WO2018105095A1

WO2018105095A1 - Power conversion device

Info

Publication number: WO2018105095A1
Application number: PCT/JP2016/086667
Authority: WO
Inventors: 優志重満; 佐藤　聡
Original assignee: 東芝三菱電機産業システム株式会社
Priority date: 2016-12-09
Filing date: 2016-12-09
Publication date: 2018-06-14
Also published as: JPWO2018105095A1

Abstract

This power conversion device is provided with a first module (1), and a second module that is disposed below the first module (1). The first module (1) includes: a first housing (9); a semiconductor element (3), which is housed in the first housing (9), and which generates heat; a cooling medium flow channel, in which a cooling medium that cools the semiconductor element (3) flows; a pan (40) that is disposed below the cooling medium flow channel; and a discharge section (41) for communicating the pan (40) and the outside of the first housing (9) with each other, said discharge section having a protruding end that is protruding to the outside from the front surface of the first housing (9). The second module includes a second housing that houses an electric component. In plan view, the protruding end of the discharge section (41) is disposed at a position not overlapping the second housing.

Description

Power converter

The present disclosure relates to a power conversion device.

For example, Japanese Patent No. 5127929 (Patent Document 1) discloses a conventional technique related to a power conversion device.

Japanese Patent No. 5127929

The power conversion device includes a heat generating device that generates heat. A cooling medium such as cooling water is supplied and the heat generating device and the cooling medium exchange heat to cool the heat generating device. Even when the cooling medium leaks out, it is necessary to have a configuration in which the power converter can be continuously operated without stopping.

In the present disclosure, a power conversion device capable of continuing operation even when the cooling medium leaks is provided.

According to this indication, a power converter provided with the 1st module and the 2nd module arranged in the up-and-down direction and the 1st module below the 1st module is provided. The first module includes a first housing, a heat generating device that generates heat, a cooling medium flow path through which a cooling medium that cools the heat generating apparatus flows, and a lower portion of the cooling medium flow path. And a discharge portion that has a protrusion protruding outward from the front surface of the first housing and communicates the tray with the outside of the first housing. The second module includes a second housing that houses electrical components. In plan view, the protruding end is disposed at a position that does not overlap the second housing.

The above-described power conversion device is provided outside the first housing and includes a cooling medium pipe connected to the cooling medium flow path. The cooling medium pipe is provided with a joint. In plan view, the joint is disposed at a position that does not overlap with the second housing.

In the above power conversion device, the cooling medium pipe has a tubular body integrally formed from the position of the front surface of the first housing to the position of the back surface of the first housing.

According to the power conversion device according to the present disclosure, the operation of the power conversion device can be continued even when the cooling medium leaks.

It is the perspective view which looked at the power converter device of an embodiment from the front. It is the perspective view which looked at the power converter device of an embodiment from back. It is a side view of the power converter of an embodiment. FIG. 4 is a side view showing the internal structure of the module shown in FIGS.

Hereinafter, the power conversion device according to the embodiment will be described with reference to the drawings. In the embodiments described below, the same or substantially the same configuration is denoted by the same reference numeral, and repeated description is not repeated.

(Configuration of power conversion device 100)
FIG. 1 is a perspective view of a power conversion device 100 according to an embodiment as viewed from the front. Drawing 2 is a perspective view which looked at power converter 100 of an embodiment from back. FIG. 3 is a side view of the power conversion apparatus 100 according to the embodiment. A schematic configuration of the power conversion apparatus 100 will be described with reference to FIGS. The power conversion apparatus 100 includes a pedestal that forms the outer shell of the apparatus. However, in order to clarify the internal configuration of the power conversion apparatus 100 surrounded by the pedestal, the base 102 that forms the bottom of the pedestal is excluded. The gantry is not shown.

The power conversion apparatus 100 includes a first module 1, a second module 51, and a third module 91. The first module 1, the second module 51, and the third module 91 are arranged in this order from top to bottom along the vertical direction. Of the first module 1, the second module 51, and the third module 91, the first module 1 is disposed at the uppermost position. The second module 51 and the third module 91 are arranged below the first module 1. Of the first module 1, the second module 51, and the third module 91, the third module 91 is disposed closest to the base 102.

In the power conversion apparatus 100 according to the embodiment, three-stage modules are arranged in the vertical direction, and six rows of modules are arranged in the horizontal direction. The power conversion apparatus 100 according to the embodiment has a total of 18 modules. The number of modules included in the power conversion device 100 can be arbitrarily adjusted according to the required voltage. Moreover, the some power converter device 100 may be used mutually electrically connected.

The first module 1 has a first housing 9 that forms the outline of the first module 1. A heat generating device that generates heat and an electrical component different from the heat generating device are housed inside the first housing 9. The heat generating device is, for example, a semiconductor element. The electrical component is, for example, a control board that controls a semiconductor element. The second module 51 has a second housing 59 that forms the outline of the second module 51. The third module 91 has a third housing 99 that forms the outline of the third module 91.

