KR102341840B1 - Sensor Package - Google Patents

Abstract

Embodiments of the present invention relate to the structure of a sensor package, and the bonding between the terminal pattern and the metal pattern of the sensing element is not implemented in a separate UBM (Under Bump Metallurgy) on the terminal pattern of the sensing element, but is applied to the metal pattern on the PCB. It is characterized in that it is joined by realizing a solder joint layer.

Description

Sensor Package

Embodiments of the present invention relate to the structure of a sensor package.

A sensor that detects various environmental conditions such as gas, pressure, infrared rays, and humidity has recently used a semiconductor structure called a sensing device. In general, such a sensing device operates in a manner of analyzing information of a measured state by reading a sensing unit implementing sensing and reading the sensing signal to analyze a changing signal value.

Taking a gas sensor as an example, a sensing device of a recent semiconductor chip structure is implemented, and it is implemented by mounting it on a circuit pattern of a printed circuit board (PCB). It is formed between the patterns, and mutual bonding is realized. In this case, aluminum is generally used as an input/output pad corresponding to a terminal provided in the sensing element. However, since aluminum has poor wettability with solder bumps, a plurality of metal layers called UBM (Under Bump Metallurgy) are formed on the aluminum pad to secure wettability. Such a UBM layer is an essential component in order to strengthen the bondability, and it is implemented by performing multi-layer plating, which causes a problem in that the process becomes complicated and the cost rises.

Embodiments of the present invention have been devised to solve the above-described problem, and in particular, bonding between the terminal pattern and the metal pattern of the sensing element is not implemented in a separate UBM (Under Bump Metallurgy) in the terminal pattern of the sensing element, By implementing and bonding the solder bonding layer to the metal pattern on the PCB, the manufacturing process is simplified and the process cost is reduced, the reliability of bonding is improved, and the flow of the solder bonding layer inside the metal pattern to which the terminal pattern of the sensing element is bonded. It is possible to provide a sensing device capable of eliminating the defect rate due to short circuit by implementing a dam pattern to prevent flow.

As a means for solving the above problems, in an embodiment of the present invention, a sensing device including a first substrate including a metal pattern and a terminal pattern bonded to the metal pattern, and disposed between the bonding pad and the terminal pattern It makes it possible to provide a sensor package including a solder bonding layer. In addition, in order to eliminate defects due to diffusion of the solder bonding layer, a first dam pattern having a structure in which the surface of the first substrate is exposed inside the metal pattern may be further included.

According to an embodiment of the present invention, the bonding between the terminal pattern and the metal pattern of the sensing device is not implemented in a separate UBM (Under Bump Metallurgy) in the terminal pattern of the sensing device, but a solder bonding layer is implemented in the metal pattern on the PCB. By joining, the manufacturing process is simplified, the process cost is reduced, and the reliability of the joining is improved.

In particular, by implementing a dam pattern that prevents the flow of the solder bonding layer inside the metal pattern to which the terminal pattern of the sensing element is bonded, there is an effect that the defect rate due to short circuit can be eliminated.

When the bonding structure according to the embodiment of the present invention is applied to a gas sensor package, a gas movement spacer is provided between the substrate and the gas sensing device in a structure in which the gas sensing device is mounted on the substrate by a flip chip bonding method. This has the effect of maximizing gas detection efficiency by inducing smooth gas movement.

In particular, a cover member is implemented on the upper surface of the device body to form a cavity in the gas sensing device to protect the device including the gas sensing part, while the cover member is fixed to the upper part of the adjacent device around the gas sensing device. This has the effect of strengthening the connection reliability between the device and the substrate.

In addition, when the bonding structure according to the embodiment of the present invention is applied to the gas sensor package, the sensing efficiency is increased by allowing the gas to stay on the cavity, while providing a through hole in the first substrate coupled to the package, Gas can be sensed by allowing gas to be introduced through the through hole, thereby increasing sensing efficiency, and forming a gas sensor having a very thin structure. In particular, since the gas sensing device is directly mounted on the metal electrode of the substrate, bar wire bonding is unnecessary, thereby reducing the package area and reducing the overall height of the package.

