WO2018159112A1

WO2018159112A1 - Radiation imaging device and radiation imaging system

Info

Publication number: WO2018159112A1
Application number: PCT/JP2018/000648
Authority: WO
Inventors: 竹田　慎市; 長野　和美; 野村　慶一; 智之大池
Original assignee: キヤノン株式会社
Priority date: 2017-03-02
Filing date: 2018-01-12
Publication date: 2018-09-07
Also published as: JP2018146306A

Abstract

Provided is a radiation imaging device configured such that inside a casing are disposed: a first imaging panel and a second imaging panel that are disposed such that pixel arrays thereof, which are for acquiring radiation images, overlap each other; a plurality of processing chips that process signals output from the first imaging panel and the second imaging panel; and a support base that is for supporting the first imaging panel and the second imaging panel. The plurality of processing chips are disposed between a rear surface of the support base, the rear surface being on the opposite side from a support surface of the support base that supports the first imaging panel and the second imaging panel, and a bottom part of the casing, the bottom part facing the rear surface of the support base. The plurality of processing chips radiate heat via the bottom part or a side part of the casing that intersects the bottom part.

Description

Radiation imaging apparatus and radiation imaging system

The present invention relates to a radiation imaging apparatus and a radiation imaging system.

As an imaging apparatus used for medical image diagnosis and nondestructive inspection, there is a radiation imaging apparatus including an imaging panel in which pixels in which a combination of a conversion element that converts radiation into electric charge and a switching element such as a thin film transistor (TFT) are arranged in an array. Widely used. There is a method for acquiring a plurality of radiographic images using radiation having different energy components using such a radiation imaging apparatus, and acquiring an energy subtraction image in which a specific subject portion is separated or emphasized from a difference between the acquired radiographic images. Are known. In Patent Document 1, to obtain an energy subtraction image, radiation images of radiation having two different energy components are recorded by one radiation irradiation (one-shot method) on a subject using two imaging panels. A radiation imaging apparatus has been proposed.

JP 2010-101805 A

The processing chip that processes the signal output from each imaging panel generates heat when processing the signal. As shown in Patent Document 1, when a substrate on which a circuit for performing signal processing is attached to a support base instructed by two imaging panels, heat from the processing chip passes through the support base. To the imaging panel. In this case, a temperature difference may occur between the imaging panel arranged on the support base side and the imaging panel arranged on the side away from the support base. When a temperature difference occurs between the imaging panels, a difference in characteristics may occur between the pixels arranged in the two imaging panels. In the one-shot method, an energy subtraction image is generated from radiographic images captured by two imaging panels at the same time. If there is a difference in characteristics between the two imaging panels, the image quality of the acquired energy subtraction image is degraded. there is a possibility.

An object of the present invention is to provide a technique for suppressing deterioration in image quality in a radiation imaging apparatus that uses two imaging panels to acquire an energy subtraction image by one irradiation of radiation.

In view of the above problems, a radiation imaging apparatus according to an embodiment of the present invention includes a first imaging panel and a second imaging panel in which pixel arrays for acquiring a radiation image are arranged to overlap each other, and a first imaging panel. A plurality of processing chips for processing signals output from the imaging panel and the second imaging panel, and a support base for supporting the first imaging panel and the second imaging panel. A plurality of processing chips including a back surface opposite to a support surface supporting the first image pickup panel and the second image pickup panel of the support base; Among these, it is arranged between the back surface of the support base and the bottom portion facing, and radiates heat through the bottom portion or a side portion intersecting with the bottom portion.

By the above means, a technique for suppressing deterioration in image quality is provided in a radiation imaging apparatus for acquiring an energy subtraction image by one radiation irradiation using two imaging panels.

Other features and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings. In the accompanying drawings, the same or similar components are denoted by the same reference numerals.

The accompanying drawings are included in the specification, constitute a part thereof, show an embodiment of the present invention, and are used to explain the principle of the present invention together with the description.
The figure which shows the external shape of the radiation imaging device which concerns on embodiment of this invention. The top view of the radiation imaging device of FIG. Sectional drawing of the radiation imaging device of FIG. The figure which shows the modification of the top view of FIG. The figure which shows the modification of sectional drawing of FIG. The figure which shows the modification of the top view of FIG. The figure which shows the modification of sectional drawing of FIG. The figure which shows the structural example of the radiation imaging system using the radiation imaging device of FIG.

