WO2018168608A1 - Pressure sensor - Google Patents

Pressure sensor Download PDF

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Publication number
WO2018168608A1
WO2018168608A1 PCT/JP2018/008776 JP2018008776W WO2018168608A1 WO 2018168608 A1 WO2018168608 A1 WO 2018168608A1 JP 2018008776 W JP2018008776 W JP 2018008776W WO 2018168608 A1 WO2018168608 A1 WO 2018168608A1
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WO
WIPO (PCT)
Prior art keywords
insulating sheet
pressure
lead pins
pressure sensor
housing
Prior art date
Application number
PCT/JP2018/008776
Other languages
French (fr)
Japanese (ja)
Inventor
和哉 滝本
Original Assignee
株式会社鷺宮製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社鷺宮製作所 filed Critical 株式会社鷺宮製作所
Priority to CN201880018027.XA priority Critical patent/CN110418950B/en
Publication of WO2018168608A1 publication Critical patent/WO2018168608A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure

Definitions

  • the present invention relates to a pressure sensor, and more particularly, to a liquid-sealed pressure sensor that is disposed in a liquid-sealed chamber in which a semiconductor sensor chip is filled with sealed oil.
  • Pressure sensors include refrigerant pressure sensors for refrigeration, refrigeration and air conditioning equipment, water pressure sensors for water supply and industrial pumps, steam pressure sensors for steam boilers, air / hydraulic sensors for air / hydraulic industrial equipment, automobile pressure sensors, It is used for various purposes.
  • a pressure sensor for detecting fluid pressure for example, as disclosed in Patent Document 1, a liquid-sealed pressure sensor in which a semiconductor pressure sensor chip is disposed in a liquid-sealed chamber filled with sealed oil. Is conventionally known.
  • the fluid pressure of the fluid in the pressure chamber acting on the diaphragm partitioning the pressure chamber and the liquid-sealed chamber is transmitted to the semiconductor sensor chip via the sealed oil in the liquid-sealed chamber, and the fluid fluid Pressure is detected.
  • a plurality of lead pins are connected to the semiconductor sensor chip via bonding wires, and power supply, transmission of detected pressure signals, various adjustments, and the like are performed via the plurality of lead pins.
  • hermetic glass is sealed around the liquid sealing chamber, and a plurality of lead pins are also fixed by the hermetic glass.
  • a housing made of metal or the like is disposed around the hermetic glass in order to maintain strength.
  • the liquid-sealed pressure sensor described in Patent Document 1 as described above has a problem that an internal circuit of the semiconductor sensor chip is damaged by electrostatic discharge (ESD).
  • ESD electrostatic discharge
  • an ESD protection circuit may be incorporated in the semiconductor sensor chip.
  • due to the recent downsizing of the semiconductor sensor chip it is difficult to secure the area of the ESD protection circuit, and the incorporation of such a circuit also leads to an increase in the unit price of the semiconductor sensor chip.
  • the electrostatic withstand voltage is improved by filling an adhesive having a higher withstand voltage than air between the lead pin and the housing.
  • an adhesive having a higher withstand voltage than air between the lead pin and the housing.
  • the flow of the adhesive is not stable, and a large amount of adhesive is required, which may cause interference with other parts or jigs.
  • an object of the present invention is to provide a pressure sensor that can stably maintain a high electrostatic withstand voltage without using a large amount of adhesive regardless of the presence or absence of an ESD protection circuit.
  • a pressure sensor is a semiconductor sensor that is liquid-sealed in a liquid-sealed chamber filled with sealed oil, and the pressure of the fluid introduced into the pressure chamber is detected via the sealed oil.
  • a chip a plurality of lead pins connected to the semiconductor sensor chip with bonding wires, constituting external input / output terminals of the semiconductor sensor chip, connected to the connection terminals, and hermetic glass holding the plurality of lead pins;
  • a metal housing that is arranged around a plurality of lead pins and holds the hermetic glass, and an insulation that is arranged around the plurality of lead pins extending from the hermetic glass and covers the surface of the housing on the connection terminal side And a sheet.
  • the space between the insulating sheet and the surface of the hermetic glass on the connection terminal side and the surface of the housing on the connection terminal side may be sealed with an insulating adhesive.
  • the internal circuit of the semiconductor sensor chip can be further prevented from being damaged by electrostatic discharge.
  • an inclined surface is provided on the inner peripheral portion of the surface on the connection terminal side of the housing, and the insulating adhesive penetrates into a gap between the inclined surface of the housing and the insulating sheet. It may be a thing.
  • a through hole into which the insulating adhesive is injected may be formed at the center of the insulating sheet.
  • At least one notch may be formed on the inner peripheral surface of the through hole.
  • the insulating adhesive can be uniformly permeated by the surface tension by the cutout and the lead pin close to the cutout.
  • a bubble removal hole may be formed around the through hole of the insulating sheet.
  • the air bubbles generated inside the insulating adhesive can be discharged from the air vent hole to improve insulation.
  • a plurality of the bubble removal holes may be formed, and the plurality of bubble removal holes may be formed at positions corresponding to the entire circumference of the insulating sheet.
  • a high electrostatic withstand voltage can be stably maintained without using a large amount of adhesive regardless of the presence or absence of an ESD protection circuit.
  • FIG. 1 is a longitudinal sectional view showing an entire liquid-sealed pressure sensor 100 as an example of the pressure sensor of the present invention.
  • a liquid ring-type pressure sensor 100 includes a fluid introduction unit 110 that introduces a fluid whose pressure is detected into a pressure chamber 112A described later, a pressure detection unit 120 that detects the pressure of the fluid in the pressure chamber 112A, and a pressure A signal sending unit 130 that sends the pressure signal detected by the detection unit 120 to the outside, and a fluid introduction unit 110, a pressure detection unit 120, and a connection member 140 that connects the signal sending unit 130 are provided.
  • the fluid introduction part 110 is connected by welding or the like to a metal joint member 111 connected to a pipe through which a fluid whose pressure is detected is guided, and an end part connected to the pipe of the joint member 111. And a metal base plate 112 having a bowl shape.
  • the joint member 111 is formed with a female screw portion 111a that is screwed into a male screw portion of a pipe connection portion, and a port 111b that guides the fluid introduced from the pipe to the pressure chamber 112A.
  • the opening end of the port 111b is connected to an opening provided in the center of the base plate 112 by welding or the like.
  • the joint member 111 is provided with the female thread portion 111a.
  • the joint member 111 may be provided with a male thread, or a copper connection pipe may be connected instead of the joint member 111.
  • the base plate 112 has a bowl shape that widens toward the side facing the joint member 111, and forms a pressure chamber 112A between the base plate 112 and a diaphragm 122 described later.
  • the pressure detection unit 120 includes a housing 121 having a through-hole, a diaphragm 122 that partitions the above-described pressure chamber 112A and a liquid sealing chamber 124A described later, a protective cover 123 disposed on the pressure chamber 112A side of the diaphragm 122, Arranged in the center of the hermetic glass 124, a hermetic glass 124 fitted into the through hole of the housing 121, a liquid sealing chamber 124 A filled with sealed oil between the recess 122 on the pressure chamber 112 A side of the hermetic glass 124 and the diaphragm 122.
  • the housing 121 is formed of a metal material such as an Fe / Ni alloy or stainless steel in order to maintain the strength around the hermetic glass 124.
  • the diaphragm 122 and the protective cover 123 are both formed of a metal material, and are both welded at the outer peripheral edge portion of the through hole on the pressure chamber 112 ⁇ / b> A side of the housing 121.
  • the protective cover 123 is provided inside the pressure chamber 112A to protect the diaphragm 122, and is provided with a plurality of communication holes 123a through which the fluid introduced from the fluid introduction unit 110 passes. After the pressure detection unit 120 is assembled, the housing 121 is welded from the outside by TIG welding, plasma welding, laser welding, or the like at the outer peripheral edge of the base plate 112 of the fluid introduction unit 110.
  • the hermetic glass 124 protects the liquid sealing chamber 124A in which the semiconductor sensor chip 126 is sealed from ambient environmental conditions such as humidity, dust, and heat in the air, and holds the plurality of lead pins 128. It is provided to insulate the housing 121.
  • a semiconductor sensor chip 126 is supported by an adhesive or the like on the liquid sealing chamber 124 ⁇ / b> A side of the column 125 disposed in the center of the hermetic glass 124.
  • the support column 125 is formed of an Fe / Ni alloy, but is not limited thereto, and may be formed of other metal materials such as stainless steel. Further, the support 125 may be provided directly without being provided on the flat surface that forms the concave portion of the hermetic glass 124.
