JP2019036806A - Dielectric waveguide filter, high frequency front end circuit and communication apparatus - Google Patents

Abstract

To provide a dielectric waveguide filter capable of suppressing fluctuation in a resonance frequency.SOLUTION: In a dielectric waveguide filter 1 provided with a plurality of resonators 11a to 11g including a resonator in/from which a high frequency signal is input/output, each of the resonators 11a to 11g includes a dielectric 52 and a ground electrode 65 covering at least part of the surface of the dielectric 52, and is a TE mode resonator having a mounting surface F1 serving as a main surface on a mounting substrate 70 side and a top surface F2 serving as a main surface opposed to the mounting surface F1, the electric field being largest at the mounting surface F1 or the top surface F2. At least one resonator (for example, resonator 11d) excluding the resonators 11a, 11g in/from which the high frequency signal is input/output among the plurality of resonators 11a to 11g has the ground electrode 65 and an electrode non-forming portion NE where the ground electrode 65 is not formed each on the mounting surface of the resonator 11d, and the electrode non-forming portion NE is surrounded by the ground electrode 65 on the resonator 11d in a plan view of the mounting surface F1 of the resonator 11d.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a dielectric waveguide filter including a plurality of resonators, a high-frequency front-end circuit, and a communication device.

  In order to cope with an increase in communication capacity of communication terminals, a communication method in a quasi-millimeter wave band such as 28 GHz is being studied. As a filter used in such a high frequency band, a dielectric waveguide filter using a TE (Transverse Electric) mode resonator is known. Since the dielectric waveguide filter using the TE mode resonator has a high Q value, the loss in a high frequency band is small.

  Patent Document 1 discloses a frequency adjustment method for a dielectric waveguide filter including a plurality of dielectric resonators. In this dielectric waveguide filter, the resonance frequency is adjusted by removing a part of the ground electrode formed on the top surface of the dielectric waveguide filter.

JP 2000-49511 A

  However, in the dielectric waveguide filter disclosed in Patent Document 1, since the exposed dielectric is exposed to the external space by removing the ground electrode, for example, a conductor such as a metal near the exposed dielectric If is placed, there is a problem that the resonance frequency fluctuates.

  Therefore, an object of the present invention is to provide a dielectric waveguide filter that can suppress fluctuations in resonance frequency.

  In order to achieve the above object, a dielectric waveguide filter according to an aspect of the present invention is a dielectric waveguide filter including a plurality of resonators including a resonator that inputs and outputs a high-frequency signal. Each of the plurality of resonators includes a dielectric and a ground electrode that covers at least a part of the surface of the dielectric, and is a main surface on the mounting substrate side or a main surface facing the mounting surface. A TE (Transverse Electric) mode resonator having a maximum electric field on the top surface, which is a surface, and at least one resonator other than a resonator to which a high-frequency signal is input / output among the plurality of resonators. When the mounting surface of the resonator is viewed in plan, the mounting surface of the resonator has a ground electrode and an electrode non-forming portion on which the ground electrode is not formed. By They are surrounded.

  As described above, by providing the electrode non-forming portion on the mounting surface of the dielectric waveguide filter, when the dielectric waveguide filter is mounted on the mounting substrate, the electrode non-forming portion is covered with the mounting substrate. Therefore, the electrode non-formation part for adjusting the frequency is not exposed to the external space, and is not easily affected by external parts. Thereby, the fluctuation | variation of the resonant frequency of a dielectric waveguide filter can be suppressed.

  Moreover, the electrode non-formation part may contain the space | gap.

  As described above, when the gap is included in the electrode non-forming portion, the frequency adjustment amount can be increased, and the non-electrode forming portion is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter is suppressed. can do.

  In addition, the interface between the electrode non-forming portion and the dielectric may enter the inside of the dielectric rather than the interface between the ground electrode and the dielectric on the mounting surface of the resonator.

  According to this, for example, the volume of the electrode non-forming portion can be increased, and the resonance frequency of the dielectric waveguide filter can be increased.

  In addition, the electrode non-forming portion may be provided in a region including the center of the resonator when viewed from a direction perpendicular to the mounting surface.

  Thus, by providing the electrode non-forming portion in the region including the center of the resonator, the resonance frequency of the dielectric waveguide filter can be easily adjusted.

  One or more resonators different from the plurality of resonators may be further provided on the plurality of resonators.

  Thus, by arranging a plurality of resonators in the vertical direction, the area on the mounting surface side of the dielectric waveguide filter can be reduced.

  The dielectric waveguide filter may further include a mounting substrate, and the electrode non-forming portion may be covered with the mounting substrate and the ground electrode in the resonator.

  According to this, when the dielectric waveguide filter is mounted on the mounting substrate, the electrode non-forming portion is covered with the mounting substrate and the ground electrode, so that the shielding property of the electrode non-forming portion is improved and the resonance frequency is reduced. Variations can be suppressed.

  The mounting substrate may have a ground pattern on the main surface on the mounting surface side, and the electrode non-forming portion may be covered with the ground pattern and the ground electrode in the resonator.

  According to this, when the dielectric waveguide filter is mounted on the mounting substrate, the electrode non-formed part is covered with the ground pattern and the ground electrode, so that the shielding property of the electrode non-formed part is enhanced, and the resonance frequency is reduced. Variations can be suppressed.

  In addition, the ground pattern and the ground electrode in the resonator are joined by a joining material, and a damming member that dams the inflow of the joining material in a region on the ground pattern corresponding to the non-electrode forming portion. It may be provided.

  In this way, by providing the blocking member on the ground pattern of the mounting substrate in the region corresponding to the electrode non-forming portion NE, it is possible to suppress the bonding material from flowing into the electrode non-forming portion. Thereby, a space required for frequency adjustment can be ensured in the electrode non-forming portion. Further, the electrode non-formed portion is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter can be suppressed.

  Further, a damming member that protrudes from the ground electrode may be provided on the outer periphery of the electrode non-formation portion when the resonator is viewed in plan, on the ground electrode of the resonator.

  Thus, by providing a blocking member on the outer periphery of the electrode non-formation portion of the dielectric waveguide filter, when the dielectric waveguide filter is mounted on the mounting substrate, the bonding material is placed on the electrode non-formation portion. Inflow can be suppressed. Thereby, a space required for frequency adjustment can be ensured in the electrode non-forming portion. Further, the electrode non-formed portion is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter can be suppressed.

  The damming member may be formed of a resist.

  According to this, the damming portion can be easily formed.

  The dielectric waveguide filter according to one aspect of the present invention includes a lower resonator group including one or more resonators arranged in a predetermined plane, and a lower resonance in a vertical direction perpendicular to the predetermined plane. An upper resonator group including one or more resonators disposed on the resonator group, the dielectric waveguide filter comprising: a resonator of the lower resonator group; and a resonance of the upper resonator group Each of the resonators has a dielectric and a ground electrode that covers at least a part of the surface of the dielectric, and a contact surface that contacts the resonators arranged in the vertical direction or a surface that faces the contact surface The TE (Transverse Electric) mode resonator having the maximum electric field at the at least one of the resonator in the lower resonator group and the resonator in the upper resonator group is in contact with the resonator. Ground electrode and ground And a non-electrode part not poles formed, a contact surface of the cavity when viewed in plan, the electrode non-formation part is surrounded by the ground electrode in the resonator.

  Thus, by providing the electrode non-forming part on the contact surface of the dielectric waveguide filter, the electrode non-forming part is covered with the resonators arranged in the vertical direction. Therefore, the electrode non-formation part for adjusting the frequency is not exposed to the external space, and is not easily affected by external parts. Thereby, the fluctuation | variation of the resonant frequency of a dielectric waveguide filter can be suppressed.

  Moreover, the electrode non-formation part may contain the space | gap.

  As described above, when the gap is included in the electrode non-forming portion, the frequency adjustment amount can be increased, and the non-electrode forming portion is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter is suppressed. can do.

  In addition, the interface between the electrode non-forming portion and the dielectric may enter the inside of the dielectric rather than the interface between the ground electrode and the dielectric at the contact surface of the resonator.

  According to this, for example, the volume of the electrode non-forming portion can be increased, and the resonance frequency of the dielectric waveguide filter can be increased.

  The electrode non-forming portion may be provided in a region including the center of the resonator when viewed from a direction perpendicular to the contact surface.

  Thus, by providing the electrode non-forming portion in the region including the center of the resonator, the resonance frequency of the dielectric waveguide filter can be easily adjusted.

  Moreover, the electrode non-formation part may be covered with the ground electrode in the said resonator and the resonator different from self among resonators arrange | positioned at an up-down direction.

  According to this, since the electrode non-forming part is covered with the other-side resonator different from itself and the ground electrode in the resonator, the shielding property of the electrode non-forming part is enhanced and the fluctuation of the resonance frequency is suppressed. Can do.

  The electrode non-forming portion may be covered with a ground electrode in the resonator and a ground electrode of a resonator different from itself among resonators arranged in the vertical direction.

  According to this, since the electrode non-forming portion is covered with the ground electrode of the other resonator different from itself and the ground electrode in the resonator, the shielding property of the electrode non-forming portion is improved, and the fluctuation of the resonance frequency is reduced. Can be suppressed.

  Further, the resonators arranged in the vertical direction may be magnetically coupled to each other.

  Thus, by using magnetic field coupling between the resonators arranged in the vertical direction, an electrode non-formation portion for frequency adjustment can be easily formed on the contact surface as compared with the case of electric field coupling.

