WO2018105392A1 - Vibration element - Google Patents

Abstract

A vibration element (201) is provided with a vibration plate (101) and a first magnet (magnet (41)). The vibration plate (101) comprises a stacked body (10A) in which a plurality of flexible insulating base material layers are stacked, and a coil (31) formed on the stacked body (10A) and having a first major surface (VS1). The coil (31) includes a plurality of coil patterns (CP1, CP2, CP3) respectively formed on the plurality of insulating base material layers, and has a winding axis (AX) in a stacked direction (Z-axis direction) of the plurality of insulating base material layers. Of the plurality of coil patterns, at least a part of a first major surface-side coil pattern (coil pattern (CP1)) which is disposed closest to the first major surface (VS1) has a line width narrower than a line width of at least one of the other coil patterns. The magnet (41) is disposed in a position which overlaps a coil formation area (CE) as viewed from the Z-axis direction, and disposed in closest proximity to the coil pattern (CP1).

Description

Vibration element

The present invention relates to a vibration element, and particularly to a vibration element in which a plurality of coil patterns are formed across a plurality of insulating base layers.

Conventionally, there has been known a diaphragm in which a coil is formed on a flexible laminate formed by laminating a plurality of insulating base layers. For example, Patent Document 1 discloses a diaphragm having a configuration in which a coil pattern is formed across a plurality of insulating base layers in order to increase the number of turns of a coil. Such a diaphragm is vibrated by the interaction of the electromagnetic force with the magnet.

Special table 2014-517594 gazette

Inventors and others found that the diaphragm as disclosed in Patent Document 1 has the following problems in the process of developing the diaphragm.

(A) In order to reduce the conductor loss of the coil, when the line width of the coil pattern formed over the plurality of insulating base layers is increased, the magnetic flux generated around the coil pattern is reduced. For this reason, the electromagnetic force due to the interaction between the coil and the magnet is also reduced, and the amplitude of the diaphragm is reduced.

(B) On the contrary, in order to increase the electromagnetic force due to the interaction between the coil and the magnet, when the line width of the coil pattern formed across the plurality of insulating base layers is reduced, the DCR of the coil is high. Thus, the conductor loss of the coil is greatly increased.

An object of the present invention is to provide a vibrating element having a coil including a plurality of coil patterns formed over a plurality of insulating base layers and a magnet, and an electromagnetic force between the diaphragm and the magnet. An object of the present invention is to provide a vibration element that suppresses a significant increase in the conductor loss of a coil while increasing it.

(1) The vibration element of the present invention includes:
Comprising a diaphragm and a first magnet;
The diaphragm is
A plurality of insulating base material layers having flexibility, and a laminate having a first main surface;
A coil formed in the laminate and having a winding axis in the stacking direction of the plurality of insulating base layers;
Have
The coil includes a plurality of coil patterns respectively formed on two or more insulating base layers among the plurality of insulating base layers.
The line width of at least a part of the first main surface side coil pattern disposed closest to the first main surface among the plurality of coil patterns is narrower than at least one line width of the other coil patterns,
The first magnet is disposed at a position overlapping the formation region of the coil when viewed from the winding axis direction of the coil, and is closest to the first main surface side coil pattern among the plurality of coil patterns. It is characterized by being arranged.

Generally, the magnetic flux generated around the coil pattern increases when the line width of the coil pattern is narrower than when the line width of the coil pattern (conductor) forming the coil is large. Therefore, with this configuration, the electromagnetic force due to the interaction between the first magnet and the first main surface side coil pattern is increased, and the driving efficiency of the diaphragm is increased (the amplitude of the diaphragm can be increased).

Also, with this configuration, the electromagnetic force due to the interaction between the first magnet and the coil can be increased as compared with the case where the line widths of all the plurality of coil patterns are the same under the same conductor loss of the coil. In addition, a significant increase in the coil conductor loss is suppressed as compared with the case where the line widths of all the plurality of coil patterns are the same under the same electromagnetic force.

(2) In the above (1), the stacked body has a second main surface facing the first main surface, and the first main surface side coil pattern is more than the second main surface in the stacking direction. Is preferably close to the first main surface. With this configuration, the coil is disposed closer to the first magnet than the first main surface side coil pattern is closer to the second main surface than the first main surface in the stacking direction. The electromagnetic force due to the interaction between the first magnet and the coil can be further increased.

(3) In the above (1) or (2), the first main surface side coil pattern has a spiral shape, and a line width equal to or greater than a half circumference of the outermost peripheral portion of the first main surface side coil pattern is It is preferable that the line width of the coil pattern other than is narrower. When the coil pattern is spiral (when the coil pattern has one or more turns), the outermost peripheral portion of the coil pattern mainly contributes to the formation of magnetic flux that interacts with the magnet. Therefore, by making the line width more than half the outermost circumference of the first main surface side coil pattern thinner than the line width of the other coil patterns, it is possible to suppress a significant increase in coil conductor loss, The electromagnetic force due to the interaction between one magnet and the coil can be effectively increased.

(4) In any one of the above (1) to (3), the line width of the entire first main surface side coil pattern is preferably narrower than the line width of the other coil patterns. With this configuration, it is possible to efficiently increase the electromagnetic force due to the interaction between the first magnet and the coil while suppressing an increase in the conductor loss of the coil.

(5) In any one of (1) to (3), further including a second magnet, the stacked body has a second main surface facing the first main surface, and the coil includes the plurality of coils. A plurality of coil patterns respectively formed on three or more insulating base material layers of the insulating base material layers, and the second main surface side disposed closest to the second main surface among the plurality of coil patterns The line width of at least a part of the coil pattern and the line width of at least a part of the first main surface side coil pattern are narrower than at least one line width of the other coil patterns, and the second magnet When viewed from the winding axis direction of the coil, the coil is disposed at a position overlapping the coil formation region, and is disposed closest to the second main surface side coil pattern among the plurality of coil patterns. preferable. With this configuration, the electromagnetic force due to the interaction between the first magnet and the first main surface side coil pattern is increased, and the electromagnetic force due to the interaction between the second magnet and the second main surface side coil pattern is also increased. Therefore, the driving efficiency of the diaphragm is further increased as compared with the vibration element including only the first magnet (the amplitude of the diaphragm can be further increased).

(6) In the above (5), it is preferable that the second main surface side coil pattern is closer to the second main surface than the first main surface in the stacking direction. With this configuration, the coil is disposed closer to the second magnet than the second main surface side coil pattern is closer to the first main surface than the second main surface in the stacking direction. The electromagnetic force due to the interaction between the second magnet and the coil can be further increased.

(7) In the above (5) or (6), the second main surface side coil pattern has a spiral shape, and a line width equal to or greater than a half circumference of the outermost peripheral portion of the second main surface side coil pattern is It is preferable that the line width of the coil pattern other than is narrower. When the coil pattern is spiral (when the coil pattern has one or more turns), the outermost peripheral portion of the coil pattern mainly contributes to the formation of magnetic flux that interacts with the magnet. Therefore, by making the line width of the outer circumference of the second main surface side coil pattern more than half the circumference of the coil pattern thinner than that of the other coil patterns, it is possible to suppress a significant increase in coil conductor loss. The electromagnetic force due to the interaction between the two magnets and the coil can be effectively increased.

(8) In the above (5) to (7), the line width of the entire first main surface side coil pattern and the line width of the entire second main surface side coil pattern are larger than the line widths of the other coil patterns. Thin is preferable. With this configuration, it is possible to more efficiently suppress an increase in the conductor loss of the coil while increasing the electromagnetic force due to the interaction between the magnet (the first magnet and the second magnet) and the coil.

(9) In any one of the above (1) to (8), a first recess is formed in the first main surface, and the first recess is an inner side of a coil opening of the coil as viewed from the stacking direction. It is preferable that at least a part of the first magnet is disposed inside the first recess. With this configuration, since the coil is disposed closer to the first magnet, the electromagnetic force due to the interaction between the first magnet and the coil can be further increased.

(10) In the above (9), it is preferable that a side surface of the first recess is formed in a tapered shape from the first main surface toward the inside of the laminate. With this configuration, when the diaphragm vibrates irregularly, the side surface of the first recess comes into contact with the first magnet and the diaphragm moves to an appropriate position, so that the diaphragm is in a correct positional relationship with respect to the first magnet. It can be corrected.

(11) In any one of the above (5) to (8), a second recess is formed in the second main surface, and the second recess is inside the coil opening of the coil as viewed from the stacking direction. The second magnet is arranged at least partially inside the second recess, so that the coil is arranged closer to the second magnet, so that the second magnet and the coil are mutually connected. The electromagnetic force due to the action can be further increased.

