WO2018121289A1 - Mems sensor packaging structure and fabricating method thereof - Google Patents

Abstract

A MEMS sensor packaging structure and a fabricating method thereof. The MEMS sensor packaging structure comprises: a substrate comprising a first surface, an opposite second surface, and an interconnect circuit; and a gyroscope sensor, an accelerometer sensor, and a magnetic induction sensor. All the gyroscope sensor, accelerometer sensor, and magnetic induction sensor comprise top sides and opposite rear sides. The top side of the gyroscope sensor comprises a first external pad. The top side of the accelerometer sensor comprises a second external pad. The top side of the magnetic induction sensor comprises a third external pad. The gyroscope sensor and the accelerometer sensor are mounted on the first surface of the substrate. The first external pad of the gyroscope sensor is electrically connected to a first interconnect circuit. The second external pad of the accelerometer sensor is electrically connected to a second interconnect circuit. The magnetic induction sensor is mounted on the second surface of the substrate. The third external pad of the magnetic induction sensor is electrically connected to the interconnect circuit. The packaging structure in the invention implements integrated packaging of sensors and achieves a reduced size thereof.

Description

MEMS sensor package structure and forming method thereof

The present application claims the priority of the following two Chinese patent applications, the entire contents of which are hereby incorporated by reference:

1. The application date is 2016-12-30, the application number is 201611264764.7, and the invention name is “MEMS sensor package structure and its forming method”;

2. The application date is 2016-12-30, the application number is 201621483484.0, and the invention name is “MEMS sensor package structure”.

Technical field

The present invention relates to the field of semiconductor technologies, and in particular, to a MEMS sensor package structure and a method of forming the same.

Background technique

Since the end of the 1980s, with the development of Micro-Electro-Mechanical-System (MEMS) technology, various sensors have been miniaturized.

At present, many applications of various sensors mainly include MEMS acceleration sensors, MEMS gyro sensors and MEMS magnetic induction sensors. The MEMS accelerometer is a device for detecting acceleration, the MEMS gyroscope sensor is a device for detecting acceleration, and the MEMS magnetic sensor is a device for measuring a magnetic field in a space.

At present, MEMS accelerometers, MEMS gyro sensors and MEMS magnetic sensors have been applied in mobile phones or automotive electronics. However, MEMS accelerometers, MEMS gyroscope sensors and MEMS magnetic sensors are designed separately and then packaged separately. . Since various sensors are separately designed and packaged independently, the existing MEMS devices are bulky and costly.

Summary of the invention

The problem solved by the present invention is how to reduce the volume of the MEMS device and realize an integrated package of the acceleration sensor, the gyro sensor and the magnetic induction sensor.

To solve the above problems, the technical solution of the present invention provides a method for forming a MEMS sensor package structure, including:

Providing a substrate including a first surface and an opposite second surface, the substrate having an interconnection; providing a gyro sensor, an acceleration sensor, and a magnetic induction sensor, the gyro sensor, the acceleration sensor, and the magnetic induction sensor each including a front surface And the opposite back surface, the front surface of the gyro sensor includes a plurality of first external pads, the front surface of the acceleration sensor includes a plurality of second external pads, and the front surface of the magnetic induction sensor includes a plurality of third external pads; The gyro sensor and the acceleration sensor are respectively mounted on the first surface of the substrate, and the first external pad of the gyro sensor is electrically connected to the interconnection through the first metal connection structure, and the second external pad of the acceleration sensor passes through the second metal The connection structure is electrically connected to the interconnection line; the magnetic induction sensor is mounted on the second surface of the substrate, and the third external connection pad of the magnetic induction sensor is electrically connected to the interconnection through the third metal connection structure; Forming a plurality of solder bumps on the surface, the solder bumps and interconnect lines It is electrically connected to solder bumps for connection with an external circuit.

Optionally, the interconnection line includes a first interconnection line and a second interconnection line in the substrate, and a metal circuit layer on the second surface, the first interconnection line, the second interconnection line, and the metal The circuit layers are insulated from each other, and the first external pads of the gyro sensor are electrically connected to the first interconnection through the first metal connection structure, and the second external pads of the acceleration sensor are electrically connected to the second interconnection through the second metal connection structure Connecting, the third external pad of the magnetic induction sensor is electrically connected to the metal circuit layer through the third metal connection structure; forming a plurality of solder bumps on the second surface of the substrate, the welder protrusion including the first solder bump a second solder bump and a third solder bump, the first solder bump is electrically connected to the first interconnecting line, the second solder bump is electrically connected to the second interconnecting line, and the third solder bump is connected to the metal The circuit layer is electrically connected.

Optionally, the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal wires, and the two ends of the first metal connection structure are respectively connected to the first external connection The pad is electrically connected to the first interconnecting line, and a middle portion of the first metal connecting structure is suspended on both sides of the gyro sensor, and two ends of the second metal connecting structure are electrically connected to the second external pad and the second interconnecting line, respectively The middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor.

Optionally, the method further includes: forming a dispensing layer covering at least the metal wire.

Optionally, after forming the dispensing layer, the magnetic induction sensor is mounted on the second surface of the substrate; after the magnetic induction sensor is mounted on the second surface of the substrate, forming a plurality on the second surface of the substrate Welding bumps.

Optionally, the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, the first metal connection structure penetrates the back surface and a portion of the thickness of the gyro sensor, and is soldered to the first external surface of the front surface of the gyro sensor. The disk is electrically connected, and the second metal connecting structure penetrates the back surface and the partial thickness of the acceleration sensor, and is electrically connected to the second external pad of the front surface of the acceleration sensor.

Optionally, the gyro sensor and the acceleration sensor are respectively flipped on the first surface of the substrate, the first metal connection structure is located on a surface of the first external connection pad, and the second metal connection structure is located on the second external connection pad s surface.

Optionally, the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the gyro sensor further includes an angular velocity sensing area. The front surface of the gyro sensor has a first sealing cover, and the first sealing cover is sealed. In the angular velocity sensing area, a plurality of first external pads are located on both sides of the first sealing cover; the acceleration sensor further includes an acceleration sensing area, the second surface of the acceleration sensor has a second sealing cover, and the second sealing cover seals the acceleration sensing area, A plurality of second outer pads are located on both sides of the second sealing cover.

Optionally, the magnetic induction sensor is flipped on the second surface of the substrate, the third metal connection structure is located on the surface of the third external connection pad; or the back surface of the magnetic induction sensor is attached to the second surface of the substrate, The three metal connection structure is a metal wire, and the two ends of the third metal connection structure are electrically connected to the third outer pad and the metal layer respectively, and the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor; or the back of the magnetic induction sensor Attached to the second surface of the substrate, the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor and is electrically connected to the third external connection pad on the front surface of the magnetic induction sensor.

Optionally, the data processing chip is further included, and the data processing chip is electrically connected to the interconnection.

Optionally, the interconnection line includes a third interconnection line and a fourth interconnection line located in the substrate, and a plurality of first metal circuit layers and a plurality of second metal circuit layers on the second surface of the substrate, The three interconnect lines, the fourth interconnect line, the first metal line layer and the second metal line layer are insulated from each other; the first external pad of the gyro sensor is electrically connected to the third interconnect line through the first metal connection structure The second external pad of the acceleration sensor is electrically connected to the fourth interconnection through the second metal connection structure; the third external pad of the magnetic induction sensor is electrically connected to the first metal circuit layer through the third metal connection structure; the data processing chip Mounted on the second surface of the substrate, the data processing chip is electrically connected to the third interconnecting line, the fourth interconnecting line, the first metal wiring layer and the second metal wiring layer; the solder bump is located on the second surface of the substrate The surface of the two metal circuit layers.

Optionally, the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal wires, and the two ends of the first metal connection structure are respectively connected to the first external connection The pad and the third interconnection are electrically connected, and a middle portion of the first metal connection structure is suspended on both sides of the gyro sensor, and two ends of the second metal connection structure are electrically connected to the second external pad and the fourth interconnection line, respectively a middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor; or the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure penetrates the back surface and the portion of the gyro sensor a thickness and electrically connected to the first external pad of the front surface of the gyro sensor, the second metal connection structure penetrating through the back surface and the partial thickness of the acceleration sensor, and electrically connected to the second external pad of the front surface of the acceleration sensor; The gyro sensor and the acceleration sensor are respectively flipped on the first surface of the substrate, the first metal connection Located on the external surface of the first pad, the second surface of the second metal structure is located external connection pad.

Optionally, after the step of mounting the gyro sensor and the acceleration sensor on the first surface of the substrate and the second surface of the substrate, the method further comprises: forming a glue covering at least the metal wire Floor.

Optionally, the signal processing chip is flipped on the second surface of the substrate; or the back surface of the signal processing chip is attached to the second surface of the substrate, and the signal processing chip passes through the metal wire and the third interconnection The fourth interconnecting line and the second metal wiring layer are electrically connected.

Optionally, the interconnection line includes a fifth interconnection line and a sixth interconnection line located in the substrate, and a plurality of third metal circuit layers and a plurality of fourth metal circuit layers located on the first surface of the substrate, and a fifth The interconnection line, the sixth interconnection line, the third metal circuit layer and the fourth metal circuit layer are insulated from each other; the first external pad of the gyro sensor is electrically connected to the third metal circuit layer through the first metal connection structure, the acceleration sensor The second external pad is electrically connected to the fourth metal circuit layer through the second metal connection structure; the third external connection pad of the magnetic induction sensor is electrically connected to the fifth interconnection line through the third metal connection structure; the data processing chip is mounted on the substrate a first surface, the data processing chip is electrically connected to the third metal circuit layer, the fourth metal circuit layer, the fifth interconnection, and the sixth interconnection; the interconnection further includes a second surface on the substrate a plurality of fifth metal circuit layers, the fifth metal circuit layer is electrically connected to the sixth interconnection circuit, the solder bumps are located on the surface of the fifth metal circuit layer, and the fifth metal circuit layer Connection.

Optionally, the method further includes a first data processing chip, a second data processing chip, and a third data processing chip, the first data processing chip is electrically connected to the gyro sensor, and the second data processing chip is electrically connected to the acceleration sensor The third data processing chip is electrically connected to the magnetic induction sensor.

Optionally, the interconnection line includes a first interconnection line and a second interconnection line in the substrate, and a metal circuit layer on the second surface of the substrate; the first external connection pad of the gyro sensor passes the a metal connection structure is electrically connected to the first interconnection line, and the second external connection pad of the acceleration sensor is electrically connected to the second interconnection line through the second metal connection structure; the third external connection pad of the magnetic induction sensor passes through the third metal connection structure Electrically connecting with the metal circuit layer; forming a solder bump on the second surface of the substrate, the solder bump including the first solder bump, the second solder bump and the third solder bump, the first solder bump and the first The interconnection line is electrically connected, the second solder bump is electrically connected to the second interconnecting line, and the third solder bump is electrically connected to the metal wiring layer.

Optionally, the front surface of the gyro sensor has a plurality of first internal pads and a first external pad, the first data processing chip is located on the front surface of the gyro sensor, the first data processing chip and the first internal pad and the first The external pad is electrically connected. The front surface of the acceleration sensor has a plurality of second internal pads and a second external pad. The second data processing chip is located on the front surface of the acceleration sensor, and the second data processing chip is connected to the second internal pad and the second external connection. The pad is electrically connected, the front surface of the magnetic induction sensor has a third inner pad and a third outer pad, the third data processing chip is located on the front surface of the magnetic induction sensor, and the third data processing chip and the third inner pad and the third outer pad Electrical connection.

Optionally, the first data processing chip includes a front surface and an opposite back surface, and the front surface of the first data processing chip has an input pad and an output pad, and the input pad of the first data processing chip is connected through the fourth metal The structure is electrically connected to the first internal pad, the output pad of the first data processing chip is electrically connected to the first external pad through a fifth metal connection structure, the second data processing chip includes a front surface and an opposite back surface, and the input solder The disk and the output pad are located on the front side of the second data processing chip, the input pad of the second data processing chip is electrically connected to the second internal pad through the sixth metal connection structure, and the output pad of the second data processing chip passes the seventh The metal connection structure is electrically connected to the second external processing pad, the third data processing chip includes a front surface and an opposite back surface, the input pad and the output pad are located on the front side of the third data processing chip, and the input processing of the third data processing chip The disk is electrically connected to the third internal pad through the eighth metal connection structure, and the output pad of the third data processing chip passes through the ninth metal connection structure and the External pads are electrically connected.

Optionally, the back surface of the first data processing chip is attached to the front surface of the gyro sensor, the back surface of the second data processing chip is attached to the front surface of the acceleration sensor, and the back surface of the third data processing chip is attached to the magnetic induction sensor. Front side; or the first data processing chip is flipped on the front side of the gyro sensor, the second data processing chip is flipped on the front side of the acceleration sensor, and the third data processing chip is flipped on the front side of the magnetic induction sensor on-.

Optionally, the back surface of the first data processing chip is attached to the front surface of the gyro sensor, the back surface of the second data processing chip is attached to the front surface of the acceleration sensor, and the back surface of the third data processing chip is attached to the magnetic induction sensor. The front side of the first data processing chip, the second data processing chip, and the third data processing chip form a groove.

Optionally, the gyro sensor is a three-axis gyro sensor, the acceleration sensor is a three-axis acceleration sensor, and the magnetic induction sensor is a three-axis magnetic induction sensor.

The invention also provides a MEMS sensor package structure, comprising:

a substrate including a first surface and an opposite second surface, the substrate having interconnection lines; a gyro sensor, an acceleration sensor, and a magnetic induction sensor, the gyro sensor, the acceleration sensor, and the magnetic induction sensor each including a front surface and a relative The front surface of the gyro sensor includes a plurality of first external pads, the front surface of the acceleration sensor includes a plurality of second external pads, and the front surface of the magnetic induction sensor includes a plurality of third external pads; the gyroscope The sensor and the acceleration sensor are mounted on the first surface of the substrate, and the first external pad of the gyro sensor is electrically connected to the interconnection through the first metal connection structure, and the second external connection pad of the acceleration sensor passes through the second metal connection structure and Connecting the magnetic connection sensor; the magnetic induction sensor is mounted on the second surface of the substrate; the third external connection pad of the magnetic induction sensor is electrically connected to the interconnection through the third metal connection structure; and a plurality of solder bumps on the second surface of the substrate The solder bump is electrically connected to the interconnecting line, and the solder bump is It is electrically connected to an external circuit.

Optionally, the interconnection line includes a first interconnection line and a second interconnection line in the substrate, and a metal circuit layer on the second surface, the first interconnection line, the second interconnection line, and the metal The circuit layers are insulated from each other, and the first external pads of the gyro sensor are electrically connected to the first interconnection through the first metal connection structure, and the second external pads of the acceleration sensor are electrically connected to the second interconnection through the second metal connection structure Connecting, the third external pad of the magnetic induction sensor is electrically connected to the metal circuit layer through the third metal connection structure; a plurality of solder bumps on the second surface of the substrate, the welder protrusion including the first solder bump, the second a solder bump and a third solder bump, the first solder bump is electrically connected to the first interconnecting line, the second solder bump is electrically connected to the second interconnecting line, and the third solder bump is electrically connected to the metal wiring layer connection.

Optionally, the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal wires, and the two ends of the first metal connection structure are respectively connected to the first external connection The pad is electrically connected to the first interconnecting line, and a middle portion of the first metal connecting structure is suspended on both sides of the gyro sensor, and two ends of the second metal connecting structure are electrically connected to the second external pad and the second interconnecting line, respectively a middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor; or the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure penetrates the back surface and the portion of the gyro sensor a thickness and electrically connected to the first external pad of the front surface of the gyro sensor, the second metal connection structure penetrating through the back surface and the partial thickness of the acceleration sensor, and electrically connected to the second external pad of the front surface of the acceleration sensor; The gyro sensor and the acceleration sensor are respectively flipped on the first surface of the substrate, the first metal connection The surface is located on the surface of the first external pad, and the second metal connection structure is located on the surface of the second external pad.

Optionally, the method further includes: sealing at least the dispensing layer of the metal wire.

Optionally, the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the gyro sensor further includes an angular velocity sensing area. The front surface of the gyro sensor has a first sealing cover, and the first sealing cover is sealed. In the angular velocity sensing area, a plurality of first external pads are located on both sides of the first sealing cover; the acceleration sensor further includes an acceleration sensing area, the second surface of the acceleration sensor has a second sealing cover, and the second sealing cover seals the acceleration sensing area, A plurality of second outer pads are located on both sides of the second sealing cover.

Optionally, the magnetic induction sensor is flipped on the second surface of the substrate, the third metal connection structure is located on the surface of the third external connection pad; or the back surface of the magnetic induction sensor is attached to the second surface of the substrate, The three metal connection structure is a metal wire, and two ends of the third metal connection structure are respectively electrically connected to the third external pad and the metal circuit layer, and a middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor; or the magnetic induction sensor The back surface is adhered to the second surface of the substrate, and the third metal connecting structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor and is electrically connected to the third external pad of the front surface of the magnetic induction sensor.

Optionally, the data processing chip is further included, and the data processing chip is electrically connected to the interconnection.

Optionally, the interconnection line includes a third interconnection line and a fourth interconnection line located in the substrate, and a plurality of first metal circuit layers and a plurality of second metal circuit layers on the second surface of the substrate, The three interconnect lines, the fourth interconnect line, the first metal line layer and the second metal line layer are insulated from each other; the first external pad of the gyro sensor is electrically connected to the third interconnect line through the first metal connection structure The second external pad of the acceleration sensor is electrically connected to the fourth interconnection through the second metal connection structure; the third external pad of the magnetic induction sensor is electrically connected to the first metal circuit layer through the third metal connection structure; the data processing chip Mounted on the second surface of the substrate, the data processing chip is electrically connected to the third interconnecting line, the fourth interconnecting line, the first metal wiring layer and the second metal wiring layer; the solder bump is located on the second surface of the substrate The surface of the two metal circuit layers is electrically connected to the second metal circuit layer.

Optionally, the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal wires, and the two ends of the first metal connection structure are respectively connected to the first external connection The pad and the third interconnection are electrically connected, and a middle portion of the first metal connection structure is suspended on both sides of the gyro sensor, and two ends of the second metal connection structure are electrically connected to the second external pad and the fourth interconnection line, respectively a middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor; or the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure penetrates the back surface and the portion of the gyro sensor a thickness and electrically connected to the first external pad of the front surface of the gyro sensor, the second metal connection structure penetrating through the back surface and the partial thickness of the acceleration sensor, and electrically connected to the second external pad of the front surface of the acceleration sensor; The gyro sensor and the acceleration sensor are respectively flipped on the first surface of the substrate, the first metal connection Located on the external surface of the first pad, the second surface of the second metal structure is located external connection pad.

