JP7051806B2 - Authentication system and communication system - Google Patents

Description

One aspect of the present invention relates to a display code generation method, a display code detection method, an authentication system, and a communication system.

It should be noted that one aspect of the present invention is not limited to the above technical fields. The technical field of one aspect of the invention disclosed in the present specification and the like relates to a product, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). In particular, one aspect of the present invention relates to a semiconductor device, a display device, a light emitting device, a power storage device, a storage device, a driving method thereof, or a manufacturing method thereof.

In the present specification and the like, the semiconductor device refers to an element, a circuit, a device, or the like that can function by utilizing the semiconductor characteristics. As an example, a semiconductor element such as a transistor or a diode is a semiconductor device. As another example, the circuit having a semiconductor element is a semiconductor device. As another example, the device provided with the circuit having the semiconductor element is a semiconductor device.

The electronic device uses an authentication code to determine permission to communicate between the electronic devices. When transmitting and receiving by wire or wirelessly, digital data is used as an authentication code. As different authentication codes, barcodes, or two-dimensional codes, are often used to identify goods.

The bar code or the two-dimensional code has a limited amount of information to be held, and is suitable for managing information for identifying a product or information such as an address on a network. However, barcodes or two-dimensional codes are not suitable for handling large amounts of information.

Patent Document 1 discloses a method of generating a two-dimensional code using the gradation value of an image.

For example, Patent Document 2 discloses an authentication system in which an electronic device is permitted to access a database via an authentication server.

Japanese Unexamined Patent Publication No. 2008-052588 International Publication No. 2003/06949

Since the barcode or the two-dimensional code is displayed as a printed matter or a still image, the visibility is good. However, it is necessary to prevent the leakage of the authentication code for the authentication code having highly confidential information.

Bar codes or two-dimensional codes have a limit on the amount of information they can hold. Therefore, it is not suitable for handling large data. Therefore, there is a problem that it is difficult to handle a large amount of information via a barcode or a two-dimensional code.

In view of the above problems, one aspect of the present invention is to provide a novel code generation method. Alternatively, one aspect of the present invention is to provide a novel code detection method. Alternatively, one aspect of the present invention is to provide a new authentication system. Alternatively, one aspect of the present invention is to provide a new communication system.

The description of these issues does not preclude the existence of other issues. It should be noted that one aspect of the present invention does not need to solve all of these problems. Issues other than these are self-evident from the description of the description, drawings, claims, etc., and it is possible to extract problems other than these from the description of the specification, drawings, claims, etc. Is.

The problems of one aspect of the present invention are not limited to the problems listed above. The issues listed above do not preclude the existence of other issues. Other issues are issues not mentioned in this item, which are described below. Issues not mentioned in this item can be derived from the description of the description, drawings, etc. by those skilled in the art, and can be appropriately extracted from these descriptions. In addition, one aspect of the present invention solves at least one of the above-listed descriptions and / or other problems.

One aspect of the present invention is a display code generation method for generating a display code from digital data, in which the digital data is encoded into gradation values and the plurality of display frames are encoded into gradation values. Digital data is displayed, and in each of the plurality of display frames, the digital data encoded by the gradation value is displayed as a two-dimensional cell and as a first display code, and the plurality of first display codes display the digital data. It is a display code generation method characterized in that a second display code is generated.

In the above configuration, as the second display code, a display code generation method characterized in that a plurality of consecutive first display codes are displayed at the same coordinates of a plurality of display frames is preferable.

In each of the above configurations, the second display code is preferably a display code generation method characterized in that a plurality of consecutive first display codes are displayed in a first display area having the same size.

In each of the above configurations, the second display code is preferably a display code generation method characterized in that a plurality of consecutive first display codes are displayed at different coordinates of a plurality of display frames.

In each of the above configurations, the second display code is preferably a display code generation method characterized in that a plurality of consecutive first display codes are displayed in first display areas having different sizes.

In each of the above configurations, the second display code is preferably a display code generation method characterized in that a plurality of first display codes are continuously displayed in a plurality of display frames.

In each of the above configurations, the second display code is preferably a display code generation method characterized in that a plurality of first display codes are displayed discontinuously in a plurality of display frames.

The uniformity of the present invention is a display code detection method, in which the neural network has a function of detecting a first display code composed of two-dimensional cells from image data, and the neural network has a function of detecting a first display code composed of two-dimensional cells from image data. It is a display code detection method characterized by detecting a plurality of first display codes and concatenating them to generate a second display code and decoding digital data from image data.

In the above configuration, the image data has continuously captured image data, the neural network detects the first display code from the continuous image data, and the neural network detects the first display code. A display code detection method characterized in that a second display code is generated by concatenating them in order and digital data is decoded from the image data is preferable.

In the above configuration, the image data has image data captured discontinuously, the neural network detects the first display code from the discontinuous image data, and the neural network detects the first display code. A display code detection method characterized in that a second display code is generated by concatenating the two in the order of the image data and digital data is decoded from the image data is preferable.

A uniform aspect of the present invention is an authentication system having a first electronic device and a second electronic device, wherein the first electronic device has a display panel and an electric power-powered electric device. The second electronic device has an image pickup element and a neural network, the first electronic device and the second electronic device have the first authentication code, and the neural network detects the features of the image. The first electronic device has a function of encoding the first authentication code into the third display code, and the first electronic device displays the third display code on the display panel. The second electronic device has a function of capturing a third display code by an image pickup element, and the second electronic device has a third display code from the images captured by the neural network. The second electronic device has a function of decrypting the second authentication code from the third display code, and the second electronic device has the first authentication code of the second electronic device. And, it has a function to determine the match of the decrypted second authentication code, and when the result of the determination matches, the first electronic device has a function to allow access from the second electronic device. However, if the results of the determination do not match, the first electronic device is an authentication system having a function of not permitting access from the second electronic device.

The uniformity of the present invention is a communication system having a first electronic device and a second electronic device, and the first electronic device has a display panel and an electric motor powered by electricity, and the first electronic device is the first. The second electronic device has an image pickup element and a neural network, the first electronic device has communication data, and the neural network has a function of detecting a feature of an image, and the first electron. The device has a function of encoding communication data into a fourth display code, the first electronic device has a function of displaying the fourth display code on the display panel, and the second electronic device has a function of displaying the fourth display code. The second electronic device has a function of capturing the fourth display code by the image pickup element, the second electronic device detects the fourth display code from the images captured by the neural network, and the second electronic device is the fourth. It is a communication system having a function of decoding communication data from the display code of.

One aspect of the present invention can provide a novel code generation method. Alternatively, one aspect of the present invention can provide a novel code detection method. Alternatively, one aspect of the invention can provide a novel authentication system. Alternatively, one aspect of the present invention can provide a novel communication system.

The effect of one aspect of the present invention is not limited to the effects listed above. The effects listed above do not preclude the existence of other effects. The other effects are the effects not mentioned in this item, which are described below. Effects not mentioned in this item can be derived from the description in the specification, drawings, etc. by those skilled in the art, and can be appropriately extracted from these descriptions. In addition, one aspect of the present invention has at least one of the above-listed effects and / or other effects. Therefore, one aspect of the present invention may not have the effects listed above in some cases.

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Hereinafter, embodiments will be described with reference to the drawings. However, it is easily understood by those skilled in the art that embodiments can be implemented in many different embodiments and that the embodiments and details can be varied in various ways without departing from the spirit and scope thereof. .. Therefore, the present invention is not construed as being limited to the description of the following embodiments.

Also, in the drawings, the size, layer thickness, or area may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. The drawings schematically show ideal examples, and are not limited to the shapes or values shown in the drawings.

In addition, the ordinal numbers "first", "second", and "third" used in the present specification are added to avoid confusion of the components, and are not limited numerically. Addition.

Further, in the present specification, words and phrases indicating arrangements such as "above" and "below" are used for convenience in order to explain the positional relationship between the configurations with reference to the drawings. Further, the positional relationship between the configurations changes appropriately depending on the direction in which each configuration is depicted. Therefore, it is not limited to the words and phrases explained in the specification, and can be appropriately paraphrased according to the situation.

Further, in the present specification and the like, a transistor is an element having at least three terminals including a gate, a drain, and a source. A channel region is provided between the drain (drain terminal, drain region or drain electrode) and the source (source terminal, source region or source electrode), and a current is generated between the source and the drain via the channel region. Can be shed. In the present specification and the like, the channel region refers to a region in which a current mainly flows.

Further, the functions of the source and the drain may be switched when transistors having different polarities are adopted or when the direction of the current changes in the circuit operation. Therefore, in the present specification and the like, the terms source and drain can be used interchangeably.

Further, in the present specification and the like, "electrically connected" includes the case of being connected via "something having some kind of electrical action". Here, the "thing having some kind of electrical action" is not particularly limited as long as it enables the exchange of electric signals between the connection targets. For example, "things having some kind of electrical action" include electrodes, wirings, switching elements such as transistors, resistance elements, inductors, capacitors, and other elements having various functions.

Further, in the present specification and the like, "parallel" means a state in which two straight lines are arranged at an angle of −10 ° or more and 10 ° or less. Therefore, the case of −5 ° or more and 5 ° or less is also included. Further, "vertical" means a state in which two straight lines are arranged at an angle of 80 ° or more and 100 ° or less. Therefore, the case of 85 ° or more and 95 ° or less is also included.

Further, in the present specification and the like, the term "membrane" and the term "layer" can be interchanged with each other. For example, it may be possible to change the term "conductive layer" to the term "conductive film". Alternatively, for example, it may be possible to change the term "insulating film" to the term "insulating layer".

Further, in the present specification and the like, unless otherwise specified, the off current means a drain current when the transistor is in an off state (also referred to as a non-conducting state or a cutoff state). Unless otherwise specified, the off state is a state in which the voltage Vgs between the gate and the source is lower than the threshold voltage Vth in the n-channel transistor, and the voltage Vgs between the gate and the source in the p-channel transistor. Is higher than the threshold voltage Vth. For example, the off-current of an n-channel transistor may refer to the drain current when the voltage Vgs between the gate and the source is lower than the threshold voltage Vth.

The off current of the transistor may depend on Vgs. Therefore, the fact that the off current of the transistor is I or less may mean that there is a value of Vgs in which the off current of the transistor is I or less. The off-current of a transistor may refer to an off-current in a predetermined Vgs, an off-state in Vgs within a predetermined range, an off-state in Vgs in which a sufficiently reduced off-current is obtained, and the like.

As an example, the threshold voltage Vth is 0.5V, the drain current at Vgs is 0.5V is 1 × ^10-9A , and the drain current at Vgs is 0.1V is 1 × ^10-13A . Assume an n-channel transistor having a drain current of 1 × 10 ^-19 A at Vgs of −0.5 V and a drain current of 1 × 10 ^-22 A at Vgs of −0.8 V. Since the drain current of the transistor is 1 × 10 ^-19 A or less in the range of Vgs of −0.5 V or Vgs in the range of −0.5 V to −0.8 V, the off current of the transistor is 1. It may be said that it is × ^10-19 A or less. Since there are Vgs in which the drain current of the transistor is 1 × ^10-22 A or less, it may be said that the off current of the transistor is 1 × ^10-22 A or less.

Further, in the present specification and the like, the off-current of a transistor having a channel width W may be represented by a current value flowing per channel width W. Further, it may be represented by a current value flowing around a predetermined channel width (for example, 1 μm). In the latter case, the off-current unit may be expressed in units having a current / length dimension (eg, A / μm).

The off current of the transistor may depend on the temperature. In the present specification, the off-current may represent an off-current at room temperature, 60 ° C., 85 ° C., 95 ° C., or 125 ° C., unless otherwise specified. Alternatively, at a temperature at which the reliability of the semiconductor device or the like containing the transistor is guaranteed, or at a temperature at which the semiconductor device or the like containing the transistor is used (for example, any one of 5 ° C. and 35 ° C.). May represent off-current. The off current of a transistor is I or less, which means that the temperature is room temperature, 60 ° C, 85 ° C, 95 ° C, 125 ° C, the temperature at which the reliability of the semiconductor device including the transistor is guaranteed, or the transistor is included. It may indicate that there is a value of Vgs in which the off-current of the transistor is I or less at the temperature at which the semiconductor device or the like is used (for example, any one of 5 ° C. to 35 ° C.).

The off current of the transistor may depend on the voltage Vds between the drain and the source. In the present specification, the off current has Vds of 0.1V, 0.8V, 1V, 1.2V, 1.8V, 2.5V, 3V, 3.3V, 10V, 12V, 16V unless otherwise specified. , Or may represent off-current at 20V. Alternatively, it may represent Vds in which the reliability of the semiconductor device or the like including the transistor is guaranteed, or the off-current in Vds used in the semiconductor device or the like including the transistor. When the off current of the transistor is I or less, Vds is 0.1V, 0.8V, 1V, 1.2V, 1.8V, 2.5V, 3V, 3.3V, 10V, 12V, 16V, 20V. , There is a value of Vgs in which the off current of the transistor is I or less in Vds in which the reliability of the semiconductor device or the like including the transistor is guaranteed, or Vds in which the reliability of the semiconductor device or the like including the transistor is guaranteed. It may refer to that.

In the above description of the off-current, the drain may be read as the source. In short, off-current may also refer to the current flowing through the source when the transistor is in the off state.

Further, in the present specification and the like, it may be described as a leak current in the same meaning as an off current. Further, in the present specification and the like, the off current may refer to, for example, the current flowing between the source and the drain when the transistor is in the off state.

The voltage means the potential difference between two points, and the potential means the electrostatic energy (electrical potential energy) of the unit charge in the electrostatic field at a certain point. However, in general, the potential difference between the potential at a certain point and the reference potential (for example, the ground potential) is simply called potential or voltage, and potential and voltage are often used as synonyms. Therefore, unless otherwise specified in the present specification, the potential may be read as a voltage, or the voltage may be read as a potential.

(Embodiment 1)
In the present embodiment, a new display code generation method for an electronic device, a display code detection method, an authentication system using the generated display code, and a communication system will be described with reference to FIGS. 1 to 10.

FIG. 1 describes a new display code generation method. As the display code, a bar code or a two-dimensional code is known as an authentication code. However, the bar code or the two-dimensional code is limited in the amount of digital data that can be encoded. In the present embodiment, a method of generating a new display code without limiting the amount of digital data that can be encoded will be described with reference to FIG. For the sake of explanation, the new display code is referred to as a flushing code (hereinafter referred to as FCODE). The FCODE is preferably displayed on the display panel of the electronic device. In the display panel, the display data is updated on a frame-by-frame basis. Therefore, when the display code is shown in units of one frame, it will be described as the display code FC (hereinafter referred to as FC). Therefore, FCODE is composed of one FC or a plurality of FCs.

FCODE is composed of one frame or a plurality of frames. The number of FCs constituting the FCODE can be changed depending on the size of the digital data to be encoded. Further, the number of cells possessed by the FC can be changed depending on the size of the digital data to be encoded. The display data of one frame has a display area composed of two-dimensional cells in which FC is displayed. In order to distinguish it from the display area of the display panel, the area where FC is displayed will be described as a display area FCD. The two-dimensional cell is preferably composed of 1 or more and m or less. m is a natural number of 2 or more.

FIG. 1 (A-1) shows, as an example, a two-dimensional cell in which FC is composed of 16 cells in 4 rows and 4 columns. One cell means a bit which is the minimum composition of the data to be encoded. Therefore, in FIG. 1 (A-1), FC has 16 bits. The minimum configuration that constitutes FC can be referred to as a flushing bit (hereinafter referred to as FB). FIG. 1 (A-1) shows an example in which FB0 to FB15 are arranged in order. However, it is preferable that the order in which FB0 to FB15 are arranged is not limited.

The set of cells can be expressed as FB [15: 0] as data. Since the FB is displayed in the display area FCD, the gradation value that can be displayed in the display area FCD can be used as a weight. Therefore, if the display area FCD can display 256 gradation values, the FB can obtain a weight of 256 values at the maximum. However, since the FCODE is determined by the image acquired by the image sensor, it is preferable to set it according to the resolution of the image sensor. As the image pickup element, a photodiode, an optical sensor, an image sensor, or the like can be used.

FIG. 1 (A-2) shows an example in which FC1 to FC8 are continuously displayed in a continuous display frame of FCODE. By continuously displaying the FC, the image sensor can continuously decode the FC from the image to be captured and recognize the FCODE. Therefore, a large amount of data can be transmitted in a short time.

FIG. 1 (A-3) shows the relationship when digital data encodes and decodes FCODE. The digital data is divided into FC1 to FC8 and encoded, and when decoding, FC1 to FC8 are detected from the image captured by the image pickup device, and FC1 to FC8 are connected to decode the digital data.

FIG. 2 (A-1) describes an example in which the digital data of [F10DF20CF30BF40AF509F608F707F806] is set in the FCODE.

FIG. 2 (A-2) is an example in which FB is represented by a binary number of “1” and “0” for the sake of simplification of explanation. The FCODE is composed of FC1 to FC8 displayed in 8 frames. For example, when the FB has a weight of 2 and is expressed in binary, the FB can be displayed by using a display panel capable of displaying from 0 gradation to 255 gradations.

For example, in order for the FB to express "1", it can be displayed using any gradation from 128 gradations to 255 gradations. Further, in order for the FB to express "0", it can be displayed using any gradation from 0 gradation to 127 gradations. Further, the plurality of pixels constituting the cell may have gradation values in any of the above ranges.

When the upper limit of the gradation range for expressing "0" in FB and the lower limit of the gradation range for expressing "1" in FB are close to each other, erroneous detection is performed by the detection accuracy of the image sensor. It is expected that. Therefore, in order to prevent erroneous detection of the gradation value, the width of the gradation value for the FB to express "0" (hereinafter referred to as the gradation width) and the floor for the FB to express "1". It is preferable to provide a non-selected gradation width that is not recognized as FB between the adjustment width and the adjustment width.

As described above, the gradation width for expressing "1" in FB or the gradation width for expressing "0" in FB can be arbitrarily set. Therefore, even if the FB is a binary number, the confidentiality at the time of decoding can be improved by setting the gradation width.

