WO2018124751A1 - Flexible circuit board and frame assembly including same - Google Patents

Flexible circuit board and frame assembly including same Download PDF

Info

Publication number
WO2018124751A1
WO2018124751A1 PCT/KR2017/015594 KR2017015594W WO2018124751A1 WO 2018124751 A1 WO2018124751 A1 WO 2018124751A1 KR 2017015594 W KR2017015594 W KR 2017015594W WO 2018124751 A1 WO2018124751 A1 WO 2018124751A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection circuit
connection
bus bar
circuit board
disposed
Prior art date
Application number
PCT/KR2017/015594
Other languages
French (fr)
Korean (ko)
Inventor
오정학
염진수
이종원
전태현
이천효
사광욱
강지은
노승준
Original Assignee
주식회사 유라코퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160180292A external-priority patent/KR101928065B1/en
Priority claimed from KR1020160180293A external-priority patent/KR101928073B1/en
Priority claimed from KR1020160182296A external-priority patent/KR101928066B1/en
Priority claimed from KR1020160183890A external-priority patent/KR101844852B1/en
Priority claimed from KR1020170113677A external-priority patent/KR101996449B1/en
Priority claimed from KR1020170141527A external-priority patent/KR102033001B1/en
Priority claimed from KR1020170159696A external-priority patent/KR102087699B1/en
Priority to CN201780081162.4A priority Critical patent/CN110114905B/en
Priority to PL17888917T priority patent/PL3565022T3/en
Priority to US16/474,414 priority patent/US11309593B2/en
Priority to JP2019536176A priority patent/JP6869355B2/en
Application filed by 주식회사 유라코퍼레이션 filed Critical 주식회사 유라코퍼레이션
Priority to EP17888917.6A priority patent/EP3565022B1/en
Priority to RS20210557A priority patent/RS61814B1/en
Publication of WO2018124751A1 publication Critical patent/WO2018124751A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/42Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/42Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/209Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/218Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material
    • H01M50/22Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material of the casings or racks
    • H01M50/227Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/244Secondary casings; Racks; Suspension devices; Carrying devices; Holders characterised by their mounting method
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/262Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with fastening means, e.g. locks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/271Lids or covers for the racks or secondary casings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/569Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/572Means for preventing undesired use or discharge
    • H01M50/584Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries
    • H01M50/588Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries outside the batteries, e.g. incorrect connections of terminals or busbars
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/572Means for preventing undesired use or discharge
    • H01M50/584Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries
    • H01M50/59Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries characterised by the protection means
    • H01M50/591Covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/053Tails
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/055Folded back on itself
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10037Printed or non-printed battery
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the present disclosure relates to a flexible circuit board and a frame assembly including the same.
  • Secondary batteries are widely used in mobile devices, auxiliary power devices, and the like.
  • the secondary battery has attracted attention as a main driving force for electric vehicles, hybrid electric vehicles, plug-in hybrid electric vehicles, etc., which are proposed as alternatives to solve various problems such as air pollution of conventional gasoline or diesel vehicles.
  • Secondary batteries used in electric vehicles, etc. are used because of the necessity of a high output large capacity battery, a plurality of battery cells are stacked and electrically connected in series and in parallel.
  • Such a battery module has an advantage of providing the required high power according to the degree of stacking of battery cells, but the battery cells may be used in a stacked state, such that overvoltage, overcurrent, and overheating may occur in some battery cells.
  • the battery module senses the voltage of each battery cell using a circuit board connected to the battery cell, and transfers it as electrical information to the BMS (Battery Mamagement System) through the busbar to overvoltage, overcurrent, overheating, etc. of each battery cell. To detect the phenomenon of and thereby prevent further damage.
  • BMS Battery Mamagement System
  • Embodiments of the present disclosure provide a flexible circuit board for use in a frame assembly for fixing a cell assembly.
  • it provides a structure of a flexible circuit board to improve the yield of the production process, to prevent breakage that may occur during the assembly process, and to improve the workability.
  • a flexible circuit board installed in a frame to which a bus bar is coupled, the flexible circuit board comprising: a central portion having a band shape; First connection circuits formed at both ends of the central portion and disposed to face each other; A second connection circuit portion extending from the first connection circuit portion to be parallel to the central portion; And a third connection circuit part extending from each of the first connection circuit part and the second connection circuit part and connected to the busbar, wherein the second connection circuit part is arranged to overlap each other in the cross-sectional direction when the second connection circuit part is folded to one side of the first connection circuit part.
  • the second connection circuit part may be disposed on the same line as the first connection circuit part.
  • the second connection circuit portion is formed on both ends of the first connection circuit portion, respectively, the first overlapping portion formed by folding the second connection circuit portion toward the first connection circuit portion along the first bending line; And a second overlapping portion formed by being folded to be bent in the longitudinal direction of the first connection circuit portion along the second bending line.
  • the first bending line may be formed in parallel with the first connection circuit, and the second bending line may be formed to be inclined at a predetermined angle with respect to the first bending line.
  • between the portions of the second connecting portion constituting the first overlapping portion and the second overlapping portion may be tightly fixed by an adhesive that provides a fixing force for the upper side and the lower side.
  • the adhesive may be characterized as double-sided tape or double-sided pad.
  • a plurality of third connection circuit portion formed in the first connection circuit portion is formed to be spaced apart from each other, when the first connection circuit portion and the second connection circuit portion is located on the same line, the third formed on the second connection circuit
  • the connection circuit unit may be arranged in line with the third connection circuit unit formed in the first connection circuit unit.
  • it may further include a temperature sensing unit formed to extend outward from the center.
  • the third connection circuit portion may include a substrate layer and an insulating layer configured to expose one surface of the substrate layer, and one surface of the substrate layer may be configured to contact the busbar.
  • the third connection circuit portion includes a substrate layer and an insulating layer configured to expose both surfaces of the substrate layer, the substrate layer comprising: a first surface in contact with the busbar; And a second surface formed on an opposite side of the first surface.
  • the third connection circuit portion may be characterized in that the size of the first surface is larger than the size of the second surface.
  • the frame assembly for fixing the cell assembly is formed by stacking at least one battery cell according to another embodiment of the present disclosure, including a top plate, side plates connected to both ends of the top plate, surrounding the cell assembly A frame disposed to be; A bus bar disposed on and fixed to the side plate; And a flexible circuit board disposed along the upper plate and the side plate to sense a voltage of the battery cell, wherein the upper plate has a path groove formed at a predetermined depth in the upper side thereof, and the flexible circuit board extends outward.
  • Sensing portion is formed, the center portion of the band shape seated in the path groove; First connection circuits formed at both ends of the central portion and disposed to face each other; Second connection circuit portions extending at both ends of the first connection circuit portion and formed to be parallel to the central portion; And a third connection circuit portion extending from each of the first connection circuit portion and the second connection circuit portion and connected to the busbar, wherein the flexible circuit board is formed by folding the second connection circuit portion toward the first connection circuit portion along the first bending line.
  • the overlapping part is formed, an overlapping part including a second overlapping part formed by folding the first overlapping part and the second connection circuit part to be bent along the second bending line in the longitudinal direction of the first connection circuit part is formed, and the overlapping part is formed.
  • the circuit part may be disposed on the same line as the first connection circuit part, and the third connection circuit part formed on the second connection circuit part may be disposed in line with the third connection circuit part formed on the first connection circuit part.
  • the cell assembly may be formed by stacking terminal parts formed at each end of each of the plurality of battery cells in series or in parallel, and electrically connecting the terminal parts to the busbars.
  • an insertion hole is formed in the same direction as the direction in which the battery cells are stacked in the bus bar, the cell assembly includes a plurality of battery cells stacked in parallel, and the battery cells stacked in parallel are again stacked in series.
  • the terminal unit may be inserted into the insertion hole and electrically connected to the bus bar.
  • the terminal portion penetrates the insertion hole, and the portion protruding therethrough may be folded outside the bus bar and laser-welded to be electrically connected.
  • the first bending line is formed in parallel with the first connection circuit portion
  • the second bending line is formed to be inclined at a predetermined angle with the first bending line
  • the second connection circuit portion and The second bending line may be sequentially folded along the second bending line, and disposed on the same line as the first connection circuit unit.
  • the side plate is fixed in close contact with the side, and further comprises a reinforcing plate covering the end of the central portion, the upper plate may further be formed ribs to prevent the separation of the center and the path grooves along the path grooves. have.
  • the ribs may be provided in plurality so as to be spaced apart from each other alternately on both sides of the path groove.
  • the fusion plate is formed in the side plate corresponding to the position where the center is disposed, the fixing hole may be formed in the center and the reinforcing plate corresponding to the position of the fusion projection.
  • the center in the state that the center is seated in the path groove, may further include a top cover that covers the upper side of the center.
  • the bus bar is formed with a recessed to a predetermined depth, one side is fixedly coupled to the flexible circuit board, the other side further comprises a connection terminal bonded to the bus bar, the connection terminal is formed with a fixing projection is formed 3 fixed part fixed to the connection circuit; And a connection part extending from the fixing part and disposed on the seating part.
  • connection portion may be characterized in that joined to the seating portion by laser welding.
  • connection part may further include a fastening member which is formed in a ring shape to form a fastening hole and is inserted into the seating part through the fastening hole to fix the connection terminal.
  • the third connection circuit part may further include a coating part configured to cover the third connection circuit part and a part of the bus bar around the third connection circuit part while the third connection circuit part is connected to the bus bar.
  • the bus bar may be provided with a recessed part having a predetermined depth, and one surface of the three connection circuit part may be in contact with the seating part.
  • a frame assembly for fixing a cell assembly is formed by stacking at least one battery cell according to another embodiment of the present disclosure, the cell assembly including a top plate, side plates connected to both ends of the top plate A frame disposed to be; A bus bar disposed on and fixed to the side plate; A flexible circuit board disposed along the upper plate and the side plate to sense a voltage of the battery cell; And a reinforcing plate that is tightly fixed to one side of the side plate and covers an end portion of the flexible circuit board, wherein the upper plate is formed with a protection groove which is dug at a predetermined depth on a bottom surface thereof, and the flexible circuit board has a temperature sensing unit extending outwardly.
  • the overlapping part is formed, an overlapping part including a second overlapping part formed by folding the first overlapping part and the second connection circuit part to be bent along the second bending line in the longitudinal direction of the first connection circuit part is formed, and the overlapping part is formed.
  • the circuit part may be disposed in parallel with the first connection circuit part, and the third connection circuit part formed in the second connection circuit part may be disposed in parallel with the third connection circuit part formed in the first connection circuit part.
  • the overlapping portion formed between the protective groove and the central portion and between the first connection circuit portion and the second connection circuit portion may be tightly fixed by an adhesive.
  • At least one of the upper plate and the side plate is formed with a protective hole corresponding to the position of the protective groove, the end portion of the central portion passes through the protective hole, and bent so that the third connection circuit portion is outside the bus bar. Can be bonded to the sides.
  • the fusion plate is formed in the side plate corresponding to the position of the protective hole, the fixing hole may be formed in the center and the reinforcement plate corresponding to the position of the fusion projection.
  • the first coupling hole is formed in the bus bar
  • the second coupling hole is formed in the third connection circuit part corresponding to the position of the first coupling hole, and penetrates the first coupling hole and the second coupling hole. It may further comprise a coupling member.
  • the bus bar is formed with a recessed groove is formed to a predetermined depth
  • the first coupling hole is formed in the mounting groove
  • the first coupling hole and the second coupling hole may be formed in a pair, respectively spaced apart from each other. have.
  • the coupling member may be characterized in that the rivet.
  • the second connection circuit part is bent at the end of the first connection circuit part and has a shape formed parallel to the central part, the first connection circuit part and the second connection circuit part are parallel to each other during initial cutting. Compared with the comparative example, the loss of design can be minimized, thereby reducing the production cost.
  • the second connection circuit part is folded along the first bending line and the second bending line and positioned on the same line as the second connection circuit part and the first connection circuit part, the production yield can be improved, and the plurality of battery cells stacked in a wide range. The voltage of each can be sensed.
  • first overlapping part and the second overlapping part may be closely fixed to each other by a double-sided tape or a PAD, thereby preventing damage caused by lifting during assembly and preventing pattern cracking of the flexible circuit board due to vibration.
  • the third connection circuit portion does not require a separate configuration, and thus may have a cost reduction effect.
  • the size of the first surface may be larger than that of the second surface, thereby facilitating bonding and at the same time protecting the substrate layer.
  • the cell assembly of the battery module according to the present disclosure can be easily connected electrically through a terminal formed in the battery cell, the insertion hole is formed in the bus bar and the terminal portion can be folded through it to be electrically connected to the bus bar to facilitate assembly. Can be done.
  • the cell frame includes a shape surrounding the cell assembly, thereby fixing the battery cell primarily and protecting the battery cell.
  • the upper plate and the side plate are hinged, the side plate is rotated at an angle, it can be easy to assemble the frame.
  • a path groove having a predetermined depth may be formed on the upper side of the upper plate, or a protection groove may be formed at a predetermined depth on the bottom thereof, thereby protecting the center of the flexible circuit board and preventing damage that may occur during the assembly process. .
  • Ribs are formed along the path grooves to prevent separation of the center, which facilitates the fixing of the flexible circuit boards, and a plurality of alternately formed on both sides of the path grooves is formed to prevent damage to the flexible circuit boards that may occur during assembly. Can be.
  • the top cover covering the upper side of the flexible circuit board may be further installed to minimize damage to the flexible circuit board which may occur during assembly.
  • the central part can be easily fixed to the protective groove by double-sided tape, and the protective hole is formed corresponding to the position where the protective groove is formed, thereby minimizing the bending portion of the flexible circuit board. Damage to the flexible circuit board can be prevented.
  • the reinforcing plate covers the end of the center portion to prevent damage that may occur to the flexible circuit board during the thermal fusion process.
  • the busbars are formed so that the seating part can be dug to a certain depth to clarify the joint, improving workability and joining in the correct position to improve the joint quality.
  • Integral terminals allow the flexible circuit board and busbars to be electrically connected, reducing labor and production costs.
  • ring-shaped integrated terminals can be used to connect to the busbars by fastening members (eg, screws), productivity can be improved by reducing the number of operations such as laser welding.
  • a coating portion covering the third connection circuit portion and a part of the busbar may be further formed to increase the bonding force between the substrate layer and the sidebar and protect the substrate layer.
  • the coupling member may be formed of a metal material having electrical conductivity to electrically connect the bus bar and the flexible circuit board, thereby fundamentally preventing warpage or cracking of the welded portion due to welding.
  • FIG. 1 is a view for explaining a comparative example for comparison with various embodiments of the present disclosure.
  • FIG. 2 is a plan view of a flexible printed circuit board according to an exemplary embodiment of the present disclosure.
  • FIG. 3 is a view illustrating a folding method of the flexible printed circuit board shown in FIG. 2.
  • FIG. 4 is a perspective view illustrating a final shape of a connection unit on one side of the flexible circuit board illustrated in FIG. 2.
  • FIG. 5 is an enlarged perspective view of the overlapping part illustrated in FIG. 4.
  • FIG. 6 is a perspective view illustrating a method in which the first overlapping part and the second overlapping part shown in FIG. 5 are fixed by an adhesive.
  • FIG. 7 is a perspective view illustrating an exposed state of the substrate layer of the third connection circuit unit illustrated in FIG. 4.
  • FIG. 8 is a plan view illustrating the first and second surfaces illustrated in FIG. 7.
  • FIG. 9 is a cross-sectional view illustrating a cross section of the third connection circuit unit illustrated in FIG. 8.
  • FIG. 10 is a perspective view of a battery module according to a first embodiment of the present disclosure.
  • FIG. 11 is an exploded perspective view of the battery module shown in FIG. 10.
  • FIG. 12 is a perspective view of a cell assembly of the battery module shown in FIG. 10.
  • FIG. 13 is a perspective view of a frame assembly of the battery module shown in FIG. 10.
  • FIG. 14 is a perspective view illustrating a hinge coupling between the upper plate and the side plate of the frame shown in FIG. 13.
  • FIG. 15 is a side view illustrating an arrangement of a frame and a flexible circuit board of the battery module illustrated in FIG. 10.
  • FIG. 16 is a perspective view illustrating a combined configuration of the upper plate and the flexible circuit board of the frame assembly shown in FIG. 13.
  • FIG. 17 is an exploded perspective view illustrating an exploded configuration of the upper plate and the flexible circuit board illustrated in FIG. 16.
  • FIG. 18 is a plan view illustrating a flexible circuit board seated in a path groove of the upper plate illustrated in FIG. 17.
  • FIG. 19 is a front view of the side plate of the battery module shown in FIG. 10.
  • FIG. 20 is an enlarged perspective view of the reinforcing plate illustrated in FIG. 19.
  • FIG. 21 is a sectional perspective and sectional view taken along the line A-A shown in FIG.
  • FIG. 22 is a view showing a fixing method of the reinforcing plate shown in FIG.
  • FIG. 23 is an enlarged perspective view illustrating a seating part of the bus bar illustrated in FIG. 19.
  • FIG. 24 is a front view illustrating a state in which the substrate layer is directly bonded to the seating portion shown in FIG. 23.
  • 25 is a cross-sectional view illustrating a bonding method for bonding the substrate layer shown in FIG. 24 to a busbar.
  • FIG. 26 is a plan view illustrating a state in which a coating unit is further formed in the third connection circuit unit illustrated in FIG. 24.
  • FIG. 27 is a cross-sectional view of the coating layer shown in FIG. 26.
  • FIG. 28 is a front view illustrating a state in which a connection portion of the integrated connection terminal according to an embodiment is bonded to the seating portion illustrated in FIG. 23.
  • FIG. 29 is a perspective view of the integrated connection terminal according to the embodiment shown in FIG. 28.
  • FIG. 30 is a front view illustrating a state in which the integrated portion of the connecting portion of the ring portion and the connecting portion of the ring-shaped connecting terminal, which is another embodiment, is joined to the seating portion illustrated in FIG.
  • FIG. 31 is a perspective view of the ring-shaped connecting terminal and the fastening member shown in FIG. 30.
  • FIGS. 28 and 30 are a perspective view illustrating a method in which the fixing part illustrated in FIGS. 28 and 30 is fixed to the third connection circuit part.
  • FIG. 33 is a perspective view illustrating a state in which a coupling member is coupled to a seating unit illustrated in FIG. 23.
  • FIG. 34 is a perspective view illustrating a coupling method for coupling the coupling member to the seating portion illustrated in FIG. 33.
  • FIG. 35 is a cross-sectional view along the B-B direction shown in FIG. 33.
  • 36 is a perspective view of a battery module according to a second embodiment of the present disclosure.
  • FIG. 37 is an exploded side view illustrating an exploded configuration of the frame and the flexible circuit board illustrated in FIG. 36.
  • FIG. 38 is a perspective view in a lower direction of the frame shown in FIG. 36.
  • FIG. 39 is an exploded view of the upper plate and the flexible printed circuit board shown in FIG. 38.
  • FIG. 40 is an enlarged perspective view of the protection hole illustrated in FIG. 39.
  • 41 is a perspective view illustrating a direction in which the frame assembly is assembled to the cell assembly.
  • FIG. 42 is a perspective view illustrating a state in which a terminal unit is inserted into an insertion hole after the cell assembly and the frame assembly are assembled.
  • FIG. 43 is a perspective view illustrating a state in which a terminal unit is inserted into an insertion hole and then folded and connected to a bus bar.
  • FIG. 44 is an enlarged perspective view of the terminal unit illustrated in FIG. 43.
  • 45 is a perspective view illustrating a method of assembling a battery module and a monoframe.
  • Embodiments of the present disclosure are illustrated for the purpose of describing the technical spirit of the present disclosure.
  • the scope of the present disclosure is not limited to the embodiments set forth below or the detailed description of these embodiments.
  • a component when referred to as being "connected” or “connected” to another component, the component may be directly connected to or connected to the other component, or new It is to be understood that the connection may be made or may be connected via other components.
  • FIG. 1 is a view for explaining a comparative example for comparison with various embodiments of the present disclosure.
  • the flexible printed circuit board 1000 of the comparative example is cut and used to form the sensing unit of the battery cell wide.
  • a band-shaped central portion 1110, connection portions 1120 formed at both ends of the central portion 1110 and disposed to face each other, and protruding from the connection portion, are connected to the bus bar by a third connection circuit portion. 1150 is cut into shapes.
  • the loss portion (a) formed on both sides of the center portion 1110 is increased, there may be a problem that the production yield of the flexible circuit board 1000 is somewhat reduced.
  • the flexible circuit board in the process of assembling the flexible circuit board 1000 to the frame, the flexible circuit board may be damaged or torn due to an external force, etc., and thus, an electric element mounted on the flexible circuit board may be damaged. Accordingly, a problem may occur in which a crack is generated in a portion bent to the side plate of the flexible circuit board by a severe vibration or shock applied to the battery module.
  • FIG. 2 is a plan view of a flexible printed circuit board 100 according to an embodiment of the present disclosure
  • FIG. 3 is a view illustrating a folding method of the flexible printed circuit board 100 shown in FIG. 2
  • FIG. 4 is illustrated in FIG. 2.
  • 4 is a perspective view illustrating a final shape of a connection part of one side of the flexible printed circuit board 100 shown in FIG.
  • FIG. 5 is an enlarged perspective view of the overlapping part 140 illustrated in FIG. 4
  • FIG. 6 is a diagram illustrating a first overlapping part 141 and a second overlapping part 142 shown in FIG. 5 by an adhesive 200. It is a perspective view showing the fixing method.
  • a flexible circuit board 100 installed in a frame to which a bus bar is coupled and configured to sense a voltage of a battery cell is formed at a central portion 110 having a band shape and at both ends of the central portion 110.
  • the third connection circuit unit 150 may be formed to extend from each of the first connection circuit unit 120 and the second connection circuit unit 130 to be connected to the bus bar.
  • the overlapping part 140 may be formed between the first connection circuit part 120 and the second connection circuit part 130. have.
  • the second connection circuit part 130 may be disposed on the same line as the first connection circuit part 120.
  • the substrate layer 101 may be formed at the center of the flexible circuit board 100 in the cross-sectional direction, and the insulating layers 102 may be stacked above and below the substrate layer 101, respectively.
  • the substrate layer 101 may be composed of a circuit that transmits information as an electrical signal, and the insulating layer 102 may protect the substrate layer 101 and prevent short circuit with other conductive structures.
  • the substrate layer 101 may be formed of a metal layer having electrical conductivity, and may be formed of a copper plate having a high electrical conductivity.
  • the insulating layer 102 may be formed of a material having no electrical conductivity in the form of films PEN and P1. In addition, since the substrate layer 101 and the insulating layer 102 each have a flexible characteristic, they can be easily deformed.
  • the flexible circuit board 100 includes a central portion 110, a first connection circuit part 120, and a second connection circuit part 130, and a first connection circuit part 120 and the second connection part.
  • the overlapping part 140 may be formed between the circuit parts 130.
  • the center portion, the first connection circuit portion 120, the second connection circuit portion 130, and the overlapping portion 140 may correspond to portions of the flexible circuit board 100, which are together with the central portion 110, one flexible circuit board. It can be formed integrally with.
  • the first fixing hole 115 may be formed at an end portion of the central portion 110.
  • the protrusion hole 112 may be further formed in a portion protruding from the central portion 110 and the second connection circuit portion 130.
  • the central portion 110 may be formed long in a band shape.
  • the temperature sensing unit 111 may be formed to extend outward from the central portion 110.
  • the temperature sensing unit 111 may be provided to extend in a plurality of sides.
  • the temperature sensing unit 111 may be configured to detect a phenomenon such as overheating by measuring the temperature of the battery cell and transferring it to the external device as electrical information through the flexible circuit board 100.
  • the first connection circuit unit 120 and the second connection circuit unit 130 may be identically formed at both ends of the central portion 110 and applied.
  • various embodiments of the present disclosure will be described based on portions formed on one side of the central portion 110.
  • the first connection circuits 120 are formed at both ends of the central portion 110, respectively.
  • the first connection circuit part 120 may extend to both sides of one end of the central portion 110 and may have a shape perpendicular to the central portion 110.
  • the first connection circuit part 120 may be disposed to face each other with the center part 110 in the center.
  • the second connection circuit unit 130 may be formed to be bent from the first connection circuit unit 120.
  • the central portion 110 is bent vertically in the direction in which the central portion 110 is formed to be formed parallel to the central portion 110.
  • the second connection circuit unit 130 may be formed at each end of the first connection circuit unit 120. For example, a total of four second connection circuit parts 130 may be formed in one flexible circuit board 100.
  • the overlapping part 140 may be formed between the first connection circuit part 120 and the second connection circuit part 130.
  • the overlapping part 140 may be defined as a part in which the second connection circuit part 130 is folded to one side of the first connection circuit part 120 so that the second connection circuit part 130 overlaps with a plurality of layers.
  • the overlapping part 140 includes a first overlapping part 141 and a second connection circuit part in which the second connection circuit part 130 is folded upward toward the first connection circuit part 120 along the first bending line 131.
  • 130 may further include a second overlapping part 142 that is folded upwardly in the length direction of the first connection circuit part 120 of the first overlapping part 141 along the second bending line 132.
  • the overlapping part 140 is formed by folding the second connection circuit part 130 along the first bending line 131 and the second bending line 132 and corresponds to a part of the second connection circuit part 130.
  • the second connection circuit part 130 may be disposed in parallel with the first connection circuit part 120.
  • the third connection circuit unit 150 formed in the second connection circuit unit 130 may be disposed in parallel with the third connection circuit unit 150 formed in the first connection circuit unit 120.
  • the first bending line 131 may be formed to be parallel to the longitudinal direction of the first connection circuit unit 120.
  • the second bending line 132 may be formed in an oblique direction to an angle of about 45 degrees with the first bending line 131.
  • the second connection circuit part 130 is formed in parallel with the center part 110 (first state), and is folded along the first bending line 131 to the upper side of the second connection circuit part 130 to the opposite side of the center part 110.
  • a state formed in parallel with the central portion 110 (second state), and the first overlapping portion 141 is formed between the first connection circuit portion 120 and the second connection circuit portion 130.
  • the second connection circuit unit 130 is bent along the second bending line 132 to the upper side of the first overlapping unit 141 and is in a state of being arranged on the same line as the first connection circuit unit 120 (first 3), a second overlapping part 142 may be formed between the first overlapping part 141 and the second connection circuit part 130.
