 31. The high frequency power source 62 provides a high frequency load, and the 220V conventional power source 63 supplies power to the matcher 61 and the high frequency power source.

The gas supply portion serves as a gas supply device for supplying one or more gases including argon gas, oxygen gas, and nitrogen gas, preferably installed along the width direction of the mold, and supplies the gas at a speed of 1 ∼ 50 L/min; The pressure regulator 33 and the flow regulator 34 are configured.

The gas storage tank 32 serves as a gas storage device for storing a gas of one of argon gas, oxygen gas, and nitrogen gas. In the present embodiment, the gas storage tank 32 is composed of an argon storage tank 32a for storing argon gas and an oxygen storage tank 32b for storing oxygen.

The pressure regulator 33 functions as a pressure adjusting device for adjusting the gas pressure of one of argon gas, oxygen gas and nitrogen gas. In the present embodiment, the argon gas pressure regulator 33a for adjusting the pressure of the argon gas and the oxygen pressure for regulating the pressure of the oxygen gas are used. The regulator 33b is constructed.

As such a pressure regulator, a 2-phase pressure regulator (2 Gauge Regulator) is preferably used to measure and control the pressure to adjust the gas pressures of argon, oxygen and nitrogen, respectively.

The flow regulator 34 serves as a flow regulating device for adjusting the flow rate of one of argon, oxygen and nitrogen, respectively. In the present embodiment, the argon flow regulator 34a for adjusting the flow rate of the argon gas and the oxygen flow regulator for regulating the flow rate of the oxygen are provided. 34b constitutes.

As such a flow regulator, an MFC (Mass Flow Controller) is preferably used in order to adjust the gas flow rates of argon, oxygen, and nitrogen, respectively, by using variations that do not vary with pressure and temperature. Quality, measurement and control flow.

The bonding portion 40 serves as a bonding device for stamping the pattern of the mold F and the substrate W for the plasma-treated mold to the substrate, by the chamber 41, the supporting device 42, the lifting device 43, the gear box 44, the driving device 45, and the hardening The device 46, the weight measuring device 47, and the stationary device 48 are constructed.

The chamber 41 serves as a vacuum space for the mold to enter and exit and maintain a vacuum state, and provides a joint space in a vacuum state in which the mold F and the substrate W are joined, so that the pattern of the mold can be punched on the substrate.

The supporting device 42 serves as a supporting device attached to the lower layer inside the chamber 41 and supports the substrate W, and adsorbs and supports the substrate by an adsorption force caused by a negative pressure like a suction disk or the like.

The lifting device 43 is provided as a lifting device that is attached to the lower portion of the supporting device 42 and that raises and lowers the substrate W and presses and presses the lower portion of the mold F, and receives the lifting driving force in the vertical direction like a bellows, and expands and contracts up and down.

The gear case 44 serves as a transmission member that is attached to the lower portion of the lifting device 43 and transmits the lifting/lowering driving force, and receives the transmission of the lifting/lowering force from the driving device 45, and transmits it to the lifting device 43.

The driving device 45 serves as a power source for supplying the lifting and lowering driving force to the lifting device 43, and is coupled to one of the gear boxes 44 to provide the lifting and lowering driving force to the lifting device 43 by using the gear box 44 as a medium.

The hardening device 46 is a hardening device that is attached to the upper layer inside the chamber 41 and hardens the stamped substrate, and is composed of a heating member such as an LED UV lamp to harden the pattern stamped on the upper portion of the substrate.

The load measuring device 47 measures the load as a measuring device mounted on the upper portion of the hardening device 46 like a load cell or the like to measure the pressure in the case where the substrate W is raised by means of the lifting device 43.

The fixing device 48 serves as a fixing device for fixing the front and rear sides of the mold F located inside the chamber 41 as the outside of the chamber 41, using a holding member such as a pliers, etc., in order to prevent the mold pattern from being shaken when the pattern is punched on the substrate. Or move.

