WO2018152740A1

WO2018152740A1 - Sensing unit

Info

Publication number: WO2018152740A1
Application number: PCT/CN2017/074575
Authority: WO
Inventors: 郭益平; 李绍佳
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2017-02-23
Filing date: 2017-02-23
Publication date: 2018-08-30
Also published as: CN109313697A; CN109313697B

Abstract

A sensing unit, comprising: a substrate (1), a sensor (2), at least one light-emitting element (3), a cover plate (4) comprising a light-transmissive region (41), and a light transmission member (5). The sensor (2) and the light-emitting element (3) are separately provided on the substrate (1); the light transmission member (5) is provided between the cover plate (4) and the sensor (2), and is used for transmitting the light emitted from the light-emitting element (3) to the light-transmissive region (41). A terminal device, comprising the sensing unit. By combining an optical structure and a packaging structure, the existing light-emitting or light-transmissive module structure is simplified, and the sensing unit is more miniaturized while the light-transmissive effect is achieved, thereby facilitating use in a thin electronic device.

Description

Sensing device

Technical field

Embodiments of the present invention relate to the field of biometrics, and in particular, to a sensing device.

Background technique

At present, with the development of biometric sensors, especially the rapid development of fingerprint recognition sensors, consumers' demand for biometric sensors is not limited to functional convenience, and more and more pursuit of differentiation and personalization in appearance.

The existing biometric package structure comprises a biometric sensor 101, a substrate 102, a molding compound 103, a solid crystal glue 104, and a bonding wire 105, as shown in FIG.

In the process of implementing the present invention, the inventors have found that at least the following problems exist in the prior art:

The current biometric sensor only has the recognition function, and there is no visual guidance function in the single color and dark environment of the appearance color, and it is difficult to realize the consumer's demand for differentiation and personalization.

The current illuminating or light-transmitting scheme is to achieve uniform light transmission through a relatively large-volume, thick-thickness backlight module or light-guiding module to achieve light transmission through a visible light permeable pattern. Due to its size and size, it is not suitable for applications requiring thinner and smaller biometric sensors, especially fingerprint recognition sensors.

Summary of the invention

The object of the embodiments of the present invention is to provide a sensing device, which simplifies the structure of the existing light-emitting or light-transmitting module, and achieves a light-transmissive effect, so that the sensing device is further miniaturized, so as to be applied to a thin and light electronic device. on.

In order to solve the above technical problem, an embodiment of the present invention provides a sensing device including: a substrate, a sensor, at least one light emitting element, a cover plate having a light transmissive area, and a light guiding member; the sensor and the light emitting element Separatingly disposed on the substrate; the light guiding member is disposed between the cover plate and the sensor, and the light guiding member is configured to conduct light emitted by the light emitting element to the light transmitting region.

The embodiment of the invention further provides a terminal device, comprising the above sensing device.

Compared with the prior art, the embodiment of the present invention emits visible light through the light-emitting element directly under the cover plate and the pattern, and transmits the light through the light-transmitting region on the cover plate through the light-conducting member to form a light-emitting or light-transmitting effect. Therefore, the optical structure and the package structure are designed together, which simplifies the existing light-emitting or light-transmitting module structure, and achieves a light-transmitting effect, and the sensing device is further miniaturized, so as to be applied to a thin and light electronic device.

In addition, the cover plate includes a transparent cover body and an opaque layer, and the opaque layer is disposed on the transparent cover body and has the light transmissive area. This embodiment provides an implementation of the cover.

In addition, the opaque layer is disposed on an inner surface of the transparent cover and faces the light guiding member. This embodiment provides an implementation of the location of the opaque layer.

In addition, the cover plate further includes a translucent layer disposed between the transparent cover and the opaque layer. By setting up a translucent layer, you can avoid seeing the opaque layer directly from the outside and enhance the visual experience.

In addition, the opaque layer is disposed on an outer surface of the transparent cover, and the transparent cover faces the light guiding member. This embodiment provides another implementation of the location of the opaque layer, making the embodiment of the present invention more flexible.