(12) In the above (11), it is preferable that a side surface of the second recess is formed in a tapered shape from the second main surface toward the inside of the laminate. With this configuration, when the diaphragm vibrates irregularly, the side surface of the second recess comes into contact with the second magnet and the diaphragm moves to an appropriate position, so that the diaphragm is in a correct positional relationship with respect to the second magnet. It can be corrected.

(13) In the above (4) or (8), it is preferable that the line widths of the plurality of coil patterns are thicker as they are arranged in the inner layer than the surface layer of the stacked body in the stacking direction. With this configuration, while maintaining the flexibility of the diaphragm, the electromagnetic force due to the interaction between the magnet and the coil can be increased more efficiently and the increase in the conductor loss of the coil can be suppressed.

According to the present invention, in a vibration element including a diaphragm having a coil including a plurality of coil patterns formed over a plurality of insulating base layers and a magnet, an electromagnetic force between the diaphragm and the magnet is reduced. It is possible to realize a vibration element that suppresses a significant increase in the conductor loss of the coil while increasing the height.

FIG. 1A is an external perspective view of the diaphragm 101 according to the first embodiment, and FIG. 1B is an exploded perspective view of the diaphragm 101. FIG. 2 is a cross-sectional view of the vibration plate 101 on the XZ plane. FIG. 3A is a plan view showing the main part of the vibration element 201 according to the first embodiment, and FIG. 3B is a cross-sectional view showing the main part of the vibration element 201. FIG. 4 is a cross-sectional view illustrating the manufacturing process of the diaphragm 101 in order. FIG. 5A is an external perspective view of the diaphragm 102 according to the second embodiment, and FIG. 5B is an exploded perspective view of the diaphragm 102. 6A is a cross-sectional view of the diaphragm 102 on the XZ plane showing the positional relationship of the first main surface side coil pattern, and FIG. 6B is the positional relationship of the second main surface side coil pattern. FIG. 6 is a cross-sectional view of the vibration plate 102 taken along the XZ plane. FIG. 7 is a cross-sectional view illustrating a main part of the vibration element 202 according to the second embodiment. FIG. 8A is an external perspective view of the diaphragm 103 according to the third embodiment, and FIG. 8B is an exploded perspective view of the diaphragm 103. FIG. 9 is a cross-sectional view of the diaphragm 103 on the XZ plane. FIG. 10 is a cross-sectional view along the XZ plane of the diaphragm 104 according to the fourth embodiment. FIG. 11A is an external perspective view of the diaphragm 105 according to the fifth embodiment, and FIG. 11B is an exploded perspective view of the diaphragm 105. 12A is a plan view of the diaphragm 105, and FIG. 12B is a cross-sectional view of the diaphragm 105 on the XZ plane. FIG. 13 is a cross-sectional view illustrating a main part of a vibration element 205 according to the fifth embodiment. FIG. 14 is a cross-sectional view sequentially illustrating the manufacturing process of the diaphragm 105. FIG. 15A is an external perspective view of the diaphragm 106 according to the sixth embodiment, and FIG. 15B is a cross-sectional view of the diaphragm 106. FIG. 16 is an exploded plan view of the diaphragm 106. FIG. 17 is a cross-sectional view illustrating a main part of a vibration element 206 according to the sixth embodiment.

Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but the components shown in different embodiments can be partially replaced or combined. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

<< First Embodiment >>
FIG. 1A is an external perspective view of the diaphragm 101 according to the first embodiment, and FIG. 1B is an exploded perspective view of the diaphragm 101. FIG. 2 is a cross-sectional view of the vibration plate 101 on the XZ plane. In FIG. 1B, the coil patterns CP1, CP2, and CP3 are shown as dot patterns for easy understanding of the structure. In FIG. 2, the thickness of each part is exaggerated. The same applies to the sectional views in the following embodiments.

The diaphragm 101 includes a laminated body 10A, a coil 31 (described in detail later) formed on the laminated body 10A, and external electrodes P1 and P2.

The laminated body 10A is a rectangular flat plate whose longitudinal direction coincides with the X-axis direction, and has a first main surface VS1 and a second main surface VS2 facing each other. The laminated body 10A is made of a thermoplastic resin, and is formed by sequentially laminating a plurality of insulating base material layers 13a, 12a, 11a and a protective layer 1a as shown in FIG. The plurality of insulating base layers 11a, 12a, and 13a are each a rectangular flat plate made of a resin material having flexibility and having a longitudinal direction coinciding with the X-axis direction. The plurality of insulating base layers 11a, 12a, and 13a are sheets mainly made of, for example, a liquid crystal polymer (LCP) or polyether ether ketone (PEEK) which is a thermoplastic resin.

The coil pattern CP1, the external electrodes P1, P2, and the connection conductor CN1 are formed on the surface of the insulating base layer 11a. The coil pattern CP1 is a rectangular loop-shaped conductor of about 1 turn that is wound along the outer periphery of the insulating base layer 11a. The external electrode P1 is a rectangular conductor disposed near the center of the first side of the insulating base layer 11a (the left side of the insulating base layer 11a in FIG. 1B). The external electrode P2 is a rectangular conductor disposed near the center of the second side of the insulating base layer 11a (the right side of the insulating base layer 11a in FIG. 1B). The connection conductor CN1 is a conductor that connects the external electrode P1 and the first end of the coil pattern CP1. The coil pattern CP1, the external electrodes P1, P2, and the connection conductor CN1 are conductor patterns made of, for example, Cu foil.

Further, interlayer connection conductors V1 and V4 are formed on the insulating base material layer 11a.

The coil pattern CP2 and the conductor 22 are formed on the surface of the insulating base material layer 12a. The coil pattern CP2 is a rectangular loop-shaped conductor of about one turn that is wound along the outer periphery of the insulating base layer 12a. As shown in FIG. 1B, the first end of the coil pattern CP2 is connected to the second end of the coil pattern CP1 through the interlayer connection conductor V1. The conductor 22 is a rectangular conductor disposed near the center of the second side of the insulating base layer 12a (the right side of the insulating base layer 12a in FIG. 1B). The conductor 22 is connected to the external electrode P2 through the interlayer connection conductor V4. The coil pattern CP2 and the conductor 22 are conductor patterns made of, for example, Cu foil.

Further, interlayer connection conductors V2 and V3 are formed on the insulating base material layer 12a.

The coil pattern CP3, the conductor 21 and the connection conductor CN2 are formed on the surface of the insulating base layer 13a. The coil pattern CP3 is a rectangular loop-shaped conductor of about one turn that is wound along the outer periphery of the insulating base layer 13a. As shown in FIG. 1B, the first end of the coil pattern CP3 is connected to the second end of the coil pattern CP2 via the interlayer connection conductor V2. The conductor 21 is a rectangular conductor disposed near the center of the second side of the insulating base layer 13a (the right side of the insulating base layer 13a in FIG. 1B). The conductor 21 is connected to the conductor 22 via the interlayer connection conductor V3. The connection conductor CN2 is a conductor that connects between the conductor 21 and the second end of the coil pattern CP3. The coil pattern CP3, the conductor 21 and the connection conductor CN2 are conductor patterns such as a Cu foil, for example.

The protective layer 1a is a resin film that is formed on substantially the entire surface of the laminated body 10A on the first main surface VS1 side and covers the coil pattern CP1 formed on the insulating base layer 11a (first main surface VS1 side). The protective layer 1a has openings AP1 and AP2 at positions corresponding to the external electrodes P1 and P2. Therefore, the external electrodes P1 and P2 are exposed from the first main surface VS1 by forming the protective layer 1a on the upper surface of the insulating base layer 11a. The protective layer 1a is, for example, a solder resist film or a coverlay film. In the “diaphragm” of the present invention, the protective layer 1a is not essential.

As described above, the diaphragm 101 includes a plurality of coil patterns CP1, CP2, CP3 and interlayer connection conductors V1, V2 formed on the three insulating base layers 11a, 12a, 13a, respectively, and a rectangular helical structure having about 3 turns. A coil 31 is formed. As shown in FIG. 2, the winding axis AX of the coil 31 coincides with the stacking direction (Z-axis direction) of the plurality of insulating base layers 11a, 12a, 13a. The first end of the coil 31 is connected to the external electrode P1, and the second end of the coil 31 is connected to the external electrode P2.

As shown in FIG. 2, the line width of the coil pattern CP1 is narrower than the line widths of the other coil patterns CP2 and CP3.

