WO2018086108A1 - Système de refroidissement de blindage électromagnétique, et aéronef sans pilote - Google Patents

Système de refroidissement de blindage électromagnétique, et aéronef sans pilote Download PDF

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Publication number
WO2018086108A1
WO2018086108A1 PCT/CN2016/105676 CN2016105676W WO2018086108A1 WO 2018086108 A1 WO2018086108 A1 WO 2018086108A1 CN 2016105676 W CN2016105676 W CN 2016105676W WO 2018086108 A1 WO2018086108 A1 WO 2018086108A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
shield
fin
disposed
Prior art date
Application number
PCT/CN2016/105676
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English (en)
Chinese (zh)
Inventor
郭晓凯
彭涛
才志伟
欧迪
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201680002513.3A priority Critical patent/CN107079607B/zh
Priority to PCT/CN2016/105676 priority patent/WO2018086108A1/fr
Publication of WO2018086108A1 publication Critical patent/WO2018086108A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening

Definitions

  • the invention relates to the technical field of drones, in particular to an electromagnetic shielding heat dissipation system and a drone.
  • the heat dissipation system and the electromagnetic shielding system are separately and separately set, which occupy a relatively large space and are not suitable for a drone with a smaller and smaller volume.
  • the technical problem to be solved by the present invention is to provide an electromagnetic shielding heat dissipation system and a drone, which can solve the problem that the heat dissipation system and the electromagnetic shielding system are separately disposed separately.
  • an electromagnetic shielding heat dissipation system comprising: a shielding cover for electromagnetic shielding of a first circuit component disposed on one side of the shielding cover; The set is fixedly disposed on the first surface of the shield away from the other side of the first circuit component.
  • the shield is made of a heat conductive material.
  • the heat dissipation rate of the heat dissipation fin group is greater than the thermal conductivity of the shielding cover.
  • the second surface adjacent to the first circuit component of the shielding cover is provided with at least one heat conducting portion, and the heat conducting portion is in contact with the heat source of the first circuit component.
  • the heat conductive portion is attached or soldered with a heat conductive metal sheet and/or a heat conductive grease coated on the surface of the heat source contacting the first circuit component with the heat conductive portion.
  • the heat sink fin set is soldered to the first surface of the shield.
  • the heat dissipation fin group includes a plurality of heat dissipation fins, and the heat dissipation fins respectively include a contact portion, a connecting portion and a lateral extension portion, wherein the contact portion is fixed on the first surface of the shielding cover, and one end of the connection portion is in contact with Connecting, and extending away from the first surface of the shield, the other end of the connecting portion is connected to the lateral extension, wherein the projection of the lateral extension on the first surface of the shield is greater than the first surface of the shield on the shield Projection on.
  • the contact portion is disposed on the first surface of the shielding cover
  • the connecting portion is disposed perpendicular to the first surface of the shielding cover
  • the lateral extending portion is disposed in parallel with the first surface of the shielding cover.
  • connection portion and the lateral extension are located on the same side of the connection portion.
  • the electromagnetic shielding heat dissipation system further includes a fan for supplying airflow to the plurality of heat dissipation fins.
  • the plurality of heat dissipation fins are further divided into a first heat dissipation fin and a second heat dissipation fin, wherein the connection portion of the second heat dissipation fin is inclined with respect to the connection portion of the first heat dissipation fin, thereby changing the heat dissipation from the first The flow of the airflow from the fins.
  • the second heat dissipation fins and the first heat dissipation fins are disposed in one-to-one correspondence, so that the airflow flowing out between the adjacent two first heat dissipation fins enters between the corresponding adjacent two second heat dissipation fins.
  • the electromagnetic shielding heat dissipation system further includes a heat pipe for thermally connecting the first heat dissipation fin and the second heat dissipation fin.
  • the second heat dissipation fin and the first heat dissipation fin are disposed one-to-many such that the airflow flowing out from between the plurality of first heat dissipation fins is changed by the connection portion of the same second heat dissipation fin.
  • the second heat dissipation fin is arranged to guide the airflow to the second circuit component disposed on the other side of the shield.
  • the electromagnetic shielding heat dissipation system further includes: an air guiding cover disposed between the fan and the heat dissipation fin group for guiding the airflow generated by the fan to the heat dissipation fin group.