Optionally, the signal processing chip is flipped on the second surface of the substrate; or the back surface of the signal processing chip is attached to the second surface of the substrate, and the signal processing chip passes through the metal wire and the third interconnection line, The fourth interconnect line and the second metal line layer are electrically connected.

Optionally, the interconnection line includes a fifth interconnection line and a sixth interconnection line located in the substrate, and a plurality of third metal circuit layers and a plurality of fourth metal circuit layers located on the first surface of the substrate, and a fifth The interconnection line, the sixth interconnection line, the third metal circuit layer and the fourth metal circuit layer are insulated from each other; the first external pad of the gyro sensor is electrically connected to the third metal circuit layer through the first metal connection structure, the acceleration sensor The second external pad is electrically connected to the fourth metal circuit layer through the second metal connection structure; the third external connection pad of the magnetic induction sensor is electrically connected to the fifth interconnection line through the third metal connection structure; the data processing chip is mounted on the substrate a first surface, the data processing chip is electrically connected to the third metal circuit layer, the fourth metal circuit layer, the fifth interconnection, and the sixth interconnection; the interconnection further includes a second surface on the substrate a plurality of fifth metal circuit layers, the fifth metal circuit layer is electrically connected to the sixth interconnection circuit, the solder bumps are located on the surface of the fifth metal circuit layer, and the fifth metal circuit layer Connection.

Optionally, the method further includes a first data processing chip, a second data processing chip, and a third data processing chip, the first data processing chip is electrically connected to the gyro sensor, and the second data processing chip is electrically connected to the acceleration sensor The third data processing chip is electrically connected to the magnetic induction sensor.

Optionally, the interconnection line includes a first interconnection line and a second interconnection line in the substrate, and a metal circuit layer on the second surface of the substrate; the first external connection pad of the gyro sensor passes the a metal connection structure is electrically connected to the first interconnection line, and the second external connection pad of the acceleration sensor is electrically connected to the second interconnection line through the second metal connection structure; the third external connection pad of the magnetic induction sensor passes through the third metal connection structure Electrically connecting with the metal circuit layer; a plurality of solder bumps on the second surface of the substrate, the solder bumps including the first solder bumps, the second solder bumps, and the third solder bumps, the first solder bumps and the first solder bumps An interconnecting line is electrically connected, the second soldering bump is electrically connected to the second interconnecting strip, and the third soldering bump is electrically connected to the metal wiring layer.

Optionally, the front surface of the gyro sensor has a plurality of first internal pads and a first external pad, the first data processing chip is located on the front surface of the gyro sensor, the first data processing chip and the first internal pad and the first The external pad is electrically connected. The front surface of the acceleration sensor has a plurality of second internal pads and a second external pad. The second data processing chip is located on the front surface of the acceleration sensor, and the second data processing chip is connected to the second internal pad and the second external connection. The pad is electrically connected, the front surface of the magnetic induction sensor has a third inner pad and a third outer pad, the third data processing chip is located on the front surface of the magnetic induction sensor, and the third data processing chip and the third inner pad and the third outer pad Electrical connection.

Optionally, the first data processing chip includes a front surface and an opposite back surface, and the front surface of the first data processing chip has an input pad and an output pad, and the input pad of the first data processing chip is connected through the fourth metal The structure is electrically connected to the first internal pad, the output pad of the first data processing chip is electrically connected to the first external pad through a fifth metal connection structure, the second data processing chip includes a front surface and an opposite back surface, and the input solder The disk and the output pad are located on the front side of the second data processing chip, the input pad of the second data processing chip is electrically connected to the second internal pad through the sixth metal connection structure, and the output pad of the second data processing chip passes the seventh The metal connection structure is electrically connected to the second external processing pad, the third data processing chip includes a front surface and an opposite back surface, the input pad and the output pad are located on the front side of the third data processing chip, and the input processing of the third data processing chip The disk is electrically connected to the third internal pad through the eighth metal connection structure, and the output pad of the third data processing chip passes through the ninth metal connection structure and the External pads are electrically connected.

Optionally, the back surface of the first data processing chip is attached to the front surface of the gyro sensor, the back surface of the second data processing chip is attached to the front surface of the acceleration sensor, and the back surface of the third data processing chip is attached to the magnetic induction sensor. Front side; or the first data processing chip is flipped on the front side of the gyro sensor, the second data processing chip is flipped on the front side of the acceleration sensor, and the third data processing chip is flipped on the front side of the magnetic induction sensor on.

Optionally, the back sides of the first data processing chip, the second data processing chip, and the third data processing chip form a recess.

Optionally, the gyro sensor is a three-axis gyro sensor, the acceleration sensor is a three-axis acceleration sensor, and the magnetic induction sensor is a three-axis magnetic induction sensor.

Compared with the prior art, the technical solution of the present invention has the following advantages:

The packaging method and the package structure of the invention make the gyro sensor, the acceleration sensor and the magnetic induction touch sensor integrated in one MEMS package structure, which reduces the volume of the MEMS package structure and improves the integration degree. Moreover, since the magnetic induction touch sensor is sensitive to magnetic materials, the magnetic induction touch sensor is mounted on different surfaces of the substrate relative to the gyro sensor and the acceleration sensor, so that the magnetic induction touch sensor is not interfered by the gyro sensor and the acceleration sensor, thereby improving Detection accuracy of MEMS package structure.

Further, a metal circuit layer is formed on the second surface of the substrate, and the magnetic induction sensor is flipped on the second surface of the substrate and electrically connected to the metal circuit layer through the third metal connection structure, so that the back side of the magnetic induction sensor is on the substrate The thickness of the two surfaces is small, and when the solder bumps are formed on the second surface of the substrate, the height of the solder bumps can be small, which is advantageous for reducing the process difficulty of solder bump formation and reducing the volume of the entire package structure.

Further, the first metal connection structure or the back surface and part of the thickness of the gyro sensor are electrically connected to the first external pad of the front surface of the gyro sensor, and the second metal connection structure or the back surface and part of the thickness of the acceleration sensor are The second external pad of the front surface of the acceleration sensor is electrically connected, and the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, so that the first metal connection structure is electrically connected to the first interconnection line, so that the second metal connection structure The connection manner electrically connected to the second interconnection line makes the thickness between the gyro sensor and the acceleration sensor and the first surface of the substrate small, which is advantageous for reducing the volume of the package structure.

Further, the first metal connection structure is formed on the surface of the first external pad of the gyro sensor, and the second metal connection structure is formed on the surface of the first external pad of the acceleration sensor, so that the gyro sensor and the acceleration sensor can be flipped separately Connecting to the first interconnecting line and the second interconnecting line on the first surface of the substrate respectively reduces the process difficulty and facilitates reducing the volume of the package structure.

Further, the third metal connection structure or the back surface and the partial thickness of the magnetic induction sensor are electrically connected to the third external pad of the front surface of the magnetic induction sensor, and the back surface of the magnetic induction sensor is attached to the second surface of the substrate, and the magnetic induction sensor is reduced. Simultaneously with the thickness of the second surface of the first substrate, the magnetic sensing region of the magnetic induction sensor can be moved away from the gyro sensor and the acceleration touch sensor on the first surface of the substrate, and the magnetic induction sensor is improved while reducing the volume of the package structure. Detection accuracy.

The package structure and the packaging method of the present invention realize an integrated package of a data processing chip and a gyro sensor, an acceleration sensor and a magnetic induction sensor, which reduces the volume of the package structure, and the data processing chip can measure the gyro sensor and the acceleration The signals sensed by the sensor and the magnetic induction sensor are processed and the processed signal is transmitted from the solder bump.

In the package structure and packaging method of the present invention, the data processing chip and the gyro sensor and the acceleration sensor are both packaged on the first surface of the substrate, and the magnetic induction sensor is packaged on the second surface of the substrate to implement a data processing chip and the gyroscope The integrated package of the sensor, the acceleration sensor and the magnetic induction sensor reduces the volume of the package structure, and the data processing chip can process signals induced by the gyro sensor, the acceleration sensor and the magnetic induction sensor, and the processed signal is soldered The bump is transmitted, and at the same time, since the data processing chip and the gyro sensor and the acceleration sensor are both packaged on the first surface of the substrate, and the magnetic induction sensor is packaged on the second surface of the substrate, the solder bump formed on the second surface of the substrate is more favorable. The layout.

The package structure and the packaging method of the invention realize integrated packaging of the gyro sensor module, the acceleration sensor module, and the magnetic induction sensor module, reduce the volume of the package structure, and the first data processing chip, the second data processing chip and the third data The processing chip can separately process the signals sensed by the corresponding gyro sensor, the acceleration sensor, and the magnetic induction sensor, thereby improving the processing efficiency, and passing the processed signal through the first solder bump, the second solder bump, and the third Welding bump output.

DRAWINGS

FIG. 1 is a schematic structural view showing a process of forming a MEMS sensor package structure according to a first embodiment of the present invention; FIG. 1 is a schematic view of a substrate; FIG. 2 is a schematic diagram of a gyro sensor; FIG. 4 is a schematic view of a magnetic induction sensor; FIG. 5 is a schematic view showing the mounting of the gyro sensor and the acceleration sensor to the substrate; FIG. 6 is a schematic view showing the metal circuit layer on the second surface of the substrate in FIG. 5; FIG. 8 is a schematic view showing the arrangement of the solder bumps in FIG. 7; FIG.

9 to FIG. 14 are schematic structural views showing a process of forming a MEMS sensor package structure according to a second embodiment of the present invention; wherein FIG. 9 is a schematic diagram of a gyro sensor; FIG. 10 is a schematic diagram of an acceleration sensor; FIG. 12 is a schematic diagram of another type of gyro sensor; FIG. 13 is a schematic diagram of the gyro sensor and the acceleration sensor mounted on the substrate in FIGS. 9 and 10; FIG. 14 is a gyro sensor in FIGS. a schematic diagram of the acceleration sensor mounted to the substrate;

15 to FIG. 17 are schematic structural views showing a process of forming a MEMS sensor package structure according to a third embodiment of the present invention; wherein FIG. 15 is a schematic diagram of a gyro sensor; FIG. 16 is a schematic diagram of an acceleration sensor; And 16 schematic diagrams of the gyro sensor and the acceleration sensor mounted on the substrate;

18 to FIG. 21 are schematic diagrams showing the structure of a MEMS sensor package structure according to a fourth embodiment of the present invention; FIG. 18 is a schematic diagram of a magnetic induction sensor; FIG. 19 is a schematic diagram of another magnetic induction sensor; FIG. 21 is a schematic view showing the mounting of the magnetic induction sensor to the substrate in FIG. 19; FIG.

22 to FIG. 23 are schematic structural diagrams showing a process of forming a MEMS sensor package structure according to a fifth embodiment of the present invention; wherein, the substrate in FIGS. 22 and 23 is further provided with a data processing chip;

24 to FIG. 25 are schematic structural diagrams showing a process of forming a MEMS sensor package structure according to a sixth embodiment of the present invention; wherein, the substrate of FIGS. 24 and 25 is further provided with a data processing chip, and the gyro sensor and the acceleration sensor are both located on the substrate. a surface

26 to 37 are structural diagrams showing a process of forming a MEMS sensor package structure according to a seventh embodiment of the present invention; wherein, FIG. 26 is a schematic diagram of a first type of gyro sensor module; FIG. 27 is a schematic diagram of a first type of acceleration sensor module; 28 is a schematic diagram of a first type of magnetic induction sensor module; FIG. 29 is a schematic diagram of a second type of gyro sensor module; FIG. 30 is a schematic diagram of a second type of acceleration sensor module; and FIG. 31 is a schematic diagram of a second type of magnetic induction sensor module; A schematic diagram of a third type of gyro sensor module; FIG. 33 is a schematic diagram of a third type of acceleration sensor module; FIG. 34 is a schematic diagram of a third type of magnetic induction sensor module; and FIGS. 35-37 are three kinds of gyro sensors, acceleration sensors, A schematic diagram of a magnetic induction sensor module mounted on a substrate.

detailed description

As the background art states, the current MEMS accelerometers, MEMS gyroscope sensors, and MEMS magnetic inductive sensors are separately designed and then packaged separately. Since various sensors are separately designed and packaged independently, the existing MEMS are made. The device is bulky and costly.

To this end, the present invention provides a method for extremely forming a MEMS sensor package structure, which realizes an integrated package of an acceleration sensor, a gyro sensor and a magnetic induction sensor, and reduces the volume of the package structure.

The above described objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims. In the detailed description of the embodiments of the present invention, for the convenience of the description, the schematic diagram will not be partially enlarged, and the schematic diagram is only an example, and the scope of protection of the present invention should not be limited herein. In addition, the actual three-dimensional dimensions of length, width and depth should be included in the actual production.

First embodiment

FIG. 1 is a schematic structural view showing a process of forming a MEMS sensor package structure according to a first embodiment of the present invention.

Referring to FIG. 1, a substrate 100 is provided that includes a first surface 101 and an opposite second surface 102, the substrate 100 having interconnecting lines.

In this embodiment, the interconnect line includes a first interconnect line 103 and a second interconnect line 104 located in the substrate 100.

The first interconnect line 103 and the second interconnect line 104 are used to direct electrical connection points of the first surface 101 of the substrate 100 to the second surface 102 of the substrate 100.

In this embodiment, the first interconnection line 103 subsequently realizes that the gyro sensor mounted on the first surface 101 of the substrate 100 is electrically connected to the solder bump formed on the second surface 102 of the substrate 100, and the second interconnection line 104 is subsequently followed. An electrical connection electrically connected to the solder bumps formed on the second surface 102 of the acceleration sensor substrate 100 mounted on the first surface 101 of the substrate 100 is achieved.

The substrate 100 may be one of a printed wiring board, a BT (Bismaleimide Triazine) resin substrate, or a semiconductor substrate. When the substrate 100 is a semiconductor substrate, the semiconductor substrate may be a silicon substrate, a germanium substrate, a silicon germanium substrate, or other suitable semiconductor material substrate.

In an embodiment, when the substrate 100 is a printed wiring board or a BT (Bismaleimide Triazine) resin substrate, the substrate may be a single layer or a multi-layer stacked structure, and the first interconnecting lines 103 and second are corresponding. Interconnect lines 104 can also be a single layer or multi-layer stack structure. When the first interconnection line 103 and the second interconnection line 104 are a multi-layer stacked structure, the first interconnection line 103 and the second interconnection line 104 may include a plurality of metal wiring layers and adjacent layers. Metal plug or via connection structure interconnected by metal circuit layers.

In another embodiment, when the substrate 100 is a semiconductor substrate, the first interconnect line 103 and the second interconnect line 104 may include a via interconnect structure penetrating the semiconductor substrate and a first surface of the semiconductor substrate And/or a rewiring metal wiring layer electrically connected to the via interconnect structure on the second surface.

The number of the first interconnecting lines 103 and the second interconnecting lines 104 is plural (≥2), and the different first interconnecting lines 103 and/or the second interconnecting lines 104 are isolated from each other. And insulated from each other. In this embodiment, the number of the first interconnection lines 103 is the same as the number of the first external connection pads on the subsequently mounted gyro sensor, and the number of the second interconnection lines 104 is the same as that of the subsequently installed acceleration sensor. The number of the two external pads is the same.

Referring to FIGS. 2, 3, and 4, a gyro sensor 21, an acceleration sensor 31, and a magnetic induction sensor 41 are provided. The gyro sensor 21 includes a plurality of first external pads 202, and the acceleration sensor 31 includes a plurality of second external solders. The disk 302, the magnetic induction sensor 41 includes a plurality of third external pads 402.

The gyro sensor 21 is used to detect the angular velocity of an object such as a mobile phone or a car, that is, the gyro sensor 21 can sense the acceleration of the object to generate an electrical signal.

In one embodiment, the gyro sensor 21 includes an angular velocity sensing region 201 and a first external pad 202 located around the angular velocity sensing region 201. The angular velocity sensing region 201 is configured to sense an acceleration of an object to generate an electrical signal. The first external pad 202 serves as an electrical connection point for electrical signal transmission between the gyro sensor 21 and an external chip or circuit. An associated circuit (not shown) is further formed in the gyro sensor 21, and the associated circuit electrically connects the angular velocity sensing area 201 with the first external pad 202, and the electrical signal induced by the angular velocity sensing area 201 can pass through the associated circuit. Transfer to the first external pad 202. In an embodiment, the gyro sensor 21 has a first sealing cover 210 on the front surface thereof, the first sealing cover 210 seals the angular velocity sensing area 201, and a plurality of first external bonding pads 202 are located on opposite sides of the first sealing cover 210. The first sealing cover 210 seals the angular velocity sensing area 201, prevents damage of the angular velocity sensing area 201 during the subsequent packaging process, or prevents moisture and corrosion during use, and the plurality of first external pads 202 are located on the first sealing cover 210. On the side, the presence of the first sealing cover 210 does not affect the subsequent packaging process. The material of the first sealing cover 210 may be silicon, glass or ceramic, and may be formed on the front surface of the gyro sensor 21 by an adhesive layer bonding or bonding process.

The number of the first external pads 202 is plural (two or more), and some of the first external pads can transmit induced electrical signals, and some of the first external pads can receive external control signals or power signals.

The gyro sensor 21 includes a front surface and an opposite back surface, and the first outer pad 21 and the angular velocity sensing region 201 are located on the front surface of the gyro sensor 21.

The acceleration sensor 31 is for detecting the acceleration of an object such as a mobile phone or a car, i.e., the acceleration sensor 31 can sense the acceleration of the object to generate an electrical signal.

In an embodiment, the acceleration sensor 31 includes an acceleration sensing area 301 and a second external bonding pad 302 located around the acceleration sensing area 301. The acceleration sensing area 301 is configured to sense an acceleration of an object to generate an electrical signal. The second external pad 302 serves as an electrical connection point for the electrical signal transmission of the acceleration sensor 31 and an external chip or circuit. An associated circuit (not shown) is further formed in the acceleration sensor 31. The associated circuit electrically connects the acceleration sensing area 301 and the second external pad 302. The electrical signal induced by the acceleration sensing area 301 can be transmitted through the associated circuit. To the second external pad 302. In an embodiment, the acceleration sensor 301 has a second sealing cover 310 on the front surface thereof, and the second sealing cover 310 seals the acceleration sensing area 301, and the plurality of second external bonding pads 302 are located on both sides of the second sealing cover 310. The second sealing cover 310 seals the acceleration sensing area 301 to prevent damage of the acceleration sensing area 301 or moisture and corrosion during use in the subsequent packaging process, and the plurality of second external pads 302 are located on both sides of the second sealing cover 310. The presence of the second sealing cover 310 does not affect the subsequent packaging process. The material of the second sealing cover 310 may be silicon, glass or ceramic, and may be formed on the front surface of the acceleration sensor 301 by an adhesive layer bonding or bonding process.