Hereinafter, specific embodiments of the radiation imaging apparatus according to the present invention will be described with reference to the accompanying drawings. The radiation in the present invention includes a beam having energy of the same degree or more, such as X-rays, β-rays, γ-rays, etc., which are beams formed by particles (including photons) emitted by radiation decay, such as X It can also include rays, particle rays, and cosmic rays.

First Embodiment A configuration of a radiation imaging apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a configuration example of the outer shape of the radiation imaging apparatus 100 according to the first embodiment of the present invention. The radiation imaging apparatus 100 includes a housing 150, and the radiation is emitted from the direction of the arrow in the drawing. The housing 150 includes an irradiation surface 151 on which radiation is irradiated. FIG. 2 is a plan view seen from the irradiation surface 151 side of the radiation imaging apparatus 100. FIG. 3 is a cross-sectional view of the portion indicated by ABC in FIG.

In the housing 150, two imaging panels 130 are arranged in which pixel arrays for acquiring radiographic images are arranged so as to overlap each other. (In this specification, when a specific imaging panel of the two imaging panels 130 is described, “a” or the like is added after the reference symbol as in the imaging panel 130a. The same applies to other components. In addition, a support base 140 for supporting the two imaging panels 130 is disposed in the housing 150. In this embodiment, the support base 140 is fixed to the back surface opposite to the irradiation surface 151 for irradiating the housing 150 with radiation.

As shown in FIG. 3, among the two imaging panels 130, the imaging panel 130 a is arranged on the side near the irradiation surface 151 for irradiating radiation, and the imaging panel 130 b is arranged on the side near the support base 140. . For fixing each of the imaging panels 130, an adhesive resin, an adhesive sheet (double-sided adhesive sheet), a damper material, or the like can be used. Further, a radiation absorption filter (not shown) may be disposed between the imaging panel 130a and the imaging panel 130b. As the radiation absorbing filter, a metal sheet (metal foil), a sheet containing metal particles in a resin, or a laminate of them is used, and the radiation on the low energy side is absorbed. For example, a copper (Cu) filter that reduces X-rays of 33 keV or less can be used. By disposing the radiation absorbing filter between the imaging panel 130a and the imaging panel 130b, it is possible to increase the resolution of the energy of the radiation received by the two imaging panels 130. In the present embodiment, the imaging panel 130a generates an image signal mainly based on high-energy radiation, and the imaging panel 130b generates an image signal mainly based on low-energy radiation.

In the present embodiment, the imaging panel 130 includes a scintillator 132 that converts radiation into light, and a pixel array 133 in which pixels including a conversion element that converts light converted by the scintillator 132 into an electrical signal are arranged in a two-dimensional array. The photoelectric conversion panel 131 provided with. The imaging panel 130a and the imaging panel 130b are arranged on the support base 140 so that the pixel array 133a of the imaging panel 130a and the pixel array 133b of the imaging panel 130b overlap each other. The imaging panel 130a and the imaging panel 130b may have the same configuration. In the imaging panel 130, the pixel array 133a and the pixel array 133b may have the same configuration. By using imaging panels having the same configuration for the two imaging panels 130, the types of components and members used in the radiation imaging apparatus 100 can be suppressed, and the manufacturing cost of the radiation imaging apparatus 100 can be suppressed. .

The photoelectric conversion panel 131 can be configured by forming a semiconductor layer such as amorphous silicon on a substrate using glass or the like, and forming a switch element such as a thin film transistor (TFT), a conversion element, or the like on the semiconductor layer. . A switch element and a conversion element may be formed using a silicon substrate. As the scintillator 132, cesium iodide (CsI) in which thallium (Tl), sodium (Na), or the like is used as an activator, gadolinium oxysulfide (Gd2O2S: Tb), or the like can be used. A protective film (not shown) can be formed on the scintillator 132. As the protective film, polyparaxylylene (parylene), hot melt resin, or a laminated sheet of hot melt resin and aluminum can be used.

In the present embodiment, a configuration using the scintillator 132 that converts radiation into light and the photoelectric conversion panel 131 that converts light into an electrical signal is shown, but a configuration that directly converts incident radiation into an electrical signal may be used. In this case, amorphous selenium (a-Se) or the like can be used as a material constituting the conversion element.

