WO2018135427A1 - Flux and solder material - Google Patents

Flux and solder material Download PDF

Info

Publication number
WO2018135427A1
WO2018135427A1 PCT/JP2018/000786 JP2018000786W WO2018135427A1 WO 2018135427 A1 WO2018135427 A1 WO 2018135427A1 JP 2018000786 W JP2018000786 W JP 2018000786W WO 2018135427 A1 WO2018135427 A1 WO 2018135427A1
Authority
WO
WIPO (PCT)
Prior art keywords
flux
mass
phenol resin
terpene phenol
solder
Prior art date
Application number
PCT/JP2018/000786
Other languages
French (fr)
Japanese (ja)
Inventor
一博 行方
勇介 佐藤
Original Assignee
株式会社弘輝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社弘輝 filed Critical 株式会社弘輝
Publication of WO2018135427A1 publication Critical patent/WO2018135427A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to a flux and a solder material containing the flux.
  • solder materials including solder alloy and flux are used for joining electronic parts.
  • a metal alloy such as copper or a copper alloy is used for a joint portion of an electronic component joined by such solder.
  • the flux is for improving solderability, and is mixed in the solder material or used together with the solder alloy.
  • Such a flux includes various components such as a resin component, an activator component, a solvent component, an antioxidant component, a thixotropic component, and the like.
  • discoloration may occur in the metal at the joint due to these flux components.
  • copper or a copper alloy there is a problem that it may be discolored to green due to the formation of an organic acid copper salt, which is mistaken for corrosion (greenish blue).
  • a flux for suppressing such discoloration has been studied.
  • Patent Document 1 describes a flux containing benzotriazole. Since benzotriazole has a rust preventive action on the alloy, it is effective in suppressing discoloration due to rust and also suppressing discoloration of copper or copper alloy. However, the flux containing benzotriazole has a problem that the wettability of the solder material is lowered.
  • Patent Document 2 describes a flux that can suppress discoloration of copper or a copper alloy by containing tetrazole. However, tetrazole reacts with metals such as copper in an acidic solution to form a metal salt, and when such a metal salt crystallizes, it may explode by heating. Therefore, the content of tetrazole cannot be increased, and as a result, the discoloration suppressing effect may be insufficient.
  • the present invention has been made in view of the problems of the prior art as described above, and it is an object to provide a flux and a solder material that can sufficiently suppress discoloration of a metal surface while maintaining solder wettability.
  • the present invention concerning flux contains a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
  • the present invention contains a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
  • a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
  • a terpene phenol resin having a softening point of 20 ° C. or higher and 180 ° C. or lower may be included.
  • the terpene phenol resin may be contained in an amount of 5% by mass to 90% by mass in terms of solid content.
  • the hydroxyl value of the terpene phenol resin may be 250 mgKOH / g or less.
  • the present invention concerning the solder material includes the flux and the solder alloy.
  • the flux which concerns on this invention, and the solder material containing a flux are demonstrated.
  • the flux of the present embodiment is a flux containing a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
  • the terpene phenol resin refers to a resin obtained by copolymerizing a terpene monomer and a phenol. Or the thing obtained by copolymerizing a terpene monomer, monomers other than a terpene monomer, and phenols is said. Furthermore, what added the other component to the obtained terpene phenol resin, for example, what hydrogenated, etc. are included.
  • terpene monomer examples include hemiterpenes having 5 carbon atoms such as isoprene, monoterpenes having 10 carbon atoms, sesquiterpenes having 15 carbon atoms, diterpenes having 20 carbon atoms, sesterterpenes having 25 carbon atoms, and 30 carbon atoms. Examples include, but are not limited to, triterpenes and tetraterpenes having 40 carbon atoms.
  • phenols include, but are not limited to, phenol, cresol, xylenol and the like.
  • the hydroxyl value of the terpene phenol resin is 110 mgKOH / g or more, preferably 250 mgKOH / g or less, more preferably 150 mgKOH / g or more and 250 mgKOH / g or less, and still more preferably 180 mgKOH / g or more and 200 mgKOH / g or less.
  • discoloration of the metal surface can be sufficiently suppressed while maintaining the solder wettability.
  • the hydroxyl value of the terpene phenol resin of this embodiment is 7.2 potentiometric titration of JIS K 0070 “Testing method for acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponified product of chemical products”. It refers to the hydroxyl value measured according to the method.
  • terpene phenol resin examples include YS polyster (terpene phenol resin: manufactured by Yashara Chemical Co., Ltd.), Tamanol (terpene phenol resin: manufactured by Arakawa Chemical Industry Co., Ltd.), Tertac 80 (terpene phenol resin: manufactured by Nippon Terpene Chemical Co., Ltd.), Sylvares TP ( Terpene phenol resin (manufactured by Air Brown Co., Ltd.) and the like can be mentioned as commercially available products.
  • YS polyster terpene phenol resin: manufactured by Yashara Chemical Co., Ltd.
  • Tamanol terpene phenol resin: manufactured by Arakawa Chemical Industry Co., Ltd.
  • Tertac 80 terpene phenol resin: manufactured by Nippon Terpene Chemical Co., Ltd.
  • Sylvares TP Terpene phenol resin (manufactured by Air Brown Co., Ltd.) and the like can be mentioned as commercially available products.
  • the content of the terpene phenol resin in the flux is not particularly limited, but is, for example, 5% by mass to 90% by mass, preferably 15% by mass to 50% by mass, and more preferably 20% by mass. % Or more and 30% by mass or less.
  • a flux having a higher discoloration suppressing effect can be obtained while maintaining the solderability.
  • the flux of this embodiment may include a terpene phenol resin having a softening point of 20 ° C. or higher and 180 ° C. or lower.
  • the flux of the present embodiment may include one terpene phenol resin having a hydroxyl value in the above range and a softening point in the above range, or the hydroxyl value in the above range.
  • a terpene phenol resin having a softening point in the above range may be further included. That is, the terpene phenol resin may include one type or a plurality of types.
  • the softening point of the terpene phenol resin is, for example, 20 ° C. or higher and 180 ° C.
  • the softening point of the terpene phenol resin of this embodiment refers to the softening point measured according to the JIS K 2207 “petroleum asphalt” 6.4 softening point test method.
  • the flux of the present embodiment includes known flux components such as organic acids, resin components other than terpene phenol resins, activator components other than organic acids, solvent components, antioxidant components, thixotropic An ingredient etc. may be included.