As shown in FIG. 2, the coil pattern CP1 is closer to the first main surface VS1 than the second main surface VS2 in the stacking direction (Z-axis direction). Specifically, the distance between the coil pattern CP1 and the first main surface VS1 in the Z-axis direction is L11, and the distance between the coil pattern CP1 and the second main surface VS2 in the Z-axis direction is L12. In addition, L11 <L12 holds.

In the present embodiment, the coil pattern CP1 described above corresponds to the “first main surface side coil pattern” in the present invention. The “first main surface side coil pattern” in the present invention refers to a coil pattern arranged closest to the first main surface VS1 among a plurality of coil patterns.

In addition, the “coil pattern” in the present invention refers to a conductor pattern that contributes to the formation of magnetic flux that interacts with the magnet (see coil patterns CP1, CP2, and CP3 shown by the dot pattern in FIG. 1B). Note that the connection conductors CN1 and CN2 connected to both ends of the coil 31 are considered not to substantially contribute to the formation of the magnetic flux that interacts with the magnet, and thus are excluded from the “coil pattern” of the present invention. .

Next, the vibration element according to this embodiment will be described with reference to the drawings. FIG. 3A is a plan view showing the main part of the vibration element 201 according to the first embodiment, and FIG. 3B is a cross-sectional view showing the main part of the vibration element 201. In FIG. 3A, the formation region CE of the coil 31 is indicated by a dot pattern for easy understanding of the structure.

The vibration element 201 includes a vibration plate 101 and a magnet 41.

Both ends in the longitudinal direction of the vibration plate 101 are fixed when the vibration element 201 is incorporated in an electronic device (not shown), and the magnet 41 is fixed to a casing (or cover) of the electronic device (not shown). As shown in FIG. 3A, the magnet 41 is disposed at a position overlapping the formation region CE of the coil 31 when viewed from the Z-axis direction.

In the present embodiment, the magnet 41 corresponds to the “first magnet” in the present invention. In addition, the “first magnet” in the present invention refers to a magnet arranged closest to the first main surface side coil pattern among the plurality of coil patterns.

Further, the external electrodes P1 and P2 of the vibration plate 101 are connected to a circuit of the electronic device when the vibration element 201 is incorporated in an electronic device (not shown). When a drive current flows through the coil 31 of the diaphragm 101, the diaphragm 101 vibrates in the direction indicated by the white arrow in FIG.

The vibrating element 201 according to the present embodiment has the following effects.

(A) In the vibration element 201 according to the present embodiment, the first magnet (magnet 41) is closest to the first main surface side coil pattern (coil pattern CP1) among the plurality of coil patterns CP1, CP2, CP3. Has been placed. The line width of the first main surface side coil pattern is narrower than the line widths of the other coil patterns CP2 and CP3. In general, more magnetic flux is generated around the coil pattern when the line width of the coil pattern is narrower than when the line width of the coil pattern (conductor) forming the coil is large. Therefore, with this configuration, the electromagnetic force due to the interaction between the first magnet and the first main surface side coil pattern is increased, and the driving efficiency of the diaphragm 101 is increased (the amplitude of the diaphragm 101 can be increased).

In the present embodiment, the line width of the first main surface side coil pattern (coil pattern CP1) is narrower than the line widths of the other coil patterns CP2 and CP3. That is, by reducing only the line width of the first main surface side coil pattern, the first magnet and the coil are compared with the case where the line widths of all the coil patterns are the same under the same conductor loss of the coil. Electromagnetic force due to interaction with can be increased. In addition, a significant increase in the conductor loss of the coil is suppressed as compared with the case where the line widths of all the plurality of coil patterns are the same under the same electromagnetic force.

(B) In the present embodiment, as shown in FIG. 2, the first main surface side coil pattern (coil pattern CP1) is located on the first main surface VS1 more than the second main surface VS2 in the stacking direction (Z-axis direction). It is close (L11 <L12). With this configuration, compared to the case where the first main surface side coil pattern is closer to the second main surface VS2 than the first main surface VS1 in the Z-axis direction (L11> L12), the coil 31 is the first magnet. Therefore, the electromagnetic force due to the interaction between the first magnet and the coil 31 can be further increased.

In general, when the diaphragm vibrates, the surface layer of the diaphragm (laminate) expands and contracts more than the inner layer. That is, in the present embodiment, the first main surface side coil pattern having a line width narrower than the other coil patterns CP2 and CP3 in the vicinity of the first main surface VS1 of the laminate 10A that greatly expands and contracts when the diaphragm vibrates. Are arranged (L11 <L12). Generally, a conductor pattern has relatively higher rigidity than an insulating base material layer made of a resin material. Therefore, with this configuration, flexibility in the vicinity of the first main surface VS1 of the laminated body 10A that greatly expands and contracts when the diaphragm vibrates can be maintained, and the amplitude when the diaphragm vibrates can be increased.

In the present embodiment, the case where the line width of the first main surface side coil pattern (coil pattern CP1) is narrower than the line widths of the other coil patterns CP2 and CP3 is shown, but the present invention is limited to this configuration. It is not a thing. If the line width of the first main surface side coil pattern is narrower than at least one line width of the other coil patterns, the above-described operations and effects are achieved. However, by making the line width of the first main surface side coil pattern thinner than the line width of the other coil patterns, the electromagnetic force due to the interaction between the first magnet and the coil can be increased efficiently, and the coil The increase in the conductor loss of 31 can be suppressed.

The diaphragm 101 according to the present embodiment is manufactured by, for example, the following process. FIG. 4 is a cross-sectional view illustrating the manufacturing process of the diaphragm 101 in order. In FIG. 4, for the convenience of explanation, the manufacturing process using one chip (individual piece) will be described. However, the actual manufacturing process of the diaphragm is performed in a collective substrate state.

As shown in (1) in FIG. 4, first, a plurality of insulating base layers 11a, 12a, and 13a are prepared. Thereafter, coil patterns CP1, CP2, CP3, external electrodes P1, P2, conductors 21, 22 and the like are formed on the plurality of insulating base layers 11a, 12a, 13a, respectively. Specifically, a metal foil (for example, Cu foil) is laminated on one side main surface of the insulating base material layers 11a, 12a, and 13a in a collective substrate state, and the metal foil is patterned by photolithography, whereby the coil pattern CP1. , CP2, CP3, external electrodes P1, P2 and conductors 21, 22 are formed.

The insulating base layers 11a, 12a, and 13a are thermoplastic resin sheets such as liquid crystal polymers.

The plurality of insulating base layers 11a, 12a and 13a include other conductors (connection conductors CN1 and CN2 in FIG. 1B) and interlayer connection conductors (interlayer connection conductors V1, V2 in FIG. 1B). V3, V4) are formed. The interlayer connection conductor is provided with a through-hole with a laser or the like, and then a conductive paste containing one or more of Cu, Ag, Sn, Ni, Mo or the like or an alloy thereof is disposed and cured by subsequent heating and pressing. It is provided by (solidifying). Therefore, the interlayer connection conductor is made of a material having a melting point (melting temperature) lower than the temperature at the time of subsequent heating and pressurization.

Next, as shown in (2) and (3) in FIG. 4, the insulating base layers 11a, 12a, and 13a are stacked in this order on the highly rigid base 2, and a plurality of stacked insulating base layers 11a are stacked. , 12a, and 13a are heated and pressed to form the laminated body 10AP. Specifically, the plurality of laminated insulating base layers 11a, 12a, and 13a are heated, and isotropic pressure pressing (pressurization) is performed by hydrostatic pressure from the direction of the white arrow shown in (2) in FIG. .

Then, the protective layer 1a is formed on the one main surface (upper surface of the laminated body 10AP shown in (3) in FIG. 4) of the laminated body 10AP. The protective layer 1a has openings at positions corresponding to the external electrodes P1 and P2. Therefore, the protective layer 1a is formed on the upper surface of the multilayer body 10AP (insulating base material layer 11a), so that the external electrodes P1 and P2 are exposed from the first main surface. The protective layer 1a is a resin film for preventing oxidation of the formation surface of the coil pattern CP1, etc., and is, for example, a solder resist film or a coverlay film.

Finally, the diaphragm 101 as shown in (4) of FIG. 4 is obtained by separating into individual pieces from the collective substrate.

With the above manufacturing method, it is possible to easily manufacture a diaphragm that suppresses a significant increase in the conductor loss of the coil while increasing the electromagnetic force with the magnet.

<< Second Embodiment >>
In the second embodiment, an example in which the configuration of a coil pattern formed over a plurality of insulating base material layers is different from that in the first embodiment will be described.