In the housing 150, a plurality of processing chips 101 that process signals output from the two imaging panels 130 and a plurality of driving chips 102 that drive the two imaging panels 130 are further arranged. Each of the processing chips 101 is attached to a circuit board. In the present embodiment, the circuit board to which the processing chip 101 is attached includes a rigid circuit board 111 and a flexible circuit board 121. However, the present invention is not limited to this, and the processing chip 101 may be disposed only on the rigid circuit board 111, and the imaging panel 130 and the rigid circuit board 111 may be connected by a flexible wiring board. Further, all the processing chips 101 may be attached to the flexible circuit board 121. Each of the processing chips 101 is attached to a circuit board including at least one of one or more rigid circuit boards 111 and one or more flexible circuit boards 121. The arrangement of the processing chip 101, the rigid circuit board 111, and the flexible circuit board 121 will be described later. The driving chip 102 is attached to the driving circuit board 112, and is fixed to the support base 140, the bottom part 152 inside the casing 150, or the side part 153 inside the casing 150 via the driving circuit board 112. . The imaging panel 130 and the driving circuit board 112 are connected by a flexible wiring board 122. Similarly to the processing chip 101, the driving chip 102 may be attached to the flexible circuit board. The rigid circuit board 111 and the driving circuit board 112 are insulating boards using a resin such as epoxy resin or fluororesin, ceramic, etc., and a wiring pattern is formed on the surface, and the processing chip 101 or the driving chip. 102 is attached. The flexible circuit board 121 and the flexible wiring board 122 are substrates having a resin pattern such as a polyimide film as a base material and a wiring pattern formed on the surface thereof. A processing chip 101 is attached to the flexible circuit board 121. For the wiring pattern, a metal such as copper or another conductor can be used. The processing chip 101, the driving chip 102, the rigid circuit board 111, the flexible circuit board 121, the driving circuit board 112, and the flexible wiring board 122 have the same configuration and structure regardless of the imaging panel 130 to be connected. It may be. By using parts and members having the same configuration and structure, the types of parts and members are suppressed as compared with the case where the parts and members are properly used for each imaging panel 130 to be connected, and the manufacturing cost of the radiation imaging apparatus 100 is reduced. It becomes possible to suppress.

In the present embodiment, the two imaging panels 130 have a rectangular shape, and the connection portions 171 provided on two opposite sides are electrically connected to the processing chip 101. In addition, the imaging panel 130a and the imaging panel 130b are arranged so that the two sides where the connection part 171a of the imaging panel 130a is arranged and the two sides where the connection part 171b of the imaging panel 130b are arranged are along each other. Is done. In addition, the connection portion 172 provided on two sides intersecting the side where the connection portion 171 is arranged and the driving chip 102 are electrically connected. In other words, either the connection portion 171 or the connection portion 172 is disposed on the side where the two

image pickup panels

130a and 130b overlap each other in the

image pickup panels

130a and 130b.

2 and 3, the flexible circuit board 121a and the rigid circuit board 111a are connected to the connection portion 171a of the imaging panel 130a via the flexible circuit board 121a. A processing chip 101a-1 is attached to the rigid circuit board 111a, and a processing chip 101a-2 is attached to the flexible circuit board 121a to process signals output from the imaging panel 130a. In addition, the side including the connection portion 171b of the imaging panel 130b is arranged so as to overlap the side including the connection portion 171a of the imaging panel 130a. The flexible circuit board 121b and the rigid circuit board 111b are connected to the connection portion 171b of the imaging panel 130b via the flexible circuit board 121b. The processing chip 101b-1 is attached to the rigid circuit board 111b, and the processing chip 101b-2 is attached to the flexible circuit board 121b, respectively, and processes signals output from the imaging panel 130b. The connection portion 172a of the imaging panel 130a is electrically connected to the driving chip 102a through the flexible wiring board 122a and the driving circuit board 112a, and the driving chip 102 drives the imaging panel 130a. In addition, the side including the connection portion 172b of the imaging panel 130b is arranged so as to overlap the side including the connection portion 172a of the imaging panel 130a. The connection portion 172b of the imaging panel 130b is electrically connected to the driving chip 102b via the flexible wiring board 122b and the driving circuit board 112b, and the driving chip 102 drives the imaging panel 130a.

