WO2018036035A1 - 一种具有温度补偿的无热阵列波导光栅及其制作方法 - Google Patents

一种具有温度补偿的无热阵列波导光栅及其制作方法 Download PDF

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WO2018036035A1
WO2018036035A1 PCT/CN2016/110668 CN2016110668W WO2018036035A1 WO 2018036035 A1 WO2018036035 A1 WO 2018036035A1 CN 2016110668 W CN2016110668 W CN 2016110668W WO 2018036035 A1 WO2018036035 A1 WO 2018036035A1
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bottom plate
chip
plate portion
waveguide grating
arrayed waveguide
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PCT/CN2016/110668
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English (en)
French (fr)
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徐来
凌九红
吴凡
胡家艳
张冀
何俊刚
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武汉光迅科技股份有限公司
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12019—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes
    • G02B6/12021—Comprising cascaded AWG devices; AWG multipass configuration; Plural AWG devices integrated on a single chip
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
    • G02B6/12028—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence based on a combination of materials having a different refractive index temperature dependence, i.e. the materials are used for transmitting light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
    • G02B6/1203—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients

Definitions

  • the present invention relates to an optical communication device, and in particular to a temperature-compensated Athermal Arrayed Wavelength Gratings (AAWG or AWG-free) and a method for fabricating the same, and the present invention belongs to the field of communications.
  • AAWG Athermal Arrayed Wavelength Gratings
  • the WDM (Wavelength Division Multiplexing) system is the most common optical layer networking system, and realizes multi-channel signal transmission through multiplexing and demultiplexing.
  • An AWG (Arrayed Wavelength Grating) based on PLC (Planar Lightwave Circuit) technology is an important implementation of multiplexing/demultiplexing devices in WDM systems.
  • the waveguide refractive index of the silicon-based silicon dioxide waveguide AWG chip is sensitive to temperature. When the temperature of the working environment changes, the wavelength of the center of the response spectrum of the AWG chip changes, which is basically linear, and the wavelength of the center wavelength drifts with temperature. At about 0.011 nm/°C, this AWG is not suitable for DWDM systems with 100 GHz wavelength spacing or narrower spacing.
  • AWG Thermal AWG
  • the athermal AWG does not use a heater chip and a temperature control circuit, and relies on its own special material structure or mechanical structure to achieve the purpose that the center wavelength of the AWG spectrum does not change with the temperature of the working environment.
  • the commercial athermal AWG is roughly divided into two types, one is to fill a polymer material in the chip waveguide region, The direction of change of the refractive index of the material with respect to the direction of temperature change is opposite to the direction of change of the refractive index of the silica, thereby counteracting the temperature sensitivity of the chip itself, such as the technical solution used in US Pat. No. 6,304,687.
  • the disadvantage of this method is that the AWG chip requires special design and processing, the traditional AWG chip is not suitable, and suitable polymer materials are difficult to obtain.
  • Another solution is a heat-free AWG that relies on a mechanical structure to achieve temperature compensation.
  • the implementation principle is: cutting at the input plane waveguide of the AWG chip, separating the chip into two parts, connecting the input waveguide portion with a metal compensation rod, or using an optical fiber. Instead of the input waveguide, the relative position of the two parts of the chip is changed under the driving of the thermal expansion and contraction of the metal compensating rod to compensate for the drift of the wavelength with temperature.
  • This embodiment has many embodiments, such as the technical solution used in US Pat. No. 6,826,332. Since the AWG chip waveguide is micron-sized and the wavelength is highly sensitive to the relative position of the two parts of the chip, this solution has extremely high requirements on the process in every detail.
  • the object of the present invention is to overcome the defects of the existing mechanical structure, to provide a heatless arrayed waveguide grating capable of realizing temperature compensation, and a manufacturing method thereof, comprising: a bottom plate and an arrayed waveguide grating chip disposed on the bottom plate and temperature compensation a bottom plate comprising a first bottom plate portion and a second bottom plate portion, the first bottom plate portion and the second bottom plate portion being connected by an elastic member;
  • the thermal expansion coefficient of the temperature compensating member is different from the bottom plate, and both ends of the temperature compensating member are fixedly coupled to the first bottom plate portion and the second bottom plate portion, respectively, such that the first bottom plate portion and the second bottom plate
  • the portion is capable of being driven by the temperature compensating member such that the two are in parallel relative displacement in a plane in which the bottom plate is located;
  • the arrayed waveguide grating chip is cut into a first chip portion and a second chip portion that are movable to each other, and the first chip portion and the second chip portion are respectively fixed on the first bottom plate portion and the second bottom plate portion.
  • At least one flat bottom plate slit is disposed between the first bottom plate portion and the second bottom plate portion; and a chip slit is disposed between the first chip portion and the second chip portion.
  • the chip slit is aligned in parallel with one of the bottom plate slits, and the elastic member is disposed at both ends of the bottom plate slit or the chip slit is disposed at a position above one of the elastic members.
  • the first chip portion includes an input waveguide of the arrayed waveguide grating chip and a portion of the input free waveguide;
