WO2018124411A1 - 레이저 리플로우 방법 - Google Patents

레이저 리플로우 방법 Download PDF

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Publication number
WO2018124411A1
WO2018124411A1 PCT/KR2017/006605 KR2017006605W WO2018124411A1 WO 2018124411 A1 WO2018124411 A1 WO 2018124411A1 KR 2017006605 W KR2017006605 W KR 2017006605W WO 2018124411 A1 WO2018124411 A1 WO 2018124411A1
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WO
WIPO (PCT)
Prior art keywords
temperature
laser
laser beam
electronic component
irradiating
Prior art date
Application number
PCT/KR2017/006605
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
최재준
김기석
이영진
김병록
Original Assignee
크루셜머신즈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 크루셜머신즈 주식회사 filed Critical 크루셜머신즈 주식회사
Publication of WO2018124411A1 publication Critical patent/WO2018124411A1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Definitions

  • the present invention relates to a laser reflow method, and more particularly, to a laser reflow method capable of irradiating a homogenized laser beam, easily adjusting the irradiation area, and obtaining a bonding result with excellent durability.
  • a reflow apparatus is used to attach an electronic component element such as a semiconductor chip or a device including an integrated circuit (IC), a transistor (TR), a resistor (R), and a capacitor (C) to a printed circuit board.
  • IC integrated circuit
  • TR transistor
  • R resistor
  • C capacitor
  • reflow devices are classified into mass reflow devices and laser reflow devices.
  • a mass reflow device mounts a plurality of substrates to which a solder material such as solder balls, solder pads, or solder pastes are attached on a conveyor belt, and drives the conveyor belt.
  • the substrate passes through a heating section with an infrared heater or ceramic heater along the driven conveyor belt.
  • the infrared heater is provided on the upper side and the lower side of the conveyor belt, the infrared heater attaches the semiconductor element to the substrate by applying heat to the solder ball on the substrate.
  • the electronic component device or device is subjected to thermal stress for about 210 seconds at a high temperature between about 50 ° C and up to about 230 to 290 ° C. Therefore, the electronic component element or device may be damaged by heat, and thus there is a problem in that the characteristics or lifespan of the electronic component element or device are deteriorated.
  • the infrared heater takes about 3 to 10 minutes (min) to heat the solder ball to couple the electronic component device or device to the substrate, which is not economical.
  • the mass reflow process may cause defects by applying heat even to a device that is susceptible to heat among the devices attached to the substrate, and may cause heat deformation on the substrate because heat is applied to the entire substrate.
  • the laser reflow apparatus converts a spot laser beam transmitted through an optical fiber from a laser oscillator and a laser oscillator that outputs a laser beam into a plane laser beam through a plurality of lenses, and then irradiates the converted laser beam. It includes a beam irradiation unit.
  • the laser beam output from the laser oscillator generates a Gaussian function distribution in which the highest energy is generated at the center of the irradiation area, and the energy is rapidly decreased as it is moved away from the center of the irradiation area. Therefore, when the reflow process is applied in a state where the energy of the laser beam has a Gaussian function distribution, the center of the irradiation area receives excessive energy and thermal deformation occurs. It may not be fixed to the substrate. An apparatus for converting such a laser beam into a planar laser beam through a plurality of lenses has been developed.
  • Korean Patent No. 10-1012959 (hereinafter referred to as 'prior document 1') includes a lens array for dividing a laser beam in a predetermined direction, and a first convex cylindrical lens for synthesizing the laser beam divided by the lens array.
  • a laser irradiation apparatus arranged to condense at a plurality of points between waveguides. According to the prior document 1, a square laser beam or a rectangular laser beam can be formed by changing the width
  • Korean Patent No. 10-0777575 discloses a technique for connecting an electronic component including an electronic chip to the surface of a glass substrate or film of a flat panel display device using a laser.
  • a first step of generating a laser beam of a predetermined wavelength a second step of pressing the substrate and the electronic component with each other, and a connection medium by irradiating the substrate and the electronic component with the laser beam generated in the first step
  • the laser beam used in the first step or the third step is a line beam or an area beam. It is used in the form, and in the third step, the output of the laser is controlled from the continuous form to the pulse form so as to maintain a constant curing temperature after reaching the curing temperature of the connection medium to control the increase in temperature.
  • the laser reflow apparatus has excellent durability when bonding an electronic component such as a semiconductor chip or a device including an integrated circuit (IC), a transistor (TR), a resistor (R), and a capacitor (C) to a printed circuit board. You should be able to get results.
  • the printed circuit board is a flexible substrate, when repeated thermal stress is applied to the printed circuit board, the electronic component elements or devices bonded to the printed circuit board are damaged or dislodged.
  • the present invention provides a laser reflow method in which breakage does not easily occur at an interface between a conductive bump and a solder part even after repeated thermal stress is applied to a printed circuit board after bonding.
  • the present invention is to provide a laser reflow method that can increase the manufacturing efficiency by reducing the time to bond the electronic component device or device to the substrate.
  • FIG. 2 is an exemplary diagram for describing a conductive bump and a solder portion of an electronic component die.
  • the temperature ramp-up step S111 may further include a preheating step of preheating the printed circuit board to prevent the solder part of the electronic component device or the device from splashing during the bonding process.
  • the preheating step may be, for example, in the case of a semiconductor, when the printed circuit board is seated on the stage, to heat up the stage.
  • the preheating step may be implemented to preheat the electronic component device or device to about 60 ° C. or more and 170 ° C. or less by irradiating the laser beam with 0.5 second or more and 1 second or less. Can be.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/KR2017/006605 2016-12-28 2017-06-22 레이저 리플로우 방법 WO2018124411A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160180823A KR20180076544A (ko) 2016-12-28 2016-12-28 레이저 리플로우 방법
KR10-2016-0180823 2016-12-28

