WO2018095135A1 - 量子点led模组 - Google Patents

量子点led模组 Download PDF

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Publication number
WO2018095135A1
WO2018095135A1 PCT/CN2017/103787 CN2017103787W WO2018095135A1 WO 2018095135 A1 WO2018095135 A1 WO 2018095135A1 CN 2017103787 W CN2017103787 W CN 2017103787W WO 2018095135 A1 WO2018095135 A1 WO 2018095135A1
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Prior art keywords
quantum dot
led module
accommodating cavity
dot led
disposed
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French (fr)
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郑少洪
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
Guangzhou Shirui Electronics Co Ltd
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Guangzhou Shiyuan Electronics Thecnology Co Ltd
Guangzhou Shirui Electronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling

Definitions

  • the utility model relates to the technical field of LED packaging, in particular to a quantum dot LED module.
  • Quantum dots also known as nanocrystals, are quasi-zero-dimensional nanomaterials composed of a small number of atoms. Roughly speaking, the dimensions of the three dimensions of quantum dots are all below 100 nm, and the appearance is like a very small dot. The movement of internal electrons in all directions is limited, so the quantum confinement effect is special. Significantly, it is often used in the field of LED light-emitting technology due to the unique luminescent properties of quantum dots.
  • the glass tube with the quantum powder encapsulated therein is generally placed in front of the LED light emitting chip by the bracket structure, and the LED light emitting chip emits high-purity blue light during operation.
  • the quantum powder of different sizes is excited to emit three primary colors and finally mixed into white light.
  • the structure of the above-mentioned quantum dot LED module requires very high precision in mounting. If the mounting structure of the bracket is not properly installed, the blue light emitted by the LED light emitting chip may be transmitted directly through the quantum tube without being transmitted through the quantum tube. The side view of the quantum dot LED module is bluish, and the luminous efficiency of the quantum dots is also reduced.
  • the purpose of the utility model is mainly to solve the problem that the above quantum dot LED installation is difficult and the quantum dot utilization rate is low, so as to meet the needs of practical applications.
  • the utility model provides a quantum dot LED module, which comprises a bracket body and a transparent cover plate.
  • the transparent cover plate is disposed at the top of the bracket body and encloses a receiving cavity with the bracket body.
  • the chamber is filled with quantum dots and an LED light-emitting chip disposed at a lower portion of the quantum dots.
  • the quantum dot LED module wherein the accommodating cavity includes a first accommodating cavity at the top and a second accommodating cavity at the bottom, a partition is disposed between the first accommodating cavity and the second accommodating cavity, and the quantum dot is filled in the first accommodating cavity
  • the LED light emitting chip is disposed in the second accommodating cavity.
  • the quantum dot LED module wherein the second accommodating cavity is filled with glue and phosphor.
  • the quantum dot LED module wherein the bracket body comprises a support portion and a base, and the support portion is disposed on an upper surface of the base and connected to the base.
  • a first bonding stage and a second bonding stage are disposed in order from the top to the bottom of the support portion, and the first bonding stage and the second bonding stage are respectively
  • Each of the stages is an annular bonding table, and the first bonding table and the transparent cover plate are attached to each other, and the second bonding table and the spacer are bonded to each other.
  • the first bonding stage and the second bonding stage are sequentially disposed from the top to the bottom of the support portion, and are disposed on the first bonding stage a first fitting groove, a second fitting groove on the second bonding table, a cover inserting portion on the outer side of the transparent cover, and a partition on the outer side of the partition
  • the cover fitting portion and the first fitting groove are fitted to each other, and the spacer fitting portion and the second fitting groove are fitted to each other.
  • the quantum dot LED module wherein a heat dissipation through hole is uniformly disposed inside the bracket body, and the heat dissipation through hole has a circular shape.
  • the quantum dot LED module wherein the quantum dot comprises a CdSe/ZnS or CdSe/CdS/ZnS nanocrystalline quantum dot having a core-shell structure.
  • the quantum dot LED module wherein the transparent cover is made of PMMA or PC.
  • the quantum dot LED module wherein the transparent cover plate is integrally injection molded.
  • the quantum dot LED module proposed by the utility model has the advantages of simple structure, low production cost, high quantum dot utilization rate, good luminous efficiency and good practicability.
  • FIG. 1 is a schematic view showing the overall structure of a quantum dot LED module in a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of a bracket body in the quantum dot LED module shown in FIG. 1;
  • FIG. 3 is a schematic view showing the overall structure of a quantum dot LED module in a second embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a bracket body in the quantum dot LED module shown in FIG. 3;
  • FIG. 5 is a schematic structural view of a transparent cover plate of the quantum dot LED module shown in FIG. 3;
  • FIG. 6 is a schematic view showing the overall structure of a quantum dot LED module in a third embodiment of the present invention.