  A high-frequency front-end circuit according to an aspect of the present invention includes a dielectric waveguide filter connected to an antenna element, a transmission amplifier circuit that amplifies a high-frequency transmission signal transmitted to the antenna element, and a high-frequency signal received by the antenna element. A reception amplifier circuit that amplifies a reception signal, a transmission amplifier circuit and a reception amplifier circuit, and a switch circuit that switches connection between the dielectric waveguide filter.

  A high-frequency front end circuit according to an aspect of the present invention includes a transmission amplifier circuit that amplifies a high-frequency transmission signal output from an RF signal processing circuit, and a reception amplifier circuit that amplifies the high-frequency reception signal and outputs the amplified signal to the RF signal processing circuit And the dielectric waveguide filter disposed between the RF signal processing circuit and the transmission amplification circuit or between the RF signal processing circuit and the reception amplification circuit.

  By configuring the high-frequency front-end circuit using the dielectric waveguide filter in which the fluctuation of the resonance frequency is suppressed, it is possible to suppress a decrease in communication performance of the high-frequency front-end circuit.

  A communication device according to an aspect of the present invention is connected to an antenna element, the high-frequency front end circuit that is connected to the antenna element, amplifies a high-frequency signal transmitted and received by the antenna element, and the high-frequency front-end circuit, An RF signal processing circuit that performs signal processing including frequency conversion between a high-frequency signal and a baseband signal, and a baseband signal processing circuit that is connected to the RF signal processing circuit and performs signal processing on the baseband signal.

  By configuring the communication device using the high-frequency front-end circuit in which the fluctuation of the resonance frequency is suppressed, it is possible to suppress a decrease in communication performance of the communication device.

  According to the present invention, fluctuations in the resonance frequency of the dielectric waveguide filter can be suppressed. In addition, fluctuations in the resonance frequency can be suppressed in the high-frequency front-end circuit and communication device using the dielectric waveguide filter of the present invention.

It is the figure which looked at the dielectric waveguide filter which concerns on Embodiment 1 from diagonally downward. It is a perspective view of the mounting board | substrate with which a dielectric waveguide filter is mounted. It is a perspective view which shows the state by which the dielectric waveguide filter which concerns on Embodiment 1 was mounted in the mounting board | substrate. (A) is sectional drawing of the dielectric waveguide filter which concerns on Embodiment 1, (b) is sectional drawing of a mounting substrate. It is sectional drawing which shows the state with which the dielectric waveguide filter which concerns on Embodiment 1 was mounted in the mounting board | substrate. 6 is a diagram showing another example of the dielectric waveguide filter according to Embodiment 1. FIG. It is the figure which looked at the dielectric waveguide filter which concerns on the modification of Embodiment 1 from diagonally downward. It is a perspective view which shows the state by which the dielectric waveguide filter which concerns on Embodiment 2 was mounted in the mounting board | substrate. 5 is an exploded perspective view of a dielectric waveguide filter according to a second embodiment. FIG. It is an exploded view at the time of seeing the dielectric waveguide filter which concerns on Embodiment 2 from diagonally downward. 6 is a diagram showing input / output paths of a dielectric waveguide filter according to a second embodiment. FIG. It is a schematic diagram which shows the electromagnetic field which generate | occur | produces in a part of dielectric waveguide filter which concerns on Embodiment 2, Comprising: (a) is a side view, (b) is the direction which shows (a) to IVb-IVb line | wire. It is the figure seen from. It is a perspective view which shows the state by which the dielectric waveguide filter which concerns on Embodiment 3 was mounted in the mounting board | substrate. It is an exploded view at the time of seeing the dielectric waveguide filter which concerns on Embodiment 3 from diagonally downward. 10 is an exploded perspective view of a dielectric waveguide filter according to a modification of the third embodiment. FIG. It is a perspective view which shows the state by which the dielectric waveguide filter which concerns on Embodiment 4 was mounted in the mounting board | substrate. FIG. 10 is a diagram showing input / output paths of a dielectric waveguide filter according to a fourth embodiment. It is the figure which looked at the partial exploded view of the dielectric waveguide filter which concerns on Embodiment 4 from diagonally downward. It is a perspective view which shows the state by which the dielectric waveguide filter which concerns on Embodiment 5 was mounted in the mounting board | substrate. (A) is the figure which looked at the dielectric waveguide filter which concerns on Embodiment 5 from diagonally downward, (b) is a perspective view of a mounting substrate. It is sectional drawing which shows the state with which the dielectric waveguide filter which concerns on Embodiment 5 was mounted in the mounting board | substrate. (A) is the figure which looked at the dielectric waveguide filter which concerns on the modification 1 of Embodiment 5 from diagonally downward, (b) is the perspective view of a mounting substrate. FIG. 10 is a cross-sectional view showing a state where a dielectric waveguide filter according to Modification 1 of Embodiment 5 is mounted on a mounting substrate. FIG. 10 is a cross-sectional view showing a state where a dielectric waveguide filter according to a second modification of the fifth embodiment is mounted on a mounting board. It is the figure which looked at the dielectric waveguide filter of Embodiment 6 from diagonally downward. FIG. 10 is a circuit diagram showing a high frequency front end circuit and a communication device according to a seventh embodiment. FIG. 10 is a circuit diagram showing a Massive MIMO system according to an eighth embodiment. FIG. 20 is a perspective view showing a communication apparatus of a Massive MIMO system according to Embodiment 8.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. Numerical values, shapes, materials, constituent elements, arrangement of constituent elements, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as optional constituent elements. Further, the size of components shown in the drawings or the ratio of sizes is not necessarily strict.

(Embodiment 1)
The dielectric waveguide filter 1 according to the first embodiment will be described. FIG. 1A is a diagram of the dielectric waveguide filter 1 as viewed obliquely from below. FIG. 1B is a perspective view of a mounting substrate 70 on which the dielectric waveguide filter 1 is mounted. FIG. 1C is a diagram illustrating a state in which the dielectric waveguide filter 1 is mounted on the mounting substrate 70.

  The dielectric waveguide filter 1 includes a plurality of resonators 11a, 11b, 11c, 11d, 11e, 11f, and 11g. The plurality of resonators 11a to 11g are arranged in a line and constitute one resonator group.

  Each of the resonators 11 a to 11 g has a rectangular parallelepiped dielectric 52 and a ground electrode 65 covering the surface 52 a of the dielectric 52. Further, each of the resonators 11a to 11g has a mounting surface F1 that is a main surface on the mounting substrate 70 side or a top surface F2 that is a main surface facing the mounting surface F1. Each of the resonators 11a to 11g is a TE mode resonator in which the electric field is maximized on the mounting surface F1 or the top surface F2.

  1A to 1C, the direction in which the resonators 11a to 11g are arranged is the Y direction, the direction in which the mounting surface F1 and the top surface F2 are opposed is the Z direction, and the direction perpendicular to both the Y direction and the Z direction is X. Shown as direction.

  As shown in FIG. 1A, the plurality of resonators 11 a to 11 g are formed by a dielectric block 51. The dielectric block 51 has a prismatic shape, and a part of the surface is covered with the ground electrode 65. The dielectric block 51 is a resonance block formed by integrally molding a dielectric material such as quartz or ceramic. The ground electrode 65 is formed, for example, by applying a conductive paste containing silver or copper to the surface of the dielectric block 51.

  A coupling portion 55 is provided between each of the resonators adjacent in the Y direction. For example, the resonators 11a and 11b are magnetically coupled by the coupling portion 55 provided between the resonator 11a and the resonator 11b. The coupling portion 55 is formed by providing a plurality of grooves at predetermined intervals in the longitudinal direction (Y direction) of the dielectric block 51.

  Of the resonators 11a to 11g, the resonator 11d has an electrode non-forming portion NE in which the ground electrode 65 is not formed on the mounting surface F1. This electrode non-forming portion NE is a characteristic configuration of the present embodiment, and will be described in detail later.

  An input / output electrode 61 to which a high frequency signal is input is provided on the mounting surface F1 of the resonator 11a. The mounting surface F1 of the resonator 11g is provided with an input / output electrode 62 from which a high-frequency signal input through the input / output electrode 61 is output. The ground electrode 65 is provided in a region different from the region in which the input / output electrodes 61 and 62 are provided.

  The dielectric waveguide filter 1 is mounted on the mounting substrate 70. The main body of the mounting substrate 70 is formed of a resin material such as epoxy or phenol, for example.

  As shown in FIG. 1B, input / output patterns 71 and 72 and a ground pattern 75 corresponding to the input / output electrodes 61 and 62 and the ground electrode 65 are formed on the mounting substrate 70. The input / output patterns 71 and 72 and the ground pattern 75 are formed of, for example, copper foil.

  As shown in FIG. 1C, when the dielectric waveguide filter 1 is mounted on the mounting substrate 70, the plurality of resonators 11a to 11g have the mounting surface F1 facing the main surface 70a of the mounting substrate 70. Bonded to the mounting substrate 70. Specifically, the input / output electrode 61 and the input / output pattern 71, the input / output electrode 62 and the input / output pattern 72, and the ground electrode 65 and the ground pattern 75 are joined by a conductive joining material such as solder.

  When the frequency of the dielectric waveguide filter 1 is adjusted, the frequency is adjusted by removing a part of the ground electrode 65. In the present embodiment, a case will be described in which the frequency adjustment is performed by removing a part of the ground electrode 65 of the resonator 11d from the resonators 11b to 11f excluding the resonators 11a and 11g to which high-frequency signals are input and output. .

