WO2018125974A1 - Dissipateur thermique divisé - Google Patents

Dissipateur thermique divisé Download PDF

Info

Publication number
WO2018125974A1
WO2018125974A1 PCT/US2017/068656 US2017068656W WO2018125974A1 WO 2018125974 A1 WO2018125974 A1 WO 2018125974A1 US 2017068656 W US2017068656 W US 2017068656W WO 2018125974 A1 WO2018125974 A1 WO 2018125974A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
coupled
pcm
section
split
Prior art date
Application number
PCT/US2017/068656
Other languages
English (en)
Inventor
Rami HAKAM
Original Assignee
Littelfuse, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Littelfuse, Inc. filed Critical Littelfuse, Inc.
Publication of WO2018125974A1 publication Critical patent/WO2018125974A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the disclosure relates generally to heat sinks for semiconductor devices and, more particularly, to split heat sinks having first and second heat sinks coupled together.
  • Transistor devices such as insulated gate bipolar transistors (IGBT) have become increasingly common because IGBT's are able to handle a relatively high power density by connecting a dozen or more individual gates in parallel.
  • IGBT insulated gate bipolar transistors
  • the increasing power density of such devices has pushed traditional electronic cooling to its limits.
  • One known heat removal approach includes coupling a heat sink to a PC/IGBT board containing the IGBT.
  • Heat sinks are typically comprised of a metal having a high thermal conductivity, and may be mounted upon the PC board for limiting the operating temperature of electronic components positioned in circuit upon the board.
  • the heat sink ideally provides a high degree of heat transfer and thermal dissipation to accommodate the increased density of the electronic circuitry associated therewith.
  • Increasing the thermal dissipation by means of convection generally requires increasing the surface area per unit volume of the heat sink.
  • having the heat sink occupying only a minimum area on the PC board is beneficial to permit high density electronic component packaging.
  • a heat sink apparatus includes a first heat sink coupled to a second heat sink, and a membrane coupled to a first side of the first heat sink and disposed between the first heat sink and the second heat sink.
  • the membrane includes a phase change material (PCM).
  • the heat sink apparatus may further include a semiconductor device coupled to a second side of the first heat sink.
  • the heat sink apparatus includes a support frame coupled to the second heat sink.
  • the heat sink apparatus includes additional PCM disposed within the first heat sink and/or the second heat sink.
  • the heat sink apparatus includes one or more fluid conduits formed therein.
  • One exemplary approach in accordance with the present disclosure may include a heat sink apparatus having a first heat sink coupled to a second heat sink, a membrane coupled to a first side of the first heat sink and disposed between the first heat sink and the second heat sink, wherein the membrane includes a phase change material (PCM), and a semiconductor device coupled to a second side of the first heat sink.
  • PCM phase change material
  • Another exemplary approach in accordance with the present disclosure may include a split heat sink having a first heat sink coupled to a second heat sink, a membrane coupled to a first side of the first heat sink and disposed between the first heat sink and the second heat sink, wherein the membrane includes a phase change material (PCM), and a support frame coupled to the second heat sink and disposed adjacent the first heat sink.
  • PCM phase change material
  • split heat sink apparatus having a first heat sink coupled to a second heat sink, the second heat sink defining a first section and a second section, the second section comprising at least one cooling fin.
  • the split heat sink apparatus may further include a phase change material (PCM) coupled to first side of the first heat sink, the PCM disposed between the first heat sink and the second heat sink, and a semiconductor device coupled to a second side of the first heat sink.
  • the split heat sink apparatus may further include a support frame coupled to the second heat sink, the support frame disposed directly adjacent an outer edge of the first heat sink.
  • FIG. 1 is a side view of a heat sink apparatus according to exemplary embodiments of the disclosure.
  • FIG. 2 is an exploded side cross-sectional view of the apparatus shown in FIG.
  • FIG. 3 is an exploded side cross-sectional view of the apparatus shown in FIG.
  • FIG. 4 is an exploded side cross-sectional view of the apparatus shown in FIG.
  • FIG. 5 is a side view of the heat sink apparatus including a cooling conduit formed therein according to exemplary embodiments of the disclosure.
  • a heat sink apparatus including a first heat sink coupled to a second heat sink, and a membrane coupled to a first side of the first heat sink and disposed between the first heat sink and the second heat sink.
  • the membrane includes a phase change material (PCM).
  • the heat sink apparatus may further include a semiconductor device coupled to a second side of the first heat sink.
  • the heat sink apparatus includes a support frame coupled to the second heat sink.
  • the heat sink apparatus includes additional PCM disposed within the first heat sink and/or the second heat sink.
  • the heat sink apparatus includes one or more fluid conduits formed therein.
