WO2018092453A1 - DIELECTRIC COMPOSITE FILTER, HIGH-FREQUENCY MODULE, HIGH-FREQUENCY FRONT-END CIRCUIT, COMMUNICATION DEVICE, AND Massive MIMO SYSTEM - Google Patents

DIELECTRIC COMPOSITE FILTER, HIGH-FREQUENCY MODULE, HIGH-FREQUENCY FRONT-END CIRCUIT, COMMUNICATION DEVICE, AND Massive MIMO SYSTEM Download PDF

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Publication number
WO2018092453A1
WO2018092453A1 PCT/JP2017/036181 JP2017036181W WO2018092453A1 WO 2018092453 A1 WO2018092453 A1 WO 2018092453A1 JP 2017036181 W JP2017036181 W JP 2017036181W WO 2018092453 A1 WO2018092453 A1 WO 2018092453A1
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Prior art keywords
filter
dielectric
dielectric composite
composite filter
circuit
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PCT/JP2017/036181
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French (fr)
Japanese (ja)
Inventor
克人 黒田
尾仲　健吾
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株式会社村田製作所
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Publication of WO2018092453A1 publication Critical patent/WO2018092453A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/212—Frequency-selective devices, e.g. filters suppressing or attenuating harmonic frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides

Definitions

  • the present invention relates to a dielectric composite filter, a high frequency module, a high frequency front end circuit, a communication device, and a Massive MIMO system.
  • a dielectric waveguide filter provides a pass characteristic with extremely steep attenuation at the end of the pass band.
  • TE102 and TE201 since there are a plurality of higher order modes such as TE102 and TE201, suppression of spurious away from the passband is possible. It may not always be enough.
  • Spurious can be easily suppressed, for example, by adding a separate filter element.
  • the wiring conductor which is a wiring connecting the dielectric resonator and the separate filter element, is exposed to the space, the dielectric loss occurs due to radiation loss from the wiring conductor. There is a concern that the insertion loss of the body waveguide filter increases.
  • the present invention provides a dielectric composite filter with low insertion loss while suppressing spurious, a high-frequency module, a high-frequency front-end circuit, a communication device, and a Massive MIMO system using the dielectric composite filter.
  • a dielectric composite filter is formed by connecting a plurality of dielectric resonators, and converts a signal propagation mode into at least one dielectric resonator.
  • a waveguide filter provided with an input / output unit, a dielectric block connected to the dielectric resonator at one end, and a wiring formed on the surface of the dielectric block and extending from the input / output unit
  • a transmission line filter having a conductor.
  • the frequency characteristic of the waveguide filter can be supplemented by the transmission line filter.
  • the transmission line filter is connected to a dielectric resonator at one end where an input / output unit of the waveguide filter is provided, and is connected to the input / output unit by a wiring conductor formed on the surface of the dielectric block. Therefore, for example, compared to a case where a transmission line filter and a waveguide filter provided separately are connected by wiring, the wiring conductor can be significantly shortened, and radiation loss from the wiring conductor can be kept small. As a result, a dielectric composite filter having excellent frequency characteristics and low insertion loss can be obtained.
  • the transmission line filter may be a low pass filter.
  • the wiring conductor may have at least two or more portions having different widths that are dimensions in a direction orthogonal to the signal propagation direction in the wiring conductor.
  • the insufficient suppression of spurious due to the waveguide filter can be compensated by the transmission line filter which is a low-pass filter.
  • the transmission line filter may be a band elimination filter or a notch filter.
  • the wiring conductor may include a main conductor provided in a signal propagation direction and a plurality of open stubs branched from the main conductor.
  • a transmission line filter that is a band elimination filter or a notch filter.
  • the plurality of open stubs may include a first open stub extending to one side of the main conductor and a second open stub extending to the other side of the main conductor.
  • a conductor film may be formed on the surface of the transmission line filter opposite to the surface on which the wiring conductor is formed.
  • the wiring conductor of the transmission line filter is shielded by the conductor film, the radiation loss from the wiring conductor can be further reduced. As a result, the insertion loss of the dielectric composite filter is further reduced.
  • a conductor film is formed on the surface of the waveguide filter, and the conductor film formed on the opposite surface of the transmission line filter is a conductor film formed on the surface of the waveguide filter. There may be.
  • the wiring conductor and the input / output unit may be formed on the same surface of the dielectric composite filter.
  • the dielectric composite filter can be surface-mounted with the surface on which the wiring conductor and the input / output section are formed as the mounting surface, so the structure of the dielectric composite filter is simplified and the size is reduced. Is possible.
  • the input / output unit may be provided at a corner of the dielectric resonator at the one end.
  • the radiation loss from the wiring conductor is further suppressed, and the insertion loss of the dielectric composite filter is further reduced.
  • the dielectric composite filter may further include a dielectric resonator connected to a dielectric resonator at the other end of the waveguide filter.
  • the transmission line filter may be a low pass filter, and the dielectric resonator connected to the dielectric resonator at the other end may be a band elimination filter.
  • the dielectric resonator connected to the dielectric resonator at the other end functions as a band elimination filter, so that a steeper attenuation can be obtained at the passband end of the dielectric composite filter.
  • a high-frequency module includes the above-described dielectric composite filter, and a substrate on which a connection electrode having the same shape as a wiring conductor of the dielectric composite filter is formed. The wiring conductor and the connection electrode of the substrate are combined.
  • a high-frequency front-end circuit includes the above-described dielectric composite filter connected to an antenna element, a transmission amplifier circuit that amplifies a high-frequency transmission signal to be transmitted to the antenna element, and reception by the antenna element.
  • a reception amplifier circuit that amplifies the received high-frequency received signal, a transmission amplifier circuit, the reception amplifier circuit, and a switch circuit that switches connection between the dielectric composite filter.
  • a high-frequency front-end circuit includes a transmission amplifier circuit that amplifies a high-frequency transmission signal output from an RF signal processing circuit, and a reception amplifier circuit that amplifies a high-frequency reception signal and outputs the amplified signal to the RF signal processing circuit And the above-mentioned dielectric composite filter disposed between the RF signal processing circuit and the transmission amplifier circuit or between the RF signal processing circuit and the reception amplifier circuit.
  • a communication apparatus is connected to an antenna element, and amplifies a high-frequency signal transmitted and received by the antenna element.
  • the communication apparatus is connected to the high-frequency front-end circuit and the high-frequency front-end circuit.
  • An RF signal processing circuit that performs signal processing including frequency conversion between a high-frequency signal and a baseband signal, and a baseband signal processing circuit that is connected to the RF signal processing circuit and performs signal processing on the baseband signal.
  • a Massive MIMO system includes an antenna including a plurality of patch antennas arranged in a matrix and the above-described dielectric composite filter for each patch antenna.
  • a dielectric composite filter with low insertion loss while suppressing spurious, and a high-frequency front-end circuit, a communication device, and a Massive MIMO system using the dielectric composite filter are obtained. It is done.
  • FIG. 1 is a perspective view showing a structure of a dielectric composite filter according to Embodiment 1.
  • FIG. FIG. 2 is a plan view of a substrate on which the dielectric composite filter according to Embodiment 1 is mounted.
  • FIG. 3 is a graph showing the characteristics of the dielectric composite filter according to the first embodiment.
  • FIG. 4 is a perspective view showing the structure of the dielectric composite filter according to the second embodiment.
  • FIG. 5 is a graph showing the characteristics of the dielectric composite filter according to the second embodiment.
  • FIG. 6 is a perspective view showing a structure of a dielectric composite filter according to a comparative example of the second embodiment.
  • FIG. 7 is a graph showing characteristics of the transmission line filter according to the comparative example of the second embodiment.
  • FIG. 8 is a perspective view showing the structure of the dielectric composite filter according to the third embodiment.
  • FIG. 9 is a perspective view showing the structure of another dielectric composite filter according to the third embodiment.
  • FIG. 10 is an exploded perspective view showing the structure of the dielectric composite filter according to the fourth embodiment.
  • FIG. 11 is a perspective view showing the structure of the dielectric composite filter according to the fourth embodiment.
  • FIG. 12 is an exploded perspective view showing the structure of another dielectric composite filter according to the fifth embodiment.
  • FIG. 13A is a circuit diagram showing a high-frequency front-end circuit and a communication device according to Embodiment 6.
  • FIG. 13B is a circuit diagram showing a high-frequency front-end circuit according to Modification 1 of Embodiment 6.
  • FIG. 13A is a circuit diagram showing a high-frequency front-end circuit and a communication device according to Embodiment 6.
  • FIG. 13B is a circuit diagram showing a high-frequency front-end circuit according to Modification 1 of Embodiment
  • FIG. 13C is a circuit diagram showing a high-frequency front-end circuit according to Modification 2 of Embodiment 6.
  • FIG. 14A is a circuit diagram showing a Massive MIMO system according to Embodiment 7.
  • FIG. 14B is a plan view of the antenna device of the Massive MIMO system according to Embodiment 7.
  • FIG. 1 is a perspective view showing an example of the structure of the dielectric composite filter according to the first embodiment.
  • the dielectric composite filter 1 includes a waveguide filter 10 and a transmission line filter 21.
  • the waveguide filter 10 is formed by connecting a plurality of dielectric resonators 12 to 15.
  • the waveguide filter 10 is formed by covering a substantially rectangular parallelepiped dielectric block 40 provided with a plurality of grooves 40a and 40b with a conductive film 50, and a region divided by the grooves 40a and 40b is a dielectric resonator 12. Functions as ⁇ 15.
  • the dielectric block 40 is made of, for example, a dielectric material such as crystal or ceramic, and the grooves 40a and 40b are provided by machining using, for example, a wire saw.
  • the conductive film 50 is formed, for example, by applying and baking a conductive paste containing silver. In FIG. 1, a conductive film 50 is formed in a hatched area on the surface of the dielectric block 40, and the dielectric block 40 is exposed in a white area. Although not shown in FIG. 1, the conductive coating 50 is also formed on the back side and left side surfaces of the dielectric block 40.
  • the dielectric resonators 12 and 15 at both ends are provided with input / output units 18 and 19 for converting a signal propagation mode between a TE (Transverse Electric) mode and a TEM (Transverse ElectroMagnetic) mode, respectively.
  • TE Transverse Electric
  • TEM Transverse ElectroMagnetic
  • the TE mode and the TEM mode are signal propagation modes inside and outside the waveguide filter 10, respectively.
  • the transmission line filter 21 includes a dielectric block connected to the dielectric resonator 12 and a wiring conductor 53 formed on the surface of the dielectric block and extending from the input / output unit 18.
  • the dielectric block constituting the transmission line filter 21 is one end portion divided by the groove 40 b of the dielectric block 40. That is, the transmission line filter 21 and the waveguide filter 10 are integrally formed using a single dielectric block 40.
  • the term “wiring conductor 53” extending from the input / output unit 18 means that the wiring conductor 53 is a part of the conductive coating 50 and is connected to a portion of the conductive coating 50 that constitutes the input / output unit 18. It may mean that.
  • the wiring conductor 53 has a plurality of portions having different widths, and a region where the conductive coating 50 is not disposed is provided around the wiring conductor 53.
  • the width of the wiring conductor 53 refers to a dimension in a direction orthogonal to the signal propagation direction in the wiring conductor 53.
  • the transmission line filter 21 functions as a low-pass filter.
  • the wiring conductor 53 may be formed by applying and baking a conductive paste containing silver.
  • the wiring conductor 53 and the input / output unit 18 are formed on the same surface of the dielectric block 40 constituting the dielectric composite filter 1 (the surface shown on the front side in FIG. 1).
  • the dielectric composite filter 1 is mounted on the substrate on the surface.
  • this surface is referred to as a mounting surface.
  • a conductive coating 51 is formed on the surface of the transmission line filter 21 opposite to the surface on which the wiring conductor 53 is formed (the back side surface in FIG. 1).
  • the conductive film 51 (including the wiring conductor 53) formed on the surface of the transmission line filter 21 may be the same conductor film as the conductive film 51 formed on the surface of the waveguide filter 10.
  • FIG. 2 is a plan view showing an example of a substrate 80 on which the dielectric composite filter 1 is mounted. The broken line represents the mounting position of the dielectric composite filter 1.
  • a conductive foil 81 is laid on the substrate 80.
  • the substrate 80 is made of, for example, a resin such as epoxy or phenol, and the conductor foil 81 is made of, for example, a copper foil.
  • the conductor foil 81 is disposed in a region indicated by oblique lines on the surface of the substrate 80 and is not disposed in a white region.
  • the conductor foil 81 extends from a corresponding position of the input / output unit 18 of the dielectric composite filter 1 and constitutes a connection electrode 82 having the same shape as the wiring conductor 53. Further, a coplanar line 83 connected to the connection electrode 82 and a coplanar line 84 extending from a corresponding position of the input / output unit 19 of the dielectric composite filter 1 are configured. Other portions of the conductor foil 81 constitute a ground plane.
  • connection electrode 82 of the substrate 80 and the wiring conductor 53 of the dielectric composite filter 1 are joined by a conductive joining material such as solder to constitute the high frequency module 8.
  • An application circuit using the high-frequency module 8 inputs and outputs signals to the dielectric composite filter 1 via the coplanar lines 83 and 84 of the substrate 80.
  • the fact that the wiring conductor 53 and the connection electrode 82 have the same shape is not limited to the fact that the shape of the wiring conductor 53 and the shape of the connection electrode 82 are exactly the same.
  • a shape having the same design and including a manufacturing error may be included in the same shape.
  • shapes having overlapping regions that can be joined to each other through a conductive bonding material such as solder may be included in the same shape.
  • FIG. 3 is a graph showing an example of pass characteristics (frequency dependence of insertion loss) of the dielectric composite filter 1.
  • FIG. 3 shows the simulation results of the pass characteristics of the waveguide filter 10 and the transmission line filter 21 separated from the dielectric composite filter 1 and the pass characteristics of the dielectric composite filter 1 as a whole. The loss is shown normalized to 0 dB.
  • the transmission line filter 21 can supplement the frequency characteristics of the waveguide filter 10. Specifically, insufficient transmission of spurious due to the waveguide filter 10 is compensated by the transmission line filter 21 that is a low-pass filter.
  • the transmission line filter 21 is connected to the dielectric resonator 12 having the input / output unit 18 of the waveguide filter 10 and is connected to the input / output unit 18 by a wiring conductor 53 formed on the surface of the dielectric block.
  • the wiring conductor 53 can be significantly shortened, and radiation loss from the wiring conductor 53 can be kept small.
  • the radiation loss from the wiring conductor 53 can be reduced by shielding the wiring conductor 53 with the conductive coating 50.
  • the dielectric composite filter 1 having excellent frequency characteristics and low insertion loss can be obtained.
  • the dielectric resonator 12 of the waveguide filter 10 and the transmission line filter 21 are connected to each other and can be integrally formed from a single dielectric block 40.
  • integrally forming the waveguide filter 10 and the transmission line filter 21 from a single dielectric block 40 the manufacturing process of the dielectric composite filter 1 is simplified, and variations in frequency characteristics are also suppressed.
  • the dielectric composite filter 1 can be surface-mounted with the same surface as a mounting surface. This simplifies the structure of the dielectric composite filter 1 and enables downsizing.
  • the radiation loss from the wiring conductor 53 is further reduced, and the insertion loss of the dielectric composite filter 1 is further reduced.
  • Embodiment 2 In Embodiment 1, although the transmission line filter 21 which functions as a low-pass filter was illustrated, a transmission line filter is not restricted to a low-pass filter. In the second embodiment, a dielectric composite filter in which the transmission line filter is a band elimination filter or a notch filter will be described.
  • FIG. 4 is a perspective view showing an example of the structure of the dielectric composite filter according to the second embodiment.
  • the dielectric composite filter 2 shown in FIG. 4 is configured by replacing the transmission line filter 21 of the dielectric composite filter 1 of FIG. Since the other components of the dielectric composite filter 2 are the same as those of the dielectric composite filter 1, the same reference numerals are given and description thereof is omitted.
  • the transmission line filter 22 includes a dielectric block connected to the dielectric resonator 12 and a wiring conductor 54 formed on the surface of the dielectric block and extending from the input / output unit 18.
  • the dielectric block constituting the transmission line filter 22 is one end portion divided by the groove 40 b of the dielectric block 40. That is, the transmission line filter 22 and the waveguide filter 10 are integrally formed using a single dielectric block 40.
  • the wiring conductor 54 has a main conductor 56 provided in the signal propagation direction in the wiring conductor 54 and a plurality of open stubs 57 and 58 branched from the main conductor 56. A region where the coating 50 is not disposed is provided. Thereby, the transmission line filter 22 functions as a band elimination filter or a notch filter.
  • the wiring conductor 54 and the input / output unit 18 are formed on the mounting surface of the dielectric composite filter 2 (the surface shown on the front side in FIG. 4).