  • an unmanned aerial vehicle including an electromagnetic shielding heat dissipation system
  • the electromagnetic shielding heat dissipation system includes: a shielding cover for the side disposed on one side of the shielding cover A circuit component performs electromagnetic shielding; the heat dissipation fin set is fixedly disposed on the first surface of the shielding cover away from the other side of the first circuit component.
  • the shield is made of a heat conductive material.
  • the heat dissipation rate of the heat dissipation fin group is greater than the thermal conductivity of the shielding cover.
  • the second surface adjacent to the first circuit component of the shielding cover is provided with at least one heat conducting portion, and the heat conducting portion is in contact with the heat source of the first circuit component.
  • the heat conductive portion is attached or soldered with a heat conductive metal sheet and/or a heat conductive grease coated on the surface of the heat source contacting the first circuit component with the heat conductive portion.
  • the heat sink fin set is soldered to the first surface of the shield.
  • the heat dissipation fin group includes a plurality of heat dissipation fins, and the heat dissipation fins respectively include a contact portion, a connecting portion and a lateral extension portion, wherein the contact portion is fixed on the first surface of the shielding cover, and one end of the connection portion is connected to the contact portion. And extending away from the first surface of the shield, the other end of the connecting portion is connected to the lateral extension, wherein the projection of the lateral extension on the first surface of the shield is greater than the projection of the connecting portion on the first surface of the shield .
  • the contact portion is disposed on the first surface of the shielding cover
  • the connecting portion is disposed perpendicular to the first surface of the shielding cover
  • the lateral extending portion is disposed in parallel with the first surface of the shielding cover.
  • connection portion and the lateral extension are located on the same side of the connection portion.
  • the electromagnetic shielding heat dissipation system further includes a fan for supplying airflow to the plurality of heat dissipation fins.
  • the plurality of heat dissipation fins are further divided into a first heat dissipation fin and a second heat dissipation fin, wherein the connection portion of the second heat dissipation fin is inclined with respect to the connection portion of the first heat dissipation fin, thereby changing the heat dissipation from the first The flow of the airflow from the fins.
  • the second heat dissipation fins and the first heat dissipation fins are disposed in one-to-one correspondence, so that the airflow flowing out between the adjacent two first heat dissipation fins enters between the corresponding adjacent two second heat dissipation fins.
  • the electromagnetic shielding heat dissipation system further includes a heat pipe for thermally connecting the first heat dissipation fin and the second heat dissipation fin.
  • the second heat dissipation fin and the first heat dissipation fin are disposed one-to-many such that the airflow flowing out from between the plurality of first heat dissipation fins is changed by the connection portion of the same second heat dissipation fin.
  • the second heat dissipation fin is arranged to guide the airflow to the second electricity disposed on the other side of the shielding cover Road components.
  • the electromagnetic shielding heat dissipation system further includes: an air guiding cover disposed between the fan and the heat dissipation fin group for guiding the airflow generated by the fan to the heat dissipation fin group.
  • the first circuit component is a camera chipset of the drone
  • the second circuit component is an inertial navigation system of the drone.
  • the present invention fixes the heat dissipation fin set on the first surface of the shielding cover away from the other side of the first circuit component, so that the shielding cover pair is disposed on the shielding While the first circuit component on one side of the cover is electromagnetically shielded, the heat dissipation fin group can conduct heat of the surface of the shielding cover, thereby achieving good heat dissipation effect on the basis of taking into consideration electromagnetic shielding, and electromagnetic shielding and heat dissipation are integrally provided, effectively Reduce the space occupied.
  • FIG. 1 is a schematic structural view of a first embodiment of an electromagnetic shielding heat dissipation system of the present invention
  • Figure 2 is a schematic view showing the structure of the first surface of the shield cover of Figure 1;
  • Figure 3 is a schematic structural view of the second surface of one side of the shield cover of Figure 1;
  • Figure 4 is a cross-sectional view of the heat sink fin of Figure 1;
  • FIG. 5 is a schematic structural view of a second embodiment of an electromagnetic shielding heat dissipation system of the present invention.
  • Figure 6 is a schematic view showing the structure of an embodiment of the drone of the present invention.
  • FIG. 1 is a schematic structural view of a first embodiment of an electromagnetic shielding heat dissipation system according to the present invention.
  • the electromagnetic shielding system 10 of the present invention includes a shield case 101 and a heat dissipation fin set 102.