  • the apparatus 100 includes a first heat sink 104 coupled to a second heat sink 108, and a membrane 110 coupled to a first side 112 of the first heat sink 104 such that the membrane 110 is disposed between the first heat sink 104 and the second heat sink 108.
  • the first heat sink 104 may be coupled to the second heat sink 108 using one or more fasteners 114, such as screws, bolts, clamps, clasps, and/or an adhesive.
  • One or more semiconductor devices 120 may be coupled to a second side 122 of the first heat sink 104, for example.
  • the semiconductor device 120 may be formed on a PC board (not shown), which is then secured to the second side 122 of the first heat sink 104.
  • the semiconductor device 120 may be a microprocessor, memory device, micro electro-mechanical system (MEMS), network communications device, laser emitter, radio-frequency component, integrated circuit, etc.
  • MEMS micro electro-mechanical system
  • Each of the semiconductor devices 120 produces some respective amount of heat that is removed by the first and second heat sinks 104 and 108, as will be further described below.
  • the membrane 110 may be secured to the first heat sink 104 and/or the second heat sink 108, for example via the fasteners 114, thereby allowing the membrane 110 to be removed for replacement.
  • the membrane 110 may be a flexible phase change material (PCM) in contact with both the first heat sink 104 and the second heat sink 108.
  • PCM phase change material
  • the PCM helps reduce the overall weight of the apparatus 100 and is configured to change phase from a solid state to a liquid state at a predetermined heat storage temperature greater than a normal operating temperature. For example, the temperature of the PCM of the membrane 110 also begins to rise with that of the first heat sink 104 and/or the second heat sink 108.
  • the PCM begins to store heat by transitioning from solid to liquid state.
  • the first heat sink 104 and/or the second heat sink 108 exhibit thermal equilibrium at a new temperature a few degrees greater than the normal operating temperature.
  • Illustrative and non-limiting examples of such PCM include paraffin, glycol mixtures, formamide, salt and water mixtures, etc. Other suitable PCMs can also be used.
  • no membrane is present between the first and second heat sinks 104, 108.
  • the apparatus 100 may further include a support frame 130 coupled to the second heat sink 108 using one or more fasteners 132, such as screws, bolts, clamps, clasps, and/or an adhesive.
  • the support frame 130 has an L-shaped cross-section, which generally conforms to a cutout or recess 134 of the second heat sink 108.
  • the support frame 130 is also disposed directly adjacent an outer edge 138 of the first heat sink 104.
  • the support frame 130 may also be coupled to the first heat sink 104 using one or more fasteners (not shown).
  • the second heat sink 108 is generally larger than the first heat sink 104.
  • the second heat sink 108 has a width 'W2' that is greater than a width 'W of the first heat sink 104.
  • Providing a larger surface area for the second heat sink 108 increases heat transfer/dissipation, while the smaller first heat sink 104 minimizes heat sink density at the PC board level.
  • providing the apparatus 100 as a split heat sink allows for a more modular design by which the semiconductor device 120, the first heat sink 104, and/or the membrane 110 can be removed and replaced more efficiently.
  • FIG. 2 an exploded side cross-sectional view of a heat sink assembly 200 (hereinafter "assembly 200") according to another embodiment will be described in greater detail.
  • the assembly 200 includes a first heat sink 204 and a second heat sink 208, and a membrane 210 (e.g., a PCM) coupled to a first side 212 of the first heat sink 204 such that the membrane 210 is disposed between, and in direct contact with, the first heat sink 204 and the second heat sink 208.
  • a membrane 210 e.g., a PCM
  • the second heat sink 208 includes a first section 244 adjacent and coupled to a second section 246.
  • the first section 244 and the first heat sink 204 may be solid construction aluminum or copper, while the second section 246 may include a set of cooling fins 250.
  • the cooling fins 250 which may be made from aluminum or plated copper, extend from an outer surface 251 of the first section 244 to further support heat dissipation.
  • the 200 may further include a support device similar to the support frame 130 demonstrated in FIG. 1.
  • the support frame 130 may have a shape that generally conforms to a cutout or recess 234 of the second heat sink 208.
  • FIG. 3 an exploded side cross-sectional view of a heat sink assembly 300 (hereinafter “assembly 300") according to another embodiment will be described in greater detail.
  • the assembly 300 includes a first heat sink 304 and a second heat sink 308, and a membrane 310 coupled to a first side 312 of the first heat sink 304 such that the membrane 310 is disposed between the first heat sink 304 and the second heat sink 308.
  • the first heat sink 304 may be coupled to the second heat sink 308 so that the membrane 310 is contact on either side with the first and second heat sinks 304, 308.
  • the first heat sink 304 includes a set of walls 352 defining one or more cavities 354 filled with a PCM 358, such as paraffin, glycol mixtures, formamide, salt and water mixtures, etc.
  • the cavity 354 can be formed, for example, by milling, machining, laser ablation, etc. Other suitable techniques can also be used.
  • the cavity 354 may be circular, rectangular, oval, or any other suitable shape in cross-section or plan.