Next, the arrangement of the plurality of processing chips 101, the rigid circuit board 111, and the flexible circuit board 121 will be described. The rigid circuit board 111 is disposed between the support base 140 and the bottom 152 of the housing 150, and the surface 1111 of the rigid circuit board 111 that faces the support base 140 has a space with respect to the support base 140. Opposite through. Although not shown in FIG. 3, the rigid circuit board 111 is disposed between the support base 140 and the side portion 153 of the housing 150 and faces the support base 140 in the rigid circuit board 111. The surface 1111 faces the support base 140 through a space. Similarly, the flexible circuit board 121 is disposed between the support base 140 and the bottom 152 or the side part 153 of the housing 150, and the surface 1211 of the flexible circuit board 121 that faces the support base 140 is a support base. It can be opposed to the table 140 via a space. In addition, each processing chip 101 is attached to the

surfaces

1112 and 1212 on the opposite side of the surface facing the support base 140 of the rigid circuit board 111 and the flexible circuit board 121. In other words, each processing chip 101 is attached to the

surfaces

1112 and 1212 of the rigid circuit board 111 and the flexible circuit board 121 that face the bottom 152 or the side 153 of the housing 150. Further, each processing chip 101 is in contact with the bottom 152 or the side 153 of the casing 150 directly or via the fixing member 160 so that heat is radiated through the bottom 152 or the side 153 of the casing 150. . The fixing member 160 may be made of silicon resin or rubber having high thermal conductivity so that heat generated in the processing chip 101 can be efficiently radiated. In the present embodiment, the processing chip 101 includes a bottom 152 that faces the back surface of the housing 150 opposite to the support surface that supports the imaging panel 130 of the support base 140, and a side portion 153 that intersects the bottom 152. And so as to contact each other. With the above-described configuration, the positions of the rigid circuit board 111 and the flexible circuit board 121 can be respectively fixed with respect to the housing 150 via the processing chip 101 (and the fixing member 160).

Here, the effect of the present invention will be described. The heat generation amount of the processing chip 101 that processes the signal output from the imaging panel 130 can be larger than the heat generation amount of the driving chip 102 for driving the imaging panel 130. This is a circuit that requires high-speed processing, and since the signal read from the imaging panel 130 is very weak, a low-noise and high-magnification amplifier circuit is necessary, and the components (amplifier IC, etc.) used generate heat. This is because it is particularly large. In this embodiment, the processing chip 101 is in contact with the bottom 152 or the side part 153 of the housing 150 that is in direct contact with the outside air, either directly or via the fixing member 160, against the heat generated by the processing chip 101. As a result, heat can be efficiently radiated to the outside air. Further, spaces exist between the

surfaces

1111 and 1211 of the rigid circuit board 111 and the flexible circuit board 121 that face the support base 140 and the support base 140. In other words, the processing chip 101 does not contact the back surface opposite to the support surface of the support base 140 directly or via the rigid circuit board 111 or the flexible circuit board 121. That is, the circuit board (rigid circuit board 111 or flexible circuit board 121.) and the circuit board (rigid circuit board 111 or flexible circuit board 121.) between the processing chip 101 and the support base 140, and the support base 140. The thermal resistance through the space between the processing chip 101 and the bottom portion 152 or the side portion 153 of the housing 150 is larger than the thermal resistance. For this reason, the thermal resistance from the processing chip 101 to the imaging panel 130 via the support base 140 or the like increases. Accordingly, the heat generated from the processing chip 101 is prevented from diffusing to the imaging panel 130, and a temperature difference is generated between the imaging panel 130a and the imaging panel 130b due to the heat generated from the processing chip 101. This can be suppressed. For this reason, it is suppressed that the characteristic of a pixel varies between the pixel array 133a and the pixel array 133b of the

imaging panels

130a and 130b, and the deterioration of the image quality of the energy subtraction image acquired by the one-shot method is suppressed.

Further, as shown in FIGS. 2 and 3, in order to efficiently dissipate the heat generated from the processing chip 101 through the housing 150, the rigid circuit board 111 and the support base 140 of the flexible circuit board 121 The processing chip 101 may not be disposed on the opposing