The FCODE in FIG. 2 (A-2) is composed of FC1 to FC8, and when each FC is displayed in hexadecimal display FC_H, FC1 is [F10D], FC2 is [F20C], and FC3 is [F30B]. FC4 can be represented as [F40A], FC5 as [F509], FC6 as [F608], FC7 as [F707], and FC8 as [F806]. That is, since the FCODE is configured by connecting FC1 to FC8, the FCODE can show the digital data of [F10DF20CF30BF40AF509F608F707F806].

FIG. 2 (A-3) shows an example in which FCODE is displayed by a display frame having periodicity, unlike FIG. 1 (A-2). FIG. 2 (A-3) shows an example in which FC1 and FC2 are displayed every four frames. Since the FC is displayed with periodicity, the display code can be displayed without deteriorating the visibility. The periodicity is not limited to every 4 frames. It may have a periodicity longer than 4 frames. Alternatively, it may have a periodicity shorter than 4 frames.

FIG. 2 (A-4) shows each FC twice in succession as a different example. When displaying FC continuously, the number of consecutive times is not limited to two. By displaying the images continuously, the image sensor can secure the time to accurately image the FC.

FIG. 2 (A-5) shows an example in which the FB has a weight of 8 and is expressed in octal. For example, in order for FB to express "0", it can be displayed using any gradation from 0 gradation to 31 gradation. Further, in order for the FB to express "1", it can be displayed using any gradation from 32 gradations to 63 gradations. Further, in order for the FB to express "2", it can be displayed using any gradation from 64 gradations to 95 gradations. Further, in order for the FB to express "3", it can be displayed using any gradation from 96 gradations to 127 gradations. Further, in order for the FB to express "4", it can be displayed using any gradation from 128 gradations to 159 gradations. Further, in order for the FB to express "5", it can be displayed using any gradation from 160 gradations to 191 gradations. Further, in order for the FB to express "6", it can be displayed using any gradation from 192 gradations to 223 gradations. Further, in order for the FB to express "7", it can be displayed using any gradation from 224 gradations to 255 gradations.

However, when one cell has a plurality of weights, the gradation width indicating each weight becomes smaller. In order to prevent erroneous detection by the image pickup device, it is preferable to have a non-selected gradation width that is not recognized as FB between the upper limit value of the gradation width showing different weights and the lower limit value of the gradation width.

For example, in order for FB to express "0", it is displayed in any gradation from 0 gradation to 20 gradations, and in order for FB to express "1", it is displayed in 32 gradations to 52 gradations. It can be displayed in any gradation. A non-selective gradation width can be provided from 21 gradations to 31 gradations between the gradation width for expressing "0" by FB and the gradation width for expressing "1" by FB. .. By providing a non-selective gradation width, it is possible to suppress erroneous detection due to the detection accuracy of the image sensor. It is preferable that the gradation width can be set by the user of the electronic device.

As described above, in FIG. 2 (A-5), the weight of the FB can be changed by changing the gradation value displayed in each cell. Therefore, the amount of data contained in the FC can be increased.

The display panel that can display FCODE is 4 colors from the sub-pixels with the color gamut of any of 3 colors of red R, green G, blue B, cyan C, magenta M, and yellow Y, or white W. It is known that color is displayed using the color gamut of. The FC may assign an FB to each color gamut of the sub-pixel. Therefore, the amount of data contained in FCODE can be further dramatically increased. Therefore, FCODE can be used not only for the authentication code but also for data communication.

The display panel may notify the electronic device at what timing the FCODE is displayed. Alternatively, the electronic device may acquire the FCODE for the image data captured by the image pickup device after transmitting the authentication code by using the image recognition function of AI (Artificial Integrity). In particular, the neural network is excellent in detecting the cell characteristics of the FC by learning the image on which the FC is displayed. Since the FC is displayed in the display area FCD, FCODE can be easily extracted from a plurality of FCs. Even if the FC is randomly displayed in the display area FCD, it can be decoded by using the image recognition function of AI. Preserving the aspect ratio of the cell makes detection by AI even easier.

In the FCODE display method different from the above, the FCODE may be configured by displaying a plurality of FCs on the same display surface. As an example, FC can be printed on the surface of paper, plastic resin, building materials, and the like. Alternatively, it may be projected using a projector.

FIG. 3 shows a display panel included in an electronic device as an example. The display area 150 included in the display panel has a display area FCD. FC can be displayed in the display area FCD. Therefore, when the display data of the display area FCD is updated, the FC is also updated. FCODE is composed of a plurality of FCs connected to each other. Here, the display area FCD1 of FC1 or the display area FCD2 of FC2 will be used for description.

FIG. 3 (A-1) shows an example in which the display area FCD1 and the display area FCD2 are displayed at the same coordinates and the same size. By displaying the display area FCD1 and the display area FCD2 at the same coordinates and the same size, FC can be easily detected from the image data.

FIG. 3 (A-2) is an example in which the display area FCD1 of FC1 and the display area FCD2 of FC2 are displayed in different sizes. However, the center coordinates of the display area FCD1 and the center coordinates of the display area FCD2 are the same. By making the center coordinates of the display area FCD1 and the display area FCD2 the same, FC can be easily detected from the image data.

FIG. 3A is an example in which the center coordinates of the display area FCD1 of FC1 and the center coordinates of the display area FCD2 of FC2 are different. However, the display area FCD1 and the display area FCD2 are displayed in the same size. The confidentiality of the FCODE is improved by moving the center coordinates of the display area FCD1 or the display area FCD2 to different coordinates. Further, since the display area FCD1 and the display area FCD2 are not displayed at the same center coordinates, the display contents change. Therefore, it is possible to suppress display deterioration of the display area 150 such as burn-in.

FIG. 3 (A-4) is an example in which the center coordinates of the display area FCD1 of FC1 and the center coordinates of the display area FCD2 of FC2 are different. Further, the display area FCD1 and the display area FCD2 are displayed in different sizes. By moving the center coordinates of the display area FCD1 and the display area FCD2, the confidentiality can be improved. Further, the confidentiality of FCODE is improved by using display area FCDs of different sizes. Since the display area FCDs are not displayed at the same center coordinates and have different sizes, the randomness of the display area FCDs can be improved, and display deterioration of the display area 150 such as burn-in can be suppressed.

However, it is preferable that the aspect ratios of the display area FCD1 and the display area FCD2 are the same. Further, it is preferable that the cell has 3 or more and n or less sides. n is an integer of 4 or more.

FIG. 4A illustrates the configuration of the electronic device 110 and the electronic device 120 from the side surface. The electronic device 110 includes a communication module 111, an image pickup device 112, and a display module 113. The display module 113 will be described in detail with reference to FIG. Here, the display module 113 will be described as the display panel 113d.

The electronic device 120 has a communication module 121 and a display module 122. The display module 122 will be described in detail with reference to FIG. Here, the display module 122 will be described as the display panel 122d.

FIG. 4B shows the configuration of the electronic device 120 from above. The electronic device 120 has switches 123a to 123d. It is preferable that the switch 123a to the switch 123d are assigned a function for controlling the electronic device 120. The display panel 122d has a display area 150. The display area 150 has a display area 150a for displaying the authentication code. The display area 150a shows the display area FCD described with reference to FIG. Therefore, the authentication code is encoded and displayed as FCODE in the display area 150a.

The size of the display area 150a is preferably smaller than or equal to the size of the display area 150. The image pickup device 112 has a function of receiving light from the display area 150a and determining the gradation. Hereinafter, the image pickup element 112 receives light from the display area 150a to determine the gradation, which is described in other words.

Although FIG. 4B shows an example including the switch 123a to the switch 123d, the electronic device 120 may not include the switch 123a to the switch 123d. The same operation as the switch 123a to the switch 123d can be performed by using the touch panel provided in the display module 122.

As shown in FIG. 4A, it is preferable that the communication module 111 and the communication module 121 can transmit and receive data. The communication method between the communication module 111 and the communication module 121 may be a communication method using wireless communication or a communication method using infrared rays. Alternatively, a communication method using a wired connection may be used.

The electronic device 110 has registration information. The registration information is preferably composed of a first authentication code and a second authentication code. Further, it is preferable that the electronic device 110 has a GPS (Global Positioning System) function. The electronic device 110 can use the GPS coordinates as one of the registration information.

The electronic device 110 can request access permission from the electronic device 120. The electronic device 110 has a step of transmitting the first authentication code to the electronic device 120 via the communication module 111.

The electronic device 120 has a step of receiving and determining the first authentication code via the communication module 121.

The electronic device 120 has a step of generating a second authentication code for determining that the electronic device 110 exists in the vicinity of the electronic device 120 by receiving the first authentication code. There is.

The electronic device 120 has a step of encoding the second authentication code into FCODE and displaying it on the display panel 122d.

The electronic device 110 has a step of imaging the FCODE using the image sensor 112.

The electronic device 110 decodes the FCODE into a second authentication code, compares the decrypted second authentication code with the first authentication code, and further updates the registration information of the electronic device 110 to electronically. The device 110 has a step of authenticating the electronic device 120.

The electronic device 110 has a step of notifying the electronic device 120 that the electronic device 120 is being authenticated.

Therefore, the present embodiment is an authentication system in which the image sensor 112 of the electronic device 110 has an authentication target within a distance that can image the display panel 122d of the electronic device 120.

In the above, the authentication system in which the second authentication code is encoded in FCODE and authenticated has been described, but the communication data may be encoded in FCODE. FCODE is suitable for transmitting large amounts of data because there are no restrictions on the amount of digital data to be encoded.

The authentication system of the present embodiment can guarantee that the electronic device 110 and the electronic device 120 are in the vicinity of each other. Therefore, it can be used for maintenance and maintenance of highly confidential precision equipment, equipment that requires safety such as vehicles, trains, and aircraft, and production equipment that requires high-precision management. Further, the electronic device capable of displaying FCODE is not limited to the above, and includes a mobile terminal, a TV, a monitor, a clock, a projector, a vending machine, a ticket vending machine, a digital signage, and the like. When the electronic device shown above has an image pickup device, it is possible to provide an authentication system using FCODE or a communication system using FCODE.

FIG. 5 shows an example in which an authentication system using FCODE is applied to the copier 120a. The copier 120a has a scanner device 131, a display module 132, a communication module 133, an input device 134, and an electronic device 120. The electronic device 120 is one of the components of the copier 120a.

The copier 120a can communicate with the electronic device 110 via the electronic device 120. Therefore, the copier 120a can use the authentication system of the present embodiment by using the electronic device 120 and the electronic device 110. Therefore, the authentication system performed between the electronic device 110 and the electronic device 120 will be described below. Further, it is preferable that the electronic device 110 and the electronic device 120 are connected to the data server 137 via a network (Network).

The electronic device 120 can manage the management parameters of the copier 120a. The display module 132 can input an instruction for printing the information stored in the data server 137. The communication module 133 has a telephone function. The input device 134 can read information from the external storage device.

The electronic device 110 transmits the first authentication code via the communication module 111. Upon receiving the first authentication code, the electronic device 120 encodes the second authentication code into FCODE and displays it in the display area 150a of the electronic device 120. The electronic device 110 uses the image sensor 112 to take an image of the FCODE and decode it into a second authentication code. It is preferable to use the neural network of the electronic device 110 for the analysis of FCODE. Using the first authentication code and the second authentication code, the electronic device 110 notifies the electronic device 120 that the electronic device 120 has been authenticated. The electronic device 120 permits access from the electronic device 110 by receiving a notification from the electronic device 110.

The electronic device 110 has a GPS function. When the electronic device 110 acquires the second authentication code from the electronic device 120, the electronic device 110 can also identify the GPS coordinates acquired by the GPS function of the electronic device 110. The GPS coordinates managed as the registration information of the electronic device 110 can be used as the identification information registered when the copier 120a is installed. Therefore, the copier 120a can be managed by the electronic device 110. Therefore, when the electronic device 110 is not used, it is not permitted to access the management parameters of the copying machine 120a through the electronic device 120. Therefore, it is possible to provide an authentication system in which access is permitted only by imaging the FCODE using the image sensor 112 and decoding the second authentication code.

The electronic device 110 may update the first authentication code of the registration information to the second authentication code. By always using a new authentication code, the electronic device 110 and the copier 120a can be associated and managed. Therefore, it is preferable that the copier 120a stores the latest second authentication code generated by the electronic device 120. Further, it is preferable that the electronic device 110 stores the registration information. Alternatively, the data server 137 may manage the registration information via the network.

When the electronic device 110 is permitted to access the electronic device 120, the electronic device 110 can access the device information and the management parameters of the copying machine 120a via the electronic device 120. The device information includes the product code, serial number, usage period, maintenance history information, trouble history information, and the like of the copier 120a. The management parameters include device condition information of the copier 120a, device condition history information, consumption location information, information on locations that are expected to deviate from the standard values that operate normally in the near future, and locations that have already deviated from the standard values. Information etc. are included.

Further, the electronic device 110 downloads information such as a structural drawing of the copy machine 120a, which is device information, a maintenance manual, a maintenance procedure, and an access procedure to a defective portion from the data server 137 via a network, and displays the information. be able to. An example of the display is shown on the display panel 113d included in the electronic device 110.

For example, on the display panel 113d, categories such as device parameters are displayed in the display area 114a, a drawing viewer is displayed in the display area 114b, maintenance procedures are displayed in the display area 114c, a device manual is displayed in the display area 114d, and history information is displayed in the display area 114e. Has been done. By touching the touch panel arranged at a position overlapping the display area 114a to the display area 114e, the content to be displayed in the display area 114f can be selected.

FIG. 5 shows an example in which an image of the copying machine 120a imaged by the image pickup device 112 is displayed in the display area 114f. The electronic device 110 can create a perspective view by adding a management parameter to the image of the copying machine 120a. Therefore, a perspective view of the copying machine 120a is displayed in the display area 114f. In the perspective view, the defect portion 114g and the reason for the defect 114h are displayed. FIG. 5 shows an example in which the position of a paper jam in the copier is displayed. However, the paper jam is not a problem of the roller portion where the paper jam is occurring, but it clearly shows that the sensor that detects the position of the paper to feed the paper to the roller is deteriorated. In this way, it is possible to obtain from the management parameters that the phenomenon and the cause of the defect are different. Hereinafter, the perspective view created by adding management parameters to the captured image will be referred to as an AR (Augmented Reality) image.

For example, when performing maintenance on electronic devices, it is estimated from AI that not only the problems that have occurred but also the electronic components used in the copier 120a show a tendency to deteriorate from the management parameters of the copier 120a. And can call attention. For grasping the tendency of deterioration, not only the history information possessed by the management parameters but also the information stored in the data server 137 can be used. Therefore, the tendency of deterioration can be estimated by combining the management parameters of the products installed in other places.

In the above, an example in which an authentication system using FCODE is applied to maintenance and maintenance of a copier 120a used in an office or the like has been described. As an example of different electronic devices or facilities, safety-required devices such as vehicles, trains, and aircraft, or production devices and power generation facilities that require quality control, require high-level maintenance and maintenance. Also, from the viewpoint of quality stability and confidentiality, which are important control items, it is preferable that access to electronic devices is permitted under limited environment and conditions. Therefore, it is preferable that the authentication system of the electronic device is an authentication system in which access is permitted only by encoding the second authentication code into FCODE, taking an image using the image sensor 112, and decoding the image.

Further, even when the amount of data of the management parameter is large, a large amount of data can be transmitted and received in a short time by using FCODE. Further, by giving the FB a weight according to the gradation value, a larger amount of data can be handled, and the confidentiality of the data can be further improved.

FIG. 6 shows the configurations of the electronic device 110 and the copier 120a. The electronic device 110 includes a communication module 111, an image pickup element 112, a display module 113, a processor 115, a storage device 116, and an input device 117. The display module 113 has a display device 113a and a touch panel 113e. The display device 113a has a display controller 113b, a frame memory 113c, and a display panel 113d.

The copier 120a includes an electronic device 120, a scanner device 131, a display module 132, a communication module 133, an input device 134, a processor 135, and a storage device 136. The electronic device 120 includes a communication module 121, a display module 122, an input device 123, a processor 125, and a storage device 126. The display module 122 has a display device 122a and a touch panel 122e. The display device 122a has a display controller 122b, a frame memory 122c, and a display panel 122d. The display module 132 preferably has the same configuration as the display module 122. The input device 123 is preferably an operation switch or the like as shown in FIG. 4 (B). Further, the input device 134 is preferably a non-volatile memory that can be connected via USB, or a non-volatile memory that is inserted from the outside.

The data server 137 is connected to the communication module 111, the communication module 133, and the communication module 121 via a network. The processor 135 included in the copier 120a can transmit and receive data by sharing a data bus and an address bus with the processor 125 included in the electronic device 120. Further, it is preferable that the communication module 111 and the communication module 121 can directly transmit and receive data without going through a network.

It is preferable that the storage device 116 stores a program for controlling the electronic device 110 and registration information. The FCODE displayed by the display panel 122d is imaged by the image sensor 112. The imaged FCODE is decoded into a second authentication code by the program of the electronic device 110. The second authentication code is programmatically compared or updated with the registration information stored in the storage device 116.

The processing flow of the authentication system using the second authentication code encoded by FCODE will be described with reference to FIGS. 7 to 9. The copier 120a has an electronic device 120 as one of its constituent parts. However, the second authentication code is displayed on the display panel 122d of the electronic device 120. Therefore, the copier 120a will be described by paraphrasing it as an electronic device 120. Therefore, in the processing flow shown in FIGS. 7 to 9, the interface between the electronic device 110, the electronic device 120, and the data server 137 will be described.

FIG. 7 shows a processing flow when the copier 120a is newly installed or registered. ST1011 is a step in which the electronic device 110 transmits an initialization request to the electronic device 120. The initialization request is made using the first authentication code of the electronic device 110.

ST1021 is a step in which the electronic device 120 temporarily authenticates the access from the electronic device 110 by receiving the first authentication code.