FIG. 5A is an external perspective view of the diaphragm 102 according to the second embodiment, and FIG. 5B is an exploded perspective view of the diaphragm 102. 6A is a cross-sectional view of the diaphragm 102 on the XZ plane showing the positional relationship of the first main surface side coil pattern, and FIG. 6B is the positional relationship of the second main surface side coil pattern. FIG. 6 is a cross-sectional view of the vibration plate 102 taken along the XZ plane. In FIG. 5B, the coil patterns CP1, CP2, CP3, CP4, and CP5 are shown as dot patterns for easy understanding of the structure.

The diaphragm 102 includes a laminated body 10B, a coil 32 (described in detail later) formed on the laminated body 10B, and external electrodes P1 and P2.

The coil 32 according to the present embodiment is different from the coil 31 according to the first embodiment in that the coil 32 includes five coil patterns respectively formed on five insulating base layers. Moreover, the laminated body 10B of the present embodiment is different from the laminated body 10A according to the first embodiment in the number of laminated insulating base material layers. Other configurations are substantially the same as those of the diaphragm 101.

Hereinafter, parts different from the diaphragm 101 according to the first embodiment will be described.

The laminated body 10B is formed by sequentially laminating a plurality of insulating base material layers 15b, 14b, 13b, 12b, 11b and a protective layer 1b as shown in FIG. The configuration of the plurality of insulating base layers 11b, 12b, 13b, 14b, and 15b is substantially the same as the insulating base layers 11a, 12a, and 13a described in the first embodiment.

The coil pattern CP1, the external electrodes P1 and P2, and the connection conductor CN1 are formed on the surface of the insulating base layer 11b. The configurations of the coil pattern CP1, the external electrodes P1 and P2, and the connection conductor CN1 are substantially the same as those described in the first embodiment.

Further, interlayer connection conductors V1 and V8 are formed on the insulating base material layer 11b.

The coil pattern CP2 and the conductor 24 are formed on the surface of the insulating base layer 12b. The coil pattern CP2 and the conductor 24 are substantially the same as the coil pattern CP2 and the conductor 22 described in the first embodiment. As shown in FIG. 5B, the first end of the coil pattern CP2 is connected to the second end of the coil pattern CP1 through the interlayer connection conductor V1. The conductor 24 is connected to the external electrode P2 through the interlayer connection conductor V8.

Further, interlayer connection conductors V2 and V7 are formed on the insulating base material layer 12b.

The coil pattern CP3 and the conductor 23 are formed on the surface of the insulating base layer 13b. The configuration of the coil pattern CP3 is substantially the same as the coil pattern CP3 described in the first embodiment. As shown in FIG. 5B, the first end of the coil pattern CP3 is connected to the second end of the coil pattern CP2 via the interlayer connection conductor V2. The conductor 23 is a rectangular conductor arranged near the center of the second side of the insulating base layer 13b (the right side of the insulating base layer 13b in FIG. 5B). The conductor 23 is connected to the conductor 24 via the interlayer connection conductor V7. The conductor 23 is a conductor pattern such as a Cu foil, for example.

Further, interlayer connection conductors V3 and V6 are formed on the insulating base material layer 13b.

The coil pattern CP4 and the conductor 22 are formed on the surface of the insulating base layer 14b. The coil pattern CP4 is a rectangular loop-shaped conductor of about one turn that is wound along the outer periphery of the insulating base layer 14b. As shown in FIG. 5B, the first end of the coil pattern CP4 is connected to the second end of the coil pattern CP3 via the interlayer connection conductor V3. The conductor 22 is a rectangular conductor arranged near the center of the second side of the insulating base layer 14b (the right side of the insulating base layer 14b in FIG. 5B). The conductor 22 is connected to the conductor 23 via the interlayer connection conductor V6. Coil pattern CP4 and conductor 23 are conductor patterns, such as Cu foil, for example.

Further, interlayer connection conductors V4 and V5 are formed on the insulating base material layer 14b.

The coil pattern CP5 and the conductor 21 are formed on the surface of the insulating base layer 15b. The coil pattern CP5 is a rectangular loop-shaped conductor of about 1 turn formed along the outer periphery of the insulating base material layer 15b. As shown in FIG. 5B, the first end of the coil pattern CP5 is connected to the coil pattern CP4 via the interlayer connection conductor V4. The second end of the coil pattern CP5 is connected to the conductor 21. The conductor 21 is a rectangular conductor disposed near the center of the second side of the insulating base layer 15b (the right side of the insulating base layer 15b in FIG. 5B). The conductor 21 is connected to the conductor 22 via the interlayer connection conductor V5. Coil pattern CP5 and conductor 21 are conductor patterns, such as Cu foil, for example.

The configuration of the protective layer 1b is substantially the same as that of the protective layer 1a described in the first embodiment.

As described above, in the diaphragm 102, the plurality of coil patterns CP1, CP2, CP3, CP4, CP5 and the interlayer connection conductors V1, V2, formed on the five insulating base layers 11b, 12b, 13b, 14b, 15b, respectively. A rectangular helical coil 32 of about 5 turns including V3 and V4 is formed. The first end of the coil 32 is connected to the external electrode P1, and the second end of the coil 31 is connected to the external electrode P2.

As shown in FIGS. 6A and 6B, the coil widths of the coil patterns CP1 and CP5 are at least one of the other coil patterns CP2, CP3 and CP4 (coil patterns CP2 and CP4). It is thinner than the width.

As shown in FIG. 6A, the coil pattern CP1 is closer to the first main surface VS1 than the second main surface VS2 in the stacking direction (Z-axis direction). Specifically, the distance between the coil pattern CP1 and the first main surface VS1 in the Z-axis direction is L11, and the distance between the coil pattern CP1 and the second main surface VS2 in the Z-axis direction is L12. In addition, L11 <L12 holds. As shown in FIG. 6B, the coil pattern CP5 is closer to the second main surface VS2 than the first main surface VS1 in the Z-axis direction. Specifically, the distance between the coil pattern CP5 and the first main surface VS1 in the Z-axis direction is L21, and the distance between the coil pattern CP5 and the second main surface VS2 in the Z-axis direction is L22. In addition, L21> L22 holds.

In the present embodiment, the coil pattern CP1 described above corresponds to the “first main surface side coil pattern” in the present invention. In the present embodiment, the coil pattern CP5 described above corresponds to the “second main surface side coil pattern” in the present invention. The “second main surface side coil pattern” in the present invention refers to a coil pattern arranged closest to the second main surface VS2 among a plurality of coil patterns.

Next, the vibration element according to this embodiment will be described with reference to the drawings. FIG. 7 is a cross-sectional view illustrating a main part of the vibration element 202 according to the second embodiment.

The vibration element 202 includes a vibration plate 102 and magnets 41 and 42.

Both ends in the longitudinal direction of the diaphragm 102 are fixed when the vibration element 202 is incorporated in an electronic device (not shown), and the magnets 41 and 42 are fixed to a casing (or cover) of the electronic device (not shown).

In the present embodiment, the magnet 41 corresponds to the “first magnet” in the present invention. In the present embodiment, the magnet 42 corresponds to the “second magnet” in the present invention. The “second magnet” in the present invention refers to a magnet that is disposed closest to the second main surface side coil pattern among the plurality of coil patterns.

In addition, although illustration is abbreviate | omitted, the magnets 41 and 42 are arrange | positioned in the position which overlaps with the formation area (refer coil formation area | region CE in FIG. 3 (A)) of the coil 31 seeing from a Z-axis direction.

Further, the external electrodes P1 and P2 of the diaphragm 102 are connected to a circuit of the electronic device when the vibration element 202 is incorporated in an electronic device (not shown). When a drive current flows through the coil 32 of the diaphragm 102, the diaphragm 102 vibrates in the direction indicated by the white arrow in FIG.

The vibration element 202 according to the present embodiment has the following effects in addition to the effects described in the first embodiment.

(C) In the vibration element 202 according to the present embodiment, the first magnet (magnet 41) is disposed closest to the first main surface side coil pattern (coil pattern CP1) among the plurality of coil patterns, The second magnet (magnet 42) is disposed closest to the second main surface side coil pattern (coil pattern CP5) among the plurality of coil patterns. The line widths of the first main surface side coil pattern and the second main surface side coil pattern are narrower than at least one of the other coil patterns CP2, CP3, CP4. Therefore, this configuration increases the electromagnetic force due to the interaction between the first magnet and the first main surface side coil pattern, and also increases the electromagnetic force due to the interaction between the second magnet and the second main surface side coil pattern. . Therefore, the driving efficiency of the diaphragm 102 is further increased (the amplitude of the diaphragm 102 can be further increased) compared to the vibration element 201 described in the first embodiment.