  • the overlapping part 140 and the bending lines 131 and 132 are not necessarily formed in two, based on one second connection circuit part 130, and may vary according to the cutting shape and the final shape of the flexible circuit board 100. It can be formed as.
  • the portions of the second connecting portions constituting the first overlapping portion 141 and the second overlapping portion 142 may be tightly fixed by the adhesive 200.
  • the adhesive 200 may be configured to provide a fastening force on the upper side and the lower side at the same time.
  • the adhesive 200 may use, for example, double-sided tape or double-sided pad. When the adhesive 200 is used, the increase in thickness due to the overlap of the flexible circuit board 100 may be minimized and the lifting may be prevented to prevent damage due to vibration due to the assembling process or driving of the vehicle.
  • the flexible circuit board 100 may have a final shape after the folding operation is different from the cut shape before the bending operation. Accordingly, the yield in the production process of the flexible printed circuit board 100 may be improved, and the voltages of the plurality of battery cells stacked to occupy a wide width may be sensed.
  • FIG. 7 is a perspective view illustrating an exposed state of the substrate layer of the third connection circuit unit 150 illustrated in FIG. 4, and FIG. 8 illustrates the first surface 151 and the second surface 152 illustrated in FIG. 7.
  • 9 is a cross-sectional view illustrating a cross section of the third connection circuit unit 150 illustrated in FIG. 8.
  • the third connection circuit part 150 is formed to extend from the first connection circuit part 120 and the second connection circuit part 130 so as to branch from each of the first connection circuit part 120 and the second connection circuit part 130. One side may be bonded to the busbar.
  • the plurality of third connection circuit parts 150 may extend in the same direction in the first connection circuit part 120.
  • one third connection circuit unit 150 may be formed to extend to an end of the second connection circuit unit 130.
  • the third connection circuit part 150 is formed of the second connection circuit part 130 when the second connection circuit part 130 is in a state of being arranged on the same line as the first connection circuit part 120 (that is, a third state).
  • the third connection circuit unit 150 may be arranged side by side in the same direction such that the third connection circuit unit 150 protrudes in the same direction as the third connection circuit unit 150 formed in the first connection circuit unit 120.
  • the third connection circuit unit 150 may be bonded to the bus bar to measure voltage and current of each of the battery cells and transmit the electrical information along the substrate layer 101. Therefore, the number of the third connection circuit units 150 may be adjusted to increase or decrease according to the number of battery cells and the number of bus bars.
  • Both sides of the third connection circuit unit 150 may be formed to expose the internal substrate layer 101 of the flexible circuit board 100, and the substrate layer 101 may be formed by contacting the bus bar with the first surface 151 and the first surface 151. It may include a second surface 152 formed on the opposite side of the first surface 151 and exposed.
  • the size of the first surface 151 may be larger than that of the second surface 152. Such a structure may facilitate bonding between the first surface 151 and the bus bar, and minimize damage of the substrate layer 101 by reducing a portion of the substrate layer 101 exposed to the outside.
  • the third connection circuit 150 may be formed such that one surface of the inner substrate layer 101 is exposed.
  • the opposite side of one surface of the substrate layer 101 may be covered with an insulating layer.
  • one surface of the exposed substrate layer 101 may be in contact with the bus bar.
  • the bus bar and the third connection circuit unit 150 can be directly bonded to each other, thereby reducing the labor and the weight and cost. This will be described in detail when describing the battery module.
  • FIG. 10 is a perspective view of a battery module 1 according to a first embodiment of the present disclosure
  • FIG. 11 is an exploded view of the battery module 1 shown in FIG. 10
  • FIG. 12 is a battery module 1 shown in FIG. 10.
  • FIG. 13 is a perspective view of the frame assembly 10 of the battery module 1 shown in FIG. 10, and
  • FIG. 14 is a top plate () of the frame 400 shown in FIG. 13. 410 and a perspective view showing the hinge coupling of the side plate 420.
  • the battery module 1 according to the first embodiment of the present disclosure includes a cell assembly 300 in which one or more battery cells are stacked and a frame assembly for fixing the cell assembly 300. (10) may be included.
  • the frame assembly 10 includes a top plate 410, side plates 420 connected to both ends of the top plate 410, and a frame 400 and side plates arranged to surround the cell assembly 300.
  • the bus bar 500 may be disposed and fixed to the 420, and the flexible circuit board 100 may be disposed along the upper plate 410 and the side plate 420 to sense the voltage of the battery cell.
  • the upper plate 410 may be formed with a path groove 411 is formed in a predetermined depth on the upper side.
  • the cell assembly 300 is formed by stacking one or more battery cells, and the battery cell is generally formed of a secondary battery, but is not limited thereto.
  • the cell assembly 300 may be formed of any battery that can be charged or discharged.
  • the battery cell may protrude to both sides to form a terminal portion 310. If a negative terminal is formed on one side, a positive terminal is formed on the other side. It is also preferred that it is formed of a conductive material and has a flexible characteristic to be deformable. Therefore, the terminal part 310 is folded to one side and electrically connected to the adjacent terminal part 310 through a bonding process.
  • the cell assembly 300 may be formed by stacking battery cells upright, and the battery cells are connected to other adjacent battery cells and the terminal unit 310.
  • the battery cells are electrically connected in parallel, and when the terminals having different polarities are connected to each other, the battery cells are electrically connected in series.
  • connection of the battery cells can be configured differently as necessary. For example, eight battery cells may be connected in parallel by two, and four cells connected in parallel may be connected in series to form 4P 3S.
  • the battery assembly according to the vehicle package can be easily changed by changing the connection configuration of the battery cells in the cell assembly 300, and the productivity time can be improved by reducing the time required for the bonding process.
  • the frame 400 may include an upper plate 410 and side plates 420 connected to both ends of the upper plate 410.
  • the upper plate 410 and the side plate 420 of the frame 400 are hingedly coupled to the hook portion 414 formed on the upper plate 410 and the rod portion 424 formed on the side plate 420.
  • Each end of the upper plate 410 may be formed with a plurality of hook-shaped hook portions 414 spaced apart from each other, and a rod portion may be formed on an upper surface of the side plate 420 corresponding to a position at which the hook portion 414 is formed. 424 may be formed.
  • the hook portion 414 and the rod portion 424 protrude from the upper plate 410 and the side plate 420, respectively, and face each other, so that the rod portion 424 is fitted to the hook portion 414. It can be hinged.
  • the radius of curvature of the hook portion 414 may be equal to or smaller than the radius of the rod portion 424. Accordingly, a predetermined or more fixing force may be secured in the coupling of the upper plate 410 and the side plate 420, and thus, workability may be improved by preventing the frame 400 from being separated during the assembly process.
  • the upper plate 410 is disposed above the cell assembly 300, and the side plate 420 is disposed on both sides of the cell assembly 300 in which the terminal portion 310 is formed. ) May be arranged to surround.
  • the frame 400 may have a top plate 410 and a side plate 420 formed by plastic injection molding. Accordingly, the frame 400 is inexpensive to produce, and can be easily assembled by hinge coupling.
  • FIG. 15 is a side view illustrating an arrangement of the frame 400 and the flexible circuit board 100 of the battery module 1 illustrated in FIG. 10, and FIG. 16 is a top plate of the frame assembly 10 illustrated in FIG. 13. 410 and a perspective view showing a combined configuration of the flexible circuit board 100
  • Figure 17 is an exploded perspective view showing an exploded configuration of the upper plate 410 and the flexible circuit board 100 shown in FIG.
  • FIG. 18 is a plan view illustrating a state in which the flexible circuit board 100 is seated in the path groove 411 of the upper plate 410 of FIG. 17.
  • FIG. 19 is a front view of the side plate 420 of the battery module 1 shown in FIG. 10,
  • FIG. 20 is an enlarged perspective view of the reinforcing plate 600 shown in FIG. 19, and
  • FIG. 21 is shown in FIG. 20.
  • AA is a cross-sectional perspective view and a cross-sectional view
  • Figure 22 is a view showing a fixing method of the reinforcing plate 600 shown in Figure 20
  • Figure 23 is a seating portion 520 of the bus bar 500 shown in Figure 19 It is an enlarged perspective view.
  • the flexible printed circuit board 100 is disposed along the outer side of the frame 400, as shown in FIG. 15.
  • the central portion 110 may be disposed on an upper surface of the upper plate 410.
  • the central portion 110 is seated and fixed in a path groove 411 formed with a constant depth, the length of the central portion 110 is formed longer than the longitudinal direction of the upper plate 410 so that both ends of the central portion 110 are side plates Can be bent along 420.
  • the first connection circuit part 120 and the second connection circuit part 130 are disposed outside the side plate 420, and are bent and adhered along the exterior of the side plate 420. Therefore, the third connection circuit unit 150 formed in the first connection circuit unit 210 and the second connection circuit unit 130 may be structurally disposed outside the bus bar 500.
  • protruding holes 112 may be formed in the central portion 110 and the second connection circuit portion 130.
  • a plurality of protruding holes 112 may be formed, and fastening members (not shown) may penetrate to fix the flexible circuit board 100 to the frame 400.
  • the protruding hole 112 extends to protrude outward and does not affect the internal circuit.
  • BMS battery management system
  • BMS manages charging and discharging of each battery cell. For example, BMS may charge a plurality of battery cells discharged to different voltage levels in a charging mode to have a uniform voltage level.
  • the upper plate 410 is formed in a quadrangular shape corresponding to the size of the cell assembly 300, and is disposed above the cell assembly 300.
  • the upper side surface includes a path groove 411 in which the center portion 110 is seated, and includes a top cover 413 covering an upper side of the path groove 411.
  • the path groove 411 may be formed to pit to a certain depth so that the center portion 110 can be seated.
  • the top cover 413 may cover the upper side of the central portion 110 in a state in which the central portion 110 is seated in the path groove 411. Therefore, the path groove 411 and the top cover 413 may be formed in the same shape as the shape of the central portion (110). Therefore, the central portion 110 is not separated to the outside of the frame 400 and is not exposed to the outside, thereby preventing damage to the central portion 110 during the assembly process.
  • the upper plate 410 may be formed with a rib 412 protruding toward the inside of the path groove 411. Ribs 412 are formed in a plurality of alternately on both sides of the path groove 411, may be formed to be spaced apart from each other at regular intervals.
  • the rib 412 may be formed to protrude inwardly from both sides of the path groove 411, and the bottom surface of the rib 412 may be spaced apart from the path groove 411 by a predetermined distance. Therefore, the central portion 110 is disposed between the rib 412 and the path groove 411, and thus prevents the central part 110 from being separated from the path groove 411, so that the flexible circuit board 100 can be used without an adhesive such as a double-sided tape. ) May be tightly fixed to the frame 400.
  • the reinforcing plate 600 and the bus bar 500 may be tightly fixed to an outer surface of the side plate 420.
  • the side plate 420 is composed of two and connected to both ends of the upper plate 410, respectively.
  • two side plates 420 may be disposed on both sides of the cell assembly 300.
  • Both sides of the cell assembly 300 may be both sides on which the terminal unit 310 of the battery cell is formed.
  • the reinforcement plate 600 may cover the end of the central portion 110 and be fixed in close contact with the side plate 420.
  • a fusion protrusion 425 protruding from the side plate 420 may be formed to fix the reinforcing plate 600.
  • Fixing holes 115 and 615 may be formed in each of the central portion 110 and the reinforcing plate 600 to correspond to the position of the fusion protrusion 425.
  • the reinforcing plate 600, the fusion protrusion 425 sequentially penetrates through the first fixing hole 115 of the central portion 110 and the second fixing hole 615 of the reinforcing plate 600, and then fixed in a fusion method. Can be.
  • the fusion protrusion 425 is melted from the outside by a pressing member (not shown) equipped with a heater in the thermal fusion process, and then compressed, and then the reinforcement plate 600 is cooled to the side plate 420 while the compressed portion is cooled and cured. It may be in close contact.
  • an end portion of the central portion 110 may be disposed and fixed between the reinforcing plate 600 and the side plate 420. Since the reinforcement plate 600 presses the lower end portion past the bent portion of the central portion 110, the bending of the flexible circuit board 100 may be further minimized by the pressurization to prevent damage such as cracks. In addition, the flexible circuit board 100 may be directly prevented from being pressurized in the heat fusion process, and damage may be minimized by absorbing external force such as continuous vibration or shock caused by driving of the vehicle.
  • the fusion process here includes not only thermal fusion fixing but also ultrasonic fusion fixing and the like.
  • the reinforcement plate 600 may be formed of any insulating material without a circuit except for metal so as not to interfere with the electrical connection between the flexible circuit board 100 and the bus bar 500.
  • the bus bar 500 may be tightly fixed to the side plate 420 so that one part may be connected to the third connection circuit 150 and the other part may be connected to the terminal 310. Therefore, the bus bar 500 may be configured to electrically connect the flexible circuit board 100 and the battery cell.
  • the bus bars 500 may be provided in plural numbers so as to be spaced apart from each other, and the number of bus bars 500 may be changed as necessary.
  • an insertion hole 510 and a seating part 520 may be formed in each bus bar 500.
  • the seating part 520 may be a part that is joined to the third connection circuit part 150 of each bus bar 500, and may be formed to pie at a predetermined depth. Therefore, the worker can visually identify the working position based on the seating part 520, and can grasp
  • the insertion hole 510 may be formed along the same direction as the direction in which the battery cells are stacked.
  • the terminal portion 310 of the cell assembly 300 is inserted into the insertion hole 510, and a portion of the terminal portion 310 protruding through the insertion hole 510 may be folded to one side and bonded to the bus bar 500. . Accordingly, the battery cell may be electrically connected to another battery cell through the bus bar 500.
  • a hole (not shown) may be formed in the side plate 420 corresponding to the position where the insertion hole 510 is formed to insert the terminal portion 310.
  • the bus bar 500 may include a sensing bus bar and an HV bus bar that are separately formed.
  • the bus bar 500 may be electrically connected to the terminal 310 of the cell assembly 300 to transmit information about voltage and current of each battery cell, or may be connected to a bus bar installed outside the battery module 1 to provide electrical information. Can be passed.
  • the bus bar 500 may be formed of a conductor, and may be formed of a metal having high electrical conductivity.
  • FIG. 24 is a front view illustrating a state in which the substrate layer 101 is directly bonded to the seating portion 520 illustrated in FIG. 23, and FIG. 25 illustrates the substrate layer 101 illustrated in FIG. 24 attached to the bus bar 500.
  • 26 is a cross-sectional view illustrating a bonding method for bonding
  • FIG. 26 is a plan view illustrating a state in which a coating unit 800 is further formed on the third connection circuit unit 150 of FIG. 24, and
  • FIG. 27 is a view of the coating layer illustrated in FIG. 26. It is a cross section.
  • the substrate layer 101 includes a first surface 151 contacting the bus bar 500 and a second surface 152 formed on an opposite side of the first surface 151 and an outer side of the second surface 152. As a coating portion 800 may be further formed.
  • the first surface 151 and the second surface 152 may be formed by cutting the insulating layer 102 of the flexible circuit board 100 to expose the internal substrate layer 101.
  • the first surface 151 may be in contact with one side of the bus bar 500, and may be in contact with a seating part 520 formed in the bus bar 500 at a predetermined depth.
  • the seating part 520 may improve the workability by clearly indicating a position where the third connection circuit part 150 is bonded.
  • the size of the first surface 151 may be larger than that of the second surface 152. According to the present embodiment, the welding area with the bus bar 500 may be secured, and the damage of the third connection circuit part 150 may be prevented by reducing the area of the substrate layer exposed to the outside.
  • the substrate layer 101 is formed of an electrically conductive material and serves as a circuit of the flexible printed circuit board 100.
  • the substrate layer 101 directly bonds the first surface 151 and the seating portion 520 to the bus bar 500.
  • the flexible circuit board 100 may be electrically connected. In this process, the first surface 151 may be joined by laser welding on the outside of the second surface 152.
  • the first surface 151 may be a surface exposed by cutting the insulating layer 102. If an air gap corresponding to the outside of the seating portion 520 and the thickness of the insulating layer 102 exists, a shape in which the substrate layer 101 is burned in the bonding process due to the air gap occurs or the insulating layer 102 is formed. ) May burn and fail to achieve the required quality.
  • the air gap existing between the first surface 151 and the seating portion 520 may be removed by pressing the second surface 152 with the jig (Z, jig) in the bonding process.
  • the contact area between the seating portion 520 and the first surface 151 may be increased by pressurization to improve the fixing force of the welded portion.
  • the third connection circuit unit 150 is configured to be exposed to both surfaces of the substrate layer 101, the third connection circuit unit 150 may have a structure that can be directly coupled to the bus bar 500. Thus, it is possible to provide more improved productivity by reducing the number of applied parts and the man-hour.
  • the coating part 800 may be formed to cover a portion of the bus bar 500 around the second surface 152 and the third connection circuit part 150.
  • the coating part 800 may be made of a non-conductive material so as not to interfere with the electrical connection between the substrate layer 101 and the bus bar 500, and may be applied only to a part using a nozzle.
  • the coating part 800 may be formed with the first surface 151 bonded to the bus bar 500. In addition, it is formed to cover not only the second surface 152 but also a portion of the peripheral insulating layer 102 and the peripheral bus bar 500 of the second surface 152 to prevent corrosion of the substrate layer 101 and at the same time Bonding strength with 500 can be improved.
  • FIG. 28 is a front view illustrating a state in which the connection portion 720 of the integrated connection terminal 700 is bonded to the seating portion 520 illustrated in FIG. 23, and FIG. 29 is an embodiment illustrated in FIG. 28.
  • FIG. 30 is a perspective view of an integrated connection terminal 700 according to an example, and FIG. 30 is a connection portion 1720 of a ring-shaped connection terminal 1700 which is a different embodiment from the integrated connection terminal 700 in the seating portion 520 illustrated in FIG. 23. Is a front view showing a bonded state, and FIG. 31 is a perspective view of the ring-shaped connection terminal 1700 and the fastening member 1730 illustrated in FIG. 30, and FIG. 32 is a fixing portion (shown in FIGS. 28 and 30). 710 is a perspective view illustrating how the third connection circuit unit 150 is fixed.
  • the flexible circuit board 100 and the bus bar 500 may be electrically connected to each other by the substrate layer 101 formed on the third connection circuit unit 150 as described in the above-described embodiment. However, it may be electrically connected to the third connection circuit unit 150 and the connection terminals 700 and 1700 respectively connected to the bus bar 500.
  • connection terminals 700 and 1700 include fixing parts 710 and connecting parts 720 and 1720, and the connecting parts 720 and 1720 extend from one side of the fixing part 710 and are integrally formed.
  • the connection terminals 700 and 1700 are positioned between the bus bar 500 and the third connection circuit unit 150, and are connected to both sides to electrically connect the third connection circuit unit 150 and the bus bar 500. Can be.
  • the fixing part 710 may be formed to be relatively narrow as a part fixed to the third connection circuit part 150, and a fixing protrusion 711 protruding upward and downward may be formed.
  • the fixing protrusions 711 may be provided in plural to be spaced apart from each other, and may pass through the third connection circuit unit 150 arranged at a predetermined position. The protruding portion of the fixing protrusion 711 is bent and deformed and fixed to the third connection circuit unit 150.
  • connection terminals 700 and 1700 may have various embodiments, and the same parts will be described below with the same reference numerals even when they correspond to different embodiments.
  • connection part 720 of the connection terminal 700 is formed to be relatively wide and joined to the seating part 520 of the bus bar 500, and is formed by laser welding. Can be bonded.
  • connection portion 1720 of the connection terminal 1700 may have a ring shape having a hole 1721 formed at the center thereof, and the ring shape may include a fastening member 1730 such as a screw. It can be fixed by.
  • connection terminals 700 and 1700 unlike the conventional fixed terminal and the connection plate for connecting the flexible circuit board and the bus bar, the fixing unit 710 and the connection unit 720 and 1720 are integrated. Can reduce labor and reduce production costs, thus improving productivity.
  • FIG. 33 is a perspective view illustrating a state in which the coupling member 2700 is coupled to the seating portion 520 illustrated in FIG. 23, and FIG. 34 illustrates a coupling member 2700 coupled to the seating portion 520 illustrated in FIG. 33.
  • 35 is a perspective view showing a coupling method for performing the same.
  • the flexible circuit board 100 and the bus bar 500 may be electrically connected to each other by the substrate layer 101 or the connection terminals 700 and 1700 formed in the third connection circuit unit 150 as described above.
  • the coupling member 2700 may be overlapped between the third connection circuit unit 150 and the bus bar 500 to electrically connect the third connection circuit unit 150 and the bus bar 500.
  • the coupling member 2700 may include a head 2710 disposed outside the third connection circuit 150 and a joint 2720 extending from the head 2710.
  • the joint 2720 may electrically connect the flexible circuit board and the bus bar. Therefore, the coupling member 2700 is formed of a metal material having electrical conductivity.
  • the head 2710 may be disposed to protrude outward from the joint part 2720 to press the third connection circuit 150 to the seating part 520 to fix the third connection circuit 150 to the seating part 520. have.
  • a first coupling hole 521 is formed in the seating portion 520 to couple with the coupling member 2700, and a second coupling hole corresponding to the position of the first coupling hole 521 in the third connection circuit portion 150. 153 may be formed.
  • the first coupling hole 521 and the second coupling hole 153 may be formed in pairs spaced apart from each other, and may have the same inner diameter.
  • the joint part 2720 may be fixed to the bus bar 500 by sequentially passing through the second coupling hole 153 and the first coupling hole 521.
  • the head 2710 extends to the outside of the joint part 2720 and protrudes outside the third connection circuit unit 150.
  • the joint portion 2720 may have the same size as the first coupling hole 521 and the second coupling hole 153, and the head 2710 may have a radius larger than that of the joint portion 2720. Therefore, the head 2710 may not be penetrated through the first coupling hole 521 and the second coupling hole 153 and may be disposed outside the third connection circuit unit 150.
  • the joint portion 2720 of the coupling member 2700 penetrates through the second coupling hole 153 and is electrically connected to the substrate layer 102 of the third connection circuit unit 150. 1 Since the coupling bar 521 is electrically connected to the bus bar 500, the coupling member 2700 may electrically connect the flexible circuit board and the bus bar.
  • the engagement member 2700 may be composed of a rivet that provides a permanent binding force and is usefully used between thin members.
  • the rivet it is possible to fundamentally prevent distortion due to the welding process or crack shape generated at the welded portion, thereby improving the reliability of the bonding.
  • the battery module 2 according to the second embodiment of the present disclosure has the same configuration as the battery module 1 according to the first embodiment described above, a redundant description of the same configuration as that described above will be omitted. .
  • FIG. 36 is a perspective view of a battery module 2 according to a second embodiment of the present disclosure
  • FIG. 37 is a side view illustrating an exploded configuration of the frame 400 and the flexible circuit board 100 shown in FIG. 36
  • FIG. 38 is a perspective view from below of the frame 400 shown in FIG. 36
  • FIG. 39 is an exploded view of the upper plate 410 and the flexible circuit board 100 shown in FIG. 38
  • FIG. 40 is shown in FIG. 39. It is an enlarged perspective view of the protection hole 417 shown.
  • the battery module 2 is a frame assembly for fixing the cell assembly 300 and the cell assembly 300 formed by stacking one or more battery cells. 20 may be included.
  • the frame assembly 20 includes a top plate 410 and a frame 400 disposed to surround the cell assembly 300 including side plates 420 connected to both ends of the top plate 410.
  • a bus bar 500 disposed on and fixed to the side plate 420, a flexible circuit board 100 disposed along the upper plate 410 and the side plate 420 to sense a voltage of the battery cell, and the side surface.
  • the reinforcing plate 600 may be tightly fixed to one side of the plate 420 to cover an end portion of the flexible circuit board 100.
  • the upper plate 410 may be formed with a protective groove 416 that is dug to a certain depth on the bottom.
  • the central portion 110 of the flexible circuit board 100 may be disposed on the bottom surface of the upper plate 410.
  • the first connection unit 120 and the second connection circuit unit 130 may be disposed on the outer surface of the side plate 420.
  • the central portion 110 may be located between the upper plate 410 and the cell assembly 300, thereby minimizing a portion of the flexible circuit board exposed to the outside of the battery module 1. Therefore, damage to the flexible circuit board 100, such as tearing due to cracks, which may occur in the assembly process, may be minimized.
  • the upper plate 410 of the frame 400 may have a protective groove 416 formed at a bottom thereof to accommodate the central portion 110, and the protective groove 416 may have a central portion 110. It may be formed in the same shape.
  • the central portion 110 may be tightly fixed to the protective groove 416 by the adhesive 200.
  • the adhesive 200 may use a double-sided tape 200 having a shape corresponding to that of the central portion 110 and the protective groove 416. In the case of fixing the central portion 110 by the double-sided tape 200, the heat fusion process can be minimized during the assembly of the battery module 1, thereby shortening the production time, and the ductility caused by the pressure in the fusion fixing. Damage to the circuit board 100 can be prevented.
  • a protective hole 417 may be formed in at least one of the upper plate 410 and the side plate 420 corresponding to the position where the protective groove 416 is formed.
  • the protection hole 417 passes through an end portion of the central portion 110 such that the first connection circuit portion 120 and the second connection circuit portion 130 may be disposed on the outer surface of the side plate 420.
  • the central portion 110 may be bent while penetrating through the protection hole 417, so that the protection hole 417 may be formed in the upper plate 410 in order to minimize this.
  • first connection circuit part 120 and the second connection circuit part 130 are formed wider than the central part 110, the central part 110 is protected before the upper plate 410 and the side plate 420 are hinged. Receiving and fixed in the groove 416 may facilitate assembly of the frame assembly 20.
  • FIG. 41 is a perspective view illustrating a direction in which the frame assembly 20 is assembled to the cell assembly 300
  • FIG. 42 is a terminal part in the insertion hole 510 after the cell assembly 300 and the frame assembly 20 are assembled.
  • FIG. 43 is a perspective view illustrating the inserted state
  • FIG. 43 is a perspective view illustrating a state in which the terminal unit 310 is inserted into the insertion hole 510 and then folded and connected to the bus bar 500.
  • An enlarged perspective view of the terminal unit 310 shown. 45 is a perspective view illustrating a method of assembling the battery module 2 and the monoframe 900.
  • the terminal unit 310 of one battery cell may be connected to the terminal unit 310 of an adjacent battery cell to form a stacked cell assembly 300.
  • the terminal unit 310 may be connected to the adjacent terminal unit 310 in a state protruding to both sides of the battery cell.
  • the frame 400 may be in a state where the upper plate 410 and the side plate 420 are hinged and assembled.
  • the flexible circuit board 100 may be disposed along the frame 400, and the third connection circuit unit 150 may be disposed in a state of being bonded to the bus bar 500.
  • the assembled frame assembly 20 is coupled to the cell assembly 300 from the upper side to the lower side of the cell assembly 300.
  • the side plate 420 may be rotated outward with respect to the hinge coupling with the upper plate 410 to be opened outward with respect to the upper plate 410. Accordingly, the frame assembly 20 may be disposed to surround the outside of the cell assembly 300 without disturbing the terminal portion 310.
  • the side plate 420 rotated outward is rotated back to the inner position and positioned.
  • the protruding terminal portion 310 passes through a hole (not shown) formed in the side plate 420 and an insertion hole 510 formed in the bus bar 500, and an end of the terminal portion 310 of the bus bar 500. It may protrude outward.
  • An end portion of the terminal portion 310 is formed by attaching a plurality of terminal portions 310 to which the terminal portions 310 of the battery cells adjacent to the battery cells are bonded.
  • an end portion of the terminal portion 310 protruding outward is folded to one side and bonded to an outer surface of the bus bar 500.
  • the terminal part 310 end does not contact the end of another adjacent terminal part 310, and thus is connected to one terminal part 310 by another terminal part 310.
  • the battery cell may be electrically connected to another battery cell only by the bus bar 500.
  • the terminal portion 310 and the busbar 500 are joined by laser welding on the outside of the terminal portion 310 ends without providing a separate configuration for coupling, so that the time and cost required for the production of the battery module. Can reduce the cost.
  • the assembled battery module 1 may be assembled and fixed with the mono frame 900 once again.
  • the mono frame 900 prevents slippage or damage of the cell assembly 300 when a vehicle accident occurs, thereby preventing secondary accidents such as fire.
  • the mono frame 900 may be formed of a metal material or the like having high strength.