  As described above, the mounting surface F1 of the resonator 11d is provided with the electrode non-forming portion NE where the ground electrode 65 is not formed. The electrode non-forming portion NE is provided in a region A1 surrounded by the outer periphery of the ground electrode 65 on the mounting surface F1. In other words, the electrode non-forming part NE and the ground electrode 65 surrounding the electrode non-forming part NE are provided on the mounting surface F1 of the resonator 11d. The electrode non-forming portion NE is, for example, circular, elliptical, or polygonal, and the entire outer periphery of the electrode non-forming portion NE is surrounded by the ground electrode 65. Further, the electrode non-forming portion NE is provided at a position including the center of the resonator 11d when viewed from the direction perpendicular to the mounting surface F1. The electrode non-forming portion NE is formed by removing a part of the ground electrode 65 formed on the mounting surface F1 using, for example, a grinder or a laser. The resonance frequency of the resonator 11d is adjusted, for example, by changing the area of the electrode non-forming part NE.

  2A is a cross-sectional view of the dielectric waveguide filter 1, and FIG. 2A is a cross-sectional view of the mounting substrate 70. FIG. 2B is a cross-sectional view showing a state where the dielectric waveguide filter 1 is mounted on the mounting substrate 70. In FIG. 2B, the description of the bonding material for bonding the dielectric waveguide filter 1 and the mounting substrate 70 is omitted.

  As shown in (a) of FIG. 2A, in the dielectric waveguide filter 1 before mounting, the dielectric 52 is exposed at the electrode non-forming portion NE. As shown in FIG. 2B, when the dielectric waveguide filter 1 is mounted on the mounting substrate 70, the electrode non-forming portion NE is covered with the ground pattern 75. Specifically, the electrode non-forming portion NE includes a gap S1 made of an air layer, and the gap S1 is surrounded by the dielectric 52, the ground electrode 65, and the ground pattern 75.

  The relative permittivity of air present in the air gap S1 is 1, and the relative permittivity of the dielectric 52 used in the present embodiment is, for example, 4.5 or more and 8.5 or less. Therefore, by providing the resonator 11d with the electrode non-forming portion NE including the gap S1, the average dielectric constant of the resonator 11d is lowered. As a result, the resonance frequency of the resonator 11d is adjusted to be high.

  In the present embodiment, among the plurality of resonators 11a to 11g, at least one resonator (for example, the resonator 11d) excluding the resonators 11a and 11g to / from which high-frequency signals are input / output is the mounting surface F1 of the resonator 11d. In addition, a ground electrode 65 and an electrode non-forming portion NE where the ground electrode 65 is not formed are provided. When the mounting surface F1 of the resonator 11d is viewed in plan, the electrode non-forming portion NE is surrounded by the ground electrode 65 in the resonator 11d. Since the electrode non-forming portion NE is provided on the mounting surface F1, when the dielectric waveguide filter 1 is mounted on the mounting substrate 70, the electrode non-forming portion NE is covered with the mounting substrate 70. Therefore, the electrode non-forming portion NE for adjusting the resonance frequency is not exposed to the external space and is not easily affected by external components. Thereby, the fluctuation | variation of the resonant frequency of the dielectric waveguide filter 1 can be suppressed.

  In addition, when the dielectric waveguide filter 1 is mounted on the mounting substrate 70, the electrode non-forming part NE is covered with the ground pattern 75, so that the shielding property of the electrode non-forming part NE is enhanced and the resonance frequency is changed. Can be suppressed.

  The electrode non-forming portion NE is not limited to the resonator 11d, and may be provided in other resonators 11b, 11c, and 11e to 11f. The electrode non-forming portion NE is not limited to one resonator 11d, and may be provided in two or more resonators among the plurality of resonators 11b to 11f.

  In the case where the resonator 11a having the input / output electrode 61 is provided with the electrode non-forming portion NE, as shown in FIG. 2C, the electrode non-forming portion NE is connected to the region where the input / output electrode 61 is formed and the input / output electrode 61. May be provided in a region excluding a region where the dielectric 52 existing between the ground electrode 65 and the ground electrode 65 is exposed, that is, in a region A <b> 1 surrounded by the outer periphery of the ground electrode 65.

(Modification of Embodiment 1)
FIG. 3 is a diagram of a dielectric waveguide filter 1A according to a modification of the first embodiment viewed from obliquely below.

  As shown in FIG. 3, in the dielectric waveguide filter 1 </ b> A according to the modified example, the dielectric 52 at a location in contact with the electrode non-forming portion NE has a dent. Specifically, the interface 52b between the electrode non-forming portion NE and the dielectric 52 enters the inside of the dielectric 52 more than the ground electrode 65 and the dielectric 52 and interface on the mounting surface F1 of the resonator 11d. The electrode non-forming portion NE is formed by bringing a grinder into contact with the mounting surface F1 of the resonator 11d and removing a part of the dielectric 52 together with the ground electrode 65.

  In the dielectric waveguide filter 1A of the modified example, the volume of the gap S1 in the electrode non-forming portion NE can be increased and the resonance frequency can be increased as compared with the dielectric waveguide filter 1 of the embodiment. . Further, when the dielectric waveguide filter 1A is mounted on the mounting substrate 70, the electrode non-forming portion NE is covered with the mounting substrate 70, so that the electrode non-forming portion NE is not exposed to the external space, and the fluctuation of the resonance frequency is caused. Can be suppressed.

(Embodiment 2)
A dielectric waveguide filter 1B according to the second embodiment will be described. The dielectric waveguide filter 1B of the second embodiment has a structure in which a plurality of resonators are stacked, and the electrode non-forming portion NE is formed on the mounting surface F1 of the dielectric waveguide filter 1B. .

  FIG. 4A is a perspective view showing a state in which the dielectric waveguide filter 1B is mounted on the mounting substrate 70. FIG. FIG. 4B is an exploded perspective view of the dielectric waveguide filter 1B. FIG. 4C is an exploded view of the dielectric waveguide filter 1B as viewed obliquely from below. FIG. 4D is a diagram illustrating input / output paths of the dielectric waveguide filter 1B.

  As shown in FIGS. 4A and 4B, the dielectric waveguide filter 1 </ b> B includes a resonator group 10 and a resonator group 20 disposed on the resonator group 10. The resonator group 10 includes four resonators 11, 12, 13, and 14, and the resonator group 20 includes four resonators 21, 22, 23, and 24. The resonator group 10 is disposed closer to the mounting substrate 70 than the resonator group 20. In the present embodiment, the resonator group 10 is a lower resonator group, and the resonator group 20 is an upper resonator group. Hereinafter, the resonators 11 to 14 and the resonators 21 to 24 may be collectively referred to as resonators 11 to 24.

  Each of the resonators 11 to 24 includes a rectangular parallelepiped dielectric 52 and a ground electrode 65 that covers the surface 52 a of the dielectric 52. Each of the resonators 11 to 24 has a lower surface fa, an upper surface fb, and a side surface fc, and is a TE mode resonator in which the electric field is maximized on the lower surface fa or the upper surface fb.

  As shown in FIG. 4C, among the resonators 12, 14, and 21 to 24 excluding the resonators 11 and 13 to which high-frequency signals are input and output, the resonator 12 is a mounting surface F <b> 1 that is a main surface on the mounting substrate 70 side. In addition, an electrode non-forming portion NE in which the ground electrode 65 is not formed is provided. The mounting surface F1 is the same surface as the lower surface fa of the resonator 12. This electrode non-forming portion NE is a characteristic configuration of the present embodiment, and will be described in detail later.

  An input / output electrode 61 to which a high frequency signal is input is provided on the lower surface fa of the resonator 11. On the lower surface fa of the resonator 13, an input / output electrode 62 that outputs a high-frequency signal input from the input / output electrode 61 is provided. A ground electrode 65 is provided in a region different from the region where the input / output electrodes 61 and 62 are provided on the surface of the resonators 11 to 24.

  The dielectric waveguide filter 1B is mounted on the mounting substrate 70. The mounting substrate 70 is formed of a resin material such as epoxy or phenol, for example. On the mounting substrate 70, input / output patterns 71, 72 and a ground pattern 75 corresponding to the input / output electrodes 61, the input / output electrodes 62, and the ground electrode 65 are formed. The input / output patterns 71 and 72 and the ground pattern 75 are formed of, for example, copper foil.

  The dielectric waveguide filter 1B is bonded to the mounting substrate 70 so that the mounting surface F1 faces the main surface 70a of the mounting substrate 70. Specifically, the input / output electrode 61 and the input / output pattern 71, the input / output electrode 62 and the input / output pattern 72, and the ground electrode 65 and the ground pattern 75 are joined by a conductive joining material such as solder.

  Here, the direction in which the resonator 13 and the resonator 11 are arranged is the X direction, the direction in which the resonator 11 and the resonator 21 overlap vertically is the Z direction, and the resonator 11 and the resonator 12 are arranged in the direction. A direction perpendicular to both the X direction and the Z direction is defined as a Y direction. In addition, a plane including both the X-direction axis and the Y-direction axis and including the mounting surface F1 is defined as a predetermined plane.

  The plurality of resonators 11 to 24 have the following arrangement relationship. Specifically, the resonators 11 to 14 are arranged in a matrix along a predetermined plane. Each of the resonators 21 to 24 is arranged in a matrix on the resonator group 10 so as to correspond to each of the resonators 11 to 14, and overlaps each of the resonators 11 to 14 in the Z direction.

  The resonators 11 and 12 are formed by a dielectric block 51a, the resonators 13 and 14 are formed by a dielectric block 51b, the resonators 21 and 22 are formed by a dielectric block 51c, and the resonators 23 and 24 are dielectrics. It is formed by the block 51d. Each of the dielectric blocks 51a to 51d has a prismatic shape, and a part of the surface is covered with the ground electrode 65 described above. Each of the dielectric blocks 51a to 51d is a resonance block formed by integrally molding a dielectric material such as quartz or ceramic. The ground electrode 65 is formed, for example, by applying a conductive paste containing silver or copper to the surface 52a of each of the dielectric blocks 51a to 51d.

