WO2018158648A1 - Display code generation method, display code detection method, authentication system, and communication system - Google Patents

Abstract

A new display code is provided. This display code generation method generates a display code from digital data, which are encoded into grayscale values. A plurality of display frames indicate digital data that have been encoded into grayscale values. It should be noted that a first display code indicates, as two-dimensional cells, digital data that have been encoded into a plurality of grayscale values, and a second display code is generated from a plurality of first display codes.

Description

Display code generation method, display code detection method, authentication system, and communication system

One embodiment of the present invention relates to a display code generation method, a display code detection method, an authentication system, and a communication system.

Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one embodiment of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method. Or this invention relates to a process, a machine, a manufacture, or a composition (composition of matter). In particular, one embodiment of the present invention relates to a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, a driving method thereof, or a manufacturing method thereof.

Note that in this specification and the like, a semiconductor device refers to an element, circuit, device, or the like that can function by utilizing semiconductor characteristics. As an example, a semiconductor device such as a transistor or a diode is a semiconductor device. As another example, the circuit including a semiconductor element is a semiconductor device. As another example, a device including a circuit including a semiconductor element is a semiconductor device.

The electronic device uses the authentication code to determine permission for communication between the electronic devices. When data is transmitted or received by wire or wireless, digital data is used as an authentication code. As a different authentication code, a bar code or a two-dimensional code is often used to identify a product.

Bar codes or two-dimensional codes are limited in the amount of information to be held, and are suitable for managing information such as product identification information and network addresses. However, barcodes or two-dimensional codes are not suitable for handling large information.

Patent Document 1 discloses a method for generating a two-dimensional code using an image gradation value.

For example, Patent Document 2 discloses an authentication system in which an electronic device is allowed to access a database via an authentication server.

JP 2008-052588 A International Publication No. 2003/069490

The barcode or two-dimensional code is displayed as a printed material or a still image, and thus has good visibility. However, an authentication code having highly confidential information needs to prevent leakage of the authentication code.

∙ Barcode or 2D code has a limited amount of information. Therefore, it is not suitable for handling large data. Therefore, there is a problem that it is difficult to handle large information via a barcode or a two-dimensional code.

In view of the above problems, an object of one embodiment of the present invention is to provide a novel code generation method. Another object of one embodiment of the present invention is to provide a novel code detection method. Another object of one embodiment of the present invention is to provide a novel authentication system. Another object of one embodiment of the present invention is to provide a novel communication system.

Note that the description of these issues does not disturb the existence of other issues. Note that one embodiment of the present invention does not have to solve all of these problems. Issues other than these will be apparent from the description of the specification, drawings, claims, etc., and other issues can be extracted from the descriptions of the specification, drawings, claims, etc. It is.

Note that the problems of one embodiment of the present invention are not limited to the problems listed above. The problems listed above do not disturb the existence of other problems. Other issues are issues not mentioned in this section, which are described in the following description. Problems not mentioned in this item can be derived from descriptions of the specification or drawings by those skilled in the art, and can be appropriately extracted from these descriptions. Note that one embodiment of the present invention solves at least one of the above-described description and / or other problems.

One embodiment of the present invention is a display code generation method for generating a display code from digital data, wherein the digital data is encoded into gradation values, and the plurality of display frames are encoded into gradation values. Digital data is displayed, and in each of the plurality of display frames, the digital data encoded in the gradation value is displayed as a two-dimensional cell and as a first display code, and by the plurality of first display codes, A display code generation method is characterized in that a second display code is generated.

In the above configuration, the display code generation method is preferably characterized in that the second display code includes a plurality of continuous first display codes displayed at the same coordinates of a plurality of display frames.

In each of the above configurations, it is preferable that the second display code is a display code generation method characterized in that a plurality of continuous first display codes are displayed in a first display area having the same size.

In each of the above configurations, the display code generation method is preferably characterized in that the second display code includes a plurality of continuous first display codes displayed at different coordinates of a plurality of display frames.

In each of the above configurations, the display code generation method is preferably characterized in that the second display code is displayed in a first display area having a different size from a plurality of continuous first display codes.

In each of the above configurations, it is preferable that the second display code is a display code generation method characterized in that a plurality of first display codes are continuously displayed on a plurality of display frames.

In each of the above configurations, it is preferable that the second display code is a display code generation method characterized in that a plurality of first display codes are discontinuously displayed on a plurality of display frames.

One aspect of the present invention is a display code detection method, wherein a neural network has a function of detecting a first display code composed of two-dimensional cells from image data, and the neural network is based on image data. A display code detection method characterized in that a plurality of first display codes are detected and connected to generate a second display code, and the digital data is decoded from the image data.

In the above configuration, the image data includes image data captured continuously, the neural network detects the first display code from the continuous image data, and the neural network detects the first display code. A display code detection method is characterized in that the second display code is generated by connecting in order and the digital data is decoded from the image data.

In the above configuration, the image data includes image data captured non-continuously, the neural network detects the first display code from the non-continuous image data, and the neural network detects the first display code. Preferably, the display code detection method is characterized in that the second display code is generated by concatenating in the order of decoding, and the digital data is decoded from the image data.

One embodiment of the present invention is an authentication system having a first electronic device and a second electronic device, the first electronic device having a display panel and an electric motor powered by electricity. The second electronic device has an imaging element and a neural network, the first electronic device and the second electronic device have a first authentication code, and the neural network detects image features. The first electronic device has a function of encoding the first authentication code into the third display code, and the first electronic device displays the third display code on the display panel. The second electronic device has a function of imaging the third display code by the image sensor, and the second electronic device uses the third display code from the image captured by the neural network. And the second electronic device detects the third display code. The second electronic device has a function of decrypting the second authentication code, and the second electronic device determines a match between the first authentication code of the second electronic device and the decrypted second authentication code. The first electronic device has a function of permitting access from the second electronic device when the result is determined to match, and the result of the determination is that they do not match, the first electronic device Is an authentication system having a function of not permitting access from the second electronic device.

One embodiment of the present invention is a communication system including a first electronic device and a second electronic device, the first electronic device including a display panel and an electric motor powered by electricity. The electronic device 2 includes an image sensor and a neural network. The first electronic device includes communication data. The neural network has a function of detecting image characteristics. The device has a function of encoding communication data into a fourth display code, the first electronic device has a function of displaying the fourth display code on a display panel, and the second electronic device has The second electronic device has a function of imaging the fourth display code by the imaging element, the second electronic device detects the fourth display code from the image captured by the neural network, and the second electronic device For decoding communication data from the display code A communication system having a.

One embodiment of the present invention can provide a novel code generation method. Alternatively, one embodiment of the present invention can provide a novel code detection method. One embodiment of the present invention can provide a novel authentication system. Alternatively, according to one embodiment of the present invention, a novel communication system can be provided.

Note that the effects of one embodiment of the present invention are not limited to the effects listed above. The effects listed above do not preclude the existence of other effects. The other effects are effects not mentioned in this item described in the following description. Effects not mentioned in this item can be derived from the description of the specification or drawings by those skilled in the art, and can be appropriately extracted from these descriptions. Note that one embodiment of the present invention has at least one of the above effects and / or other effects. Therefore, one embodiment of the present invention may not have the above-described effects depending on circumstances.

The figure explaining a display code. The figure explaining a display code. The figure explaining a display code. FIG. 6 illustrates a structure of an electronic device. 10A and 10B each illustrate an electronic device. FIG. 6 illustrates a structure of an electronic device. Processing flow of electronic equipment. Processing flow of electronic equipment. Processing flow of electronic equipment. 10A and 10B each illustrate an electronic device. 2 shows a configuration example of a display device. 2 shows a configuration example of a display device. 2 shows a configuration example of a display device. 2 shows a configuration example of a display device. 2 shows a configuration example of a display device. 2 shows a configuration example of a display device. 2A and 2B illustrate a laser irradiation method and a laser crystallization apparatus. FIG. 5 illustrates a laser irradiation method. The figure explaining a pixel unit. The figure explaining a pixel unit. 4A and 4B illustrate a circuit of a display device and a top view of a pixel. FIG. 6 illustrates a circuit of a display device. 4A and 4B each illustrate a circuit of a display device and a top view of a pixel. FIG. 6 illustrates a structure of a display device. FIG. 6 illustrates a structure of a display device. FIG. 6 illustrates a structure of a display device. FIG. 6 illustrates a structure of a display device. 10A and 10B each illustrate an electronic device. 10A and 10B each illustrate an electronic device. 10A and 10B each illustrate an electronic device.

Hereinafter, embodiments will be described with reference to the drawings. However, the embodiments can be implemented in many different modes, and it is easily understood by those skilled in the art that the modes and details can be variously changed without departing from the spirit and scope thereof. . Therefore, the present invention should not be construed as being limited to the description of the following embodiments.

In the drawings, the size, the layer thickness, or the region is exaggerated for simplicity in some cases. Therefore, it is not necessarily limited to the scale. The drawings schematically show an ideal example, and are not limited to the shapes or values shown in the drawings.

In addition, the ordinal numbers “first”, “second”, and “third” used in the present specification are attached to avoid confusion between components, and are not limited numerically. Appendices.

Further, in this specification, terms indicating arrangement such as “above” and “below” are used for convenience in order to describe the positional relationship between components with reference to the drawings. Moreover, the positional relationship between components changes suitably according to the direction which draws each structure. Therefore, the present invention is not limited to the words and phrases described in the specification, and can be appropriately rephrased depending on the situation.

In this specification and the like, a transistor is an element having at least three terminals including a gate, a drain, and a source. A channel region is provided between the drain (drain terminal, drain region, or drain electrode) and the source (source terminal, source region, or source electrode), and a current flows between the source and the drain through the channel region. Can be used. Note that in this specification and the like, a channel region refers to a region through which a current mainly flows.

Also, the functions of the source and drain may be switched when transistors with different polarities are used or when the direction of current changes during circuit operation. Therefore, in this specification and the like, the terms source and drain can be used interchangeably.

In addition, in this specification and the like, “electrically connected” includes a case of being connected via “something having an electric action”. Here, the “thing having some electric action” is not particularly limited as long as it can exchange electric signals between connection targets. For example, “thing having some electric action” includes electrodes, wiring, switching elements such as transistors, resistance elements, inductors, capacitors, and other elements having various functions.

In addition, in this specification and the like, “parallel” means a state in which two straight lines are arranged at an angle of −10 ° to 10 °. Therefore, the case of −5 ° to 5 ° is also included. “Vertical” refers to a state in which two straight lines are arranged at an angle of 80 ° to 100 °. Therefore, the case of 85 ° to 95 ° is also included.

In addition, in this specification and the like, the terms “film” and “layer” can be interchanged. For example, the term “conductive layer” may be changed to the term “conductive film”. Alternatively, for example, the term “insulating film” may be changed to the term “insulating layer”.

In this specification and the like, unless otherwise specified, off-state current refers to drain current when a transistor is off (also referred to as a non-conduction state or a cutoff state). The off state is a state where the voltage Vgs between the gate and the source is lower than the threshold voltage Vth in the n-channel transistor, and the voltage Vgs between the gate and the source in the p-channel transistor unless otherwise specified. Is higher than the threshold voltage Vth. For example, the off-state current of an n-channel transistor sometimes refers to a drain current when the voltage Vgs between the gate and the source is lower than the threshold voltage Vth.

The transistor off current may depend on Vgs. Therefore, the off-state current of the transistor being I or less sometimes means that there is a value of Vgs at which the off-state current of the transistor is I or less. The off-state current of a transistor may refer to an off-state current in an off state at a predetermined Vgs, an off state in a Vgs within a predetermined range, or an off state in Vgs at which a sufficiently reduced off current is obtained.

As an example, when the threshold voltage Vth is 0.5 V, the drain current when Vgs is 0.5 V is 1 × 10 ⁻⁹ A, and the drain current when Vgs is 0.1 V is 1 × 10 ⁻¹³ A. Assume that the n-channel transistor has a drain current of 1 × 10 ⁻¹⁹ A when Vgs is −0.5 V and a drain current of 1 × 10 ⁻²² A when Vgs is −0.8 V. Since the drain current of the transistor is 1 × 10 ⁻¹⁹ A or less when Vgs is −0.5 V or Vgs is in the range of −0.5 V to −0.8 V, the off-state current of the transistor is 1 It may be said that it is below ^x10 <^-19> A. Since there is Vgs at which the drain current of the transistor is 1 × 10 ⁻²² A or less, the off-state current of the transistor may be 1 × 10 ⁻²² A or less.

In this specification and the like, the off-state current of a transistor having a channel width W may be represented by a current value flowing around the channel width W. In some cases, the current value flows around a predetermined channel width (for example, 1 μm). In the latter case, the unit of off-current may be represented by a unit having a dimension of current / length (for example, A / μm).

∙ Transistor off-state current may depend on temperature. In this specification, off-state current may represent off-state current at room temperature, 60 ° C., 85 ° C., 95 ° C., or 125 ° C. unless otherwise specified. Alternatively, at a temperature at which reliability of the semiconductor device including the transistor is guaranteed or a temperature at which the semiconductor device including the transistor is used (for example, any one temperature of 5 ° C. to 35 ° C.). May represent off-state current. The off-state current of a transistor is I or less means that room temperature, 60 ° C., 85 ° C., 95 ° C., 125 ° C., a temperature at which reliability of a semiconductor device including the transistor is guaranteed, or the transistor is included. In some cases, there is a value of Vgs at which the off-state current of the transistor is equal to or lower than I at a temperature (for example, any one temperature of 5 ° C. to 35 ° C.) at which the semiconductor device or the like is used.

The off-state current of the transistor may depend on the voltage Vds between the drain and the source. In this specification, the off-state current is Vds of 0.1V, 0.8V, 1V, 1.2V, 1.8V, 2.5V, 3V, 3.3V, 10V, 12V, 16V unless otherwise specified. Or an off-current at 20V. Alternatively, Vds in which reliability of a semiconductor device or the like including the transistor is guaranteed, or an off-current in Vds used in the semiconductor device or the like including the transistor may be represented. The off-state current of the transistor is equal to or less than I. Vds is 0.1V, 0.8V, 1V, 1.2V, 1.8V, 2.5V, 3V, 3.3V, 10V, 12V, 16V, 20V In addition, there is a value of Vgs at which the off-state current of the transistor in Vds for which the reliability of the semiconductor device including the transistor is guaranteed or Vds used in the semiconductor device including the transistor is I or less. It may point to that.

In the description of the off-state current, the drain may be read as the source. In short, the off-state current sometimes refers to a current that flows through the source when the transistor is in an off state.

In addition, in this specification and the like, the leakage current may be described in the same meaning as the off-state current. In this specification and the like, off-state current may refer to current that flows between a source and a drain when a transistor is off, for example.

The voltage means a potential difference between two points, and the potential means electrostatic energy (electric potential energy) of a unit charge in an electrostatic field at one point. However, generally, a potential difference between a potential at a certain point and a reference potential (for example, ground potential) is simply referred to as a potential or a voltage, and the potential and the voltage are often used as synonyms. Therefore, in this specification, unless otherwise specified, the potential may be read as a voltage, or the voltage may be read as a potential.

(Embodiment 1)
In the present embodiment, a novel display code generation method and display code detection method for an electronic device, and an authentication system and communication system using the generated display code will be described with reference to FIGS.

FIG. 1 illustrates a new display code generation method. As the display code, a bar code or a two-dimensional code is known as an authentication code. However, a bar code or a two-dimensional code is limited in the amount of digital data that can be encoded. In this embodiment, a method for generating a new display code without limiting the amount of digital data that can be encoded will be described with reference to FIG. For the sake of explanation, a new display code is a flashing code (hereinafter referred to as FCODE). The FCODE is preferably displayed on a display panel included in the electronic device. In the display panel, display data is updated in units of frames. Therefore, when the display code is indicated in units of one frame, it will be described as a display code FC (hereinafter referred to as FC). Therefore, the FCODE is composed of one FC or a plurality of FCs.

FCODE is composed of one frame or multiple frames. The number of FCs constituting the FCODE can be changed according to the size of digital data to be encoded. The number of cells of FC can be changed depending on the size of digital data to be encoded. One frame of display data has a display area composed of two-dimensional cells in which FC is displayed. In order to identify the display area of the display panel, the area where the FC is displayed will be described as a display area FCD. The two-dimensional cell is preferably configured with a number of pixels of 1 to m. m is a natural number of 2 or more.

FIG. 1 (A-1) shows, as an example, a two-dimensional cell in which FC is composed of 16 cells of 4 rows and 4 columns. One cell means a bit which is the minimum configuration of data to be encoded. Therefore, in FIG. 1 (A-1), FC has 16 bits. The minimum configuration that constitutes the FC can be referred to as a flashing bit (hereinafter referred to as FB). FIG. 1A-1 shows an example in which FB0 to FB15 are arranged in order. However, it is preferable that the order in which FB0 to FB15 are arranged is not limited.

A set of cells can be expressed as FB [15: 0] as data. Since FB is displayed in the display area FCD, a gradation value that can be displayed in the display area FCD can be used as a weight. Therefore, if the display area FCD can display 256 levels of gradation values, the FB can obtain a maximum weight of 256 values. However, since FCODE is determined by an image acquired by the image sensor, it is preferable to set it according to the resolution of the image sensor. As the imaging element, a photodiode, an optical sensor, an image sensor, or the like can be used.

FIG. 1A-2 shows an example in which FC1 to FC8 are continuously displayed in a display frame in which FCODE is continuous. By continuously displaying the FC, the image sensor can continuously decode the FC from the captured image and recognize the FCODE. Therefore, a large amount of data can be transmitted in a short time.

FIG. 1 (A-3) shows the relationship when digital data encodes and decodes FCODE. When the digital data is divided into FC1 to FC8, encoded, and decoded, FC1 to FC8 are detected from the image picked up by the image pickup device, and the digital data is decoded by connecting FC1 to FC8.

FIG. 2A-1 illustrates an example in which digital data of [F10DF20CF30BF40AF509F608F707F806] is set in FCODE.

