WO2018149236A1 - Double-layer cavity combiner and public port device thereof - Google Patents
Double-layer cavity combiner and public port device thereof Download PDFInfo
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- WO2018149236A1 WO2018149236A1 PCT/CN2017/119468 CN2017119468W WO2018149236A1 WO 2018149236 A1 WO2018149236 A1 WO 2018149236A1 CN 2017119468 W CN2017119468 W CN 2017119468W WO 2018149236 A1 WO2018149236 A1 WO 2018149236A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
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- the present invention relates to the field of communication device technologies, and in particular, to a dual-layer cavity combiner and a common port device thereof.
- the microwave cavity combiner is composed of a multi-path filter, and when the pass band is large, the double-layer cloth cavity mode is advantageous for miniaturization of the device.
- the commonly used double-cavity combiner is only used to realize the two filter path combination of the upper and lower layers.
- three filter paths are needed to be combined, three filter paths are required to be directly and common with the tapped metal lines.
- the port and the coupling rod are connected. This will result in three solder joints on the common port and the coupling rod, which makes the intermodulation index of the combiner worse.
- the road can realize the upper and lower double-layer three-way combination. This design will increase the number of resonant cavities, which not only increases the insertion loss and manufacturing cost, but also can not further miniaturize the device.
- the present invention overcomes the deficiencies of the prior art, and provides a double-cavity combiner and a common port device thereof, which can realize the distribution of the bandwidth of the upper and lower three-channel ports of the double-layer cavity by using a coupling rod, which has The insertion loss is small, the volume is small, the processing is easy, and the processing cost is low, and the solderless point thereof can reduce the nonlinear factor of the device.
- a common port device for a double-layer cavity combiner comprising a casing, a first partition, a second partition, a first resonant column, a second resonant column, a third resonant column, and a coupling rod
- the first partition a plate is disposed in the housing for separating the inner cavity of the housing to form a first layer cavity and a second layer cavity
- the second partition being disposed on the first partition for
- the first layer cavity is divided to form a first first cavity and a second first cavity
- the first resonant column is located in the first first cavity
- the second resonant column is located in the second first cavity
- the first a third resonant column is located in the second layer cavity
- the housing is provided with a common joint hole for connecting a common joint
- a side of the first partition facing the common joint hole is concavely provided with a coupling window
- the first head cavity, the second head cavity, and the second layer cavity are both in communication with the coupling window
- the third resonant column includes a pylon disposed on the first partition and a resonant column body on the pedestal, and the coupling hole is opened on the pedestal.
- the coupling hole is disposed opposite to the common joint hole.
- a dielectric sleeve sleeved on the coupling rod is further disposed, and the dielectric sleeve is located in the coupling hole.
- a gap is provided between a side of the second partition facing the common joint hole and the housing.
- the coupling rod includes a first stage rod inserted into the coupling hole and a second stage rod for connection with a common joint, the first stage rod having a larger diameter than the second stage rod diameter of.
- the coupling rod includes a first stage rod inserted into the coupling hole and a second stage rod for connection with a common joint, the first stage rod having a diameter smaller than the second level rod diameter of.
- the coupling window includes a first window that interfaces with the first head cavity and a second window that interfaces with the second head cavity, and the bottom of the first window is concavely provided with an expansion port .
- the coupling window includes a first window that interfaces with the first head cavity and a second window that interfaces with the second head cavity, and the bottom of the second window is concavely provided with an expansion port .
- the technical solution also provides a double cavity combiner comprising the common port device.
- the common port device of the double-cavity combiner of the present invention divides the inner cavity of the casing into two upper and lower layers through the first partition, and then separates the first layer cavity by the second partition to form a first filter.
- the first head cavity of the path and the second head cavity of the second filter path, the second layer cavity may constitute a third head cavity of the third filter path.
- the first spacer of the present invention is provided with a coupling window, and the coupling window connects the first layer cavity and the second layer cavity in abutting manner, and connects the first head cavity and the second head cavity in a butt connection.
- the present invention has a coupling hole formed in the first spacer, the second spacer, the first resonant column, the second resonant column or the third resonant column, and is disposed in the coupling hole A coupling rod that is connected to a common joint.
- the electromagnetic field energy is finally radiated into the three head cavities through the common joint, the coupling rod, the coupling hole, and the coupling window, thereby realizing the distribution of the bandwidth of the upper and lower three filtering path ports.
- the public port device of the present invention only needs one rod insertion coupling to realize the port bandwidth allocation of the upper and lower double layer three paths at the same time, which will make the double layer structure form more widely used in modern mobile communication systems;
- the invention eliminates the common resonant cavity required for the traditional structural design, has the characteristics of small insertion loss, small volume, convenient processing and low processing cost; in addition, the invention does not need to adopt the method of connecting the tap wire, so that the entire common port device is not welded. Points, thereby reducing the non-linear factors of the public port device.
- FIG. 1 is a partial cross-sectional view of a public port device according to an embodiment of the present invention
- FIG. 2 is a longitudinal cross-sectional view of a common port device according to an embodiment of the present invention.
- FIG. 3 is a top plan view of a public port device according to an embodiment of the present invention.
- FIG. 4 is a bottom view of a public port device according to an embodiment of the present invention.
- the common port device of the double-cavity combiner of the present invention comprises a housing 200, a first partition 300, a second partition 400, a first resonant column 500, and a second The resonant column 600, the third resonant column 700, and the coupling rod 800.
- the first partition plate 300 is located in the casing 200 for separating the inner cavity of the casing 200 into a first layer cavity and a second layer cavity, and the second partition plate 400 is standing on the first
- the partition 300 is configured to divide the first layer cavity into a first head cavity 210 and a second head cavity 220, and the second layer cavity is a third head cavity 230.
- the first resonant column 500, the second resonant column 600, and the third resonant column 700 are respectively located in the first head cavity 210, in the second head cavity 220, and in the third head cavity 230 Inside.
- the first resonant column 500 and the second resonant column 600 shown in the drawings of the present embodiment are respectively disposed on the upper surface of the first spacer 300, and the third resonant column 700 is disposed on the first spacer.
- the lower surface of the 300 is disposed on the first spacer.
- the housing 200 is provided with a common joint hole 240 for connecting the common joint 100, and a coupling window 310 is opened on a side of the first partition 300 facing the common joint hole 240.
- the coupling window 310 is in communication with the first head cavity 210, the second head cavity 220, and the third head cavity 230. Specifically, as shown in FIG. 1 , the coupling window 310 extends up and down to the first layer cavity and the second layer cavity, and extends left and right to the first head cavity 210 and the second head cavity 220 .
- a coupling hole 711 may be defined, and the coupling hole 711 is disposed opposite to the common joint hole 240.
- One end of the coupling rod 800 is in communication with the common joint 100 at the common joint hole 240, and the other end is inserted into the coupling hole 711.
- the signal is transmitted from the common connector 100 to the coupling rod 800, and then passes through the coupling hole 711 and the coupling window 310 to be finally radiated to the first head cavity 210, the second head cavity 220, and the third The first cavity 230.
