WO2018155440A1 - Method for filming resin film, and mask - Google Patents
Method for filming resin film, and mask Download PDFInfo
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- WO2018155440A1 WO2018155440A1 PCT/JP2018/006003 JP2018006003W WO2018155440A1 WO 2018155440 A1 WO2018155440 A1 WO 2018155440A1 JP 2018006003 W JP2018006003 W JP 2018006003W WO 2018155440 A1 WO2018155440 A1 WO 2018155440A1
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- mask
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- film
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- 239000011347 resin Substances 0.000 title claims abstract description 113
- 229920005989 resin Polymers 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 104
- 239000000463 material Substances 0.000 claims abstract description 97
- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 14
- 239000004925 Acrylic resin Substances 0.000 description 31
- 229920000178 Acrylic resin Polymers 0.000 description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 24
- 239000002313 adhesive film Substances 0.000 description 24
- 230000008016 vaporization Effects 0.000 description 15
- 238000005755 formation reaction Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000009834 vaporization Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- 239000006200 vaporizer Substances 0.000 description 7
- 239000012159 carrier gas Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
Definitions
- One end of a resin material bypass pipe 113 (second pipe) having a valve 113V is connected to a position closer to the vaporizer 300 than the valve 112V of the resin material supply pipe 112 (first pipe).
- the other end of the resin material bypass pipe 113 (second pipe) is connected to the outside through an exhaust pipe 114, and gas can be exhausted through the resin material bypass pipe 113.
Abstract
This method for forming a patterned resin film on a substrate involves, in order, at least: a first step in which a mask is used having a mask main body structured such that a flexible support part and an adhesive part overlap, and the mask is disposed such that the adhesive part contacts the substrate; a second step in which a gasified resin material is supplied to the substrate through an opening provided in the mask main body and is condensed on the substrate, and, after formation of the liquid resin material film on the substrate, the resin material film and the mask are irradiated with UV light; and a third step in which the mask is separated from the substrate.
Description
本発明は、低コスト化および作業の簡単化を図ることが可能な、樹脂膜の形成方法と、樹脂膜の形成において有効な構成を備えたマスクに関する。
本願は、２０１７年２月２１日に日本に出願された特願２０１７－０３０３２０号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a resin film forming method capable of reducing costs and simplifying operations, and a mask having a configuration effective in forming a resin film.
This application claims priority based on Japanese Patent Application No. 2017-030320 for which it applied to Japan on February 21, 2017, and uses the content here.
本願は、２０１７年２月２１日に日本に出願された特願２０１７－０３０３２０号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a resin film forming method capable of reducing costs and simplifying operations, and a mask having a configuration effective in forming a resin film.
This application claims priority based on Japanese Patent Application No. 2017-030320 for which it applied to Japan on February 21, 2017, and uses the content here.
高分子有機物からなる樹脂膜の製法としては、蒸着重合法や紫外線硬化法が広く用いられている。この２つの製法は何れも、減圧された処理槽内に低分子の有機物ガスを導入し、被処理体上に供給された樹脂材料が重合反応を起し、高分子の樹脂膜を被処理体の表面上に形成する方法であり、被処理体の表面に対する樹脂膜のカバレッジ（被覆率）が良いという特長がある。特許文献１には、これに適した成膜装置が開示されている。
As a method for producing a resin film made of a polymer organic material, a vapor deposition polymerization method or an ultraviolet curing method is widely used. In each of these two manufacturing methods, a low molecular organic gas is introduced into a decompressed treatment tank, the resin material supplied onto the object to be polymerized undergoes a polymerization reaction, and a polymer resin film is formed on the object to be processed. The method has a feature that the coverage (coverage) of the resin film on the surface of the object to be processed is good. Patent Document 1 discloses a film forming apparatus suitable for this.
図７にメタルマスクを用いて樹脂膜を成膜するプロセスを示す。樹脂膜の代表例としてアクリル樹脂膜を例示する。
まず、基板Ｓに対して無機保護膜形成などの前処理を施した後、成膜室内へ基板Ｓを移動する（ＳＸ１、ＳＸ２）。 FIG. 7 shows a process for forming a resin film using a metal mask. An acrylic resin film is illustrated as a representative example of the resin film.
First, after pre-processing such as formation of an inorganic protective film is performed on the substrate S, the substrate S is moved into the deposition chamber (SX1, SX2).
まず、基板Ｓに対して無機保護膜形成などの前処理を施した後、成膜室内へ基板Ｓを移動する（ＳＸ１、ＳＸ２）。 FIG. 7 shows a process for forming a resin film using a metal mask. An acrylic resin film is illustrated as a representative example of the resin film.
First, after pre-processing such as formation of an inorganic protective film is performed on the substrate S, the substrate S is moved into the deposition chamber (SX1, SX2).
成膜室内（減圧雰囲気）において、図８～図１０に示すように、所望の開口部を設けたメタルマスクＭＸを基板Ｓの被成膜面上に配置する（ＳＸ３）。これにより、開口部の位置にある基板Ｓの被成膜面は、図１０に示すように、露呈された状態となる。
次に、図１１に示すように、メタルマスクＭＸを介して、アクリル材料膜ｆを基板Ｓの上に形成する（ＳＸ４）。アクリル材料膜ｆは、基板Ｓを被覆する部位ｆ１と、部位ｆ１に連なりメタルマスクＭＸを被覆する部位ｆ２と、から構成される［図１１Ｂ］。 In the film forming chamber (depressurized atmosphere), as shown in FIGS. 8 to 10, a metal mask MX provided with a desired opening is placed on the film forming surface of the substrate S (SX3). Thereby, the film-forming surface of the substrate S at the position of the opening is exposed as shown in FIG.
Next, as shown in FIG. 11, an acrylic material film f is formed on the substrate S through the metal mask MX (SX4). The acrylic material film f includes a part f1 that covers the substrate S and a part f2 that continues to the part f1 and covers the metal mask MX [FIG. 11B].
次に、図１１に示すように、メタルマスクＭＸを介して、アクリル材料膜ｆを基板Ｓの上に形成する（ＳＸ４）。アクリル材料膜ｆは、基板Ｓを被覆する部位ｆ１と、部位ｆ１に連なりメタルマスクＭＸを被覆する部位ｆ２と、から構成される［図１１Ｂ］。 In the film forming chamber (depressurized atmosphere), as shown in FIGS. 8 to 10, a metal mask MX provided with a desired opening is placed on the film forming surface of the substrate S (SX3). Thereby, the film-forming surface of the substrate S at the position of the opening is exposed as shown in FIG.
Next, as shown in FIG. 11, an acrylic material film f is formed on the substrate S through the metal mask MX (SX4). The acrylic material film f includes a part f1 that covers the substrate S and a part f2 that continues to the part f1 and covers the metal mask MX [FIG. 11B].
次いで、アクリル材料膜ｆに紫外線（ＵＶ）照射して、アクリル材料膜ｆを硬化してアクリル樹脂膜Ｆを形成した後、図１２に示すように、メタルマスクＭＸを矢印の方向へ移動させることにより、メタルマスクＭＸを基板Ｓから剥離する（ＳＸ５、ＳＸ６）。メタルマスクＭＸは、一回の成膜後、もしくは、基板を入れ替えて複数回使用された（複数回の成膜が行われた）後、クリーニングされて、再使用される。
このような装置では、メタルマスクＭＸをクリーニングする設備が必要となる。さらに、真空中でメタルマスクＭＸと基板を位置合わせするアライメント機構が必要となる。 Next, the acrylic material film f is irradiated with ultraviolet rays (UV) to cure the acrylic material film f to form the acrylic resin film F, and then the metal mask MX is moved in the direction of the arrow as shown in FIG. Thus, the metal mask MX is peeled from the substrate S (SX5, SX6). The metal mask MX is cleaned and reused after a single film formation or after being used a plurality of times by changing the substrate (a plurality of film formations are performed).
Such an apparatus requires equipment for cleaning the metal mask MX. Furthermore, an alignment mechanism for aligning the metal mask MX and the substrate in a vacuum is required.
このような装置では、メタルマスクＭＸをクリーニングする設備が必要となる。さらに、真空中でメタルマスクＭＸと基板を位置合わせするアライメント機構が必要となる。 Next, the acrylic material film f is irradiated with ultraviolet rays (UV) to cure the acrylic material film f to form the acrylic resin film F, and then the metal mask MX is moved in the direction of the arrow as shown in FIG. Thus, the metal mask MX is peeled from the substrate S (SX5, SX6). The metal mask MX is cleaned and reused after a single film formation or after being used a plurality of times by changing the substrate (a plurality of film formations are performed).