ST1022 is a step in which the electronic device 120 generates a second authentication code. The electronic device 120 can generate a second authentication code from the device information of the copier 120a, management parameters, and the like. It is preferable that the device information includes ID information such as a product code and a serial number of the copier 120a.

ST1023 is a step of encoding the generated second authentication code into FCODE and displaying it on the display panel 122d of the electronic device 120.

ST1012 is a step of detecting GPS coordinates by the GPS function of the electronic device 110 after transmitting the first authentication code to the electronic device 120. Since the electronic device 110 and the electronic device 120 exist within a distance where image authentication is possible, the location where the electronic device 120 is installed can be recognized by detecting the GPS coordinates. However, the GPS coordinate detection may be performed at the same time as the transmission of the first authentication code, or may be performed before the transmission of the first authentication code.

ST1013 is a step of image-certifying the second authentication code encoded in the FCODE by the electronic device 120 by the electronic device 110. First, the image sensor 112 included in the electronic device 110 images the FCODE displayed on the display panel 122d. Next, the imaged FCODE is decoded into a second authentication code by the program possessed by the electronic device 110. Therefore, the second authentication code is image-authenticated using FCODE.

ST1014 is a step of transmitting the ID information included in the second authentication code to be decrypted by the electronic device 110 to the data server 137.

ST1015 is a step of transmitting other device information and management parameters included in the second authentication code decrypted by the electronic device 110 to the data server 137.

ST1016 is a step of transmitting the GPS coordinates detected by ST1012 to the data server 137.

ST1041 is a step of registering the information transmitted to the data server 137 in ST1014 to ST1016 as registration information. When the data server 137 registers the information, the data server 137 notifies the electronic device 110 of the completion of the registration.

ST1017 is a step of registering the device information and the management parameter as the registration information when the notification of the registration completion is received from the data server 137. Further, the electronic device 110 notifies the electronic device 120 of the completion of registration. The first authentication code is preferably updated with the second authentication code.

ST1024 is a step of updating the first authentication code of the electronic device 120 with the second authentication code generated by ST1022. The electronic device 120 improves the confidentiality of the management parameters of the electronic device 120 by updating the first authentication code of the registration information with the second authentication code.

ST1018 is a step of completing the registration of the first authentication code and the second authentication code in the electronic device 110. ST1042 is a step of completing the registration of the first authentication code and the second authentication code in the data server 137. ST1025 is a step in which the installation of the copier 120a is completed.

FIG. 8 shows a processing flow of an authentication system using FCODE for the electronic device 110 to obtain an access permission from the electronic device 120. ST1111 is a step of detecting the GPS coordinates of the electronic device 110 by using the GPS function of the electronic device 110.

ST1112 is a step of transmitting the GPS coordinates detected by the electronic device 110 to the data server 137.

ST1141 is a step of searching for an electronic device 120 that matches the GPS coordinates detected by the electronic device 110. The data server 137 shifts to ST1142 when there is registration information matching the GPS coordinates (Yes). When the data server 137 cannot find the registration information matching the GPS coordinates (No), it notifies the electronic device 110 that there is no search target, and ends the processing flow.

ST1142 is a step of transmitting a first authentication code, which is registration information, to the electronic device 110 when the data server 137 detects the electronic device 120 matching the GPS coordinates.

ST1113 is a step in which the electronic device 110 requests login authentication from the electronic device 120.

ST1114 is a step of transmitting the first authentication code received from the data server 137 to the electronic device 120.

ST1121 is a step of comparing the first authentication code received from the electronic device 110 with the second authentication code stored in the electronic device 120. As a result of comparison, when they match (Yes), the process shifts to ST1122. As a result of the comparison, if they do not match (No), the electronic device 110 is notified that they do not match, and the processing flow ends.

ST1122 is a step in which the electronic device 120 generates a second authentication code. The electronic device 120 can generate a second authentication code from device information, management parameters, and the like. The device information includes at least one ID information such as a product code and a serial number of the copier 120a. Since the management parameter of the copier 120a includes any one of the information such as the condition history of the apparatus, it has a feature different from that of the stored second authentication code.

ST1123 is a step of encoding the generated second authentication code into FCODE and displaying it on the display panel 122d of the electronic device 120.

ST1115 is a step of image-certifying the second authentication code encoded in the FCODE by the electronic device 120 by the image sensor 112 of the electronic device 110.

ST1116 is a step of transmitting the ID information included in the second authentication code to be decrypted by the electronic device 110 to the data server 137 via the network.

ST1117 is a step of transmitting other device information and management parameters included in the second authentication code decrypted by the electronic device 110 to the data server 137 via the network. ST1143 is a step of registering other device information and management parameters included in the second authentication code to be decrypted in the data server 137 and notifying the electronic device 110 that the registration has been performed.

ST1118 is a step of notifying the electronic device 110 to log in to the electronic device 120.

ST1124 is a step of updating the first authentication code of the registration information possessed by the electronic device 120 with the second authentication code generated by ST1122. The electronic device 120 updates the first authentication code of the registration information as a new second authentication code, thereby improving the confidentiality of the management parameters of the electronic device 120.

ST1125 is a step of authenticating that the electronic device 120 has logged in from the electronic device 110.

ST1119 is a step of shifting to a state in which the electronic device 110 is logged in to the electronic device 120.

ST1126 is a step in which the electronic device 120 permits access from the electronic device 110 and provides management parameters and device information in response to a request from the electronic device 110.

FIG. 9 shows an example in which maintenance and maintenance of the electronic device 120 are performed using the electronic device 110 as a processing flow. In FIG. 9, the electronic device 120 is already logged in to the electronic device 110 by the process of FIG.

ST1211 is a step in which the electronic device 110 requests the data server 137 for detailed device information of the electronic device 120 via the network. When the electronic device 110 has detailed device information of the electronic device 120, the steps ST1211 and ST1241 to ST1243 may not be executed.

ST1241 is a step of downloading an operation manual corresponding to device information from the data server 137 to the electronic device 110.

ST1242 is a step of downloading the structural drawing information corresponding to the device information from the data server 137 to the electronic device 110.

ST1243 is a step of downloading a troubleshooting method (TSM: Trouble Shooting Method) from the data server 137 to the electronic device 110.

ST1212 is a step in which the electronic device 110 requests the electronic device 120 for information on the latest management parameters. Request information indicating the status of electronic devices, such as equipment conditions, consumable parts, or parts that are expected to deviate from the standard values that operate normally in the near future, or parts that have already deviated from the standard values.

ST1221 is a step in which the electronic device 120 transmits the status information of the electronic device 120 in response to the status request of the electronic device 110. The transmission data at this time may be transmitted via the communication module 121, or may be encoded in the FCODE and transmitted.

ST1213 is a step of transmitting the status information received by the electronic device 110 from the electronic device 120 to the data server 137.

ST1244 is a step of updating the status information in the management parameters stored in the data server 137. The data server 137 can store the management parameters of the electronic device 120 and the work history in association with each other together with the status information.

ST1214 is a step of photographing the copier 120a by the image pickup element 112 included in the electronic device 110. The image sensor 112 can image the copier 120a as a still image or a moving image.

ST1215 is a step of synthesizing the image data of the captured copier 120a with the status information acquired by ST1221 and displaying the status information on the display panel 113d. On the display panel 113d, it is possible to generate an AR image in which the structural drawing acquired by ST1242 and the image acquired by ST1214 are combined. Furthermore, to the AR image, information such as the consumed part, the part predicted to deviate from the standard value for normal operation in the near future, or the part already deviated from the standard value is added to the AR image according to the status information received by ST1221. Can be displayed.

The display panel 113d of the electronic device 110 of FIG. 5 shows, as an example, a defective portion 114 g and a reason for the defect 114h. Since the parts to be adjusted are small and have high performance, it is preferable that the AR image is displayed on the display panel 113d having a high resolution. For example, a display panel having 4K (3840 × 2160), 8K (7680 × 4320), 16K (15360 × 8640), or more pixels is preferable because the amount of information to be displayed can be increased.

By confirming the AR image displayed on the display panel 113d, the ST1222 confirms where the problem is in the copier 120a, confirms where the adjustment is required, or obtains an instruction on the adjustment method. It is a step to do at least one of the above.

ST1223 is a step of determining the end of adjustment. When the adjustment is required again (No), the process proceeds to ST1221. If the adjustment is completed (Yes), the process proceeds to ST1224.

ST1224 is a step in which the electronic device 120 transmits the adjusted status information to the electronic device 110. The transmission data at this time may be transmitted via the communication module 121, or may be encoded in the FCODE and transmitted.

ST1216 is a step of transmitting the status information received by the electronic device 110 from the electronic device 120 to the data server 137.

ST1245 is a step of updating the status information in the management parameters stored in the data server 137. The data server 137 can store the management parameters of the electronic device 120 and the work history in association with each other together with the status information.

ST1217 is a step of transmitting a request for the electronic device 110 to log out from the electronic device 120 because the adjustment work of the electronic device 120 is completed.

ST1218 is a step in which the electronic device 110 logs out of the electronic device 120.

ST1225 is a step in which the electronic device 120 is in a state of being logged out from the electronic device 110.

ST1226 is a step of setting the copying machine 120a into a state (User Mode) that can be used by the user via the electronic device 120.

As described above, the second authentication code or communication data can be encoded in FCODE using a novel code generation method. Therefore, it is possible to provide an authentication system in which confidentiality is improved by encoding the second authentication code in FCODE. Further, by encoding the communication data in FCODE, it is possible to provide a communication system that improves confidentiality and facilitates transmission of a large amount of data.

10 (A-1) and 10 (B) show a communication system using an FCODE having a configuration different from that of FIG. FIG. 10A shows a substrate 160a, an electronic component 161a, a substrate 160b, and an electronic component 161b. The electronic component 161a has a light emitting element 162, and the electronic component 161b has an image pickup element 163. As the substrate 160a or the substrate 160b, either a printed circuit board or a flexible printed circuit board can be used.

The light emitting element 162 and the image pickup element 163 are arranged at positions facing each other, and the light emitted from the light emitting element 162 has an optical path for incident on the image pickup element 163. Although not shown, the optical path of the light emitted from the light emitting element 162 may be surrounded by a light-shielding wall in order to block the influence from other external light.

FIG. 10A-2 shows an example in which 16 light emitting elements 162 are arranged in 4 rows and 4 columns. However, the number of light emitting elements 162 is not limited. The number of light emitting elements 162 may be any number of 1 or more and n or less. n is an integer of 2 or more.

FIG. 10 (A-3) shows an example in which 16 image pickup devices 163 are arranged in 4 rows and 4 columns. However, the number of image pickup devices 163 is not limited. The number of image pickup devices 163 can be any number of 1 or more and n or less.

As the light emitting element 162, an OLED (Organic Light Emitting Diode), an LED (Light Emitting Diode), or the like can be used. For example, as the image pickup device 163 formed on the electronic component 161b mounted on the display, a photodiode, an optical sensor, an image sensor, or the like can be used.

As shown in FIG. 10A, the wiring between electronic components can be reduced by using the gradation value of light for data communication between electronic components. Therefore, it is not necessary to provide wiring for data communication between electronic components arranged on different boards. Therefore, it is possible to reduce the wiring area, wiring resistance, parasitic capacitance of wiring, electronic components such as buffers for transmitting and receiving signals, connectors for electrically connecting boards, and the like. Moreover, it is not necessary to adjust the wiring impedance. In electronic devices, miniaturization and high-density mounting are progressing, and it is becoming difficult to secure a mounting area and an arrangement space for components. When an electronic device uses the brightness of light as a gradation value for data communication between electronic components, it is possible to reduce the number of components and the wiring area.

In FIG. 10B, unlike FIG. 10A, the image pickup device 163 is formed on the substrate 160c. The substrate 160c may be a substrate made of a translucent material such as a glass substrate or a quartz substrate. As a different example, the display device 113a has a display controller 113b and a display panel 113d formed on the substrate 160c. Therefore, the electronic component 161a mounted on the substrate 160a may have a function as the display controller 113b.

The number of wires connecting the display controller 113b and the display panel 113d increases in proportion to the fineness of the display. By using the image pickup device 163 formed on the substrate 160c, the number of wirings connecting the display controller 113b and the display panel 113d can be reduced. Therefore, the display controller 113b does not have to be electrically connected to the display panel 113d via the flexible printed circuit board, so that the number of flexible printed circuit boards can be reduced. Further, since the wiring and the like provided on the substrate 160c can be shortened, the substrate size can be reduced. Therefore, not only the electrical aspects such as the wiring area, the wiring resistance, and the parasitic capacitance of the wiring can be improved, but also the component cost, the manufacturing cost, and the like can be reduced.

As described above, the configuration and method shown in this embodiment can be used in appropriate combination with the configuration and method shown in other embodiments.

(Embodiment 2)
In the present embodiment, the display device of one aspect of the present invention will be described. A high-definition display panel suitable for displaying an AR image will be described in detail.

One aspect of the present invention is a display device including a display area (also referred to as a pixel unit) in which a plurality of pixels are arranged in a matrix. Wiring (also referred to as a gate line or scanning line) to which a selection signal is supplied and wiring (source line, signal line, data line, etc.) to which a signal to be written to the pixel (also referred to as a video signal, etc.) are supplied to the pixel portion. Also called), each is provided in multiples. Here, the gate lines and the source lines are provided in parallel with each other, and the gate lines and the source lines intersect with each other.

One pixel comprises at least one transistor and one display element. The display element has a conductive layer that functions as a pixel electrode, and the conductive layer is electrically connected to either the source or the drain of the transistor. Also, in a transistor, the gate is electrically connected to the gate line, and the other of the source or drain is electrically connected to the source line.

Here, the extending direction of the gate line is referred to as the row direction or the first direction, and the extending direction of the source line is referred to as the column direction or the second direction.

Here, it is preferable that the same selection signal is supplied to two or more adjacent gate lines. That is, it is preferable that the selection periods of these gate lines are the same. Here, an example of a set of three gate lines will be used for explanation. However, the number of gate lines having the same gate line selection period is not limited to a set of three gate lines, and may be a set of four gate lines. Further, a set of more gate lines may be used.

When the same selection signal is supplied to the three gate lines, three pixels adjacent to each other in the column direction are selected at the same time. Therefore, different source lines are connected to each of these three pixels. That is, the configuration is such that three source lines are arranged for each column.

Here, it is preferable that the source line located inside out of the three source lines is arranged so as to overlap with the conductive layer that functions as the pixel electrode. As a result, the distance between the pixel electrodes can be reduced.

Further, it is preferable that a part of the semiconductor layer of the transistor is provided between the source line located on the outer side and the source line located on the inner side of the three source lines. For example, when the first to third source lines are arranged in this order, a part of the semiconductor layer of the transistor connected to the first source line and the transistor connected to the second source line is the first source line. The configuration is located between the second source lines. Further, a part of the semiconductor layer of the transistor connected to the third source line is configured to be located between the second source line and the third source line. As a result, the node between each source line and each semiconductor layer can be configured so as not to intersect with other source lines. Therefore, the parasitic capacitance between the source lines can be reduced.

With such a configuration, the horizontal period can be made longer than before. For example, when the same selection signal is supplied to three gate lines, the length of one horizontal period can be tripled. Further, since the parasitic capacitance between the source lines can be reduced, the load on the source lines can be reduced. This makes it possible to operate a display device having an extremely high resolution such as 4K or 8K by using a transistor having a low field effect mobility. Further, it can be applied to a large display device having a screen size of 50 inches or more diagonally, 60 inches or more diagonally, or 70 inches or more diagonally.

Hereinafter, a more specific example of the display device will be described with reference to the drawings.

[Display device configuration example]
FIG. 11 shows a block diagram of the display device 1100 according to one aspect of the present invention. The display device 1100 includes a pixel area (Pixel Area, display area), a source driver (Source Driver IC), and a gate driver (Gate Driver).

FIG. 11 shows an example of having two gate drivers across a pixel area. A plurality of gate lines GL ₀ are connected to these two gate drivers. FIG. 11 shows the i-th gate line GL ₀ (i). The gate line GL ₀ (i) shows an example of being electrically connected to three gate lines (gate line GL (i), gate line GL (i + 1), and gate line GL (i + 2)). Therefore, the same selection signal is given to these three gate lines.

Multiple source lines are connected to the source driver. Three source lines are provided for one pixel row. In FIG. 11, the three source lines (source line SL ₁ (j), source line SL ₂ (j), source line SL ₃ (j)) corresponding to the j-th pixel string and the j + 1th pixel string are shown. The corresponding three source lines (source line SL ₁ (j + 1), source line SL ₂ (j + 1), source line SL ₃ (j + 1)) are shown.

One pixel has at least one transistor and one conductive layer 21 that functions as a pixel electrode of the display element. A pixel is a pixel corresponding to one color. Therefore, when color display is performed by utilizing the color mixing of light exhibited by a plurality of pixels, the pixels can also be referred to as sub-pixels.

Further, it is preferable that the plurality of pixels arranged in the column direction are pixels having the same color. When a liquid crystal element is used as the display element, the pixels arranged in the column direction are provided with a colored layer that is superimposed on the liquid crystal element and transmits light of the same color.

Here, it is preferable that a part of the source line (source line SL ₂ (j)) located inside is superimposed on the conductive layer 21 among the three source lines corresponding to one pixel row. Further, it is preferable to arrange the source line SL ₂ (j) in the central portion of the conductive layer 21 so as to be separated from other source lines. For example, the distance between the source line SL ₁ (j) and the source line SL ₂ (j) and the distance between the source line SL ₂ (j) and the source line SL ₃ (j) are arranged so as to be approximately equal intervals. Is preferable. This makes it possible to more effectively reduce the parasitic capacitance generated between the source lines and reduce the load per source line.

Here, when applying a transistor using amorphous silicon or the like, which is difficult to increase the mobility of the electric field effect, the display area of the display device is divided into a plurality of pixel areas and driven as a method of achieving high resolution. The method can be mentioned. However, in the case of the above method, the boundary portion of the divided pixel region may be visually recognized due to variations in the characteristics of the drive circuit, and the visibility may be deteriorated. Further, image processing for dividing the input image data in advance is required, and a high-speed and large-scale image processing device is required.