- the common port device of the present invention divides the inner cavity of the casing 200 into two upper and lower layers through the first partition plate 300, and then passes through the second partition plate 400 to be the first
- the layer cavity is divided to form a first head cavity 210 of the first filter path and a second head cavity 220 of the second filter path, and the second layer cavity may constitute a third head cavity 230 of the third filter path.
- the first spacer 300 of the present invention is provided with a coupling window 310.
- the coupling window 310 connects the first layer cavity and the second layer cavity in abutting manner, and the first head cavity 210 and the second head cavity are connected. 220 docking connection.
- the present invention provides a coupling hole on one of the first spacer 300, the second spacer 400, the first resonant column 500, the second resonant column 600, or the third resonant column 700. 711, and a coupling rod 800 connected to the common joint 100 is disposed in the coupling hole 711.
- the electromagnetic field energy is finally radiated into the three head cavities through a common port (the common port is composed of the common joint hole 240 and the common joint 100), the coupling rod 800 and the coupling hole 711, and the coupling window 310, thereby implementing three filters.
- the allocation of the channel port bandwidth is composed of the common joint hole 240 and the common joint 100.
- the public port device of the present invention only needs one rod insertion coupling to realize the port bandwidth allocation of the upper and lower double layer three paths at the same time, which will make the double layer structure form more widely used in modern mobile communication systems;
- the invention eliminates the common resonant cavity required for the traditional structural design, has the characteristics of small insertion loss, small volume, convenient processing and low processing cost; in addition, the invention does not need to adopt the method of connecting the tap wire, so that the entire common port device is not welded. Points, thereby reducing the non-linear factors of the public port device.
- the coupling hole 711 is preferably opened on the third resonant column 700.
- the third resonant column 700 includes a pillar 710 disposed on the first spacer 300 and a resonant pillar body 720 on the pillar 710.
- the coupling is opened on the pillar 710. Hole 711.
- the structure of the first resonant column 500 and the second resonant column 600 may be the same as that of the third resonant column 700, that is, the column and the resonant column body structure may also be included.
- the invention fully utilizes the physical structure of the resonant column, so that the setting of the coupling hole 711 in the common port device is reasonable and effective, and does not affect the device characteristics.
- the thickness of the first separator 300 and the second separator 400 needs to be designed to be thick enough, and the second separator is too thick. 400 will affect the frequency distribution of the first head cavity 210 and the second head cavity 220, and thus the present invention preferentially places the coupling hole 711 on the pillar 710 of the resonant column.
- the electromagnetic field energy is radiated onto the third resonant column 700, that is, the third first cavity 230, and then re-radiated to the first resonant column 500 of the first head cavity 210 via the coupling window 310 and The second resonant column 600 of the second head cavity 220.
- the housing 200, the first spacer 300, the second spacer 400, and the post 710 of each resonant column of the embodiment may be an integrally formed structure, which simplifies the fabrication of the entire device.
- a gap is provided between the side of the second partition 400 facing the common joint hole 240 and the housing 200 to ensure the first head cavity 210, the second head cavity 220 and the first The coupling between the three heads 230 is better. It should be noted that, in one embodiment, when the coupling hole 711 is disposed on a side of the second partition 400 facing the common joint hole 240, the second partition 400 and the housing 200 are required. A gap is provided to ensure that electromagnetic field energy can be radiated from the coupling hole 711 into the first head cavity 210, the second head cavity 220, and the third head cavity 230.
- the coupling rod 800 is a step bar including a first stage rod extending into the coupling hole 711 and a second stage rod for connection with the common joint 100.
- the diameter of the first stage rod is greater than the diameter of the second stage rod, or the diameter of the first stage rod is smaller than the diameter of the second stage rod.
- the diameter of the first-stage rod can be set according to the standard size or the common size of the coupling hole 711, that is, the diameter of the first-stage rod matches the inner diameter of the coupling hole 711; the diameter of the second-stage rod can be required
- the magnitude of the bandwidth tolerated and the impedance characteristics are set so that the coupling bar 800 can be designed as a step bar.
- the coupling rod 800 can also be designed as a flat rod structure according to actual needs by those skilled in the art.
- the invention further includes a dielectric sleeve (not shown) that is sleeved on the coupling rod 800, and the dielectric sleeve is located in the coupling hole 711.
- the dielectric sleeve is configured to secure the coupling bar 800 to prevent electrical shorting of the coupling bar 800 from the post 710.
- the common port device of the present invention can adjust the bandwidth allocation of the upper and lower three port ports by adjusting the position of the coupling hole 711.
- the coupling hole 711 can be moved or moved down on the surface of the first spacer 300.
- the second layer cavity (the first layer)
- the bandwidth allocation of the three headrooms 230) will increase.
- the common joint 100 and the coupling rod 800 move upward, such as when moving to the second separator 400, the bandwidth distribution of the second layer cavity is reduced.
- the upper two channels and the lower layer bandwidth are allocated by adjusting the heights of the common joint 100 and the coupling rod 800.
- the length of the dielectric sleeve or the dielectric constant of the dielectric sleeve of the gap between the coupling rod 800 and the coupling hole 711 can be adjusted to adjust the upper two filtering paths (the first Portwidth of a filter path and a second filter path) and a lower filter path (third filter path).
- the port bandwidth of the upper two filter paths and the lower filter path can also be adjusted by adjusting the depth of the coupling bar 800 into the coupling hole 711.
- the common joint 100 and the coupling rod 800 are biased toward the lower layer that is planar with the first partition 300, increasing or decreasing the area of one side of the coupling window 310 can adjust the bandwidth allocation of the upper two filter paths.
- the first window 311 is increased (ie, the coupling window 310 is located on the side of the first resonant column 500)
- the bandwidth of the first filter path where the first resonant column 500 is located is increased.
- a bottom of the window 311 is further recessed with an expansion opening 3111 for increasing the area of the first window 311, as shown in FIGS. 1 and 3; likewise, when the second window 312 is enlarged (ie, located at the second resonant column 600).
- the bandwidth of the second filtering path where the second resonant column 600 is located is increased.
- the present invention can further recess another opening at the bottom of the second window 312 (not shown in the drawing) ) to increase the area of the second window 312.
- the bandwidth of the first filter path of the first resonant column 500 is reduced.
- the present invention can add a filler or the like to the first window 311 to reduce the first window according to actual needs.
- the area of the second window 312 is reduced.
- the bandwidth of the second filter path of the second resonant column 600 is reduced.
- the present invention can add a filler or the like to the second window 312 according to actual needs.
- the area of the second window 312 is reduced.
- the diameter of the third resonant column 700 (column 710 and the resonant column body 720) is increased (increased by the facing area of the inner wall of the casing 200) or close to the inner wall of the casing 200, it will increase.
- the lower layer bandwidth allocation likewise, when the diameters of the first resonant column 500 and the second resonant column 600 increase or are close to the inner wall of the housing 200, the bandwidth allocation of the upper two filter paths is increased.