  • FIG. 5 is a graph showing an example of the pass characteristic of the dielectric composite filter 2.
  • FIG. 5 shows the simulation results of the pass characteristics of the waveguide filter 10 and the transmission line filter 22 separated from the dielectric composite filter 2 and the pass characteristics of the dielectric composite filter 2 as a whole. The loss is shown normalized to 0 dB.
  • the radiation loss from the wiring conductor 54 can be kept small.
  • the dielectric composite filter 2 having excellent frequency characteristics and low insertion loss can be obtained.
  • FIG. 6 is a perspective view showing an example of the structure of the dielectric composite filter according to the comparative example of the second embodiment.
  • the dielectric composite filter 3 shown in FIG. 6 is configured by replacing the transmission line filter 22 of the dielectric composite filter 2 of FIG. Since the other components of the dielectric composite filter 3 are the same as those of the dielectric composite filter 2, the same reference numerals are given and description thereof is omitted.
  • the transmission line filter 23 is configured by changing the open stub 58 of the transmission line filter 22 to an open stub 59 extending to the same side as the open stub 57 of the main conductor 56.
  • FIG. 7 is a graph showing an example of pass characteristics of the transmission line filters 22 and 23.
  • FIG. 7 shows the simulation results of the transmission characteristics of the transmission line filters 22 and 23 separated from the dielectric composite filters 2 and 3, respectively, with the minimum loss within the display range normalized to 0 dB.
  • the transmission line filter 23 has a smaller attenuation than the transmission line filter 22 at a frequency of 38 GHz or more corresponding to spurious. This is thought to be because the open stubs are connected to the same side of the main conductor and coupling occurs between the open stubs, thereby reducing the attenuation.
  • the transmission line filter 22 that opens the open stubs 57 and 58 to both sides of the main conductor 56 is more than the transmission line filter 23 that opens the open stubs 57 and 59 only to one side of the main conductor 56. It can be said that it is excellent.
  • the dielectric composite filter formed by connecting the transmission line filter to one end of the waveguide filter is illustrated, but the dielectric composite filter is not limited to this example.
  • a dielectric composite filter in which a dielectric resonator is further connected to the other end of the waveguide filter will be described.
  • FIG. 8 is a perspective view showing an example of the structure of the dielectric composite filter according to the third embodiment.
  • the dielectric composite filter 4 shown in FIG. 8 is different from the dielectric composite filter 1 of FIG. 1 in that the waveguide filter 11 is changed, and a transmission line filter 21 and a dielectric are formed at one end and the other end of the waveguide filter 11.
  • the body resonators 31 are connected to each other.
  • the waveguide filter 11 is configured by adding a dielectric resonator 16 to the waveguide filter 10. Since the other components of the dielectric composite filter 4 are the same as those of the dielectric composite filter 1, the same reference numerals are given and description thereof is omitted.
  • the dielectric resonator 31 is connected to the dielectric resonator 15.
  • the dielectric resonator 31 is an end portion divided by the groove 40 c of the dielectric block 40. That is, the dielectric resonator 31 and the waveguide filter 11 are integrally formed using a single dielectric block 40.
  • the dielectric resonator 31 functions as a band elimination filter and further improves the frequency characteristics of the dielectric composite filter 4 by giving large attenuation to the frequency in the vicinity of the pass band.
  • FIG. 9 is a perspective view showing an example of the structure of another dielectric composite filter according to the third embodiment.
  • the dielectric composite filter 5 shown in FIG. 9 is configured by replacing the transmission line filter 21 of the dielectric composite filter 4 of FIG. Since the other components of the dielectric composite filter 5 are the same as those of the dielectric composite filter 4, the same reference numerals are given and description thereof is omitted. Also in the dielectric composite filter 5, the frequency characteristics are improved by the dielectric resonator 31 as in the case of the dielectric composite filter 4.
  • the dielectric composite filter according to Embodiment 4 is a dielectric composite filter formed by bonding a first part and a second part of a dielectric composite filter provided separately.
  • FIG. 10 is an exploded perspective view showing an example of the structure of the dielectric composite filter according to the fourth embodiment.
  • the dielectric composite filter 6 includes a first portion 61 and a second portion 62.
  • the first portion 61 and the second portion 62 are shown as seen from different viewpoints.
  • the dielectric composite filter 6 corresponds to a portion composed of the transmission line filter 22 and the waveguide filter 11 in the dielectric composite filter 5 of FIG.
  • the constituent elements of the dielectric composite filter 6 are denoted by the same reference numerals as the corresponding constituent elements of the dielectric composite filter 5.
  • the first portion 61 is formed by connecting the transmission line filter 22 and the dielectric resonators 12 and 13a.
  • the first portion 61 is formed by covering a substantially rectangular parallelepiped dielectric block 41 provided with a plurality of grooves 41a and 41b with a conductive film 51, and a region divided by the grooves 41a and 41b is the transmission line filter 22, dielectric It functions as the body resonators 12 and 13a.
  • the transmission line filter 22 is provided with a wiring conductor 54 similar to that shown in FIG.
  • the second portion 62 is formed by connecting the dielectric resonators 14a, 16, and 15.
  • the second portion 62 is formed by covering a substantially rectangular parallelepiped dielectric block 42 provided with a plurality of grooves 42 a with a conductive film 52, and regions divided by the grooves 42 a are used as dielectric resonators 14 a, 16, and 15. Function.
  • the dielectric resonators 13 a and 14 a are provided with coupling windows 51 a and 52 a through which electromagnetic waves can pass through the dielectric resonators 13 and 14 of the dielectric composite filter 5.
  • the coupling windows 51a and 52a are formed by not disposing the conductive films 51 and 52.
  • the dielectric composite filter 6 is configured by bonding the first portion 61 and the second portion 62 with, for example, an adhesive.
  • FIG. 11 is a perspective view showing an example of the dielectric composite filter 6 after the first portion 61 and the second portion 62 are bonded together.
  • Dielectric resonators 13a and 14a are coupled via coupling windows 51a and 52a.
  • the dielectric composite filter 6 functions substantially the same as the portion constituted by the transmission line filter 22 and the waveguide filter 11 of the dielectric composite filter 5 of FIG. To do.
  • the transmission line filter in the dielectric composite filter 6 is not limited to the transmission line filter 22, and for example, the transmission line filter 21 of FIG. 8 may be used.
  • the dielectric composite filter 6 functions substantially the same as the portion constituted by the transmission line filter 21 and the waveguide filter 11 of the dielectric composite filter 4 of FIG.
  • FIG. 12 is an exploded perspective view showing an example of the structure of another dielectric composite filter according to the fourth embodiment. As shown in FIG. 12, the dielectric composite filter 7 is configured by bonding the first portion 71 and the second portion 72 together.
  • a desired attenuation pole is added by providing coupling windows 51 b and 52 b in the dielectric resonators 12 a and 16 a.
  • the dielectric composite filter formed by bonding a plurality of parts provided separately is not limited to the above example.
  • the third portion and the fourth portion may be further bonded to the invisible surface on the side.
  • a dielectric having a two-story structure in which the first portion 61 and the second portion 62 are located in the first layer including the mounting surface, and the third portion and the fourth portion are located in the second layer above the mounting surface.
  • a body composite filter is constructed. In such a dielectric composite filter, for example, the arrangement of the coupling window is changed and added so that a signal is transmitted in the order of the first portion 61, the third portion, the fourth portion, and the second portion 62.
  • FIG. 13A is a circuit diagram showing the high-frequency front-end circuit 110 and its peripheral circuits according to the sixth embodiment.
  • a high-frequency front-end circuit 110 an antenna element 150, an RF signal processing circuit 191 and a baseband signal processing circuit 192 are shown.
  • the high-frequency front end circuit 110 includes filters 161, 162, and 163, a switch circuit 170, a power amplifier circuit 181, and a low noise amplifier circuit 182.
  • the power amplifier circuit 181 is a transmission amplification circuit that amplifies the high-frequency transmission signal output from the RF signal processing circuit 191 and outputs the amplified signal to the antenna element 150 via the switch circuit 170 and the filter 161.
  • the low noise amplifier circuit 182 is a reception amplification circuit that amplifies a high-frequency signal that has passed through the antenna element 150, the filter 161, and the switch circuit 170 and outputs the amplified signal to the RF signal processing circuit 191.
  • the filter 161 is an antenna filter that is connected to the antenna element 150 and selectively allows high-frequency signals in the transmission band and the reception band to pass therethrough, for example.
  • the filter 162 is an interstage filter that is disposed between the power amplifier circuit 181 and the RF signal processing circuit 191 and selectively passes a high-frequency signal in the transmission band.
  • the filter 163 is an interstage filter that is disposed between the low noise amplifier circuit 182 and the RF signal processing circuit 191 and selectively passes a high frequency signal in the reception band.
  • the switch circuit 170 is a switch that switches connection between the antenna element 150 and the transmission signal path and the reception signal path.
  • the RF signal processing circuit 191 processes the high-frequency reception signal input from the antenna element 150 via the reception signal path by down-conversion or the like, and the baseband signal processing circuit 192 generates the reception signal generated by the signal processing. Output to.
  • the RF signal processing circuit 191 is, for example, an RFIC (Radio Frequency Integrated Circuit). Further, the RF signal processing circuit 191 performs signal processing on the transmission signal input from the baseband signal processing circuit 192 by up-conversion or the like, and outputs the high-frequency transmission signal generated by the signal processing to the power amplifier circuit 181.
  • the signal processed by the baseband signal processing circuit 192 is used, for example, for displaying an image as an image signal or for calling as an audio signal.
  • the high-frequency front end circuit 110 may include other circuit elements between the filters 161, 162, and 163, the switch circuit 170, the power amplifier circuit 181, and the low noise amplifier circuit 182.
  • the dielectric composite filters according to the first to fourth embodiments can be used as the filters 161, 162, and 163.
  • the filters 161, 162, and 163 achieve a small insertion loss while suppressing spurious, so that a high-frequency front-end circuit having excellent high-frequency characteristics can be realized.
  • FIG. 13B is a circuit diagram showing the high-frequency front end circuit 110B according to the first modification of the sixth embodiment.
  • the high frequency front end circuit 110 ⁇ / b> B includes filters 161, 162 and 163, a power amplifier circuit 181, a low noise amplifier circuit 182, a circulator 171, and a switch circuit 172.
  • the high-frequency front end circuit 110B according to this modification is different from the high-frequency front end circuit 110 in the configuration for switching between the transmission signal path and the reception signal path.
  • the description of the same configuration as that of the high-frequency front end circuit 110 will be omitted, and a description will be given focusing on different configurations.
  • the circulator 171 has an antenna-side terminal, a transmission-side terminal, and a reception-side terminal. During reception, the circulator 171 selectively propagates a reception signal from the antenna element 150 to the reception signal path, and at the time of transmission, the antenna element 150 is transmitted from the transmission signal path. This is a circuit element that selectively propagates a transmission signal to.
  • the switch circuit 172 is a switch for switching the connection between the circulator 171 and the reception signal path.
  • the receiving side terminal of the circulator 171 is terminated with a terminating resistor (50 ⁇ ).
  • the reception side terminal of the circulator 171 is connected to the low noise amplifier circuit 182.
  • the high-frequency front end circuit 110B is applied as a time division duplex front-end circuit.
  • the dielectric composite filters according to the first to fourth embodiments can be used as the filters 161, 162, and 163.
  • FIG. 13C is a circuit diagram showing a high-frequency front-end circuit 110C according to the second modification of the sixth embodiment.
  • the high frequency front end circuit 110 ⁇ / b> C includes a duplexer 164, filters 162 and 163, a power amplifier circuit 181, a low noise amplifier circuit 182, and an isolator 173.
  • the high-frequency front end circuit 110C according to this modification is different from the high-frequency front end circuit 110 in the configuration for switching between the transmission signal path and the reception signal path.
  • the description of the same configuration as that of the high-frequency front end circuit 110 will be omitted, and a description will be given focusing on different configurations.
  • the duplexer 164 has an antenna terminal, a transmission side terminal, and a reception side terminal, has a transmission filter between the antenna terminal and the transmission side terminal, and has a reception filter between the antenna terminal and the reception side terminal. Have.
  • the isolator 173 is a circuit element that is disposed between the transmission-side terminal of the duplexer 164 and the power amplifier circuit 181 and propagates a transmission signal in one direction from the power amplifier circuit 181 to the duplexer 164.
  • the isolator 173 can be realized, for example, by terminating one terminal among the three terminals of the circulator by 50 ⁇ .
  • the high frequency front end circuit 110C is applied as a front end circuit of a frequency division duplex system.
  • the dielectric composite filter according to the first to fourth embodiments can be used as the transmission-side filter and the reception-side filter of the duplexer 164 and the filters 162 and 163.
  • the phantom cell is a network configuration that separates a control signal for ensuring communication stability between a macro cell in a low frequency band and a small cell in a high frequency band and a data signal that is a target of high-speed data communication.
  • Each phantom cell is provided with a Massive MIMO antenna device.
  • the Massive MIMO system is a technique for improving transmission quality in a millimeter wave band or the like, and controls the directivity of the antenna element by controlling a signal transmitted from each antenna element.
  • the Massive MIMO system uses a large number of antenna elements, and therefore can generate a sharp directional beam.
  • By increasing the directivity of the beam it is possible to fly radio waves to some extent even in a high frequency band, and it is possible to reduce the interference between cells and increase the frequency utilization efficiency.
  • FIG. 14A is a circuit diagram showing a Massive MIMO system according to Embodiment 7.
  • FIG. 14B is a plan view of the antenna device of the Massive MIMO system according to Embodiment 7.
  • the antenna device 111 shown in FIG. 14B is used in the Massive MIMO system shown in FIG. 14A.
  • the antenna device 111 includes a plurality of patch antennas 112 arranged in a matrix.
  • FIG. 14A is a diagram illustrating a configuration of a high-frequency front-end circuit 110A including the antenna device 111.
  • This high-frequency front end circuit 110A is a Massive MIMO system according to the present embodiment.
  • the patch antenna 112 is connected with band-pass filters 161a, 161b and 161c.
  • a switch circuit 170a is connected between the filter 161a, the power amplifier circuit 181a, and the low noise amplifier circuit 182a.
  • a switch circuit 170b is connected between the filter 161b, the power amplifier circuit 181b, and the low noise amplifier circuit 182b.
  • a switch circuit 170c is connected between the filter 161c, the power amplifier circuit 181c, and the low noise amplifier circuit 182c.
  • the low noise amplifier circuits 182a, 182b, and 182c are connected to the baseband signal processing circuit 192.
  • a band pass filter 162a and a mixer 194a are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181a.
  • a band-pass filter 162b and a mixer 194b are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181b.
  • a band-pass filter 162c and a mixer 194c are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181c.
  • a local oscillator 193 is connected to the mixers 194a, 194b and 194c. The local oscillator 193 outputs, to the mixers 194a to 194c, a reference frequency for up-conversion to a high frequency and down-conversion to a low frequency in the mixers 194a to 194c.
  • Filters 161a to 161c pass the transmission / reception frequency band and remove other frequency components.
  • the switch circuits 170a to 170c switch between a transmission signal and a reception signal.
  • the filters 162a to 162c pass the frequency band of the transmission signal and remove other frequency components.
  • the dielectric composite filters 161a to 161c and 162a to 162c can be used as the filters 161a to 161c and 162a to 162c.
  • the filters 161a to 161c connected to the patch antenna 112 may be arranged on the back surface of the substrate on which the patch antenna 112 is formed. Thereby, the antenna device 111 including the patch antenna 112 with the filters 161a to 161c is configured.
  • the filters 161a to 161c and 162a to 162c achieve a small insertion loss while suppressing spurious, so that a Massive MIMO system having excellent high-frequency characteristics can be realized. Is possible.
  • the present invention is not limited to individual embodiments. Unless it deviates from the gist of the present invention, the embodiment in which various modifications conceived by those skilled in the art have been made in the present embodiment, and forms constructed by combining components in different embodiments are also applicable to one or more of the present invention. It may be included within the scope of the embodiments.
  • the present invention can be widely used in communication devices such as millimeter wave mobile communication systems and massive MIMO systems as dielectric composite filters with low insertion loss while suppressing spurious.
  • Dielectric Composite Filter 8 High Frequency Module 10, 11 Waveguide Filter 12-16, 12a-14a, 16a, 31 Dielectric Resonator 18, 19 Input / Output Unit 21-23 Transmission Line Filter 40-42 Dielectric Block 40a, 40b, 40c, 41a, 41b, 42a Groove 50-52 Conductive coating 51a, 51b, 52a, 52b Coupling window 53, 54 Wiring conductor 56 Main conductor 57-59 Open stub 80 Substrate 81 Conductive foil 82 Connection electrode 83, 84 Coplanar lines 110, 110A to 110C High-frequency front end circuit 111 Antenna device 112 Patch antenna 150 Antenna element 161, 161a to 161c, 162, 162a to 162c, 163 Filter 164 Duplexer 1 0,170a ⁇ 170c, 172 switching circuit 171 circulator 173 isolators 181,181a ⁇ 181c power amplifier circuit 182,182a ⁇ 182c low-noise amplifier circuit