surfaces

1111 and 1211. Further, as shown in FIG. 2, the processing chip 101 is arranged at a point-symmetrical position with respect to the center of the rectangular casing 150 in the orthogonal projection with respect to the irradiation surface 151 for irradiating the radiation of the casing 150. May be. Further, in the orthogonal projection with respect to the irradiation surface 151 for irradiating the radiation of the housing 150, the processing chip 101 is directed to a virtual line 190 passing through the center of the housing 150 and the centers of the two opposite sides of the housing 150. It may be arranged in a line symmetrical position. By disposing the plurality of processing chips 101 at point-symmetrical or line-symmetrical positions with respect to the housing 150, it is possible to suppress a temperature distribution caused by the position of a component having a large amount of heat generation being biased in the housing 150. Thereby, temperature unevenness in each plane of the imaging panel 130 can be suppressed, and variation in pixel characteristics in each plane of the imaging panel 130 can be suppressed. Here, the center of the casing 150 in the orthogonal projection with respect to the irradiation surface 151 of the casing 150 refers to the center of the diagonal of the casing 150 and the radius within the range of 20% of the diagonal from the center. Further, the center of two opposite sides of the casing 150 in the orthogonal projection with respect to the irradiation surface 151 of the casing 150 is a range of 20% of the length of each of the two opposite sides from the center and the center of the two opposite sides. Say the inside.

The housing 150 can be an exterior case that covers the above-described components. In the configuration shown in FIGS. 1 to 3, the casing 150 is drawn like a sealed integral box, but it can be configured by a member divided into two or more. Therefore, the housing 150 can be configured by combining appropriate materials for each location in the housing 150. For example, the irradiation surface 151 for irradiating the radiation of the housing 150 may be made of a material having a low radiation absorption rate on one or a part thereof so as to increase the incident efficiency of the radiation to the imaging panel 130. Examples of the material having a low radiation absorption rate include a plastic plate, a carbon plate, and a carbon fiber reinforced plastic (CFRP) plate. Further, a portion having a high thermal conductivity can be used for a portion of the housing 150 where the processing chip 101 contacts directly or via the fixing member 160. For example, the side surface and the bottom surface of the housing 150 other than the irradiation surface 151 for irradiating radiation may be configured using a material such as a metal having a high thermal conductivity. In the case where the surface on which the processing chip 101 of the housing 150 is disposed has conductivity such as metal, an insulating sheet such as a PET film is provided on the surface of the bottom 152 or the side portion 153 of the housing 150 in order to provide electrical insulation. It may be arranged.

As shown in FIGS. 2 and 3, the driving chip 102 that generates less heat than the processing chip 101 has a back surface opposite to the support surface that supports the imaging panel 130 of the support base 140 and a bottom portion of the housing 150. 152 or the side portion 153. In this case, the support base 140 may be made of a material having a lower thermal conductivity than the portion of the housing 150 that the processing chip 101 contacts directly or via the fixing member 160. The driving chip 102 can also generate heat, but by using a material with low thermal conductivity for the support base 140, it is possible to prevent heat from being transmitted from the driving chip 102 to the imaging panel 130 via the support base 140. be able to. Further, the driving chip 102b shown in FIG. 3 may be fixed to the bottom 152 or the side 153 of the housing 150 via the driving circuit board 112b like the driving chip 102a.

In this embodiment, an example in which one processing chip 101 is attached to one rigid circuit board 111 is shown, but a plurality of processing chips 101 may be attached to one rigid circuit board 111. Similarly, a plurality of processing chips 101 may be attached to one flexible circuit board 121. The number of processing chips 101 connected to each imaging panel 130 is not limited to the number shown in FIGS. 2 and 3, and the performance required for the imaging panel 130 and the performance of the processing chip 101. What is necessary is just to determine suitably by etc. Similarly, the number of the driving chips 102 is not limited to the number shown in FIGS. 2 and 3, and may be appropriately determined depending on the performance required for the imaging panel 130, the performance of the driving chip 102, and the like.

Second Embodiment A configuration of a radiation imaging apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a plan view seen from the irradiation surface 151 side of the radiation imaging apparatus 100 shown in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line ABC in FIG. Compared with the first embodiment described above, the radiation imaging apparatus 100 of the present embodiment includes

connection portions

171 and 172 to which the processing chip 101 and the driving chip 102 in the imaging panel 130a and the imaging panel 130b are connected. The positional relationship is rotated by 90 °. Other configurations may be the same as those in the first embodiment.

Also in the present embodiment, the two imaging panels 130 have a rectangular shape, and the connection portions 171 provided on two opposite sides and the processing chip 101 are electrically connected. On the other hand, in the present embodiment, the imaging panel 130a extends so that the two sides where the connection part 171a of the imaging panel 130a is arranged and the two sides where the connection part 171b of the imaging panel 130b are arranged cross each other. And the imaging panel 130b are arranged to overlap each other. In addition, the connection portion 172 provided on two sides intersecting the side where the connection portion 171 is arranged and the driving chip 102 are electrically connected. In other words, the connection part 171a and the imaging panel 130b are connected to the imaging panel 130a on the side where the two imaging panels 130 overlap with each other, or the connection part 172a and the imaging panel 130b are connected to the imaging panel 130a. A portion 171b is arranged.