Hereinafter, the configuration of the first module 1 will be described in detail. The second module 51 and the third module 91, and the other 15 modules included in the power conversion device 100 according to the embodiment are basically the same. Therefore, it has the same configuration as the first module 1.

The first housing 9 has a front surface 9F (FIGS. 1 and 3) and a back surface 9R (FIGS. 2 and 3). The forward direction and the backward direction in the embodiment are indicated by arrows in the drawing. In the first housing 9, the front surface 9 </ b> F is an outer surface of the outer surface of the first housing 9 that is most easily accessible by a worker who performs field work on the power conversion device 100. The back surface 9R is an outer surface of the first housing 9 on the opposite side to the front surface 9F.

The first module 1 is configured to be movable in the front-rear direction. When replacing the first module 1, the operator moves the first module 1 to be replaced in the forward direction and removes it from the power converter 100, and moves the new first module 1 in the backward direction. Attached to the power converter 100.

As shown in FIG. 1,

couplers

14 and 34 are attached to the front surface 9 </ b> F of the first housing 9. A cooling medium inflow pipe 11 is connected to the coupler 14. A cooling medium outflow pipe 31 is connected to the coupler 34. The cooling medium inflow piping 11 and the cooling medium outflow piping 31 are insulating piping. The

couplers

14 and 34 are configured to be detachable from the front surface 9F of the first housing 9.

When replacing the first module 1, the operator removes the

couplers

14 and 34 from the first module 1 to be replaced. Thereby, the connection between the first module 1 to be exchanged, the cooling medium inflow piping 11 and the cooling medium outflow piping 31 is released. After attaching the new first module 1 to the power converter 100, the operator attaches the

couplers

14 and 34 to the new first module 1. Thereby, the cooling medium inflow piping 11 and the cooling medium outflow piping 31 are connected to the new first module 1, and the cooling medium can be supplied to the new first module 1.

A discharge portion 41 is also provided on the front surface 9F of the first housing 9. Details of the discharge unit 41 will be described later.

As shown in FIGS. 1 and 2,

header tubes

111 and 112 are arranged behind the first module 1. The header pipe 111 is connected to the cooling medium inflow pipe 11 via the joint 12. The header pipe 112 is connected to the cooling medium outflow pipe 31 via the joint 32.

As shown in FIG. 3, the coupler 14 is disposed in front of the front surface 9 </ b> F of the first housing 9. A coupler 13 is attached to the coupler 14, and the cooling medium inflow pipe 11 is connected to the coupler 14 via the joint 13. The joint 13 is disposed in front of the front surface 9F of the first housing 9. Similarly, the coupler 34 and the joint that connect the cooling medium outflow pipe 31 to the first housing 9 are also arranged in front of the front surface 9F of the first housing 9. The second module 51 is disposed below the first module 1, and the joint 13 and the

couplers

14 and 34 are disposed at positions that do not overlap with the second housing 59 of the second module 51 in plan view. ing.

The header tube 111 is arranged behind the rear surface 9R of the first housing 9. A joint 12 is attached to the header pipe 111, and the cooling medium inflow pipe 11 is connected to the header pipe 111 via the joint 12. The joint 12 is disposed behind the back surface 9R of the first housing 9. The joint 32 that connects the header pipe 112 and the cooling medium outflow pipe 31 is also arranged behind the back surface 9 </ b> R of the first housing 9. In a plan view, the

joints

12 and 32 are arranged at positions that do not overlap with the second housing 59 of the second module 51.

The cooling medium inflow pipe 11 and the cooling medium outflow pipe 31 are arranged below the first module 1 and extend in the front-rear direction. The cooling medium inflow piping 11 and the cooling medium outflow piping 31 are disposed above the second module 51. The cooling medium inflow pipe 11 and the cooling medium outflow pipe 31 are arranged in a space between the first module 1 and the second module 51.

The cooling medium inflow piping 11 is connected to the joint 13 at the front end, and is connected to the joint 12 at the rear end. No other joint is provided between the joint 12 and the joint 13. The cooling medium inflow piping 11 has a tubular body integrally formed from the position of the front surface 9F of the first housing 9 to the position of the back surface 9R of the first housing 9. Similarly, the cooling medium outflow pipe 31 has a tubular body integrally formed from the position of the front surface 9F of the first housing 9 to the position of the back surface 9R of the first housing 9.