(D) In the present embodiment, the line width of the first main surface side coil pattern (coil pattern CP1) and the line width of the second main surface side coil pattern (coil pattern CP5) are the other coil patterns CP2. , Smaller than the line width of CP4. Therefore, with this configuration, the electromagnetic force due to the interaction between the magnet (first magnet and second magnet) and the coil 32 can be increased compared to the case where the line widths of all of the plurality of coil patterns are the same, and the coil A large increase in the conductor loss of 32 can be suppressed.

(E) Further, in the present embodiment, as shown in FIG. 6B, the second main surface side coil pattern (coil pattern CP5) is more than the first main surface VS1 in the stacking direction (Z-axis direction). 2 is close to the main surface VS2 (L21> L22). With this configuration, compared to the case where the second main surface side coil pattern is closer to the first main surface VS1 than the second main surface VS2 in the Z-axis direction, the coil 32 is connected to the second magnet (magnet 42). Since they are arranged close to each other, the electromagnetic force due to the interaction between the second magnet and the coil 32 can be further increased. In the present embodiment, the first main surface side coil pattern (coil pattern CP1) is closer to the first main surface VS1 than the second main surface VS2 in the Z-axis direction (L11 <L12). The overall electromagnetic force due to the interaction between the coil 32 and the coil 32 can be further increased.

(F) Further, in the present embodiment, other coil patterns CP2, near both main surfaces (first main surface VS1 and second main surface VS2) of the laminate 10B that greatly expands and contracts when the diaphragm vibrates. A first main surface side coil pattern and a second main surface side coil pattern whose line width is narrower than CP4 are respectively arranged (L11 <L12 and L21> L22). Therefore, with this configuration, the flexibility in the vicinity of both main surfaces (first main surface VS1 and second main surface VS2) of the laminate 10B that greatly expands and contracts when the vibration plate vibrates is maintained, and the vibration plate vibrates. The time amplitude can be further increased.

<< Third Embodiment >>
In 3rd Embodiment, the structure from which the structure of the coil pattern formed over a some insulating base material layer differs from 2nd Embodiment is shown.

FIG. 8A is an external perspective view of the diaphragm 103 according to the third embodiment, and FIG. 8B is an exploded perspective view of the diaphragm 103. FIG. 9 is a cross-sectional view of the diaphragm 103 on the XZ plane. In FIG. 8B, the coil patterns CP1, CP2, CP3, CP4, and CP5 are shown as dot patterns for easy understanding of the structure.

The diaphragm 103 includes a laminated body 10B, a coil 33 (described in detail later) formed on the laminated body 10B, and external electrodes P1 and P2.

The coil 33 according to the present embodiment is different from the coil 32 according to the second embodiment in the configuration of five coil patterns respectively formed on the five insulating base layers. Other configurations are substantially the same as those of the diaphragm 102.

Hereinafter, parts different from the diaphragm 102 according to the second embodiment will be described.

In the diaphragm 103, a plurality of coil patterns CP1, CP2, CP3, CP4, CP5 and interlayer connection conductors V1, V2, V3, V4 formed on the five insulating base layers 11b, 12b, 13b, 14b, 15b, respectively. A rectangular helical coil 33 having about 5 turns is formed.

As shown in FIG. 9, the first main surface side coil pattern (coil pattern CP1) is closer to the first main surface VS1 than the second main surface VS2 in the stacking direction (Z-axis direction). The second main surface side coil pattern (coil pattern CP5) is closer to the second main surface VS2 than the first main surface VS1 in the Z-axis direction.

Further, as shown in FIG. 9, the line widths of the plurality of coil patterns CP1, CP2, CP3, CP4, CP5 are thicker as they are arranged in the inner layer than the surface layer of the stacked body 10C in the stacking direction (Z-axis direction). . Specifically, the first main surface side coil pattern (coil pattern CP1) and the second main surface side coil pattern (coil pattern CP5) located on the outermost surface of the multilayer body 10C in the Z-axis direction include a plurality of coil patterns CP1. , CP2, CP3, CP4, CP5 has the narrowest line width, and the coil pattern CP3 located in the innermost layer of the laminate 10C in the Z-axis direction is the most of the plurality of coil patterns CP1, CP2, CP3, CP4, CP5. The line width is thick. As described above, in the present embodiment, the coil pattern closest to the first main surface VS1 or the second main surface VS2 in the Z-axis direction has a narrower line width, and the stacked body 10C including the protective layer 1b in the Z-axis direction. The coil width is closer to the coil pattern arranged closer to the center height (see the center height ML in FIG. 9).

According to the present embodiment, in addition to the effects described in the first and second embodiments, the following effects can be obtained.

(G) In the diaphragm 103 according to the present embodiment, as shown in FIG. 9, the line width of the first main surface side coil pattern (coil pattern CP1) and the line of the second main surface side coil pattern (coil pattern CP5). The width is narrower than the line width of the other coil patterns CP2, CP3, CP4. With this configuration, compared to the case where the line width of the first main surface side coil pattern is narrower than that of the other coil patterns (see the first embodiment), the magnet (the first magnet and the first magnet) The increase in the conductor loss of the coil can be suppressed while increasing the electromagnetic force due to the interaction between the second magnet) and the coil.

(H) In addition to the configuration of (g), in the present embodiment, the line widths of the plurality of coil patterns CP1, CP2, CP3, CP4, CP5 are the same as those of the stacked body 10C in the stacking direction (Z-axis direction). It is thicker as it is arranged in the inner layer than the surface layer. With this configuration, it is possible to increase the electromagnetic force due to the interaction between the magnet and the coil 33 and to suppress an increase in the conductor loss of the coil 33 while maintaining the flexibility of the diaphragm.

<< Fourth Embodiment >>
In 4th Embodiment, the structure from which the structure of the coil pattern formed over several insulating base material layers differs from 3rd Embodiment is shown.

FIG. 10 is a cross-sectional view taken along the XZ plane of the diaphragm 104 according to the fourth embodiment.

The diaphragm 104 includes a laminated body 10B, a coil 34 (described in detail later) formed on the laminated body 10B, and external electrodes P1 and P2.

The coil 34 according to the present embodiment is different from the coil 33 according to the third embodiment in the arrangement of five coil patterns respectively formed on the five insulating base layers. Other configurations are substantially the same as those of the diaphragm 103.

Hereinafter, parts different from the diaphragm 103 according to the third embodiment will be described.

As shown in FIG. 10, the coil patterns CP1, CP2, CP3, CP4, and CP5 wound around the surfaces of the plurality of insulating base layers are each provided with an inner end portion of the Z axis so that the coil opening is maximized. Arranged to match the direction.

According to this embodiment, in addition to the effects described in the first, second, and third embodiments, the following effects can be obtained.

(I) In this embodiment, since the coil opening of the coil 34 can be widened, the electromagnetic force due to the interaction between the magnet and the coil can be increased.

<< Fifth Embodiment >>
In 5th Embodiment, the example of a diaphragm provided with the laminated body in which the recessed part was formed in the main surface is shown.

FIG. 11A is an external perspective view of the diaphragm 105 according to the fifth embodiment, and FIG. 11B is an exploded perspective view of the diaphragm 105. 12A is a plan view of the diaphragm 105, and FIG. 12B is a cross-sectional view of the diaphragm 105 on the XZ plane. In FIG. 11B, the coil patterns CP1, CP2, and CP3 are shown as dot patterns for easy understanding of the structure. In FIG. 12A, the coil opening CO is indicated by hatching.

The diaphragm 105 includes a laminated body 10C, a coil 31 formed in the laminated body 10C, and external electrodes P1 and P2. The coil 31 according to the present embodiment is substantially the same as that described in the first embodiment.

The laminated body 10C according to the present embodiment is different from the laminated body 10A of the first embodiment in that it has a first recess HP1. Further, the laminated body 10C is different from the laminated body 10A in the number of laminated insulating base material layers. Other configurations are substantially the same as those of the diaphragm 101.

Hereinafter, parts different from the diaphragm 101 according to the first embodiment will be described.

The laminated body 10C is formed by sequentially laminating a plurality of insulating base material layers 14c, 13c, 12c, 11c and a protective layer 1c as shown in FIG. The configurations of the plurality of insulating base layers 11c, 12c, 13c, 14c and the protective layer 1c are substantially the same as the insulating base layers 11a, 12a, 13a and the protective layer 1a described in the first embodiment.