Such an apparatus requires equipment for cleaning the metal mask MX. Furthermore, an alignment mechanism for aligning the metal mask MX and the substrate in a vacuum is required.
本発明は、上述した事情に鑑みてなされたもので、マスクを用いた樹脂膜の形成において、低コスト化および作業の簡単化を図ることが可能な、樹脂膜の形成方法を提供することを目的とする。
The present invention has been made in view of the above-described circumstances, and provides a method for forming a resin film capable of reducing the cost and simplifying the operation in forming a resin film using a mask. Objective.
本発明の第１態様に係る樹脂膜の形成方法は、基板上にパターニングされた樹脂膜を形成する方法であって、マスク本体が可撓性（フィルム状）の支持部と接着部とが重なった構造を有するマスクを用い、前記基板（被成膜面）に対して前記接着部が接するように前記マスクを設ける第１工程（工程α）と、前記マスク本体に設けた開口部を通して前記基板（被成膜面）に気化した樹脂材料を供給し該基板上で凝縮させ、該基板上に液状の樹脂材料膜を形成した後、該樹脂材料膜と前記マスクにＵＶ光を照射する第２工程（工程β）と、前記基板から前記マスクを剥離する第３工程（工程γ）と、を少なくとも順に備える。
本発明の第１態様に係る樹脂膜の形成方法においては、前記接着部としてＵＶ光の照射により前記基板に対する粘着性が低下する部材を用いてもよい。
本発明の第１態様に係る樹脂膜の形成方法においては、前記樹脂材料膜の厚さが前記接着部の厚さを超えないように制御してもよい。
本発明の第１態様に係る樹脂膜の形成方法においては、前記第１工程と前記第３工程は大気圧雰囲気において行われ、前記第２工程は減圧雰囲気において行われてもよい。 The method for forming a resin film according to the first aspect of the present invention is a method for forming a patterned resin film on a substrate, wherein the mask main body overlaps a flexible (film-like) support portion and an adhesive portion. A first step (step α) in which the mask is provided so that the adhesive portion is in contact with the substrate (film formation surface) using a mask having a structure, and the substrate through the opening provided in the mask body A vaporized resin material is supplied to the (deposition surface), condensed on the substrate, a liquid resin material film is formed on the substrate, and then the resin material film and the mask are irradiated with UV light. The process (process (beta)) and the 3rd process (process (gamma)) which peels the said mask from the said board | substrate are provided at least in order.
In the method for forming a resin film according to the first aspect of the present invention, a member whose adhesiveness to the substrate is reduced by irradiation with UV light may be used as the adhesive portion.
In the method for forming a resin film according to the first aspect of the present invention, the thickness of the resin material film may be controlled so as not to exceed the thickness of the adhesive portion.
In the method for forming a resin film according to the first aspect of the present invention, the first step and the third step may be performed in an atmospheric pressure atmosphere, and the second step may be performed in a reduced pressure atmosphere.
本発明の第１態様に係る樹脂膜の形成方法においては、前記接着部としてＵＶ光の照射により前記基板に対する粘着性が低下する部材を用いてもよい。
本発明の第１態様に係る樹脂膜の形成方法においては、前記樹脂材料膜の厚さが前記接着部の厚さを超えないように制御してもよい。
本発明の第１態様に係る樹脂膜の形成方法においては、前記第１工程と前記第３工程は大気圧雰囲気において行われ、前記第２工程は減圧雰囲気において行われてもよい。 The method for forming a resin film according to the first aspect of the present invention is a method for forming a patterned resin film on a substrate, wherein the mask main body overlaps a flexible (film-like) support portion and an adhesive portion. A first step (step α) in which the mask is provided so that the adhesive portion is in contact with the substrate (film formation surface) using a mask having a structure, and the substrate through the opening provided in the mask body A vaporized resin material is supplied to the (deposition surface), condensed on the substrate, a liquid resin material film is formed on the substrate, and then the resin material film and the mask are irradiated with UV light. The process (process (beta)) and the 3rd process (process (gamma)) which peels the said mask from the said board | substrate are provided at least in order.
In the method for forming a resin film according to the first aspect of the present invention, a member whose adhesiveness to the substrate is reduced by irradiation with UV light may be used as the adhesive portion.
In the method for forming a resin film according to the first aspect of the present invention, the thickness of the resin material film may be controlled so as not to exceed the thickness of the adhesive portion.
In the method for forming a resin film according to the first aspect of the present invention, the first step and the third step may be performed in an atmospheric pressure atmosphere, and the second step may be performed in a reduced pressure atmosphere.
本発明の第２態様に係るマスクは、マスク本体に設けた開口部を通して基板に液状の樹脂材料膜を形成した後、該樹脂材料膜を重合させて、該基板上に樹脂膜を形成するためのマスクであって、前記マスク本体は可撓性（フィルム状）の支持部に接着部が重なった構造を有し、前記接着部はＵＶ光の照射によって前記基板に対する粘着性が低下する部材である。
本発明の第２態様に係るマスクにおいては、前記接着部の厚さが、前記基板上に形成される樹脂材料膜の厚さに比べて大きくてもよい。 In the mask according to the second aspect of the present invention, a liquid resin material film is formed on a substrate through an opening provided in the mask body, and then the resin material film is polymerized to form a resin film on the substrate. The mask body has a structure in which an adhesive part overlaps a flexible (film-like) support part, and the adhesive part is a member whose adhesiveness to the substrate is reduced by irradiation with UV light. is there.
In the mask according to the second aspect of the present invention, the thickness of the adhesive portion may be larger than the thickness of the resin material film formed on the substrate.
本発明の第２態様に係るマスクにおいては、前記接着部の厚さが、前記基板上に形成される樹脂材料膜の厚さに比べて大きくてもよい。 In the mask according to the second aspect of the present invention, a liquid resin material film is formed on a substrate through an opening provided in the mask body, and then the resin material film is polymerized to form a resin film on the substrate. The mask body has a structure in which an adhesive part overlaps a flexible (film-like) support part, and the adhesive part is a member whose adhesiveness to the substrate is reduced by irradiation with UV light. is there.
In the mask according to the second aspect of the present invention, the thickness of the adhesive portion may be larger than the thickness of the resin material film formed on the substrate.
本発明の態様に係る樹脂膜の形成方法は、樹脂膜を形成する前にマスクを基板に配置する作業や、樹脂を形成した後にマスクを基板から剥離する作業を、大気圧雰囲気で行うことができる。これにより、従来の製法においては必須であった、減圧雰囲気における基板に対するマスクの配置および剥離の作業が、本発明の態様においては不要となる。
ゆえに、本発明の態様は、マスクを用いた樹脂膜の形成において、低コスト化および作業の簡単化を図ることが可能な、樹脂膜の形成方法をもたらす。 In the method for forming a resin film according to an aspect of the present invention, the operation of placing the mask on the substrate before forming the resin film and the operation of peeling the mask from the substrate after forming the resin are performed in an atmospheric pressure atmosphere. it can. Thereby, the arrangement | positioning and peeling of the mask with respect to the board | substrate in a pressure-reduced atmosphere which were essential in the conventional manufacturing method become unnecessary in the aspect of this invention.
Therefore, an aspect of the present invention provides a method for forming a resin film that can reduce costs and simplify operations in forming a resin film using a mask.
ゆえに、本発明の態様は、マスクを用いた樹脂膜の形成において、低コスト化および作業の簡単化を図ることが可能な、樹脂膜の形成方法をもたらす。 In the method for forming a resin film according to an aspect of the present invention, the operation of placing the mask on the substrate before forming the resin film and the operation of peeling the mask from the substrate after forming the resin are performed in an atmospheric pressure atmosphere. it can. Thereby, the arrangement | positioning and peeling of the mask with respect to the board | substrate in a pressure-reduced atmosphere which were essential in the conventional manufacturing method become unnecessary in the aspect of this invention.
Therefore, an aspect of the present invention provides a method for forming a resin film that can reduce costs and simplify operations in forming a resin film using a mask.