  • each of these components can be mix
  • the flux of this embodiment may contain an organic acid.
  • the organic acid is not particularly limited as long as it is a known component used as a flux activator component or the like. Examples thereof include glutaric acid, adipic acid, azelaic acid, sebacic acid, stearic acid, benzoic acid, dodecanedioic acid, succinic acid, maleic acid, isocyanuric acid and the like.
  • the organic acids can be used alone or in combination.
  • the content of the organic acid in the flux is not particularly limited.
  • the content is 0.1% by mass to 80% by mass, preferably 1.0% by mass to 70% by mass in terms of solid matter. It is done.
  • amine halogen salts examples include diethylamine, dibutylamine, tributylamine, diphenylguanidine, cyclohexylamine and the like.
  • examples of the halogen compound include fluorine, chlorine, bromine and iodine.
  • examples of halogen compounds include 2,3-dibromo-2-butene-1,4-diol, 2-bromo-3-iodo-2-butene-1,4-diol, and TBA-bis (2,3-dibromopropyl ether). ) And the like.
  • the activator can be used alone or in combination.
  • the content of the activator component in the flux is not particularly limited.
  • the activator component other than the organic acid 0.1% by mass or more and 20% by mass or less, preferably 0.5% by mass or more. 10 mass% or less etc. are mentioned.
  • the flux of this embodiment may contain a resin component other than the terpene phenol resin as a rosin component.
  • the resin component other than the terpene phenol resin is not particularly limited as long as it is a known resin component used as a resin component of the flux, such as a synthetic resin or a natural resin. Examples thereof include polymerized rosin, hydrogenated rosin, natural rosin, disproportionated rosin, and acid-modified rosin.
  • the above resins can be used alone or in combination.
  • the content of the resin component in the flux is not particularly limited. For example, it is 1.0% by mass or more and 80% by mass or less (preferably 10% by mass) together with the terpene phenol resin. % Or more and 30% by mass or less.
  • the content of the terpene phenol resin in all the resin components may be 50% by mass or more and 100% by mass or less, and preferably 70% by mass or more and 90% by mass or less.
  • the compatibility of these components can be improved when an organic acid and other activator components are contained.
  • glycol ethers such as diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono 2-ethylhexyl ether (2 ethylhexyl diglycol), diethylene glycol monobutyl ether (butyl diglycol); n- Aliphatic compounds such as hexane, isohexane and n-heptane; esters such as isopropyl acetate, methyl propionate and ethyl propionate; ketones such as methyl ethyl ketone, methyl-n-propyl ketone and diethyl ketone; ethanol and n-propanol , Alcohols such as isopropanol, isobutanol, and
  • the content of the solvent component in the flux is not particularly limited, and examples thereof include 20% by mass to 98% by mass, preferably 40% by mass to 96% by mass.
  • the antioxidant component is not particularly limited as long as it is a known component used as an antioxidant component of the flux.
  • a phenolic antioxidant, a bisphenolic antioxidant, a polymer type antioxidant, etc. are mentioned.
  • the content of the antioxidant in the flux is not particularly limited, and examples include 0.1 mass% to 50 mass%, preferably 1.0 mass% to 20 mass%.
  • the thixotropic component is not particularly limited as long as it is a known component used as a thixotropic component of the flux.
  • a thixotropic component of the flux For example, hydrogenated castor oil, fatty acid amides, oxy fatty acids, wax and the like can be mentioned.
  • the content of the thixotropic component in the flux is not particularly limited, and examples thereof include 0.1 to 50% by mass, preferably 1.0 to 20% by mass.
  • the flux of this embodiment may further contain other additives.
  • the flux of the present embodiment can be used as a liquid flux such as a post flux, but can also be used as a flux for a solder material such as solder paste or flux solder.
  • the solder material of this embodiment contains each said flux and solder alloy.
  • the solder alloy may be a lead-free alloy.
  • the solder alloy is not particularly limited, and may be either a lead-free (lead-free) solder alloy or a leaded solder alloy, but a lead-free solder alloy is preferable from the viewpoint of environmental impact.
  • examples of the lead-free solder alloy include alloys containing tin, silver, copper, zinc, bismuth, antimony, etc., and more specifically, Sn / Ag, Sn / Ag / Cu, Sn.
  • Sn / Ag / Bi examples thereof include alloys such as / Ag / Cu / Bi / In / Sb and In / Ag.
  • Sn / Ag / Cu is preferable.
  • the solder material of the present embodiment is a cored solder having a linear solder alloy filled with a flux therein, for example, the solder alloy is 95% by mass to 99% by mass, preferably 96% by weight. % To 98% by weight is preferable.
  • the solder material of the present embodiment is a solder paste obtained by mixing the solder alloy and the flux of the present embodiment, for example, the solder alloy is 80 mass% to 95 mass%, and the flux is 5 mass. % To 20% by mass or less is preferable.
  • the flux of the present embodiment contains a terpene phenol resin having a specific hydroxyl value, and when blended in a solder material, the discoloration of the metal surface can be sufficiently suppressed while maintaining the solder wettability. . In particular, it has an excellent discoloration suppressing effect on copper or copper alloys.
  • Flux production The materials shown below were prepared according to the formulation shown in Table 1 to produce fluxes used in each example and comparative example.
  • the manufacturing method is as follows. Each flux was put into a suitable container and mixed at room temperature until all the materials were uniformly dissolved to obtain each flux.
  • Rosin component rosin 1: hydrogenated rosin
  • rosin 2 ultra light rosin ester
  • rosin 3 ultra light liquid rosin derivative terpene phenol resin
  • terpene phenol resin 1-5 Polyparavinylphenol marcalinker (Maruzen Petrochemical Co., Ltd.) Organic acid, commercially available organic acid activator additive, 2,3-dibromo-2-butene-1,4-diol solvent component, IPA
  • Table 2 shows the hydroxyl value and softening point (manufacturer indicated value) of the terpene phenol resins 1 to 5.
  • the hydroxyl value was measured according to the 7.2 potentiometric titration method of JIS K 0070 “Testing method of acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponified product of chemical products”.
  • the softening point was measured according to JIS K 2207 “Petroleum Asphalt” 6.4 Softening Point Test Method. Each measured value was a numerical value inside the range shown in Table 2.
  • a phosphorus-deoxidized copper plate (10 mm ⁇ 30 mm ⁇ thickness 0.3 mm) was subjected to ultrasonic cleaning with IPA for 5 minutes, then wiped off with IPA, further washed with 1.75% HCl aqueous solution, 4 times with pure water, and 1 with IPA.
  • the test substrate was rinsed, wiped off IPA, and dried.