- the lower layer bandwidth distribution is reduced; likewise, when the first resonant column 500 and the second resonant column 600 are reduced in diameter or away from the inner wall of the housing 200 At the same time, the bandwidth allocation of the upper two filter paths is reduced.
- the present invention also provides a dual chamber combiner comprising the above described common port device, common joint 100 and one, two or three branch joints (not shown in the drawings).
- each branch connector is electrically connected to the first cavity; when the branch connectors are two, two of the first cavity energy are concentrated and electrically connected to one of the branch connectors, and the other first cavity is The other branch connector is electrically connected; when the branch connector is one, the three head cavity energy is concentrated and communicated with the branch connector.
- the common joint, the branch joint and the like of the present invention may be a joint rod or a wire.
- the present invention realizes the distribution of the bandwidth of the upper and lower three filter path ports by inserting the coupling bar 800 into the coupling hole 711, which will make the two-layer structure form more widely used in modern mobile communication systems.
- the common joint 100 and the coupling rod 800 are directly assembled without welding with the cavity resonance column, and the invention does not need to adopt the method of connecting the tap wire, so that the entire common port device has no solder joints, which not only reduces the assembly difficulty but also reduces the assembly difficulty. A non-linear factor in the public port device.
- the present invention can realize the required port bandwidth without increasing the common resonant cavity, and has the characteristics of small insertion loss, small volume, convenient processing and low processing cost compared with the existing co-resonator combiner.
- the invention has the advantages of simple structure, easy assembly, low material cost, good reliability and stability, wide applicability, can effectively save production cost, improve product quality and enhance market competitiveness.
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Abstract
Disclosed are a double-layer cavity combiner and a public port device thereof. A first baffle is located in a shell to divide the shell into a first layer of the cavity and a second layer of the cavity, and a second baffle is located on the first baffle to divide the first layer of the cavity into a first head cavity and a second head cavity. The shell is provided with a common connector hole connected to a common connector, and the side of the first baffle, facing the common connector hole, is recessed and provided with a coupling window. The first baffle, the second baffle, a first resonant column, a second resonant column or a third resonant column is provided with a coupling hole. One end of a coupling rod is used to be connected to the common connector, and the other end thereof is inserted into the coupling hole. In the present invention, port bandwidth allocation with upper-and-lower double layers and three pathways can be realized simply by means of one rod plug-in coupling, thus making the double-layer structure capable of being applied more widely in modern mobile communication systems. In addition, the present invention omits a common resonant cavity required in traditional structural designs, and has the advantages of a low insertion loss, a small volume, convenience during processing, and a low processing cost.
Description
本发明涉及通信设备技术领域,尤其是涉及一种双层腔合路器及其公共端口装置。The present invention relates to the field of communication device technologies, and in particular, to a dual-layer cavity combiner and a common port device thereof.
在现代移动通信技术中,微波滤波器构成的微波器件已经成为了必不可少的重要组成部分。其中,微波腔体合路器由多路滤波器构成,当通带较多时采用双层布腔方式有利于器件小型化。目前常用的双层腔合路器仅用于实现上下两层的两个滤波通路合路,而当需要实现三个滤波通路合路的话,则需要三个滤波通路都用抽头金属线直接与公共端口及耦合棒连接,这会在公共端口及耦合棒上出现三个焊点,使合路器的互调指标变差很多;或者需要先在一层中加入额外的公共谐振腔将两通路合路,才能实现上下双层三通路合路,此种设计会使谐振腔的数目增加,不但增加了插损和制作成本,也无法进一步做到器件小型化。In modern mobile communication technology, microwave devices composed of microwave filters have become an indispensable and important component. Among them, the microwave cavity combiner is composed of a multi-path filter, and when the pass band is large, the double-layer cloth cavity mode is advantageous for miniaturization of the device. At present, the commonly used double-cavity combiner is only used to realize the two filter path combination of the upper and lower layers. When three filter paths are needed to be combined, three filter paths are required to be directly and common with the tapped metal lines. The port and the coupling rod are connected. This will result in three solder joints on the common port and the coupling rod, which makes the intermodulation index of the combiner worse. Or you need to add an additional common resonant cavity in the first layer to combine the two paths. The road can realize the upper and lower double-layer three-way combination. This design will increase the number of resonant cavities, which not only increases the insertion loss and manufacturing cost, but also can not further miniaturize the device.
发明内容Summary of the invention
基于此,本发明在于克服现有技术的缺陷,提供一种双层腔合路器及其公共端口装置,其采用一根耦合棒即可以实现双层腔上下三通路端口带宽的分配,其具有插损小、体积小、便于加工及加工成本低等特点,并且其无焊点,可以降低器件的非线性因素。Based on this, the present invention overcomes the deficiencies of the prior art, and provides a double-cavity combiner and a common port device thereof, which can realize the distribution of the bandwidth of the upper and lower three-channel ports of the double-layer cavity by using a coupling rod, which has The insertion loss is small, the volume is small, the processing is easy, and the processing cost is low, and the solderless point thereof can reduce the nonlinear factor of the device.
其技术方案如下:Its technical solutions are as follows:
一种双层腔合路器的公共端口装置,包括壳体、第一隔板、第二隔板、第一谐振柱、第二谐振柱、第三谐振柱以及耦合棒,所述第一隔板位于所述壳体内用以将所述壳体的内腔分隔形成第一层腔体和第二层腔体,所述第二隔板立于所述第一隔板上用以将所述第一层腔体分隔形成第一首腔和第二首腔,所述第一谐振柱位于所述第一首腔内,所述第二谐振柱位于所述第二首腔内,所述第三谐振柱位于所述第二层腔体内,所述壳体开设有用于连接公共接头的公共 接头孔,所述第一隔板面向所述公共接头孔的一侧凹设有耦合窗口,所述第一首腔、所述第二首腔以及所述第二层腔体均与所述耦合窗口连通,所述第一隔板、所述第二隔板、所述第一谐振柱、所述第二谐振柱或所述第三谐振柱上开设有耦合孔,所述耦合棒一端用于与公共接头连接,另一端插入所述耦合孔内,信号由公共接头传输到所述耦合棒,再经过所述耦合孔和所述耦合窗口后最终辐射到所述第一首腔、所述第二首腔以及所述第二层腔体。A common port device for a double-layer cavity combiner, comprising a casing, a first partition, a second partition, a first resonant column, a second resonant column, a third resonant column, and a coupling rod, the first partition a plate is disposed in the housing for separating the inner cavity of the housing to form a first layer cavity and a second layer cavity, the second partition being disposed on the first partition for The first layer cavity is divided to form a first first cavity and a second first cavity, the first resonant column is located in the first first cavity, and the second resonant column is located in the second first cavity, the first a third resonant column is located in the second layer cavity, the housing is provided with a common joint hole for connecting a common joint, and a side of the first partition facing the common joint hole is concavely provided with a coupling window, The first head cavity, the second head cavity, and the second layer cavity are both in communication with the coupling window, the first partition, the second partition, the first resonant column, the a coupling hole is formed in the second resonant column or the third resonant column, and one end of the coupling rod is connected to the common joint, and the other end is inserted into the In the coupling hole, a signal is transmitted from the common joint to the coupling rod, and then through the coupling hole and the coupling window, and finally radiated to the first head cavity, the second head cavity and the second layer Cavity.