本発明の態様に係るマスクは、マスク本体が可撓性（フィルム状）の支持部と接着部とが重なった構造を有し、接着部はＵＶ光の照射によって基板に対する粘着性が低下する部材から構成されている。これにより、樹脂膜の形成後に行われる、基板からマスクを除去する作業が容易となる。また、マスクを除去した際に生じる、マスクに隣接する部分（マスク端とも呼ぶ）において樹脂膜の膜厚が局所的に増加する現象（図１２Ｂに示すような急峻な凸部の発生）が抑制される。
したがって、本発明の態様によれば、樹脂膜の膜厚ムラが小さく、均一な膜厚の樹脂膜を実現する。このような樹脂膜の用途としては、例えば、フレキシブルディスプレイの封止膜に好適に用いられる。 The mask according to the aspect of the present invention has a structure in which the mask body has a structure in which a flexible (film-like) support portion and an adhesive portion overlap each other, and the adhesive portion is a member whose adhesiveness to the substrate is reduced by irradiation with UV light. It is composed of Thereby, the operation | work which removes a mask from a board | substrate performed after formation of a resin film becomes easy. In addition, the phenomenon (the generation of steep convex portions as shown in FIG. 12B) that occurs when the mask is removed and the thickness of the resin film locally increases in a portion adjacent to the mask (also referred to as a mask edge) is suppressed. Is done.
Therefore, according to the aspect of the present invention, a resin film having a uniform film thickness can be realized with small film thickness unevenness. For example, the resin film is preferably used as a sealing film for a flexible display.
したがって、本発明の態様によれば、樹脂膜の膜厚ムラが小さく、均一な膜厚の樹脂膜を実現する。このような樹脂膜の用途としては、例えば、フレキシブルディスプレイの封止膜に好適に用いられる。 The mask according to the aspect of the present invention has a structure in which the mask body has a structure in which a flexible (film-like) support portion and an adhesive portion overlap each other, and the adhesive portion is a member whose adhesiveness to the substrate is reduced by irradiation with UV light. It is composed of Thereby, the operation | work which removes a mask from a board | substrate performed after formation of a resin film becomes easy. In addition, the phenomenon (the generation of steep convex portions as shown in FIG. 12B) that occurs when the mask is removed and the thickness of the resin film locally increases in a portion adjacent to the mask (also referred to as a mask edge) is suppressed. Is done.
Therefore, according to the aspect of the present invention, a resin film having a uniform film thickness can be realized with small film thickness unevenness. For example, the resin film is preferably used as a sealing film for a flexible display.
以下、本発明の一実施形態に係る樹脂膜の形成方法と、この樹脂膜の形成において有効な構成を備えたマスクを、図面に基づいて説明する。樹脂膜の一例としてアクリル樹脂を例示する。
Hereinafter, a method for forming a resin film according to an embodiment of the present invention and a mask having a configuration effective in forming the resin film will be described with reference to the drawings. An acrylic resin is illustrated as an example of the resin film.
＜アクリル樹脂膜の形成方法＞
図１は、本発明の一実施形態に係るアクリル樹脂膜の作製工程を示すフローチャートであり、アクリル樹脂膜の形成方法は、工程ＳＡ１～工程ＳＡ７の７つの工程から構成される。
工程ＳＡ２～工程ＳＡ３はアクリル樹脂膜を形成する前にマスクを基板に配置する工程（作業）であり、工程ＳＡ６～工程ＳＡ７はアクリルを樹脂形成した後にマスクを基板から剥離する工程（作業）である。これらの作業は全て、後述する粘着フィルムマスクを用いることにより、成膜室外（大気圧雰囲気）において行うことができる。これらの２つの作業の間に位置する、工程ＳＡ４～工程ＳＡ５は基板上にアクリル樹脂膜を形成する工程（作業）であり、この作業のみ成膜室内（減圧雰囲気）において行なわれる。ゆえに、本発明の実施形態によれば、従来の製法においては必須であった、減圧雰囲気における基板に対するマスクの配置および剥離の作業が不要となる。このため、マスクを用いたアクリル樹脂膜の形成において、低コスト化および作業の簡単化を図ることが可能となる。 <Method for forming acrylic resin film>
FIG. 1 is a flowchart showing a process for producing an acrylic resin film according to an embodiment of the present invention, and the method for forming an acrylic resin film is composed of seven processes SA1 to SA7.
Steps SA2 to SA3 are steps (work) for placing the mask on the substrate before forming the acrylic resin film. Steps SA6 to SA7 are steps (work) for peeling the mask from the substrate after forming the acrylic resin. is there. All of these operations can be performed outside the deposition chamber (atmospheric pressure atmosphere) by using an adhesive film mask described later. Steps SA4 to SA5, which are located between these two operations, are steps (operations) for forming an acrylic resin film on the substrate, and only this operation is performed in the film forming chamber (reduced pressure atmosphere). Therefore, according to the embodiment of the present invention, it is not necessary to arrange and peel the mask on the substrate in a reduced pressure atmosphere, which is essential in the conventional manufacturing method. For this reason, in the formation of the acrylic resin film using the mask, it is possible to reduce the cost and simplify the operation.
図１は、本発明の一実施形態に係るアクリル樹脂膜の作製工程を示すフローチャートであり、アクリル樹脂膜の形成方法は、工程ＳＡ１～工程ＳＡ７の７つの工程から構成される。
工程ＳＡ２～工程ＳＡ３はアクリル樹脂膜を形成する前にマスクを基板に配置する工程（作業）であり、工程ＳＡ６～工程ＳＡ７はアクリルを樹脂形成した後にマスクを基板から剥離する工程（作業）である。これらの作業は全て、後述する粘着フィルムマスクを用いることにより、成膜室外（大気圧雰囲気）において行うことができる。これらの２つの作業の間に位置する、工程ＳＡ４～工程ＳＡ５は基板上にアクリル樹脂膜を形成する工程（作業）であり、この作業のみ成膜室内（減圧雰囲気）において行なわれる。ゆえに、本発明の実施形態によれば、従来の製法においては必須であった、減圧雰囲気における基板に対するマスクの配置および剥離の作業が不要となる。このため、マスクを用いたアクリル樹脂膜の形成において、低コスト化および作業の簡単化を図ることが可能となる。 <Method for forming acrylic resin film>
FIG. 1 is a flowchart showing a process for producing an acrylic resin film according to an embodiment of the present invention, and the method for forming an acrylic resin film is composed of seven processes SA1 to SA7.
Steps SA2 to SA3 are steps (work) for placing the mask on the substrate before forming the acrylic resin film. Steps SA6 to SA7 are steps (work) for peeling the mask from the substrate after forming the acrylic resin. is there. All of these operations can be performed outside the deposition chamber (atmospheric pressure atmosphere) by using an adhesive film mask described later. Steps SA4 to SA5, which are located between these two operations, are steps (operations) for forming an acrylic resin film on the substrate, and only this operation is performed in the film forming chamber (reduced pressure atmosphere). Therefore, according to the embodiment of the present invention, it is not necessary to arrange and peel the mask on the substrate in a reduced pressure atmosphere, which is essential in the conventional manufacturing method. For this reason, in the formation of the acrylic resin film using the mask, it is possible to reduce the cost and simplify the operation.
以下では、図１のフローチャートに示した各工程（工程ＳＡ１～工程ＳＡ７）について、図２～図６を用いて詳細に説明する。
図２は、本発明の実施形態において用いる粘着フィルムマスクを基板に配置する前の断面図である。図３は、粘着フィルムマスクの平面図である。図４Ａ及び図４Ｂは、基板に粘着フィルムマスクを配置した状態を示す断面図である。 Hereinafter, each step (step SA1 to step SA7) shown in the flowchart of FIG. 1 will be described in detail with reference to FIGS.
FIG. 2 is a cross-sectional view before the adhesive film mask used in the embodiment of the present invention is arranged on the substrate. FIG. 3 is a plan view of the adhesive film mask. 4A and 4B are cross-sectional views showing a state in which an adhesive film mask is arranged on a substrate.
図２は、本発明の実施形態において用いる粘着フィルムマスクを基板に配置する前の断面図である。図３は、粘着フィルムマスクの平面図である。図４Ａ及び図４Ｂは、基板に粘着フィルムマスクを配置した状態を示す断面図である。 Hereinafter, each step (step SA1 to step SA7) shown in the flowchart of FIG. 1 will be described in detail with reference to FIGS.