Abstract

Flux, etc., that includes a terpene phenol resin that has a hydroxyl value of at least 110 mgKOH/g.

Description

フラックス及びはんだ材料Flux and solder materials
　本発明は、フラックス、及びフラックスを含むはんだ材料に関する。 The present invention relates to a flux and a solder material containing the flux.
　電子部品の接合等には、はんだ合金とフラックスとを含むはんだ材料等が用いられる。かかるはんだで接合される電子部品の接合部は銅あるいは銅合金等の金属合金が使用される。フラックスははんだ付け性を向上させるためのものであり、はんだ材料中に配合されたり、はんだ合金と共に使用されたりするものである。かかるフラックスは、樹脂成分、活性剤成分、溶剤成分、酸化防止成分、チキソトロピック成分等の各種成分を含むが、これらのフラックスの成分によって前記接合部の金属に変色が生じる場合がある。特に、銅あるいは銅合金の場合には有機酸銅塩が生じることにより緑色に変色する場合があり、腐食（緑青）と見間違われるという問題がある。かかる変色を抑制するためのフラックスが検討されている。 は ん だ Solder materials including solder alloy and flux are used for joining electronic parts. A metal alloy such as copper or a copper alloy is used for a joint portion of an electronic component joined by such solder. The flux is for improving solderability, and is mixed in the solder material or used together with the solder alloy. Such a flux includes various components such as a resin component, an activator component, a solvent component, an antioxidant component, a thixotropic component, and the like. In some cases, discoloration may occur in the metal at the joint due to these flux components. In particular, in the case of copper or a copper alloy, there is a problem that it may be discolored to green due to the formation of an organic acid copper salt, which is mistaken for corrosion (greenish blue). A flux for suppressing such discoloration has been studied.
　例えば、特許文献１には、ベンゾトリアゾールを含むフラックスが記載されている。ベンゾトリアゾールは合金に対して防錆作用があるため錆による変色の抑制とともに、銅あるいは銅合金の変色抑制にも効果を発揮する。しかし、ベンゾトリアゾールを含むフラックスでははんだ材料の濡れ性が低下するという問題がある。
　特許文献２には、テトラゾールを含むことで銅あるいは銅合金の変色が抑制できるフラックスが記載されている。しかし、テトラゾールは酸性の溶液中などでは銅などの金属と反応して金属塩を形成し、かかる金属塩が結晶化すると加熱によって爆発することもある。よって、テトラゾールの含有量を多くすることができず、その結果、変色抑制効果も不十分になる可能性がある。 For example, Patent Document 1 describes a flux containing benzotriazole. Since benzotriazole has a rust preventive action on the alloy, it is effective in suppressing discoloration due to rust and also suppressing discoloration of copper or copper alloy. However, the flux containing benzotriazole has a problem that the wettability of the solder material is lowered.
Patent Document 2 describes a flux that can suppress discoloration of copper or a copper alloy by containing tetrazole. However, tetrazole reacts with metals such as copper in an acidic solution to form a metal salt, and when such a metal salt crystallizes, it may explode by heating. Therefore, the content of tetrazole cannot be increased, and as a result, the discoloration suppressing effect may be insufficient.
日本国特許第３２４７７５２号公報Japanese Patent No. 32477752 日本国特許第４７６０７１０号公報Japanese Patent No. 4760710
　本発明は、前記のような従来技術の問題点に鑑みてなされたものであり、はんだ濡れ性を維持しつつ、金属表面の変色を十分に抑制しうるフラックス及びはんだ材料を提供することを課題とする。 The present invention has been made in view of the problems of the prior art as described above, and it is an object to provide a flux and a solder material that can sufficiently suppress discoloration of a metal surface while maintaining solder wettability. And
　フラックスにかかる本発明は、水酸基価が１１０ｍｇＫＯＨ／ｇ以上のテルペンフェノール樹脂を含む。 The present invention concerning flux contains a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
　本発明によれば、水酸基価が１１０ｍｇＫＯＨ／ｇ以上のテルペンフェノール樹脂を含むものであり、はんだ材料に配合された場合には、はんだ濡れ性を維持しつつ、金属表面の変色を十分に抑制しうる。 According to the present invention, it contains a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more. When blended in a solder material, the discoloration of the metal surface is sufficiently suppressed while maintaining solder wettability. sell.
　本発明において、軟化点が２０℃以上１８０℃以下であるテルペンフェノール樹脂を含んでいてもよい。 In the present invention, a terpene phenol resin having a softening point of 20 ° C. or higher and 180 ° C. or lower may be included.
　本発明において、テルペンフェノール樹脂が固形分換算で５質量％以上９０質量％以下含まれていてもよい。 In the present invention, the terpene phenol resin may be contained in an amount of 5% by mass to 90% by mass in terms of solid content.
　本発明において、テルペンフェノール樹脂の水酸基価が２５０ｍｇＫＯＨ／ｇ以下であってもよい。 In the present invention, the hydroxyl value of the terpene phenol resin may be 250 mgKOH / g or less.
　はんだ材料にかかる本発明は、前記フラックスとはんだ合金とを含む。 The present invention concerning the solder material includes the flux and the solder alloy.
　本発明によれば、はんだ濡れ性を維持しつつ、金属表面の変色を十分に抑制しうるフラックス及びはんだ材料を提供することができる。 According to the present invention, it is possible to provide a flux and a solder material that can sufficiently suppress discoloration of a metal surface while maintaining solder wettability.
　以下に、本発明に係るフラックス、及び、フラックスを含むはんだ材料について説明する。
　本実施形態のフラックスは水酸基価が１１０ｍｇＫＯＨ／ｇ以上のテルペンフェノール樹脂を含むフラックスである。 Below, the flux which concerns on this invention, and the solder material containing a flux are demonstrated.
The flux of the present embodiment is a flux containing a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
