WO2018053823A1

WO2018053823A1 - Heat dispersion structure, and unmanned aerial vehicle provided with heat dispersion structure

Info

Publication number: WO2018053823A1
Application number: PCT/CN2016/100070
Authority: WO
Inventors: 彭涛; 欧迪; 才志伟; 郭晓凯
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2016-09-26
Filing date: 2016-09-26
Publication date: 2018-03-29
Also published as: CN107079608B; CN107079608A

Abstract

A heat dispersion structure, and an unmanned aerial vehicle provided with the heat dispersion structure. The heat dispersion structure is used for dissipating heat from a substrate assembly (10) and a storage device (20). The heat dispersion structure comprises: a housing (1), used for accommodating the substrate assembly (10) and the storage device (20); and a heat dispersion fan (30), mounted on the housing (1) and supplying a heat dissipation air flow into the housing (1). A first accommodating space for accommodating the substrate assembly (10), a second accommodating space for accommodating the storage device (20) and a heat dissipation air duct for guiding heat dissipation air flows to flow through the first accommodating space and the second accommodating space are disposed in the housing (1). The heat dispersion fan drives air flows outside the housing to enter the heat dissipation air duct, so as to supply the heat dissipation air flows into the housing and guide, through the heat dissipation air duct, the heat dissipation air flows to flow through the substrate assembly accommodated in the first accommodating space and the storage device accommodated the second accommodating space, thereby achieving the effect for dissipating heat from the substrate assembly and the storage device at the same time.

Description

Heat dissipation structure and drone having the same

Technical field

The invention relates to the technical field of drones, in particular to a heat dissipation structure and a drone having the same.

Background technique

At present, high heat flux electronic products, such as drones and camera heads, are provided with a heat dissipation structure to dissipate heat from chips, storage or other heat dissipating components within the electronic product, thereby ensuring that the electronic product can operate normally. The traditional heat dissipation structure usually adopts a fan and a heat pipe, and the heat dissipation efficiency is low.

However, with the continuous improvement of technology, the requirements for UAV camera storage space and storage speed are getting higher and higher. Therefore, in the prior art, for example, a solid state drive (SSD) solution has been added to a drone to meet storage requirements. However, in the current UAV models, the SSD is located on the UAV camera pan/tilt assembly. Due to the slim shape of the SSD, plus the required heat dissipation structure of the SSD during operation, The entire camera pan/tilt assembly is oversized, affecting the overall appearance, and it is difficult to design a heat dissipation structure.

Summary of the invention

The invention provides a heat dissipation structure and a drone having the same.

According to a first aspect of the present invention, a heat dissipation structure is provided for dissipating heat from a substrate assembly and a storage device, including:

a housing for housing the substrate assembly and the storage device;

a heat dissipation fan mounted on the housing and providing a heat dissipation airflow into the housing;

The housing is provided with a first receiving space for receiving the substrate assembly, a second receiving space for receiving the storage device, and guiding the heat dissipation airflow through the first receiving space and the second receiving The cooling air duct of the space.

The heat dissipation structure, the substrate assembly and the storage device of the invention are housed together in the casing, which solves the defect that the existing UAV has an excessive volume and affects the overall appearance. The heat-dissipating fan drives the airflow outside the casing to enter the heat-dissipating air channel, and then provides a heat-dissipating airflow into the casing, and then guides the heat-dissipating airflow through the heat-dissipating air channel to flow through the substrate component received in the first receiving space and in the second receiving space. The storage device achieves the effect of simultaneously dissipating heat from the substrate assembly and the storage device of the electronic device.

According to a second aspect of the present invention, a drone is provided, including a heat dissipation structure, for dissipating heat from a substrate assembly and a storage device of the drone, the heat dissipation structure including:

a housing for housing the substrate assembly and the storage device;

The UAV of the present invention, the substrate assembly and the storage device are housed together in the casing, which solves the defect that the existing UAV has an excessive volume and affects the overall appearance. The heat-dissipating fan drives the airflow outside the casing to enter the heat-dissipating air channel, and then provides a heat-dissipating airflow into the casing, and then guides the heat-dissipating airflow through the heat-dissipating air channel to flow through the substrate component received in the first receiving space and in the second receiving space. The storage device achieves the effect of simultaneously dissipating heat from the substrate assembly and the storage device.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Other drawings may also be obtained from those of ordinary skill in the art in view of the drawings.

1 is a front view of a drone shown in an embodiment of the present invention.

2 is a perspective view of a drone according to an embodiment of the invention.

3 is an exploded perspective view of an unmanned aerial vehicle according to an embodiment of the present invention.

Figure 4 is a partial cross-sectional view of the drone shown in the embodiment of Figure 1.

