JP6328179B2 - Radiation detection apparatus, radiation detection system, and method of manufacturing radiation detection apparatus - Google Patents

Description

  The present invention relates to a radiation detection apparatus, a radiation detection system, and a method for manufacturing the radiation detection apparatus applied to a medical diagnostic imaging apparatus, a nondestructive inspection apparatus, an analysis apparatus using radiation, and the like.

  2. Description of the Related Art In recent years, thin film semiconductor manufacturing technology has been used for detection devices and radiation detection devices in which switch elements such as TFTs (thin film transistors) and conversion elements such as photoelectric conversion elements are combined. As shown in Patent Document 1, a proposal has been made to configure a radiation detection device by arranging a pixel array on the side irradiated with radiation emitted from a radiation source and a scintillator on the side opposite to the side irradiated with radiation. ing. And in patent document 1, it arrange | positions in order of the conductive member to which fixed potential is supplied from the radiation irradiation side of a radiation detection apparatus, a pixel array, and a scintillator, and the electromagnetic noise mixed from the radiation incident side of a pixel array A radiation detection apparatus that suitably reduces the influence has been proposed.

JP 2012-112726 A

  However, Patent Document 1 does not sufficiently study in which region of the substrate on which the pixel array is provided the conductive member is disposed. When the pixel array is provided on the first surface of the substrate and the conductive member is fixed to the second surface of the substrate facing the first surface, a problem may occur depending on the region to which the conductive member is fixed. For example, a connection terminal portion that performs electrical connection between the pixel array and an external circuit (such as a flexible wiring board or a printed circuit board) is provided around the pixel array on the first surface of the substrate. When an external circuit is connected to the connection terminal portion and the characteristic inspection of the radiation detection apparatus is performed, if a conductive member is not provided, it is affected by electromagnetic wave noise from the second surface side of the substrate. Characteristic inspection cannot be performed. For this reason, when performing the characteristic inspection, it is desirable that the conductive member be fixed to the second surface side of the substrate. However, when a defect is confirmed in the external circuit by the characteristic inspection, it is necessary to perform electrical mounting again in order to replace the external circuit. If the conductive member is fixed in a region facing the connection terminal portion on the second surface of the substrate, the substrate may be damaged when the external circuit is fixed to the connection terminal portion by pressure, heat treatment, or the like. is there.

  Therefore, in the present invention, a radiation detection device arranged in the order of a conductive member to which a fixed potential is supplied, a pixel array, and a scintillator from the radiation irradiation side of the radiation detection device is produced while ensuring electromagnetic shielding properties. The purpose is to ensure safety and maintainability.

  In the radiation detection apparatus of the present invention, a plurality of scintillators that convert irradiated radiation into visible light and pixels that convert visible light converted by the scintillator into electrical signals are arranged in a two-dimensional array on the first surface of the substrate. And a plurality of connection terminal portions provided around the pixel array on the first surface of the substrate for electrical connection between the pixel array and an external circuit, and a constant potential is supplied. The radiation detection includes: a conductive member that is arranged in the order of the conductive member, the pixel array, and the scintillator from the radiation-irradiated side; and the scintillator is disposed on the first surface side. The apparatus is characterized in that the conductive member is disposed in a region excluding a region facing the plurality of connection terminal portions on a second surface facing the first surface of the substrate. That.

  According to the present invention, in a radiation detection device arranged in the order of a conductive member, a pixel array, and a scintillator to which a fixed potential is supplied from the radiation irradiation side of the radiation detection device, productivity is ensured while ensuring electromagnetic shielding properties. Maintainability can be ensured.

Plane schematic diagram and cross-sectional schematic diagram for explaining the schematic configuration of the radiation detection apparatus Plane schematic diagram for explaining the configuration of the sensor panel of the radiation detection apparatus Plane schematic diagram of the entire radiation detector Cross-sectional schematic diagram of the entire radiation detector Cross-sectional schematic diagram for explaining each step in the manufacturing method of the radiation detection apparatus Cross-sectional schematic diagram for explaining another example of the radiation detection apparatus Cross-sectional schematic diagram for explaining another example of the radiation detection apparatus Cross-sectional schematic diagram for explaining a scintillator of a radiation detection apparatus Plane schematic diagram for explaining the scintillator of the radiation detection apparatus Schematic diagram showing an example of a schematic configuration of a radiation detection system

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. In this specification, in addition to α-rays, β-rays, γ-rays, etc., which are beams produced by particles (including photons) emitted by radioactive decay, beams having the same or higher energy, such as X-rays, Particle rays and cosmic rays are also included in the radiation.