The separation unit 50 is a separation device that separates the mold F and the substrate W joined to the joint portion 40, and is composed of an adsorption device 51, a vertical movement device 52, separation devices 53, 54 and a front-rear movement device 55.

The adsorption device 51 serves as a fixing device for fixing the substrate that is pressed at the joint portion 40 and bonded to the mold. In order to separate the mold and the substrate, the substrate is fixed by an adsorption force guided by a negative pressure like a suction disk.

The up-and-down moving device 52 functions as a moving device attached to the lower portion of the adsorption device 51 and moves the substrate up and down, and moves up and down using a linear moving member such as a linear motor or a hydraulic cylinder/air cylinder.

The separating apparatus 53, 54 as an apparatus for separating a mold from a substrate punched at the joint portion 40, comprising: a first separating roller 53, which separates the mold from the substrate by rolling; and a second separating roller 54, which is mounted thereon The upper portion of the first separation roller 53 guides the separated mold.

The first separation roller 53 is rolled on the upper portion of the mold as a roller member R attached to the lower portion of the separation device, and the die punched on the upper portion of the substrate is separated, transferred upward, and transmitted to the second separation roller 54.

The second separation roller 54 serves as a guide roller attached to the upper portion of the first separation roller 53 and guides the separated mold, and guides the mold separated by the first separation roller 53 downstream.

The front-rear moving device 55 is a moving device mounted on the side of the separating device and moving the separating device forward and backward, using a linear moving member such as a linear motor or a hydraulic cylinder/air cylinder to reciprocate back and forth.

In particular, between the discharge roller 21 and the separation portion 50, as the tension adjustment device 23 for measuring the adjustment of the mold tension which is changed by the separation device by the front-rear movement device 55, it is of course also possible to use the adjustment roller.

The imprint method using the imprint apparatus of this embodiment will be described in more detail below with reference to the drawings.

As shown in FIGS. 1 and 3, the imprint method using the imprint apparatus of the present embodiment includes a mold supply step S10, a surface reforming step S20, a bonding step S30, a separating step S40, a repeating step S50, and a discharging step S60. The configuration is a method of imprinting a pattern on a substrate W by using a mold F having a film shape formed on a surface thereof.

The mold supply step S10 is a step of transferring and supplying a film-shaped mold having a pattern on the surface in one direction, and in the first transfer unit 10, the film-shaped mold is unwound in one direction, and in the second transfer unit 20, A film-shaped mold is taken in one direction to supply the mold.

At this time, the diameter of the discharge roller 21 is measured, the moving distance of the mold is calculated, the mold is transferred in accordance with the predetermined moving distance, and the mold is supplied to the operating position of the surface reforming unit 30.

The surface reforming step S20 serves as a step of surface reforming the surface of the transferred mold by plasma processing, and performs surface reforming on the surface of the mold transferred to the surface reforming portion 30 by the plasma processing.

The step S30 is combined as a step of bonding the mold and the substrate so that the pattern of the plasma-treated mold can be stamped on the substrate, and the supporting device for adsorbing the substrate is moved while the mold is transferred in other directions by the reverse rotation of the transfer portion. 42 is raised, the mold and the substrate are joined and stamped, and hardened by means of the hardening device 46.

The separating step S40 is a step of separating the mold and the substrate joined in the bonding step S30, and the substrate is fixed by the adsorption device 51 while the mold to which the substrate is bonded is transferred in one direction by the positive rotation of the transfer portion. The mold and the substrate are separated from each other by means of rolling of the separating device.

Step S50 is repeated as the mold separated in the separating step S40 is transferred to the other direction, and the steps of the mold reforming step S20, the joining step S30, and the separating step S40 are repeated a plurality of times in sequence, and the mold is re-rotated by the reverse rotation of the transfer portion. The process is transferred to the surface reforming unit 30 and repeated several times or repeated five times.