Figure 5 is a cross-sectional view of the drone shown in the embodiment of Figure 1 taken along the line A-A.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. The following description refers to the same or similar elements in the different figures unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with aspects of the invention as detailed in the appended claims.

The terminology used in the present invention is for the purpose of describing particular embodiments, and is not intended to limit the invention. In the singular forms "a", "sai", And "the" is also intended to include a plurality of forms unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

The heat dissipation structure of the present invention and the unmanned aerial vehicle having the same will be described in detail below with reference to the accompanying drawings. The features of the embodiments and embodiments described below may be combined with each other without conflict.

Referring to Figures 1 to 5, Figure 1 is a front elevational view of a drone according to an embodiment of the present invention. 2 is a perspective view of a drone according to an embodiment of the invention. 3 is an exploded perspective view of an unmanned aerial vehicle according to an embodiment of the present invention. Figure 4 is a cross-sectional view of the drone shown in the embodiment of Figure 1 with half of the housing removed. Figure 5 is a cross-sectional view of the drone shown in the embodiment of Figure 1 taken along the line A-A. The electronic devices in the following embodiments all take a drone as an example.

The present invention provides a heat dissipating structure and a drone having the same. The heat dissipating structure is used for dissipating heat from the substrate assembly 10 and the storage device 20 of the drone. The heat dissipating structure will be described in detail below.

1 to 5, the heat dissipation structure of the present invention is used to dissipate heat from the substrate assembly 10 and the storage device 20 of the electronic device, including:

The housing 1 is configured to receive the substrate assembly 10 and the storage device 20, as shown in FIG. 3 and FIG. 4, the storage device 20 is located above the substrate assembly 10;

The cooling fan 30 is mounted on the housing 1 and provides a heat dissipation airflow into the housing 1;

The housing 1 is provided with a first receiving space for accommodating the substrate assembly 10, a second receiving space for accommodating the storage device 20, and guiding the heat-dissipating airflow through the first receiving space and the second receiving space. Cooling air duct.

The heat dissipation structure, the substrate assembly and the storage device of the invention are housed together in the casing, which solves the defect that the existing UAV has an excessive volume and affects the overall appearance. The airflow fan drives the airflow outside the casing to enter the heat dissipation air channel, thereby providing a heat dissipation airflow into the casing, and then guiding the heat dissipation airflow through the heat dissipation air channel. The substrate assembly accommodated in the first receiving space and the storage device housed in the second receiving space are configured to simultaneously dissipate heat from the substrate assembly and the storage device of the electronic device.

Referring to FIG. 2 to FIG. 5 again, the heat dissipation air channel includes: a first air channel 410 formed in the first receiving space and a second air channel 420 formed in the second receiving space. The housing 1 includes a bottom case 510, a bottom cover 520 that is disposed on the bottom case 510, and a mounting bracket 70 for mounting the storage device 20. The first receiving space is formed between the bottom case 510 and the bottom case 520, and the second receiving space is formed in the mounting bracket 70. The bottom case 510 is formed with a recessed receiving space. The substrate assembly 10 is disposed in the receiving space, and the bottom cover 520 is further disposed on the bottom case 510. It can be understood that the first air channel 410 is formed between the substrate assembly 10 and the bottom case 520, and the second air channel 420 is formed between the storage device 20 and the mounting bracket 70.

As shown in FIG. 3 , in one embodiment of the present invention, the substrate assembly 10 includes a substrate 100 and a shield 110 disposed on the substrate 100 . The first air channel 410 is formed between the shield 110 and the bottom cover 520 . . As shown in FIG. 5, in another embodiment of the present invention, the number of the second air ducts 420 is two, and a second air duct 420 is formed between the two side walls of the storage device 20 and the mounting bracket 70, respectively. Increase heat dissipation space and improve heat dissipation efficiency. Preferably, the substrate 100 of the substrate assembly 10 is a printed circuit board (Printed Circuit Board), and the storage device 20 is a solid state hard disk.

Further, the bottom cover 520 includes two sidewalls 522 respectively extending from the top wall 521 and the two sides of the top wall 521 respectively. It can be understood that the bottom cover 520 is disposed on the bottom casing 510, and the first air passage 410 is disposed. Formed between the top wall 521, the two side walls 522, and the substrate assembly 10. In addition, the top wall 521 of the bottom cover 520 is provided with a flow guiding port 523 for guiding the heat dissipation airflow from the first air channel 410 to the second air channel 420. Preferably, the bottom cover 520 further includes a guiding surface 524 extending downward to the substrate assembly 10, and the guiding surface 524 has a sloped surface, so that the heat dissipation airflow can be smoothly guided from the first air passage 410 to the flow opening 523, and further Lead to the second air duct 420.