Publications (1)

Publication Number Publication Date
WO2018124411A1 true WO2018124411A1 (ko) 2018-07-05

Family

ID=62709598

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/006605 WO2018124411A1 (ko) 2016-12-28 2017-06-22 레이저 리플로우 방법

Country Status (3)

Country Link
KR (1) KR20180076544A (zh)
TW (1) TW201822930A (zh)
WO (1) WO2018124411A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240009171A (ko) * 2022-07-13 2024-01-22 성균관대학교산학협력단 솔더 범프의 형성 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025166A (ko) * 1997-09-11 1999-04-06 구자홍 레이저 납땜 장치 및 그 방법
US20040047127A1 (en) * 2000-12-28 2004-03-11 Akira Yamauchi Method of mounting chip
JP2004207645A (ja) * 2002-12-26 2004-07-22 Matsushita Electric Ind Co Ltd リフローはんだ付け方法およびはんだ付け装置
KR20120037543A (ko) * 2010-10-12 2012-04-20 주식회사 엘티에스 레이저 모듈을 이용한 인라인 리플로우 장치 및 리플로우 방법
KR20160115045A (ko) * 2015-03-25 2016-10-06 주식회사 제이스텍 플렉시블 디스플레이와 전자부품의 레이져 본딩방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025166A (ko) * 1997-09-11 1999-04-06 구자홍 레이저 납땜 장치 및 그 방법
US20040047127A1 (en) * 2000-12-28 2004-03-11 Akira Yamauchi Method of mounting chip
JP2004207645A (ja) * 2002-12-26 2004-07-22 Matsushita Electric Ind Co Ltd リフローはんだ付け方法およびはんだ付け装置
KR20120037543A (ko) * 2010-10-12 2012-04-20 주식회사 엘티에스 레이저 모듈을 이용한 인라인 리플로우 장치 및 리플로우 방법
KR20160115045A (ko) * 2015-03-25 2016-10-06 주식회사 제이스텍 플렉시블 디스플레이와 전자부품의 레이져 본딩방법

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TW201822930A (zh) 2018-07-01
KR20180076544A (ko) 2018-07-06

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