WO2018161240A1 - Automatic pcb substrate assembly apparatus - Google Patents

Automatic pcb substrate assembly apparatus Download PDF

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Publication number
WO2018161240A1
WO2018161240A1 PCT/CN2017/075811 CN2017075811W WO2018161240A1 WO 2018161240 A1 WO2018161240 A1 WO 2018161240A1 CN 2017075811 W CN2017075811 W CN 2017075811W WO 2018161240 A1 WO2018161240 A1 WO 2018161240A1
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WO
WIPO (PCT)
Prior art keywords
pcb substrate
bracket
positioning
slide plate
electronic component
Prior art date
Application number
PCT/CN2017/075811
Other languages
French (fr)
Chinese (zh)
Inventor
邹霞
Original Assignee
邹霞
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 邹霞 filed Critical 邹霞
Priority to PCT/CN2017/075811 priority Critical patent/WO2018161240A1/en
Publication of WO2018161240A1 publication Critical patent/WO2018161240A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a PCB substrate production apparatus, specifically a PCB substrate automatic assembly device.
  • the substrate is a copper-clad laminate, and the single-sided and double-sided printed boards are manufactured on a substrate material-copper-clad laminate, selectively performing hole processing, electroless copper plating, copper plating, etching, and the like. , get the required circuit graphics.
  • electronic components that need to be soldered to the substrate, such as a semiconductor chip, an electrical connection between the chip and the substrate, soldering the leads, or other components such as resistors.
  • the present invention provides a PCB substrate assembly apparatus which is low in cost but can be accurately positioned for assembling electronic components and performing soldering.
  • a PCB substrate automatic assembly device includes a bracket, the bracket has a vertical rail opposite to the inner side; a bracket is connected between the brackets, a cylinder is mounted on the beam; and a robot is connected to the cylinder, The robot grips the electronic component; the robot has a slide under the robot, and the slider has a slider connected to both ends thereof; the slider is installed in the guide rail to form a sliding pair; The positioning hole is used for positioning the electronic component captured by the robot; the rotating plate is arranged below the sliding plate; the outer side of the bracket is provided with a rotating column, and the rotating disk has a plurality of Distributed on the rotating column, and the plurality of rotating disks are on the same horizontal surface, rotating the column one station, one rotating disk is located below the sliding plate; the rotating disk has a positioning support frame; the PCB substrate is placed on Positioning the support frame; there is a base below the sliding plate and the rotating disk, and the base has a welding head thereon.
  • the manipulator includes a horizontal cantile
  • a sliding plate return spring is further connected between the sliding plate and the bracket; the sliding plate is driven downward by the cylinder through the electronic component fixing block, and the sliding plate is returned by the spring.
  • the rotating disk is a frame-shaped structure, and the positioning support frame is placed in the middle hollow;
  • the positioning support frame includes a PCB substrate positioning groove, and the upper edge of the positioning hole of the PCB substrate has a convex edge.
  • the protruding edge is located on the outer sidewall of the positioning groove of the PCB substrate, and a compression spring is vertically mounted between the convex edge and the rotating disk;
  • the bottom of the groove of the PCB substrate positioning groove is hollow, and the bottom of the groove has an inner protrusion
  • the supporting edge is disposed on the inner side wall of the positioning groove of the PCB substrate, and the PCB substrate is placed on the inner convex supporting edge.
  • the base is mounted with a vertical first guiding rod, the first guiding rod is sleeved with a bracket, and the bracket is used for supporting the bottom of the positioning groove of the PCB substrate;
  • a first return compression spring is mounted below the frame.
  • the base is further provided with a second guiding rod, the second guiding rod is sleeved with a total bracket; a second return compression spring is mounted between the lower bracket and the base; The bracket is located above the main bracket; the first return compression spring is mounted between the bracket and the main bracket.
  • the automatic assembly device for a PCB substrate provided by the present invention is positioned by a simple guide bar or the like, and is sequentially positioned layer by layer, and the precise positioning function is achieved, and can be adjusted according to different assembly products, which is higher than the manual assembly welding effect. Lower cost than smart robotic equipment.
  • 1 is a schematic view showing the structure of the present invention.
  • FIG. 1 a PCB substrate automatic assembly device, package
  • the bracket 1 is provided, and the bracket 1 has a vertical rail 9 on the inner side.