4 and 5, the flexible circuit board 121a and the rigid circuit board 111a are connected to the connection portion 171a of the imaging panel 130a via the flexible circuit board 121a. A processing chip 101a-1 is attached to the rigid circuit board 111a, and a processing chip 101a-2 is attached to the flexible circuit board 121a to process signals output from the imaging panel 130a. The side provided with the connection part 172b of the imaging panel 130b is arranged so as to overlap the side provided with the connection part 171a of the imaging panel 130a. The connection portion 172b of the imaging panel 130b is electrically connected to the driving chip 102b via the flexible wiring board 122b and the driving circuit board 112b, and the driving chip 102 drives the imaging panel 130a. The connection portion 172a of the imaging panel 130a is electrically connected to the driving chip 102a through the flexible wiring board 122a and the driving circuit board 112a, and the driving chip 102 drives the imaging panel 130a. The side provided with the connection part 171a of the imaging panel 130b is arranged so as to overlap the side provided with the connection part 172a of the imaging panel 130a. The flexible circuit board 121b and the rigid circuit board 111b are connected to the connection portion 171b of the imaging panel 130b via the flexible circuit board 121b. The processing chip 101b-1 is attached to the rigid circuit board 111b, and the processing chip 101b-2 is attached to the flexible circuit board 121b, respectively, and processes signals output from the imaging panel 130b.

Also in the present embodiment, the processing chip 101 efficiently dissipates heat to the outside air by contacting the bottom portion 152 or the side portion 153 of the casing 150 that directly contacts the outside air, directly or via the fixing member 160. Can do. Further, spaces exist between the support base 140 and the

surfaces

1111 and 1211 facing the support base 140 of the rigid circuit board 111 and the flexible circuit board 121, and the support base 140 is moved from the processing chip 101. The thermal resistance to the imaging panel 130 is large. Further, the processing chip 101 does not contact the back surface opposite to the support surface of the support base 140. With this configuration, heat generated from the processing chip 101 can be prevented from diffusing to the imaging panel 130, and a temperature difference between the imaging panel 130a and the imaging panel 130b can be suppressed. For this reason, it is suppressed that the characteristic of a pixel varies between the pixel array 133a and the pixel array 133b of the

imaging panels

Furthermore, in the present embodiment, the connection portions 171 to which the processing chip 101 is connected are distributed on the four sides of the two imaging panels 130. For this reason, it becomes possible to arrange | position the processing chip | tip 101 more evenly in the bottom part 152 and the side part 153 of the housing | casing 150 than the above-mentioned 1st Embodiment. Thereby, temperature unevenness in each plane of the imaging panel 130 can be suppressed, and variation in pixel characteristics in each plane of the imaging panel 130 can be further suppressed. Similarly to the above-described first embodiment, in order to suppress uneven temperature in the surface, as shown in FIG. 4, in the orthogonal projection for the irradiation surface 151 for irradiating the radiation of the housing 150, processing is performed. The chip 101 may be disposed at a point-symmetrical position with respect to the center of the rectangular casing 150. Similarly, in orthographic projection onto the irradiation surface 151 for irradiating the radiation of the housing 150, the processing chip 101 passes through the center of the housing 150 and the center of two opposite sides of the housing 150. May be arranged in a line-symmetric position.

Third Embodiment A configuration of a radiation imaging apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a plan view seen from the irradiation surface 151 side of the radiation imaging apparatus 100 shown in FIG. 1, and FIG. 7 is a cross-sectional view taken along the line ABC in FIG. In the first and second embodiments described above, the rigid circuit board 111a to which the processing chip 101 connected to the imaging panel 130a is attached and the rigid circuit to which the processing chip 101 connected to the imaging panel 130b is attached. The substrate 111b was arranged separately. On the other hand, the radiation imaging apparatus 100 according to the present embodiment includes a processing chip 101a and a processing chip 101b that process signals output from the imaging panel 130a and the imaging panel 130b, as compared with the second embodiment described above. Both are arranged on one rigid circuit board 111. Other configurations may be the same as those of the second embodiment described above.