  First, the schematic configuration of the radiation detection apparatus of the present invention will be described with reference to FIGS. 1 (a), 1 (b), and 2. FIG. 1A is a schematic plan view excluding the housing portion of the radiation detection apparatus, FIG. 1B is a schematic cross-sectional view of the radiation detection apparatus excluding the housing portion, and AA in FIG. It is a cross-sectional schematic diagram of '. FIG. 2 is a schematic plan view for explaining the configuration of the sensor panel of the radiation detection apparatus.

  As shown in FIG. 1A, FIG. 1B, and FIG. 2, the radiation detection apparatus of the present invention includes a scintillator 400, a pixel array 302, a plurality of connection terminal portions 303, and a conductive member 200. . The scintillator 400 converts irradiated radiation into visible light. The scintillator 400 can include a scintillator layer 401 that converts radiation into visible light, and a protective member 402 that protects the scintillator layer 401. In the pixel array 302, a plurality of pixels P that convert visible light converted by the scintillator 400 into electrical signals are arranged on the first surface 306 of the substrate 301 in a two-dimensional array. The substrate 301 includes a second surface 307 that faces the first surface 306. Each of the pixels 302 includes a photoelectric conversion element 304 that converts visible light into an electric signal, and a switch element such as a thin film transistor (TFT) for controlling accumulation and output of the electric signal obtained by the photoelectric conversion element 304. obtain. Each of the plurality of connection terminal portions 303 is provided in the periphery of the pixel array 302 on the first surface 306 of the substrate 301, and electrical connection between the pixel array 300 and an external circuit (details will be described later) via the wiring portion 308. It is for making a general connection. The conductive member 200 is supplied with a constant potential in order to reduce electromagnetic noise mixed from the side irradiated with radiation (second surface 307 side) to the pixel array 302. Then, the conductive member 200, the pixel array 302, and the scintillator 400 are arranged in this order from the radiation irradiation side, and the scintillator 400 is arranged on the first surface side (first surface 306 side) of the substrate 301. . Here, the conductive member 200 is disposed in a region excluding the region 309 facing the plurality of connection terminal portions 303 on the second surface 307 of the substrate 301. The conductive member 200 can be fixed to the second surface 307 of the substrate 301 in a region excluding the region 309 via an adhesive. Here, the conductive member 200 is a region whose end is located between the end of the region where the pixel array 302 of the second surface 307 is disposed and the region 309 facing the plurality of connection terminal portions 303. It is arranged in a region excluding 309. Note that the pixel array 302 and the wiring portion 308 are covered with a passivation film 310, and in this case, the scintillator 400 is provided on the surface of the passivation film 310 on the first surface 306 side of the substrate 301. The protection member 402 covers the scintillator layer 401 and the surface of the passivation film 310 in the vicinity thereof, thereby covering the scintillator layer 401 and the first surface 306 of the substrate 301 to protect the scintillator layer 401. . The protective member 402 can include a conductive layer to which a constant potential is supplied. In that case, the pixel array 302 is shielded from electromagnetic noise by the conductive member 200 and the conductive layer of the protective member 402 from both surface sides.

  The plurality of connection terminal portions 303 are electrically connected to a drive circuit (not shown) for driving the pixel array 302 as shown in FIG. It includes a plurality of first connection terminal portions arranged along one side and the opposite third side. A plurality of first flexible wiring boards 103b are electrically connected to the plurality of connection terminal portions. Further, the plurality of connection terminal portions 303 are electrically connected to a readout circuit (not shown) for reading out an electrical signal from the pixel array 302, and are opposed to a second side adjacent to the first side of the substrate 301. A plurality of second connection terminal portions arranged along the fourth side are included. A plurality of second flexible wiring boards 103b are electrically connected to the plurality of second connection terminal portions. The electrical connection between the set of connection terminal portions 303 and the flexible wiring board is made by a conductive adhesive 108 such as an anisotropic conductive film.