  • a diaphragm made of a material such as single crystal silicon having a piezoresistive effect, and a plurality of semiconductor strain gauges formed on the diaphragm, and a bridge circuit in which these semiconductor strain gauges are bridge-connected.
  • an integrated circuit such as an amplifier circuit or an arithmetic processing circuit for processing the output from the bridge circuit.
  • the semiconductor sensor chip 126 is connected to a plurality of lead pins 128 by, for example, bonding wires 126 a made of gold or aluminum, and the plurality of lead pins 128 constitutes an external input / output terminal of the semiconductor sensor chip 126.
  • the fluid introduced from the pipe is introduced from the joint member 111 into the pressure chamber 112A and presses the diaphragm 122.
  • the pressure applied to the diaphragm 122 is transmitted to the semiconductor sensor chip 126 through the sealed oil in the liquid sealing chamber 124A.
  • the silicon diaphragm of the semiconductor sensor chip 126 is deformed by this pressure, and the pressure is converted into an electrical signal by a bridge circuit using a piezoresistive element, and output from the integrated circuit of the semiconductor sensor chip 126 to a plurality of lead pins 128 via bonding wires 126a. Is done.
  • the potential adjusting member 127 places the semiconductor sensor chip 126 in a non-electric field (zero potential), and the inside of the chip is affected by the potential generated between the frame ground and the secondary power source. It is provided to prevent the circuit and the like from being adversely affected.
  • the potential adjusting member 127 is disposed between the semiconductor sensor chip 126 and the diaphragm 122 in the liquid sealing chamber 124A, is formed of a conductive material such as metal, and is connected to a terminal connected to the zero potential of the semiconductor sensor chip 126. Connected.
  • a plurality of lead pins 128 and an oil filling pipe 129 are fixed to the hermetic glass 124 by hermetic treatment in a penetrating state.
  • a total of eight lead pins 128 are provided as the lead pins 128. That is, three lead pins 128 for external input / output (Vout), drive voltage supply (Vcc), and ground (GND) are provided, and five lead pins 128 are provided as adjustment terminals for the semiconductor sensor chip 126. Yes. In FIG. 1, four of the eight lead pins 128 are shown.
  • the oil filling pipe 129 is provided to fill the inside of the liquid sealing chamber 124A with, for example, silicone oil or a fluorine-based inert liquid as sealed oil.
  • One end portion of the oil filling pipe 129 is crushed and closed as shown in FIG. 1 after the oil filling.
  • the signal sending unit 130 is fixed to the connector housing 131 for external connection provided on the opposite side of the pressure chamber 112 ⁇ / b> A of the pressure detection unit 120, the external output board 132 connected to the plurality of lead pins 128, and the connector housing 131. And a connection terminal 133 connected to the external output substrate 132.
  • the connector housing 131 is formed of an insulating resin or the like, and is connected to an external connector together with the connection terminal 133.
  • a plurality of lead pins 128 extending from the hermetic glass 124, an external output substrate 132, and the like are disposed.
  • the external output board 132 is formed of a flexible material such as a flexible printed circuit board (FPC), and connects the connection terminals 133 fixed to the connector housing 131 and the plurality of lead pins 128.
  • FPC flexible printed circuit board
  • connection member 140 includes a caulking cover 141 that fixes the fluid introduction unit 110, the pressure detection unit 120, and the signal transmission unit 130 by caulking, and an O-ring 142 that is disposed between the pressure detection unit 120 and the connector housing 131. Is provided.
  • the caulking cover 141 is formed in a cylindrical shape with a metal such as copper.
  • the caulking cover 141 is disposed around the assembled pressure detection unit 120 after the fluid introduction unit 110 is fixed by welding or the like, together with the signal transmission unit 130, with the O-ring 142 interposed therebetween. Caulking is performed and these are fixed.
  • the O-ring 142 is disposed between the pressure detection unit 120 and the signal transmission unit 130 and fulfills these waterproof and dustproof functions.
  • the pressure sensor 100 of the present invention further includes an ESD protection member 150.
  • the ESD protection member 150 is disposed around the plurality of lead pins 128 and is disposed in a space between the insulating sheet 151 covering the upper surface of the housing 121 and the upper surface of the hermetic glass 124 and the upper surface of the housing 121, and has a predetermined withstand voltage.
  • an adhesive 152 having.
  • the insulating sheet 151 prevents electrostatic discharge (ESD: Electro-Static Discharge) from occurring between the metal housing 121 and the plurality of lead pins 128 and damages the internal circuit of the semiconductor sensor chip 126 when static electricity is applied.
  • ESD Electro-Static Discharge
  • the shape of the insulating sheet 151 is formed in a shape having a through hole 151a in the center because the plurality of lead pins 128 extend from the hermetic glass 124 in the center, but is not limited thereto.
  • the material of the insulating sheet 151 is a transparent polyester sheet having a predetermined withstand voltage, and an adhesive acrylic sheet is pasted, but is not limited thereto.
  • the adhesive 152 is applied to the center of the hermetic glass 124 from the through hole 151 a provided in the center of the insulating sheet 151. Since the adhesive 152 has a predetermined withstand voltage higher than that of air, the adhesive 152 is provided for ESD protection like the insulating sheet 151.
  • the adhesive 152 is provided with an inclined surface on the inner peripheral portion of the upper surface of the housing 121, and permeates the gap between the inclined surface of the housing 121 and the insulating sheet 151, and thereby the withstand voltage is increased. Is increasing.
  • providing the housing 121 with the inclined surface makes it easy to incorporate the hermetic glass 124 and has an effect of improving workability.
  • both the insulating sheet 151 and the adhesive 152 are provided. However, when the desired ESD protection performance can be ensured only by the insulating sheet 151, only the insulating sheet 151 may be provided. Further, when the insulating sheet 151 does not have the through hole 151 a, the adhesive 152 may be directly applied to the inner peripheral portion of the upper surface of the hermetic glass 124 and the upper surface of the housing 121.
  • FIG. 2 is a plan view showing an example 151A of the shape of the insulating sheet of the pressure sensor 100 of the present invention.
  • the insulating sheet 151 ⁇ / b> A is provided with a through hole 151 ⁇ / b> Aa at the center, and further, a plurality of notches 151 ⁇ / b> Ab are provided on the inner periphery of the through hole 151 ⁇ / b> Aa. Between the plurality of notches 151Ab, the inner peripheral portion of the through hole 151Aa partially remains as a protrusion, and is close to the plurality of lead pins 128. For this reason, the adhesive 152 applied to the center of the hermetic glass 124 from the through hole 151Aa uniformly penetrates the entire circumference due to the surface tension.
  • the insulating sheet 151 ⁇ / b> A has a plurality of circular air vents 151 ⁇ / b> Ac for discharging air bubbles generated inside the adhesive 152 when the adhesive 152 is cured, which will be described in detail below. Moreover, the further effect which provided several notch 151Ab is demonstrated below using FIG.3 and FIG.4.
  • FIG. 3 is a longitudinal sectional view of a main part for explaining a problem when the insulating sheet 151 having no notch is used.
  • FIG. 4 is a longitudinal sectional view of a main part for explaining the case where the insulating sheet 151A shown in FIG. 2 is used.
  • the adhesive 152A may permeate through a plurality of notches 151Ab provided on the inner periphery of the through-hole 151Aa, and the adhesive 152A may permeate from a portion not in contact with the protrusion on the upper surface of the hermetic glass 124 on the side surface of the notch 151Ab. it can. Thereby, the adhesive 152A can be evenly distributed over the entire circumference of the upper surface of the hermetic glass 124, and a desired withstand voltage by the adhesive 152A can be maintained.
  • FIG. 5 is a longitudinal sectional view for explaining the case where the insulating sheet 151A shown in FIG. 2 is used and bubbles remain inside the adhesive 152B.
  • the silicone-based adhesive 152 ⁇ / b> B having a long curing time may be generally cured by heating to a high temperature. At this time, if there is moisture in or around the adhesive 152B, as shown in FIG. 5, water vapor is generated to form bubbles, and if the generated bubbles remain in the cured adhesive, the effective of the adhesive 152B Therefore, there is a possibility that the desired ESD protection performance cannot be ensured because the dielectric thickness is reduced and the static electricity passes through the breakdown route shown in FIG.
  • FIG. 6 is a plan view showing another example 151B of the shape of the insulating sheet.