  • Bracket body 10 First accommodating cavity 131 Transparent cover 11 Second accommodating cavity 132 Partition 12 First fitting station 1011 Cavity chamber 13 Second fitting station 1012 Support 101 Quantum dot 1311 Base 102 LED light emitting chip 1321 Cover body 111 First fitting groove 10111 Cover insert 112 Second fitting groove 10121
  • a quantum dot LED module includes a bracket body 10 and a transparent cover 11 .
  • the transparent cover 11 is disposed at the top of the bracket body 10 and is enclosed with the bracket body 10 .
  • the accommodating cavity 13 includes a first accommodating cavity 131 and a second accommodating cavity 132.
  • the first accommodating cavity 131 is located at an upper portion of the second accommodating cavity 132.
  • the first accommodating cavity 131 and the A partition 12 is disposed between the second accommodating cavities 132.
  • the partition 12 is a transparent partition.
  • the first accommodating cavity 131 is filled with a quantum dot 1311, and the second accommodating cavity 132 is provided.
  • the shape of the LED light-emitting chip 1321 is square.
  • the LED light-emitting chip 1321 is used to emit high-purity blue light to excite the quantum dots 1311 to emit three primary colors. White light.
  • the bracket body 10 includes a support portion 101 and a base 102.
  • the support portion 101 is disposed on an upper surface of the base 102 and connected to the base 102.
  • the support portion is The shape of 101 may be circular or square. In the present embodiment, the shape of the support portion 101 is circular.
  • a first bonding stage 1011 and a second bonding stage 1012 are provided in this order from the top to the bottom of the support portion 101, and the first bonding stage 1011 and the second bonding stage 1012 are both annular. In the bonding table, the first bonding table 1011 and the transparent cover 11 are bonded to each other, and the second bonding table 1012 and the spacer 12 are bonded to each other to achieve good packaging with each other.
  • the second accommodating cavity 132 is filled with phosphor powder and a package glue to complete the packaging of the blue LED.
  • the quantum dot 1311 is filled in the first accommodating cavity 131.
  • the LED light-emitting chip 1321 disposed in the second accommodating cavity 132 emits high-purity blue light and is excited.
  • the quantum dots 1311 filled in the first accommodating cavity 131 are emitted to emit light of three primary colors and finally mixed into white light.
  • the quantum dot 1311 includes a CdSe/ZnS or CdSe/CdS/ZnS nanocrystalline quantum dot having a core-shell structure.
  • the quantum dot 1311 is a CdSe/ZnS having a core-shell structure, and the core has a core.
  • the shell structure of CdSe/ZnS has good luminescence properties.
  • the material of the transparent cover 11 includes PMMA or PC material.
  • the transparent cover 11 is made of PMMA, and the transparent cover 11 is integrated. Injection molding.
  • the quantum dot LED module includes a bracket body 10 and a transparent cover 11 , and the transparent cover 11 is provided.
  • the accommodating cavity 13 includes a first accommodating cavity 131 and a second accommodating cavity 132, and the first accommodating cavity
  • the cavity 131 is located at an upper portion of the second accommodating cavity 132, wherein a partition 12 is disposed between the first accommodating cavity 131 and the second accommodating cavity 132, and the partition 12 is a transparent partition
  • the first accommodating cavity 131 is filled with a quantum dot 1311, and an LED illuminating chip 1321 is disposed in the second accommodating cavity 132.
  • the embodiment of this embodiment is substantially the same as that in the first embodiment, and the difference is only in:
  • the first bonding table 1011 and the second bonding table 1012 are disposed on the inner side of the support portion 101 from the top to the bottom, and the first fitting groove 10111 is disposed on the first bonding table 1011.
  • a second fitting groove 10121 is provided on the second bonding table 1012.
  • the transparent cover 11 includes a cover body 111 and a cover inserting portion 112 provided on an outer circumference of the cover body 111, similarly a partition inserting portion (not shown) is disposed on an outer side of the partition plate 12, and the cover inserting portion 112 and the first fitting groove 10111 are fitted to each other, and the partition inserting portion is
  • the second fitting grooves 10121 are fitted to each other.
  • the shape of the LED light emitting chip is square.
  • the quantum dot LED module includes a bracket body 10 and a transparent cover 11 , and the transparent cover 11 is disposed on the bracket body 10 .