　本実施形態においてテルペンフェノール樹脂とは、テルペンモノマーとフェノール類とを共重合して得られたものをいう。あるいは、テルペンモノマーと、テルペンモノマー以外のモノマーと、フェノール類とを共重合して得られたものをいう。さらに、得られたテルペンフェノール樹脂に他の成分を添加したもの、例えば、水素添加したもの等も含む。 In this embodiment, the terpene phenol resin refers to a resin obtained by copolymerizing a terpene monomer and a phenol. Or the thing obtained by copolymerizing a terpene monomer, monomers other than a terpene monomer, and phenols is said. Furthermore, what added the other component to the obtained terpene phenol resin, for example, what hydrogenated, etc. are included.
　テルペンモノマーとしては、イソプレンなどの炭素数５のヘミテルペン類、炭素数１０のモノテルペン類、炭素数１５のセスキテルペン類、炭素数２０のジテルペン類、炭素数２５のセスタテルペン類、炭素数３０のトリテルペン類、炭素数４０のテトラテルペン類等が挙げられるがこれらに限定されない。 Examples of the terpene monomer include hemiterpenes having 5 carbon atoms such as isoprene, monoterpenes having 10 carbon atoms, sesquiterpenes having 15 carbon atoms, diterpenes having 20 carbon atoms, sesterterpenes having 25 carbon atoms, and 30 carbon atoms. Examples include, but are not limited to, triterpenes and tetraterpenes having 40 carbon atoms.
　フェノール類としては、フェノール、クレゾール、キシレノール等が挙げられるが、これらに限定されない。 Examples of phenols include, but are not limited to, phenol, cresol, xylenol and the like.
　テルペンフェノール樹脂の水酸基価は、１１０ｍｇＫＯＨ／ｇ以上、好ましくは、２５０ｍｇＫＯＨ／ｇ以下、より好ましくは、１５０ｍｇＫＯＨ／ｇ以上２５０ｍｇＫＯＨ／ｇ以下、さらにより好ましくは１８０ｍｇＫＯＨ／ｇ以上２００ｍｇＫＯＨ／ｇ以下である。
　テルペンフェノール樹脂の水酸基価が上記範囲であることで、はんだ濡れ性を維持しつつ、金属表面の変色を十分に抑制しうる。 The hydroxyl value of the terpene phenol resin is 110 mgKOH / g or more, preferably 250 mgKOH / g or less, more preferably 150 mgKOH / g or more and 250 mgKOH / g or less, and still more preferably 180 mgKOH / g or more and 200 mgKOH / g or less.
When the hydroxyl value of the terpene phenol resin is within the above range, discoloration of the metal surface can be sufficiently suppressed while maintaining the solder wettability.
　尚、本実施形態のテルペンフェノール樹脂の水酸基価は、ＪＩＳ　Ｋ　００７０「化学製品の酸価，けん化価，エステル価，よう素価，水酸基価及び不けん化物の試験方法」の７．２　電位差滴定法に従って測定される水酸基価を指す。 The hydroxyl value of the terpene phenol resin of this embodiment is 7.2 potentiometric titration of JIS K 0070 “Testing method for acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponified product of chemical products”. It refers to the hydroxyl value measured according to the method.
　テルペンフェノール樹脂の具体例としては、ＹＳポリスター（テルペンフェノール樹脂：ヤスハラケミカル社製）、タマノル（テルペンフェノール樹脂：荒川化学工業社製）、テルタック８０（テルペンフェノール樹脂：日本テルペン化学社製）、ＳｙｌｖａｒｅｓＴＰ（テルペンフェノール樹脂：エア・ブラウン社製）等が市販品として容易に入手できるものとして挙げられる。 Specific examples of the terpene phenol resin include YS polyster (terpene phenol resin: manufactured by Yashara Chemical Co., Ltd.), Tamanol (terpene phenol resin: manufactured by Arakawa Chemical Industry Co., Ltd.), Tertac 80 (terpene phenol resin: manufactured by Nippon Terpene Chemical Co., Ltd.), Sylvares TP ( Terpene phenol resin (manufactured by Air Brown Co., Ltd.) and the like can be mentioned as commercially available products.
　テルペンフェノール樹脂のフラックスにおける含有量（固形分換算）は特に限定されるものではないが、例えば、５質量％以上９０質量％以下、好ましくは１５質量％以上５０質量％以下、より好ましくは２０質量％以上３０質量％以下であること等が挙げられる。
　テルペンフェノール樹脂のフラックスにおける含有量が前記範囲である場合には、はんだ付け性を維持しつつより変色抑制効果が高いフラックスが得られる。 The content of the terpene phenol resin in the flux (in terms of solid content) is not particularly limited, but is, for example, 5% by mass to 90% by mass, preferably 15% by mass to 50% by mass, and more preferably 20% by mass. % Or more and 30% by mass or less.
When the content of the terpene phenol resin in the flux is within the above range, a flux having a higher discoloration suppressing effect can be obtained while maintaining the solderability.
　本実施形態のフラックスは、軟化点が２０℃以上１８０℃以下であるテルペンフェノール樹脂を含んでいてもよい。
　本実施形態のフラックスは、水酸基価が上述のような範囲であって、且つ、軟化点が上記範囲であるような一のテルペンフェノール樹脂を含んでいてもよく、あるいは、水酸基価が上記範囲であるようなテルペンフェノール樹脂に加えて、軟化点が上記範囲であるようなテルペンフェノール樹脂をさらに含んでいてもよい。すなわち、テルペンフェノール樹脂として、一種類を含んでいても、複数種類を含んでいてもよい。
　テルペンフェノール樹脂の軟化点は、例えば、２０℃以上１８０℃以下、好ましくは２０℃以上１５０℃以下、より好ましくは２０℃以上１３０℃以下である。
　かかる軟化点であるテルペンフェノール樹脂をさらに含むことで、より高い変色抑制効果及びはんだ付け性効果が得られる。 The flux of this embodiment may include a terpene phenol resin having a softening point of 20 ° C. or higher and 180 ° C. or lower.
The flux of the present embodiment may include one terpene phenol resin having a hydroxyl value in the above range and a softening point in the above range, or the hydroxyl value in the above range. In addition to a certain terpene phenol resin, a terpene phenol resin having a softening point in the above range may be further included. That is, the terpene phenol resin may include one type or a plurality of types.
The softening point of the terpene phenol resin is, for example, 20 ° C. or higher and 180 ° C. or lower, preferably 20 ° C. or higher and 150 ° C. or lower, more preferably 20 ° C. or higher and 130 ° C. or lower.