The acceleration sensor 31 and the gyro sensor 21 each include a front surface and an opposite back surface. Specifically, in this embodiment, the second outer contact pad 302 and the acceleration sensing region 301 are located on the front surface of the acceleration sensor 31. An external pad 202 and an angular velocity sensing area 201 are located on the front side of the gyro sensor 21.

The magnetic induction sensor 41 is used to detect the magnetic field of an object such as a mobile phone or a car, that is, the magnetic induction sensor 41 can sense the acceleration of the object to generate an electrical signal.

In one embodiment, the magnetic induction sensor 41 includes a magnetic field sensing region 401 and a third external bonding pad 402 located around the magnetic field sensing region 401. The magnetic field sensing region 401 is configured to sense an acceleration of an object to generate an electrical signal. The third external pad 402 serves as an electrical connection point for the electrical signal transmission between the magnetic induction sensor 41 and an external chip or circuit. An associated circuit (not shown) is further formed in the magnetic induction sensor 41. The associated circuit electrically connects the magnetic field sensing area 401 and the third external bonding pad 402, and the electrical signal induced by the magnetic field sensing area 401 can be transmitted through the associated circuit. Go to the third external pad 402.

The number of the third external pads 402 is plural (two or more), some of the third external pads can transmit induced electrical signals, and some of the third external pads can receive external control signals or power signals.

The magnetic induction sensor 41 includes a front surface and an opposite back surface, and the third external contact pad 41 and the magnetic field sensing region 401 are located on the front surface of the magnetic induction sensor 41.

The gyro sensor 21 can be a single-axis or multi-axis (≥ 2 axis) gyro sensor. In one embodiment, when the gyro sensor 21 is a three-axis gyro sensor, the three-axis gyro sensor can be used to sense three. The angular velocity of the directions, the three directions refer to a first direction, a second direction, and a third direction, the first direction being perpendicular to the second direction, and the third direction being perpendicular to a plane in which the first direction and the second direction are located.

The acceleration sensor 31 may be a single-axis or multi-axis (≥ 2 axis) acceleration sensor. In an embodiment, when the acceleration sensor 31 is a three-axis acceleration sensor, the three-axis acceleration sensor may be used to sense acceleration in three directions. The three directions refer to a first direction, a second direction, and a third direction, the first direction being perpendicular to the second direction, and the third direction being perpendicular to a plane in which the first direction and the second direction are located.

The magnetic induction sensor 41 can be a single-axis or multi-axis (≥ 2 axis) acceleration sensor. In one embodiment, when the magnetic induction sensor 41 is a three-axis magnetic induction sensor, the three-axis magnetic induction sensor can be used to sense magnetic fields in three directions. The three directions refer to a first direction, a second direction, and a third direction, the first direction being perpendicular to the second direction, and the third direction being perpendicular to a plane in which the one direction and the second direction are located.

Referring to FIG. 5, the gyro sensor 21 and the acceleration sensor 31 are respectively mounted on the first surface 101 of the substrate 100, and the first external pad 202 of the gyro sensor 21 is electrically connected to the first interconnection 103 through the first metal connection structure 109. Connected, the second external pad 302 of the acceleration sensor 31 is electrically coupled to the second interconnect 104 via the second metal connection 108.

The back surfaces of the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface of the substrate 100. In the embodiment, the back surfaces of the gyro sensor 21 and the acceleration sensor 31 are bonded to the first substrate 100 through the adhesive layers 105 and 106. surface. The material of the adhesive layer 308 is epoxy resin glue, polyimide glue, benzocyclobutene glue or polybenzoxazole glue.

The forming process by the adhesive layers 105, 106 may be: forming a layer of adhesive material on the first surface 101 of the substrate 100 by a filming process, a printing process, or a roll-on process, and bonding the layer of adhesive material through exposure and development processes. Graphically, adhesive layers 105, 106 are formed on the substrate, and the size and position of the adhesive layers 105, 106 are attached to the size of the back surface of the gyro sensor 21 and the acceleration sensor 31, and the gyro sensor 21 and the acceleration sensor 31 are attached. The positions on the first surface 31 of the substrate 300 correspond.

In this embodiment, the first metal connection structure 109 and the second metal connection structure 108 are metal wires, and two ends of the first metal connection structure 109 are electrically connected to the first outer pad 202 and the first interconnection line 103, respectively. A middle portion of a metal connection structure 109 is suspended on both sides of the gyro sensor 21, and two ends of the second metal connection structure 108 are electrically connected to the second outer contact pad 302 and the second interconnection line 104, respectively, and the second metal connection structure 108 The middle portion is suspended on both sides of the acceleration sensor 31.

The first metal connection structure 109 and the second metal connection structure 108 may be formed by a wire bonding process.

In the present embodiment, the back surfaces of the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface of the substrate 100 through the adhesive layers 105, 106, and the first metal connection structure 109 and the second metal connection structure 108 are connected by a wire bonding process. Such a connection or process can prevent damage to the gyro sensor 21 and the acceleration sensor 31 by other process steps such as a heat treatment process.

In an embodiment, after forming the first metal connection structure 109 and the second metal connection structure 108, a glue layer that seals at least the first metal connection structure 109 and the second metal connection structure 108 (metal lines) is formed. The dispensing layer may include a first dispensing layer covering the first metal connecting structure 109 and a second dispensing layer covering the second metal connecting structure 108, and the first dispensing layer and the second dispensing layer are respectively formed. The dispensing layer may also be a unitary structure covering both the first metal connection structure 109 and the second metal connection structure 108. The dispensing layer may cover the first surface 101 of the substrate 100 and the gyro sensor 21 and the acceleration sensor 31 in addition to the first metal connection structure 109 and the second metal connection structure 108, and the dispensing layer has a flat surface. The dispensing layer can be used as a platform to facilitate subsequent processing steps such as mounting the magnetic induction sensor 41 and forming the solder bump on the second surface of the substrate 100. In one embodiment, the material of the dispensing layer is a resin (glue), and the forming process is a dispensing process, an injection molding process, or a transformation process.

Referring to FIG. 6, a metal wiring layer 110 is formed on the second surface 102 of the substrate 100.

The metal circuit layer 110 is a part of the interconnect structure. In the embodiment, the interconnect line includes the first interconnect line 103 and the second interconnect line 104 in the substrate 100, and further includes the substrate 100. The metal wiring layer 110 on the second surface, the first interconnection 103, the second interconnection 104, and the metal wiring layer 110 are insulated from each other.

The metal circuit layer 110 is used for subsequent connection with a magnetic induction sensor. The metal circuit layer 100 serves as a first partial metal circuit layer. The second surface 102 of the substrate 100 is also formed on the second surface 102 of the substrate 100 while the metal wiring layer 100 is formed on the second surface 102 of the substrate 100. A second partial metal wiring layer and a third partial metal wiring layer may be formed, the second partial metal wiring layer is electrically connected to the first interconnection line 103, and the third partial metal wiring layer is electrically connected to the second interconnection line 104, the first portion The metal wiring layer, the second partial metal wiring layer, and the third partial metal wiring layer are not electrically connected to each other.

In this example, the first partial metal wiring layer, the second partial metal wiring layer and the third partial metal wiring layer are simultaneously formed and have the same thickness, and the first partial metal wiring layer is used for guiding the third external bonding pad of the magnetic induction sensor to the substrate. a second surface for facilitating electrical connection with a third solder bump formed on a surface of the first portion of the metal wiring layer, and a second portion of the metal wiring layer as a pad connected to the first interconnecting line for facilitating subsequent formation on the surface of the first portion of the metal wiring layer a first solder bump, the third portion of the metal circuit layer as a pad connected to the second interconnect line, to facilitate subsequent formation of a second solder bump on the surface of the third portion of the metal circuit layer, the first portion of the metal circuit layer, the second portion The metal circuit layer and the third portion of the metal circuit layer have the same thickness, such that the heights of the first solder bump, the second solder bump and the third solder bump are kept uniform, and the first solder bump and the second solder bump are reduced. Starting and third welding convex process difficulty.

In this embodiment, the first partial metal circuit layer, the second partial metal circuit layer and the third partial metal circuit layer are located on the second surface 102 of the substrate 100. In other embodiments, the first partial metal circuit layer The second partial metal wiring layer and the third partial metal wiring layer are embedded in the interior of the substrate 100, and the surfaces of the first partial metal wiring layer, the second partial metal wiring layer and the third partial metal wiring layer are flush with the second surface 102 of the substrate 100. Flat, the forming process of the first partial metal wiring layer, the second partial metal wiring layer and the third partial metal wiring layer may be performed simultaneously with forming the first interconnection line and the second interconnection line, which is advantageous in simplifying the process steps Reduce the size of the package structure.

In one embodiment, the step of forming the metal wiring layer 110 is performed before the step of mounting the gyro sensor 21 and the acceleration sensor 31 on the first surface 101 of the substrate 100, respectively, to reduce the formation of the metal wiring layer 110. The process difficulty, on the other hand, prevents damage to the gyro sensor 21 and the acceleration sensor 31 when the metal wiring layer 110 is formed.

The material of the metal wiring layer 304 may be one or more of W, Al, Cu, Ti, Ag, Au, Pt, and Ni.

In an embodiment, the metal circuit layer 110 is formed by forming a metal material layer on the second surface 102 of the substrate 100, and the metal material layer may be formed by sputtering; forming a mask layer on the surface of the metal material layer. The mask layer has a plurality of openings exposing the surface of the metal material layer; the mask layer is used as a mask to etch away the exposed metal material layer of the opening, and the remaining metal material layer of the second surface 102 of the substrate 100 a metal circuit layer; the mask layer is removed.

In another embodiment, the metal wiring layer 110 is formed by forming a dielectric layer on the second surface 102 of the substrate 100, the dielectric layer having a plurality of recesses exposing the second surface 102 of the substrate 100. a trench; a metal wiring layer 110 filled with a recess is formed in the recess, and the filling process is electroplating.

In other embodiments, the metal wiring layer 110 can also be formed by a printing process.

Referring to FIG. 7, the magnetic induction sensor 41 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 402 of the magnetic induction sensor 41 is electrically connected to the interconnection (metal wiring layer 110) through the third metal connection structure 111.

In this embodiment, the metal circuit layer 110 is formed on the second surface 102 of the substrate 100, and the magnetic induction sensor 41 is flip-chip mounted on the second surface 102 of the substrate and electrically connected to the metal circuit layer 110 through the third metal connection structure 111. The thickness of the back surface of the magnetic induction sensor 41 to the second surface 102 of the substrate 100 is small. When the second surface 102 of the substrate 100 is formed with a solder bump, the height of the solder bump can be small, which is advantageous for reducing the solder bump. The process difficulty is formed and the volume of the entire package structure is reduced.

In this embodiment, the third metal connection structure 111 is electrically connected to the first part of the metal circuit layer in the metal circuit layer 110.

Solder of the material of the third metal connection structure 111, tin, tin silver, tin lead, tin silver copper, tin silver zinc, tin zinc, tin antimonide indium, tin indium, tin gold, tin copper, tin zinc indium or tin silver One or more of metals such as ruthenium.

Since the magnetic induction sensor 41 is flipped on the second surface 102 of the substrate 100, a reflow process (heat treatment process) is required to make the third metal connection structure 111 and the metal wiring layer 110 on the second surface 102 of the substrate 100. Electrically connected, thus, in one embodiment, the magnetic induction sensor 41 is flipped over the second surface 102 of the substrate 100, and the gyro sensor 21 and the acceleration sensor 31 are mounted on the first surface 101 of the substrate 100, respectively. The step before and after the step of forming the metal wiring layer 110 on the second surface 102 of the substrate 100 is performed, thereby preventing damage to the gyro sensor 21 and the acceleration sensor 31 by the reflow process.

In an embodiment, the method further includes forming a third dispensing layer covering the surface of the magnetic induction sensor 41 and the third metal connecting structure 111 and filling the space of the adjacent third metal connecting structure 111, through the third dispensing layer and the substrate 100. The second surface 102 seals the magnetic field sensing region 401 of the magnetic induction sensor 41, prevents damage to the magnetic field sensing region 401 by the subsequent packaging process, and prevents moisture and corrosion during use, and does not require additional magnetic induction sensors by forming a third dispensing layer. The front surface of the 41 forms a sealing cover, which reduces the volume of the package structure and achieves a sealing function. The material of the third layer of the glue layer is a resin glue, and the forming process is a dispensing process.

Referring to FIG. 8, a plurality of solder bumps are formed on the second surface 102 of the substrate 100, the solder bumps being electrically connected to the interconnect lines.

In the embodiment, the solder bump includes a first solder bump 112, a second solder bump 114, and a third solder bump 113. The first solder bump 112 is electrically connected to the first interconnecting line 103, and the second soldering The bump 114 is electrically connected to the second interconnecting line 104, and the third solder bump 113 is electrically connected to the metal wiring layer 110.

In this embodiment, the first solder bumps 112 are electrically connected to the first interconnecting lines through the second portion of the metal wiring layer, and the second solder bumps 114 pass through the third portion of the metal wiring layer and the second interconnecting lines. Electrically connected, the third solder bump 113 is electrically connected to the metal wiring layer 110 (third portion metal wiring layer).

The material of the first solder bump 112, the second solder bump 114 and the third solder bump 113 is solder, and the solder may be tin, tin silver, tin lead, tin silver copper, tin silver zinc, tin zinc One or more of metals such as tin antimonide, tin indium, tin gold, tin copper, tin zinc indium or tin silver crucible. The first solder bumps 112, the second solder bumps 114, and the third solder bumps 113 may be formed by a plating or stencil brushing process.

In other embodiments, the first solder bumps 112, the second solder bumps 114, and the third solder bumps 113 include metal bumps on the second surface 102 of the substrate 100 and solder on the surface of the metal bumps. The material of the metal bump may be one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, ruthenium, gold, silver; the material of the solder layer may be tin, tin silver, tin One or more of metals such as lead, tin-silver-copper, tin-silver-zinc, tin-zinc, tin-bismuth-indium, tin-indium, stannic, tin-copper, tin-zinc-indium, or tin-silver-tellurium.

The first solder bumps 112, the second solder bumps 114, and the third solder bumps 113 serve as ports for communication of the entire MEMS package structure with an external chip or circuit, such that the gyro sensor 21, the acceleration sensor 31, and the magnetic induction touch sensor 41 The induced electrical signal can be transmitted through the first solder bump 112, the second solder bump 114, and the third solder bump 113.

In other embodiments, a molding layer is formed that forms the second surface 102 of the cover substrate 100 and the sidewall portions of the first solder bumps 112, the second solder bumps 114, and the third solder bumps 113. In this embodiment, the gyro sensor 21, the acceleration sensor 31, and the magnetic induction touch sensor 41 are integrated in one MEMS package structure by the above method, which reduces the volume of the MEMS package structure and improves the integration degree. Moreover, since the magnetic induction touch sensor 41 is relatively sensitive to magnetic materials, the magnetic induction touch sensor 41 is mounted on different surfaces of the substrate 100 with respect to the gyro sensor 21 and the acceleration sensor 31 in the present invention, so that the magnetic induction touch sensor 41 is not affected by the gyro sensor 21. The interference of the acceleration sensor 31 improves the detection accuracy of the MEMS package structure.

Second embodiment

9 to FIG. 14 are structural diagrams showing a process of forming a MEMS sensor package structure according to a second embodiment of the present invention.

The difference between the embodiment and the foregoing embodiment is that the gyro sensor 21 is different from the first interconnection 103, the acceleration sensor 31, and the second interconnection 104. In this embodiment, the first metal connection structure 203 or 206 penetrates the back surface and a portion of the thickness of the gyro sensor 21 and is electrically connected to the first external pad 202 on the front surface of the gyro sensor 21, and the second metal connection structure 303 or 306 penetrates the back surface and a portion of the thickness of the acceleration sensor 31, and the acceleration The second external pads 302 on the front side of the sensor 31 are electrically connected. When the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface 101 of the substrate 100, the first metal connection structure 203 is electrically connected to the first interconnection 103. The connection manner of electrically connecting the second metal connection structure 203 and the second interconnection line 104 is such that the thickness between the gyro sensor 21 and the acceleration sensor 31 and the first surface 101 of the substrate 100 is small, which is advantageous for reducing the package. The volume of the structure. It should be noted that, in the present embodiment, the forming process and the setting of the same structure or the like are referred to the forming process and the setting of the related structure in the foregoing embodiment, and details are not described in this embodiment.

Referring to FIGS. 9 and 11, a first metal connection structure 203 or 206 is formed in the gyro sensor 21, and the first metal connection structure 203 or 206 penetrates the back surface and a portion of the thickness of the gyro sensor 21, and the gyro sensor 21 The front first outer pads 202 are electrically connected.

In an embodiment, referring to FIG. 9 , the first metal connection structure 203 is formed by etching the etched gyro sensor 21 along the back surface and forming a first external solder in the gyro sensor 21 . An etched hole on the bottom surface of the disk 202; the etched hole is filled with metal to form a first metal connection structure 203.

In another embodiment, referring to FIG. 11 , the first metal connection structure 206 is formed by etching the gyro sensor 21 along the back surface and forming a first external contact pad in the gyro sensor 21 . a groove of the bottom surface of the 202; a metal wiring layer is formed on the sidewall and the bottom surface of the groove and the back surface of the gyro sensor 21, and a part of the metal wiring layer on the back surface of the gyro sensor 21 is removed by etching, on the side of the groove A first metal connection structure 206 is formed on the wall and bottom surface and a portion of the back surface of the gyro sensor 21; an insulating medium is formed to fill the gap between the remaining recess and the adjacent first metal connection structure 206 on the back surface of the gyro sensor 21. The layer, the surface of the dielectric layer is flush with the surface of the first metal connection 206 on the back side of the gyro sensor 21.

In other embodiments, the surface of the first metal connection structure 203 or 206 may also form a solder layer.

Referring to FIGS. 10 and 12, a second metal connection structure 303 or 306 is formed in the acceleration sensor 31, the second metal connection structure 303 or 306 penetrating the back surface and a portion of the thickness of the acceleration sensor 31, and the second surface of the acceleration sensor 31. The external pads 302 are electrically connected.

In an embodiment, referring to FIG. 10, the second metal connection structure 303 is formed by etching the etch acceleration sensor 31 along the back surface and exposing the second external contact pad 302 in the acceleration sensor 31. An etched hole in the bottom surface; the etched hole is filled with metal to form a second metal connection structure 303.