  • the insulating sheet 151 ⁇ / b> B is formed at a position corresponding to the entire circumference of the insulating sheet 151 ⁇ / b> B instead of the plurality of circular bubble vent holes 151 ⁇ / b> Ac as compared to the insulating sheet 151 ⁇ / b> A shown in FIG. 2.
  • the difference is that a plurality of elongated holes 151Bc are formed, and other configurations are the same. Similar components are denoted by the same reference numerals, and description thereof is omitted.
  • the air bubble removal hole 151Bc is formed at a position corresponding to the entire circumference of the insulating sheet 151B, the air bubbles shown in FIG. 5 are discharged to the upper part during curing, and the above-mentioned problems are solved. I understood it.
  • the insulating sheet 151B shown in FIG. 6 is formed with a plurality of bubble vent holes 151Bc which are a plurality of arc-shaped long holes formed around the through hole formed in the center. Since the plurality of bubble removal holes 151Bc are formed in steps, they can be formed at positions corresponding to the entire circumference of the insulating sheet 151B.
  • the present invention is not limited to this, and a material that is slow in curing and easily generates bubbles. And all other adhesives 152 of the curing method.
  • the pressure sensor 100 has been described as an example of the pressure sensor of the present invention, the present invention is not limited to this, and the present invention is applicable to all liquid-sealed pressures for liquid-sealing a semiconductor sensor chip in a liquid-sealed chamber. Applicable to sensors.
  • a high electrostatic withstand voltage can be stably maintained without using a large amount of adhesive regardless of the presence or absence of an ESD protection circuit.
  • Pressure sensor 110 Fluid introducing

Abstract

The purpose of the present invention is to provide a pressure sensor that is capable of stably maintaining a high static electricity breakdown voltage without using large amounts of an adhesive irrespective of whether an ESD protection circuit is present. A pressure sensor (100) according to the present invention is characterized by being provided with: a semiconductor sensor chip (126) that is liquid-sealed in a liquid sealing chamber (124A) and that detects the pressure of a fluid introduced into a pressure chamber (112A); a plurality of lead pins (128) that are connected to the semiconductor sensor chip (126) through bonding wires (126a) and connected to a connection terminal (133); a hermetic glass (124) that protects the liquid sealing chamber (124A) from the surrounding environmental conditions, and holds the lead pins (128); and a metal housing (121) that is disposed around the lead pins (128) and holds the hermetic glass (124), and further being provided with an insulating sheet (151) that is disposed around the lead pins (128) extending from the hermetic glass (124) and covers a surface, on the connection terminal (133) side, of the housing (121).

Description

圧力センサPressure sensor
　本発明は、圧力センサに関し、特に半導体センサチップを封入オイルで充填した液封室に配置する液封型の圧力センサに関する。 The present invention relates to a pressure sensor, and more particularly, to a liquid-sealed pressure sensor that is disposed in a liquid-sealed chamber in which a semiconductor sensor chip is filled with sealed oil.
　圧力センサは、冷凍、冷蔵、空調機器用の冷媒圧力センサ、給水、産業用ポンプ等の水圧センサ、蒸気ボイラの蒸気圧センサ、空／油圧産業機器の空／油圧センサ、自動車の圧力センサ等、各種の用途に使用されている。 Pressure sensors include refrigerant pressure sensors for refrigeration, refrigeration and air conditioning equipment, water pressure sensors for water supply and industrial pumps, steam pressure sensors for steam boilers, air / hydraulic sensors for air / hydraulic industrial equipment, automobile pressure sensors, It is used for various purposes.
　このような圧力センサのうち流体圧検出用の圧力センサとして、例えば、特許文献１に開示されるように、半導体圧力センサチップを封入オイルで充填した液封室に配置した液封型の圧力センサが従来から知られている。 Among such pressure sensors, as a pressure sensor for detecting fluid pressure, for example, as disclosed in Patent Document 1, a liquid-sealed pressure sensor in which a semiconductor pressure sensor chip is disposed in a liquid-sealed chamber filled with sealed oil. Is conventionally known.
　液封型の圧力センサでは、圧力室と液封室を区画するダイヤフラムに作用する圧力室の流体の流体圧が、液封室内の封入オイルを介して、半導体センサチップに伝達され、流体の流体圧が検出される。半導体センサチップには、ボンディングワイヤを介して複数のリードピンが接続され、複数のリードピンを介して、電源供給、及び、検出された圧力信号の送出、各種調整などが行われる。また、液封室を空気中の湿気や埃、熱などの環境条件から保護するため、液封室の周囲には、ハーメチックガラスが封着され、複数のリードピンもハーメチックガラスにより固定される。また、ハーメチックガラスの周囲には、強度を保つために、金属製等のハウジングが配置される。 In the liquid-sealed pressure sensor, the fluid pressure of the fluid in the pressure chamber acting on the diaphragm partitioning the pressure chamber and the liquid-sealed chamber is transmitted to the semiconductor sensor chip via the sealed oil in the liquid-sealed chamber, and the fluid fluid Pressure is detected. A plurality of lead pins are connected to the semiconductor sensor chip via bonding wires, and power supply, transmission of detected pressure signals, various adjustments, and the like are performed via the plurality of lead pins. Further, in order to protect the liquid sealing chamber from environmental conditions such as moisture, dust and heat in the air, hermetic glass is sealed around the liquid sealing chamber, and a plurality of lead pins are also fixed by the hermetic glass. In addition, a housing made of metal or the like is disposed around the hermetic glass in order to maintain strength.
特開２００５－３０８３９７号公報JP 2005-308397 A 特許第３９８７３８６号公報Japanese Patent No. 3987386
　しかしながら、上述のような特許文献１に記載の液封型の圧力センサでは、静電気放電（ＥＳＤ：Electro-Static Discharge）により、半導体センサチップの内部回路が破損するという問題がある。このような問題の対策として、半導体センサチップ内にＥＳＤ保護回路を組み込むことも考えられる。しかしながら、昨今の半導体センサチップのダウンサイジングにより、ＥＳＤ保護回路の面積を確保するのが難しく、また、このような回路の組み込みは、半導体センサチップの単価の高騰にも繋がる。 However, the liquid-sealed pressure sensor described in Patent Document 1 as described above has a problem that an internal circuit of the semiconductor sensor chip is damaged by electrostatic discharge (ESD). As a countermeasure against such a problem, an ESD protection circuit may be incorporated in the semiconductor sensor chip. However, due to the recent downsizing of the semiconductor sensor chip, it is difficult to secure the area of the ESD protection circuit, and the incorporation of such a circuit also leads to an increase in the unit price of the semiconductor sensor chip.
　このような問題を改善するために、リードピンとハウジングの間に空気より絶縁耐圧の高い接着剤を充填させることにより静電気耐圧を向上させている。しかしながら、このような接着剤を使用する方法では、接着剤の流れ方が安定せず、多量の接着剤を必要とするため、他の部品または治具との干渉が発生するおそれがある。 In order to improve such a problem, the electrostatic withstand voltage is improved by filling an adhesive having a higher withstand voltage than air between the lead pin and the housing. However, in the method using such an adhesive, the flow of the adhesive is not stable, and a large amount of adhesive is required, which may cause interference with other parts or jigs.
　従って、本発明の目的は、ＥＳＤ保護回路の有無によらず、多量の接着剤を使用することなく、安定して高い静電気耐圧を維持できる圧力センサを提供することである。 Therefore, an object of the present invention is to provide a pressure sensor that can stably maintain a high electrostatic withstand voltage without using a large amount of adhesive regardless of the presence or absence of an ESD protection circuit.
　上記課題を解決するために、本発明の圧力センサは、封入オイルが充填された液封室に液封され、圧力室に導入された流体の圧力が上記封入オイルを介して検出される半導体センサチップと、上記半導体センサチップにボンディングワイヤで接続され、上記半導体センサチップの外部入出力端子を構成し、接続端子に接続される複数のリードピンと、上記複数のリードピンを保持するハーメチックガラスと、上記複数のリードピンの周囲に配置され、上記ハーメチックガラスを保持する金属製のハウジングと、上記ハーメチックガラスから延出した上記複数のリードピンの周囲に配置され、上記ハウジングの前記接続端子側の面を覆う絶縁シートとを備えることを特徴とする。 In order to solve the above-described problems, a pressure sensor according to the present invention is a semiconductor sensor that is liquid-sealed in a liquid-sealed chamber filled with sealed oil, and the pressure of the fluid introduced into the pressure chamber is detected via the sealed oil. A chip, a plurality of lead pins connected to the semiconductor sensor chip with bonding wires, constituting external input / output terminals of the semiconductor sensor chip, connected to the connection terminals, and hermetic glass holding the plurality of lead pins; A metal housing that is arranged around a plurality of lead pins and holds the hermetic glass, and an insulation that is arranged around the plurality of lead pins extending from the hermetic glass and covers the surface of the housing on the connection terminal side And a sheet.