In addition, since a separate cap for protecting the sensing unit on the upper part of the sensor chip, which is essential for the existing gas sensing package, is unnecessary, the manufacturing cost can be further reduced, and the package can be further miniaturized. In addition, in addition to the primary gas inflow through the gas inlet hole of the substrate through the gas inlet for sensing, there is an advantage in that efficient sensing can be realized because gas is introduced through the spaced part on the side of the chip.

The gas sensor package of various embodiments of the present invention can be applied to the overall IT device in which the size reduction and cost reduction of the entire package are reflected through the aforementioned slimming and multifunctionalization.

1A to 1C are cross-sectional views and images showing the structure of a sensing package according to an embodiment of the present invention.
2 is a main cross-sectional view showing the structure of a sensing package according to another embodiment of the present invention.
3 is a conceptual diagram illustrating a mounting process flow chart of a sensing device and a substrate according to an embodiment of the present invention and problems thereof.
4 is a diagram illustrating a bonding process between a sensing device and a substrate according to another embodiment of the present invention.
5 is an image of a main part of the first dam pattern bonded to the terminal pattern of the present invention.
6 shows various embodiments of the first dam pattern of the present invention.
7 illustrates a structure of a dam pattern different from that of the first dam pattern of the present invention.
8 and 9 are partial cross-sectional views illustrating the structure of a gas sensor package to which the sensing package according to the embodiment of the present invention described above in FIGS. 1 to 7 is applied.
10 is a conceptual diagram showing the structure of a gas sensing device according to an embodiment of the present invention applied to the gas sensor package described above in FIGS. 8 and 9 .
FIG. 11 illustrates the implementation of a cover member for sealing the upper surface of the cavity, in particular, in the structure of the gas sensing device described above in FIG. 10 .
12 is a conceptual diagram illustrating a structure of a gas sensor package according to another embodiment of the present invention.
13 illustrates a top plan view of the package structure described above in FIG. 5 .
14 is a plan conceptual view of the package shown in FIGS. 12 and 13 viewed from the top.

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components are given the same reference, regardless of the reference numerals, and redundant description thereof will be omitted. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

1A to 1C are conceptual views illustrating a method for packaging a sensing device and a substrate according to an embodiment of the present invention.

Referring to the illustrated drawings, the sensing device according to an embodiment of the present invention includes a first substrate 210 including a metal pattern 220 and a terminal pattern 130 bonded to the metal pattern 220 . The sensing device 100 and the solder bonding layer 225 disposed between the metal pattern 220 and the terminal pattern 130 may be included. That is, by bonding the terminal pattern 130 of the sensing device 100 and the metal pattern 220 on the first substrate using a single solder bonding layer 225, a plurality of existing plating or deposition layers are implemented. The structure can be simplified by removing the UBM (Under Bump Metallurgy) layer, which is required, thereby reducing the cost and simplifying the process. In addition, since an incidental plating layer of the junction does not exist, the signal transmission resistance is reduced, so that the effect of increasing the efficiency of signal processing is realized.

The sensing device 100 may be implemented as a device having a semiconductor chip structure including a sensing unit 110 for sensing various external environments or stimulus elements, for example, a sensing device such as a gas sensor, a pressure sensor, and an infrared sensor. can be In any case, a first substrate 210 such as a printed circuit board having a metal pattern on which the sensing element 100 is mounted is provided for signal transmission, and in this case, the first substrate 210 is a flexible printed circuit board It may be a structure having a variety of materials and flexibility, including In addition, a through hole 211 for gas sensing may be implemented in the first substrate 210 .