Abstract

Provided is a flexible circuit board installed in a frame to which a bus bar is coupled. The Flexible circuit board may comprise: a center part having a band shape; first connection circuit parts formed at both ends of the center part and disposed to face each other; second connection circuit parts which respectively extend from the first connection circuit parts and are parallel to the center part; and third connection circuit parts which respectively extend from a first connection circuit part and a second connection circuit part and are connected to the bus bar. When the second connection circuit part is folded toward one side of the first connection circuit part, an overlapped portion, which includes one portion of the second connection circuit part and is disposed to overlap another portion of the second connection circuit part in view of a section, may be formed. When the overlapped portion is formed, the second connection circuit part may be disposed on the same line as that of the first connection circuit part.

Description

연성회로기판 및 이를 포함하는 프레임 조립체Flexible circuit board and frame assembly including same
본 개시는 연성회로기판 및 이를 포함하는 프레임 조립체에 관한 것이다.The present disclosure relates to a flexible circuit board and a frame assembly including the same.
이차전지는 모바일 기기, 보조 전력장치 등에 광범위하게 사용되고 있다. 또한 이차전지는 종래 가솔린 차량이나 디젤 차량이 갖는 대기 오염 등의 각종 문제점을 해결하기 위한 대안으로 제시된 전기자동차, 하이브리드 전기자동차, 플러그인 하이브리드 전기자동차 등의 주된 원동력으로서도 주목 받고 있다.Secondary batteries are widely used in mobile devices, auxiliary power devices, and the like. In addition, the secondary battery has attracted attention as a main driving force for electric vehicles, hybrid electric vehicles, plug-in hybrid electric vehicles, etc., which are proposed as alternatives to solve various problems such as air pollution of conventional gasoline or diesel vehicles.
전기자동차 등에 사용되는 이차전지는 고출력 대용량 배터리의 필요성으로 인해 복수 개의 배터리 셀을 적층시킨 후 이를 전기적으로 직렬 및 병렬 연결한 배터리 모듈이 사용된다. 이러한 배터리 모듈은 배터리 셀의 적층된 정도에 따라 필요한 고출력을 제공할 수 있다는 장점이 있으나, 배터리 셀이 적층된 상태로 사용되어 일부 배터리 셀에서 과전압, 과전류, 과발열 등의 현상이 발생할 수 있다.Secondary batteries used in electric vehicles, etc. are used because of the necessity of a high output large capacity battery, a plurality of battery cells are stacked and electrically connected in series and in parallel. Such a battery module has an advantage of providing the required high power according to the degree of stacking of battery cells, but the battery cells may be used in a stacked state, such that overvoltage, overcurrent, and overheating may occur in some battery cells.
이러한 형상은 배터리 모듈의 안정성이나 작동 효율 등에 영향을 미치므로, 이를 미리 검출하기 위한 수단이 요청된다. 따라서 배터리 모듈은 배터리 셀에 연결되는 회로기판을 이용하여 각 배터리 셀의 전압을 센싱하고, 이를 버스바를 통해 BMS(Battery Mamagement System)로 전기적 정보로 전달하여 각 배터리 셀의 과전압, 과전류, 과발열 등의 현상을 검출하고, 이에 따른 추가적인 손상을 방지한다.Since the shape affects the stability, the operation efficiency, and the like of the battery module, a means for detecting it in advance is required. Therefore, the battery module senses the voltage of each battery cell using a circuit board connected to the battery cell, and transfers it as electrical information to the BMS (Battery Mamagement System) through the busbar to overvoltage, overcurrent, overheating, etc. of each battery cell. To detect the phenomenon of and thereby prevent further damage.
한편, 얇은 절연층 사이에 동박이 적층되어 형성되는 연성회로기판은 무게가 가볍고, 공간을 적게 차지하며, 원하는 형상에 따라 재단하여 사용할 수 있는 장점이 때문에 최근 다양한 분야에서 사용되고 있다. 따라서 차량의 프레임 조립체에서도 차량의 경량화 및 연비 개선을 위해 배터리 셀 전압을 센싱하기 위해 연성회로기판을 사용하기 위한 다양한 연구가 진행 중에 있다.Meanwhile, flexible circuit boards formed by stacking copper foils between thin insulating layers have been used in various fields recently because they are light in weight, take up less space, and can be cut and used according to a desired shape. Therefore, various studies are underway to use the flexible circuit board to sense the battery cell voltage in order to reduce the weight and fuel efficiency of the vehicle frame assembly.
본 개시의 실시예들은, 셀 조립체를 고정하기 위한 프레임 조립체에 사용되는 연성회로기판을 제공한다. 또한, 생산과정의 수율을 향상시키고, 조립과정에서 발생할 수 있는 파손현상을 방지하며, 작업성을 향상시킬 수 있는 연성회로기판의 구조를 제공한다.Embodiments of the present disclosure provide a flexible circuit board for use in a frame assembly for fixing a cell assembly. In addition, it provides a structure of a flexible circuit board to improve the yield of the production process, to prevent breakage that may occur during the assembly process, and to improve the workability.
본 개시의 일 실시예에 따른 버스바가 결합된 프레임에 설치되는 연성회로기판에 있어서, 밴드 형상의 중심부; 중심부의 양 단부에 형성되고, 서로 대향하도록 배치되는 제1 연결 회로부; 제1 연결 회로부로부터 중심부와 나란하도록 연장된 제2 연결 회로부; 및 제1 연결 회로부 및 제2 연결 회로부 각각으로부터 연장되어 버스바에 연결되는 제3 연결 회로부를 포함하고, 제2 연결 회로부가 제1 연결 회로부의 일측으로 접히는 경우, 단면 방향에서 서로 겹치도록 배치된 제1 연결 회로부의 일부 및 제2 연결 회로부의 일부를 포함하는 겹침부가 형성되고, 겹침부가 형성되는 경우, 제2 연결 회로부는 제1 연결 회로부와 동일선상에 배치될 수 있다.According to an embodiment of the present disclosure, a flexible circuit board installed in a frame to which a bus bar is coupled, the flexible circuit board comprising: a central portion having a band shape; First connection circuits formed at both ends of the central portion and disposed to face each other; A second connection circuit portion extending from the first connection circuit portion to be parallel to the central portion; And a third connection circuit part extending from each of the first connection circuit part and the second connection circuit part and connected to the busbar, wherein the second connection circuit part is arranged to overlap each other in the cross-sectional direction when the second connection circuit part is folded to one side of the first connection circuit part. When the overlapping part including a part of the first connection circuit part and a part of the second connection circuit part is formed, and when the overlapping part is formed, the second connection circuit part may be disposed on the same line as the first connection circuit part.
일 실시예에 따르면, 제2 연결 회로부는 제1 연결 회로부의 양 단부에 각각 형성되고, 제2 연결 회로부가 제1 벤딩 라인을 따라 제1 연결 회로부를 향하여 접혀서 형성되는 제1 겹침부; 및 제2 연결 회로부가 제2 벤딩 라인을 따라 제1 연결 회로부의 길이 방향으로 꺾어지도록 접혀서 형성되는 제2 겹침부를 포함할 수 있다.According to one embodiment, the second connection circuit portion is formed on both ends of the first connection circuit portion, respectively, the first overlapping portion formed by folding the second connection circuit portion toward the first connection circuit portion along the first bending line; And a second overlapping portion formed by being folded to be bent in the longitudinal direction of the first connection circuit portion along the second bending line.
일 실시예에 따르면, 제1 벤딩 라인은 제1 연결 회로부와 나란하게 형성되고, 제2 벤딩 라인은 제1 벤딩 라인에 대하여 소정의 각도로 기울어지도록 형성될 수 있다.In example embodiments, the first bending line may be formed in parallel with the first connection circuit, and the second bending line may be formed to be inclined at a predetermined angle with respect to the first bending line.
일 실시예에 따르면, 제1 겹침부 및 제2 겹침부를 구성하는 제2 연결부의 부분들 사이는 상측 및 하측에 대하여 고정력을 제공하는 접착제에 의해 밀착 고정될 수 있다.According to one embodiment, between the portions of the second connecting portion constituting the first overlapping portion and the second overlapping portion may be tightly fixed by an adhesive that provides a fixing force for the upper side and the lower side.
일 실시예에 따르면, 접착제는 양면 테이프 또는 양면 패드인 것을 특징으로 할 수 있다.According to one embodiment, the adhesive may be characterized as double-sided tape or double-sided pad.
일 실시예에 따르면, 제1 연결 회로부에 형성된 제3 연결 회로부는 서로 이격되도록 복수 개로 형성되고, 제1 연결 회로부와 제2 연결 회로부가 동일선상에 위치하는 경우, 제2 연결 회로부에 형성된 제3 연결 회로부가 제1 연결 회로부에 형성된 제3 연결 회로부와 일렬로 배치될 수 있다.According to one embodiment, a plurality of third connection circuit portion formed in the first connection circuit portion is formed to be spaced apart from each other, when the first connection circuit portion and the second connection circuit portion is located on the same line, the third formed on the second connection circuit The connection circuit unit may be arranged in line with the third connection circuit unit formed in the first connection circuit unit.
일 실시예에 따르면, 중심부로부터 외측으로 연장되어 형성되는 온도센싱부를 더 포함할 수 있다.According to one embodiment, it may further include a temperature sensing unit formed to extend outward from the center.
일 실시예에 따르면, 제3 연결 회로부는 기판층 및 기판층의 일 면을 노출시키도록 구성된 절연층을 포함하고, 기판층의 일 면은 버스바에 접촉하도록 구성될 수 있다.According to one embodiment, the third connection circuit portion may include a substrate layer and an insulating layer configured to expose one surface of the substrate layer, and one surface of the substrate layer may be configured to contact the busbar.
일 실시예에 따르면, 제3 연결 회로부는 기판층 및 기판층의 양 면을 노출시키도록 구성된 절연층을 포함하고, 기판층은, 버스바에 접촉되는 제1 면; 및 제1 면의 반대측에 형성되는 제2 면을 포함할 수 있다.According to one embodiment, the third connection circuit portion includes a substrate layer and an insulating layer configured to expose both surfaces of the substrate layer, the substrate layer comprising: a first surface in contact with the busbar; And a second surface formed on an opposite side of the first surface.
일 실시예에 따르면, 제3 연결 회로부는 제1 면의 크기가 제2 면의 크기보다 큰 것을 특징으로 할 수 있다.According to one embodiment, the third connection circuit portion may be characterized in that the size of the first surface is larger than the size of the second surface.
본 개시의 다른 실시예에 따른 적어도 하나의 배터리 셀이 적층되어 형성되는 셀 조립체를 고정하기 위한 프레임 조립체에 있어서, 상부 플레이트, 상부 플레이트의 양 단에 연결되는 측면 플레이트를 포함하여, 셀 조립체를 감싸도록 배치되는 프레임; 측면 플레이트에 배치되어 고정되는 버스바; 및 상부 플레이트와 측면 플레이트를 따라 배치되어 배터리 셀의 전압을 센싱하는 연성회로기판을 포함하고, 상부 플레이트는 상측면에 일정한 깊이로 파인 경로홈이 형성되며, 연성회로기판은, 외측으로 연장된 온도센싱부가 형성되고, 경로홈에 안착되는 밴드 형상의 중심부; 중심부의 양 단부에 형성되고, 서로 대향하도록 배치되는 제1 연결 회로부; 제1 연결 회로부의 양 단부에 연장되고, 중심부와 나란하게 형성되는 제2 연결 회로부; 및 제1 연결 회로부 및 제2 연결 회로부 각각으로부터 연장되어 버스바에 연결되는 제3 연결 회로부를 포함하고, 연성회로기판에는, 제2 연결 회로부가 제1 벤딩 라인을 따라 제1 연결 회로부를 향하여 접혀서 형성되는 제1 겹침부 및 제2 연결 회로부가 제2 벤딩 라인을 따라 제1 연결 회로부의 길이 방향으로 꺾어지도록 접혀서 형성되는 제2 겹침부를 포함하는 겹침부가 형성되고, 겹침부가 형성되는 경우, 제2 연결 회로부는 제1 연결 회로부와 동일선상에 배치되고, 제2 연결 회로부에 형성된 제3 연결 회로부는 제1 연결 회로부에 형성된 제3 연결 회로부와 일렬로 배치될 수 있다.In the frame assembly for fixing the cell assembly is formed by stacking at least one battery cell according to another embodiment of the present disclosure, including a top plate, side plates connected to both ends of the top plate, surrounding the cell assembly A frame disposed to be; A bus bar disposed on and fixed to the side plate; And a flexible circuit board disposed along the upper plate and the side plate to sense a voltage of the battery cell, wherein the upper plate has a path groove formed at a predetermined depth in the upper side thereof, and the flexible circuit board extends outward. Sensing portion is formed, the center portion of the band shape seated in the path groove; First connection circuits formed at both ends of the central portion and disposed to face each other; Second connection circuit portions extending at both ends of the first connection circuit portion and formed to be parallel to the central portion; And a third connection circuit portion extending from each of the first connection circuit portion and the second connection circuit portion and connected to the busbar, wherein the flexible circuit board is formed by folding the second connection circuit portion toward the first connection circuit portion along the first bending line. When the overlapping part is formed, an overlapping part including a second overlapping part formed by folding the first overlapping part and the second connection circuit part to be bent along the second bending line in the longitudinal direction of the first connection circuit part is formed, and the overlapping part is formed. The circuit part may be disposed on the same line as the first connection circuit part, and the third connection circuit part formed on the second connection circuit part may be disposed in line with the third connection circuit part formed on the first connection circuit part.
일 실시예에 따르면, 셀 조립체는 복수 개의 배터리 셀의 각 양단에 형성된 단자부가 직렬 또는 병렬로 적층되어 형성되고, 버스바에 단자부가 직접 접합되어 전기적으로 연결될 수 있다.According to an embodiment, the cell assembly may be formed by stacking terminal parts formed at each end of each of the plurality of battery cells in series or in parallel, and electrically connecting the terminal parts to the busbars.
일 실시예에 따르면, 버스바에는 배터리 셀이 적층된 방향과 동일한 방향으로 삽입홀이 형성되고, 셀 조립체는 복수 개의 배터리 셀이 병렬로 적층되고, 병렬로 적층된 배터리 셀이 다시 직렬로 적층되어 형성되고, 단자부가 삽입홀에 삽입되어 버스바와 전기적으로 연결될 수 있다.According to an embodiment, an insertion hole is formed in the same direction as the direction in which the battery cells are stacked in the bus bar, the cell assembly includes a plurality of battery cells stacked in parallel, and the battery cells stacked in parallel are again stacked in series. The terminal unit may be inserted into the insertion hole and electrically connected to the bus bar.
일 실시예에 따르면, 단자부는 삽입홀을 관통하고, 관통되어 돌출되는 부분은 버스바의 외측으로 접혀 레이져 용접되어 전기적으로 연결될 수 있다.According to one embodiment, the terminal portion penetrates the insertion hole, and the portion protruding therethrough may be folded outside the bus bar and laser-welded to be electrically connected.
일 실시예에 따르면, 제1 벤딩 라인은 제1 연결 회로부와 나란하게 형성되고, 제2 벤딩 라인은 제1 벤딩 라인과 소정의 각도로 기울어지도록 형성되며, 제2 연결 회로부는 제1 벤딩 라인 및 제2 벤딩 라인을 따라 순차로 접혀, 제1 연결 회로부와 동일선상에 배치되는 것을 특징으로 할 수 있다.According to one embodiment, the first bending line is formed in parallel with the first connection circuit portion, the second bending line is formed to be inclined at a predetermined angle with the first bending line, the second connection circuit portion and The second bending line may be sequentially folded along the second bending line, and disposed on the same line as the first connection circuit unit.
일 실시예에 따르면, 측면 플레이트의 일 측에 밀착되어 고정되고, 중심부의 단부를 덮는 보강플레이트를 더 포함하고, 상부 플레이트는 경로홈을 따라 중심부와 경로홈의 이격을 방지하는 리브가 더 형성될 수 있다.According to one embodiment, the side plate is fixed in close contact with the side, and further comprises a reinforcing plate covering the end of the central portion, the upper plate may further be formed ribs to prevent the separation of the center and the path grooves along the path grooves. have.
일 실시예에 따르면, 리브는 경로홈의 양 측에 번갈아가며 서로 이격되도록 복수 개로 제공되는 것을 특징으로 할 수 있다.According to one embodiment, the ribs may be provided in plurality so as to be spaced apart from each other alternately on both sides of the path groove.
일 실시예에 따르면, 측면 플레이트에는 중심부가 배치되는 위치에 대응하여 융착돌기가 형성되고, 중심부 및 보강플레이트에는 융착돌기의 위치에 대응하여 고정홀이 각각 형성될 수 있다.According to one embodiment, the fusion plate is formed in the side plate corresponding to the position where the center is disposed, the fixing hole may be formed in the center and the reinforcing plate corresponding to the position of the fusion projection.
일 실시예에 따르면, 경로홈에 중심부가 안착된 상태에서, 중심부의 상측을 덮는 탑 커버를 더 포함할 수 있다.According to one embodiment, in the state that the center is seated in the path groove, may further include a top cover that covers the upper side of the center.
일 실시예에 따르면, 버스바에는 일정한 깊이로 파인 안착부가 형성되고, 일측은 연성회로기판에 고정 결합되고, 타측은 버스바에 접합되는 연결 단자를 더 포함하며, 연결 단자는, 고정돌기 형성되어 제3 연결 회로부에 고정되는 고정부; 및 고정부에서 연장 형성되고, 안착부에 배치되는 연결부를 포함할 수 있다.According to one embodiment, the bus bar is formed with a recessed to a predetermined depth, one side is fixedly coupled to the flexible circuit board, the other side further comprises a connection terminal bonded to the bus bar, the connection terminal is formed with a fixing projection is formed 3 fixed part fixed to the connection circuit; And a connection part extending from the fixing part and disposed on the seating part.
일 실시예에 따르면, 고정돌기는 고정부의 양 측으로 이격되어 복수 개 형성되고, 미리 설정된 위치에서 제3 연결 회로부를 관통하여 연성회로기판과 전기적으로 연결되고, 관통되어 돌출되는 부분은 압착되어 휨 변형에 의해 고정되며, 연결부는 레이져 용접에 의해 안착부에 접합되는 것을 특징으로 할 수 있다.According to one embodiment, a plurality of fixing projections spaced apart from both sides of the fixing portion are formed, and electrically connected to the flexible circuit board through the third connection circuit portion at a predetermined position, the portion protruding through the compression is compressed and flexed It is fixed by the deformation, the connection portion may be characterized in that joined to the seating portion by laser welding.
일 실시예에 따르면, 연결부는 체결 홀이 형성되도록 링 형상으로 형성되고, 체결 홀을 관통하여 안착부에 삽입되어 연결 단자를 고정하는 체결 부재를 더 포함할 수 있다.According to an embodiment, the connection part may further include a fastening member which is formed in a ring shape to form a fastening hole and is inserted into the seating part through the fastening hole to fix the connection terminal.
일 실시예에 따르면, 제3 연결 회로부가 버스바에 연결된 상태에서, 제3 연결 회로부 및 제3 연결 회로부 주변의 버스바의 일부를 커버하도록 구성된 코팅부를 더 포함할 수 있다.According to an embodiment of the present disclosure, the third connection circuit part may further include a coating part configured to cover the third connection circuit part and a part of the bus bar around the third connection circuit part while the third connection circuit part is connected to the bus bar.
일 실시예에 따르면, 버스바에는 일정한 깊이로 파인 안착부가 형성되고3 연결 회로부의 일 면은 안착부에 접촉되는 것을 특징으로 할 수 있다.According to an embodiment, the bus bar may be provided with a recessed part having a predetermined depth, and one surface of the three connection circuit part may be in contact with the seating part.
본 개시의 또 다른 실시예에 따른 적어도 하나의 배터리 셀이 적층되어 형성되는 셀 조립체를 고정하기 위한 프레임 조립체에 있어서, 상부 플레이트, 상부 플레이트의 양 단에 연결되는 측면 플레이트를 포함하여 셀 조립체를 감싸도록 배치되는 프레임; 측면 플레이트에 배치되어 고정되는 버스바; 상부 플레이트와 측면 플레이트를 따라 배치되어 배터리 셀의 전압을 센싱하는 연성회로기판; 및 측면 플레이트의 일 측에 밀착 고정되어 연성회로기판의 단부를 덮는 보강플레이트를 포함하고, 상부 플레이트는 저면에 일정한 깊이로 파인 보호홈이 형성되며, 연성회로기판은, 외측으로 연장된 온도센싱부가 형성되고, 보호홈에 수용되는 밴드 형상의 중심부; 중심부의 양 단부에 형성되고, 서로 대향하도록 배치되는 제1 연결 회로부; 제1 연결 회로부의 양 단부에 연장되고, 중심부와 나란하게 형성되는 제2 연결 회로부; 및 제1 연결 회로부 및 제2 연결 회로부 각각으로부터 연장되어 버스바에 연결되는 제3 연결 회로부를 포함하고, 연성회로기판에는, 제2 연결 회로부가 제1 벤딩 라인을 따라 제1 연결 회로부를 향하여 접혀서 형성되는 제1 겹침부 및 제2 연결 회로부가 제2 벤딩 라인을 따라 제1 연결 회로부의 길이 방향으로 꺾어지도록 접혀서 형성되는 제2 겹침부를 포함하는 겹침부가 형성되고, 겹침부가 형성되는 경우, 제2 연결 회로부는 제1 연결 회로부와 평행하게 배치되고, 제2 연결 회로부에 형성된 제3 연결 회로부는 제1 연결 회로부에 형성된 제3 연결 회로부와 평행하게 배치될 수 있다.In a frame assembly for fixing a cell assembly is formed by stacking at least one battery cell according to another embodiment of the present disclosure, the cell assembly including a top plate, side plates connected to both ends of the top plate A frame disposed to be; A bus bar disposed on and fixed to the side plate; A flexible circuit board disposed along the upper plate and the side plate to sense a voltage of the battery cell; And a reinforcing plate that is tightly fixed to one side of the side plate and covers an end portion of the flexible circuit board, wherein the upper plate is formed with a protection groove which is dug at a predetermined depth on a bottom surface thereof, and the flexible circuit board has a temperature sensing unit extending outwardly. A central portion having a band shape formed in the protective groove; First connection circuits formed at both ends of the central portion and disposed to face each other; Second connection circuit portions extending at both ends of the first connection circuit portion and formed to be parallel to the central portion; And a third connection circuit portion extending from each of the first connection circuit portion and the second connection circuit portion and connected to the busbar, wherein the flexible circuit board is formed by folding the second connection circuit portion toward the first connection circuit portion along the first bending line. When the overlapping part is formed, an overlapping part including a second overlapping part formed by folding the first overlapping part and the second connection circuit part to be bent along the second bending line in the longitudinal direction of the first connection circuit part is formed, and the overlapping part is formed. The circuit part may be disposed in parallel with the first connection circuit part, and the third connection circuit part formed in the second connection circuit part may be disposed in parallel with the third connection circuit part formed in the first connection circuit part.
일 실시예에 따르면, 보호홈과 중심부의 사이 및 제1 연결 회로부와 제2 연결 회로부 사이에 형성되는 겹침부는 접착제에 의해 밀착 고정될 수 있다.According to one embodiment, the overlapping portion formed between the protective groove and the central portion and between the first connection circuit portion and the second connection circuit portion may be tightly fixed by an adhesive.
일 실시예에 따르면, 상부 플레이트 및 측면 플레이트 중 적어도 어느 하나에는 보호홈의 위치에 대응하여 보호홀이 형성되고, 중심부의 단부는 보호홀을 관통하고, 구부러져서 제3 연결 회로부가 버스바의 외측면에 접합될 수 있다.According to one embodiment, at least one of the upper plate and the side plate is formed with a protective hole corresponding to the position of the protective groove, the end portion of the central portion passes through the protective hole, and bent so that the third connection circuit portion is outside the bus bar. Can be bonded to the sides.
일 실시예에 따르면, 측면 플레이트에는 보호홀의 위치에 대응하여 융착돌기가 형성되고, 중심부 및 보강플레이트에는 융착돌기의 위치에 대응하여 고정홀이 각각 형성될 수 있다.According to one embodiment, the fusion plate is formed in the side plate corresponding to the position of the protective hole, the fixing hole may be formed in the center and the reinforcement plate corresponding to the position of the fusion projection.
일 실시예에 따르면, 버스바에는 제1 결합홀이 형성되고, 제3 연결 회로부에는 제1 결합홀의 위치에 대응하여 제2 결합홀이 형성되며, 제1 결합홀 및 제2 결합홀을 관통하는 결합 부재를 더 포함할 수 있다.According to one embodiment, the first coupling hole is formed in the bus bar, the second coupling hole is formed in the third connection circuit part corresponding to the position of the first coupling hole, and penetrates the first coupling hole and the second coupling hole. It may further comprise a coupling member.
일 실시예에 따르면, 버스바에는 일정한 깊이로 파인 안착홈이 형성되고, 제1 결합홀은 안착홈에 형성되며, 제1 결합홀 및 제2 결합홀은 각각 서로 이격되어 한 쌍으로 형성될 수 있다.According to one embodiment, the bus bar is formed with a recessed groove is formed to a predetermined depth, the first coupling hole is formed in the mounting groove, the first coupling hole and the second coupling hole may be formed in a pair, respectively spaced apart from each other. have.
일 실시예에 따르면, 결합 부재는 리벳인 것을 특징으로 할 수 있다.According to one embodiment, the coupling member may be characterized in that the rivet.
이상에서 살펴본 바와 같이 본 개시의 과제해결 수단에 의하면 다음과 같은 사항을 모두 포함하는 다양한 효과를 기대할 수 있다. 다만, 본 개시가 하기와 같은 효과를 모두 발휘해야 성립되는 것은 아니다.As described above, according to the problem solving means of the present disclosure, various effects including all of the following matters can be expected. However, the present disclosure is not necessarily achieved by all of the following effects.
본 개시의 따른 연성회로기판은, 제2 연결 회로부가 제1 연결 회로부의 단부에 꺾어져 연결되고 이들이 중심부와 나란하게 형성된 형상을 가지므로, 초기 재단시 제1 연결 회로부와 제2 연결 회로부가 나란하게 재단되는 비교예에 비하여 설계상의 손실되는 부분을 최소화하여, 생산 원가를 절감할 수 잇다.In the flexible circuit board according to the present disclosure, since the second connection circuit part is bent at the end of the first connection circuit part and has a shape formed parallel to the central part, the first connection circuit part and the second connection circuit part are parallel to each other during initial cutting. Compared with the comparative example, the loss of design can be minimized, thereby reducing the production cost.
또한, 제1 벤딩 라인 및 제2 벤딩 라인을 따라 제2 연결 회로부를 접어서 제2 연결 회로부와 제1 연결 회로부와 동일선상에 위치시키므로, 생산 수율을 향상시킬 수 있고, 넓게 적층된 복수 개의 배터리 셀의 전압을 각각 센싱할 수 있다.In addition, since the second connection circuit part is folded along the first bending line and the second bending line and positioned on the same line as the second connection circuit part and the first connection circuit part, the production yield can be improved, and the plurality of battery cells stacked in a wide range. The voltage of each can be sensed.
또한, 제1 겹침부 및 제2 겹침부는 양면테이프 또는 PAD에 의해 밀착 고정되어, 조립과정에서 들뜸에 의한 손상을 방지하고, 진동에 의한 연성회로기판의 패턴 크랙을 방지할 수 있다.In addition, the first overlapping part and the second overlapping part may be closely fixed to each other by a double-sided tape or a PAD, thereby preventing damage caused by lifting during assembly and preventing pattern cracking of the flexible circuit board due to vibration.
또한, 제3 연결 회로부는 연성회로기판의 내부 기판층이 노출 형성되어 다른 구성 없이도 버스바에 직접 접합 가능하여, 별도의 구성을 필요로 하지 않으므로 원가 절감의 효과를 가질 수 있다.In addition, since the inner substrate layer of the flexible printed circuit board is exposed and can be directly bonded to the busbar without any other configuration, the third connection circuit portion does not require a separate configuration, and thus may have a cost reduction effect.
제1 면의 크기는 제2 면의 크기보다 크게 형성되어, 접합을 용이하는 동시에, 기판층을 보호하는 효과를 가질 수 있다.The size of the first surface may be larger than that of the second surface, thereby facilitating bonding and at the same time protecting the substrate layer.
본 개시의 따른 배터리 모듈의 셀 조립체는 배터리 셀에 형성된 단자를 통해 전기적으로 용이하에 연결될 수 있고, 버스바에 삽입홀이 형성되고 단자부가 이를 관통하여 접혀 버스바와 전기적으로 연결될 수 있어 그 조립이 용이하게 될 수 있다.The cell assembly of the battery module according to the present disclosure can be easily connected electrically through a terminal formed in the battery cell, the insertion hole is formed in the bus bar and the terminal portion can be folded through it to be electrically connected to the bus bar to facilitate assembly. Can be done.
상부 플레이트 및 측면 플레이트 포함하여 셀 조립체를 감싸는 형상의 셀 프레임을 포함하여 배터리 셀을 1차적으로 고정하며, 배터리 셀을 보호할 수 있다.Including a top frame and a side plate, the cell frame includes a shape surrounding the cell assembly, thereby fixing the battery cell primarily and protecting the battery cell.
상부 플레이트와 측면 플레이트는 힌지 결합되고, 측면 플레이트가 일정 각도로 회동하여, 프레임의 조립이 용이하게 될 수 있다.The upper plate and the side plate are hinged, the side plate is rotated at an angle, it can be easy to assemble the frame.
상부 플레이트의 상측면에 일정한 깊이로 파인 경로홈이 형성되거나, 저면에 일정한 깊이로 파인 보호홈이 형성될 수 있으므로, 연성회로기판의 중심부를 보호하여 조립과정에서 발생할 수 있는 손상을 방지할 수 있다.Since a path groove having a predetermined depth may be formed on the upper side of the upper plate, or a protection groove may be formed at a predetermined depth on the bottom thereof, thereby protecting the center of the flexible circuit board and preventing damage that may occur during the assembly process. .
경로홈을 따라 중심부의 이격을 방지하는 리브가 형성되어 연성회로기판의 고정을 용이하게 할 수 있으며, 경로홈의 양 측에 번갈아가며 복수 개가 형성되어 조립 시 발생할 수 있는 연성회로기판의 손상을 방지할 수 있다.Ribs are formed along the path grooves to prevent separation of the center, which facilitates the fixing of the flexible circuit boards, and a plurality of alternately formed on both sides of the path grooves is formed to prevent damage to the flexible circuit boards that may occur during assembly. Can be.
경로홈에 연성회로기판이 안착된 상태에서, 연성회로기판의 상측을 덮는 탑커버을 더 설치하여 조립시 발생할 수 있는 연성회로기판의 손상을 최소화할 수 있다.In a state where the flexible circuit board is seated in the path groove, the top cover covering the upper side of the flexible circuit board may be further installed to minimize damage to the flexible circuit board which may occur during assembly.