Abstract

A dielectric composite filter (1) is provided with: a waveguide filter (10) which is formed by coupling a plurality of dielectric resonators (12-15), and in which an input/output part (18) for converting a signal propagation mode is provided at least in the dielectric resonator (12) at one end; and a transmission line filter (21) which comprises a dielectric block coupled to the dielectric resonator (12), and a wiring conductor (53) formed on the surface of the dielectric block and extending from the input/output part (18). As an example, the transmission line filter (21) may be a low-pass filter, and the wiring conductor (53) may have at least two portions with different widths, each width being a size in a direction orthogonal to the signal propagation direction of the wiring conductor (53).

Description

誘電体複合フィルタ、高周波モジュール、高周波フロントエンド回路、通信装置、及びＭａｓｓｉｖｅ　ＭＩＭＯシステムDielectric composite filter, high-frequency module, high-frequency front-end circuit, communication device, and Massive MIMO system
　本発明は誘電体複合フィルタ、高周波モジュール、高周波フロントエンド回路、通信装置装置、及びＭａｓｓｉｖｅ　ＭＩＭＯシステムに関する。 The present invention relates to a dielectric composite filter, a high frequency module, a high frequency front end circuit, a communication device, and a Massive MIMO system.
　従来、複数の誘電体共振器を連結してなる誘電体導波管フィルタがある（例えば、特許文献１）。 Conventionally, there is a dielectric waveguide filter formed by connecting a plurality of dielectric resonators (for example, Patent Document 1).
特開２００２－１３５００３号公報JP 2002-135003 A
　誘電体導波管フィルタでは、一般に、通過帯域端での減衰が極めて急峻な通過特性が得られる反面、ＴＥ１０２、ＴＥ２０１等、複数の高次モードがあるので、通過帯域から離れたスプリアスの抑制が必ずしも十分でないことがある。 In general, a dielectric waveguide filter provides a pass characteristic with extremely steep attenuation at the end of the pass band. However, since there are a plurality of higher order modes such as TE102 and TE201, suppression of spurious away from the passband is possible. It may not always be enough.
　スプリアスは、例えば、別途のフィルタ素子を追加することで容易に抑制できる。しかしながら、誘電体共振器と別途のフィルタ素子とを接続する場合、誘電体共振器と別途のフィルタ素子とを接続する配線である配線導体が空間に露出すると、配線導体からの放射損失により、誘電体導波管フィルタの挿入損失が増大する懸念がある。 Spurious can be easily suppressed, for example, by adding a separate filter element. However, when connecting a dielectric resonator and a separate filter element, if the wiring conductor, which is a wiring connecting the dielectric resonator and the separate filter element, is exposed to the space, the dielectric loss occurs due to radiation loss from the wiring conductor. There is a concern that the insertion loss of the body waveguide filter increases.
　そこで、本発明は、スプリアスを抑制しながら挿入損失が小さい誘電体複合フィルタ、及び、当該誘電体複合フィルタを用いた高周波モジュール、高周波フロントエンド回路、通信装置、及びＭａｓｓｉｖｅ　ＭＩＭＯシステムを提供する。 Therefore, the present invention provides a dielectric composite filter with low insertion loss while suppressing spurious, a high-frequency module, a high-frequency front-end circuit, a communication device, and a Massive MIMO system using the dielectric composite filter.
　上記目的を達成するために、本発明の一態様に係る誘電体複合フィルタは、複数の誘電体共振器を連結してなり、少なくとも一方端の誘電体共振器に、信号の伝搬モードを変換する入出力部が設けられている導波管フィルタと、前記一方端の誘電体共振器に連結された誘電体ブロックと、前記誘電体ブロックの表面に形成され、かつ、前記入出力部から延びる配線導体と、を有する伝送線路フィルタと、を備える。 In order to achieve the above object, a dielectric composite filter according to one aspect of the present invention is formed by connecting a plurality of dielectric resonators, and converts a signal propagation mode into at least one dielectric resonator. A waveguide filter provided with an input / output unit, a dielectric block connected to the dielectric resonator at one end, and a wiring formed on the surface of the dielectric block and extending from the input / output unit A transmission line filter having a conductor.
　この構成によれば、導波管フィルタの周波数特性を、伝送線路フィルタで補うことができる。伝送線路フィルタは、導波管フィルタの入出力部がある一方端の誘電体共振器に連結して設けられ、誘電体ブロックの表面に形成された配線導体で入出力部と接続される。そのため、例えば、別体に設けた伝送線路フィルタと導波管フィルタとを配線で接続する場合と比べて、配線導体を大幅に短くでき、配線導体からの放射損失は小さく抑えられる。その結果、周波数特性に優れかつ挿入損失が小さい誘電体複合フィルタが得られる。 According to this configuration, the frequency characteristic of the waveguide filter can be supplemented by the transmission line filter. The transmission line filter is connected to a dielectric resonator at one end where an input / output unit of the waveguide filter is provided, and is connected to the input / output unit by a wiring conductor formed on the surface of the dielectric block. Therefore, for example, compared to a case where a transmission line filter and a waveguide filter provided separately are connected by wiring, the wiring conductor can be significantly shortened, and radiation loss from the wiring conductor can be kept small. As a result, a dielectric composite filter having excellent frequency characteristics and low insertion loss can be obtained.
　また、前記伝送線路フィルタはローパスフィルタであってもよい。また、前記配線導体は、前記配線導体における信号の伝搬方向に直交する方向の寸法である幅が異なる部分を少なくとも２以上有していてもよい。 The transmission line filter may be a low pass filter. The wiring conductor may have at least two or more portions having different widths that are dimensions in a direction orthogonal to the signal propagation direction in the wiring conductor.
　この構成によれば、導波管フィルタによるスプリアスの抑制不足を、ローパスフィルタである伝送線路フィルタで補うことができる。 According to this configuration, the insufficient suppression of spurious due to the waveguide filter can be compensated by the transmission line filter which is a low-pass filter.
　また、前記伝送線路フィルタはバンドエリミネーションフィルタ又はノッチフィルタであってもよい。また、前記配線導体は、信号の伝搬方向に設けられた主導体と、当該主導体から分岐する複数のオープンスタブとを有していてもよい。 The transmission line filter may be a band elimination filter or a notch filter. The wiring conductor may include a main conductor provided in a signal propagation direction and a plurality of open stubs branched from the main conductor.
　この構成によれば、導波管フィルタによるスプリアスの抑制不足を、バンドエリミネーションフィルタ又はノッチフィルタである伝送線路フィルタで補うことができる。 According to this configuration, insufficient suppression of spurious due to the waveguide filter can be compensated for by a transmission line filter that is a band elimination filter or a notch filter.
　また、前記複数のオープンスタブは、前記主導体の一方側へ延びる第１のオープンスタブと、前記主導体の他方側へ延びる第２のオープンスタブとを含んでもよい。 Further, the plurality of open stubs may include a first open stub extending to one side of the main conductor and a second open stub extending to the other side of the main conductor.
　この構成によれば、第１のオープンスタブと第２のオープンスタブとの結合が弱まるので、スプリアスをより大幅に抑制することができる。 According to this configuration, since the coupling between the first open stub and the second open stub is weakened, spurious can be more significantly suppressed.
　また、前記伝送線路フィルタの表面のうち前記配線導体が形成されている面の反対面に、導体膜が形成されていてもよい。 Further, a conductor film may be formed on the surface of the transmission line filter opposite to the surface on which the wiring conductor is formed.
　この構成によれば、伝送線路フィルタの配線導体が導体膜でシールドされるので、配線導体からの放射損失はさらに小さく抑えられる。その結果、誘電体複合フィルタの挿入損失がさらに低減する。 According to this configuration, since the wiring conductor of the transmission line filter is shielded by the conductor film, the radiation loss from the wiring conductor can be further reduced. As a result, the insertion loss of the dielectric composite filter is further reduced.
　また、前記導波管フィルタの表面に導体膜が形成されており、前記伝送線路フィルタの前記反対面に形成されている導体膜は、前記導波管フィルタの表面に形成されている導体膜であってもよい。 Further, a conductor film is formed on the surface of the waveguide filter, and the conductor film formed on the opposite surface of the transmission line filter is a conductor film formed on the surface of the waveguide filter. There may be.
　この構成によれば、導波管フィルタと伝送線路フィルタとに同じ導体膜を用いるので、誘電体複合フィルタの製造を簡素化できる。 According to this configuration, since the same conductor film is used for the waveguide filter and the transmission line filter, the production of the dielectric composite filter can be simplified.
　また、前記配線導体と前記入出力部とは、前記誘電体複合フィルタの同一面に形成されていてもよい。 Further, the wiring conductor and the input / output unit may be formed on the same surface of the dielectric composite filter.
　この構成によれば、誘電体複合フィルタは、配線導体と入出力部とが形成された面を実装面とする表面実装が可能となるので、誘電体複合フィルタの構造が簡素になり、小型化が可能になる。 According to this configuration, the dielectric composite filter can be surface-mounted with the surface on which the wiring conductor and the input / output section are formed as the mounting surface, so the structure of the dielectric composite filter is simplified and the size is reduced. Is possible.
　また、前記入出力部が、前記一方端の誘電体共振器の角部に設けられていてもよい。 Further, the input / output unit may be provided at a corner of the dielectric resonator at the one end.
　この構成によれば、配線導体からの放射損失はさらに小さく抑えられ、誘電体複合フィルタの挿入損失がさらに低減する。 According to this configuration, the radiation loss from the wiring conductor is further suppressed, and the insertion loss of the dielectric composite filter is further reduced.
　また、前記誘電体複合フィルタは、前記導波管フィルタの他方端の誘電体共振器に連結された誘電体共振器を、さらに備えてもよい。 The dielectric composite filter may further include a dielectric resonator connected to a dielectric resonator at the other end of the waveguide filter.
　また、前記伝送線路フィルタは、ローパスフィルタであり、前記他方端の誘電体共振器に連結された誘電体共振器は、バンドエリミネーションフィルタであってもよい。 The transmission line filter may be a low pass filter, and the dielectric resonator connected to the dielectric resonator at the other end may be a band elimination filter.
　この構成によれば、他方端の誘電体共振器に連結された誘電体共振器がバンドエリミネーションフィルタとして機能することにより、誘電体複合フィルタの通過帯域端においてさらに急峻な減衰を得ることができる。 According to this configuration, the dielectric resonator connected to the dielectric resonator at the other end functions as a band elimination filter, so that a steeper attenuation can be obtained at the passband end of the dielectric composite filter. .
　本発明の一態様に係る高周波モジュールは、前述の誘電体複合フィルタと、前記誘電体複合フィルタの配線導体と同一形状の接続電極が形成された基板と、を備え、前記誘電体複合フィルタの前記配線導体と前記基板の前記接続電極とが結合されてなる。 A high-frequency module according to an aspect of the present invention includes the above-described dielectric composite filter, and a substrate on which a connection electrode having the same shape as a wiring conductor of the dielectric composite filter is formed. The wiring conductor and the connection electrode of the substrate are combined.
　この構成によれば、前述の誘電体複合フィルタによる優れた周波数特性と小さい挿入損失とを持つ高周波モジュールが得られる。 According to this configuration, a high-frequency module having excellent frequency characteristics and small insertion loss due to the above-described dielectric composite filter can be obtained.
　本発明の一態様に係る高周波フロントエンド回路は、アンテナ素子に接続された、前述の誘電体複合フィルタと、前記アンテナ素子へ送信する高周波送信信号を増幅する送信増幅回路と、前記アンテナ素子で受信した高周波受信信号を増幅する受信増幅回路と、前記送信増幅回路及び前記受信増幅回路と、前記誘電体複合フィルタとの接続を切り替えるスイッチ回路と、を備える。 A high-frequency front-end circuit according to an aspect of the present invention includes the above-described dielectric composite filter connected to an antenna element, a transmission amplifier circuit that amplifies a high-frequency transmission signal to be transmitted to the antenna element, and reception by the antenna element. A reception amplifier circuit that amplifies the received high-frequency received signal, a transmission amplifier circuit, the reception amplifier circuit, and a switch circuit that switches connection between the dielectric composite filter.
　本発明の一態様に係る高周波フロントエンド回路は、ＲＦ信号処理回路から出力される高周波送信信号を増幅する送信増幅回路と、高周波受信信号を増幅して前記ＲＦ信号処理回路へ出力する受信増幅回路と、前記ＲＦ信号処理回路と前記送信増幅回路との間、又は、前記ＲＦ信号処理回路と前記受信増幅回路との間に配置された、前述の誘電体複合フィルタと、を備える。 A high-frequency front-end circuit according to an aspect of the present invention includes a transmission amplifier circuit that amplifies a high-frequency transmission signal output from an RF signal processing circuit, and a reception amplifier circuit that amplifies a high-frequency reception signal and outputs the amplified signal to the RF signal processing circuit And the above-mentioned dielectric composite filter disposed between the RF signal processing circuit and the transmission amplifier circuit or between the RF signal processing circuit and the reception amplifier circuit.
　これらの構成によれば、前述の誘電体複合フィルタによる優れた周波数特性と小さい挿入損失とを利用した高周波フロントエンド回路が得られる。 According to these configurations, it is possible to obtain a high-frequency front-end circuit using the excellent frequency characteristics and small insertion loss due to the above-described dielectric composite filter.
　本発明の一態様に係る通信装置は、アンテナ素子に接続され、前記アンテナ素子で送信及び受信される高周波信号を増幅する、前述の高周波フロントエンド回路と、前記高周波フロントエンド回路に接続され、前記高周波信号とベースバンド信号との間の周波数変換を含む信号処理を行うＲＦ信号処理回路と、前記ＲＦ信号処理回路に接続され、前記ベースバンド信号を信号処理するベースバンド信号処理回路と、を備える。 A communication apparatus according to an aspect of the present invention is connected to an antenna element, and amplifies a high-frequency signal transmitted and received by the antenna element. The communication apparatus is connected to the high-frequency front-end circuit and the high-frequency front-end circuit. An RF signal processing circuit that performs signal processing including frequency conversion between a high-frequency signal and a baseband signal, and a baseband signal processing circuit that is connected to the RF signal processing circuit and performs signal processing on the baseband signal. .
　この構成によれば、前述の高周波フロントエンド回路が備える誘電体複合フィルタによる優れた周波数特性と小さい挿入損失とを利用した通信装置が得られる。 According to this configuration, it is possible to obtain a communication device using the excellent frequency characteristics and the small insertion loss by the dielectric composite filter provided in the above-described high frequency front end circuit.
　本発明の一態様に係るＭａｓｓｉｖｅ　ＭＩＭＯシステムは、行列状に配列された複数のパッチアンテナを含むアンテナと、パッチアンテナごとに前述の誘電体複合フィルタと、を備える。 A Massive MIMO system according to an aspect of the present invention includes an antenna including a plurality of patch antennas arranged in a matrix and the above-described dielectric composite filter for each patch antenna.
　この構成によれば、前述の誘電体複合フィルタによる優れた周波数特性と小さい挿入損失とを利用したＭａｓｓｉｖｅ　ＭＩＭＯシステムが得られる。 According to this configuration, it is possible to obtain a Massive MIMO system using the excellent frequency characteristics and small insertion loss due to the above-described dielectric composite filter.
　本発明に係る誘電体複合フィルタによれば、スプリアスを抑制しながら挿入損失が小さい誘電体複合フィルタ、及び、当該誘電体複合フィルタを用いた高周波フロントエンド回路、通信装置、及びＭａｓｓｉｖｅ　ＭＩＭＯシステムが得られる。 According to the dielectric composite filter of the present invention, a dielectric composite filter with low insertion loss while suppressing spurious, and a high-frequency front-end circuit, a communication device, and a Massive MIMO system using the dielectric composite filter are obtained. It is done.
図１は、実施の形態１に係る誘電体複合フィルタの構造を示す斜視図である。1 is a perspective view showing a structure of a dielectric composite filter according to Embodiment 1. FIG. 図２は、実施の形態１に係る誘電体複合フィルタが実装される基板の平面図である。FIG. 2 is a plan view of a substrate on which the dielectric composite filter according to Embodiment 1 is mounted. 図３は、実施の形態１に係る誘電体複合フィルタの特性を示すグラフである。FIG. 3 is a graph showing the characteristics of the dielectric composite filter according to the first embodiment. 図４は、実施の形態２に係る誘電体複合フィルタの構造を示す斜視図である。FIG. 4 is a perspective view showing the structure of the dielectric composite filter according to the second embodiment. 図５は、実施の形態２に係る誘電体複合フィルタの特性を示すグラフである。FIG. 5 is a graph showing the characteristics of the dielectric composite filter according to the second embodiment. 図６は、実施の形態２の比較例に係る誘電体複合フィルタの構造を示す斜視図である。FIG. 6 is a perspective view showing a structure of a dielectric composite filter according to a comparative example of the second embodiment. 図７は、実施の形態２の比較例に係る伝送線路フィルタの特性を示すグラフである。FIG. 7 is a graph showing characteristics of the transmission line filter according to the comparative example of the second embodiment. 図８は、実施の形態３に係る誘電体複合フィルタの構造を示す斜視図である。FIG. 8 is a perspective view showing the structure of the dielectric composite filter according to the third embodiment. 図９は、実施の形態３に係る他の誘電体複合フィルタの構造を示す斜視図である。FIG. 9 is a perspective view showing the structure of another dielectric composite filter according to the third embodiment. 図１０は、実施の形態４に係る誘電体複合フィルタの構造を示す分解斜視図である。FIG. 10 is an exploded perspective view showing the structure of the dielectric composite filter according to the fourth embodiment. 図１１は、実施の形態４に係る誘電体複合フィルタの構造を示す斜視図である。FIG. 11 is a perspective view showing the structure of the dielectric composite filter according to the fourth embodiment. 図１２は、実施の形態５に係る他の誘電体複合フィルタの構造を示す分解斜視図である。FIG. 12 is an exploded perspective view showing the structure of another dielectric composite filter according to the fifth embodiment. 図１３Ａは、実施の形態６に係る高周波フロントエンド回路および通信装置を示す回路図である。FIG. 13A is a circuit diagram showing a high-frequency front-end circuit and a communication device according to Embodiment 6. 図１３Ｂは、実施の形態６の変形例１に係る高周波フロントエンド回路示す回路図である。FIG. 13B is a circuit diagram showing a high-frequency front-end circuit according to Modification 1 of Embodiment 6. 図１３Ｃは、実施の形態６の変形例２に係る高周波フロントエンド回路示す回路図である。FIG. 13C is a circuit diagram showing a high-frequency front-end circuit according to Modification 2 of Embodiment 6. 図１４Ａは、実施の形態７に係るＭａｓｓｉｖｅ　ＭＩＭＯシステムを示す回路図である。FIG. 14A is a circuit diagram showing a Massive MIMO system according to Embodiment 7. 図１４Ｂは、実施の形態７に係るＭａｓｓｉｖｅ　ＭＩＭＯシステムのアンテナ装置の平面図である。FIG. 14B is a plan view of the antenna device of the Massive MIMO system according to Embodiment 7.