　このように、ハウジングの上面に絶縁シートを設けたことにより、ＥＳＤ保護回路の有無によらず静電気放電による半導体センサチップの内部回路の破損を防止できる。 Thus, by providing the insulating sheet on the upper surface of the housing, damage to the internal circuit of the semiconductor sensor chip due to electrostatic discharge can be prevented regardless of the presence or absence of the ESD protection circuit.
　また、上記絶縁シートと、上記ハーメチックガラスの上記接続端子側の面及び上記ハウジングの上記接続端子側の面との間の空間が絶縁性接着剤により封止されるものとしてもよい。 The space between the insulating sheet and the surface of the hermetic glass on the connection terminal side and the surface of the housing on the connection terminal side may be sealed with an insulating adhesive.
　このように、絶縁シートとハーメチックガラスとハウジングとの間の空間が絶縁性接着剤で封止されたことにより、さらに静電気放電による半導体センサチップの内部回路の破損を防止できる。 Thus, since the space between the insulating sheet, the hermetic glass, and the housing is sealed with the insulating adhesive, the internal circuit of the semiconductor sensor chip can be further prevented from being damaged by electrostatic discharge.
　また、上記ハウジングの上記接続端子側の面の内周部には、傾斜の面が設けられ、上記ハウジングの上記傾斜面と上記絶縁シートとの間の隙間に、上記絶縁性接着剤が浸透するものとしてもよい。 In addition, an inclined surface is provided on the inner peripheral portion of the surface on the connection terminal side of the housing, and the insulating adhesive penetrates into a gap between the inclined surface of the housing and the insulating sheet. It may be a thing.
　このように、ハウジングの内周面に傾斜面を設けたことにより、ハウジングと絶縁シートの間に確実に空間を形成することができ絶縁性接着剤を浸透させることができる。 Thus, by providing the inclined surface on the inner peripheral surface of the housing, a space can be surely formed between the housing and the insulating sheet, and the insulating adhesive can be permeated.
　また、上記絶縁シートの中央には、上記絶縁性接着剤が注入される貫通孔が形成されるものとしてもよい。 Further, a through hole into which the insulating adhesive is injected may be formed at the center of the insulating sheet.
　このように、絶縁シートの中央に貫通孔を設けたことにより、絶縁性接着剤を中央１箇所に塗布することで一定量の接着剤を安定して供給できる。 Thus, by providing the through-hole in the center of the insulating sheet, a certain amount of adhesive can be stably supplied by applying the insulating adhesive to one center.
　また、上記貫通孔の内周面には、少なくとも１つの切り欠きが形成されるものとしてもよい。 Further, at least one notch may be formed on the inner peripheral surface of the through hole.
　このように、絶縁シートの貫通孔に切り欠きを設けたことにより、切り欠きと切り欠きに近接したリードピンとにより絶縁性接着剤を表面張力により全周に均一に浸透させることができる。 Thus, by providing a cutout in the through hole of the insulating sheet, the insulating adhesive can be uniformly permeated by the surface tension by the cutout and the lead pin close to the cutout.
　また、上記絶縁シートの上記貫通孔の周囲には、気泡抜き穴が形成されるものとしてもよい。 Further, a bubble removal hole may be formed around the through hole of the insulating sheet.
　このように、気泡抜き穴が設けられたことにより、絶縁性接着剤の内部に発生した気泡が気泡抜き穴から排出され絶縁性を向上できる。 Thus, by providing the air vent hole, the air bubbles generated inside the insulating adhesive can be discharged from the air vent hole to improve insulation.
　また、上記気泡抜き穴は、複数形成され、複数の気泡抜き穴は、上記絶縁シートの全周に対応する位置に形成されるものとしてもよい。 Also, a plurality of the bubble removal holes may be formed, and the plurality of bubble removal holes may be formed at positions corresponding to the entire circumference of the insulating sheet.
　このように、全周に相当する位置に気泡抜き穴を設けたことにより、気泡が発生し残留しやすい絶縁性接着剤を使用した場合に、気泡の排出を促し絶縁性を向上できる。 As described above, by providing a bubble vent at a position corresponding to the entire circumference, when an insulating adhesive that is likely to generate bubbles and remain is used, it is possible to promote discharge of bubbles and improve insulation.
　本発明の圧力センサによれば、ＥＳＤ保護回路の有無によらず、多量の接着剤を使用することなく、安定して高い静電気耐圧を維持できる。 According to the pressure sensor of the present invention, a high electrostatic withstand voltage can be stably maintained without using a large amount of adhesive regardless of the presence or absence of an ESD protection circuit.
本発明の圧力センサの一例として液封形の圧力センサの全体を示す縦断面図である。It is a longitudinal cross-sectional view which shows the whole liquid-sealed pressure sensor as an example of the pressure sensor of this invention. 本発明の圧力センサの絶縁シートの形状の一例を示す平面図である。It is a top view which shows an example of the shape of the insulating sheet of the pressure sensor of this invention. 切り欠きがない絶縁シートを使用した場合の問題点を説明する要部の縦断面図である。It is a longitudinal cross-sectional view of the principal part explaining the problem at the time of using the insulating sheet without a notch. 図２に示す絶縁シートを使用した場合を説明する要部の縦断面図である。It is a longitudinal cross-sectional view of the principal part explaining the case where the insulating sheet shown in FIG. 2 is used. 図２に示す絶縁シートを使用し、気泡が接着剤内部に残留した場合を説明する要部の縦断面図である。It is a longitudinal cross-sectional view of the principal part explaining the case where the insulating sheet shown in FIG. 2 is used and bubbles remain inside the adhesive. 絶縁シートの別の例を示す平面図である。It is a top view which shows another example of an insulating sheet.
　以下、本発明の実施形態を、図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　図１は、本発明の圧力センサの一例として液封形の圧力センサ１００の全体を示す縦断面図である。 FIG. 1 is a longitudinal sectional view showing an entire liquid-sealed pressure sensor 100 as an example of the pressure sensor of the present invention.
　図１において、液封型の圧力センサ１００は、圧力検出される流体を後述する圧力室１１２Ａに導入する流体導入部１１０と、圧力室１１２Ａの流体の圧力を検出する圧力検出部１２０と、圧力検出部１２０で検出された圧力信号を外部に送出する信号送出部１３０と、流体導入部１１０、圧力検出部１２０、及び、信号送出部１３０を接続する接続部材１４０とを備える。 In FIG. 1, a liquid ring-type pressure sensor 100 includes a fluid introduction unit 110 that introduces a fluid whose pressure is detected into a pressure chamber 112A described later, a pressure detection unit 120 that detects the pressure of the fluid in the pressure chamber 112A, and a pressure A signal sending unit 130 that sends the pressure signal detected by the detection unit 120 to the outside, and a fluid introduction unit 110, a pressure detection unit 120, and a connection member 140 that connects the signal sending unit 130 are provided.
　流体導入部１１０は、圧力検出される流体が導かれる配管に接続される金属製の継手部材１１１と、継手部材１１１の配管に接続される端部と別の端部に溶接等により接続されるお椀形状を有する金属製のベースプレート１１２とを備える。 The fluid introduction part 110 is connected by welding or the like to a metal joint member 111 connected to a pipe through which a fluid whose pressure is detected is guided, and an end part connected to the pipe of the joint member 111. And a metal base plate 112 having a bowl shape.
　継手部材１１１には、配管の接続部の雄ねじ部にねじ込まれる雌ねじ部１１１ａと、配管から導入された流体を圧力室１１２Ａに導くポート１１１ｂとが形成される。ポート１１１ｂの開口端は、ベースプレート１１２の中央に設けられた開口部に溶接等により接続される。なお、ここでは、継手部材１１１に雌ねじ部１１１ａが設けられるものとしたが、雄ねじが設けられるものとしてもよく、または、継手部材１１１の代わりに、銅製の接続パイプが接続されるものとしてもよい。ベースプレート１１２は、継手部材１１１と対向する側に向かい広がるお椀形状を有し、後述するダイヤフラム１２２との間に圧力室１１２Ａを形成する。 The joint member 111 is formed with a female screw portion 111a that is screwed into a male screw portion of a pipe connection portion, and a port 111b that guides the fluid introduced from the pipe to the pressure chamber 112A. The opening end of the port 111b is connected to an opening provided in the center of the base plate 112 by welding or the like. Here, the joint member 111 is provided with the female thread portion 111a. However, the joint member 111 may be provided with a male thread, or a copper connection pipe may be connected instead of the joint member 111. . The base plate 112 has a bowl shape that widens toward the side facing the joint member 111, and forms a pressure chamber 112A between the base plate 112 and a diaphragm 122 described later.