在其中一个实施例中,所述第三谐振柱包括设于所述第一隔板上的柱台和位于所述柱台上的谐振柱本体,所述柱台上开设有所述耦合孔。In one embodiment, the third resonant column includes a pylon disposed on the first partition and a resonant column body on the pedestal, and the coupling hole is opened on the pedestal.
在其中一个实施例中,所述耦合孔与所述公共接头孔相对设置。In one of the embodiments, the coupling hole is disposed opposite to the common joint hole.
在其中一个实施例中,还包括套设于所述耦合棒上的介质套,所述介质套位于所述耦合孔内。In one embodiment, a dielectric sleeve sleeved on the coupling rod is further disposed, and the dielectric sleeve is located in the coupling hole.
在其中一个实施例中,所述第二隔板面向所述公共接头孔的一侧与所述壳体之间设有间隙。In one embodiment, a gap is provided between a side of the second partition facing the common joint hole and the housing.
在其中一个实施例中,所述耦合棒包括插入所述耦合孔的第一级棒和用于与公共接头连接的第二级棒,所述第一级棒的直径大于所述第二级棒的直径。In one embodiment, the coupling rod includes a first stage rod inserted into the coupling hole and a second stage rod for connection with a common joint, the first stage rod having a larger diameter than the second stage rod diameter of.
在其中一个实施例中,所述耦合棒包括插入所述耦合孔的第一级棒和用于与公共接头连接的第二级棒,所述第一级棒的直径小于所述第二级棒的直径。In one embodiment, the coupling rod includes a first stage rod inserted into the coupling hole and a second stage rod for connection with a common joint, the first stage rod having a diameter smaller than the second level rod diameter of.
在其中一个实施例中,所述耦合窗口包括与所述第一首腔对接的第一窗口和与所述第二首腔对接的第二窗口,所述第一窗口的底部凹设有扩张口。In one embodiment, the coupling window includes a first window that interfaces with the first head cavity and a second window that interfaces with the second head cavity, and the bottom of the first window is concavely provided with an expansion port .
在其中一个实施例中,所述耦合窗口包括与所述第一首腔对接的第一窗口和与所述第二首腔对接的第二窗口,所述第二窗口的底部凹设有扩张口。In one embodiment, the coupling window includes a first window that interfaces with the first head cavity and a second window that interfaces with the second head cavity, and the bottom of the second window is concavely provided with an expansion port .
本技术方案还提供了一种双层腔合路器,包括所述的公共端口装置。The technical solution also provides a double cavity combiner comprising the common port device.
下面对前述技术方案的优点或原理进行说明:The advantages or principles of the foregoing technical solutions are described below:
本发明所述双层腔合路器的公共端口装置,其通过第一隔板将壳体的内腔分隔形成上下两层,再通过第二隔板将第一层腔体分隔形成第一滤波通路的第一首腔和第二滤波通路的第二首腔,第二层腔体则可构成第三滤波通路的第三首腔。与此同时,本发明所述的第一隔板开设有耦合窗口,耦合窗口将第一层腔体和第二层腔体对接连通,并将第一首腔和第二首腔对接连通。本发明在所 述第一隔板、所述第二隔板、所述第一谐振柱、所述第二谐振柱或所述第三谐振柱上开设耦合孔,并在耦合孔内设置有与公共接头连接的耦合棒。电磁场能量通过公共接头、耦合棒、耦合孔、耦合窗口后最终辐射到三个首腔中,进而实现上下三个滤波通路端口带宽的分配。本发明所述公共端口装置只需要一个棒插入式耦合即可以同时实现上下双层三通路的端口带宽分配,这将使双层结构形式在现代移动通信系统中有了更广泛应用;同时,本发明省去传统结构设计所需要的公共谐振腔,具有插损小、体积小、便于加工及加工成本低等特点;此外,本发明无需采用抽头金属线连接的方式,使得整个公共端口装置没有焊点,从而降低了公共端口装置的非线性因素。The common port device of the double-cavity combiner of the present invention divides the inner cavity of the casing into two upper and lower layers through the first partition, and then separates the first layer cavity by the second partition to form a first filter. The first head cavity of the path and the second head cavity of the second filter path, the second layer cavity may constitute a third head cavity of the third filter path. At the same time, the first spacer of the present invention is provided with a coupling window, and the coupling window connects the first layer cavity and the second layer cavity in abutting manner, and connects the first head cavity and the second head cavity in a butt connection. The present invention has a coupling hole formed in the first spacer, the second spacer, the first resonant column, the second resonant column or the third resonant column, and is disposed in the coupling hole A coupling rod that is connected to a common joint. The electromagnetic field energy is finally radiated into the three head cavities through the common joint, the coupling rod, the coupling hole, and the coupling window, thereby realizing the distribution of the bandwidth of the upper and lower three filtering path ports. The public port device of the present invention only needs one rod insertion coupling to realize the port bandwidth allocation of the upper and lower double layer three paths at the same time, which will make the double layer structure form more widely used in modern mobile communication systems; The invention eliminates the common resonant cavity required for the traditional structural design, has the characteristics of small insertion loss, small volume, convenient processing and low processing cost; in addition, the invention does not need to adopt the method of connecting the tap wire, so that the entire common port device is not welded. Points, thereby reducing the non-linear factors of the public port device.
图1为本发明实施例所述的公共端口装置的局部剖视图;1 is a partial cross-sectional view of a public port device according to an embodiment of the present invention;
图2为本发明实施例所述的公共端口装置的纵向剖视图;2 is a longitudinal cross-sectional view of a common port device according to an embodiment of the present invention;
图3为本发明实施例所述的公共端口装置的俯视图;3 is a top plan view of a public port device according to an embodiment of the present invention;
图4为本发明实施例所述的公共端口装置的仰视图。4 is a bottom view of a public port device according to an embodiment of the present invention.
附图标记说明:Description of the reference signs:
100、公共接头,200、壳体,210、第一首腔,220、第二首腔,230、第三首腔,240、公共接头孔,300、第一隔板,310、耦合窗口,311、第一窗口,312、第二窗口,400、第二隔板,500、第一谐振柱,600、第二谐振柱,700、第三谐振柱,710、柱台,711、耦合孔,720、谐振柱本体,800、耦合棒。100, common joint, 200, housing, 210, first head cavity, 220, second head cavity, 230, third head cavity, 240, common joint hole, 300, first partition, 310, coupling window, 311 , first window, 312, second window, 400, second partition, 500, first resonant column, 600, second resonant column, 700, third resonant column, 710, abutment, 711, coupling hole, 720 , the resonant column body, 800, coupling rod.