FIG. 2 (A-2) is an example in which the FB is expressed by binary numbers of “1” and “0” for the sake of simplicity of explanation. The FCODE is composed of FC1 to FC8 displayed in 8 frames. For example, when the FB has a weight of 2 and is expressed in a binary number, the FB can be displayed using a display panel that can display from 0 gradation to 255 gradation.

For example, in order for FB to express “1”, display can be performed using any of the gradations from 128 gradations to 255 gradations. In addition, in order for FB to express “0”, display can be performed using any gradation from 0 gradation to 127 gradation. Further, the plurality of pixels constituting the cell may have any gradation value within the above range.

Further, when the upper limit value of the gradation range for expressing “0” in the FB is close to the lower limit value of the gradation range for expressing the “1” in the FB, the detection error of the image sensor is erroneously detected. It is expected that. Therefore, in order to prevent erroneous detection of the gradation value, the width of the gradation value for FB expressing “0” (hereinafter referred to as gradation width) and the level for FB expressing “1”. It is preferable to provide a non-selected gradation width that is not recognized as FB between the adjustment widths.

As described above, the gradation width for expressing FB as “1” or the gradation width for expressing FB as “0” can be arbitrarily set. Therefore, even in the case of binary FB, the confidentiality when decrypting can be improved by setting the gradation width.

The FCODE in FIG. 2 (A-2) is composed of FC1 to FC8. When each FC is displayed in hexadecimal notation FC_H, FC1 is [F10D], FC2 is [F20C], FC3 is [F30B], FC4 can be expressed as [F40A], FC5 as [F509], FC6 as [F608], FC7 as [F707], and FC8 as [F806]. That is, since FCODE is configured by connecting FC1 to FC8, FCODE can indicate digital data of [F10DF20CF30BF40AF509F608F707F806].

FIG. 2 (A-3) shows an example in which FCODE is displayed by a display frame having periodicity, unlike FIG. 1 (A-2). FIG. 2A-3 shows an example in which FC1 and FC2 are displayed every four frames. By displaying FC with periodicity, it is possible to display a display code without reducing visibility. The periodicity is not limited every four frames. It may have a periodicity longer than 4 frames. Alternatively, it may have a periodicity shorter than 4 frames.

Fig. 2 (A-4) displays each FC twice consecutively as a different example. When displaying FC continuously, the number of continuous times is not limited to two. By continuously displaying images, the image sensor can ensure time for accurately capturing the FC.

FIG. 2 (A-5) shows an example in which FB has a weight of 8 and is expressed in octal. For example, in order for FB to express “0”, display can be performed using any one of gradations from 0 gradation to 31 gradation. In addition, in order for FB to express “1”, display can be performed using any one of gradations from 32 gradations to 63 gradations. In addition, in order for FB to express “2”, display can be performed using any of gradations from 64 gradations to 95 gradations. In addition, in order for FB to represent “3”, display can be performed using any one of the 96 to 127 gradations. Also, in order for FB to express “4”, display can be performed using any gradation from 128 gradation to 159th floor. In order to express “5” in the FB, display can be performed using any of the gradations from 160 to 191 gradations. In order to express “6” in the FB, display can be performed using any of the gray levels from 192 to 223. In addition, in order for FB to express “7”, display can be performed using any one of 224 to 255 gradations.

However, when one cell has a plurality of weights, the gradation width indicating each weight becomes small. In order to prevent erroneous detection by the image sensor, it is preferable to have a non-selected gradation width that is not recognized as FB between the upper limit value of the gradation width and the lower limit value of the gradation width that indicate different weights of FB.

For example, in order for FB to represent “0”, display is performed in any gradation from 0 to 20 gradations, and in order for FB to represent “1”, from 32 gradations to 52 gradations. Any gradation can be displayed. Between the gradation width for expressing FB “0” and the gradation width for expressing FB “1”, a non-selected gradation width from 21 gradations to 31 gradations can be provided. . By providing a non-selected gradation width, erroneous detection due to the detection accuracy of the image sensor can be suppressed. It is preferable that the gradation width can be set by the user of the electronic device.

As described above, in FIG. 2A-5, the weight of the FB can be changed by changing the gradation value displayed in each cell. Therefore, the amount of data included in the FC can be increased.

The display panel that can display FCODE has four colors from among the sub-pixels, which include the three color gamuts of red R, green G, blue B, cyan C, magenta M, and yellow Y, or white W. It is known that color display is performed using this color gamut. FC may assign FB to each color gamut of the sub-pixel. Therefore, the amount of data included in FCODE can be further increased dramatically. Therefore, the FCODE can be used not only for the authentication code but also for data communication.

The display panel may notify the electronic device at which timing the FCODE is displayed. Alternatively, after transmitting the authentication code, the electronic device may acquire the FCODE using the AI (Artificial Intelligence) image recognition function for the image data captured by the image sensor. In particular, the neural network is excellent in detecting the characteristics of the cells of the FC by learning an image on which the FC is displayed. Since the FC is displayed in the display area FCD, the FCODE can be easily extracted from a plurality of FCs. Even if the FC is displayed randomly in the display area FCD, it can be decoded using the AI image recognition function. If the aspect ratio of the cell is maintained, detection by AI is further facilitated.

In the FCODE display method different from the above, the FCODE may be configured by displaying a plurality of FCs on the same display surface. As an example, paper, plastic resin, building materials, etc. can print FC on the surface. Or you may project using a projector.

FIG. 3 shows a display panel of an electronic device as an example. The display area 150 included in the display panel has a display area FCD. FC can be displayed in the display area FCD. Therefore, when the display data in the display area FCD is updated, the FC is also updated. FCODE is configured by connecting a plurality of FCs. Here, the display area FCD1 of FC1 or the display area FCD2 of FC2 will be described.

FIG. 3A-1 shows an example in which the display area FCD1 and the display area FCD2 are displayed with the same coordinates and the same size. Since the display area FCD1 and the display area FCD2 are displayed at the same coordinates and the same size, FC can be easily detected from the image data.

FIG. 3 (A-2) is an example in which the display area FCD1 of FC1 and the display area FCD2 of FC2 are displayed in different sizes. However, the center coordinates of the display area FCD1 and the center coordinates of the display area FCD2 are the same. By making the center coordinates of the display area FCD1 and the display area FCD2 the same, the FC can be easily detected from the image data.

FIG. 3 (A-3) is an example in which the center coordinates of the display area FCD1 of FC1 and the center coordinates of the display area FCD2 of FC2 are different. However, the display area FCD1 and the display area FCD2 are displayed in the same size. The confidentiality of the FCODE is improved by moving the center coordinates of the display area FCD1 or the display area FCD2 to different coordinates. Further, since the display area FCD1 and the display area FCD2 are not displayed at the same center coordinates, the display content changes. Therefore, display deterioration of the display area 150 such as burn-in can be suppressed.

3A-4 is an example in which the center coordinates of the display area FCD1 of FC1 and the center coordinates of the display area FCD2 of FC2 are different. Further, the display area FCD1 and the display area FCD2 are displayed in different sizes. The confidentiality can be improved by moving the center coordinates of the display area FCD1 and the display area FCD2. Furthermore, the confidentiality of FCODE is improved by using display areas FCD of different sizes. Since the display area FCD is not displayed at the same center coordinates and the sizes are different, the randomness of the display area FCD is improved, and further, display deterioration of the display area 150 such as burn-in can be suppressed.

However, the aspect ratios of the display area FCD1 and the display area FCD2 are preferably the same. The cell preferably has 3 or more and n or less sides. n is an integer of 4 or more.

FIG. 4A illustrates the configuration of the electronic device 110 and the electronic device 120 from the side. The electronic device 110 includes a communication module 111, an image sensor 112, and a display module 113. The display module 113 will be described in detail with reference to FIG. Here, the display module 113 is described as a display panel 113d.

The electronic device 120 includes a communication module 121 and a display module 122. The display module 122 will be described in detail with reference to FIG. Here, the display module 122 is described as the display panel 122d.

FIG. 4B illustrates the configuration of the electronic device 120 from the top. The electronic device 120 includes switches 123a to 123d. The switches 123a to 123d are preferably assigned a function for controlling the electronic device 120. The display panel 122d has a display area 150. The display area 150 has a display area 150a for displaying an authentication code. The display area 150a indicates the display area FCD described with reference to FIG. Accordingly, the authentication code is encoded and displayed as FCODE in the display area 150a.

The size of the display area 150a is preferably equal to or smaller than the size of the display area 150. The image sensor 112 has a function of receiving a light from the display region 150a and judging a gradation. In the following, a description will be given in which the image pickup device 112 receives the light from the display area 150a and determines the gradation, in other words, the image pickup.

4B illustrates an example in which the switches 123a to 123d are provided, the electronic device 120 may not have the switches 123a to 123d. The touch panel included in the display module 122 can be used to perform the same operation as the switches 123a to 123d.

As shown in FIG. 4A, it is preferable that the communication module 111 and the communication module 121 can transmit and receive data. The communication method between the communication module 111 and the communication module 121 may be a wireless communication method or an infrared communication method. Alternatively, a communication method using a wired connection may be used.

The electronic device 110 has registration information. The registration information is preferably composed of a first authentication code and a second authentication code. Furthermore, the electronic device 110 preferably has a GPS (Global Positioning System) function. The electronic device 110 can use GPS coordinates as one piece of registration information.

The electronic device 110 can request access permission from the electronic device 120. The electronic device 110 has a step of transmitting a first authentication code to the electronic device 120 via the communication module 111.

The electronic device 120 includes a step of receiving and determining the first authentication code via the communication module 121.

The electronic device 120 includes a step of generating a second authentication code for determining that the electronic device 110 exists in the vicinity of the electronic device 120 by receiving the first authentication code. Yes.

The electronic device 120 has a step of encoding the second authentication code into FCODE and displaying it on the display panel 122d.

The electronic device 110 has a step of imaging FCODE using the image sensor 112.

The electronic device 110 decrypts the FCODE into the second authentication code, compares the decrypted second authentication code with the first authentication code, and further updates the registration information of the electronic device 110 to The device 110 has a step of authenticating the electronic device 120.

The electronic device 110 has a step of notifying the electronic device 120 that the electronic device 120 is authenticated.

Therefore, the present embodiment is an authentication system in which the imaging device 112 included in the electronic device 110 has an authentication target within a distance where the display panel 122d included in the electronic device 120 can be imaged.

In the above description, the authentication system that authenticates by encoding the second authentication code into FCODE has been described, but communication data may be encoded into FCODE. FCODE is suitable for transmitting large data because there is no restriction on the amount of digital data to be encoded.

The authentication system according to the present embodiment can ensure that the electronic device 110 and the electronic device 120 exist in the vicinity. Therefore, it can be used for maintenance and maintenance of highly sensitive precision equipment, equipment that requires safety such as vehicles, trains, and aircraft, and production equipment that requires high precision management. An electronic device that can display FCODE is not limited to the above, and includes a mobile terminal, a TV, a monitor, a clock, a projector, a vending machine, a ticket vending machine, or a digital signage. When the electronic device described above includes an image sensor, an authentication system using FCODE or a communication system using FCODE can be provided.

FIG. 5 shows an example in which an authentication system using FCODE is applied to the copy machine 120a. The copier 120 a includes a scanner device 131, a display module 132, a communication module 133, an input device 134, and an electronic device 120. The electronic device 120 is one of the components of the copier 120a.

The copy machine 120 a can communicate with the electronic device 110 via the electronic device 120. Therefore, the copy machine 120a can use the authentication system of the present embodiment using the electronic device 120 and the electronic device 110. Therefore, hereinafter, an authentication system performed between the electronic device 110 and the electronic device 120 will be described. The electronic device 110 and the electronic device 120 are preferably connected to the data server 137 via a network.

The electronic device 120 can manage the management parameters of the copier 120a. The display module 132 can input an instruction for printing information stored in the data server 137. The communication module 133 has a telephone function. The input device 134 can read information from the external storage device.

The electronic device 110 transmits the first authentication code via the communication module 111. When the electronic device 120 receives the first authentication code, the electronic device 120 encodes and displays the second authentication code in FCODE on the display area 150a of the electronic device 120. The electronic device 110 captures the FCODE using the image sensor 112 and decodes it to the second authentication code. It is preferable to use a neural network included in the electronic device 110 for the analysis of the FCODE. Using the first authentication code and the second authentication code, the electronic device 110 notifies the electronic device 120 that the electronic device 120 has been authenticated. The electronic device 120 permits access from the electronic device 110 by receiving a notification from the electronic device 110.

The electronic device 110 has a GPS function. When acquiring the second authentication code from the electronic device 120, the electronic device 110 can identify the GPS coordinates acquired by the GPS function of the electronic device 110 together. The GPS coordinates managed as registration information of the electronic device 110 can be used as identification information registered when the copy machine 120a is installed. Therefore, the copy machine 120a can be managed by the electronic device 110. Therefore, when the electronic device 110 is not used, access to the management parameters of the copier 120a via the electronic device 120 is not permitted. Therefore, it is possible to provide an authentication system in which access is permitted only by imaging FCODE using the image sensor 112 and decrypting the second authentication code.

The electronic device 110 may update the first authentication code of the registration information to the second authentication code. By always using a new authentication code, the electronic device 110 and the copier 120a can be managed in association with each other. Therefore, the copier 120a preferably stores the latest second authentication code generated by the electronic device 120. In addition, the electronic device 110 preferably stores registration information. Alternatively, the data server 137 may manage registration information via a network.

When access to the electronic device 120 is permitted, the electronic device 110 can access the device information and management parameters of the copier 120a via the electronic device 120. The device information includes a product code, a serial number, a usage period, maintenance history information, trouble history information, and the like of the copier 120a. The management parameters include device condition information, device condition history information, consumable part information, information on a part that is expected to deviate from a normal value that operates normally in the near future, and a part that is already deviated from the standard value. Information is included.

Furthermore, the electronic device 110 downloads information such as a structural drawing of the copier 120a, a maintenance manual, a maintenance procedure, a procedure for accessing a defective part, and the like from the data server 137 via the network and displays the information. be able to. An example of display is shown on the display panel 113d of the electronic device 110.

For example, the display panel 113d displays device parameters in the display area 114a, a drawing viewer (Viewer) in the display area 114b, a maintenance procedure in the display area 114c, a device manual in the display area 114d, and a category such as history information in the display area 114e. Has been. By touching the touch panel arranged at a position overlapping the display areas 114a to 114e, the contents to be displayed in the display area 114f can be selected.

FIG. 5 shows an example in which an image of the copy machine 120a captured by the image sensor 112 is displayed in the display area 114f. The electronic device 110 can create a perspective view by adding management parameters to the image of the copier 120a. Therefore, a perspective view of the copier 120a is displayed in the display area 114f. In the perspective view, a defect location 114g and a defect reason 114h are displayed. FIG. 5 shows an example in which the position of the paper jam of the copier is displayed. However, the paper jam is not a problem of a part of the roller in which the paper jam occurs, but clearly shows that the sensor for detecting the paper position for feeding the paper to the roller is deteriorated. In this way, it is possible to obtain from the management parameters that the phenomenon and cause of the failure are different. Hereinafter, a perspective view created by adding a management parameter to a captured image is referred to as an AR (Augmented Reality) image.

For example, when performing maintenance of an electronic device, it is estimated by AI that the electronic components used in the copier 120a show a tendency to deteriorate from the management parameters of the copier 120a as well as the malfunction that has occurred. And call attention. For grasping the tendency of deterioration, not only the history information included in the management parameter but also information stored in the data server 137 can be used. Therefore, the tendency of deterioration can be estimated by combining the management parameters of products installed in other locations.

In the above description, an example in which an authentication system using FCODE is applied to maintenance and maintenance of the copy machine 120a used in an office or the like has been described. As examples of different electronic devices or facilities, high-level maintenance and maintenance are required for devices such as vehicles, trains, and aircraft that require safety, production devices that require accuracy control, power generation facilities, and the like. Further, from the viewpoint of quality stability and confidentiality which are important management items, it is preferable that access to the electronic device is permitted under a limited environment and conditions. Therefore, the authentication system of the electronic device is preferably an authentication system in which access is permitted only by encoding the second authentication code into FCODE, capturing the image using the image sensor 112, and decoding the image.

Also, even when the amount of management parameter data is large, a large amount of data can be transmitted and received in a short time by using FCODE. Furthermore, by giving weights to the FBs with gradation values, a larger amount of data can be handled, and the confidentiality of the data can be further improved.

FIG. 6 shows the configuration of the electronic device 110 and the copy machine 120a. The electronic device 110 includes a communication module 111, an image sensor 112, a display module 113, a processor 115, a storage device 116, and an input device 117. The display module 113 includes a display device 113a and a touch panel 113e. The display device 113a includes a display controller 113b, a frame memory 113c, and a display panel 113d.

The copying machine 120a includes an electronic device 120, a scanner device 131, a display module 132, a communication module 133, an input device 134, a processor 135, and a storage device 136. The electronic device 120 includes a communication module 121, a display module 122, an input device 123, a processor 125, and a storage device 126. The display module 122 includes a display device 122a and a touch panel 122e. The display device 122a includes a display controller 122b, a frame memory 122c, and a display panel 122d. The display module 132 preferably has the same configuration as the display module 122. The input device 123 is preferably an operation switch or the like as shown in FIG. The input device 134 is preferably a non-volatile memory capable of USB connection or a non-volatile memory inserted from the outside.

The data server 137 is connected to the communication module 111, the communication module 133, and the communication module 121 via a network. The processor 135 included in the copy machine 120a can transmit and receive data by sharing the data bus and address bus with the processor 125 included in the electronic device 120. Further, it is preferable that the communication module 111 and the communication module 121 can directly transmit and receive data without going through a network.

The storage device 116 preferably stores a program for controlling the electronic device 110 and registration information. The FCODE displayed on the display panel 122d is imaged by the image sensor 112. The imaged FCODE is decoded into the second authentication code by the program of the electronic device 110. The second authentication code is compared or updated with the registration information stored in the storage device 116 by the program.