In the embodiment of the present invention, the terminal pattern 130 provided in the sensing device 100 and the metal pattern 220 serving as a pad portion to be bonded to the terminal pattern 130 are provided, and on the metal pattern 220 . A solder bonding layer 225 is formed. The solder bonding layer 225 may be implemented on the metal pattern 220 in various ways, for example, by printing solder cream using a silk screen printing method, or by patterning a solder resist to form a thin metal pattern ( 220) so that it can be implemented. Thereafter, as shown in FIGS. 1A and 1C , the solder bonding layer 225 is arranged between the terminal pattern 130 of the sensing device and the metal pattern 220 and mutual bonding is implemented through a reflow process. will do In this process, there is no need to implement a separate UBM (Under Bump Metallurgy) layer, so bonding can be implemented with a very simple process. That is, there is no need to implement solder bumps (bump structures) for bonding.

FIG. 2 is a cross-sectional conceptual view illustrating another embodiment in which the structure of a metal pattern is diversified from that of FIG. 1 .

In this embodiment, unlike the structure of FIG. 1 , a dam pattern (hereinafter, referred to as a 'first dam pattern'; 227) having a structure in which the surface of the lower first substrate 210 is exposed within the metal pattern is implemented. There is a difference in that

When the first dam pattern 227 is printed on the metal pattern 220 on the surface of the first substrate 210 in the embodiment of the present invention or the solder bonding layer 225 is applied in another way, the first dam pattern 227 is , if the viscosity is weak, there is a risk that the solder bonding layer 225 may flow into an adjacent circuit or overflow in a reflow process to cause a short circuit with the adjacent circuit.

Referring to FIG. 3 , this is a process conceptual diagram illustrating this problem. (a) In the bonding process according to an embodiment of the present invention, a metal pattern 220 is implemented on a first substrate 210, and the metal pattern A solder bonding layer 225 is implemented on the upper surface of 220 by silk printing.

Thereafter, the sensing device 100 and the first substrate are aligned as in the process of (b) of FIG. 3 , and thereafter, as shown in FIG. 3 (c), the terminal pattern 130 of the sensing device 100 and the A-line bonding is performed by using the metal pattern 220 as a medium through a solder bonding layer. In this case, the reflow process proceeds simultaneously. In this case, there is a risk that the solder joint layer flows into the adjacent terminal pattern to cause a short circuit or transfer to another part.

To this end, like the structures shown in FIGS. 2, 4 and 5 , in the present invention, the first dam pattern 227 can be implemented in the metal pattern bonded to the terminal pattern of the sensing element.

4 is a conceptual diagram of a process according to an embodiment of the present invention. First, as shown in FIG. 4( a ), among a plurality of circuit patterns provided on the surface of the first substrate 210 , terminal patterns of sensing By processing the metal pattern 220, which is a circuit pattern of the corresponding portion to be joined, a pattern (first dam pattern) having a groove pattern structure capable of preventing the solder bonding layer 225 from flowing is realized. The first dam pattern 227 implements an engraved pattern of a structure in which the surface of the lower first substrate 220 is exposed by etching the metal pattern 220, as shown in the actual image of FIG. 5 (a). . The engraved pattern structure can prevent a short circuit because the solder bonding layer does not flow to the adjacent terminal pattern when the sensing element is actually aligned and reflowed as shown in FIGS. 4(c) and 5 . Accordingly, in a preferred embodiment of the present invention, as shown in FIG. 5 , the first dam pattern 227 may be arranged around a portion corresponding to the center of the sensing element when the sensing element is mounted. That is, it is arranged between the terminals of the sensing element to prevent a short circuit between the terminal patterns that are adjacent to each other.

Of course, as a further extension, the shape and arrangement structure of the first dam pattern can be variously modified in consideration of the terminal position of the device or arrangement between adjacent circuits.

5 and 6, it shows various embodiments of the first dam pattern 227 of the present invention.