  The connecting portion 201 is for electrically connecting a constant potential member (details will be described later) for supplying a constant potential to the conductive member 200 and the conductive member 200. As shown in FIG. 1A, the connecting portion 201 is provided so as to pass between regions 309 facing the plurality of connecting terminal portions 303 on the second surface 307 on the second side and the fourth side of the substrate 301. It has been. Moreover, the connection part 201 is provided so that it may pass between the some 2nd flexible wiring boards 103a. The signal passing through the second flexible wiring board 103a is an electric signal generated by the pixel array 302 and is very weak compared to the signal for driving the pixel array passing through the first flexible wiring board 103b. Since the connection portion 201 to which a constant potential is supplied is located on the second flexible wiring board 103a side, the electromagnetic noise resistance of the second flexible wiring board 103a through which a weak electric signal passes can be improved. Further, as shown in FIGS. 1A and 1B, the connecting portion 201 can take a configuration in which a part of the conductive member 200 is stretched using the same material as the conductive member 200. . As a material for the conductive member 200 and the connection portion 201, a sheet-like member having a total thickness of 0.05 to 0.1 mm in which aluminum and PET (polyethylene terephthalate) are stacked may be used. The sheet resistance applicable as the conductive member 200 is 10000Ω / □ or less. A plurality of connection portions 201 are preferably provided. In the example illustrated in FIG. 1A, the connection portions 201 are provided at a total of 10 locations, 5 locations on the second side and 5 locations on the fourth side.

  Next, the schematic configuration of the entire radiation detection apparatus of the present invention will be described with reference to FIGS. 3, 4 (a), and 4 (b). 3A is a schematic plan view of the entire radiation detection apparatus, FIG. 4A is a schematic cross-sectional view of the entire radiation detection apparatus, and is a schematic cross-sectional view taken along line AA ′ of FIG. b) is a schematic cross-sectional view taken along the line BB ′ of FIG. 3.

  As shown in FIGS. 3, 4 (a), and 4 (b), the radiation detection apparatus 100 includes a sensor panel 300, a scintillator 400, a conductive member 200, first and second flexible wiring boards 103 a and 103b and a housing for accommodating the connecting portion 201 is included. As shown in FIG. 4, the housing includes an outer box 102 including an outer box upper part 102 a and an outer box lower part 102 b, and a cover 101. As the cover 101 on the radiation irradiation side of the radiation detection apparatus 100, CFRP (carbon fiber reinforced plastic) having a thickness of 1 to 1.5 mm can be suitably used. For the outer box upper part 102a and the outer box lower part 102b, SUS (stainless steel) having a thickness of 1.5 to 2.5 mm having both lightness and robustness can be used. Here, SUS is an alloy steel containing iron (Fe) as a main component (50% or more) and 10.5% or more of chromium (Cr). Therefore, the outer box upper part 102a and the outer box lower part 102b function as electromagnetic shields by supplying a constant potential such as ground. The cover 101 can be adhered and fixed to the outer box upper part 102.

  The radiation detection apparatus 100 further includes a conductive member 200, a substrate 301 including a pixel array 302 from the side of the scintillator 400, and a support member 106 that supports the scintillator 400 in the housing. The support member 106 includes a radiation absorbing plate 106a and a base 106b, which are arranged in order from the side irradiated with radiation (the scintillator 400 side). The base 106b is made of Al having a thickness of 2 to 3.5 mm, the radiation absorbing plate 106a is made of SUS having a thickness of 0.25 to 1 mm, and is higher in radiation than the base 106b. Has absorption performance. The support member 106 is fixed and held by the spacer 104 to the lower portion 102b of the outer box by screwing or the like. The protective member 402 and the support member 106 of the scintillator 400 are fixed by an adhesive sheet 403 having a buffer function. The pressure-sensitive adhesive sheet 403 preferably has a total thickness of 0.5 to 0.75 mm in order to achieve both a buffer function and adhesiveness. Moreover, it is preferable that the adhesive sheet 403 has an area substantially the same as or wider than the surface of the scintillator 400 on the support member 106 side.