The processing flow of the authentication system using the second authentication code encoded in FCODE will be described with reference to FIGS. The copier 120a uses the electronic device 120 as one of the components. However, the second authentication code is displayed on the display panel 122d of the electronic device 120. Therefore, the copying machine 120a will be described in other words as the electronic device 120. Therefore, in the processing flow shown in FIGS. 7 to 9, the interface between the electronic device 110, the electronic device 120, and the data server 137 will be described.

FIG. 7 shows a processing flow when the copy machine 120a is newly installed or registered. ST 1011 is a step in which electronic device 110 transmits an initialization request to electronic device 120. The initialization request is made using the first authentication code that the electronic device 110 has.

ST1021 is a step of temporarily authenticating access from the electronic device 110 when the electronic device 120 receives the first authentication code.

ST1022 is a step in which the electronic device 120 generates the second authentication code. The electronic device 120 can generate the second authentication code from the device information or management parameters of the copier 120a. The device information preferably includes ID information such as the product code and serial number of the copier 120a.

ST1023 is a step in which the generated second authentication code is encoded into FCODE and displayed on the display panel 122d of the electronic device 120.

ST 1012 is a step of detecting the GPS coordinates by the GPS function of the electronic device 110 after transmitting the first authentication code to the electronic device 120. Since the electronic device 110 and the electronic device 120 exist within a distance where image authentication can be performed, the location where the electronic device 120 is installed can be recognized by detecting the GPS coordinates. However, the detection of the GPS coordinates may be performed simultaneously with the transmission of the first authentication code, or may be performed before the transmission of the first authentication code.

ST1013 is a step in which the electronic device 110 performs image authentication on the second authentication code encoded in FCODE by the electronic device 120. First, the image sensor 112 included in the electronic device 110 images the FCODE displayed on the display panel 122d. Next, the imaged FCODE is decoded into a second authentication code by a program included in the electronic device 110. Therefore, the second authentication code is image-authenticated using FCODE.

ST 1014 is a step of transmitting ID information included in the second authentication code decrypted by the electronic device 110 to the data server 137.

ST1015 is a step of transmitting other device information and management parameters included in the second authentication code decrypted by the electronic device 110 to the data server 137.

ST1016 is a step of transmitting the GPS coordinates detected in ST1012 to the data server 137.

ST 1041 is a step of registering the information transmitted to the data server 137 in ST 1014 to ST 1016 as registration information. When the data server 137 registers the information, the data server 137 notifies the electronic device 110 of the completion of registration.

ST 1017 is a step of registering device information and management parameters as registration information upon receiving a notification of registration completion from the data server 137. Furthermore, the electronic device 110 notifies the electronic device 120 of registration completion. The first authentication code is preferably updated with the second authentication code.

ST1024 is a step of updating the first authentication code of the electronic device 120 with the second authentication code generated in ST1022. The electronic device 120 updates the first authentication code of the registration information with the second authentication code, thereby improving the confidentiality of the management parameters of the electronic device 120.

ST1018 is a step in which registration of the first authentication code and the second authentication code to the electronic device 110 is completed. ST1042 is a step in which registration of the first authentication code and the second authentication code to the data server 137 is completed. ST1025 is a step in which the installation of the copying machine 120a is completed.

FIG. 8 shows a processing flow of an authentication system using FCODE for the electronic device 110 to obtain access permission from the electronic device 120. ST1111 is a step of detecting the GPS coordinates of the electronic device 110 using the GPS function of the electronic device 110.

ST1112 is a step of transmitting the GPS coordinates detected by the electronic device 110 to the data server 137.

ST1141 is a step of searching for the electronic device 120 that matches the GPS coordinates detected by the electronic device 110. If there is registration information that matches the GPS coordinates (Yes), the data server 137 proceeds to ST1142. When the registration information matching the GPS coordinates cannot be found (No), the data server 137 notifies the electronic device 110 that there is no search target, and ends the processing flow.

ST1142 is a step of transmitting a first authentication code as registration information to the electronic device 110 when the data server 137 detects the electronic device 120 matching the GPS coordinates.

ST1113 is a step in which the electronic device 110 requests the electronic device 120 for login authentication.

ST1114 is a step of transmitting the first authentication code received from the data server 137 to the electronic device 120.

ST1121 is a step of comparing the first authentication code received from the electronic device 110 with the second authentication code stored in the electronic device 120. As a result of the comparison, if they match (Yes), the process proceeds to ST1122. As a result of the comparison, if they do not match (No), the electronic device 110 is notified that they do not match, and the processing flow ends.

ST1122 is a step in which the electronic device 120 generates the second authentication code. The electronic device 120 can generate the second authentication code from the device information or the management parameter. The device information includes at least one ID information such as a product code and a serial number of the copier 120a. Since the management parameter of the copier 120a includes any one piece of information such as the condition history of the apparatus, it has a feature different from the stored second authentication code.

ST1123 is a step in which the generated second authentication code is encoded into FCODE and displayed on the display panel 122d of the electronic device 120.

ST1115 is a step of performing image authentication of the second authentication code encoded in FCODE by the electronic device 120 by the image sensor 112 of the electronic device 110.

ST1116 is a step of transmitting ID information included in the second authentication code decrypted by the electronic device 110 to the data server 137 via the network.

ST1117 is a step of transmitting other device information and management parameters included in the second authentication code decrypted by the electronic device 110 to the data server 137 via the network. ST 1143 is a step of registering other device information and management parameters included in the second authentication code to be decrypted in the data server 137 and notifying the electronic device 110 of the registration.

ST1118 is a step of notifying that the electronic device 110 logs in to the electronic device 120.

ST1124 is a step of updating the first authentication code of the registration information included in the electronic device 120 with the second authentication code generated in ST1122. The electronic device 120 updates the first authentication code of the registration information as a new second authentication code, thereby improving the confidentiality of the management parameters of the electronic device 120.

ST 1125 is a step of authenticating that the electronic device 120 has logged in from the electronic device 110.

ST1119 is a step in which the electronic device 110 transitions to a state in which it has logged into the electronic device 120.

ST1126 is a step in which the electronic device 120 permits access from the electronic device 110, and provides management parameters and device information in response to a request from the electronic device 110.

FIG. 9 shows an example of performing maintenance and maintenance of the electronic device 120 using the electronic device 110 in a processing flow. In FIG. 9, the electronic device 120 has already been logged into the electronic device 110 by the process of FIG. 8.

ST1211 is a step in which the electronic device 110 requests detailed device information of the electronic device 120 from the data server 137 via the network. When the electronic device 110 has detailed device information of the electronic device 120, the steps ST1211 and ST1241 to ST1243 may not be executed.

ST1241 is a step of downloading an operation manual corresponding to the device information from the data server 137 to the electronic device 110.

ST1242 is a step of downloading structural drawing information corresponding to device information from the data server 137 to the electronic device 110.

ST 1243 is a step of downloading a troubleshooting method (TSM: Trouble Shooting Method) from the data server 137 to the electronic device 110.

ST1212 is a step in which the electronic device 110 requests the electronic device 120 for information on the latest management parameters. Information indicating the status of the electronic device, such as a device condition, a consumable part, a part that is expected to deviate from a standard value that normally operates, or a part that is already deviating from the standard value is requested.

ST1221 is a step in which the electronic device 120 transmits the status information of the electronic device 120 in response to the status request of the electronic device 110. The transmission data at this time may be transmitted via the communication module 121 or may be transmitted after being encoded into FCODE.

ST1213 is a step in which the electronic device 110 transmits status information received from the electronic device 120 to the data server 137.

ST1244 is a step of updating the status information in the management parameters stored in the data server 137. The data server 137 can store the management parameters of the electronic device 120 and the work history in association with the status information.

ST1214 is a step of capturing an image of the copy machine 120a by the image sensor 112 included in the electronic device 110. The image sensor 112 can capture an image of the copy machine 120a with a still image or a moving image.

ST1215 is a step in which the status information acquired in ST1221 is combined with the captured image data of the copying machine 120a and displayed on the display panel 113d. The display panel 113d can generate an AR image in which the structural drawing acquired in ST1242 and the image acquired in ST1214 are combined. Furthermore, information such as a depleted location, a location that is expected to deviate from the standard value that operates normally in the near future, or a location that has already deviated from the standard value is added to the AR image by the status information received in ST1221. Can be displayed.

As an example, the display panel 113d included in the electronic device 110 of FIG. 5 shows a defect location 114g and a reason 114h for the defect. Since the parts at the adjustment location are small and have high performance, it is preferable that the AR image is displayed on the display panel 113d having high resolution. For example, a display panel having 4K (3840 × 2160), 8K (7680 × 4320), 16K (15360 × 8640), or more pixels is preferable because the amount of information to be displayed can be increased.

ST1222 confirms the AR image displayed on the display panel 113d, thereby confirming where the defect is in the copier 120a, confirming where the adjustment is required, obtaining an instruction on the adjustment method, and the like. This is a step of performing at least one of the above.

ST 1223 is a step of determining the end of adjustment. When adjustment is required again (No), the process proceeds to ST1221. If the adjustment has been completed (Yes), the process proceeds to ST1224.

ST1224 is a step in which the electronic device 120 transmits adjusted status information to the electronic device 110. The transmission data at this time may be transmitted via the communication module 121 or may be transmitted after being encoded into FCODE.

ST1216 is a step of transmitting status information received by the electronic device 110 from the electronic device 120 to the data server 137.

ST1245 is a step of updating the status information in the management parameters stored in the data server 137. The data server 137 can store the management parameters of the electronic device 120 and the work history in association with the status information.

ST1217 is a step of transmitting a request for the electronic device 110 to log out of the electronic device 120 because the adjustment work of the electronic device 120 is completed.

ST 1218 is a step in which the electronic device 110 logs out of the electronic device 120.

ST1225 is a step in which the electronic device 120 is logged out of the electronic device 110.

ST1226 is a step in which the user can use the copy machine 120a via the electronic device 120 (User Mode).

As described above, the second authentication code or communication data can be encoded into FCODE using a new code generation method. Therefore, it is possible to provide an authentication system in which confidentiality is improved by encoding the second authentication code into FCODE. Further, since communication data is encoded in FCODE, a communication system that improves confidentiality and facilitates transmission of a large amount of data can be provided.

FIGS. 10A-1 and 10B show a communication system using FCODE having a configuration different from that shown in FIG. FIG. 10A-1 illustrates a substrate 160a, an electronic component 161a, a substrate 160b, and an electronic component 161b. The electronic component 161 a has a light emitting element 162, and the electronic component 161 b has an imaging element 163. As the substrate 160a or the substrate 160b, either a printed circuit board or a flexible printed circuit board can be used.

The light emitting element 162 and the image pickup element 163 are arranged at positions facing each other, and the light emitted from the light emitting element 162 has an optical path for entering the image pickup element 163. Although not shown, the optical path of the light emitted from the light emitting element 162 may be surrounded by a light shielding wall in order to block the influence from other external light.

FIG. 10 (A-2) shows an example in which 16 light emitting elements 162 are arranged in 4 rows and 4 columns. However, the number of the light emitting elements 162 is not limited. The number of the light emitting elements 162 can be any number from 1 to n. n is an integer of 2 or more.

FIG. 10 (A-3) shows an example in which 16 image sensors 163 are arranged in 4 rows and 4 columns. However, the number of image sensors 163 is not limited. The number of image sensors 163 can be any number between 1 and n.

As the light emitting element 162, OLED (Organic Light Emitting Diode), LED (Light Emitting Diode), or the like can be used. For example, a photodiode, an optical sensor, an image sensor, or the like can be used as the imaging element 163 formed on the electronic component 161b mounted on the display.

As shown in FIG. 10A-1, wiring between electronic components can be reduced by using a light gradation value for data communication between electronic components. Therefore, it is not necessary to provide wiring for data communication between electronic components arranged on different substrates. Therefore, the wiring area, wiring resistance, wiring parasitic capacitance, electronic components such as buffers for transmitting and receiving signals, connectors for electrically connecting the substrates, and the like can be reduced. Further, adjustment of wiring impedance is not required. In electronic devices, miniaturization and high-density mounting have progressed, and it has become difficult to secure a mounting area and arrangement space for components. By using the luminance of light as a gradation value for data communication between electronic components, the electronic device can reduce the number of components, the wiring area, and the like.

In FIG. 10B, unlike FIG. 10A-1, the image sensor 163 is formed on the substrate 160c. The substrate 160c may be a substrate formed of a light-transmitting material such as a glass substrate or a quartz substrate. As a different example, the display device 113a includes a display controller 113b and a display panel 113d formed on the substrate 160c. Therefore, the electronic component 161a mounted on the board 160a may have a function as the display controller 113b.

The number of wires connecting the display controller 113b and the display panel 113d increases in proportion to the display definition. By using the imaging element 163 formed on the substrate 160c, the number of wirings connecting the display controller 113b and the display panel 113d can be reduced. Therefore, the display knit roller 113b can be flexibly printed on the display panel 113d. Since it is not necessary to electrically connect via a circuit board, a flexible printed circuit board can be reduced. Furthermore, since the wiring provided on the substrate 160c can be shortened, the substrate size can be reduced. Therefore, not only the electrical aspects such as the wiring area, the wiring resistance, and the parasitic capacitance of the wiring can be improved, but also the component cost and the manufacturing cost can be reduced.

As described above, the structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments.

(Embodiment 2)
In this embodiment, a display device of one embodiment of the present invention will be described. A high-definition display panel suitable for displaying an AR image will be described in detail.

One embodiment of the present invention is a display device including a display region (also referred to as a pixel portion) in which a plurality of pixels are arranged in a matrix. In the pixel portion, a wiring (also referred to as a gate line or a scanning line) to which a selection signal is supplied and a wiring (a source line, a signal line, a data line, or the like) to which a signal written to the pixel (also referred to as a video signal) is supplied. Are also provided in plurality. Here, the gate lines and the source lines are provided in parallel to each other, and the gate line and the source line intersect each other.

One pixel includes at least one transistor and one display element. The display element includes a conductive layer functioning as a pixel electrode, and the conductive layer is electrically connected to one of a source and a drain of the transistor. In the transistor, the gate is electrically connected to the gate line, and the other of the source and the drain is electrically connected to the source line.

Here, the extending direction of the gate line is referred to as the row direction or the first direction, and the extending direction of the source line is referred to as the column direction or the second direction.

Here, it is preferable that the same selection signal is supplied to two or more adjacent gate lines. That is, it is preferable that the selection periods of these gate lines be the same. Here, description will be made using an example in which three gate lines are combined. However, the number of gate lines with the same gate line selection period is not limited to a set of three gate lines, and may be a set of four gate lines. Further, a larger number of gate lines may be combined.

When the same selection signal is supplied to the three gate lines, three pixels adjacent in the column direction are simultaneously selected. Therefore, different source lines are connected to these three pixels. In other words, the structure is such that three source lines are arranged for each column.

Here, among the three source lines, it is preferable that the source line located inside is overlapped with the conductive layer functioning as the pixel electrode. Thereby, the distance between pixel electrodes can be reduced.

Further, it is preferable that a part of the semiconductor layer of the transistor is provided between the source line located outside and the source line located inside of the three source lines. For example, in the case where the first to third source lines are arranged in this order, a part of the semiconductor layer of the transistor connected to the first source line and the transistor connected to the second source line is connected to the first source line. The structure is located between the second source lines. Further, a part of the semiconductor layer of the transistor connected to the third source line is positioned between the second source line and the third source line. Thus, a node between each source line and each semiconductor layer can be configured not to intersect with other source lines. Therefore, parasitic capacitance between source lines can be reduced.

With this configuration, one horizontal period can be made longer than before. For example, when the same selection signal is supplied to three gate lines, the length of one horizontal period can be tripled. Furthermore, since the parasitic capacitance between the source lines can be reduced, the load on the source lines can be reduced. Accordingly, even a display device with extremely high resolution such as 4K or 8K can be operated using a transistor with low field-effect mobility. Further, the present invention can be applied to a large display device having a screen size of 50 inches diagonal or more, 60 inches diagonal or more, or 70 inches diagonal or more.

Hereinafter, more specific examples of the display device will be described with reference to the drawings.

[Configuration example of display device]
FIG. 11 is a block diagram of a display device 1100 of one embodiment of the present invention. The display device 1100 includes a pixel area (Pixel Area, display area), a source driver (Source Driver IC), and a gate driver (Gate Driver).

FIG. 11 shows an example having two gate drivers with a pixel region interposed therebetween. These two gate drivers, a plurality of gate lines GL ₀ is connected. FIG. 11 shows the i-th gate line GL ₀ (i). In the example, the gate line GL ₀ (i) is electrically connected to three gate lines (gate line GL (i), gate line GL (i + 1), and gate line GL (i + 2)). Therefore, the same selection signal is given to these three gate lines.

A plurality of source lines are connected to the source driver. Three source lines are provided for one pixel column. In FIG. 11, three source lines (source line SL ₁ (j), source line SL ₂ (j), source line SL ₃ (j)) corresponding to the j-th pixel column and the j + 1-th pixel column are connected. corresponding three source lines show the (source line _SL 1 (j + 1), the source line _SL 2 (j + 1), the source line _{SL 3 (j + 1))} .

Each pixel has at least one transistor and one conductive layer 21 that functions as a pixel electrode of a display element. A pixel is a pixel corresponding to one color. Therefore, in the case where color display is performed using a color mixture of light exhibited by a plurality of pixels, the pixels can also be referred to as sub-pixels.

Further, it is preferable that the plurality of pixels arranged in the column direction are pixels that exhibit the same color. In the case where a liquid crystal element is used as the display element, a pixel layer arranged in the column direction is provided with a colored layer that transmits the same color light as the liquid crystal element.

Here, it is preferable that a part of the source line (source line SL ₂ (j)) located on the inner side of the three source lines corresponding to one pixel column overlap with the conductive layer 21. Furthermore, the source line SL ₂ (j) is preferably disposed in the center of the conductive layer 21 while being separated from other source lines. For example, the distance between the source line SL ₁ (j) and the source line SL ₂ (j) and the distance between the source line SL ₂ (j) and the source line SL ₃ (j) are approximately equal. It is preferable. Thereby, the parasitic capacitance generated between the source lines can be reduced more effectively, and the load per source line can be reduced.