(Internal structure of module)
FIG. 4 is a side view showing the internal structure of the first module 1 shown in FIGS. The cooling fin 4 and the semiconductor element 3 mounted on the cooling fin 4 are accommodated in the internal space of the first housing 9 of the first module 1. The first module 1 has a plurality of cooling fins 4. A plurality of semiconductor elements 3 are mounted on each cooling fin 4. In the power conversion device 100 of the embodiment, the semiconductor element 3 is a heat-generating device that generates heat. Resistors 5 and cooling fins 6 are also accommodated in the internal space of the first housing 9. The resistor 5 is mounted on the cooling fin 6.

A cooling medium flow path through which the cooling medium flows is provided in the internal space of the first housing 9. The cooling medium flowing into the first housing 9 via the coupler 14 flows into the cooling fin 6 via the pipe 15, the joint 16, the insulating pipe 17 and the joint 18 in this order. The cooling medium flowing out from the cooling fin 6 flows into one cooling fin 4 via the insulating pipe 19 and the joint 20. The cooling medium flowing out from one cooling fin 4 flows into the other cooling fin 4 via the joint 21, the insulating pipe 22 and the joint 23 in this order. The cooling medium flowing out from the other cooling fin 4 flows through the joint 25 and the insulating pipe 26 in this order. The cooling medium flowing out from the first housing 9 flows to the cooling medium outflow pipe 31 via the coupler 34.

The cooling medium flow path provided in the first module 1 of the embodiment includes a pipe 15, a joint 16, an insulating pipe 17, a joint 18, a cooling fin 6, an insulating pipe 19, a joint 20, one cooling fin 4, A joint 21, an insulating pipe 22, a joint 23, the other cooling fin 4, a joint 25, and an insulating pipe 26 are included. Inside the

cooling fins

4 and 6, a meandering space is formed, and the cooling medium can flow through the

cooling fins

4 and 6 through the meandering space.

The heat generated by the semiconductor element 3 is transmitted to the cooling fin 4. Heat is transferred to the cooling medium in the cooling fins 4. In the cooling fin 4, the cooling fin 4 itself that has received heat from the semiconductor element 3 exchanges heat with the cooling medium, whereby the cooling fin 4 is cooled, and thus the semiconductor element 3 is also cooled. Similarly, the resistance 5 is cooled by heat exchange in the cooling fins 6. The semiconductor element 3 and the resistor 5 that generate heat are cooled by the flow of the cooling medium that passes through the internal space of the first housing 9.

A tray 40 is arranged at the bottom of the first module 1. The tray 40 is disposed below the cooling medium flow path. Of the pipes and joints constituting the cooling medium flow path, at least all of the joints are disposed above the tray 40. The

joints

16, 18, 20, 21, 23, 25 shown in FIG. 4 are arranged above the tray 40. The

joints

16, 18, 20, 21, 23, 25 are arranged at positions that overlap with the tray 40 in plan view.

The space defined by the tray 40 and the external space of the first housing 9 are communicated with each other by the discharge unit 41. The discharge portion 41 has a base end provided inside the tray 40 and a protruding end that protrudes outward from the front surface 9F of the first housing 9. The discharge part 41 has a tubular shape. The discharge portion 41 is formed with an internal space that penetrates the discharge portion 41 from the base end to the protruding end. The inner section of the discharge part 41 is open at the base end and is open at the protruding end. The discharge portion 41 protrudes forward with respect to the front surface 9F of the first housing 9. The protruding end of the discharge portion 41 is disposed in front of the front surface 9F of the first housing 9.

The first module 1 has a control board mounting part 2 at its upper end. A control board (not shown) for controlling the semiconductor element 3 is arranged inside the control board mounting portion 2. In the power conversion device 100 of the embodiment, the control board is an electrical component housed in the control board mounting unit 2. As described above, since the second module 51 has the same configuration as that of the first module 1, a control board mounting portion is also formed in the second casing 59 (FIGS. 1 to 3) of the second module 51. The control board is housed in the control board mounting portion.

In the front-rear direction (left-right direction in FIG. 4), the protruding end from which the discharge portion 41 protrudes most from the first housing 9 is disposed in front of the control board mounting portion 2. As shown in FIGS. 1 to 3, the first housing 9 of the first module 1 and the second housing 59 of the second module 51 are in the front-rear direction and the left-right direction (the direction perpendicular to the paper surface in FIG. 4). Arranged at the same position. In plan view, the protruding end of the discharge unit 41 is disposed at a position that does not overlap with the second housing 59 of the second module 51, and thus is disposed at a position that does not overlap with the control board mounting portion of the second module 51. ing.

(Action / Effect)
In the power conversion device 100 described above, as shown in FIG. 4, the tray 40 is disposed below the cooling medium flow path through which the cooling medium flows in the first housing 9 of the first module 1. . The tray 40 is disposed below the

joints

16, 18, 20, 21, 23, 25 included in the cooling medium flow path, and the cooling medium leaks from the

joints

16, 18, 20, 21, 23, 25. In some cases, the leaked cooling medium is received. The cooling medium accumulated in the tray 40 flows into the internal space of the discharge portion 41 from the opening at the proximal end of the discharge portion 41, flows through the internal space of the discharge portion 41, and from the opening at the protruding end of the discharge portion 41. By flowing out, it is discharged to the outside of the first housing 9.