为使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及具体实施方式,对本发明进行进一步的详细说明。应当理解的是,此处所描述的具体实施方式仅用以解释本发明,并不限定本发明的保护范围。The present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the scope of the invention.
需要说明的是,当一个元件被称为是“连通”另一个元件,它可以是直接连通到另一个元件或者也可以是通过居中的元件而连通于另一个元件。本发明所述的“电性连接”可表示为“有线连接”或“无线连接”。此外,除非特别指出,否则说 明书中的术语“第一”及“第二”等描述仅仅用于区分说明书中的各个组件、元素、步骤等,而不是用于表示各个组件、元素、步骤之间的逻辑关系或者顺序关系等。It is to be noted that when an element is referred to as "connected" to another element, it can be directly connected to the other element or can be connected to the other element. "Electrical connection" as used in the present invention may be referred to as "wired connection" or "wireless connection." In addition, the terms "first" and "second" in the specification are used to distinguish between the various components, elements, steps, etc. in the specification, and are not intended to represent the various components, elements, and steps. Logical relationship or order relationship, etc.
如图1和图2所示,本发明所述的双层腔合路器的公共端口装置,包括壳体200、第一隔板300、第二隔板400、第一谐振柱500、第二谐振柱600、第三谐振柱700以及耦合棒800。所述第一隔板300位于所述壳体200内用以将壳体200的内腔分隔形成第一层腔体和第二层腔体,所述第二隔板400立于所述第一隔板300上用以将所述第一层腔体分隔形成第一首腔210和第二首腔220,所述第二层腔体则为第三首腔230。所述第一谐振柱500、所述第二谐振柱600以及所述第三谐振柱700分别位于所述第一首腔210内、所述第二首腔220内以及所述第三首腔230内。具体地,本实施例附图所示第一谐振柱500和第二谐振柱600分别安设于所述第一隔板300的上表面,第三谐振柱700安设于所述第一隔板300的下表面。As shown in FIG. 1 and FIG. 2, the common port device of the double-cavity combiner of the present invention comprises a housing 200, a first partition 300, a second partition 400, a first resonant column 500, and a second The resonant column 600, the third resonant column 700, and the coupling rod 800. The first partition plate 300 is located in the casing 200 for separating the inner cavity of the casing 200 into a first layer cavity and a second layer cavity, and the second partition plate 400 is standing on the first The partition 300 is configured to divide the first layer cavity into a first head cavity 210 and a second head cavity 220, and the second layer cavity is a third head cavity 230. The first resonant column 500, the second resonant column 600, and the third resonant column 700 are respectively located in the first head cavity 210, in the second head cavity 220, and in the third head cavity 230 Inside. Specifically, the first resonant column 500 and the second resonant column 600 shown in the drawings of the present embodiment are respectively disposed on the upper surface of the first spacer 300, and the third resonant column 700 is disposed on the first spacer. The lower surface of the 300.
所述壳体200开设有用于连接公共接头100的公共接头孔240,所述第一隔板300面向所述公共接头孔240的一侧开设有耦合窗口310。所述耦合窗口310与所述第一首腔210、所述第二首腔220以及所述第三首腔230均连通。具体地,如图1所示,所述耦合窗口310上下延伸至第一层腔体和第二层腔体,并左右延伸至第一首腔210和第二首腔220。所述第一隔板300、所述第二隔板400、所述第一谐振柱500、所述第二谐振柱600或所述第三谐振柱700的面向所述公共接头孔240的一侧可开设有耦合孔711,所述耦合孔711与所述公共接头孔240相对设置。所述耦合棒800一端与位于所述公共接头孔240处的公共接头100连通,另一端插入所述耦合孔711内。信号由公共接头100传输到所述耦合棒800,再经过所述耦合孔711和所述耦合窗口310后最终辐射到所述第一首腔210、所述第二首腔220以及所述第三首腔230。The housing 200 is provided with a common joint hole 240 for connecting the common joint 100, and a coupling window 310 is opened on a side of the first partition 300 facing the common joint hole 240. The coupling window 310 is in communication with the first head cavity 210, the second head cavity 220, and the third head cavity 230. Specifically, as shown in FIG. 1 , the coupling window 310 extends up and down to the first layer cavity and the second layer cavity, and extends left and right to the first head cavity 210 and the second head cavity 220 . a side of the first separator 300, the second separator 400, the first resonator column 500, the second resonator column 600, or the third resonator column 700 facing the common joint hole 240 A coupling hole 711 may be defined, and the coupling hole 711 is disposed opposite to the common joint hole 240. One end of the coupling rod 800 is in communication with the common joint 100 at the common joint hole 240, and the other end is inserted into the coupling hole 711. The signal is transmitted from the common connector 100 to the coupling rod 800, and then passes through the coupling hole 711 and the coupling window 310 to be finally radiated to the first head cavity 210, the second head cavity 220, and the third The first cavity 230.
下面对上述技术方案的工作原理进行说明:本发明所述公共端口装置,其通过第一隔板300将壳体200的内腔分隔形成上下两层,再通过第二隔板400将第一层腔体分隔形成第一滤波通路的第一首腔210和第二滤波通路的第二首腔220,第二层腔体则可构成第三滤波通路的第三首腔230。与此同时,本发明 所述的第一隔板300开设有耦合窗口310,耦合窗口310将第一层腔体和第二层腔体对接连通,并将第一首腔210和第二首腔220对接连通。本发明在所述第一隔板300、所述第二隔板400、所述第一谐振柱500、所述第二谐振柱600或所述第三谐振柱700的其中之一上开设耦合孔711,并在耦合孔711内设置有与公共接头100连接的耦合棒800。电磁场能量通过公共端口(本文所述公共端口由公共接头孔240和公共接头100构成)、耦合棒800以及耦合孔711、耦合窗口310后最终辐射到三个首腔中,进而实现上下三个滤波通路端口带宽的分配。本发明所述公共端口装置只需要一个棒插入式耦合即可以同时实现上下双层三通路的端口带宽分配,这将使双层结构形式在现代移动通信系统中有了更广泛应用;同时,本发明省去传统结构设计所需要的公共谐振腔,具有插损小、体积小、便于加工及加工成本低等特点;此外,本发明无需采用抽头金属线连接的方式,使得整个公共端口装置没有焊点,从而降低了公共端口装置的非线性因素。The following describes the working principle of the above technical solution: the common port device of the present invention divides the inner cavity of the casing 200 into two upper and lower layers through the first partition plate 300, and then passes through the second partition plate 400 to be the first The layer cavity is divided to form a first head cavity 210 of the first filter path and a second head cavity 220 of the second filter path, and the second layer cavity may constitute a third head cavity 230 of the third filter path. At the same time, the first spacer 300 of the present invention is provided with a coupling window 310. The coupling window 310 connects the first layer cavity and the second layer cavity in abutting manner, and the first head cavity 210 and the second head cavity are connected. 220 docking connection. The present invention provides a coupling hole on one of the first spacer 300, the second spacer 400, the first resonant column 500, the second resonant column 600, or the third resonant column 700. 711, and a coupling rod 800 connected to the common joint 100 is disposed in the coupling hole 711. The electromagnetic field energy is finally radiated into the three head cavities through a common port (the common port is composed of the common joint hole 240 and the common joint 100), the coupling rod 800 and the coupling hole 711, and the coupling window 310, thereby implementing three filters. The allocation of the channel port bandwidth. The public port device of the present invention only needs one rod insertion coupling to realize the port bandwidth allocation of the upper and lower double layer three paths at the same time, which will make the double layer structure form more widely used in modern mobile communication systems; The invention eliminates the common resonant cavity required for the traditional structural design, has the characteristics of small insertion loss, small volume, convenient processing and low processing cost; in addition, the invention does not need to adopt the method of connecting the tap wire, so that the entire common port device is not welded. Points, thereby reducing the non-linear factors of the public port device.
