WO2018055663A1

WO2018055663A1 - Imaging device and mounting device

Info

Publication number: WO2018055663A1
Application number: PCT/JP2016/077647
Authority: WO
Inventors: 秀晃大木; 聡士大崎; 芳行深谷
Original assignee: 富士機械製造株式会社
Priority date: 2016-09-20
Filing date: 2016-09-20
Publication date: 2018-03-29
Also published as: JP6865227B2; CN109792860A; JPWO2018055663A1; CN109792860B

Abstract

An imaging control unit 52 of a parts camera 40 of the present invention causes a light source 44 for vertical illumination and a light source 47 for side illumination to emit light when imaging a component 90 such that the amount of light received from vertical illumination is less than the amount of light received from side illumination when imaging the component 90 having wiring patterns 95, 96 and terminals 93, 94 having flat surfaces. The amount of light received from vertical illumination is the amount of light emitted from the light source 44 for vertical illumination, reflected by the component 90, and received by an imaging unit 51. Similarly, the amount of light received from side illumination is the amount of light emitted from the light source 47 for side illumination, reflected by the component 90, and received by the imaging unit 51.

Description

Imaging apparatus and mounting apparatus

The present invention relates to an imaging apparatus and a mounting apparatus.

2. Description of the Related Art Conventionally, as an imaging apparatus, an apparatus that performs imaging by irradiating light from illumination means onto an electronic component that is an imaging target is known. For example, Patent Document 1 describes an illumination unit having a three-stage light emitting diode group that irradiates light obliquely on a component. The three-stage light emitting diode groups are attached so that the irradiation directions are at different angles. And it is described that an image suitable for the type and characteristics of the electronic component can be obtained by individually controlling the amount of light for each light emitting diode group.

JP 2005-260268 A

By the way, in a component having a wiring pattern and a terminal having a flat surface, there is a case where it is desired to take an image in which the outer portion of the component and the terminal are copied. However, when such a component is irradiated with light and an image of the component is captured, an unnecessary wiring pattern is captured, which causes a problem such as a decrease in terminal detection accuracy based on the captured image. was there. Patent Document 1 does not describe control of light amount suitable for imaging such a component.

The present invention has been made in order to solve the above-described problems, and has as its main object to capture an image in which the external part of a component and terminals are copied while making it difficult to capture the wiring pattern.

The present invention adopts the following means in order to achieve the above-mentioned main object.

The imaging apparatus of the present invention
An imaging device for imaging a component having a wiring pattern and a terminal having a flat surface,
An imaging unit that images the component based on the received light;
An epi-illumination light source that irradiates light in a direction along the optical axis of the imaging unit with respect to the component;
A side-light source that emits light in a direction inclined from the optical axis of the imaging unit to the component;
The incident light amount, which is the amount of light emitted from the incident light source and reflected by the component and received by the imaging unit, is emitted from the incident light source and reflected by the component and received by the imaging unit. A light emission control unit that emits light from the incident light source and the incident light source at the time of imaging the component, so as to be smaller than an amount of side incident light that is a light amount of
It is equipped with.

In this imaging apparatus, the light emission control unit causes the incident light source and the side light source to emit light during imaging of the component so that the incident light amount is smaller than the incident light amount, and the imaging unit detects the component based on the received light. Take an image. Here, the light from the incident light source is irradiated in a direction along the optical axis of the imaging unit. For this reason, the light emitted from the epi-illumination light source and reflected by the terminal having a flat surface is relatively easy to reach the imaging unit as compared with the light radiated from the epi-illumination light source and reflected from the external part of the component. In other words, using the epi-illumination light source makes it easy to capture an image of a terminal having a flat surface. On the other hand, the light emitted from the incident light source and reflected by the wiring pattern is relatively easy to reach the imaging unit. However, the wiring pattern tends to have a low reflectance as compared with the terminal, for example, the surface is covered with an insulating film. Therefore, by making the incident light received amount smaller than the side received light amount, that is, by preventing the amount of light from the incident light source from becoming too large, it is possible to capture an image of the terminal while making the wiring pattern difficult to see. Further, light from the side light source is emitted in a direction inclined from the optical axis of the imaging unit. For this reason, the light emitted from the side-light source and reflected by the external part of the component is relatively easy to reach the imaging unit compared to the light emitted from the side-light source and reflected from the wiring pattern or terminal. That is, by using the side-emitting light source, it becomes easy to capture an image in which the outer portion of the component is copied. Therefore, by making the amount of incident light received greater than the amount of incident light received, that is, by making the amount of light from the side light source relatively large, it is possible to capture an image of the external part of the component while making the wiring pattern difficult to see. On the other hand, for example, when the incident light incident amount and the side incident light amount at the time of image capturing are equal and large, the external part of the component and the terminal can be copied, but the wiring pattern is also easily captured. Further, for example, when the incident light received amount and the side received light amount at the time of imaging are equal and small, the wiring pattern can be difficult to be seen, but the external part of the component and the terminal are difficult to be seen. As described above, the imaging apparatus according to the present invention makes it difficult to capture the wiring pattern by making the incident light received amount smaller than the incident light received amount, and copies the terminal mainly by the light from the incident light source. It is possible to capture an image in which the external part of the component is captured by light from the projecting light source. “Making the wiring pattern difficult to capture” means that the luminance value of the pixel corresponding to the wiring pattern in the image is reduced.