The protruding end of the discharge part 41 from which the cooling medium flows out from the discharge part 41 is arranged at a position that does not overlap with the second housing 59 of the second module 51 in plan view, as shown in FIG. For this reason, the cooling medium flowing out from the discharge unit 41 is suppressed from being scattered in the second casing 59 of the second module 51. The cooling medium flowing out from the discharge part 41 of the first module 1 is suppressed from being scattered on the control board housed in the control board mounting part of the lower second housing 59. Therefore, the control board of the second module 51 is avoided from being affected by the cooling medium. Therefore, even when the cooling medium leaks from the

joints

16, 18, 20, 21, 23, 25 of the first module 1, it is possible to avoid the occurrence of problems in the second module 51. Can continue driving.

The power converter 100 includes a cooling medium inflow pipe 11 and a cooling medium outflow pipe 31. The cooling medium inflow pipe 11 and the cooling medium outflow pipe 31 are connected to the cooling medium flow path of the first module 1 and are arranged outside the first housing 9. As shown in FIG. 3, the

joints

12 and 13 provided in the cooling medium inflow pipe 11 and the joint 32 provided in the cooling medium outflow pipe 31 include a second housing 59 of the second module 51 in a plan view. It is arrange | positioned in the position which does not overlap. The coupler 14 connected to the cooling medium inflow pipe 11 and the coupler 34 connected to the cooling medium outflow pipe 31 are arranged at positions that do not overlap with the second housing 59 of the second module 51 in plan view. .

In this way, even when the cooling medium leaks from the

joints

12, 13, 32 or the

couplers

14, 34, the leaked cooling medium is stored in the control board mounting portion of the second casing 59 below. Scattering to the substrate is suppressed, and the control substrate of the second module 51 is prevented from being affected by the cooling medium. Therefore, since it is possible to avoid the occurrence of a problem in the second module 51, the operation of the power conversion device 100 can be continued.

As shown in FIG. 3, the cooling medium inflow piping 11 has a tubular body integrally formed from the position of the front surface 9F to the position of the rear surface 9R of the first housing 9. Similarly, the cooling medium outflow pipe 31 is integrally formed from the position of the front surface 9F of the first housing 9 to the position of the back surface 9R.

In this way, even when the cooling medium inflow pipe 11 and the cooling medium outflow pipe 31 are arranged at a position overlapping the second casing 59 in plan view, the position overlapping with the second casing 59 in plan view. It is avoided that the joint is arranged in Thereby, the leakage of the cooling medium at a position overlapping the second housing 59 in a plan view can be suppressed. Therefore, the cooling medium scattered from the cooling medium inflow pipe 11 and the cooling medium outflow pipe 31 is suppressed from being scattered on the control board housed in the control board mounting portion of the second housing 59, and the second module 51. It is avoided that the control board is affected by the cooling medium. Therefore, since it is possible to avoid the occurrence of a problem in the second module 51, the operation of the power conversion device 100 can be continued.

Although the embodiment has been described as described above, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 1st module, 2 control board mounting part, 3 semiconductor elements, 4, 6 cooling fins, 5 resistance, 9 first housing, 9F front, 9R back, 11 cooling medium inflow piping, 12, 13, 16, 18 , 20, 21, 23, 25, 32 joint, 14, 34 coupler, 15 piping, 17, 19, 22, 26 insulation piping, 31 cooling medium outflow piping, 40 tray, 41 discharge section, 51 second module, 59 Second housing, 91 third module, 99 third housing, 100 power converter, 102 base, 111, 112 header tube.

Claims

A first module;
The first module and a second module arranged in the vertical direction and disposed below the first module,
The first module includes:
A first housing;
A heat generating device for generating heat, housed in the first housing;
A cooling medium flow path through which a cooling medium for cooling the heat generating device flows;
A saucer disposed below the cooling medium flow path;
A projecting end projecting outward from the front surface of the first housing, and including a discharge portion communicating the tray and the outside of the first housing;
The second module includes a second housing that houses electrical components;
In plan view, the protruding end is disposed at a position that does not overlap the second housing.
A cooling medium pipe disposed outside the first housing and connected to the cooling medium flow path;
The cooling medium pipe is provided with a joint,
The power converter according to claim 1, wherein the joint is disposed at a position that does not overlap with the second housing in a plan view.
The power conversion device according to claim 2, wherein the cooling medium pipe has a tubular body integrally formed from a position on the front surface of the first housing to a position on the back surface of the first housing.