  The resonators 11 and 12 are magnetically coupled via a coupling part 55 provided between them, and are magnetically coupled via a coupling part 55 provided between the resonators 13 and 14, and the resonators 21 and 22 are provided between them. The resonators 23 and 24 are magnetically coupled via the coupling portion 55 provided therebetween. The coupling portion 55 is formed by providing a groove near the center in the longitudinal direction (Y direction) of each of the dielectric blocks 51a to 51d. For example, the resonators 11 and 12 are formed by providing a groove near the center in the longitudinal direction of the dielectric block 51a.

  The resonator group 10 is formed by joining the opposing side surfaces of the dielectric blocks 51a and 51b using a conductive paste. The resonator group 20 is formed by joining the opposing side surfaces of the dielectric blocks 51c and 51d using a conductive paste. The dielectric waveguide filter 1B is formed by joining the upper surface of the resonator group 10 and the lower surface of the resonator group 20 using a conductive paste.

  A coupling portion 56 including a region where the dielectric 52 is exposed is provided on each of the mutually facing side surfaces fc of the resonator 21 and the resonator 23. The coupling portions 56 of the resonators 21 and 23 face each other, and the resonator 21 and the resonator 23 are magnetically coupled by the coupling portion 56. The coupling portion 56 of the resonator 21 has a rectangular shape and is provided at a position including the center of the side surface fc of the resonator 21. The coupling portion 56 of the resonator 23 has a rectangular shape and is provided at a position including the center of the side surface fc of the resonator 23.

  A coupling portion 57 including a region where the dielectric 52 is exposed is formed on each of the upper surface fb of the resonator 12 and the lower surface fa of the resonator 22. The coupling portions 57 of the resonators 12 and 22 are opposed to each other, and the resonator 12 and the resonator 22 are magnetically coupled via the coupling portion 57. The coupling portion 57 of the resonator 12 has a long hole shape, and is provided along a part of the outer periphery of the resonator 12 when viewed from a direction perpendicular to the upper surface fb. The coupling portion 57 of the resonator 22 has a long hole shape, and is provided along a part of the outer periphery of the resonator 22 when viewed from a direction perpendicular to the lower surface fa.

  A coupling portion 57 including a region where the dielectric 52 is exposed is formed on each of the upper surface fb of the resonator 14 and the lower surface fa of the resonator 24. In the resonator 14 and the resonator 24, the coupling portions 57 of the resonators 14 and 24 are opposed to each other, and are magnetically coupled through the coupling portion 57. The coupling portion 57 of the resonator 14 has a long hole shape, and is provided along a part of the outer periphery of the resonator 14 when viewed from a direction perpendicular to the upper surface fb. The coupling portion 57 of the resonator 24 has a long hole shape, and is provided along a part of the outer periphery of the resonator 24 when viewed from a direction perpendicular to the lower surface fa.

  Next, the electromagnetic field generated in the resonators 11 to 24 will be described with reference to FIG. 4E. 4E is a schematic diagram showing an electromagnetic field generated in a part of the dielectric waveguide filter 1B, where (a) is a side view and (b) is a direction from the direction indicated by the line IVb-IVb. FIG.

  When a signal of a predetermined frequency is input from the input / output electrode 61, the resonator 11 resonates, and as shown in FIGS. 4E (a) and (b), the resonator 11 includes an electric field directed in the Z direction, And a magnetic field that surrounds the axis in the Z direction. At that time, as shown in FIG. 4E (b), the electric field is strongly generated at the center of the resonator 11, and the magnetic field is strongly generated along the outer peripheral side surface of the resonator 11.

  Coupling portions 55 are provided on the side surfaces of the resonator 11 and the resonator 12 facing each other. Therefore, a magnetic field is generated in the resonator 12 so as to be coupled with the magnetic field generated in the resonator 11, and an electric field is generated in the resonator 12 along with the generated magnetic field.

  A coupling portion 57 is provided near the outer periphery of each of the upper surface fb of the resonator 12 and the lower surface fa of the resonator 22. Therefore, a magnetic field is generated in the resonator 22 so as to be coupled with the magnetic field generated in the resonator 12, and an electric field is generated in the resonator 22 along with the generated magnetic field.

  A coupling portion 55 is provided between the resonator 22 and the resonator 21, and the resonators 22 and 21 are magnetically coupled to each other. In addition, a coupling portion 56 is provided between the resonator 21 and the resonator 23, and the resonators 21 and 23 are magnetically coupled to each other. Further, the resonator 23 and the resonator 24 are magnetically coupled to each other by a coupling portion 55 provided therebetween, and the resonator 24 and the resonator 14 are magnetically coupled to each other by a coupling portion 57 provided therebetween. The resonator 14 and the resonator 13 are magnetically coupled to each other by a coupling portion 55 provided therebetween.

  In this way, the high-frequency signal input to the input / output electrode 61 is output from the input / output electrode 62 via a plurality of magnetic field couplings. That is, the dielectric waveguide filter 1B outputs the signal input to the input / output electrode 61 from the input / output electrode 62 through the resonators 11, 12, 22, 21, 23, 24, 14, 13 in order. An input / output path P1 is provided (see FIG. 4D).

  As described above, the electrode non-forming portion NE is provided on the mounting surface F1 of the resonator 12. The electrode non-forming part NE is provided in a region A1 surrounded by the outer periphery of the ground electrode 65 on the mounting surface F1. In other words, the mounting surface F1 of the resonator 12 is provided with the electrode non-forming portion NE and the ground electrode 65 surrounding the electrode non-forming portion NE. The electrode non-forming portion NE is, for example, circular, elliptical, or polygonal, and the entire outer periphery of the electrode non-forming portion NE is surrounded by the ground electrode 65. Further, the electrode non-forming portion NE is provided at a position including the center of the resonator 14 when viewed from a direction perpendicular to the mounting surface F1. The electrode non-forming portion NE is formed by removing a part of the ground electrode 65 formed on the mounting surface F1 using, for example, a grinder or a laser. The resonance frequency of the resonator 14 is adjusted, for example, by changing the area of the electrode non-forming part NE.

  In the dielectric waveguide filter 1B before mounting, the dielectric 52 in the electrode non-forming portion NE is exposed. When the dielectric waveguide filter 1B is mounted on the mounting substrate 70, the electrode non-forming portion NE is covered with the ground pattern 75. Specifically, the electrode non-forming portion NE includes a void S1 (not shown) made of an air layer, and the void S1 is surrounded by the dielectric 52, the ground electrode 65, and the ground pattern 75. By providing the resonator 12 with the electrode non-forming portion NE including the gap S1, the average dielectric constant of the resonator 12 is lowered. Thereby, it adjusts so that the resonant frequency of the resonator 12 may become high.

  In the present embodiment, at least one resonator (for example, the resonator 12) other than the resonators 11 and 13 to / from which high-frequency signals are input / output among the resonators 11 to 14 of the resonator group 10, The mounting surface F1 includes a ground electrode 65 and an electrode non-forming portion NE where the ground electrode 65 is not formed. When the mounting surface F1 of the resonator 12 is viewed in plan, the electrode non-forming portion NE is surrounded by the ground electrode 65 in the resonator 12. Since the electrode non-forming portion NE is provided on the mounting surface F1, the electrode non-forming portion NE is covered with the mounting substrate 70 when the dielectric waveguide filter 1B is mounted on the mounting substrate 70. Therefore, the electrode non-forming portion NE for adjusting the resonance frequency is not exposed to the external space and is not easily affected by external components. Thereby, the fluctuation | variation of the resonant frequency of the dielectric waveguide filter 1B can be suppressed.

  In addition, when the dielectric waveguide filter 1B is mounted on the mounting substrate 70, the electrode non-forming part NE is covered with the ground pattern 75, so that the shielding property of the electrode non-forming part NE is improved, and the resonance frequency varies. Can be suppressed.

  Further, for example, when the resonator group 10 and the resonator group 20 are joined, even if the positions of the coupling portion 57 of the resonator 12 and the coupling portion 57 of the resonator 22 are shifted, The resonance frequency can be adjusted by providing the electrode non-forming portion NE on the mounting surface F1 of the resonator 12. Thereby, the precision of the resonant frequency of the dielectric waveguide filter 1B can be improved.

  The electrode non-forming portion NE is not limited to the resonator 12, and may be provided on the mounting surface F1 (lower surface fa) of another resonator 14 in the resonator group 10. The electrode non-forming portion NE is not limited to one resonator 12 and may be provided on the mounting surface F1 of the two resonators 12 and 14.

  Further, the total number of resonators 11 to 24 is not limited to eight. That is, the resonator group 10 of the dielectric waveguide filter 1B includes four or more resonators arranged in a matrix along a predetermined plane, and the resonator group 20 is arranged in a matrix on the resonator group 10. Four or more resonators may be included. Further, the number of resonators in the resonator group 20 is not limited to a plurality, and may be configured by one resonator.

(Embodiment 3)
A dielectric waveguide filter 1C according to the third embodiment will be described. The dielectric waveguide filter 1C according to the third embodiment has a structure in which a plurality of resonators are stacked, and the electrode non-forming portion NE is a contact surface between the lower resonator and the upper resonator. F3 is formed.

  FIG. 5A is a perspective view showing a state where the dielectric waveguide filter 1C is mounted on the mounting substrate 70. FIG. FIG. 5B is an exploded view of the dielectric waveguide filter 1C as viewed obliquely from below.