　以下、本発明の実施の形態について、図面を用いて詳細に説明する。なお、以下で説明する実施の形態は、いずれも包括的又は具体的な例を示すものである。以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置および接続形態などは、一例であり、本発明を限定する主旨ではない。以下の実施の形態における構成要素のうち、独立請求項に記載されていない構成要素については、任意の構成要素として説明される。また、図面に示される構成要素の大きさ又は大きさの比は、必ずしも厳密ではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. Numerical values, shapes, materials, constituent elements, arrangement of constituent elements, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as optional constituent elements. In addition, the size or ratio of components shown in the drawings is not necessarily strict.
　（実施の形態１）
　図１は、実施の形態１に係る誘電体複合フィルタの構造の一例を示す斜視図である。図１に示されるように、誘電体複合フィルタ１は、導波管フィルタ１０と、伝送線路フィルタ２１とを備える。 (Embodiment 1)
FIG. 1 is a perspective view showing an example of the structure of the dielectric composite filter according to the first embodiment. As shown in FIG. 1, the dielectric composite filter 1 includes a waveguide filter 10 and a transmission line filter 21.
　導波管フィルタ１０は、複数の誘電体共振器１２～１５を連結してなる。導波管フィルタ１０は、複数の溝４０ａ、４０ｂを設けた略直方体の誘電体ブロック４０を導電性被膜５０で被覆してなり、溝４０ａ、４０ｂで区分された領域が、誘電体共振器１２～１５として機能する。 The waveguide filter 10 is formed by connecting a plurality of dielectric resonators 12 to 15. The waveguide filter 10 is formed by covering a substantially rectangular parallelepiped dielectric block 40 provided with a plurality of grooves 40a and 40b with a conductive film 50, and a region divided by the grooves 40a and 40b is a dielectric resonator 12. Functions as ~ 15.
　誘電体ブロック４０は、例えば、水晶又はセラミックなどの誘電体材料で構成され、溝４０ａ、４０ｂは、例えば、ワイヤソーなどによる機械加工により設けられる。導電性被膜５０は、例えば、銀を含有する導電性ペーストの塗布、焼成により形成される。図１において、誘電体ブロック４０の表面の斜線で示した領域に導電性被膜５０が形成され、白抜きの領域は誘電体ブロック４０が露出している。また、図１では示されていないが、導電性被膜５０は、誘電体ブロック４０の奥側及び左側方の面にも形成されている。 The dielectric block 40 is made of, for example, a dielectric material such as crystal or ceramic, and the grooves 40a and 40b are provided by machining using, for example, a wire saw. The conductive film 50 is formed, for example, by applying and baking a conductive paste containing silver. In FIG. 1, a conductive film 50 is formed in a hatched area on the surface of the dielectric block 40, and the dielectric block 40 is exposed in a white area. Although not shown in FIG. 1, the conductive coating 50 is also formed on the back side and left side surfaces of the dielectric block 40.
　両端の誘電体共振器１２、１５には、信号の伝搬モードをＴＥ（Ｔｒａｎｓｖｅｒｓｅ　Ｅｌｅｃｔｒｉｃ）モードとＴＥＭ（Ｔｒａｎｓｖｅｒｓｅ　ＥｌｅｃｔｒｏＭａｇｎｅｔｉｃ）モードとの間で変換する入出力部１８、１９が、それぞれ設けられている。ここで、ＴＥモード及びＴＥＭモードは、それぞれ、導波管フィルタ１０の内部及び外部での信号の伝搬モードである。 The dielectric resonators 12 and 15 at both ends are provided with input / output units 18 and 19 for converting a signal propagation mode between a TE (Transverse Electric) mode and a TEM (Transverse ElectroMagnetic) mode, respectively. Here, the TE mode and the TEM mode are signal propagation modes inside and outside the waveguide filter 10, respectively.
　伝送線路フィルタ２１は、誘電体共振器１２に連結された誘電体ブロックと、当該誘電体ブロックの表面に形成され、かつ、入出力部１８から延びる配線導体５３と、を有する。伝送線路フィルタ２１を構成する誘電体ブロックは、誘電体ブロック４０の溝４０ｂで区分された一端部分である。つまり、伝送線路フィルタ２１と導波管フィルタ１０とは、単一の誘電体ブロック４０を用いて一体に形成されている。ここで、入出力部１８から延びる配線導体５３という文言は、配線導体５３が、導電性被膜５０の一部であって、導電性被膜５０の入出力部１８を構成する部分と接続されていることを意味してもよい。 The transmission line filter 21 includes a dielectric block connected to the dielectric resonator 12 and a wiring conductor 53 formed on the surface of the dielectric block and extending from the input / output unit 18. The dielectric block constituting the transmission line filter 21 is one end portion divided by the groove 40 b of the dielectric block 40. That is, the transmission line filter 21 and the waveguide filter 10 are integrally formed using a single dielectric block 40. Here, the term “wiring conductor 53” extending from the input / output unit 18 means that the wiring conductor 53 is a part of the conductive coating 50 and is connected to a portion of the conductive coating 50 that constitutes the input / output unit 18. It may mean that.
　配線導体５３は、幅が異なる複数の部分を有し、配線導体５３の周囲には、導電性被膜５０が配置されていない領域が設けられている。配線導体５３の幅とは、配線導体５３における信号の伝搬方向に直交する方向の寸法を言う。これにより、伝送線路フィルタ２１は、ローパスフィルタとして機能する。配線導体５３は、導電性被膜５０と同様、銀を含有する導電性ペーストの塗布、焼成により形成されてもよい。 The wiring conductor 53 has a plurality of portions having different widths, and a region where the conductive coating 50 is not disposed is provided around the wiring conductor 53. The width of the wiring conductor 53 refers to a dimension in a direction orthogonal to the signal propagation direction in the wiring conductor 53. Thereby, the transmission line filter 21 functions as a low-pass filter. Similar to the conductive coating 50, the wiring conductor 53 may be formed by applying and baking a conductive paste containing silver.
　配線導体５３と入出力部１８とは、誘電体複合フィルタ１を構成する誘電体ブロック４０の同じ面（図１において手前に表されている面）に形成されている。誘電体複合フィルタ１は、当該面で基板に実装される。以下、当該面を実装面と言う。 The wiring conductor 53 and the input / output unit 18 are formed on the same surface of the dielectric block 40 constituting the dielectric composite filter 1 (the surface shown on the front side in FIG. 1). The dielectric composite filter 1 is mounted on the substrate on the surface. Hereinafter, this surface is referred to as a mounting surface.
　伝送線路フィルタ２１の表面のうち配線導体５３が形成されている面の反対面（図１における奥側面）に、導電性被膜５１が形成されている。伝送線路フィルタ２１の表面に形成されている導電性被膜５１（配線導体５３を含む）は、導波管フィルタ１０の表面に形成されている導電性被膜５１と同じ導体膜であってもよい。 A conductive coating 51 is formed on the surface of the transmission line filter 21 opposite to the surface on which the wiring conductor 53 is formed (the back side surface in FIG. 1). The conductive film 51 (including the wiring conductor 53) formed on the surface of the transmission line filter 21 may be the same conductor film as the conductive film 51 formed on the surface of the waveguide filter 10.
　図２は、誘電体複合フィルタ１が実装される基板８０の一例を示す平面図である。破線は、誘電体複合フィルタ１の実装位置を表している。 FIG. 2 is a plan view showing an example of a substrate 80 on which the dielectric composite filter 1 is mounted. The broken line represents the mounting position of the dielectric composite filter 1.
　基板８０には、導体箔８１が敷設される。基板８０は、例えば、エポキシ、フェノールなどの樹脂で構成され、導体箔８１は、例えば、銅箔などで構成される。導体箔８１は、図２において、基板８０の表面の斜線で示した領域に配置され、白抜きの領域には配置されていない。 A conductive foil 81 is laid on the substrate 80. The substrate 80 is made of, for example, a resin such as epoxy or phenol, and the conductor foil 81 is made of, for example, a copper foil. In FIG. 2, the conductor foil 81 is disposed in a region indicated by oblique lines on the surface of the substrate 80 and is not disposed in a white region.
　導体箔８１は、誘電体複合フィルタ１の入出力部１８の対応位置から延び、配線導体５３と同一形状の接続電極８２を構成している。また、接続電極８２に接続するコプレーナライン８３、及び誘電体複合フィルタ１の入出力部１９の対応位置から延びるコプレーナライン８４を構成している。導体箔８１のその他の部分は、グランドプレーンを構成している。 The conductor foil 81 extends from a corresponding position of the input / output unit 18 of the dielectric composite filter 1 and constitutes a connection electrode 82 having the same shape as the wiring conductor 53. Further, a coplanar line 83 connected to the connection electrode 82 and a coplanar line 84 extending from a corresponding position of the input / output unit 19 of the dielectric composite filter 1 are configured. Other portions of the conductor foil 81 constitute a ground plane.
　基板８０の接続電極８２と誘電体複合フィルタ１の配線導体５３とは、はんだなどの導電性接合材で接合されて、高周波モジュール８を構成する。高周波モジュール８を利用する応用回路は、基板８０のコプレーナライン８３、８４を介して、誘電体複合フィルタ１に信号を入出力する。 The connection electrode 82 of the substrate 80 and the wiring conductor 53 of the dielectric composite filter 1 are joined by a conductive joining material such as solder to constitute the high frequency module 8. An application circuit using the high-frequency module 8 inputs and outputs signals to the dielectric composite filter 1 via the coplanar lines 83 and 84 of the substrate 80.
　なお、配線導体５３と接続電極８２とが同一形状であるとは、配線導体５３の形状と接続電極８２の形状とが厳密に同一であることには限定されない。例えば、設計上の同一形状であって製造上の誤差を含む形状を同一形状に含めてもよい。また、例えば、はんだなどの導電性接合材を介在して互いに接合できる程度の重複領域を有する形状を、同一形状に含めてもよい。 Note that the fact that the wiring conductor 53 and the connection electrode 82 have the same shape is not limited to the fact that the shape of the wiring conductor 53 and the shape of the connection electrode 82 are exactly the same. For example, a shape having the same design and including a manufacturing error may be included in the same shape. In addition, for example, shapes having overlapping regions that can be joined to each other through a conductive bonding material such as solder may be included in the same shape.
　図３は、誘電体複合フィルタ１の通過特性（挿入損失の周波数依存性）の一例を示すグラフである。図３には、誘電体複合フィルタ１から分離した導波管フィルタ１０及び伝送線路フィルタ２１のそれぞれの通過特性、及び誘電体複合フィルタ１全体での通過特性のシミュレーション結果が、表示範囲内の最小損失を０ｄＢに正規化して示されている。 FIG. 3 is a graph showing an example of pass characteristics (frequency dependence of insertion loss) of the dielectric composite filter 1. FIG. 3 shows the simulation results of the pass characteristics of the waveguide filter 10 and the transmission line filter 21 separated from the dielectric composite filter 1 and the pass characteristics of the dielectric composite filter 1 as a whole. The loss is shown normalized to 0 dB.
　図３に見られるように、誘電体複合フィルタ１全体の通過特性において、２８ＧＨｚ近傍に設けられる通過帯域の両端では、導波管フィルタ１０による急峻な減衰が得られ、かつ、通過帯域から離れた３８ＧＨｚ以上のスプリアスは、伝送線路フィルタ２１によって抑制される。 As can be seen from FIG. 3, in the pass characteristic of the entire dielectric composite filter 1, sharp attenuation by the waveguide filter 10 is obtained at both ends of the pass band provided in the vicinity of 28 GHz, and it is separated from the pass band. Spurious at 38 GHz or higher is suppressed by the transmission line filter 21.
　以上のように構成された誘電体複合フィルタ１によれば、次の効果が得られる。 According to the dielectric composite filter 1 configured as described above, the following effects can be obtained.
　導波管フィルタ１０の周波数特性を、伝送線路フィルタ２１で補うことができる。具体的に、導波管フィルタ１０によるスプリアスの抑制不足を、ローパスフィルタである伝送線路フィルタ２１で補っている。 The transmission line filter 21 can supplement the frequency characteristics of the waveguide filter 10. Specifically, insufficient transmission of spurious due to the waveguide filter 10 is compensated by the transmission line filter 21 that is a low-pass filter.
　伝送線路フィルタ２１は、導波管フィルタ１０の入出力部１８がある誘電体共振器１２に連結して設けられ、誘電体ブロックの表面に形成された配線導体５３で入出力部１８と接続される。そのため、例えば、別体に設けた伝送線路フィルタと導波管フィルタとを配線で接続する場合と比べて、配線導体５３を大幅に短くでき、配線導体５３からの放射損失は小さく抑えられる。また、配線導体５３が導電性被膜５０でシールドされることによっても、配線導体５３からの放射損失は小さく抑えられる。その結果、周波数特性に優れかつ挿入損失が小さい誘電体複合フィルタ１が得られる。 The transmission line filter 21 is connected to the dielectric resonator 12 having the input / output unit 18 of the waveguide filter 10 and is connected to the input / output unit 18 by a wiring conductor 53 formed on the surface of the dielectric block. The Therefore, for example, compared to a case where a transmission line filter and a waveguide filter provided separately are connected by wiring, the wiring conductor 53 can be significantly shortened, and radiation loss from the wiring conductor 53 can be kept small. In addition, the radiation loss from the wiring conductor 53 can be reduced by shielding the wiring conductor 53 with the conductive coating 50. As a result, the dielectric composite filter 1 having excellent frequency characteristics and low insertion loss can be obtained.
　また、導波管フィルタ１０の誘電体共振器１２と伝送線路フィルタ２１とは連結されていて、単一の誘電体ブロック４０から一体に形成できる。導波管フィルタ１０と伝送線路フィルタ２１とを、単一の誘電体ブロック４０から一体に形成することにより、誘電体複合フィルタ１の製造工程が簡素化され、周波数特性のばらつきも抑制される。 Further, the dielectric resonator 12 of the waveguide filter 10 and the transmission line filter 21 are connected to each other and can be integrally formed from a single dielectric block 40. By integrally forming the waveguide filter 10 and the transmission line filter 21 from a single dielectric block 40, the manufacturing process of the dielectric composite filter 1 is simplified, and variations in frequency characteristics are also suppressed.
　また、配線導体５３と入出力部１８とが、誘電体複合フィルタ１の同一面に形成されることで、誘電体複合フィルタ１は、前記同一面を実装面とする表面実装が可能となる。これにより、誘電体複合フィルタ１の構造が簡素になり、小型化が可能になる。 Further, since the wiring conductor 53 and the input / output unit 18 are formed on the same surface of the dielectric composite filter 1, the dielectric composite filter 1 can be surface-mounted with the same surface as a mounting surface. This simplifies the structure of the dielectric composite filter 1 and enables downsizing.
　また、入出力部１８を誘電体共振器１２の角部に設けることにより、配線導体５３からの放射損失はさらに小さく抑えられ、誘電体複合フィルタ１の挿入損失がさらに低減する。 Also, by providing the input / output unit 18 at the corner of the dielectric resonator 12, the radiation loss from the wiring conductor 53 is further reduced, and the insertion loss of the dielectric composite filter 1 is further reduced.
　（実施の形態２）
　実施の形態１では、ローパスフィルタとして機能する伝送線路フィルタ２１を例示したが、伝送線路フィルタはローパスフィルタには限られない。実施の形態２では、伝送線路フィルタがバンドエリミネーションフィルタ又はノッチフィルタである誘電体複合フィルタについて説明する。 (Embodiment 2)
In Embodiment 1, although the transmission line filter 21 which functions as a low-pass filter was illustrated, a transmission line filter is not restricted to a low-pass filter. In the second embodiment, a dielectric composite filter in which the transmission line filter is a band elimination filter or a notch filter will be described.
　図４は、実施の形態２に係る誘電体複合フィルタの構造の一例を示す斜視図である。図４に示される誘電体複合フィルタ２は、図１の誘電体複合フィルタ１の伝送線路フィルタ２１を伝送線路フィルタ２２に置き換えて構成される。誘電体複合フィルタ２のその他の構成要素は、誘電体複合フィルタ１と同一のため、同一の符号を付して説明を省略する。 FIG. 4 is a perspective view showing an example of the structure of the dielectric composite filter according to the second embodiment. The dielectric composite filter 2 shown in FIG. 4 is configured by replacing the transmission line filter 21 of the dielectric composite filter 1 of FIG. Since the other components of the dielectric composite filter 2 are the same as those of the dielectric composite filter 1, the same reference numerals are given and description thereof is omitted.
　伝送線路フィルタ２２は、誘電体共振器１２に連結された誘電体ブロックと、当該誘電体ブロックの表面に形成され、かつ、入出力部１８から延びる配線導体５４と、を有する。伝送線路フィルタ２２を構成する誘電体ブロックは、誘電体ブロック４０の溝４０ｂで区分された一端部分である。つまり、伝送線路フィルタ２２と導波管フィルタ１０とは、単一の誘電体ブロック４０を用いて一体に形成されている。 The transmission line filter 22 includes a dielectric block connected to the dielectric resonator 12 and a wiring conductor 54 formed on the surface of the dielectric block and extending from the input / output unit 18. The dielectric block constituting the transmission line filter 22 is one end portion divided by the groove 40 b of the dielectric block 40. That is, the transmission line filter 22 and the waveguide filter 10 are integrally formed using a single dielectric block 40.
　配線導体５４は、配線導体５４における信号の伝搬方向に設けられた主導体５６と、主導体５６から分岐する複数のオープンスタブ５７、５８とを有し、配線導体５４の周囲には、導電性被膜５０が配置されていない領域が設けられている。これにより、伝送線路フィルタ２２は、バンドエリミネーションフィルタ又はノッチフィルタとして機能する。 The wiring conductor 54 has a main conductor 56 provided in the signal propagation direction in the wiring conductor 54 and a plurality of open stubs 57 and 58 branched from the main conductor 56. A region where the coating 50 is not disposed is provided. Thereby, the transmission line filter 22 functions as a band elimination filter or a notch filter.
　配線導体５４と入出力部１８とは、誘電体複合フィルタ２の実装面（図４において手前に表されている面）に形成されている。 The wiring conductor 54 and the input / output unit 18 are formed on the mounting surface of the dielectric composite filter 2 (the surface shown on the front side in FIG. 4).
　図５は、誘電体複合フィルタ２の通過特性の一例を示すグラフである。図５には、誘電体複合フィルタ２から分離した導波管フィルタ１０及び伝送線路フィルタ２２のそれぞれの通過特性、及び誘電体複合フィルタ２全体での通過特性のシミュレーション結果が、表示範囲内の最小損失を０ｄＢに正規化して示されている。 FIG. 5 is a graph showing an example of the pass characteristic of the dielectric composite filter 2. FIG. 5 shows the simulation results of the pass characteristics of the waveguide filter 10 and the transmission line filter 22 separated from the dielectric composite filter 2 and the pass characteristics of the dielectric composite filter 2 as a whole. The loss is shown normalized to 0 dB.