In the imaging apparatus according to the aspect of the invention, the light emission control unit may control the light emission time of the incident light source and the side light source during the imaging of the component, so that the incident light amount is less than the incident light amount. It may be small. By so doing, it is possible to control the incident light amount and the incident light amount relatively easily as compared with, for example, controlling the power supplied to the incident light source and the incident light source.

In the imaging apparatus according to the aspect of the invention, the light emission control unit may include the incident light source and the incident light source so that the incident light amount is 0.9 times or less of the incident light amount when imaging the component. You may make it light-emit. By doing so, the wiring pattern can be more reliably prevented from being captured. The incident light received light amount may not be 0, but may be 0.1 times or more of the side incident light received amount.

The mounting apparatus of the present invention is
An imaging device of the present invention according to any one of the aspects described above;
A component holding unit capable of holding the component;
A moving unit for moving the component holding unit;
A mounting control unit that performs processing based on an image obtained by the imaging, and processing of controlling the component holding unit and the moving unit to mount the component on a substrate;
It is equipped with.

The mounting apparatus of the present invention includes the imaging apparatus according to any one of the above-described aspects. Therefore, this mounting apparatus can obtain the same effect as that of the above-described imaging apparatus of the present invention, for example, an effect of capturing an image of the external part of the component and the terminal while making it difficult to capture the wiring pattern.

The perspective view of the mounting apparatus 10. FIG. FIG. 2 is a schematic explanatory diagram of a configuration of a parts camera 40. FIG. 3 is a block diagram showing a configuration relating to control of the mounting apparatus 10. The flowchart of a component mounting process routine. Explanatory drawing of the binary image P1 at the time of imaging the components 90 as incident light received amount <side incident received light amount. Explanatory drawing of the binary image P2 at the time of imaging the component 90 by making the incident light received amount and the side received light amount equal and both large. Explanatory drawing of the binary image P3 at the time of imaging the component 90 by making the incident light received amount and the side received light amount equal and both small.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the mounting apparatus 10, FIG. 2 is a schematic explanatory diagram of a configuration of a parts camera 40 provided in the mounting apparatus 10, and FIG. 3 is a block diagram illustrating a configuration related to control of the mounting apparatus 10. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

The mounting apparatus 10 includes a base 12, a mounting apparatus main body 14 installed on the base 12, and a reel unit 70 as a component supply apparatus mounted on the mounting apparatus main body 14.

The mounting apparatus main body 14 is installed to be exchangeable with respect to the base 12. The mounting apparatus main body 14 includes a substrate transport device 18 that transports and holds the substrate 16, a head 24 that can move on the XY plane, and a mechanical chuck 37 that is attached to the head 24 and can move along the Z axis. A parts camera 40 that images the parts gripped by the mechanical chuck 37 and a controller 60 that executes various controls are provided.

The substrate transfer device 18 is provided with

support plates

20 and 20 extending in the left-right direction with a space between the front and rear in FIG. 1 and

conveyor belts

22 and 22 provided on opposite surfaces of the support plates 20 and 20 (see FIG. 1). 1 shows only one of them). The

conveyor belts

22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the

support plates

20 and 20 so as to be endless. The board | substrate 16 is mounted on the upper surface of a pair of

conveyor belts

22 and 22, and is conveyed from the left to the right. The substrate 16 is supported from the back side by a large number of support pins 23 erected.

The head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. A pair of upper and

lower guide rails

28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The

sliders

26 and 30 are driven by

drive motors

26a and 30a (see FIG. 3), respectively. The head 24 incorporates a Z-axis motor 34 and adjusts the height of a mechanical chuck 37 attached to a ball screw 35 extending along the Z-axis by the Z-axis motor 34. Further, the head 24 incorporates a Q-axis motor 36 (see FIG. 3) that rotates the mechanical chuck 37.

The mechanical chuck 37 is a mechanism capable of holding a part by gripping the part. The mechanical chuck 37 includes a pair of front and rear gripping portions 38 projecting downward from the bottom surface of the main body of the mechanical chuck 37, a slider (not shown) that can slide the pair of gripping portions 38 toward and away from each other, and the slider. And a drive motor 39 (see FIG. 3) for driving. The gripping part 38 grips a component by the gripping part 38 approaching each other by the drive motor 39. Further, the mechanical chuck 37 is moved up and down along the Z-axis direction by the Z-axis motor 34 to adjust the height of the component gripped by the grip portion 38. When the mechanical chuck 37 is rotated by the Q-axis motor 36, the orientation of the component gripped by the gripping portion 38 is adjusted.

The parts camera 40 is disposed in front of the support plate 20 on the front side of the substrate transfer device 18. The parts camera 40 has an imaging range above the parts camera 40 and images the parts held by the mechanical chuck 37 from below to generate an image. As shown in FIG. 2, the parts camera 40 controls the illumination unit 41 that irradiates light to the imaging target component, the imaging unit 51 that images the component based on the received light, and the entire part camera 40. An imaging control unit 52.