FIG. 2 is a cross-sectional view before the adhesive film mask used in the embodiment of the present invention is arranged on the substrate. FIG. 3 is a plan view of the adhesive film mask. 4A and 4B are cross-sectional views showing a state in which an adhesive film mask is arranged on a substrate.
粘着フィルムマスクＭＡは、マスク本体ＭＡ１に設けた開口部を通して基板Ｓ上にアクリル材料を供給し、基板Ｓ上に液状のアクリル材料膜を形成するためのマスクである。粘着フィルムマスクＭＡを配置する前に、基板Ｓには、発光部や無機封止膜などが形成される（工程ＳＡ１）。
The adhesive film mask MA is a mask for forming a liquid acrylic material film on the substrate S by supplying an acrylic material onto the substrate S through an opening provided in the mask body MA1. Before placing the adhesive film mask MA, a light emitting part, an inorganic sealing film, and the like are formed on the substrate S (step SA1).
粘着フィルムマスクＭＡは、図２および図３に示すように、基板Ｓに対して、所定の形状からなる開口部を有する。粘着フィルムマスクＭＡは、図４Ｂに示すように、可撓性（フィルム状）の支持部からなるマスク本体ＭＡ１と、マスク本体ＭＡ１に接着部ＭＡ２が重なった構造を有する。この接着部ＭＡ２は、ＵＶ光照射により、基板Ｓに対する粘着性が低下する部材から構成されている。
The adhesive film mask MA has an opening having a predetermined shape with respect to the substrate S as shown in FIGS. As shown in FIG. 4B, the adhesive film mask MA has a structure in which a mask main body MA1 including a flexible (film-like) support portion and an adhesive portion MA2 overlap the mask main body MA1. This adhesion part MA2 is comprised from the member from which adhesiveness with respect to the board | substrate S falls by UV light irradiation.
可撓性（フィルム状）の支持部からなるマスク本体ＭＡ１と接着部ＭＡ２とが重なった構造を有するマスクＭＡを用い、基板Ｓの被成膜面（図４Ａ及び図４Ｂにおいては上面）に対して接着部ＭＡ２が接するようにマスクＭＡを配置する（工程ＳＡ２）。接着部ＭＡ２により、マスクＭＡは基板Ｓに接着されて固定される。粘着フィルムマスクＭＡが貼り付けられた基板Ｓは成膜室内に搬送される（工程ＳＡ３）。工程ＳＡ２と工程ＳＡ３を、工程αとする。
A mask MA having a structure in which a mask main body MA1 composed of a flexible (film-like) support portion and an adhesive portion MA2 overlap each other is used with respect to the film formation surface of the substrate S (the upper surface in FIGS. 4A and 4B). Then, the mask MA is arranged so that the adhesive part MA2 is in contact (step SA2). The mask MA is bonded and fixed to the substrate S by the bonding portion MA2. The substrate S to which the adhesive film mask MA is attached is transferred into the film forming chamber (step SA3). Process SA2 and process SA3 are defined as process α.
次に、マスク本体ＭＡ１に設けた開口部を通して基板Ｓの被成膜面に気化したアクリル材料を供給する。基板は冷却されているので、気体のアクリル材料は凝縮し、図５Ａ及び図５Ｂに示すように、基板Ｓ上に液体のアクリル材料膜ｆを形成する（工程ＳＡ４）。ここで、符号ｆ１は基板Ｓの被成膜面に着膜したアクリル材料膜であり、符号ｆ２は可撓性（フィルム状）の支持部からなるマスク本体ＭＡ１に着膜したアクリル材料膜である。
Next, the vaporized acrylic material is supplied to the film formation surface of the substrate S through the opening provided in the mask main body MA1. Since the substrate is cooled, the gaseous acrylic material condenses and forms a liquid acrylic material film f on the substrate S as shown in FIGS. 5A and 5B (step SA4). Here, reference numeral f1 is an acrylic material film deposited on the deposition surface of the substrate S, and reference numeral f2 is an acrylic material film deposited on the mask body MA1 formed of a flexible (film-like) support portion. .
その後、アクリル材料膜ｆに対してＵＶ光を照射する（工程ＳＡ５）。これにより、アクリル材料膜ｆは硬化し、アクリル樹脂膜Ｆとなる。さらに、ＵＶ光の照射の影響を受けて、マスク本体ＭＡ１と基板Ｓとの間に位置する接着部ＭＡ２は基板Ｓに対して、接着力が弱まった状態となる。工程ＳＡ４と工程ＳＡ５を、工程βとする。この状態で基板Ｓは、成膜装置の外部へ搬送される（工程ＳＡ６）。
Thereafter, the acrylic material film f is irradiated with UV light (step SA5). As a result, the acrylic material film f is cured and becomes an acrylic resin film F. Further, under the influence of UV light irradiation, the adhesive portion MA2 located between the mask main body MA1 and the substrate S is in a state where the adhesive force with respect to the substrate S is weakened. Process SA4 and process SA5 are defined as process β. In this state, the substrate S is transferred to the outside of the film forming apparatus (step SA6).
次いで、図６Ａ及び図６Ｂに示すように、基板ＳからマスクＭＡを剥離する（工程ＳＡ７）。工程ＳＡ７を、工程γとする。
接着部ＭＡは接着力が弱まっている、もしくは失っているので、マスクＭＡは容易に基板Ｓから剥離することができる。剥離されたマスクは廃棄される。フィルムマスクは金属マスクに比べて安価であることから、使い捨てが可能である。さらに、フィルムマスクを洗浄する必要がないので、最終的には環境負荷、コスト共に、金属マスクに比べて有利になる。
図６Ａにおける矢印は、基板からマスクＭＡを剥離する方向を表わしている。図６Ｂは符号Ｅの領域の拡大図である。符号ｅａは、基板Ｓの被成膜面に着膜したアクリル樹脂膜の部位Ｆ１の端部である。アクリル樹脂膜の部位Ｆ１の端部とは、基板からマスクＭＡが剥離された際に形成された側端部を意味する。 Next, as shown in FIGS. 6A and 6B, the mask MA is peeled from the substrate S (step SA7). Step SA7 is referred to as step γ.
Since the adhesive strength of the adhesive portion MA is weakened or lost, the mask MA can be easily peeled from the substrate S. The peeled mask is discarded. Since the film mask is cheaper than the metal mask, it can be disposable. Furthermore, since it is not necessary to clean the film mask, ultimately, both the environmental burden and cost are advantageous over the metal mask.
The arrow in FIG. 6A represents the direction in which the mask MA is peeled from the substrate. FIG. 6B is an enlarged view of a region E. Reference numeral ea denotes an end portion of the portion F1 of the acrylic resin film deposited on the deposition surface of the substrate S. The end portion of the acrylic resin film portion F1 means a side end portion formed when the mask MA is peeled from the substrate.
接着部ＭＡは接着力が弱まっている、もしくは失っているので、マスクＭＡは容易に基板Ｓから剥離することができる。剥離されたマスクは廃棄される。フィルムマスクは金属マスクに比べて安価であることから、使い捨てが可能である。さらに、フィルムマスクを洗浄する必要がないので、最終的には環境負荷、コスト共に、金属マスクに比べて有利になる。
図６Ａにおける矢印は、基板からマスクＭＡを剥離する方向を表わしている。図６Ｂは符号Ｅの領域の拡大図である。符号ｅａは、基板Ｓの被成膜面に着膜したアクリル樹脂膜の部位Ｆ１の端部である。アクリル樹脂膜の部位Ｆ１の端部とは、基板からマスクＭＡが剥離された際に形成された側端部を意味する。 Next, as shown in FIGS. 6A and 6B, the mask MA is peeled from the substrate S (step SA7). Step SA7 is referred to as step γ.
Since the adhesive strength of the adhesive portion MA is weakened or lost, the mask MA can be easily peeled from the substrate S. The peeled mask is discarded. Since the film mask is cheaper than the metal mask, it can be disposable. Furthermore, since it is not necessary to clean the film mask, ultimately, both the environmental burden and cost are advantageous over the metal mask.
The arrow in FIG. 6A represents the direction in which the mask MA is peeled from the substrate. FIG. 6B is an enlarged view of a region E. Reference numeral ea denotes an end portion of the portion F1 of the acrylic resin film deposited on the deposition surface of the substrate S. The end portion of the acrylic resin film portion F1 means a side end portion formed when the mask MA is peeled from the substrate.