  As shown in FIG. 4A, the second flexible wiring board 103a is provided with a second integrated circuit (IC) 112a having a readout circuit for reading out an electrical signal from the pixel array, so-called COF (Chip). On Film) may be used. The second integrated circuit 112a includes an IC having a power supply circuit and a processing circuit provided in the second printed circuit board 105a, an IC having a control circuit provided in the third printed circuit board 105c, and a third flexible wiring board 103c. It is electrically connected via. The second integrated circuit 112a, the second printed circuit board 105a, the third printed circuit board 105c, and the third flexible wiring board 103c may be disposed between the support member 106 and the outer box lower part 102b. Thereby, these members can be arranged on the side opposite to the side irradiated with radiation with respect to the radiation absorbing plate 106a. Here, a first heat transfer member 109 made of Al and a heat dissipating member 111 made of heat dissipating rubber are disposed between the second integrated circuit 112a and the Al base 106b. As a result, the heat generated in the second integrated circuit 112a is transferred and diffused to the base 106b, thereby relaxing the heat concentration. Further, a second heat transfer member 110 made of Al and a heat dissipation member 111 made of heat radiating rubber are arranged between the second integrated circuit 112a and the outer box lower portion 102b. Thereby, the heat generated in the second integrated circuit 112a is transferred to the outer box lower part 102b and radiated to the outside through the outer box lower part 102b. The second printed circuit board 105 a is fixed to the base 106 b through the spacer 104, and the third printed circuit board 105 c is fixed to the base 106 b and the outer box lower part 102 b through the spacer 104. The spacer 104 can have a heat transfer function in addition to the position restriction by using a material having a higher thermal conductivity than air.

  As shown in FIG. 4B, the first flexible wiring substrate 103b has a so-called COF (Chip On Film) provided with a first integrated circuit 112b having a driving circuit for driving the pixel array. Can be used. The first integrated circuit 112b is electrically connected to an IC having a power supply circuit provided on the first printed circuit board 105b. The first integrated circuit 112b and the first printed circuit board 105b may be disposed between the support member 106 and the outer box lower part 102b. Thereby, these members can be arranged on the side opposite to the side irradiated with radiation with respect to the radiation absorbing plate 106a.

  On the other hand, a spacer 113 and a buffer member 114 are arranged between the substrate 301 and the conductive member 200 and the outer box upper portion 102a, and the position of the substrate 301 and the conductive member 200 is regulated with respect to the outer box upper portion 102a. . The spacer 113 is made of SUS having a thickness of 1 to 2.5 mm, and has higher radiation absorption performance than the base 106b. The radiation absorbing plate 106a and the spacer 113 ensure the radiation absorbability of the entire radiation detection apparatus.

  Here, the connecting portion 201 is fixed to the support member 106 so as to be electrically connected to the base 106b. The base 106b of the support member 106 is electrically connected to a constant potential portion of the power supply circuit and the casing by a metal such as a screw used for the spacer 104 and is supplied with a fixed potential, and functions as a constant potential member. . As described above, the connection portion 201 is electrically connected to the base 106b, whereby a constant potential can be supplied to the conductive member 200. Note that the supplied constant potential may be a ground potential due to grounding or a constant potential generated by any one of the power supply circuits.

  Next, each process in the manufacturing method of a radiation detection apparatus is demonstrated using Fig.5 (a)-FIG.5 (f). First, as shown in FIG. 5A, a scintillator 400 is prepared on the surface of the passivation film 310 on the first surface 306 side of the sensor panel 300 so as to cover the pixel array 302. Here, in the scintillator 400, a scintillator layer 401 is formed so as to cover the pixel array 302, and then a protective member 402 is formed so as to cover a part of the surface of the passivation film 310 around the scintillator layer 401 and the pixel array 302. Can be prepared. The scintillator layer 401 may be an alkali halide scintillator layer having a columnar crystal structure prepared by depositing cesium iodide by a vacuum vapor deposition method. The protective member 402 can be prepared by adhering and fixing a conductive layer such as Al to the scintillator layer 401 and the sensor panel 300 with an adhesive layer made of hot melt resin.