As shown in FIG. 5A , the first dam pattern 227 may be implemented in a structure in which the surface of the first substrate is exposed inside the metal pattern. In this case, the first dam pattern 227 may be implemented to have a certain bent shape in consideration of the possibility that the solder bonding layer 225 may affect adjacent terminal patterns or circuits. In addition, the first dam pattern may be implemented as a pattern of a continuous or discontinuous structure. The continuous structure is a structure in which one end Y1 of the first dam pattern 225 and the other end Y2 extending from the one end do not communicate with each other, that is, the solder bonding layer 225 as shown in FIG. 5A . ) is preferably formed so that the one end and the other end do not meet to completely isolate. This is to secure reliability of electrical signal transmission through bonding of the terminal pattern and the metal pattern itself.

5 (b) and 5 (c) are images illustrating an actual alignment process and a reflow process after bonding the sensing element.

6 illustrates a modified structure of the various first dam patterns described above in FIG. 5 .

That is, as shown in FIG. 6 , the first dam pattern 227 in the embodiment of the present invention may be implemented in a structure in which the surface of the first substrate is exposed inside the metal pattern. In this case, either the one end Y1 of the first dam pattern 225 and the other end Y2 extending from the one end do not communicate with each other as shown in FIG. 6(a), or solder bonding as shown in FIG. 6(b) It can be designed with various modifications such as a structure that surrounds three surfaces of the layer, or a structure that surrounds three surfaces of the solder bonding layer and the other one surface, as shown in FIG. 6(c). have.

In addition, in the case of the first dam pattern, it is possible to simultaneously implement the patterning process (eg wet etching, dry etching, laser processing, etc.) for implementing the circuit pattern of the first substrate. It can be implemented in a simple process without any burden in terms of cost and process time.

7 illustrates a structure of a dam pattern different from that of the first dam pattern of the present invention.

That is, the dam pattern for reducing the risk of short circuit of the adjacent terminal pattern during the reflow process of the solder bonding layer according to the embodiment of the present invention is a metal pattern as shown in FIG. 7 in addition to the structure described in FIGS. 4 to 6 . The embossed second dam pattern 229 spaced apart from 220 may be implemented in a structure. That is, if the above-described first pattern has a structure provided inside the metal pattern, the present second dam pattern 229 leaves the original metal pattern 220 as it is, and a protruding circuit pattern of a certain shape is formed outside the metal pattern 220 in the patterning process. Implement the pattern in a way that leaves. In this case, the second dam pattern 229 is not connected to another metal pattern and is disposed so that the surface of the first substrate is exposed between adjacent metal patterns. That is, it acts as a barrier rib like a dam, but has a structure that is separated from other patterns, so a function to prevent the movement of the solder bonding layer is realized. In the case of the second dam pattern, since it is implemented in a structure that leaves a metal layer during circuit pattern processing, it may be implemented with the same material as the metal pattern. That is, since patterning is additionally performed in the original process, there is no loss of material, and it can be implemented in a way that there is no cost loss for additional equipment or additional processes.

As shown in FIG. 7, the second dam pattern 229 is implemented in a structure that implements a spaced portion 210a spaced apart from the metal pattern as shown in FIGS. 7 (a) to (b), but one end and the other end are It can be implemented with a structure that does not communicate. Furthermore, it is also possible to implement by modifying the shape of the discontinuous patterns 229a to 229c as shown in FIG. 7C .

The sensing package for implementing the bonding structure according to the embodiment of the present invention does not implement a separate UBM (Under Bump Metallurgy) for bonding between the terminal pattern and the metal pattern of the sensing element to the terminal pattern of the sensing element, but rather the metal on the PCB. By implementing the solder joint layer on the pattern and joining, the manufacturing process is simplified, the process cost is reduced, the reliability of the joining is improved, and various applications are possible. That is, it is possible to apply variously to a sensor package to which a sensing device of a semiconductor structure such as a gas sensor, a pressure sensor, and an infrared sensor is applied.

Hereinafter, an example of implementing a gas sensor package among application examples to which the sensor package of the present invention is applied will be described.

8 and 9 are partial cross-sectional views showing the structure of a gas sensor package to which the sensing package according to the embodiment of the present invention described above with reference to FIGS. 1 to 7 is applied. In particular, FIG. 8 shows the structure of FIG. 1 , and FIG. 9 shows the package structure according to the embodiment of FIGS. 2 to 7 in which the dam pattern is implemented.