　圧力検出部１２０は、貫通孔を有するハウジング１２１と、上述の圧力室１１２Ａと後述する液封室１２４Ａとを区画するダイヤフラム１２２と、ダイヤフラム１２２の圧力室１１２Ａ側に配置される保護カバー１２３と、ハウジング１２１の貫通孔内部にはめ込まれるハーメチックガラス１２４と、ハーメチックガラス１２４の圧力室１１２Ａ側の凹部とダイヤフラム１２２との間に封入オイルが充填される液封室１２４Ａと、ハーメチックガラス１２４の中央に配置される支柱１２５と、支柱１２５に支持され液封室１２４Ａ内部に配置される半導体センサチップ１２６と、液封室１２４Ａの周囲に配置される電位調整部材１２７と、ハーメチックガラス１２４に固定される複数のリードピン１２８と、ハーメチックガラス１２４に固定されるオイル充填用パイプ１２９とを備える。 The pressure detection unit 120 includes a housing 121 having a through-hole, a diaphragm 122 that partitions the above-described pressure chamber 112A and a liquid sealing chamber 124A described later, a protective cover 123 disposed on the pressure chamber 112A side of the diaphragm 122, Arranged in the center of the hermetic glass 124, a hermetic glass 124 fitted into the through hole of the housing 121, a liquid sealing chamber 124 A filled with sealed oil between the recess 122 on the pressure chamber 112 A side of the hermetic glass 124 and the diaphragm 122. Column 125, a semiconductor sensor chip 126 supported by the column 125 and disposed inside the liquid sealing chamber 124A, a potential adjusting member 127 disposed around the liquid sealing chamber 124A, and a plurality of fixed to the hermetic glass 124. Lead pins 128 and hermetic glass 124 And a oil-filled pipe 129 being.
　ハウジング１２１は、ハーメチックガラス１２４の周囲の強度を保つために、例えばＦｅ・Ｎｉ系合金やステンレス等の金属材料により形成される。ダイヤフラム１２２と、保護カバー１２３は、共に金属材料で形成され、共にハウジング１２１の圧力室１１２Ａ側の貫通孔の外周縁部において溶接される。保護カバー１２３は、ダイヤフラム１２２を保護するために圧力室１１２Ａ内部に設けられ、流体導入部１１０から導入された流体が通過するための複数の連通孔１２３ａが設けられる。ハウジング１２１は、圧力検出部１２０が組み立てられた後、流体導入部１１０のベースプレート１１２の外周縁部において、ＴＩＧ溶接、プラズマ溶接、レーザ溶接等により外側から溶接される。 The housing 121 is formed of a metal material such as an Fe / Ni alloy or stainless steel in order to maintain the strength around the hermetic glass 124. The diaphragm 122 and the protective cover 123 are both formed of a metal material, and are both welded at the outer peripheral edge portion of the through hole on the pressure chamber 112 </ b> A side of the housing 121. The protective cover 123 is provided inside the pressure chamber 112A to protect the diaphragm 122, and is provided with a plurality of communication holes 123a through which the fluid introduced from the fluid introduction unit 110 passes. After the pressure detection unit 120 is assembled, the housing 121 is welded from the outside by TIG welding, plasma welding, laser welding, or the like at the outer peripheral edge of the base plate 112 of the fluid introduction unit 110.
　ハーメチックガラス１２４は、半導体センサチップ１２６が液封された液封室１２４Ａを空気中の湿気や埃、熱などの周囲の環境条件から保護し、複数のリードピン１２８を保持し、複数のリードピン１２８とハウジング１２１とを絶縁するために設けられる。ハーメチックガラス１２４の中央に配置された支柱１２５の液封室１２４Ａ側には、半導体センサチップ１２６が接着剤などにより支持される。なお、本実施形態では、支柱１２５は、Ｆｅ・Ｎｉ系合金で形成されるものとしたが、これには限定されず、ステンレス等その他の金属材料で形成されるものとしてもよい。また、支柱１２５を設けずに、ハーメチックガラス１２４の凹部を形成する平坦面に直接的に支持されるように構成されてもよい。 The hermetic glass 124 protects the liquid sealing chamber 124A in which the semiconductor sensor chip 126 is sealed from ambient environmental conditions such as humidity, dust, and heat in the air, and holds the plurality of lead pins 128. It is provided to insulate the housing 121. A semiconductor sensor chip 126 is supported by an adhesive or the like on the liquid sealing chamber 124 </ b> A side of the column 125 disposed in the center of the hermetic glass 124. In the present embodiment, the support column 125 is formed of an Fe / Ni alloy, but is not limited thereto, and may be formed of other metal materials such as stainless steel. Further, the support 125 may be provided directly without being provided on the flat surface that forms the concave portion of the hermetic glass 124.
　半導体センサチップ１２６の内部には、ピエゾ抵抗効果を有する、例えば単結晶シリコン等の材料からなるダイヤフラムと、ダイヤフラム上に複数の半導体歪みゲージを形成し、これらの半導体歪みゲージをブリッジ接続したブリッジ回路及びブリッジ回路からの出力を処理する増幅回路、演算処理回路等の集積回路が含まれる。また、半導体センサチップ１２６は、例えば、金またはアルミニウム製のボンディングワイヤ１２６ａにより複数のリードピン１２８に接続され、複数のリードピン１２８は、半導体センサチップ１２６の外部入出力端子を構成している。 Inside the semiconductor sensor chip 126, a diaphragm made of a material such as single crystal silicon having a piezoresistive effect, and a plurality of semiconductor strain gauges formed on the diaphragm, and a bridge circuit in which these semiconductor strain gauges are bridge-connected. And an integrated circuit such as an amplifier circuit or an arithmetic processing circuit for processing the output from the bridge circuit. The semiconductor sensor chip 126 is connected to a plurality of lead pins 128 by, for example, bonding wires 126 a made of gold or aluminum, and the plurality of lead pins 128 constitutes an external input / output terminal of the semiconductor sensor chip 126.
　配管から導入される流体は、継手部材１１１から圧力室１１２Ａに導入され、ダイヤフラム１２２を押圧する。このダイヤフラム１２２に加えられた圧力は、液封室１２４Ａ内の封入オイルを介して半導体センサチップ１２６に伝達される。この圧力により半導体センサチップ１２６のシリコンダイヤフラムが変形し、ピエゾ抵抗素子によるブリッジ回路で圧力を電気信号に変換して、半導体センサチップ１２６の集積回路からボンディングワイヤ１２６ａを介して複数のリードピン１２８に出力される。 The fluid introduced from the pipe is introduced from the joint member 111 into the pressure chamber 112A and presses the diaphragm 122. The pressure applied to the diaphragm 122 is transmitted to the semiconductor sensor chip 126 through the sealed oil in the liquid sealing chamber 124A. The silicon diaphragm of the semiconductor sensor chip 126 is deformed by this pressure, and the pressure is converted into an electrical signal by a bridge circuit using a piezoresistive element, and output from the integrated circuit of the semiconductor sensor chip 126 to a plurality of lead pins 128 via bonding wires 126a. Is done.
　電位調整部材１２７は、特許文献２に記載されているように、半導体センサチップ１２６を無電界（ゼロ電位）内に置き、フレームアースと２次電源との間に生じる電位の影響でチップ内の回路などが悪影響を受けないようにするために設けられる。電位調整部材１２７は、液封室１２４Ａ内の半導体センサチップ１２６とダイヤフラム１２２との間に配置され、金属等の導電性の材料で形成され、半導体センサチップ１２６のゼロ電位に接続される端子に接続される。 As described in Patent Document 2, the potential adjusting member 127 places the semiconductor sensor chip 126 in a non-electric field (zero potential), and the inside of the chip is affected by the potential generated between the frame ground and the secondary power source. It is provided to prevent the circuit and the like from being adversely affected. The potential adjusting member 127 is disposed between the semiconductor sensor chip 126 and the diaphragm 122 in the liquid sealing chamber 124A, is formed of a conductive material such as metal, and is connected to a terminal connected to the zero potential of the semiconductor sensor chip 126. Connected.