　図５に見られるように、誘電体複合フィルタ２全体の通過特性において、２８ＧＨｚ近傍に設けられる通過帯域の両端では、導波管フィルタ１０による急峻な減衰が得られ、かつ、通過帯域から離れた３８ＧＨｚ以上のスプリアスは、伝送線路フィルタ２２によって抑制される。 As can be seen from FIG. 5, in the pass characteristic of the entire dielectric composite filter 2, sharp attenuation by the waveguide filter 10 is obtained at both ends of the pass band provided in the vicinity of 28 GHz, and it is separated from the pass band. Spurious at 38 GHz or higher is suppressed by the transmission line filter 22.
　以上のように構成された誘電体複合フィルタ２によれば、誘電体複合フィルタ１と同様、配線導体５４からの放射損失は小さく抑えられる。その結果、周波数特性に優れかつ挿入損失が小さい誘電体複合フィルタ２が得られる。 According to the dielectric composite filter 2 configured as described above, similarly to the dielectric composite filter 1, the radiation loss from the wiring conductor 54 can be kept small. As a result, the dielectric composite filter 2 having excellent frequency characteristics and low insertion loss can be obtained.
　なお、伝送線路フィルタ２２の例で示されるように、主導体５６の一方側へ延びるオープンスタブ５７と、主導体５６の他方側へ延びるオープンスタブ５８とを設けることで、より優れたスプリアスの抑制が可能になる。このことを、比較例に係る誘電体複合フィルタを参照して説明する。 In addition, as shown in the example of the transmission line filter 22, by providing an open stub 57 extending to one side of the main conductor 56 and an open stub 58 extending to the other side of the main conductor 56, more excellent spurious suppression. Is possible. This will be described with reference to a dielectric composite filter according to a comparative example.
　図６は、実施の形態２の比較例に係る誘電体複合フィルタの構造の一例を示す斜視図である。図６に示される誘電体複合フィルタ３は、図４の誘電体複合フィルタ２の伝送線路フィルタ２２を伝送線路フィルタ２３に置き換えて構成される。誘電体複合フィルタ３のその他の構成要素は、誘電体複合フィルタ２と同一のため、同一の符号を付して説明を省略する。 FIG. 6 is a perspective view showing an example of the structure of the dielectric composite filter according to the comparative example of the second embodiment. The dielectric composite filter 3 shown in FIG. 6 is configured by replacing the transmission line filter 22 of the dielectric composite filter 2 of FIG. Since the other components of the dielectric composite filter 3 are the same as those of the dielectric composite filter 2, the same reference numerals are given and description thereof is omitted.
　伝送線路フィルタ２３は、伝送線路フィルタ２２のオープンスタブ５８を、主導体５６のオープンスタブ５７と同じ側へ延びるオープンスタブ５９に変更して構成される。 The transmission line filter 23 is configured by changing the open stub 58 of the transmission line filter 22 to an open stub 59 extending to the same side as the open stub 57 of the main conductor 56.
　図７は、伝送線路フィルタ２２、２３の通過特性の一例を示すグラフである。図７には、誘電体複合フィルタ２、３からそれぞれ分離した伝送線路フィルタ２２、２３の単体での通過特性のシミュレーション結果が、表示範囲内の最小損失を０ｄＢに正規化して示されている。 FIG. 7 is a graph showing an example of pass characteristics of the transmission line filters 22 and 23. FIG. 7 shows the simulation results of the transmission characteristics of the transmission line filters 22 and 23 separated from the dielectric composite filters 2 and 3, respectively, with the minimum loss within the display range normalized to 0 dB.
　図７に見られるように、スプリアスに対応する３８ＧＨｚ以上の周波数における減衰は、伝送線路フィルタ２３のほうが伝送線路フィルタ２２より小さい。これは、オープンスタブを主導体の同じ側へ出すことによってオープンスタブ間で結合が生じ、減衰量が減少したものと考えられる。 As seen in FIG. 7, the transmission line filter 23 has a smaller attenuation than the transmission line filter 22 at a frequency of 38 GHz or more corresponding to spurious. This is thought to be because the open stubs are connected to the same side of the main conductor and coupling occurs between the open stubs, thereby reducing the attenuation.
　従って、スプリアスを抑制する点で、オープンスタブ５７、５８を主導体５６の両側へ出す伝送線路フィルタ２２のほうが、オープンスタブ５７、５９を主導体５６の一方側のみへ出す伝送線路フィルタ２３よりも優れていると言える。 Therefore, in terms of suppressing spurious, the transmission line filter 22 that opens the open stubs 57 and 58 to both sides of the main conductor 56 is more than the transmission line filter 23 that opens the open stubs 57 and 59 only to one side of the main conductor 56. It can be said that it is excellent.
　（実施の形態３）
　実施の形態１、２では、導波管フィルタの一端に伝送線路フィルタを連結してなる誘電体複合フィルタを例示したが、誘電体複合フィルタはこの例には限られない。実施の形態３では、導波管フィルタの他端にさらに誘電体共振器を連結してなる誘電体複合フィルタについて説明する。 (Embodiment 3)
In the first and second embodiments, the dielectric composite filter formed by connecting the transmission line filter to one end of the waveguide filter is illustrated, but the dielectric composite filter is not limited to this example. In the third embodiment, a dielectric composite filter in which a dielectric resonator is further connected to the other end of the waveguide filter will be described.
　図８は、実施の形態３に係る誘電体複合フィルタの構造の一例を示す斜視図である。図８に示される誘電体複合フィルタ４は、図１の誘電体複合フィルタ１と比べて、導波管フィルタ１１を変更し、導波管フィルタ１１の一端及び他端に伝送線路フィルタ２１及び誘電体共振器３１をそれぞれ連結して構成される。導波管フィルタ１１は、導波管フィルタ１０に誘電体共振器１６を追加して構成される。誘電体複合フィルタ４のその他の構成要素は、誘電体複合フィルタ１と同一のため、同一の符号を付して説明を省略する。 FIG. 8 is a perspective view showing an example of the structure of the dielectric composite filter according to the third embodiment. The dielectric composite filter 4 shown in FIG. 8 is different from the dielectric composite filter 1 of FIG. 1 in that the waveguide filter 11 is changed, and a transmission line filter 21 and a dielectric are formed at one end and the other end of the waveguide filter 11. The body resonators 31 are connected to each other. The waveguide filter 11 is configured by adding a dielectric resonator 16 to the waveguide filter 10. Since the other components of the dielectric composite filter 4 are the same as those of the dielectric composite filter 1, the same reference numerals are given and description thereof is omitted.
　誘電体共振器３１は、誘電体共振器１５に連結されている。誘電体共振器３１は、誘電体ブロック４０の溝４０ｃで区分された一端部分である。つまり、誘電体共振器３１と導波管フィルタ１１とは、単一の誘電体ブロック４０を用いて一体に形成されている。 The dielectric resonator 31 is connected to the dielectric resonator 15. The dielectric resonator 31 is an end portion divided by the groove 40 c of the dielectric block 40. That is, the dielectric resonator 31 and the waveguide filter 11 are integrally formed using a single dielectric block 40.
　誘電体共振器３１は、バンドエリミネーションフィルタとして機能し、通過帯域の近傍の周波数に大きな減衰を与えることで、誘電体複合フィルタ４の周波数特性をさらに向上させる。 The dielectric resonator 31 functions as a band elimination filter and further improves the frequency characteristics of the dielectric composite filter 4 by giving large attenuation to the frequency in the vicinity of the pass band.
　図９は、実施の形態３に係る他の誘電体複合フィルタの構造の一例を示す斜視図である。図９に示される誘電体複合フィルタ５は、図８の誘電体複合フィルタ４の伝送線路フィルタ２１を伝送線路フィルタ２２に置き換えて構成される。誘電体複合フィルタ５のその他の構成要素は、誘電体複合フィルタ４と同一のため、同一の符号を付して説明を省略する。誘電体複合フィルタ５においても、誘電体複合フィルタ４と同様、誘電体共振器３１によって周波数特性が向上する。 FIG. 9 is a perspective view showing an example of the structure of another dielectric composite filter according to the third embodiment. The dielectric composite filter 5 shown in FIG. 9 is configured by replacing the transmission line filter 21 of the dielectric composite filter 4 of FIG. Since the other components of the dielectric composite filter 5 are the same as those of the dielectric composite filter 4, the same reference numerals are given and description thereof is omitted. Also in the dielectric composite filter 5, the frequency characteristics are improved by the dielectric resonator 31 as in the case of the dielectric composite filter 4.
　（実施の形態４）
　実施の形態４に係る誘電体複合フィルタは、別体に設けた誘電体複合フィルタの第１部分と第２部分とを貼り合わせてなる誘電体複合フィルタである。 (Embodiment 4)
The dielectric composite filter according to Embodiment 4 is a dielectric composite filter formed by bonding a first part and a second part of a dielectric composite filter provided separately.
　図１０は、実施の形態４に係る誘電体複合フィルタの構造の一例を示す分解斜視図である。図１０に示されるように、誘電体複合フィルタ６は、第１部分６１と、第２部分６２とからなる。図１０では、便宜上、第１部分６１及び第２部分６２を互いに異なる視点から見て示している。 FIG. 10 is an exploded perspective view showing an example of the structure of the dielectric composite filter according to the fourth embodiment. As shown in FIG. 10, the dielectric composite filter 6 includes a first portion 61 and a second portion 62. In FIG. 10, for convenience, the first portion 61 and the second portion 62 are shown as seen from different viewpoints.
　誘電体複合フィルタ６は、図９の誘電体複合フィルタ５のうち、伝送線路フィルタ２２と導波管フィルタ１１とで構成される部分に対応する。図１０では、誘電体複合フィルタ６の構成要素を、誘電体複合フィルタ５の対応する構成要素と同一の符号で示す。 The dielectric composite filter 6 corresponds to a portion composed of the transmission line filter 22 and the waveguide filter 11 in the dielectric composite filter 5 of FIG. In FIG. 10, the constituent elements of the dielectric composite filter 6 are denoted by the same reference numerals as the corresponding constituent elements of the dielectric composite filter 5.
　第１部分６１は、伝送線路フィルタ２２、誘電体共振器１２、１３ａを連結してなる。第１部分６１は、複数の溝４１ａ、４１ｂを設けた略直方体の誘電体ブロック４１を導電性被膜５１で被覆してなり、溝４１ａ、４１ｂで区分された領域が、伝送線路フィルタ２２、誘電体共振器１２、１３ａとして機能する。伝送線路フィルタ２２には、図９と同様の配線導体５４が設けられる。 The first portion 61 is formed by connecting the transmission line filter 22 and the dielectric resonators 12 and 13a. The first portion 61 is formed by covering a substantially rectangular parallelepiped dielectric block 41 provided with a plurality of grooves 41a and 41b with a conductive film 51, and a region divided by the grooves 41a and 41b is the transmission line filter 22, dielectric It functions as the body resonators 12 and 13a. The transmission line filter 22 is provided with a wiring conductor 54 similar to that shown in FIG.
　第２部分６２は、誘電体共振器１４ａ、１６、１５を連結してなる。第２部分６２は、複数の溝４２ａを設けた略直方体の誘電体ブロック４２を導電性被膜５２で被覆してなり、溝４２ａで区分された領域が、誘電体共振器１４ａ、１６、１５として機能する。 The second portion 62 is formed by connecting the dielectric resonators 14a, 16, and 15. The second portion 62 is formed by covering a substantially rectangular parallelepiped dielectric block 42 provided with a plurality of grooves 42 a with a conductive film 52, and regions divided by the grooves 42 a are used as dielectric resonators 14 a, 16, and 15. Function.
　誘電体共振器１３ａ、１４ａは、誘電体複合フィルタ５の誘電体共振器１３、１４に、電磁波が透過できる結合窓５１ａ、５２ａを設けてなる。結合窓５１ａ、５２ａは、導電性被膜５１、５２を配置しないことで形成される。 The dielectric resonators 13 a and 14 a are provided with coupling windows 51 a and 52 a through which electromagnetic waves can pass through the dielectric resonators 13 and 14 of the dielectric composite filter 5. The coupling windows 51a and 52a are formed by not disposing the conductive films 51 and 52.
　第１部分６１と第２部分６２とを、例えば、接着剤で貼り合わせることにより、誘電体複合フィルタ６は構成される。 The dielectric composite filter 6 is configured by bonding the first portion 61 and the second portion 62 with, for example, an adhesive.
　図１１は、第１部分６１と第２部分６２とを貼り合わせた後の誘電体複合フィルタ６の一例を示す斜視図である。 FIG. 11 is a perspective view showing an example of the dielectric composite filter 6 after the first portion 61 and the second portion 62 are bonded together.
　誘電体共振器１３ａ、１４ａは、結合窓５１ａ、５２ａを介して結合している。誘電体共振器１３ａ、１４ａが結合することにより、誘電体複合フィルタ６は、図９の誘電体複合フィルタ５の伝送線路フィルタ２２と導波管フィルタ１１とで構成される部分と略同等に機能する。 Dielectric resonators 13a and 14a are coupled via coupling windows 51a and 52a. When the dielectric resonators 13a and 14a are coupled, the dielectric composite filter 6 functions substantially the same as the portion constituted by the transmission line filter 22 and the waveguide filter 11 of the dielectric composite filter 5 of FIG. To do.
　なお、誘電体複合フィルタ６における伝送線路フィルタは、伝送線路フィルタ２２には限られず、例えば、図８の伝送線路フィルタ２１を用いてもよい。その場合、誘電体複合フィルタ６は、図８の誘電体複合フィルタ４の伝送線路フィルタ２１と導波管フィルタ１１とで構成される部分と略同等に機能する。 Note that the transmission line filter in the dielectric composite filter 6 is not limited to the transmission line filter 22, and for example, the transmission line filter 21 of FIG. 8 may be used. In that case, the dielectric composite filter 6 functions substantially the same as the portion constituted by the transmission line filter 21 and the waveguide filter 11 of the dielectric composite filter 4 of FIG.
　図１２は、実施の形態４に係る他の誘電体複合フィルタの構造の一例を示す分解斜視図である。図１２に示されるように、第１部分７１、第２部分７２を貼り合わせることにより、誘電体複合フィルタ７は構成される。 FIG. 12 is an exploded perspective view showing an example of the structure of another dielectric composite filter according to the fourth embodiment. As shown in FIG. 12, the dielectric composite filter 7 is configured by bonding the first portion 71 and the second portion 72 together.
　誘電体複合フィルタ７では、誘電体複合フィルタ６と比べて、誘電体共振器１２ａ、１６ａに結合窓５１ｂ、５２ｂを設けることにより、所望の減衰極が追加される。 In the dielectric composite filter 7, compared to the dielectric composite filter 6, a desired attenuation pole is added by providing coupling windows 51 b and 52 b in the dielectric resonators 12 a and 16 a.
　なお、別体に設けた複数の部分を貼り合わせてなる誘電体複合フィルタは、上述の例には限られない。図示はしていないが、例えば、誘電体複合フィルタ６の第１部分６１および第２部分６２の実装面（図１１において手前に表されている面）に背向する反対面（図１１における奥側の不可視面）に、さらに第３部分および第４部分をそれぞれ貼り合わせてもよい。この場合、第１部分６１および第２部分６２が実装面を含む第１階層に位置し、第３部分および第４部分が実装面の上方の第２階層に位置する、２階建て構造の誘電体複合フィルタが構成される。このような誘電体複合フィルタでは、例えば、第１部分６１、第３部分、第４部分、および第２部分６２の順に信号が伝達するように、結合窓の配置が変更および追加される。 Note that the dielectric composite filter formed by bonding a plurality of parts provided separately is not limited to the above example. Although not shown, for example, the opposite surface (the back in FIG. 11) that faces away from the mounting surface (the surface that is shown in the front in FIG. 11) of the first portion 61 and the second portion 62 of the dielectric composite filter 6. The third portion and the fourth portion may be further bonded to the invisible surface on the side. In this case, a dielectric having a two-story structure in which the first portion 61 and the second portion 62 are located in the first layer including the mounting surface, and the third portion and the fourth portion are located in the second layer above the mounting surface. A body composite filter is constructed. In such a dielectric composite filter, for example, the arrangement of the coupling window is changed and added so that a signal is transmitted in the order of the first portion 61, the third portion, the fourth portion, and the second portion 62.
　（実施の形態５）
　本実施の形態では、実施の形態１から４に係る誘電体複合フィルタを備える高周波フロントエンド回路１１０について説明する。 (Embodiment 5)
In the present embodiment, a high frequency front end circuit 110 including the dielectric composite filter according to the first to fourth embodiments will be described.
　図１３Ａは、実施の形態６に係る高周波フロントエンド回路１１０およびその周辺回路を示す回路図である。同図には、高周波フロントエンド回路１１０と、アンテナ素子１５０と、ＲＦ信号処理回路１９１と、ベースバンド信号処理回路１９２とが示されている。 FIG. 13A is a circuit diagram showing the high-frequency front-end circuit 110 and its peripheral circuits according to the sixth embodiment. In the figure, a high-frequency front-end circuit 110, an antenna element 150, an RF signal processing circuit 191 and a baseband signal processing circuit 192 are shown.
　高周波フロントエンド回路１１０は、フィルタ１６１、１６２および１６３と、スイッチ回路１７０と、パワーアンプ回路１８１と、ローノイズアンプ回路１８２とを備える。 The high-frequency front end circuit 110 includes filters 161, 162, and 163, a switch circuit 170, a power amplifier circuit 181, and a low noise amplifier circuit 182.
　パワーアンプ回路１８１は、ＲＦ信号処理回路１９１から出力された高周波送信信号を増幅し、スイッチ回路１７０およびフィルタ１６１を経由してアンテナ素子１５０に出力する送信増幅回路である。 The power amplifier circuit 181 is a transmission amplification circuit that amplifies the high-frequency transmission signal output from the RF signal processing circuit 191 and outputs the amplified signal to the antenna element 150 via the switch circuit 170 and the filter 161.
　ローノイズアンプ回路１８２は、アンテナ素子１５０、フィルタ１６１およびスイッチ回路１７０を経由した高周波信号を増幅し、ＲＦ信号処理回路１９１へ出力する受信増幅回路である。 The low noise amplifier circuit 182 is a reception amplification circuit that amplifies a high-frequency signal that has passed through the antenna element 150, the filter 161, and the switch circuit 170 and outputs the amplified signal to the RF signal processing circuit 191.
　フィルタ１６１は、アンテナ素子１５０に接続され、例えば、送信帯域および受信帯域の高周波信号を選択的に通過させるアンテナフィルタである。フィルタ１６２は、パワーアンプ回路１８１とＲＦ信号処理回路１９１との間に配置され、送信帯域の高周波信号を選択的に通過させる段間フィルタである。フィルタ１６３は、ローノイズアンプ回路１８２とＲＦ信号処理回路１９１との間に配置され、受信帯域の高周波信号を選択的に通過させる段間フィルタである。 The filter 161 is an antenna filter that is connected to the antenna element 150 and selectively allows high-frequency signals in the transmission band and the reception band to pass therethrough, for example. The filter 162 is an interstage filter that is disposed between the power amplifier circuit 181 and the RF signal processing circuit 191 and selectively passes a high-frequency signal in the transmission band. The filter 163 is an interstage filter that is disposed between the low noise amplifier circuit 182 and the RF signal processing circuit 191 and selectively passes a high frequency signal in the reception band.
　スイッチ回路１７０は、アンテナ素子１５０と送信信号経路および受信信号経路との接続を切り替えるスイッチである。 The switch circuit 170 is a switch that switches connection between the antenna element 150 and the transmission signal path and the reception signal path.