  • the shield cover 101 is configured to electromagnetically shield the first circuit component 103 disposed on one side of the shield cover 101; the heat dissipation fin set 102 is fixedly disposed on the shield cover 101 away from the first On the first surface 1011 of the other side of a circuit assembly 103.
  • the shield cover 101 is made of a conductive metal material, and the absorption effect (eddy current loss) of the electromagnetic signal by the conductive metal, the reflection effect (the electromagnetic signal is reflected at the interface between the shield cover 101 and the air) and the offset function (electricity)
  • the magnetic induction generates a reverse electromagnetic field on the shield 101 to cancel part of the electromagnetic signal), thereby reducing or eliminating the electromagnetic interference of the electromagnetic signal generated by the first circuit component 103 to the external circuit or the electromagnetic of the external electromagnetic signal to the first circuit component 103. interference.
  • the first circuit component 103 disposed on one side of the shield case 101 is a circuit component that easily interferes with other circuits, such as a camera chip set.
  • other circuits such as a camera chip set.
  • the electromagnetic signal interference usually affects the normal operation of the circuit, such as the influence. The quality of the image taken by the camera. Therefore, the circuit component that is easy to generate electromagnetic signal interference to other circuits is disposed on one side of the shield cover 101, and the shielding effect of the shield cover 101 is utilized, so that the electromagnetic signal generated by the shield cover 101 cannot continue to propagate through the shield cover, thereby reducing the first circuit.
  • the electromagnetic signal generated by the component 103 electromagnetic interference with an external circuit.
  • the shield cover 101 may be made of copper or a conductive metal such as aluminum, and is not specifically limited herein.
  • the shield case 101 is made of a heat conductive material, and the heat dissipation fin group 102 has a thermal conductivity greater than that of the shield case 101.
  • Thermal conductivity also known as thermal conductivity or thermal conductivity, refers to the amount of heat transferred per unit of time through a unit heat transfer surface per unit temperature gradient (1K reduction in length over 1 m), which is the physical quantity indicating the thermal conductivity of the material. Since the shield 101 is typically made of a conductive metal, the conductive metal generally has thermal conductivity, but the thermal conductivity of different metals or alloys varies.
  • the heat dissipation fin group 102 is made of a material having a high thermal conductivity, such as aluminum, and the shield 101 is made of a material having a lower thermal conductivity than the heat dissipation fin group 102, such as a white copper. Since the heat dissipation fin group 102 is fixedly disposed on the first surface 1011 of the shield cover 101 away from the other side of the first circuit component 103, and the heat dissipation rate of the heat dissipation fin group 102 is greater than the thermal conductivity of the shield cover 101, the shield cover The heat on the 101 can be transferred to the heat sink fin set 102 more quickly, improving heat dissipation efficiency.
  • the second surface 1012 of the shield 101 adjacent to the first circuit component 103 is shown. At least one thermally conductive portion 1012a is provided, the thermally conductive portion 1012a being in contact with a heat source of the first circuit component 103.
  • the heat conductive portion 1012a is attached or soldered with a heat conductive metal sheet and/or a heat conductive portion of the heat source portion 1012a contacting the heat source surface of the first circuit assembly 103.
  • Thermal grease is a kind of high thermal conductivity insulating silicone material. It is made of organic silicone as the main raw material. It is a material with excellent heat resistance and thermal conductivity. It can maintain the grease state at the temperature of -50 °C ⁇ 230 °C for a long time. Thermal grease has excellent electrical insulation and thermal conductivity, and can be widely applied to various electronic products, the contact surface between the heating element and the heat dissipation device in the electrical equipment, acting as a heat transfer medium and preventing moisture, dust, and defense. Corrosion, shockproof and other properties.
  • the first circuit component 103 is a camera chipset
  • the second surface 1012 of the shield 101 adjacent to the first circuit component 103 is provided with four heat conducting portions 1012a1, 1012a2, 1012a3, and 1012a4, wherein The heat conducting portion 1012a1 is welded with a heat conductive aluminum sheet, and the other heat conducting portions 1012a2, 1012a3 and 1012a4 contact the heat conductive grease applied to the heat source surface of the first circuit component 103.
  • the heat conductive aluminum piece welded on the heat conducting portion 1012a1 contacts the camera image processing chip of the first circuit component 103, and the heat source of the other heat conducting portions 1012a2, 1012a3, and 1012a4 contacting the first circuit component 103 is another chip or an element that is easy to generate heat, due to camera image processing.