Referring to FIG. 8 , a gas sensor package according to an embodiment of the present invention includes a first substrate 210 including a metal pattern 220 and a gas sensing unit disposed to face a surface of the first substrate 210 ( 110) including a gas sensing device 100, and between the gas sensing device 100 and the first substrate 210), to be configured by including the gas moving spacers G1 and G2. In addition, in the structure of FIG. 9 , an embodiment in which a first dam pattern is formed on the metal pattern 220 ( FIGS. 2 to 6 ) or an embodiment in which a second dam pattern is formed ( FIG. 7 ) may be applied.

As shown in FIG. 1, the first substrate 210 is formed in a structure including a plurality of metal patterns 220 in which electrode patterns (circuit patterns) are patterned with a metal material on a substrate surface formed of an insulating material, In particular, it includes a first through hole 211 having a structure penetrating the upper and lower portions of the substrate. The first through hole 211 serves as a passage through which the gas sensing unit 110 of the gas sensing device 100 to be described later is exposed to contact the gas.

In particular, the gas sensing device is mounted through the combination of the metal pattern 220 and the terminal pattern 130 of the gas sensing device. As described above, the mounting of the gas sensing device does not form a separate UBM layer, as described above with reference to FIGS. In addition, the gas sensing device 100 forms a structure spaced apart from the first substrate, that is, gas movement spaced portions G1 and G2 that serve as gas passage passages. Gas can be more easily detected by the gas sensing unit 110 .

In addition, the first substrate 210 is provided with a plurality of second through holes 230 for coupling the first substrate 210 with an external substrate or object in addition to the first through hole 211, in particular The second through hole 230 is filled with a metal material (hereinafter, referred to as a metal filling part; 240) as shown in FIGS. 1 and 2, and the metal filling part 240 is partially filled with the second through hole as shown in FIG. It is formed in a structure protruding from the lower portion of the first substrate 210 . Formed in such a protruding structure serves to provide a gas passage while the metal filling part 240 is electrically coupled to an object such as a printed circuit board such as a second substrate to be described later. This gas passage also facilitates the inflow of gas to perform a function of increasing gas sensing efficiency (described later in FIG. 12 ).

In particular, the gas moving separation parts G1 and G2 appear to have blocked the passage to the gas sensing part 110 in FIGS. 1 and 2, but this is a one-sided view, and the terminal pattern 130 and the metal pattern Since the junction portion of 220 corresponds to a very small portion, the separation space created by the terminal pattern 130 and the metal pattern 220 is evenly formed along the edge of the gas sensing device 100 .

Specifically, the metal pattern 220 on the upper surface of the first substrate 210 is directly bonded to the terminal pattern 220 or the metal electrode of the gas sensing device 100, and generally Ag, Au on the Cu layer. It is preferably formed in a structure including a surface-treated plating layer such as , Sn, and the like, so that bondability with the above-described solder bonding layer can be improved. In particular, by adjusting the thickness of the metal patterns 211 and 212 to form a range of 1 μm to several hundreds of μm, the gas sensing device 100 serves to implement a gas passageway that allows gas to vent through the side portion. can make it

The gas sensing device 100 is a functional part including a sensing material capable of gas sensing, which can be applied to all commercially available gas sensing structures collectively, and a sensing device using an oxide semiconductor, using carbon nanotubes. All sensing devices and various other sensing semiconductor chips can be applied. In an embodiment of the present invention, the gas sensing device 100 is mounted to face the surface of the first substrate 100 on which it is mounted.

That is, the terminal pattern 130 of the gas sensing device 100 and the metal pattern 220 of the first substrate are directly bonded through the solder bonding layer 225 in a flip chip bonding method. , by making it possible to remove the bonding wire, the package area is reduced, and a cap member or a mesh member on the upper portion of the separate gas sensing unit is unnecessary, so that the package can be further miniaturized and the manufacturing cost can be reduced.