  • the cavity 354 is configured to contain a quantity of the PCM 358, which is preserved in a solid state during operation at a normal temperature.
  • the second heat sink 308 includes a first section 344 adjacent and coupled to a second section 346.
  • the first section 344 may include a set of walls 360 (e.g., Al or Cu) defining one or more cavities 362 filled with a quantity of a PCM 364, such as paraffin, glycol mixtures, formamide, salt and water mixtures, etc.
  • the cavity 362 can be formed, for example, by milling, machining, laser ablation, etc.
  • the PCM 358 within the cavity 354 and the PCM 364 within the cavity 362 is preserved in a solid state during operation at a normal temperature.
  • the second section 346 may include a set of aluminum or copper plated cooling fins 350 extending from an outer surface 351 of the first section 344 to further support heat dissipation.
  • FIG. 4 an exploded side cross-sectional view of a heat sink assembly 400 (hereinafter “assembly 400") according to another embodiment will be described in greater detail.
  • the assembly 400 includes a first heat sink 404 and a second heat sink 408, and a membrane 410 (e.g., a PCM) coupled to a first side 412 of the first heat sink 404 such that the membrane 410 is disposed between, and in contact with, the first heat sink 404 and the second heat sink 408.
  • a membrane 410 e.g., a PCM
  • the first heat sink 404 includes a set of walls 452 defining one or more cavities 454 filled with a PCM 458, such as paraffin, glycol mixtures, formamide, salt and water mixtures, etc.
  • the second heat sink 408 includes a first section 444 adjacent and coupled to a second section 446.
  • the first section 444 may include a set of walls 460 (e.g., Al or Cu) defining one or more cavities 462 filled with a quantity of a PCM 464, such as paraffin, glycol mixtures, formamide, salt and water mixtures, etc.
  • the PCM 458 within the cavity 454 and the PCM 464 within the cavity 462 is preserved in a solid state during operation at a normal temperature, and transitions to a liquid when heated.
  • the second section 446 may include a set of aluminum or copper plated cooling fins 450 extending from an outer surface 451 of the first section 444 to further support heat dissipation.
  • the first heat sink 404 includes a first conduit 470 formed through an interior of the first heat sink 404.
  • the first conduit 470 is provided through the PCM 458.
  • the first conduit 470 may be formed through a solid layer of Al or Cu, such as the first heat sink 204 shown in FIG. 2.
  • the second heat sink 408 may also include a second conduit 472 formed through an interior of the second heat sink 408.
  • the second conduit 472 is provided through the PCM 464.
  • the second conduit 472 may be formed through a solid layer of Al or Cu, such as the second heat sink 208 shown in FIG. 2.
  • the first and second conduits 470, 472 may be formed by milling, machining, laser ablation or other known techniques, and may be circular, rectangular, or any other suitable cross-section shape.
  • a fluid coolant traverses the first and second conduits 470,
  • a fluid conduit can be defined in the form of an inlet header and an outlet header with a plurality of parallel fluid passageways there between.
  • the second heat sink 508 may include the second conduit 572 formed entirely within an interior of the second heat sink 508.
  • the second conduit 572 is provided as a cooling loop circulating throughout the PCM 564.
  • the second conduit 572 may be a set of completely sealed quasi evacuated tubes partially filled with air or other gases and arranged in a loop to create a cooling circulation flow.
  • Other suitable arrangements for the second conduit 572 may also be envisioned.
  • a two-piece, split heat sink which includes a first heat sink coupled to a semiconductor device and a second heat sink acting as a finned convector.
  • the first heat sink is provided with a small cross section to minimize PC board space required for mounting the heat sink, while the second heat sink is provided with a large number of spaced fins oriented generally along the direction of air flow adjacent to the PC board for improved heat dissipation by means of convection.
  • the two heat sink components are attached by press fit employing a serrated aperture.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne divers dissipateurs thermiques divisés. Dans une approche, un appareil de dissipateur thermique comprend un premier dissipateur thermique couplé à un second dissipateur thermique, et une membrane couplée à un premier côté du premier dissipateur thermique et disposée entre le premier dissipateur thermique et le second dissipateur thermique. Dans certaines approches, la membrane comprend un matériau à changement de phase (PCM). L'appareil de dissipateur thermique peut en outre comprendre un dispositif à semi-conducteur couplé à un second côté du premier dissipateur thermique. Dans certaines approches, l'appareil de dissipateur thermique comprend un cadre de support couplé au second dissipateur thermique. Dans certaines approches, l'appareil de dissipateur thermique comprend un PCM supplémentaire disposé à l'intérieur du premier dissipateur thermique et/ou du second dissipateur thermique. Dans certaines approches, l'appareil de dissipateur thermique comprend un ou plusieurs conduits de fluide formés en son sein.
PCT/US2017/068656 2016-12-28 2017-12-28 Dissipateur thermique divisé WO2018125974A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662439673P 2016-12-28 2016-12-28
US62/439,673 2016-12-28