In addition, the heat dissipation structure further includes: an air guiding cover 310 for receiving the heat dissipation fan 30, the first end of the air guiding cover 310 is connected to the substrate assembly 10, and the second end of the air guiding cover 310 is connected to the bottom case 510. The air guiding cover 310 is provided with an air guiding duct 430 that introduces the heat radiating airflow to the first air duct 410. Preferably, the air hood 310 is disposed at an inclined position. Accordingly, an inclined air guiding duct 430 is formed at the air outlet of the heat radiating fan 30, so that the heat radiating airflow can be better introduced into the first air duct 410. The housing 1 further includes a front cover 61 and a rear cover 62. The front cover 61 is provided with an air inlet 610. The air inlet 610 is disposed at the air inlet of the heat dissipation fan 30. The rear cover 62 is provided with an exhaust. Port 620, exhaust port 620 is in communication with the end of second air duct 420. The air inlet 610 and the air outlet 620 can enable convection of air inside and outside the casing 1.

Referring again to FIG. 2 and FIG. 3, in a specific embodiment of the present invention, the housing 1 is further provided with a connector 63 for connecting the storage device 20, and the connector 63 is disposed on the mounting bracket 70 near the front cover. The first end of 61. The second end of the mounting bracket 70 is provided with a card interface 710, and the rear cover 62 is latched to the card interface 710. The storage device 20 is inserted into the mounting bracket 70. In FIG. 2, the storage device 20 is in a semi-extracted state, and the rear cover 62 is provided with an insertion interface 621 for inserting the storage device 20 into the mounting bracket 70. After the rear case cover 62 is mounted to the card interface 710 of the mounting bracket 70, the storage device 20 can be freely inserted or withdrawn from the mounting bracket 70 through the insertion interface 621 of the rear case cover 62. Preferably, the mounting bracket 70 is a battery mounting bracket, and the battery connector 80 for connecting the battery is also provided in the housing 1. The battery mounting bracket also mounts the battery while also installing the storage device 20, which saves space and makes the appearance of the drone more beautiful.

As can be seen from FIG. 4 and FIG. 5, the airflow of the heat dissipation fan 30 driving the outside of the casing 1 enters the casing 1 through the air inlet 610 provided on the front casing cover 61 to form a heat dissipation airflow, and the heat dissipation airflow first passes through the air guiding duct. The 430 enters the first air channel 410 to dissipate heat from the substrate assembly 10 received in the first receiving space. Then, the heat dissipating air flow is guided from the first air channel 410 through the guiding surface 524 to the flow port 523 to further dissipate heat. The airflow enters the second air duct 420 to dissipate heat from the storage device 20 received in the second receiving space. Finally, the airflow is exhausted through the exhaust port 620 disposed on the rear cover 62 to complete the counter substrate. The heat dissipation process of assembly 10 and storage device 20. The flow direction of the heat dissipation airflow is shown by the direction of the arrow in the figure.

The invention also provides a drone comprising a heat dissipation structure, wherein the heat dissipation structure is used for The substrate assembly and the storage device of the human machine perform heat dissipation. It should be noted that the description about the heat dissipation structure in the embodiment described above is also applicable to the heat dissipation structure of the drone provided by the present invention.

The unmanned aerial vehicle provided by the invention adopts the above-mentioned heat dissipating structure, and the substrate assembly and the storage device are housed together in the casing, thereby solving the defect that the existing UAV has an excessive volume and affects the overall appearance. The heat-dissipating fan drives the airflow outside the casing to enter the heat-dissipating air channel, and then provides a heat-dissipating airflow into the casing, and then guides the heat-dissipating airflow through the heat-dissipating air channel to flow through the substrate component received in the first receiving space and in the second receiving space. The storage device achieves the effect of simultaneously dissipating heat from the substrate assembly and the storage device.

It should be noted that, in this context, relational terms such as first and second are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply such entities or operations. There is any such actual relationship or order between them. The terms "including", "comprising" or "comprising" or "comprising" are intended to include a non-exclusive inclusion, such that a process, method, article, or device that comprises a plurality of elements includes not only those elements but also other items not specifically listed Elements, or elements that are inherent to such a process, method, item, or device. An element that is defined by the phrase "comprising a ..." does not exclude the presence of additional equivalent elements in the process, method, item, or device that comprises the element.

The method and apparatus provided by the embodiments of the present invention are described in detail above. The principles and implementations of the present invention are described in the specific examples. The description of the above embodiments is only used to help understand the method of the present invention and At the same time, there will be changes in the specific embodiments and the scope of application according to the idea of the present invention, and the contents of the present specification should not be construed as limiting the present invention. .