  • the accommodating cavity 13 includes a first accommodating cavity 131 and a second accommodating cavity 132, and the first accommodating cavity 131 is located at the top An upper portion of the accommodating cavity 132, wherein a partition 12 is disposed between the first accommodating cavity 131 and the second accommodating cavity 132, the partition 12 is a transparent partition, and the first volume
  • the cavity 131 is filled with a quantum dot 1311, and an LED light-emitting chip 1321 is disposed in the second cavity 132.
  • the specific embodiment of the present invention is substantially the same as the specific embodiment in the first embodiment, and the difference is that the heat dissipation through hole 103 is evenly disposed inside the bracket body 10, and the heat dissipation through hole 103 is The shape is a circle. Since the illuminating LED chip 1321 generates a certain amount of heat in actual use, if it is accumulated in the second accommodating cavity 132, the device may be damaged and a certain safety hazard may be caused. Therefore, the heat dissipation through hole 103 is disposed. It is beneficial to eliminate the generated heat in time and ensure safe use.
  • the shape of the LED light-emitting chip 1321 is hemispherical, and the LED light-emitting chip 1321 of the shape is more favorable for uniform scattering of light to finally improve the overall light-emitting effect of the quantum dot LED module.
  • the quantum dot LED module proposed by the utility model has the advantages of simple structure, low production cost, high quantum dot utilization rate, good luminous efficiency and good practicability.

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Abstract

本实用新型涉及一种量子点LED模组，包括支架主体以及透明盖板，所述透明盖板设于所述支架主体的顶部且与所述支架主体围成一容置腔，在所述容置腔内填充有量子点以及设于所述量子点下部的LED发光芯片。本实用新型提出的量子点LED模组结构较为简单、制作成本低且量子点利用率较高，具有良好的发光效率，具有良好的实用性。

Description

量子点LED模组 技术领域
本实用新型涉及LED封装技术领域，特别涉及一种量子点LED模组。
背景技术
量子点(quantum dot)，又可称为纳米晶，是准零维(quasi-zero-dimensional)的纳米材料，由少量的原子所构成。粗略地说，量子点三个维度的尺寸都在100nm以下，外观恰似一极小的点状物，其内部电子在各方向上的运动都受到局限，所以量子限域效应(quantum confinement effect)特别显著，由于量子点所独有的发光性质而常常用在LED发光技术领域。
现有的量子点LED模组在进行装配时，一般利用支架结构将内部封装了量子粉的玻璃管放置在LED发光芯片的正前方，在工作时该LED发光芯片发出高纯度的蓝光照射在该玻璃管上，从而激发不同尺寸的量子粉发出三基色光最终混合成白光。
然而，上述量子点LED模组的结构对安装的精度要求非常高，如果所述支架结构安装配合得不合适，则所述LED发光芯片发出的蓝光很可能直接不经过量子管而透射出画面，使得量子点LED模组的侧画面偏蓝，并且也降低了量子点的发光效率。