このように作製されたアクリル樹脂膜では、図１２Ｂに示されるような急峻な凸部の発生は確認されなかった。
すなわち、従来の製法ではマスクを除去した際に発生していた、マスクに隣接する部分（マスク端とも呼ぶ）における急峻な凸部の形成が、本発明の実施形態によれば著しく抑制できることが明らかとなった。
したがって、本発明の実施形態は、膜厚ムラが小さく、良好な視認性が確保される均一な膜厚が要求される、封止膜の用途に好適なマスクパターンの形成方法をもたらす。 In the acrylic resin film produced in this way, generation of steep convex portions as shown in FIG. 12B was not confirmed.
That is, it is clear that the formation of steep convex portions in the portion adjacent to the mask (also referred to as the mask edge), which occurred when the mask was removed in the conventional manufacturing method, can be remarkably suppressed according to the embodiment of the present invention. It became.
Therefore, the embodiment of the present invention provides a mask pattern forming method suitable for the use of a sealing film, which requires a uniform film thickness with small film thickness unevenness and good visibility.
すなわち、従来の製法ではマスクを除去した際に発生していた、マスクに隣接する部分（マスク端とも呼ぶ）における急峻な凸部の形成が、本発明の実施形態によれば著しく抑制できることが明らかとなった。
したがって、本発明の実施形態は、膜厚ムラが小さく、良好な視認性が確保される均一な膜厚が要求される、封止膜の用途に好適なマスクパターンの形成方法をもたらす。 In the acrylic resin film produced in this way, generation of steep convex portions as shown in FIG. 12B was not confirmed.
That is, it is clear that the formation of steep convex portions in the portion adjacent to the mask (also referred to as the mask edge), which occurred when the mask was removed in the conventional manufacturing method, can be remarkably suppressed according to the embodiment of the present invention. It became.
Therefore, the embodiment of the present invention provides a mask pattern forming method suitable for the use of a sealing film, which requires a uniform film thickness with small film thickness unevenness and good visibility.
＜粘着フィルムマスク＞
本発明の一実施形態に係る粘着フィルムマスクＭＡは、図４Ｂに示すように、可撓性（フィルム状）の支持部からなるマスク本体ＭＡ１と接着部ＭＡ２とが重なった構造を有する。そして、接着部ＭＡ２は、ＵＶ光の照射によって基板に対する粘着性が低下する部材から構成されている。これにより、第一実施形態においても説明したように、アクリル樹脂膜Ｆを形成した後に行われる、基板Ｓから粘着フィルムマスクＭＡを除去する作業が容易となる。 <Adhesive film mask>
As shown in FIG. 4B, the adhesive film mask MA according to one embodiment of the present invention has a structure in which a mask main body MA1 composed of a flexible (film-like) support portion and an adhesive portion MA2 overlap each other. And adhesion part MA2 is comprised from the member from which the adhesiveness with respect to a board | substrate falls by irradiation of UV light. As a result, as described in the first embodiment, the operation of removing the adhesive film mask MA from the substrate S performed after the acrylic resin film F is formed is facilitated.
本発明の一実施形態に係る粘着フィルムマスクＭＡは、図４Ｂに示すように、可撓性（フィルム状）の支持部からなるマスク本体ＭＡ１と接着部ＭＡ２とが重なった構造を有する。そして、接着部ＭＡ２は、ＵＶ光の照射によって基板に対する粘着性が低下する部材から構成されている。これにより、第一実施形態においても説明したように、アクリル樹脂膜Ｆを形成した後に行われる、基板Ｓから粘着フィルムマスクＭＡを除去する作業が容易となる。 <Adhesive film mask>
As shown in FIG. 4B, the adhesive film mask MA according to one embodiment of the present invention has a structure in which a mask main body MA1 composed of a flexible (film-like) support portion and an adhesive portion MA2 overlap each other. And adhesion part MA2 is comprised from the member from which the adhesiveness with respect to a board | substrate falls by irradiation of UV light. As a result, as described in the first embodiment, the operation of removing the adhesive film mask MA from the substrate S performed after the acrylic resin film F is formed is facilitated.
また、基板Ｓに対する粘着性が低下する部材（接着部ＭＡ２）が存在することにより、基板Ｓに液体のアクリル材料膜ｆが形成された時に、表面張力によりマスクと接触する部分でアクリル材料膜の膜厚が増加することが抑制される。これは、接着部ＭＡ２に対して液体のアクリル材料膜の接触角が大きい場合や、アクリル材料膜の硬化と接着部ＭＡ２の粘着性の低下が同時に起こる場合などに顕著になると考えられる。ゆえに、本発明の一実施形態に係る粘着フィルムマスクＭＡは、粘着フィルムマスクＭＡを除去した際に生じる、アクリル樹脂膜の部位Ｆ１と部位Ｆ２の分離を誘導する。その結果、マスクに隣接する部分（マスク端とも呼ぶ）において樹脂膜の膜厚が局所的に増加する現象（急峻な凸部の発生）の発生が解消される。
したがって、本発明の実施形態は、アクリル樹脂膜の膜厚ムラが小さく、良好な視認性が確保される均一な膜厚のアクリル樹脂膜を実現する。このようなアクリル樹脂膜の用途としては、例えば、有機ＥＬディスプレイやフレキシブルディスプレイの封止膜に好適に用いられる。 Further, the presence of a member (adhesive portion MA2) whose adhesiveness with respect to the substrate S is reduced, so that when the liquid acrylic material film f is formed on the substrate S, the portion of the acrylic material film in contact with the mask due to surface tension. An increase in film thickness is suppressed. This is considered to be prominent when the contact angle of the liquid acrylic material film is large with respect to the adhesive portion MA2, or when the acrylic material film is cured and the adhesiveness of the adhesive portion MA2 is reduced at the same time. Therefore, the adhesive film mask MA according to an embodiment of the present invention induces separation of the part F1 and the part F2 of the acrylic resin film that occurs when the adhesive film mask MA is removed. As a result, the occurrence of a phenomenon in which the thickness of the resin film locally increases in a portion adjacent to the mask (also referred to as a mask edge) (occurrence of a steep convex portion) is eliminated.
Therefore, the embodiment of the present invention realizes an acrylic resin film having a uniform film thickness with small thickness unevenness of the acrylic resin film and ensuring good visibility. As an application of such an acrylic resin film, for example, it is suitably used as a sealing film for an organic EL display or a flexible display.
したがって、本発明の実施形態は、アクリル樹脂膜の膜厚ムラが小さく、良好な視認性が確保される均一な膜厚のアクリル樹脂膜を実現する。このようなアクリル樹脂膜の用途としては、例えば、有機ＥＬディスプレイやフレキシブルディスプレイの封止膜に好適に用いられる。 Further, the presence of a member (adhesive portion MA2) whose adhesiveness with respect to the substrate S is reduced, so that when the liquid acrylic material film f is formed on the substrate S, the portion of the acrylic material film in contact with the mask due to surface tension. An increase in film thickness is suppressed. This is considered to be prominent when the contact angle of the liquid acrylic material film is large with respect to the adhesive portion MA2, or when the acrylic material film is cured and the adhesiveness of the adhesive portion MA2 is reduced at the same time. Therefore, the adhesive film mask MA according to an embodiment of the present invention induces separation of the part F1 and the part F2 of the acrylic resin film that occurs when the adhesive film mask MA is removed. As a result, the occurrence of a phenomenon in which the thickness of the resin film locally increases in a portion adjacent to the mask (also referred to as a mask edge) (occurrence of a steep convex portion) is eliminated.
Therefore, the embodiment of the present invention realizes an acrylic resin film having a uniform film thickness with small thickness unevenness of the acrylic resin film and ensuring good visibility. As an application of such an acrylic resin film, for example, it is suitably used as a sealing film for an organic EL display or a flexible display.
粘着フィルムマスクＭＡは、ポリイミド（ＰＩ）やポリエチレンテレフタレート（ＰＥＴ）樹脂からなるマスク本体ＭＡ１と、ＵＶ光の照射により粘着性が低下する接着材からなる接着部ＭＡ２とから構成されている。マスク本体ＭＡ１が可撓性（フィルム状）の支持部からなる。
基板Ｓと接する接着材ＭＥ２の厚さは、形成されるアクリル樹脂膜の厚さより大きく設定されるとよい。これにより、「急峻な凸部」状態の発生が更に低減するので好ましい。例えば、接着材ＭＥ２の厚さがアクリル樹脂膜の厚さより大きい範囲で、アクリル樹脂膜の厚さが５０ｎｍ～２０μｍの場合、接着部ＭＡ２の厚さが１０μｍ～５０μｍである。 The adhesive film mask MA is composed of a mask body MA1 made of polyimide (PI) or polyethylene terephthalate (PET) resin, and an adhesive part MA2 made of an adhesive whose adhesiveness is reduced by irradiation with UV light. Mask main body MA1 consists of a flexible (film-like) support part.