　ＲＦ信号処理回路１９１は、アンテナ素子１５０から受信信号経路を介して入力された高周波受信信号を、ダウンコンバートなどにより信号処理し、当該信号処理して生成された受信信号をベースバンド信号処理回路１９２へ出力する。ＲＦ信号処理回路１９１は、例えば、ＲＦＩＣ（Ｒａｄｉｏ　Ｆｒｅｑｕｅｎｃｙ　Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）である。また、ＲＦ信号処理回路１９１は、ベースバンド信号処理回路１９２から入力された送信信号をアップコンバートなどにより信号処理し、当該信号処理して生成された高周波送信信号をパワーアンプ回路１８１へ出力する。 The RF signal processing circuit 191 processes the high-frequency reception signal input from the antenna element 150 via the reception signal path by down-conversion or the like, and the baseband signal processing circuit 192 generates the reception signal generated by the signal processing. Output to. The RF signal processing circuit 191 is, for example, an RFIC (Radio Frequency Integrated Circuit). Further, the RF signal processing circuit 191 performs signal processing on the transmission signal input from the baseband signal processing circuit 192 by up-conversion or the like, and outputs the high-frequency transmission signal generated by the signal processing to the power amplifier circuit 181.
　ベースバンド信号処理回路１９２で処理された信号は、例えば、画像信号として画像表示のために、または、音声信号として通話のために使用される。 The signal processed by the baseband signal processing circuit 192 is used, for example, for displaying an image as an image signal or for calling as an audio signal.
　なお、高周波フロントエンド回路１１０は、フィルタ１６１、１６２および１６３、スイッチ回路１７０、パワーアンプ回路１８１、ならびにローノイズアンプ回路１８２の間に、他の回路素子を備えていてもよい。 The high-frequency front end circuit 110 may include other circuit elements between the filters 161, 162, and 163, the switch circuit 170, the power amplifier circuit 181, and the low noise amplifier circuit 182.
　ここで、本実施の形態に係る高周波フロントエンド回路１１０では、フィルタ１６１、１６２および１６３として、実施の形態１から４に係る誘電体複合フィルタを用いることができる。 Here, in the high-frequency front-end circuit 110 according to the present embodiment, the dielectric composite filters according to the first to fourth embodiments can be used as the filters 161, 162, and 163.
　上記構成によれば、フィルタ１６１、１６２および１６３において、スプリアスを抑制しながら小さい挿入損失を達成するので、高周波特性に優れた高周波フロントエンド回路を実現することが可能となる。 According to the above configuration, the filters 161, 162, and 163 achieve a small insertion loss while suppressing spurious, so that a high-frequency front-end circuit having excellent high-frequency characteristics can be realized.
　図１３Ｂは、実施の形態６の変形例１に係る高周波フロントエンド回路１１０Ｂを示す回路図である。高周波フロントエンド回路１１０Ｂは、フィルタ１６１、１６２および１６３と、パワーアンプ回路１８１と、ローノイズアンプ回路１８２と、サーキュレータ１７１と、スイッチ回路１７２と、を備える。本変形例に係る高周波フロントエンド回路１１０Ｂは、高周波フロントエンド回路１１０と比較して、送信信号経路および受信信号経路を切り替えるための構成が異なる。本変形例に係る高周波フロントエンド回路１１０Ｂについて、高周波フロントエンド回路１１０と同じ構成については説明を省略し、異なる構成を中心に説明する。 FIG. 13B is a circuit diagram showing the high-frequency front end circuit 110B according to the first modification of the sixth embodiment. The high frequency front end circuit 110 </ b> B includes filters 161, 162 and 163, a power amplifier circuit 181, a low noise amplifier circuit 182, a circulator 171, and a switch circuit 172. The high-frequency front end circuit 110B according to this modification is different from the high-frequency front end circuit 110 in the configuration for switching between the transmission signal path and the reception signal path. Regarding the high-frequency front end circuit 110B according to this modification, the description of the same configuration as that of the high-frequency front end circuit 110 will be omitted, and a description will be given focusing on different configurations.
　サーキュレータ１７１は、アンテナ側端子、送信側端子、および受信側端子を有し、受信時には、アンテナ素子１５０から受信信号経路へ受信信号を選択的に伝搬させ、送信時には、送信信号経路からアンテナ素子１５０へ送信信号を選択的に伝搬させる回路素子である。 The circulator 171 has an antenna-side terminal, a transmission-side terminal, and a reception-side terminal. During reception, the circulator 171 selectively propagates a reception signal from the antenna element 150 to the reception signal path, and at the time of transmission, the antenna element 150 is transmitted from the transmission signal path. This is a circuit element that selectively propagates a transmission signal to.
　スイッチ回路１７２は、サーキュレータ１７１と受信信号経路との接続を切り替えるスイッチである。送信時には、サーキュレータ１７１の受信側端子を終端抵抗で（５０Ω）終端させる。受信時には、サーキュレータ１７１の受信側端子をローノイズアンプ回路１８２に接続させる。 The switch circuit 172 is a switch for switching the connection between the circulator 171 and the reception signal path. At the time of transmission, the receiving side terminal of the circulator 171 is terminated with a terminating resistor (50Ω). At the time of reception, the reception side terminal of the circulator 171 is connected to the low noise amplifier circuit 182.
　上記回路構成により、高周波フロントエンド回路１１０Ｂは、時分割複信（Ｔｉｍｅ　Ｄｉｖｉｓｉｏｎ　Ｄｕｐｌｅｘ）方式のフロントエンド回路として適用される。 With the above circuit configuration, the high-frequency front end circuit 110B is applied as a time division duplex front-end circuit.
　ここで、本変形例に係る高周波フロントエンド回路１１０Ｂでは、フィルタ１６１、１６２および１６３として、実施の形態１から４に係る誘電体複合フィルタを用いることができる。 Here, in the high-frequency front-end circuit 110B according to this modification, the dielectric composite filters according to the first to fourth embodiments can be used as the filters 161, 162, and 163.
　図１３Ｃは、実施の形態６の変形例２に係る高周波フロントエンド回路１１０Ｃを示す回路図である。高周波フロントエンド回路１１０Ｃは、デュプレクサ１６４と、フィルタ１６２および１６３と、パワーアンプ回路１８１と、ローノイズアンプ回路１８２と、アイソレータ１７３と、を備える。本変形例に係る高周波フロントエンド回路１１０Ｃは、高周波フロントエンド回路１１０と比較して、送信信号経路および受信信号経路を切り替えるための構成が異なる。本変形例に係る高周波フロントエンド回路１１０Ｃについて、高周波フロントエンド回路１１０と同じ構成については説明を省略し、異なる構成を中心に説明する。 FIG. 13C is a circuit diagram showing a high-frequency front-end circuit 110C according to the second modification of the sixth embodiment. The high frequency front end circuit 110 </ b> C includes a duplexer 164, filters 162 and 163, a power amplifier circuit 181, a low noise amplifier circuit 182, and an isolator 173. The high-frequency front end circuit 110C according to this modification is different from the high-frequency front end circuit 110 in the configuration for switching between the transmission signal path and the reception signal path. Regarding the high-frequency front end circuit 110C according to this modification, the description of the same configuration as that of the high-frequency front end circuit 110 will be omitted, and a description will be given focusing on different configurations.
　デュプレクサ１６４は、アンテナ端子、送信側端子、および受信側端子を有し、アンテナ端子と送信側端子との間に送信用フィルタを有し、アンテナ端子と受信側端子との間に受信用フィルタを有している。 The duplexer 164 has an antenna terminal, a transmission side terminal, and a reception side terminal, has a transmission filter between the antenna terminal and the transmission side terminal, and has a reception filter between the antenna terminal and the reception side terminal. Have.
　アイソレータ１７３は、デュプレクサ１６４の送信側端子とパワーアンプ回路１８１との間に配置され、送信信号をパワーアンプ回路１８１からデュプレクサ１６４への１方向に伝搬させる回路素子である。アイソレータ１７３は、例えば、サーキュレータの３端子のうちの１端子を５０Ω終端することで実現できる。 The isolator 173 is a circuit element that is disposed between the transmission-side terminal of the duplexer 164 and the power amplifier circuit 181 and propagates a transmission signal in one direction from the power amplifier circuit 181 to the duplexer 164. The isolator 173 can be realized, for example, by terminating one terminal among the three terminals of the circulator by 50Ω.
　上記回路構成により、高周波フロントエンド回路１１０Ｃは、周波数分割複信（Ｆｒｅｑｕｅｎｃｙ　Ｄｉｖｉｓｉｏｎ　Ｄｕｐｌｅｘ）方式のフロントエンド回路として適用される。 With the above circuit configuration, the high frequency front end circuit 110C is applied as a front end circuit of a frequency division duplex system.
　ここで、本変形例に係る高周波フロントエンド回路１１０Ｃでは、デュプレクサ１６４の送信側フィルタおよび受信側フィルタならびにフィルタ１６２および１６３として、実施の形態１から４に係る誘電体複合フィルタを用いることができる。 Here, in the high-frequency front-end circuit 110C according to this modification, the dielectric composite filter according to the first to fourth embodiments can be used as the transmission-side filter and the reception-side filter of the duplexer 164 and the filters 162 and 163.
　（実施の形態６）
　本実施の形態では、実施の形態１から４に係る誘電体複合フィルタを備えるＭａｓｓｉｖｅ　ＭＩＭＯシステムを例示する。 (Embodiment 6)
In this embodiment, a Massive MIMO system including the dielectric composite filter according to Embodiments 1 to 4 is illustrated.
　５Ｇ（第５世代移動通信システム）で有望な無線伝送技術の１つは、ファントムセルとＭａｓｓｉｖｅ　ＭＩＭＯシステムとの組み合わせである。ファントムセルは、低い周波数帯のマクロセルと高い周波数帯のスモールセルとの間で通信の安定性を確保するための制御信号と、高速データ通信の対象であるデータ信号とを分離するネットワーク構成である。各ファントムセルにＭａｓｓｉｖｅ　ＭＩＭＯのアンテナ装置が設けられる。Ｍａｓｓｉｖｅ　ＭＩＭＯシステムは、ミリ波帯等において伝送品質を向上させるための技術であり、各アンテナ素子から送信される信号を制御することで、当該アンテナ素子の指向性を制御する。また、Ｍａｓｓｉｖｅ　ＭＩＭＯシステムは、多数のアンテナ素子を用いるため、鋭い指向性のビームを生成することができる。ビームの指向性を高めることで高い周波数帯でも電波をある程度遠くまで飛ばすことができるとともに、セル間の干渉を減らして周波数利用効率を高めることができる。 One of the promising wireless transmission technologies in 5G (5th generation mobile communication system) is a combination of a phantom cell and a Massive MIMO system. The phantom cell is a network configuration that separates a control signal for ensuring communication stability between a macro cell in a low frequency band and a small cell in a high frequency band and a data signal that is a target of high-speed data communication. . Each phantom cell is provided with a Massive MIMO antenna device. The Massive MIMO system is a technique for improving transmission quality in a millimeter wave band or the like, and controls the directivity of the antenna element by controlling a signal transmitted from each antenna element. Further, the Massive MIMO system uses a large number of antenna elements, and therefore can generate a sharp directional beam. By increasing the directivity of the beam, it is possible to fly radio waves to some extent even in a high frequency band, and it is possible to reduce the interference between cells and increase the frequency utilization efficiency.
　図１４Ａは、実施の形態７に係るＭａｓｓｉｖｅ　ＭＩＭＯシステムを示す回路図である。また、図１４Ｂは、実施の形態７に係るＭａｓｓｉｖｅ　ＭＩＭＯシステムのアンテナ装置の平面図である。 FIG. 14A is a circuit diagram showing a Massive MIMO system according to Embodiment 7. FIG. 14B is a plan view of the antenna device of the Massive MIMO system according to Embodiment 7.
　図１４Ｂに示されたアンテナ装置１１１は、図１４Ａに示されたＭａｓｓｉｖｅ　ＭＩＭＯシステムで用いられる。アンテナ装置１１１は、行列状に配列された複数のパッチアンテナ１１２を備える。図１４Ａには、アンテナ装置１１１を含む高周波フロントエンド回路１１０Ａの構成を示す図である。この高周波フロントエンド回路１１０Ａは、本実施の形態に係るＭａｓｓｉｖｅ　ＭＩＭＯシステムである。 The antenna device 111 shown in FIG. 14B is used in the Massive MIMO system shown in FIG. 14A. The antenna device 111 includes a plurality of patch antennas 112 arranged in a matrix. FIG. 14A is a diagram illustrating a configuration of a high-frequency front-end circuit 110A including the antenna device 111. This high-frequency front end circuit 110A is a Massive MIMO system according to the present embodiment.
　パッチアンテナ１１２には、帯域通過型のフィルタ１６１ａ、１６１ｂおよび１６１ｃが接続されている。フィルタ１６１ａとパワーアンプ回路１８１ａおよびローノイズアンプ回路１８２ａとの間には、スイッチ回路１７０ａが接続されている。フィルタ１６１ｂとパワーアンプ回路１８１ｂおよびローノイズアンプ回路１８２ｂとの間には、スイッチ回路１７０ｂが接続されている。フィルタ１６１ｃとパワーアンプ回路１８１ｃおよびローノイズアンプ回路１８２ｃとの間には、スイッチ回路１７０ｃが接続されている。ローノイズアンプ回路１８２ａ、１８２ｂおよび１８２ｃは、ベースバンド信号処理回路１９２に接続されている。ベースバンド信号処理回路１９２とパワーアンプ回路１８１ａとの間には、帯域通過型のフィルタ１６２ａおよびミキサ１９４ａが接続されている。ベースバンド信号処理回路１９２とパワーアンプ回路１８１ｂとの間には、帯域通過型のフィルタ１６２ｂよびミキサ１９４ｂが接続されている。ベースバンド信号処理回路１９２とパワーアンプ回路１８１ｃとの間には、帯域通過型のフィルタ１６２ｃおよびミキサ１９４ｃが接続されている。ミキサ１９４ａ、１９４ｂおよび１９４ｃには、ローカルオシレータ１９３が接続されている。ローカルオシレータ１９３は、ミキサ１９４ａ～１９４ｃにおいて高い周波数へアップコンバート、低い周波数へダウンコンバートするための基準周波数を、ミキサ１９４ａ～１９４ｃへ出力する。 The patch antenna 112 is connected with band- pass filters 161a, 161b and 161c. A switch circuit 170a is connected between the filter 161a, the power amplifier circuit 181a, and the low noise amplifier circuit 182a. A switch circuit 170b is connected between the filter 161b, the power amplifier circuit 181b, and the low noise amplifier circuit 182b. A switch circuit 170c is connected between the filter 161c, the power amplifier circuit 181c, and the low noise amplifier circuit 182c. The low noise amplifier circuits 182a, 182b, and 182c are connected to the baseband signal processing circuit 192. A band pass filter 162a and a mixer 194a are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181a. A band-pass filter 162b and a mixer 194b are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181b. A band-pass filter 162c and a mixer 194c are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181c. A local oscillator 193 is connected to the mixers 194a, 194b and 194c. The local oscillator 193 outputs, to the mixers 194a to 194c, a reference frequency for up-conversion to a high frequency and down-conversion to a low frequency in the mixers 194a to 194c.
　フィルタ１６１ａ～１６１ｃは、送受信周波数帯域を通過させ、その他の周波数成分を除去する。スイッチ回路１７０ａ～１７０ｃは、送信信号と受信信号とを切り替える。フィルタ１６２ａ～１６２ｃは、送信信号の周波数帯域を通過させ、その他の周波数成分を除去する。 Filters 161a to 161c pass the transmission / reception frequency band and remove other frequency components. The switch circuits 170a to 170c switch between a transmission signal and a reception signal. The filters 162a to 162c pass the frequency band of the transmission signal and remove other frequency components.
　フィルタ１６１ａ～１６１ｃおよび１６２ａ～１６２ｃとして、実施の形態１から４に係る誘電体複合フィルタを用いることができる。 As the filters 161a to 161c and 162a to 162c, the dielectric composite filters according to the first to fourth embodiments can be used.
　実施の形態１から４に係る誘電体複合フィルタは、小型に構成できるので、パッチアンテナ１１２に接続されるフィルタ１６１ａ～１６１ｃを、パッチアンテナ１１２が形成される基板の裏面に配置してもよい。これにより、フィルタ１６１ａ～１６１ｃ付きのパッチアンテナ１１２を備えるアンテナ装置１１１が構成される。 Since the dielectric composite filters according to Embodiments 1 to 4 can be made compact, the filters 161a to 161c connected to the patch antenna 112 may be arranged on the back surface of the substrate on which the patch antenna 112 is formed. Thereby, the antenna device 111 including the patch antenna 112 with the filters 161a to 161c is configured.
　本実施の形態に係る高周波フロントエンド回路１１０Ａによれば、フィルタ１６１ａ～１６１ｃおよび１６２ａ～１６２ｃにおいて、スプリアスを抑制しながら小さい挿入損失を達成するので、高周波特性に優れたＭａｓｓｉｖｅ　ＭＩＭＯシステムを実現することが可能となる。 According to the high-frequency front-end circuit 110A according to the present embodiment, the filters 161a to 161c and 162a to 162c achieve a small insertion loss while suppressing spurious, so that a Massive MIMO system having excellent high-frequency characteristics can be realized. Is possible.
　以上、本発明の実施の形態に係る誘電体複合フィルタ、高周波モジュール、高周波フロントエンド回路、通信装置、及びＭａｓｓｉｖｅ　ＭＩＭＯシステムについて説明したが、本発明は、個々の実施の形態には限定されない。本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態に施したものや、異なる実施の形態における構成要素を組み合わせて構築される形態も、本発明の一つ又は複数の態様の範囲内に含まれてもよい。 Although the dielectric composite filter, the high frequency module, the high frequency front end circuit, the communication device, and the Massive MIMO system according to the embodiments of the present invention have been described above, the present invention is not limited to individual embodiments. Unless it deviates from the gist of the present invention, the embodiment in which various modifications conceived by those skilled in the art have been made in the present embodiment, and forms constructed by combining components in different embodiments are also applicable to one or more of the present invention. It may be included within the scope of the embodiments.
　本発明は、スプリアスを抑制しながら挿入損失が小さい誘電体複合フィルタとして、ミリ波帯移動体通信システムおよびＭａｓｓｉｖｅ　ＭＩＭＯシステムなどの通信装置に広く利用できる。 The present invention can be widely used in communication devices such as millimeter wave mobile communication systems and massive MIMO systems as dielectric composite filters with low insertion loss while suppressing spurious.
　　　　１～７　　誘電体複合フィルタ
　　　　８　　高周波モジュール
　　　１０、１１　　導波管フィルタ
　　　１２～１６、１２ａ～１４ａ、１６ａ、３１　　誘電体共振器
　　　１８、１９　　入出力部
　　　２１～２３　　伝送線路フィルタ
　　　４０～４２　　誘電体ブロック
　　　４０ａ、４０ｂ、４０ｃ、４１ａ、４１ｂ、４２ａ　溝
　　　５０～５２　　導電性被膜
　　　５１ａ、５１ｂ、５２ａ、５２ｂ　結合窓
　　　５３、５４　　配線導体
　　　５６　　主導体
　　　５７～５９　　オープンスタブ
　　　８０　　基板
　　　８１　　導体箔
　　　８２　　接続電極
　　　８３、８４　　コプレーナライン
　　１１０、１１０Ａ～１１０Ｃ　　高周波フロントエンド回路
　　１１１　　アンテナ装置
　　１１２　　パッチアンテナ
　　１５０　　アンテナ素子
　　１６１、１６１ａ～１６１ｃ、１６２、１６２ａ～１６２ｃ、１６３　　フィルタ
　　１６４　　デュプレクサ
　　１７０、１７０ａ～１７０ｃ、１７２　　スイッチ回路
　　１７１　　サーキュレータ
　　１７３　　アイソレータ
　　１８１、１８１ａ～１８１ｃ　　パワーアンプ回路
　　１８２、１８２ａ～１８２ｃ　　ローノイズアンプ回路
　　１９１　　ＲＦ信号処理回路
　　１９２　　ベースバンド信号処理回路
　　１９３　　ローカルオシレータ
　　１９４ａ～１９４ｃ　ミキサ 1-7 Dielectric Composite Filter 8 High Frequency Module 10, 11 Waveguide Filter 12-16, 12a-14a, 16a, 31 Dielectric Resonator 18, 19 Input / Output Unit 21-23 Transmission Line Filter 40-42 Dielectric Block 40a, 40b, 40c, 41a, 41b, 42a Groove 50-52 Conductive coating 51a, 51b, 52a, 52b Coupling window 53, 54 Wiring conductor 56 Main conductor 57-59 Open stub 80 Substrate 81 Conductive foil 82 Connection electrode 83, 84 Coplanar lines 110, 110A to 110C High-frequency front end circuit 111 Antenna device 112 Patch antenna 150 Antenna element 161, 161a to 161c, 162, 162a to 162c, 163 Filter 164 Duplexer 1 0,170a ~ 170c, 172 switching circuit 171 circulator 173 isolators 181,181a ~ 181c power amplifier circuit 182,182a ~ 182c low-noise amplifier circuit 191 RF signal processing circuit 192 baseband signal processing circuit 193 the local oscillator 194a ~ 194c mixer