On the other hand, the display device according to one aspect of the present invention can be driven without dividing the display area even when a transistor having a relatively low field effect mobility is used.

FIG. 11 shows an example in which the source driver is arranged along one side of the pixel area, but as shown in FIG. 12, the pixel area is sandwiched along two opposite sides of the pixel area (Pixel Area). The source driver may be placed in. Further, as shown in FIG. 12, a gate driver (Gate Driver) may be arranged so as to sandwich the pixel area.

In FIG. 12, of the plurality of source lines provided in the pixel area, the source driver IC (Source Driver IC) connected to the odd-numbered number and the source driver IC (Source Driver IC) connected to the even-numbered number are opposed to each other. An example of the arrangement is shown. That is, the plurality of source lines arranged in the column direction are configured to be connected to different source driver ICs alternately. In FIG. 12, the source line SL ₁ (j) and the source line SL ₃ (j) are connected to the source driver IC located on the upper side, and the source line SL ₂ (j) is connected to the source driver IC located on the lower side. An example is shown. With such a configuration, it is possible to reduce display unevenness due to potential drop due to wiring resistance even in a large display device. Further, by adopting the configuration of FIG. 12, since the area for arranging the source driver IC can be increased as compared with the configuration of FIG. 11, the distance between two adjacent source driver ICs can be increased, and the production yield can be improved. be able to.

[Pixel configuration example]
Hereinafter, a configuration example of pixels arranged in the pixel area of the display device 1100 will be described.

FIG. 13A shows a circuit diagram including three pixels arranged in the column direction.

One pixel has a transistor 30, a liquid crystal element 20, and a capacitive element 60.

The wirings S1 to S3 correspond to the source line, and the wirings G1 to G3 correspond to the gate line, respectively. Further, the wiring CS is electrically connected to one of the electrodes of the capacitive element 60, and a predetermined potential is given.

The pixel is electrically connected to any one of the wirings S1 to S3 and any one of the wirings G1 to G3. As an example, the pixels connected to the wiring S1 and the wiring G1 will be described. In the transistor 30, the gate is electrically connected to the wiring G1, one of the source and the drain is electrically connected to the wiring S1, the other is the other electrode of the capacitive element 60, and one electrode (pixel) of the liquid crystal element 20. Electrically connected to the electrode). A common potential is supplied to one of the electrodes of the capacitive element 60.

FIG. 13B shows an example of the layout of the pixels connected to the wiring S1 and the wiring G1.

As shown in FIG. 13B, the wiring G1 and the wiring CS extend in the row direction (horizontal direction), and the wirings S1 to S3 extend in the column direction (vertical direction).

Further, in the transistor 30, a semiconductor layer 32 is provided on the wiring G1, and a part of the wiring G1 functions as a gate electrode. Further, a part of the wiring S1 functions as one of the source electrode and the drain electrode. The semiconductor layer 32 has a region located between the wiring S1 and the wiring S2.

The other of the source electrode or the drain electrode of the transistor 30 and the conductive layer 21 functioning as a pixel electrode are electrically connected via a connecting portion 38. Further, the colored layer 41 is provided at a position overlapping with the conductive layer 21.

Further, the conductive layer 21 has a portion that overlaps with the wiring S2. Further, it is preferable that the conductive layer 21 does not overlap with the wiring S1 and the wiring S3 located at both ends. Thereby, the parasitic capacitance of the wiring S1 and the wiring S3 can be reduced.

Here, when the distance between the wiring S1 and the wiring S2 is the distance D1 and the distance between the wiring S2 and the wiring S3 is the distance D2, it is preferable that the distance D1 and the distance D2 are substantially equal. For example, the ratio of the distance D2 to the distance D1 (that is, the value of D2 / D1) is preferably 0.8 or more and 1.2 or less, preferably 0.9 or more and 1.1 or less. As a result, the parasitic capacitance between the wiring S1 and the wiring S2 and the parasitic capacitance between the wiring S2 and the wiring S3 can be reduced.

Further, by increasing the distance between the wirings, if dust or the like adheres between the wirings during the manufacturing process, it can be easily removed by cleaning, so that the yield can be improved. When a line cleaning device is used as the cleaning method, it is preferable to perform cleaning while moving the substrate along the stretching direction of the wiring S1 or the like because it becomes easier to remove dust.

Further, in FIG. 13B, a part of the wirings S1 to S3 and a part of the wiring CS have a portion thicker than the other parts. As a result, the wiring resistance can be reduced.

13 (C) and 13 (D) show an example of the layout of the pixels connected to the wiring G2 and the wiring G3, respectively.

In FIG. 13C, the semiconductor layer 32 provided on the wiring G2 is electrically connected to the wiring S2 and has a region located between the wiring S1 and the wiring S2.

Further, in FIG. 13D, the semiconductor layer 32 provided on the wiring G3 is electrically connected to the wiring S3 and has a region located between the wiring S2 and the wiring S3.

Further, it is preferable that each of the pixels shown in FIGS. 13 (B), 13 (C), and (D) is a pixel exhibiting the same color. A colored layer 41 that transmits light of the same color can be superimposed and arranged in a region that overlaps with the conductive layer 21. Further, the pixels adjacent to each other in the column direction may have the same configuration as in FIGS. 13 (B), (C), and (D), but only the colored layer 41 is a colored layer that transmits a different color.

[Cross section configuration example]
Hereinafter, an example of the cross-sectional configuration of the display device will be described.

[Cross-section configuration example 1]
FIG. 14 shows an example of a cross section corresponding to the cutting lines A1-A2 in FIG. 13 (B). Here, an example in which a transmissive liquid crystal element 20 is applied as the display element is shown. In FIG. 14, the substrate 12 side is the display surface side.

The display device 1100 has a configuration in which the liquid crystal 22 is sandwiched between the substrate 11 and the substrate 12. The liquid crystal element 20 has a conductive layer 21 provided on the substrate 11 side, a conductive layer 23 provided on the substrate 12 side, and a liquid crystal 22 sandwiched between them. Further, an alignment film 24a is provided between the liquid crystal 22 and the conductive layer 21, and an alignment film 24b is provided between the liquid crystal 22 and the conductive layer 23.

The conductive layer 21 functions as a pixel electrode. Further, the conductive layer 23 functions as a common electrode or the like. Further, both the conductive layer 21 and the conductive layer 23 have a function of transmitting visible light. Therefore, the liquid crystal element 20 is a transmissive liquid crystal element.

A colored layer 41 and a light-shielding layer 42 are provided on the surface of the substrate 12 on the substrate 11 side. The insulating layer 26 is provided so as to cover the colored layer 41 and the light-shielding layer 42, and the conductive layer 23 is provided so as to cover the insulating layer 26. Further, the colored layer 41 is provided in a region overlapping the conductive layer 21. The light-shielding layer 42 is provided so as to cover the transistor 30 and the connection portion 38.

The polarizing plate 39a is arranged outside the substrate 11, and the polarizing plate 39b is arranged outside the substrate 12. Further, a backlight unit 90 is provided outside the polarizing plate 39a.

A transistor 30, a capacitive element 60, and the like are provided on the substrate 11. The transistor 30 functions as a pixel selection transistor. The transistor 30 is electrically connected to the liquid crystal element 20 via the connecting portion 38.

The transistor 30 shown in FIG. 14 is a transistor having a so-called bottom gate channel etch structure. The transistor 30 includes a conductive layer 31 that functions as a gate electrode, an insulating layer 34 that functions as a gate insulating layer, a semiconductor layer 32, a pair of impurity semiconductor layers 35 that function as a source region and a drain region, and a source electrode and a drain. It has a pair of conductive layers 33a and a conductive layer 33b that function as electrodes. The portion of the semiconductor layer 32 that overlaps with the conductive layer 31 functions as a channel region. The semiconductor layer 32 and the impurity semiconductor layer 35 are provided in contact with each other, and the impurity semiconductor layer 35 and the conductive layer 33a or the conductive layer 33b are provided in contact with each other.

The conductive layer 31 corresponds to a part of the wiring G1 in FIG. 13B, and the conductive layer 33a corresponds to a part of the wiring S1. Further, the conductive layer 31a, the conductive layer 33c, and the conductive layer 33d, which will be described later, correspond to the wiring CS, the wiring S2, and the wiring S3, respectively.

It is preferable to use a semiconductor containing silicon for the semiconductor layer 32. For example, amorphous silicon, microcrystalline silicon, polycrystalline silicon, or the like can be used. In particular, it is preferable to use amorphous silicon because it can be formed on a large substrate with good yield. The display device of one aspect of the present invention can display well even if it is a transistor to which amorphous silicon having a relatively low field effect mobility is applied. When amorphous silicon is used, it is preferable to use hydrided amorphous silicon (a—Si: may be referred to as H) in which dangling bonds are terminated by hydrogen.

The impurity semiconductor film constituting the impurity semiconductor layer 35 is formed of a semiconductor to which an impurity element that imparts a conductive type is added. When the transistor is n-type, examples of the semiconductor to which an impurity element that imparts a conductive type is added include silicon to which P or As is added. Alternatively, when the transistor is p-type, it is possible to add, for example, B as an impurity element that imparts one conductive type, but it is preferable that the transistor is n-type. The impurity semiconductor layer 35 may be formed of an amorphous semiconductor or a crystalline semiconductor such as a microcrystalline semiconductor.

The capacitive element 60 is composed of a conductive layer 31a, an insulating layer 34, and a conductive layer 33b. Further, on the conductive layer 31a, a conductive layer 33c and a conductive layer 33d are provided via an insulating layer 34, respectively.

The insulating layer 82 and the insulating layer 81 are laminated and provided so as to cover the transistor 30 and the like. The conductive layer 21 that functions as a pixel electrode is provided on the insulating layer 81. Further, in the connecting portion 38, the conductive layer 21 and the conductive layer 33b are electrically connected to each other through the openings provided in the insulating layer 81 and the insulating layer 82. The insulating layer 81 preferably functions as a flattening layer. Further, the insulating layer 82 preferably has a function as a protective film for suppressing the diffusion of impurities and the like to the transistor 30 and the like. For example, an inorganic insulating material can be used for the insulating layer 82, and an organic insulating material can be used for the insulating layer 81.

[Cross-section configuration example 2]
In the above, an example of a vertical electric field type liquid crystal element in which a pair of electrodes sandwiching the liquid crystal are arranged one above the other as the liquid crystal element is shown, but the configuration of the liquid crystal element is not limited to this, and various types of liquid crystal elements are shown. Can be applied.

FIG. 15 shows a schematic cross-sectional view of a display device having a liquid crystal element to which an FFS (Fringe Field Switching) mode is applied.

The liquid crystal element 20 has a conductive layer 21 that functions as a pixel electrode, and a conductive layer 23 that overlaps the conductive layer 21 via an insulating layer 83. The conductive layer 23 has a slit-shaped or comb-shaped upper surface shape.

Further, in this configuration, a capacitance is formed in a portion where the conductive layer 21 and the conductive layer 23 overlap, and this can be used as the capacitive element 60. Therefore, since the occupied area of the pixels can be reduced, a high-definition display device can be realized. In addition, the aperture ratio can be improved.

Here, when manufacturing a display device, the smaller the number of photolithography steps in the manufacturing process, that is, the smaller the number of masks in the photomask, the lower the manufacturing cost can be.

For example, in the configuration shown in FIG. 14, among the steps on the substrate 11 side, a step of forming the conductive layer 31 and the like, a step of forming the semiconductor layer 32 and the impurity semiconductor layer 35, a step of forming the conductive layer 33a and the like, and an opening serving as the connection portion 38. It can be manufactured by going through a total of five photolithography steps, that is, a step of forming a portion and a step of forming a conductive layer 21. That is, a backplane substrate can be manufactured by using five photomasks. On the other hand, on the substrate 12 (opposite substrate) side, it is preferable to use an inkjet method, a screen printing method, or the like as a method for forming the colored layer 41 and the light-shielding layer 42 because a photomask becomes unnecessary. For example, when the three-color colored layer 41 and the light-shielding layer 42 are provided, a total of four photomasks can be reduced as compared with the case where these are formed by a photolithography method.

The above is the description of the cross-sectional configuration example.

[Transistor configuration]
In the following, an example of a transistor configuration different from the above will be described.

The transistor shown in FIG. 16A has a semiconductor layer 37 between the semiconductor layer 32 and the impurity semiconductor layer 35.

The semiconductor layer 37 may be formed of the same semiconductor film as the semiconductor layer 32. The semiconductor layer 37 can function as an etching stopper for preventing the semiconductor layer 32 from disappearing due to etching when the impurity semiconductor layer 35 is etched. Although FIG. 16A shows an example in which the semiconductor layer 37 is separated to the left and right, a part of the semiconductor layer 37 may cover the channel region of the semiconductor layer 32.

Further, the semiconductor layer 37 may contain impurities having a lower concentration than that of the impurity semiconductor layer 35. As a result, the semiconductor layer 37 can function as an LDD (Lightly Doped Drain) region, and hot carrier deterioration when the transistor is driven can be suppressed.

In the transistor shown in FIG. 16B, an insulating layer 84 is provided on the channel region of the semiconductor layer 32. The insulating layer 84 functions as an etching stopper when etching the impurity semiconductor layer 35.

The transistor shown in FIG. 16C has a semiconductor layer 32p instead of the semiconductor layer 32. The semiconductor layer 32p includes a semiconductor film having high crystallinity. For example, the semiconductor layer 32p includes a polycrystalline semiconductor or a single crystal semiconductor. This makes it possible to obtain a transistor having high field effect mobility.

The transistor shown in FIG. 16D has a semiconductor layer 32p in the channel region of the semiconductor layer 32. For example, the transistor shown in FIG. 16D can be formed by locally crystallizing the semiconductor film to be the semiconductor layer 32 by irradiating it with laser light or the like. This makes it possible to realize a transistor having high field effect mobility.

The transistor shown in FIG. 16E has a crystalline semiconductor layer 32p in the channel region of the semiconductor layer 32 of the transistor shown in FIG. 16A.

The transistor shown in FIG. 16F has a crystalline semiconductor layer 32p in the channel region of the semiconductor layer 32 of the transistor shown in FIG. 16B.

The above is the description of the configuration example of the transistor.

[For each component]
Hereinafter, each component shown above will be described.

〔substrate〕
A material having a flat surface can be used for the substrate of the display panel. A material that transmits the light is used for the substrate that extracts the light from the display element. For example, materials such as glass, quartz, ceramics, sapphire, and organic resins can be used.

By using a thin substrate, it is possible to reduce the weight and thickness of the display panel. Further, by using a substrate having a thickness sufficient to have flexibility, a flexible display panel can be realized. Alternatively, glass or the like thin enough to have flexibility can be used for the substrate. Alternatively, a composite material in which glass and a resin material are bonded by an adhesive layer may be used.

[Transistor]
The transistor has a conductive layer that functions as a gate electrode, a semiconductor layer, a conductive layer that functions as a source electrode, a conductive layer that functions as a drain electrode, and an insulating layer that functions as a gate insulating layer.

The structure of the transistor included in the display device according to one aspect of the present invention is not particularly limited. For example, it may be a planar type transistor, a stagger type transistor, or an inverted stagger type transistor. Further, either a top gate type or bottom gate type transistor structure may be used. Alternatively, gate electrodes may be provided above and below the channel.

The crystallinity of the semiconductor material used for the transistor is not particularly limited, and either an amorphous semiconductor or a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor having a partially crystalline region). May be used. It is preferable to use a semiconductor having crystallinity because deterioration of transistor characteristics can be suppressed.

For example, silicon can be used as the semiconductor in which the channel of the transistor is formed. It is particularly preferable to use amorphous silicon as the silicon. By using amorphous silicon, transistors can be formed on a large substrate with good yield and excellent mass productivity.

Further, silicon having crystallinity such as microcrystalline silicon, polycrystalline silicon, and single crystal silicon can also be used. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon.

Alternatively, a metal oxide may be used for the semiconductor layer of the transistor. It is known that a transistor having a metal oxide in a semiconductor layer has a small off-current of the transistor. By using a transistor having a small off-current as a pixel selection transistor, deterioration of display quality can be suppressed even if the display update interval is lengthened. Therefore, when displaying a still image, the number of times the display is updated can be reduced, so that the power consumption can be reduced. The display controller 113b or 122b of the first embodiment is suitable for controlling a selection transistor having a metal oxide in a semiconductor layer. A transistor using a metal oxide as a semiconductor layer will be described in detail in the sixth embodiment.

The transistor having the bottom gate structure exemplified in this embodiment is preferable because the manufacturing process can be reduced. Further, since amorphous silicon can be formed at a lower temperature than polycrystalline silicon at this time, it is possible to use a material having low heat resistance as a material for wiring and electrodes below the semiconductor layer and a material for a substrate. , The range of material choices can be expanded. For example, a glass substrate having an extremely large area can be preferably used. On the other hand, the top gate type transistor is preferable because it is easy to form an impurity region in a self-aligned manner and it is possible to reduce variations in characteristics. At this time, it may be particularly suitable when polycrystalline silicon, single crystal silicon, or the like is used.

[Conductive layer]
Materials that can be used for conductive layers such as transistor gates, sources and drains, as well as various wiring and electrodes that make up display devices include aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, and silver. Examples thereof include a metal such as tantalum or tungsten, or an alloy containing this as a main component. Further, a film containing these materials can be used as a single layer or as a laminated structure. For example, a single-layer structure of an aluminum film containing silicon, a two-layer structure in which an aluminum film is laminated on a titanium film, a two-layer structure in which an aluminum film is laminated on a tungsten film, and a copper film on a copper-magnesium-aluminum alloy film. Two-layer structure to stack, two-layer structure to stack copper film on titanium film, two-layer structure to stack copper film on tungsten film, titanium film or titanium nitride film, and aluminum film or copper film on top of it A three-layer structure, a molybdenum film or a molybdenum nitride film, on which a titanium film or a titanium nitride film is formed, and an aluminum film or a copper film laminated on the film, and a molybdenum film or a molybdenum film or There is a three-layer structure that forms a molybdenum nitride film. Oxides such as indium oxide, tin oxide, and zinc oxide may be used. Further, it is preferable to use copper containing manganese because the controllability of the shape by etching is improved.