  As shown in FIG. 5A, the dielectric waveguide filter 1C includes a lower resonator group 10 including a plurality of resonators 11 to 14 arranged along a predetermined plane (mounting surface F1), and a predetermined plane. And an upper resonator group 20 including a plurality of resonators 21 to 24 arranged on the lower resonator group 10 in the vertical vertical direction.

  As shown in FIG. 5B, the resonator 21 of the resonator group 20 has an electrode non-forming portion NE on the contact surface F3 where the upper and lower resonators 11 and 21 are in contact with each other. In the present embodiment, the electrode non-forming portion NE is provided on the contact surface F3 on the lower surface fa side of the resonator 21.

  The electrode non-forming portion NE is provided in a region A1 surrounded by the outer periphery of the ground electrode 65 on the contact surface F3. In other words, on the contact surface F3 of the resonator 21, the electrode non-forming part NE and the ground electrode 65 surrounding the electrode non-forming part NE are provided. The electrode non-forming portion NE is, for example, circular, elliptical, or polygonal, and the entire outer periphery of the electrode non-forming portion NE is surrounded by the ground electrode 65. Further, the electrode non-forming portion NE is provided at a position including the center of the resonator 21 when viewed from a direction perpendicular to the contact surface F3. The electrode non-forming portion NE is formed by removing a part of the ground electrode 65 formed on the contact surface F3 using, for example, a grinder or a laser. The resonance frequency of the resonator 21 is adjusted, for example, by changing the area of the electrode non-forming part NE.

  By joining the resonator group 10 and the resonator group 20 to each other, the electrode non-forming portion NE of the resonator 21 is covered with the ground electrode 65 of the resonator 11. Specifically, the electrode non-forming portion NE includes a gap S1 (not shown) made of an air layer, and the gap S1 is surrounded by the dielectric 52, the ground electrode 65 of the resonator 21, and the ground electrode 65 of the resonator 11. . Since the electrode non-forming part NE including the gap S1 is provided in the resonator 21, the average dielectric constant of the resonator 21 is lowered. Thereby, it adjusts so that the resonant frequency of the resonator 21 may become high.

  In the present embodiment, at least one resonator (for example, the resonator 21) among the resonators 21 to 24 of the upper resonator group 20 includes a ground electrode 65 and a ground electrode on the contact surface F <b> 3 of the resonator 21. And an electrode non-forming part NE in which 65 is not formed. When the contact surface F <b> 3 of the resonator 21 is viewed in plan, the electrode non-forming portion NE is surrounded by the ground electrode 65 in the resonator 21. Since the electrode non-forming part NE is provided on the contact surface F3, when the resonator group 10 and the resonator group 20 are joined, the electrode non-forming part NE of the resonator 21 is arranged in the vertical direction. 11 and 21. Therefore, the electrode non-forming portion NE for adjusting the resonance frequency is not exposed to the external space and is not easily affected by external components. Thereby, the fluctuation | variation of the resonant frequency of 1 C of dielectric waveguide filters can be suppressed.

  Further, when the resonator group 10 and the resonator group 20 are joined, the electrode non-forming portion NE of the resonator 21 is the resonator on the other side different from itself among the resonators 21 and 11 arranged in the vertical direction. 11 is covered with the ground electrode 65, the shielding property of the electrode non-forming portion NE is improved, and the fluctuation of the resonance frequency can be suppressed.

  Further, the interface between the electrode non-forming portion NE and the dielectric 52 may enter the inside of the dielectric 52 more than the interface between the ground electrode 65 and the dielectric 52 in the contact surface F3 of the resonator 21. By having the said structure, the volume of space | gap S1 in the electrode non-formation part NE can be increased, and the resonant frequency of 1 C of dielectric waveguide filters can be made high.

  The electrode non-forming portion NE is not limited to the resonator 21 and may be provided on the contact surface F3 (lower surface fa) of the other resonators 22 to 24 in the resonator group 20. The electrode non-forming portion NE is not limited to one resonator 21 and may be provided on the contact surface F3 of two or more resonators among the resonators 21 to 24.

(Modification of Embodiment 3)
FIG. 6 is an exploded perspective view of a dielectric waveguide filter 1D according to a modification of the third embodiment. In the dielectric waveguide filter 1D of the modification, the electrode non-forming portion NE is formed on the upper surface fb of the resonator disposed on the lower side.

  As shown in FIG. 6, the dielectric waveguide filter 1D includes a lower resonator group 10 including a plurality of resonators 11 to 14, and an upper resonator group 20 including a plurality of resonators 21 to 24. It has.

  The resonator 11 of the resonator group 10 has an electrode non-forming portion NE on a contact surface F3 where the upper and lower resonators 11 and 21 are in contact with each other. In the present embodiment, the electrode non-forming portion NE is provided on the contact surface F3 on the upper surface fb side of the resonator 11.

  The electrode non-forming portion NE is provided in a region A1 surrounded by the outer periphery of the ground electrode 65 on the contact surface F3. In other words, the electrode non-forming portion NE and the ground electrode 65 surrounding the electrode non-forming portion NE are provided on the contact surface F3 of the resonator 11. The electrode non-forming portion NE is, for example, circular, elliptical, or polygonal, and the entire outer periphery of the electrode non-forming portion NE is surrounded by the ground electrode 65. The electrode non-forming portion NE is provided at a position including the center of the resonator 11 when viewed from a direction perpendicular to the contact surface F3.

  By joining the resonator group 10 and the resonator group 20 to each other, the electrode non-forming portion NE of the resonator 11 is covered with the ground electrode 65 of the resonator 21. Specifically, the electrode non-forming portion NE includes a gap S1 (not shown) made of an air layer, and the gap S1 is surrounded by the dielectric 52, the ground electrode 65 of the resonator 11, and the ground electrode 65 of the resonator 21. . By providing the resonator 11 with the electrode non-forming portion NE including the gap S1, the average dielectric constant of the resonator 11 is lowered. Thereby, it adjusts so that the resonant frequency of the resonator 11 may become high.

  In this modification, at least one resonator (for example, the resonator 11) among the resonators 11 to 14 of the lower resonator group 10 has a ground electrode 65 and a ground electrode on the contact surface F <b> 3 of the resonator 11. And an electrode non-forming part NE in which 65 is not formed. When the contact surface F <b> 3 of the resonator 11 is viewed in plan, the electrode non-forming portion NE is surrounded by the ground electrode 65 in the resonator 11. Since the electrode non-forming part NE is provided on the contact surface F3, when the resonator group 10 and the resonator group 20 are joined, the electrode non-forming part NE of the resonator 11 is arranged in the vertical direction. 11 and 21. Therefore, the electrode non-forming portion NE for adjusting the resonance frequency is not exposed to the external space and is not easily affected by external components. Thereby, the fluctuation | variation of the resonant frequency of the dielectric waveguide filter 1D can be suppressed.

  Further, when the resonator group 10 and the resonator group 20 are joined, the electrode non-forming portion NE of the resonator 11 is the resonator on the other side different from itself among the resonators 21 and 11 arranged in the vertical direction. 21 is covered with the ground electrode 65, the shielding property of the electrode non-forming portion NE is enhanced, and the fluctuation of the resonance frequency can be suppressed.

  The electrode non-forming part NE is not limited to the resonator 11 and may be provided on the contact surface F3 (upper surface fb) of the other resonators 12 to 14 in the resonator group 10. The electrode non-forming portion NE is not limited to one resonator 11, and may be provided on the contact surface F <b> 3 of two or more resonators among the resonators 11 to 14. Further, as shown in the second embodiment, the electrode non-forming portion NE may be provided on the mounting surface F1 (lower surface fa) of the resonators 11-14. For example, the electrode non-forming portion NE may be provided on both the lower surface fa and the upper surface fb of the resonator 11.

(Embodiment 4)
A dielectric waveguide filter 1E according to the fourth embodiment will be described. The dielectric waveguide filter 1E according to the fourth embodiment has a structure in which a plurality of resonators are stacked in three stages.

  FIG. 7A is a perspective view showing a state where the dielectric waveguide filter 1E is mounted on the mounting substrate. FIG. 7B is a diagram showing input / output paths of the dielectric waveguide filter 1E. FIG. 7C is a partial exploded view of the dielectric waveguide filter 1E as viewed obliquely from below.

  As shown in FIG. 7A, the dielectric waveguide filter 1E includes a resonator group 10, a resonator group 20 disposed on the resonator group 10, and a resonator group 30 disposed on the resonator group 20. And. The resonator group 10 includes four resonators 11, 12, 13, and 14, the resonator group 20 includes four resonators 21, 22, 23, and 24, and the resonator group 30 includes four resonators. It has containers 31, 32, 33, 34. In the present embodiment, when the resonator group 10 is a lower resonator group, the resonator group 20 is an upper resonator group. Further, when the resonator group 30 is an upper resonator group, the resonator group 20 is a lower resonator group. Hereinafter, the resonators 11 to 14, the resonators 21 to 24, and the resonators 31 to 34 may be collectively referred to as resonators 11 to 34.

  As shown in FIG. 7B, two sets of resonators 12 and 22 and resonators 24 and 14 each including a vertically overlapping resonator are magnetically coupled to each other. Further, the two resonators 21 and 31 and the resonators 33 and 23, each having a resonator overlapping in the vertical direction, are magnetically coupled to each other in each pair. Specifically, the dielectric waveguide filter 1E converts the signal input to the input / output electrode 61 into the resonators 11, 12, 22, 21, 31, 32, 34, 33, 23, 24, 14, 13 In this manner, an input / output path P1 for outputting from the input / output electrode 62 is provided.