The thickness of the adhesive ME2 in contact with the substrate S may be set larger than the thickness of the acrylic resin film to be formed. This is preferable because the occurrence of the “steep convex portion” state is further reduced. For example, when the thickness of the adhesive ME2 is larger than the thickness of the acrylic resin film and the thickness of the acrylic resin film is 50 nm to 20 μm, the thickness of the adhesive portion MA2 is 10 μm to 50 μm.
基板Ｓと接する接着材ＭＥ２の厚さは、形成されるアクリル樹脂膜の厚さより大きく設定されるとよい。これにより、「急峻な凸部」状態の発生が更に低減するので好ましい。例えば、接着材ＭＥ２の厚さがアクリル樹脂膜の厚さより大きい範囲で、アクリル樹脂膜の厚さが５０ｎｍ～２０μｍの場合、接着部ＭＡ２の厚さが１０μｍ～５０μｍである。 The adhesive film mask MA is composed of a mask body MA1 made of polyimide (PI) or polyethylene terephthalate (PET) resin, and an adhesive part MA2 made of an adhesive whose adhesiveness is reduced by irradiation with UV light. Mask main body MA1 consists of a flexible (film-like) support part.
The thickness of the adhesive ME2 in contact with the substrate S may be set larger than the thickness of the acrylic resin film to be formed. This is preferable because the occurrence of the “steep convex portion” state is further reduced. For example, when the thickness of the adhesive ME2 is larger than the thickness of the acrylic resin film and the thickness of the acrylic resin film is 50 nm to 20 μm, the thickness of the adhesive portion MA2 is 10 μm to 50 μm.
＜アクリル樹脂膜の製造装置＞
図１３は、上述した本発明の一実施形態に係る粘着フィルムマスクＭＡを用い、基板に樹脂材料を供給することにより該基板上に液体の樹脂材料膜を形成し、樹脂材料膜を重合して樹脂膜を形成する製造装置１００の一構成例である。以下では、樹脂材料膜の一例であるアクリル膜を成膜する場合について詳述する。
成膜装置１００は、内部空間が減圧可能なチャンバ１１０と、気化した樹脂材料をチャンバ１１０（処理室）に供給する気化器３００と、を有する。 <Acrylic resin film manufacturing equipment>
FIG. 13 shows the use of the above-described adhesive film mask MA according to one embodiment of the present invention, by supplying a resin material to the substrate, thereby forming a liquid resin material film on the substrate, and polymerizing the resin material film. It is an example of 1 structure of themanufacturing apparatus 100 which forms a resin film. Below, the case where the acrylic film which is an example of the resin material film | membrane is formed into a film is explained in full detail.
Thefilm forming apparatus 100 includes a chamber 110 whose internal space can be decompressed, and a vaporizer 300 that supplies the vaporized resin material to the chamber 110 (processing chamber).
図１３は、上述した本発明の一実施形態に係る粘着フィルムマスクＭＡを用い、基板に樹脂材料を供給することにより該基板上に液体の樹脂材料膜を形成し、樹脂材料膜を重合して樹脂膜を形成する製造装置１００の一構成例である。以下では、樹脂材料膜の一例であるアクリル膜を成膜する場合について詳述する。
成膜装置１００は、内部空間が減圧可能なチャンバ１１０と、気化した樹脂材料をチャンバ１１０（処理室）に供給する気化器３００と、を有する。 <Acrylic resin film manufacturing equipment>
FIG. 13 shows the use of the above-described adhesive film mask MA according to one embodiment of the present invention, by supplying a resin material to the substrate, thereby forming a liquid resin material film on the substrate, and polymerizing the resin material film. It is an example of 1 structure of the
The
チャンバ１１０の内部空間は、後述するように、上部空間１０７、下部空間１０８から構成されている。
チャンバ１１０には、不図示の真空排気装置（真空排気手段、真空ポンプ等）が接続され、真空排気装置は、チャンバ１１０の内部空間が真空雰囲気となるように、内部空間のガスを排気できるように構成されている。 The internal space of thechamber 110 is composed of an upper space 107 and a lower space 108 as will be described later.
An unillustrated evacuation device (evacuation means, vacuum pump, etc.) is connected to thechamber 110, and the evacuation device can evacuate the gas in the internal space so that the internal space of the chamber 110 becomes a vacuum atmosphere. It is configured.
チャンバ１１０には、不図示の真空排気装置（真空排気手段、真空ポンプ等）が接続され、真空排気装置は、チャンバ１１０の内部空間が真空雰囲気となるように、内部空間のガスを排気できるように構成されている。 The internal space of the
An unillustrated evacuation device (evacuation means, vacuum pump, etc.) is connected to the
チャンバ１１０の内部空間には、図１３に示すように、シャワープレート１０５が配されており、チャンバ１１０内においてシャワープレート１０５より上側が上部空間１０７を構成する。チャンバ１１０の最上部には、紫外光を透過可能な部材からなる天板１２０が設けられ、天板１２０の上側には紫外光の照射装置１２２（ＵＶ照射装置）が配されている。ここで、シャワープレート１０５も紫外光を透過可能な部材で形成することにより、照射装置１２２から天板１２０を通過して上部空間１０７へ導入された紫外光は、さらにシャワープレート１０５を通過し、シャワープレート１０５の下側に位置する下部空間１０８へ進行可能となる。これにより、後述する基板Ｓ上に形成されたアクリル材料膜に対して、成膜後に紫外光を照射し、アクリル材料膜（樹脂材料膜）を硬化させ、アクリル樹脂膜（樹脂膜）を形成することが可能とされている。
As shown in FIG. 13, a shower plate 105 is arranged in the internal space of the chamber 110, and an upper space 107 is formed above the shower plate 105 in the chamber 110. A top plate 120 made of a material capable of transmitting ultraviolet light is provided at the top of the chamber 110, and an ultraviolet light irradiation device 122 (UV irradiation device) is disposed above the top plate 120. Here, the shower plate 105 is also formed of a member that can transmit ultraviolet light, so that the ultraviolet light that has passed through the top plate 120 from the irradiation device 122 and introduced into the upper space 107 further passes through the shower plate 105, It becomes possible to proceed to the lower space 108 located below the shower plate 105. As a result, an acrylic material film formed on the substrate S, which will be described later, is irradiated with ultraviolet light after film formation, the acrylic material film (resin material film) is cured, and an acrylic resin film (resin film) is formed. It is possible.
チャンバ１１０には、不図示の加熱装置が配されている。上部空間１０７及び下部空間１０８を構成するチャンバ１１０の内壁面の温度は、樹脂材料の露点温度以上、好ましくは４０～２５０℃程度となるように設定可能であり、加熱装置によって制御される。
The chamber 110 is provided with a heating device (not shown). The temperature of the inner wall surface of the chamber 110 constituting the upper space 107 and the lower space 108 can be set to be equal to or higher than the dew point temperature of the resin material, preferably about 40 to 250 ° C., and is controlled by a heating device.
チャンバ１１０内においてシャワープレート１０５より下側に位置する下部空間１０８には、アクリル樹脂膜が形成される基板Ｓを載置するステージ１０２（基板保持部）が配されている。
In the lower space 108 located below the shower plate 105 in the chamber 110, a stage 102 (substrate holding part) on which the substrate S on which the acrylic resin film is formed is placed.
ステージ１０２においては、表面に基板が配置されるべき位置が予め定められている。ステージ１０２は、その表面が露出された状態で、チャンバ１１０内に配置されている。符号Ｓは基板ステージ１０２の表面の所定位置に配置された基板を示している。ステージ１０２には、基板Ｓを冷却する基板冷却装置１０２ａが設けられる。
In stage 102, the position where the substrate is to be placed on the surface is predetermined. The stage 102 is disposed in the chamber 110 with its surface exposed. Reference numeral S denotes a substrate disposed at a predetermined position on the surface of the substrate stage 102. The stage 102 is provided with a substrate cooling device 102a for cooling the substrate S.