In another embodiment, referring to FIG. 12, the second metal connection structure 306 is formed by etching the acceleration sensor 31 along the back surface and forming a bottom portion of the second external connection pad 302 exposed in the acceleration sensor 31. a groove of the surface; a metal wiring layer is formed on the side wall and the bottom surface of the groove and the back surface of the acceleration sensor 31, and a part of the metal wiring layer on the back surface of the acceleration sensor 31 is etched away, on the side wall and the bottom surface of the groove And forming a second metal connection structure 306 on a portion of the back surface of the acceleration sensor 31; forming an insulating dielectric layer filling the remaining grooves and the gap between adjacent second metal connection structures 306 on the back surface of the acceleration sensor 31, the dielectric layer The surface is flush with the surface of the second metal connection 306 on the back side of the acceleration sensor 31.

In other embodiments, the surface of the second metal connection structure 303 or 306 may also form a solder layer.

Referring to FIG. 13, the gyro sensor 21 and the acceleration sensor 31 shown in FIGS. 9 and 11 are attached to the first surface 101 of the substrate 100 such that the first metal connection structure 203 is electrically connected to the first interconnection 103. The second metal connection structure 203 is electrically connected to the second interconnection line 104.

The bonding process may employ one or a combination of a direct bonding process, a metal diffusion bonding, an anodic bonding, and a solder bonding.

In another embodiment, referring to FIG. 14 , the back surface of the gyro sensor 21 and the acceleration sensor 31 shown in FIG. 10 and FIG. 12 are attached to the first surface 101 of the substrate 100 such that the first metal connection structure 203 and the first An interconnect line 103 is electrically connected such that the second metal connection structure 203 is electrically coupled to the second interconnect line 104.

The bonding process may employ one or a combination of a direct bonding process, a metal diffusion bonding, an anodic bonding, and a solder bonding.

Third embodiment

15 to FIG. 17 are structural diagrams showing a process of forming a MEMS sensor package structure according to a third embodiment of the present invention.

The difference between the embodiment and the foregoing embodiment is that the gyro sensor 21 is different from the first interconnection line, the acceleration sensor 31 and the second interconnection. In the embodiment, the first metal connection structure 208 is formed on the gyroscope. The surface of the first outer pad 202 of the sensor 21, the second metal connection structure 308 is formed on the surface of the first outer pad 302 of the acceleration sensor 31, so that the gyro sensor 21 and the acceleration sensor 31 can be flipped on the substrate 100, respectively. The first surface 101 is connected to the first interconnecting line 103 and the second interconnecting line 104, respectively, which reduces the process difficulty and is advantageous for reducing the volume of the package structure. It should be noted that, in the present embodiment, the forming process and the setting of the same structure or the like are referred to the forming process and the setting of the related structure in the foregoing embodiment, and details are not described in this embodiment.

Referring to FIGS. 15 and 16, a first metal connection structure 208 is formed on the surface of the first outer pad 202 of the gyro sensor 21, and a second metal connection structure 308 is formed on the surface of the second outer pad 302 of the acceleration sensor 31.

The material of the first metal connection structure 208 and the second metal connection structure 308 is solder, and the solder may be tin, tin silver, tin lead, tin silver copper, tin silver zinc, tin zinc, tin antimonide, tin indium. One or more of metals such as tin, tin, tin, zinc, indium or tin-silver. The first metal connection structure 208 and the second metal connection structure 308 may be formed by a plating or stencil brushing process.

Referring to FIG. 17, the gyro sensor 21 and the acceleration sensor 31 shown in FIGS. 15 and 16 are respectively flipped on the first surface 101 of the substrate 100, and the first metal connection structure 208 is electrically connected to the first interconnection 103. The second metal connection structure 308 is electrically connected to the second interconnection 104.

In an embodiment, the method further includes forming a fourth dispensing layer covering the surface of the gyro sensor 21 and the first metal connecting structure 208 and filling the space of the adjacent first metal connecting structure 208, through the third dispensing layer and the substrate The first surface seals the angular velocity sensing region 201 of the gyro sensor 21 to prevent damage to the angular velocity sensing region 201 of the subsequent packaging process and moisture and corrosion during use, and by forming a third dispensing layer, without additional gyroscopes The front surface of the sensor 21 forms a sealing cover, which reduces the volume of the package structure and achieves a sealing function. The material of the fourth layer of the glue layer is a resin (glue), and the forming process is a dispensing process, an injection molding process or a transformation process.

The method further includes forming a fifth dispensing layer covering the surface of the acceleration sensor 31 and the second metal connecting structure 308 and filling the space of the adjacent second metal connecting structure 308, and the acceleration sensor is disposed through the fifth dispensing layer and the first surface of the substrate The acceleration sensing region 301 of 31 is sealed to prevent damage to the acceleration sensing region 301 by the subsequent packaging process and moisture and corrosion during use, and by forming a fifth dispensing layer, it is not necessary to additionally form a sealing cover on the front surface of the acceleration sensor 31. The sealing function is achieved while the volume of the small package structure is small. The material of the fifth layer of the glue layer is a resin glue (glue), and the forming process is a dispensing process, an injection molding process or a transformation process.

In the fourth embodiment

18 to FIG. 20 are structural diagrams showing a process of forming a MEMS sensor package structure according to a fourth embodiment of the present invention.

The difference between the present embodiment and the foregoing embodiment is that the magnetic induction sensor 41 is connected to the metal wiring layer 111 on the second surface 102 of the substrate 100 in a different manner, and the third metal connection structure 403 or 406 penetrates the back surface and the portion of the magnetic induction sensor 41. The thickness is electrically connected to the third external pad 402 on the front surface of the magnetic induction sensor 41. The back surface of the magnetic induction sensor 41 is attached to the second surface 102 of the substrate 100, and the surface of the magnetic induction sensor 41 is reduced to the second substrate 100. Simultaneously with the thickness of the surface 102, the magnetic induction region 401 of the magnetic induction sensor 41 can be moved away from the gyro sensor 21 and the acceleration touch sensor 31 on the first surface 101 of the substrate 100, and the detection of the magnetic induction sensor is improved while reducing the volume of the package structure. Precision. It should be noted that, in the present embodiment, the forming process and the setting of the same structure or the like are referred to the forming process and the setting of the related structure in the foregoing embodiment, and are not described in detail in this embodiment. Moreover, in this embodiment, the connection manner of the gyro sensor 21 and the first interconnection line, the acceleration sensor 31 and the second interconnection line may be the same as the connection manner disclosed in FIG. 20 and FIG. Any one of the connection methods is not particularly limited herein.

Referring to FIGS. 18 and 19, a third metal connection structure 403 or 406 is formed in the magnetic induction sensor 41, the third metal connection structure 403 or 406 penetrating the back surface and a portion of the thickness of the magnetic induction sensor 41, and the third surface of the magnetic induction sensor 41. The external pads 402 are electrically connected.

In an embodiment, referring to FIG. 18, the third metal connection structure 403 is formed by etching the etched magnetic induction sensor 41 along the back surface, and exposing the exposed third external contact pad 402 in the magnetic induction sensor 41. An etched hole in the bottom surface; the etched hole is filled with metal to form a third metal connection structure 403.

In another embodiment, referring to FIG. 19, the third metal connection structure 406 is formed by etching the third metal connection structure 403 along the back surface and forming an exposed surface in the third metal connection structure 403. a recess of the bottom surface of the third external contact pad 402; a metal wiring layer is formed on the sidewall and the bottom surface of the recess and the back surface of the third metal connection structure 406, and a portion of the metal on the back surface of the third metal connection structure 406 is etched away a circuit layer, a third metal connection structure 406 is formed on the sidewalls and the bottom surface of the recess and a portion of the back surface of the third metal connection structure 406; forming a recess filled with the remaining recess and adjacent on the back surface of the third metal connection structure 406 An insulating dielectric layer between the third metal connection structures 406, the surface of the insulating dielectric layer being flush with the surface of the third metal connection structure 406 on the back surface of the third metal connection structure 406.

In one embodiment, the magnetic induction sensor 41 has a third sealing cover 410 on the front surface thereof, and the third sealing cover 410 seals the magnetic field sensing area 401, and the plurality of third external bonding pads 402 are located on both sides of the third sealing cover 410. The third sealing cover 410 seals the magnetic field sensing area 401 to prevent damage of the magnetic field sensing area 401 or moisture and corrosion during use in the subsequent packaging process, and a plurality of third external pads 402 are located on both sides of the third sealing cover 410. The presence of the third sealing cover 410 does not affect the subsequent packaging process. The material of the third sealing cover 410 may be silicon, glass or ceramic, and may be formed on the front surface of the magnetic induction sensor 41 by an adhesive layer bonding or bonding process.

In other embodiments, the surface of the first metal connection structure 203 or 206 may also form a solder layer.

Referring to FIG. 20, the back surface of the magnetic induction sensor 41 shown in FIG. 18 is attached to the second surface 102 of the substrate 100 such that the first metal connection structure 403 is electrically connected to the metal wiring layer 110 on the second surface 102 of the substrate 100.

In another embodiment, referring to FIG. 21, the back surface of the magnetic induction sensor 41 shown in FIG. 18 is attached to the second surface 102 of the substrate 100 such that the first metal connection structure 406 and the second surface of the substrate 100 The metal wiring layer 110 is electrically connected.

The bonding process may employ one or a combination of a direct bonding process, a metal diffusion bonding, an anodic bonding, and a solder bonding.

In this embodiment, the third metal connection structure 403 or 406 penetrates the back surface and a portion of the thickness of the magnetic induction sensor 41, and is electrically connected to the third external contact pad 402 on the front surface of the magnetic induction sensor 41. The back of the magnetic induction sensor 41 is attached to the back surface. The second surface 102 of the substrate 100, and the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100 through the adhesive layers 105, 106, and the first metal connection structure 109 is passed through a wire bonding process. And the second metal connection structure 108, the two ends of the first metal connection structure 109 are electrically connected to the first outer connection pad 202 and the first interconnection line 103, respectively, and the two ends of the second metal connection structure 108 are respectively soldered to the second external connection The disk 302 and the second interconnection 104 are electrically connected.

In other embodiments, the third metal connection structure 403 or 406 penetrates the back surface and a portion of the thickness of the magnetic induction sensor 41, and is electrically connected to the third external contact pad 402 on the front surface of the magnetic induction sensor 41. The magnetic induction sensor 41 is attached to the back surface. On the second surface 102 of the substrate 100, and (refer to FIGS. 13 and 14) the first metal connection structure 203 or 206 penetrates the back surface and a portion of the thickness of the gyro sensor 21, and the first external pad 202 on the front side of the gyro sensor 21 Electrically connected, the second metal connection structure 303 or 306 penetrates the back surface and a portion of the thickness of the acceleration sensor 31, and is electrically connected to the second external contact pad 302 on the front surface of the acceleration sensor 31. The back surface of the gyro sensor 21 and the acceleration sensor 31 are attached to the substrate. The first surface 101 of the 100 causes the first metal connection structure 203 to be electrically connected to the first interconnection line 103, and the integrated package manner of the gyro sensor 21, the acceleration sensor 31, and the magnetic induction sensor 41, so that the gyro sensor 21 and the acceleration sensor 31 and the subsequent surface of the magnetic induction sensor 41 to the first surface 101 of the substrate 100 are smaller, which is advantageous for reducing the volume of the package structure. The magnetic induction region 401 of the magnetic induction sensor 41 is away from the gyro sensor 21 and the acceleration sensor 31, so that the magnetic induction sensor 41 is less interfered by the gyro sensor 21 and the acceleration sensor 31, and the detection accuracy of the magnetic induction sensor 41 is improved.

In the embodiment of the present invention, a MEMS sensor package structure is also provided. Referring to FIG. 8, the method includes:

The substrate 100 includes a first surface 101 having an interconnecting line and an opposite second surface 102, the interconnecting line including a first interconnecting line 103 and a second interconnecting line 104 in the substrate ;

a gyro sensor 21, an acceleration sensor 31 and a magnetic induction sensor 41, the gyro sensor 21 includes a plurality of first external pads 202, the acceleration sensor 31 includes a plurality of second external pads 302, and the magnetic induction sensor 41 includes a plurality of Three external pads 401;

The gyro sensor 21 and the acceleration sensor 31 are mounted on the first surface 101 of the substrate 100, and the first external pad 202 of the gyro sensor 21 is electrically connected to the interconnection (the first interconnection 103) through the first metal connection structure 109. The second external pad 302 of the acceleration sensor 31 is electrically connected to the interconnection (second interconnection 104) through the second metal connection structure 108;

The interconnect line further includes a plurality of metal circuit layers 110 on the second surface 102 of the substrate 100;

The magnetic induction sensor 41 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 402 of the magnetic induction sensor 41 is electrically connected to the interconnection (metal wiring layer 110) through the third metal connection structure 111;

a plurality of solder bumps on the second surface 102 of the substrate 100, the solder bumps being electrically connected to the interconnect lines, the specific solder bumps including the first solder bumps 112, the second solder bumps 114, and the third solder bumps 113 The first solder bumps 112 are electrically connected to the first interconnecting lines 103, the second solder bumps 114 are electrically connected to the second interconnecting lines 104, and the third solder bumps 113 are electrically connected to the metal wiring layer 110.

The gyro sensor 21 includes a front surface and an opposite back surface, the first external pad 202 is located on the front surface of the gyro sensor, the acceleration sensor 31 includes a front surface and an opposite back surface, and the second external contact pad 302 is located at an acceleration. On the front side of the sensor, the magnetic induction sensor 41 includes a front side and an opposite back side, and the third external contact pad 402 is located on the front side of the magnetic induction sensor.

In this embodiment, the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100. The first metal connection structure 109 and the second metal connection structure 108 are metal lines, and the first metal connection structure 109 The two ends are electrically connected to the first outer pad 202 and the first interconnecting line 103, respectively, and the middle portion of the first metal connecting structure 109 is suspended on both sides of the gyro sensor 21, and the two ends of the second metal connecting structure 109 are respectively The second external pad 302 and the second interconnection 104 are electrically connected, and the intermediate portion of the second metal connection 108 is suspended on both sides of the acceleration sensor.

In another embodiment, referring to FIG. 13 or 14, the back surface of the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface 101 of the substrate 100, and the first metal connecting structure 203/206 penetrates the gyro sensor. The back surface and the partial thickness of 21 are electrically connected to the first outer pad 202 on the front surface of the gyro sensor 21, and the second metal connection structure 303/306 penetrates the back surface and the partial thickness of the acceleration sensor 31, and the acceleration sensor 31. The front second external pads 302 are electrically connected.

In another embodiment, the first metal connection structure 208 is located on the surface of the first external pad 202, and the second metal connection structure 308 is located on the surface of the second external pad 302. The gyro sensor 21 and the acceleration sensor 31 is flip-chip mounted on the first surface 101 of the substrate 100, respectively.

Referring to FIG. 8 , in the embodiment, the third metal connection structure 111 is located on the surface of the third external pad 402 , and the magnetic induction sensor 41 is flipped on the second surface 402 of the substrate 100 .

In another embodiment, the back surface of the magnetic induction sensor 41 is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively connected to the third external connection pad and the metal circuit layer. Electrically connected, the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor.

In another embodiment, referring to FIG. 20 and FIG. 21, the back surface of the magnetic induction sensor 41 is adhered to the second surface 102 of the substrate 100, and the third metal connection structure 403/406 penetrates the back surface and the portion of the magnetic induction sensor 41. The thickness is electrically connected to the third external pad 403 on the front surface of the magnetic induction sensor 41.

In one embodiment, the gyro sensor is a three-axis gyro sensor, the acceleration sensor is a three-axis acceleration sensor, and the magnetic induction sensor is a three-axis magnetic induction sensor.

Fifth embodiment

22 to FIG. 23 are structural diagrams showing a process of forming a MEMS sensor package structure according to a fifth embodiment of the present invention.

The difference between this embodiment and the foregoing embodiment is that the present embodiment implements an integrated package of a data processing chip 501 and a gyro sensor 21, an acceleration sensor 31, and a magnetic induction sensor 41, which reduces the volume of the package structure, and the data processing The chip 501 can process signals induced by the gyro sensor 21, the acceleration sensor 31, and the magnetic induction sensor 41, and transmit the processed signals from the solder bumps. It should be noted that, in the present embodiment, the definitions or descriptions of the same or similar structures, the same or similar connection manners in the foregoing embodiments, refer to the corresponding structures in the foregoing embodiments, the definitions or descriptions of the corresponding connection manners, This embodiment will not be described again.

Referring to FIG. 22, a substrate 100 is provided. The substrate 100 includes a first surface 101 and an opposite second surface 102. The substrate 100 has an interconnection line therein. In the embodiment, the interconnection line is included in the substrate 100. Third interconnecting line 124 and fourth interconnecting line 125, and a plurality of first metal wiring layers 116 and a plurality of second metal wiring layers 117 on the second surface 102 of the substrate 100, third interconnecting lines 124, The four interconnecting lines 125, the first metal wiring layer 116 and the plurality of second metal wiring layers 117 are insulated from each other;

A gyro sensor 21, an acceleration sensor 31 and a magnetic induction sensor 41 are provided. The gyro sensor 21 includes a plurality of first external pads 202, the acceleration sensor 31 includes a plurality of second external pads 302, and the magnetic induction sensor 41 includes a plurality of a third external pad 402;

The gyro sensor 21 and the acceleration sensor 31 are respectively mounted on the first surface 101 of the substrate 100, and the first external pad 202 of the gyro sensor 21 passes through the first metal connection structure 109 and the interconnection (third interconnection 124) Electrically connected, the second external pad 302 of the acceleration sensor 31 is electrically connected to the interconnection (fourth interconnection 125) through the second metal connection structure 108;

Forming a plurality of first metal wiring layers 116 and a plurality of second metal wiring layers 117 on the second surface 102 of the substrate 100;

The magnetic induction sensor 41 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 402 of the magnetic induction sensor 41 is electrically connected to the interconnection (the first metal wiring layer 116) through the third metal connection structure 111;

The data processing chip 501 is flip-chip mounted on the second surface 102 of the substrate 100, the data processing chip 501 and the interconnection (the third interconnection 124, the fourth interconnection 125, the first metal wiring layer 116, and the second metal wiring) Layer 117) electrical connection;

Solder bumps 115 are formed on the surface of the second metal wiring layer 117.