In addition, the sensor includes a sensor body and a molding body, and the molding body covers the sensor body. This embodiment provides an implementation of the sensor structure.

In addition, the sensing device further includes a light blocking plate disposed between the substrate and the cover plate; The light shielding plate, the substrate and the cover plate form a receiving cavity, and the sensor, the light emitting component and the light guiding component are all located in the accommodating cavity. In this way, the light-emitting element can be sealed by the light-shielding plate, the substrate and the cover plate, so that the light-conducting member can conduct the light emitted from the light-emitting element.

In addition, the sensing device further includes two light-shielding sealing layers, wherein one light-shielding sealing layer is disposed between the light-blocking plate and the substrate, and another light-shielding sealing layer is disposed on the light-blocking plate and the cover plate. between. The light-emitting element can be better sealed by the light-shielding sealing layer, so that a better light-transmitting effect can be formed in the light-transmitting region of the cover plate.

In addition, the molding body includes a body molding portion and an extension packaging portion; the body packaging portion covers the sensor body, the extension packaging portion covers a sidewall of the light emitting element; wherein the light emitting element emits Light is emitted from the top wall of the light emitting element to the light conducting member. This embodiment provides an implementation manner of the plastic sealing body, which can be molded by the plastic sealing body together with the sensor body, which is simple and convenient.

In addition, the light guiding member includes a light guiding layer and a mirror; a surface of the light guiding layer facing the sensor is formed with a grating, and a projection of the grating on the cover plate covers the light transmitting region; The mirror is disposed on an extension of the light guiding layer and corresponds to the light emitting element; wherein the mirror reflects light emitted by the light emitting element into the light guiding layer, the light Projected to the light transmissive region by the grating. This embodiment provides a specific implementation manner of the light-conducting member. The light-conducting layer and the mirror can better transmit the visible light emitted by the light-emitting element through the light-transmitting region on the cover plate.

In addition, the grating is a spherical matrix structure or a tapered matrix structure. This embodiment provides various implementations of the grating structure.

In addition, the angle between the mirror and the horizontal plane is 45°. This embodiment provides a preferred implementation of the mirror.

Additionally, the sensor is a fingerprint recognition sensor. This embodiment provides a preferred implementation of the sensor.

DRAWINGS

The one or more embodiments are exemplified by the accompanying drawings in the accompanying drawings, and FIG. The figures in the drawings do not constitute a scale limitation unless otherwise stated.

1 is a package structure of a biometric sensor according to the prior art;

2a is a top plan view of a light-transmitting region in a first embodiment of the present invention;

2b is a schematic structural view of a sensing device when the grating is a spherical matrix structure according to the first embodiment of the present invention;

2c is a schematic view showing a grating as a spherical matrix structure in the first embodiment of the present invention;

2d is a schematic view showing a grating having a tapered matrix structure in accordance with a first embodiment of the present invention;

2e is a schematic structural view of a sensing device when the grating has a tapered matrix structure according to the first embodiment of the present invention;

3 is a schematic structural view of a sensing device according to a second embodiment of the present invention;

4 is a schematic structural view of a sensing device according to a third embodiment of the present invention;

Figure 5 is a schematic structural view of a sensing device according to a fourth embodiment of the present invention;

6 is a schematic view showing the structure in which the cover plate includes a transparent cover and an opaque layer, and the opaque layer is disposed on the outer surface of the transparent cover according to the fourth embodiment of the present invention.

Specific embodiment

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will appreciate that many techniques have been proposed in order to provide the reader with a better understanding of the present application in various embodiments of the present invention. detail. However, the technical solutions claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

A first embodiment of the invention relates to a sensing device comprising: a substrate 1, a sensor 2, at least one light-emitting element 3, a cover plate 4 having a light-transmissive region 41, and a light-conducting member 5. The visible light emitted from the light-emitting element 3 can be transmitted through the light-transmitting region 41 to form a light-transmitting effect, as shown in FIG. 2a. The light-conducting member 5 in this embodiment may have a transparent optical material which is plastic and can be processed into an optical structure, and has a refractive index higher than that of the cover plate 4. The material may be polyethylene terephthalate (PET) or polymethacrylic acid. Methyl ester (PMMA), polycarbonate (PC), thermoplastic polyurethane elastomer rubber (TPU), UV resin, and the like are not limited thereto.