중심부는 보호홈에 양면테이프에 의해 용이하게 고정될 수 있으며, 보호홈이 형성된 위치에 대응하여 보호홀이 형성되어 연성회로기판이 구부러지는 부분을 최소화하여 조립 과정 또는 차량에 운행 과정에서 발생하는 외력에 의한 연성회로기판의 손상을 방지할 수 있다.The central part can be easily fixed to the protective groove by double-sided tape, and the protective hole is formed corresponding to the position where the protective groove is formed, thereby minimizing the bending portion of the flexible circuit board. Damage to the flexible circuit board can be prevented.
또한 측면 플레이트의 일측에 밀착 고정되고, 중심부의 단부를 덮는 보강플레이트를 포함하여, 연성회로기판의 조립과정에서 발생할 수 있는 손상의 가능성을 보다 확실하게 차단할 수 있다.In addition, including a reinforcing plate that is tightly fixed to one side of the side plate, covering the end of the center, it is possible to more reliably block the possibility of damage that may occur in the assembly process of the flexible circuit board.
보강플레이트는 중심부의 단부를 덮어 열 융착과정에서 연성회로기판에 발생할 수 있는 손상을 방지할 수 있다.The reinforcing plate covers the end of the center portion to prevent damage that may occur to the flexible circuit board during the thermal fusion process.
버스바에는 안착부가 일정한 깊이로 파이도록 형성되어 접합 부분을 명확히 하여 작업성이 향상되고 정확한 위치에 접합되어 접합 품질을 향상시킬 수 있다.The busbars are formed so that the seating part can be dug to a certain depth to clarify the joint, improving workability and joining in the correct position to improve the joint quality.
일체형 단자를 통해 연성회로기판과 버스바를 전기적으로 연결 가능하여, 작업 공수를 절감하고, 생산 비용을 절감할 수 있다.Integral terminals allow the flexible circuit board and busbars to be electrically connected, reducing labor and production costs.
링 형상의 일체형 단자를 사용하여 체결 부재(예를 들어, 나사)에 의해 버스바에 연결할 수 있으므로, 레이져 웰딩과 같은 작업 공수를 절감하여 생산성을 향상시킬 수 있다.Since ring-shaped integrated terminals can be used to connect to the busbars by fastening members (eg, screws), productivity can be improved by reducing the number of operations such as laser welding.
기판층을 직접 버스바에 접합하는 경우, 제3 연결 회로부와 버스바의 일부를 덮는 코팅부를 더 형성하여 기판층과 접스바 사이의 접합력을 높이고, 기판층을 보호할 수 있다.When the substrate layer is directly bonded to the busbar, a coating portion covering the third connection circuit portion and a part of the busbar may be further formed to increase the bonding force between the substrate layer and the sidebar and protect the substrate layer.
결합 부재는 전기 전도성을 갖는 금속 재질로 형성되어 버스바와 연성회로기판을 전기적으로 연결할 수 있어 용접에 따른 뒤틀림이나 용접 부위의 균열 현상 등을 근본적으로 방지할 수 있다.The coupling member may be formed of a metal material having electrical conductivity to electrically connect the bus bar and the flexible circuit board, thereby fundamentally preventing warpage or cracking of the welded portion due to welding.
도 1은 본 개시의 다양한 실시예들과 비교하기 위한 비교예를 설명하기 위한 도면이다.1 is a view for explaining a comparative example for comparison with various embodiments of the present disclosure.
도 2는 본 개시의 일 실시예에 따른 연성회로기판의 평면도이다.2 is a plan view of a flexible printed circuit board according to an exemplary embodiment of the present disclosure.
도 3은 도 2에 도시된 연성회로기판의 접는 방법을 도시한 도면이다.3 is a view illustrating a folding method of the flexible printed circuit board shown in FIG. 2.
도 4는 도 2에 도시된 연성회로기판의 일 측의 연결부의 최종 형상을 도시한 사시도이다.FIG. 4 is a perspective view illustrating a final shape of a connection unit on one side of the flexible circuit board illustrated in FIG. 2.
도 5는 도 4에 도시된 겹침부를 확대 도시한 사시도이다.FIG. 5 is an enlarged perspective view of the overlapping part illustrated in FIG. 4.
도 6은 도 5에 도시된 제1 겹침부 및 제2 겹침부가 접착제에 의해 고정되는 방법을 도시한 사시도이다.FIG. 6 is a perspective view illustrating a method in which the first overlapping part and the second overlapping part shown in FIG. 5 are fixed by an adhesive.
도 7은 도 4에 도시된 제3 연결 회로부의 기판층이 노출된 상태를 도시한 사시도이다.FIG. 7 is a perspective view illustrating an exposed state of the substrate layer of the third connection circuit unit illustrated in FIG. 4.
도 8은 도 7에 도시된 제1 면 및 제2 면을 도시한 평면도이다.FIG. 8 is a plan view illustrating the first and second surfaces illustrated in FIG. 7.
도 9는 도 8에 도시된 제3 연결 회로부의 단면을 도시한 단면도이다.FIG. 9 is a cross-sectional view illustrating a cross section of the third connection circuit unit illustrated in FIG. 8.
도 10은 본 개시의 제1 실시예에 따른 배터리 모듈의 사시도이다.10 is a perspective view of a battery module according to a first embodiment of the present disclosure.
도 11은 도 10에 도시된 배터리 모듈의 분해 사시도이다.FIG. 11 is an exploded perspective view of the battery module shown in FIG. 10.
도 12는 도 10에 도시된 배터리 모듈의 셀 조립체의 사시도이다.12 is a perspective view of a cell assembly of the battery module shown in FIG. 10.
도 13은 도 10에 도시된 배터리 모듈의 프레임 조립체의 사시도이다.FIG. 13 is a perspective view of a frame assembly of the battery module shown in FIG. 10.
도 14은 도 13에 도시된 프레임의 상부 플레이트와 측면 플레이트의 힌지 결합을 도시한 사시도이다.FIG. 14 is a perspective view illustrating a hinge coupling between the upper plate and the side plate of the frame shown in FIG. 13.
도 15는 도 10에 도시된 배터리 모듈의 프레임과 연성회로기판의 배치를 도시한 측면도이다.FIG. 15 is a side view illustrating an arrangement of a frame and a flexible circuit board of the battery module illustrated in FIG. 10.
도 16은 도 13에 도시된 프레임 조립체의 상부 플레이트 및 연성회로기판의 결합된 구성을 도시한 사시도이다.FIG. 16 is a perspective view illustrating a combined configuration of the upper plate and the flexible circuit board of the frame assembly shown in FIG. 13.
도 17은 도 16에 도시된 상부 플레이트 및 연성회로기판의 분해된 구성을 도시한 분해 사시도이다.FIG. 17 is an exploded perspective view illustrating an exploded configuration of the upper plate and the flexible circuit board illustrated in FIG. 16.
도 18은 도 17에 도시된 상부 플레이트의 경로홈에 연성회로기판이 안착된 상태를 도시한 평면도이다.FIG. 18 is a plan view illustrating a flexible circuit board seated in a path groove of the upper plate illustrated in FIG. 17.
도 19는 도 10에 도시된 배터리 모듈의 측면 플레이트의 정면도이다.19 is a front view of the side plate of the battery module shown in FIG. 10.
도 20은 도 19에 도시된 보강 플레이트를 확대 도시한 사시도이다.20 is an enlarged perspective view of the reinforcing plate illustrated in FIG. 19.
도 21는 도 20에 표시된 A-A방향 단면 사시도 및 단면도이다.FIG. 21 is a sectional perspective and sectional view taken along the line A-A shown in FIG.
도 22는 도 20에 도시된 보강 플레이트의 고정방법을 도시한 도면이다.22 is a view showing a fixing method of the reinforcing plate shown in FIG.
도 23은 도 19에 도시된 버스바의 안착부를 확대 도시한 사시도이다.FIG. 23 is an enlarged perspective view illustrating a seating part of the bus bar illustrated in FIG. 19.
도 24는 도 23에 도시된 안착부에 기판층이 직접 접합된 상태를 도시한 정면도이다.FIG. 24 is a front view illustrating a state in which the substrate layer is directly bonded to the seating portion shown in FIG. 23.
도 25는 도 24에 도시된 기판층을 버스바에 접합하기 위한 접합방법을 도시한 단면도이다.25 is a cross-sectional view illustrating a bonding method for bonding the substrate layer shown in FIG. 24 to a busbar.
도 26은 도 24에 도시된 제3 연결 회로부에 코팅부가 더 형성된 상태를 도시한 평면도이다.FIG. 26 is a plan view illustrating a state in which a coating unit is further formed in the third connection circuit unit illustrated in FIG. 24.
도 27은 도 26에 도시된 코팅층의 단면도이다.FIG. 27 is a cross-sectional view of the coating layer shown in FIG. 26.
도 28은 도 23에 도시된 안착부에 일 실시예에 따른 일체형 연결 단자의 연결부가 접합된 상태를 도시한 정면도이다.FIG. 28 is a front view illustrating a state in which a connection portion of the integrated connection terminal according to an embodiment is bonded to the seating portion illustrated in FIG. 23.
도 29는 도 28에 도시된 일 실시예에 따른 일체형 연결 단자의 사시도이다.FIG. 29 is a perspective view of the integrated connection terminal according to the embodiment shown in FIG. 28.
도 30은 도 23에 도시된 안착부에 일체형 연결 단자와 다른 실시예인 링 형상의 연결 단자의 연결부가 접합된 상태를 도시한 정면도이다.FIG. 30 is a front view illustrating a state in which the integrated portion of the connecting portion of the ring portion and the connecting portion of the ring-shaped connecting terminal, which is another embodiment, is joined to the seating portion illustrated in FIG.
도 31은 도 30에 도시된 링 형상의 연결 단자 및 체결 부재의 사시도이다.FIG. 31 is a perspective view of the ring-shaped connecting terminal and the fastening member shown in FIG. 30.
도 32는 도 28 및 도 30에 도시된 고정부가 제3 연결 회로부에 고정되는 방법을 도시한 사시도이다.32 is a perspective view illustrating a method in which the fixing part illustrated in FIGS. 28 and 30 is fixed to the third connection circuit part.
도 33은 도 23에 도시된 안착부에 결합 부재가 결합된 상태를 도시한 사시도이다.FIG. 33 is a perspective view illustrating a state in which a coupling member is coupled to a seating unit illustrated in FIG. 23.
도 34는 도 33에 도시된 안착부에 결합 부재를 결합하기 위한 결합방법을 도시한 사시도이다.34 is a perspective view illustrating a coupling method for coupling the coupling member to the seating portion illustrated in FIG. 33.
도 35는 도 33에 표시된 B-B 방향 단면도이다.FIG. 35 is a cross-sectional view along the B-B direction shown in FIG. 33.
도 36은 본 개시의 제2 실시예에 따른 배터리 모듈의 사시도이다.36 is a perspective view of a battery module according to a second embodiment of the present disclosure.
도 37은 도 36에 도시된 프레임과 연성회로기판의 분해된 구성을 도시한 측면도이다.FIG. 37 is an exploded side view illustrating an exploded configuration of the frame and the flexible circuit board illustrated in FIG. 36.
도 38은 도 36에 도시된 프레임의 하측 방향에서의 사시도이다.FIG. 38 is a perspective view in a lower direction of the frame shown in FIG. 36.
도 39는 도 38에 도시된 상부 플레이트와 연성회로기판의 분해도이다.FIG. 39 is an exploded view of the upper plate and the flexible printed circuit board shown in FIG. 38.
도 40은 도 39에 도시된 보호홀을 확대 도시한 사시도이다.40 is an enlarged perspective view of the protection hole illustrated in FIG. 39.
도 41은 셀 조립체에 프레임 조립체가 조립되는 방향을 도시한 사시도이다.41 is a perspective view illustrating a direction in which the frame assembly is assembled to the cell assembly.
도 42는 셀 조립체와 프레임 조립체가 조립된 후 삽입홀에 단자부가 삽입된 상태를 도시한 사시도이다.FIG. 42 is a perspective view illustrating a state in which a terminal unit is inserted into an insertion hole after the cell assembly and the frame assembly are assembled.
도 43은 삽입홀에 단자부가 삽입된 후 접혀 버스바에 연결된 상태를 도시한 사시도이다.43 is a perspective view illustrating a state in which a terminal unit is inserted into an insertion hole and then folded and connected to a bus bar.
도 44는 도 43에 도시된 단자부를 확대 도시한 사시도이다.44 is an enlarged perspective view of the terminal unit illustrated in FIG. 43.
도 45는 배터리 모듈과 모노프레임의 조립 방법을 도시한 사시도이다.45 is a perspective view illustrating a method of assembling a battery module and a monoframe.
본 개시의 실시예들은 본 개시의 기술적 사상을 설명하기 위한 목적으로 예시된 것이다. 본 개시에 따른 권리범위가 이하에 제시되는 실시예들이나 이들 실시예들에 대한 구체적 설명으로 한정되는 것은 아니다.Embodiments of the present disclosure are illustrated for the purpose of describing the technical spirit of the present disclosure. The scope of the present disclosure is not limited to the embodiments set forth below or the detailed description of these embodiments.
본 개시에 사용되는 모든 기술적 용어들 및 과학적 용어들은, 달리 정의되지 않는 한, 본 개시가 속하는 기술 분야에서 통상의 지식을 가진 자에게 일반적으로 이해되는 의미를 갖는다. 본 개시에 사용되는 모든 용어들은 본 개시를 더욱 명확히 설명하기 위한 목적으로 선택된 것이며 본 개시에 따른 권리범위를 제한하기 위해 선택된 것이 아니다.All technical and scientific terms used in the present disclosure, unless defined otherwise, have the meanings that are commonly understood by one of ordinary skill in the art to which this disclosure belongs. All terms used in the present disclosure are selected for the purpose of more clearly describing the present disclosure, and are not selected to limit the scope of the rights according to the present disclosure.
본 개시에서 사용되는 "포함하는", "구비하는", "갖는" 등과 같은 표현은, 해당 표현이 포함되는 어구 또는 문장에서 달리 언급되지 않는 한, 다른 실시예를 포함할 가능성을 내포하는 개방형 용어(open-ended terms)로 이해되어야 한다.As used in this disclosure, expressions such as "comprising", "including", "having", and the like, are open terms that imply the possibility of including other embodiments unless otherwise stated in the phrase or sentence in which the expression is included. It should be understood as (open-ended terms).
본 개시에서 기술된 단수형의 표현은 달리 언급하지 않는 한 복수형의 의미를 포함할 수 있으며, 이는 청구범위에 기재된 단수형의 표현에도 마찬가지로 적용된다.As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
본 개시에서 사용되는 "제1", "제2" 등의 표현들은 복수의 구성요소들을 상호 구분하기 위해 사용되며, 해당 구성요소들의 순서 또는 중요도를 한정하는 것은 아니다.Expressions such as “first”, “second”, and the like used in the present disclosure are used to distinguish a plurality of components from each other, and do not limit the order or importance of the components.
본 개시에서, 어떤 구성요소가 다른 구성요소에 "연결되어" 있다거나 "접속되어" 있다고 언급된 경우, 상기 어떤 구성요소가 상기 다른 구성요소에 직접적으로 연결될 수 있거나 접속될 수 있는 것으로, 또는 새로운 다른 구성요소를 매개로 하여 연결될 수 있거나 접속될 수 있는 것으로 이해되어야 한다.In the present disclosure, when a component is referred to as being "connected" or "connected" to another component, the component may be directly connected to or connected to the other component, or new It is to be understood that the connection may be made or may be connected via other components.
이하, 첨부한 도면들을 참조하여, 본 개시의 실시예들을 설명한다. 첨부된 도면에서, 동일하거나 대응하는 구성요소에는 동일한 참조부호가 부여되어 있다. 또한, 이하의 실시예들의 설명에 있어서, 동일하거나 대응하는 구성요소를 중복하여 기술하는 것이 생략될 수 있다. 그러나, 구성요소에 관한 기술이 생략되어도, 그러한 구성요소가 어떤 실시예에 포함되지 않는 것으로 의도되지는 않는다.Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the accompanying drawings, the same or corresponding components are given the same reference numerals. In addition, in the following description of the embodiments, it may be omitted to duplicate the same or corresponding components. However, even if the description of the component is omitted, it is not intended that such component is not included in any embodiment.
도 1은 본 개시의 다양한 실시예들과 비교하기 위한 비교예를 설명하기 위한 도면이다.1 is a view for explaining a comparative example for comparison with various embodiments of the present disclosure.
최근 보다 높은 고출력의 대용량 배터리가 요구되면서 적층되는 배터리 셀의 개수가 증가되고 있다. 이 과정에서, 비교예의 연성회로기판(1000)은 배터리 셀의 센싱부가 넓게 형성되는 형태로 재단되어 사용된다. 예를 들어, 도 1에 도시된 바와 같이, 밴드 형상의 중심부(1110), 중심부(1110)의 양 단부에 형성되어 서로 대향하도록 배치되는 연결부(1120) 및 연결부에서 돌출되어 버스바에 제3 연결 회로부(1150)를 갖는 형상으로 재단된다.Recently, as a higher capacity large capacity battery is required, the number of stacked battery cells is increasing. In this process, the flexible printed circuit board 1000 of the comparative example is cut and used to form the sensing unit of the battery cell wide. For example, as illustrated in FIG. 1, a band-shaped central portion 1110, connection portions 1120 formed at both ends of the central portion 1110 and disposed to face each other, and protruding from the connection portion, are connected to the bus bar by a third connection circuit portion. 1150 is cut into shapes.
상술한 비교예에서, 중심부(1110)의 양 측에 형성되는 손실 부분(a)이 증가하여, 연성회로기판(1000)의 생산 수율이 다소 감소하는 문제점이 발생할 수 있다. 또한 연성회로기판(1000)을 프레임에 조립하는 과정에서 연성회로기판이 외력 등에 의해 파손되거나 찢어져, 연성회로기판에 실장된 전기소자가 파손되는 등의 문제점이 발생할 수 있다. 이에 따라, 배터리 모듈에 가해지는 심한 진동이나 충격에 의해 연성회로기판의 측면 플레이트로 구부러지는 부분에 크랙이 발생되는 문제점이 발생할 수 있다.In the above-described comparative example, the loss portion (a) formed on both sides of the center portion 1110 is increased, there may be a problem that the production yield of the flexible circuit board 1000 is somewhat reduced. In addition, in the process of assembling the flexible circuit board 1000 to the frame, the flexible circuit board may be damaged or torn due to an external force, etc., and thus, an electric element mounted on the flexible circuit board may be damaged. Accordingly, a problem may occur in which a crack is generated in a portion bent to the side plate of the flexible circuit board by a severe vibration or shock applied to the battery module.
도 2는 본 개시의 일 실시예에 따른 연성회로기판(100)의 평면도이고, 도 3은 도 2에 도시된 연성회로기판(100)의 접는 방법을 도시한 도면이며, 도 4는 도 2에 도시된 연성회로기판(100)의 일 측의 연결부의 최종 형상을 도시한 사시도이다. 도 5는 도 4에 도시된 겹침부(140)를 확대 도시한 사시도이고, 도 6은 도 5에 도시된 제1 겹침부(141) 및 제2 겹침부(142)가 접착제(200)에 의해 고정되는 방법을 도시한 사시도이다.2 is a plan view of a flexible printed circuit board 100 according to an embodiment of the present disclosure, FIG. 3 is a view illustrating a folding method of the flexible printed circuit board 100 shown in FIG. 2, and FIG. 4 is illustrated in FIG. 2. 4 is a perspective view illustrating a final shape of a connection part of one side of the flexible printed circuit board 100 shown in FIG. FIG. 5 is an enlarged perspective view of the overlapping part 140 illustrated in FIG. 4, and FIG. 6 is a diagram illustrating a first overlapping part 141 and a second overlapping part 142 shown in FIG. 5 by an adhesive 200. It is a perspective view showing the fixing method.
도 2 내지 도 6을 참조하면, 버스바가 결합된 프레임에 설치되어 배터리 셀의 전압을 센싱하도록 구성된 연성회로기판(100)은 밴드 형상의 중심부(110), 상기 중심부(110)의 양 단부에 형성되고, 서로 대향 배치되는 제1 연결 회로부(120), 상기 제1 연결 회로부(120)에 꺾어져 연장되고 상기 중심부(110)와 나란하게 형성되는 제2 연결 회로부(130)를 포함할 수 있다. 제3 연결 회로부(150)는 제1 연결 회로부(120) 및 제2 연결 회로부(130) 각각으로부터 연장되어 버스바에 연결되도록 형성될 수 있다. 2 to 6, a flexible circuit board 100 installed in a frame to which a bus bar is coupled and configured to sense a voltage of a battery cell is formed at a central portion 110 having a band shape and at both ends of the central portion 110. And a first connection circuit part 120 facing each other and a second connection circuit part 130 which is bent and extended to the first connection circuit part 120 and formed in parallel with the central part 110. The third connection circuit unit 150 may be formed to extend from each of the first connection circuit unit 120 and the second connection circuit unit 130 to be connected to the bus bar.
제2 연결 회로부(130)가 상기 제1 연결 회로부(120)의 일측으로 접히는 경우, 제1 연결 회로부(120)와 상기 제2 연결 회로부(130)의 사이에 겹침부(140)가 형성될 수 있다. 겹침부(140)가 형성되는 경우, 제2 연결 회로부(130)는 제1 연결 회로부(120)와 동일선상에 배치될 수 있다.When the second connection circuit part 130 is folded to one side of the first connection circuit part 120, the overlapping part 140 may be formed between the first connection circuit part 120 and the second connection circuit part 130. have. When the overlapping part 140 is formed, the second connection circuit part 130 may be disposed on the same line as the first connection circuit part 120.
도 9를 참고하면, 연성회로기판(100)의 단면 방향으로의 중심에는 기판층(101)이 형성되고, 기판층(101)의 상하로 절연층(102)이 각각 적층되어 형성될 수 있다. 기판층(101)은 전기적은 신호로 정보를 전달하는 회로로 구성될 수 있고, 절연층(102)은 기판층(101)을 보호하고 다른 도전성 구성과의 쇼트현상을 방지할 수 있다.Referring to FIG. 9, the substrate layer 101 may be formed at the center of the flexible circuit board 100 in the cross-sectional direction, and the insulating layers 102 may be stacked above and below the substrate layer 101, respectively. The substrate layer 101 may be composed of a circuit that transmits information as an electrical signal, and the insulating layer 102 may protect the substrate layer 101 and prevent short circuit with other conductive structures.
도 9를 참고하면, 기판층(101)은 전기 전도성이 있는 금속층으로 형성되며, 전기 전도성이 높은 동판(copper plate)로 형성될 수 있다. 절연층(102)은 필름(PEN, P1)형태의 전기 전도성이 없는 물질로 형성될 수 있다. 또한 기판층(101) 및 절연층(102) 각각은 플렉서블한 특성을 가지므로 용이하게 변형될 수 있다.Referring to FIG. 9, the substrate layer 101 may be formed of a metal layer having electrical conductivity, and may be formed of a copper plate having a high electrical conductivity. The insulating layer 102 may be formed of a material having no electrical conductivity in the form of films PEN and P1. In addition, since the substrate layer 101 and the insulating layer 102 each have a flexible characteristic, they can be easily deformed.
다시 도 2를 참고하면, 연성회로기판(100)은 중심부(110), 제1 연결 회로부(120) 및 제2 연결 회로부(130)를 포함하고, 제1 연결 회로부(120)와 상기 제2 연결 회로부(130) 사이에 겹침부(140)가 형성될 수 있다. 중심부, 제1 연결 회로부(120), 제2 연결 회로부(130) 및 겹침부(140)는 연성회로기판(100)의 부분에 해당할 수 있고, 이들은 중심부(110)와 함께 하나의 연성회로기판으로 일체로 형성될 수 있다.Referring back to FIG. 2, the flexible circuit board 100 includes a central portion 110, a first connection circuit part 120, and a second connection circuit part 130, and a first connection circuit part 120 and the second connection part. The overlapping part 140 may be formed between the circuit parts 130. The center portion, the first connection circuit portion 120, the second connection circuit portion 130, and the overlapping portion 140 may correspond to portions of the flexible circuit board 100, which are together with the central portion 110, one flexible circuit board. It can be formed integrally with.
중심부(110)의 단부에는 제1 고정홀(115)이 형성될 수 있다. 또한, 중심부(110) 및 제2 연결 회로부(130)로부터 돌출 연장된 부분에 돌출홀(112)이 더 형성될 수 있다.The first fixing hole 115 may be formed at an end portion of the central portion 110. In addition, the protrusion hole 112 may be further formed in a portion protruding from the central portion 110 and the second connection circuit portion 130.
중심부(110)는 밴드 형상으로 길게 형성될 수 있다. 온도센싱부(111)는 중심부(110)로부터 외측으로 연장되어 형성될 수 있다. 온도센싱부(111)는 일 측으로 복수 개가 연장되어 형성되도록 제공될 수 있다. 온도센싱부(111)는 배터리 셀의 온도를 측정하여 연성회로기판(100)을 통해 전기적 정보로 외부 장치에 전달하여 과발열 등의 현상을 검출하도록 구성될 수 있다.The central portion 110 may be formed long in a band shape. The temperature sensing unit 111 may be formed to extend outward from the central portion 110. The temperature sensing unit 111 may be provided to extend in a plurality of sides. The temperature sensing unit 111 may be configured to detect a phenomenon such as overheating by measuring the temperature of the battery cell and transferring it to the external device as electrical information through the flexible circuit board 100.
제1 연결 회로부(120)와 제2 연결 회로부(130)는 중심부(110)의 양 단부에 각각 동일하게 형성되어 적용할 수 있다. 이하에서는, 중심부(110)의 일 측에 형성되는 부분을 기초로 본 개시의 다양한 실시예에 대하여 설명한다.The first connection circuit unit 120 and the second connection circuit unit 130 may be identically formed at both ends of the central portion 110 and applied. Hereinafter, various embodiments of the present disclosure will be described based on portions formed on one side of the central portion 110.
제1 연결 회로부(120)는 중심부(110)의 양 단부에 각각 형성된다. 제1 연결 회로부(120)는 중심부(110)의 하나의 단부의 양 측으로 연장 형성되고, 중심부(110)에 대해 수직한 형상을 가질 수 있다. 또한, 제1 연결 회로부(120)는 중심부(110)를 가운데 두고 서로 대향 배치될 수 있다.The first connection circuits 120 are formed at both ends of the central portion 110, respectively. The first connection circuit part 120 may extend to both sides of one end of the central portion 110 and may have a shape perpendicular to the central portion 110. In addition, the first connection circuit part 120 may be disposed to face each other with the center part 110 in the center.
제2 연결 회로부(130)는 제1 연결 회로부(120)로부터 꺾어져 연장되어 형성될 수 있다. 중심부(110)가 형성된 방향으로 수직으로 꺾어져 중심부(110)와 나란하게 형성된다. 제2 연결 회로부(130)는 제1 연결 회로부(120)의 단부에 각각 형성될 수 있다. 예를 들어, 하나의 연성회로기판(100)에 총 4개의 제2 연결 회로부(130)가 형성될 수 있다.The second connection circuit unit 130 may be formed to be bent from the first connection circuit unit 120. The central portion 110 is bent vertically in the direction in which the central portion 110 is formed to be formed parallel to the central portion 110. The second connection circuit unit 130 may be formed at each end of the first connection circuit unit 120. For example, a total of four second connection circuit parts 130 may be formed in one flexible circuit board 100.
겹침부(140)는 제1 연결 회로부(120) 및 제2 연결 회로부(130)의 사이에 형성될 수 있다. 겹침부(140)는 제2 연결 회로부(130)가 제1 연결 회로부(120)의 일 측으로 접혀 제2 연결 회로부(130)가 복수의 층으로 겹쳐지는 부분으로 정의될 수 있다.The overlapping part 140 may be formed between the first connection circuit part 120 and the second connection circuit part 130. The overlapping part 140 may be defined as a part in which the second connection circuit part 130 is folded to one side of the first connection circuit part 120 so that the second connection circuit part 130 overlaps with a plurality of layers.
겹침부(140)는 제2 연결 회로부(130)가 제1 벤딩 라인(131)을 따라 제1 연결 회로부(120)를 향하여 상측으로 접혀 형성되는 제1 겹침부(141) 및 제2 연결 회로부(130)가 다시 제2 벤딩 라인(132)을 따라 제1 겹침부(141)의 제1 연결 회로부(120)의 길이 방향으로 상측으로 꺾어져 접혀 형성되는 제2 겹침부(142)를 포함할 수 있다. 즉, 겹침부(140)는 제2 연결 회로부(130)가 제1 벤딩 라인(131) 및 제2 벤딩 라인(132)을 따라 접혀 형성되는 것으로 제2 연결 회로부(130)의 일부에 해당된다.The overlapping part 140 includes a first overlapping part 141 and a second connection circuit part in which the second connection circuit part 130 is folded upward toward the first connection circuit part 120 along the first bending line 131. 130 may further include a second overlapping part 142 that is folded upwardly in the length direction of the first connection circuit part 120 of the first overlapping part 141 along the second bending line 132. have. That is, the overlapping part 140 is formed by folding the second connection circuit part 130 along the first bending line 131 and the second bending line 132 and corresponds to a part of the second connection circuit part 130.
겹침부(140)가 형성되는 경우, 제2 연결 회로부(130)는 제1 연결 회로부(120)와 평행하게 배치될 수 있다. 또한, 제2 연결 회로부(130)에 형성된 제3 연결 회로부(150)는 제1 연결 회로부(120)에 형성된 제3 연결 회로부(150)와 평행하게 배치될 수 있다. 본 개시의 다양한 실시예에서, 두 구성이 평행하게 배치되는 경우, 두 구성이 완전히 평행하여 연장선이 만나지 않는 경우뿐만 아니라, 소정의 각도로 기울어져서 실질적으로 평행을 이루는 경우를 포함한다.When the overlapping part 140 is formed, the second connection circuit part 130 may be disposed in parallel with the first connection circuit part 120. In addition, the third connection circuit unit 150 formed in the second connection circuit unit 130 may be disposed in parallel with the third connection circuit unit 150 formed in the first connection circuit unit 120. In various embodiments of the present disclosure, when the two configurations are arranged in parallel, the two configurations are completely parallel so that the extension lines do not meet, as well as the case where the components are inclined at a predetermined angle to be substantially parallel.
일 실시예에 따른 연성회로기판(100)에서, 제1 벤딩 라인(131)은 제1 연결 회로부(120)의 길이 방향과 나란하게 형성될 수 있다. 제2 벤딩 라인(132)은 제1 벤딩 라인(131)과 약 45도 정도의 각도록, 사선 방향으로 형성될 수 있다.In the flexible circuit board 100 according to an exemplary embodiment, the first bending line 131 may be formed to be parallel to the longitudinal direction of the first connection circuit unit 120. The second bending line 132 may be formed in an oblique direction to an angle of about 45 degrees with the first bending line 131.
도 3을 참고하여, 제2 연결부(130)의 폴딩 방법에 대하여 설명한다. 제2 연결 회로부(130)는 중심부(110)와 나란히 형성된 상태에서(제1 상태), 제1 벤딩 라인(131)을 따라 제2 연결 회로부(130)의 상측으로 접혀 중심부(110)의 반대측으로 중심부(110)와 나란하게 형성된 상태가 되고(제2 상태), 제1 겹침부(141)가 제1 연결 회로부(120)와 제2 연결 회로부(130) 사이에 형성된다. 다음으로, 제2 연결 회로부(130)는 제2 벤딩 라인(132)을 따라 제1 겹침부(141)의 상측으로 꺾어져 제1 연결 회로부(120)와 동일선상에 배치되는 상태가 되고(제3 상태), 제1 겹침부(141)와 제2 연결 회로부(130) 사이에는 제2 겹침부(142)가 형성될 수 있다.Referring to FIG. 3, the folding method of the second connector 130 will be described. The second connection circuit part 130 is formed in parallel with the center part 110 (first state), and is folded along the first bending line 131 to the upper side of the second connection circuit part 130 to the opposite side of the center part 110. A state formed in parallel with the central portion 110 (second state), and the first overlapping portion 141 is formed between the first connection circuit portion 120 and the second connection circuit portion 130. Next, the second connection circuit unit 130 is bent along the second bending line 132 to the upper side of the first overlapping unit 141 and is in a state of being arranged on the same line as the first connection circuit unit 120 (first 3), a second overlapping part 142 may be formed between the first overlapping part 141 and the second connection circuit part 130.
하나의 제2 연결 회로부(130)를 기준으로 겹침부(140)와 벤딩 라인(131, 132)은 반드시 2개로 형성되는 것은 아니며, 연성회로기판(100)의 재단 형상 및 최종 형상에 따라 다른 개수로 형성될 수 있다.The overlapping part 140 and the bending lines 131 and 132 are not necessarily formed in two, based on one second connection circuit part 130, and may vary according to the cutting shape and the final shape of the flexible circuit board 100. It can be formed as.