  • the height of the chip from the second surface 1012 is greater than the height of the other heat source from the second surface 1012.
  • the surface of the camera image processing chip can be fully contacted by using a heat conductive aluminum sheet soldered on the heat conducting portion 1012a1, thereby causing the camera image processing chip to generate
  • the heat is more efficiently transferred to the heat-conducting aluminum sheet and then transmitted to the heat-dissipating fin group 102 through the shield cover; while the other heat source and the second surface 1012 are not suitable for soldering the aluminum sheet, so the surface of the heat source, that is, the chip or other component is applied.
  • the thermal grease can also be utilized to transfer heat to the heat sink fin group 102 more efficiently.
  • the second surface 1012 can set the number of the heat conducting portions 1012a according to actual needs, or can be attached or welded to the heat conducting portion 1012a according to actual conditions, or the heat conducting portion 1012a is placed in contact with the first circuit component.
  • the thermal grease applied to the surface of the heat source of 103 is not specifically limited herein.
  • the heat dissipation fin set 102 is soldered to the first surface 1011 of the shield case 101.
  • the heat dissipation fin group 102 includes a plurality of heat dissipation fins 1021 , and the heat dissipation fins 1021 respectively include a contact portion 1021 a , a connecting portion 1021 b and a lateral extending portion 1021 c , wherein the contact portion 1021 a is fixed on the first surface 1011 of the shielding cover 101 , One end of the connecting portion 1021b is connected to the contact portion 1021a and extends away from the first surface 1011 of the shield case 101, and the other end of the connecting portion 1021b is connected to the lateral extending portion 1021c, wherein the lateral extending portion 1021c is at the first of the shield case 101
  • the projection h1 on the surface 1011 is larger than the projection h2 of the connecting portion 1021b on the first surface 1011 of the shield case 101, and the contact portion 1021a and the lateral extending portion 1021c are located on the same side of the connecting portion 1021b.
  • the contact portion 1021a of the heat dissipation fin 1021 is attached to the first surface 1011 of the shield cover 101 by soldering, and one end of the connection portion 1021b of the heat dissipation fin 1021 is connected to the contact portion 1021a. And extending away from the first surface 1011 of the shield 101 and perpendicular to the first surface 1011 of the shield 101, the other end of the connection 1021b is connected to the lateral extension 1021c, and the lateral extension 1021c is opposite to the shield The first surface 1011 of the 101 is disposed in parallel, and the contact portion 1021a and the lateral extending portion 1021c are located on the left side of the connecting portion 1021b.
  • the connecting portion 1021b may be disposed obliquely with respect to the first surface 1011 of the shield cover 101, which is not specifically limited herein.
  • the lateral extension portion 1021c of the heat dissipation fin 1021 can abut against the lateral extension portion 1021c or the connection portion 1021b of the adjacent heat dissipation fins 1021, thereby forming a top end between the two adjacent heat dissipation fins 1021. Closed airflow path.
  • the electromagnetic shielding heat dissipation system 10 further includes a fan 104 for providing airflow to the plurality of heat dissipation fins 1021.
  • the electromagnetic shielding heat dissipation system 10 further includes an air guiding cover 105 disposed between the fan 104 and the heat dissipation fin group 102 for guiding the airflow generated by the fan 104 to the heat dissipation fin group 102.
  • the fan blades of the fan 104 rotate to drive the air to generate airflow, and the airflow generated by the air guiding cover 105 is guided between the heat dissipation fin groups 102 to accelerate the heat dissipation fins.
  • the air in the airflow passage of the 1021 flows, thereby utilizing the airflow to dissipate the fins.
  • the heat on the 1021 is taken out to accelerate the temperature of the surface of the heat dissipation fin 1021, thereby accelerating the temperature of the shield cover 101, and finally achieving the purpose of accelerating the temperature of the circuit assembly and maintaining the stable operation of the circuit assembly.
  • the plurality of heat dissipation fins 1021 are further divided into a first heat dissipation fin 10211 and a second heat dissipation fin 10212 , wherein the connection portion 10212 b of the second heat dissipation fin 10212 is opposite to the first heat dissipation fin
  • the connecting portion 10211b of the 10211 is obliquely disposed to change the flow direction of the airflow flowing out of the first heat radiating fins 10211.