The illumination unit 41 includes a housing 42, a connecting unit 43, an incident light source 44, a half mirror 46, and a side light source 47. The housing 42 is a bowl-shaped member whose upper surface and lower surface (bottom surface) are opened in an octagonal shape. The housing 42 has a shape in which the opening on the upper surface is larger than the opening on the lower surface, and the internal space tends to increase from the lower surface toward the upper surface. The connecting portion 43 is a cylindrical member that connects the housing 42 and the imaging portion 51. The light emitted from the epi-illumination light source 44 and the light received by the imaging unit 51 pass through the internal space of the connection unit 43. The incident light source 44 is a light source for irradiating the component held by the mechanical chuck 37 with light in a direction along the optical axis 51 a of the imaging unit 51. The incident light source 44 includes a plurality of LEDs 45 that emit light toward the half mirror 46 in a direction perpendicular to the optical axis 51a. The plurality of LEDs 45 are attached to the inner peripheral surface of the connecting portion 43. In this embodiment, the optical axis 51a is along the up-down direction, and the light from the LED 45 is irradiated in the horizontal direction (for example, the left-right direction). The half mirror 46 is disposed inside the connecting portion 43 so as to be inclined from the optical axis 51a (for example, an inclination angle of 45 °). The half mirror 46 reflects the light in the horizontal direction from the incident light source 44 upward. Therefore, the light from the LED 45 of the incident light source 44 is irradiated in the direction along the optical axis 51a of the imaging unit 51 (upward here) after being reflected by the half mirror 46. Further, the half mirror 46 transmits light from above toward the imaging unit 51. The side-emitting light source 47 is a light source for irradiating light on a component held by the mechanical chuck 37 in a direction inclined from the optical axis 51a. The side light source 47 includes an upper light source 47a having a plurality of LEDs 48a, a middle light source 47b having a plurality of LEDs 48b disposed below the upper light source 47a, and a plurality of LEDs 48c disposed below the middle light source 47b. A lower light source 47c. These LEDs 48 a to 48 c are attached to the inner peripheral surface of the housing 42. Each of the LEDs 48a to 48c irradiates light in a direction inclined from the optical axis 51a (an inclination angle from the optical axis 51a is more than 0 ° and less than 90 °). The LED 48a has the largest inclination angle from the optical axis 51a in the irradiation direction of the LEDs 48a to 48c, and the LED 48a emits light in a direction close to the horizontal. Further, the LED 48c has the smallest inclination angle.

The imaging unit 51 includes an optical system such as a lens (not shown) and an imaging element. When the light emitted from the incident light source 44 and the side light source 47 and reflected by the component to be imaged is transmitted through the half mirror 46 and reaches the image capturing unit 51, the image capturing unit 51 receives this light. Then, the imaging unit 51 photoelectrically converts the received light to generate charges corresponding to each pixel in the image, and based on the generated charges, image data that is digital data including information on each pixel is generated. Generate.

The imaging control unit 52 outputs a control signal to the illuminating unit 41 to control light irradiation from the illuminating unit 41, outputs a control signal to the imaging unit 51 to take an image, or captures an image. The image data generated by is output to the controller 60. The imaging control unit 52 controls the value of current that is applied to each of the

LEDs

45, 48 a to 48 c of the illumination unit 41 and the energization time, and the light emission amount and light emission per unit time of the incident light source 44 and the side light source 47. Time can be individually controlled. The imaging control unit 52 can individually control the light emission amount and the light emission time per unit time for each of the upper light source 47a, the middle light source 47b, and the lower light source 47c of the side light source 47.

Here, an example of a part imaged by the parts camera 40 will be described with reference to FIG. In the diagram of the component 90 shown in FIG. 2, the upper diagram is a bottom view of the component 90, and the lower diagram is a front view of the component 90. The component 90 includes a main body portion 91 and a terminal plate 92 used for connection to the substrate when the main body portion 91 is disposed on the substrate. The terminal board 92 is a plate-like member whose lower surface is substantially flat. The terminal board 92 has a quadrangular shape with two corners cut off when viewed from below. Of the cut-off portion, the lower left portion in the upper part of FIG. 2 is referred to as a notch 92a, and the lower right portion is referred to as a notch 92b. On the lower surface of the terminal plate 92,

terminals

93 and 94, a wiring pattern 95 connected to the terminal 93, and a wiring pattern 96 connected to the terminal 94 are disposed. The

terminals

93 and 94 are electrodes connected to, for example, other components or a wiring pattern on the substrate, the surface (here, the lower surface) is flat, and a conductor such as metal is exposed. Further, the terminal 93 and the terminal 94 have polarity, and the terminal 93 and the terminal 94 can be identified by the positional relationship with the

notches

92a and 92b. The

wiring patterns

95 and 96 are wirings for conducting the

terminals

93 and 94 and the inside of the main body 91, and the lower surface is flat and is mainly composed of a conductor such as metal. Further, the surface (here, the lower surface) of the

wiring patterns

95 and 96 is covered with an insulating film in order to prevent a short circuit. Since the

wiring patterns

95 and 96 are covered with an insulating film, the reflectance is lower than that of the

terminals

93 and 94. Further, the terminal plate 92 is made of a material having a lower reflectance than the

terminals

93 and 94 and the

wiring patterns

95 and 96, such as black resin. The parts camera 40 irradiates the lower surface of the terminal plate 92 with light from the illumination unit 41, and the imaging unit 51 receives the reflected light of the light, and images the lower surface of the terminal plate 92. Although details will be described later, the parts camera 40 performs imaging by varying the light emission amount of the illumination unit 41 between the case where the imaging target is the component 90 and the other components.