제1 겹침부(141)와 제2 겹침부(142)를 구성하는 제2 연결부의 부분들 사이는 접착제(200)에 의해 밀착 고정될 수 있다. 접착제(200)는 상측 및 하측에 동시에 고정력을 제공도록 구성될 수 있다. 접착제(200)는 예를 들어, 양면테이프 또는 양면 패드를 사용할 수 있다. 접착제(200)를 사용하면 연성회로기판(100)의 겹침에 따른 두께 증대를 최소화하고, 들뜸을 방지하여 조립과정 또는 차량 운행에 따른 진동 등에 의한 손상을 방지할 수 있다.The portions of the second connecting portions constituting the first overlapping portion 141 and the second overlapping portion 142 may be tightly fixed by the adhesive 200. The adhesive 200 may be configured to provide a fastening force on the upper side and the lower side at the same time. The adhesive 200 may use, for example, double-sided tape or double-sided pad. When the adhesive 200 is used, the increase in thickness due to the overlap of the flexible circuit board 100 may be minimized and the lifting may be prevented to prevent damage due to vibration due to the assembling process or driving of the vehicle.
상술한 실시예에 따르면, 연성회로기판(100)은, 벤딩 작업이 진행되기 전의 재단된 형상과 다른, 폴딩 작업이 진행된 후의 최종 형상을 가질 수 있다. 이에 따라, 연성회로기판(100)의 생산과정에서의 수율을 향샹시킬 수 있고, 넓은 폭을 차지하도록 적층된 복수 개의 배터리 셀의 전압을 각각 센싱할 수 있도록 구성될 수 있다.According to the above-described embodiment, the flexible circuit board 100 may have a final shape after the folding operation is different from the cut shape before the bending operation. Accordingly, the yield in the production process of the flexible printed circuit board 100 may be improved, and the voltages of the plurality of battery cells stacked to occupy a wide width may be sensed.
도 7은 도 4에 도시된 제3 연결 회로부(150)의 기판층이 노출된 상태를 도시한 사시도이고, 도 8은 도 7에 도시된 제1 면(151) 및 제2 면(152)을 도시한 평면도이며, 도 9는 도 8 에 도시된 제3 연결 회로부(150)의 단면을 도시한 단면도이다.FIG. 7 is a perspective view illustrating an exposed state of the substrate layer of the third connection circuit unit 150 illustrated in FIG. 4, and FIG. 8 illustrates the first surface 151 and the second surface 152 illustrated in FIG. 7. 9 is a cross-sectional view illustrating a cross section of the third connection circuit unit 150 illustrated in FIG. 8.
제3 연결 회로부(150)는, 제1 연결 회로부(120) 및 제2 연결 회로부(130) 각각으로부터 분기되도록, 제1 연결 회로부(120) 및 제2 연결 회로부(130)로부터 연장되어 형성되고, 일 측이 버스바에 접합될 수 있다. 일 실시예에 따른 연성회로기판(100)에서, 제1 연결 회로부(120)에는 복수 개의 제3 연결 회로부(150)가 동일한 방향으로 연장되어 형성될 수 있다. 또한, 하나의 제3 연결 회로부(150)는 제2 연결 회로부(130)의 단부에 연장되어 형성될 수 있다.The third connection circuit part 150 is formed to extend from the first connection circuit part 120 and the second connection circuit part 130 so as to branch from each of the first connection circuit part 120 and the second connection circuit part 130. One side may be bonded to the busbar. In the flexible circuit board 100 according to an embodiment, the plurality of third connection circuit parts 150 may extend in the same direction in the first connection circuit part 120. In addition, one third connection circuit unit 150 may be formed to extend to an end of the second connection circuit unit 130.
제3 연결 회로부(150)는 제2 연결 회로부(130)가 제1 연결 회로부(120)와 동일선상에 배치되는 상태(즉, 제3 상태)일 때, 제2 연결 회로부(130)에 형성된 제3 연결 회로부(150)가 제1 연결 회로부(120)에 형성된 제3 연결 회로부(150)와 동일 방향으로 돌출된 형태를 가지도록, 동일한 방향으로 나란히 배치될 수 있다.The third connection circuit part 150 is formed of the second connection circuit part 130 when the second connection circuit part 130 is in a state of being arranged on the same line as the first connection circuit part 120 (that is, a third state). The third connection circuit unit 150 may be arranged side by side in the same direction such that the third connection circuit unit 150 protrudes in the same direction as the third connection circuit unit 150 formed in the first connection circuit unit 120.
제3 연결 회로부(150)는 버스바에 접합되어 배터리 셀의 각각의 전압 및 전류를 측정하여 전기적인 정보로 기판층(101)을 따라 전달할 수 있다. 따라서 제3 연결 회로부(150)의 수는 배터리 셀의 개수 및 버스바 개수에 따라, 그 수가 증감 되도록 조절할 수 있다.The third connection circuit unit 150 may be bonded to the bus bar to measure voltage and current of each of the battery cells and transmit the electrical information along the substrate layer 101. Therefore, the number of the third connection circuit units 150 may be adjusted to increase or decrease according to the number of battery cells and the number of bus bars.
제3 연결 회로부(150)는 양 측면은 연성회로기판(100)의 내부 기판층(101)이 노출되도록 형성될 수 있으며, 기판층(101)은 버스바에 접촉되는 제1 면(151) 및 제1 면(151)의 반대측에 형성되어 노출되는 제2 면(152)을 포함할 수 있다.Both sides of the third connection circuit unit 150 may be formed to expose the internal substrate layer 101 of the flexible circuit board 100, and the substrate layer 101 may be formed by contacting the bus bar with the first surface 151 and the first surface 151. It may include a second surface 152 formed on the opposite side of the first surface 151 and exposed.
제1 면(151)의 크기는 제2 면(152)의 크기보다 크게 형성될 수 있다. 이러한 구조는, 제1 면(151)과 버스바와의 접합을 용이하게 할 수 있고, 외부로 노출된 기판층(101)의 부분을 감소시켜 기판층(101)의 손상을 최소화할 수 있다.The size of the first surface 151 may be larger than that of the second surface 152. Such a structure may facilitate bonding between the first surface 151 and the bus bar, and minimize damage of the substrate layer 101 by reducing a portion of the substrate layer 101 exposed to the outside.
다른 실시예에서, 제3 연결 회로부(150)는 내부 기판층(101)의 일 면이 노츨되도록 형성될 수 있다. 기판층(101)의 일 면의 반대측 면은 절연층으로 커버될 수 있다. 또한, 노출된 기판층(101)의 일 면은 버스바에 접촉될 수 있다.In another embodiment, the third connection circuit 150 may be formed such that one surface of the inner substrate layer 101 is exposed. The opposite side of one surface of the substrate layer 101 may be covered with an insulating layer. In addition, one surface of the exposed substrate layer 101 may be in contact with the bus bar.
상술한 실시예에 따르면, 버스바와 제3 연결 회로부(150)가 직접 접합될 수 있도록 하여, 작업 공수를 절감시키는 동시에 중량 및 원가를 절감할 수 있다. 이에 대해서는 배터리 모듈 설명 시 자세히 설명하도록 한다.According to the above-described embodiment, the bus bar and the third connection circuit unit 150 can be directly bonded to each other, thereby reducing the labor and the weight and cost. This will be described in detail when describing the battery module.
이하 도면을 참조하여 전술한 연성회로기판을 포함하는 본 개시의 배터리 모듈의 구체적인 실시예를 상세히 설명한다.Hereinafter, specific embodiments of the battery module of the present disclosure including the above-described flexible circuit board will be described in detail with reference to the accompanying drawings.
[제1 실시예][First Embodiment]
도 10은 본 개시의 제1 실시예에 따른 배터리 모듈(1)의 사시도이고, 도 11은 도 10에 도시된 배터리 모듈(1)의 분해도이며, 도 12는 도 10에 도시된 배터리 모듈(1)의 셀 조립체(300)의 사시도이고, 도 13은 도 10에 도시된 배터리 모듈(1)의 프레임 조립체(10)의 사시도이며, 도 14은 도 13에 도시된 프레임(400)의 상부 플레이트(410)와 측면 플레이트(420)의 힌지 결합을 도시한 사시도이다.10 is a perspective view of a battery module 1 according to a first embodiment of the present disclosure, FIG. 11 is an exploded view of the battery module 1 shown in FIG. 10, and FIG. 12 is a battery module 1 shown in FIG. 10. FIG. 13 is a perspective view of the frame assembly 10 of the battery module 1 shown in FIG. 10, and FIG. 14 is a top plate () of the frame 400 shown in FIG. 13. 410 and a perspective view showing the hinge coupling of the side plate 420.
도 10 내지 도 14를 참조하면, 본 개시의 제1 실시예에 따른 배터리 모듈(1)은 하나 이상의 배터리 셀이 적층되어 형성되는 셀 조립체(300), 셀 조립체(300)를 고정하기 위한 프레임 조립체(10)를 포함할 수 있다.10 to 14, the battery module 1 according to the first embodiment of the present disclosure includes a cell assembly 300 in which one or more battery cells are stacked and a frame assembly for fixing the cell assembly 300. (10) may be included.
프레임 조립체(10)는 상부 플레이트(410), 상부 플레이트(410)의 양 단에 연결되는 측면 플레이트(420)를 포함하여, 상기 셀 조립체(300)를 감싸도록 배치되는 프레임(400), 측면 플레이트(420)에 배치되어 고정되는 버스바(500), 및 상부 플레이트(410)와 상기 측면 플레이트(420)를 따라 배치되어 배터리 셀의 전압을 센싱하는 연성회로기판(100)을 포함할 수 있다. 상부 플레이트(410)에는 상측면에 일정한 깊이로 파인 경로홈(411)이 형성될 수 있다.The frame assembly 10 includes a top plate 410, side plates 420 connected to both ends of the top plate 410, and a frame 400 and side plates arranged to surround the cell assembly 300. The bus bar 500 may be disposed and fixed to the 420, and the flexible circuit board 100 may be disposed along the upper plate 410 and the side plate 420 to sense the voltage of the battery cell. The upper plate 410 may be formed with a path groove 411 is formed in a predetermined depth on the upper side.
셀 조립체(300)는 하나 이상의 배터리 셀이 적층되어 형성되고, 배터리 셀은 이차 전지로 형성되는 것이 일반적이나, 이에 한정되는 것은 아니고 충전 또는 방전이 가능한 전지인 경우 어느 것으로도 형성될 수 있다.The cell assembly 300 is formed by stacking one or more battery cells, and the battery cell is generally formed of a secondary battery, but is not limited thereto. The cell assembly 300 may be formed of any battery that can be charged or discharged.
배터리 셀은 양 측으로 돌출되어 단자부(310)가 형성될 수 있고, 일 측에 (-)단자가 형성되면, 타 측에는 (+)단자가 형성된다. 또한 도전성 물질로 형성되며, 플렉서블한 특성을 가져 변형가능한 것이 바람직하다. 따라서 단자부(310)는 일 측으로 접혀 인접하는 단자부(310)와 접합 공정을 통해 전기적으로 연결된다.The battery cell may protrude to both sides to form a terminal portion 310. If a negative terminal is formed on one side, a positive terminal is formed on the other side. It is also preferred that it is formed of a conductive material and has a flexible characteristic to be deformable. Therefore, the terminal part 310 is folded to one side and electrically connected to the adjacent terminal part 310 through a bonding process.
셀 조립체(300)는, 도 12에 도시된 바와 같이, 배터리 셀이 세워진 형태로 적층되어 형성될 수 있으며, 배터리 셀은 인접하는 다른 배터리 셀과 단자부(310)가 서로 연결된다. 예를 들어 동일 극성을 갖는 단자끼리 연결되는 경우 배터리 셀은 전기적으로 병렬 연결되며, 서로 다른 극성을 갖는 단자끼리 연결되는 경우 배터리 셀은 전기적으로 직렬 연결된다.As illustrated in FIG. 12, the cell assembly 300 may be formed by stacking battery cells upright, and the battery cells are connected to other adjacent battery cells and the terminal unit 310. For example, when terminals having the same polarity are connected to each other, the battery cells are electrically connected in parallel, and when the terminals having different polarities are connected to each other, the battery cells are electrically connected in series.
배터리 셀의 연결은 필요에 따라 다르게 구성 할 수 있다. 예를 들어, 8개의 배터리 셀을 2개씩 병렬 연결하고, 병렬 연결한 4개의 셀을 다시 직렬 연결하여 4P 3S로 형성할 수 있다.The connection of the battery cells can be configured differently as necessary. For example, eight battery cells may be connected in parallel by two, and four cells connected in parallel may be connected in series to form 4P 3S.
상술한 실시예에 따르면, 셀 조립체(300)에서 배터리 셀의 연결 구성을 달리 하여 차량 패키지에 따른 배터리 용량을 용이하게 변경할 수 있고, 접합 공정에 소요되는 시간을 절감하여 생산성을 향상시킬 수 있다.According to the embodiment described above, the battery assembly according to the vehicle package can be easily changed by changing the connection configuration of the battery cells in the cell assembly 300, and the productivity time can be improved by reducing the time required for the bonding process.
도 13 및 도 14를 참조하면, 프레임(400)은 상부 플레이트(410)와 상부 플레이트(410)의 양 단에 연결되는 측면 플레이트(420)를 포함할 수 있다. 프레임(400)의 상부 플레이트(410) 및 측면 플레이트(420)는, 상부 플레이트(410)에 형성된 후크부(414)와 측면 플레이트(420)에 형성된 로드부(424)에 끼워져 힌지 결합된다.13 and 14, the frame 400 may include an upper plate 410 and side plates 420 connected to both ends of the upper plate 410. The upper plate 410 and the side plate 420 of the frame 400 are hingedly coupled to the hook portion 414 formed on the upper plate 410 and the rod portion 424 formed on the side plate 420.
상부 플레이트(410)의 단부 각각에는 후크 형상의 후크부(414)가 이격되어 복수 개 형성될 수 있고, 후크부(414)가 형성된 위치에 대응하여 측면 플레이트(420)의 상측면에는 로드부(424)가 형성될 수 있다. 후크부(414)와 로드부(424)는 각각 상부 플레이트(410) 및 측면 플레이트(420)에 돌출 형성되어, 일 측에서 마주치게 되어, 로드부(424)가 후크부(414)에 끼워져서 힌지 결합될 수 있다.Each end of the upper plate 410 may be formed with a plurality of hook-shaped hook portions 414 spaced apart from each other, and a rod portion may be formed on an upper surface of the side plate 420 corresponding to a position at which the hook portion 414 is formed. 424 may be formed. The hook portion 414 and the rod portion 424 protrude from the upper plate 410 and the side plate 420, respectively, and face each other, so that the rod portion 424 is fitted to the hook portion 414. It can be hinged.
일 실시예에서, 후크부(414)의 내부 곡률반경은 로드부(424)의 반경과 동일하거나 작게 형성될 수 있다. 이에 따라, 상부 플레이트(410)와 측면 플레이트(420)의 결합에서 일정 이상의 고정력이 확보될 수 있으므로, 조립과정에서 프레임(400)이 분리되는 것을 방지하여 작업성을 향상시킬 수 있다.In one embodiment, the radius of curvature of the hook portion 414 may be equal to or smaller than the radius of the rod portion 424. Accordingly, a predetermined or more fixing force may be secured in the coupling of the upper plate 410 and the side plate 420, and thus, workability may be improved by preventing the frame 400 from being separated during the assembly process.
프레임(400)은, 상부 플레이트(410)가 셀 조립체(300)의 상측에 배치되고 측면 플레이트(420)는 단자부(310)가 형성된 셀 조립체(300)의 양 측면에 배치되어, 셀 조립체(300)를 감싸도록 배치될 수 있다.In the frame 400, the upper plate 410 is disposed above the cell assembly 300, and the side plate 420 is disposed on both sides of the cell assembly 300 in which the terminal portion 310 is formed. ) May be arranged to surround.
프레임(400)은 상부 플레이트(410)와 측면 플레이트(420)가 플라스틱 사출 성형 방식으로 형성될 수 있다. 이에 따라, 프레임(400)은 생산 비용이 저렴하고, 힌지 결합되어 용이하게 조립될 수 있다.The frame 400 may have a top plate 410 and a side plate 420 formed by plastic injection molding. Accordingly, the frame 400 is inexpensive to produce, and can be easily assembled by hinge coupling.
도 15는 도 10에 도시된 배터리 모듈(1)의 프레임(400)과 연성회로기판(100)의 배치를 도시한 측면도이고, 도 16는 도 13에 도시된 프레임 조립체(10)의 상부 플레이트(410) 및 연성회로기판(100)의 결합된 구성을 도시한 사시도이며, 도 17은 도 16에 도시된 상부 플레이트(410) 및 연성회로기판(100)의 분해된 구성을 도시한 분해 사시도이고, 도 18은 도 17에 도시된 상부 플레이트(410)의 경로홈(411)에 연성회로기판(100)이 안착된 상태를 도시한 평면도이다. FIG. 15 is a side view illustrating an arrangement of the frame 400 and the flexible circuit board 100 of the battery module 1 illustrated in FIG. 10, and FIG. 16 is a top plate of the frame assembly 10 illustrated in FIG. 13. 410 and a perspective view showing a combined configuration of the flexible circuit board 100, Figure 17 is an exploded perspective view showing an exploded configuration of the upper plate 410 and the flexible circuit board 100 shown in FIG. FIG. 18 is a plan view illustrating a state in which the flexible circuit board 100 is seated in the path groove 411 of the upper plate 410 of FIG. 17.
도 19는 도 10에 도시된 배터리 모듈(1)의 측면 플레이트(420)의 정면도이고, 도 20은 도 19에 도시된 보강 플레이트(600)를 확대 도시한 사시도이며, 도 21는 도 20에 표시된 A-A방향 단면 사시도 및 단면도이고, 도 22는 도 20에 도시된 보강 플레이트(600)의 고정방법을 도시한 도면이며, 도 23은 도 19에 도시된 버스바(500)의 안착부(520)를 확대 도시한 사시도이다.FIG. 19 is a front view of the side plate 420 of the battery module 1 shown in FIG. 10, FIG. 20 is an enlarged perspective view of the reinforcing plate 600 shown in FIG. 19, and FIG. 21 is shown in FIG. 20. AA is a cross-sectional perspective view and a cross-sectional view, Figure 22 is a view showing a fixing method of the reinforcing plate 600 shown in Figure 20, Figure 23 is a seating portion 520 of the bus bar 500 shown in Figure 19 It is an enlarged perspective view.
연성회로기판(100)은, 도 15에 도시된 바와 같이, 프레임(400)의 외측을 따라 배치된다. 중심부(110)는 상부 플레이트(410)의 상측면에 배치될 수 있다. 중심부(110)는 일정한 깊이로 파인 형성된 경로홈(411)에 안착되어 고정되며, 중심부(110)의 길이는 상부 플레이트(410)의 길이 방향보다 길게 형성되어 중심부(110)의 양 단부는 측면 플레이트(420)를 따라 구부러질 수 있다.The flexible printed circuit board 100 is disposed along the outer side of the frame 400, as shown in FIG. 15. The central portion 110 may be disposed on an upper surface of the upper plate 410. The central portion 110 is seated and fixed in a path groove 411 formed with a constant depth, the length of the central portion 110 is formed longer than the longitudinal direction of the upper plate 410 so that both ends of the central portion 110 are side plates Can be bent along 420.
제1 연결 회로부(120) 및 제2 연결 회로부(130)는 측면 플레이트(420)의 외측에 배치되며, 측면 플레이트(420)의 외관을 따라 구부러져서 밀착된다. 따라서 제1 연결 회로부(210)와 제2 연결 회로부(130)에 형성된 제3 연결 회로부(150)는 구조적으로 버스바(500)의 외측에 배치될 수 있다.The first connection circuit part 120 and the second connection circuit part 130 are disposed outside the side plate 420, and are bent and adhered along the exterior of the side plate 420. Therefore, the third connection circuit unit 150 formed in the first connection circuit unit 210 and the second connection circuit unit 130 may be structurally disposed outside the bus bar 500.
도 2를 참고하면, 중심부(110) 및 제2 연결 회로부(130)에는 돌출홀(112)이 형성될 수 있다. 돌출홀(112)은 복수개 형성될 수 있으며, 체결 부재(미도시)가 관통되어 연성회로기판(100)을 프레임(400)에 고정시킬 수 있다. 돌출홀(112)은 외측으로 돌출하도록 연장 형성되어 내부 회로에는 영향을 미치지 않는다.Referring to FIG. 2, protruding holes 112 may be formed in the central portion 110 and the second connection circuit portion 130. A plurality of protruding holes 112 may be formed, and fastening members (not shown) may penetrate to fix the flexible circuit board 100 to the frame 400. The protruding hole 112 extends to protrude outward and does not affect the internal circuit.
연성회로기판(100)의 일 단은 버스바(500)에 전기적으로 연결되고, 내부에 복수 개의 선이 나란하게 배열되어 배터리 셀의 전압 및 전압에 관한 정보를 비엠에스(BMS, Battery Management System)(미도시) 측으로 전달한다. 비엠에스는 각 배터리 셀의 충전과 방전을 관리한다. 예를 들어, 비엠에스는 충전 모드에서 서로 다른 전압 레벨로 방전된 복수 개의 배터리 셀을 균일한 전압 레벨을 갖도록 충전할 수 있다.One end of the flexible circuit board 100 is electrically connected to the bus bar 500, and a plurality of lines are arranged in parallel to each other so that information about the voltage and voltage of the battery cell may be measured by a battery management system (BMS). Deliver to the side (not shown). BMS manages charging and discharging of each battery cell. For example, BMS may charge a plurality of battery cells discharged to different voltage levels in a charging mode to have a uniform voltage level.
상부 플레이트(410)는 셀 조립체(300)의 크기에 대응되어 사각형상으로 형성되고, 셀 조립체(300)의 상측에 배치된다. 상측면에는 중심부(110)가 안착되는 경로홈(411)이 형성되고, 경로홈(411)의 상측을 덮는 탑 커버(413)을 포함한다.The upper plate 410 is formed in a quadrangular shape corresponding to the size of the cell assembly 300, and is disposed above the cell assembly 300. The upper side surface includes a path groove 411 in which the center portion 110 is seated, and includes a top cover 413 covering an upper side of the path groove 411.
경로홈(411)은 중심부(110)가 안착될 수 있도록 일정한 깊이로 파이도록 형성될 수 있다. 탑 커버(413)는 중심부(110)가 경로홈(411)에 안착된 상태에서 중심부(110)의 상측을 덮을 수 있다. 따라서 경로홈(411)과 탑 커버(413)는 중심부(110)의 형상과 동일한 형상으로 형성될 수 있다. 따라서, 중심부(110)는 프레임(400)의 외측으로 이탈되지 않으며, 외부로 노출되지 않아 조립과정에서 중심부(110)에 발생할 수 있는 손상이 방지될 수 있다.The path groove 411 may be formed to pit to a certain depth so that the center portion 110 can be seated. The top cover 413 may cover the upper side of the central portion 110 in a state in which the central portion 110 is seated in the path groove 411. Therefore, the path groove 411 and the top cover 413 may be formed in the same shape as the shape of the central portion (110). Therefore, the central portion 110 is not separated to the outside of the frame 400 and is not exposed to the outside, thereby preventing damage to the central portion 110 during the assembly process.
상부 플레이트(410)에는 경로홈(411)의 내측을 향하여 돌출된 리브(412)가 형성될 수 있다. 리브(412)는 경로홈(411)의 양 측에 번갈아가며 복수 개 형성되며, 서로 일정한 간격을 두고 이격되도록 형성될 수 있다.The upper plate 410 may be formed with a rib 412 protruding toward the inside of the path groove 411. Ribs 412 are formed in a plurality of alternately on both sides of the path groove 411, may be formed to be spaced apart from each other at regular intervals.
리브(412)는 경로홈(411)의 양 측면으로부터 내측으로 돌출되도록 형성될 수 있고, 리브(412)의 하측면은 경로홈(411)으로부터 소정의 간격을 두고 이격될 수 있다. 따라서, 중심부(110)는 리브(412)와 경로홈(411) 사이에 배치되어, 중심부(110)가 경로홈(411)에서 이탈되는 것을 방지하므로, 양면테이프와 같은 접착제 없이도 연성회로기판(100)은 프레임(400)에 밀착 고정될 수 있다.The rib 412 may be formed to protrude inwardly from both sides of the path groove 411, and the bottom surface of the rib 412 may be spaced apart from the path groove 411 by a predetermined distance. Therefore, the central portion 110 is disposed between the rib 412 and the path groove 411, and thus prevents the central part 110 from being separated from the path groove 411, so that the flexible circuit board 100 can be used without an adhesive such as a double-sided tape. ) May be tightly fixed to the frame 400.
도 19를 참고하면, 측면 플레이트(420)의 외측면에는 보강플레이트(600)와 버스바(500)가 밀착 고정될 수 있다. 측면 플레이트(420)는 2개로 구성되어 상부 플레이트(410)의 양 단부에 각각 연결된다. 따라서, 2개의 측면 플레이트(420)는 셀 조립체(300)의 양 측면에 배치될 수 있다. 셀 조립체(300)의 양 측면은 배터리 셀의 단자부(310)가 형성된 양 측면이 될 수 있다. Referring to FIG. 19, the reinforcing plate 600 and the bus bar 500 may be tightly fixed to an outer surface of the side plate 420. The side plate 420 is composed of two and connected to both ends of the upper plate 410, respectively. Thus, two side plates 420 may be disposed on both sides of the cell assembly 300. Both sides of the cell assembly 300 may be both sides on which the terminal unit 310 of the battery cell is formed.
보강플레이트(600)는 중심부(110)의 단부를 덮고 측면 플레이트(420)에 밀착 고정될 수 있다. 측면 플레이트(420)에는, 보강플레이트(600)의 고정을 위해 측면 플레이트(420)로부터 돌출된 융착돌기(425)가 형성될 수 있다. 중심부(110) 및 보강플레이트(600) 각각에는 융착돌기(425)의 위치에 대응하여 고정홀(115, 615)이 형성될 수 있다.The reinforcement plate 600 may cover the end of the central portion 110 and be fixed in close contact with the side plate 420. In the side plate 420, a fusion protrusion 425 protruding from the side plate 420 may be formed to fix the reinforcing plate 600. Fixing holes 115 and 615 may be formed in each of the central portion 110 and the reinforcing plate 600 to correspond to the position of the fusion protrusion 425.
보강플레이트(600)는, 융착돌기(425)가 중심부(110)의 제1 고정홀(115)과 보강플레이트(600)의 제2 고정홀(615)을 순차로 관통한 후, 융착 방식으로 고정될 수 있다. 융착돌기(425)는 열 융착 공정에서 히터가 구비된 가압부재(미도시)에 의해 외측부터 녹아내려 압착되고, 이후 압착된 부분이 냉각되어 경화되면서 보강플레이트(600)는 측면 플레이트(420)에 밀착될 수 있다.The reinforcing plate 600, the fusion protrusion 425 sequentially penetrates through the first fixing hole 115 of the central portion 110 and the second fixing hole 615 of the reinforcing plate 600, and then fixed in a fusion method. Can be. The fusion protrusion 425 is melted from the outside by a pressing member (not shown) equipped with a heater in the thermal fusion process, and then compressed, and then the reinforcement plate 600 is cooled to the side plate 420 while the compressed portion is cooled and cured. It may be in close contact.
상술한 실시예에 따르면, 중심부(110)의 단부는 보강플레이트(600)와 측면 플레이트(420) 사이에 배치되어 고정될 수 있다. 보강플레이트(600)는 중심부(110)의 구부러진 부분을 지나서 하측 단부 부분을 가압하므로, 가압에 의하여 연성회로기판(100)이 추가로 구부러지는 현상을 최소화되어 크랙 등과 같은 손상을 방지할 수 있다. 또한, 열 융착 공정에서 연성회로기판(100)이 직접 가압 받는 것을 차단하고, 차량의 운행에 따른 지속적인 진동이나 충격 등의 외력을 흡수하여 손상을 최소화할 수 있다.According to the embodiment described above, an end portion of the central portion 110 may be disposed and fixed between the reinforcing plate 600 and the side plate 420. Since the reinforcement plate 600 presses the lower end portion past the bent portion of the central portion 110, the bending of the flexible circuit board 100 may be further minimized by the pressurization to prevent damage such as cracks. In addition, the flexible circuit board 100 may be directly prevented from being pressurized in the heat fusion process, and damage may be minimized by absorbing external force such as continuous vibration or shock caused by driving of the vehicle.
여기서의 융착 공정은 열 융착 고정뿐만 아니라, 초음파 융착 고정 등을 포함한다.The fusion process here includes not only thermal fusion fixing but also ultrasonic fusion fixing and the like.
보강플레이트(600)는 연성회로기판(100)과 버스바(500)의 전기적 연결을 방해하지 않기 위해 금속을 제외한 회로가 없는 어떠한 절연 재질로도 형성 가능하다.The reinforcement plate 600 may be formed of any insulating material without a circuit except for metal so as not to interfere with the electrical connection between the flexible circuit board 100 and the bus bar 500.
버스바(500)는 측면 플레이트(420)에 밀착 고정되어 일 부분은 제3 연결 회로부(150)와 연결되며, 다른 부분은 단자부(310)와 연결될 수 있다. 따라서 버스바(500)는 연성회로기판(100)과 배터리 셀을 전기적으로 연결하도록 구성될 수 있다.The bus bar 500 may be tightly fixed to the side plate 420 so that one part may be connected to the third connection circuit 150 and the other part may be connected to the terminal 310. Therefore, the bus bar 500 may be configured to electrically connect the flexible circuit board 100 and the battery cell.
버스바(500)는 서로 이격되도록 복수 개로 제공될 수 있고, 버스바(500)의 개수는 필요에 따라 변경 가능하다. 또한 각 버스바(500)에는 삽입홀(510) 및 안착부(520)가 형성될 수 있다.The bus bars 500 may be provided in plural numbers so as to be spaced apart from each other, and the number of bus bars 500 may be changed as necessary. In addition, an insertion hole 510 and a seating part 520 may be formed in each bus bar 500.
안착부(520)는 각 버스바(500)의 제3 연결 회로부(150)와 접합되는 부분이 될 수 있고, 일정한 깊이로 파이도록 형성될 수 있다. 따라서, 작업자는 안착부(520)에 기초하여 작업 위치를 육안으로 식별할 수 있고, 접합 위치를 명확하게 파악할 수 있다. 이에 따라, 접합 불량 등의 문제점을 해결할 수 있다.The seating part 520 may be a part that is joined to the third connection circuit part 150 of each bus bar 500, and may be formed to pie at a predetermined depth. Therefore, the worker can visually identify the working position based on the seating part 520, and can grasp | ascertain the bonding position clearly. Accordingly, problems such as poor bonding can be solved.
삽입홀(510)은 배터리 셀이 적층된 방향과 동일한 방향을 따라 형성될 수 있다. 삽입홀(510)로 셀 조립체(300)의 단자부(310)가 삽입되고, 삽입홀(510)을 관통하여 돌출되는 단자부(310)의 부분은 일 측으로 접혀 버스바(500)와 접합될 수 있다. 따라서, 버스바(500)를 통해 배터리 셀은 다른 배터리 셀과 전기적으로 연결될 수 있다.The insertion hole 510 may be formed along the same direction as the direction in which the battery cells are stacked. The terminal portion 310 of the cell assembly 300 is inserted into the insertion hole 510, and a portion of the terminal portion 310 protruding through the insertion hole 510 may be folded to one side and bonded to the bus bar 500. . Accordingly, the battery cell may be electrically connected to another battery cell through the bus bar 500.
이때, 단자부(310)의 삽입을 위해 삽입홀(510)이 형성된 위치에 대응하여 측면 플레이트(420)에도 홀(미도시)이 형성될 수 있다.In this case, a hole (not shown) may be formed in the side plate 420 corresponding to the position where the insertion hole 510 is formed to insert the terminal portion 310.
버스바(500)는 각각 별도로 형성된 센싱 버스바 및 HV 버스바를 포함할 수 있다. 버스바(500)는 셀 조립체(300)의 단자부(310)와 전기적으로 연결되어 배터리 셀의 각각의 전압과 전류에 관한 정보를 전달하거나, 배터리 모듈(1) 외부에 설치된 버스바와 연결되어 전기적 정보를 전달할 수 있다. 또한, 버스바(500)는 도체로 형성되며, 전기 전도율이 높은 금속으로 형성될 수 있다.The bus bar 500 may include a sensing bus bar and an HV bus bar that are separately formed. The bus bar 500 may be electrically connected to the terminal 310 of the cell assembly 300 to transmit information about voltage and current of each battery cell, or may be connected to a bus bar installed outside the battery module 1 to provide electrical information. Can be passed. In addition, the bus bar 500 may be formed of a conductor, and may be formed of a metal having high electrical conductivity.
도 24는 도 23에 도시된 안착부(520)에 기판층(101)이 직접 접합된 상태를 도시한 정면도이고, 도 25는 도 24에 도시된 기판층(101)을 버스바(500)에 접합하기 위한 접합방법을 도시한 단면도이며, 도 26은 도 24의 제3 연결 회로부(150)에 코팅부(800)가 더 형성된 상태를 도시한 평면도이고, 도 27은 도 26에 도시된 코팅층의 단면도이다.24 is a front view illustrating a state in which the substrate layer 101 is directly bonded to the seating portion 520 illustrated in FIG. 23, and FIG. 25 illustrates the substrate layer 101 illustrated in FIG. 24 attached to the bus bar 500. 26 is a cross-sectional view illustrating a bonding method for bonding, FIG. 26 is a plan view illustrating a state in which a coating unit 800 is further formed on the third connection circuit unit 150 of FIG. 24, and FIG. 27 is a view of the coating layer illustrated in FIG. 26. It is a cross section.