  • a bracket is connected between the brackets 1 , and the cylinder 2 is mounted with a cylinder 2; a robot is connected to the cylinder 2, and the robot grabs the electronic component 7;
  • the slider 6 is connected to the slider 8 at both ends thereof; the slider 8 is mounted in the guide rail 9 to form a sliding pair; the slider 6 is provided with a positioning hole, and the positioning hole is used for positioning the robot
  • the electronic component 7 is grasped; the rotating plate 12 is arranged under the sliding plate 6; the rotating column 22 is mounted on the outer side of the bracket 1 , and the rotating disk 12 is evenly distributed on the rotating column 22 .
  • the plurality of rotating disks 12 are on the same horizontal surface, rotating the column 22-station, wherein one rotating disk 12 is located below the sliding plate 6; the rotating disk 12 has a positioning support frame; and the PC B substrate 20 It is placed on the positioning support frame; there is a base 18 below the sliding plate 6 and the rotating disk 12, and the base 18 has a welding head 21 thereon.
  • the PCB substrate 20 is placed on the positioning support of the rotating disk 12, and the rotating column 22 rotates the rotating disk 12 to the lower side of the sliding plate 6, the robot grasps the electronic component 7, and then inserts the electronic component 7 into the sliding plate 6.
  • the positioning hole on the cylinder 2 pushes the robot down, the robot pushes the slide 6 down, inserts the electronic component 7 on the PC B substrate 20, and then the cylinder 2 continues to push, and the recommended slide 6 and the positioning support are descended until the PCB substrate
  • the lower surface of 20 contacts the weld head 21 on the base 18, and the weld head 21 welds the pins of the electronic component 7 to the lower surface of the PCB substrate 20. After the welding is completed, the cylinder 2 goes up.
  • the manipulator includes a horizontal cantilever 3, the cantilever 3 has a plurality of movable joints 4, the movable joint 4 moves on the cantilever 3, and the movable joint 4 is connected with an electron below Component fixing block 5.
  • the movable joint 4 is adjusted according to the mounting position of the electronic component 7, and the shape of the electronic component fixing block 5 is also designed and selected according to the electronic components to be assembled.
  • a slide return spring is further connected between the slide plate 6 and the bracket 1; the slide plate 6 is driven downward by the cylinder 2 through the electronic component fixing block 5, and is driven by a slide return spring.
  • the rotating disk 12 is a frame-shaped structure, and the positioning support frame is placed at the middle hollow; the positioning support frame includes a PCB substrate positioning slot 10, and the upper edge of the PCB substrate positioning slot 10 is external. a convex edge, the convex edge is located on the outer side wall of the PCB substrate positioning groove 10, and a compression spring 11 is vertically disposed between the convex edge and the rotating disk 12; the bottom of the groove of the PCB substrate positioning groove 10 is hollowed out. There is an inner convex supporting edge around the bottom of the groove, the inner convex supporting edge is located on the inner side wall of the PCB substrate positioning groove 10, and the PCB substrate 20 is placed on the inner convex supporting edge.
  • the base 18 is mounted with a vertical first guiding rod 16 , and the first guiding rod 16 is sleeved with a bracket 13 for supporting the PCB substrate positioning slot 10 .
  • a bottom portion; a first return compression spring 14 is mounted below the bracket 13.
  • the bracket 13 is used for accurately positioning the PCB substrate positioning groove 10 and guiding the P CB substrate positioning groove 10 downward.
  • the carrier 13 is pushed down, and after the upstream, the PCB substrate positioning groove 10 is separated from the carrier 13, and the carrier 13 is reset by the first reset compression spring 14.
  • the base 18 is further mounted with a second guiding rod 23, and the second guiding rod 23 is sleeved with a total bracket 15; the second bracket 15 is mounted between the lower bracket and the base 18 a reset spring 17; the bracket 13 is located above the main bracket 15; the first return compression spring 14 is mounted between the bracket 13 and the main bracket 15
  • the total carriage 15 performs the final precise positioning and the downward guidance. Make sure the final welding position is accurate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

An automatic PCB substrate assembly apparatus comprises a support (1). Opposing inner sides of the support (1) are provided with vertical guide rails (9). A mechanical arm is connected below a cylinder (2) and retrieves an electronic component (7). A slide plate (6) is further disposed below the mechanical arm. Sliders (8) are connected to two ends of the slide plate (6). The sliders (8) are mounted on the guide rails (9). The slide plate (6) is provided with a positioning hole used to position the electronic component (7) retrieved by the mechanical arm. Turnplates (12) are disposed blow the slide plate (6). A rotary column (22) is mounted at an outer side of the support (1). The multiple turnplates (12) are evenly distributed on the rotary column (22). The rotary column (22) is a work station. One of the turnplates (12) is located below the slide plate (6). The turnplate (12) is provided with a positioning support frame. A base (18) is further provided below the slide plate (6) and the turnplates (12). The base (18) is provided with a welding head (21). The automatic PCB substrate assembly apparatus of the invention achieves accurate positioning by performing positioning layer by layer sequentially, can be adapted to different products to be assembled, is more effective than manual assembly and welding, and has lower costs than an intelligent mechanical arm apparatus.