As shown in FIG. 3, the controller 60 is configured as a microprocessor centered on the CPU 61, and includes a ROM 62 that stores processing programs, an HDD 63 that stores various data, a RAM 64 that is used as a work area, and external devices and electrical signals. An input / output interface 65 and the like for performing exchanges are provided, and these are connected via a bus 66. The controller 60 sends drive signals to the substrate transport device 18, the drive motor 26 a of the X-axis slider 26, the drive motor 30 a of the Y-axis slider 30, the Z-axis motor 34, the Q-axis motor 36, and the drive motor 39 of the mechanical chuck 37. Output. Further, the controller 60 outputs information related to imaging conditions including control amounts of the incident light source 44 and the side illumination light source 47 at the time of imaging to the parts camera 40 and inputs image data from the parts camera 40. . Although not shown, each

slider

26, 30 is equipped with a position sensor (not shown), and the controller 60 inputs position information from these position sensors while driving the

drive motors

26a, 30a of each

slider

26, 30. To control.

The reel unit 70 includes a plurality of reels 72 and is detachably attached to the front side of the mounting apparatus body 14. A tape is wound around each reel 72, and components are held on the surface of the tape along the longitudinal direction of the tape. These parts are protected by a film covering the surface of the tape. Such a tape is unwound from the reel toward the rear, and the film is peeled off at the feeder portion 74 so that the components are exposed. When the gripped portion 38 of the mechanical chuck 37 grips the exposed component, the component is held by the mechanical chuck 37 and can move with the head 24.

The management computer 80 is a computer that manages a production job of the mounting apparatus 10 and is connected to the controller 60 of the mounting apparatus 10 so as to be communicable. The production job is information that defines which components are mounted on which substrate 16 in which order in the mounting apparatus 10 and how many substrates 16 are to be mounted with components. The management computer 80 stores the production job and outputs information included in the production job to the mounting apparatus 10 as necessary.

Next, the operation of the mounting apparatus 10 according to the present embodiment, in particular, the process of mounting the component on the board 16 with the imaging of the component using the parts camera 40 will be described. When the CPU 61 of the controller 60 of the mounting apparatus 10 receives a command from the management computer 80, the CPU 61 first acquires information on the component to be mounted to be mounted from the management computer 80. Next, the CPU 61 performs a component mounting process including a process for imaging a component to be mounted and a process for placing the component on a board. Then, the CPU 61 repeatedly performs processing for acquiring information on the next component to be mounted and component mounting processing until the mounting of all the components on the substrate 16 is completed. In the following, a component mounting process when the component 90 shown in FIG. 2 is a component to be mounted will be described. FIG. 4 is a flowchart illustrating an example of a component mounting process routine. The component mounting process routine of FIG. 4 is stored in the HDD 63. The component mounting process routine of FIG. 4 is started by the controller 60 when the component type of the next component to be mounted acquired from the management computer 80 is the component 90.

When the component mounting process routine of FIG. 4 is started, the CPU 61 sets the control amounts of the incident light source 44 and the incident light source 47 at the time of imaging so that the incident light amount <the side light amount (step S100). Here, the incident light amount is the amount of light emitted from the incident light source 44 and reflected by the component 90 and received by the imaging unit 51. Similarly, the side received light amount is the amount of light emitted from the side light source 47 and reflected by the component 90 and received by the imaging unit 51. The incident light received amount and the side received light amount are respectively integrated values of the received light amount at the time of imaging (for example, the product of the received light amount per unit time and the received light time). In other words, the case where the incident light amount is smaller than the incident light amount, in other words, the average value of the luminance values (e.g., 256 gradation luminance values) of each pixel of the image when only the incident light source 44 emits light. This is a case where the luminance value is smaller than the average value of the luminance values of the respective pixels of the image when only the side light source 47 is emitted for imaging. In the present embodiment, when the component 90 is imaged, only the upper light source 47a of the side light source 47 is caused to emit light. In the present embodiment, the light emission time of the incident light source 44 during imaging (referred to as the incident light emission time t1) and the light emission time of the side light source 47 (only the upper light source 47a here) (referred to as the side emission light time t2). ) Is equal to the incident light received amount and the side received light amount, the values of the currents that the imaging unit 51 supplies to the

LEDs

45 and 48a are determined in advance by experiments. For this reason, in step S100, the CPU 61 sets the incident light emission time t1 and the side light emission time t2 as t1 <t2 as control amounts of the incident light source 44 and the side light source 47. Note that the values of the incident light emission time t1 and the side light emission time t2 may be stored in advance in the HDD 63 in association with the component 90, for example, or may be included in the production job, or the CPU 61 may execute the production job. May be derived based on the information contained in.

When the incident light emission time t1 and the side light emission time t2 are set in step S100, the CPU 61 moves the head 24 and causes the gripping portion 38 of the mechanical chuck 37 to grip the component to be mounted supplied by the reel unit 70 (step S100). S110). Subsequently, the CPU 61 moves the head 24 to move the component held by the mechanical chuck 37 above the parts camera 40 (step S120). Then, the CPU 61 outputs a control signal to the imaging control unit 52 so as to control the illumination unit 41 with the control amounts set here in step S100 (here, the epi-illumination light emission time t1 and the side emission light emission time t2). Step S130). The imaging control unit 52 causes the epi-illumination light source 44 and the side-illumination light source 47 to emit light based on the incident epi-emission time t1 and the side-emission light emission time t2, and causes the imaging unit 51 to generate an image based on the received light. Then, the part gripped by the mechanical chuck 37 is imaged. As a result, an image of the component 90 is captured under the condition that the incident light received amount <the side received light amount. In the present embodiment, the imaging unit 51 generates, for example, grayscale image data in which the luminance value of each pixel is expressed in 256 gradations based on the received light. The imaging control unit 52 outputs the captured image data to the controller 60.