The discharging step S60 is a step of transferring and discharging the separated mold. After the final repeating step, the mold separated in the separating step S40 is transferred to the discharge roller 21 by the positive rotation of the transfer portion, where the winding is performed. ,discharge.

As explained above, according to the present invention, a film-shaped mold having a pattern formed on the surface is reformed by plasma, the pattern is stamped on the substrate, and the substrate and the mold are separated, thereby providing plasma on the surface of the pattern. The pattern is printed and reformed, and the pattern printing time is shortened, and the printing performance is improved.

Further, the transfer unit is provided with a supply roller and a discharge roller, and is capable of facilitating the transfer and reverse transfer of the film-shaped mold by the forward rotation and the reverse rotation of the transfer portion, thereby improving the running property of the mold and improving the mold. Supply performance and discharge performance.

Further, a position detecting device that detects the traveling position of the mold is attached to the periphery of the supply roller or the discharge roller, thereby providing an effect that the traveling state of the mold for traveling can be easily grasped, and the subsequent process loss due to the running failure can be alleviated. .

In addition, a tension measuring device for measuring the tension of the mold is included on the outer circumference of the supply roller and the discharge roller, thereby providing an upper and lower position capable of arranging the mold, and while maintaining plasma uniformity of the pattern, the tension of the mold is maintained and the traveling performance is improved. Effect.

Further, the tension measuring device is linked to the control unit that controls the rotational speeds of the supply roller and the discharge roller, thereby providing an effect of easily adjusting the tension of the mold in accordance with the rotational speed control of the supply roller and the discharge roller by the control unit.

Further, the surface reforming unit includes a plasma generating unit that is connected to a high frequency, and the interval between the mold and the plasma generating unit and the transfer speed of the mold are limited to a predetermined value, thereby providing plasma processing performance while improving plasma processing performance. Improve the effect of poor plasma processing.

In addition, as the joint portion, a chamber, a supporting device, a lifting device, a hardening device, and a fixing device are provided, thereby providing a mold that can be punched on the substrate and improving pattern adhesion while easily performing bonding between the substrate and the mold. Performance effect.

Further, the separation unit includes an adsorption device, a vertical movement device, a separation device, and a front-rear movement device, thereby providing an effect of facilitating separation between the substrate and the mold while improving the separation performance of the mold.

The above-described creations can be implemented in various other forms without departing from the technical idea or main features. Therefore, the described embodiments are merely exemplary in all aspects and are not to be construed as limiting.

10‧‧‧First Transfer Department
11‧‧‧Supply roller
12‧‧‧First position measuring equipment
13‧‧‧Guide Roller
14‧‧‧Tensometer
20‧‧‧Second Transfer Department
21‧‧‧ discharge roller
22‧‧‧Second position measuring equipment
23‧‧‧Second tension measuring equipment
30‧‧‧Surface reforming
31‧‧‧ Plasma Generation Department
32‧‧‧ gas storage tank
33‧‧‧pressure regulator
34‧‧‧Flow Regulator
40‧‧‧Combination Department
41‧‧‧ chamber
42‧‧‧Support equipment
43‧‧‧ lifting equipment
44‧‧‧ Gearbox
45‧‧‧Drive equipment
46‧‧‧ Hardening equipment
47‧‧‧ Weight measuring equipment
48‧‧‧Fixed equipment
50‧‧‧Departure Department
51‧‧‧Adsorption equipment
52‧‧‧Up and down mobile devices
53‧‧‧Separation equipment
54‧‧‧Separation equipment
55‧‧‧ Before and after mobile devices
60‧‧‧Control Department
61‧‧‧matcher
62‧‧‧High frequency power supply
63‧‧‧Common power supply
32a‧‧‧Argon storage tank
32b‧‧‧Oxygen storage tank
33a‧‧‧ Argon Pressure Regulator
33b‧‧‧Oxygen pressure regulator
34a‧‧‧ Argon flow regulator
34b‧‧‧Oxygen flow regulator
F‧‧‧Mold
M‧‧‧Rotary drive equipment
R‧‧‧roller components
S10, S20, S30, S40, S50, S60‧‧ steps
W‧‧‧Substrate

Fig. 1 is a view showing the configuration of an imprint apparatus of an embodiment of the present invention.