Claims (17)

  1. 　複数の誘電体共振器を連結してなり、少なくとも一方端の誘電体共振器に、信号の伝搬モードを変換する入出力部が設けられている導波管フィルタと、
    　前記一方端の誘電体共振器に連結された誘電体ブロックと、前記誘電体ブロックの表面に形成され、かつ、前記入出力部から延びる配線導体と、を有する伝送線路フィルタと、
    　を備える誘電体複合フィルタ。     A waveguide filter in which a plurality of dielectric resonators are connected, and at least one dielectric resonator is provided with an input / output unit for converting a signal propagation mode;
    A transmission line filter having a dielectric block connected to the dielectric resonator at the one end, and a wiring conductor formed on the surface of the dielectric block and extending from the input / output unit;
    A dielectric composite filter comprising:
  2. 　前記伝送線路フィルタは、ローパスフィルタである、
    　請求項１に記載の誘電体複合フィルタ。     The transmission line filter is a low-pass filter.
    The dielectric composite filter according to claim 1.
  3. 　前記配線導体は、前記配線導体における信号の伝搬方向に直交する方向の寸法である幅が異なる部分を少なくとも２以上有する、
    　請求項２に記載の誘電体複合フィルタ。     The wiring conductor has at least two or more portions having different widths that are dimensions in a direction orthogonal to a signal propagation direction in the wiring conductor.
    The dielectric composite filter according to claim 2.
  4. 　前記伝送線路フィルタは、バンドエリミネーションフィルタ又はノッチフィルタである、
    　請求項１に記載の誘電体複合フィルタ。     The transmission line filter is a band elimination filter or a notch filter.
    The dielectric composite filter according to claim 1.
  5. 　前記配線導体は、前記配線導体における信号の伝搬方向に設けられた主導体と、当該主導体から分岐する複数のオープンスタブとを有する、
    　請求項４に記載の誘電体複合フィルタ。     The wiring conductor has a main conductor provided in a signal propagation direction in the wiring conductor, and a plurality of open stubs branched from the main conductor.
    The dielectric composite filter according to claim 4.
  6. 　前記複数のオープンスタブは、前記主導体の一方側へ延びる第１のオープンスタブと、前記主導体の他方側へ延びる第２のオープンスタブとを含む、
    　請求項５に記載の誘電体複合フィルタ。     The plurality of open stubs include a first open stub extending to one side of the main conductor and a second open stub extending to the other side of the main conductor.
    The dielectric composite filter according to claim 5.
  7. 　前記伝送線路フィルタの表面のうち前記配線導体が形成されている面の反対面に、導体膜が形成されている、
    　請求項１から６の何れか１項に記載の誘電体複合フィルタ。     A conductor film is formed on the surface of the transmission line filter opposite to the surface on which the wiring conductor is formed.
    The dielectric composite filter according to any one of claims 1 to 6.
  8. 　前記導波管フィルタの表面に導体膜が形成されており、
    　前記伝送線路フィルタの前記反対面に形成されている導体膜は、前記導波管フィルタの表面に形成されている導体膜である、
    　請求項７に記載の誘電体複合フィルタ。     A conductor film is formed on the surface of the waveguide filter,
    The conductor film formed on the opposite surface of the transmission line filter is a conductor film formed on the surface of the waveguide filter.
    The dielectric composite filter according to claim 7.
  9. 　前記配線導体と前記入出力部とは、前記誘電体複合フィルタの同一面に形成されている、
    　請求項１から８の何れか１項に記載の誘電体複合フィルタ。     The wiring conductor and the input / output unit are formed on the same surface of the dielectric composite filter.
    The dielectric composite filter according to any one of claims 1 to 8.
  10. 　前記入出力部が、前記一方端の誘電体共振器の角部に設けられている、
    　請求項１から９の何れか１項に記載の誘電体複合フィルタ。     The input / output unit is provided at a corner of the dielectric resonator at the one end;
    The dielectric composite filter according to any one of claims 1 to 9.
  11. 　前記導波管フィルタの他方端の誘電体共振器に連結された誘電体共振器を、さらに備える、
    　請求項１に記載の誘電体複合フィルタ。     A dielectric resonator coupled to the dielectric resonator at the other end of the waveguide filter;
    The dielectric composite filter according to claim 1.
  12. 　前記伝送線路フィルタは、ローパスフィルタであり、
    　前記他方端の誘電体共振器に連結された誘電体共振器は、バンドエリミネーションフィルタである、
    　請求項１１に記載の誘電体複合フィルタ。     The transmission line filter is a low-pass filter,
    The dielectric resonator connected to the dielectric resonator at the other end is a band elimination filter.
    The dielectric composite filter according to claim 11.
  13. 　請求項１から１２の何れか１項に記載の誘電体複合フィルタと、
    　前記誘電体複合フィルタの配線導体と同一形状の接続電極が形成された基板と、を備え、
    　前記誘電体複合フィルタの前記配線導体と前記基板の前記接続電極とが結合されてなる、
    　高周波モジュール。     The dielectric composite filter according to any one of claims 1 to 12,
    A substrate on which a connection electrode having the same shape as the wiring conductor of the dielectric composite filter is formed,
    The wiring conductor of the dielectric composite filter and the connection electrode of the substrate are combined,
    High frequency module.
  14. 　アンテナ素子に接続された、請求項１から１２の何れか１項に記載の誘電体複合フィルタと、
    　前記アンテナ素子へ送信する高周波送信信号を増幅する送信増幅回路と、
    　前記アンテナ素子で受信した高周波受信信号を増幅する受信増幅回路と、
    　前記送信増幅回路及び前記受信増幅回路と、前記誘電体複合フィルタとの接続を切り替えるスイッチ回路と、
    　を備える高周波フロントエンド回路。     The dielectric composite filter according to any one of claims 1 to 12, connected to an antenna element,
    A transmission amplifier circuit for amplifying a high-frequency transmission signal to be transmitted to the antenna element;
    A reception amplification circuit for amplifying a high-frequency reception signal received by the antenna element;
    A switch circuit that switches connection between the transmission amplifier circuit and the reception amplifier circuit, and the dielectric composite filter;
    High frequency front-end circuit with
  15. 　ＲＦ信号処理回路から出力される高周波送信信号を増幅する送信増幅回路と、
    　高周波受信信号を増幅して前記ＲＦ信号処理回路へ出力する受信増幅回路と、
    　前記ＲＦ信号処理回路と前記送信増幅回路との間、又は、前記ＲＦ信号処理回路と前記受信増幅回路との間に配置された、請求項１から１２の何れか１項に記載の誘電体複合フィルタと、
    　を備える高周波フロントエンド回路。     A transmission amplifier circuit for amplifying a high-frequency transmission signal output from the RF signal processing circuit;
    A reception amplification circuit that amplifies a high-frequency reception signal and outputs the amplified signal to the RF signal processing circuit;
    The dielectric composite according to any one of claims 1 to 12, wherein the dielectric composite is disposed between the RF signal processing circuit and the transmission amplifier circuit, or between the RF signal processing circuit and the reception amplifier circuit. Filters,
    High frequency front-end circuit with
  16. 　アンテナ素子に接続され、前記アンテナ素子で送信及び受信される高周波信号を増幅する、請求項１４又は１５に記載の高周波フロントエンド回路と、
    　前記高周波フロントエンド回路に接続され、前記高周波信号とベースバンド信号との間の周波数変換を含む信号処理を行うＲＦ信号処理回路と、
    　前記ＲＦ信号処理回路に接続され、前記ベースバンド信号を信号処理するベースバンド信号処理回路と、
    　を備える通信装置。     A high-frequency front-end circuit according to claim 14 or 15, which is connected to an antenna element and amplifies a high-frequency signal transmitted and received by the antenna element;
    An RF signal processing circuit connected to the high-frequency front-end circuit for performing signal processing including frequency conversion between the high-frequency signal and a baseband signal;
    A baseband signal processing circuit connected to the RF signal processing circuit and processing the baseband signal;
    A communication device comprising:
  17. 　行列状に配列された複数のパッチアンテナを含むアンテナと、
    　パッチアンテナごとに請求項１から１２のいずれか１項に記載の誘電体複合フィルタと、
    　を備えるＭａｓｓｉｖｅ　ＭＩＭＯシステム。     An antenna including a plurality of patch antennas arranged in a matrix;
    The dielectric composite filter according to any one of claims 1 to 12, for each patch antenna,
    Massive MIMO system comprising:
PCT/JP2017/036181 2016-11-18 2017-10-04 DIELECTRIC COMPOSITE FILTER, HIGH-FREQUENCY MODULE, HIGH-FREQUENCY FRONT-END CIRCUIT, COMMUNICATION DEVICE, AND Massive MIMO SYSTEM WO2018092453A1 (en)