When image data obtained by imaging is input from the imaging control unit 52, the CPU 61 performs predetermined processing based on the image (steps S140 to S180). Specifically, the CPU 61 first binarizes the luminance value of each pixel of the obtained image data to obtain a binary image (step S140). The binarization can be performed by a known method such as a discriminant analysis method (binarization of Otsu).

Here, an example of a binary image obtained from image data obtained by imaging the component 90 will be described. FIG. 5 is an explanatory diagram of a binary image P1 obtained by imaging the component 90 with the incident light received amount <the side received light amount. FIG. 6 is an explanatory diagram of a binary image P2 when the component 90 is imaged as a comparative example, unlike the present embodiment, with the incident light reception amount and the side light reception amount being equal and large. FIG. 7 is an explanatory diagram of a binary image P3 when the component 90 is imaged as a comparative example, unlike the present embodiment, with the incident light received amount and the side received light amount being equal and both small. In FIGS. 5 to 7, the pixel with the smaller luminance value after binarization is represented in black, and the pixel with the larger luminance value after binarization is represented in white.

As can be seen from FIG. 5, in the binary image P1, the outer portion of the component 90 (here, the edge portion of the terminal plate 92 in the bottom view) and the pixels corresponding to the

terminals

93 and 94 are white. On the other hand, in the binary image P1, pixels corresponding to portions other than the edges of the terminal board 92, the

wiring patterns

95 and 96, and portions other than the component 90 (background portion) are black, and the

wiring patterns

95 and 96 are It is not shown. In this way, by imaging the component 90 with the incident light received amount <the side received light amount, a binary image can be obtained in which the

wiring patterns

95 and 96 are not captured and the outer portion of the component 90 and the

terminals

93 and 94 are copied. it can. The reason for this will be described.

First, the light from the incident light source 44 is irradiated in a direction along the optical axis 51a of the imaging unit 51 (here, upward). Thereby, the light irradiated upward from the epi-illumination light source 44 and reflected by the plane portion perpendicular to the optical axis 51a of the component 90 proceeds in the direction along the optical axis 51a (downward here) as it is. Therefore, the light irradiated from the epi-illumination light source 44 and reflected by the

terminals

93 and 94 with flat surfaces is compared with the imaging unit 51 compared to the light radiated from the epi-illumination light source 44 and reflected from the outer portion of the component 90. Easy to reach. That is, the use of the epi-illumination light source 44 makes it easy to capture an image of the

terminals

93 and 94 having flat surfaces. On the other hand, the light emitted from the incident light source 44 and reflected by the

wiring patterns

95 and 96 is relatively easy to reach the imaging unit 51 because the surfaces of the

wiring patterns

95 and 96 are flat. However, the surface of the

wiring patterns

95 and 96 is covered with an insulating film as described above, and the reflectance is lower than that of the

terminals

93 and 94. For this reason, the incident light receiving amount is made smaller than the side incident light receiving amount, that is, the light amount from the incident light source 44 is not increased too much, so that the

wiring patterns

95 and 96 are difficult to be seen while the

terminals

93 and 94 are copied. Images can be taken. In the present embodiment, in an image captured by the imaging unit 51 (here, a grayscale image with 256 gradations), the luminance value of the pixel corresponding to the

terminals

93 and 94 is higher than the threshold value when the image is binarized. The incident light reception amount is set to a small value so that the brightness value of the pixels corresponding to the

wiring patterns

95 and 96 becomes small. Thereby, based on the image picked up by the image pickup unit 51, an image in which the

wiring patterns

95 and 96 are not copied while the

terminals

93 and 94 are copied can be obtained like the binary image P1 in FIG. The value of the incident light amount and the control amount of the incident light source 44 (in this case, the incident light emission time t1) for realizing the value can be determined in advance by experiments, for example.

Further, light from the side-emitting light source 47 (here, the upper light source 47a) is irradiated in a direction inclined from the optical axis 51a of the imaging unit 51. For this reason, the light emitted from the side light source 47 and reflected from the outer portion of the component 90 (here, the edge portion of the terminal plate 92 in the bottom view) is emitted from the side light source 47 and is connected to the

wiring patterns

95 and 96 or the terminals. Compared to the light reflected by 93 and 94, it is relatively easy to reach the imaging unit 51. That is, by using the side-emitting light source 47, it becomes easy to capture an image in which the outer portion of the component 90 is captured. Accordingly, by making the side received light amount larger than the incident light received amount, that is, by making the light amount from the side light source 47 relatively large, the outline of the component 90 can be copied while keeping the

wiring patterns

95 and 96 difficult to be seen. Images can be taken. In the present embodiment, in an image captured by the imaging unit 51 (here, a grayscale image having 256 gradations), the luminance of the pixel corresponding to the outer portion of the component 90 is higher than a threshold value when the image is binarized. The side received light amount is set to a large value as the value increases. Thereby, based on the image imaged by the imaging unit 51, an image in which the outer portion of the component 90 is copied can be obtained as in the binary image P1 of FIG. Such a value of the lateral light reception amount and a control amount (here, the side light emission time t2) of the side light source 47 for realizing the value can be determined in advance by experiments, for example.