The data processing chip 501 is configured to process signals induced by the gyro sensor 21, the acceleration sensor 31, and the magnetic induction sensor 41, and transmit the processed signals to other chips or circuits through the solder bumps 115, the data. A processing circuit (not shown) is formed in the processing chip 501, the surface of the data processing chip 501 having a plurality of input pads 503 and output pads 502 electrically connected to the signal processing circuit, the input pads 503 and corresponding The third interconnect line 124, the fourth interconnect line 125, the first metal line layer 116 are electrically connected, and the output pad 502 is electrically connected to the second metal line layer 117. In a specific embodiment, a portion of the input pads 503 of the data processing chip 501 are electrically coupled to the gyro sensor 21 via a third interconnect 124, a first metal connection 109, and a first external pad 202. The data processing chip 501 The portion of the input pad 503 is electrically connected to the acceleration sensor 31 through the fourth interconnection 125, the second metal connection 108, and the second external pad 302. A portion of the input pad 503 of the data processing chip 501 passes through the first metal circuit layer. 116. The third metal connection structure 111 and the third external connection pad 402 are electrically connected to the magnetic induction sensor.

The signal processing chip 501 can also receive an external signal through the solder bump 115, the second metal wiring layer 117, and the output pad 502, and transmit a corresponding control signal to the gyro sensor 21 and the acceleration sensor through the input pad 503. 31 and magnetic induction sensor 41.

The gyro sensor 21 includes a front surface and an opposite back surface, the first external pad 202 is located on the front surface of the gyro sensor 21, the acceleration sensor 31 includes a front surface and an opposite back surface, and the second external contact pad 302 is located On the front side of the acceleration sensor 21, the magnetic induction sensor 41 includes a front surface and an opposite back surface, and the third external contact pad 402 is located on the front surface of the magnetic induction sensor 41.

In this embodiment, the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100. The first metal connection structure 109 and the second metal connection structure 108 are metal lines, and the first metal connection structure 109 The two ends are electrically connected to the first external pad 202 and the third interconnection 124, respectively, and the middle portion of the first metal connection structure 109 is suspended on both sides of the gyro sensor 21, and the two ends of the second metal connection structure 108 are respectively The second outer pad 302 and the fourth interconnecting line 125 are electrically connected, and the middle portion of the second metal connecting structure 108 is suspended on both sides of the acceleration sensor 31.

The forming process of the metal wires (the first metal connecting structure 109 and the second metal connecting structure 108) is wire bonding, and after forming the metal wires, further comprising forming a dispensing layer that at least seals the metal wires.

In another embodiment, referring to FIG. 23, the gyro sensor 21 and the acceleration sensor 31 are back-attached to the first surface 101 of the substrate 100, and the first metal connection structure 109 penetrates the back surface of the gyro sensor 31 and Partially thicknessed and electrically connected to the first outer pad 202 on the front side of the gyro sensor 21, the second metal connection structure 108 penetrating the back surface and the partial thickness of the acceleration sensor 31, and the second external soldering of the front surface of the acceleration sensor 31 The disk 302 is electrically connected.

In another embodiment, the first metal connection structure is located on a surface of the first external connection pad, the second metal connection structure is located on a surface of the second external connection pad, and the gyro sensor and the acceleration sensor are respectively flipped on the substrate On the first surface (similar to the connection shown in Figure 17).

The third metal connection structure 111 is located on the surface of the third external pad 402, and the magnetic induction sensor 41 is flipped on the second surface 102 of the substrate 100.

In another embodiment, the back side of the magnetic induction sensor 40 is attached to the second surface 102 of the substrate 100. The third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively connected with the third external connection pad and the metal. The circuit layers are electrically connected, and the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor (similar to the connection manner shown in FIGS. 20 and 21).

In another embodiment, the back surface of the magnetic induction sensor 41 is adhered to the second surface 102 of the substrate 100. The third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor, and is connected to the third external connection of the front surface of the magnetic induction sensor. Disk connection (similar to the connection shown in Figure 20 and Figure 21).

For the formation process and related definitions of the first metal circuit layer 116 and the plurality of second metal circuit layers 117, refer to the formation process and related definitions of the metal circuit layer in the foregoing embodiments, and details are not described herein again.

The embodiment of the invention further provides a MEMS sensor package structure. Referring to FIG. 22, the method includes:

a substrate 100 including a first surface 101 having an interconnecting line and an opposite second surface 102, the interconnecting line including a third interconnecting line 124 and a fourth interconnecting line in the substrate 100 125, and a plurality of first metal circuit layers 116 and a plurality of second metal circuit layers 117 on the second surface 102 of the substrate 100;

a gyro sensor 21, an acceleration sensor 31 and a magnetic induction sensor 41, the gyro sensor 21 includes a plurality of first external pads 202, the acceleration sensor 31 includes a plurality of second external pads 302, and the magnetic induction sensor 41 includes a plurality of Three external pads 402;

The gyro sensor 21 and the acceleration sensor 31 are mounted on the first surface 101 of the substrate 100, and the first external pad 202 of the gyro sensor 11 is electrically connected to the interconnection (third interconnection 124) through the first metal connection structure 109. The second external pad 302 of the acceleration sensor 31 is electrically connected to the interconnection (fourth interconnection 125) through the second metal connection structure 108;

The magnetic induction sensor 41 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 402 of the magnetic induction sensor 41 is electrically connected to the interconnection (the first metal wiring layer 116) through the third metal connection structure 111;

The data processing chip 501 is flip-chip mounted on the second surface 102 of the substrate 100, the data processing chip 401 and the interconnection (the third interconnection 124, the fourth interconnection 125, the first metal wiring layer 116, and the second metal wiring layer). 117) electrical connection;

A solder bump 115 on the second surface of the substrate 100, the solder bump 115 is electrically connected to the second metal wiring layer 117.

The gyro sensor 21 includes a front surface and an opposite back surface, the first external pad 202 is located on the front surface of the gyro sensor 21, the acceleration sensor 31 includes a front surface and an opposite back surface, and the second external contact pad 302 is located On the front side of the acceleration sensor 21, the magnetic induction sensor 41 includes a front surface and an opposite back surface, and the third external contact pad 402 is located on the front surface of the magnetic induction sensor 41.

In this embodiment, the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100. The first metal connection structure 109 and the second metal connection structure 108 are metal lines, and the first metal connection structure 109 The two ends are electrically connected to the first external pad 202 and the third interconnection 124, respectively, and the middle portion of the first metal connection structure 109 is suspended on both sides of the gyro sensor 21, and the two ends of the second metal connection structure 108 are respectively The second outer pad 302 and the fourth interconnecting line 125 are electrically connected, and the middle portion of the second metal connecting structure 108 is suspended on both sides of the acceleration sensor 31.

In another embodiment, referring to FIG. 23, the gyro sensor 21 and the acceleration sensor 31 are back-attached to the first surface 101 of the substrate 100, and the first metal connection structure 109 penetrates the back surface of the gyro sensor 31 and Partially thicknessed and electrically connected to the first outer pad 202 on the front side of the gyro sensor 21, the second metal connection structure 108 penetrating the back surface and the partial thickness of the acceleration sensor 31, and the second external soldering of the front surface of the acceleration sensor 31 The disk 302 is electrically connected.

In another embodiment, the first metal connection structure is located on a surface of the first external connection pad, the second metal connection structure is located on a surface of the second external connection pad, and the gyro sensor and the acceleration sensor are respectively flipped on the substrate On the first surface (similar to the connection shown in Figure 17).

The third metal connection structure 111 is located on the surface of the third external pad 402, and the magnetic induction sensor 41 is flipped on the second surface 102 of the substrate 100.

In another embodiment, the back side of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively electrically connected to the third external connection pad and the metal circuit layer. Connected, the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor (similar to the connection shown in Figures 20 and 21).

In another embodiment, the back of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor, and is electrically connected to the third external pad of the front surface of the magnetic induction sensor. (Like the connection method shown in Fig. 20 and Fig. 21).

The gyro sensor 21 includes a front surface and an opposite back surface, the first external pad 202 is located on the front surface of the gyro sensor 21, the acceleration sensor 31 includes a front surface and an opposite back surface, and the second external contact pad 302 is located On the front side of the acceleration sensor 21, the magnetic induction sensor 41 includes a front surface and an opposite back surface, and the third external contact pad 402 is located on the front surface of the magnetic induction sensor 41.

In this embodiment, the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100. The first metal connection structure 109 and the second metal connection structure 108 are metal lines, and the first metal connection structure 109 The two ends are electrically connected to the first external pad 202 and the third interconnection 124, respectively, and the middle portion of the first metal connection structure 109 is suspended on both sides of the gyro sensor 21, and the two ends of the second metal connection structure 108 are respectively The second outer pad 302 and the fourth interconnecting line 125 are electrically connected, and the middle portion of the second metal connecting structure 108 is suspended on both sides of the acceleration sensor 31.

In another embodiment, referring to FIG. 23, the gyro sensor 21 and the acceleration sensor 31 are back-attached to the first surface 101 of the substrate 100, and the first metal connection structure 109 penetrates the back surface of the gyro sensor 31 and Partially thicknessed and electrically connected to the first outer pad 202 on the front side of the gyro sensor 21, the second metal connection structure 108 penetrating the back surface and the partial thickness of the acceleration sensor 31, and the second external soldering of the front surface of the acceleration sensor 31 The disk 302 is electrically connected.

In another embodiment, the first metal connection structure is located on a surface of the first external connection pad, the second metal connection structure is located on a surface of the second external connection pad, and the gyro sensor and the acceleration sensor are respectively flipped on the substrate On the first surface (similar to the connection shown in Figure 17).

The third metal connection structure 111 is located on the surface of the third external pad 402, and the magnetic induction sensor 41 is flipped on the second surface 102 of the substrate 100.

In another embodiment, the back side of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively electrically connected to the third external connection pad and the metal circuit layer. Connected, the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor (similar to the connection shown in Figures 20 and 21).

In another embodiment, the back of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor, and is electrically connected to the third external pad of the front surface of the magnetic induction sensor. (Like the connection method shown in Fig. 20 and Fig. 21).

The surface of the data processing chip 501 has a plurality of input pads 503 and output pads 502. The input pads 503 are electrically connected to the corresponding third interconnecting lines 124, fourth interconnecting lines 125, and first metal wiring layer 116. The output pad 502 is electrically connected to the second metal wiring layer 117.

Sixth embodiment

24 to FIG. 25 are structural diagrams showing a process of forming a MEMS sensor package structure according to a sixth embodiment of the present invention.

The difference between this embodiment and the fifth embodiment is that the data processing chip 501 and the gyro sensor 21 and the acceleration sensor 31 are both packaged on the first surface 101 of the substrate 100, and the magnetic induction sensor 41 is packaged on the second surface 102 of the substrate 100. In the above, an integrated package of the data processing chip 501 and the gyro sensor 21, the acceleration sensor 31 and the magnetic induction sensor 41 is realized, the volume of the package structure is reduced, and the data processing chip 501 can be used for the gyro sensor 21 and the acceleration sensor. 31 and the signal induced by the magnetic induction sensor 41 are processed, and the processed signal is transmitted from the solder bump, and since the data processing chip 501 and the gyro sensor 21 and the acceleration sensor 31 are both packaged on the first surface 101 of the substrate 100, The magnetic induction sensor 41 is packaged on the second surface of the substrate 100 to facilitate the layout of the solder bumps formed on the second surface 102 of the substrate 100. It should be noted that, in the present embodiment, the definitions or descriptions of the same or similar structures, the same or similar connection manners in the foregoing embodiments, refer to the corresponding structures in the foregoing embodiments, the definitions or descriptions of the corresponding connection manners, This embodiment will not be described again.

Referring to FIG. 24, a substrate 100 is provided, which includes a first surface 101 and an opposite second surface 1021, the substrate 100 having interconnection lines; in the embodiment, the interconnection line includes a portion located in the substrate 100. a fifth interconnecting line 120 and a sixth interconnecting line 119, and a plurality of third metal wiring layers 122 and a plurality of fourth metal wiring layers 123 formed on the first surface 101 of the substrate 100;

A gyro sensor 21, an acceleration sensor 31 and a magnetic induction sensor 41 are provided. The gyro sensor 21 includes a plurality of first external pads 202, the acceleration sensor 31 includes a plurality of second external pads 302, and the magnetic induction sensor 41 includes a plurality of a third external pad 402;

The gyro sensor 21 and the acceleration sensor 31 are respectively mounted on the first surface 101 of the substrate 100, and the first external pad 202 of the gyro sensor 21 passes through the first metal connection structure 109 and the interconnection (third metal wiring layer 122) Electrically connected, the second external pad 302 of the acceleration sensor 31 is electrically connected to the interconnection (fourth metal circuit layer 123) through the second metal connection structure 108;

The magnetic induction sensor 41 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 402 of the magnetic induction sensor 41 is electrically connected to the interconnection (the fifth interconnection 120) through the third metal connection structure 111;

The data processing chip 501 is flip-chip mounted on the first surface 101 of the substrate 100, the data processing chip 501 and the interconnection (the third metal wiring layer 122, the fourth metal wiring layer 123, the fifth interconnection 120, and the sixth interconnection) Line 119) electrical connection;

The interconnection further includes a plurality of fifth metal wiring layers 121 on the second surface 102 of the substrate 100, and a plurality of fifth metal wiring layers 121 are formed on the second surface 102 of the substrate 100, and the fifth metal wiring layer 121 is The sixth interconnection 119 is electrically connected;

Solder bumps 118 are formed on the surface of the fifth metal wiring layer 121.

The gyro sensor 21 includes a front surface and an opposite back surface, the first external pad 202 is located on the front surface of the gyro sensor 21, the acceleration sensor 31 includes a front surface and an opposite back surface, and the second external contact pad 302 is located On the front side of the acceleration sensor 31, the magnetic induction sensor 41 includes a front surface and an opposite back surface, and the third external contact pad 402 is located on the front surface of the magnetic induction sensor 41.

In this embodiment, the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100. The first metal connection structure 109 and the second metal connection structure 108 are metal lines, and the first metal connection structure 109 The two ends are electrically connected to the first external pad 202 and the third metal circuit layer 122, respectively, and the middle portion of the first metal connection structure 109 is suspended on both sides of the gyro sensor 21, and the two ends of the second metal connection structure 108 are respectively The second outer pad 302 and the fourth metal wiring layer 123 are electrically connected, and the intermediate portion of the second metal connecting structure 109 is suspended on both sides of the acceleration sensor 31.

In an embodiment, after the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface 101 of the substrate 100 and the data processing chip 501 is flipped over the first surface 101 of the substrate 100, the method further includes: forming at least a coating A dispensing layer of metal wires (first metal connection structure 109 and second metal connection structure 108). In an embodiment, the dispensing layer covers the gyro sensor 21, the acceleration sensor 31, the data processing chip 501, and the first substrate 100 in addition to the first metal connection structure 109 and the second metal connection structure 108. A surface, and the dispensing layer has a flat upper surface, such that the dispensing layer can serve as a platform for facilitating subsequent processing steps of mounting the magnetic induction sensor 41 and forming the solder bumps 118 on the second surface of the substrate 100. In one embodiment, the material of the dispensing layer is a resin (glue), and the forming process is a dispensing process, an injection molding process, or a transformation process.

In another embodiment, referring to FIG. 25, the back surface of the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface 101 of the substrate 100, and one end of the first metal connection structure 106 runs through the gyro sensor 21. The back surface and a portion of the thickness are electrically connected to the first external pad 202 on the front surface of the gyro sensor 21, and the other end of the first metal connection structure 106 is electrically connected to the third metal circuit layer 122, and one end of the second metal connection structure 306 The back surface and the partial thickness of the acceleration sensor 31 are electrically connected to the second outer contact pad 302 on the front surface of the acceleration sensor 31, and the other end of the second metal connection structure 306 is electrically connected to the fourth metal circuit layer.

In another embodiment, the first metal connection structure is located on a surface of the first external connection pad, the second metal connection structure is located on a surface of the second external connection pad, and the gyro sensor and the acceleration sensor are respectively flipped on the substrate The first metal connection structure and the second metal connection structure are electrically connected to the third metal circuit layer and the fourth metal circuit layer, respectively.

In this embodiment, the third metal connection structure 111 is located on the surface of the third external contact pad 402, and the magnetic induction sensor 41 is flipped on the second surface 102 of the substrate 400.

In another embodiment, the back side of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively connected to the third external pad and the fifth interconnection. The line connection, the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor.

In another embodiment, the back of the magnetic induction sensor is attached to the second surface of the substrate, and one end of the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor, and the third external pad of the front surface of the magnetic induction sensor The other end is electrically connected to the fifth interconnecting line.

With continued reference to FIG. 24, the data processing chip 501 includes a plurality of input pads 503 and output pads 502, and input pads 503 and corresponding third metal lines 122, fourth metal line layers 123, and fifth interconnect lines 120. Electrically connected, the output pad 502 is electrically coupled to the sixth interconnect.

In an embodiment, when the third metal wiring layer 122 and the fourth metal wiring layer 123 are formed on the first surface 101 of the substrate 100, the fourth portion of the metal wiring layer and the fifth portion may be further formed on the first surface 101. The metal wiring layer, the fourth partial metal wiring layer is electrically connected to the fifth interconnection line 120, and the fifth partial metal wiring layer is electrically connected to the sixth interconnection line 119.

It should be noted that, for the formation process and related definitions of the third metal line 122, the fourth metal circuit layer 123, and the fifth metal circuit layer 121, refer to the formation process and related definitions of the metal circuit layer in the foregoing embodiments, and no longer Narration.

A MEMS sensor package structure is also provided in this embodiment. Referring to FIG. 23, the method includes:

a substrate 100 including a first surface 101 having an interconnection line and an opposite second surface 102, the interconnection line including a fifth interconnection line 120 and a sixth interconnection located in the substrate 100 Connecting lines 119, and a plurality of third metal circuit layers 122 and a plurality of fourth metal circuit layers 123 on the first surface 101 of the substrate 100;

a gyro sensor 21, an acceleration sensor 31 and a magnetic induction sensor 41, the gyro sensor 21 includes a plurality of first external pads 202, the acceleration sensor 31 includes a plurality of second external pads 302, and the magnetic induction sensor 41 includes a plurality of Three external pads 402;

The gyro sensor 21 and the acceleration sensor 31 are respectively mounted on the first surface 101 of the substrate 100, and the first external pad 202 of the gyro sensor 21 is electrically connected to the interconnection (third metal wiring layer 122) through the first metal connection structure 109. Connecting, the second external pad 302 of the acceleration sensor 31 is electrically connected to the interconnection (fourth metal circuit layer 123) through the second metal connection 108;

The magnetic induction sensor 41 is mounted on the second surface 102 of the substrate 100, and the third external connection 402 of the magnetic induction sensor 41 is electrically connected to the interconnection (the fifth interconnection 120) through the third metal connection structure 111;

The data processing chip 501 is flip-chip mounted on the first surface 101 of the substrate 100, the data processing chip 501 and the interconnection (the third metal wiring layer 122, the fourth metal wiring layer 123, the fifth interconnection 120, and the sixth interconnection) 119) electrical connection;

The interconnection further includes a plurality of fifth metal circuit layers 121 on the second surface 102 of the substrate 100, the fifth metal circuit layer 121 being electrically connected to the sixth interconnection 119;

A solder bump 118 on the surface of the fifth metal wiring layer 121.