　ハーメチックガラス１２４には、複数のリードピン１２８と、オイル充填用パイプ１２９が貫通状態でハーメチック処理により固定される。本実施形態では、リードピン１２８として、全部で８本のリードピン１２８が設けられている。すなわち、外部入出力用（Ｖｏｕｔ）、駆動電圧供給用（Ｖｃｃ）、接地用（ＧＮＤ）の３本のリードピン１２８と、半導体センサチップ１２６の調整用の端子として５本のリードピン１２８が設けられている。なお、図１においては、８本のリードピン１２８のうち４本が示されている。 A plurality of lead pins 128 and an oil filling pipe 129 are fixed to the hermetic glass 124 by hermetic treatment in a penetrating state. In the present embodiment, a total of eight lead pins 128 are provided as the lead pins 128. That is, three lead pins 128 for external input / output (Vout), drive voltage supply (Vcc), and ground (GND) are provided, and five lead pins 128 are provided as adjustment terminals for the semiconductor sensor chip 126. Yes. In FIG. 1, four of the eight lead pins 128 are shown.
　オイル充填用パイプ１２９は、液封室１２４Ａの内部に封入オイルとして、例えば、シリコーンオイル、または、フッ素系不活性液体等を充填するために設けられる。なお、オイル充填用パイプ１２９の一方の端部は、オイル充填後、図１に示されるように、押し潰されて閉塞される。 The oil filling pipe 129 is provided to fill the inside of the liquid sealing chamber 124A with, for example, silicone oil or a fluorine-based inert liquid as sealed oil. One end portion of the oil filling pipe 129 is crushed and closed as shown in FIG. 1 after the oil filling.
　信号送出部１３０は、圧力検出部１２０の圧力室１１２Ａの反対側に設けられた外部接続用のコネクタハウジング１３１と、複数のリードピン１２８に接続される外部出力用基板１３２と、コネクタハウジング１３１に固定され、外部出力用基板１３２に接続される接続端子１３３とを備える。 The signal sending unit 130 is fixed to the connector housing 131 for external connection provided on the opposite side of the pressure chamber 112 </ b> A of the pressure detection unit 120, the external output board 132 connected to the plurality of lead pins 128, and the connector housing 131. And a connection terminal 133 connected to the external output substrate 132.
　コネクタハウジング１３１は、絶縁性の樹脂等により形成され、接続端子１３３と共に、外部のコネクタに接続される。コネクタハウジング１３１の圧力室１１２Ａ側の内部空間には、ハーメチックガラス１２４から延出した複数のリードピン１２８、及び、外部出力用基板１３２等が配置される。外部出力用基板１３２は、フレキシブルプリント基板（ＦＰＣ）等の柔軟性を有する材料により形成され、コネクタハウジング１３１に固定された接続端子１３３と、複数のリードピン１２８を接続する。 The connector housing 131 is formed of an insulating resin or the like, and is connected to an external connector together with the connection terminal 133. In the internal space on the pressure chamber 112A side of the connector housing 131, a plurality of lead pins 128 extending from the hermetic glass 124, an external output substrate 132, and the like are disposed. The external output board 132 is formed of a flexible material such as a flexible printed circuit board (FPC), and connects the connection terminals 133 fixed to the connector housing 131 and the plurality of lead pins 128.
　接続部材１４０は、流体導入部１１０、圧力検出部１２０、及び、信号送出部１３０をカシメ加工により固定するかしめカバー１４１と、圧力検出部１２０とコネクタハウジング１３１の間に配置されるＯリング１４２とを備える。 The connection member 140 includes a caulking cover 141 that fixes the fluid introduction unit 110, the pressure detection unit 120, and the signal transmission unit 130 by caulking, and an O-ring 142 that is disposed between the pressure detection unit 120 and the connector housing 131. Is provided.
　かしめカバー１４１は、銅等の金属で円筒形状に形成される。かしめカバー１４１は、組み立てられた圧力検出部１２０に、流体導入部１１０が溶接等により固定された後、信号送出部１３０と供に、これらの周囲に配置され、Ｏリング１４２を間に挟んでかしめ加工を行い、これらを固定する。Ｏリング１４２は、圧力検出部１２０と信号送出部１３０の間に配置され、これらの防水・防塵機能を果たす。 The caulking cover 141 is formed in a cylindrical shape with a metal such as copper. The caulking cover 141 is disposed around the assembled pressure detection unit 120 after the fluid introduction unit 110 is fixed by welding or the like, together with the signal transmission unit 130, with the O-ring 142 interposed therebetween. Caulking is performed and these are fixed. The O-ring 142 is disposed between the pressure detection unit 120 and the signal transmission unit 130 and fulfills these waterproof and dustproof functions.
　本発明の圧力センサ１００は、ＥＳＤ保護部材１５０をさらに備える。ＥＳＤ保護部材１５０は、複数のリードピン１２８の周囲に配置され、ハウジング１２１の上面を覆う絶縁シート１５１と、ハーメチックガラス１２４の上面及びハウジング１２１の上面との間の空間に配置され、所定の絶縁耐圧を有する接着剤１５２とを備える。 The pressure sensor 100 of the present invention further includes an ESD protection member 150. The ESD protection member 150 is disposed around the plurality of lead pins 128 and is disposed in a space between the insulating sheet 151 covering the upper surface of the housing 121 and the upper surface of the hermetic glass 124 and the upper surface of the housing 121, and has a predetermined withstand voltage. And an adhesive 152 having.
　絶縁シート１５１は、静電気印加時に、金属製のハウジング１２１と複数のリードピン１２８との間で、静電気放電（ＥＳＤ：Electro-Static Discharge）が発生し、半導体センサチップ１２６の内部回路が破損するのを防止するために設けられる。絶縁シート１５１の形状は、ここでは、中央にハーメチックガラス１２４から複数のリードピン１２８が延出しているため、中央に貫通孔１５１ａを有する形状に形成されるが、これには限定されない。また、絶縁シート１５１の材質は、ここでは、所定の絶縁耐圧を有する透明なポリエステルシートに、粘着アクリルシートを貼付したものを使用したが、これには限定されない。 The insulating sheet 151 prevents electrostatic discharge (ESD: Electro-Static Discharge) from occurring between the metal housing 121 and the plurality of lead pins 128 and damages the internal circuit of the semiconductor sensor chip 126 when static electricity is applied. Provided to prevent. Here, the shape of the insulating sheet 151 is formed in a shape having a through hole 151a in the center because the plurality of lead pins 128 extend from the hermetic glass 124 in the center, but is not limited thereto. In addition, here, the material of the insulating sheet 151 is a transparent polyester sheet having a predetermined withstand voltage, and an adhesive acrylic sheet is pasted, but is not limited thereto.
　接着剤１５２は、ここでは、絶縁シート１５１の中央に設けられた貫通孔１５１ａからハーメチックガラス１２４の中央に塗布される。接着剤１５２は、空気より高い所定の絶縁耐圧を有するため、絶縁シート１５１と同様にＥＳＤ保護のために設けられる。本実施形態では、接着剤１５２は、ハウジング１２１の上面の内周部に、傾斜面が設けられ、このハウジング１２１の傾斜面と絶縁シート１５１との間の隙間に、浸透し、これにより絶縁耐圧を高めている。なお、ハウジング１２１に傾斜面を設けることにより、ハーメチックガラス１２４が組み込み易くなり、作業性が向上するという効果も有する。 Here, the adhesive 152 is applied to the center of the hermetic glass 124 from the through hole 151 a provided in the center of the insulating sheet 151. Since the adhesive 152 has a predetermined withstand voltage higher than that of air, the adhesive 152 is provided for ESD protection like the insulating sheet 151. In the present embodiment, the adhesive 152 is provided with an inclined surface on the inner peripheral portion of the upper surface of the housing 121, and permeates the gap between the inclined surface of the housing 121 and the insulating sheet 151, and thereby the withstand voltage is increased. Is increasing. In addition, providing the housing 121 with the inclined surface makes it easy to incorporate the hermetic glass 124 and has an effect of improving workability.