在本实施例中,所述耦合孔711优选开设于所述第三谐振柱700上。具体地,所述第三谐振柱700包括设于所述第一隔板300上的柱台710和位于所述柱台710上的谐振柱本体720,所述柱台710上开设有所述耦合孔711。需要说明的是,第一谐振柱500、第二谐振柱600的结构可与第三谐振柱700的结构相同,即,也可包括柱台和谐振柱本体结构。本发明充分利用谐振柱的物理结构,使得公共端口装置中耦合孔711的设置合理有效,不会影响器件特性。因为当将耦合孔711开设于第一隔板300或第二隔板400上时,则第一隔板300和第二隔板400的厚度需要设计成足够厚,而过厚的第二隔板400将影响第一首腔210与第二首腔220的频率分配,因而本发明优先将耦合孔711设置在谐振柱的柱台710上。当耦合棒800插入第三谐振柱700时,电磁场能量辐射至第三谐振柱700上即第三首腔230内,之后经由耦合窗口310再辐射至第一首腔210的第一谐振柱500和第二首腔220的第二谐振柱600。本实施例所述壳体200、第一隔板300、第二隔板400以及各个谐振柱的柱台710可为一体成型结构,简化整个器件的制作。In the embodiment, the coupling hole 711 is preferably opened on the third resonant column 700. Specifically, the third resonant column 700 includes a pillar 710 disposed on the first spacer 300 and a resonant pillar body 720 on the pillar 710. The coupling is opened on the pillar 710. Hole 711. It should be noted that the structure of the first resonant column 500 and the second resonant column 600 may be the same as that of the third resonant column 700, that is, the column and the resonant column body structure may also be included. The invention fully utilizes the physical structure of the resonant column, so that the setting of the coupling hole 711 in the common port device is reasonable and effective, and does not affect the device characteristics. Because when the coupling hole 711 is opened on the first separator 300 or the second separator 400, the thickness of the first separator 300 and the second separator 400 needs to be designed to be thick enough, and the second separator is too thick. 400 will affect the frequency distribution of the first head cavity 210 and the second head cavity 220, and thus the present invention preferentially places the coupling hole 711 on the pillar 710 of the resonant column. When the coupling rod 800 is inserted into the third resonant column 700, the electromagnetic field energy is radiated onto the third resonant column 700, that is, the third first cavity 230, and then re-radiated to the first resonant column 500 of the first head cavity 210 via the coupling window 310 and The second resonant column 600 of the second head cavity 220. The housing 200, the first spacer 300, the second spacer 400, and the post 710 of each resonant column of the embodiment may be an integrally formed structure, which simplifies the fabrication of the entire device.
值得注意的是,所述第二隔板400面向所述公共接头孔240的一侧与所述 壳体200之间设有间隙,用以确保第一首腔210,第二首腔220和第三首腔230之间的耦合效果更好。需要说明的是,在其中一个实施例中,当耦合孔711设于第二隔板400面向所述公共接头孔240的一侧时,所述第二隔板400与壳体200之间则需设置间隙用以确保电磁场能量能够从耦合孔711中发散辐射至第一首腔210、第二首腔220以及第三首腔230中。It should be noted that a gap is provided between the side of the second partition 400 facing the common joint hole 240 and the housing 200 to ensure the first head cavity 210, the second head cavity 220 and the first The coupling between the three heads 230 is better. It should be noted that, in one embodiment, when the coupling hole 711 is disposed on a side of the second partition 400 facing the common joint hole 240, the second partition 400 and the housing 200 are required. A gap is provided to ensure that electromagnetic field energy can be radiated from the coupling hole 711 into the first head cavity 210, the second head cavity 220, and the third head cavity 230.
在本实施例中,所述耦合棒800为阶梯棒,其包括伸入所述耦合孔711的第一级棒和用于与公共接头100连接的第二级棒。所述第一级棒的直径大于所述第二级棒的直径,或所述第一级棒的直径小于所述第二级棒的直径。所述第一级棒的直径可根据耦合孔711的标准大小或通用大小进行设定,即第一级棒的直径与耦合孔711的内径大小相匹配;第二级棒的直径则可由所需承受的带宽大小以及阻抗特性进行设定,因而耦合棒800可设计为阶梯棒。需要说明的是,本领域技术人员也可根据实际需要将耦合棒800设计为平直棒状结构。本发明还包括套设于所述耦合棒800上的介质套(附图未示出),所述介质套位于所述耦合孔711内。介质套的设置用以固定耦合棒800,防止耦合棒800与柱台710出现电气短路。In the present embodiment, the coupling rod 800 is a step bar including a first stage rod extending into the coupling hole 711 and a second stage rod for connection with the common joint 100. The diameter of the first stage rod is greater than the diameter of the second stage rod, or the diameter of the first stage rod is smaller than the diameter of the second stage rod. The diameter of the first-stage rod can be set according to the standard size or the common size of the coupling hole 711, that is, the diameter of the first-stage rod matches the inner diameter of the coupling hole 711; the diameter of the second-stage rod can be required The magnitude of the bandwidth tolerated and the impedance characteristics are set so that the coupling bar 800 can be designed as a step bar. It should be noted that the coupling rod 800 can also be designed as a flat rod structure according to actual needs by those skilled in the art. The invention further includes a dielectric sleeve (not shown) that is sleeved on the coupling rod 800, and the dielectric sleeve is located in the coupling hole 711. The dielectric sleeve is configured to secure the coupling bar 800 to prevent electrical shorting of the coupling bar 800 from the post 710.