As shown in FIG. 11B, openings H1 and H2 are formed in the insulating base layers 11c and 12c, respectively. The opening H1 is a rectangular hole penetrating both main surfaces of the insulating base material layer 11c, and is disposed in a region surrounded by the coil pattern CP1. The opening H2 is a rectangular hole penetrating both main surfaces of the insulating base material layer 12c, and is disposed in a region surrounded by the coil pattern CP2.

The configuration of the protective layer 1c is substantially the same as that of the protective layer 1a described in the first embodiment. The protective layer 1c has openings AP1 and AP2 at positions corresponding to the external electrodes P1 and P2, and has an opening AP3 at a position corresponding to the opening H1 of the insulating base material layer 11c.

The opening AP3 of the protective layer 1c and the openings H1 and H2 of the insulating base layers 11c and 12c constitute the first recess HP1 (described in detail later).

As shown in FIG. 12B, the line width of the first main surface side coil pattern (coil pattern CP1) is narrower than the line widths of the other coil patterns CP2 and CP3. Further, the line widths of the plurality of coil patterns CP1, CP2, CP3 are thicker as they are arranged in the inner layer than the surface layer of the stacked body 10C in the stacking direction (Z-axis direction).

1st recessed part HP1 is formed in 1st main surface VS1 of the laminated body 10C, as shown to FIG. 11 (A), FIG. 12 (A), and FIG. 12 (B). The first recess HP1 is an inverted square frustum-shaped opening formed from the first main surface VS1 toward the inner side (−Z direction) of the stacked body 10C.

1st recessed part HP1 is arrange | positioned inside the coil opening CO of the coil 31, seeing from a Z-axis direction, as shown to FIG. 12 (A). Further, as shown in FIG. 12B, the first recess HP1 has a side surface tapered from the first main surface VS1 toward the inner side (−Z direction) of the stacked body 10C.

Next, the vibration element according to this embodiment will be described with reference to the drawings. FIG. 13 is a cross-sectional view illustrating a main part of a vibration element 205 according to the fifth embodiment.

The vibration element 205 includes a vibration plate 105 and a magnet 41.

Both ends in the longitudinal direction of the diaphragm 105 are fixed when the vibration element 205 is incorporated in an electronic device (not shown), and the magnet 41 is fixed to a casing (or cover) of the electronic device (not shown). As shown in FIG. 13, at least a part of the magnet 41 is disposed inside the first recess HP1.

In the present embodiment, the magnet 41 corresponds to the “first magnet” in the present invention.

Further, the external electrodes P1 and P2 of the diaphragm 105 are connected to a circuit of the electronic device when the vibration element 205 is incorporated in an electronic device (not shown). When the drive current flows through the coil 31 of the diaphragm 105, the diaphragm 105 vibrates in the direction indicated by the white arrow in FIG.

The vibration element 205 according to the present embodiment has the following effects in addition to the effects described in the first embodiment.

(J) In the present embodiment, the line width of the first main surface side coil pattern (coil pattern CP1) is narrower than the line widths of the other coil patterns CP2 and CP3. Further, the line widths of the plurality of coil patterns CP1, CP2, CP3P4, CP5 are thicker as they are arranged in the inner layer than the surface layer of the stacked body 10C in the stacking direction (Z-axis direction). With this configuration, while maintaining the flexibility of the diaphragm, the electromagnetic force due to the interaction between the magnet (the first magnet and the second magnet) and the coil 33 is increased more efficiently, and the conductor loss of the coil 33 is reduced. Increase can be suppressed.

(K) In the present embodiment, the first recess HP1 is formed on the first main surface VS1 of the stacked body 10C, and at least a part of the first magnet (magnet 41) is disposed inside the first recess HP1. With this configuration, since the coil 31 is disposed closer to the first magnet than in the case where the first magnet is not disposed inside the first recess HP1, the electromagnetic force due to the interaction between the first magnet and the coil 31. Can be further increased.

(M) In the present embodiment, the first recess HP1 is disposed inside the coil opening CO of the coil 31 when viewed from the Z-axis direction. That is, as shown in FIG. 12B, the first recess HP1 is formed along the coil patterns CP1, CP2, CP3 having higher rigidity than the insulating base layer made of a resin material. The shape of HP1 is reinforced by coil patterns CP1, CP2, CP3. Therefore, even if the laminated body 10C (resin base material layer) is a resin material that easily deforms, it is easy to maintain the shape of the first recess HP1.

(N) In the present embodiment, the first recess HP1 has a side surface tapered from the first main surface VS1 toward the inside of the stacked body 10C, and at least the first magnet (magnet 41). A part is disposed inside the first recess HP1. With this configuration, when the vibration plate 105 vibrates irregularly, the side surface of the first recess HP1 comes into contact with the first magnet and the vibration plate 105 moves to an appropriate position, so that the vibration plate 105 is moved relative to the first magnet. The correct positional relationship can be corrected.

The diaphragm 105 according to the present embodiment is manufactured by, for example, the following process. FIG. 14 is a cross-sectional view sequentially illustrating the manufacturing process of the diaphragm 105. In FIG. 14, for the convenience of explanation, the manufacturing process using one chip (individual piece) will be described.

First, as shown in (1) in FIG. 14, a plurality of insulating base layers 11c, 12c, 13c, and 14c are prepared.

Next, coil patterns CP1, CP2, CP3, external electrodes P1, P2, conductors 21, 22, and other conductors (connection conductors CN1, CN2 in FIG. 12B) are formed on the plurality of insulating base layers 11c, 12c, 13c. ) And interlayer connection conductors and the like are formed.

Also, openings H1a and H2a are formed in the insulating base layers 11c and 12c, respectively. The opening H1a is a through hole arranged in a region surrounded by the coil pattern CP1. The opening H2a is a through hole arranged in a region surrounded by the coil pattern CP2. The openings H1a and H2a are formed by etching with a laser or the like, for example. The openings H1a and H2a may be formed by grinding, polishing, or punching with a drill or the like.

In the present embodiment, the area of the opening H1a viewed from the Z-axis direction is larger than the area of the opening H2a viewed from the Z-axis direction.

Next, as shown in (2) in FIG. 14, the insulating base layers 14c, 13c, 12c, and 11c are stacked in this order on the highly rigid base 2. At this time, the opening H2a of the insulating base material layer 12c is disposed so as to fit inside the opening H1a of the insulating base material layer 11c when viewed from the stacking direction (Z-axis direction). That is, when the insulating base material layer 11c and the insulating base material layer 12c are laminated, the openings H1a and H2a overlap.

Thereafter, the laminated body 10CP is formed by heating and pressurizing the plurality of laminated insulating base material layers 11c, 12c, 13c, and 14c. Specifically, the plurality of laminated insulating base layers are heated and pressed (pressed) by the highly rigid member 3 from the direction of the arrow indicated by (2) in FIG. At the same time, the portion not pressed by the member 3 is isostatically pressed by hydrostatic pressure from the direction of the hollow arrow shown in (2) in FIG. The member 3 has a square frustum shape in which the area of one surface (the upper surface of the member 3 shown in (2) in FIG. 14) is larger than the area of the other surface (the lower surface of the member 3 shown in (2) in FIG. 14). For example, a metal block.

During the heating and pressurization, the member 3 is disposed so as to be located inside the overlapping openings H1a and H2a. Therefore, the side surfaces of the overlapping openings H1a and H2a are pressed against the end surface of the member 3 and are shaped along the end surface of the member 3. In this way, the first recess HP1a having a tapered side surface is formed.

Next, the protective layer 1c is formed on one main surface of the multilayer body 10CP (the upper surface of the multilayer body 10CP shown in (3) in FIG. 14). The protective layer 1c has an opening at a position corresponding to the external electrodes P1 and P2, and an opening at a position corresponding to the first recess HP1a. Therefore, when the protective layer 1c is formed on the upper surface of the multilayer body 10CP (insulating base material layer 11c), the external electrodes P1 and P2 are exposed from the first main surface, and the first recess HP1 is formed.

After the above steps, the diaphragm 105 is separated from the aggregate substrate into individual pieces to obtain a diaphragm 105 as shown in (4) in FIG.

In the above manufacturing method, the example in which the first recess HP1 is formed by laminating the insulating base material layer in which the openings (openings H1a and H2a shown in (1) in FIG. 14) are formed is shown. The formation method of 1st recessed part HP1 is not limited to this. The first recess HP1 may be formed by grinding, polishing, and etching the main surface of the laminate with a laser or a drill after the laminate is formed. Moreover, a laminated body is formed.