Here, when a transistor using amorphous silicon or the like for which field-effect mobility is difficult to increase is applied, the display region of the display device is driven by being divided into a plurality of pixel regions as a method for realizing high resolution. A method is mentioned. However, in the case of the above method, the boundary portion of the divided pixel region may be visually recognized due to variations in characteristics of the drive circuit, and the visibility may be deteriorated. In addition, image processing for dividing input image data in advance is required, and a high-speed and large-scale image processing apparatus is required.

On the other hand, the display device of one embodiment of the present invention can be driven without dividing the display region even when a transistor with relatively low field-effect mobility is used.

FIG. 11 shows an example in which the source driver is arranged along one side of the pixel area. However, as shown in FIG. 12, the pixel area is sandwiched along two opposite sides of the pixel area (Pixel Area). A source driver may be arranged in In addition, a gate driver (Gate Driver) may be disposed so as to sandwich the pixel region as shown in FIG.

In FIG. 12, among a plurality of source lines provided in the pixel region, a source driver IC (Source Driver IC) connected to an odd number and a source driver IC (Source Driver IC) connected to an even number are opposed to each other. An example is shown. That is, a plurality of source lines arranged in the column direction are connected to different source driver ICs alternately. In FIG. 12, the source line SL ₁ (j) and the source line SL ₃ (j) are connected to the source driver IC located on the upper side, and the source line SL ₂ (j) is connected to the source driver IC located on the lower side. An example is shown. With such a structure, display unevenness due to a potential drop caused by wiring resistance can be reduced even in a large display device. In addition, the configuration shown in FIG. 12 can increase the area where the source driver ICs are arranged as compared with the configuration shown in FIG. 11. Therefore, the distance between two adjacent source driver ICs can be increased, and the production yield can be improved. be able to.

[Pixel configuration example]
Hereinafter, a configuration example of pixels arranged in the pixel region of the display device 1100 will be described.

FIG. 13A shows a circuit diagram including three pixels arranged in the column direction.

One pixel includes a transistor 30, a liquid crystal element 20, and a capacitor element 60.

The wirings S1 to S3 correspond to source lines, and the wirings G1 to G3 correspond to gate lines, respectively. In addition, the wiring CS is electrically connected to one electrode of the capacitor 60 and given a predetermined potential.

The pixel is electrically connected to any one of the wirings S1 to S3 and any one of the wirings G1 to G3. As an example, a pixel connected to the wiring S1 and the wiring G1 will be described. In the transistor 30, the gate is electrically connected to the wiring G 1, one of the source and the drain is electrically connected to the wiring S 1, the other is the other electrode of the capacitor 60, and one electrode (pixel) of the liquid crystal element 20. Electrode). A common potential is supplied to one electrode of the capacitor 60.

FIG. 13B shows an example of the layout of pixels connected to the wiring S1 and the wiring G1.

As shown in FIG. 13B, the wiring G1 and the wiring CS extend in the row direction (lateral direction), and the wirings S1 to S3 extend in the column direction (vertical direction).

In the transistor 30, the semiconductor layer 32 is provided over the wiring G1, and part of the wiring G1 functions as a gate electrode. Further, part of the wiring S1 functions as one of a source electrode and a drain electrode. The semiconductor layer 32 has a region located between the wiring S1 and the wiring S2.

The other of the source electrode or the drain electrode of the transistor 30 and the conductive layer 21 functioning as a pixel electrode are electrically connected through a connection portion 38. A colored layer 41 is provided at a position overlapping the conductive layer 21.

Further, the conductive layer 21 has a portion overlapping the wiring S2. The conductive layer 21 preferably does not overlap with the wirings S1 and S3 located at both ends. Thereby, the parasitic capacitance of the wiring S1 and the wiring S3 can be reduced.

Here, when the distance between the wiring S1 and the wiring S2 is the distance D1, and the distance between the wiring S2 and the wiring S3 is the distance D2, it is preferable that the distance D1 and the distance D2 are approximately equal. For example, the ratio of the distance D2 to the distance D1 (that is, the value of D2 / D1) is 0.8 or more and 1.2 or less, preferably 0.9 or more and 1.1 or less. Thereby, the parasitic capacitance between the wiring S1 and the wiring S2 and the parasitic capacitance between the wiring S2 and the wiring S3 can be reduced.

In addition, by increasing the distance between the wirings, if dust or the like adheres between the wirings during the manufacturing process, it can be easily removed by cleaning, so that the yield can be improved. When a line cleaning apparatus is used as a cleaning method, it is preferable to clean the substrate while moving the substrate along the extending direction of the wiring S1 and the like because dust is more easily removed.

In FIG. 13B, a part of the wirings S1 to S3 and a part of the wiring CS have thicker portions than the other parts. Thereby, wiring resistance can be made small.

FIGS. 13C and 13D show examples of the layout of pixels connected to the wiring G2 and the wiring G3, respectively.

In FIG. 13C, the semiconductor layer 32 provided over the wiring G2 is electrically connected to the wiring S2, and has a region located between the wiring S1 and the wiring S2.

In FIG. 13D, the semiconductor layer 32 provided over the wiring G3 is electrically connected to the wiring S3 and has a region located between the wiring S2 and the wiring S3.

Further, it is preferable that each pixel shown in FIGS. 13B, 13C, and 13D is a pixel that exhibits the same color. A colored layer 41 that transmits light of the same color can be overlaid in a region overlapping with the conductive layer 21. Further, the pixels adjacent in the column direction can have the same structure as in FIGS. 13B, 13C, and 13D, but only the colored layer 41 is a colored layer that transmits different colors.

[Section configuration example]
Hereinafter, an example of a cross-sectional configuration of the display device will be described.

[Cross-section configuration example 1]
FIG. 14 shows an example of a cross section corresponding to the cutting line A1-A2 in FIG. Here, an example in which a transmissive liquid crystal element 20 is applied as a display element is shown. In FIG. 14, the substrate 12 side is the display surface side.

The display device 1100 has a configuration in which a liquid crystal 22 is sandwiched between a substrate 11 and a substrate 12. The liquid crystal element 20 includes a conductive layer 21 provided on the substrate 11 side, a conductive layer 23 provided on the substrate 12 side, and a liquid crystal 22 sandwiched therebetween. An alignment film 24 a is provided between the liquid crystal 22 and the conductive layer 21, and an alignment film 24 b is provided between the liquid crystal 22 and the conductive layer 23.

The conductive layer 21 functions as a pixel electrode. The conductive layer 23 functions as a common electrode. Further, each of the conductive layer 21 and the conductive layer 23 has a function of transmitting visible light. Therefore, the liquid crystal element 20 is a transmissive liquid crystal element.

A colored layer 41 and a light shielding layer 42 are provided on the surface of the substrate 12 on the substrate 11 side. An insulating layer 26 is provided so as to cover the colored layer 41 and the light shielding layer 42, and a conductive layer 23 is provided so as to cover the insulating layer 26. The colored layer 41 is provided in a region overlapping with the conductive layer 21. The light shielding layer 42 is provided so as to cover the transistor 30 and the connection portion 38.

A polarizing plate 39 a is disposed outside the substrate 11, and a polarizing plate 39 b is disposed outside the substrate 12. Further, a backlight unit 90 is provided outside the polarizing plate 39a.

A transistor 30, a capacitor element 60, and the like are provided on the substrate 11. The transistor 30 functions as a pixel selection transistor. The transistor 30 is electrically connected to the liquid crystal element 20 through the connection portion 38.

14 is a so-called bottom-gate / channel-etched transistor. The transistor 30 includes a conductive layer 31 functioning as a gate electrode, an insulating layer 34 functioning as a gate insulating layer, a semiconductor layer 32, a pair of impurity semiconductor layers 35 functioning as a source region and a drain region, and a source electrode and a drain. It has a pair of conductive layers 33a and 33b that function as electrodes. A portion of the semiconductor layer 32 that overlaps with the conductive layer 31 functions as a channel region. The semiconductor layer 32 and the impurity semiconductor layer 35 are provided in contact with each other, and the impurity semiconductor layer 35 and the conductive layer 33a or the conductive layer 33b are provided in contact with each other.

Note that the conductive layer 31 corresponds to part of the wiring G1 in FIG. 13B, and the conductive layer 33a corresponds to part of the wiring S1. A conductive layer 31a, a conductive layer 33c, and a conductive layer 33d described later correspond to the wiring CS, the wiring S2, and the wiring S3, respectively.

The semiconductor layer 32 is preferably a semiconductor containing silicon. For example, amorphous silicon, microcrystalline silicon, polycrystalline silicon, or the like can be used. In particular, amorphous silicon is preferably used because it can be formed over a large substrate with a high yield. The display device of one embodiment of the present invention can perform favorable display even with a transistor to which amorphous silicon with relatively low field-effect mobility is applied. When amorphous silicon is used, it is preferable to use hydrogenated amorphous silicon (which may be expressed as a-Si: H) in which dangling bonds are terminated with hydrogen.

The impurity semiconductor film constituting the impurity semiconductor layer 35 is formed of a semiconductor to which an impurity element imparting one conductivity type is added. In the case where the transistor is n-type, a semiconductor to which an impurity element imparting one conductivity type is added includes, for example, silicon to which P or As is added. Alternatively, in the case where the transistor is p-type, for example, B can be added as an impurity element imparting one conductivity type, but the transistor is preferably n-type. Note that the impurity semiconductor layer 35 may be formed using an amorphous semiconductor or a crystalline semiconductor such as a microcrystalline semiconductor.

The capacitor element 60 includes a conductive layer 31a, an insulating layer 34, and a conductive layer 33b. Further, a conductive layer 33c and a conductive layer 33d are provided on the conductive layer 31a with an insulating layer 34 interposed therebetween.

An insulating layer 82 and an insulating layer 81 are stacked so as to cover the transistor 30 and the like. The conductive layer 21 that functions as a pixel electrode is provided over the insulating layer 81. In the connection portion 38, the conductive layer 21 and the conductive layer 33 b are electrically connected through openings provided in the insulating layer 81 and the insulating layer 82. The insulating layer 81 preferably functions as a planarization layer. The insulating layer 82 preferably has a function as a protective film that suppresses diffusion of impurities and the like into the transistor 30 and the like. For example, an inorganic insulating material can be used for the insulating layer 82 and an organic insulating material can be used for the insulating layer 81.

[Cross-section configuration example 2]
In the above, an example of a liquid crystal element of a vertical electric field type in which a pair of electrodes sandwiching a liquid crystal is arranged above and below is shown as the liquid crystal element, but the configuration of the liquid crystal element is not limited to this, and liquid crystal elements of various types Can be applied.

FIG. 15 is a schematic cross-sectional view of a display device having a liquid crystal element to which an FFS (Fringe Field Switching) mode is applied.

The liquid crystal element 20 includes a conductive layer 21 that functions as a pixel electrode, and a conductive layer 23 that overlaps the conductive layer 21 with the insulating layer 83 interposed therebetween. The conductive layer 23 has a slit-like or comb-like top shape.

In this configuration, a capacitor is formed in a portion where the conductive layer 21 and the conductive layer 23 overlap, and this can be used as the capacitor element 60. Therefore, since the area occupied by the pixels can be reduced, a high-definition display device can be realized. In addition, the aperture ratio can be improved.

Here, when manufacturing a display device, the manufacturing cost can be reduced as the photolithography process in the manufacturing process is smaller, that is, as the number of photomasks is smaller.

For example, in the configuration shown in FIG. 14, among the processes on the substrate 11 side, the formation process of the conductive layer 31 and the like, the formation process of the semiconductor layer 32 and the impurity semiconductor layer 35, the formation process of the conductive layer 33 a and the like, and the opening to be the connection portion It can be manufactured through a total of five photolithography processes, that is, a part forming process and a conductive layer 21 forming process. That is, a backplane substrate can be manufactured using five photomasks. On the other hand, on the substrate 12 (counter substrate) side, it is preferable to use an inkjet method or a screen printing method as a method for forming the colored layer 41 and the light shielding layer 42 because a photomask is not necessary. For example, when three colored layers 41 and a light-shielding layer 42 are provided, a total of four photomasks can be reduced as compared with the case where these are formed by photolithography.

The above is an explanation of a cross-sectional configuration example.

[About transistor configuration]
Hereinafter, an example of a structure of a transistor different from the above will be described.

The transistor illustrated in FIG. 16A includes a semiconductor layer 37 between the semiconductor layer 32 and the impurity semiconductor layer 35.

The semiconductor layer 37 may be formed of a semiconductor film similar to the semiconductor layer 32. The semiconductor layer 37 can function as an etching stopper for preventing the semiconductor layer 32 from being lost by etching when the impurity semiconductor layer 35 is etched. 16A shows an example in which the semiconductor layer 37 is separated into the left and right, a part of the semiconductor layer 37 may cover the channel region of the semiconductor layer 32.

Further, the semiconductor layer 37 may contain impurities having a lower concentration than the impurity semiconductor layer 35. As a result, the semiconductor layer 37 can function as an LDD (Lightly Doped Drain) region, and hot carrier deterioration when the transistor is driven can be suppressed.

In the transistor illustrated in FIG. 16B, the insulating layer 84 is provided over the channel region of the semiconductor layer 32. The insulating layer 84 functions as an etching stopper when the impurity semiconductor layer 35 is etched.

The transistor illustrated in FIG. 16C includes a semiconductor layer 32p instead of the semiconductor layer 32. The semiconductor layer 32p includes a highly crystalline semiconductor film. For example, the semiconductor layer 32p includes a polycrystalline semiconductor or a single crystal semiconductor. Thus, a transistor with high field effect mobility can be obtained.

The transistor illustrated in FIG. 16D includes a semiconductor layer 32 p in the channel region of the semiconductor layer 32. For example, the transistor illustrated in FIG. 16D can be formed by locally crystallization by irradiating a semiconductor film serving as the semiconductor layer 32 with laser light or the like. Thereby, a transistor with high field effect mobility can be realized.

The transistor illustrated in FIG. 16E includes a crystalline semiconductor layer 32p in the channel region of the semiconductor layer 32 of the transistor illustrated in FIG.

The transistor illustrated in FIG. 16F includes a crystalline semiconductor layer 32p in a channel region of the semiconductor layer 32 of the transistor illustrated in FIG.

The above is the description of the configuration example of the transistor.

[About each component]
Below, each component shown above is demonstrated.

〔substrate〕
A substrate having a flat surface can be used for the substrate included in the display panel. A substrate that extracts light from the display element is formed using a material that transmits the light. For example, materials such as glass, quartz, ceramic, sapphire, and organic resin can be used.

By using a thin substrate, the display panel can be reduced in weight and thickness. Furthermore, a flexible display panel can be realized by using a flexible substrate. Alternatively, glass that is thin enough to be flexible can be used for the substrate. Alternatively, a composite material in which glass and a resin material are bonded together with an adhesive layer may be used.

[Transistor]
The transistor includes a conductive layer that functions as a gate electrode, a semiconductor layer, a conductive layer that functions as a source electrode, a conductive layer that functions as a drain electrode, and an insulating layer that functions as a gate insulating layer.

Note that there is no particular limitation on the structure of the transistor included in the display device of one embodiment of the present invention. For example, a planar transistor, a staggered transistor, or an inverted staggered transistor may be used. Further, a top-gate or bottom-gate transistor structure may be employed. Alternatively, gate electrodes may be provided above and below the channel.

There is no particular limitation on the crystallinity of a semiconductor material used for the transistor, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region) is used. May be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.

For example, silicon can be used for the semiconductor in which the channel of the transistor is formed. As silicon, it is particularly preferable to use amorphous silicon. By using amorphous silicon, a transistor can be formed over a large substrate with high yield, and the mass productivity is excellent.

Further, silicon having crystallinity such as microcrystalline silicon, polycrystalline silicon, or single crystal silicon can also be used. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon.

Alternatively, a metal oxide may be used for the semiconductor layer of the transistor. A transistor including a metal oxide in a semiconductor layer is known to have a low off-state current. By using a transistor with a small off-state current as a pixel selection transistor, deterioration in display quality can be suppressed even if the display update interval is extended. Therefore, when displaying a still image, the number of display updates can be reduced, so that power consumption can be reduced. The display controller 113b or 122b in Embodiment 1 is suitable for controlling a selection transistor having a metal oxide in a semiconductor layer. A transistor using a metal oxide for a semiconductor layer will be described in detail in Embodiment 6.

The bottom-gate transistor exemplified in this embodiment is preferable because the number of manufacturing steps can be reduced. At this time, since amorphous silicon can be used at a lower temperature than polycrystalline silicon, it is possible to use a material having low heat resistance as a material for wiring, electrodes, and substrates below the semiconductor layer. Can widen the choice of materials. For example, a glass substrate having an extremely large area can be suitably used. On the other hand, a top-gate transistor is preferable because an impurity region can be easily formed in a self-aligned manner and variation in characteristics can be reduced. In this case, it may be particularly suitable when using polycrystalline silicon or single crystal silicon.

[Conductive layer]
In addition to the gate, source, and drain of the transistor, materials that can be used for conductive layers such as various wirings and electrodes constituting the display device include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, A metal such as tantalum or tungsten, or an alloy containing this as a main component can be used. A film containing any of these materials can be used as a single layer or a stacked structure. For example, a single layer structure of an aluminum film containing silicon, a two layer structure in which an aluminum film is stacked on a titanium film, a two layer structure in which an aluminum film is stacked on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film Two-layer structure to stack, two-layer structure to stack copper film on titanium film, two-layer structure to stack copper film on tungsten film, titanium film or titanium nitride film, and aluminum film or copper film on top of it A three-layer structure for forming a titanium film or a titanium nitride film thereon, a molybdenum film or a molybdenum nitride film, and an aluminum film or a copper film stacked thereon, and a molybdenum film or There is a three-layer structure for forming a molybdenum nitride film. Note that an oxide such as indium oxide, tin oxide, or zinc oxide may be used. Further, it is preferable to use copper containing manganese because the controllability of the shape by etching is increased.