By further including the terpene phenol resin which is such a softening point, higher discoloration suppressing effect and solderability effect can be obtained.
　尚、本実施形態のテルペンフェノール樹脂の軟化点は、ＪＩＳ　Ｋ　２２０７「石油アスファルト」６．４　軟化点試験方法に従って測定される軟化点を指す。 In addition, the softening point of the terpene phenol resin of this embodiment refers to the softening point measured according to the JIS K 2207 “petroleum asphalt” 6.4 softening point test method.
　本実施形態のフラックスは、テルペンフェノール樹脂の他に、公知のフラックスの成分、例えば、有機酸、テルペンフェノール樹脂以外の樹脂成分、有機酸以外の活性剤成分、溶剤成分、酸化防止成分、チキソトロピック成分等を含んでいてもよい。
　尚、これらの各成分は必要に応じてフラックスに配合されることができ、いずれの成分が含まれていても含まれていなくてもよい。 In addition to the terpene phenol resin, the flux of the present embodiment includes known flux components such as organic acids, resin components other than terpene phenol resins, activator components other than organic acids, solvent components, antioxidant components, thixotropic An ingredient etc. may be included.
In addition, each of these components can be mix | blended with a flux as needed, and it does not need to be contained even if any component is contained.
　本実施形態のフラックスは、有機酸を含んでいてもよい。
　有機酸は、フラックスの活性剤成分等として用いられる公知の成分であれば特に限定されるものではない。例えば、グルタル酸、アジピン酸、アゼライン酸、セバシン酸、ステアリン酸、安息香酸、ドデカン二酸、コハク酸、マレイン酸、イソシアヌル酸等が挙げられる。
　前記有機酸は、単独で、あるいは複数種類を混合して用いることができる。 The flux of this embodiment may contain an organic acid.
The organic acid is not particularly limited as long as it is a known component used as a flux activator component or the like. Examples thereof include glutaric acid, adipic acid, azelaic acid, sebacic acid, stearic acid, benzoic acid, dodecanedioic acid, succinic acid, maleic acid, isocyanuric acid and the like.
The organic acids can be used alone or in combination.
　前記有機酸のフラックスにおける含有量は特に限定されるものではないが、例えば、固形物換算で０．１質量％以上８０質量％以下、好ましくは１．０質量％以上７０質量％以下等が挙げられる。 The content of the organic acid in the flux is not particularly limited. For example, the content is 0.1% by mass to 80% by mass, preferably 1.0% by mass to 70% by mass in terms of solid matter. It is done.
　有機酸以外の活性剤成分としては、アミンハロゲン塩、ハロゲン化合物等を用いることができる。
　アミンハロゲン塩のアミンとしては、ジエチルアミン、ジブチルアミン、トリブチルアミン、ジフェニルグアニジン、シクロヘキシルアミンなどが挙げられる。対するハロゲン化合物としては、フッ素、塩素、臭素、ヨウ素が挙げられる。ハロゲン化合物としては、２，３－ジブロモ-２-ブテン-１，４-ジオール、２-ブロモ-３-ヨード-２-ブテン-１，４-ジオール、ＴＢＡ－ビス（２，３－ジブロモプロピルエーテル）等が挙げられる。
　前記活性剤は、単独で、あるいは複数種類を混合して用いることができる。 As activator components other than organic acids, amine halogen salts, halogen compounds, and the like can be used.
Examples of the amine halogen salt include diethylamine, dibutylamine, tributylamine, diphenylguanidine, cyclohexylamine and the like. On the other hand, examples of the halogen compound include fluorine, chlorine, bromine and iodine. Examples of halogen compounds include 2,3-dibromo-2-butene-1,4-diol, 2-bromo-3-iodo-2-butene-1,4-diol, and TBA-bis (2,3-dibromopropyl ether). ) And the like.
The activator can be used alone or in combination.
　前記活性剤成分のフラックスにおける含有量は特に限定されるものではないが、例えば、有機酸以外の活性剤成分については、０．１質量％以上２０質量％以下、好ましくは０．５質量％以上１０質量％以下等が挙げられる。 The content of the activator component in the flux is not particularly limited. For example, for the activator component other than the organic acid, 0.1% by mass or more and 20% by mass or less, preferably 0.5% by mass or more. 10 mass% or less etc. are mentioned.
　本実施形態のフラックスは、テルペンフェノール樹脂以外の樹脂成分をロジン成分として含んでいてもよい。
　テルペンフェノール樹脂以外の樹脂成分としては、合成樹脂、天然樹脂など、フラックスの樹脂成分として用いられる公知の樹脂成分であれば特に限定されるものではない。例えば、重合ロジン、水添ロジン、天然ロジン、不均化ロジン、酸変性ロジン等が挙げられる。
　前記樹脂は、単独で、あるいは複数種類を混合して用いることができる。
　この場合、前記樹脂成分のフラックスにおける含有量は特に限定されるものではないが、例えば、テルペンフェノール樹脂と合わせて（固形物換算で）１．０質量％以上８０質量％以下、好ましくは１０質量％以上３０質量％以下等が挙げられる。 The flux of this embodiment may contain a resin component other than the terpene phenol resin as a rosin component.
The resin component other than the terpene phenol resin is not particularly limited as long as it is a known resin component used as a resin component of the flux, such as a synthetic resin or a natural resin. Examples thereof include polymerized rosin, hydrogenated rosin, natural rosin, disproportionated rosin, and acid-modified rosin.
The above resins can be used alone or in combination.
In this case, the content of the resin component in the flux is not particularly limited. For example, it is 1.0% by mass or more and 80% by mass or less (preferably 10% by mass) together with the terpene phenol resin. % Or more and 30% by mass or less.
　さらに、全樹脂成分中のテルペンフェノール樹脂の含有量は５０質量％以上１００質量％以下、好ましくは７０質量％以上９０質量％以下であってもよい。
　フラックス中にテルペンフェノール樹脂とさらにその他のロジンとが含まれることで、有機酸やその他の活性剤成分を含む場合にこれらの各成分の相溶性を向上させることができる。 Furthermore, the content of the terpene phenol resin in all the resin components may be 50% by mass or more and 100% by mass or less, and preferably 70% by mass or more and 90% by mass or less.
When the terpene phenol resin and other rosin are contained in the flux, the compatibility of these components can be improved when an organic acid and other activator components are contained.