As shown in FIGS. 8 and 9 , the gas sensing unit 110 of the gas sensing device 100 has a first through-hole ( 211), it is desirable to be aligned. This is a structure in which the gas sensing unit 110 is exposed through the gas inlet hole, that is, the center of the gas sensing unit 110 and the gas inlet hole 211 in order to increase the contact efficiency with the gas. It is the most efficient in terms of efficiency. Of course, the present invention is not limited thereto, and it is also possible to arrange the alignment configuration to be shifted within a certain range. Since the detection can be supplemented, the effect of improving the sensing efficiency can be realized in the same way.

In addition, in the embodiment of the present invention, one or more adjacent elements 300 mounted on the first substrate may be further included. Such an adjacent element is a concept including both active elements and passive elements, and may further include, for example, a fixed resistor or a negative temperature coefficient thermistor (NTC) element. In the case of such a fixed resistor or NTC (negative temperature coefficient thermistor) device, the resistance type is converted to a voltage type output, and in particular, in the case of NTC, the resistance change value is compensated for the initial sensing material according to the temperature to have a constant initial voltage value. may be

In particular, in the embodiment of the present invention, it is more preferable to include the cover member 150 having a structure that simultaneously covers the upper portions of the gas sensing device 100 and the adjacent device 300 . The configuration of the cover member 150 is a unique structure of the present invention, in which a cavity 140 forming a gas retention region is provided inside the gas sensing device 100, and the upper part is sealed to protect the inside. On the other hand, this is to control heat dissipation.

Furthermore, when the cover member 150 is fixed together with the upper surface of the adjacent element 300, it is fixed together with the adjacent element in addition to protecting the gas sensing element to improve bonding reliability of the gas sensing element itself. be able to In the embodiment of the present invention, it is described that the cover member is fixed together with the adjacent element, but in these adjacent elements, in addition to the chip structure such as an active element or a passive element, a plurality of chip package structures (projecting structures other than the gas sensing element) It is a concept that includes being able to fix together in

The cover member 150 can be applied with materials of various materials having insulating properties, for example, all materials used as a sealing material, such as a material containing epoxy, urethane, and Si as a synthetic resin material, can be applied, It is preferable to apply a material having a certain viscosity so that the synthetic resin material does not flow into the cavity.

10 is a conceptual diagram showing the structure of the gas sensing device 100 according to an embodiment of the present invention applied to the gas sensor package described above in FIGS. 8 and 9 .

Referring to FIG. 10 , the gas sensing device applied to the package according to the embodiment of the present invention includes a device body 120 including a lower surface 121 and a side wall 122 and a cavity 140 provided therein; It may be configured to include a cover member 150 disposed on the upper side of the side wall 122 to seal the upper surface of the cavity 140 and the gas sensing unit 110 disposed on the outer surface of the lower surface.

Specifically, Fig. 10 (a) is a conceptual view of the main parts defining the lower direction (A) and the upper direction (B) of the gas sensing device of the present invention, viewed from the upper direction (A), Fig. 10 (b) is the lower The main part conceptual view in the direction (A), FIG. 10(c) is a side cross-sectional conceptual view.

Referring to this, a gas sensing unit 110 for detecting gas through a sensing material or a sensing chip is disposed on the outer surface of the lower surface of the device body 120 in the upper direction (B) in the upper direction (B) as shown in FIG. is provided with an electrode pattern 130 that can be connected to an external terminal, and the gas sensing unit 110 and the electrode pattern 130 are configured to be electrically connected to each other.

When viewed from the downward direction (B) of the device as shown in FIG. 10 (b), the gas sensing device according to the embodiment of the present invention has a structure in which a cavity 140 is provided therein, and the side walls 122 and the lower surface 121 ) is implemented, and it is provided in a structure in which an area opened in the upper direction is implemented.