  As shown in FIG. 7C, the resonator 31 of the resonator group 30 has an electrode non-forming portion NE on the contact surface F3 where the upper and lower resonators 21 and 31 are in contact with each other. In the present embodiment, the electrode non-forming portion NE is provided on the contact surface F3 on the lower surface fa side of the resonator 31.

  The electrode non-forming portion NE is provided in a region A1 surrounded by the outer periphery of the ground electrode 65 on the contact surface F3. In other words, on the contact surface F3 of the resonator 31, the electrode non-forming part NE and the ground electrode 65 surrounding the electrode non-forming part NE are provided. The electrode non-forming portion NE is, for example, circular, elliptical, or polygonal, and the entire outer periphery of the electrode non-forming portion NE is surrounded by the ground electrode 65. Further, the electrode non-forming portion NE is provided at a position including the center of the resonator 31 when viewed from the direction perpendicular to the contact surface F3. By joining the resonator group 20 and the resonator group 30 to each other, the electrode non-forming portion NE of the resonator 31 is covered with the ground electrode 65 of the resonator 21. Specifically, the electrode non-forming portion NE includes a gap S1 (not shown) made of an air layer, and the gap S1 is surrounded by the dielectric 52, the ground electrode 65 of the resonator 31, and the ground electrode 65 of the resonator 21. . By providing the non-electrode-forming part NE including the gap S1 in the resonator 31, the average dielectric constant of the resonator 31 is lowered. Thereby, it adjusts so that the resonant frequency of the resonator 31 may become high.

  In the present embodiment, among the resonators 31 to 34 of the resonator group 30, at least one resonator (for example, the resonator 31) has a ground electrode 65 and a ground electrode 65 on the contact surface F <b> 3 of the resonator 31. And an electrode non-forming part NE in which is not formed. When the contact surface F3 of the resonator 31 is viewed in plan, the electrode non-forming portion NE is surrounded by the ground electrode 65 in the resonator 31. Since the electrode non-forming part NE is provided on the contact surface F3, when the resonator group 20 and the resonator group 30 are joined, the electrode non-forming part NE of the resonator 31 is arranged in the vertical direction. 21 and 31. Therefore, the electrode non-forming portion NE for adjusting the resonance frequency is not exposed to the external space and is not easily affected by external components. Thereby, the fluctuation | variation of the resonant frequency of the dielectric waveguide filter 1E can be suppressed.

  Further, when the resonator group 20 and the resonator group 30 are joined, the electrode non-forming portion NE of the resonator 31 is the resonator on the other side different from itself among the resonators 31 and 21 arranged in the vertical direction. 21 is covered with the ground electrode 65, the shielding property of the electrode non-forming portion NE is enhanced, and the fluctuation of the resonance frequency can be suppressed.

  The electrode non-forming portion NE is not limited to the resonator 31, and may be provided on the contact surface F3 (lower surface fa) of the other resonators 32-34 in the resonator group 30. The electrode non-forming portion NE is not limited to the single resonator 31 and may be provided on the contact surface F3 of two or more resonators among the resonators 31 to 34.

  Further, the electrode non-forming portion NE may be provided not on the resonator group 30 but on the contact surface F3 on the upper surface fb side of the resonators 21 to 24 of the resonator group 20. Further, as shown in the third embodiment, the electrode non-forming portion NE may be provided on the contact surface F3 on the lower surface fa side of the resonators 21 to 24. For example, the electrode non-forming part NE may be provided on both the lower surface fa and the upper surface fb of the resonator 21.

(Embodiment 5)
A dielectric waveguide filter 1F according to the fifth embodiment will be described. In the dielectric waveguide filter 1F of the fifth embodiment, the mounting substrate 70 is provided with a blocking member 77 that blocks the inflow of solder or the like.

  FIG. 8A is a perspective view showing a state in which the dielectric waveguide filter 1F is mounted on the mounting substrate 70. FIG. FIG. 8B is a view of the dielectric waveguide filter 1F as viewed obliquely from below, and FIG. 8B is a perspective view of the mounting substrate 70. FIG. In FIG. 8A and FIG. 8B (b), the description of the input / output patterns 71 and 72 is omitted.

  As shown in FIG. 8B (a), the dielectric waveguide filter 1F includes a plurality of resonators 11a and 11g. The resonators 11a and 11g are arranged side by side in the Y direction.

  An input / output electrode 61 is provided on the mounting surface F1 of the resonator 11a, and an input / output electrode 62 is provided on the mounting surface F1 of the resonator 11g. The ground electrodes 65 of the resonators 11a and 11g are provided in a region different from the region where the input / output electrodes 61 and 62 are provided.

  In addition, an electrode non-forming portion NE is provided on the mounting surface F1 of the resonator 11g. The electrode non-forming portion NE is a region excluding a region where the input / output electrode 62 is formed and a region where the dielectric 52 existing between the input / output electrode 62 and the ground electrode 65 is exposed, that is, the outer periphery of the ground electrode 65. Is provided in a region A1 surrounded by. The electrode non-forming portion NE is circular, and the entire outer periphery of the electrode non-forming portion NE is surrounded by the ground electrode 65.

  The dielectric waveguide filter 1F is mounted on the mounting substrate 70 (see FIG. 8A). When the dielectric waveguide filter 1F is mounted on the mounting substrate 70, the resonators 11a and 11g are joined to the mounting substrate 70 so that the mounting surface F1 faces the main surface 70a of the mounting substrate 70.

  As shown in FIG. 8B, a damming member 77 is provided on the ground pattern 75 of the mounting substrate 70 to dam the inflow of the bonding material 76 such as solder. The damming member 77 is formed of a resist and has a disk shape smaller than that of the electrode non-forming portion NE. The damming member 77 is provided in a region corresponding to the electrode non-forming portion NE when the dielectric waveguide filter 1F is mounted on the mounting substrate 70. Specifically, the damming portion 77 is provided on the ground pattern 75, and when the dielectric waveguide filter 1F is mounted on the mounting substrate 70, the damming portion 77 overlaps with the electrode non-forming portion NE in a plan view. It is provided in a region including at least a part. On the ground pattern 75 of the mounting substrate 70, an outer frame resist 79 having the same outer shape as that of the dielectric waveguide filter 1F is provided.

  FIG. 8C is a cross-sectional view (a view showing a cut surface) showing a state where the dielectric waveguide filter 1F is mounted on the mounting substrate 70. FIG. As shown in FIG. 8C, since the blocking member 77 is formed on the ground pattern 75 of the mounting substrate 70 in the region corresponding to the electrode non-forming portion NE, the bonding material 76 is formed on the electrode non-forming portion NE. Inflow can be suppressed. By this damming member 77, the gap S1 in the electrode non-forming portion NE can be secured.

  Further, in the dielectric waveguide filter 1F, the dielectric 52 at a location in contact with the electrode non-forming portion NE has a recess. Specifically, the interface 52b between the electrode non-forming portion NE and the dielectric 52 enters the inside of the dielectric 52 more than the interface 52c between the ground electrode 65 and the dielectric 52 on the mounting surface F1 of the resonator 11g. Yes. Thereby, the volume of the electrode non-forming part NE can be increased, and the resonance frequency of the dielectric waveguide filter 1F can be increased. In the dielectric waveguide filter 1F shown in FIG. 8C, the dielectric 52 at the portion in contact with the electrode non-forming portion NE has a recess, but the interface 52b and the interface 52c do not have a recess. They may be on the same plane.

  As in the present embodiment, by providing a blocking member 77 on the ground pattern 75 of the mounting substrate 70 in a region corresponding to the electrode non-forming portion NE, the bonding material 76 flows into the electrode non-forming portion NE. Can be suppressed. As a result, the electrode non-forming portion NE is not completely filled with the bonding material 76, and a space necessary for frequency adjustment can be secured in the electrode non-forming portion NE. Further, the electrode non-forming portion NE is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter 1F can be suppressed.

(Modification 1 of Embodiment 5)
FIG. 9A is a diagram of a dielectric waveguide filter 1G according to Modification 1 of Embodiment 5 as viewed obliquely from below, and FIG. 9B is a perspective view of the mounting substrate 70. FIG. In FIG. 9A (b), the input / output patterns 71 and 72 are not shown.

  As shown in FIG. 9A (a), the dielectric waveguide filter 1G includes a plurality of resonators 11a and 11g. The electrode non-forming portion NE is provided in the resonator 11g, like the dielectric waveguide filter 1F.

  As shown in FIG. 9A (b), a blocking member 77 is provided on the ground pattern 75 of the mounting substrate 70 to block the inflow of the bonding material 76. The damming member 77 is formed of a resist and has a ring shape larger than that of the electrode non-forming portion NE. The damming member 77 is provided in a region corresponding to the electrode non-forming portion NE when the dielectric waveguide filter 1G is mounted on the mounting substrate 70. Specifically, the damming portion 77 is provided on the ground pattern 75, and when the dielectric waveguide filter 1G is mounted on the mounting substrate 70, the damming portion 77 overlaps the electrode non-forming portion NE in plan view. It is provided in a region including the outer periphery. In order to maintain the posture of the dielectric waveguide filter 1G after mounting, the damming member 77 is also provided in a region corresponding to the resonator 11a.

  FIG. 9B is a cross-sectional view (a view showing a cut surface) showing a state in which the dielectric waveguide filter 1G is mounted on the mounting substrate 70. As shown in FIG. 9B, since the blocking member 77 is formed on the ground pattern 75 of the mounting substrate 70 in the region corresponding to the electrode non-forming portion NE, the bonding material 76 is formed on the electrode non-forming portion NE. Inflow can be suppressed. By this damming member 77, the gap S1 in the electrode non-forming portion NE can be secured.