Further, examples of the translucent conductive material that can be used for the gate, source and drain of the transistor, as well as the conductive layer such as various wirings and electrodes constituting the display device, include indium oxide and indium tin oxide. Conductive oxides such as indium tin oxide, zinc oxide, zinc oxide added with gallium, or graphene can be used. Alternatively, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, or an alloy material containing the metal material can be used. Alternatively, a nitride of the metal material (for example, titanium nitride) may be used. When a metal material or an alloy material (or a nitride thereof) is used, it may be made thin enough to have translucency. Further, the laminated film of the above material can be used as the conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and an indium tin oxide because the conductivity can be enhanced. These can also be used for a conductive layer such as various wirings and electrodes constituting a display device, and a conductive layer (a conductive layer that functions as a pixel electrode or a common electrode) of a display element.

[Insulation layer]
Insulating materials that can be used for each insulating layer include, for example, resins such as acrylic and epoxy, resins having a siloxane bond, and inorganic insulation such as silicon oxide, silicon oxide nitride, silicon nitride oxide, silicon nitride, and aluminum oxide. Materials can also be used.

Examples of the insulating film having low water permeability include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Further, a silicon oxide film, a silicon nitride film, an aluminum oxide film and the like may be used.

[Liquid crystal element]
As the liquid crystal element, for example, a liquid crystal element to which a vertical alignment (VA: Vertical Alignment) mode is applied can be used. As the vertical orientation mode, an MVA (Multi-Domain Vertical Alignment) mode, a PVA (Patterned Vertical Alignment) mode, an ASV (Advanced Super View) mode and the like can be used.

Further, as the liquid crystal element, a liquid crystal element to which various modes are applied can be used. For example, in addition to the VA mode, a TN (Twisted Nematic) mode, an IPS (In-Plane-Switching) mode, an FFS (Fringe Field Switching) mode, an ASM (Axially Systemic aligned Micro-cell) mode, and an OCere , FLC (Ferroelectric Liquid Crystal) mode, AFLC (Antiferroelectric Liquid Crystal) mode, ECB (Electricularly Controlled Birefringence) mode, guest host mode and the like can be used.

The liquid crystal element is an element that controls the transmission or non-transmission of light by the optical modulation action of the liquid crystal. The optical modulation action of the liquid crystal is controlled by an electric field related to the liquid crystal (including a horizontal electric field, a vertical electric field, or an oblique electric field). The liquid crystal used for the liquid crystal element includes a thermotropic liquid crystal, a low molecular weight liquid crystal, a polymer liquid crystal, a polymer dispersed liquid crystal (PDLC: Polymer Dispersed Liquid Crystal), and a polymer network type liquid crystal (PNLC: Polymer Network Liquid Crystal). A strong dielectric liquid crystal, an anti-strong dielectric liquid crystal, or the like can be used. These liquid crystal materials show a cholesteric phase, a smectic phase, a cubic phase, a chiral nematic phase, an isotropic phase and the like depending on the conditions.

Further, as the liquid crystal material, either a positive type liquid crystal or a negative type liquid crystal may be used, and the optimum liquid crystal material may be used according to the mode and design to which the liquid crystal is applied.

Further, in order to control the orientation of the liquid crystal, an alignment film can be provided. When the transverse electric field method is adopted, a liquid crystal showing a blue phase without using an alignment film may be used. The blue phase is one of the liquid crystal phases, and is a phase that appears immediately before the transition from the cholesteric phase to the isotropic phase when the temperature of the cholesteric liquid crystal is raised. Since the blue phase is expressed only in a narrow temperature range, a liquid crystal composition mixed with a chiral agent of several weight% or more is used for the liquid crystal layer in order to improve the temperature range. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response rate and is optically isotropic. Further, the liquid crystal composition containing the liquid crystal exhibiting the blue phase and the chiral agent does not require an orientation treatment and has a small viewing angle dependence. In addition, since it is not necessary to provide an alignment film, the rubbing process is not required, so that electrostatic breakdown caused by the rubbing process can be prevented, and defects and breakage of the liquid crystal display device during the manufacturing process can be reduced. ..

Further, as the liquid crystal element, there are a transmissive type liquid crystal element, a reflective type liquid crystal element, a semi-transmissive type liquid crystal element and the like.

In one aspect of the present invention, a transmissive liquid crystal element can be particularly preferably used.

When a transmissive type or semi-transmissive type liquid crystal element is used, two polarizing plates are provided so as to sandwich the pair of substrates. In addition, a backlight is provided outside the polarizing plate. The backlight may be a direct type backlight or an edge light type backlight. It is preferable to use a direct-type backlight provided with an LED because local dimming can be facilitated and contrast can be increased. Further, it is preferable to use an edge light type backlight because the thickness of the module including the backlight can be reduced.

By turning off the edge light type backlight, see-through display can be performed.

[Colored layer]
Examples of the material that can be used for the colored layer include a metal material, a resin material, a resin material containing a pigment or a dye, and the like.

[Shading layer]
Examples of the material that can be used as the light-shielding layer include carbon black, titanium black, metal, metal oxide, and a composite oxide containing a solid solution of a plurality of metal oxides. The light-shielding layer may be a film containing a resin material or a thin film of an inorganic material such as metal. Further, as the light-shielding layer, a laminated film of a film containing a material of a colored layer can also be used. For example, a laminated structure of a film containing a material used for a colored layer that transmits light of a certain color and a film containing a material used for a colored layer that transmits light of another color can be used. By using the same material for the colored layer and the light-shielding layer, it is preferable because the device can be shared and the process can be simplified.

The above is a description of each component.

This embodiment can be carried out in combination with at least a part thereof as appropriate in combination with other embodiments described in the present specification.

(Embodiment 3)
In this embodiment, an example of a polycrystalline silicon crystallization method and a laser crystallization apparatus that can be used for the semiconductor layer of a transistor will be described.

In order to form a polycrystalline silicon layer having good crystallinity, it is preferable to provide an amorphous silicon layer on the substrate and irradiate the amorphous silicon layer with laser light to crystallize the amorphous silicon layer. For example, by using a laser beam as a linear beam and moving the substrate while irradiating the amorphous silicon layer with the linear beam, a polycrystalline silicon layer can be formed in a desired region on the substrate.

The method using a linear beam has a relatively good throughput. On the other hand, since the method is to irradiate a certain region a plurality of times while the laser light moves relatively, the crystallinity tends to vary due to the output fluctuation of the laser light and the change of the beam profile caused by the fluctuation. For example, when the semiconductor layer crystallized by the method is used for a transistor included in a pixel of a display device, a random striped pattern due to a variation in crystallinity may appear on the display.

Ideally, the length of the linear beam is equal to or greater than the length of one side of the substrate, but the length of the linear beam is limited by the output of the laser oscillator and the configuration of the optical system. Therefore, in the processing of a large substrate, it is realistic to fold the inside of the substrate surface and irradiate the laser. Therefore, there is a region where the laser beams are overlapped and irradiated. Since the crystallinity of the region is likely to be different from the crystallinity of other regions, display unevenness may occur in the region.

In order to suppress the above-mentioned problems, the amorphous silicon layer formed on the substrate may be locally irradiated with a laser to be crystallized. Local laser irradiation tends to form a polycrystalline silicon layer with little variation in crystallinity.

FIG. 17A is a diagram illustrating a method of locally irradiating an amorphous silicon layer formed on a substrate with a laser.

The laser beam 826 emitted from the optical system unit 821 is reflected by the mirror 822 and incident on the microlens array 823. The microlens array 823 collects the laser beam 826 to form a plurality of laser beams 827.

The substrate 830 on which the amorphous silicon layer 840 is formed is fixed to the stage 815. By irradiating the amorphous silicon layer 840 with a plurality of laser beams 827, a plurality of polycrystalline silicon layers 841 can be formed at the same time.

It is preferable that the individual microlenses included in the microlens array 823 are provided according to the pixel pitch of the display device. Alternatively, the intervals may be an integral multiple of the pixel pitch. In either case, the polycrystalline silicon layer can be formed in the region corresponding to all the pixels by repeating the laser irradiation and the movement of the stage 815 in the X direction or the Y direction.

For example, when the microlens array 823 has M rows and N columns (M and N are natural numbers) microlenses at a pixel pitch, the laser beam is first irradiated at a predetermined start position, and then the M row and N columns polycrystalline silicon layer 841. Can be formed. Then, it is moved in the row direction by the distance of N columns to irradiate the laser beam, and further forms the polycrystalline silicon layer 841 having M rows and N columns to form the polycrystalline silicon layer 841 having M rows and 2N columns. be able to. By repeating this step, a plurality of polycrystalline silicon layers 841 can be formed in a desired region. Further, when the laser irradiation step is performed by turning back, the laser irradiation may be performed by moving the laser irradiation step by the distance of N columns in the row direction, and then the movement of the distance of M rows and the irradiation of the laser beam may be repeated in the column direction.

If the oscillation frequency of the laser beam and the moving speed of the stage 815 are appropriately adjusted, the polycrystalline silicon layer can be formed at the pixel pitch even by the method of irradiating the laser while moving the stage 815 in one direction.

The size of the laser beam 827 can be, for example, an area that includes the entire semiconductor layer of one transistor. Alternatively, the area may be such that the entire channel region of one transistor is included. Alternatively, the area may be such that a part of the channel region of one transistor is included. These may be used properly according to the required electrical characteristics of the transistor.

In the case of a display device having a plurality of transistors in one pixel, the laser beam 827 can have an area that includes the entire semiconductor layer of each transistor in one pixel. Further, the laser beam 827 may have an area that includes the entire semiconductor layer of the transistor having the plurality of pixels.

Further, as shown in FIG. 18A, a mask 824 may be provided between the mirror 822 and the microlens array 823. The mask 824 is provided with a plurality of openings corresponding to each microlens. The shape of the opening can be reflected in the shape of the laser beam 827, and when the mask 824 has a circular opening as shown in FIG. 18A, a circular laser beam 827 can be obtained. Further, when the mask 824 has a rectangular opening, a rectangular laser beam 827 can be obtained. The mask 824 is effective, for example, when it is desired to crystallize only the channel region of the transistor. The mask 824 may be provided between the optical system unit 821 and the mirror 822 as shown in FIG. 18 (B).

FIG. 17B is a perspective view illustrating a main configuration of a laser crystallization apparatus that can be used in the process of local laser irradiation shown above. The laser crystallization apparatus has a moving mechanism 812, a moving mechanism 813, and a stage 815, which are components of the XY stage. It also has a laser oscillator 820 for forming the laser beam 827, an optical system unit 821, a mirror 822, and a microlens array 823.

The moving mechanism 812 and the moving mechanism 813 have a function of making a reciprocating linear motion in the horizontal direction. As a mechanism for giving power to the moving mechanism 812 and the moving mechanism 813, for example, a ball screw mechanism 816 driven by a motor can be used. Since the moving directions of the moving mechanism 812 and the moving mechanism 813 intersect vertically, the stage 815 fixed to the moving mechanism 813 can be freely moved in the X direction and the Y direction.

The stage 815 has a fixing mechanism such as a vacuum suction mechanism, and can fix the substrate 830 or the like. Further, the stage 815 may have a heating mechanism, if necessary. Although not shown, the stage 815 has a pusher pin and a vertical mechanism thereof, and the substrate 830 and the like can be moved up and down when the substrate 830 and the like are carried in and out.

The laser oscillator 820 may be a pulse laser, but may be a CW laser, as long as it can output light having a wavelength and intensity suitable for the purpose of processing. Typically, an excimer laser capable of irradiating ultraviolet light having a wavelength of 351-353 nm (XeF), 308 nm (XeCl) or the like can be used. Alternatively, a double wave (515 nm, 532 nm, etc.) or a triple wave (343 nm, 355 nm, etc.) of a solid-state laser (YAG laser, fiber laser, etc.) may be used. Further, the number of laser oscillators 820 may be plural.

The optical system unit 821 has, for example, a mirror, a beam expander, a beam homogenizer, and the like, and can extend the energy of the laser beam 825 output from the laser oscillator 820 while making the in-plane distribution uniform.

For the mirror 822, for example, a dielectric multilayer mirror can be used, and the mirror is installed so that the incident angle of the laser beam is approximately 45 °. The microlens array 823 may have a shape such that a plurality of convex lenses are provided on the upper surface or the upper and lower surfaces of a quartz plate, for example.

By using the above laser crystallization apparatus, a polycrystalline silicon layer with little variation in crystallinity can be formed.

This embodiment can be carried out in combination with at least a part thereof as appropriate in combination with other embodiments described in the present specification.

(Embodiment 4)
In this embodiment, a hybrid display according to one aspect of the present invention will be described. A display device suitable for displaying a flushing code will be described in detail.

Further, the hybrid display method is a method of displaying a plurality of lights in the same pixel or the same sub-pixel to display characters and / or images. Further, the hybrid display is an aggregate that displays a plurality of lights in the same pixel or the same sub-pixel included in the display unit and displays characters and / or images.

As an example of the hybrid display method, there is a method of displaying the first light and the second light at different display timings in the same pixel or the same sub-pixel. At this time, in the same pixel or the same sub-pixel, the first light and the second light of the same color tone (either red, green, or blue, or any one of cyan, magenta, or yellow) are simultaneously displayed and displayed. Characters and / and images can be displayed in the unit.

Further, as an example of the hybrid display method, there is a method of displaying reflected light and self-luminous light with the same pixel or the same sub-pixel. Reflected light and self-luminous light of the same color tone (for example, OLED light, LED light, etc.) can be simultaneously displayed by the same pixel or the same sub-pixel.

In the hybrid display method, a plurality of lights may be displayed in adjacent pixels or adjacent sub-pixels instead of the same pixel or the same sub-pixel. In addition, displaying the first light and the second light at the same time means displaying the first light and the second light for the same period to the extent that the flicker is not perceived by the human eye, and the human eye. If the flicker is not detected by the sense of, the display period of the first light and the display period of the second light may be different from each other.

Further, the hybrid display is an aggregate having a plurality of display elements in the same pixel or the same sub-pixel, and each of the plurality of display elements displays in the same period. Further, the hybrid display has a plurality of display elements and an active element for driving the display element in the same pixel or the same sub-pixel. Active elements include switches, transistors, thin film transistors and the like. Since the active element is connected to each of the plurality of display elements, the display of each of the plurality of display elements can be individually controlled.

In the present specification and the like, a display that satisfies any one or more of the above configurations is referred to as a hybrid display. The display controller 113b or 122b of the first embodiment can control the hybrid display.

Further, the hybrid display has a plurality of display elements in the same pixel or the same sub-pixel. Examples of the plurality of display elements include a reflective element that reflects light and a self-luminous element that emits light. The reflective element and the self-luminous element can be controlled independently. The hybrid display has a function of displaying characters and / or an image by using one or both of reflected light and self-luminous light in a display unit.

The display device of one aspect of the present invention can have a pixel provided with a first display element that reflects visible light. Alternatively, it may have a pixel provided with a second display element that emits visible light. Alternatively, it may have a pixel provided with a first display element and a second display element. Therefore, the first display element is suitable for displaying a normal display, and the second display element is suitable for displaying a flushing code.

In the present embodiment, a display device including a first display element that reflects visible light and a second display element that emits visible light will be described.

The display device has a function of displaying an image by one or both of the first light reflected by the first display element and the second light emitted by the second display element. Alternatively, the display device has a function of expressing gradation by controlling the amount of first light reflected by the first display element and the amount of second light emitted by the second display element, respectively. Have.

Further, the display device controls the gradation by controlling the amount of light emitted from the first pixel and the second display element, which expresses the gradation by controlling the amount of reflected light of the first display element. It is preferable to have a configuration having a second pixel to be expressed. A plurality of the first pixel and the second pixel are arranged in a matrix, for example, to form a display unit.

Further, it is preferable that the first pixel and the second pixel are arranged in the display area with the same number and the same pitch. At this time, the adjacent first pixel and second pixel can be collectively called a pixel unit. As a result, as will be described later, both the image displayed only by the plurality of first pixels, the image displayed only by the plurality of second pixels, and the plurality of first pixels and the plurality of second pixels. Each of the images displayed in can be displayed in the same display area.

As the first display element included in the first pixel, an element that reflects and displays external light can be used. Since such an element does not have a light source, it is possible to extremely reduce the power consumption at the time of display.

As the first display element, a reflective liquid crystal element can be typically used. Alternatively, as the first display element, in addition to a shutter type MEMS (Micro Electro Electro Mechanical System) element and an optical interference type MEMS element, a microcapsule type, an electrophoresis method, an electrowetting method, and an electronic powder fluid (registered trademark). An element or the like to which a method or the like is applied can be used.

The second display element included in the second pixel has a light source, and an element that displays by using the light from the light source can be used. In particular, it is preferable to use an electroluminescent device that can extract light emission from a luminescent substance by applying an electric field. Since the brightness and chromaticity of the light emitted by such pixels are not affected by external light, high color reproducibility (wide color gamut) and high contrast, that is, vivid display is performed. be able to.

As the second display element, for example, a self-luminous light emitting element such as an OLED, an LED, a QLED (Quantum-dot Light Emitting Diode), or a semiconductor laser can be used. Alternatively, as the display element included in the second pixel, a combination of a backlight as a light source and a transmissive liquid crystal element that controls the amount of transmitted light from the backlight may be used.

The first pixel may be configured to have, for example, a sub-pixel exhibiting white (W), or a sub-pixel exhibiting, for example, three colors of light of red (R), green (G), and blue (B). .. Similarly, the second pixel is also configured to have a sub-pixel exhibiting, for example, white (W), or a sub-pixel exhibiting light of three colors, for example, red (R), green (G), and blue (B). can do. The sub-pixels of the first pixel and the second pixel may have four or more colors. The more types of sub-pixels, the more power consumption can be reduced and the color reproducibility can be improved.