The sensor 2 and the light-emitting element 3 are respectively disposed on the substrate 1; the light-conducting member 5 is disposed between the cover plate 4 and the sensor 2, and the light-conducting member 5 is configured to conduct the light emitted by the light-emitting element 3 to the light-transmitting region 41, as shown in the figure. As shown in FIG. 2b, there may be more than one light-transmitting region 41 in this embodiment (two in FIG. 2b as an example), and more than one light-emitting element 3 in this embodiment may be used (two in FIG. 2b as an example). The light-emitting element 3 is connected to the substrate 1 independently of the sensor 2.

In this embodiment, the cover 4 may include a transparent cover 42 and an opaque layer 43. The cover 4 in this embodiment may have a certain thickness and a certain dielectric constant, and the cover 4 may have a thickness of several tens of micrometers to several hundreds of micrometers. The material having a refractive index lower than that of the light guiding layer 51 of the light-conducting member 5 serves as a protective and light-conducting material, and the material thereof may be glass, translucent zirconia ceramic, sapphire, optical resin film material, etc., but is not limited thereto. The opaque layer 43 may be a material that blocks the transmission of visible light, such as an ink, a non-conductive metal plating film, or the like. The opaque layer 43 has a thickness of several micrometers to several tens of micrometers, and the opaque layer 43 may be disposed on the transparent cover 42 and has a light-transmitting region. 41, wherein the light transmissive region 41 is substantially formed by an open area on the opaque layer 43. Specifically, the opaque layer 43 may be disposed on the inner surface of the transparent cover 42 and face the light guiding member 5.

In this embodiment, the light guiding member 5 includes a light guiding layer 51 and a mirror 52. The light guiding layer 51 is hidden under the cover plate 4 and has a thickness of at least 30 micrometers. The light guiding layer 51 can be directly transferred to the cover through the mold. On the plate 4 or on the opaque layer 43. The mirror 52 is disposed directly above the light-emitting element 3, the thickness of the mirror 52 is at least 500 nanometers, the width and pitch of the mirror 52 are at least 25 nanometers, the height of the mirror 52 is at least 5 nanometers, and the reflective surface of the mirror 52 is reflected by the surface. The light reflecting layer 521 is formed to reflect the light emitted by the light emitting element 3; the grating 53 is formed on the surface of the light guiding layer 51 facing the sensor 2, and the projection of the grating 53 on the cover 4 covers the light transmitting area 41; The mirror 52 is disposed on the extension of the light guiding layer 51 and corresponds to the light emitting element 3; wherein the mirror 52 reflects the light emitted by the light emitting element 3 into the light guiding layer 51, and the light is projected through the grating 53 The light region 41, the grating 53 in this embodiment may be a spherical matrix structure, as shown in Fig. 2c.

Preferably, the sensing device in this embodiment may further include a light blocking plate 6 disposed between the substrate 1 and the cover plate 4; the light blocking plate 6 may be a metal, non-metal material that is opaque, the light blocking plate 6, and the substrate 1 The cover plate 4 forms a receiving cavity, and the sensor 2, the light-emitting element 3 and the light-conducting member 5 are all located in the accommodating cavity. More preferably, the sensing device may further comprise two light-shielding sealing layers 7, wherein one light-shielding sealing layer 7 is disposed between the light-blocking plate 6 and the substrate 1, and the other light-shielding sealing layer 7 is disposed on the light-blocking plate 6 and the cover plate 4. Between, as shown in Figure 2b. In practical applications, the light-shielding sealing layer 7 may be a light-shielding foam, a double-sided adhesive or an adhesive which can be adhesive on both sides.