  As in Modification 1, by providing a blocking member 77 on the ground pattern 75 of the mounting substrate 70 in a region corresponding to the electrode non-forming portion NE, the bonding material 76 flows into the electrode non-forming portion NE. This can be suppressed. Accordingly, a space necessary for frequency adjustment can be secured in the electrode non-forming portion NE without filling the electrode non-forming portion NE with the bonding material 76. Further, the electrode non-forming portion NE is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter 1G can be suppressed.

(Modification 2 of Embodiment 5)
FIG. 10 is a cross-sectional view (a view showing a cut surface) illustrating a state where the dielectric waveguide filter 1H according to the second modification of the fifth embodiment is mounted on the mounting substrate 70.

  As shown in FIG. 10, a damming member 77 that dams the inflow of the bonding material 76 is provided on the ground pattern 75 of the mounting substrate 70. The damming member 77 is formed of a resist and has a larger disk shape than the electrode non-forming portion NE. The damming member 77 is provided in a region corresponding to the electrode non-forming portion NE when the dielectric waveguide filter 1H is mounted on the mounting substrate 70. Specifically, the damming portion 77 is provided on the ground pattern 75, and when the dielectric waveguide filter 1H is mounted on the mounting substrate 70, a region overlapping the electrode non-forming portion NE in plan view and It is provided in a region outside the region overlapping with the electrode non-forming portion NE.

  As shown in FIG. 10, since the blocking member 77 is formed on the ground pattern 75 of the mounting substrate 70 in the region corresponding to the electrode non-forming portion NE, the bonding material 76 is formed on the electrode non-forming portion NE. Inflow can be suppressed. By this damming member 77, the gap S1 in the electrode non-forming portion NE can be secured.

  As in Modification 2, by providing a blocking member 77 on the ground pattern 75 of the mounting substrate 70 in a region corresponding to the electrode non-forming portion NE, the bonding material 76 flows into the electrode non-forming portion NE. This can be suppressed. Accordingly, a space necessary for frequency adjustment can be secured in the electrode non-forming portion NE without filling the electrode non-forming portion NE with the bonding material 76. Further, the electrode non-forming portion NE is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter 1H can be suppressed.

  In the fifth embodiment and the first and second modifications of the fifth embodiment, the electrode non-forming portion NE is provided in the resonator 11g that inputs and outputs the high-frequency signal, but the electrode non-forming portion NE is provided. The resonator is not limited to the resonator 11g. For example, in the dielectric waveguide filters 1F, 1G, and 1H, other resonators 11b to 11f are provided between the resonator 11a and the resonator 11g, and at least one resonator of the resonators 11b to 11f is provided. The electrode non-forming part NE may be formed. That is, among the plurality of resonators 11a to 11g, at least one resonator excluding the resonators 11a and 11g to / from which high-frequency signals are input / output has the ground electrode 65 and the ground electrode 65 on the mounting surface F1 of the resonator. The damming portion 77 may be provided on the ground pattern 75 in a region corresponding to the non-electrode forming portion NE.

(Embodiment 6)
A dielectric waveguide filter 1I according to the sixth embodiment will be described. In the dielectric waveguide filter 1I according to the sixth embodiment, the damming portion 78 is provided not on the mounting substrate 70 but on the dielectric waveguide filter 1I.

  FIG. 11 is a diagram of the dielectric waveguide filter 1I viewed from obliquely below.

  As shown in FIG. 11, the dielectric waveguide filter 1I includes a plurality of resonators 11a and 11g. The electrode non-forming portion NE is provided in the resonator 11g, like the dielectric waveguide filter 1F.

  In the present embodiment, a blocking member 78 that blocks the inflow of the bonding material 76 is provided on the mounting surface F1 of the resonator 11g. The damming member 78 is formed of a resist and has a ring shape surrounding the outer periphery of the electrode non-forming portion NE when the resonator 11g is viewed in plan. The damming member 78 is provided so as to protrude from the ground electrode 65. Since the blocking member 78 is formed on the mounting surface F1 of the resonator 11g, when the dielectric waveguide filter 1I is mounted on the mounting substrate 70, the bonding material 76 flows into the electrode non-forming portion NE. Can be suppressed. The damming member 78 can secure the gap S1 in the electrode non-forming portion NE.

  When the dielectric waveguide filter 1I is mounted on the mounting substrate 70 by providing the blocking member 78 on the outer periphery of the electrode non-forming portion NE of the dielectric waveguide filter 1I as in the present embodiment. It is possible to suppress the bonding material 76 from flowing into the electrode non-forming part NE. Thereby, in electrode non-formation part NE, the space required for frequency adjustment is securable. Further, the electrode non-forming portion NE is not exposed to the external space, and the fluctuation of the resonance frequency of the dielectric waveguide filter 1I can be suppressed.

  In the sixth embodiment, the electrode non-forming portion NE is provided in the resonator 11g that receives and outputs a high-frequency signal. However, the resonator in which the electrode non-forming portion NE is provided is not limited to the resonator 11g. . For example, in the dielectric waveguide filter 1I, other resonators 11b to 11f are provided between the resonator 11a and the resonator 11g, and an electrode non-forming portion is provided in at least one of the resonators 11b to 11f. NE may be formed. That is, among the plurality of resonators 11a to 11g, at least one resonator excluding the resonators 11a and 11g to / from which high-frequency signals are input / output has the ground electrode 65 and the ground electrode 65 on the mounting surface F1 of the resonator. The damming portion 78 may be provided on the outer periphery of the electrode non-forming portion NE on the ground electrode 65 of the resonator.

(Embodiment 7)
In the present embodiment, a high-frequency front end circuit 110 including the dielectric waveguide filter according to the first to sixth embodiments and a communication apparatus 100 including the high-frequency front end circuit 110 will be described.

  FIG. 12 is a circuit diagram showing the high-frequency front-end circuit 110 and the communication device 100 according to the seventh embodiment. In the figure, a high-frequency front-end circuit 110, an antenna element 150, an RF signal processing circuit 191 and a baseband signal processing circuit 192 are shown.

  The high frequency front end circuit 110 includes filters 161, 162, and 163, a switch circuit 170, a power amplifier circuit 181, and a low noise amplifier circuit 182.

  The power amplifier circuit 181 is a transmission amplifier circuit that amplifies the high-frequency transmission signal output from the RF signal processing circuit 191 and outputs the amplified signal to the antenna element 150 via the switch circuit 170 and the filter 161.

  The low noise amplifier circuit 182 is a reception amplification circuit that amplifies a high-frequency signal that has passed through the antenna element 150, the filter 161, and the switch circuit 170 and outputs the amplified signal to the RF signal processing circuit 191.

  The filter 161 is an antenna filter that is connected to the antenna element 150 and selectively allows high-frequency signals in the transmission band and the reception band to pass therethrough, for example. The filter 162 is an interstage filter that is disposed between the power amplifier circuit 181 and the RF signal processing circuit 191 and selectively passes a high-frequency signal in the transmission band. The filter 163 is an interstage filter that is disposed between the low noise amplifier circuit 182 and the RF signal processing circuit 191 and selectively passes a high frequency signal in the reception band.

  The switch circuit 170 is a switch that switches connection between the antenna element 150 and a transmission signal path and a reception signal path.

  The RF signal processing circuit 191 is connected to the high frequency front end circuit 110. The RF signal processing circuit 191 is, for example, an RFIC (Radio Frequency Integrated Circuit), and performs signal processing including frequency conversion between a high-frequency signal and a baseband signal. The RF signal processing circuit 191 processes the high-frequency reception signal input from the antenna element 150 via the reception signal path by down-conversion or the like, and the baseband signal processing circuit 192 generates the reception signal generated by the signal processing. Output to. Further, the RF signal processing circuit 191 performs signal processing on the transmission signal input from the baseband signal processing circuit 192 by up-conversion or the like, and outputs the high-frequency transmission signal generated by the signal processing to the power amplifier circuit 181.

  The baseband signal processing circuit 192 is connected to the RF signal processing circuit 191 and performs signal processing on the baseband signal. The signal processed by the baseband signal processing circuit 192 is used, for example, for displaying an image as an image signal or for calling as an audio signal.

  The high-frequency front end circuit 110 may include other circuit elements between the filters 161, 162 and 163, the switch circuit 170, the power amplifier circuit 181, and the low noise amplifier circuit 182.

  Here, in high-frequency front end circuit 110 and communication apparatus 100 according to the present embodiment, dielectric waveguide filters 1-1I according to first to sixth embodiments can be used as filters 161, 162, and 163. .

  According to the configuration described above, fluctuations in the resonance frequency of the filters 161, 162, and 163 can be suppressed, so that deterioration in communication performance of the high-frequency front-end circuit 110 and the communication device 100 can be suppressed.

(Embodiment 8)
In the present embodiment, a Massive MIMO system including the dielectric waveguide filter according to Embodiments 1 to 6 is exemplified.

  FIG. 13 is a circuit diagram showing a Massive MIMO system according to the eighth embodiment. FIG. 14 is a perspective view showing communication apparatus 100A of the Massive MIMO system according to Embodiment 8.

  The communication device 100A includes a plurality of antenna elements 150 arranged in a matrix. The antenna element 150 is configured by a patch antenna.

  Band-pass filters 161a, 161b, and 161c are connected to the antenna element 150. A switch circuit 170a is connected between the filter 161a, the power amplifier circuit 181a, and the low noise amplifier circuit 182a. A switch circuit 170b is connected between the filter 161b, the power amplifier circuit 181b, and the low noise amplifier circuit 182b. A switch circuit 170c is connected between the filter 161c, the power amplifier circuit 181c, and the low noise amplifier circuit 182c. The low noise amplifier circuits 182a, 182b, and 182c are connected to the baseband signal processing circuit 192. A band pass filter 162a and a mixer 194a are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181a. A band-pass filter 162b and a mixer 194b are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181b. A band-pass filter 162c and a mixer 194c are connected between the baseband signal processing circuit 192 and the power amplifier circuit 181c. A local oscillator 193 is connected to the mixers 194a, 194b and 194c. The local oscillator 193 outputs a reference frequency for up-conversion to a high frequency and down-conversion to a low frequency in the mixers 194a to 194c to the mixers 194a to 194c.