Description

PCB基板自动装配装置  PCB substrate automatic assembly device
技术领域  Technical field
[0001] 本发明涉及一种 PCB基板生产设备， 具体为 PCB基板自动装配装置。  [0001] The present invention relates to a PCB substrate production apparatus, specifically a PCB substrate automatic assembly device.
背景技术  Background technique
[0002] 基板就是覆铜箔层压板， 单、 双面印制板在制造中是在基板材料 -覆铜箔层压 板上， 有选择地进行孔加工、 化学镀铜、 电镀铜、 蚀刻等加工， 得到所需电路 图形。 还有部分电子元器件需要焊接在基板上， 比如半导体芯片， 芯片与基板 的电气连接， 将引线焊接， 或者例如电阻等其他元器件。  [0002] The substrate is a copper-clad laminate, and the single-sided and double-sided printed boards are manufactured on a substrate material-copper-clad laminate, selectively performing hole processing, electroless copper plating, copper plating, etching, and the like. , get the required circuit graphics. There are also some electronic components that need to be soldered to the substrate, such as a semiconductor chip, an electrical connection between the chip and the substrate, soldering the leads, or other components such as resistors.
技术问题  technical problem
[0003] 传统的是人工焊接， 因为需要精准定位。 现在也有采用自动化设备焊接， 主要 是高度智能的机械手， 逐个进行安装和焊接， 而这种智能机械手的成本较高。 问题的解决方案  [0003] Traditionally, manual welding is required because of the need for precise positioning. There are also automated equipment welding, mainly highly intelligent robots, which are installed and welded one by one, and the cost of such a smart robot is high. Problem solution
技术解决方案  Technical solution
[0004] 针对上述技术问题， 本发明提供一种成本低、 但是可以精确定位的 PCB基板装 配装置， 用于装配电子元器件并进行焊接。  In view of the above technical problems, the present invention provides a PCB substrate assembly apparatus which is low in cost but can be accurately positioned for assembling electronic components and performing soldering.
[0005] 具体技术方案为： [0005] The specific technical solution is:
[0006] PCB基板自动装配装置， 包括支架， 所述的支架相对内侧有垂直的导轨； 支架 之间有横梁连接， 所述的横梁上安装有气缸； 所述的气缸下方连接有机械手， 所述的机械手抓取电子元器件； 所述的机械手下方还有滑板， 所述的滑板的两 端连接有滑块； 所述的滑块安装在导轨内， 形成滑动副； 所述的滑板上幵设有 定位孔， 所述的定位孔用于定位机械手抓取的电子元器件； 所述的滑板下方有 旋转盘； 所述的支架的外侧安装有旋转立柱， 所述的旋转盘有多个， 均匀分布 在旋转立柱上， 并且多个旋转盘在同一个水平面上， 旋转立柱一个工位， 其中 一个旋转盘位于滑板的下方； 所述的旋转盘上有定位支撑架； 所述的 PCB基板放 置在定位支撑架上； 所述的滑板和旋转盘的下方还有底座， 所述的底座上有焊 接头。 [0007] 所述的机械手包括水平的悬臂， 所述的悬臂上有多个可移动关节， 所述的可移 动关节在悬臂上移动， 所述的移动关节下方连接有电子元件固定块。 [0006] A PCB substrate automatic assembly device includes a bracket, the bracket has a vertical rail opposite to the inner side; a bracket is connected between the brackets, a cylinder is mounted on the beam; and a robot is connected to the cylinder, The robot grips the electronic component; the robot has a slide under the robot, and the slider has a slider connected to both ends thereof; the slider is installed in the guide rail to form a sliding pair; The positioning hole is used for positioning the electronic component captured by the robot; the rotating plate is arranged below the sliding plate; the outer side of the bracket is provided with a rotating column, and the rotating disk has a plurality of Distributed on the rotating column, and the plurality of rotating disks are on the same horizontal surface, rotating the column one station, one rotating disk is located below the sliding plate; the rotating disk has a positioning support frame; the PCB substrate is placed on Positioning the support frame; there is a base below the sliding plate and the rotating disk, and the base has a welding head thereon. [0007] The manipulator includes a horizontal cantilever, the cantilever has a plurality of movable joints, the movable joint moves on the cantilever, and an electronic component fixing block is connected below the moving joint.