기판층(101)은 버스바(500)에 접촉되는 제1 면(151)과 제1 면(151)의 반대측에 형성되는 제2 면(152)을 포함하고, 제2 면(152)의 외측으로 코팅부(800)가 더 형성될 수 있다. 제1 면(151)과 제2 면(152)은 연성회로기판(100)의 절연층(102)을 절삭하여 내부 기판층(101)을 노출시키는 것에 의하여 형성될 수 있다.The substrate layer 101 includes a first surface 151 contacting the bus bar 500 and a second surface 152 formed on an opposite side of the first surface 151 and an outer side of the second surface 152. As a coating portion 800 may be further formed. The first surface 151 and the second surface 152 may be formed by cutting the insulating layer 102 of the flexible circuit board 100 to expose the internal substrate layer 101.
제1 면(151)은 버스바(500)의 일 측에 접촉되며, 제 버스바(500)에 일정한 깊이로 파인 형성된 안착부(520)에 접촉될 수 있다. 안착부(520)는 제3 연결 회로부(150)가 접합되는 위치를 명확하게 나타내어 작업성을 향상시킬 수 있다.The first surface 151 may be in contact with one side of the bus bar 500, and may be in contact with a seating part 520 formed in the bus bar 500 at a predetermined depth. The seating part 520 may improve the workability by clearly indicating a position where the third connection circuit part 150 is bonded.
일 실시예에서, 제1 면(151)의 크기는 제2 면(152)의 크기보다 크게 형성될 수 있다. 본 실시예는 버스바(500)와의 용접 면적을 확보할 수 있고, 외부로 노출되는 기판층의 면적을 감소시켜 제3 연결 회로부(150)의 손상을 방지할 수 있다.In an embodiment, the size of the first surface 151 may be larger than that of the second surface 152. According to the present embodiment, the welding area with the bus bar 500 may be secured, and the damage of the third connection circuit part 150 may be prevented by reducing the area of the substrate layer exposed to the outside.
기판층(101)은 연성회로기판(100)의 회로 역할을 하는 구성으로 전기 전도성이 있는 물질로 형성되고, 제1 면(151)과 안착부(520)를 직접 접합시켜 버스바(500)와 연성회로기판(100)을 전기적으로 연결시킬 수 있다. 이 과정에서, 제2 면(152)의 외측에서 레이져 용접하여 제1 면(151)을 접합시킬 수 있다.The substrate layer 101 is formed of an electrically conductive material and serves as a circuit of the flexible printed circuit board 100. The substrate layer 101 directly bonds the first surface 151 and the seating portion 520 to the bus bar 500. The flexible circuit board 100 may be electrically connected. In this process, the first surface 151 may be joined by laser welding on the outside of the second surface 152.
제1 면(151)은 절연층(102)을 절삭되어 노출된 면이 될 수 있다. 만일, 안착부(520)의 외측과 절연층(102)의 두께에 대응하는 에어 갭이 존재한다면, 에어 갭에 의해 접합과정에서 기판층(101)이 그을리는 형상이 발생하거나 절연층(102)이 연소되는 현상이 발생되어 요구되는 품질을 달성하지 못할 수 있다. The first surface 151 may be a surface exposed by cutting the insulating layer 102. If an air gap corresponding to the outside of the seating portion 520 and the thickness of the insulating layer 102 exists, a shape in which the substrate layer 101 is burned in the bonding process due to the air gap occurs or the insulating layer 102 is formed. ) May burn and fail to achieve the required quality.
일 실시예에 따르면, 접합 공정에서 지그(Z, jig)로 제2 면(152)을 가압하여 제1 면(151)과 안착부(520)사이에 존재하는 에어갭을 제거할 수 있다. 또한, 가압에 의해 안착부(520)와 제1 면(151)의 접촉 면적은 증가되어 용접부의 고정력을 향상시킬 수 있다.According to one embodiment, the air gap existing between the first surface 151 and the seating portion 520 may be removed by pressing the second surface 152 with the jig (Z, jig) in the bonding process. In addition, the contact area between the seating portion 520 and the first surface 151 may be increased by pressurization to improve the fixing force of the welded portion.
제3 연결 회로부(150)는 기판층(101)의 양 면으로 노출되도록 구성되므로, 버스바(500)에 직접적으로 결합될 수 있는 구조를 가질 수 있다. 따라서, 적용 부품의 감소 및 작업 공수를 절감시켜 보다 향상된 생산성을 제공할 수 있다.Since the third connection circuit unit 150 is configured to be exposed to both surfaces of the substrate layer 101, the third connection circuit unit 150 may have a structure that can be directly coupled to the bus bar 500. Thus, it is possible to provide more improved productivity by reducing the number of applied parts and the man-hour.
코팅부(800)는 제2 면(152) 및 제3 연결 회로부(150)의 주변의 버스바(500)의 일부를 커버하도록 형성될 수 있다. 코팅부(800)는 기판층(101)과 버스바(500)의 전기적 연결을 방해하지 않도록 비전도성 재료로 구성될 수 있으며, 노즐을 이용하여 일부에만 도포될 수 있다.The coating part 800 may be formed to cover a portion of the bus bar 500 around the second surface 152 and the third connection circuit part 150. The coating part 800 may be made of a non-conductive material so as not to interfere with the electrical connection between the substrate layer 101 and the bus bar 500, and may be applied only to a part using a nozzle.
도 27에 도시된 바와 같이, 코팅부(800)는 제1 면(151)이 버스바(500)에 접합된 상태에서 형성될 수 있다. 또한, 제2 면(152)뿐만 아니라 제2 면(152) 주변 절연층(102) 및 주변 버스바(500)의 일부까지 커버하도록 형성되어 기판층(101)의 부식을 방지하는 동시에, 버스바(500)와의 접합 강도를 향상시킬 수 있다.As shown in FIG. 27, the coating part 800 may be formed with the first surface 151 bonded to the bus bar 500. In addition, it is formed to cover not only the second surface 152 but also a portion of the peripheral insulating layer 102 and the peripheral bus bar 500 of the second surface 152 to prevent corrosion of the substrate layer 101 and at the same time Bonding strength with 500 can be improved.
도 28은 도 23에 도시된 안착부(520)에 일 실시예에 따른 일체형 연결 단자(700)의 연결부(720)가 접합된 상태를 도시한 정면도이고, 도 29는 도 28에 도시된 일 실시예에 따른 일체형 연결 단자(700)의 사시도이며, 도 30은 도 23에 도시된 안착부(520)에 일체형 연결 단자(700)와 다른 실시예인 링 형상의 연결 단자(1700)의 연결부(1720)가 접합된 상태를 도시한 정면도이고, 도 31은 도 30에 도시된 링 형상의 연결 단자(1700) 및 체결 부재(1730)의 사시도이며, 도 32는 도 28 및 도 30에 도시된 고정부(710)가 제3 연결 회로부(150)에 고정되는 방법을 도시한 사시도이다.FIG. 28 is a front view illustrating a state in which the connection portion 720 of the integrated connection terminal 700 is bonded to the seating portion 520 illustrated in FIG. 23, and FIG. 29 is an embodiment illustrated in FIG. 28. FIG. 30 is a perspective view of an integrated connection terminal 700 according to an example, and FIG. 30 is a connection portion 1720 of a ring-shaped connection terminal 1700 which is a different embodiment from the integrated connection terminal 700 in the seating portion 520 illustrated in FIG. 23. Is a front view showing a bonded state, and FIG. 31 is a perspective view of the ring-shaped connection terminal 1700 and the fastening member 1730 illustrated in FIG. 30, and FIG. 32 is a fixing portion (shown in FIGS. 28 and 30). 710 is a perspective view illustrating how the third connection circuit unit 150 is fixed.
연성회로기판(100)과 버스바(500)는 상술한 실시예에서 설명한 바와 같이 제3 연결 회로부(150)에 형성된 기판층(101)에 의해 전기적으로 연결 가능하다. 다만, 제3 연결 회로부(150)와 버스바(500)에 각각 연결되는 연결 단자(700, 1700)에 의해서도 전기적으로 연결 가능하다.The flexible circuit board 100 and the bus bar 500 may be electrically connected to each other by the substrate layer 101 formed on the third connection circuit unit 150 as described in the above-described embodiment. However, it may be electrically connected to the third connection circuit unit 150 and the connection terminals 700 and 1700 respectively connected to the bus bar 500.
연결 단자(700, 1700)는 고정부(710)와 연결부(720, 1720)를 포함하고, 연결부(720, 1720)는 고정부(710)의 일 측에서 연장 형성되어 일체로 형성된다. 연결 단자(700, 1700)는 버스바(500)와 제3 연결 회로부(150)의 사이에 위치하고, 양 측에 연결되어 제3 연결 회로부(150)와 버스바(500)를 전기적으로 연결하도록 구성될 수 있다.The connection terminals 700 and 1700 include fixing parts 710 and connecting parts 720 and 1720, and the connecting parts 720 and 1720 extend from one side of the fixing part 710 and are integrally formed. The connection terminals 700 and 1700 are positioned between the bus bar 500 and the third connection circuit unit 150, and are connected to both sides to electrically connect the third connection circuit unit 150 and the bus bar 500. Can be.
구체적으로는 고정부(710)는 제3 연결 회로부(150)에 고정되는 부분으로 상대적으로 좁게 형성되고, 상측 및 하측으로 돌출된 고정돌기(711)가 형성될 수 있다. 고정돌기(711)는 서로 이격되도록 복수 개로 제공되고, 미리 설정된 위치에서 정렬되는 제3 연결 회로부(150)를 관통할 수 있다. 고정돌기(711)의 관통하여 돌출된 부분은 휘어져 변형되어 제3 연결 회로부(150)에 고정된다.Specifically, the fixing part 710 may be formed to be relatively narrow as a part fixed to the third connection circuit part 150, and a fixing protrusion 711 protruding upward and downward may be formed. The fixing protrusions 711 may be provided in plural to be spaced apart from each other, and may pass through the third connection circuit unit 150 arranged at a predetermined position. The protruding portion of the fixing protrusion 711 is bent and deformed and fixed to the third connection circuit unit 150.
연결 단자(700, 1700)는 여러 실시예를 가질 수 있으며, 이하에서는 서로 다른 실시예에 해당하는 경우에도 동일한 부분에 대해서는 동일한 부호를 사용하여 설명하도록 한다.The connection terminals 700 and 1700 may have various embodiments, and the same parts will be described below with the same reference numerals even when they correspond to different embodiments.
도 25에 도시된 바와 같이, 일실시예에 따른 연결 단자(700)의 연결부(720)는 버스바(500)의 안착부(520)에 접합되는 부분으로 상대적으로 넓게 형성되고, 레이저 용접에 의해 접합될 수 있다. 도 27에 도시된 바와 같이, 다른 실시예에 따른 연결 단자(1700)의 연결부(1720)는 중심에 홀(1721)이 형성된 링 형상을 가질 수 있고, 링 형상은 나사 등과 같은 체결 부재(1730)에 의해 고정될 수 있다.As shown in FIG. 25, the connection part 720 of the connection terminal 700 according to the exemplary embodiment is formed to be relatively wide and joined to the seating part 520 of the bus bar 500, and is formed by laser welding. Can be bonded. As shown in FIG. 27, the connection portion 1720 of the connection terminal 1700 according to another embodiment may have a ring shape having a hole 1721 formed at the center thereof, and the ring shape may include a fastening member 1730 such as a screw. It can be fixed by.
상술한 실시예에 따른 연결 단자(700, 1700)는 종래 연성회로기판과 버스바의 연결을 위해 고정 단자와 연결판을 사용하는 것과 달리, 고정부(710)와 연결부(720,1720)가 일체로 연결되어 작업의 공수를 절감하고, 생산 비용을 절감시켜 생산성을 향상시킬 수 있다.In the connection terminals 700 and 1700 according to the above-described embodiment, unlike the conventional fixed terminal and the connection plate for connecting the flexible circuit board and the bus bar, the fixing unit 710 and the connection unit 720 and 1720 are integrated. Can reduce labor and reduce production costs, thus improving productivity.
도 33은 도 23에 도시된 안착부(520)에 결합 부재(2700)가 결합된 상태를 도시한 사시도이고, 도 34는 도 33에 도시된 안착부(520)에 결합 부재(2700)를 결합하기 위한 결합방법을 도시한 사시도이며, 도 35는 도 33에 표시된 B-B 방향 단면도이다.FIG. 33 is a perspective view illustrating a state in which the coupling member 2700 is coupled to the seating portion 520 illustrated in FIG. 23, and FIG. 34 illustrates a coupling member 2700 coupled to the seating portion 520 illustrated in FIG. 33. 35 is a perspective view showing a coupling method for performing the same.
연성회로기판(100)과 버스바(500)는 상기한 바와 같이 제3 연결 회로부(150)에 형성된 기판층(101) 또는 연결 단자(700,1700) 의해 전기적으로 연결 가능하다. 다만, 결합 부재(2700)는 제3 연결 회로부(150) 및 버스바(500) 사이에서 겹이음되어 제3 연결 회로부(150) 및 버스바(500)를 전기적으로 연결 할 수 있다.The flexible circuit board 100 and the bus bar 500 may be electrically connected to each other by the substrate layer 101 or the connection terminals 700 and 1700 formed in the third connection circuit unit 150 as described above. However, the coupling member 2700 may be overlapped between the third connection circuit unit 150 and the bus bar 500 to electrically connect the third connection circuit unit 150 and the bus bar 500.
결합 부재(2700)는 제3 연결 회로부(150)의 외측에 배치되는 헤드(2710)와 헤드(2710)에서 연장 형성되는 이음부(2720)를 포함할 수 있다. 이음부(2720)는 연성회로기판과 버스바를 전기적으로 연결할 수 있다. 따라서 결합 부재(2700)는 전기 전도성을 갖는 금속 재질로 형성된다. 헤드(2710)는 이음부(2720)에서 외측으로 돌출되어 배치되어 제3 연결 회로부(150)를 안착부(520) 측으로 가압하여 제3 연결 회로(150)부를 안착부(520)에 고정시킬 수 있다.The coupling member 2700 may include a head 2710 disposed outside the third connection circuit 150 and a joint 2720 extending from the head 2710. The joint 2720 may electrically connect the flexible circuit board and the bus bar. Therefore, the coupling member 2700 is formed of a metal material having electrical conductivity. The head 2710 may be disposed to protrude outward from the joint part 2720 to press the third connection circuit 150 to the seating part 520 to fix the third connection circuit 150 to the seating part 520. have.
결합 부재(2700)와의 결합을 위해 안착부(520)에는 제1 결합홀(521)이 형성되고, 제3 연결 회로부(150)에는 제1 결합홀(521)의 위치에 대응하여 제2 결합홀(153)이 형성될 수 있다. 제1 결합홀(521) 및 제2 결합홀(153)은 각각 서로 이격되어 한 쌍으로 형성되며, 내경이 서로 동일하게 형성될 수 있다. 결합 부재(2700)가 결합된 상태에서, 이음부(2720)는 제2 결합홀(153) 및 제1 결합홀(521)을 순차적으로 관통하여 버스바(500)에 고정될 수 있다. 또한, 헤드(2710)는 이음부(2720)에 외측으로 연장 형성되고 제3 연결 회로부(150)의 외측에 돌출되어 배치된다.A first coupling hole 521 is formed in the seating portion 520 to couple with the coupling member 2700, and a second coupling hole corresponding to the position of the first coupling hole 521 in the third connection circuit portion 150. 153 may be formed. The first coupling hole 521 and the second coupling hole 153 may be formed in pairs spaced apart from each other, and may have the same inner diameter. In a state in which the coupling member 2700 is coupled, the joint part 2720 may be fixed to the bus bar 500 by sequentially passing through the second coupling hole 153 and the first coupling hole 521. In addition, the head 2710 extends to the outside of the joint part 2720 and protrudes outside the third connection circuit unit 150.
이음부(2720)는 제1 결합홀(521) 및 제2 결합홀(153)과 동일한 크기로 형성되고, 헤드(2710)는 이음부(2720)의 반경보다 더 큰 반경을 가질 수 있다. 따라서, 헤드(2710)는 제1 결합홀(521) 및 제2 결합홀(153)을 관통하지 못하고 제3 연결 회로부(150)의 외측에 배치될 수 있다.The joint portion 2720 may have the same size as the first coupling hole 521 and the second coupling hole 153, and the head 2710 may have a radius larger than that of the joint portion 2720. Therefore, the head 2710 may not be penetrated through the first coupling hole 521 and the second coupling hole 153 and may be disposed outside the third connection circuit unit 150.
상술한 실시예에 따르면, 결합 부재(2700)의 이음부(2720)가 제2 결합홀(153)을 관통하며 제3 연결 회로부(150)의 기판층(102)과 전기적으로 연결되고, 다시 제1 결합홀(521)을 관통하여 버스바(500)와 전기적으로 연결되되므로, 결합 부재(2700)는 연성회로기판과 버스바를 전기적으로 연결할 수 있다. According to the above-described embodiment, the joint portion 2720 of the coupling member 2700 penetrates through the second coupling hole 153 and is electrically connected to the substrate layer 102 of the third connection circuit unit 150. 1 Since the coupling bar 521 is electrically connected to the bus bar 500, the coupling member 2700 may electrically connect the flexible circuit board and the bus bar.
일 실시예에서, 결합 부재(2700)는, 영구적인 결속력을 제공하고 두께가 얇은 부재 사이에서 유용하게 사용되는 리벳(rivet)으로 구성될 수 있다. 리벳을 사용하는 경우, 용접 공정에 따른 뒤틀림이나 용접 부위에 발생하는 균열 형상 등을 근본적으로 방지하여 결합에 대한 신뢰성을 향상시킬 수 있다.In one embodiment, the engagement member 2700 may be composed of a rivet that provides a permanent binding force and is usefully used between thin members. In the case of using the rivet, it is possible to fundamentally prevent distortion due to the welding process or crack shape generated at the welded portion, thereby improving the reliability of the bonding.
[제2실시예]Second Embodiment
본 개시의 제2 실시예에 따른 배터리 모듈(2)은 상술한 제1 실시예에 따른 배터리 모듈(1)과 일부 구성이 동일하므로, 이하에서 상술한 구성과 동일한 구성에 대한 중복 설명은 생략한다.Since the battery module 2 according to the second embodiment of the present disclosure has the same configuration as the battery module 1 according to the first embodiment described above, a redundant description of the same configuration as that described above will be omitted. .
도 36은 본 개시의 제2 실시예에 따른 배터리 모듈(2)의 사시도이고, 도 37은 도 36에 도시된 프레임(400)과 연성회로기판(100)의 분해된 구성을 도시한 측면도이며, 도 38는 도 36에 도시된 프레임(400)의 하측 방향에서의 사시도이고, 도 39는 도 38에 도시된 상부 플레이트(410)와 연성회로기판(100)의 분해도이며, 도 40은 도 39에 도시된 보호홀(417)을 확대 도시한 사시도이다.36 is a perspective view of a battery module 2 according to a second embodiment of the present disclosure, and FIG. 37 is a side view illustrating an exploded configuration of the frame 400 and the flexible circuit board 100 shown in FIG. 36. FIG. 38 is a perspective view from below of the frame 400 shown in FIG. 36, FIG. 39 is an exploded view of the upper plate 410 and the flexible circuit board 100 shown in FIG. 38, and FIG. 40 is shown in FIG. 39. It is an enlarged perspective view of the protection hole 417 shown.
도 36 내지 도 40을 참조하면, 본 개시의 제2 실시예에 따른 배터리 모듈(2)은 하나 이상의 배터리 셀이 적층되어 형성되는 셀 조립체(300) 및 셀 조립체(300)를 고정하기 위한 프레임 조립체(20)를 포함할 수 있다.36 to 40, the battery module 2 according to the second embodiment of the present disclosure is a frame assembly for fixing the cell assembly 300 and the cell assembly 300 formed by stacking one or more battery cells. 20 may be included.
프레임 조립체(20)는, 상부 플레이트(410), 상기 상부 플레이트(410)의 양 단에 연결되는 측면 플레이트(420)를 포함하여 상기 셀 조립체(300)를 감싸도록 배치되는 프레임(400), 상기 측면 플레이트(420)에 배치되어 고정되는 버스바(500), 상기 상부 플레이트(410)와 상기 측면 플레이트(420)를 따라 배치되어 상기 배터리 셀의 전압을 센싱하는 연성회로기판(100), 상기 측면 플레이트(420)의 일 측에 밀착 고정되어 상기 연성회로기판(100)의 단부를 덮는 보강플레이트(600)를 포함할 수 있다. 상기 상부 플레이트(410)는 저면에 일정한 깊이로 파인 보호홈(416)이 형성될 수 있다.The frame assembly 20 includes a top plate 410 and a frame 400 disposed to surround the cell assembly 300 including side plates 420 connected to both ends of the top plate 410. A bus bar 500 disposed on and fixed to the side plate 420, a flexible circuit board 100 disposed along the upper plate 410 and the side plate 420 to sense a voltage of the battery cell, and the side surface. The reinforcing plate 600 may be tightly fixed to one side of the plate 420 to cover an end portion of the flexible circuit board 100. The upper plate 410 may be formed with a protective groove 416 that is dug to a certain depth on the bottom.
본 개시의 제2 실시예에 따른 배터리 모듈(2)은, 도 37에 도시된 바와 같이, 연성회로기판(100)의 중심부(110)는 상부 플레이트(410)의 저면에 배치될 수 있고, 제1연결부(120) 및 제2 연결 회로부(130)는 측면 플레이트(420)의 외측면에 배치될 수 있다.In the battery module 2 according to the second embodiment of the present disclosure, as shown in FIG. 37, the central portion 110 of the flexible circuit board 100 may be disposed on the bottom surface of the upper plate 410. The first connection unit 120 and the second connection circuit unit 130 may be disposed on the outer surface of the side plate 420.
중심부(110)는 상부 플레이트(410)와 셀 조립체(300) 사이에 위치하게 되어, 배터리 모듈(1)의 외부로 연성회로기판이 노출되는 부분을 최소화할 수 있다. 이에 조립과정에서 발생할 수 있는 크랙 등에 의한 찢어짐 등의 연성회로기판(100)의 손상을 최소화할 수 있다.The central portion 110 may be located between the upper plate 410 and the cell assembly 300, thereby minimizing a portion of the flexible circuit board exposed to the outside of the battery module 1. Therefore, damage to the flexible circuit board 100, such as tearing due to cracks, which may occur in the assembly process, may be minimized.
도 39에 도시된 바와 같이, 프레임(400)의 상부 플레이트(410)는 저면에는 중심부(110)가 수용되는 보호홈(416)이 형성될 수 있으며, 보호홈(416)은 중심부(110)와 동일한 형상으로 형성될 수 있다.As shown in FIG. 39, the upper plate 410 of the frame 400 may have a protective groove 416 formed at a bottom thereof to accommodate the central portion 110, and the protective groove 416 may have a central portion 110. It may be formed in the same shape.
중심부(110)는 접착제(200)에 의해 보호홈(416)에 밀착 고정될 수 있다. 접착제(200)는 중심부(110) 및 보호홈(416)의 형상과 대응되는 형상의 양면테이프(200)를 사용할 수 있다. 양면테이프(200)에 의해 중심부(110)를 고정하는 경우에는 배터리 모듈(1)의 조립과정에서 열 융착 공정을 최소화할 수 있어 생산 시간을 단축시킬 수 있으며, 융착 고정에서 가압에 의해 발생하는 연성회로기판(100)의 파손을 방지할 수 있다.The central portion 110 may be tightly fixed to the protective groove 416 by the adhesive 200. The adhesive 200 may use a double-sided tape 200 having a shape corresponding to that of the central portion 110 and the protective groove 416. In the case of fixing the central portion 110 by the double-sided tape 200, the heat fusion process can be minimized during the assembly of the battery module 1, thereby shortening the production time, and the ductility caused by the pressure in the fusion fixing. Damage to the circuit board 100 can be prevented.
일 실시예에서, 보호홈(416)이 형성된 위치에 대응하여 상부 플레이트(410) 및 측면 플레이트(420) 중 적어도 어느 하나에는 보호홀(417)이 형성될 수 있다. 보호홀(417)은 중심부(110)의 단부가 통과되어, 제1 연결 회로부(120) 및 제2 연결 회로부(130)가 측면 플레이트(420)의 외측면에 배치될 수 있도록 한다.In one embodiment, a protective hole 417 may be formed in at least one of the upper plate 410 and the side plate 420 corresponding to the position where the protective groove 416 is formed. The protection hole 417 passes through an end portion of the central portion 110 such that the first connection circuit portion 120 and the second connection circuit portion 130 may be disposed on the outer surface of the side plate 420.
도 40을 참고하면, 중심부(110)는 보호홀(417)을 관통하여 구부러지면서 들뜨는 부분이 발생할 수 있으므로, 이를 최소화히기 위해 보호홀(417)은 상부 플레이트(410)에 형성될 수 있다.Referring to FIG. 40, the central portion 110 may be bent while penetrating through the protection hole 417, so that the protection hole 417 may be formed in the upper plate 410 in order to minimize this.
또한, 제1 연결 회로부(120) 및 제2 연결 회로부(130)는 중심부(110) 보다 넓게 형성되므로, 상부 플레이트(410)와 측면 플레이트(420)가 힌지 결합되기 전에, 중심부(110)가 보호홈(416)에 수용되어 고정되게 하는 것이, 프레임 조립체(20)의 조립을 편리하게 할 수 있다.In addition, since the first connection circuit part 120 and the second connection circuit part 130 are formed wider than the central part 110, the central part 110 is protected before the upper plate 410 and the side plate 420 are hinged. Receiving and fixed in the groove 416 may facilitate assembly of the frame assembly 20.
이하, 본 개시의 배터리 모듈(1)의 셀 조립체(300)와 프레임 조립체(20)가 조립되는 순서에 대해 설명하도록 한다.Hereinafter, the order of assembling the cell assembly 300 and the frame assembly 20 of the battery module 1 of the present disclosure will be described.
도 41은 셀 조립체(300)에 프레임 조립체(20)가 조립되는 방향을 도시한 사시도이고, 도 42는 셀 조립체(300)와 프레임 조립체(20)가 조립된 후 삽입홀(510)에 단자부(310)가 삽입된 상태를 도시한 사시도이며, 도 43은 삽입홀(510)에 단자부(310)가 삽입된 후 접혀 버스바(500)에 연결된 상태를 도시한 사시도이고, 도 44눈 도 43에 도시된 단자부(310)를 확대 도시한 사시도이다. 도 45는 배터리 모듈(2) 과 모노프레임(900)의 조립 방법을 도시한 사시도이다.FIG. 41 is a perspective view illustrating a direction in which the frame assembly 20 is assembled to the cell assembly 300, and FIG. 42 is a terminal part in the insertion hole 510 after the cell assembly 300 and the frame assembly 20 are assembled. FIG. 43 is a perspective view illustrating the inserted state, and FIG. 43 is a perspective view illustrating a state in which the terminal unit 310 is inserted into the insertion hole 510 and then folded and connected to the bus bar 500. An enlarged perspective view of the terminal unit 310 shown. 45 is a perspective view illustrating a method of assembling the battery module 2 and the monoframe 900.
일 실시예에서, 하나의 배터리 셀의 단자부(310)는 인접하는 배터리 셀의 단자부(310)와 연결되어 적층된 셀 조립체(300)를 형성할 수 있다. 이때, 단자부(310)는 배터리 셀의 양 측으로 돌출된 상태에서 인접하는 단자부(310)와 연결될 수 있다.In one embodiment, the terminal unit 310 of one battery cell may be connected to the terminal unit 310 of an adjacent battery cell to form a stacked cell assembly 300. In this case, the terminal unit 310 may be connected to the adjacent terminal unit 310 in a state protruding to both sides of the battery cell.
프레임(400)은 상부 플레이트(410)와 측면 플레이트(420)는 힌지 결합되어 조립된 상태가 될 수 있다. 연성회로기판(100)은 프레임(400)를 따라 배치될 수 있고, 제3 연결 회로부(150)는 버스바(500)에 접합된 상태로 배치될 수 있다.The frame 400 may be in a state where the upper plate 410 and the side plate 420 are hinged and assembled. The flexible circuit board 100 may be disposed along the frame 400, and the third connection circuit unit 150 may be disposed in a state of being bonded to the bus bar 500.
도 41에 도시된 바와 같이, 조립된 프레임 조립체(20)는 셀 조립체(300)의 상측에서 하측방향으로 셀 조립체(300)에 결합된다. 이때, 단자부(310)가 돌출되어 있으므로, 측면 플레이트(420)를 상부 플레이트(410)와의 힌지 결합을 중심으로 외측으로 회동시켜 상부 플레이트(410)에 대하여 외측으로 벌어지게 할 수 있다. 따라서, 프레임 조립체(20)는 단자부(310)의 방해없이 셀 조립체(300)의 외측을 감싸도록 배치될 수 있다.As shown in FIG. 41, the assembled frame assembly 20 is coupled to the cell assembly 300 from the upper side to the lower side of the cell assembly 300. At this time, since the terminal portion 310 protrudes, the side plate 420 may be rotated outward with respect to the hinge coupling with the upper plate 410 to be opened outward with respect to the upper plate 410. Accordingly, the frame assembly 20 may be disposed to surround the outside of the cell assembly 300 without disturbing the terminal portion 310.
다음으로, 도 42에 도시된 바와 같이, 외측으로 회동시킨 측면 플레이트(420)를 다시 내측으로 회동시켜 원래 자리에 위치시킨다. 이때 돌출된 단자부(310)는 측면 플레이트(420)에 형성된 홀(미도시) 및 버스바(500)에 형성된 삽입홀(510)을 관통하고, 단자부(310)의 단부는 버스바(500)의 외측으로 돌출될 수 있다.Next, as shown in FIG. 42, the side plate 420 rotated outward is rotated back to the inner position and positioned. At this time, the protruding terminal portion 310 passes through a hole (not shown) formed in the side plate 420 and an insertion hole 510 formed in the bus bar 500, and an end of the terminal portion 310 of the bus bar 500. It may protrude outward.
단자부(310)의 단부는 배터리 셀과 인접하는 배터리 셀의 단자부(310)가 접합된 것으로 복수의 단자부(310)가 부착되어 형성된 것이다.An end portion of the terminal portion 310 is formed by attaching a plurality of terminal portions 310 to which the terminal portions 310 of the battery cells adjacent to the battery cells are bonded.
다음으로, 도 43에 도시된 바와 같이, 외측으로 돌출되어 형성된 단자부(310)의 단부는 일 측으로 접혀 버스바(500)의 외측면에 접합된다. 접합된 상태를 보면, 도 44에 도시된 바와 같이, 단자부(310) 단부는 인접하는 다른 단자부(310)의 단부와 접촉하지 않으므로, 하나의 단자부(310)와 다른 단자부(310)의 접합으로 연결된 배터리 셀은 버스바(500)에 의해서만 다른 배터리 셀과 전기적으로 연결될 수 있다.Next, as shown in FIG. 43, an end portion of the terminal portion 310 protruding outward is folded to one side and bonded to an outer surface of the bus bar 500. In the bonded state, as shown in FIG. 44, the terminal part 310 end does not contact the end of another adjacent terminal part 310, and thus is connected to one terminal part 310 by another terminal part 310. The battery cell may be electrically connected to another battery cell only by the bus bar 500.
일 실시예에서, 단자부(310)와 버스바(500)는 결합을 위한 별도의 구성을 제공하지 않고도, 단자부(310) 단부의 외측에서 레이져 용접으로 접합되어 배터리 모듈의 생산에 소요되는 시간 및 비용을 절감할 수 있다.In one embodiment, the terminal portion 310 and the busbar 500 are joined by laser welding on the outside of the terminal portion 310 ends without providing a separate configuration for coupling, so that the time and cost required for the production of the battery module. Can reduce the cost.
도 45를 참고하면, 상기와 같은 방법으로, 조립된 배터리 모듈(1)은 모노 프레임(900)과 다시 한번 조립되어 고정될 수 있다. 모노 프레임(900)은 차량의 사고 발생 시, 셀 조립체(300)의 지끄러짐 또는 파손을 방지하여, 이에 의한 화재 등의 2차적 사고 발생을 예방한다. 또한, 외부 충격으로부터 프레임(400) 및 셀 조립체(300)의 결합상태를 보호한다. 또한, 모노 프레임(900)은 고강도를 갖는 금속 재료 등으로 형성될 수 있다.Referring to FIG. 45, in the same manner as described above, the assembled battery module 1 may be assembled and fixed with the mono frame 900 once again. The mono frame 900 prevents slippage or damage of the cell assembly 300 when a vehicle accident occurs, thereby preventing secondary accidents such as fire. In addition, to protect the coupled state of the frame 400 and the cell assembly 300 from external impact. In addition, the mono frame 900 may be formed of a metal material or the like having high strength.
이상 일부 실시예들과 첨부된 도면에 도시된 예에 의해 본 개시의 기술적 사상이 설명되었지만, 본 개시가 속하는 기술 분야에서 통상의 지식을 가진 자가 이해할 수 있는 본 개시의 기술적 사상 및 범위를 벗어나지 않는 범위에서 다양한 치환, 변형 및 변경이 이루어질 수 있다는 점을 알아야 할 것이다. 또한, 그러한 치환, 변형 및 변경은 첨부된 청구범위 내에 속하는 것으로 생각되어야 한다.While the technical spirit of the present disclosure has been described with reference to some embodiments and the examples shown in the accompanying drawings, the technical spirit and scope of the present disclosure may be understood by those skilled in the art. It will be appreciated that various substitutions, modifications, and alterations can be made in the scope. Also, such substitutions, modifications and variations are intended to be included within the scope of the appended claims.