  Next, as shown in FIG. 5B, the sensor panel 300 provided with the scintillator 400 is placed on the crimping apparatus stage 502 with the second surface 307 side of the substrate 301 facing down. A receiving member 501 is provided in a region 309 facing the plurality of connection terminal portions 303. In this state, the flexible wiring board shown here as the second flexible wiring board 103a is heated and pressurized by the pressure-bonding head 500 through the anisotropic conductive film. Thereby, the flexible wiring board is electrically connected to the plurality of connection terminal portions 303 via the conductive adhesive 108.

  Next, as shown in FIG. 5C, here, the printed circuit board shown as the second printed circuit board is supported from the lower side by the receiving member 501, and the flexible wiring board is attached to the crimping head via the anisotropic conductive film. Heat and pressure treatment is performed by 500. Thereby, the printed circuit board is electrically connected to the flexible wiring board via the conductive adhesive 108. The process of electrically connecting the printed circuit board to the plurality of connection terminal portions 303 via the flexible wiring board is referred to as a connection process.

  Next, as shown in FIG. 5D, an inspection process for inspecting electrical characteristics of the pixel array 302, the plurality of flexible wiring boards, and the printed circuit board is performed. In the inspection process, the conductive member 200 is electrically connected to at least one of the plurality of printed circuit boards via the connection portion 201 and the fixing screw 503. Thereby, in the inspection process, a constant potential can be supplied from the printed circuit board to the conductive member 200 via the connection portion 201. Therefore, also in the inspection process, it is possible to reduce the influence of electromagnetic wave noise from the second surface 307 side of the substrate 301. Thereby, it becomes possible to perform an inspection process more appropriately, and it becomes possible to ensure productivity. Similarly, by supplying a constant potential to the conductive layer of the protective member 402, the influence of electromagnetic noise from the first surface 306 side can be further reduced.

  When a defect is found in any of the plurality of flexible wiring boards in the inspection process, the flexible wiring board in which the defect is found is removed from the plurality of connection terminal portions 303 as shown in FIG. At this time, as shown in FIG. 5E, the connection portion 201 is performed while being electrically disconnected from the printed circuit board.

  Then, as shown in FIG. 5 (f), the flexible circuit board is normally connected again to the number of connection terminal portions 303 while the connection portion 201 is electrically disconnected. Thereafter, the connection process and the inspection process described with reference to FIGS. 5C and 5D are performed again. As described above, it is possible to ensure maintainability by facilitating replacement of an electrical component in which a defect is found.

  In the example shown in FIG. 1A, the connecting portion 201 passes between the regions 309 on the second side and the fourth side of the substrate 301 so as to pass between the plurality of second flexible wiring boards 103a. However, the present invention is not limited to this. For example, as shown in FIG. 6A, the connecting portion 201 passes between the regions 309 on the first side and the third side of the substrate 301 and passes between the plurality of first flexible wiring boards 103b. May be provided. Further, as shown in FIG. 1A, the conductive member 200 has an end portion of the second surface 307 where the pixel array 302 is disposed and a region 309 facing the plurality of connection terminal portions 303. However, the present invention is not limited to this. For example, as shown in FIGS. 6B and 6C, the conductive member 200 is disposed such that a part of the end portion is located between the plurality of regions 309 of the second surface 307. It may be. By arrange | positioning in this way, the electroconductive member 200 can be arrange | positioned in a wider area | region compared with the example shown to Fig.1 (a).

  Further, as shown in FIG. 7A, the connection portion 201 is arranged so that it can be disposed between the plurality of first flexible wiring boards and between the plurality of second flexible wiring boards. It may be provided in a larger number than the example shown in 1 (a). In the example shown in FIG. 1A, the connection portion 201 uses a configuration in which a part of the conductive member 200 is stretched using the same material as that of the conductive member 200. It is not limited. As shown in FIG. 7B, the connection portion 201 may be provided separately from the conductive member 200 and electrically connected to the conductive member 200 via the conductive adhesive 205.