When viewed from the side cross-sectional view as shown in FIG. 10 ( c ), the gas sensing unit 110 is disposed on the opposite surface of the lower surface 121 of the device body providing the internal cavity 140 , and around the gas sensing unit The electrode pattern 130 is provided so that it can be mounted on a substrate or the like later.

11 illustrates the implementation of the cover member 150 for sealing the upper surface of the cavity in particular in the structure of the gas sensing device described above in FIG. 10 .

The cover member 150 may be disposed in a structure that covers the upper surface of the side wall portion 122 of the device body and the upper surface of the cavity, and is processed into a separate structure to adhere a synthetic resin film such as polyimide. However, in a preferred embodiment of the present invention, a synthetic resin material having a certain viscosity is dropped and sealed on the upper surface of the cavity in a dispensing method to protect the inside of the cavity and the gas sensing unit, and the gas sensing unit To secure a space for gas to stay for gas sensing in the system, and to implement a function to prevent heat dissipation. In particular, in the embodiment of the present invention, the cover member 150 not only covers the upper surface of the gas sensing device, but extends to adjacent devices and simultaneously fixes the cover member 150 to increase the bonding reliability of the gas sensing device as described above. .

In configuring the cover member 150, a potting material is dropped on the upper surface of the gas sensing element and the upper surface of the adjacent element to cover it by dispensing or the like. Accordingly, the lower surface P2 of the cover member according to the embodiment of the present invention has a structure formed to be less than or equal to the imaginary horizontal surface P1 formed by the upper end surface of the side wall portion 122 of the device body 120 . . The lower surface of the cover member is implemented to have a curvature according to surface tension or sagging due to gravity of a synthetic resin material having a certain viscosity, and this structure makes the upper surface of the cavity have a curvature, making it easier to retain and circulate gas A complementary function to increase the sensing sensitivity is also implemented. In order to increase sensing efficiency, a fine gas moving hole may be formed on the lower surface of the device body, and a fine gas moving hole may be additionally implemented in a part of the cover member. Furthermore, it is preferable that the cover member is implemented in a structure that does not contact the surface of the first substrate or only a part thereof is in contact so as not to block the gas movement spacer formed on the side surface of the gas sensing element.

12 is a conceptual diagram illustrating a structure of a gas sensor package according to another embodiment of the present invention.

Referring to FIG. 12 , the package in which the gas sensing device 100 and the first substrate 210 are coupled according to an embodiment of the present invention is mounted on a second substrate 400 such as a separate printed circuit board. structure can be implemented. Of course, in the embodiment of Fig. 12, the embodiment implementing the structure of the dam pattern as shown in Figs. 2 to 7 can be applied.

The second substrate 400 may be a printed circuit board. In particular, the printed circuit board can apply a flexible material, and as shown, the metal filling part 240 of the first board 210 according to the embodiment of the present invention and the second board as a printed circuit board ( 400) to be electrically connected. In particular, in this case, the metal filling part 240 has a structure in which a certain part protrudes in the direction of the lower surface of the first substrate 210 , and has a constant spacing part even after connection with the second substrate 400 , and this spacing part As shown, the gas movement passages G3 and G4 are formed (hereinafter, referred to as a 'second gas movement separation unit').

The second gas moving spacer 410 is in addition to direct contact between the gas and the gas sensing unit 110 through the first through hole 211 provided in the first substrate in the package according to the embodiment of the present invention. , it is possible to make the gas approaching from the side of the gas sensing device come into contact with the gas sensing unit, thereby ensuring an increase in sensing efficiency.

The conventional gas sensors are implemented in a manner in which the gas sensing unit faces the upper surface of the substrate in order to secure contact efficiency with the gas. need to increase the size of the package, but in the case of the package according to the embodiment of the present invention, the mounting is implemented so that the portion provided with the gas sensing unit is in contact with the surface of the first substrate, so that a separate cap is not installed. Not only can the package be miniaturized, but also the manufacturing cost can be reduced, and the sensing efficiency is realized by gas retention using a cavity inside the device and a spaced part for guiding gas from the first through hole and side of the first substrate to the gas sensing unit. can also be obtained.