Also in the present embodiment, the processing chip 101 efficiently dissipates heat to the outside air by contacting the bottom portion 152 or the side portion 153 of the casing 150 that directly contacts the outside air, directly or via the fixing member 160. And has the same effect as the second embodiment described above. In addition, the rigid circuit board 111 has an integral structure in the housing 150. For this reason, the rigid circuit board 111 functions as a plate-like member that conducts heat, thereby further suppressing temperature unevenness in the housing 150 and the respective surfaces of the imaging panel 130, thereby stabilizing the radiation imaging apparatus 100. It becomes possible to operate.

As mentioned above, although embodiment which concerns on this invention was shown, it cannot be overemphasized that this invention is not limited to these embodiment, In the range which does not deviate from the summary of this invention, embodiment mentioned above can be changed and combined suitably. Is possible. For example, the monolithic rigid circuit board 111 described in the third embodiment may be incorporated in the first embodiment. Further, in each of the above-described embodiments, in each imaging panel 130, two connection portions 171 connected to the processing chip 101 and two connection portions 172 connected to the driving chip 102 are arranged. Explained the configuration. However, even if each of the imaging panels 130 has a configuration in which one connection portion 171 connected to the processing chip 101 and one connection portion 172 connected to the driving chip 102 are arranged, one by one. An effect can be obtained.

Hereinafter, a radiation imaging system in which the radiation imaging apparatus 100 of the present invention is incorporated will be exemplarily described with reference to FIG. X-rays 6060 generated by an X-ray tube 6050 serving as a radiation source pass through a chest 6062 of a patient or subject 6061 and enter the radiation imaging apparatus 100 of the present invention. This incident X-ray includes information inside the body of the patient or subject 6061. In the radiation imaging apparatus 100, the scintillator emits light in response to the incidence of the X-ray 6060, and this is photoelectrically converted by the photoelectric conversion element to obtain electrical information. This information is converted into digital data, image-processed by an image processor 6070 as a signal processing unit, and can be observed on a display 6080 as a display unit of a control room.

Further, this information can be transferred to a remote place by a transmission processing unit such as a network 6090 such as a telephone, a LAN, and the Internet. In this way, it can be displayed on a display 6081 which is a display unit such as a doctor room in another place, and a doctor in a remote place can make a diagnosis. In addition, this information can be recorded on a recording medium such as an optical disk, and can also be recorded on a film 6110 serving as a recording medium by the film processor 6100.

The present invention is not limited to the above embodiment, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, in order to make the scope of the present invention public, the following claims are attached.

This application claims priority on the basis of Japanese Patent Application No. 2017-39773 filed on Mar. 2, 2017, the entire contents of which are incorporated herein by reference.