  Here, the scintillator 400 provided in the sensor panel 300 will be described in more detail with reference to FIGS. 8A to 8D. As shown in FIG. 8A, the protective member 402 of the scintillator 400 can include a support layer 204, a moisture-proof layer 405, and an adhesive layer 406. The moisture-proof layer 405 is a layer that protects the scintillator layer 401 from external moisture and the like, and a conductive layer such as Al can be used. By supplying a constant potential to the conductive layer, the moisture-proof layer 405 can function as an electromagnetic shield. The support layer 204 is a layer that supports the moisture-proof layer 405. If the moisture-proof layer 405 has sufficient rigidity, the support layer 204 is not necessarily provided as shown in FIG. For the support layer 204, PET (polyethylene terephthalate) or the like can be suitably used. The adhesive layer 406 is a layer for adhering the moisture-proof layer 405 to the scintillator layer 401 and the sensor panel 300, and a hot melt resin or the like can be suitably used. Note that, as shown in FIG. 8C, the adhesive layer 406 is used to suppress electrochemical corrosion when an alkali halide material is used for the scintillator layer 401 and a conductive layer is used for the moisture-proof layer. The scintillator layer 401 may be provided so as to cover it. Otherwise, as shown in FIG. 8D, the adhesive layer 406 may be provided so as to adhere only to the sensor panel 300 without adhering to the scintillator layer 401.

  Further, as shown in FIG. 9, the conductive layer of the protection member 402 passes between the regions 309 on the first side and the third side of the substrate 301 so as to pass between the plurality of first flexible wiring boards 103b. Is provided. A part of the conductive layer of the protective member 402 that has passed through is electrically connected to the support member 106, whereby a constant potential is supplied to the conductive layer of the protective member 402 and can function as an electromagnetic shield. In order to reinforce this electromagnetic shielding function, as shown in FIG. 9 (b), the conductive layer of the protective member 402 may be electrically connected to the support member 106 from a plurality of paths through a larger area. Good.

  Next, an example in which the radiation detection apparatus 100 is applied to a radiation detection system will be described with reference to FIG. X-rays 6060 generated by an X-ray tube 6050 serving as a radiation source pass through a chest 6062 of a patient or subject 6061 and enter a radiation detection apparatus 6040 typified by the radiation detection apparatus 100 described above. This incident X-ray includes information inside the body of the subject 6061. The scintillator 216 emits light in response to the incidence of X-rays, and this is photoelectrically converted by a photoelectric conversion element to obtain electrical information. This information can be digitally converted and image-processed by an image processor 6070 serving as a signal processing device, and can be observed on a display 6080 serving as display means in a control room. Further, this information can be transferred to a remote place by transmission processing means such as a telephone line 6090, and can be displayed on a display 6081 serving as a display means such as a doctor room in another place or stored in a recording means such as an optical disk. It is also possible for a doctor to make a diagnosis. Moreover, it can also record on the film 6110 used as a recording medium by the film processor 6100 used as a recording means.

  Note that the above-described embodiments of the present invention are merely examples of implementation in practicing the present invention, and the technical scope of the present invention should not be construed as being limited thereto. It is. That is, the present invention can be implemented in various forms without departing from the technical idea or the main features thereof.

P pixel 200 conductive member 301 substrate 302 pixel array 303 connection terminal portion 306 first surface 307 second surface 309 region facing a plurality of connection terminal portions 400 scintillator

Claims (16)