On the other hand, for example, when the incident light incident amount and the side incident light amount at the time of imaging are equal and large, the outer portion of the component 90 and the

terminals

93 and 94 can be copied, but the

wiring patterns

95 and 96 are also easily captured. . That is, the luminance value of the pixel corresponding to the

wiring patterns

95 and 96 in the image captured by the imaging unit 51 tends to increase. Therefore, like the binary image P2 in FIG. 6, pixels corresponding to the

wiring patterns

95 and 96 after binarization are likely to be white. For example, when the incident light received amount and the side received light amount are equal and small, the

wiring patterns

95 and 96 can be hard to be seen, but the outer portion of the component 90 and the

terminals

93 and 94 are hard to be seen. That is, the luminance value of the pixel corresponding to the outer shape portion of the component 90 and the

terminals

93 and 94 in the image captured by the imaging unit 51 tends to be small. Therefore, as in the binary image P3 in FIG. 7, pixels corresponding to at least one of the outer portion of the component 90 and the

terminals

93 and 94 after binarization (pixels corresponding to the outer portion of the component 90 in FIG. 7). It tends to turn black. Although illustration is omitted, for example, in contrast to the present embodiment, when imaging is performed with the incident light received amount> the side received light amount, the outer portion of the component 90 is difficult to see and the

wiring patterns

95 and 96 are not shown. It becomes easy. For this reason, for example, if the captured image is binarized, the outer portion of the component 90 is not captured, and an image in which the

terminals

93 and 94 and the

wiring patterns

95 and 96 are captured tends to be obtained.

As described above, the parts camera 40 according to the present embodiment makes it difficult to capture the

wiring patterns

95 and 96 by making the incident light received amount smaller than the side received light amount, and the terminal camera 40 mainly uses the light from the incident light source 44. 93 and 94 can be imaged, and an image in which the outer portion of the component 90 is mainly captured by the light from the side light source 47 can be taken. Then, by binarizing the image, a binary image obtained by copying the outer portion of the component 90 and the

terminals

93 and 94 without the

wiring patterns

95 and 96 appearing like the binary image P1 of FIG. Can do.

When the binary image of the component 90 is obtained in step S140, the CPU 61 acquires information on the component 90 based on the binary image (step S150). In the present embodiment, the CPU 61 detects the outer shape of the component 90, the

terminals

93 and 94, the center of the component 90, and the orientation of the component 90. Specifically, the CPU 61 first detects the outer shape of the component 90 and the

terminals

93 and 94 based on the binary image by pattern matching or the like. Next, the CPU 61 detects the center position of the component 90 based on the detected outer shape. Further, the CPU 61 detects the

notches

92a and 92b based on the detected outer shape, and detects the orientation of the component 90 based on this. In the present embodiment, the

wiring patterns

95 and 96 are not shown in the binary image as shown in FIG. Therefore, for example, compared to the case where the

wiring patterns

95 and 96 are shown in FIG. 6, the CPU 61 erroneously detects that the

wiring patterns

95 and 96 are the outer portion of the component 90 and the

terminals

93 and 94 in step S150. This can be suppressed.

Subsequently, the CPU 61 determines whether there is an abnormality in the component 90 gripped by the gripping part 38 based on the information acquired in step S150 (step S160). If there is an abnormality, the CPU 61 grips the part 90. The component 90 is discarded (step S170), and the processing after step S110 is performed. The CPU 61 determines whether there is an abnormality in the component 90 based on, for example, the outer shape of the component 90 and the shapes of the

terminals

93 and 94. If there is no abnormality in step S160, the CPU 61 derives a correction amount for the mounting position and orientation of the component 90 based on the information acquired in step S150 (step S180). For example, the CPU 61 derives the correction amount of the mounting position of the component 90 on the board 16 based on the detected center position (coordinates) of the component 90. Further, based on the detected orientation of the component 90, the CPU 61 derives a driving amount of the Q-axis motor 36 (amount of rotation of the component 90) necessary for mounting the component 90 on the substrate 16 as a direction correction amount. Then, the CPU 61 places the component 90 on the substrate 16 in consideration of the derived mounting position and orientation correction amount (step S190), and ends the component mounting processing routine. As described above, since the CPU 61 can be prevented from erroneously detecting the

wiring patterns

95 and 96 as the outer portion of the component 90 and the

terminals

93 and 94 in step S150, the CPU 61 is also accurate in the processes in steps S160 and S180. Can be done well.

Note that the CPU 61 performs the component mounting process performed on the components of the component types other than the component 90 in the same manner as the component mounting process routine of FIG. However, the control amounts of the incident light source and the side light source in step S100 are predetermined for each component type, and the CPU 61 sets a control amount according to the component type to be mounted. For example, for a component type that does not have a wiring pattern and has only a terminal unlike the component 90, the CPU 61 may set t1 = t2 in step S100 so that the incident light received amount = the side received light amount. . The contents of the processes in steps S150 to S180 are also predetermined for each component type, and the CPU 61 performs a process according to the component type to be mounted. Information predetermined for each of these component types may be stored in advance in the HDD 63, for example, or may be included in a production job.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The parts camera 40 of the present embodiment corresponds to the imaging device of the present invention, the imaging unit 51 corresponds to the imaging unit, the incident light source 44 corresponds to the incident light source, and the lateral light source 47 serves as the lateral light source. The imaging control unit 52 corresponds to the light emission control unit. The mechanical chuck 37 corresponds to a component holding unit, the X-axis slider 26 and the Y-axis slider 30 correspond to a moving unit, and the controller 60 corresponds to a mounting control unit.