[0008] 所述的滑板与支架之间还连接有滑板复位弹簧； 所述的滑板下行由气缸通过电 子元件固定块推动， 上行有滑板复位弹簧驱动。  [0008] A sliding plate return spring is further connected between the sliding plate and the bracket; the sliding plate is driven downward by the cylinder through the electronic component fixing block, and the sliding plate is returned by the spring.
[0009] 所述的旋转盘为框形结构， 中间镂空处放置所述的定位支撑架； 所述的定位支 撑架包括 PCB基板定位槽， 所述的 PCB基板定位槽上边缘有外凸边缘， 所述的外 凸边缘位于 PCB基板定位槽的外侧壁上， 外凸边缘与旋转盘之间垂直安装有压缩 弹簧； 所述的 PCB基板定位槽的槽底为镂空， 槽底周围有内凸起支撑边沿， 所述 的内凸起支撑边沿位于 PCB基板定位槽的内侧壁上， PCB基板放置在内凸起支撑 边沿上。  [0009] The rotating disk is a frame-shaped structure, and the positioning support frame is placed in the middle hollow; the positioning support frame includes a PCB substrate positioning groove, and the upper edge of the positioning hole of the PCB substrate has a convex edge. The protruding edge is located on the outer sidewall of the positioning groove of the PCB substrate, and a compression spring is vertically mounted between the convex edge and the rotating disk; the bottom of the groove of the PCB substrate positioning groove is hollow, and the bottom of the groove has an inner protrusion The supporting edge is disposed on the inner side wall of the positioning groove of the PCB substrate, and the PCB substrate is placed on the inner convex supporting edge.
[0010] 所述的底座上安装有垂直的第一导向杆， 所述的第一导向杆上套有托架， 所述 的托架用于托住 PCB基板定位槽的底部； 所述的托架下方安装有第一复位压缩弹 簧。  [0010] The base is mounted with a vertical first guiding rod, the first guiding rod is sleeved with a bracket, and the bracket is used for supporting the bottom of the positioning groove of the PCB substrate; A first return compression spring is mounted below the frame.
[0011] 所述的底座上还安装有第二导向杆， 所述的第二导向杆上套有总托架； 所述的 总托架下方与底座之间安装有第二复位压缩弹簧； 所述的托架位于总托架上方 ； 所述的第一复位压缩弹簧安装在托架和总托架之间。  [0011] The base is further provided with a second guiding rod, the second guiding rod is sleeved with a total bracket; a second return compression spring is mounted between the lower bracket and the base; The bracket is located above the main bracket; the first return compression spring is mounted between the bracket and the main bracket.
发明的有益效果  Advantageous effects of the invention
有益效果  Beneficial effect
[0012] 本发明提供的 PCB基板自动装配装置， 通过简单的导向杆等进行定位， 逐层依 次进行定位， 达到了精确定位功能， 并且可以根据不同装配产品进行调整， 比 人工装配焊接效果高， 比智能机械手设备成本低。  [0012] The automatic assembly device for a PCB substrate provided by the present invention is positioned by a simple guide bar or the like, and is sequentially positioned layer by layer, and the precise positioning function is achieved, and can be adjusted according to different assembly products, which is higher than the manual assembly welding effect. Lower cost than smart robotic equipment.
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0013] 图 1是本发明的结构示意图。 1 is a schematic view showing the structure of the present invention.