In addition to a gate, a source, and a drain of a transistor, a light-transmitting conductive material that can be used for conductive layers such as various wirings and electrodes included in a display device includes indium oxide, indium tin oxide, A conductive oxide such as indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or graphene can be used. Alternatively, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, or an alloy material containing the metal material can be used. Alternatively, a nitride (eg, titanium nitride) of the metal material may be used. Note that in the case where a metal material or an alloy material (or a nitride thereof) is used, it may be thin enough to have a light-transmitting property. In addition, a stacked film of the above materials can be used as a conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and indium tin oxide because the conductivity can be increased. These can also be used for conductive layers such as various wirings and electrodes constituting the display device and conductive layers (conductive layers functioning as pixel electrodes and common electrodes) included in the display element.

[Insulating layer]
Insulating materials that can be used for each insulating layer include, for example, resins such as acrylic and epoxy, resins having a siloxane bond, and inorganic insulation such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide. Materials can also be used.

Examples of the low water-permeable insulating film include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride oxide film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[Liquid crystal element]
As the liquid crystal element, for example, a liquid crystal element to which a vertical alignment (VA: Vertical Alignment) mode is applied can be used. As the vertical alignment mode, an MVA (Multi-Domain Vertical Alignment) mode, a PVA (Patterned Vertical Alignment) mode, an ASV (Advanced Super View) mode, or the like can be used.

Further, liquid crystal elements to which various modes are applied can be used as the liquid crystal elements. For example, in addition to the VA mode, TN (Twisted Nematic) mode, IPS (In-Plane-Switching) mode, FFS (Fringe Field Switching) mode, ASM (Axially Symmetrical Aligned Micro-cell) mode , Using liquid crystal elements to which FLC (Ferroelectric Liquid Crystal) mode, AFLC (Antiferroelectric Liquid Crystal) mode, ECB (Electrically Controlled Birefringence) mode, guest host mode, etc. are applied. Can.

Note that the liquid crystal element is an element that controls transmission or non-transmission of light by an optical modulation action of liquid crystal. Note that the optical modulation action of the liquid crystal is controlled by an electric field (including a horizontal electric field, a vertical electric field, or an oblique electric field) related to the liquid crystal. As the liquid crystal used for the liquid crystal element, a thermotropic liquid crystal, a low molecular liquid crystal, a polymer liquid crystal, a polymer dispersed liquid crystal (PDLC: Polymer Dispersed Liquid Crystal), a polymer network type liquid crystal (PNLC: Polymer Network Liquid Crystal), Ferroelectric liquid crystals, antiferroelectric liquid crystals, and the like can be used. These liquid crystal materials exhibit a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase, and the like depending on conditions.

Further, as the liquid crystal material, either a positive type liquid crystal or a negative type liquid crystal may be used, and an optimal liquid crystal material may be used according to the mode and design to be applied.

Also, an alignment film can be provided to control the alignment of the liquid crystal. Note that in the case of employing a horizontal electric field mode, liquid crystal exhibiting a blue phase for which an alignment film is unnecessary may be used. The blue phase is one of the liquid crystal phases. When the temperature of the cholesteric liquid crystal is increased, the blue phase appears immediately before the transition from the cholesteric phase to the isotropic phase. Since the blue phase appears only in a narrow temperature range, a liquid crystal composition mixed with several percent by weight or more of a chiral agent is used for the liquid crystal layer in order to improve the temperature range. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response speed and is optically isotropic. In addition, a liquid crystal composition including a liquid crystal exhibiting a blue phase and a chiral agent does not require alignment treatment and has a small viewing angle dependency. Further, since it is not necessary to provide an alignment film, a rubbing process is not required, so that electrostatic breakdown caused by the rubbing process can be prevented, and defects or breakage of the liquid crystal display device during the manufacturing process can be reduced. .

As the liquid crystal element, there are a transmissive liquid crystal element, a reflective liquid crystal element, a transflective liquid crystal element, and the like.

In one embodiment of the present invention, a transmissive liquid crystal element can be particularly preferably used.

When using a transmissive or transflective liquid crystal element, two polarizing plates are provided so as to sandwich a pair of substrates. A backlight is provided outside the polarizing plate. The backlight may be a direct type backlight or an edge light type backlight. It is preferable to use a direct-type backlight including LEDs because local dimming is facilitated and contrast can be increased. An edge light type backlight is preferably used because the thickness of the module including the backlight can be reduced.

Note that see-through display can be performed by turning off the edge-light type backlight.

(Colored layer)
Examples of materials that can be used for the colored layer include metal materials, resin materials, resin materials containing pigments or dyes, and the like.

[Light shielding layer]
Examples of the material that can be used for the light-shielding layer include carbon black, titanium black, metal, metal oxide, and composite oxide containing a solid solution of a plurality of metal oxides. The light shielding layer may be a film containing a resin material or a thin film of an inorganic material such as a metal. Alternatively, a stacked film of a film containing a material for the colored layer can be used for the light shielding layer. For example, a stacked structure of a film including a material used for a colored layer that transmits light of a certain color and a film including a material used for a colored layer that transmits light of another color can be used. It is preferable to use a common material for the coloring layer and the light-shielding layer because the apparatus can be shared and the process can be simplified.

The above is an explanation of each component.

Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.

(Embodiment 3)
In this embodiment, an example of a polycrystalline silicon crystallization method and a laser crystallization apparatus that can be used for a semiconductor layer of a transistor will be described.

In order to form a polycrystalline silicon layer with good crystallinity, it is preferable to provide an amorphous silicon layer on a substrate and crystallize the amorphous silicon layer by irradiating it with laser light. For example, a polycrystalline silicon layer can be formed in a desired region on the substrate by using a laser beam as a linear beam and moving the substrate while irradiating the amorphous silicon layer with the linear beam.

The method using a linear beam has a relatively good throughput. On the other hand, since it is a method of irradiating a laser beam a plurality of times while moving relative to a certain region, variations in crystallinity are likely to occur due to fluctuations in the output of the laser beam and beam profile changes resulting therefrom. For example, when a semiconductor layer crystallized by the above method is used for a transistor included in a pixel of a display device, a random stripe pattern due to variation in crystallinity may be displayed.

Also, the length of the linear beam is ideally longer than the length of one side of the substrate, but the length of the linear beam is limited by the output of the laser oscillator and the configuration of the optical system. Therefore, in the processing of a large substrate, it is realistic to irradiate the laser by folding the substrate surface. For this reason, a region where laser light is overlapped and irradiated is generated. Since the crystallinity of the region is easily different from the crystallinity of other regions, display unevenness may occur in the region.

In order to suppress the above problems, the amorphous silicon layer formed on the substrate may be locally irradiated with laser to be crystallized. With local laser irradiation, it is easy to form a polycrystalline silicon layer with little variation in crystallinity.

FIG. 17A is a diagram for explaining a method of locally irradiating an amorphous silicon layer formed on a substrate with laser.

The laser beam 826 emitted from the optical system unit 821 is reflected by the mirror 822 and enters the microlens array 823. The microlens array 823 condenses the laser light 826 to form a plurality of laser beams 827.

The substrate 830 on which the amorphous silicon layer 840 is formed is fixed to the stage 815. By irradiating the amorphous silicon layer 840 with a plurality of laser beams 827, a plurality of polycrystalline silicon layers 841 can be formed at the same time.

It is preferable that each microlens included in the microlens array 823 is provided in accordance with the pixel pitch of the display device. Or you may provide in the space | interval of the integral multiple of a pixel pitch. In any case, a polycrystalline silicon layer can be formed in a region corresponding to all pixels by repeating laser irradiation and movement of the stage 815 in the X direction or Y direction.

For example, when the microlens array 823 has M rows and N columns (M and N are natural numbers) microlenses at a pixel pitch, first, laser light is irradiated at a predetermined start position, and M rows and N columns of the polycrystalline silicon layer 841. Can be formed. Then, the substrate is moved by a distance corresponding to N columns in the row direction and irradiated with laser light, and further, an M row and N column polycrystalline silicon layer 841 is formed, thereby forming an M row and 2N column polycrystalline silicon layer 841. be able to. By repeating this process, a plurality of polycrystalline silicon layers 841 can be formed in a desired region. In the case of performing the laser irradiation process by turning back, the laser irradiation may be performed by moving the distance by N columns in the row direction, and the movement of the distance for M rows in the column direction and the laser light irradiation may be repeated.

Note that if the oscillation frequency of the laser beam and the moving speed of the stage 815 are appropriately adjusted, a polycrystalline silicon layer can be formed at a pixel pitch even by a method of performing laser irradiation while moving the stage 815 in one direction.

The size of the laser beam 827 can be set to an area that includes the entire semiconductor layer of one transistor, for example. Alternatively, the area can be such that the entire channel region of one transistor is included. Alternatively, the area can be such that part of the channel region of one transistor is included. These may be used properly according to the electrical characteristics of the required transistors.

Note that in the case where a display device including a plurality of transistors in one pixel is used, the laser beam 827 can have an area enough to include the entire semiconductor layer of each transistor in one pixel. The laser beam 827 may have an area enough to include the entire semiconductor layer of the transistor included in the plurality of pixels.

Further, as shown in FIG. 18A, a mask 824 may be provided between the mirror 822 and the microlens array 823. The mask 824 is provided with a plurality of openings corresponding to the respective microlenses. The shape of the opening can be reflected in the shape of the laser beam 827. When the mask 824 has a circular opening as shown in FIG. 18A, a circular laser beam 827 can be obtained. When the mask 824 has a rectangular opening, a rectangular laser beam 827 can be obtained. The mask 824 is effective when, for example, it is desired to crystallize only the channel region of the transistor. Note that the mask 824 may be provided between the optical system unit 821 and the mirror 822 as shown in FIG.

FIG. 17B is a perspective view illustrating a main configuration of a laser crystallization apparatus that can be used in the local laser irradiation process described above. The laser crystallization apparatus includes a moving mechanism 812, a moving mechanism 813, and a stage 815 that are components of the XY stage. Further, a laser oscillator 820 for shaping the laser beam 827, an optical system unit 821, a mirror 822, and a microlens array 823 are provided.

The moving mechanism 812 and the moving mechanism 813 have a function of reciprocating linear motion in the horizontal direction. As a mechanism for supplying power to the moving mechanism 812 and the moving mechanism 813, for example, a ball screw mechanism 816 driven by a motor can be used. Since the moving directions of the moving mechanism 812 and the moving mechanism 813 intersect each other vertically, the stage 815 fixed to the moving mechanism 813 can be freely moved in the X direction and the Y direction.

The stage 815 has a fixing mechanism such as a vacuum suction mechanism, and can fix the substrate 830 and the like. Moreover, the stage 815 may have a heating mechanism as needed. Although not shown, the stage 815 includes a pusher pin and its vertical mechanism, and the substrate 830 and the like can be moved up and down when the substrate 830 and the like are carried in and out.

The laser oscillator 820 only needs to be able to output light having a wavelength and intensity suitable for the purpose of processing, and is preferably a pulse laser, but may be a CW laser. Typically, an excimer laser that can emit ultraviolet light with a wavelength of 351 to 353 nm (XeF), 308 nm (XeCl), or the like can be used. Alternatively, a second harmonic (515 nm, 532 nm, etc.) or a third harmonic (343 nm, 355 nm, etc.) of a solid-state laser (YAG laser, fiber laser, etc.) may be used. A plurality of laser oscillators 820 may be provided.

The optical system unit 821 includes, for example, a mirror, a beam expander, a beam homogenizer, and the like, and can extend the laser light 825 output from the laser oscillator 820 while making the in-plane distribution of the energy uniform.

As the mirror 822, for example, a dielectric multilayer mirror can be used, and the mirror 822 is installed so that the incident angle of the laser beam is approximately 45 °. For example, the microlens array 823 can have a shape in which a plurality of convex lenses are provided on the upper surface or upper and lower surfaces of a quartz plate.

By using the above laser crystallization apparatus, a polycrystalline silicon layer with little variation in crystallinity can be formed.

Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.

(Embodiment 4)
In this embodiment, a hybrid display of one embodiment of the present invention will be described. A display device suitable for displaying a flushing code will be described in detail.

In addition, the hybrid display method is a method of displaying characters or / and images by displaying a plurality of lights in the same pixel or the same sub-pixel. The hybrid display is an aggregate that displays a plurality of lights and displays characters or / and images in the same pixel or the same sub-pixel included in the display unit.

As an example of the hybrid display method, there is a method in which the display timing of the first light and the second light is made different in the same pixel or the same sub-pixel. At this time, the first light and the second light having the same color tone (red, green, or blue, or any one of cyan, magenta, or yellow) are simultaneously displayed and displayed in the same pixel or the same sub-pixel. Characters and / or images can be displayed in the section.

Further, as an example of the hybrid display method, there is a method of displaying reflected light and self-light emission by the same pixel or the same sub-pixel. Reflected light of the same color and self-emission (for example, OLED light, LED light, etc.) can be simultaneously displayed on the same pixel or the same sub-pixel.

In the hybrid display method, a plurality of lights may be displayed not in the same pixel or the same subpixel but in an adjacent pixel or an adjacent subpixel. In addition, displaying the first light and the second light at the same time means displaying the first light and the second light for the same period to the extent that the flicker is not sensed by human eyes. If the flicker is not sensed with the sense, the display period of the first light and the display period of the second light may be shifted.

In addition, the hybrid display is an aggregate that includes a plurality of display elements in the same pixel or the same sub-pixel, and each of the plurality of display elements displays in the same period. In addition, the hybrid display includes a plurality of display elements and active elements that drive the display elements in the same pixel or the same sub-pixel. Examples of active elements include switches, transistors, and thin film transistors. Since the active element is connected to each of the plurality of display elements, the display of each of the plurality of display elements can be individually controlled.

In the present specification and the like, a display that satisfies any one or more expressions of the above configuration is referred to as a hybrid display. The display controller 113b or 122b of Embodiment 1 can control the hybrid display.

Moreover, the hybrid display has a plurality of display elements in the same pixel or the same sub-pixel. Examples of the plurality of display elements include a reflective element that reflects light and a self-luminous element that emits light. Note that the reflective element and the self-luminous element can be controlled independently. The hybrid display has a function of displaying characters and / or images using either one or both of reflected light and self-light emission in the display unit.

The display device of one embodiment of the present invention can include a pixel provided with a first display element that reflects visible light. Alternatively, a pixel provided with a second display element that emits visible light can be provided. Alternatively, the pixel can include a pixel provided with a first display element and a second display element. Accordingly, the first display element is suitable for performing normal display, and the second display element is suitable for displaying a flushing code.

In this embodiment, a display device including a first display element that reflects visible light and a second display element that emits visible light will be described.

The display device has a function of displaying an image by one or both of the first light reflected by the first display element and the second light emitted by the second display element. Alternatively, the display device functions to express gradation by controlling the amount of first light reflected by the first display element and the amount of second light emitted by the second display element, respectively. Have

In addition, the display device controls the first pixel that expresses gradation by controlling the amount of reflected light from the first display element, and the gradation by controlling the amount of light emitted from the second display element. A structure including the second pixel to be expressed is preferable. A plurality of first pixels and second pixels are arranged in a matrix, for example, and constitute a display unit.

Further, it is preferable that the first pixels and the second pixels are arranged in the display area with the same number and the same pitch. At this time, the adjacent first pixel and second pixel can be collectively referred to as a pixel unit. Thereby, as will be described later, an image displayed with only the plurality of first pixels, an image displayed with only the plurality of second pixels, and both the plurality of first pixels and the plurality of second pixels. Each of the images displayed in can be displayed in the same display area.

As the first display element included in the first pixel, an element that reflects and displays external light can be used. Since such an element does not have a light source, power consumption during display can be extremely reduced.

As the first display element, a reflective liquid crystal element can be typically used. Alternatively, as a first display element, in addition to a shutter type MEMS (Micro Electro Mechanical System) element, an optical interference type MEMS element, a microcapsule type, an electrophoretic type, an electrowetting type, an electropowder fluid (registered trademark) An element to which a method or the like is applied can be used.

The second display element included in the second pixel includes a light source, and an element that performs display using light from the light source can be used. In particular, an electroluminescent element that can extract light emitted from a light-emitting substance by applying an electric field is preferably used. The light emitted from such pixels does not depend on external light in brightness or chromaticity, and therefore has high color reproducibility (wide color gamut) and high contrast, that is, vivid display. be able to.

As the second display element, for example, a self-luminous light emitting element such as an OLED, an LED, a QLED (Quantum-dot Light Emitting Diode), or a semiconductor laser can be used. Alternatively, as the display element included in the second pixel, a combination of a backlight that is a light source and a transmissive liquid crystal element that controls the amount of light transmitted through the backlight may be used.

The first pixel can include a sub-pixel that exhibits white (W), for example, or a sub-pixel that exhibits light of three colors, for example, red (R), green (G), and blue (B). . Similarly, the second pixel includes a sub-pixel that exhibits, for example, white (W), or a sub-pixel that exhibits, for example, three colors of light of red (R), green (G), and blue (B). can do. Note that the subpixels included in each of the first pixel and the second pixel may have four or more colors. As the number of subpixels increases, power consumption can be reduced and color reproducibility can be improved.

According to one embodiment of the present invention, a first mode in which an image is displayed with a first pixel, a second mode in which an image is displayed with a second pixel, and an image is displayed with the first pixel and the second pixel. The third mode can be switched. In addition, a different image signal can be input to each of the first pixel and the second pixel to display a composite image.

The first mode is a mode in which an image is displayed using reflected light from the first display element. The first mode is a driving mode with extremely low power consumption because no light source is required. For example, it is effective when the illuminance of outside light is sufficiently high and the outside light is white light or light in the vicinity thereof. The first mode is a display mode suitable for displaying character information such as books and documents. In addition, since the reflected light is used, it is possible to perform display that is kind to the eyes, and the effect that the eyes are less tired is achieved.