　溶剤成分としては、フラックスの溶剤成分として用いられる公知の成分であれば特に限定されるものではない。例えば、ジエチレングリコールモノヘキシルエーテル（ヘキシルジグリコール）、ジエチレングリコールジブチルエーテル（ジブチルジグリコール）、ジエチレングリコールモノ２－エチルヘキシルエーテル（２エチルヘキシルジグリコール）、ジエチレングリコールモノブチルエーテル（ブチルジグリコール）などのグリコールエーテル類；ｎ－ヘキサン、イソヘキサン、ｎ－ヘプタンなどの脂肪族系化合物；酢酸イソプロピル、プロピオン酸メチル、プロピオン酸エチルなどのエステル類；メチルエチルケトン、メチル－ｎ－プロピルケトン、ジエチルケトンなどのケトン類；エタノール、ｎ－プロパノール、イソプロパノール、イソブタノール、オクタンジオールなどのアルコール類等が挙げられる。
　前記溶剤は、単独で、あるいは複数種類を混合して用いることができる。 As a solvent component, if it is a well-known component used as a solvent component of a flux, it will not specifically limit. For example, glycol ethers such as diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono 2-ethylhexyl ether (2 ethylhexyl diglycol), diethylene glycol monobutyl ether (butyl diglycol); n- Aliphatic compounds such as hexane, isohexane and n-heptane; esters such as isopropyl acetate, methyl propionate and ethyl propionate; ketones such as methyl ethyl ketone, methyl-n-propyl ketone and diethyl ketone; ethanol and n-propanol , Alcohols such as isopropanol, isobutanol, and octanediol.
The said solvent can be used individually or in mixture of multiple types.
　前記溶剤成分のフラックスにおける含有量は特に限定されるものではないが、例えば、２０質量％以上９８質量％以下、好ましくは４０質量％以上９６質量％以下等が挙げられる。 The content of the solvent component in the flux is not particularly limited, and examples thereof include 20% by mass to 98% by mass, preferably 40% by mass to 96% by mass.
　酸化防止剤成分としては、フラックスの酸化防止剤成分として用いられる公知の成分であれば特に限定されるものではない。例えば、フェノール系酸化防止剤、ビスフェノール系酸化防止剤、ポリマー型酸化防止剤等が挙げられる。
　前記酸化防止剤のフラックスにおける含有量は特に限定されるものではないが、例えば、０．１質量％以上５０質量％以下、好ましくは１．０質量％以上２０質量％以下等が挙げられる。 The antioxidant component is not particularly limited as long as it is a known component used as an antioxidant component of the flux. For example, a phenolic antioxidant, a bisphenolic antioxidant, a polymer type antioxidant, etc. are mentioned.
The content of the antioxidant in the flux is not particularly limited, and examples include 0.1 mass% to 50 mass%, preferably 1.0 mass% to 20 mass%.
　チキソトロピック成分としては、フラックスのチキソトロピック成分として用いられる公知の成分であれば特に限定されるものではない。例えば、水素添加ヒマシ油、脂肪酸アマイド類、オキシ脂肪酸類、ワックス等が挙げられる。
　前記チキソトロピック成分のフラックスにおける含有量は特に限定されるものではないが、例えば、０．１質量％以上５０質量％以下、好ましくは１．０質量％以上２０質量％以下等が挙げられる。 The thixotropic component is not particularly limited as long as it is a known component used as a thixotropic component of the flux. For example, hydrogenated castor oil, fatty acid amides, oxy fatty acids, wax and the like can be mentioned.
The content of the thixotropic component in the flux is not particularly limited, and examples thereof include 0.1 to 50% by mass, preferably 1.0 to 20% by mass.
　本実施形態のフラックスには、さらに、他の添加剤を含んでいてもよい。 The flux of this embodiment may further contain other additives.
　本実施形態のフラックスは、ポストフラックス等の液状フラックスとして用いることができるが、その他、ソルダーペースト、やに入りはんだのようなはんだ材料用のフラックスとしても用いられる。 The flux of the present embodiment can be used as a liquid flux such as a post flux, but can also be used as a flux for a solder material such as solder paste or flux solder.
　本実施形態のはんだ材料は、前記各フラックスとはんだ合金とを含む。
　前記はんだ合金は、鉛フリー合金であってもよい。
　前記はんだ合金としては、特に限定されるものではなく、鉛フリー(無鉛）のはんだ合金、有鉛のはんだ合金のいずれでもよいが、環境への影響の観点から鉛フリーのはんだ合金が好ましい。
　具体的には、鉛フリーのはんだ合金としては、スズ、銀、銅、亜鉛、ビスマス、アンチモン等を含む合金等が挙げられ、より具体的には、Ｓｎ／Ａｇ、Ｓｎ／Ａｇ／Ｃｕ、Ｓｎ／Ｃｕ、Ｓｎ／Ａｇ／Ｂｉ、Ｓｎ／Ｂｉ、Ｓｎ／Ａｇ／Ｃｕ／Ｂｉ、Ｓｎ／Ｓｂ、Ｓｎ／Ｚｎ／Ｂｉ、Ｓｎ／Ｚｎ、Ｓｎ／Ｚｎ／Ａｌ、Ｓｎ／Ａｇ／Ｂｉ／Ｉｎ、Ｓｎ／Ａｇ／Ｃｕ／Ｂｉ／Ｉｎ／Ｓｂ、Ｉｎ／Ａｇ等の合金が挙げられる。特に、Ｓｎ／Ａｇ／Ｃｕが好ましい。 The solder material of this embodiment contains each said flux and solder alloy.
The solder alloy may be a lead-free alloy.
The solder alloy is not particularly limited, and may be either a lead-free (lead-free) solder alloy or a leaded solder alloy, but a lead-free solder alloy is preferable from the viewpoint of environmental impact.
Specifically, examples of the lead-free solder alloy include alloys containing tin, silver, copper, zinc, bismuth, antimony, etc., and more specifically, Sn / Ag, Sn / Ag / Cu, Sn. / Cu, Sn / Ag / Bi, Sn / Bi, Sn / Ag / Cu / Bi, Sn / Sb, Sn / Zn / Bi, Sn / Zn, Sn / Zn / Al, Sn / Ag / Bi / In, Sn Examples thereof include alloys such as / Ag / Cu / Bi / In / Sb and In / Ag. In particular, Sn / Ag / Cu is preferable.
　前記はんだ合金のはんだ材料における含有量は、特に限定されるものではないが、例えば、８０質量％以上９９質量％以下、好ましくは８５質量％以上９８質量％以下等が挙げられる。 The content of the solder alloy in the solder material is not particularly limited, and examples thereof include 80 mass% to 99 mass%, preferably 85 mass% to 98 mass%.
　本実施形態のはんだ材料が、内部にフラックスが充填された線状のはんだ合金を有するやに入りはんだである場合には、例えば、はんだ合金が９５質量％以上９９質量％以下、好ましくは９６重量％以上９８重量％となるように構成されていることが好ましい。
　本実施形態のはんだ材料がはんだ合金と上記本実施形態のフラックスとを混合することで得られるソルダーペーストである場合には、例えば、前記はんだ合金８０質量％以上９５質量％以下、前記フラックス５質量％以上２０質量％以下で混合されていることが好ましい。 When the solder material of the present embodiment is a cored solder having a linear solder alloy filled with a flux therein, for example, the solder alloy is 95% by mass to 99% by mass, preferably 96% by weight. % To 98% by weight is preferable.