A scintillator that converts the irradiated radiation into visible light;
A pixel array in which a plurality of pixels that convert visible light converted by the scintillator into electrical signals are arranged in a two-dimensional array on the first surface of the substrate;
A plurality of connection terminal portions provided around the pixel array on the first surface of the substrate for electrically connecting the pixel array and an external circuit;
A conductive member supplied with a constant potential;
Including
A radiation detection device in which the conductive member, the pixel array, and the scintillator are arranged in this order from the side irradiated with radiation, and the scintillator is arranged on the first surface side,
The radiation detecting apparatus according to claim 1, wherein the conductive member is disposed in a region excluding a region facing the plurality of connection terminal portions on a second surface facing the first surface of the substrate.   The end portion of the conductive member is located between an end of a region where the pixel array is disposed on the second surface and a region facing the plurality of connection terminal portions. The radiation detection apparatus according to 1.   3. The radiation detection apparatus according to claim 1, wherein a part of an end portion of the conductive member is located between regions of the second surface facing the plurality of connection terminal portions.   Between a region where the constant potential member for supplying a constant potential to the conductive member and the conductive member for electrically connecting the conductive member are opposed to the plurality of connection terminal portions on the second surface The radiation detection apparatus according to claim 1, wherein the radiation detection apparatus is provided so as to pass through the beam. The plurality of connection terminal portions include a plurality of first connection terminal portions arranged along the first side of the substrate and a plurality of second connection sides arranged adjacent to the first side of the substrate. A second connection terminal portion,
The plurality of first connection terminal portions are electrically connected to a drive circuit for driving the pixel array,
The plurality of second connection terminal portions are electrically connected to a readout circuit for reading an electrical signal from the pixel array,
The said connection part is provided so that it may pass between the area | regions facing the said several connection terminal part of the said 2nd surface in the said 2nd edge | side of the said board | substrate. Radiation detection equipment. A plurality of first flexible wiring boards electrically connected to the plurality of first connection terminal portions; and a plurality of second flexible wiring boards electrically connected to the plurality of second connection terminal portions. Including
The radiation detection apparatus according to claim 5, wherein the connection portion is provided so as to pass between the plurality of second flexible wiring boards. A support member that supports the conductive member, the substrate, and the scintillator from the scintillator side;
The radiation detecting apparatus according to claim 4, wherein the constant potential member is the support member. The support member includes a base, and a radiation absorbing plate disposed between the scintillator and the base,
The radiation detecting apparatus according to claim 7, wherein the constant potential member is the base. The scintillator includes a scintillator layer that converts radiation into visible light, and a protection member that covers at least a part of the scintillator layer and the first surface of the substrate to protect the scintillator layer,
The radiation detection apparatus according to claim 8, wherein the protection member includes a conductive layer to which a constant potential is supplied. A housing that houses the conductive member, the substrate, the scintillator, and the support member;
The radiation detection apparatus according to claim 9, wherein a constant potential is supplied to the conductive member by grounding the base together with the housing. The radiation detection apparatus according to any one of claims 1 to 10,
A signal processing device for processing an electrical signal obtained by the radiation detection device;
A radiation detection system comprising: A scintillator that converts irradiated radiation into visible light, a pixel array in which a plurality of pixels that convert visible light converted by the scintillator into electrical signals are arranged in a two-dimensional array on the first surface of the substrate, and the substrate A plurality of connection terminal portions provided in the periphery of the pixel array on the first surface for electrically connecting the pixel array and an external circuit, and a conductive member to which a constant potential is supplied. The method of manufacturing a radiation detection apparatus, wherein the conductive member, the pixel array, and the scintillator are arranged in this order from the side irradiated with radiation, and the scintillator is arranged on the first surface side,
The manufacturing method of the radiation detection apparatus characterized by including the arrangement | positioning process which arrange | positions the said electroconductive member in the area | region except the area | region which opposes these connection terminal parts of the 2nd surface facing the said 1st surface of the said board | substrate. Method.   In the arrangement step, a connection portion for electrically connecting a constant potential member for supplying a constant potential to the conductive member and the conductive member includes the plurality of connection terminal portions on the second surface. It is arrange | positioned so that it may pass between the area | regions which oppose, The manufacturing method of the radiation detection apparatus of Claim 12 characterized by the above-mentioned. A plurality of flexible wirings by heat and pressure treatment using an anisotropic conductive film in a state where receiving members are provided in regions facing the plurality of connection terminal portions on the second surface of the substrate facing the first surface. A connection step of electrically connecting a printed circuit board via the plurality of flexible wiring boards by connecting a board to the plurality of connection terminal portions;
The region facing the plurality of connection terminal portions on the second surface facing the first surface of the substrate is wider than a portion of the receiving member in contact with the substrate. Manufacturing method of radiation detection apparatus. An inspection process for inspecting electrical characteristics of the pixel array, the plurality of flexible wiring boards, and the printed circuit board;
In the inspection step, the conductive member is electrically connected to at least one of the plurality of printed circuit boards through the connection portion, and a constant potential is supplied to the conductive member. The manufacturing method of the radiation detection apparatus of Claim 14 to do.   When a defect is found in any of the plurality of flexible wiring boards in the inspection step, the flexible wiring in which the connection portion is electrically disconnected from at least one of the plurality of printed circuit boards and the defect is found. The method for manufacturing a radiation detection apparatus according to claim 15, further comprising a step of removing the substrate from the plurality of connection terminal portions.

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