The disclosure of this patent document contains material that is subject to copyright protection. This copyright is the property of the copyright holder. The copyright owner has no objection to the reproduction of the patent document or the patent disclosure in the official records and files of the Patent and Trademark Office.

Claims

A heat dissipation structure for dissipating heat from a substrate assembly and a storage device, comprising:

a housing for housing the substrate assembly and the storage device;

a heat dissipation fan mounted on the housing and providing a heat dissipation airflow into the housing;

The housing is provided with a first receiving space for receiving the substrate assembly, a second receiving space for receiving the storage device, and guiding the heat dissipation airflow through the first receiving space and the second receiving The cooling air duct of the space.
The heat dissipation structure according to claim 1, wherein the heat dissipation air channel comprises: a first air passage formed in the first receiving space; and a second air passage formed in the second receiving space .
The heat dissipation structure according to claim 2, wherein the housing comprises: a bottom case and a bottom cover disposed on the bottom case, wherein the first receiving space is formed in the bottom case and the bottom Between the bottom casings, and the substrate assembly is disposed on the bottom casing; the first air passage is formed between the substrate assembly and the bottom casing.
The heat dissipation structure according to claim 3, wherein the bottom cover comprises a top wall having a flow guiding opening; the flow guiding opening is configured to use the heat dissipation airflow from the first air passage Leading to the second air duct.
The heat dissipation structure according to claim 4, wherein the bottom cover further comprises a guiding surface extending downward to the substrate assembly; the guiding surface is for driving the heat dissipation airflow from the first wind The track is directed to the flow diversion port.
The heat dissipation structure according to claim 2, wherein the housing comprises a mounting bracket for mounting the storage device, the second receiving space is located in the mounting bracket; and the second air duct is formed on The storage device is interposed between the mounting bracket.
The heat dissipation structure according to claim 6, wherein the two air passages are two, respectively located between two side walls of the storage device and the mounting bracket.
The heat dissipation structure according to claim 6, wherein the mounting bracket is a battery mounting bracket.
The heat dissipation structure according to claim 2, wherein the housing is provided with an air inlet and an air outlet, the air inlet is disposed at the heat dissipation fan position, and the air outlet is The ends of the second air passage are connected.
The heat dissipation structure according to claim 9, wherein the housing further comprises a front cover and a rear cover, the air inlet is opened on the front cover, and the exhaust opening is opened in the Said on the back cover.
The heat dissipation structure according to claim 2, wherein the heat dissipation structure further comprises: an air hood that houses the heat dissipation fan; and the air hood is configured to introduce the heat dissipation airflow into the first wind The air duct of the road.
The heat dissipation structure according to claim 1, wherein the storage device is a solid state hard disk, and the substrate assembly comprises a circuit board.
An unmanned aerial vehicle, comprising: a heat dissipation structure for dissipating heat from a substrate assembly and a storage device of the drone, wherein the heat dissipation structure comprises:

a housing for housing the substrate assembly and the storage device;

a heat dissipation fan mounted on the housing and providing a heat dissipation airflow into the housing;

The housing is provided with a first receiving space for receiving the substrate assembly, a second receiving space for receiving the storage device, and guiding the heat dissipation airflow through the first receiving space and the second receiving The cooling air duct of the space.
The unmanned aerial vehicle according to claim 13, wherein the heat dissipation air passage comprises: a first air passage formed in the first receiving space; and a second air formed in the second receiving space Road.
The drone according to claim 14, wherein the housing comprises: a bottom case and a bottom cover that is disposed on the bottom case, the first receiving space is formed in the bottom case and Between the bottom casings, and the substrate assembly is disposed on the bottom casing; the first air passage is formed between the substrate assembly and the bottom casing.
The drone according to claim 15, wherein the bottom cover comprises a top wall having a flow guiding opening; the flow guiding opening is for driving the heat releasing airflow from the first wind The road leads to the second air duct.
The drone of claim 16 wherein said bottom cover further comprises a guide surface extending downwardly to said base assembly; said guide surface for said venting air flow from said first The air duct leads to the air inlet.
The drone according to claim 14, wherein the housing comprises a mounting bracket for mounting the storage device, the second receiving space is located in the mounting bracket; and the second air duct is formed Between the storage device and the mounting bracket.
The drone according to claim 18, wherein the two air passages are two, respectively located between the two side walls of the storage device and the mounting bracket.
The air conditioner according to claim 14, wherein the heat dissipation structure further comprises: an air hood that houses the heat dissipation fan; and the air hood is configured to introduce the heat dissipation airflow to the first Air duct of the duct.