Preferably, the sensor 2 in this embodiment may be a fingerprint recognition sensor, and the sensor 2 includes a sensor body 21 and a molding body 22, and the molding body 22 covers the sensor body 21. In practical applications, a solid crystal glue 23 may also be included for fixing the sensor body 21 to the substrate 1, as shown in FIG. 2b.

In practical applications, the light-emitting element 3 can be a light-emitting diode that emits visible light. At least one of the mirrors 52 is disposed directly above the light-emitting element 3, and each of the light-emitting elements 3 corresponds to a mirror 52. Preferably, the mirror 52 and the horizontal surface of the cover plate 4 may be at an angle, for example, at an angle of 45° to the horizontal plane of the cover plate 4; the light guide layer 51 is below the light transmission pattern, and the opaque layer 43 is formed under the cover plate 4 to form a light transmission. The grating 53 is bonded to the surface of the molding body 22 by using an adhesive, and the area of the grating 53 covers the entire surface or partial area of the surface of the sensor 2 and the molding body 22; Sealed by the light-shielding sealing layer 7 and the light-blocking plate 6, the light-emitting element 3 is prevented from leaking light or the light-emitting energy is attenuated; the light emitted by the light-emitting element 3 is emitted through the light-reflecting layer 521 on the mirror 52 to emit light at a certain angle into the light guiding layer 51. When the grating 53 is in a matrix structure, light is reflected through the cover 4 to form a light-emitting or light-transmitting effect.

It should be noted that, in practical applications, the grating 53 may also have a tapered matrix structure, as shown in FIG. 2d, and the structure of the sensing device when the grating 53 is a tapered matrix structure is as shown in FIG. 2e.

Compared with the prior art, the present embodiment emits visible light through the light-emitting element 3 directly under the cover 4 and the pattern, and emits light into the optical path conduction structure through the mirror 52 distributed directly above the light-emitting element 3, and the pattern is positive. The lower grating 53 forms a reflection such that the light-emitting element 3 is conducted through the cover 4 or the light-transmitting region 41 to form a light-emitting or light-transmitting effect. The optical structure and the package structure are designed together to simplify the existing light-emitting or light-transmitting module structure, and the light-sensing effect is achieved, so that the sensing device is further miniaturized, so as to be applied to the thin and light electronic device.

A second embodiment of the invention relates to a sensing device. The second embodiment is modified on the basis of the first embodiment, and the improvement is that the cover 4 in this embodiment may further include a translucent layer 44 as shown in FIG.

Specifically, the translucent layer 44 in this embodiment may be disposed between the transparent cover 42 and the opaque layer 43. The translucent layer 44 may be a material having a certain visible light transmittance, such as an ink, a non-conductive coating, etc., the semi-transparent layer 44 has a thickness of several micrometers to several tens of micrometers, and the light-transmitting region 41 may be made of an opaque layer 43 or translucent. Layer 44 is partially hollowed out.

In this embodiment, the grating 53 is a spherical matrix structure as an example. However, the actual application may also be a tapered matrix structure, which is not limited in this embodiment.

In this embodiment, by providing the translucent layer 44, the opaque layer 43 can be directly seen from the outside to enhance the visual experience.

A third embodiment of the invention relates to a sensing device. The third embodiment is substantially the same as the first embodiment. The main difference is that in the first embodiment, the opaque layer 43 can be disposed on the inner surface of the transparent cover 42. In the embodiment, the opaque layer 43 can be disposed on the third embodiment. The outer surface of the transparent cover 42 is as shown in FIG.

Specifically, in the present embodiment, the opaque layer 43 may be disposed on the outer surface of the transparent cover 42, and the transparent cover 42 faces the light guiding member 5.

This embodiment provides another implementation of the cover 4, making the embodiments of the present invention more flexible.

A fourth embodiment of the invention relates to a sensing device. The fourth embodiment is substantially the same as the second embodiment, and the main difference is that in the second embodiment, the light-emitting elements 3 are independently disposed on the substrate 1, and in the fourth embodiment of the present invention, the light-emitting elements 3 are The molded body 22 is sealed as shown in FIG.