  The filters 161a to 161c pass the transmission / reception frequency band and remove other frequency components. The switch circuits 170a to 170c switch between a transmission signal and a reception signal. The filters 162a to 162c pass the frequency band of the transmission signal and remove other frequency components.

  As the filters 161a to 161c and 162a to 162c, for example, the dielectric waveguide filter 1B according to the second embodiment can be used. As shown in FIG. 14, in the communication device 100A, one dielectric waveguide filter 1B is connected to one antenna element 150. According to the above configuration, it is possible to suppress fluctuations in the resonance frequencies of the filters 161a to 161c and 162 to 162c, and thus it is possible to suppress a decrease in communication performance of the communication device 100A of the Massive MIMO system.

(Other forms)
Although the dielectric waveguide filter, the high frequency front end circuit, and the communication device according to the embodiments of the present invention have been described above, the present invention is not limited to the individual embodiments. Unless it deviates from the gist of the present invention, the embodiment in which various modifications conceived by those skilled in the art have been made in the present embodiment, and forms constructed by combining components in different embodiments are also applicable to one or more of the present invention. It may be included within the scope of the embodiments.

  For example, the input / output paths of the dielectric waveguide filters 1 to 1I may be in the opposite direction to the above embodiment. That is, the input / output electrode 62 may be on the input side and the input / output electrode 61 may be on the output side.

  Further, the input / output path P1 of the dielectric waveguide filter 1B is not limited to the path shown in the second embodiment. For example, the input / output path P1 is a path through which a signal input to the input / output electrode 61 is output from the input / output electrode 62 through the resonators 11, 21, 22, 12, 14, 24, 23, and 13 in order. There may be.

  Further, the coupling portion 57 of the resonator 12 of the dielectric waveguide filter 1B is not limited to the portion shown in FIG. 4B, and a plurality of coupling portions 57 may be provided along the outer periphery of the upper surface fb of the resonator 12. In that case, the coupling portion 57 of the resonator 22 may be provided at a position facing the coupling portion 57 of the resonator 12. The same applies to the resonators 14 and 24.

  Further, the input / output path of the dielectric waveguide filter 1B is not limited to magnetic field coupling, and may include electric field coupling. For example, the resonator 12 and the resonator 22 of the dielectric waveguide filter 1B may be electric field coupled, or the resonator 24 and the resonator 14 may be electric field coupled.

  INDUSTRIAL APPLICABILITY The present invention can be widely used in communication devices such as millimeter wave band mobile communication systems and Massive MIMO systems as dielectric waveguide filters that can suppress resonance frequency fluctuations.

1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I Dielectric waveguide filter 10, 20, 30 Resonator group 11, 12, 13, 14, 21, 22, 23, 24, 31 , 32, 33, 34 Resonator 11a, 11b, 11c, 11d, 11e, 11f, 11g Resonator 51, 51a, 51b, 51c, 51d Dielectric block 52 Dielectric 52a Surface 52b, 52c Interface 55, 56, 57 Coupling Portions 61, 62 Input / output electrode 65 Ground electrode 70 Mounting substrate 70a Mounting substrate main surface 71, 72 Input / output pattern 75 Ground pattern 76 Bonding material 77, 78 Damping member 79 Outer frame resist 100, 100A Communication device 110 High frequency front end Circuit 150 Antenna element 161, 161a-161c, 162, 162a-162c, 16 Filter 170, 170a-170c Switch circuit 181, 181a-181c Power amplifier circuit 182, 182a-182c Low noise amplifier circuit 191 RF signal processing circuit 192 Baseband signal processing circuit 193 Local oscillator 194a-194c Mixer A1 Surrounded by the outer periphery of the ground electrode F1 Mounting surface F2 Top surface F3 Contact surface fa Lower surface fb Upper surface fc Side surface P1 I / O path NE Electrode non-forming portion S1 Gap

Claims (20)

A dielectric waveguide filter including a plurality of resonators including a resonator to which a high-frequency signal is input and output,
Each of the plurality of resonators is
A dielectric,
A ground electrode covering at least a part of the surface of the dielectric;
And having
A TE (Transverse Electric) mode resonator in which an electric field is maximized on a mounting surface that is a main surface on the mounting substrate side or a top surface that is a main surface facing the mounting surface;
At least one of the plurality of resonators excluding the resonator to / from which the high-frequency signal is input / output is not formed on the mounting surface of the resonator with the ground electrode and the electrode on which the ground electrode is not formed. And
When the mounting surface of the resonator is viewed in plan, the electrode non-forming portion is surrounded by the ground electrode in the resonator.
Dielectric waveguide filter. The electrode non-forming portion includes a gap,
The dielectric waveguide filter according to claim 1. The interface between the electrode non-forming portion and the dielectric material enters the inside of the dielectric material from the interface between the ground electrode and the dielectric material on the mounting surface of the resonator.
The dielectric waveguide filter according to claim 1 or 2. The electrode non-forming portion is provided in a region including the center of the resonator when viewed from a direction perpendicular to the mounting surface.
The dielectric waveguide filter according to claim 1. One or more resonators different from the plurality of resonators are further provided on the plurality of resonators.
The dielectric waveguide filter according to any one of claims 1 to 4. Further comprising the mounting substrate,
The electrode non-formation part is covered with the mounting substrate and the ground electrode in the resonator,
The dielectric waveguide filter according to claim 1. The mounting substrate has a ground pattern on the main surface on the mounting surface side,
The electrode non-forming portion is covered with the ground pattern and the ground electrode in the resonator,
The dielectric waveguide filter according to claim 6. The ground pattern and the ground electrode in the resonator are bonded by a bonding material, and a dam that blocks the inflow of the bonding material on the ground pattern and in a region corresponding to the non-electrode forming portion. A stop member is provided,
The dielectric waveguide filter according to claim 7. A damming member protruding from the ground electrode is provided on the outer periphery of the electrode non-formation portion on the ground electrode of the resonator when the resonator is viewed in plan view.
The dielectric waveguide filter according to claim 1. The damming member is formed of a resist.
The dielectric waveguide filter according to claim 8 or 9. A lower resonator group including one or more resonators arranged in a predetermined plane, and an upper side including one or more resonators arranged on the lower resonator group in the vertical direction perpendicular to the predetermined plane. A dielectric waveguide filter comprising:
Each of the resonators in the lower resonator group and the resonators in the upper resonator group is:
A dielectric,
A ground electrode covering at least a part of the surface of the dielectric;
And having
A TE (Transverse Electric) mode resonator in which an electric field is maximized on a contact surface where the resonators arranged in the vertical direction contact each other or a surface facing the contact surface;
At least one of the resonators in the lower resonator group and the resonators in the upper resonator group is not formed with the ground electrode and the ground electrode on the contact surface of the resonator. An electrode non-forming part,
When the contact surface of the resonator is viewed in plan, the electrode non-forming portion is surrounded by the ground electrode in the resonator.
Dielectric waveguide filter. The electrode non-forming portion includes a gap,
The dielectric waveguide filter according to claim 11. The interface between the electrode non-forming portion and the dielectric material enters the inside of the dielectric material more than the interface between the ground electrode and the dielectric material at the contact surface of the resonator.
The dielectric waveguide filter according to claim 11 or 12. The electrode non-formation portion is provided in a region including the center of the resonator when viewed from a direction perpendicular to the contact surface.
The dielectric waveguide filter according to any one of claims 11 to 13. The electrode non-forming portion is covered with the ground electrode in the resonator and a resonator different from itself among the resonators arranged in the vertical direction.
The dielectric waveguide filter according to claim 11. The electrode non-forming portion is covered with the ground electrode in the resonator and a ground electrode of a resonator different from itself among the resonators arranged in the vertical direction.
The dielectric waveguide filter according to claim 15. The resonators arranged in the vertical direction are magnetically coupled to each other,
The dielectric waveguide filter according to any one of claims 11 to 16. The dielectric waveguide filter according to any one of claims 1 to 17, which is connected to an antenna element;
A transmission amplifier circuit for amplifying a high-frequency transmission signal to be transmitted to the antenna element;
A reception amplification circuit for amplifying a high-frequency reception signal received by the antenna element;
A switch circuit for switching connection between the transmission amplifier circuit and the reception amplifier circuit, and the dielectric waveguide filter;
High frequency front-end circuit with A transmission amplifier circuit for amplifying a high-frequency transmission signal output from the RF signal processing circuit;
A reception amplification circuit that amplifies a high-frequency reception signal and outputs the amplified signal to the RF signal processing circuit;
18. The dielectric conductor according to claim 1, disposed between the RF signal processing circuit and the transmission amplifier circuit, or between the RF signal processing circuit and the reception amplifier circuit. A wave tube filter,
High frequency front-end circuit with An antenna element;
The high-frequency front-end circuit according to claim 18 or 19, wherein the high-frequency front-end circuit is connected to the antenna element and amplifies a high-frequency signal transmitted and received by the antenna element.
An RF signal processing circuit connected to the high-frequency front-end circuit for performing signal processing including frequency conversion between the high-frequency signal and a baseband signal;
A baseband signal processing circuit connected to the RF signal processing circuit and processing the baseband signal;
A communication device comprising:

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