  • the second heat dissipation fins 10212 and the first heat dissipation fins 10211 are disposed one-to-many such that the airflow flowing out between the plurality of first heat dissipation fins 10211 is changed by the connection portion 10212b of the same second heat dissipation fins 10212.
  • the flow direction, and the second heat dissipation fins 10212 are arranged to direct the air flow to the second circuit assembly 106 disposed on the other side of the shield case 101.
  • the lateral extensions 10212c of the second heat dissipation fins 10212 are in the shape of a right-angled triangle and are disposed parallel to the first surface 1011 of the shield 101, wherein the right triangle
  • the strip-shaped oblique side is connected to the connecting portion 10212b, and the connecting portion 10212b of the second heat-dissipating fin 10212 is inclined with respect to the connecting portion 10211b of the first heat-dissipating fin 10211 so as to flow out from between the plurality of first heat-dissipating fins 10211.
  • connection portion 10212b of the same second heat dissipation fin 10212 The air flow is changed by the connection portion 10212b of the same second heat dissipation fin 10212, and the air flow is guided to the second circuit assembly 106 disposed on the other side of the shield 101, thereby reducing the temperature of the second circuit assembly 106 and maintaining The second circuit assembly 106 is stable for operation; wherein the specific air flow direction is as indicated by the direction of the arrow in FIG.
  • the shape of the lateral extension portion 10212c of the second heat dissipation fins 10212 can be set according to specific requirements, and the connection portion 10212b of the second heat dissipation fins 10212 is inclined to the connection portion 10211b of the first heat dissipation fins 10211.
  • the angle can also be set according to the actual situation, and is not specifically limited herein.
  • the second heat dissipation fins and the first heat dissipation fins are disposed one-to-many, and in other embodiments, the second heat dissipation fins and the first heat dissipation fins may also be disposed in one-to-one correspondence.
  • FIG. 5 is a schematic structural view of a second embodiment of the electromagnetic shielding heat dissipation system of the present invention.
  • FIG. 5 is similar to the structure of FIG. 1 and is not described here again. The difference is that the second heat dissipation fins 10212 and the first heat dissipation fins 10211 are disposed one-to-one correspondingly in the electromagnetic shielding heat dissipation system 20 of the present invention, so as to be adjacent to each other. The airflow flowing between the two first heat dissipation fins 10211 enters between the corresponding adjacent two second heat dissipation fins 10212.
  • the second heat dissipation fins 10212 and the first heat dissipation fins 10211 are disposed in one-to-one correspondence, and wherein the connection portion 10212b of the second heat dissipation fins 10212 is disposed obliquely with respect to the connection portion 10211b of the first heat dissipation fins 10211, thereby
  • the airflow flowing out between the two adjacent first heat dissipation fins 10211 enters between the corresponding two adjacent second heat dissipation fins 10212, and finally flows away from the other end of the fan 104, thereby reducing the first circuit component 103 and
  • the purpose of the temperature of the second circuit component 106 is that the specific airflow direction is as indicated by the direction of the arrow in FIG.
  • the inclination direction of the second heat dissipation fins 10212 and the first heat dissipation fins 10211 and the angle between them may be determined according to specific conditions, and are not specifically limited herein.
  • the electromagnetic shielding heat dissipation system 20 further includes a heat pipe 107 for thermally connecting the first heat dissipation fins 10211 and the second heat dissipation fins 10212.
  • the heat pipe 107 is a heat transfer element that realizes heat transfer by means of a phase change of its internal working liquid, generally consisting of a tube shell, a die and a working medium, fully utilizing the principle of heat conduction and the rapid heat transfer property of the phase change working medium, The heat of the hot object is quickly transmitted to the outside of the heat source for heat transfer purposes.
  • the heat pipe 107 is U-shaped, one end is welded to the first surface 1011 of the shield cover 101, and the other end is welded with the first heat dissipation fins 10211 and the second heat dissipation fins 10212, thereby passing through the heat pipe 107.
  • the heat of the first circuit component 103 can be quickly transferred to the first heat sink fins 10211 and the second heat sink fins 10212, thereby carrying away heat by convection of the airflow, ultimately reducing the temperature of the first circuit component 103.
  • the shape of the heat pipe 107 can be set according to specific requirements, and the position of the heat pipe 107 can also be determined according to actual conditions, and is not specifically limited herein.
  • FIG. 6 is a schematic structural diagram of an embodiment of the drone of the present invention.