　なお、ここでは、絶縁シート１５１と接着剤１５２の両方を設けるものとしたが、絶縁シート１５１のみで所望のＥＳＤ保護性能を確保できる場合には、絶縁シート１５１のみを設けるものとしてもよい。また、絶縁シート１５１に貫通孔１５１ａがない場合には、接着剤１５２をハーメチックガラス１２４の上面とハウジング１２１の上面の内周部に直接塗布してもよい。 Here, both the insulating sheet 151 and the adhesive 152 are provided. However, when the desired ESD protection performance can be ensured only by the insulating sheet 151, only the insulating sheet 151 may be provided. Further, when the insulating sheet 151 does not have the through hole 151 a, the adhesive 152 may be directly applied to the inner peripheral portion of the upper surface of the hermetic glass 124 and the upper surface of the housing 121.
　図２は、本発明の圧力センサ１００の絶縁シートの形状の一例１５１Ａを示す平面図である。 FIG. 2 is a plan view showing an example 151A of the shape of the insulating sheet of the pressure sensor 100 of the present invention.
　図２において、絶縁シート１５１Ａには、中央に貫通孔１５１Ａａが設けられ、更に、貫通孔１５１Ａａの内周に複数の切り欠き１５１Ａｂが設けられる。複数の切り欠き１５１Ａｂの間には、貫通孔１５１Ａａの内周部分が部分的に突起として残り、複数のリードピン１２８に近接する。このため、貫通孔１５１Ａａからハーメチックガラス１２４の中央に塗布された接着剤１５２は、表面張力により全周に均一に浸透する。また、絶縁シート１５１Ａには、以下で詳細に説明する、接着剤１５２が硬化する際に接着剤１５２の内部で発生した気泡を排出するための複数の円形の気泡抜き穴１５１Ａｃが形成される。また、複数の切り欠き１５１Ａｂを設けた更なる効果について、図３及び図４を使用して以下に説明する。 In FIG. 2, the insulating sheet 151 </ b> A is provided with a through hole 151 </ b> Aa at the center, and further, a plurality of notches 151 </ b> Ab are provided on the inner periphery of the through hole 151 </ b> Aa. Between the plurality of notches 151Ab, the inner peripheral portion of the through hole 151Aa partially remains as a protrusion, and is close to the plurality of lead pins 128. For this reason, the adhesive 152 applied to the center of the hermetic glass 124 from the through hole 151Aa uniformly penetrates the entire circumference due to the surface tension. The insulating sheet 151 </ b> A has a plurality of circular air vents 151 </ b> Ac for discharging air bubbles generated inside the adhesive 152 when the adhesive 152 is cured, which will be described in detail below. Moreover, the further effect which provided several notch 151Ab is demonstrated below using FIG.3 and FIG.4.
　図３は、切り欠きがない絶縁シート１５１を使用した場合の問題点を説明する要部の縦断面図である。 FIG. 3 is a longitudinal sectional view of a main part for explaining a problem when the insulating sheet 151 having no notch is used.
　図３に示すように、ハーメチックガラス１２４の上面は、平坦に形成するのが難しく、上面に突起が残ってしまう場合がある。絶縁シート１５１に貫通孔１５１ａのみを形成し、切り欠き１５１ｂを形成しない場合には、絶縁シート１５１とハーメチックガラス１２４の上面に残った突起が接触するおそれがある。この場合、絶縁シート１５１の中央に設けられた貫通孔１５１ａから塗布された接着剤１５２Ａがこの突起に阻まれ、ハーメチックガラス１２４の上面の全周に均等に行き渡らず、所望の絶縁耐圧を確保できないおそれがある。 As shown in FIG. 3, it is difficult to form the upper surface of the hermetic glass 124 flat, and a protrusion may remain on the upper surface. When only the through-hole 151a is formed in the insulating sheet 151 and the notch 151b is not formed, there is a possibility that the protrusion remaining on the upper surface of the insulating sheet 151 and the hermetic glass 124 may come into contact. In this case, the adhesive 152A applied from the through-hole 151a provided in the center of the insulating sheet 151 is blocked by this protrusion, and does not spread evenly over the entire circumference of the upper surface of the hermetic glass 124, so that a desired withstand voltage cannot be ensured. There is a fear.
　図４は、図２に示す絶縁シート１５１Ａを使用した場合を説明する要部の縦断面図である。 FIG. 4 is a longitudinal sectional view of a main part for explaining the case where the insulating sheet 151A shown in FIG. 2 is used.
　図４に示すように、図２に示す絶縁シート１５１Ａを使用した場合には、ハーメチックガラス１２４の上面に突起が残り、この突起が絶縁シート１５１Ａと接触した場合であっても、絶縁シート１５１Ａの貫通孔１５１Ａａの内周に設けられた複数の切り欠き１５１Ａｂを通して接着剤１５２Ａが浸透し、切り欠き１５１Ａｂの側面のハーメチックガラス１２４の上面の突起に接していない部分から接着剤１５２Ａが浸透することができる。これにより、接着剤１５２Ａをハーメチックガラス１２４の上面の全周に均等に行き渡らせることができ、接着剤１５２Ａによる所望の絶縁耐圧が維持できる。 As shown in FIG. 4, when the insulating sheet 151A shown in FIG. 2 is used, a protrusion remains on the upper surface of the hermetic glass 124, and even if this protrusion is in contact with the insulating sheet 151A, the insulating sheet 151A The adhesive 152A may permeate through a plurality of notches 151Ab provided on the inner periphery of the through-hole 151Aa, and the adhesive 152A may permeate from a portion not in contact with the protrusion on the upper surface of the hermetic glass 124 on the side surface of the notch 151Ab. it can. Thereby, the adhesive 152A can be evenly distributed over the entire circumference of the upper surface of the hermetic glass 124, and a desired withstand voltage by the adhesive 152A can be maintained.
　図５は、図２に示す絶縁シート１５１Ａを使用し、気泡が接着剤１５２Ｂの内部に残った場合を説明する縦断面図である。 FIG. 5 is a longitudinal sectional view for explaining the case where the insulating sheet 151A shown in FIG. 2 is used and bubbles remain inside the adhesive 152B.
　図５に示すように、例えば硬化時間の長い、シリコーン系等の接着剤１５２Ｂは、一般に高温に熱して硬化させることがある。このときに、接着剤１５２Ｂの内部または周囲に水分があると、図５に示すように、水蒸気が発生し気泡となり、この発生した気泡が硬化後の接着剤に残ると、接着剤１５２Ｂの実効的な厚みが減少し、静電気が図５に示す絶縁破壊ルートを通過するため絶縁耐圧が低下し、所望のＥＳＤ保護性能が確保できない可能性がある。 As shown in FIG. 5, for example, the silicone-based adhesive 152 </ b> B having a long curing time may be generally cured by heating to a high temperature. At this time, if there is moisture in or around the adhesive 152B, as shown in FIG. 5, water vapor is generated to form bubbles, and if the generated bubbles remain in the cured adhesive, the effective of the adhesive 152B Therefore, there is a possibility that the desired ESD protection performance cannot be ensured because the dielectric thickness is reduced and the static electricity passes through the breakdown route shown in FIG.
　図６は、絶縁シートの形状の別の例１５１Ｂを示す平面図である。 FIG. 6 is a plan view showing another example 151B of the shape of the insulating sheet.
　図６に示すように、絶縁シート１５１Ｂは、図２に示す絶縁シート１５１Ａと比較して、複数の円形の気泡抜き穴１５１Ａｃの代わりに、絶縁シート１５１Ｂの全周に対応する位置に形成された複数の長穴である気泡抜き穴１５１Ｂｃが形成される点が異なり、その他の構成は同様である。同様の構成には、同様の符号を付し、説明を省略する。 As shown in FIG. 6, the insulating sheet 151 </ b> B is formed at a position corresponding to the entire circumference of the insulating sheet 151 </ b> B instead of the plurality of circular bubble vent holes 151 </ b> Ac as compared to the insulating sheet 151 </ b> A shown in FIG. 2. The difference is that a plurality of elongated holes 151Bc are formed, and other configurations are the same. Similar components are denoted by the same reference numerals, and description thereof is omitted.
　図３、及び、図４に示すように、硬化速度の速いエポキシ系等の接着剤１５２Ａを使用した場合にも、量の少ない気泡が発生する可能性があるため、図２に示す絶縁シート１５１Ａにも、開口面積の小さい複数の円形の気泡抜き穴１５１Ａｃが設けられている。これに対して、図６に示すように、硬化速度の遅い、シリコーン系等の接着剤１５２Ｂを使用した場合には、気泡が発生しやすく、接着剤１５２Ｂの上部を覆う絶縁シート１５１Ｂに開口面積の大きい気泡抜き穴１５１Ｂｃを設ける必要がある。 As shown in FIGS. 3 and 4, even when an epoxy-based adhesive 152A having a high curing speed is used, a small amount of air bubbles may be generated. Therefore, the insulating sheet 151A shown in FIG. In addition, a plurality of circular bubble vents 151Ac having a small opening area are provided. On the other hand, as shown in FIG. 6, when the silicone-based adhesive 152B having a slow curing rate is used, bubbles are likely to be generated, and the opening area of the insulating sheet 151B covering the upper part of the adhesive 152B is increased. It is necessary to provide a large bubble removal hole 151Bc.