本发明的实施方式 Embodiments of the invention
[0014] 结合附图说明本发明的具体实施例， 如图 1所示， PCB基板自动装配装置， 包 括支架 1， 所述的支架 1相对内侧有垂直的导轨 9。 支架 1之间有横梁连接， 所述 的横梁上安装有气缸 2; 所述的气缸 2下方连接有机械手， 所述的机械手抓取电 子元器件 7; 所述的机械手下方还有滑板 6， 所述的滑板 6的两端连接有滑块 8; 所述的滑块 8安装在导轨 9内， 形成滑动副； 所述的滑板 6上幵设有定位孔， 所述 的定位孔用于定位机械手抓取的电子元器件 7; 所述的滑板 6下方有旋转盘 12; 所述的支架 1的外侧安装有旋转立柱 22， 所述的旋转盘 12有多个， 均匀分布在旋 转立柱 22上， 并且多个旋转盘 12在同一个水平面上， 旋转立柱 22—个工位， 其 中一个旋转盘 12位于滑板 6的下方； 所述的旋转盘 12上有定位支撑架； 所述的 PC B基板 20放置在定位支撑架上； 所述的滑板 6和旋转盘 12的下方还有底座 18， 所 述的底座 18上有焊接头 21。 [0014] A specific embodiment of the present invention will be described with reference to the accompanying drawings, as shown in FIG. 1, a PCB substrate automatic assembly device, package The bracket 1 is provided, and the bracket 1 has a vertical rail 9 on the inner side. a bracket is connected between the brackets 1 , and the cylinder 2 is mounted with a cylinder 2; a robot is connected to the cylinder 2, and the robot grabs the electronic component 7; The slider 6 is connected to the slider 8 at both ends thereof; the slider 8 is mounted in the guide rail 9 to form a sliding pair; the slider 6 is provided with a positioning hole, and the positioning hole is used for positioning the robot The electronic component 7 is grasped; the rotating plate 12 is arranged under the sliding plate 6; the rotating column 22 is mounted on the outer side of the bracket 1 , and the rotating disk 12 is evenly distributed on the rotating column 22 . And the plurality of rotating disks 12 are on the same horizontal surface, rotating the column 22-station, wherein one rotating disk 12 is located below the sliding plate 6; the rotating disk 12 has a positioning support frame; and the PC B substrate 20 It is placed on the positioning support frame; there is a base 18 below the sliding plate 6 and the rotating disk 12, and the base 18 has a welding head 21 thereon.
[0015] PCB基板 20放在旋转盘 12的定位支撑架上， 旋转立柱 22将该旋转盘 12旋转送到 滑板 6下方， 机械手抓取电子元器件 7， 然后将电子元器件 7插入到滑板 6上的定 位孔； 气缸 2推动机械手下行， 机械手再推动滑板 6下行， 将电子元器件 7插在 PC B基板 20上， 然后气缸 2继续推动， 荐滑板 6和定位支撑架一起下行， 直到 PCB基 板 20的下表面接触到底座 18上的焊机头 21， 焊机头 21将电子元器件 7的针脚在与 PCB基板 20的下表面进行焊接。 焊接结束后， 气缸 2上行。  [0015] The PCB substrate 20 is placed on the positioning support of the rotating disk 12, and the rotating column 22 rotates the rotating disk 12 to the lower side of the sliding plate 6, the robot grasps the electronic component 7, and then inserts the electronic component 7 into the sliding plate 6. The positioning hole on the cylinder 2 pushes the robot down, the robot pushes the slide 6 down, inserts the electronic component 7 on the PC B substrate 20, and then the cylinder 2 continues to push, and the recommended slide 6 and the positioning support are descended until the PCB substrate The lower surface of 20 contacts the weld head 21 on the base 18, and the weld head 21 welds the pins of the electronic component 7 to the lower surface of the PCB substrate 20. After the welding is completed, the cylinder 2 goes up.
[0016] 所述的机械手包括水平的悬臂 3， 所述的悬臂 3上有多个可移动关节 4， 所述的 可移动关节 4在悬臂 3上移动， 所述的移动关节 4下方连接有电子元件固定块 5。 可移动关节 4根据电子元器件 7安装位置进行调节， 电子元件固定块 5的形状也是 根据需要装配的电子元器件进行设计和选择。  [0016] The manipulator includes a horizontal cantilever 3, the cantilever 3 has a plurality of movable joints 4, the movable joint 4 moves on the cantilever 3, and the movable joint 4 is connected with an electron below Component fixing block 5. The movable joint 4 is adjusted according to the mounting position of the electronic component 7, and the shape of the electronic component fixing block 5 is also designed and selected according to the electronic components to be assembled.
