WO2018119870A1

WO2018119870A1 - Photoresist coating process and loading device

Info

Publication number: WO2018119870A1
Application number: PCT/CN2016/112998
Authority: WO
Inventors: 徐顺龙
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2016-12-29
Filing date: 2016-12-29
Publication date: 2018-07-05
Also published as: CN108698070A; CN108698070B

Abstract

Provided are a photoresist coating process and a loading device, wherein the photoresist coating process comprises: providing a loading stage, and placing a substrate to be coated with a photoresist on the loading stage; coating the substrate with a magnetic photoresist material; and generating a magnetic field on one side of the substrate to divide the magnetic photoresist material into a conductive layer and a photoresist layer under the action of the magnetic field. The photoresist coating process and the loading device can reduce the photoresist coating process, improve efficiency, and reduce the manufacturing cost.

Description

Photoresist coating process and loading device

[0001] The present invention belongs to the field of display panels, and in particular, to a photoresist coating process and a loading device.

Background technique

[0002] The photoresist coating process is part of a process in a TFTCThin Film Transistor (TFTCT) array substrate. Specifically, it is common practice to first pass PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition) on the substrate.

A conductive layer is deposited in a manner, and a photoresist is coated on the conductive layer to form a photoresist layer. However, P VD or CVD is prolonged, resulting in a long-lasting and inefficient photoresist coating process.

technical problem

[0003] The object of the present invention is to overcome the above-mentioned deficiencies of the prior art and to provide a photoresist coating process which aims to solve the problems of long consumption and low efficiency.

Problem solution

Technical solution

The present invention is implemented as follows:

[0005] A photoresist coating process comprising the steps of:

Providing a loading stage, and placing a substrate to be coated with a photoresist on the loading stage;

Coating a magnetic photoresist material on the substrate;

A magnetic field is generated on one side of the substrate, and the magnetic photoresist material is separated into a conductive layer and a photoresist layer by the magnetic field.

[0009] Optionally, the magnetic photoresist material is a mixed material formed of a photoresist and a magnetic organic substance.

[0010] Optionally, the magnetic photoresist material is a magnetic polymer compound composed of a metal oxide core, a shell material composed of a polymer material, and mixed with an organic photoresist.

[0011] Optionally, the magnetic photoresist material is a magnetic polymer compound formed by using a polymer material as a core, a magnetic material as a shell layer, and mixing with an organic photoresist.

[0012] Optionally, after the magnetic photoresist material is separated by the magnetic field, the conductive layer is in the magnetic The substrate is adsorbed on the substrate, and the photoresist layer covers the conductive layer away from the surface of the substrate.

[0013] Optionally, the magnetic field is generated by an energized coil in an energized state.

[0014] Optionally, the energizing coil is disposed in the loading platform.

[0015] The present invention also provides a loading device for a photoresist coating process, the loading device includes the loading platform, and the loading platform includes a loading station for generating The energized coil of the magnetic field.

[0016] Optionally, the loading platform includes a limiting structure disposed on the loading platform for preventing the substrate from sliding

[0017] Optionally, the limiting structure is a clamp.

Advantageous effects of the invention

Beneficial effect

[0018] According to the structure of the present invention, in the photoresist coating process, since the magnetic photoresist material is selected and the magnetic field is set, magnetic properties are realized by magnetic interaction between the magnetic photoresist material and the magnetic field. The photoresist is separated to form a conductive layer and a photoresist layer. In this process, the conductive layer and the photoresist layer can be formed by only one coating process, and the conductive layer can be formed by PVD first, and then the photoresist layer can be formed by coating, thereby reducing the process on the process. Improve efficiency and reduce manufacturing costs.

Brief description of the drawing

DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings to be used in the embodiments will be briefly described below. Obviously, the drawings in the following description are only some implementations of the present invention. For example, other drawings may be obtained from those of ordinary skill in the art in light of the inventive work.

1 is a flow chart of a photoresist coating process provided by an embodiment of the present invention;

2 is a cross-sectional view of the loading stage and the substrate in step S110 in the photoresist coating process according to an embodiment of the present invention;

3 is a cross-sectional view of a loading stage, a substrate, and a magnetic photoresist material in step S120 in the photoresist coating process according to an embodiment of the present invention;

4 is a loading stage, a substrate, and a substrate in step S130 in the photoresist coating process according to an embodiment of the present invention. a cross-sectional view of the conductive layer and the photoresist layer;

Description of the reference numerals:

[Table 1]

Embodiments of the invention

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical" The orientation or positional relationship of the indications such as "directly", "horizontal", "top", "bottom", "inside" and "outside" is based on the orientation or positional relationship shown in the drawings, for convenience of description of the present invention and simplified description. It is not intended to be a limitation or limitation of the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless specifically defined otherwise.

[0028] In the present invention, the terms "installation", "connected", "connected", "fixed" and the like should be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integrated; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal connection of two elements or the interaction of two elements. For The specific meanings of the above terms in the present invention can be understood by those skilled in the art on a case-by-case basis.

[0029] A first embodiment of the present invention provides a photoresist coating process. It can be understood that the photoresist coating process can be applied to various fields. For the convenience of the reader, the process of forming the gate electrode in the TFT array substrate will be exemplified herein. It should be noted, however, that the applicability of the photoresist coating process in the specific embodiment of the present invention is not limited to the gate electrode used in forming the _TFT array substrate. Referring to FIG. 1, the photoresist coating process includes the following steps:

[0030] Step S110, referring to FIG. 2, a loading stage 10 is provided, and the substrate 20 to be coated with the photoresist is placed on the loading table 10.

In the present embodiment, the substrate 20 is a substrate in a TFT array substrate. The substrate 20 may be a hard material (e.g., glass, resin, etc.) or a flexible material (e.g., polyimide, etc.).