Specifically, in the embodiment, the molding body 22 includes a body molding portion 221 and an extension encapsulation portion 222. The body encapsulation portion 221 covers the sensor body 21, and the extension encapsulation portion 222 covers the sidewall of the light-emitting element 3, such that the light-emitting element 3 is molded together with the sensor 2, and light emitted from the light-emitting element 3 is emitted from the top wall of the light-emitting element 3 to the light-conducting member 5.

It should be noted that, in this embodiment, the improvement may be based on the first or third embodiment, that is, the cover 4 in this embodiment may also include only the transparent cover 42 and the opaque layer 43 or the implementation. The opaque layer 43 in the example may also be disposed on the outer surface of the transparent cover 42. When the cover 4 only The schematic diagram of the structure including the transparent cover 42 and the opaque layer 43 and the opaque layer 43 disposed on the outer surface of the transparent cover 42 is as shown in FIG. 6 (the grating 53 in the figure is exemplified by a tapered matrix structure).

This embodiment provides another implementation for sealing the light-emitting element 3, which is simple and convenient, and also makes the embodiment of the present invention more flexible and changeable.

A fifth embodiment of the present invention relates to a terminal device. The terminal device in this embodiment includes the sensing device in any of the above embodiments.

A person skilled in the art can understand that the above embodiments are specific embodiments for implementing the present invention, and various changes can be made in the form and details without departing from the spirit and scope of the present invention. range.

Claims

A sensing device, comprising: a substrate, a sensor, at least one light emitting element, a cover plate having a light transmitting area, and a light guiding member;

The sensor and the light emitting element are respectively disposed on the substrate;

The light guiding member is disposed between the cover plate and the sensor, and the light guiding member is configured to conduct light emitted by the light emitting element to the light transmitting region.
The sensing device according to claim 1, wherein the cover plate comprises a transparent cover and an opaque layer, and the opaque layer is disposed on the transparent cover and has the transparent region.
The sensing device according to claim 2, wherein the opaque layer is disposed on an inner surface of the transparent cover and faces the light guiding member.
The sensing device according to claim 3, wherein the cover further comprises a translucent layer disposed between the transparent cover and the opaque layer.
The sensing device according to claim 2, wherein the opaque layer is disposed on an outer surface of the transparent cover, and the transparent cover faces the light guiding member.
The sensing device according to claim 1, wherein the sensor comprises a sensor body and a molding body, and the molding body covers the sensor body.
The sensing device according to claim 6, wherein the sensing device further comprises a light blocking plate disposed between the substrate and the cover plate;

The light shielding plate, the substrate and the cover plate form a receiving cavity, and the sensor, the light emitting component and the light guiding component are all located in the accommodating cavity.
The sensing device according to claim 7, wherein the sensing device further comprises two light-shielding sealing layers, wherein a light-shielding sealing layer is disposed between the light-blocking plate and the substrate, and another light-shielding seal A layer is disposed between the light barrier and the cover.
The sensing device according to claim 6, wherein the molding body comprises a body molding portion and an extension packaging portion; the body packaging portion covers the sensor body, and the extension packaging portion covers the light emitting portion Side wall of the component;

Wherein, light emitted by the light emitting element is emitted from the top wall of the light emitting element to the light guiding member.
The sensing device according to claim 1, wherein the light guiding member comprises a light guiding layer and a mirror;

A light barrier is formed on a surface of the light guiding layer facing the sensor, and a projection of the grating on the cover plate covers the light transmissive area;

The mirror is disposed on an extension of the light guiding layer and corresponds to the light emitting element;

Wherein the mirror reflects light emitted by the light-emitting element into the light guiding layer, and the light is projected to the light-transmitting region by the grating.
The sensing device according to claim 10, wherein the grating is a spherical matrix structure or a tapered matrix structure.
The sensing device of claim 10 wherein said mirror is at an angle of 45 to the horizontal.
The sensing device of claim 1 wherein said sensor is a fingerprint recognition sensor.
A terminal device comprising the sensing device according to any one of claims 1 to 13.