According to the parts camera 40 of the mounting apparatus 10 of the present embodiment described in detail above, the imaging control unit 52 reflects the incident light when imaging the component 90 having the

wiring patterns

95 and 96 and the

terminals

93 and 94 having flat surfaces. The incident light source 44 and the side light source 47 are caused to emit light when the component 90 is imaged so that the amount of received light is smaller than the amount of side light received. Thereby, it is possible to capture an image in which the outer portion of the component 90 and the

terminals

93 and 94 are copied while making the

wiring patterns

95 and 96 difficult to see.

In addition, the imaging control unit 52 controls the light emission time (t1, t2) of the incident light source 44 and the side light source 47 when imaging the component 90, thereby reducing the incident light amount to be smaller than the incident light amount. . Therefore, for example, the incident light amount and the incident light amount can be controlled relatively easily as compared with the case where the power supplied to the incident light source 44 and the side light source 47 is controlled.

In addition, when the luminance value of the pixel is binarized, the imaging control unit 52 includes pixels corresponding to the

wiring patterns

95 and 96 on the low luminance side, and corresponds to the pixels corresponding to the

terminals

93 and 94 and the outline portion of the component 90. The epi-illumination light source 44 and the side of the epi-illumination light source 44 and the side so as to obtain predetermined epi-illumination light reception amount and side-radiation light reception amount so as to obtain an image in which the pixel to be included is included on the high luminance side (for example, the binary image P1 in FIG. 5). The projecting light source 47 emits light. Therefore, by binarizing, it is possible to capture an image that can eliminate the

wiring patterns

95 and 96.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the embodiment described above, the incident light received amount and the side incident received light amount correspond to the

terminals

93 and 94 when the luminance values of the pixels are binarized and the pixels corresponding to the

wiring patterns

95 and 96 are included on the low luminance side. However, the present invention is not limited to this. If the incident light amount is smaller than the incident light amount, the predetermined pixels may be obtained. Good. For example, the imaging control unit 52 may cause the incident light source 44 and the incident light source 47 to emit light so that the incident light amount is 0.9 times or less of the incident light amount when the component 90 is imaged. By doing so, the

wiring patterns

95 and 96 can be more reliably prevented from being captured. The incident light received amount may be 0.8 times or less of the side received light amount, or 0.7 times or less. The incident light received light amount may not be 0, but may be 0.1 times or more of the side incident light received amount. The incident light received amount may be 0.3 times or more of the side received light amount, or may be 0.5 times or more.

Alternatively, the imaging control unit 52 may obtain an image in a state where the maximum value of the luminance value of the pixels corresponding to the

wiring patterns

95 and 96 is smaller than the minimum value of the luminance value of the pixels corresponding to the outer shape portion of the component 90 in advance. The incident light source 44 and the incident light source 47 may emit light so that the incident incident light amount and the incident incident light amount are set. By doing so, it is possible to capture an image in which the

wiring patterns

95 and 96 are hardly captured so that the outer portion of the component 90 and the

wiring patterns

95 and 96 can be easily distinguished based on the luminance value. In this case, the imaging control unit 52 has a predetermined incident light amount and incident light amount so as to obtain an image in which the luminance values of the pixels corresponding to the

wiring patterns

95 and 96 are the smallest among all the pixels. As described above, the incident light source 44 and the side light source 47 may emit light. By so doing, it is possible to capture an image in which the

wiring patterns

95 and 96 are more difficult to be captured.

Alternatively, the imaging control unit 52 may have a predetermined incident light amount and side incident light amount so that the

wiring patterns

95 and 96 are not captured and an image in which the outer portion of the component 90 and the

terminals

93 and 94 are captured can be obtained. Further, the incident light source 44 and the side light source 47 may emit light. By doing so, it is possible to obtain an image in which the

wiring patterns

95 and 96 that do not require imaging are not shown. The image in which the

wiring patterns

95 and 96 are not shown may be, for example, a binary image in which pixels corresponding to the

wiring patterns

95 and 96 are included on the low luminance side as in the above-described embodiment. Also, an image in which the luminance values of the pixels corresponding to the

wiring patterns

95 and 96 can be regarded as the same as the luminance values of the surrounding pixels (in other words, an image in which the pixels of the

wiring patterns

95 and 96 cannot be specified even if image processing is performed). Alternatively, the pixel corresponding to the

wiring patterns

95 and 96 may be the pixel having the smallest luminance value among all the pixels, or the luminance value of the pixel corresponding to the

wiring patterns

95 and 96 is 0 (black). It may be an image.

In the above-described embodiment, the imaging control unit 52 controls the incident light emission time t1 and the side light emission time t2 so that the incident light reception amount is less than the side incident light reception amount, but is not limited thereto. For example, instead of controlling the incident light emission time t1 and the side light emission time t2, that is, the continuous light emission time, the imaging control unit 52 determines the duty of the light emission time and the non-light emission time of the incident light source 44 and the side light source 47. The ratio may be controlled so that the incident light received amount <the side received light amount. That is, it is assumed that the incident light source 44 and the side light source 47 repeat light emission and non-light emission in one imaging, and the imaging control unit 52 is a ratio of the light emission time in one cycle of this light emission and non-light emission (= (Duty ratio) may be controlled so that the incident light received amount <the side received light amount. Alternatively, the imaging control unit 52 may control the current supplied to the incident light source 44 and the side light source 47 so that the incident light amount <the incident light amount.