In the present embodiment, an example in which one first recess HP1 is formed on the first main surface VS1 of the stacked body 10C is shown, but the present invention is not limited to this configuration. A concave portion (“second concave portion” in the present invention) may be formed on the second main surface VS2 of the stacked body 10C, and at least a part of the second magnet may be disposed inside the second concave portion. Note that the number of first recesses HP1 (or second recesses) is not limited to one, and may be plural. The position of the first recess HP1 (or the second recess) can be changed as appropriate.

In the present embodiment, an example is shown in which the first recess HP1 (or the second recess) is an inverted square frustum-shaped opening formed inward from the main surface of the stacked body 10C. 1 recessed part HP1 (or 2nd recessed part) is not limited to this shape. The shape of the first recess HP1 (or the second recess) can be changed as appropriate, and may be, for example, an inverted polygonal pyramid shape, an inverted truncated cone shape, an inverted cylindrical shape, an inverted conical shape, a hemispherical shape, or the like. That is, the side surface of the first recess HP1 (or the second recess) does not need to be tapered. However, it is preferable that the side surface of the first recess HP1 (or the second recess) is formed in a taper shape from the viewpoint of the function and effect such as (n).

Furthermore, it may be a structure in which at least a part of the first magnet is disposed inside the first recess HP1, and at least a part of the second magnet is disposed inside the second recess. With this configuration, since the coil 31 is disposed closer to the first magnet and the coil 31 is disposed closer to the second magnet, the electromagnetic force due to the interaction between the first magnet and the coil 31 can be increased, and The electromagnetic force due to the interaction between the second magnet and the coil 31 can be increased. Therefore, the driving efficiency of the diaphragm is further increased (the amplitude of the diaphragm can be further increased) as compared with the configuration in which at least a part of the first magnet is disposed in the first recess HP1.

Further, in the present embodiment, the example in which the first recess HP1 is disposed inside the coil opening CO of the coil 31 when viewed from the Z-axis direction is shown, but the present invention is not limited to this configuration. The first recess HP1 may not be disposed inside the coil opening CO of the coil 31 when viewed from the Z-axis direction. However, from the viewpoint of the function and effect such as the above (m), the first recess HP1 (or the second recess) is preferably disposed inside the coil opening CO of the coil 31 as viewed from the Z-axis direction.

<< Sixth Embodiment >>
In the sixth embodiment, an example in which a plurality of coil patterns is spiral is shown.

FIG. 15A is an external perspective view of the diaphragm 106 according to the sixth embodiment, and FIG. 15B is a cross-sectional view of the diaphragm 106. FIG. 16 is an exploded plan view of the diaphragm 106. In FIG. 16, the coil patterns CP1A, CP2A, CP3A, and CP4A are shown as dot patterns in order to facilitate understanding of the structure. In FIG. 16, the outermost peripheral portion of the coil pattern CP1A is shown by a darker dot pattern than the other portions.

The diaphragm 106 includes a laminate 10D, a coil 36 formed in the laminate 10D, and external electrodes P1 and P2. The diaphragm 106 according to the present embodiment is different from the diaphragm 101 according to the first embodiment in that a coil 36 is provided. The other configuration of the diaphragm 106 is substantially the same as that of the diaphragm 101.

Hereinafter, parts different from the diaphragm 101 according to the first embodiment will be described.

As shown in FIG. 16, the laminated body 10D is formed by sequentially laminating a plurality of insulating base material layers 14d, 13c, 12d, 11d and a protective layer 1d. The configuration of the plurality of insulating base material layers 11d, 12d, 13d, 14d and the protective layer 1d is substantially the same as that of the plurality of insulating base material layers 11a, 12a, 13a, 14a and the protective layer 1a described in the first embodiment. The same.

The coil pattern CP1A, the external electrodes P1 and P2, and the connection conductor CN1 are formed on the surface of the insulating base layer 11d. The coil pattern CP1A is a rectangular spiral conductor of about 1.5 turns that is wound along the outer periphery of the insulating base layer 11d. The configurations of the external electrodes P1, P2 and the connection conductor CN1 are the same as those described in the first embodiment.

Further, interlayer connection conductors V1 and V6 are formed on the insulating base material layer 11d.

The coil pattern CP2A and the conductor 23 are formed on the surface of the insulating base layer 12d. The coil pattern CP2A is a rectangular spiral conductor having a strength of about 1.5 turns wound around the outer periphery of the insulating base layer 12d. As shown in FIG. 16, the first end of the coil pattern CP2A is connected to the second end of the coil pattern CP1A via the interlayer connection conductor V1. The conductor 23 is a rectangular conductor disposed near the center of the second side of the insulating base layer 12d (the right side of the insulating base layer 12d in FIG. 16). The conductor 23 is connected to the external electrode P2 through the interlayer connection conductor V6.

Further, interlayer connection conductors V2 and V5 are formed on the insulating base material layer 12d.

The coil pattern CP3A and the conductor 22 are formed on the surface of the insulating base layer 13d. The coil pattern CP3A is a rectangular spiral conductor of about 1.5 turns that is wound along the outer periphery of the insulating base layer 13d. As shown in FIG. 16, the first end of the coil pattern CP3A is connected to the second end of the coil pattern CP2A via the interlayer connection conductor V2. As shown in FIG. 16, the conductor 22 is a rectangular conductor arranged near the center of the second side of the insulating base layer 13d (the right side of the insulating base layer 13d in FIG. 16). The conductor 22 is connected to the conductor 23 via the interlayer connection conductor V5.

Further, interlayer connection conductors V3 and V4 are formed on the insulating base material layer 13d.

The coil pattern CP4A, the conductor 21 and the connection conductor CN2 are formed on the surface of the insulating base layer 14d. The coil pattern CP4A is a rectangular spiral conductor of about 1.5 turns that is wound along the outer periphery of the insulating base layer 14d. As shown in FIG. 16, the first end of the coil pattern CP4A is connected to the second end of the coil pattern CP3A via the interlayer connection conductor V3. The conductor 21 is a rectangular conductor arranged near the center of the second side of the insulating base layer 14d (the right side of the insulating base layer 14d in FIG. 16). The conductor 21 is connected to the conductor 22 via the interlayer connection conductor V4. The connection conductor CN2 is a conductor that connects between the conductor 21 and the second end of the coil pattern CP4A.

Thus, the diaphragm 106 includes a plurality of coil patterns CP1A, CP2A, CP3A, CP4A and interlayer connection conductors V1, V2, V3 formed on the four insulating base layers 11d, 12d, 13d, 14d, respectively. A coil 36 having about 6.5 turns is formed. The first end of the coil 36 is connected to the external electrode P1, and the second end of the coil 36 is connected to the external electrode P2.

As shown in FIG. 16, the line width of a part of the first main surface side coil pattern (coil pattern CP1A) is narrower than the line widths of the other coil patterns CP2A, CP3A, CP4A. Specifically, the line width of the outermost peripheral portion of the first main surface side coil pattern (about one turn located on the outermost outer periphery of the coil pattern CP1A) is larger than the line widths of the other coil patterns CP2A, CP3A, CP4A. thin.

Further, as shown in FIG. 15B, the first main surface side coil pattern (coil pattern CP1A) is closer to the first main surface VS1 than the second main surface VS2 in the stacking direction (Z-axis direction). (L11 <L12).

Next, the vibration element according to this embodiment will be described with reference to the drawings. FIG. 17 is a cross-sectional view illustrating a main part of a vibration element 206 according to the sixth embodiment.

The vibration element 206 includes a vibration plate 106 and a magnet 41.

Both ends in the longitudinal direction of the diaphragm 106 are fixed when the vibration element 206 is incorporated in an electronic device (not shown), and the magnet 41 is fixed to a casing (or cover) of the electronic device (not shown).

In the present embodiment, the magnet 41 corresponds to the “first magnet” in the present invention.

In addition, although illustration is abbreviate | omitted, the magnet 41 is arrange | positioned in the position which overlaps with the formation area (refer coil formation area | region CE in FIG. 3 (A)) of the coil 36 seeing from a Z-axis direction.

Further, the external electrodes P1 and P2 of the diaphragm 106 are connected to the circuit of the electronic device when the vibration element 202 is incorporated in the electronic device (not shown). When a drive current flows through the coil 36 of the diaphragm 106, the diaphragm 106 vibrates in the direction indicated by the white arrow in FIG.

As in the diaphragm 106 according to the present embodiment, a part of the first main surface side coil pattern (coil pattern CP1A) has a narrower line width than the other coil patterns CP2 and CP3. Also, the operations and effects as described in the first embodiment are achieved.