基板冷却装置１０２ａは、ステージ１０２内部に冷媒を供給してステージ１０２上面の基板Ｓを冷却する。具体的には、基板Ｓの温度が基板Ｓを載置するステージ１０２（基板保持部）に内蔵された冷却装置１０２ａにより制御され、樹脂材料の気化温度以下、好ましくは零度（０℃）以下、例えば、－３０℃～０℃程度に制御される。
The substrate cooling device 102 a supplies a coolant into the stage 102 to cool the substrate S on the upper surface of the stage 102. Specifically, the temperature of the substrate S is controlled by a cooling device 102a built in the stage 102 (substrate holding unit) on which the substrate S is placed, and is equal to or lower than the vaporization temperature of the resin material, preferably zero degrees (0 ° C.) or less. For example, the temperature is controlled to about −30 ° C. to 0 ° C.
ステージ１０２の上側位置には、ステージ１０２の全面に対してシャワープレート１０５が設けられる。シャワープレート１０５は、多数の貫通孔の設けられた石英等の紫外線透過材料からなる板状部材で構成され、チャンバ１１０の内部空間を上空間と下空間とに分割している。
A shower plate 105 is provided on the upper surface of the stage 102 with respect to the entire surface of the stage 102. The shower plate 105 is composed of a plate-like member made of an ultraviolet light transmitting material such as quartz provided with a large number of through holes, and divides the internal space of the chamber 110 into an upper space and a lower space.
チャンバ１１０の上部空間１０７は、配管１１２（樹脂材料供給管）およびバルブ１１２Ｖを介して気化器３００と連通している。この樹脂材料供給管１１２を介してチャンバ１１０の上部空間１０７に対して、気化された樹脂材料は供給可能である。
The upper space 107 of the chamber 110 communicates with the vaporizer 300 via a pipe 112 (resin material supply pipe) and a valve 112V. The vaporized resin material can be supplied to the upper space 107 of the chamber 110 through the resin material supply pipe 112.
樹脂材料供給管１１２（第一配管）のバルブ１１２Ｖよりも気化器３００に近い位置には、バルブ１１３Ｖを有する樹脂材料迂回管１１３（第二配管）の一端が接続されている。樹脂材料迂回管１１３（第二配管）の他端は、排気管１１４を介して外部に接続されており、樹脂材料迂回管１１３を通じてガスが排気可能である。
One end of a resin material bypass pipe 113 (second pipe) having a valve 113V is connected to a position closer to the vaporizer 300 than the valve 112V of the resin material supply pipe 112 (first pipe). The other end of the resin material bypass pipe 113 (second pipe) is connected to the outside through an exhaust pipe 114, and gas can be exhausted through the resin material bypass pipe 113.
バルブ１１２Ｖおよびバルブ１１３Ｖの開閉駆動は、制御部４００によって制御される。制御部４００は、気化器３００からの気化した樹脂材料をチャンバ１１０内へ供給する成膜状態と、気化器３００からの気化した樹脂材料を外部に排気してチャンバ１１０内への供給しない非成膜状態と、を切り替え可能に制御する。
The opening / closing drive of the valve 112V and the valve 113V is controlled by the control unit 400. The control unit 400 has a film forming state in which the vaporized resin material from the vaporizer 300 is supplied into the chamber 110, and a non-generated state in which the vaporized resin material from the vaporizer 300 is exhausted to the outside and not supplied into the chamber 110. The film state is controlled to be switchable.
バルブ１１２Ｖ、バルブ１１３Ｖ、及び制御部４００は、チャンバ１１０の内部に樹脂材料を供給する、或いは、チャンバ１１０の外部に樹脂材料を排気する選択機能を有する切替部を構成している。
The valve 112V, the valve 113V, and the control unit 400 constitute a switching unit having a selection function of supplying a resin material into the chamber 110 or exhausting the resin material to the outside of the chamber 110.
気化器３００は、チャンバ１１０に対して気化された樹脂材料を供給可能とする。図１３に示すように、気化器３００は、気化槽１３０と、吐出部１３２と、樹脂材料原料容器１５０と、を有する。
The vaporizer 300 can supply the vaporized resin material to the chamber 110. As illustrated in FIG. 13, the vaporizer 300 includes a vaporization tank 130, a discharge unit 132, and a resin material raw material container 150.
気化槽１３０は、図１３に示すように、液状の樹脂材料を気化するための内部空間を備え、内部空間の上方には、液状の樹脂材料を噴霧する吐出部１３２が配されている。気化槽１３０は、略円筒状に形成されるが、他の断面形状とされることもできる。気化槽１３０は、その内面が、例えば、ＳＵＳやアルミニウム等からなることができる。
As shown in FIG. 13, the vaporization tank 130 has an internal space for vaporizing the liquid resin material, and a discharge part 132 for spraying the liquid resin material is disposed above the internal space. The vaporization tank 130 is formed in a substantially cylindrical shape, but may have other cross-sectional shapes. The inner surface of the vaporization tank 130 can be made of, for example, SUS or aluminum.
吐出部１３２には、樹脂材料原料容器１５０にバルブ１４０Ｖを介して接続された樹脂材料液供給管１４０の一端と、窒素ガス等とされるキャリアガスを供給するキャリアガス供給管１３０Ｇと、が接続されている。樹脂材料液供給管１４０の他端は、樹脂材料原料容器１５０に接続されるとともに、樹脂材料原料容器１５０内に貯留された液状の樹脂材料の内部に位置している。
Connected to the discharge section 132 are one end of a resin material liquid supply pipe 140 connected to the resin material raw material container 150 via a valve 140V and a carrier gas supply pipe 130G for supplying a carrier gas such as nitrogen gas. Has been. The other end of the resin material liquid supply pipe 140 is connected to the resin material raw material container 150 and is located inside the liquid resin material stored in the resin material raw material container 150.
樹脂材料原料容器１５０には、窒素ガス等とされる材料液供給用の加圧ガス供給管１５０Ｇが接続され、樹脂材料原料容器１５０の内圧を上昇させて加圧した液状の樹脂材料を樹脂材料液供給管１４０へと送液可能となっている。
A pressurized gas supply pipe 150G for supplying a material liquid such as nitrogen gas is connected to the resin material raw material container 150, and the liquid resin material pressurized by increasing the internal pressure of the resin material raw material container 150 is used as the resin material. Liquid supply to the liquid supply pipe 140 is possible.
吐出部１３２は、樹脂材料液供給管１４０から供給された液状の樹脂材料をキャリアガスとともに気化槽１３０の内部空間に噴霧するよう構成されている。吐出部１３２は、気化槽１３０の頂部略中央位置に設けられている。
The discharge unit 132 is configured to spray the liquid resin material supplied from the resin material liquid supply pipe 140 into the internal space of the vaporization tank 130 together with the carrier gas. The discharge part 132 is provided in the approximate center position of the top part of the vaporization tank 130.
気化槽１３０には、図１３に示すように、気化槽１３０の下側位置に加温部１３５が設けられる。
加温部１３５は、内部空間を上空間と下空間とに分割するように配置され、加温部１３５より上方に気化空間が形成され、下方に貯留部が形成される。 As shown in FIG. 13, thevaporization tank 130 is provided with a heating unit 135 at a lower position of the vaporization tank 130.
Theheating unit 135 is arranged so as to divide the internal space into an upper space and a lower space, a vaporization space is formed above the heating unit 135, and a storage unit is formed below.
加温部１３５は、内部空間を上空間と下空間とに分割するように配置され、加温部１３５より上方に気化空間が形成され、下方に貯留部が形成される。 As shown in FIG. 13, the
The
加温部１３５は、吐出部１３２より下方位置に設けられ、吐出部１３２から噴霧された液状の樹脂材料を加熱して気化させるものである。
The heating unit 135 is provided below the discharge unit 132 and heats and vaporizes the liquid resin material sprayed from the discharge unit 132.
樹脂材料原料容器１５０の内圧を上昇させて、樹脂材料液供給管１４０から供給された液状の樹脂材料を、吐出部１３２からキャリアガスとともに気化槽１３０の内部空間に噴霧する。このとき、吐出部１３２に供給される樹脂材料およびキャリアガスをさらに加温することもできる。
The internal pressure of the resin material raw material container 150 is increased, and the liquid resin material supplied from the resin material liquid supply pipe 140 is sprayed from the discharge unit 132 to the internal space of the vaporization tank 130 together with the carrier gas. At this time, the resin material and the carrier gas supplied to the discharge unit 132 can be further heated.