In the second mode, an image is displayed by using light emission by the second display element. Therefore, an extremely vivid display (high contrast and high color reproducibility) can be performed regardless of the illuminance and chromaticity of external light. For example, it is effective when the illuminance of outside light is extremely small, such as at night or in a dark room. Further, when the outside light is dark, the user may feel dazzled when performing bright display. In order to prevent this, it is preferable to perform display with reduced luminance in the second mode. Thereby, in addition to suppressing glare, power consumption can also be reduced. The second mode is a mode suitable for displaying a vivid image or a smooth moving image.

In the third mode, display is performed using both reflected light from the first display element and light emission from the second display element. Specifically, driving is performed so as to express one color by mixing light emitted by the first pixel and light emitted by the second pixel adjacent to the first pixel. While displaying more vividly than in the first mode, it is possible to suppress power consumption as compared with the second mode. For example, it is effective when the illuminance of outside light is relatively low, such as under room lighting or in the morning or evening hours, or when the chromaticity of outside light is not white.

Hereinafter, more specific examples of one embodiment of the present invention will be described with reference to the drawings.

[Configuration example of display device]
FIG. 19 illustrates a display region 70 included in the display device of one embodiment of the present invention. The display area 70 includes a plurality of pixel units 75 arranged in a matrix. The pixel unit 75 includes a pixel 76 and a pixel 77.

FIG. 19 shows an example in which the pixel 76 and the pixel 77 each have display elements corresponding to three colors of red (R), green (G), and blue (B).

The pixel 76 includes a display element 76R corresponding to red (R), a display element 76G corresponding to green (G), and a display element 76B corresponding to blue (B). The display elements 76R, 76G, and 76B are second display elements that use light from the light source.

The pixel 77 includes a display element 77R corresponding to red (R), a display element 77G corresponding to green (G), and a display element 77B corresponding to blue (B). The display elements 77R, 77G, and 77B are first display elements that utilize reflection of external light.

The above is the description of the configuration example of the display device.

[Configuration example of pixel unit]
Next, the pixel unit 75 will be described with reference to FIGS. 20 (A), (B), and (C). 20A, 20 </ b> B, and 20 </ b> C are schematic diagrams illustrating a configuration example of the pixel unit 75.

The pixel 76 includes a display element 76R, a display element 76G, and a display element 76B. The display element 76 </ b> R has a light source and emits red light RL <b> 2 having luminance corresponding to the gradation value corresponding to red included in the second gradation value input to the pixel 76 to the display surface side. Similarly, the display element 76G and the display element 76B each emit green light GL2 or blue light BL2 to the display surface side.

The pixel 77 includes a display element 77R, a display element 77G, and a display element 77B. The display element 77R reflects external light and emits red light RL1 having a luminance corresponding to the gradation value corresponding to red included in the first gradation value input to the pixel 77 to the display surface side. . Similarly, the display element 77G and the display element 77B each emit green light GL1 or blue light BL1 to the display surface side.

[First mode]
FIG. 20A illustrates an example of an operation mode in which an image is displayed by driving the display element 77R, the display element 77G, and the display element 77B that reflect external light. As shown in FIG. 20A, the pixel unit 75 does not drive the pixel 76, for example, when the illuminance of outside light is sufficiently high, and does not drive the pixel 76 (light RL1, light GL1, and light). By mixing only BL1), the light 79 of a predetermined color can be emitted to the display surface side. Thereby, driving with extremely low power consumption can be performed.

[Second mode]
FIG. 20B illustrates an example of an operation mode in which the display element 76R, the display element 76G, and the display element 76B are driven to display an image. As shown in FIG. 20B, the pixel unit 75 does not drive the pixel 77, for example, when the illuminance of outside light is extremely small, and the light from the pixel 76 (light RL2, light GL2, and light BL2). ) Only, it is possible to emit light 79 of a predetermined color to the display surface side. Thereby, a vivid display can be performed. Further, by reducing the luminance when the illuminance of outside light is small, it is possible to suppress glare that the user feels and to reduce power consumption.

[Third mode]
FIG. 20C illustrates an operation in which an image is displayed by driving both the display element 77R, the display element 77G, and the display element 77B that reflect external light, and the display element 76R, the display element 76G, and the display element 76B that emit light. An example of the mode is shown. As shown in FIG. 20C, the pixel unit 75 mixes six lights of the light RL1, the light GL1, the light BL1, the light RL2, the light GL2, and the light BL2, thereby causing the light 79 of a predetermined color to be mixed. It can be emitted to the display surface side.

Therefore, the display area 70 shown in FIG. 19 has a light-emitting display element and a reflective display element in the pixel unit, and is therefore suitable for displaying a selected area. For example, when the display area 70 is displayed with a reflective display element, the selected area can be displayed with a light-emitting display element. In addition, when the display area 70 is displayed with a light emitting display element, the selection area may be displayed with a reflective display element. Alternatively, the selection area may be displayed by changing the gradation data of the reflective display element, or the selection area may be displayed by changing the gradation data of the light-emitting display element.

The above is the description of the configuration example of the pixel unit 75.

Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.

(Embodiment 5)
Hereinafter, a specific example of the configuration of the hybrid display described in the fourth embodiment will be described. The display panel exemplified below is a display panel that includes both a reflective liquid crystal element and a light-emitting element and can perform both transmission mode and reflection mode displays.

[Configuration example]
FIG. 21A is a block diagram illustrating an example of a structure of the display device 400. The display device 400 includes a plurality of pixels 410 arranged in a matrix on the display portion 362. The display device 400 includes a circuit GD and a circuit SD. In addition, a plurality of pixels 410 arranged in the direction R, a plurality of wirings GD1 electrically connected to the circuit GD, a plurality of wirings GD2, a plurality of wirings ANO, and a plurality of wirings CSCOM are provided. In addition, a plurality of pixels 410 arranged in the direction C, a plurality of wirings S1 electrically connected to the circuit SD, and a plurality of wirings S2 are provided.

Note that, here, for the sake of simplicity, a configuration including one circuit GD and one circuit SD is shown; however, the circuit GD and the circuit SD that drive the liquid crystal element and the circuit GD and the circuit SD that drive the light emitting element are separately provided. May be provided.

The pixel 410 includes a reflective liquid crystal element and a light emitting element. In the pixel 410, the liquid crystal element and the light-emitting element have portions that overlap each other.

FIG. 21B1 illustrates a configuration example of the conductive layer 311b included in the pixel 410. The conductive layer 311b functions as a reflective electrode of the liquid crystal element in the pixel 410. In addition, an opening 451 is provided in the conductive layer 311b.

In FIG. 21B1, a light-emitting element 360 located in a region overlapping with the conductive layer 311b is indicated by a broken line. The light-emitting element 360 is disposed so as to overlap with the opening 451 included in the conductive layer 311b. Thereby, the light emitted from the light emitting element 360 is emitted to the display surface side through the opening 451.

In FIG. 21 (B1), the pixel 410 adjacent in the direction R is a pixel corresponding to a different color. At this time, as illustrated in FIG. 21B1, in two pixels adjacent in the direction R, the openings 451 are preferably provided at different positions in the conductive layer 311b so as not to be arranged in a line. Accordingly, the two light-emitting elements 360 can be separated from each other, and a phenomenon (also referred to as crosstalk) in which light emitted from the light-emitting elements 360 enters the colored layer of the adjacent pixel 410 can be suppressed. In addition, since the two adjacent light emitting elements 360 can be arranged apart from each other, a display device with high definition can be realized even when the EL layer of the light emitting element 360 is separately formed using a shadow mask or the like.

Alternatively, an arrangement as shown in FIG. 21 (B2) may be used.

If the ratio of the total area of the opening 451 to the total area of the non-opening is too large, the display using the liquid crystal element becomes dark. If the ratio of the total area of the openings 451 to the total area of the non-openings is too small, the display using the light emitting element 360 is darkened.

If the area of the opening 451 provided in the conductive layer 311b functioning as the reflective electrode is too small, the efficiency of light that can be extracted from the light emitted from the light emitting element 360 is reduced.

The shape of the opening 451 can be, for example, a polygon, a rectangle, an ellipse, a circle, a cross, or the like. Moreover, it is good also as an elongated streak shape, a slit shape, and a checkered shape. Further, the opening 451 may be arranged close to adjacent pixels. Preferably, the opening 451 is arranged close to other pixels displaying the same color. Thereby, crosstalk can be suppressed.

[Circuit configuration example]
FIG. 22 is a circuit diagram illustrating a configuration example of the pixel 410. In FIG. 22, two adjacent pixels 410 are shown.

The pixel 410 includes a switch SW1, a capacitor element C1, a liquid crystal element 340, a switch SW2, a transistor M, a capacitor element C2, a light emitting element 360, and the like. In addition, a wiring GD1, a wiring GD3, a wiring ANO, a wiring CSCOM, a wiring S1, and a wiring S2 are electrically connected to the pixel 410. In FIG. 22, a wiring VCOM1 electrically connected to the liquid crystal element 340 and a wiring VCOM2 electrically connected to the light emitting element 360 are illustrated.

FIG. 22 shows an example in which transistors are used for the switch SW1 and the switch SW2.

The switch SW1 has a gate connected to the wiring GD3, one of the source and the drain connected to the wiring S1, and the other of the source and the drain connected to one electrode of the capacitor C1 and one electrode of the liquid crystal element 340. Yes. The other electrode of the capacitor C1 is connected to the wiring CSCOM. The other electrode of the liquid crystal element 340 is connected to the wiring VCOM1.

The switch SW2 has a gate connected to the wiring GD1, one of a source and a drain connected to the wiring S2, and the other of the source and the drain connected to one electrode of the capacitor C2 and the gate of the transistor M. . The other electrode of the capacitor C2 is connected to the wiring CSCOM. In the transistor M, one of a source and a drain is connected to one electrode of the light emitting element 360. The other electrode of the light emitting element 360 is connected to the wiring VCOM2.

FIG. 22 shows an example in which the transistor M has two gates sandwiching a semiconductor and these are connected. As a result, the current that can be passed by the transistor M can be increased.

The signal which controls switch SW1 to a conduction | electrical_connection state or a non-conduction state can be given to wiring GD3. A predetermined potential can be applied to the wiring VCOM1. A signal for controlling the alignment state of the liquid crystal included in the liquid crystal element 340 can be supplied to the wiring S1. A predetermined potential can be applied to the wiring CSCOM.

The signal which controls switch SW2 to a conduction | electrical_connection state or a non-conduction state can be given to wiring GD1. The wiring VCOM2 and the wiring ANO can each be supplied with a potential at which a potential difference generated by the light emitting element 360 emits light. A signal for controlling the conduction state of the transistor M can be supplied to the wiring S2.

For example, when performing display in the reflection mode, the pixel 410 illustrated in FIG. 22 can be driven by a signal applied to the wiring GD3 and the wiring S1, and can display using optical modulation by the liquid crystal element 340. Further, in the case where display is performed in the transmissive mode, display can be performed by driving the light-emitting element 360 to emit light by driving signals supplied to the wiring GD1 and the wiring S2. In the case of driving in both modes, the driving can be performed by signals given to the wiring GD1, the wiring GD3, the wiring S1, and the wiring S2.

Note that although FIG. 22 illustrates an example in which one pixel 410 includes one liquid crystal element 340 and one light emitting element 360, the present invention is not limited thereto. FIG. 23A illustrates an example in which one pixel 410 includes one liquid crystal element 340 and four light-emitting elements 360 (light-emitting elements 360r, 360g, 360b, and 360w).

23A, in addition to the example of FIG. 22, a wiring GD4 and a wiring S3 are connected to the pixel 410.

In the example shown in FIG. 23A, for example, as the four light emitting elements 360, light emitting elements exhibiting red (R), green (G), blue (B), and white (W) can be used. As the liquid crystal element 340, a reflective liquid crystal element exhibiting white can be used. Thereby, when displaying in reflection mode, white display with high reflectance can be performed. In addition, when display is performed in the transmissive mode, display with high color rendering properties can be performed with low power.

FIG. 23B shows a configuration example of the pixel 410. The pixel 410 includes a light-emitting element 360 w that overlaps with an opening included in the electrode 311, and a light-emitting element 360 r, a light-emitting element 360 g, and a light-emitting element 360 b that are disposed around the electrode 311. The light emitting element 360r, the light emitting element 360g, and the light emitting element 360b preferably have substantially the same light emitting area.

[Display panel configuration example]
FIG. 24 is a schematic perspective view of a display panel 300 of one embodiment of the present invention. The display panel 300 has a structure in which a substrate 351 and a substrate 361 are attached to each other. In FIG. 24, the substrate 361 is indicated by a broken line.

The display panel 300 includes a display unit 362, a circuit 364, a wiring 365, and the like. The substrate 351 is provided with, for example, a circuit 364, a wiring 365, a conductive layer 311b functioning as a pixel electrode, and the like. FIG. 24 shows an example in which an IC 373 and an FPC 372 are mounted on a substrate 351. Therefore, the structure illustrated in FIG. 24 can also be referred to as a display module including the display panel 300, the FPC 372, and the IC 373.

As the circuit 364, for example, a circuit that functions as a scanning line driver circuit can be used.

The wiring 365 has a function of supplying signals and power to the display portion 362 and the circuit 364. The signal and power are input to the wiring 365 from the outside or the IC 373 via the FPC 372.

FIG. 24 shows an example in which the IC 373 is provided on the substrate 351 by a COG (Chip On Glass) method or the like. As the IC 373, for example, an IC having a function as a scan line driver circuit, a signal line driver circuit, or the like can be used. Note that when the display panel 300 includes a circuit that functions as a scan line driver circuit and a signal line driver circuit, or a circuit that functions as a scan line driver circuit or a signal line driver circuit is provided outside, the display panel 300 is driven via the FPC 372. For example, the IC 373 may not be provided in the case of inputting a signal to do so. The IC 373 may be mounted on the FPC 372 by a COF (Chip On Film) method or the like.

FIG. 24 shows an enlarged view of a part of the display unit 362. In the display portion 362, conductive layers 311b included in the plurality of display elements are arranged in a matrix. The conductive layer 311b has a function of reflecting visible light, and functions as a reflective electrode of a liquid crystal element 340 described later.

As shown in FIG. 24, the conductive layer 311b has an opening. Further, the light-emitting element 360 is provided on the substrate 351 side of the conductive layer 311b. Light from the light-emitting element 360 is emitted to the substrate 361 side through the opening of the conductive layer 311b.

Further, an input device 366 can be provided on the substrate 361. For example, a structure may be employed in which a sheet-like capacitive touch sensor is provided over the display portion 362. Alternatively, a touch sensor may be provided between the substrate 361 and the substrate 351. In the case where a touch sensor is provided between the substrate 361 and the substrate 351, an optical touch sensor using a photoelectric conversion element may be used in addition to the capacitive touch sensor.

[Cross-section configuration example 1]
FIG. 25 illustrates an example of a cross section of the display panel illustrated in FIG. 24 when a part of the region including the FPC 372, a part of the region including the circuit 364, and a part of the region including the display portion 362 are cut. .

The display panel has an insulating layer 220 between the substrate 351 and the substrate 361. In addition, the light-emitting element 360, the transistor 201, the transistor 205, the transistor 206, the coloring layer 262, and the like are provided between the substrate 351 and the insulating layer 220. A liquid crystal element 340, a colored layer 263, and the like are provided between the insulating layer 220 and the substrate 361. In addition, the substrate 361 and the insulating layer 220 are bonded through an adhesive layer 143, and the substrate 351 and the insulating layer 220 are bonded through an adhesive layer 142.

The transistor 206 is electrically connected to the liquid crystal element 340, and the transistor 205 is electrically connected to the light emitting element 360. Since both the transistor 205 and the transistor 206 are formed over the surface of the insulating layer 220 on the substrate 351 side, they can be manufactured using the same process.

The substrate 361 is provided with a coloring layer 263, a light shielding layer 264, an insulating layer 261, a conductive layer 313 functioning as a common electrode of the liquid crystal element 340, an alignment film 133b, an insulating layer 260, and the like. The insulating layer 260 functions as a spacer for maintaining the cell gap of the liquid crystal element 340.

On the substrate 351 side of the insulating layer 220, insulating layers such as an insulating layer 211, an insulating layer 212, an insulating layer 213, an insulating layer 214, and an insulating layer 215 are provided. A part of the insulating layer 211 functions as a gate insulating layer of each transistor. The insulating layer 212, the insulating layer 213, and the insulating layer 214 are provided so as to cover each transistor. An insulating layer 215 is provided to cover the insulating layer 214. The insulating layer 214 and the insulating layer 215 function as a planarization layer. Note that although the case where the insulating layer covering the transistor and the like has three layers of the insulating layer 212, the insulating layer 213, and the insulating layer 214 is described here, the number of layers is not limited to this, and four or more layers may be used. There may be a layer or two layers. The insulating layer 214 functioning as a planarization layer is not necessarily provided if not necessary.

The transistor 201, the transistor 205, and the transistor 206 each include a conductive layer 221 that partially functions as a gate, a conductive layer 222 that partially functions as a source or a drain, and a semiconductor layer 231. Here, the same hatching pattern is given to a plurality of layers obtained by processing the same conductive film.

The liquid crystal element 340 is a reflective liquid crystal element. The liquid crystal element 340 has a stacked structure in which a conductive layer 311a, a liquid crystal 312 and a conductive layer 313 are stacked. In addition, a conductive layer 311b that reflects visible light is provided in contact with the conductive layer 311a on the substrate 351 side. The conductive layer 311b has an opening 251. The conductive layer 311a and the conductive layer 313 include a material that transmits visible light. An alignment film 133a is provided between the liquid crystal 312 and the conductive layer 311a, and an alignment film 133b is provided between the liquid crystal 312 and the conductive layer 313.

A light diffusion plate 129 and a polarizing plate 140 are disposed on the outer surface of the substrate 361. As the polarizing plate 140, a linear polarizing plate may be used, but a circular polarizing plate can also be used. As a circularly-polarizing plate, what laminated | stacked the linearly-polarizing plate and the quarter wavelength phase difference plate, for example can be used. Thereby, external light reflection can be suppressed. In addition, a light diffusing plate 129 is provided to suppress external light reflection. In addition, a desired contrast may be realized by adjusting a cell gap, an alignment, a driving voltage, and the like of the liquid crystal element used for the liquid crystal element 340 depending on the type of the polarizing plate.