[0017] 所述的滑板 6与支架 1之间还连接有滑板复位弹簧； 所述的滑板 6下行由气缸 2通 过电子元件固定块 5推动， 上行有滑板复位弹簧驱动。  [0017] A slide return spring is further connected between the slide plate 6 and the bracket 1; the slide plate 6 is driven downward by the cylinder 2 through the electronic component fixing block 5, and is driven by a slide return spring.
[0018] 所述的旋转盘 12为框形结构， 中间镂空处放置所述的定位支撑架； 所述的定位 支撑架包括 PCB基板定位槽 10， 所述的 PCB基板定位槽 10上边缘有外凸边缘， 所 述的外凸边缘位于 PCB基板定位槽 10的外侧壁上， 外凸边缘与旋转盘 12之间垂直 安装有压缩弹簧 11 ; 所述的 PCB基板定位槽 10的槽底为镂空， 槽底周围有内凸起 支撑边沿， 所述的内凸起支撑边沿位于 PCB基板定位槽 10的内侧壁上， PCB基板 20放置在内凸起支撑边沿上。 [0019] 气缸 2推动滑板 6下行后， 将滑板 6上电子元器件 7安装在 PCB基板 20上后， 带动 滑板 6和 PCB基板定位槽 10—起下行， 旋转盘 12停留在原位。 上行后， 滑板 6脱离 了 PCB基板定位槽 10后， PCB基板定位槽 10在压缩弹簧 11作用下复位。 [0018] The rotating disk 12 is a frame-shaped structure, and the positioning support frame is placed at the middle hollow; the positioning support frame includes a PCB substrate positioning slot 10, and the upper edge of the PCB substrate positioning slot 10 is external. a convex edge, the convex edge is located on the outer side wall of the PCB substrate positioning groove 10, and a compression spring 11 is vertically disposed between the convex edge and the rotating disk 12; the bottom of the groove of the PCB substrate positioning groove 10 is hollowed out. There is an inner convex supporting edge around the bottom of the groove, the inner convex supporting edge is located on the inner side wall of the PCB substrate positioning groove 10, and the PCB substrate 20 is placed on the inner convex supporting edge. [0019] After the cylinder 2 pushes the slide plate 6 down, after the electronic component 7 on the slide plate 6 is mounted on the PCB substrate 20, the slide plate 6 and the PCB substrate positioning groove 10 are driven downward, and the rotary disk 12 stays in the original position. After the upward movement, after the slide plate 6 is separated from the PCB substrate positioning groove 10, the PCB substrate positioning groove 10 is reset by the compression spring 11.
[0020] 所述的底座 18上安装有垂直的第一导向杆 16， 所述的第一导向杆 16上套有托架 13， 所述的托架 13用于托住 PCB基板定位槽 10的底部； 所述的托架 13下方安装有 第一复位压缩弹簧 14。 托架 13用于对 PCB基板定位槽 10进行精准定位， 并且对 P CB基板定位槽 10下行进行导向。 PCB基板定位槽 10下行过程中， 推动托架 13— 起下行， 上行后， PCB基板定位槽 10与托架 13分离， 托架 13在第一复位压缩弹簧 14作用下复位。  [0020] The base 18 is mounted with a vertical first guiding rod 16 , and the first guiding rod 16 is sleeved with a bracket 13 for supporting the PCB substrate positioning slot 10 . a bottom portion; a first return compression spring 14 is mounted below the bracket 13. The bracket 13 is used for accurately positioning the PCB substrate positioning groove 10 and guiding the P CB substrate positioning groove 10 downward. During the downward process of the PCB substrate positioning groove 10, the carrier 13 is pushed down, and after the upstream, the PCB substrate positioning groove 10 is separated from the carrier 13, and the carrier 13 is reset by the first reset compression spring 14.
[0021] 所述的底座 18上还安装有第二导向杆 23， 所述的第二导向杆 23上套有总托架 15 ； 所述的总托架 15下方与底座 18之间安装有第二复位压缩弹簧 17; 所述的托架 1 3位于总托架 15上方； 所述的第一复位压缩弹簧 14安装在托架 13和总托架 15之间  [0021] The base 18 is further mounted with a second guiding rod 23, and the second guiding rod 23 is sleeved with a total bracket 15; the second bracket 15 is mounted between the lower bracket and the base 18 a reset spring 17; the bracket 13 is located above the main bracket 15; the first return compression spring 14 is mounted between the bracket 13 and the main bracket 15
[0022] 总托架 15进行最后的精准定位和下行导向。 确保最后焊接位置精准。 [0022] The total carriage 15 performs the final precise positioning and the downward guidance. Make sure the final welding position is accurate.