实用新型内容
基于此，本实用新型的目的主要是为了解决上述量子点LED安装困难且量子点利用率较低的问题，以满足实际应用的需要。
本实用新型提出一种量子点LED模组，包括支架主体以及透明盖板，所述透明盖板设于所述支架主体的顶部且与所述支架主体围成一容置腔，在所述容置腔内填充有量子点以及设于所述量子点下部的LED发光芯片。
所述量子点LED模组，其中，所述容置腔包括位于顶部的第一容置腔以及 位于底部的第二容置腔，在所述第一容置腔与所述第二容置腔之间设有一隔板，在所述第一容置腔内填充有所述量子点，在所述第二容置腔内设有所述LED发光芯片。
所述量子点LED模组，其中，在所述第二容置腔内填充有胶水以及荧光粉。
所述量子点LED模组，其中，所述支架主体包括支撑部以及底座，所述支撑部设于所述底座的上表面且与所述底座相连。
所述量子点LED模组，其中，在所述支撑部的内侧从上往下依次设有第一贴合台以及第二贴合台，所述第一贴合台与所述第二贴合台均为环状贴合台，所述第一贴合台与所述透明盖板相互贴合，所述第二贴合台与所述隔板相互贴合。
所述量子点LED模组，其中，在所述支撑部的内侧从上往下依次设有所述第一贴合台以及所述第二贴合台，在所述第一贴合台上设有第一嵌合槽，在所述第二贴合台上设有第二嵌合槽，在所述透明盖板的外侧设有盖板嵌入部，在所述隔板的外侧设有隔板嵌入部，所述盖板嵌入部与所述第一嵌合槽相互嵌合，所述隔板嵌入部与所述第二嵌合槽相互嵌合。
所述量子点LED模组，其中，在所述支架主体的内部均匀设有散热通孔，所述散热通孔的形状为圆形。
所述量子点LED模组，其中，所述量子点包括具有核壳结构的CdSe/ZnS或CdSe/CdS/ZnS纳晶量子点。
所述量子点LED模组，其中，所述透明盖板的材质为PMMA或PC。
所述量子点LED模组，其中，所述透明盖板为一体化注塑成型。
本实用新型提出的量子点LED模组结构较为简单、制作成本低且量子点利用率较高，具有良好的发光效率，具有良好的实用性。
附图说明
图1为本实用新型第一实施例中的量子点LED模组的整体结构示意图；
图2为图1所示的量子点LED模组中支架主体的结构示意图；
图3为本实用新型第二实施例中的量子点LED模组的整体结构示意图；
图4为图3所示的量子点LED模组中支架主体的结构示意图；
图5为图3所示的量子点LED模组中透明盖板的结构示意图；
图6为本实用新型第三实施例中的量子点LED模组的整体结构示意图。
支架主体 10 第一容置腔 131
透明盖板 11 第二容置腔 132
隔板 12 第一贴合台 1011
容置腔 13 第二贴合台 1012
支撑部 101 量子点 1311
底座 102 LED发光芯片 1321
盖板主体 111 第一嵌合槽 10111
盖板嵌入部 112 第二嵌合槽 10121
具体实施方式
为了便于理解本实用新型，下面将参照相关附图对本实用新型进行更全面的描述。附图中给出了本实用新型的首选实施例。但是，本实用新型可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本实用新型的公开内容更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本实用新型的技术领域的技术人员通常理解的含义相同。本文中在本实用新型的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本实用新型。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图1与图2，一种量子点LED模组，包括支架主体10以及透明盖板11，所述透明盖板11设于所述支架主体10的顶部且与所述支架主体10围成一容置腔13，所述容置腔13包括第一容置腔131以及第二容置腔132，所述第一容置腔131位于所述第二容置腔132的上部，其中在所述第一容置腔131与所 述第二容置腔132之间设有一隔板12，所述隔板12为透明隔板，所述第一容置腔131内填充有量子点1311，所述第二容置腔132内设有一LED发光芯片1321，在本实施例中，所述LED发光芯片1321的形状为方形，所述LED发光芯片1321用于发出高纯的蓝光以激发所述量子点1311发出三基色光最终混合成白光。
此外，对于所述支架主体10而言，所述支架主体10包括支撑部101以及底座102，所述支撑部101设于所述底座102的上表面且与所述底座102相连，所述支撑部101的形状可以为圆形或方形，在本实施例中，所述支撑部101的形状为圆形。在所述支撑部101的内侧从上往下依次设有第一贴合台1011以及第二贴合台1012，所述第一贴合台1011与所述第二贴合台1012均为环状贴合台，所述第一贴合台1011与所述透明盖板11相互贴合，所述第二贴合台1012与所述隔板12相互贴合以实现相互之间良好地封装。
具体的，在实际安装过程中，在所述第二容置腔132内填满荧光粉以及封装胶水，以完成蓝光LED的封装。然后，再将量子点1311灌装在所述第一容置腔131内，在使用过程中，设于所述第二容置腔132内的所述LED发光芯片1321发出高纯的蓝光并激发灌装在所述第一容置腔131内的量子点1311以发出三基色光最终混合成白光。其中所述量子点1311包括具有核壳结构的CdSe/ZnS或CdSe/CdS/ZnS纳晶量子点，在本实施例中，所述量子点1311为具有核壳结构的CdSe/ZnS，该具有核壳结构的CdSe/ZnS具有良好的发光性能。对于所述透明盖板11而言，所述透明盖板11的材质包括PMMA或者PC材料，在本实施例中，所述透明盖板11的材料为PMMA，此外，该透明盖板11为一体化注塑成型。