In addition, when the line width of a part of the spiral first main surface side coil pattern is narrower than the line width of the other coil patterns, the outermost peripheral portion of the first main surface side coil pattern (positioned at the outermost periphery). It is preferable that the line width of about one turn) is narrower than the line width of the other coil patterns. When the coil pattern is spiral (when the coil pattern has one or more turns), the outermost peripheral portion of the coil pattern mainly contributes to the formation of magnetic flux that interacts with the first magnet. Therefore, by making the line width of the outer circumference of the first main surface side coil pattern more than a half circumference smaller than the line width of the other coil patterns, while suppressing a significant increase in the conductor loss of the coil 36, The electromagnetic force due to the interaction between the first magnet and the coil 36 can be effectively increased. In addition, it is preferable to make the line width of the whole outermost peripheral part of a 1st main surface side coil pattern thinner than the line width of other coil patterns from the point of said effect | action and effect. This also applies to the relationship between the second main surface side coil pattern and the second magnet.

<< Other Embodiments >>
In each embodiment shown above, although the example which a laminated body is a rectangular flat plate was shown, it is not limited to this structure. The planar shape of the laminate can be changed as appropriate within the range where the functions and effects of the present invention are exhibited, and may be, for example, a circle, an ellipse, or a polygon. Further, the first main surface VS1 and the second main surface VS2 of the stacked body are not limited to complete planes, and some of them may be curved surfaces or the like.

In each of the embodiments described above, an example of a laminate made of a thermoplastic resin has been shown, but the present invention is not limited to this configuration. The laminate of the present invention may be made of a thermosetting resin.

Further, in each of the embodiments described above, the diaphragm including the laminated body constituted by laminating three to five insulating base layers is shown, but the present invention is not limited to this configuration. The number of insulating base material layers forming the laminate can be changed as appropriate within the range where the functions and effects of the present invention are exhibited.

In addition, the diaphragm which concerns on each embodiment shown above showed the example provided with a helical coil including the coil pattern of about 1 turn each formed in three to five insulating base material layers. However, it is not limited to this configuration. The diaphragm of the present invention may include a helical or loop-shaped coil including a plurality of coil patterns of less than one turn, or may include a coil including a plurality of loop-shaped and spiral coil patterns. . In addition, the diaphragm of the present invention may have a configuration including a coil including a meandering coil pattern formed on each of a plurality of insulating base layers. The shape and the number of turns of the coil in the present invention can be changed as appropriate within the range where the functions and effects of the present invention are exhibited. In addition, the coil in this invention should just be the structure containing the coil pattern each formed in an at least 2 or more insulating base material layer.

Moreover, in each embodiment shown above, although two examples of the vibration element provided only with a 1st magnet or the vibration element provided with both the 1st magnet and the 2nd magnet were shown, it is not limited to this structure. Absent. The vibration element of the present invention may be configured to include only the second magnet. Moreover, in each embodiment shown above, although the example in which a vibration element is provided with one or two magnets was shown, the number of magnets is not limited to this, Three or more may be sufficient. When the vibration element includes three or more magnets, the vibration element may include a plurality of first magnets, and the vibration element may include a plurality of second magnets.

In each of the above-described embodiments, the example in which the external electrodes P1 and P2 are provided on the first main surface VS1 side of the multilayer body is shown, but the diaphragm in the present invention is not limited to this configuration. The number, shape, arrangement, and the like of the external electrodes P1, P2 can be changed as appropriate within the scope of the effects and effects of the present invention. The external electrode may be provided on the second main surface VS2 side, or may be provided on both the first main surface VS1 and the second main surface VS2.

Moreover, in each embodiment shown above, although the example in which the protective layer was formed in the 1st main surface VS1 side of a laminated body was shown, it is not limited to this structure. As described above, the protective layer is not essential for the diaphragm of the present invention. Further, the protective layer may be formed on the second main surface VS2 side of the multilayer body, or may be formed on both the first main surface VS1 side and the second main surface VS2 side.

Finally, the description of the above embodiment is illustrative in all respects and not restrictive. Modifications and changes can be made as appropriate by those skilled in the art. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

AP1, AP2, AP3 ... opening AX ... coil winding axis CE ... coil formation region CN1, CN2 ... connection conductor CO ... coil opening CP1, CP1A ... coil pattern (first main surface side coil pattern)
CP2, CP2A, CP3, CP3A, CP4, CP4A, CP5 ... Coil pattern H1, H1a, H2, H2a ... Opening HP1, HP1a ... First recess P1, P2 ... External electrode ML ... Center height V1, V2, V3 V4, V5, V6, V7, V8 ... interlayer connection conductor VS1 ... first main surface VS2 ... second main surface 1, 1a, 1b, 1c, 1d ... protective layer 2 ... pedestal 3 ... members 10A, 10AP, 10B, 10C , 10CP, 10D ... laminates 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 13a, 13b, 13c, 13d, 14b, 14c, 14d, 15b ... insulating base layers 21, 22, 23, 24 ... conductors 31, 32, 33, 34, 36 ... coil 41 ... magnet (first magnet)
42 ... Magnet (second magnet)
101, 102, 103, 104, 105, 106 ... diaphragms 201, 202, 205, 206 ... vibrating elements

Claims (13)

1. Comprising a diaphragm and a first magnet;
   The diaphragm is
   A plurality of insulating base material layers having flexibility, and a laminate having a first main surface;
   A coil formed in the laminate and having a winding axis in the stacking direction of the plurality of insulating base layers;
   Have
   The coil includes a plurality of coil patterns respectively formed on two or more insulating base layers among the plurality of insulating base layers.
   The line width of at least a part of the first main surface side coil pattern disposed closest to the first main surface among the plurality of coil patterns is narrower than at least one line width of the other coil patterns,
   The first magnet is disposed at a position overlapping the formation region of the coil when viewed from the winding axis direction of the coil, and is closest to the first main surface side coil pattern among the plurality of coil patterns. Arranged,
   Vibration element.
2. The laminate has a second main surface facing the first main surface,
   2. The vibration element according to claim 1, wherein the first main surface side coil pattern is closer to the first main surface than the second main surface in the stacking direction.
3. The first main surface side coil pattern has a spiral shape,
   3. The vibration element according to claim 1, wherein a line width equal to or greater than a half circumference of an outermost peripheral portion of the first main surface side coil pattern is narrower than at least one line width of other coil patterns.
4. The vibration element according to any one of claims 1 to 3, wherein a line width of the entire first main surface side coil pattern is narrower than a line width of other coil patterns.
5. A second magnet;
   The laminate has a second main surface facing the first main surface,
   The coil includes a plurality of coil patterns respectively formed on three or more insulating base layers among the plurality of insulating base layers.
   Of the plurality of coil patterns, the line width of at least a part of the second main surface side coil pattern arranged closest to the second main surface, and the line width of at least a part of the first main surface side coil pattern are: , Narrower than at least one line width of other coil patterns,
   The second magnet is disposed at a position overlapping the formation area of the coil when viewed from the winding axis direction of the coil, and is closest to the second main surface side coil pattern among the plurality of coil patterns. The vibration element according to claim 1, wherein the vibration element is disposed as follows.
6. The vibration element according to claim 5, wherein the second main surface side coil pattern is closer to the second main surface than the first main surface in the stacking direction.
7. The second main surface side coil pattern has a spiral shape,
   7. The vibration element according to claim 5, wherein a line width equal to or greater than a half circumference of an outermost peripheral portion of the second main surface side coil pattern is narrower than at least one line width of other coil patterns.
8. The line width of the whole said 1st main surface side coil pattern and the line width of the whole said 2nd main surface side coil pattern are narrower than the line width of coil patterns other than those, The Claim 1 in any one of Claim 5-7 Vibration element.
9. A first recess is formed in the first main surface,
   The first recess is disposed inside a coil opening of the coil as viewed from the stacking direction,
   The vibration element according to claim 1, wherein at least a part of the first magnet is disposed inside the first recess.
10. The vibration element according to claim 9, wherein the first recess has a side surface formed in a tapered shape from the first main surface toward the inside of the stacked body.
11. A second recess is formed in the second main surface,
    The second recess is disposed inside the coil opening of the coil as viewed from the stacking direction,
    The vibration element according to claim 5, wherein at least part of the second magnet is disposed inside the second recess.
12. The vibration element according to claim 11, wherein the second recess has a side surface formed in a taper shape from the second main surface toward the inside of the stacked body.
13. The vibration element according to claim 4 or 8, wherein a line width of the plurality of coil patterns is thicker as it is arranged in an inner layer than a surface layer of the multilayer body in the lamination direction.

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