In the liquid crystal element 340, the conductive layer 311b has a function of reflecting visible light, and the conductive layer 313 has a function of transmitting visible light. Light incident from the substrate 361 side is polarized by the polarizing plate 140, passes through the conductive layer 313 and the liquid crystal 312, and is reflected by the conductive layer 311b. Then, the light passes through the liquid crystal 312 and the conductive layer 313 again and reaches the polarizing plate 140. At this time, alignment of liquid crystal can be controlled by a voltage applied between the conductive layer 311b and the conductive layer 313, and optical modulation of light can be controlled. That is, the intensity of light emitted through the polarizing plate 140 can be controlled. In addition, light that is not in a specific wavelength region is absorbed by the colored layer 263, and thus the extracted light is, for example, light that exhibits a red color.

The light emitting element 360 is a bottom emission type light emitting element. The light-emitting element 360 has a stacked structure in which the conductive layer 191, the EL layer 192, and the conductive layer 193b are stacked in this order from the insulating layer 220 side. A conductive layer 193a is provided to cover the conductive layer 193b. The conductive layer 193b includes a material that reflects visible light, and the conductive layer 191 and the conductive layer 193a include a material that transmits visible light. Light emitted from the light-emitting element 360 is emitted to the substrate 361 side through the coloring layer 262, the insulating layer 220, the opening 251, the conductive layer 313, and the like.

Here, as shown in FIG. 25, the opening 251 is preferably provided with a conductive layer 311a that transmits visible light. Accordingly, since the liquid crystal 312 is aligned in the region overlapping with the opening 251 similarly to the other regions, it is possible to suppress the alignment failure of the liquid crystal at the boundary between these regions and the leakage of unintended light.

An insulating layer 217 is provided over the insulating layer 216 that covers the end portion of the conductive layer 191. The insulating layer 217 has a function as a spacer for suppressing the insulating layer 220 and the substrate 351 from approaching more than necessary. In the case where the EL layer 192 and the conductive layer 193a are formed using a shielding mask (metal mask), the EL layer 192 and the conductive layer 193a may have a function of suppressing contact of the shielding mask with a formation surface. Note that the insulating layer 217 is not necessarily provided if not necessary.

One of the source and the drain of the transistor 205 is electrically connected to the conductive layer 191 of the light-emitting element 360 through the conductive layer 224.

One of the source and the drain of the transistor 206 is electrically connected to the conductive layer 311b through the connection portion 207. The conductive layer 311b and the conductive layer 311a are provided in contact with each other and are electrically connected. Here, the connection portion 207 is a portion that connects the conductive layers provided on both surfaces of the insulating layer 220 through openings provided in the insulating layer 220.

A connection portion 204 is provided in a region where the substrate 351 and the substrate 361 do not overlap. The connection portion 204 is electrically connected to the FPC 372 through the connection layer 242. The connection unit 204 has the same configuration as the connection unit 207. A conductive layer obtained by processing the same conductive film as the conductive layer 311a is exposed on the upper surface of the connection portion 204. Accordingly, the connection unit 204 and the FPC 372 can be electrically connected via the connection layer 242.

The connection part 252 is provided in the one part area | region in which the contact bonding layer 143 is provided. In the connection portion 252, a conductive layer obtained by processing the same conductive film as the conductive layer 311 a and a part of the conductive layer 313 are electrically connected by a connection body 243. Therefore, a signal or a potential input from the FPC 372 connected to the substrate 351 side can be supplied to the conductive layer 313 formed on the substrate 361 side through the connection portion 252.

As the connection body 243, for example, conductive particles can be used. As the conductive particles, those obtained by coating the surface of particles such as an organic resin or silica with a metal material can be used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. In addition, it is preferable to use particles in which two or more kinds of metal materials are coated in layers, such as further coating nickel with gold. Further, as the connection body 243, a material that is elastically deformed or plastically deformed is preferably used. At this time, the connection body 243, which is a conductive particle, may have a shape crushed in the vertical direction as shown in FIG. By doing so, the contact area between the connection body 243 and the conductive layer electrically connected to the connection body 243 can be increased, the contact resistance can be reduced, and the occurrence of problems such as connection failure can be suppressed.

The connecting body 243 is preferably disposed so as to be covered with the adhesive layer 143. For example, the connection body 243 may be dispersed in the adhesive layer 143 before curing.

FIG. 25 illustrates an example in which a transistor 201 is provided as an example of the circuit 364.

25, as an example of the transistor 201 and the transistor 205, a configuration in which a semiconductor layer 231 in which a channel is formed is sandwiched between two gates is applied. One gate is formed of a conductive layer 221, and the other gate is formed of a conductive layer 223 that overlaps with the semiconductor layer 231 with an insulating layer 212 interposed therebetween. With such a structure, the threshold voltage of the transistor can be controlled. At this time, the transistor may be driven by connecting two gates and supplying the same signal thereto. Such a transistor can have higher field-effect mobility than other transistors, and can increase on-state current. As a result, a circuit that can be driven at high speed can be manufactured. Furthermore, the area occupied by the circuit portion can be reduced. By applying a transistor with a large on-state current, signal delay in each wiring can be reduced and display unevenness can be suppressed even if the number of wirings is increased when the display panel is increased in size or definition. can do.

Note that the transistor included in the circuit 364 and the transistor included in the display portion 362 may have the same structure. In addition, the plurality of transistors included in the circuit 364 may have the same structure or may be combined with different structures. In addition, the plurality of transistors included in the display portion 362 may have the same structure or may be combined with transistors having different structures.

At least one of the insulating layer 212 and the insulating layer 213 that covers each transistor is preferably made of a material in which impurities such as water and hydrogen hardly diffuse. That is, the insulating layer 212 or the insulating layer 213 can function as a barrier film. With such a structure, it is possible to effectively prevent impurities from diffusing from the outside to the transistor, and a highly reliable display panel can be realized.

On the substrate 361 side, an insulating layer 261 is provided so as to cover the colored layer 263 and the light shielding layer 264. The insulating layer 261 may function as a planarization layer. Since the surface of the conductive layer 313 can be substantially flattened by the insulating layer 261, the alignment state of the liquid crystal 312 can be made uniform.

[Cross-section configuration example 2]
The display panel shown in FIG. 26 is an example in which a top-gate transistor is applied to each transistor in the structure shown in FIG. In this manner, by applying a top-gate transistor, parasitic capacitance can be reduced, so that a display frame frequency can be increased.

The transistor included in the display device of one embodiment of the present invention functions as a conductive layer functioning as a gate electrode, a semiconductor layer, a conductive layer functioning as a source electrode, a conductive layer functioning as a drain electrode, and a gate insulating layer. And an insulating layer. Note that there is no particular limitation on the structure of the transistor.

As the semiconductor material used for the transistor, a metal oxide having an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more can be used. Typically, an oxide semiconductor containing indium can be used.

A transistor using an oxide semiconductor with a wider band gap and lower carrier density than silicon can hold charge accumulated in a capacitor connected in series with the transistor for a long time due to its low off-state current. Is possible.

The semiconductor layer includes, for example, an In-M-Zn-based oxide including In, M, and M (metal such as aluminum, titanium, gallium, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium, or hafnium), In-M. A film represented by a series oxide, an M-Zn series oxide, or an In-Zn oxide can be used.

In the case where the oxide semiconductor included in the semiconductor layer is an In-M-Zn-based oxide, the atomic ratio of the metal elements of the sputtering target used for forming the In-M-Zn oxide is In ≧ M, Zn It is preferable to satisfy ≧ M. As the atomic ratio of the metal elements of such a sputtering target, In: M: Zn = 1: 1: 1, In: M: Zn = 1: 1: 1.2, In: M: Zn = 3: 1: 2, In: M: Zn = 4: 2: 3, In: M: Zn = 4: 2: 4.1, In: M: Zn = 5: 1: 6, In: M: Zn = 5: 1: 7, In: M: Zn = 5: 1: 8 etc. are preferable. Note that the atomic ratio of the semiconductor layer to be formed includes a variation of plus or minus 40% of the atomic ratio of the metal element contained in the sputtering target.

In addition, a metal oxide formed using the above materials or the like can act as a light-transmitting conductor by controlling impurities, oxygen vacancies, and the like. Therefore, in addition to the semiconductor layer described above, a source electrode, a drain electrode, a gate electrode, and the like, which are other components of the transistor, are formed using a light-transmitting conductor, thereby forming a light-transmitting transistor. Can do. By using the light-transmitting transistor for a pixel of the display device, light transmitted through the display element or light emitted from the display element can pass through the transistor, so that the aperture ratio can be improved.

For example, like the modified example of the cross-sectional configuration example 1 shown in FIG. 27, the elements forming the transistors 205 and 206 and the connection portion 207 can be formed of a light-transmitting conductor. By omitting the conductive layer 311b from the cross-sectional configuration example 1, light emitted from the light-emitting element 360 can pass through some or all of the transistors 205 and 206 and the connection portion 207. In addition, light incident from the substrate 361 side and transmitted through the liquid crystal 312 can be reflected by the conductive layer 193b. Note that in order to improve the reliability of the transistors 205 and 206, one or both of the conductive layer functioning as a gate electrode and the conductive layer functioning as a back gate electrode are formed using a layer having no light-transmitting property, such as a metal. May be.

Silicon may be used for the semiconductor in which the channel of the transistor is formed. Although amorphous silicon may be used as silicon, it is particularly preferable to use silicon having crystallinity. For example, microcrystalline silicon, polycrystalline silicon, single crystal silicon, or the like is preferably used. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon.

Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.

(Embodiment 6)
In this specification and the like, a metal oxide is a metal oxide in a broad expression. Metal oxides are classified into oxide insulators, oxide conductors (including transparent oxide conductors), oxide semiconductors (also referred to as oxide semiconductors or simply OS), and the like. For example, in the case where a metal oxide is used for a semiconductor layer of a transistor, the metal oxide may be referred to as an oxide semiconductor. In short, when a metal oxide has at least one of an amplifying function, a rectifying function, and a switching function, the metal oxide can be referred to as a metal oxide semiconductor, or OS for short. In the case of describing as an OS FET, it can be said to be a transistor including a metal oxide or an oxide semiconductor.

In addition, in this specification and the like, metal oxides having nitrogen may be collectively referred to as metal oxides. In addition, a metal oxide containing nitrogen may be referred to as a metal oxynitride.

Also, in this specification and the like, there are cases where they are described as CAAC (c-axis aligned crystal) and CAC (Cloud-aligned Composite). Note that CAAC represents an example of a crystal structure, and CAC represents an example of a function or a material structure.

In this specification and the like, a CAC-OS or a CAC-metal oxide has a conductive function in part of a material and an insulating function in part of the material, and the whole material is a semiconductor. It has the function of. Note that in the case where a CAC-OS or a CAC-metal oxide is used for a semiconductor layer of a transistor, the conductive function is a function of flowing electrons (or holes) serving as carriers, and the insulating function is an electron serving as carriers. It is a function that does not flow. A function of switching (a function of turning on / off) can be imparted to the CAC-OS or the CAC-metal oxide by causing the conductive function and the insulating function to act complementarily. By separating each function in CAC-OS or CAC-metal oxide, both functions can be maximized.

Also, CAC-OS or CAC-metal oxide is composed of components having different band gaps. For example, CAC-OS or CAC-metal oxide includes a component having a wide gap caused by an insulating region and a component having a narrow gap caused by a conductive region. In the case of the configuration, when the carrier flows, the carrier mainly flows in the component having the narrow gap. In addition, the component having a narrow gap acts in a complementary manner to the component having a wide gap, and the carrier flows through the component having the wide gap in conjunction with the component having the narrow gap. Therefore, when the CAC-OS or the CAC-metal oxide is used for a channel region of a transistor, high current driving force, large on-state current, and high field effect mobility can be obtained in the on state of the transistor.

That is, CAC-OS or CAC-metal oxide can also be called a matrix composite (metal matrix composite) or a metal matrix composite (metal matrix composite).

<Configuration of CAC-OS>
A structure of a CAC-OS that can be used for the transistor disclosed in one embodiment of the present invention is described below.

The CAC-OS is one structure of a material in which elements forming an oxide semiconductor are unevenly distributed with a size of 0.5 nm to 10 nm, preferably 1 nm to 2 nm, or the vicinity thereof. Note that in the following, in an oxide semiconductor, one or more metal elements are unevenly distributed, and a region including the metal element has a size of 0.5 nm to 10 nm, preferably 1 nm to 2 nm, or the vicinity thereof. The state mixed with is also referred to as mosaic or patch.

Note that the oxide semiconductor preferably contains at least indium. In particular, it is preferable to contain indium and zinc. In addition, aluminum, gallium, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, etc. One kind selected from the above or a plurality of kinds may be included.

For example, a CAC-OS in In-Ga-Zn oxide (In-Ga-Zn oxide among CAC-OSs may be referred to as CAC-IGZO in particular) is an indium oxide (hereinafter referred to as InO). _X1 (X1 is greater real than 0) and.), or indium zinc oxide _{(hereinafter, in X2 Zn Y2 O Z2 (} X2, Y2, and Z2 is larger real than 0) and a.), gallium An oxide (hereinafter referred to as GaO _X3 (X3 is a real number greater than 0)) or a gallium zinc oxide (hereinafter referred to as Ga _X4 Zn _Y4 O _Z4 (where X4, Y4, and Z4 are greater than 0)) to.) and the like, the material becomes mosaic by separate into, mosaic _{InO X1,} or _in X2 _Zn Y2 _{O Z2} is configured uniformly distributed in the film (hereinafter, cloud Also referred to.) A.

In short, CAC-OS includes a region _{GaO X3} is the main _component, In _{X2 Zn} Y2 _{O Z2,} or _{InO X1} there is a region which is a main component, a composite oxide semiconductor having a structure that is mixed. Note that in this specification, for example, the first region indicates that the atomic ratio of In to the element M in the first region is larger than the atomic ratio of In to the element M in the second region. It is assumed that the concentration of In is higher than that in the second region.

Note that IGZO is a common name and sometimes refers to one compound of In, Ga, Zn, and O. As a typical example, InGaO ₃ (ZnO) _m1 (m1 is a natural number) or In _{(1 + x0)} Ga _(1-x0) O ₃ (ZnO) _m0 (−1 ≦ x0 ≦ 1, m0 is an arbitrary number) A crystalline compound may be mentioned.

The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. The CAAC structure is a crystal structure in which a plurality of IGZO nanocrystals have c-axis orientation and are connected without being oriented in the ab plane.

Meanwhile, CAC-OS relates to a material structure of an oxide semiconductor. CAC-OS refers to a region that is observed in the form of nanoparticles mainly composed of Ga in a material structure including In, Ga, Zn, and O, and nanoparticles that are partially composed mainly of In. The region observed in a shape is a configuration in which the regions are randomly dispersed in a mosaic shape. Therefore, in the CAC-OS, the crystal structure is a secondary element.

Note that the CAC-OS does not include a stacked structure of two or more kinds of films having different compositions. For example, a structure composed of two layers of a film mainly containing In and a film mainly containing Ga is not included.

Incidentally, a region _{GaO X3} is the main _component, In _{X2 Zn} Y2 _{O Z2,} or the region _{InO X1} is the main component, it may clear boundary can not be observed.

Instead of gallium, selected from aluminum, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, etc. In the case where one or more types are included, the CAC-OS includes a region observed in a part of a nanoparticle mainly including the metal element and a nano part mainly including In. The region observed in the form of particles refers to a configuration in which each region is randomly dispersed in a mosaic shape.

The CAC-OS can be formed by sputtering, for example, under the condition that the substrate is not heated. In the case where a CAC-OS is formed by a sputtering method, any one or more selected from an inert gas (typically argon), an oxygen gas, and a nitrogen gas may be used as a deposition gas. Good. Further, the flow rate ratio of the oxygen gas to the total flow rate of the deposition gas during film formation is preferably as low as possible. .

CAC-OS is characterized in that no clear peak is observed when measured using an θ / 2θ scan by the out-of-plane method, which is one of the X-ray diffraction (XRD) measurement methods. Have That is, it can be seen from X-ray diffraction that no orientation in the ab plane direction and c-axis direction of the measurement region is observed.

In addition, in the CAC-OS, an electron diffraction pattern obtained by irradiating an electron beam with a probe diameter of 1 nm (also referred to as a nanobeam electron beam) has a ring-like region having a high luminance and a plurality of bright regions in the ring region. A point is observed. Therefore, it can be seen from the electron beam diffraction pattern that the crystal structure of the CAC-OS has an nc (nano-crystal) structure having no orientation in the planar direction and the cross-sectional direction.

Further, for example, in a CAC-OS in an In—Ga—Zn oxide, a region in which GaO _X3 is a main component is obtained by EDX mapping obtained by using energy dispersive X-ray spectroscopy (EDX). It can be confirmed that a region in which In _X2 Zn _Y2 O _Z2 or InO _X1 is a main component is unevenly distributed and mixed.

CAC-OS has a structure different from that of an IGZO compound in which metal elements are uniformly distributed, and has a property different from that of an IGZO compound. In short, CAC-OS is a region in which GaO _X3 or the like is a main component and a region in which In _X2 Zn _Y2 O _Z2 or InO _X1 is a main component is phase-separated from each other, and each element is a main component. Has a mosaic structure.

Here, the region containing In _X2 Zn _Y2 O _Z2 or InO _X1 as a main component is a region having higher conductivity than a region containing GaO _X3 or the like as a main component. In _short, In _{X2 Zn} Y2 _{O Z2,} or _{InO X1} is a region which is a main component, by carriers flow, expressed the conductivity of the oxide semiconductor. Therefore, a region where In _X2 Zn _Y2 O _Z2 or InO _X1 is a main component is distributed in a cloud shape in the oxide semiconductor, whereby high field-effect mobility (μ) can be realized.