Claims (31)

  1. 버스바가 결합된 프레임에 설치되는 연성회로기판에 있어서,In the flexible circuit board is installed on the frame coupled to the bus bar,
    밴드 형상의 중심부;Center of band shape;
    상기 중심부의 양 단부에 형성되고, 서로 대향하도록 배치되는 제1 연결 회로부;First connection circuits formed at both ends of the center portion and disposed to face each other;
    상기 제1 연결 회로부로부터 상기 중심부와 나란하도록 연장된 제2 연결 회로부; 및A second connection circuit portion extending from the first connection circuit portion to be parallel to the central portion; And
    상기 제1 연결 회로부 및 상기 제2 연결 회로부 각각으로부터 연장되어 상기 버스바에 연결되는 제3 연결 회로부를 포함하고,A third connection circuit portion extending from each of the first connection circuit portion and the second connection circuit portion and connected to the bus bar;
    상기 제2 연결 회로부가 상기 제1 연결 회로부의 일측으로 접히는 경우, 단면 방향에서 상기 제2 연결 회로부의 일 부분과 서로 겹치도록 배치된 상기 제2 연결 회로부의 다른 부분을 포함하는 겹침부가 형성되고,When the second connection circuit part is folded to one side of the first connection circuit part, an overlapping part including another part of the second connection circuit part disposed to overlap each other with one part of the second connection circuit part in a cross-sectional direction is formed.
    상기 겹침부가 형성되는 경우, 상기 제2 연결 회로부는 상기 제1 연결 회로부와 동일선상에 배치되는 연성회로기판.And the second connection circuit part is disposed on the same line as the first connection circuit part when the overlap part is formed.
  2. 제1항에 있어서,The method of claim 1,
    상기 제2 연결 회로부는 상기 제1 연결 회로부의 양 단부에 각각 형성되고,The second connection circuit portion is formed at each end of the first connection circuit portion,
    상기 겹침부는,The overlapping portion,
    상기 제2 연결 회로부가 제1 벤딩 라인을 따라 상기 제1 연결 회로부를 향하여 접혀서 형성되는 제1 겹침부; 및A first overlapping part formed by folding the second connection circuit part toward the first connection circuit part along a first bending line; And
    상기 제2 연결 회로부가 제2 벤딩 라인을 따라 상기 제1 연결 회로부의 길이 방향으로 꺾어지도록 접혀서 형성되는 제2 겹침부를 포함하는 연성회로기판.And a second overlapping part formed by folding the second connection circuit part to be bent along a second bending line in a length direction of the first connection circuit part.
  3. 제2항에 있어서,The method of claim 2,
    상기 제1 벤딩 라인은 상기 제1 연결 회로부와 나란하게 형성되고,The first bending line is formed in parallel with the first connection circuit portion,
    상기 제2 벤딩 라인은 상기 제1 벤딩 라인에 대하여 소정의 각도로 기울어지도록 형성되는 연성회로기판.The second bending line is formed to be inclined at a predetermined angle with respect to the first bending line.
  4. 제2항에 있어서,The method of claim 2,
    상기 제1 겹침부 및 상기 제2 겹침부를 구성하는 제2 연결부의 부분들 사이는 상측 및 하측에 대하여 고정력을 제공하는 접착제에 의해 밀착 고정되는 연성회로기판.And a portion of the second connecting portion constituting the first overlapping portion and the second overlapping portion to be tightly fixed by an adhesive that provides a fixing force to the upper side and the lower side.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 접착제는 양면 테이프 또는 양면 패드인 것을 특징으로 하는 연성회로기판.The adhesive is a flexible circuit board, characterized in that the double-sided tape or double-sided pad.
  6. 제1항에 있어서,The method of claim 1,
    상기 제1 연결 회로부에 형성된 제3 연결 회로부는 서로 이격되도록 복수 개로 형성되고,A plurality of third connection circuit portion formed in the first connection circuit portion is formed to be spaced apart from each other,
    상기 제1 연결 회로부와 상기 제2 연결 회로부가 서로 평행하도록 위치하는 경우, 상기 제2 연결 회로부에 형성된 제3 연결 회로부가 상기 제1 연결 회로부에 형성된 제3 연결 회로부와 서로 평행하도록 배치되는 연성회로기판.When the first connection circuit portion and the second connection circuit portion are positioned parallel to each other, a flexible circuit in which the third connection circuit portion formed in the second connection circuit portion parallel to each other and the third connection circuit portion formed in the first connection circuit portion Board.
  7. 제1항에 있어서,The method of claim 1,
    상기 중심부로부터 외측으로 연장되어 형성되는 온도센싱부를 더 포함하는, 연성회로기판.The flexible circuit board further comprises a temperature sensing unit formed extending from the center to the outside.
  8. 제1항에 있어서,The method of claim 1,
    상기 제3 연결 회로부는 기판층 및 상기 기판층의 일 면을 노출시키도록 구성된 절연층을 포함하고,The third connection circuit part includes a substrate layer and an insulating layer configured to expose one surface of the substrate layer,
    상기 기판층의 일 면은 상기 버스바에 접촉하도록 구성된 연성회로기판.One side of the substrate layer is configured to contact the bus bar.
  9. 제1항에 있어서,The method of claim 1,
    상기 제3 연결 회로부는 기판층 및 상기 기판층의 양 면을 노출시키도록 구성된 절연층을 포함하고,The third connection circuit part includes an insulating layer configured to expose a substrate layer and both surfaces of the substrate layer,
    상기 기판층은,The substrate layer,
    상기 버스바에 접촉되는 제1 면; 및A first surface in contact with the busbar; And
    상기 제1 면의 반대측에 형성되는 제2 면을 포함하는 연성회로기판.A flexible circuit board comprising a second surface formed on the opposite side of the first surface.
  10. 제9항에 있어서,The method of claim 9,
    상기 제3 연결 회로부는 상기 제1 면의 크기가 상기 제2 면의 크기보다 큰 것을 특징으로 하는 연성회로기판.The third connection circuit portion, the flexible circuit board, characterized in that the size of the first surface is larger than the size of the second surface.
  11. 적어도 하나의 배터리 셀이 적층되어 형성되는 셀 조립체를 고정하기 위한 프레임 조립체에 있어서,A frame assembly for fixing a cell assembly formed by stacking at least one battery cell,
    상부 플레이트, 상기 상부 플레이트의 양 단에 연결되는 측면 플레이트를 포함하여, 상기 셀 조립체를 감싸도록 배치되는 프레임;A frame disposed to surround the cell assembly, including a top plate and side plates connected to both ends of the top plate;
    상기 측면 플레이트에 배치되어 고정되는 버스바; 및A bus bar disposed on and fixed to the side plate; And
    상기 상부 플레이트와 상기 측면 플레이트를 따라 배치되어 상기 배터리 셀의 전압을 센싱하는 연성회로기판을 포함하고,A flexible circuit board disposed along the upper plate and the side plate to sense a voltage of the battery cell;
    상기 상부 플레이트는 상측면에 일정한 깊이로 파인 경로홈이 형성되며,The upper plate is formed in the upper groove path grooves to a predetermined depth,
    상기 연성회로기판은,The flexible circuit board,
    외측으로 연장된 온도센싱부가 형성되고, 상기 경로홈에 안착되는 밴드 형상의 중심부;A temperature sensing part extending outwardly and formed in a band-shaped center seated in the path groove;
    상기 중심부의 양 단부에 형성되고, 서로 대향하도록 배치되는 제1 연결 회로부;First connection circuits formed at both ends of the center portion and disposed to face each other;
    상기 제1 연결 회로부의 양 단부에 연장되고, 상기 중심부와 나란하게 형성되는 제2 연결 회로부; 및Second connection circuit portions extending at both ends of the first connection circuit portion and formed to be parallel to the central portion; And
    상기 제1 연결 회로부 및 상기 제2 연결 회로부 각각으로부터 연장되어 상기 버스바에 연결되는 제3 연결 회로부를 포함하고,A third connection circuit portion extending from each of the first connection circuit portion and the second connection circuit portion and connected to the bus bar;
    상기 연성회로기판에는, 상기 제2 연결 회로부가 제1 벤딩 라인을 따라 상기 제1 연결 회로부를 향하여 접혀서 형성되는 제1 겹침부 및 상기 제2 연결 회로부가 제2 벤딩 라인을 따라 상기 제1 연결 회로부의 길이 방향으로 꺾어지도록 접혀서 형성되는 제2 겹침부를 포함하는 겹침부가 형성되고,The flexible printed circuit board may include a first overlapping part formed by folding the second connection circuit part toward the first connection circuit part along a first bending line and the first connection circuit part along the second bending line. An overlap portion is formed including a second overlap portion formed by being folded to be bent in the longitudinal direction of the cross section.
    상기 겹침부가 형성되는 경우,When the overlap is formed,
    상기 제2 연결 회로부는 상기 제1 연결 회로부와 동일선상에 배치되고, 상기 제2 연결 회로부에 형성된 제3 연결 회로부는 상기 제1 연결 회로부에 형성된 제3 연결 회로부와 일렬로 배치되는 프레임 조립체.And the second connection circuit portion is disposed on the same line as the first connection circuit portion, and the third connection circuit portion formed on the second connection circuit portion is arranged in line with the third connection circuit portion formed on the first connection circuit portion.
  12. 제11항에 있어서,The method of claim 11,
    상기 셀 조립체는 상기 복수 개의 배터리 셀의 각 양단에 형성된 단자부가 직렬 또는 병렬로 적층되어 형성되고, 상기 버스바에 상기 단자부가 직접 접합되어 전기적으로 연결되는 프레임 조립체.The cell assembly may be formed by stacking terminal parts formed at both ends of the plurality of battery cells in series or in parallel, and directly connecting and electrically connecting the terminal parts to the bus bars.
  13. 제12항에 있어서,The method of claim 12,
    상기 버스바에는 상기 배터리 셀이 적층된 방향과 동일한 방향으로 삽입홀이 형성되고,Insertion holes are formed in the bus bar in the same direction in which the battery cells are stacked.
    상기 셀 조립체는 상기 복수 개의 배터리 셀이 병렬로 적층되고, 병렬로 적층된 상기 배터리 셀이 다시 직렬로 적층되어 형성되고, 상기 단자부가 상기 삽입홀에 삽입되어 상기 버스바와 전기적으로 연결되는 프레임 조립체.The cell assembly may include a plurality of battery cells stacked in parallel, and the battery cells stacked in parallel are again stacked in series, and the terminal unit is inserted into the insertion hole and electrically connected to the bus bar.
  14. 제13항에 있어서,The method of claim 13,
    상기 단자부는 상기 삽입홀을 관통하고, 관통되어 돌출되는 부분은 상기 버스바의 외측으로 접혀 레이져 용접되어 전기적으로 연결되는 프레임 조립체.The terminal portion penetrates the insertion hole, and a portion protruding therethrough is folded outside the bus bar to be laser welded and electrically connected.
  15. 제11항에 있어서,The method of claim 11,
    상기 제1 벤딩 라인은 상기 제1 연결 회로부와 나란하게 형성되고,The first bending line is formed in parallel with the first connection circuit portion,
    상기 제2 벤딩 라인은 상기 제1 벤딩 라인과 소정의 각도로 기울어지도록 형성되며,The second bending line is formed to be inclined at a predetermined angle with the first bending line,
    상기 제2 연결 회로부는 상기 제1 벤딩 라인 및 상기 제2 벤딩 라인을 따라 순차로 접혀, 상기 제1 연결 회로부와 동일선상에 배치되는 것을 특징으로 하는 프레임 조립체.And the second connection circuit part is sequentially folded along the first bending line and the second bending line, and arranged in the same line as the first connection circuit part.
  16. 제11항에 있어서,The method of claim 11,
    상기 측면 플레이트의 일 측에 밀착되어 고정되고, 상기 중심부의 단부를 덮는 보강플레이트를 더 포함하고,The reinforcement plate is fixed to one side of the side plate, and covers the end of the central portion,
    상기 상부 플레이트는 상기 경로홈을 따라 상기 중심부와 상기 경로홈의 이격을 방지하는 리브가 더 형성되는 프레임 조립체.The upper plate has a frame assembly further formed with a rib to prevent the separation between the center and the path groove along the path groove.
  17. 제16항에 있어서,The method of claim 16,
    상기 리브는 상기 경로홈의 양 측에 번갈아가며 서로 이격되도록 복수 개로 제공되는 것을 특징으로 하는 프레임 조립체.The rib assembly is provided with a plurality of spaced apart from each other alternately on both sides of the path groove.
  18. 제16항에 있어서,The method of claim 16,
    상기 측면 플레이트에는 상기 중심부가 배치되는 위치에 대응하여 융착돌기가 형성되고,The side plate is formed with a fusion projection corresponding to the position where the center is disposed,
    상기 중심부 및 상기 보강플레이트에는 상기 융착돌기의 위치에 대응하여 고정홀이 각각 형성되는 프레임 조립체.Frame centers are formed in the center and the reinforcing plate, respectively, fixing holes corresponding to the position of the fusion projections.
  19. 제11항에 있어서,The method of claim 11,
    상기 경로홈에 상기 중심부가 안착된 상태에서, 상기 중심부의 상측을 덮는 탑 커버를 더 포함하는 프레임 조립체.And a top cover covering the upper side of the center in a state where the center is seated in the path groove.
  20. 제11항에 있어서,The method of claim 11,
    상기 버스바에는 일정한 깊이로 파인 안착부가 형성되고,The bus bar is provided with a seating portion dug to a certain depth,
    일측은 상기 연성회로기판에 고정 결합되고, 타측은 상기 버스바에 접합되는 연결 단자를 더 포함하며,One side is fixedly coupled to the flexible circuit board, the other side further comprises a connection terminal bonded to the bus bar,
    상기 연결 단자는 The connection terminal is
    고정돌기가 형성되어 상기 제3 연결 회로부에 고정되는 고정부; 및A fixing part formed with a fixing protrusion to be fixed to the third connection circuit part; And
    상기 고정부에서 연장 형성되고, 상기 안착부에 배치되는 연결부를 포함하는 프레임 조립체.A frame assembly extending from the fixing portion, comprising a connecting portion disposed in the seating portion.
  21. 제20항에 있어서,The method of claim 20,
    상기 고정돌기는 상기 고정부의 양 측으로 이격되어 복수 개 형성되고, 미리 설정된 위치에서 상기 제3 연결 회로부를 관통하여 상기 연성회로기판과 전기적으로 연결되고, 관통되어 돌출되는 부분은 압착되어 휨 변형에 의해 고정되며,The fixing protrusions are spaced apart from both sides of the fixing portion, and the plurality of fixing protrusions are electrically connected to the flexible circuit board through the third connection circuit unit at a predetermined position, and the portions protruding from the fixing protrusions are compressed to prevent bending deformation. Is fixed by
    상기 연결부는 레이져 용접에 의해 상기 안착부에 접합되는 것을 특징으로 하는 프레임 조립체.And the connecting portion is joined to the seating portion by laser welding.
  22. 제20항에 있어서,The method of claim 20,
    상기 연결부는 체결 홀이 형성되도록 링 형상으로 형성되고,The connection portion is formed in a ring shape to form a fastening hole,
    상기 체결 홀을 관통하여 상기 안착부에 삽입되어 상기 연결 단자를 고정하는 체결 부재를 더 포함하는 프레임 조립체.And a fastening member penetrating the fastening hole and inserted into the seating part to fix the connection terminal.
  23. 제11항에 있어서,The method of claim 11,
    상기 제3 연결 회로부가 상기 버스바에 연결된 상태에서, 상기 제3 연결 회로부 및 상기 제3 연결 회로부 주변의 상기 버스바의 일부를 커버하도록 구성된 코팅부를 더 포함하는 프레임 조립체.And a coating part configured to cover the third connection circuit part and a portion of the bus bar around the third connection circuit part while the third connection circuit part is connected to the bus bar.
  24. 제11항에 있어서,The method of claim 11,
    상기 버스바에는 일정한 깊이로 파인 안착부가 형성되고,The bus bar is provided with a seating portion dug to a certain depth,
    상기 제3 연결 회로부의 일 면은 안착부에 접촉되는 것을 특징으로 하는 프레임 조립체.One surface of the third connection circuit portion is in contact with the seating frame assembly.
  25. 적어도 하나의 배터리 셀이 적층되어 형성되는 셀 조립체를 고정하기 위한 프레임 조립체에 있어서,A frame assembly for fixing a cell assembly formed by stacking at least one battery cell,
    상부 플레이트, 상기 상부 플레이트의 양 단에 연결되는 측면 플레이트를 포함하여 상기 셀 조립체를 감싸도록 배치되는 프레임;A frame disposed to surround the cell assembly including an upper plate and side plates connected to both ends of the upper plate;
    상기 측면 플레이트에 배치되어 고정되는 버스바;A bus bar disposed on and fixed to the side plate;
    상기 상부 플레이트와 상기 측면 플레이트를 따라 배치되어 상기 배터리 셀의 전압을 센싱하는 연성회로기판; 및A flexible circuit board disposed along the upper plate and the side plate to sense a voltage of the battery cell; And
    상기 측면 플레이트의 일 측에 밀착 고정되어 상기 연성회로기판의 단부를 덮는 보강플레이트를 포함하고,A reinforcing plate which is tightly fixed to one side of the side plate and covers an end of the flexible circuit board,
    상기 상부 플레이트는 저면에 일정한 깊이로 파인 보호홈이 형성되며,The upper plate is formed with a protective groove is dug to a certain depth on the bottom,
    상기 연성회로기판은,The flexible circuit board,
    외측으로 연장된 온도센싱부가 형성되고, 상기 보호홈에 수용되는 밴드 형상의 중심부;A temperature sensing unit extending outwardly and having a band-shaped central portion accommodated in the protective groove;
    상기 중심부의 양 단부에 형성되고, 서로 대향하도록 배치되는 제1 연결 회로부;First connection circuits formed at both ends of the center portion and disposed to face each other;
    상기 제1 연결 회로부의 양 단부에 연장되고, 상기 중심부와 나란하게 형성되는 제2 연결 회로부; 및Second connection circuit portions extending at both ends of the first connection circuit portion and formed to be parallel to the central portion; And
    상기 제1 연결 회로부 및 상기 제2 연결 회로부 각각으로부터 연장되어 버스바에 연결되는 제3 연결 회로부를 포함하고,A third connection circuit part extending from each of the first connection circuit part and the second connection circuit part and connected to a bus bar;
    상기 연성회로기판에는, 상기 제2 연결 회로부가 제1 벤딩 라인을 따라 상기 제1 연결 회로부를 향하여 접혀서 형성되는 제1 겹침부 및 상기 제2 연결 회로부가 제2 벤딩 라인을 따라 상기 제1 연결 회로부의 길이 방향으로 꺾어지도록 접혀서 형성되는 제2 겹침부를 포함하는 겹침부가 형성되고,The flexible printed circuit board may include a first overlapping part formed by folding the second connection circuit part toward the first connection circuit part along a first bending line and the first connection circuit part along the second bending line. An overlap portion is formed including a second overlap portion formed by being folded to be bent in the longitudinal direction of the cross section.
    상기 겹침부가 형성되는 경우,When the overlap is formed,
    상기 제2 연결 회로부는 상기 제1 연결 회로부와 평행하게 배치되고, 상기 제2 연결 회로부에 형성된 상기 제3 연결 회로부는 상기 제1 연결 회로부에 형성된 상기 제3 연결 회로부와 평행하게 배치되는 프레임 조립체.And the second connection circuit portion is disposed in parallel with the first connection circuit portion, and the third connection circuit portion formed in the second connection circuit portion is disposed in parallel with the third connection circuit portion formed in the first connection circuit portion.
  26. 제25항에 있어서,The method of claim 25,
    상기 보호홈과 상기 중심부의 사이 및 상기 제1 연결 회로부와 상기 제2 연결 회로부 사이에 형성되는 상기 겹침부는 접착제에 의해 밀착 고정되는 프레임 조립체.And the overlapping portion formed between the protective groove and the center portion and between the first connection circuit portion and the second connection circuit portion is tightly fixed by an adhesive.
  27. 제28항에 있어서,The method of claim 28,
    상기 상부 플레이트 및 상기 측면 플레이트 중 적어도 어느 하나에는 상기 보호홈의 위치에 대응하여 보호홀이 형성되고,At least one of the upper plate and the side plate is formed with a protective hole corresponding to the position of the protective groove,
    상기 중심부의 단부는 상기 보호홀을 관통하고, 구부러져서 상기 제3 연결 회로부가 상기 버스바의 외측면에 접합되는 프레임 조립체.An end portion of the central portion penetrates through the protection hole, and is bent to join the third connection circuit portion to an outer surface of the bus bar.
  28. 제34항에 있어서,The method of claim 34, wherein
    상기 측면 플레이트에는 상기 보호홀의 위치에 대응하여 융착돌기가 형성되고,The side plate is formed with a fusion projection corresponding to the position of the protective hole,
    상기 중심부 및 상기 보강플레이트에는 상기 융착돌기의 위치에 대응하여 고정홀이 각각 형성되는 프레임 조립체.Frame centers are formed in the center and the reinforcing plate, respectively, fixing holes corresponding to the position of the fusion projections.
  29. 제25항에 있어서,The method of claim 25,
    상기 버스바에는 제1 결합홀이 형성되고,A first coupling hole is formed in the bus bar,
    상기 제3 연결 회로부에는 제1 결합홀의 위치에 대응하여 제2 결합홀이 형성되며,A second coupling hole is formed in the third connection circuit part corresponding to the position of the first coupling hole.
    상기 제1 결합홀 및 상기 제2 결합홀을 관통하는 결합 부재를 더 포함하는 프레임 조립체The frame assembly further comprises a coupling member penetrating the first coupling hole and the second coupling hole.
  30. 제29항에 있어서,The method of claim 29,
    상기 버스바에는 일정한 깊이로 파인 안착홈; 형성되고,The bus bar has a recess recessed to a certain depth; Formed,
    상기 제1 결합홀은 상기 안착홈에 형성되며,The first coupling hole is formed in the seating groove,
    상기 제1 결합홀 및 상기 제2 결합홀은 각각 서로 이격되어 한 쌍으로 형성되는 것을 특징으로 하는 프레임 조립체.The first coupling hole and the second coupling hole are frame assembly, characterized in that formed in a pair spaced apart from each other.
  31. 제29항에 있어서,The method of claim 29,
    상기 결합 부재는 리벳인 것을 특징으로 하는 프레임 조립체.And the coupling member is a rivet.
PCT/KR2017/015594 2016-12-27 2017-12-27 Flexible circuit board and frame assembly including same WO2018124751A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
RS20210557A RS61814B1 (en) 2016-12-27 2017-12-27 Flexible circuit board and frame assembly including same
EP17888917.6A EP3565022B1 (en) 2016-12-27 2017-12-27 Flexible circuit board and frame assembly including same
CN201780081162.4A CN110114905B (en) 2016-12-27 2017-12-27 Flexible circuit board and bracket assembly comprising same
JP2019536176A JP6869355B2 (en) 2016-12-27 2017-12-27 Flexible circuit board and frame assembly containing it
US16/474,414 US11309593B2 (en) 2016-12-27 2017-12-27 Flexible circuit board and frame assembly including same
PL17888917T PL3565022T3 (en) 2016-12-27 2017-12-27 Flexible circuit board and frame assembly including same