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Publication number Priority date Publication date Assignee Title
WO2023276879A1 (en) * 2021-07-02 2023-01-05 株式会社村田製作所 Filter device, antenna device, and antenna module

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Publication number Priority date Publication date Assignee Title
JPS6150303U (en) * 1984-09-07 1986-04-04
JPH11312902A (en) * 1998-04-30 1999-11-09 Murata Mfg Co Ltd Dielectric filter, transmission/reception equipment and communication equipment
JP2016171557A (en) * 2015-03-13 2016-09-23 東光株式会社 I/O STRUCTURE OF DIELECTRIC WAVEGUIDE, MOUNTING STRUCTURE OF DIELECTRIC WAVEGUIDE, DIELECTRIC WAVEGUIDE FILTER AND MassiveMIMO SYSTEM

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JPS6150303U (en) * 1984-09-07 1986-04-04
JPH11312902A (en) * 1998-04-30 1999-11-09 Murata Mfg Co Ltd Dielectric filter, transmission/reception equipment and communication equipment
JP2016171557A (en) * 2015-03-13 2016-09-23 東光株式会社 I/O STRUCTURE OF DIELECTRIC WAVEGUIDE, MOUNTING STRUCTURE OF DIELECTRIC WAVEGUIDE, DIELECTRIC WAVEGUIDE FILTER AND MassiveMIMO SYSTEM

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023276879A1 (en) * 2021-07-02 2023-01-05 株式会社村田製作所 Filter device, antenna device, and antenna module

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