[0032] In the present embodiment, the loading stage 10 is made of a hard material. The loading station 10 is used to carry the substrate 20. The loading platform 10 can include a limiting structure (not shown) disposed on the loading platform 10. The stop structure serves to prevent translation of the substrate 20. The limiting structure may be a limiting protrusion provided by the protrusion or a clamp. Preferably, the limiting structure adopts a clamp. Since the jig can be applied to the substrate 20 of various sizes, it is advantageous to improve the applicability of the limit structure.

[0033] Step S120, referring to FIG. 3 together, a magnetic photoresist material 30 is coated on the substrate 20.

[0034] Specifically, the magnetic photoresist material 30 is a mixed material formed of a photoresist and a magnetic organic substance, and the mixed material can be separated into a two-layer structure of a conductive layer and a photoresist layer by magnetic action. In this embodiment, the magnetic photoresist material 30 may be a core composed of a metal oxide (such as an oxide such as iron, cobalt, or nickel), a shell layer composed of a polymer material, and a magnetic body formed by mixing with an organic photoresist. The polymer compound may be a magnetic polymer compound formed by mixing a polymer material as a core, a magnetic material as a shell layer, and an organic photoresist.

[0035] In step S120, the magnetic photoresist material 30 may be applied to the substrate 20 using a conventional coating nozzle. In this way, the existing equipment can be fully utilized without special setting of a new coating device for coating, which is advantageous in reducing costs.

[0036] Step S130, referring to FIG. 4, a magnetic field is generated on one side of the substrate 20 to separate the magnetic photoresist material 30 into the conductive layer 31 and the photoresist layer 33. In the present embodiment, the magnetic field is used to generate a magnetic force that drives the magnetic organic matter in the magnetic photoresist material 30 to move toward the side of the loading stage 10. The magnetic photoresist material 30 is separated by the magnetic field to form the conductive layer 31 and the photoresist layer 33. It can be understood that the conductive layer 31 is a magnetic organic substance, and the conductive layer 31 is adsorbed on the substrate 20 under the action of the magnetic field, and the photoresist layer 30 covers the conductive layer 31 away from the lining. The surface of the bottom 20.

In the present embodiment, the conductive layer 31 can serve as a gate material layer of the TFT array substrate, and the photoresist layer 30 is a photoresist used for patterning the gate material layer. In the process of the TFT array substrate, after the magnetic photoresist material 30 is separated into the conductive layer 31 and the photoresist layer 33, the conductive layer 31 may be subjected to a yellow light process, and the conductive layer 31 is patterned to form The gate of the TFT array substrate.

[0039] In the present embodiment, the magnetic field is generated by the energization coil in an energized state. It is known from the principle of the magnetic field generation of the energized coil. Based on this structure, the degree of control of the magnetic field can be improved. Specifically, the generation and destruction of the magnetic field are controlled by controlling the energization and de-energization of the energized coil, and the direction of the magnetic induction line and the magnetic induction intensity of the magnetic field are controlled by controlling the current through the energized coil. It will be appreciated that in other embodiments, the magnetic field is also generated by a permanent magnet.

In the present embodiment, the energization coil is provided in the loading stage 10. Therefore, the loading platform 10 itself can protect the energized coil, and the energizing coil can be brought closer to the magnetic photoresist material 30, and the current can be reduced while ensuring the magnetic induction intensity. , reduce power consumption, and thus save costs.

[0041] Based on the above, in the photoresist coating process provided by the embodiment of the present invention, the magnetic photoresist material 30 is selected and the magnetic field is set, and the magnetic photoresist material 30 and the magnetic field are The magnetic interaction between them realizes the separation of the magnetic photoresist material 30, thereby forming the conductive layer 31 and the photoresist layer 33. In this process, the conductive layer 31 and the photoresist layer 33 can be formed by only one coating process, without first forming a conductive layer by means of P VD, and then forming a photoresist layer by coating, which can reduce the process. Processes to increase efficiency and reduce manufacturing costs.

The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention are included in the present invention. Within the scope of protection.

Claims

Claim

[Claim 1] A photoresist coating process, comprising the steps of:

Providing a loading stage, and placing a substrate to be coated with a photoresist on the loading stage; coating a magnetic photoresist material on the substrate;

[Claim 2] The photoresist coating process according to claim 1, wherein the magnetic photoresist material is a mixed material formed of a photoresist and a magnetic organic substance.

[Claim 3] The photoresist coating process according to claim 2, wherein the magnetic photoresist material is composed of a metal oxide core, a shell layer composed of a polymer material, and mixed with an organic photoresist. A magnetic polymer compound formed.

[Claim 4] The photoresist coating process according to claim 2, wherein the magnetic photoresist material is formed of a polymer material as a core, a magnetic material as a shell layer, and mixed with an organic photoresist. Magnetic polymer compound.

[Claim 5] The photoresist coating process according to claim 1, wherein after the magnetic photoresist material is separated by the magnetic field, the conductive layer is subjected to the magnetic field Adsorbed on the substrate, the photoresist layer covering the conductive layer away from the surface of the substrate.

[Claim 6] The photoresist coating process according to claim 1, wherein the magnetic field is generated by an energization coil in an energized state.

The photoresist coating process according to claim 6, wherein the energization coil is provided in the loading stage.

[Claim 8] A loading device for use in a photoresist coating process according to any one of claims 1 to 8, wherein the loading device includes the loading station, The loading stage includes an energized coil disposed in the loading stage for generating a magnetic field.

[Claim 9] The loading device according to claim 8, wherein the loading stage includes a stopper structure provided on the loading stage for preventing the substrate from sliding.

[Claim 10] The loading device according to claim 9, wherein the limiting structure is a jig.