Claims

A first imaging panel and a second imaging panel arranged so that pixel arrays for acquiring radiographic images overlap each other, and signals output from the first imaging panel and the second imaging panel are processed A plurality of processing chips, and a support base for supporting the first imaging panel and the second imaging panel, wherein the radiation imaging apparatus is disposed in a housing,
The plurality of processing chips include a back surface opposite to a support surface that supports the first imaging panel and the second imaging panel in the support base, and the support base in the housing. A radiation imaging apparatus, wherein the radiation imaging apparatus is disposed between a bottom portion facing a back surface and radiates heat through the bottom portion or a side portion intersecting with the bottom portion.
The radiation imaging apparatus according to claim 1, wherein the plurality of processing chips are in contact with the bottom portion or the side portion directly or through a fixing member.
One or more first circuit boards for mounting the plurality of processing chips are further arranged in the housing;
The one or more first circuit boards are disposed between the back surface of the support base and the bottom portion of the housing,
The first surface of the one or more first circuit boards facing the support base is opposed to the support base via a space,
Each of the plurality of processing chips is
Of the one or more first circuit boards, the second surface is opposite to the first surface, and is attached to the second surface facing the bottom portion or the side portion. The radiation imaging apparatus according to claim 2, wherein the radiation imaging apparatus is a radiation imaging apparatus.
4. The radiation imaging apparatus according to claim 3, wherein the one or more first circuit boards are fixed to the housing via the plurality of processing chips.
The radiation imaging apparatus according to claim 3 or 4, wherein the plurality of processing chips are not arranged on the first surface.
Thermal resistance through the one or more first circuit boards and the space between the plurality of processing chips and the support base includes the plurality of processing chips, the bottom portion, or the side portion. 6. The radiation imaging apparatus according to claim 3, wherein the radiation imaging apparatus is larger than a thermal resistance between.
The one or more first circuit boards include a first circuit board on which processing chips for processing signals output from the first imaging panel among the plurality of processing chips are arranged, and the plurality of first circuit boards. And a first circuit board on which a processing chip for processing a signal output from the second imaging panel is disposed. The radiation imaging apparatus according to Item.
The one or more first circuit boards include a processing chip for processing a signal output from the first imaging panel among the plurality of processing chips and the second of the plurality of processing chips. The radiation imaging apparatus according to claim 3, further comprising a first circuit board on which both processing chips for processing signals output from the imaging panel are arranged.
9. The one or more first circuit boards according to claim 3, wherein the one or more first circuit boards include at least one of one or more rigid circuit boards and one or more flexible circuit boards. Radiation imaging device.
The radiation imaging apparatus according to any one of claims 3 to 9, wherein a material of a portion of the housing that is in contact with the plurality of processing chips directly or via the fixing member includes a metal. .
11. The thermal conductivity of a portion of the casing where the plurality of processing chips are in contact directly or via the fixing member is greater than the thermal conductivity of the support base. The radiation imaging apparatus according to any one of the above.
In orthographic projection on the irradiation surface for irradiating the radiation of the housing,
The housing has a rectangular shape;
The radiation imaging apparatus according to any one of claims 1 to 11, wherein the plurality of processing chips are arranged at point-symmetrical positions with respect to a center of the casing.
In orthographic projection on the irradiation surface for irradiating the radiation of the housing,
The housing has a rectangular shape;
The plurality of processing chips are arranged at positions symmetrical with respect to an imaginary line passing through a center of the casing and a center of two opposite sides of the casing. The radiation imaging apparatus according to any one of the above.
The radiation imaging apparatus further includes: a plurality of driving chips that drive the first imaging panel and the second imaging panel; and a plurality of second circuit boards for attaching the plurality of driving chips. Including
The plurality of driving chips are fixed to the bottom part, the side part, or the support base via any one of the plurality of second circuit boards. The radiation imaging apparatus according to item 1.
The radiation imaging apparatus according to claim 14, wherein the heat generation amount of the plurality of processing chips is larger than the heat generation amount of the plurality of driving chips.
The first imaging panel and the second imaging panel have a rectangular shape,
The first imaging panel includes first and second connection portions provided on first and second sides facing each other, the first and second connection portions and the plurality of processing chips. Among them, a processing chip for processing a signal output from the first imaging panel is electrically connected,
The second imaging panel includes third and fourth connection portions provided on the third and fourth sides facing each other, and the third and fourth connection portions and the plurality of processing chips are provided. Among them, a processing chip for processing a signal output from the second imaging panel is electrically connected,
The first image pickup panel and the second image pickup panel are arranged to overlap each other so that the first and second sides and the third and fourth sides are along each other. The radiation imaging apparatus according to any one of 1 to 15.
The first imaging panel and the second imaging panel have a rectangular shape,
The first imaging panel includes first and second connection portions provided on first and second sides facing each other, the first and second connection portions and the plurality of processing chips. Among them, a processing chip for processing a signal output from the first imaging panel is electrically connected,
The second imaging panel includes third and fourth connection portions provided on the third and fourth sides facing each other, and the third and fourth connection portions and the plurality of processing chips are provided. Among them, a processing chip for processing a signal output from the second imaging panel is electrically connected,
The first imaging panel and the second imaging panel are arranged so as to overlap so that the first and second sides and the third and fourth sides extend in a direction crossing each other. The radiation imaging apparatus according to any one of claims 1 to 15.
The first imaging panel includes fifth and sixth connection portions provided on the fifth and sixth sides intersecting the first and second sides, and the fifth and sixth connection portions. And a driving chip for driving the first imaging panel among the plurality of driving chips are electrically connected,
The second imaging panel includes seventh and eighth connection portions provided on seventh and eighth sides intersecting with the first and second sides, and the seventh and eighth connection portions. 18. The drive chip for driving the second imaging panel among the plurality of drive chips is electrically connected to the drive chip for driving the second imaging panel. Radiation imaging device.
A radiation imaging apparatus according to any one of claims 1 to 18,
A radiation imaging system comprising: a signal processing unit that processes a signal from the radiation imaging apparatus.