When the solder material of the present embodiment is a solder paste obtained by mixing the solder alloy and the flux of the present embodiment, for example, the solder alloy is 80 mass% to 95 mass%, and the flux is 5 mass. % To 20% by mass or less is preferable.
　本実施形態のフラックスは、特定の水酸基価を有するテルペンフェノール樹脂を含むものであり、はんだ材料に配合された場合には、はんだ濡れ性を維持しつつ、金属表面の変色を十分に抑制しうる。特に、銅あるいは銅合金に対しての変色抑制効果にすぐれている。 The flux of the present embodiment contains a terpene phenol resin having a specific hydroxyl value, and when blended in a solder material, the discoloration of the metal surface can be sufficiently suppressed while maintaining the solder wettability. . In particular, it has an excellent discoloration suppressing effect on copper or copper alloys.
　本実施形態のフラックスは、特に、銅あるいは銅合金に対しての変色抑制効果にすぐれている。
　電子部品や基板の接合部には銅あるいは銅合金（銅を含む金属）が使用されている場合があるが、かかる接合部に含まれる銅はフラックス中の有機酸と反応して緑の有機酸銅塩を生じることがある。かかる変色は緑青等の腐食と見間違われることがある。
　特に、濡れ性を向上させるべく、フラックス中に有機酸を配合した場合には、変色が生じやすくなる。よって、本実施形態のフラックスは、はんだ濡れ性と変色抑制効果とを共に達成しうる。 The flux of this embodiment is particularly excellent in the effect of suppressing discoloration with respect to copper or a copper alloy.
Copper or copper alloys (metals containing copper) may be used in the joints of electronic components and substrates, but the copper contained in such joints reacts with the organic acid in the flux and becomes a green organic acid. May produce copper salt. Such discoloration may be mistaken for corrosion such as patina.
In particular, when an organic acid is blended in the flux to improve wettability, discoloration is likely to occur. Therefore, the flux of this embodiment can achieve both the solder wettability and the discoloration suppressing effect.
　本実施形態にかかるフラックス及びはんだ材料は、以上のとおりであるが、今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は前記説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。 The flux and solder material according to the present embodiment are as described above, but the embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　次に、本発明の実施例について比較例と併せて説明する。尚、本発明は下記の実施例に限定して解釈されるものではない。 Next, examples of the present invention will be described together with comparative examples. In addition, this invention is limited to a following example and is not interpreted.
（フラックスの作製）
　以下に示すような材料を表１に記載の配合で各実施例、比較例に用いるフラックスを作製した。
　作製方法は以下のとおりである。各材料を適当な容器に投入して、室温にて全材料が均一に溶解するまで混合することで各のフラックスを得た。 (Flux production)
The materials shown below were prepared according to the formulation shown in Table 1 to produce fluxes used in each example and comparative example.
The manufacturing method is as follows. Each flux was put into a suitable container and mixed at room temperature until all the materials were uniformly dissolved to obtain each flux.
<材用と配合>
ロジン成分
・ロジン１：水素添加ロジン
・ロジン２：超淡色ロジンエステル
・ロジン３：超淡色液状ロジン誘導体
テルペンフェノール樹脂
・テルペンフェノール樹脂１～５
ポリパラビニルフェノール
・マルカリンカー（丸善石油化学株式会社製）
有機酸
・市販の有機酸系活性剤
添加剤
・２，３－ジブロモ－２－ブテン－１，４－ジオール
溶剤成分
・ＩＰＡ <For materials and compounding>
Rosin component, rosin 1: hydrogenated rosin, rosin 2: ultra light rosin ester, rosin 3: ultra light liquid rosin derivative terpene phenol resin, terpene phenol resin 1-5
Polyparavinylphenol marcalinker (Maruzen Petrochemical Co., Ltd.)
Organic acid, commercially available organic acid activator additive, 2,3-dibromo-2-butene-1,4-diol solvent component, IPA
（水酸基価／軟化点）
　前記テルペンフェノール樹脂１～５の水酸基価及び軟化点（メーカー表示値）を表２に示す。
　水酸基価はＪＩＳ　Ｋ　００７０「化学製品の酸価，けん化価，エステル価，よう素価，水酸基価及び不けん化物の試験方法」の７．２　電位差滴定法に従って測定した。
　軟化点はＪＩＳ　Ｋ　２２０７「石油アスファルト」６．４　軟化点試験方法に従って測定した。
　各測定値は表２に示す範囲の内側の数値であった。 (Hydroxyl value / softening point)
Table 2 shows the hydroxyl value and softening point (manufacturer indicated value) of the terpene phenol resins 1 to 5.
The hydroxyl value was measured according to the 7.2 potentiometric titration method of JIS K 0070 “Testing method of acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponified product of chemical products”.
The softening point was measured according to JIS K 2207 “Petroleum Asphalt” 6.4 Softening Point Test Method.
Each measured value was a numerical value inside the range shown in Table 2.
（腐食試験）
　前記実施例及び比較例のはんだ材料を用いて、ＩＰＣ規格（試験規格：TM-650 2.6.15）における４０℃、９３％ＲＨ環境下２４０時間の試験を行い、目視で試験前後のはんだ上の色の変化を確認した。結果を表１に示す。 (Corrosion test)
Using the solder materials of the above examples and comparative examples, a test was conducted for 240 hours in an IPC standard (test standard: TM-650 2.6.15) at 40 ° C. and 93% RH and visually observed on the solder before and after the test. The color change was confirmed. The results are shown in Table 1.
（ゼロクロス時間及び濡れ張力の測定）
　各実施例及び比較例のはんだ材料について、メニスコグラフ法を用い（試験装置：RHESCA SAT-5100、REHSCA社製）ゼロクロス時間及び濡れ張力を測定した。
　尚、測定条件は、以下のとおりであった。
 