  • the drone 60 of the present invention includes an electromagnetic shielding heat dissipation system 601.
  • the electromagnetic shielding heat dissipation system 601 can refer to the first or second embodiment of the electromagnetic shielding heat dissipation system of the present invention, and will not be repeated here.
  • the first circuit component 103 is a camera chipset of the drone 60
  • the second circuit component 106 is the inertia of the drone 60.
  • the camera chipset can interfere with the transmission of signals from other external circuit components, such as the transmission of GPS signals, and The signal of the camera chipset is susceptible to the quality of the captured image due to the interference of the external electromagnetic signal. Therefore, the first circuit component 103 is disposed on the side of the shield 101 of the electromagnetic shielding heat dissipation system 601 adjacent to the second surface 1012, and the second circuit component 106 Then, it is fixedly disposed on the first surface 1011 of the shield cover 101.
  • the electromagnetic shielding heat dissipation system 601 serves as both a shielding function and a heat dissipation function for the first circuit component 103, and only serves to dissipate heat to the second circuit component 106.
  • the electromagnetic shielding heat dissipation system 601 is disposed inside the fuselage of the unmanned aerial vehicle 60, and can be fixed to the inside of the airframe of the drone 60 by the buckle of the edge of the circuit board where the first circuit component 103 is located.
  • the electromagnetic shielding heat dissipation system 601 can also be disposed inside the unmanned aerial vehicle 60 in other manners, which is not specifically limited herein.
  • the unmanned aerial vehicle is fixedly disposed on the first surface of the shielding cover away from the other side of the first circuit component through the electromagnetic shielding heat dissipation system, so that the shielding cover is disposed on the shielding cover.
  • the heat dissipation fin group can conduct heat on the surface of the shield cover, thereby achieving good heat dissipation effect on the basis of taking into consideration electromagnetic shielding, and electromagnetic shielding and heat dissipation are integrally provided, thereby effectively reducing the occupation. space.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un système de refroidissement de blindage électromagnétique et un aéronef sans pilote. Le système de refroidissement de blindage électromagnétique comprend : un couvercle (101) de blindage utilisé pour fournir un blindage électromagnétique à un premier ensemble circuit (103) d'un côté du couvercle (101) de blindage ; et un ensemble d'ailettes de refroidissement (102) disposé à demeure sur une première surface (1011) d'un autre côté du couvercle (101) de blindage à l'opposé du premier ensemble circuit (103). De cette manière, la présente invention permet au couvercle de blindage (101) de fournir un blindage électromagnétique à un premier ensemble circuit (103) d'un côté du couvercle (101) de blindage, et permet simultanément à l'ensemble d'ailettes de refroidissement (102) de transférer la chaleur sur une surface du couvercle de blindage (101), garantissant ainsi à la fois un excellent blindage électromagnétique et un effet de refroidissement supérieur, et faisant gagner efficacement de la place en fournissant un blindage électromagnétique et un refroidissement dans une seule entité.
PCT/CN2016/105676 2016-11-14 2016-11-14 Système de refroidissement de blindage électromagnétique, et aéronef sans pilote WO2018086108A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680002513.3A CN107079607B (zh) 2016-11-14 2016-11-14 一种电磁屏蔽散热系统及无人机
PCT/CN2016/105676 WO2018086108A1 (fr) 2016-11-14 2016-11-14 Système de refroidissement de blindage électromagnétique, et aéronef sans pilote

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PCT/CN2016/105676 WO2018086108A1 (fr) 2016-11-14 2016-11-14 Système de refroidissement de blindage électromagnétique, et aéronef sans pilote

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CN112208452A (zh) * 2020-10-23 2021-01-12 辽宁省交通高等专科学校 一种无人驾驶车辆用侧方距离传感装置
CN113075977A (zh) * 2021-03-26 2021-07-06 山东英信计算机技术有限公司 一种服务器节能辅助系统及服务器
CN114007373A (zh) * 2020-11-12 2022-02-01 株洲精工硬质合金有限公司 一种机电设备散热装置

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WO2021016820A1 (fr) * 2019-07-29 2021-02-04 深圳市大疆创新科技有限公司 Dispositif de protection et de dissipation de chaleur et véhicule aérien sans pilote
CN113796174A (zh) * 2020-05-25 2021-12-14 深圳市大疆创新科技有限公司 电子组件及可移动平台

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