One aspect of the present invention is a first mode in which an image is displayed in a first pixel, a second mode in which an image is displayed in a second pixel, and an image is displayed in the first pixel and the second pixel. The third mode can be switched. Further, it is also possible to input different image signals to each of the first pixel and the second pixel and display a composite image.

The first mode is a mode for displaying an image using the light reflected by the first display element. The first mode is a drive mode with extremely low power consumption because no light source is required. For example, it is effective when the illuminance of the external light is sufficiently high and the external light is white light or light in the vicinity thereof. The first mode is a display mode suitable for displaying character information such as books and documents. In addition, since the reflected light is used, the display can be made gentle on the eyes, and the effect that the eyes are not tired is achieved.

The second mode is a mode in which an image is displayed by utilizing light emission by the second display element. Therefore, extremely vivid (high contrast and high color reproducibility) display can be performed regardless of the illuminance and chromaticity of external light. For example, it is effective when the illuminance of outside light is extremely low, such as at night or in a dark room. In addition, when the outside light is dark, the user may feel dazzling when the display is bright. In order to prevent this, it is preferable to display with reduced brightness in the second mode. As a result, in addition to suppressing glare, power consumption can also be reduced. The second mode is a mode suitable for displaying a vivid image, a smooth moving image, or the like.

The third mode is a mode in which display is performed using both the reflected light by the first display element and the light emission by the second display element. Specifically, it is driven to express one color by mixing the light exhibited by the first pixel and the light exhibited by the second pixel adjacent to the first pixel. It is possible to reduce the power consumption as compared with the second mode while displaying more vividly than the first mode. For example, it is effective when the illuminance of the outside light is relatively low such as under indoor lighting or in the morning or evening time, or when the chromaticity of the outside light is not white.

Hereinafter, a more specific example of one aspect of the present invention will be described with reference to the drawings.

[Display device configuration example]
FIG. 19 is a diagram illustrating a display area 70 included in the display device of one aspect of the present invention. The display area 70 has a plurality of pixel units 75 arranged in a matrix. The pixel unit 75 has a pixel 76 and a pixel 77.

FIG. 19 shows an example in which the pixel 76 and the pixel 77 have display elements corresponding to the three colors of red (R), green (G), and blue (B), respectively.

The pixel 76 has a display element 76R corresponding to red (R), a display element 76G corresponding to green (G), and a display element 76B corresponding to blue (B). The display elements 76R, 76G, and 76B are second display elements that utilize the light of the light source, respectively.

The pixel 77 has a display element 77R corresponding to red (R), a display element 77G corresponding to green (G), and a display element 77B corresponding to blue (B). The display elements 77R, 77G, and 77B are first display elements that utilize the reflection of external light, respectively.

The above is the description of the configuration example of the display device.

[Pixel unit configuration example]
Subsequently, the pixel unit 75 will be described with reference to FIGS. 20 (A), (B), and (C). 20 (A), (B), and (C) are schematic views showing a configuration example of the pixel unit 75.

The pixel 76 has a display element 76R, a display element 76G, and a display element 76B. The display element 76R has a light source, and emits red light RL2 having a brightness corresponding to the gradation value corresponding to the red color included in the second gradation value input to the pixel 76 toward the display surface side. Similarly, the display element 76G and the display element 76B also emit green light GL2 or blue light BL2 toward the display surface side.

The pixel 77 includes a display element 77R, a display element 77G, and a display element 77B. The display element 77R reflects external light and emits red light RL1 having a brightness corresponding to the gradation value corresponding to the red color included in the first gradation value input to the pixel 77 to the display surface side. .. Similarly, the display element 77G and the display element 77B also emit green light GL1 or blue light BL1 toward the display surface side.

[First mode]
FIG. 20A shows an example of an operation mode in which an image is displayed by driving a display element 77R, a display element 77G, and a display element 77B that reflect external light. As shown in FIG. 20A, the pixel unit 75 does not drive the pixel 76, for example, when the illuminance of the external light is sufficiently high, the light from the pixel 77 (light RL1, light GL1, and light). By mixing only BL1), light 79 of a predetermined color can be emitted to the display surface side. As a result, it is possible to drive with extremely low power consumption.

[Second mode]
FIG. 20B shows an example of an operation mode in which the display element 76R, the display element 76G, and the display element 76B are driven to display an image. As shown in FIG. 20B, the pixel unit 75 does not drive the pixel 77, for example, when the illuminance of the external light is extremely small, and the light from the pixel 76 (light RL2, light GL2, and light BL2). ) Can be mixed to emit light 79 of a predetermined color to the display surface side. This makes it possible to perform a vivid display. Further, by lowering the brightness when the illuminance of the outside light is small, it is possible to suppress the glare felt by the user and reduce the power consumption.

[Third mode]
FIG. 20C shows an operation of driving both a display element 77R, a display element 77G, and a display element 77B that reflect external light, and a display element 76R, a display element 76G, and a display element 76B that emit light to display an image. An example of the mode is shown. As shown in FIG. 20C, the pixel unit 75 mixes six lights of light RL1, light GL1, light BL1, light RL2, light GL2, and light BL2 to produce light 79 of a predetermined color. It can be ejected to the display surface side.

Therefore, since the display area 70 shown in FIG. 19 has a light emitting type display element and a reflection type display element in the pixel unit, it is suitable for displaying the selected area. For example, when the display area 70 is displayed by the reflection type display element, the selected area can be displayed by the light emitting type display element. Further, when the display area 70 is displayed by the light emitting type display element, the selected area may be displayed by the reflection type display element. Alternatively, the selected area may be displayed by changing the gradation data of the reflection type display element, or the selected area may be displayed by changing the gradation data of the light emitting type display element.

The above is the description of the configuration example of the pixel unit 75.

This embodiment can be carried out in combination with at least a part thereof as appropriate in combination with other embodiments described in the present specification.

(Embodiment 5)
Hereinafter, a specific example of the configuration of the hybrid display described in the fourth embodiment will be described. The display panel exemplified below is a display panel having both a reflective liquid crystal element and a light emitting element, and capable of displaying both a transmission mode and a reflection mode.

[Configuration example]
FIG. 21A is a block diagram showing an example of the configuration of the display device 400. The display device 400 has a plurality of pixels 410 arranged in a matrix on the display unit 362. Further, the display device 400 has a circuit GD and a circuit SD. Further, it has a plurality of pixels 410 arranged in the direction R, a plurality of wiring GD1 electrically connected to the circuit GD, a plurality of wiring GD2, a plurality of wiring ANOs, and a plurality of wiring CSCOMs. Further, it has a plurality of pixels 410 arranged in the direction C, a plurality of wirings S1 electrically connected to the circuit SD, and a plurality of wirings S2.

Although the configuration having one circuit GD and one circuit SD is shown here for simplicity, the circuit GD and circuit SD for driving the liquid crystal element and the circuit GD and circuit SD for driving the light emitting element are separately separated. It may be provided in.

The pixel 410 has a reflective liquid crystal element and a light emitting element. In the pixel 410, the liquid crystal element and the light emitting element have a portion that overlaps with each other.

FIG. 21 (B1) shows a configuration example of the conductive layer 311b included in the pixel 410. The conductive layer 311b functions as a reflective electrode of the liquid crystal element in the pixel 410. Further, the conductive layer 311b is provided with an opening 451.

In FIG. 21 (B1), the light emitting element 360 located in the region overlapping the conductive layer 311b is shown by a broken line. The light emitting element 360 is arranged so as to overlap with the opening 451 of the conductive layer 311b. As a result, the light emitted by the light emitting element 360 is emitted toward the display surface side through the opening 451.

In FIG. 21 (B1), the pixels 410 adjacent to the direction R are pixels corresponding to different colors. At this time, as shown in FIG. 21 (B1), it is preferable that the openings 451 are provided at different positions of the conductive layer 311b so that the openings 451 are not arranged in a row in the two pixels adjacent to the direction R. As a result, the two light emitting elements 360 can be separated from each other, and the phenomenon that the light emitted by the light emitting element 360 is incident on the colored layer of the adjacent pixels 410 (also referred to as crosstalk) can be suppressed. Further, since the two adjacent light emitting elements 360 can be arranged apart from each other, a high-definition display device can be realized even when the EL layer of the light emitting element 360 is made separately by a shadow mask or the like.

Further, the arrangement may be as shown in FIG. 21 (B2).

If the value of the ratio of the total area of the opening 451 to the total area of the non-opening is too large, the display using the liquid crystal element becomes dark. Further, if the value of the ratio of the total area of the opening 451 to the total area of the non-opening is too small, the display using the light emitting element 360 becomes dark.

Further, if the area of the opening 451 provided in the conductive layer 311b functioning as the reflective electrode is too small, the efficiency of the light that can be extracted from the light emitted by the light emitting element 360 is lowered.

The shape of the opening 451 can be, for example, a polygon, a quadrangle, an ellipse, a circle, a cross, or the like. Further, it may have an elongated streak shape, a slit shape, or a checkered pattern shape. Further, the opening 451 may be arranged close to the adjacent pixel. Preferably, the aperture 451 is placed closer to another pixel displaying the same color. As a result, crosstalk can be suppressed.

[Circuit configuration example]
FIG. 22 is a circuit diagram showing a configuration example of the pixel 410. FIG. 22 shows two adjacent pixels 410.

The pixel 410 includes a switch SW1, a capacitive element C1, a liquid crystal element 340, a switch SW2, a transistor M, a capacitive element C2, a light emitting element 360, and the like. Further, wiring GD1, wiring GD3, wiring ANO, wiring CSCOM, wiring S1 and wiring S2 are electrically connected to the pixel 410. Further, FIG. 22 shows a wiring VCOM1 electrically connected to the liquid crystal element 340 and a wiring VCOM2 electrically connected to the light emitting element 360.

FIG. 22 shows an example in which a transistor is used for the switch SW1 and the switch SW2.

In the switch SW1, the gate is connected to the wiring GD3, one of the source or the drain is connected to the wiring S1, and the other of the source or the drain is connected to one electrode of the capacitive element C1 and one electrode of the liquid crystal element 340. There is. The other electrode of the capacitive element C1 is connected to the wiring CSCOM. The other electrode of the liquid crystal element 340 is connected to the wiring VCOM1.

Further, in the switch SW2, the gate is connected to the wiring GD1, one of the source and the drain is connected to the wiring S2, and the other of the source and the drain is connected to one electrode of the capacitive element C2 and the gate of the transistor M. .. The other electrode of the capacitive element C2 is connected to the wiring CSCOM. In the transistor M, one of the source and the drain is connected to one electrode of the light emitting element 360. The other electrode of the light emitting element 360 is connected to the wiring VCOM2.

FIG. 22 shows an example in which the transistor M has two gates sandwiching the semiconductor and these are connected to each other. As a result, the current that can be passed through the transistor M can be increased.

A signal for controlling the switch SW1 in a conducting state or a non-conducting state can be given to the wiring GD3. A predetermined potential can be applied to the wiring VCOM1. A signal for controlling the orientation state of the liquid crystal of the liquid crystal element 340 can be given to the wiring S1. A predetermined potential can be applied to the wiring CSCOM.

A signal for controlling the switch SW2 in a conducting state or a non-conducting state can be given to the wiring GD1. The wiring VCOM 2 and the wiring ANO can each be provided with a potential that causes a potential difference in which the light emitting element 360 emits light. A signal for controlling the conduction state of the transistor M can be given to the wiring S2.

For example, when displaying the reflection mode, the pixel 410 shown in FIG. 22 is driven by a signal given to the wiring GD3 and the wiring S1, and can be displayed by utilizing optical modulation by the liquid crystal element 340. Further, when the display is performed in the transmission mode, it can be driven by the signals given to the wiring GD1 and the wiring S2, and the light emitting element 360 can be made to emit light for display. Further, when driving in both modes, it can be driven by the signals given to each of the wiring GD1, the wiring GD3, the wiring S1 and the wiring S2.

Note that FIG. 22 shows an example in which one pixel 410 has one liquid crystal element 340 and one light emitting element 360, but the present invention is not limited to this. FIG. 23A shows an example in which one liquid crystal element 340 and four light emitting elements 360 (light emitting elements 360r, 360g, 360b, 360w) are provided in one pixel 410.

In FIG. 23A, in addition to the example of FIG. 22, the wiring GD4 and the wiring S3 are connected to the pixel 410.

In the example shown in FIG. 23 (A), for example, as the four light emitting elements 360, light emitting elements exhibiting red (R), green (G), blue (B), and white (W), respectively, can be used. Further, as the liquid crystal element 340, a reflective liquid crystal element exhibiting white color can be used. As a result, when displaying the reflection mode, it is possible to display white with high reflectance. Further, when the display is performed in the transmission mode, the display with high color rendering property can be performed with low power consumption.

Further, FIG. 23B shows a configuration example of the pixel 410. The pixel 410 has a light emitting element 360w that overlaps with the opening of the electrode 311 and a light emitting element 360r, a light emitting element 360g, and a light emitting element 360b arranged around the electrode 311. It is preferable that the light emitting element 360r, the light emitting element 360g, and the light emitting element 360b have substantially the same light emitting area.

[Display panel configuration example]
FIG. 24 is a schematic perspective view of the display panel 300 according to one aspect of the present invention. The display panel 300 has a configuration in which a substrate 351 and a substrate 361 are bonded together. In FIG. 24, the substrate 361 is clearly indicated by a broken line.

The display panel 300 has a display unit 362, a circuit 364, wiring 365, and the like. The substrate 351 is provided with, for example, a circuit 364, wiring 365, a conductive layer 311b that functions as a pixel electrode, and the like. Further, FIG. 24 shows an example in which the IC 373 and the FPC 372 are mounted on the substrate 351. Therefore, the configuration shown in FIG. 24 can also be said to be a display module having a display panel 300, an FPC 372, and an IC 373.

As the circuit 364, for example, a circuit that functions as a scanning line drive circuit can be used.

The wiring 365 has a function of supplying signals and electric power to the display unit 362 and the circuit 364. The signal or electric power is input to the wiring 365 from the outside or from the IC 373 via the FPC 372.

Further, FIG. 24 shows an example in which the IC 373 is provided on the substrate 351 by a COG (Chip On Glass) method or the like. As the IC 373, an IC having a function as, for example, a scanning line drive circuit or a signal line drive circuit can be applied. When the display panel 300 is provided with a circuit that functions as a scanning line drive circuit and a signal line drive circuit, or if a circuit that functions as a scanning line drive circuit or a signal line drive circuit is provided externally, the display panel 300 is driven via the FPC 372. In the case of inputting a signal for inputting the IC 373, the IC 373 may not be provided. Further, the IC 373 may be mounted on the FPC 372 by a COF (Chip On Film) method or the like.

FIG. 24 shows an enlarged view of a part of the display unit 362. In the display unit 362, conductive layers 311b having a plurality of display elements are arranged in a matrix. The conductive layer 311b has a function of reflecting visible light and functions as a reflecting electrode of the liquid crystal element 340 described later.

Further, as shown in FIG. 24, the conductive layer 311b has an opening. Further, the light emitting element 360 is provided on the substrate 351 side with respect to the conductive layer 311b. The light from the light emitting element 360 is emitted to the substrate 361 side through the opening of the conductive layer 311b.

Further, an input device 366 can be provided on the substrate 361. For example, a sheet-shaped capacitive touch sensor may be provided so as to be superimposed on the display unit 362. Alternatively, a touch sensor may be provided between the substrate 361 and the substrate 351. When a touch sensor is provided between the substrate 361 and the substrate 351, an optical touch sensor using a photoelectric conversion element may be applied in addition to the capacitive touch sensor.

[Cross-section configuration example 1]
FIG. 25 shows an example of a cross section of the display panel illustrated in FIG. 24 when a part of the area including the FPC 372, a part of the area including the circuit 364, and a part of the area including the display unit 362 are cut. ..

The display panel has an insulating layer 220 between the substrate 351 and the substrate 361. Further, a light emitting element 360, a transistor 201, a transistor 205, a transistor 206, a colored layer 262, and the like are provided between the substrate 351 and the insulating layer 220. Further, a liquid crystal element 340, a colored layer 263, and the like are provided between the insulating layer 220 and the substrate 361. Further, the substrate 361 and the insulating layer 220 are adhered to each other via the adhesive layer 143, and the substrate 351 and the insulating layer 220 are adhered to each other via the adhesive layer 142.

The transistor 206 is electrically connected to the liquid crystal element 340, and the transistor 205 is electrically connected to the light emitting element 360. Since both the transistor 205 and the transistor 206 are formed on the surface of the insulating layer 220 on the substrate 351 side, they can be manufactured by using the same process.

The substrate 361 is provided with a colored layer 263, a light-shielding layer 264, an insulating layer 261 and a conductive layer 313 that functions as a common electrode for the liquid crystal element 340, an alignment film 133b, an insulating layer 260, and the like. The insulating layer 260 functions as a spacer for holding the cell gap of the liquid crystal element 340.

Insulating layers such as an insulating layer 211, an insulating layer 212, an insulating layer 213, an insulating layer 214, and an insulating layer 215 are provided on the substrate 351 side of the insulating layer 220. A part of the insulating layer 211 functions as a gate insulating layer of each transistor. The insulating layer 212, the insulating layer 213, and the insulating layer 214 are provided so as to cover each transistor. Further, the insulating layer 215 is provided so as to cover the insulating layer 214. The insulating layer 214 and the insulating layer 215 have a function as a flattening layer. Although the case where the insulating layer covering the transistor or the like has three layers of the insulating layer 212, the insulating layer 213, and the insulating layer 214 is shown here, the case is not limited to this, and four or more layers may be used, or simply. It may be a layer or two layers. Further, the insulating layer 214 that functions as a flattening layer may not be provided if it is unnecessary.

Further, the transistor 201, the transistor 205, and the transistor 206 have a conductive layer 221 partially functioning as a gate, a conductive layer 222 partially functioning as a source or a drain, and a semiconductor layer 231. Here, the same hatching pattern is attached to a plurality of layers obtained by processing the same conductive film.