The gyro sensor 21 includes a front surface and an opposite back surface, the first external pad 202 is located on the front surface of the gyro sensor 21, the acceleration sensor 31 includes a front surface and an opposite back surface, and the second external contact pad 302 is located On the front side of the acceleration sensor 31, the magnetic induction sensor 41 includes a front surface and an opposite back surface, and the third external contact pad 402 is located on the front surface of the magnetic induction sensor 41.

In this embodiment, the back surface of the gyro sensor 21 and the acceleration sensor 31 are adhered to the first surface 101 of the substrate 100. The first metal connection structure 109 and the second metal connection structure 108 are metal lines, and the first metal connection structure 109 The two ends are electrically connected to the first external pad 202 and the third metal circuit layer 122, respectively, and the middle portion of the first metal connection structure 109 is suspended on both sides of the gyro sensor 21, and the two ends of the second metal connection structure 108 are respectively The second outer pad 302 and the fourth metal wiring layer 123 are electrically connected, and the intermediate portion of the second metal connecting structure 109 is suspended on both sides of the acceleration sensor 31.

In another embodiment, referring to FIG. 25, the back surface of the gyro sensor 21 and the acceleration sensor 31 are attached to the first surface 101 of the substrate 100, and one end of the first metal connection structure 106 runs through the gyro sensor 21. The back surface and a portion of the thickness are electrically connected to the first external pad 202 on the front surface of the gyro sensor 21, and the other end of the first metal connection structure 106 is electrically connected to the third metal circuit layer 122, and one end of the second metal connection structure 306 The back surface and the partial thickness of the acceleration sensor 31 are electrically connected to the second outer contact pad 302 on the front surface of the acceleration sensor 31, and the other end of the second metal connection structure 306 is electrically connected to the fourth metal circuit layer.

In another embodiment, the first metal connection structure is located on a surface of the first external connection pad, the second metal connection structure is located on a surface of the second external connection pad, and the gyro sensor and the acceleration sensor are respectively flipped on the substrate The first metal connection structure and the second metal connection structure are electrically connected to the third metal circuit layer and the fourth metal circuit layer, respectively.

In this embodiment, the third metal connection structure 111 is located on the surface of the third external contact pad 402, and the magnetic induction sensor 41 is flipped on the second surface 102 of the substrate 400.

In another embodiment, the back side of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively connected to the third external pad and the fifth interconnection. The line connection, the middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor.

In another embodiment, the back of the magnetic induction sensor is attached to the second surface of the substrate, and one end of the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor, and the third external pad of the front surface of the magnetic induction sensor The other end is electrically connected to the fifth interconnecting line.

With continued reference to FIG. 24, the data processing chip 501 includes a plurality of input pads 503 and output pads 502, and input pads 503 and corresponding third metal lines 122, fourth metal line layers 123, and fifth interconnect lines 120. Electrically connected, the output pad 502 is electrically coupled to the sixth interconnect.

Seventh embodiment

26 to FIG. 37 are structural diagrams showing a process of forming a MEMS sensor package structure according to a seventh embodiment of the present invention.

The difference between the embodiment and the fourth and fifth embodiments is that the integrated package of the gyro sensor module 61, the acceleration sensor module 71, and the magnetic induction sensor module 81 is implemented in the embodiment, which reduces the volume of the package structure, and is first The data processing chip, the second data processing chip and the third data processing chip can separately process the signals sensed by the corresponding gyro sensor, the acceleration sensor, and the magnetic induction sensor, thereby improving the processing efficiency and passing the processed signal through the first A solder bump, a second solder bump, and a third solder bump output. It should be noted that, in the present embodiment, the definitions or descriptions of the same or similar structures, the same or similar connection manners in the foregoing embodiments, refer to the corresponding structures in the foregoing embodiments, the definitions or descriptions of the corresponding connection manners, This embodiment will not be described again.

Referring to FIGS. 26, 27, and 28, a gyro sensor module 61, an acceleration sensor module 71, and a magnetic induction sensor module 81 are provided, the gyro sensor module 61 including a gyro sensor 21 and a first electrical connection with the gyro sensor 21 The data processing chip 601 and the first external pad 206, the acceleration sensor module 71 includes an acceleration sensor 31 and a second data processing chip 701 and a second external pad 306 electrically connected to the acceleration sensor 31, the magnetic induction sensor module 81 The third data processing chip 801 and the third external pad 805 are electrically connected to the magnetic induction sensor 41 and the magnetic induction sensor 41.

Referring to FIG. 26, the gyro sensor 21 includes a front surface and an opposite back surface. The front surface of the gyro sensor 21 has a plurality of first inner pads 205 and first outer pads 206. The first data processing chip 601 is located at the gyro sensor. On the front side of the 21, the first data processing chip 601 is electrically connected to the first inner pad 205 and the first outer pad 206, and the acceleration sensor 31 includes a front side and an opposite back side.

The first internal pad 205 is located around the angular velocity sensing area 201 for sensing the acceleration of the object to generate an electrical signal. The first internal pad 205 acts as the gyro sensor 21 and the first data processing. The chip 601 performs an electrical connection point for electrical signal transmission.

The number of the first internal pads 205 is plural (two or more), some of the first internal pads may transmit induced electrical signals, and some of the first internal pads may receive external control signals or power signals.

The first external pad 206 is adapted to transmit the processed signal of the gyro sensor module 61 and can receive an external control signal or the like. The first external pad 206 is located around the first internal pad 205 for facilitating the gyro. The meter sensor module 61 is electrically coupled to a first interconnect in the substrate. In an embodiment, the first external pad 206 is electrically connected to the first data processing chip 601. In another embodiment, a portion of the first external pads 206 are electrically connected to the first data processing chip 601, and a portion of the first external pads 206 are electrically connected to the first internal pads 205.

The first data processing chip 601 is configured to process an electrical signal induced by the gyro sensor 21, and a signal processing circuit (not shown) is formed in the first data processing chip 601, and a surface of the first data processing chip 601 is formed. A plurality of input pads 603 and output pads 602 having electrical connections to signal processing circuits, the input pads 603 being electrically coupled to the first internal pads 205 of the respective gyro sensors 21, the output pads 502 being coupled to the first external solder The disk 206 is electrically connected.

The first data processing chip 601 includes a front side and an opposite back side. The input pad 603 and the output pad 602 are located on the front side of the first data processing chip 601, and the input pad 603 of the first data processing chip 601 is connected through the fourth metal. The structure 604 is electrically connected to the first internal pad 205, and the output pad 602 of the first data processing chip 601 is electrically connected to the first external pad 206 through the fifth metal connection structure 605, so that the first data processing chip 601 can pass the input. The pad 603 receives the electrical signal induced by the gyro sensor 21 through the fourth metal connection structure 604 and the first internal pad 205, and outputs the processed signal through the output pad 602, the fifth metal connection structure 605 and the first external pad 206. Electrical signal.

In this embodiment, the back surface of the first data processing chip 601 is attached to the front surface of the gyro sensor 21, and the fourth metal connection structure 604 and the fifth metal connection structure 605 are metal wires, and the fourth metal connection structure 604 and the The intermediate portion of the five metal connection structure 605 is suspended on both sides of the first data processing chip 601, and both ends of the fourth metal connection structure 604 are electrically connected to the input pad 603 and the first internal pad 205 of the first data processing chip 601, respectively. The two ends of the fifth metal connection structure 605 are electrically connected to the output pad 602 of the first data processing chip 601 and the first external pad 206, respectively. In this embodiment, the back surface of the first data processing chip 601 is attached to the front surface of the gyro sensor 21, and the angular velocity sensing area 201 of the gyro sensor 21 is sealed, so that it is not necessary to additionally form a sealing cover on the front surface of the gyro sensor 21. While the manufacturing cost is saved, the sensing signal of the gyro sensor 21 and the sealing of the angular velocity sensing area 201 are realized.

Referring to FIG. 27, the acceleration sensor 31 includes a front surface and an opposite back surface, and the front surface of the acceleration sensor 31 has a plurality of second inner pads 305 and second outer pads 306, and the second data processing chip 701 is located on the front surface of the acceleration sensor 31. The second data processing chip 701 is electrically connected to the second internal pad 305 and the second external pad 306.

The second internal pad 305 is located around the acceleration sensing area 301 for sensing the acceleration of the object to generate an electrical signal, and the second internal pad 305 is used as the acceleration sensor 31 and the second data processing chip. 701 is an electrical connection point for electrical signal transmission.

The number of the second internal pads 305 is plural (two or more), some of the second internal pads may transmit induced electrical signals, and some of the second internal pads may receive external control signals or power signals.

The second external pad 306 is adapted to transmit the signal processed by the acceleration sensor module 71 and can receive an external control signal or the like. The second external pad 306 is located around the second internal pad 305 for the acceleration sensor. Module 71 is electrically coupled to a first interconnect in substrate 100. In an embodiment, the second external pad 306 is electrically connected to the second data processing chip 701. In another embodiment, a portion of the second external pads 306 are electrically coupled to the second data processing chip 701, and a portion of the second external pads 306 are electrically coupled to the second internal pads 305.

The second data processing chip 701 is configured to process an electrical signal induced by the acceleration sensor 31, and a signal processing circuit (not shown) is formed in the second data processing chip 701. The surface of the second data processing chip 701 has a surface. A plurality of input pads 703 and output pads 702 electrically connected to the signal processing circuit, the input pads 703 being electrically connected to the second internal pads 305 of the corresponding acceleration sensors 31, the output pads 502 and the second external pads 306 Electrical connection.

The second data processing chip 701 includes a front side and an opposite back side, the input pad 703 and the output pad 702 are located on the front side of the second data processing chip 701, and the input pad 703 of the second data processing chip 701 is connected through the sixth metal. The structure 704 is electrically connected to the second internal pad 305, and the output pad 702 of the second data processing chip 701 is electrically connected to the second external pad 306 through the seventh metal connection structure 705, so that the second data processing chip 701 can pass the input. The pad 703 receives the electrical signal induced by the acceleration sensor 31 through the sixth metal connection structure 704 and the second internal pad 305, and outputs the processed signal through the output pad 702, the seventh metal connection structure 705 and the second external connection pad 306. electric signal.

In this embodiment, the back surface of the second data processing chip 701 is attached to the front surface of the acceleration sensor 31, and the sixth metal connection structure 704 and the seventh metal connection structure 705 are metal lines, and the sixth metal connection structure 704 and the seventh. The middle portion of the metal connection structure 705 is suspended on both sides of the second data processing chip 701, and the two ends of the sixth metal connection structure 704 are electrically connected to the input pad 703 of the second data processing chip 701 and the second internal pad 305, respectively. The two ends of the seventh metal connection structure 705 are electrically connected to the output pad 702 and the second external pad 306 of the second data processing chip 701, respectively. In this embodiment, the back surface of the second data processing chip 701 is attached to the front surface of the acceleration sensor 31, and the acceleration sensing area 301 of the acceleration sensor 31 is sealed, so that it is not necessary to additionally form a sealing cover on the front surface of the acceleration sensor 31, thereby saving manufacturing costs. At the same time, the sensing signal of the acceleration sensor 31 and the sealing of the acceleration sensing area 301 are realized.

Referring to FIG. 28, the magnetic induction sensor 41 includes a front surface and an opposite back surface. The front surface of the magnetic induction sensor 41 has a plurality of third inner pads 405 and third outer pads 406. The third data processing chip 801 is located on the front surface of the magnetic induction sensor 41. The third data processing chip 801 is electrically connected to the third inner pad 405 and the third outer pad 406.

The third internal pad 405 is located around the magnetic induction sensing area 401 for sensing magnetic induction of an object to generate an electrical signal, and the third internal pad 405 functions as a magnetic induction sensor 41 and a third data processing chip. 801 is an electrical connection point for electrical signal transmission.

The number of the third internal pads 405 is plural (two or more), some of the third internal pads may transmit induced electrical signals, and some of the third internal pads may receive external control signals or power signals.

The third external pad 406 is adapted to transmit the processed signal of the magnetic induction sensor module 81 and can receive an external control signal or the like. The third external pad 406 is located around the third internal pad 405 for facilitating the magnetic induction sensor. Module 81 is electrically coupled to a first interconnect in substrate 100. In an embodiment, the third external pad 406 is electrically connected to the third data processing chip 801. In another embodiment, a portion of the third external pads 406 are electrically coupled to the third data processing chip 801, and a portion of the third external pads 406 are electrically coupled to the third internal pads 405.

The third data processing chip 801 is configured to process an electrical signal induced by the magnetic induction sensor 41, and a signal processing circuit (not shown) is formed in the third data processing chip 801. The surface of the third data processing chip 801 has a surface. A plurality of input pads 803 and output pads 802 electrically connected to the signal processing circuit, the input pads 803 being electrically connected to the third internal pads 405 of the corresponding magnetic induction sensors 41, the output pads 502 and the third external pads 406 Electrical connection.

The third data processing chip 801 includes a front side and an opposite back side, the input pad 803 and the output pad 802 are located on the front side of the third data processing chip 801, and the input pad 803 of the third data processing chip 801 is connected through the eighth metal. The structure 804 is electrically connected to the third internal pad 405, and the output pad 802 of the third data processing chip 801 is electrically connected to the third external pad 406 through the ninth metal connection structure 705, so that the third data processing chip 801 can pass the input. The pad 803 receives the electrical signal induced by the magnetic induction sensor 41 through the eighth metal connection structure 804 and the third internal pad 405, and outputs the processed signal through the output pad 802, the ninth metal connection structure 705 and the third external connection pad 406. electric signal.

In this embodiment, the back surface of the third data processing chip 801 is attached to the front surface of the magnetic induction sensor 41, and the eighth metal connection structure 804 and the ninth metal connection structure 705 are metal wires, and the eighth metal connection structure 804 and the ninth The intermediate portion of the metal connection structure 705 is suspended on both sides of the third data processing chip 801, and the two ends of the eighth metal connection structure 804 are electrically connected to the input pad 803 of the third data processing chip 801 and the third internal pad 405, respectively. The two ends of the ninth metal connection structure 705 are electrically connected to the output pad 802 and the third external pad 406 of the third data processing chip 801, respectively. In this embodiment, the back surface of the third data processing chip 801 is attached to the front surface of the magnetic induction sensor 41, and the magnetic field sensing area 401 of the magnetic induction sensor 41 is sealed, so that it is not necessary to additionally form a sealing cover on the front surface of the magnetic induction sensor 41, thereby saving manufacturing costs. At the same time, the sensing signal of the magnetic induction sensor 41 and the sealing of the magnetic field sensing region 401 are realized.

In another embodiment, referring to FIG. 29, the back surface of the first data processing chip 601 is attached to the front surface of the gyro sensor 21, and the fourth metal connection structure 606 has one end running through the back and the portion of the first data processing chip 601. The thickness is electrically connected to the input pad 603 on the front side of the first data processing chip 601, the other end of the fourth metal connection structure 606 is electrically connected to the first internal pad 205, and one end of the fifth metal connection structure 607 runs through the first data. The back surface and a portion of the thickness of the chip 601 are processed and electrically connected to the output pad 602 on the front side of the first data processing chip 601, and the other end of the fifth metal connection structure 607 is connected to the first external pad 206.

Also formed in the gyro sensor 21 is a first metal connection structure 207 that penetrates the back surface and a portion of the thickness of the gyro sensor 21 and the first external contact pad 206 on the front side of the gyro sensor 21 Electrical connection.

In an embodiment, the back surface of the first data processing chip 601 is formed with a groove 608. When the back surface of the first data processing chip 601 is attached to the front surface of the gyro sensor 21, the groove 608 is located at the angular velocity sensing area. Above the 201, the sealing cover of the sealing angular velocity sensing area 201 may not be formed during the formation of the gyro sensor 21, and the first data processing chip 601 is directly used as the sealing cover, thereby saving the manufacturing cost and realizing the first data processing. The sensing signal of the chip 601 is processed and sealed against the angular velocity sensing area 201.

In another embodiment, referring to FIG. 30, the back surface of the second data processing chip 701 is attached to the front surface of the acceleration sensor, and one end of the sixth metal connection structure 706 penetrates the back surface and a portion of the thickness of the second data processing chip 701, and The other end of the sixth metal connection structure 706 is electrically connected to the second internal pad 305, and the other end of the seventh metal connection structure 707 penetrates the second data processing chip 701. The back side and part of the thickness are electrically connected to the output pad 702 on the front side of the second data processing chip 701, and one end of the seventh metal connection structure 707 is electrically connected to the second external pad 307.

A second metal connection structure 307 is formed in the acceleration sensor 31. The second metal connection structure 307 penetrates the back surface and the partial thickness of the acceleration sensor 31, and is electrically connected to the second external connection pad 306 on the front surface of the acceleration sensor 31.

In an embodiment, a back surface of the second data processing chip is formed with a groove (may be similar to the manner in which the back surface of the first data processing chip 601 in FIG. 29 is formed with a groove 608), and the second data processing When the back side of the chip is attached to the front surface of the acceleration sensor, the groove is located above the acceleration sensing area, so that the sealing cover of the sealed acceleration sensing area may not be formed during the manufacturing process of the acceleration sensor, and the second data processing chip is directly used as the sealing cover. While saving the manufacturing cost, the sensing signal of the acceleration sensor is processed and the acceleration sensing area is sealed.

In another embodiment, referring to FIG. 31, the back surface of the third data processing chip 801 is attached to the front surface of the magnetic induction sensor 41, and one end of the eighth metal connection structure 806 penetrates the back surface and a portion of the thickness of the third data processing chip 801, and The other end of the eighth metal connection structure 806 is electrically connected to the third internal pad 405, and the other end of the ninth metal connection structure 807 passes through the third data processing chip 801. The back side and part of the thickness are electrically connected to the output pad on the front side of the third data processing chip, and the other end of the ninth metal connection structure 807 is electrically connected to the third external pad 406.

A third metal connection structure 407 is formed in the magnetic induction sensor 41. The third metal connection structure 407 penetrates the back surface and a portion of the thickness of the magnetic induction sensor 41 and is electrically connected to the third external connection pad 406 on the front surface of the magnetic induction sensor 41.