Fig. 2 is a view showing a state of a surface reforming portion of the imprint apparatus of one embodiment of the present invention.

Fig. 3 is a view showing the construction of an imprint method of an embodiment of the present invention.

Claims (15)

An imprint apparatus comprising: a transfer portion that transfers a mold in the form of a film having a pattern formed on one surface in one direction and the other direction; a surface reforming portion that utilizes a plasma, and the processing is performed by means of the transfer a surface of the pattern transferred; a joint portion that joins the mold and a substrate such that the pattern of the mold processed by the plasma can be stamped on the substrate; and a separation portion that is bonded to the portion The mold and the substrate are separated. The embossing device according to claim 1, wherein the transfer portion comprises: a supply roller that unwinds in one direction, supplies and transfers the mold, and winds and reverses the mold in other directions; and The discharge roller is wound up in one direction, supplied and transferred to the mold, unwound in other directions, and reversely transferred to the mold. The imprint apparatus of claim 2, wherein at least one of the supply roller and the joint portion and between the discharge roller and the separation portion includes detecting a center or a side of the mold A position measuring device for the position of the end. The imprint apparatus according to claim 3, wherein the position measuring device and a position correcting device that corrects a position of a center or a side end portion of the mold are interlocked. The imprint apparatus according to claim 2, wherein at least one of the supply roller and the joint portion and between the discharge roller and the separation portion includes a one for measuring a tension of the mold Tension measuring equipment. The imprint apparatus according to claim 5, wherein the tension measuring device and a control unit that controls the rotation speed of the supply roller and the discharge roller are interlocked. The imprint apparatus according to claim 1, wherein the surface reforming portion includes a plasma generating portion that is connected to the high frequency, and the interval between the mold and the plasma generating portion is 1 ∼ 10 mm. When the surface of the pattern of the mold was treated with the plasma, the mold was transferred at 5 ∼ 100 mm/s. The embossing apparatus according to claim 7, wherein the surface reforming unit further comprises a gas supply unit that supplies one or more gases including argon gas, oxygen gas, and nitrogen gas. The imprint apparatus of claim 8, wherein the gas supply portion is mounted along a width direction of the mold. The imprint apparatus according to claim 8, wherein the gas supply unit supplies a gas at a speed of 1 ∼ 50 L/min. The embossing device of claim 1, wherein the bonding portion comprises: a chamber for the mold to enter and exit to maintain a vacuum state; and a supporting device mounted on the inner lower layer of the chamber, Supporting the substrate; a lifting device for lifting and lowering the substrate in the lower portion of the supporting device, pressurizing and stamping the mold; and a hardening device mounted on the inner upper layer of the chamber to make the stamped The substrate is hardened. The imprint apparatus of claim 11, wherein the joint further comprises a fixing device that fixes the front and rear sides of the mold inside the chamber outside the chamber. The embossing device according to claim 1, wherein the separating portion comprises: an absorbing device that fixes the substrate that is stamped at the joint portion and combined with the mold; and an up-and-down moving device that is mounted on a lower portion of the adsorption device for moving the substrate up and down; a separating device for separating the mold from the substrate stamped at the joint; and a front and rear moving device mounted to one side of the separating device to make the separating device forward, backward. The embossing apparatus of claim 13, wherein the separating apparatus comprises: a first separating roller that separates the mold from the substrate; and a second separating roller that is mounted to the first separating The upper part of the roll guides the separated mold. The imprint apparatus of claim 13, wherein an adjustment roller is included between a discharge roller and the separation portion, the adjustment roller adjustment being changed as the separation device moves by means of the front and rear mobile device The tension of the mold.