本发明所述的公共端口装置可以通过调节耦合孔711的位置,实现对上下三个通路端口的带宽分配调节。如图2所示,在实际设计过程中,耦合孔711可以以第一隔板300为基准面上移或下移。当公共接头100和耦合棒800放置于以第一隔板300为平面的下层,并向下移动时,即,耦合孔711位于第一隔板300的下方时,则第二层腔体(第三首腔230)的带宽分配会增多。反之,当公共接头100和耦合棒800向上移动时,如移动至第二隔板400上时,则第二层腔体的带宽分配会减少。通过调整公共接头100和耦合棒800的高度,来实现上层两个通路和下层通路带宽分配。The common port device of the present invention can adjust the bandwidth allocation of the upper and lower three port ports by adjusting the position of the coupling hole 711. As shown in FIG. 2, in the actual design process, the coupling hole 711 can be moved or moved down on the surface of the first spacer 300. When the common joint 100 and the coupling rod 800 are placed on the lower layer that is planar with the first partition plate 300 and moved downward, that is, when the coupling hole 711 is located below the first partition 300, the second layer cavity (the first layer) The bandwidth allocation of the three headrooms 230) will increase. Conversely, when the common joint 100 and the coupling rod 800 move upward, such as when moving to the second separator 400, the bandwidth distribution of the second layer cavity is reduced. The upper two channels and the lower layer bandwidth are allocated by adjusting the heights of the common joint 100 and the coupling rod 800.
由于电磁场能量一般集中在耦合棒800与耦合孔711之间,因而可以调整耦合棒800与耦合孔711之间间隙的介质套的长短或者介质套的介电常数来调节上层两个滤波通路(第一滤波通路和第二滤波通路)和下层滤波通路(第三滤波通路)的端口带宽。此外,也可通过调整耦合棒800进入耦合孔711的深度,来调节上层两个滤波通路和下层滤波通路的端口带宽。Since the electromagnetic field energy is generally concentrated between the coupling rod 800 and the coupling hole 711, the length of the dielectric sleeve or the dielectric constant of the dielectric sleeve of the gap between the coupling rod 800 and the coupling hole 711 can be adjusted to adjust the upper two filtering paths (the first Portwidth of a filter path and a second filter path) and a lower filter path (third filter path). In addition, the port bandwidth of the upper two filter paths and the lower filter path can also be adjusted by adjusting the depth of the coupling bar 800 into the coupling hole 711.
当公共接头100和耦合棒800在偏向于以第一隔板300为平面的下层时,增大或减少耦合窗口310某一侧的面积则可调节上层两个滤波通路的带宽分配。请结合图3,当增大第一窗口311(即位于第一谐振柱500一侧的耦合窗口310)时,则会增加第一谐振柱500所在第一滤波通路的带宽,本发明可在第一窗口311的底部再凹设有一个扩张口3111,用以增加第一窗口311的面积,如图1和图3所示;同样,当增大第二窗口312(即位于第二谐振柱600一侧的耦合窗口310)时,则会增加第二谐振柱600所在的第二滤波通路的带宽,本发明可在第二窗口312的底部再凹设有另一个扩张口(附图未示出),用以增加第二窗口312的面积。反之,当减小第一窗口311时,则会减小第一谐振柱500所在第一滤波通路的带宽,本发明可根据实际需要在第一窗口311中增加填料等用以减小第一窗口311的面积;同样,当减小第二窗口312时,则会减小第二谐振柱600所在的第二滤波通路的带宽,本发明可根据实际需要在第二窗口312中增加填料等用以减小第二窗口312的面积。此外,请结合图4,当第三谐振柱700(柱台710和谐振柱本体720)直径增大(增加与壳体200内壁的正对面积)或者靠近壳体200内壁的时候,会增大下层带宽分配;同样,当第一谐振柱500和第二谐振柱600直径增大后或靠近壳体200内壁的时候,会增加上层两个滤波通路的带宽分配。反之,当第三谐振柱700直径减小或者远离壳体200内壁的时候,会减小下层带宽分配;同样,当第一谐振柱500和第二谐振柱600直径减小或远离壳体200内壁的时候,会减小上层两个滤波通路的带宽分配。When the common joint 100 and the coupling rod 800 are biased toward the lower layer that is planar with the first partition 300, increasing or decreasing the area of one side of the coupling window 310 can adjust the bandwidth allocation of the upper two filter paths. Referring to FIG. 3, when the first window 311 is increased (ie, the coupling window 310 is located on the side of the first resonant column 500), the bandwidth of the first filter path where the first resonant column 500 is located is increased. A bottom of the window 311 is further recessed with an expansion opening 3111 for increasing the area of the first window 311, as shown in FIGS. 1 and 3; likewise, when the second window 312 is enlarged (ie, located at the second resonant column 600). When the coupling window 310 of one side is used, the bandwidth of the second filtering path where the second resonant column 600 is located is increased. The present invention can further recess another opening at the bottom of the second window 312 (not shown in the drawing) ) to increase the area of the second window 312. On the other hand, when the first window 311 is reduced, the bandwidth of the first filter path of the first resonant column 500 is reduced. The present invention can add a filler or the like to the first window 311 to reduce the first window according to actual needs. The area of the second window 312 is reduced. When the second window 312 is reduced, the bandwidth of the second filter path of the second resonant column 600 is reduced. The present invention can add a filler or the like to the second window 312 according to actual needs. The area of the second window 312 is reduced. In addition, please refer to FIG. 4, when the diameter of the third resonant column 700 (column 710 and the resonant column body 720) is increased (increased by the facing area of the inner wall of the casing 200) or close to the inner wall of the casing 200, it will increase. The lower layer bandwidth allocation; likewise, when the diameters of the first resonant column 500 and the second resonant column 600 increase or are close to the inner wall of the housing 200, the bandwidth allocation of the upper two filter paths is increased. Conversely, when the third resonant column 700 is reduced in diameter or away from the inner wall of the housing 200, the lower layer bandwidth distribution is reduced; likewise, when the first resonant column 500 and the second resonant column 600 are reduced in diameter or away from the inner wall of the housing 200 At the same time, the bandwidth allocation of the upper two filter paths is reduced.
本发明还提供一种双层腔合路器,包括上述公共端口装置、公共接头100和一个、两个或三个分支接头(附图未示出)。当分支接头为三个时,每个分支接头对应一个首腔电性连接;当分支接头为两个时,其中两个首腔能量汇聚后与其中一个分支接头电性连接,另外一个首腔则与另外一个分支接头电性连接;当分支接头为一个时,则三个首腔能量汇聚后与该分支接头连通。需要说明的是,本发明所述公共接头以及分支接头等可以为接头棒或导线等。The present invention also provides a dual chamber combiner comprising the above described common port device, common joint 100 and one, two or three branch joints (not shown in the drawings). When there are three branch connectors, each branch connector is electrically connected to the first cavity; when the branch connectors are two, two of the first cavity energy are concentrated and electrically connected to one of the branch connectors, and the other first cavity is The other branch connector is electrically connected; when the branch connector is one, the three head cavity energy is concentrated and communicated with the branch connector. It should be noted that the common joint, the branch joint and the like of the present invention may be a joint rod or a wire.