In an embodiment, a back surface of the third data processing chip is formed with a groove (may be similar to the manner in which the back surface of the first data processing chip 601 is formed with a groove 608 in FIG. 29), the third data. When the back surface of the processing chip is attached to the front surface of the magnetic induction sensor, the groove is located above the magnetic sensing area, so that the sealing cover of the sealed acceleration sensing area may not be formed during the manufacturing process of the magnetic induction sensor, and the third data processing chip is directly used as the sealing cover. The manufacturing cost of the magnetic induction sensor and the sealing of the magnetic field sensing area are realized while saving the manufacturing cost.

In another embodiment, referring to FIG. 32, the fourth metal connection structure 608 is located on the surface of the input pad 603 of the first data processing chip 601, and the fifth metal connection structure 609 is located at the output pad 602 of the first data processing chip 601. The first data processing chip 601 is flipped on the front surface of the gyro sensor 21, and the fourth metal connection structure 608 is electrically connected to the first internal pad 205. The fifth metal connection structure 609 and the first external connection pad 206 are electrically connected. Electrical connection.

In another embodiment, referring to FIG. 33, the sixth metal connection structure 708 is located on the input pad surface of the second data processing chip 701, and the seventh metal connection structure 709 is located on the surface of the output pad 702 of the second data processing chip 701. The second data processing chip 701 is flipped on the front surface of the acceleration sensor 31, the sixth metal connection structure 708 is electrically connected to the second internal pad 305, and the seventh metal connection structure 709 is electrically connected to the second external connection pad 306.

In another embodiment, referring to FIG. 34, the eighth metal connection structure 808 is located on the surface of the input pad 803 of the third data processing chip 801, and the ninth metal connection structure 809 is located on the surface of the output pad 802 of the third data processing chip 801. The third data processing chip 801 is flipped on the front surface of the magnetic induction sensor 41, the eighth metal connection structure 808 is electrically connected to the third internal pad 405, and the ninth metal connection structure 809 is electrically connected to the sixth external connection 406 pad. .

Referring to FIG. 35, a substrate 100 is provided. The substrate 100 includes a first surface 101 and an opposite second surface 102. The substrate 100 has interconnection lines. In the embodiment, the interconnection lines include the first substrate 100. An interconnection 140 and a second interconnection 141;

The gyro sensor module 61 and the acceleration sensor module 71 shown in FIGS. 26 and 27 are respectively mounted on the first surface 101 of the substrate 100, and the first external contact pads 206 of the gyro sensor module 61 pass through the first metal connection structure 109 and The interconnection (the first interconnection 140) is electrically connected, and the second external pad 306 of the acceleration sensor module 71 is electrically connected to the interconnection (the second interconnection 141) through the second metal connection structure 108;

The interconnection further includes a metal wiring layer 110 on the second surface 102 of the substrate 100, and a metal wiring layer 110 is formed on the second surface 102 of the substrate 100;

The magnetic induction sensor module 81 shown in FIG. 34 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 406 of the magnetic induction sensor module 81 is electrically connected to the interconnection (metal wiring layer 110) through the third metal connection structure 407. ;

A plurality of solder bumps are formed on the second surface 102 of the substrate 100, and the solder bumps are electrically connected to the interconnecting lines. Specifically, the solder bumps include a first solder bump 112, a second solder bump 114, and a third solder bump. From 113, the first solder bumps 112 are electrically connected to the first interconnecting lines 140, the second solder bumps 114 are electrically connected to the second interconnecting lines 141, and the third solder bumps 113 are electrically connected to the metal wiring layer 110.

In this embodiment, the first metal connection structure 109 and the second metal connection structure 108 are metal wires formed by a wire bonding process.

In another embodiment, referring to FIG. 36, the gyro sensor module 61 and the acceleration sensor module 71 shown in FIG. 29 and FIG. 30 are respectively mounted on the first surface 101 of the substrate 100, and the first external connection of the gyro sensor module 61 The pad 206 is electrically connected to the first interconnect line 140 through the first metal connection structure 207, and the second outer contact pad 306 of the acceleration sensor module 71 is electrically connected to the second interconnect line 141 through the second metal connection structure 307; The magnetic induction sensor module 81 shown at 28 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 406 of the magnetic induction sensor module 81 is electrically connected to the metal wiring layer 110 through the third metal connection structure 130.

The third metal connection structure 130 is a metal wire formed by a wire bonding process. The two ends of the third metal connection structure 130 are electrically connected to the third external pad and the metal circuit layer, respectively, and the middle portion of the third metal connection structure 130 is suspended. On both sides of the magnetic induction sensor.

In another embodiment, referring to FIG. 37, the gyro sensor module 61 and the acceleration sensor module 71 shown in FIGS. 32 and 33 are respectively mounted on the first surface 101 of the substrate 100, and the first of the gyro sensor module 61 The external pad 206 is electrically connected to the first interconnection 140 through the first metal connection structure 207, and the second external connection pad 306 of the acceleration sensor module 71 is electrically connected to the second interconnection 141 through the second metal connection structure 307; The magnetic induction sensor module 81 shown in FIG. 31 is mounted on the second surface 102 of the substrate 100, and the third external contact pad 406 of the magnetic induction sensor module 81 is electrically connected to the metal wiring layer 110 through the third metal connection structure 407.

It should be noted that, in this embodiment, the package structure can be combined by using any of the modules shown in FIG. 26 to FIG. 34 to implement integrated packaging of the gyro sensor module 61, the acceleration sensor module 71, and the magnetic induction sensor module 81.

The embodiment of the invention further provides a MEMS sensor package structure. Referring to FIG. 35, the method includes:

a substrate 100 including a first surface 101 having an interconnecting line and an opposite second surface 102, the interconnecting line including a first interconnecting line 140 and a second interconnecting layer in the substrate 100 Connecting line 141;

A gyro sensor module 61, an acceleration sensor module 71 and a magnetic induction sensor module 81, the gyro sensor module 61 includes a gyro sensor 21 and a first data processing chip 601 electrically connected to the gyro sensor 21 and a first external pad 206 The acceleration sensor module 71 includes an acceleration sensor 31 and a second data processing chip 701 and a second external pad 306 electrically connected to the acceleration sensor 31. The magnetic induction sensor module 81 includes a magnetic induction sensor 41 connected to the magnetic induction sensor 41. a third data processing chip 801 and a third external pad 406;

The gyro sensor module 61 and the acceleration sensor module 71 are respectively mounted on the first surface of the substrate, and the first external pad 206 of the gyro sensor module 61 passes through the first metal connection structure 109 and the interconnection (the first interconnection 140) Electrically connected, the second external pad 306 of the acceleration sensor module 71 is electrically connected to the interconnection (second interconnection 141) through the second metal connection structure 108;

The interconnect line further includes a metal circuit layer 110 on the second surface 102 of the substrate 100;

The magnetic induction sensor module 81 is mounted on the second surface 102 of the substrate 100, and the third external connection pad 406 of the magnetic induction sensor module 81 is electrically connected to the interconnection (metal circuit layer 110) through the third metal connection structure 407;

a plurality of solder bumps on the second surface 102 of the substrate 100, the solder bumps being electrically connected to the interconnect lines, the solder bumps including the first solder bumps 112, the second solder bumps 114, and the third solder The protrusion 113, the first solder bump 112 is electrically connected to the first interconnecting line 140, the second solder bump 114 is electrically connected to the second interconnecting line 141, and the third solder bump 113 is electrically connected to the metal wiring layer 110.

In an embodiment, the gyro sensor includes a front surface and an opposite back surface, the front surface of the gyro sensor has a plurality of first inner pads and a first outer pad, and the first data processing chip is located on the front surface of the gyro sensor. The first data processing chip is electrically connected to the first inner pad and the first outer pad, the acceleration sensor includes a front surface and an opposite back surface, and the front surface of the acceleration sensor has a plurality of second inner pads and second outer pads, The second data processing chip is electrically connected to the front surface of the acceleration sensor, and the second data processing chip is electrically connected to the second inner pad and the second outer pad. The magnetic induction sensor includes a front surface and an opposite back surface, and the front surface of the magnetic induction sensor has a third internal solder. And a third external processing pad, the third data processing chip is located on the front surface of the magnetic induction sensor, and the third data processing chip is electrically connected to the third internal pad and the third external pad.

In one embodiment, the first data processing chip includes an input pad and an output pad, and an input pad of the first data processing chip is electrically connected to the first internal pad, and an output pad of the first data processing chip is The first external pad is electrically connected, the second data processing chip includes an input pad and an output pad, the input pad of the second data processing chip is electrically connected to the second internal pad, and the output of the second data processing chip is soldered The disk is electrically connected to the second external processing pad, the third data processing chip includes an input pad and an output pad, and the input pad of the third data processing chip is electrically connected to the third internal pad, and the third data processing chip The output pad is electrically connected to the third external pad.

In one embodiment, the first data processing chip includes a front side and an opposite back side, the input pad and the output pad are located on a front side of the first data processing chip, and the input pad of the first data processing chip is connected through the fourth metal The structure is electrically connected to the first internal pad, the output pad of the first data processing chip is electrically connected to the first external pad through a fifth metal connection structure, the second data processing chip includes a front surface and an opposite back surface, and the input solder The disk and the output pad are located on the front side of the second data processing chip, the input pad of the second data processing chip is electrically connected to the second internal pad through the sixth metal connection structure, and the output pad of the second data processing chip passes the seventh The metal connection structure is electrically connected to the second external processing pad, the third data processing chip includes a front surface and an opposite back surface, the input pad and the output pad are located on the front side of the third data processing chip, and the input processing of the third data processing chip The disk is electrically connected to the third internal pad through the eighth metal connection structure, and the output pad of the third data processing chip passes through the ninth metal connection structure and Three external pads are electrically connected.

In one embodiment, the back surface of the first data processing chip is attached to the front surface of the gyro sensor, the back surface of the second data processing chip is attached to the front surface of the acceleration sensor, and the back surface of the third data processing chip is attached to the magnetic sensor. a front surface of the sensor, a fourth metal connection structure, a fifth metal connection structure, a sixth metal connection structure, a seventh metal connection structure, an eighth metal connection structure, and a ninth metal connection structure are metal wires, a fourth metal connection structure, and a The middle portion of the five metal connection structure is suspended on both sides of the first data processing chip, and the two ends of the fourth metal connection structure are electrically connected to the input pad of the first data processing chip and the first internal pad, respectively, and the fifth metal connection The two ends of the structure are electrically connected to the output pads of the first data processing chip and the first external pads, respectively, and the intermediate portions of the sixth metal connection structure and the seventh metal connection structure are suspended on both sides of the second data processing chip, sixth The two ends of the metal connection structure are electrically connected to the input pads of the second data processing chip and the second internal pads, respectively, and the seventh metal connection The output pads of the second data processing chip and the second external pads are respectively electrically connected, and the intermediate portions of the seventh metal connection structure and the eighth metal connection structure are suspended on both sides of the third data processing chip, and the eighth metal connection structure The two ends are electrically connected to the input pad of the third data processing chip and the third internal pad, respectively, and the two ends of the ninth metal connection structure are electrically connected to the output pad of the third data processing chip and the third external pad respectively. .

In one embodiment, the back surface of the first data processing chip is attached to the front surface of the gyro sensor, the back surface of the second data processing chip is attached to the front surface of the acceleration sensor, and the back surface of the third data processing chip is attached to the magnetic sensor. a front surface of the sensor, the fourth metal connection structure penetrating the back surface and a portion of the thickness of the first data processing chip, and electrically connected to the input pad of the front surface of the first data processing chip, the fifth metal connection structure penetrating the back surface of the first data processing chip and a portion of the thickness and electrically connected to the output pad on the front side of the first data processing chip, the sixth metal connection structure penetrating through the back surface and a portion of the thickness of the second data processing chip, and electrically connected to the input pad on the front side of the second data processing chip, The seventh metal connection structure penetrates the back surface and the partial thickness of the second data processing chip, and is electrically connected to the output pad of the front surface of the second data processing chip, and the eighth metal connection structure penetrates the back surface and the partial thickness of the third data processing chip, and Electrically connected to the input pad on the front side of the third data processing chip, and the ninth metal connection structure runs through the third The back side and a portion of the thickness of the data processing chip are electrically connected to the output pad on the front side of the third data processing chip.

In an embodiment, the back surfaces of the first data processing chip, the second data processing chip, and the third data processing chip form a recess.

In one embodiment, the fourth metal connection structure is located on the input pad surface of the first data processing chip, the fifth metal connection structure is located on the output pad surface of the first data processing chip, and the sixth metal connection structure is located in the second data processing The input pad surface of the chip, the seventh metal connection structure is located on the output pad surface of the second data processing chip, the eighth metal connection structure is located on the input pad surface of the third data processing chip, and the ninth metal connection structure is located in the third data Processing the output pad surface of the chip, the first data processing chip is flipped on the front surface of the gyro sensor, the second data processing chip is flipped on the front surface of the acceleration sensor, and the third data processing chip is flipped On the front side of the magnetic induction sensor.

In one embodiment, the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal lines, and the two ends of the first metal connection structure are respectively An external pad is electrically connected to the first interconnecting line, and a middle portion of the first metal connecting structure is suspended on both sides of the gyro sensor, and two ends of the second metal connecting structure are respectively connected to the second external pad and the second interconnecting line Electrically connected, the middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor.

In one embodiment, the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, the first metal connection structure penetrating the back surface and the partial thickness of the gyro sensor, and the first surface of the gyro sensor The external pad is electrically connected, and the second metal connection structure penetrates the back surface and the partial thickness of the acceleration sensor and is electrically connected to the second external pad of the front surface of the acceleration sensor.

In one embodiment, the back side of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are respectively electrically connected to the third external connection pad and the metal circuit layer. The middle portion of the third metal connection structure is suspended on both sides of the magnetic induction sensor.

In one embodiment, the back of the magnetic induction sensor is attached to the second surface of the substrate, and the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor and is electrically connected to the third external pad of the front surface of the magnetic induction sensor.

The present invention has been disclosed in the preferred embodiments as described above, but it is not intended to limit the invention, and the present invention may be utilized by the method and technical contents disclosed above without departing from the spirit and scope of the invention. The technical solutions make possible changes and modifications. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments in accordance with the technical spirit of the present invention are not included in the technical solutions of the present invention. protected range.

Claims (40)

1. A method for forming a MEMS sensor package structure, comprising:

   Providing a substrate, the substrate comprising a first surface and an opposite second surface, the substrate having interconnecting lines;

   Providing a gyro sensor, an acceleration sensor, and a magnetic induction sensor, each of the gyro sensor, the acceleration sensor and the magnetic induction sensor comprising a front surface and an opposite back surface, the front surface of the gyro sensor comprising a plurality of first external pads, the acceleration sensor The front surface includes a plurality of second external pads, and the front surface of the magnetic induction sensor includes a plurality of third external pads;

   The gyro sensor and the acceleration sensor are respectively mounted on the first surface of the substrate, and the first external pad of the gyro sensor is electrically connected to the interconnection through the first metal connection structure, and the second external pad of the acceleration sensor passes the The two metal connection structure is electrically connected to the interconnection line;

   Mounting the magnetic induction sensor on the second surface of the substrate, and the third external pad of the magnetic induction sensor is electrically connected to the interconnection through the third metal connection structure;