On the other hand, areas such as _{GaO X3} is the main _component, In _{X2 Zn} Y2 _{O Z2,} or _{InO X1} is compared to region which is a main component, has a high area insulation. In short, since a region containing GaO _X3 or the like as a main component is distributed in an oxide semiconductor, leakage current can be suppressed and good switching operation can be realized.

Accordingly, when CAC-OS is used for a semiconductor element, high insulation is achieved by the complementary action of the insulating properties caused by GaO _{X3 and the} like and the conductivity caused by In _X2 Zn _Y2 O _Z2 or InO _X1. An on-current (I _on ) and high field effect mobility (μ) can be realized.

In addition, a semiconductor element using a CAC-OS has high reliability. Therefore, the CAC-OS is optimal for various semiconductor devices including a display.

Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.

(Embodiment 7)
In this embodiment, electronic devices of one embodiment of the present invention are described with reference to drawings.

FIG. 28A shows a car 2001 having an engine that burns fuel or a motor that is controlled by electricity as an example. The car 2001 includes an electronic device that receives a first authentication code from the electronic device 110, generates a second authentication code, and displays FCODE. The electronic device 110 can acquire the FCODE and decrypt the second authentication code. The electronic device 110 is permitted to access the car 2001 and can access the management parameters of the car 2001. Therefore, the authentication system described in the first embodiment can be used.

The electronic device 110 can process an image of the car 2001 captured by the image sensor included in the electronic device 110 into an AR image and display the AR image on the display panel. A user or a mechanic of the car 2001 can monitor or manage the state of the car by using the electronic device 110.

FIG. 28B shows a large transport vehicle 2002 having an engine that burns fuel or a motor that is controlled by electricity as an example. A large transport vehicle 2002 illustrated in FIG. 28B has a function similar to that of the vehicle 2001 illustrated in FIG.

FIG. 28C shows a large transport vehicle 2003 having a motor controlled by electricity or an engine that burns fuel as an example. A large transport vehicle 2003 illustrated in FIG. 28C has a function similar to that of the vehicle 2001 illustrated in FIG.

FIG. 28D shows an aircraft 2004 having an engine that burns fuel as an example. The aircraft 2004 illustrated in FIG. 28D has a function similar to that of the car 2001 illustrated in FIG.

FIG. 29A shows a wind power generation facility 2005 as an example of the power generation facility. A wind power generation facility has a motor that converts rotation by wind power into electricity. The wind power generation facility 2005 is preferably provided with a display panel 2005a for displaying FCODE. Therefore, the authentication system described in the first embodiment can be used.

Alternatively, the display panel 2005a that displays FCODE when a plurality of wind power generation facilities are integrated and managed may manage a plurality of wind power generation facilities with one FCODE. The electronic device 110 can generate and display an AR image from the image of the wind power generation facility 2005 captured by the image sensor included in the electronic device 110. Simplify management of control equipment installed at high places, such as wind power generation facilities.

The power generation facility is not limited to a wind power generation facility. The authentication system and communication system using FCODE are not shown, but they are large in scale such as nuclear power generation facilities, thermal power generation facilities, hydroelectric power generation facilities, wave power generation facilities, geothermal power generation facilities, etc. It can be applied to facilities that require sex. Even when there is a large distance between the electronic device 110 and the target facility, an AR image can be generated from the captured image and displayed. Therefore, it is possible to provide an authentication system and a communication system that can easily manage the management parameters of the target facility.

FIG. 29B shows a chemical plant 2006 as an example of a production facility. In a chemical plant, management parameters such as temperature and pressure, or state management parameters are important management items. The control system of the chemical plant 2006 preferably includes a display panel 2006a that displays FCODE. Therefore, the authentication system described in the first embodiment can be used.

The electronic device 110 can process and display an image of the chemical plant 2006 captured by the imaging device included in the electronic device 110 into an AR image. Therefore, it is possible to provide a communication system having an authentication system that can manage the management parameters of the target facility by the captured image even if there is a distance between a plurality of target facilities.

Production facilities are not limited to chemical plants. The authentication system and communication system using FCODE are not shown, but are applied to electronic equipment production facilities, car production facilities, sewing facilities for processing cloths, plant production facilities, food production facilities, etc. Can do.

30 is provided with the display device of one embodiment of the present invention that can display FCODE on a display portion. Therefore, the electronic device has a high resolution. In addition, the electronic device can achieve both high resolution and a large screen.

For example, full high-definition video, 4K2K, 8K4K, 16K8K, or higher-resolution video can be displayed on the display portion of the electronic device of one embodiment of the present invention. Further, the screen size of the display unit may be 20 inches or more diagonal, 30 inches or more diagonal, 50 inches diagonal, 60 inches diagonal, or 70 inches diagonal.

Examples of electronic devices include relatively large screens such as television devices, desktop or notebook personal computers, monitors for computers, digital signage (digital signage), and large game machines such as pachinko machines. In addition to electronic devices, digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, portable information terminals, sound reproduction devices, vending machines, ticket vending machines, and the like can be given.

The electronic device or the lighting device of one embodiment of the present invention can be incorporated along a curved surface of an inner wall or an outer wall of a house or a building, or an interior or exterior of an automobile.

The electronic device of one embodiment of the present invention preferably includes an imaging element (photodiode, optical sensor, image sensor).

The electronic device of one embodiment of the present invention may have an antenna. By receiving a signal with an antenna, video, information, and the like can be displayed on the display unit. In the case where the electronic device has an antenna and a secondary battery, the antenna may be used for non-contact power transmission.

The electronic device of one embodiment of the present invention includes a sensor (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, It may have a function of measuring voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared).

The electronic device of one embodiment of the present invention can have various functions. For example, a function for displaying various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a function for displaying a calendar, date or time, a function for executing various software (programs), and wireless communication It can have a function, a function of reading a program or data recorded in a recording medium, and the like.

The electronic apparatus according to one embodiment of the present invention preferably has a function of detecting FCODE from image data captured by an image sensor using a neural network.

FIG. 30A illustrates an example of a television device. In the television device 7100, a display portion 7000 is incorporated in a housing 7101. Here, a structure in which the housing 7101 is supported by a stand 7103 is shown.

The display device of one embodiment of the present invention can be applied to the display portion 7000.

The operation of the television device 7100 illustrated in FIG. 30A can be performed using an operation switch included in the housing 7101 or a separate remote controller 7111. Alternatively, the display unit 7000 may be provided with a touch sensor, and may be operated by touching the display unit 7000 with a finger or the like. The remote controller 7111 may include a display unit that displays information output from the remote controller 7111. Channels and volume can be operated with an operation key or a touch panel included in the remote controller 7111, and an image displayed on the display portion 7000 can be operated.

Note that the television device 7100 is provided with a receiver, a modem, and the like. A general television broadcast can be received by the receiver. In addition, by connecting to a wired or wireless communication network via a modem, information communication is performed in one direction (from the sender to the receiver) or in two directions (between the sender and the receiver or between the receivers). It is also possible.

FIG. 30B shows a laptop personal computer 7200. A laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. A display portion 7000 is incorporated in the housing 7211.

The display device of one embodiment of the present invention can be applied to the display portion 7000.

FIGS. 30C and 30D show an example of digital signage (digital signage).

A digital signage 7300 illustrated in FIG. 30C includes a housing 7301, a display portion 7000, a speaker 7303, and the like. Furthermore, an LED lamp, operation keys (including a power switch or an operation switch), connection terminals, various sensors, a microphone, and the like can be provided.

FIG. 30D shows a digital signage 7400 attached to a columnar column 7401. The digital signage 7400 includes a display portion 7000 provided along the curved surface of the column 7401.

30C and 30D, the display device of one embodiment of the present invention can be applied to the display portion 7000.

The wider the display unit 7000, the more information can be provided at one time. In addition, the wider the display unit 7000, the more easily noticeable to the human eye. For example, the advertising effect can be enhanced. The display unit 7000 preferably includes a touch panel. The user can provide detailed information to the user by using a display area 7001 in a part of the display unit 7000 by touching a part of the display unit 7000.

It is preferable to apply a touch panel to the display unit 7000, not only to display an image or a moving image on the display unit 7000, but also to be intuitively operated by the user. In addition, when it is used for providing information such as route information or traffic information, usability can be improved by an intuitive operation.

In addition, as illustrated in FIGS. 30C and 30D, the digital signage 7300 or the digital signage 7400 can be linked with the information terminal 7311 or the information terminal 7411 such as a smartphone possessed by the user by wireless communication. Is preferred. For example, advertisement information displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411. Further, by operating the information terminal 7311 or the information terminal 7411, the display of the display unit 7000 can be switched.

Also, it is possible to cause the digital signage 7300 or the digital signage 7400 to execute a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller or touch panel). Thereby, an unspecified number of users can participate and enjoy the game at the same time.

FIG. 30E is a perspective view of the portable information terminal 7500. The portable information terminal has one or more functions selected from, for example, a telephone, a notebook, an information browsing device, or the like. Specifically, it can be used as a smartphone. The portable information terminal exemplified in this embodiment can execute various applications such as mobile phone, e-mail, text browsing and creation, music playback, Internet communication, and computer games.

The portable information terminal 7500 can display characters and image information on a plurality of surfaces. For example, as shown in FIG. 30E, three operation keys 7502 can be displayed on one surface and information 7503 indicated by a rectangle can be displayed on the other surface. The operation key 7502 may be displayed on the display unit 7000 and operated via a touch panel. FIG. 30E illustrates an example in which information is displayed on the side surface of the portable information terminal. Further, information may be displayed on three or more surfaces of the portable information terminal.

Examples of information include SNS (social networking service) notifications, displays that notify incoming calls such as e-mails or telephone calls, titles or sender names such as e-mails, date and time, time, battery level, antenna There is the strength of reception. Alternatively, an operation key, an icon, or the like may be displayed instead of the information at a position where the information is displayed.

FIG. 30F illustrates a tablet personal computer, which includes a housing 601, a housing 7602, a display portion 7000, an optical sensor 7604, an optical sensor 7605, a switch 7606, and the like according to one embodiment of the present invention. The display portion 7000 is supported by a housing 7601 and a housing 7602. Since the display portion 7000 is formed using a flexible substrate, the display portion 7000 has a function of flexibly bending the shape.

By changing the angle between the housing 7601 and the housing 7602 at the hinges 7607 and 7608, the display portion 7000 can be folded so that the housing 7601 and the housing 7602 overlap with each other. Although not shown, an open / close sensor may be built in, and the change in the angle may be used as information on use conditions in a tablet personal computer. By using the display unit 7000 according to one embodiment of the present invention for a tablet personal computer, an image with high display quality can be displayed on the display unit 7000 without being influenced by the intensity of external light in a use environment. Power consumption can also be suppressed.

Note that at least part of this embodiment can be implemented in combination with any of the other embodiments described in this specification as appropriate.

BL1 light BL2 light C1 capacitive element C2 capacitive element FCD1 display area FCD2 display area G1 wiring G2 wiring G3 wiring GD1 wiring GD2 wiring GD3 wiring GD4 wiring GL1 light GL2 light RL1 light RL2 light S1 wiring S2 wiring S3 wiring SW1 switch SW2 switch VCO VCOM2 wiring 11 substrate 12 substrate 20 liquid crystal element 21 conductive layer 22 liquid crystal 23 conductive layer 24a alignment film 24b alignment film 26 insulating layer 30 transistor 31 conductive layer 31a conductive layer 32 semiconductor layer 32p semiconductor layer 33a conductive layer 33b conductive layer 33c conductive layer 33d Conductive layer 34 Insulating layer 35 Impurity semiconductor layer 37 Semiconductor layer 38 Connection portion 39a Polarizing plate 39b Polarizing plate 41 Colored layer 42 Light shielding layer 60 Capacitance element 70 Display region 75 Pixel unit 76 Pixel 7 B Display element 76G Display element 76R Display element 77 Pixel 77B Display element 77G Display element 77R Display element 79 Light 81 Insulating layer 82 Insulating layer 83 Insulating layer 84 Insulating layer 90 Backlight unit 110 Electronic device 111 Communication module 112 Imaging element 113 Display module 113a Display device 113b Display controller 113c Frame memory 113d Display panel 113e Touch panel 114a Display region 114b Display region 114c Display region 114d Display region 114e Display region 114f Display region 115 Processor 116 Storage device 117 Input device 120 Electronic device 120a Copy machine 121 Communication module 122 Display module 122a Display device 122b Display controller 122c Frame memory 22d display panel 123 input device 123a switch 123b switch 123c switch 123d switch 125 processor 126 storage device 129 light diffusion plate 130 electronic device 131 scanner device 132 display module 133 communication module 133a alignment film 133b alignment film 134 input device 135 processor 136 storage device 137 Data server 140 Polarizing plate 142 Adhesive layer 143 Adhesive layer 150 Display area 150a Display area 160a Substrate 160b Substrate 160c Substrate 161a Electronic component 161b Electronic component 162 Light emitting element 163 Imaging element 191 Conductive layer 192 EL layer 193a Conductive layer 193b Conductive layer 201 Transistor 204 Connection portion 205 Transistor 206 Transistor 207 Connection portion 211 Insulating layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 215 Insulating layer 216 Insulating layer 217 Insulating layer 220 Insulating layer 221 Conductive layer 222 Conductive layer 223 Conductive layer 224 Conductive layer 231 Semiconductor layer 242 Connecting layer 243 Connection body 251 Opening 252 Connecting portion 260 Insulating layer 261 Insulating layer 262 Colored layer 263 Colored layer 264 Light shielding layer 300 Display panel 311 Electrode 311a Conductive layer 311b Conductive layer 312 Liquid crystal 313 Conductive layer 340 Liquid crystal element 351 Substrate 360 Light emitting element 360b Light emitting element 360g Light emitting element 360r Light emitting element 360w Light emitting element 361 Substrate 362 Display unit 365 Wiring 366 Input device 372 FPC
373 IC
400 Display device 410 Pixel 451 Opening 812 Moving mechanism 813 Moving mechanism 815 Stage 816 Ball screw mechanism 820 Laser oscillator 821 Optical system unit 822 Mirror 823 Microlens array 824 Mask 825 Laser beam 826 Laser beam 827 Laser beam 830 Substrate 840 Amorphous Sirine layer 841 Polycrystalline silicon layer 1100 Display device 2001 Car 2002 Transport vehicle 2003 Transport vehicle 2004 Aircraft 2005 Wind power generation facility 2005a Display panel 2006 Chemical plant 2006a Display panel 7000 Display unit 7001 Display area 7100 Television device 7101 Housing 7103 Stand 7111 Remote control device 7200 Notebook personal computer 7211 Case 7212 Keyboard 7213 Input device 7214 external connection port 7300 digital signage 7301 casing 7303 speaker 7311 information terminal 7400 digital signage 7401 pillar 7411 information terminal 7500 portable information terminal 7502 operation key 7503 information 7601 casing 7602 casing 7604 optical sensor 7605 optical sensor 7606 Switch 7607 Hinge

Claims (12)

1. A display code generation method for generating a display code from digital data,
   The digital data is encoded into gradation values,
   In each of the plurality of display frames, the digital data encoded in the gradation value is displayed as a two-dimensional cell and as a first display code,
   A display code generation method, wherein a second display code is generated by a plurality of the first display codes.
2. In claim 1,
   The display code generation method, wherein the plurality of first display codes that are continuous are displayed at the same coordinates of the plurality of display frames.
3. In claim 1,
   The display code generation method, wherein the second display code is displayed in a first display area having the same size as the plurality of continuous first display codes.
4. In claim 1,
   The second display code is a display code generation method, wherein the plurality of continuous first display codes are displayed at different coordinates of the plurality of display frames.
5. In claim 1,
   The display code generation method, wherein the second display code is displayed in a first display area having a different size from the plurality of continuous first display codes.
6. In claim 1,
   The display code generation method, wherein the plurality of first display codes are continuously displayed on the plurality of display frames.
7. In claim 1,
   The display code generation method, wherein the plurality of first display codes are discontinuously displayed on the plurality of display frames.
8. The neural network has a function of detecting a first display code composed of two-dimensional cells from image data,
   The neural network detects a plurality of the first display codes from the image data and generates a second display code by connecting the first display codes,
   A display code detection method, comprising: decoding digital data from the image data.
9. In claim 8,
   The image data includes the image data captured continuously,
   The neural network detects the first display code from the continuous image data;
   The neural network generates the second display code by connecting in order of detecting the first display code,
   A display code detection method, comprising: decoding the digital data from the image data.
10. In claim 8,
    The image data includes the image data captured non-continuously,
    The neural network detects the first display code from the discontinuous image data;
    The neural network generates the second display code by connecting in order of detecting the first display code,
    A display code detection method, comprising: decoding the digital data from the image data.
11. An authentication system having a first electronic device and a second electronic device,
    The first electronic device has a display panel and an electric motor powered by electricity,
    The second electronic device has an image sensor and a neural network,
    The first electronic device and the second electronic device have a first authentication code,
    The neural network has a function of detecting image features;
    The first electronic device has a function of encoding the first authentication code into a display code;
    The first electronic device has a function of displaying the display code on the display panel;
    The second electronic device has a function of imaging the display code by the imaging element,
    The second electronic device detects the display code from the image captured by the neural network,
    The second electronic device has a function of decrypting a second authentication code from the display code,
    The second electronic device has a function of determining a match between the first authentication code of the second electronic device and the decrypted second authentication code,
    As a result of the determination, when they match, the first electronic device has a function of permitting access from the second electronic device,
    As a result of the determination, an authentication system having a function in which the first electronic device does not permit the access from the second electronic device when they do not match.
12. A communication system having a first electronic device and a second electronic device,
    The first electronic device has a display panel and an electric motor powered by electricity,
    The second electronic device has an image sensor and a neural network,
    The first electronic device has communication data,
    The neural network has a function of detecting image features;
    The first electronic device has a function of encoding the authentication data into a display code,
    The first electronic device has a function of displaying the display code on the display panel;
    The second electronic device has a function of imaging the display code by the imaging element,
    The second electronic device detects the first display code from the image captured by the neural network,
    The second electronic device is a communication system having a function of decoding the communication data from the display code.

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