Claims

权利要求书 [权利要求 1] PCB基板自动装配装置， 其特征在于： 包括支架 （1) ， 所述的支架 The present invention provides a PCB substrate automatic assembly device, comprising: a bracket (1), the bracket
(1) 相对内侧有垂直的导轨 （9) ； 支架 （1) 之间有横梁连接， 所 述的横梁上安装有气缸 （2) ； 所述的气缸 （2) 下方连接有机械手， 所述的机械手抓取电子元器件 （7) ； 所述的机械手下方还有滑板 （6 ) ， 所述的滑板 （6) 的两端连接有滑块 （8) ； 所述的滑块 （8) 安 装在导轨 （9) 内， 形成滑动副； 所述的滑板 （6) 上幵设有定位孔， 所述的定位孔用于定位机械手抓取的电子元器件 （7) ； 所述的滑板 (6) 下方有旋转盘 （12) ； 所述的支架 （1) 的外侧安装有旋转立柱 (22) ， 所述的旋转盘 （12) 有多个， 均匀分布在旋转立柱 （22) 上 ， 并且多个旋转盘 （12) 在同一个水平面上， 旋转立柱 （22) —个工 位， 其中一个旋转盘 （12) 位于滑板 （6) 的下方； 所述的旋转盘 （1 2) 上有定位支撑架； 所述的 PCB基板 （20) 放置在定位支撑架上； 所述的滑板 （6) 和旋转盘 （12) 的下方还有底座 （18) ， 所述的底 座 （18) 上有焊接头 （21) 。  (1) There is a vertical guide rail (9) on the inner side; a cross member is connected between the brackets (1), and a cylinder (2) is mounted on the cross beam; a robot is connected below the cylinder (2), The robot grabs the electronic component (7); there is a slide plate (6) under the robot, and the slider (8) is connected to both ends of the slide plate (6); the slider (8) is installed at a sliding pair is formed in the guide rail (9); the sliding plate (6) is provided with a positioning hole, and the positioning hole is used for positioning the electronic component (7) grasped by the robot; the sliding plate (6) There is a rotating disc (12) underneath; a rotating column (22) is mounted on the outer side of the bracket (1), and the rotating disc (12) has a plurality of rotating discs (12) evenly distributed on the rotating column (22), and a plurality of Rotating disc (12) on the same horizontal surface, rotating column (22) - one station, one rotating disc (12) is located below the sliding plate (6); the rotating disc (1 2) has a positioning support frame The PCB substrate (20) is placed on the positioning support; the skateboard (6) There is a base (18) below the rotating disc (12), and the base (18) has a welded joint (21).
[权利要求 2] 根据权利要求 1所述的 PCB基板自动装配装置， 其特征在于： 所述的 机械手包括水平的悬臂 （3) ， 所述的悬臂 （3) 上有多个可移动关节[Claim 2] The PCB substrate automatic assembly apparatus according to claim 1, wherein: the robot includes a horizontal cantilever (3), and the cantilever (3) has a plurality of movable joints
(4) ， 所述的可移动关节 （4) 在悬臂 （3) 上移动， 所述的移动关 节 （4) 下方连接有电子元件固定块 （5) 。 (4), the movable joint (4) moves on the cantilever (3), and the electronic component fixing block (5) is connected below the moving joint (4).
[权利要求 3] 根据权利要求 2所述的 PCB基板自动装配装置， 其特征在于： 所述的 滑板 （6) 与支架 （1) 之间还连接有滑板复位弹簧； 所述的滑板 （6 ) 下行由气缸 （2) 通过电子元件固定块 （5) 推动， 上行有滑板复位 弹簧驱动。 [Claim 3] The PCB substrate automatic assembly device according to claim 2, wherein: a sliding plate return spring is further connected between the sliding plate (6) and the bracket (1); the sliding plate (6) The lower side is driven by the cylinder (2) through the electronic component fixing block (5), and the upper plate is driven by the slide return spring.