综上所述,本发明通过耦合棒800插入耦合孔711来实现上下三个滤波通路端口带宽的分配,这将使双层结构形式在现代移动通信系统中有了更广泛应用。其中,公共接头100和耦合棒800直接装配,无需与腔体谐振柱焊接,并 且本发明无需采用抽头金属线连接的方式,从而使得整个公共端口装置没有焊点,不仅减少装配难度,还降低了公共端口装置的非线性因素。此外,本发明可以在不增加公共谐振腔的情况下实现所需要的端口带宽,相对于现有共谐振腔的合路器,具有插损小、体积小、便于加工及加工成本低等特点。综上可知,本发明结构简单,易于装配,物料成本低,可靠性和稳定性好,适用性广,可以有效地节省生产成本,提升产品质量,增强市场竞争力。In summary, the present invention realizes the distribution of the bandwidth of the upper and lower three filter path ports by inserting the coupling bar 800 into the coupling hole 711, which will make the two-layer structure form more widely used in modern mobile communication systems. Wherein, the common joint 100 and the coupling rod 800 are directly assembled without welding with the cavity resonance column, and the invention does not need to adopt the method of connecting the tap wire, so that the entire common port device has no solder joints, which not only reduces the assembly difficulty but also reduces the assembly difficulty. A non-linear factor in the public port device. In addition, the present invention can realize the required port bandwidth without increasing the common resonant cavity, and has the characteristics of small insertion loss, small volume, convenient processing and low processing cost compared with the existing co-resonator combiner. In summary, the invention has the advantages of simple structure, easy assembly, low material cost, good reliability and stability, wide applicability, can effectively save production cost, improve product quality and enhance market competitiveness.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
- 一种双层腔合路器的公共端口装置,其特征在于,包括壳体、第一隔板、第二隔板、第一谐振柱、第二谐振柱、第三谐振柱以及耦合棒,所述第一隔板位于所述壳体内用以将所述壳体的内腔分隔形成第一层腔体和第二层腔体,所述第二隔板立于所述第一隔板上用以将所述第一层腔体分隔形成第一首腔和第二首腔,所述第一谐振柱位于所述第一首腔内,所述第二谐振柱位于所述第二首腔内,所述第三谐振柱位于所述第二层腔体内,所述壳体开设有用于连接公共接头的公共接头孔,所述第一隔板面向所述公共接头孔的一侧凹设有耦合窗口,所述第一首腔、所述第二首腔以及所述第二层腔体均与所述耦合窗口连通,所述第一隔板、所述第二隔板、所述第一谐振柱、所述第二谐振柱或所述第三谐振柱上开设有耦合孔,所述耦合棒一端用于与公共接头连接,另一端插入所述耦合孔内;信号由公共接头传输到所述耦合棒,再经过所述耦合孔和所述耦合窗口后最终辐射到所述第一首腔、所述第二首腔以及所述第二层腔体。A common port device for a double-layer cavity combiner, comprising: a housing, a first partition, a second partition, a first resonant column, a second resonant column, a third resonant column, and a coupling rod The first partition is located in the casing to partition the inner cavity of the casing into a first layer cavity and a second layer cavity, and the second partition is disposed on the first partition Separating the first layer cavity into a first head cavity and a second head cavity, the first resonator column is located in the first head cavity, and the second resonance column is located in the second head cavity The third resonant column is located in the second layer cavity, the housing is provided with a common joint hole for connecting a common joint, and a side of the first partition facing the common joint hole is concavely coupled a window, the first head cavity, the second head cavity, and the second layer cavity are both in communication with the coupling window, the first spacer, the second spacer, and the first resonance a coupling hole is formed in the column, the second resonant column or the third resonant column, and one end of the coupling rod is used for connecting with a common joint, One end is inserted into the coupling hole; a signal is transmitted from the common joint to the coupling rod, and then passes through the coupling hole and the coupling window to finally radiate to the first head cavity, the second head cavity, and the The second layer of cavity.
- 根据权利要求1所述的双层腔合路器的公共端口装置,其特征在于,所述第三谐振柱包括设于所述第一隔板上的柱台和位于所述柱台上的谐振柱本体,所述柱台上开设有所述耦合孔。A common port device for a double-cavity combiner according to claim 1, wherein said third resonant column includes a pylon disposed on said first diaphragm and a resonance on said pylon The column body is provided with the coupling hole.
- 根据权利要求1所述的双层腔合路器的公共端口装置,其特征在于,所述耦合孔与所述公共接头孔相对设置。A common port device for a two-layer cavity combiner according to claim 1, wherein said coupling hole is disposed opposite said common joint hole.
- 根据权利要求1所述的双层腔合路器的公共端口装置,其特征在于,还包括套设于所述耦合棒上的介质套,所述介质套位于所述耦合孔内。The common port device of the double-cavity combiner according to claim 1, further comprising a dielectric sleeve sleeved on the coupling rod, the dielectric sleeve being located in the coupling hole.
- 根据权利要求1所述的双层腔合路器的公共端口装置,其特征在于,所述第二隔板面向所述公共接头孔的一侧与所述壳体之间设有间隙。The common port device of the double-cavity combiner according to claim 1, wherein a gap is provided between a side of the second partition facing the common joint hole and the casing.
- 根据权利要求1至5中任一项所述的双层腔合路器的公共端口装置,其特征在于,所述耦合棒包括插入所述耦合孔的第一级棒和用于与公共接头连接的第二级棒,所述第一级棒的直径大于所述第二级棒的直径。A common port device for a double-cavity combiner according to any one of claims 1 to 5, wherein the coupling rod includes a first-stage rod inserted into the coupling hole and is connected to a common joint a second stage rod having a diameter greater than a diameter of the second stage rod.
- 根据权利要求1至5中任一项所述的双层腔合路器的公共端口装置,其特征在于,所述耦合棒包括插入所述耦合孔的第一级棒和用于与公共接头连接 的第二级棒,所述第一级棒的直径小于所述第二级棒的直径。A common port device for a double-cavity combiner according to any one of claims 1 to 5, wherein the coupling rod includes a first-stage rod inserted into the coupling hole and is connected to a common joint a second stage rod having a diameter smaller than a diameter of the second stage rod.
- 根据权利要求1至5中任一项所述的双层腔合路器的公共端口装置,其特征在于,所述耦合窗口包括与所述第一首腔对接的第一窗口和与所述第二首腔对接的第二窗口,所述第一窗口的底部凹设有扩张口。A common port device for a two-layer cavity combiner according to any one of claims 1 to 5, wherein the coupling window includes a first window that interfaces with the first head cavity and a second window in which the first cavity is butted, and a bottom of the first window is concavely provided with an expansion port.
- 根据权利要求1至5中任一项所述的双层腔合路器的公共端口装置,其特征在于,所述耦合窗口包括与所述第一首腔对接的第一窗口和与所述第二首腔对接的第二窗口,所述第二窗口的底部凹设有扩张口。A common port device for a two-layer cavity combiner according to any one of claims 1 to 5, wherein the coupling window includes a first window that interfaces with the first head cavity and a second window in which the first cavity is butted, and a bottom of the second window is concavely provided with an expansion port.
- 一种双层腔合路器,包括权利要求1至9中任一项所述的公共端口装置。A double-cavity combiner comprising the common port device of any one of claims 1-9.
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