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
KR10-2016-0180293 2016-12-27
KR10-2016-0180292 2016-12-27
KR1020160180292A KR101928065B1 (en) 2016-12-27 2016-12-27 Connecting structure of bus-bar assembly
KR1020160180293A KR101928073B1 (en) 2016-12-27 2016-12-27 Connecting structure of bus-bar assembly
KR10-2016-0182296 2016-12-29
KR1020160182296A KR101928066B1 (en) 2016-12-29 2016-12-29 Connecting structure of bus-bar assembly
KR10-2016-0183890 2016-12-30
KR1020160183890A KR101844852B1 (en) 2016-12-30 2016-12-30 Fpcb fixing structure of battery cell module
KR20170026828 2017-02-28
KR10-2017-0026828 2017-02-28
KR10-2017-0113677 2017-09-06
KR1020170113677A KR101996449B1 (en) 2017-09-06 2017-09-06 Battery cell module with protective structure of fpcb
KR10-2017-0141527 2017-10-27
KR1020170141527A KR102033001B1 (en) 2017-02-28 2017-10-27 Frame assembly, method of manufacturing frame assembly, and method of manufacturing battery module
KR10-2017-0141526 2017-10-27
KR1020170141526A KR102032999B1 (en) 2017-02-28 2017-10-27 Battery frame assembly and method for manufacturing same
KR1020170159696A KR102087699B1 (en) 2017-11-27 2017-11-27 Flexible circuit board and battery pack having the same
KR10-2017-0159696 2017-11-27

Publications (1)

Publication Number Publication Date
WO2018124751A1 true WO2018124751A1 (en) 2018-07-05

Family

ID=62710125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/015594 WO2018124751A1 (en) 2016-12-27 2017-12-27 Flexible circuit board and frame assembly including same

Country Status (1)

Country Link
WO (1) WO2018124751A1 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109888160A (en) * 2019-03-12 2019-06-14 深圳市易为派科技有限公司 Battery pack integration mould group electrical connector and its design technology method
US20190198952A1 (en) * 2017-12-26 2019-06-27 Sk Innovation Co., Ltd. Battery module and manufacturing method thereof
CN110911595A (en) * 2018-09-17 2020-03-24 中信国安盟固利动力科技有限公司 Battery module data acquisition structure and battery module with same
CN111971848A (en) * 2018-12-26 2020-11-20 株式会社Lg化学 Battery module configured to allow accurate temperature sensing, and battery pack and vehicle including the same
CN111989799A (en) * 2019-02-21 2020-11-24 株式会社Lg化学 Battery module including protective cover covering flexible printed circuit board
CN112119517A (en) * 2018-12-26 2020-12-22 株式会社Lg化学 Battery module having guide for restricting movement of bus bar frame, and battery pack and vehicle including the same
CN112997352A (en) * 2018-11-22 2021-06-18 株式会社自动网络技术研究所 Connection module
JP2021516850A (en) * 2018-12-26 2021-07-08 エルジー・ケム・リミテッド Battery module, battery pack containing the battery module and automobile including the battery pack
EP3783687A4 (en) * 2018-12-26 2021-07-14 Lg Chem, Ltd. Battery module having structure in which energy density is improved, and battery pack and vehicle comprising same
JP2021525445A (en) * 2019-01-08 2021-09-24 エルジー・ケム・リミテッド Battery module with foldable side plate and its manufacturing method
JP2021525436A (en) * 2018-10-10 2021-09-24 エルジー・ケム・リミテッド Battery module with space-saving ICB assembly
US20210320385A1 (en) * 2018-12-26 2021-10-14 Lg Chem, Ltd. Battery module comprising inner cover
US20210336307A1 (en) * 2019-02-18 2021-10-28 Lg Chem, Ltd. Battery Pack and Device Including the Same
EP3836285A4 (en) * 2018-12-26 2021-11-03 LG Chem, Ltd. Battery module having connector mounted on fpcb, and battery pack and vehicle comprising same
CN114128022A (en) * 2019-04-12 2022-03-01 株式会社Lg新能源 Battery module
CN114725524A (en) * 2022-04-29 2022-07-08 珠海市嘉德电能科技有限公司 Automatic folding and capability test equipment of lithium cell FPC
CN114747070A (en) * 2020-06-30 2022-07-12 东莞新能德科技有限公司 Battery, battery pack, and electronic device
US11973244B2 (en) 2018-12-26 2024-04-30 Lg Energy Solution, Ltd. Battery module having guide for restricting movement of busbar frame, and battery pack and vehicle comprising same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120003432A (en) * 2009-03-31 2012-01-10 산요덴키가부시키가이샤 Battery module, battery system, and electric vehicle
JP2013097894A (en) * 2011-10-28 2013-05-20 Auto Network Gijutsu Kenkyusho:Kk Battery wiring module
KR101329252B1 (en) * 2012-07-11 2013-11-13 한국단자공업 주식회사 Series connection apparatus of battery module
KR20140090077A (en) * 2013-01-08 2014-07-16 삼성에스디아이 주식회사 Battery module
JP5715766B2 (en) * 2010-04-22 2015-05-13 矢崎総業株式会社 Wiring material connection structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120003432A (en) * 2009-03-31 2012-01-10 산요덴키가부시키가이샤 Battery module, battery system, and electric vehicle
JP5715766B2 (en) * 2010-04-22 2015-05-13 矢崎総業株式会社 Wiring material connection structure
JP2013097894A (en) * 2011-10-28 2013-05-20 Auto Network Gijutsu Kenkyusho:Kk Battery wiring module
KR101329252B1 (en) * 2012-07-11 2013-11-13 한국단자공업 주식회사 Series connection apparatus of battery module
KR20140090077A (en) * 2013-01-08 2014-07-16 삼성에스디아이 주식회사 Battery module

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190198952A1 (en) * 2017-12-26 2019-06-27 Sk Innovation Co., Ltd. Battery module and manufacturing method thereof
CN110911595A (en) * 2018-09-17 2020-03-24 中信国安盟固利动力科技有限公司 Battery module data acquisition structure and battery module with same
JP7119126B2 (en) 2018-10-10 2022-08-16 エルジー エナジー ソリューション リミテッド Battery module applying space-saving ICB assembly
JP2021525436A (en) * 2018-10-10 2021-09-24 エルジー・ケム・リミテッド Battery module with space-saving ICB assembly
CN112997352A (en) * 2018-11-22 2021-06-18 株式会社自动网络技术研究所 Connection module
CN112997352B (en) * 2018-11-22 2023-12-29 株式会社自动网络技术研究所 Connection module
EP3836285A4 (en) * 2018-12-26 2021-11-03 LG Chem, Ltd. Battery module having connector mounted on fpcb, and battery pack and vehicle comprising same
JP7044897B2 (en) 2018-12-26 2022-03-30 エルジー エナジー ソリューション リミテッド Battery module, battery pack containing the battery module and automobile including the battery pack
US11973244B2 (en) 2018-12-26 2024-04-30 Lg Energy Solution, Ltd. Battery module having guide for restricting movement of busbar frame, and battery pack and vehicle comprising same
US20210194098A1 (en) * 2018-12-26 2021-06-24 Lg Chem, Ltd. Battery Module Having Guide for Restricting Movement of Busbar Frame, and Battery Pack and Vehicle Comprising Same
JP2021516850A (en) * 2018-12-26 2021-07-08 エルジー・ケム・リミテッド Battery module, battery pack containing the battery module and automobile including the battery pack
EP3783687A4 (en) * 2018-12-26 2021-07-14 Lg Chem, Ltd. Battery module having structure in which energy density is improved, and battery pack and vehicle comprising same
JP2021521607A (en) * 2018-12-26 2021-08-26 エルジー・ケム・リミテッド Battery modules with a structure capable of accurate temperature sensing, battery packs and automobiles including them
JP2021523532A (en) * 2018-12-26 2021-09-02 エルジー・ケム・リミテッド Battery module with guides to limit movement of busbar frame, battery pack and car including it
US11967736B2 (en) * 2018-12-26 2024-04-23 Lg Energy Solution, Ltd. Battery module comprising including chamfered inner cover and chamfered housing to prevent damage during assembly
CN112119517A (en) * 2018-12-26 2020-12-22 株式会社Lg化学 Battery module having guide for restricting movement of bus bar frame, and battery pack and vehicle including the same
US20210320385A1 (en) * 2018-12-26 2021-10-14 Lg Chem, Ltd. Battery module comprising inner cover
EP3828986A4 (en) * 2018-12-26 2021-10-27 LG Chem, Ltd. Battery module structured so as to allow accurate temperature sensing, and battery pack and motor vehicle comprising same
EP3836246A4 (en) * 2018-12-26 2021-10-27 LG Chem, Ltd. Battery module having guide for restricting movement of busbar frame, and battery pack and vehicle comprising same
US11888125B2 (en) 2018-12-26 2024-01-30 Lg Energy Solution, Ltd. Battery module having connector mounted on FPCB, and battery pack and vehicle comprising same
CN111971848A (en) * 2018-12-26 2020-11-20 株式会社Lg化学 Battery module configured to allow accurate temperature sensing, and battery pack and vehicle including the same
JP7237090B2 (en) 2018-12-26 2023-03-10 エルジー エナジー ソリューション リミテッド A battery module having a structure capable of accurate temperature sensing, a battery pack including the same, and an automobile
CN112119517B (en) * 2018-12-26 2023-01-10 株式会社Lg新能源 Battery module, battery pack including the same, and vehicle
JP7060715B2 (en) 2018-12-26 2022-04-26 エルジー エナジー ソリューション リミテッド Battery modules with guides that limit the movement of the busbar frame, battery packs and cars that include them
JP7062794B2 (en) 2019-01-08 2022-05-06 エルジー エナジー ソリューション リミテッド Battery module with foldable side plate and its manufacturing method
JP2021525445A (en) * 2019-01-08 2021-09-24 エルジー・ケム・リミテッド Battery module with foldable side plate and its manufacturing method
US20210336307A1 (en) * 2019-02-18 2021-10-28 Lg Chem, Ltd. Battery Pack and Device Including the Same
US11817594B2 (en) 2019-02-21 2023-11-14 Lg Energy Solution, Ltd. Battery module including protection cover covering flexible printed circuit board
EP3761396A4 (en) * 2019-02-21 2021-06-02 Lg Chem, Ltd. Battery module including protective cover for covering flexible printed circuit board
CN111989799A (en) * 2019-02-21 2020-11-24 株式会社Lg化学 Battery module including protective cover covering flexible printed circuit board
US20210098846A1 (en) * 2019-02-21 2021-04-01 Lg Chem, Ltd. Battery module including protection cover covering flexible printed circuit board
CN109888160A (en) * 2019-03-12 2019-06-14 深圳市易为派科技有限公司 Battery pack integration mould group electrical connector and its design technology method
JP7143009B2 (en) 2019-04-12 2022-09-28 エルジー エナジー ソリューション リミテッド battery module
JP2022519501A (en) * 2019-04-12 2022-03-24 エルジー エナジー ソリューション リミテッド Battery module
CN114128022A (en) * 2019-04-12 2022-03-01 株式会社Lg新能源 Battery module
CN114128022B (en) * 2019-04-12 2024-04-05 株式会社Lg新能源 Battery module
EP3930028A4 (en) * 2019-04-12 2022-05-11 LG Energy Solution, Ltd. Battery module
CN114747070A (en) * 2020-06-30 2022-07-12 东莞新能德科技有限公司 Battery, battery pack, and electronic device
CN114747070B (en) * 2020-06-30 2024-03-19 东莞新能德科技有限公司 Battery, battery assembly, battery pack and electronic device
CN114725524A (en) * 2022-04-29 2022-07-08 珠海市嘉德电能科技有限公司 Automatic folding and capability test equipment of lithium cell FPC

Similar Documents

Publication Publication Date Title
WO2018124751A1 (en) Flexible circuit board and frame assembly including same
WO2018124494A2 (en) Bus bar assembly and frame assembly
WO2019088714A1 (en) Battery module comprising bus bar assembly
WO2019098588A1 (en) Battery module comprising sensing assembly and busbar assembly
WO2017052296A1 (en) Battery module
WO2020096221A1 (en) Battery pack comprising mounting structure
WO2017179943A1 (en) Device for fixing camera module circuit board, and camera module
WO2018128404A1 (en) Chassis components, vehicle battery system integrally formed with chassis components, and integrated battery system vehicle comprising same
WO2019225882A1 (en) Electrode lead assembly for secondary battery and method for manufacturing same
WO2016129888A1 (en) Battery module and method for connecting first and second electric terminals of first and second battery cells to voltage sensing member of interconnecting assembly
WO2022177371A1 (en) Battery, and battery pack and vehicle comprising same
WO2022191683A1 (en) Bus bar assembly, battery pack comprising bus bar assembly, and vehicle comprising battery pack
WO2022220654A1 (en) Secondary battery
WO2016129889A1 (en) Battery module and method for connecting first and second electric terminals of first and second battery cells to first voltage detecting member and second voltage detecting member of interconnecting assembly
WO2019132155A1 (en) Battery module
WO2023100164A1 (en) Battery module having a laminated busbar assembly
WO2020040590A1 (en) Coreless contactless current measurement system
WO2023243988A1 (en) Electrode assembly, and method for manufacturing electrode assembly
WO2023234733A1 (en) Battery pack
WO2022239933A1 (en) Battery module and battery pack including same
WO2024039192A1 (en) Battery module and battery pack comprising same
WO2023121416A1 (en) Battery module with reinforced safety
WO2023146275A1 (en) Current collecting plate and cylindrical secondary battery including same
WO2023128463A1 (en) Battery pack
WO2023243989A1 (en) Battery module and method for manufacturing battery module

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17888917

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019536176

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2017888917

Country of ref document: EP

Effective date: 20190729