　検討の結果、気泡抜き穴１５１Ｂｃが絶縁シート１５１Ｂの全周に対応する位置に形成されれば、上述の図５に示した気泡が硬化中に上部に排出され、上述の問題点が解消されることがわかった。このため、図６に示す絶縁シート１５１Ｂには、中央に形成された貫通孔の周囲に、段違いに形成された、複数の円弧形状の長穴である気泡抜き穴１５１Ｂｃが形成されている。複数の気泡抜き穴１５１Ｂｃは、段違いに形成されるため、絶縁シート１５１Ｂの全周に対応する位置に形成することができる。なお、ここまで、接着剤１５２としてシリコーン系の接着剤を図６に示す絶縁シート１５１Ｂに適用した場合について説明してきたが、これには限定されず、硬化速度が遅く、気泡の発生しやすい材質、及び、硬化方法の他の接着剤１５２の全てに適用可能である。 As a result of the study, if the air bubble removal hole 151Bc is formed at a position corresponding to the entire circumference of the insulating sheet 151B, the air bubbles shown in FIG. 5 are discharged to the upper part during curing, and the above-mentioned problems are solved. I understood it. For this reason, the insulating sheet 151B shown in FIG. 6 is formed with a plurality of bubble vent holes 151Bc which are a plurality of arc-shaped long holes formed around the through hole formed in the center. Since the plurality of bubble removal holes 151Bc are formed in steps, they can be formed at positions corresponding to the entire circumference of the insulating sheet 151B. Heretofore, the case where a silicone-based adhesive is applied to the insulating sheet 151B shown in FIG. 6 as the adhesive 152 has been described. However, the present invention is not limited to this, and a material that is slow in curing and easily generates bubbles. And all other adhesives 152 of the curing method.
　なお、本発明の圧力センサの一例として、圧力センサ１００を例にとり説明してきたがこれには限定されず、本発明は、半導体センサチップを液封室に液封する全ての液封型の圧力センサに適用可能である。 Although the pressure sensor 100 has been described as an example of the pressure sensor of the present invention, the present invention is not limited to this, and the present invention is applicable to all liquid-sealed pressures for liquid-sealing a semiconductor sensor chip in a liquid-sealed chamber. Applicable to sensors.
　以上のように、本発明の圧力センサによれば、ＥＳＤ保護回路の有無によらず、多量の接着剤を使用することなく、安定して高い静電気耐圧を維持できる。 As described above, according to the pressure sensor of the present invention, a high electrostatic withstand voltage can be stably maintained without using a large amount of adhesive regardless of the presence or absence of an ESD protection circuit.
　１００　圧力センサ
　１１０　流体導入部
　１１１　継手部材
　１１１ａ　雌ねじ部
　１１１ｂ　ポート
　１１２　ベースプレート
　１１２Ａ　圧力室
　１２０　圧力検出部
　１２１　ハウジング
　１２２　ダイヤフラム
　１２３　保護カバー
　１２３ａ　連通孔
　１２４　ハーメチックガラス
　１２４Ａ　液封室
　１２５　支柱
　１２６　半導体センサチップ
　１２６ａ　ボンディングワイヤ
　１２７　電位調整部材
　１２８　リードピン
　１２９　オイル充填用パイプ
　１３０　信号送出部
　１３１　コネクタハウジング
　１３２　外部出力用基板
　１３３　接続端子
　１４０　接続部材
　１４１　カシメカバー
　１４２　Ｏリング
　１５０　ＥＳＤ保護部材
　１５１、１５１Ａ、１５１Ｂ　絶縁シート
　１５１ａ、１５１Ａａ　貫通孔
　１５１Ａｂ　切り欠き
　１５１Ａｃ、１５１Ｂｃ　気泡抜き穴
　１５２、１５２Ａ、１５２Ｂ　接着剤 DESCRIPTION OF SYMBOLS 100 Pressure sensor 110 Fluid introducing | transducing part 111 Joint member 111a Female thread part 111b Port 112 Base plate 112A Pressure chamber 120 Pressure detection part 121 Housing 122 Diaphragm 123 Protective cover 123a Communication hole 124 Hermetic glass 124A Liquid seal chamber 125 Support column 126 Semiconductor sensor chip 126a Bonding wire 127 Potential adjustment member 128 Lead pin 129 Oil filling pipe 130 Signal sending part 131 Connector housing 132 External output board 133 Connection terminal 140 Connection member 141 Caulking cover 142 O-ring 150 ESD protection member 151, 151A, 151B Insulation sheet 151a, 151Aa Through Hole 151Ab Notch 151Ac, 151Bc Air bubble removal hole 152, 152A, 152B adhesive

Claims (7)

  1. 　封入オイルが充填された液封室に液封され、圧力室に導入された流体の圧力が前記封入オイルを介して検出される半導体センサチップと、
    　前記半導体センサチップにワイヤボンディングで接続され、前記半導体センサチップの外部入出力端子を構成し、接続端子に接続される複数のリードピンと、
    　前記複数のリードピンを保持するハーメチックガラスと、
    　前記複数のリードピンの周囲に配置され、前記ハーメチックガラスを保持する金属製のハウジングと、
    　前記ハーメチックガラスから延出した前記複数のリードピンの周囲に配置され、前記ハウジングの前記接続端子側の面を覆う絶縁シートと
    　を備えることを特徴とする圧力センサ。     A semiconductor sensor chip that is liquid-sealed in a liquid-sealed chamber filled with enclosed oil, and the pressure of the fluid introduced into the pressure chamber is detected via the enclosed oil;
    Connected to the semiconductor sensor chip by wire bonding, constituting an external input / output terminal of the semiconductor sensor chip, and a plurality of lead pins connected to the connection terminal;
    Hermetic glass holding the plurality of lead pins;
    A metal housing disposed around the plurality of lead pins and holding the hermetic glass;
    An insulating sheet disposed around the plurality of lead pins extending from the hermetic glass and covering a surface of the housing on the side of the connection terminal.
  2. 　前記絶縁シートと、前記ハーメチックガラスの前記接続端子側の面及び前記ハウジングの前記接続端子側の面との間の空間が絶縁性接着剤により封止されることを特徴とする請求項１に記載の圧力センサ。 2. The space between the insulating sheet and the surface of the hermetic glass on the side of the connection terminal and the surface of the housing on the side of the connection terminal is sealed with an insulating adhesive. Pressure sensor.
  3. 　前記ハウジングの前記接続端子側の面の内周部には、傾斜面が設けられ、
    　前記ハウジングの前記傾斜面と前記絶縁シートとの間の隙間に、前記絶縁性接着剤が浸透することを特徴とする請求項２に記載の圧力センサ。     An inclined surface is provided on the inner peripheral portion of the surface on the connection terminal side of the housing,
    The pressure sensor according to claim 2, wherein the insulating adhesive penetrates into a gap between the inclined surface of the housing and the insulating sheet.
  4. 　前記絶縁シートの中央には、前記絶縁性接着剤が注入される貫通孔が形成されることを特徴とする請求項２に記載の圧力センサ。 The pressure sensor according to claim 2, wherein a through-hole into which the insulating adhesive is injected is formed at the center of the insulating sheet.
  5. 　前記貫通孔の内周面には、少なくとも１つの切り欠きが形成されることを特徴とする請求項４に記載の圧力センサ。 The pressure sensor according to claim 4, wherein at least one notch is formed in an inner peripheral surface of the through hole.
  6. 　前記絶縁シートの前記貫通孔の周囲には、気泡抜き穴が形成されることを特徴とする請求項４に記載の圧力センサ。 5. The pressure sensor according to claim 4, wherein a bubble removal hole is formed around the through hole of the insulating sheet.
  7. 　前記気泡抜き穴は、複数形成され、複数の気泡抜き穴は、前記絶縁シートの全周に対応する位置にそれぞれ形成されることを特徴とする請求項６に記載の圧力センサ。 The pressure sensor according to claim 6, wherein a plurality of the bubble vent holes are formed, and the plurality of bubble vent holes are respectively formed at positions corresponding to the entire circumference of the insulating sheet.
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