The liquid crystal element 340 is a reflective liquid crystal element. The liquid crystal element 340 has a laminated structure in which a conductive layer 311a, a liquid crystal 312, and a conductive layer 313 are laminated. Further, a conductive layer 311b that reflects visible light is provided in contact with the substrate 351 side of the conductive layer 311a. The conductive layer 311b has an opening 251. Further, the conductive layer 311a and the conductive layer 313 include a material that transmits visible light. Further, an alignment film 133a is provided between the liquid crystal 312 and the conductive layer 311a, and an alignment film 133b is provided between the liquid crystal 312 and the conductive layer 313.

A light diffusing plate 129 and a polarizing plate 140 are arranged on the outer surface of the substrate 361. A linear polarizing plate may be used as the polarizing plate 140, but a circular polarizing plate may also be used. As the circular polarizing plate, for example, a linear polarizing plate and a 1/4 wavelength retardation plate laminated can be used. Thereby, the reflection of external light can be suppressed. Further, a light diffusing plate 129 is provided to suppress reflection of external light. Further, the desired contrast may be realized by adjusting the cell gap, orientation, drive voltage, etc. of the liquid crystal element used for the liquid crystal element 340 according to the type of the polarizing plate.

In the liquid crystal element 340, the conductive layer 311b has a function of reflecting visible light, and the conductive layer 313 has a function of transmitting visible light. The light incident from the substrate 361 side is polarized by the polarizing plate 140, passes through the conductive layer 313 and the liquid crystal 312, and is reflected by the conductive layer 311b. Then, it passes through the liquid crystal 312 and the conductive layer 313 again and reaches the polarizing plate 140. At this time, the orientation of the liquid crystal can be controlled by the voltage applied between the conductive layer 311b and the conductive layer 313, and the optical modulation of light can be controlled. That is, the intensity of the light emitted through the polarizing plate 140 can be controlled. Further, the light is absorbed by the colored layer 263 other than the specific wavelength region, and the light taken out becomes, for example, red-colored light.

The light emitting element 360 is a bottom emission type light emitting element. The light emitting element 360 has a laminated structure in which the conductive layer 191 and the EL layer 192 and the conductive layer 193b are laminated in this order from the insulating layer 220 side. Further, the conductive layer 193a is provided so as to cover the conductive layer 193b. The conductive layer 193b contains a material that reflects visible light, and the conductive layer 191 and the conductive layer 193a include a material that transmits visible light. The light emitted by the light emitting element 360 is emitted to the substrate 361 side via the colored layer 262, the insulating layer 220, the opening 251 and the conductive layer 313.

Here, as shown in FIG. 25, it is preferable that the opening 251 is provided with a conductive layer 311a that transmits visible light. As a result, since the liquid crystal 312 is oriented in the region overlapping the opening 251 as in the other regions, it is possible to prevent the liquid crystal from misalignment at the boundary between these regions and prevent unintended light leakage.

An insulating layer 217 is provided on the insulating layer 216 that covers the end of the conductive layer 191. The insulating layer 217 has a function as a spacer that prevents the insulating layer 220 and the substrate 351 from coming closer to each other than necessary. Further, when the EL layer 192 and the conductive layer 193a are formed by using a shielding mask (metal mask), the shielding mask may have a function of suppressing contact with the surface to be formed. The insulating layer 217 may not be provided if it is unnecessary.

One of the source and drain of the transistor 205 is electrically connected to the conductive layer 191 of the light emitting element 360 via the conductive layer 224.

One of the source and drain of the transistor 206 is electrically connected to the conductive layer 311b via the connecting portion 207. The conductive layer 311b and the conductive layer 311a are provided in contact with each other, and they are electrically connected to each other. Here, the connecting portion 207 is a portion that connects the conductive layers provided on both sides of the insulating layer 220 via the openings provided in the insulating layer 220.

A connection portion 204 is provided in a region where the substrate 351 and the substrate 361 do not overlap. The connection portion 204 is electrically connected to the FPC 372 via the connection layer 242. The connection portion 204 has the same configuration as the connection portion 207. On the upper surface of the connecting portion 204, the conductive layer obtained by processing the same conductive film as the conductive layer 311a is exposed. As a result, the connection portion 204 and the FPC 372 can be electrically connected via the connection layer 242.

A connecting portion 252 is provided in a part of the region where the adhesive layer 143 is provided. In the connecting portion 252, the conductive layer obtained by processing the same conductive film as the conductive layer 311a and a part of the conductive layer 313 are electrically connected by the connecting body 243. Therefore, the signal or potential input from the FPC 372 connected to the substrate 351 side can be supplied to the conductive layer 313 formed on the substrate 361 side via the connecting portion 252.

As the connecting body 243, for example, conductive particles can be used. As the conductive particles, those obtained by coating the surface of particles such as organic resin or silica with a metal material can be used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. Further, it is preferable to use particles in which two or more kinds of metal materials are coated in a layered manner, such as by further coating nickel with gold. Further, it is preferable to use a material that is elastically deformed or plastically deformed as the connecting body 243. At this time, the connecting body 243, which is a conductive particle, may have a shape that is crushed in the vertical direction as shown in FIG. 25. By doing so, the contact area between the connecting body 243 and the conductive layer electrically connected to the connecting body 243 can be increased, the contact resistance can be reduced, and the occurrence of defects such as poor connection can be suppressed.

The connection body 243 is preferably arranged so as to be covered with the adhesive layer 143. For example, the connecting body 243 may be dispersed in the adhesive layer 143 before curing.

FIG. 25 shows an example in which the transistor 201 is provided as an example of the circuit 364.

In FIG. 25, as an example of the transistor 201 and the transistor 205, a configuration in which the semiconductor layer 231 on which a channel is formed is sandwiched between two gates is applied. One gate is composed of a conductive layer 221 and the other gate is composed of a conductive layer 223 that overlaps with the semiconductor layer 231 via the insulating layer 212. With such a configuration, the threshold voltage of the transistor can be controlled. At this time, the transistor may be driven by connecting two gates and supplying the same signal to them. Such a transistor can increase the field effect mobility as compared with other transistors, and can increase the on-current. As a result, a circuit capable of high-speed driving can be manufactured. Furthermore, the occupied area of the circuit unit can be reduced. By applying a transistor with a large on-current, it is possible to reduce the signal delay in each wiring even if the number of wirings increases when the display panel is enlarged or has high definition, and display unevenness is suppressed. can do.

The transistor included in the circuit 364 and the transistor included in the display unit 362 may have the same structure. Further, the plurality of transistors included in the circuit 364 may all have the same structure, or transistors having different structures may be used in combination. Further, the plurality of transistors included in the display unit 362 may all have the same structure, or transistors having different structures may be used in combination.

For at least one of the insulating layer 212 and the insulating layer 213 covering each transistor, it is preferable to use a material in which impurities such as water and hydrogen do not easily diffuse. That is, the insulating layer 212 or the insulating layer 213 can function as a barrier membrane. With such a configuration, it is possible to effectively suppress the diffusion of impurities from the outside to the transistor, and it is possible to realize a highly reliable display panel.

On the substrate 361 side, an insulating layer 261 is provided so as to cover the colored layer 263 and the light-shielding layer 264. The insulating layer 261 may have a function as a flattening layer. Since the surface of the conductive layer 313 can be made substantially flat by the insulating layer 261, the orientation state of the liquid crystal 312 can be made uniform.

[Cross-section configuration example 2]
The display panel shown in FIG. 26 is an example in which a top gate type transistor is applied to each transistor in the configuration shown in FIG. 25. By applying the top gate type transistor in this way, the parasitic capacitance can be reduced, so that the frame frequency of the display can be increased.

The transistor included in the display device of one aspect of the present invention functions as a conductive layer that functions as a gate electrode, a semiconductor layer, a conductive layer that functions as a source electrode, a conductive layer that functions as a drain electrode, and a gate insulating layer. It has an insulating layer. The structure of the transistor is not particularly limited.

Further, as the semiconductor material used for the transistor, a metal oxide having an energy gap of 2 eV or more, preferably 2.5 eV or more, more preferably 3 eV or more can be used. Typically, an oxide semiconductor containing indium or the like can be used.

A transistor using an oxide semiconductor having a wider bandgap and a smaller carrier density than silicon retains the charge accumulated in the capacitive element connected in series with the transistor for a long period of time due to its low off-current. Is possible.

The semiconductor layer is an In—M—Zn-based oxide, In—M containing, for example, indium, zinc and M (metals such as aluminum, titanium, gallium, germanium, ittrium, zirconium, lanthanum, cerium, tin, neodymium or hafnium). The film may be represented by a system oxide, an M—Zn system oxide, or an In—Zn oxide.

When the oxide semiconductor constituting the semiconductor layer is an In—M—Zn-based oxide, the atomic number ratio of the metal element of the sputtering target used for forming the In—M—Zn oxide is In ≧ M, Zn. It is preferable to satisfy ≧ M. The atomic number ratios of the metal elements of such a sputtering target are In: M: Zn = 1: 1: 1, In: M: Zn = 1: 1: 1.2, In: M: Zn = 3: 1: 1. 2, In: M: Zn = 4: 2: 3, In: M: Zn = 4: 2: 4.1, In: M: Zn = 5: 1: 6, In: M: Zn = 5: 1: 1. 7, In: M: Zn = 5: 1: 8 and the like are preferable. The atomic number ratio of the semiconductor layer to be formed includes a variation of plus or minus 40% of the atomic number ratio of the metal element contained in the sputtering target.

Further, the metal oxide formed of the above-mentioned material or the like can act as a translucent conductor by controlling impurities, oxygen deficiency, and the like. Therefore, in addition to the above-mentioned semiconductor layer, the source electrode, drain electrode, gate electrode, and the like, which are other components of the transistor, are formed of a translucent conductor to form a translucent transistor. Can be done. By using the translucent transistor for the pixels of the display device, the light transmitted through the display element or the light emitted by the display element can be transmitted through the transistor, so that the aperture ratio can be improved.

For example, as in the modified example of the cross-sectional configuration example 1 shown in FIG. 27, the elements constituting the transistors 205, 206 and the connecting portion 207 can be formed of a translucent conductor. From the cross-sectional configuration example 1, the light emitted from the light emitting element 360 can pass through a part or the whole of the transistors 205, 206 and the connection portion 207 by further omitting the conductive layer 311b. Further, the light incident from the substrate 361 side and transmitted through the liquid crystal 312 can be reflected by the conductive layer 193b. In order to improve the reliability of the transistors 205 and 206, one or both of the conductive layer acting as the gate electrode and the conductive layer acting as the back gate electrode are formed of a layer having no translucency such as metal. You may.

Silicon may be used for the semiconductor in which the channel of the transistor is formed. Amorphous silicon may be used as the silicon, but it is particularly preferable to use silicon having crystallinity. For example, it is preferable to use microcrystalline silicon, polycrystalline silicon, single crystal silicon, or the like. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field effect mobility and higher reliability than amorphous silicon.

This embodiment can be carried out in combination with at least a part thereof as appropriate in combination with other embodiments described in the present specification.

(Embodiment 6)
In the present specification and the like, a metal oxide is a metal oxide in a broad expression. Metal oxides are classified into oxide insulators, oxide conductors (including transparent oxide conductors), oxide semiconductors (also referred to as Oxide Semiconductor or simply OS) and the like. For example, when a metal oxide is used for the semiconductor layer of a transistor, the metal oxide may be referred to as an oxide semiconductor. In short, when a metal oxide has at least one of an amplification action, a rectifying action, and a switching action, the metal oxide can be referred to as a metal oxide semiconductor, or OS for short. Further, when the term "OS FET" is used, it can be rephrased as a transistor having a metal oxide or an oxide semiconductor.

Further, in the present specification and the like, a metal oxide having nitrogen may also be collectively referred to as a metal oxide. Further, the metal oxide having nitrogen may be referred to as a metal oxynitride.

Further, in the present specification and the like, it may be described as CAAC (c-axis aligned crystal) and CAC (Cloud-Aligned Company). In addition, CAAC represents an example of a crystal structure, and CAC represents an example of a function or a composition of a material.

Further, in the present specification and the like, the CAC-OS or CAC-metal oxide has a conductive function in a part of the material and an insulating function in a part of the material, and the whole material is used as a semiconductor. Has the function of. When CAC-OS or CAC-metal oxide is used for the semiconductor layer of the transistor, the conductive function is the function of allowing electrons (or holes) to be carriers to flow, and the insulating function is the function of allowing electrons (or holes) to be carriers. It is a function that does not shed. By making the conductive function and the insulating function act in a complementary manner, a switching function (on / off function) can be imparted to the CAC-OS or the CAC-metal oxide. In CAC-OS or CAC-metal oxide, by separating each function, both functions can be maximized.

Further, CAC-OS or CAC-metal oxide is composed of components having different band gaps. For example, CAC-OS or CAC-metal oxide is composed of a component having a wide gap due to an insulating region and a component having a narrow gap due to a conductive region. In the case of this configuration, when the carrier is flown, the carrier mainly flows in the component having a narrow gap. Further, the component having a narrow gap acts complementarily to the component having a wide gap, and the carrier flows to the component having a wide gap in conjunction with the component having a narrow gap. Therefore, when the CAC-OS or CAC-metal oxide is used in the channel region of the transistor, a high current driving force, in short, a large on-current and a high field effect mobility can be obtained in the ON state of the transistor.

That is, the CAC-OS or CAC-metal oxide can also be referred to as a matrix composite or a metal matrix composite.

<CAC-OS configuration>
Hereinafter, the configuration of the CAC-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

The CAC-OS is, for example, a composition of a material in which the elements constituting the oxide semiconductor are unevenly distributed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof. In the following, in the oxide semiconductor, one or more metal elements are unevenly distributed, and the region having the metal elements is 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or a size in the vicinity thereof. The state of being mixed in the above is also referred to as a mosaic shape or a patch shape.

The oxide semiconductor preferably contains at least indium. In particular, it is preferable to contain indium and zinc. In addition to them, aluminum, gallium, yttrium, copper, vanadium, berylium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lantern, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium, etc. One or more kinds selected from may be included.

For example, CAC-OS in In-Ga-Zn oxide (In-Ga-Zn oxide may be particularly referred to as CAC-IGZO in CAC-OS) is an indium oxide (hereinafter, InO). _X1 (X1 is a real number larger than 0), or indium zinc oxide (hereinafter, In _X2 Zn _Y2 O _Z2 (X2, Y2, and Z2 are real numbers larger than 0)) and gallium. With an oxide (hereinafter, GaO _X3 (X3 is a real number larger than 0)) or gallium zinc oxide (hereinafter, Ga _X4 Zn _Y4 O _Z4 (X4, Y4, and Z4 are real numbers larger than 0)). _{In _ _ _} be.

In short, CAC-OS is a composite oxide semiconductor having a structure in which a region containing GaO _X3 as a main component and a region containing In _X2 Zn _Y2 O _Z2 or InO _X1 as a main component are mixed. In the present specification, for example, the atomic number ratio of In to the element M in the first region is larger than the atomic number ratio of In to the element M in the second region. It is assumed that the concentration of In is higher than that in the region 2.

In addition, IGZO is a common name and may refer to one compound consisting of In, Ga, Zn, and O. As a typical example, it is represented by InGaO ₃ (ZnO) _m1 (m1 is a natural number) or In _{(1 + x0)} Ga _(1-x0) O ₃ (ZnO) _m0 (-1≤x0≤1 and m0 is an arbitrary number). Crystalline compounds can be mentioned.

The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. The CAAC structure is a crystal structure in which a plurality of IGZO nanocrystals have a c-axis orientation and are connected without being oriented on the ab plane.

On the other hand, CAC-OS relates to the material composition of oxide semiconductors. CAC-OS is a nanoparticulate region containing In, Ga, Zn, and O, which is partially observed as nanoparticles containing Ga as a main component and a nano portion containing In as a main component. The regions observed in the form of particles refer to a configuration in which the regions are randomly dispersed in a mosaic pattern. Therefore, in CAC-OS, the crystal structure is a secondary element.

The CAC-OS does not include a laminated structure of two or more types of films having different compositions. For example, it does not include a structure consisting of two layers, a film containing In as a main component and a film containing Ga as a main component.

In some cases, a clear boundary cannot be observed between the region containing GaO _X3 as the main component and the region containing In _X2 Zn _Y2 O _Z2 or InO _X1 as the main component.

Instead of gallium, select from aluminum, ittrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium. When one or more of these species are contained, CAC-OS has a region observed in the form of nanoparticles mainly composed of the metal element and a nano portion containing In as a main component. The regions observed in the form of particles refer to a configuration in which the regions are randomly dispersed in a mosaic pattern.

The CAC-OS can be formed by a sputtering method, for example, under the condition that the substrate is not heated. When the CAC-OS is formed by the sputtering method, one or more selected from an inert gas (typically argon), an oxygen gas, and a nitrogen gas may be used as the film forming gas. good. Further, the lower the flow rate ratio of the oxygen gas to the total flow rate of the film-forming gas at the time of film formation is preferable, and for example, the flow rate ratio of the oxygen gas is preferably 0% or more and less than 30%, preferably 0% or more and 10% or less. ..

CAC-OS is characterized in that no clear peak is observed when measured using a θ / 2θ scan by the Out-of-plane method, which is one of the X-ray diffraction (XRD) measurement methods. Have. That is, from the X-ray diffraction, it can be seen that the orientation of the measurement region in the ab plane direction and the c axis direction is not observed.

Further, CAC-OS has an electron beam diffraction pattern obtained by irradiating an electron beam having a probe diameter of 1 nm (also referred to as a nanobeam electron beam) in a ring-shaped high-luminance region and a plurality of bright regions in the ring region. A point is observed. Therefore, from the electron diffraction pattern, it can be seen that the crystal structure of CAC-OS has an nc (nano-crystal) structure having no orientation in the planar direction and the cross-sectional direction.

Further, for example, in CAC-OS in In-Ga-Zn oxide, a region containing GaO _X3 as a main component by EDX mapping obtained by using energy dispersive X-ray spectroscopy (EDX). And, it can be confirmed that In _X2 Zn _Y2 O _Z2 or a region containing InO _X1 as a main component is unevenly distributed and has a mixed structure.