请参阅图3至图5，对于本实用新型第二实施例中的量子点LED模组，同样的，该量子点LED模组包括支架主体10以及透明盖板11，所述透明盖板11设于所述支架主体10的顶部且与所述支架主体10围成一容置腔13，所述容置腔13包括第一容置腔131以及第二容置腔132，所述第一容置腔131位于所述第二容置腔132的上部，其中在所述第一容置腔131与所述第二容置腔132之间设有一隔板12，所述隔板12为透明隔板，所述第一容置腔131内填充有量子点1311，所述第二容置腔132内设有一LED发光芯片1321。
本实施例的实施方案与所述第一实施例中的大致相同，其区别仅在于：在 所述支撑部101的内侧从上往下依次设有所述第一贴合台1011以及所述第二贴合台1012，在所述第一贴合台1011上设有第一嵌合槽10111，在所述第二贴合台1012上设有第二嵌合槽10121，所述透明盖板11包括盖板主体111以及设于该盖板主体111的外周的盖板嵌入部112，类似的，在所述隔板12的外侧设有隔板嵌入部(图中未标出)，所述盖板嵌入部112与所述第一嵌合槽10111相互嵌合，所述隔板嵌入部与所述第二嵌合槽10121相互嵌合。同样的，在本实施例中，所述LED发光芯片的形状为方形。
请参阅图6，对于本实用新型第三实施例中的量子点LED模组，该量子点LED模组包括支架主体10以及透明盖板11，所述透明盖板11设于所述支架主体10的顶部且与所述支架主体10围成一容置腔13，所述容置腔13包括第一容置腔131以及第二容置腔132，所述第一容置腔131位于所述第二容置腔132的上部，其中在所述第一容置腔131与所述第二容置腔132之间设有一隔板12，所述隔板12为透明隔板，所述第一容置腔131内填充有量子点1311，所述第二容置腔132内设有一LED发光芯片1321。本实用新型的具体实施方式与所述第一实施例中的具体实施方式大致相同，其区别仅在于：在所述支架主体10的内部均匀设有散热通孔103，所述散热通孔103的形状为圆形。由于所述发光LED芯片1321在实际使用时会产生一定的热量，如果堆积在所述第二容置腔132内有可能造成器件损坏以及带来一定的安全隐患，因此设置所述散热通孔103有利于将产生的热量及时排除，保证使用安全。此外，所述LED发光芯片1321的形状为半球形，该形状的LED发光芯片1321更有利于光线的均匀散射，以最终提高所述量子点LED模组的整体发光效果。
本实用新型提出的量子点LED模组结构较为简单、制作成本低且量子点利用率较高，具有良好的发光效率，具有良好的实用性。
以上所述实施例仅表达了本实用新型的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本实用新型专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干变形和改进，这些都属于本实用新型的保护范围。因此，本实用新型专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种量子点LED模组，其特征在于，包括支架主体以及透明盖板，所述透明盖板设于所述支架主体的顶部且与所述支架主体围成一容置腔，在所述容置腔内填充有量子点以及设于所述量子点下部的LED发光芯片。
  2. 根据权利要求1所述的量子点LED模组，其特征在于，所述容置腔包括位于顶部的第一容置腔以及位于底部的第二容置腔，在所述第一容置腔与所述第二容置腔之间设有一隔板，在所述第一容置腔内填充有所述量子点，在所述第二容置腔内设有所述LED发光芯片。
  3. 根据权利要求2所述的量子点LED模组，其特征在于，在所述第二容置腔内填充有胶水以及荧光粉。
  4. 根据权利要求2所述的量子点LED模组，其特征在于，所述支架主体包括支撑部以及底座，所述支撑部设于所述底座的上表面且与所述底座相连。
  5. 根据权利要求4所述的量子点LED模组，其特征在于，在所述支撑部的内侧从上往下依次设有第一贴合台以及第二贴合台，所述第一贴合台与所述第二贴合台均为环状贴合台，所述第一贴合台与所述透明盖板相互贴合，所述第二贴合台与所述隔板相互贴合。
  6. 根据权利要求4所述的量子点LED模组，其特征在于，在所述支撑部的内侧从上往下依次设有所述第一贴合台以及所述第二贴合台，在所述第一贴合台上设有第一嵌合槽，在所述第二贴合台上设有第二嵌合槽，在所述透明盖板的外侧设有盖板嵌入部，在所述隔板的外侧设有隔板嵌入部，所述盖板嵌入部与所述第一嵌合槽相互嵌合，所述隔板嵌入部与所述第二嵌合槽相互嵌合。
  7. 根据权利要求1所述的量子点LED模组，其特征在于，在所述支架主体的内部均匀设有散热通孔，所述散热通孔的形状为圆形。
  8. 根据权利要求1所述的量子点LED模组，其特征在于，所述量子点包括具有核壳结构的CdSe/ZnS或CdSe/CdS/ZnS纳晶量子点。
  9. 根据权利要求1所述的量子点LED模组，其特征在于，所述透明盖板的材质为PMMA或PC。
  10. 根据权利要求1所述的量子点LED模组，其特征在于，所述透明盖板为一体化注塑成型。
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