　　はんだ溶融温度：250℃
　　浸漬速度：25mm/sec
　　浸漬深さ：2mm
　　保持時間：10sec
　　使用するはんだ組成：Sn3.0Ag0.5Cu
 
　試験基板は以下のように作成した。
　リン脱酸銅板（１０ｍｍ×３０ｍｍ×厚み０．３ｍｍ）をＩＰＡで５分間超音波洗浄した後、ＩＰＡをふき取り、さらに、１．７５％ＨＣｌ水溶液で洗浄後、純水で４回、ＩＰＡで１回すすぎ、ＩＰＡをふき取り、乾燥させたものを試験基板とした。 (Measurement of zero crossing time and wetting tension)
About the solder material of each Example and the comparative example, the zero crossing time and the wetting tension were measured using the meniscograph method (test apparatus: RHESCA SAT-5100, manufactured by REHSCA).
The measurement conditions were as follows.

Solder melting temperature: 250 ℃
Immersion speed: 25mm / sec
Immersion depth: 2mm
Holding time: 10 sec
Solder composition used: Sn3.0Ag0.5Cu

The test substrate was prepared as follows.
A phosphorus-deoxidized copper plate (10 mm × 30 mm × thickness 0.3 mm) was subjected to ultrasonic cleaning with IPA for 5 minutes, then wiped off with IPA, further washed with 1.75% HCl aqueous solution, 4 times with pure water, and 1 with IPA. The test substrate was rinsed, wiped off IPA, and dried.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　表１に示すように、実施例のはんだ材料は、いずれも腐食試験において変色は見られなかった。一方、比較例のはんだ材料はいずれも変色がみられた。
　また、濡れ性をしめすゼロクロス時間及び濡れ張力は実施例及び比較例に差はなかった。
　以上の結果より、実施例のはんだ材料は、はんだ濡れ性は比較例のはんだ材料と同等であるが、変色は抑制されていたことが明らかである。 As shown in Table 1, no discoloration was observed in any of the solder materials of the examples in the corrosion test. On the other hand, all the solder materials of the comparative examples were discolored.
Moreover, the zero crossing time and wet tension which show wettability did not have a difference in an Example and a comparative example.
From the above results, it is clear that the solder material of the example has the same solder wettability as the solder material of the comparative example, but the discoloration was suppressed.

Claims (5)

  1. 　水酸基価が１１０ｍｇＫＯＨ／ｇ以上のテルペンフェノール樹脂を含むフラックス。 A flux containing a terpene phenol resin having a hydroxyl value of 110 mgKOH / g or more.
  2. 　軟化点が２０℃以上１８０℃以下であるテルペンフェノール樹脂を含む請求項１に記載のフラックス。 The flux according to claim 1, comprising a terpene phenol resin having a softening point of 20 ° C or higher and 180 ° C or lower.
  3. 　テルペンフェノール樹脂が固形分換算で５質量％以上９０質量％以下含まれる請求項１又は２に記載のフラックス。 The flux according to claim 1 or 2, wherein the terpene phenol resin is contained in an amount of 5% by mass to 90% by mass in terms of solid content.
  4. 　テルペンフェノール樹脂の水酸基価が２５０ｍｇＫＯＨ／ｇ以下である請求項１乃至３のいずれか一項に記載のフラックス。 The flux according to any one of claims 1 to 3, wherein the terpene phenol resin has a hydroxyl value of 250 mgKOH / g or less.
  5. 　請求項１乃至４のいずれか一項に記載のフラックスとはんだ合金とを含むはんだ材料。 A solder material comprising the flux according to any one of claims 1 to 4 and a solder alloy.
PCT/JP2018/000786 2017-01-17 2018-01-15 Flux and solder material WO2018135427A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017006031A JP6945135B2 (en) 2017-01-17 2017-01-17 Flux and solder materials
JP2017-006031 2017-01-17

Publications (1)

Publication Number Publication Date
WO2018135427A1 true WO2018135427A1 (en) 2018-07-26

Family

ID=62908057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/000786 WO2018135427A1 (en) 2017-01-17 2018-01-15 Flux and solder material

Country Status (2)

Country Link
JP (1) JP6945135B2 (en)
WO (1) WO2018135427A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022180920A1 (en) * 2021-02-26 2022-09-01 千住金属工業株式会社 Flux

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01271097A (en) * 1988-04-20 1989-10-30 Asahi Chem Res Lab Ltd Flux composition
JPH03124092A (en) * 1989-10-06 1991-05-27 Hitachi Chem Co Ltd Preflux of printed wiring board
JPH06246481A (en) * 1993-03-02 1994-09-06 Asahi Chem Res Lab Ltd Flux composition
JPH0952195A (en) * 1995-08-11 1997-02-25 Aoki Metal:Kk Soldering flux
JP2001138089A (en) * 1999-11-19 2001-05-22 Nippon Genma:Kk Flux for solder and solder paste
JP2009154170A (en) * 2007-12-25 2009-07-16 Arakawa Chem Ind Co Ltd Soldering flux and solder paste

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01271097A (en) * 1988-04-20 1989-10-30 Asahi Chem Res Lab Ltd Flux composition
JPH03124092A (en) * 1989-10-06 1991-05-27 Hitachi Chem Co Ltd Preflux of printed wiring board
JPH06246481A (en) * 1993-03-02 1994-09-06 Asahi Chem Res Lab Ltd Flux composition
JPH0952195A (en) * 1995-08-11 1997-02-25 Aoki Metal:Kk Soldering flux
JP2001138089A (en) * 1999-11-19 2001-05-22 Nippon Genma:Kk Flux for solder and solder paste
JP2009154170A (en) * 2007-12-25 2009-07-16 Arakawa Chem Ind Co Ltd Soldering flux and solder paste

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022180920A1 (en) * 2021-02-26 2022-09-01 千住金属工業株式会社 Flux

Also Published As

Publication number Publication date
JP6945135B2 (en) 2021-10-06
JP2018114522A (en) 2018-07-26

Similar Documents

Publication Publication Date Title
JP6310894B2 (en) Solder composition and method for producing electronic substrate
KR101436714B1 (en) No-clean lead-free solder paste
JP5887330B2 (en) Solder composition and printed wiring board using the same
EP3150326B1 (en) Solder composition and electronic substrate
JP5916674B2 (en) Solder composition for jet dispenser
JP6138846B2 (en) Solder composition and method for producing electronic substrate using the same
TWI704024B (en) Flux composition and solder paste composition
CN102126094A (en) Halogen-free soldering flux for lead-free solder paste
JP2019013926A (en) Flux and solder material
JP2015160234A (en) Flux composition, solder composition and printed wiring board
WO2018135426A1 (en) Flux and solder composition
WO2016125901A1 (en) Flux activating agent, flux, and solder
TWI465427B (en) Flux composition for use with lead-free solder, lead-free solder composition and rosin-containing solder
US11833622B2 (en) Flux and solder paste
WO2018135427A1 (en) Flux and solder material
JP2019130566A (en) Flux composition, solder composition and electronic substrate
JP7011823B2 (en) Flux and solder materials
JP5481753B2 (en) Flux composition and solder paste composition
JP6471306B2 (en) Solder composition
JP2010046687A (en) Flux for soldering and resin flux cored solder
JP7097611B2 (en) Flux and solder materials
JP2011173173A (en) Soldering flux and solder paste composition
JP7137212B2 (en) FLUX, SOLDER COMPOSITION AND METHOD FOR MANUFACTURING JOINT
JP2008062239A (en) Soldering flux and solder paste composition
JP2010046689A (en) Flux for soldering, solder paste, and rosin flux cored solder

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18741054

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18741054

Country of ref document: EP

Kind code of ref document: A1