Publications (1)

Publication Number Publication Date
WO2018125974A1 true WO2018125974A1 (fr) 2018-07-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3972399A1 (fr) * 2020-09-16 2022-03-23 Shenzhen Envicool Information Technology Co., Ltd. Véhicule à énergie nouvelle et son boîtier de commande électrique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060209516A1 (en) * 2005-03-17 2006-09-21 Chengalva Suresh K Electronic assembly with integral thermal transient suppression
US20110127018A1 (en) * 2009-05-01 2011-06-02 Xergy Incorporated Self-Contained Electrochemical Heat Transfer System
US20120325454A1 (en) * 2010-03-12 2012-12-27 Fujitsu Limited Heat dissipating structure and manufacture thereof
US20130206363A1 (en) * 2012-02-15 2013-08-15 General Electric Company Flexible metallic heat connector
US20140368992A1 (en) * 2013-06-14 2014-12-18 Laird Technologies, Inc. Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials
US20150109735A1 (en) * 2013-10-21 2015-04-23 International Business Machines Corporation Pump-enhanced, immersion-cooling of electronic component(s)

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060209516A1 (en) * 2005-03-17 2006-09-21 Chengalva Suresh K Electronic assembly with integral thermal transient suppression
US20110127018A1 (en) * 2009-05-01 2011-06-02 Xergy Incorporated Self-Contained Electrochemical Heat Transfer System
US20120325454A1 (en) * 2010-03-12 2012-12-27 Fujitsu Limited Heat dissipating structure and manufacture thereof
US20130206363A1 (en) * 2012-02-15 2013-08-15 General Electric Company Flexible metallic heat connector
US20140368992A1 (en) * 2013-06-14 2014-12-18 Laird Technologies, Inc. Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials
US20150109735A1 (en) * 2013-10-21 2015-04-23 International Business Machines Corporation Pump-enhanced, immersion-cooling of electronic component(s)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3972399A1 (fr) * 2020-09-16 2022-03-23 Shenzhen Envicool Information Technology Co., Ltd. Véhicule à énergie nouvelle et son boîtier de commande électrique

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