CAC-OS has a structure different from that of the IGZO compound in which metal elements are uniformly distributed, and has properties different from those of the IGZO compound. In short, CAC-OS is a region in which GaO _X3 or the like is the main component and a region in which In _X2 Zn _Y2 O _Z2 or InO _X1 is the main component are phase-separated from each other and each element is the main component. Has a mosaic-like structure.

Here, the region in which In _X2 Zn _Y2 O _Z2 or InO _X1 is the main component is a region having higher conductivity than the region in which GaO _X3 or the like is the main component. In short, the conductivity as an oxide semiconductor is exhibited by the carrier flowing through the region where In _X2 Zn _Y2 O _Z2 or InO _X1 is the main component. Therefore, a high field effect mobility (μ) can be realized by distributing the region containing In _X2 Zn _Y2 O _Z2 or InO _X1 as a main component in the oxide semiconductor in a cloud shape.

On the other hand, the region in which GaO _X3 or the like is the main component is a region having higher insulating properties than the region in which In _X2 Zn _Y2 O _Z2 or InO _X1 is the main component. In short, since the region containing GaO _X3 or the like as a main component is distributed in the oxide semiconductor, leakage current can be suppressed and good switching operation can be realized.

Therefore, when CAC-OS is used for a semiconductor element, the insulating property caused by GaO _X3 and the like and the conductivity caused by In _X2 Zn _Y2 O _Z2 or InO _X1 act in a complementary manner, so that the insulation is high. _On current (Ion) and high field effect mobility (μ) can be realized.

Further, the semiconductor element using CAC-OS has high reliability. Therefore, CAC-OS is most suitable for various semiconductor devices such as displays.

This embodiment can be carried out in combination with at least a part thereof as appropriate in combination with other embodiments described in the present specification.

(Embodiment 7)
In the present embodiment, the electronic device of one aspect of the present invention will be described with reference to the drawings.

FIG. 28A shows, as an example, a vehicle 2001 having an engine that burns fuel or a motor that is controlled by electricity. The car 2001 has an electronic device that receives a first authentication code from the electronic device 110, generates a second authentication code, and displays FCODE. The electronic device 110 can acquire the FCODE and decrypt the second authentication code. The electronic device 110 is authorized to access the vehicle 2001 and will be able to access the management parameters of the vehicle 2001. Therefore, the authentication system described in the first embodiment can be used.

The electronic device 110 can process the image of the car 2001 captured by the image pickup element included in the electronic device 110 into an AR image and display it on the display panel. The user or mechanic of the car 2001 can monitor or manage the state of the car by using the electronic device 110.

FIG. 28B shows, as an example, a large transport vehicle 2002 having an engine that burns fuel or a motor that is controlled by electricity. Since the large transport vehicle 2002 shown in FIG. 28 (B) has the same functions as the vehicle 2001 shown in FIG. 28 (A), the description thereof will be omitted.

FIG. 28C shows, for example, a large transport vehicle 2003 having a motor controlled by electricity or an engine for burning fuel. Since the large transport vehicle 2003 shown in FIG. 28 (C) has the same functions as the vehicle 2001 shown in FIG. 28 (A), the description thereof will be omitted.

FIG. 28D shows, as an example, an aircraft 2004 with an engine that burns fuel. Since the aircraft 2004 shown in FIG. 28 (D) has the same functions as the vehicle 2001 shown in FIG. 28 (A), the description thereof will be omitted.

FIG. 29A shows a wind power generation facility 2005 as an example of a power generation facility. Wind power generation facilities have motors that convert the rotation of wind power into electricity. The wind power generation facility 2005 preferably includes a display panel 2005a for displaying FCODE. Therefore, the authentication system described in the first embodiment can be used.

Alternatively, the display panel 2005a that displays the FCODE when a plurality of wind power generation facilities are integratedly managed may manage the plurality of wind power generation facilities by one FCODE. The electronic device 110 can generate and display an AR image from the image of the wind power generation facility 2005 captured by the image pickup device included in the electronic device 110. Simplify the management of control equipment installed in high places such as wind power generation facilities.

Power generation facilities are not limited to wind power generation facilities. Although not shown, the certification system and communication system using FCODE are large-scale, highly confidential, and safe, such as nuclear power generation facilities, thermal power generation facilities, hydroelectric power generation facilities, wave power generation facilities, and geothermal power generation facilities. It can be applied to facilities where sex is required. Even if there is a large distance between the electronic device 110 and the target facility, an AR image can be generated and displayed from the captured image. Therefore, it is possible to provide an authentication system and a communication system that can easily manage the management parameters of the target facility.

FIG. 29B shows a chemical plant 2006 as an example of a production facility. In a chemical plant, control parameters such as temperature and pressure, or state control parameters are important control items. The control system of the chemical plant 2006 preferably includes a display panel 2006a displaying the FCODE. Therefore, the authentication system described in the first embodiment can be used.

The electronic device 110 can process the image of the chemical plant 2006 captured by the image pickup device included in the electronic device 110 into an AR image and display it. Therefore, it is possible to provide a communication system having an authentication system capable of managing the management parameters of the target facility by the captured image even if there is a distance between a plurality of target facilities.

Production facilities are not limited to chemical plants. Although not shown, the authentication system using FCODE and the communication system shall be applied to electronic equipment production facilities, car production facilities, cloth processing sewing facilities, plant production facilities, food production facilities, etc. Can be done.

The electronic device exemplified in FIG. 30 is provided with a display device of one aspect of the present invention capable of displaying FCODE on the display unit. Therefore, it is an electronic device that realizes high resolution. In addition, it is possible to make an electronic device that has both high resolution and a large screen.

An image having a resolution of, for example, full high-definition, 4K2K, 8K4K, 16K8K, or higher can be displayed on the display unit of the electronic device of one aspect of the present invention. The screen size of the display unit may be 20 inches or more diagonally, 30 inches or more diagonally, 50 inches or more diagonally, 60 inches or more diagonally, or 70 inches or more diagonally.

As electronic devices, for example, relatively large screens such as television devices, desktop or notebook personal computers, monitors for computers, digital signage (electronic signage), large game machines such as pachinko machines, etc. In addition to the electronic devices provided, digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, sound reproduction devices, vending machines, ticket vending machines, etc. can be mentioned.

The electronic device or lighting device of one aspect of the present invention can be incorporated along the inner or outer wall of a house or building, or along the curved surface of the interior or exterior of an automobile.

The electronic device of one aspect of the present invention preferably has an image pickup device (photodiode, optical sensor, image sensor).

The electronic device of one aspect of the present invention may have an antenna. By receiving the signal with the antenna, the display unit can display images, information, and the like. Further, when the electronic device has an antenna and a secondary battery, the antenna may be used for non-contact power transmission.

The electronic device of one aspect of the present invention includes sensors (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, current, It may have the ability to measure voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared rays).

The electronic device of one aspect of the present invention can have various functions. For example, a function to display various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a calendar, a function to display a date or time, a function to execute various software (programs), wireless communication. It can have a function, a function of reading a program or data recorded on a recording medium, and the like.

It is preferable that the electronic device of one aspect of the present invention has a function of detecting FCODE from image data captured by an image pickup device using a neural network.

FIG. 30A shows an example of a television device. In the television device 7100, the display unit 7000 is incorporated in the housing 7101. Here, a configuration in which the housing 7101 is supported by the stand 7103 is shown.

A display device according to one aspect of the present invention can be applied to the display unit 7000.

The operation of the television device 7100 shown in FIG. 30 (A) can be performed by the operation switch provided in the housing 7101 or the remote control operation machine 7111 which is a separate body. Alternatively, the display unit 7000 may be provided with a touch sensor, and may be operated by touching the display unit 7000 with a finger or the like. The remote control operating device 7111 may have a display unit that displays information output from the remote control operating device 7111. The channel and volume can be operated by the operation keys or the touch panel provided on the remote controller 7111, and the image displayed on the display unit 7000 can be operated.

The television device 7100 is configured to include a receiver, a modem, and the like. The receiver can receive general television broadcasts. In addition, by connecting to a wired or wireless communication network via a modem, information communication is performed in one direction (sender to receiver) or two-way (sender and receiver, or between receivers, etc.). It is also possible.

FIG. 30B shows a notebook personal computer 7200. The notebook personal computer 7200 has a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. A display unit 7000 is incorporated in the housing 7211.

A display device according to one aspect of the present invention can be applied to the display unit 7000.

FIGS. 30C and 30D show an example of digital signage (electronic signage).

The digital signage 7300 shown in FIG. 30C has a housing 7301, a display unit 7000, a speaker 7303, and the like. Further, it may have an LED lamp, an operation key (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

Further, FIG. 30 (D) is a digital signage 7400 attached to a columnar pillar 7401. The digital signage 7400 has a display unit 7000 provided along the curved surface of the pillar 7401.

In FIGS. 30C and 30D, the display device of one aspect of the present invention can be applied to the display unit 7000.

The wider the display unit 7000, the more information can be provided at one time. Further, the wider the display unit 7000 is, the easier it is for people to see it, and for example, the advertising effect of the advertisement can be enhanced. Further, it is preferable that the display unit 7000 is provided with a touch panel. By touching a part of the display unit 7000, the user can provide detailed information to the user by using the display area 7001 for a part of the display unit 7000.

By applying the touch panel to the display unit 7000, not only the image or moving image can be displayed on the display unit 7000, but also the user can intuitively operate the display unit 7000, which is preferable. In addition, when used for the purpose of providing information such as route information or traffic information, usability can be improved by intuitive operation.

Further, as shown in FIGS. 30C and 30D, the digital signage 7300 or the digital signage 7400 can be linked with the information terminal 7311 or the information terminal 7411 such as a smartphone owned by the user by wireless communication. Is preferable. For example, the information of the advertisement displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411. Further, by operating the information terminal 7311 or the information terminal 7411, the display of the display unit 7000 can be switched.

Further, the digital signage 7300 or the digital signage 7400 can be made to execute a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller or touch panel). As a result, an unspecified number of users can participate in and enjoy the game at the same time.

FIG. 30E is a perspective view of the mobile information terminal 7500. The mobile information terminal has one or more functions selected from, for example, a telephone, a notebook, an information browsing device, and the like. Specifically, it can be used as a smartphone. The mobile information terminal exemplified in this embodiment can execute various applications such as mobile phone, e-mail, text viewing and creation, music playback, Internet communication, and computer game.

The mobile information terminal 7500 can display characters, image information, and the like on a plurality of surfaces thereof. For example, as shown in FIG. 30E, the three operation keys 7502 can be displayed on one surface, and the information 7503 indicated by a rectangle can be displayed on the other surface. The operation key 7502 is displayed on the display unit 7000 and may be operated via the touch panel. FIG. 30E shows an example in which information is displayed on the side surface of a mobile information terminal. Further, the information may be displayed on three or more sides of the mobile information terminal.

Examples of information include SNS (social networking service) notifications, displays notifying incoming e-mails or telephone calls, titles or senders of e-mails, date and time, time, remaining battery level, and antennas. There is reception strength and so on. Alternatively, an operation key, an icon, or the like may be displayed instead of the information at the position where the information is displayed.

FIG. 30F is a tablet-type personal computer, which includes a housing 7601, a housing 7602, a display unit 7000 according to one aspect of the present invention, an optical sensor 7604, an optical sensor 7605, a switch 7606, and the like. The display unit 7000 is supported by the housing 7601 and the housing 7602. Since the display unit 7000 is formed by using a flexible substrate, it has a function of being able to flexibly bend the shape.

By changing the angle between the housing 7601 and the housing 7602 at the hinges 7607 and 7608, the display unit 7000 can be folded so that the housing 7601 and the housing 7602 overlap. Although not shown, an open / close sensor may be built in and the change in angle may be used as information on usage conditions in a tablet-type personal computer. By using the display unit 7000 according to one aspect of the present invention in a tablet-type personal computer, it is possible to display a high-quality display image on the display unit 7000 regardless of the intensity of external light in the usage environment. Power consumption can also be suppressed.

This embodiment can be carried out in combination with at least a part thereof as appropriate in combination with other embodiments described in the present specification.

BL1 optical BL2 optical C1 capacitive element C2 capacitive element FCD1 display area FCD2 display area G1 wiring G2 wiring G3 wiring GD1 wiring GD2 wiring GD3 wiring GD4 wiring GL1 optical GL2 optical RL1 optical RL2 optical S1 wiring S2 wiring S3 wiring SW1 VCOM2 Wiring 11 Substrate 12 Substrate 20 Liquid crystal element 21 Conductive layer 22 Liquid crystal 23 Conductive layer 24a Alignment film 24b Alignment film 26 Insulation layer 30 Transistor 31 Conductive layer 31a Conductive layer 32 Semiconductor layer 32p Semiconductor layer 33a Conductive layer 33b Conductive layer 33c Conductive layer 33d Conductive layer 34 Insulation layer 35 Impure semiconductor layer 37 Semiconductor layer 38 Connection part 39a Plate plate 39b Plate plate 41 Colored layer 42 Light-shielding layer 60 Capacitive element 70 Display area 75 Pixel unit 76 Pixel 76B Display element 76G Display element 76R Display element 77 Pixel 77B Display element 77G Display element 77R Display element 79 Optical 81 Insulation layer 82 Insulation layer 83 Insulation layer 84 Insulation layer 90 Backlight unit 110 Electronic equipment 111 Communication module 112 Image pickup element 113 Display module 113a Display device 113b Display controller 113c Frame memory 113d Display panel 113e Touch panel 114a Display area 114b Display area 114c Display area 114d Display area 114e Display area 114f Display area 115 Processor 116 Storage device 117 Input device 120 Electronic device 120a Copy machine 121 Communication module 122 Display module 122a Display device 122b Display controller 122c Frame memory 122d Display panel 123 Input device 123a Switch 123b Switch 123c Switch 123d Switch 125 Processor 126 Storage device 129 Optical diffuser 130 Electronic device 131 Scanner device 132 Display module 133 Communication module 133a Alignment film 133b Alignment film 134 Input device 135 Processor 136 Storage device 137 Data Server 140 Plate plate 142 Adhesive layer 143 Adhesive layer 150 Display area 150a Display area 160a Substrate 160b Substrate 160c Substrate 161a Electronic component 161b Electronic component 162 Light emitting element 163 Imaging element 191 Conductive layer 192 EL layer 193a Conductive layer 193b Conductive layer 201 Transistor 204 Connection 205 Transistor 206 Transistor 207 Connection 211 Insulation layer 212 Insulation layer 213 Insulation layer 214 Insulation layer 215 Insulation layer 216 Insulation layer 217 Insulation layer 220 Insulation layer 221 Conductive layer 222 Conductive layer 223 Conductive layer 224 Conductive layer 231 Semiconductor layer 242 Connection layer 243 Connection body 251 Opening 252 Connection part 260 Insulation layer 261 Insulation layer 262 Colored layer 263 Colored layer 264 Light-shielding layer 300 Display panel 311 Electrode 311a Conductive layer 311b Conductive layer 312 Liquid crystal 313 Conductive layer 340 Liquid crystal element 351 Substrate 360 Light emitting element 360b Light emitting element 360g Light emitting element 360r Light emitting element 360w Light emitting element 361 Board 362 Display unit 365 Wiring 366 Input device 372 FPC
373 IC
400 Display device 410 Pixel 451 Opening 812 Moving mechanism 813 Moving mechanism 815 Stage 816 Ball screw mechanism 820 Laser oscillator 821 Optical system unit 822 Mirror 823 Microlens array 824 Mask 825 Laser light 828 Laser light 827 Laser beam 830 Substrate 840 Amorphous silicon layer 841 Polycrystalline Silicon Layer 1100 Display Device 2001 Car 2002 Transport Vehicle 2003 Transport Vehicle 2004 Aircraft 2005 Wind Power Facility 2005a Display Panel 2006 Chemical Plant 2006a Display Panel 7000 Display Area 7001 Display Area 7100 Television Device 7101 Housing 7103 Stand 7111 Remote Control Operator 7200 Notebook personal computer 7211 chassis 7212 keyboard 7213 pointing device 7214 external connection port 7300 digital signage 7301 chassis 7303 speaker 7311 information terminal 7400 digital signage 7401 pillar 7411 information terminal 7500 mobile information terminal 7502 operation key 7503 information 7601 chassis 7602 Housing 7604 Optical sensor 7605 Optical sensor 7606 Switch 7607 Hing

Claims (2)

An authentication system having a first electronic device and a second electronic device.
The first electronic device has a display panel and an electric motor powered by electricity.
The second electronic device includes an image pickup device and a neural network.
The first electronic device and the second electronic device have a first authentication code and have a first authentication code.
The neural network has a function of detecting features of an image and has a function of detecting the features of the image.
The first electronic device has a function of encoding the first authentication code into a display code.
The first electronic device has a function of displaying the display code on the display panel.
The second electronic device has a function of capturing the display code by the image pickup element.
The second electronic device detects the display code from the image captured by the neural network.
The second electronic device has a function of decrypting the second authentication code from the display code.
The second electronic device has a function of determining a match between the first authentication code of the second electronic device and the decrypted second authentication code.
As a result of the above determination, if they match, the first electronic device has a function of permitting access from the second electronic device.
An authentication system having a function that the first electronic device does not allow the access from the second electronic device when the results of the determination do not match. A communication system having a first electronic device and a second electronic device.
The first electronic device has a display panel and an electric motor powered by electricity.
The second electronic device includes an image pickup device and a neural network.
The first electronic device has communication data and has communication data.
The neural network has a function of detecting features of an image and has a function of detecting the features of the image.
The first electronic device has a function of encoding the communication data into a display code, and has a function of encoding the communication data into a display code.
The first electronic device has a function of displaying the display code on the display panel.
The second electronic device has a function of capturing the display code by the image pickup element.
The second electronic device detects the display code from the image captured by the neural network.
The second electronic device is a communication system having a function of decoding the communication data from the display code.

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