   A plurality of solder bumps are formed on the second surface of the substrate, the solder bumps being electrically connected to the interconnect lines for electrically connecting to an external circuit.
2. A method of forming a MEMS sensor package structure according to claim 1, wherein said interconnection line comprises a first interconnection line and a second interconnection line in the substrate, and a metal line on the second surface The first interconnect line, the second interconnect line and the metal circuit layer are insulated from each other, and the first external pad of the gyro sensor is electrically connected to the first interconnect line through the first metal connection structure, and the second external connection of the acceleration sensor The pad is electrically connected to the second interconnection through the second metal connection structure, and the third external pad of the magnetic induction sensor is electrically connected to the metal circuit layer through the third metal connection structure; forming a plurality of soldering on the second surface of the substrate a protrusion, the welder protrusion includes a first solder bump, a second solder bump, and a third solder bump, the first solder bump being electrically connected to the first interconnecting line, and the second solder bump The second interconnecting line is electrically connected, and the third soldering bump is electrically connected to the metal wiring layer.
3. The method of forming a MEMS sensor package structure according to claim 2, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal a wire, the two ends of the first metal connection structure are electrically connected to the first external pad and the first interconnection, respectively, and the middle portion of the first metal connection structure is suspended on both sides of the gyro sensor, and both ends of the second metal connection structure The second outer connecting pad and the second interconnecting line are respectively electrically connected, and the middle portion of the second metal connecting structure is suspended on both sides of the acceleration sensor.
4. The method of forming a MEMS sensor package structure according to claim 3, further comprising: forming a dispensing layer covering at least the metal line.
5. The method of forming a MEMS sensor package structure according to claim 4, wherein after the formation of the dispensing layer, the magnetic induction sensor is mounted on the second surface of the substrate; and the magnetic induction sensor is mounted on the second surface of the substrate After the surface, a plurality of solder bumps are formed on the second surface of the substrate.
6. The method of forming a MEMS sensor package structure according to claim 2, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure penetrates the back surface of the gyro sensor And a portion of the thickness and electrically connected to the first external pad of the front surface of the gyro sensor, the second metal connection structure penetrating through the back surface and the partial thickness of the acceleration sensor, and electrically connected to the second external pad of the front surface of the acceleration sensor.
7. The method of forming a MEMS sensor package structure according to claim 2, wherein the gyro sensor and the acceleration sensor are respectively flipped on the first surface of the substrate, and the first metal connection structure is located on the first external soldering The surface of the disk, the second metal connection structure is located on the surface of the second external pad.
8. The method of forming a MEMS sensor package structure according to claim 1, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the gyro sensor further includes an angular velocity sensing area, the gyroscope a first sealing cover is disposed on the front surface of the sensor, the first sealing cover seals the angular velocity sensing area, and a plurality of first external bonding pads are located on two sides of the first sealing cover; the acceleration sensor further includes an acceleration sensing area, and the acceleration sensor has a front surface The second sealing cover seals the acceleration sensing area, and the plurality of second external pads are located on two sides of the second sealing cover.
9. The method of forming a MEMS sensor package structure according to claim 2, wherein the magnetic induction sensor is flipped on a second surface of the substrate, and the third metal connection structure is located on a surface of the third external pad; or The back side of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure is a metal line, and the two ends of the third metal connection structure are electrically connected to the third external connection pad and the metal layer respectively, and the third metal connection structure is The middle portion is suspended on both sides of the magnetic induction sensor; or the back surface of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure penetrates the back surface and a portion of the thickness of the magnetic induction sensor, and is connected to the third external connection of the front surface of the magnetic induction sensor. Disk connection.
10. The method of forming a MEMS sensor package structure according to claim 1, further comprising a data processing chip, wherein the data processing chip is electrically connected to the interconnection.
11. The method of forming a MEMS sensor package structure according to claim 10, wherein the interconnection line comprises a third interconnection line and a fourth interconnection line in the substrate, and is located on the second surface of the substrate a plurality of first metal circuit layers and a plurality of second metal circuit layers, the third interconnection line, the fourth interconnection line, the first metal circuit layer and the second metal circuit layer are insulated from each other; the first external welding of the gyro sensor The disk is electrically connected to the third interconnection through the first metal connection structure, and the second external pad of the acceleration sensor is electrically connected to the fourth interconnection through the second metal connection structure; the third external pad of the magnetic induction sensor passes the third The metal connection structure is electrically connected to the first metal circuit layer; the data processing chip is mounted on the second surface of the substrate, the data processing chip and the third interconnection line, the fourth interconnection line, the first metal line layer and the second metal circuit layer Electrically connecting; the solder bump is located on a surface of the second metal wiring layer on the second surface of the substrate.
12. The method of forming a MEMS sensor package structure according to claim 11, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal. a wire, the two ends of the first metal connection structure are electrically connected to the first outer pad and the third interconnect line, respectively, the middle portion of the first metal connection structure is suspended on both sides of the gyro sensor, and the two ends of the second metal connection structure Electrically connected to the second external pad and the fourth interconnection, respectively, the middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor; or the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, The first metal connection structure penetrates the back surface and a portion of the thickness of the gyro sensor, and is electrically connected to the first external pad of the front surface of the gyro sensor, and the second metal connection structure penetrates the back surface and the partial thickness of the acceleration sensor, and Electrically connected to a second external pad on the front side of the acceleration sensor; or the gyro sensor and acceleration Flip respectively on a first surface of the substrate, the first surface of the first metal structure is located external connection pads located on a second surface of the second metal structure external connection pad.
13. The method of forming a MEMS sensor package structure according to claim 12, wherein the gyro sensor and the acceleration sensor are respectively mounted on the first surface of the substrate and the step of mounting the data processing chip on the second surface of the substrate And further comprising: forming a dispensing layer covering at least the metal wire.
14. The method of forming a MEMS sensor package structure according to claim 11, wherein the signal processing chip is flipped on the second surface of the substrate; or the back surface of the signal processing chip is attached to the second surface of the substrate. And the signal processing chip is electrically connected to the third interconnection line, the fourth interconnection line, and the second metal line layer through the metal line.
15. A method of forming a MEMS sensor package structure according to claim 10, wherein said interconnect line comprises a fifth interconnect line and a sixth interconnect line in the substrate, and a plurality of first surfaces on the substrate a third metal circuit layer and a plurality of fourth metal circuit layers, the fifth interconnection line, the sixth interconnection line, the third metal circuit layer and the fourth metal circuit layer are insulated from each other; the first external pad of the gyro sensor passes the a metal connection structure is electrically connected to the third metal circuit layer, and the second external connection pad of the acceleration sensor is electrically connected to the fourth metal circuit layer through the second metal connection structure; the third external connection pad of the magnetic induction sensor passes through the third metal connection structure Electrically connecting with the fifth interconnection line; the data processing chip is mounted on the first surface of the substrate, and the data processing chip is electrically connected to the third metal circuit layer, the fourth metal circuit layer, the fifth interconnection line, and the sixth interconnection line; The interconnection further includes a plurality of fifth metal circuit layers on the second surface of the substrate, the fifth metal circuit layer being electrically connected to the sixth interconnection, soldering A fifth projection positioned on the surface of the metal wiring layer, and is electrically connected to the fifth metal wiring layer.
16. The method of forming a MEMS sensor package structure according to claim 1, further comprising a first data processing chip, a second data processing chip, and a third data processing chip, the first data processing chip and the gyro sensor Electrically connected, the second data processing chip is electrically connected to the acceleration sensor, and the third data processing chip is electrically connected to the magnetic induction sensor.
17. A method of forming a MEMS sensor package structure according to claim 16 wherein said interconnect line comprises a first interconnect line and a second interconnect line in the substrate, and on a second surface of the substrate a metal circuit layer; the first external pad of the gyro sensor is electrically connected to the first interconnection through the first metal connection structure, and the second external pad of the acceleration sensor is electrically connected to the second interconnection through the second metal connection structure The third outer pad of the magnetic induction sensor is electrically connected to the metal circuit layer through the third metal connection structure; the solder bump is formed on the second surface of the substrate, and the solder bump includes the first solder bump and the second solder bump And a third solder bump, the first solder bump is electrically connected to the first interconnecting line, the second solder bump is electrically connected to the second interconnecting line, and the third solder bump is electrically connected to the metal wiring layer.
18. The method of forming a MEMS sensor package structure according to claim 17, wherein the front surface of the gyro sensor has a plurality of first internal pads and a first external pads, and the first data processing chip is located on the front surface of the gyro sensor. The first data processing chip is electrically connected to the first inner pad and the first outer pad. The front surface of the acceleration sensor has a plurality of second inner pads and second outer pads, and the second data processing chip is located on the front side of the acceleration sensor. The second data processing chip is electrically connected to the second internal pad and the second external pad, the front surface of the magnetic induction sensor has a third internal pad and a third external pad, and the third data processing chip is located on the front surface of the magnetic induction sensor, and the third The data processing chip is electrically connected to the third internal pad and the third external pad.
19. The method of forming a MEMS sensor package structure according to claim 18, wherein said first data processing chip comprises a front side and an opposite back side, and said front side of said first data processing chip has an input pad and an output pad The input pad of the first data processing chip is electrically connected to the first internal pad through the fourth metal connection structure, and the output pad of the first data processing chip is electrically connected to the first external pad through the fifth metal connection structure. The second data processing chip includes a front surface and an opposite back surface, the input pad and the output pad are located on the front surface of the second data processing chip, and the input pad of the second data processing chip passes through the sixth metal connection structure and the second internal pad Electrically connected, the output pad of the second data processing chip is electrically connected to the second external pad through a seventh metal connection structure, the third data processing chip includes a front surface and an opposite back surface, and the input pad and the output pad are located at the The front surface of the three data processing chip, the input pad of the third data processing chip is electrically connected to the third internal pad through the eighth metal connection structure, The output pad of the third data processing chip is electrically connected to the third external pad through the ninth metal connection structure.
20. The method of forming a MEMS sensor package structure according to claim 19, wherein a back surface of the first data processing chip is attached to a front surface of the gyro sensor, and a back surface of the second data processing chip is attached to the acceleration sensor. a front surface of the third data processing chip is attached to the front surface of the magnetic induction sensor; or the first data processing chip is flipped on the front surface of the gyro sensor, and the second data processing chip is flipped on the front surface of the acceleration sensor The third data processing chip is flipped on the front side of the magnetic induction sensor.
21. The method of forming a MEMS sensor package structure according to claim 20, wherein a back surface of the first data processing chip is attached to a front surface of the gyro sensor, and a back surface of the second data processing chip is attached to the acceleration sensor. When the back surface of the third data processing chip is attached to the front surface of the magnetic induction sensor, the back surfaces of the first data processing chip, the second data processing chip and the third data processing chip form a groove.
22. The method of forming a MEMS sensor package structure according to claim 1, wherein the gyro sensor is a three-axis gyro sensor, the acceleration sensor is a three-axis acceleration sensor, and the magnetic induction sensor is a three-axis magnetic induction sensor. .
23. A MEMS sensor package structure, comprising:

    a substrate comprising a first surface and an opposite second surface, the substrate having interconnecting lines;

    a gyro sensor, an acceleration sensor, and a magnetic induction sensor, each of the gyro sensor, the acceleration sensor, and the magnetic induction sensor includes a front surface and an opposite back surface, and the front surface of the gyro sensor includes a plurality of first external pads, a front surface of the acceleration sensor a plurality of second external pads, the front surface of the magnetic induction sensor includes a plurality of third external pads; the gyro sensor and the acceleration sensor are mounted on the first surface of the substrate, and the first external pads of the gyro sensor pass the first The metal connection structure is electrically connected to the interconnection line, and the second external connection pad of the acceleration sensor is electrically connected to the interconnection line through the second metal connection structure; the magnetic induction sensor is mounted on the second surface of the substrate, and the third external connection of the magnetic induction sensor The disk is electrically connected to the interconnection through the third metal connection structure;

    A plurality of solder bumps on the second surface of the substrate, the solder bumps being electrically connected to the interconnect lines for electrically connecting to an external circuit.
24. A MEMS sensor package structure according to claim 23, wherein said interconnection line comprises a first interconnection line and a second interconnection line in the substrate, and a metal wiring layer on the second surface, An interconnection line, a second interconnection line and a metal circuit layer are insulated from each other, and the first external connection pad of the gyro sensor is electrically connected to the first interconnection line through the first metal connection structure, and the second external connection pad of the acceleration sensor passes The second metal connection structure is electrically connected to the second interconnection line, and the third external connection pad of the magnetic induction sensor is electrically connected to the metal circuit layer through the third metal connection structure; a plurality of solder bumps on the second surface of the substrate, the soldering The machine protrusion includes a first welding protrusion, a second welding protrusion and a third welding protrusion, the first welding protrusion is electrically connected to the first interconnection line, and the second welding protrusion is electrically connected to the second interconnection line The third solder bump is electrically connected to the metal wiring layer.
25. The MEMS sensor package structure according to claim 24, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal wires, Two ends of a metal connection structure are electrically connected to the first external pad and the first interconnection, respectively, and the middle portion of the first metal connection structure is suspended on both sides of the gyro sensor, and the two ends of the second metal connection structure are respectively The second external pad and the second interconnection are electrically connected, the middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor; or the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, a metal connection structure penetrates the back surface and a portion of the thickness of the gyro sensor, and is electrically connected to the first external pad of the front surface of the gyro sensor, the second metal connection structure penetrates the back surface and the partial thickness of the acceleration sensor, and the acceleration sensor The second external pad of the front surface is electrically connected; or the gyro sensor and the acceleration sensor are respectively inverted On a first surface of the substrate, the first surface of the first metal structure is located external connection pads located on a second surface of the second metal structure external connection pad.
26. The MEMS sensor package of claim 25, further comprising: a glue layer that at least seals the metal lines.
27. The MEMS sensor package structure according to claim 25, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the gyro sensor further includes an angular velocity sensing area on the front surface of the gyro sensor Having a first sealing cover, the first sealing cover sealing the angular velocity sensing area, a plurality of first external pads are located on both sides of the first sealing cover; the acceleration sensor further comprises an acceleration sensing area, and the second surface of the acceleration sensor has a second sealing cover The second sealing cover seals the acceleration sensing area, and the plurality of second external pads are located on two sides of the second sealing cover.
28. The MEMS sensor package structure according to claim 24, wherein the magnetic induction sensor is flipped on a second surface of the substrate, the third metal connection structure is located on a surface of the third external pad; or the magnetic induction The back surface of the sensor is attached to the second surface of the substrate, the third metal connection structure is a metal wire, and the two ends of the third metal connection structure are electrically connected to the third external connection pad and the metal circuit layer respectively, and the middle portion of the third metal connection structure Hanging on both sides of the magnetic induction sensor; or the back of the magnetic induction sensor is attached to the second surface of the substrate, the third metal connection structure penetrating the back surface and the partial thickness of the magnetic induction sensor, and electrically connected to the third external connection pad on the front surface of the magnetic induction sensor connection.
29. The MEMS sensor package of claim 23, further comprising a data processing chip, the data processing chip being electrically coupled to the interconnect.
30. A MEMS sensor package structure according to claim 29, wherein said interconnect line comprises a third interconnect line and a fourth interconnect line in the substrate, and a plurality of first ones on the second surface of the substrate The metal circuit layer and the plurality of second metal circuit layers, the third interconnection line, the fourth interconnection line, the first metal circuit layer and the second metal circuit layer are insulated from each other; the first external pad of the gyro sensor passes the a metal connection structure is electrically connected to the third interconnection line, and the second external connection pad of the acceleration sensor is electrically connected to the fourth interconnection line through the second metal connection structure; the third external connection pad of the magnetic induction sensor passes through the third metal connection structure Electrically connecting with the first metal circuit layer; the data processing chip is mounted on the second surface of the substrate, and the data processing chip is electrically connected to the third interconnection line, the fourth interconnection line, the first metal line layer and the second metal line layer; The solder bump is located on a surface of the second metal wiring layer on the second surface of the substrate and is electrically connected to the second metal wiring layer.
31. The MEMS sensor package structure according to claim 30, wherein the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, and the first metal connection structure and the second metal connection structure are metal wires, Two ends of a metal connection structure are electrically connected to the first outer pad and the third interconnect line, respectively, and the middle portion of the first metal connection structure is suspended on both sides of the gyro sensor, and the two ends of the second metal connection structure are respectively The second external pad and the fourth interconnection are electrically connected, the middle portion of the second metal connection structure is suspended on both sides of the acceleration sensor; or the back surface of the gyro sensor and the acceleration sensor are attached to the first surface of the substrate, a metal connection structure penetrates the back surface and a portion of the thickness of the gyro sensor, and is electrically connected to the first external pad of the front surface of the gyro sensor, the second metal connection structure penetrates the back surface and the partial thickness of the acceleration sensor, and the acceleration sensor The second external pad of the front surface is electrically connected; or the gyro sensor and the acceleration sensor are respectively inverted On a first surface of the substrate, the first surface of the first metal structure is located external connection pads located on a second surface of the second metal structure external connection pad.
32. The MEMS sensor package structure according to claim 29, wherein the signal processing chip is flipped on the second surface of the substrate; or the back surface of the signal processing chip is attached to the second surface of the substrate, the signal The processing chip is electrically connected to the third interconnect line, the fourth interconnect line, and the second metal line layer through the metal line.
33. The MEMS sensor package structure of claim 29 wherein said interconnect line comprises a fifth interconnect line and a sixth interconnect line in the substrate, and a plurality of third metal on the first surface of the substrate The circuit layer and the plurality of fourth metal circuit layers, the fifth interconnection line, the sixth interconnection line, the third metal circuit layer and the fourth metal circuit layer are insulated from each other; the first external pad of the gyro sensor is connected by the first metal The structure is electrically connected to the third metal circuit layer, and the second external pad of the acceleration sensor is electrically connected to the fourth metal circuit layer through the second metal connection structure; the third external connection pad of the magnetic induction sensor passes the third metal connection structure and the fifth An interconnection circuit is electrically connected; a data processing chip is mounted on the first surface of the substrate, and the data processing chip is electrically connected to the third metal circuit layer, the fourth metal circuit layer, the fifth interconnection line, and the sixth interconnection line; The connection circuit further includes a plurality of fifth metal circuit layers on the second surface of the substrate, the fifth metal circuit layer being electrically connected to the sixth interconnection line, the solder bumps being located The surface of the fifth metal circuit layer is electrically connected to the fifth metal circuit layer.
34. The MEMS sensor package structure according to claim 23, further comprising a first data processing chip, a second data processing chip and a third data processing chip, wherein the first data processing chip is electrically connected to the gyro sensor, The second data processing chip is electrically connected to the acceleration sensor, and the third data processing chip is electrically connected to the magnetic induction sensor.
35. A MEMS sensor package structure according to claim 34, wherein said interconnection comprises a first interconnection line and a second interconnection line in the substrate, and a metal wiring layer on the second surface of the substrate The first external pad of the gyro sensor is electrically connected to the first interconnection through the first metal connection structure, and the second external pad of the acceleration sensor is electrically connected to the second interconnection through the second metal connection structure; the magnetic induction sensor The third external pad is electrically connected to the metal circuit layer through the third metal connection structure; a plurality of solder bumps on the second surface of the substrate, the solder bumps including the first solder bump, the second solder bump, and the first The third solder bump is electrically connected to the first interconnecting line, the second solder bump is electrically connected to the second interconnecting line, and the third soldering bump is electrically connected to the metal wiring layer.
36. The MEMS sensor package structure according to claim 35, wherein the front surface of the gyro sensor has a plurality of first inner pads and a first outer pad, and the first data processing chip is located on the front surface of the gyro sensor, first The data processing chip is electrically connected to the first internal pad and the first external pad. The front surface of the acceleration sensor has a plurality of second internal pads and a second external pad. The second data processing chip is located on the front side of the acceleration sensor, and the second data is The processing chip is electrically connected to the second internal pad and the second external pad, the front surface of the magnetic induction sensor has a third internal pad and a third external pad, and the third data processing chip is located on the front surface of the magnetic induction sensor, and the third data processing chip Electrically connected to the third inner pad and the third outer pad.
37. The MEMS sensor package structure according to claim 36, wherein said first data processing chip comprises a front side and an opposite back side, and said front side of said first data processing chip has an input pad and an output pad, first The input pad of the data processing chip is electrically connected to the first internal pad through the fourth metal connection structure, and the output pad of the first data processing chip is electrically connected to the first external pad through the fifth metal connection structure, the second The data processing chip includes a front surface and an opposite back surface, the input pad and the output pad are located on the front surface of the second data processing chip, and the input pad of the second data processing chip is electrically connected to the second internal pad through the sixth metal connection structure. The output pad of the second data processing chip is electrically connected to the second external pad through a seventh metal connection structure, the third data processing chip includes a front surface and an opposite back surface, and the input pad and the output pad are located in the third data processing On the front side of the chip, the input pad of the third data processing chip is electrically connected to the third internal pad through the eighth metal connection structure, and the third data portion Chip output pad is connected to the third external connection structure of the ninth through the metal pad electrically.
38. The MEMS sensor package structure according to claim 37, wherein the back surface of the first data processing chip is attached to the front surface of the gyro sensor, and the back surface of the second data processing chip is attached to the front surface of the acceleration sensor. a back surface of the three data processing chip is attached to the front surface of the magnetic induction sensor; or the first data processing chip is flipped on the front surface of the gyro sensor, and the second data processing chip is flipped on the front surface of the acceleration sensor, The third data processing chip is flipped on the front side of the magnetic induction sensor.
39. The MEMS sensor package structure according to claim 38, wherein the back surfaces of the first data processing chip, the second data processing chip, and the third data processing chip form a recess.
40. The MEMS sensor package structure according to claim 23, wherein the gyro sensor is a three-axis gyro sensor, the acceleration sensor is a three-axis acceleration sensor, and the magnetic induction sensor is a three-axis magnetic induction sensor.

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