13 illustrates a top plan view of the package structure described above in FIG. 5 .

As shown, the first substrate 100 is bonded to the surface of the gas sensing device in a flip-chip method so that the gas sensing unit faces it, and the metal filling unit 240 is disposed at the lower portion, and a fixed resistance or negative temperature coefficient (NTC) Thermistor device 300 may be added. (For the sake of brevity, the configuration of the cover member is omitted.)

14 is a plan conceptual view of the package in FIGS. 12 and 13 viewed from the top, and shows the gas movement paths (G3, G4) through the second gas movement spacer after the lower PCB and the first substrate 210 are combined. did it As shown, the gas moving from the side of the gas sensing device 100 is transmitted through the gas moving spacers G1 and G2, and the second gas moving spacer between the first and second substrates in the left and right side parts. The gas is smoothly vented through (G3, G4) so that the gas can be delivered to the gas sensing unit.

In addition to the above-described gas sensor package, the package to which the bonding structure of the sensing device and the printed circuit board according to FIGS. 1 to 7 according to an embodiment of the present invention is applied is an infrared sensor, a humidity sensor, a temperature sensor, a pressure sensor, and furthermore, an LED package and It can be applied to various lighting packages and Membrane type MEMS chips.

In the detailed description of the present invention as described above, specific embodiments have been described. However, various modifications are possible without departing from the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, and should be defined by the claims as well as the claims and equivalents.

100: gas sensing device
110: gas sensing unit
120: element body
130: terminal pattern
140: cavity
210: first substrate
211: first through hole
G1, G2: gas moving separation part
220: metal pattern
230: second through hole
240: metal filling part
225: solder bonding layer
227: first dam pattern, 229: second dam pattern
300: adjacent element (fixed resistance or NTC)
400: second board (printed circuit board)
410: second gas moving separation unit

Claims (10)

a first substrate;
a metal pattern disposed on the upper surface of the first substrate and including a first dam pattern of an intaglio pattern to which the upper surface of the first substrate is exposed;
a sensing element including a terminal pattern bonded to the metal pattern; and
a solder bonding layer disposed between the metal pattern and the terminal pattern and in direct contact with the surface of the metal pattern and the surface of the terminal pattern;
The metal pattern is
a first portion on which the solder bonding layer is disposed;
and a second part distinguished from the first part through the first dam pattern,
One end and the other end of the first dam pattern are not connected to each other,
A sensor package connected to each other as the first dam pattern is not formed on at least a portion between the first portion and the second portion of the metal pattern. a first substrate;
a metal pattern disposed on an upper surface of the first substrate;
a second dam pattern disposed on the upper surface of the first substrate and surrounding at least a portion of the periphery of the metal pattern;
a sensing device including a terminal pattern bonded to the metal pattern and having a cavity thereon;
a solder bonding layer disposed between the metal pattern and the terminal pattern and in direct contact with a surface of the metal pattern and a surface of the terminal pattern; and,
a protective member disposed on the sensing element and filling a portion of the cavity of the sensing element;
The lower surface of the protection member, the sensor package including a convex curved surface in a direction toward the terminal pattern. The method according to claim 1,
a protective member disposed on the sensing element;
The sensing element includes a cavity,
and the protective member fills a portion of the cavity and includes a lower surface of a convex curved surface in a direction toward the terminal pattern. 4. The method according to claim 2 or 3,
and an adjacent element disposed on the first substrate and spaced apart from the sensing element,
The protection member is
a first region disposed on the sensing element;
a second region disposed on the adjacent element;
and a third region disposed in a space between the sensing element and the adjacent element. The method according to claim 1 or 2,
The sensing element is
It is a gas sensing device including a gas sensing unit,
The gas sensing device,
It is disposed to face the surface of the first substrate,
A sensor package comprising a; a gas moving spacer between the gas sensing element and the first substrate. delete delete delete delete delete

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