吐出部１３２からキャリアガスとともに気化槽１３０の内部空間に噴霧された樹脂材料は、加温された気化槽１３０の内部において気化する。
The resin material sprayed into the internal space of the vaporizing tank 130 together with the carrier gas from the discharge unit 132 is vaporized inside the heated vaporizing tank 130.
樹脂材料の気化が定常的に行われている間に、制御部４００により、バルブ１１２Ｖを開状態として、チャンバ１１０にガスが流入可能な状態とするとともに、バルブ１１３Ｖを閉状態とする。これにより、樹脂材料迂回管１１３（第二配管）にガスが流入できない状態とする。これにより、チャンバ１１０に気化した樹脂材料が供給され、成膜処理を行うことが可能となる。
While the resin material is constantly vaporized, the control unit 400 opens the valve 112V so that gas can flow into the chamber 110 and closes the valve 113V. As a result, the gas cannot flow into the resin material bypass pipe 113 (second pipe). Thereby, the vaporized resin material is supplied to the chamber 110, and the film formation process can be performed.
切替部の駆動によって、即ち、制御部４００によってバルブ１１２Ｖ及びバルブ１１３Ｖの開閉状態を切替えるだけで、チャンバ１１０に対する樹脂材料の供給と、樹脂材料迂回管１１３（第二配管）に対する樹脂材料の供給とを選択することができる。このため、チャンバ１１０に供給する気化した樹脂材料の供給量を安定化できるため、成膜レートが変動することを防止して、膜特性の優れた樹脂材料膜を安定して形成することが可能となる。さらに、チャンバ１１０における基板の入れ替え時に、チャンバ１１０に樹脂材料を導入せずに樹脂材料の気化を継続して行うことができるので、蒸気発生の停止／開始を繰り返すことなく、蒸気の発生レートを概ね一定にすることができる。
Supplying the resin material to the chamber 110 and supplying the resin material to the resin material bypass pipe 113 (second pipe) simply by switching the valve 112V and the valve 113V by the control unit 400 by driving the switching unit. Can be selected. For this reason, since the supply amount of the vaporized resin material supplied to the chamber 110 can be stabilized, it is possible to prevent the film formation rate from fluctuating and stably form a resin material film having excellent film characteristics. It becomes. Furthermore, since the resin material can be continuously vaporized without introducing the resin material into the chamber 110 when the substrate is replaced in the chamber 110, the steam generation rate can be increased without repeating the stop / start of the steam generation. It can be made almost constant.
成膜装置１００は、例えば、気化温度４０℃～２５０℃程度とされる紫外線硬化型のアクリル樹脂とされる樹脂材料の成膜と、成膜された樹脂材料の硬化のための紫外線照射とを同一のチャンバ１１０内で可能とするように構成されている。これにより、何れの処理工程も同一の装置構成で行うことが可能となり、生産性を向上させることができる。
The film forming apparatus 100 performs, for example, film formation of a resin material that is an ultraviolet curable acrylic resin having a vaporization temperature of about 40 ° C. to 250 ° C., and ultraviolet irradiation for curing the formed resin material. It is configured to be possible in the same chamber 110. Thereby, it becomes possible to perform any processing process with the same apparatus structure, and it can improve productivity.
本発明は、樹脂膜の形成方法と、樹脂膜の形成において有効な構成を備えたマスクに広く適用可能である。本発明は、例えば、有機ＥＬディスプレイやフレキシブルディスプレイの封止膜として樹脂膜を作製する場合に好適に用いられる。
The present invention is widely applicable to a method for forming a resin film and a mask having a structure effective in forming a resin film. The present invention is suitably used, for example, when a resin film is produced as a sealing film for an organic EL display or a flexible display.
Ｆ 樹脂材料膜、ＭＡ マスク、ＭＡ１ マスク本体、ＭＡ２ 接着部、Ｓ 基板、ｆ（ｆ１、ｆ２） アクリル材料膜、Ｆ（Ｆ１、Ｆ２）アクリル樹脂膜。
F resin material film, MA mask, MA1 mask body, MA2 adhesion part, S substrate, f (f1, f2) acrylic material film, F (F1, F2) acrylic resin film.
Claims (6)
- 基板上にパターニングされた樹脂膜を形成する方法であって、
マスク本体が可撓性の支持部と接着部とが重なった構造を有するマスクを用い、前記基板に対して前記接着部が接するように前記マスクを設ける第１工程と、
前記マスク本体に設けた開口部を通して前記基板に気化した樹脂材料を供給し該基板上で凝縮させ、該基板上に液状の樹脂材料膜を形成した後、該樹脂材料膜と前記マスクにＵＶ光を照射する第２工程と、
前記基板から前記マスクを剥離する第３工程と、
を少なくとも順に備える、
樹脂膜の形成方法。 A method of forming a patterned resin film on a substrate,
Using a mask having a structure in which a mask body has a structure in which a flexible support portion and an adhesive portion overlap each other, and providing the mask so that the adhesive portion is in contact with the substrate;
After the vaporized resin material is supplied to the substrate through the opening provided in the mask body and condensed on the substrate to form a liquid resin material film on the substrate, UV light is applied to the resin material film and the mask. A second step of irradiating
A third step of peeling the mask from the substrate;
At least in order,
A method for forming a resin film. - 前記接着部としてＵＶ光の照射により前記基板に対する粘着性が低下する部材を用いる、
請求項１に記載の樹脂膜の形成方法。 Using a member whose adhesion to the substrate is reduced by irradiation with UV light as the adhesive portion,
The method for forming a resin film according to claim 1. - 前記樹脂材料膜の厚さが前記接着部の厚さを超えないように制御する、
請求項１に記載の樹脂膜の形成方法。 Control so that the thickness of the resin material film does not exceed the thickness of the adhesive portion,
The method for forming a resin film according to claim 1. - 前記第１工程と前記第３工程は大気圧雰囲気において行われ、前記第２工程は減圧雰囲気において行われる、
請求項１に記載の樹脂膜の形成方法。 The first step and the third step are performed in an atmospheric pressure atmosphere, and the second step is performed in a reduced pressure atmosphere.
The method for forming a resin film according to claim 1. - マスク本体に設けた開口部を通して基板に液状の樹脂材料膜を形成した後、該樹脂材料膜を重合させて、該基板上に樹脂膜を形成するためのマスクであって、
前記マスク本体は可撓性の支持部に接着部が重なった構造を有し、
前記接着部はＵＶ光の照射によって前記基板に対する粘着性が低下する部材である、
マスク。 A mask for forming a resin film on the substrate by polymerizing the resin material film after forming a liquid resin material film on the substrate through an opening provided in the mask body,
The mask body has a structure in which an adhesive portion overlaps a flexible support portion,
The adhesive part is a member whose adhesiveness to the substrate is lowered by irradiation with UV light.
mask. - 前記接着部の厚さが、前記基板上に形成される樹脂材料膜の厚さに比べて大きい、
請求項５に記載のマスク。 The thickness of the adhesive portion is larger than the thickness of the resin material film formed on the substrate,
The mask according to claim 5.
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| JP2019501343A JP6853873B2 (en) | 2017-02-21 | 2018-02-20 | Resin film forming method and mask |
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| JP2015067892A (en) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | Vapor deposition mask, and organic semiconductor element manufacturing method |
| JP2016166413A (en) * | 2016-03-02 | 2016-09-15 | 大日本印刷株式会社 | Vapor deposition mask, vapor deposition mask device, and production method of organic electroluminescence element |
| WO2016204022A1 (en) * | 2015-06-16 | 2016-12-22 | 株式会社アルバック | Film forming method and film forming device |
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| WO2012090770A1 (en) * | 2010-12-27 | 2012-07-05 | シャープ株式会社 | Method for forming deposition film, and method for producing display device |
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| WO2016204022A1 (en) * | 2015-06-16 | 2016-12-22 | 株式会社アルバック | Film forming method and film forming device |
| JP2016166413A (en) * | 2016-03-02 | 2016-09-15 | 大日本印刷株式会社 | Vapor deposition mask, vapor deposition mask device, and production method of organic electroluminescence element |
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