[权利要求 4] 根据权利要求 1所述的 PCB基板自动装配装置， 其特征在于： 所述的 旋转盘 （12) 为框形结构， 中间镂空处放置所述的定位支撑架； 所述 的定位支撑架包括 PCB基板定位槽 （10) ， 所述的 PCB基板定位槽 （ 10) 上边缘有外凸边缘， 所述的外凸边缘位于 PCB基板定位槽 （10) 的外侧壁上， 外凸边缘与旋转盘 （12) 之间垂直安装有压缩弹簧 （11 ) ； 所述的 PCB基板定位槽 （10) 的槽底为镂空， 槽底周围有内凸起 支撑边沿， 所述的内凸起支撑边沿位于 PCB基板定位槽 （10) 的内侧 壁上， PCB基板 （20) 放置在内凸起支撑边沿上。 [Claim 4] The PCB substrate automatic assembly device according to claim 1, wherein: the rotating disk (12) is a frame-shaped structure, and the positioning support frame is placed at an intermediate hollow; the positioning The support frame includes a PCB substrate positioning groove (10), and the upper edge of the PCB substrate positioning groove (10) has a convex edge, and the convex edge is located on the outer side wall of the PCB substrate positioning groove (10), and the convex edge A compression spring is mounted perpendicularly to the rotating disk (12) (11 The bottom of the groove of the PCB substrate positioning groove (10) is hollow, and the bottom of the groove has an inner convex support edge, and the inner convex support edge is located on the inner side wall of the PCB substrate positioning groove (10), PCB The substrate (20) is placed on the inner raised support rim.
[权利要求 5] 根据权利要求 4所述的 PCB基板自动装配装置， 其特征在于： 所述的 底座 （18) 上安装有垂直的第一导向杆 （16) ， 所述的第一导向杆 （ 16) 上套有托架 （13) ， 所述的托架 （13) 用于托住 PCB基板定位槽 (10) 的底部； 所述的托架 （13) 下方安装有第一复位压缩弹簧 （14  [Claim 5] The PCB substrate automatic assembly device according to claim 4, wherein: the base (18) is mounted with a vertical first guiding rod (16), and the first guiding rod ( 16) The upper sleeve has a bracket (13), and the bracket (13) is for supporting the bottom of the PCB substrate positioning groove (10); the first reset compression spring is mounted under the bracket (13) ( 14
[权利要求 6] 根据权利要求 4所述的 PCB基板自动装配装置， 其特征在于： 所述的 底座 （18) 上还安装有第二导向杆 （23) ， 所述的第二导向杆 （23) 上套有总托架 （15) ； 所述的总托架 （15) 下方与底座 （18) 之间安 装有第二复位压缩弹簧 （17) ； 所述的托架 （13) 位于总托架 （15) 上方； 所述的第一复位压缩弹簧 （14) 安装在托架 （13) 和总托架 （ 15) 之间。 [Claim 6] The PCB substrate automatic assembly device according to claim 4, wherein: the base (18) is further mounted with a second guiding rod (23), and the second guiding rod (23) The upper bracket has a main bracket (15); a second return compression spring (17) is mounted between the lower bracket (15) and the base (18); the bracket (13) is located at the pallet Above the frame (15); the first return compression spring (14) is mounted between the bracket (13) and the main bracket (15).
PCT/CN2017/075811 2017-03-06 2017-03-06 Automatic pcb substrate assembly apparatus WO2018161240A1 (en)

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Publication number Priority date Publication date Assignee Title
KR20010083388A (en) * 2000-02-12 2001-09-01 김홍기 Solder grip
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CN103391693A (en) * 2012-05-09 2013-11-13 珠海格力电器股份有限公司 Positioning device for welding electronic component and method for welding electronic component
CN104918477A (en) * 2015-06-25 2015-09-16 贵州天义汽车电器有限公司 Automatic inserting system for electronic components and inserting method for same
CN205847852U (en) * 2016-07-05 2016-12-28 广州鑫仕光电科技有限公司 A kind of pcb board abnormity electronic component inserter
CN106270913A (en) * 2016-09-25 2017-01-04 东莞市联洲知识产权运营管理有限公司 The welder of electronic component on a kind of surface-mounted integrated circuit

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010083388A (en) * 2000-02-12 2001-09-01 김홍기 Solder grip
CN101071783A (en) * 2006-05-10 2007-11-14 松下电器产业株式会社 Component mounting apparatus and component mounting method
CN103391693A (en) * 2012-05-09 2013-11-13 珠海格力电器股份有限公司 Positioning device for welding electronic component and method for welding electronic component
CN104918477A (en) * 2015-06-25 2015-09-16 贵州天义汽车电器有限公司 Automatic inserting system for electronic components and inserting method for same
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