In the above-described embodiment, the image captured by the imaging unit 51 is a grayscale image. The CPU 61 binarizes the image in step S140 and then acquires information regarding the component 90 in step S150. However, the present invention is not limited to this. For example, the CPU 61 may acquire information on the component 90 (for example, the outer shape of the component 90 and the shapes of the terminals 93 and 94) by performing pattern matching or edge detection on the grayscale image. Even in this case, by setting the incident light received amount <the side received light amount, the

wiring patterns

95 and 96 in the grayscale image are hardly captured (the luminance value of the pixel corresponding to the

wiring patterns

95 and 96 is small). Therefore, similarly to the above-described embodiment, for example, erroneous detection when the CPU 61 acquires information on the component 90 can be suppressed. Note that the image captured by the imaging unit 51 may be a color image or a binary image.

In the above-described embodiment, when imaging the component 90, the imaging control unit 52 emits only the upper light source 47a among the side light sources 47. However, the present invention is not limited to this, and the upper light source 47a and the middle light source are not particularly limited. At least one of the light source 47b and the lower light source 47c may be caused to emit light. However, the use of a light source whose inclination angle from the optical axis 51a is close to 90 ° tends to capture an image of the external part of the component 90 while the

wiring patterns

95 and 96 are difficult to be seen. For this reason, it is preferable to emit light from a light source having an inclination angle closest to 90 ° (in the above-described embodiment, the upper light source 47a).

In the above-described embodiment, the component 90 is exemplified as an object to be imaged so that the incident light received amount is smaller than the side received light amount. However, the component to be imaged is not limited to this. If the component has a wiring pattern and a terminal having a flat surface, and it is not necessary to detect the wiring pattern and it is necessary to detect the outer portion of the component and the terminal, the incident light amount < The same effect can be obtained by using the side light reception amount. For example, unlike the component 90, the component to be imaged may be a component having no polarity at a plurality of terminals. In addition, the part 90 has an outer shape (an edge portion in the bottom view of the terminal plate 92) having a right-angled corner. However, the present invention is not limited to this, and the outer shape of the component to be imaged is chamfered. The shape of the part may be a slope inclined from the optical axis 51a.

In the above-described embodiment, the mounting apparatus 10 includes the mechanical chuck 37 that grips a component, but is not limited thereto as long as the component can be held. For example, the mounting apparatus 10 may include a suction nozzle that sucks and holds components instead of the mechanical chuck 37.

In the above-described embodiment, the controller 60 sets the control amounts of the incident light source 44 and the side light source 47, but the present invention is not limited to this. For example, the imaging control unit 52 may determine the control amount.

The present invention can be used for a mounting apparatus for mounting components on a substrate.

10 mounting device, 12 base, 14 mounting device body, 16 substrate, 18 substrate transport device, 20 support plate, 22 conveyor belt, 23 support pin, 24 head, 26 X axis slider, 26a drive motor, 28 guide rail, 30 Y-axis slider, 30a drive motor, 32 guide rail, 34 Z-axis motor, 35 ball screw, 36 Q-axis motor, 37 mechanical chuck, 38 gripping part, 39 drive motor, 40 parts camera, 41 illumination part, 42 housing, 43 connection Part, 44 incident light source, 45 LED, 46 half mirror, 47 side illumination light source, 47a upper stage light source, 47b middle stage light source, 47c lower stage light source, 48a to 48c LED, 51 imaging unit, 51a optical axis, 52 imaging control unit, 60 controllers, 61 PU, 62 ROM, 63 HDD, 64 RAM, 65 I / O interface, 66 bus, 70 reel unit, 72 reel, 74 feeder section, 80 management computer, 90 parts, 91 main body section, 92 terminal board, 92a, 92b cutout Part, 93, 94 terminals, 95, 96 wiring pattern, P1-P3 binary image.

Claims

An imaging device for imaging a component having a wiring pattern and a terminal having a flat surface,
An imaging unit that images the component based on the received light;
An incident light source for irradiating the component with light in a direction along the optical axis of the imaging unit;
A side-light source for irradiating the component with light in a direction inclined from the optical axis of the imaging unit;
The incident light amount, which is the amount of light emitted from the incident light source and reflected by the component and received by the imaging unit, is emitted from the incident light source and reflected by the component and received by the imaging unit. A light emission control unit that emits the incident light source and the incident light source at the time of imaging the component, so as to be smaller than a side received light amount that is a light amount of
An imaging apparatus comprising:
The light emission control unit makes the incident light reception amount smaller than the incident light reception amount by controlling the light emission time of the incident light source and the side light source during imaging of the component,
The imaging device according to claim 1.
The light emission control unit causes the incident light source and the incident light source to emit light so that the incident light amount is 0.9 times or less of the incident light amount when imaging the component.
The imaging device according to claim 1 or 2.
The imaging apparatus according to any one of claims 1 to 3,
A component holding unit capable of holding the component;
A moving unit for moving the component holding unit;
A mounting control unit that performs processing based on an image obtained by the imaging, and processing of controlling the component holding unit and the moving unit to mount the component on a substrate;
Mounting device.