  • the second chip portion includes an output waveguide of the arrayed waveguide grating chip, an output free waveguide, and an array The waveguide and the remaining input free waveguide; and a portion of the first chip portion input free waveguide and the remaining input free waveguide of the second chip portion are spaced apart from each other by the chip slit.
  • the chip slit is less than or equal to 30 um.
  • the chip slits are filled with a material having a refractive index matching the waveguide refractive index of the arrayed waveguide grating chip.
  • the temperature compensating member is a temperature compensating rod, and the temperature compensating rod passes through the through hole of the elastic member such that the first bottom plate portion and the second bottom plate portion do not occur perpendicular to the Relative displacement in the direction of the bottom plate.
  • the temperature compensating member is a temperature compensating rod
  • the elastic members are symmetrically disposed along the longitudinal direction of the temperature compensating rod so that the first bottom plate portion and the second bottom plate portion do not perpendicular to the The relative displacement in the direction of the bottom plate.
  • the elastic member is an arcuate spring structure.
  • the central wavelength of the athermal arrayed waveguide grating varies from -40 to +40 picometers in an ambient temperature variation interval of -20 to +70 degrees Celsius.
  • the present invention also provides a method of fabricating a temperature-compensated athermal arrayed waveguide grating, comprising the steps of:
  • the bottom plate comprising a first bottom plate portion and a second bottom plate portion, the first bottom plate portion and the second bottom plate portion being connected by an elastic member, at least one piece being disposed between the first bottom plate portion and the second bottom plate portion Straight bottom plate slit;
  • An arrayed waveguide grating chip is fixedly disposed on the bottom plate, and the arrayed waveguide grating core is The input free waveguide of the chip is disposed on one of the bottom plate slits;
  • Two ends of the temperature compensating member having a thermal expansion coefficient different from the bottom plate are fixedly coupled to the first bottom plate portion and the second bottom plate portion, respectively, such that the first bottom plate portion and the second bottom plate portion can be at the temperature compensating member
  • the driving causes the two to have parallel relative displacements in the plane in which the bottom plate is located.
  • the AWG chip is basically intact, and the two parts are bonded to the same bottom plate to avoid relative displacement in the direction perpendicular to the metal base plate, which greatly reduces the risk of loss variation; since the bottom plate structure can be made thicker, It is not easy to be affected by external forces and the AWG indicator changes.
  • the center wavelength of the AWG can be fine-tuned when the center wavelength of the AWG changes after packaging, so that the wavelength meets the product requirements and the yield is improved.
  • the technical solution of the invention has the advantages of low cost and simple process.
  • FIG. 1 is a schematic view showing the structure of a heatless arrayed waveguide grating according to a first embodiment of the present invention
  • FIG. 2 is a schematic view showing the structure of the athermal array waveguide grating according to the second embodiment of the present invention when warming from room temperature a partial schematic diagram of the deformation;
  • FIG. 1 is a schematic view showing the structure of a heatless arrayed waveguide grating according to a first embodiment of the present invention.
  • the arrayed waveguide grating chip 101 is fixed on a metal base plate 105.
  • the arrayed waveguide grating chip 101 includes an arrayed waveguide grating chip first portion 102 and an arrayed waveguide grating chip second portion 103.
  • the first portion 102 and the second portion 103 of the arrayed waveguide grating chip 101 can be cut by cutting the existing arrayed waveguide grating chip.
  • the first portion 102 of the arrayed waveguide grating chip includes an input waveguide and a portion of the input free waveguide
  • the second portion 103 of the arrayed waveguide grating chip includes a residual input free waveguide, an arrayed waveguide, an output free waveguide, and an output waveguide.
  • a portion of the input free waveguide of the first portion 102 of the arrayed waveguide grating chip is aligned with the remaining input free waveguides of the second portion 103 of the arrayed waveguide grating chip.
  • the metal base plate 105 may be cut from a unitary metal plate or may be spliced into a unit by a plurality of components.
  • the metal plate 105 is roughly divided into two parts after being formed, that is, the first portion 106 and the second portion 107.
  • a straight slit 108 is disposed between the first portion 106 and the second portion 107, and at both ends of the straight slit 108, the first portion 106 and the second portion 107 are comprised of two spring or shrapnel structures 109 and 110 phase connection.
  • the spring structure can be formed into an arcuate structure as shown in FIG.
  • the metal substrate 105 may select a metal material similar to the silicon expansion coefficient, such as indium steel, kovar, etc., so as to avoid stress in the high and low temperature environment, causing the array waveguide grating.
  • the chip 101 is broken.
  • the two portions 102, 103 of the arrayed waveguide grating chip 101 are respectively adhered to the two portions 106, 107 corresponding to the corresponding positions of the metal base plate 105, and the silicone expansion of the array waveguide grating chip 101 and the metal base plate 105 may be selected, and the colloid is cured. After that, it is not suitable to be too hard, and the array waveguide grating chip 101 is not damaged due to the stress caused by the temperature change, and the arrayed waveguide grating chip 101 is more likely to be displaced from the metal substrate 105.
  • the input free waveguide of the arrayed waveguide grating chip 101 is cut and divided at a corresponding position of the slit 108 on the metal base plate 105, so that the arrayed waveguide grating
  • the first portion 102 of the chip is separated from the second portion 103 of the arrayed waveguide grating chip into two relatively independent portions that are capable of relative displacement.
  • the first portion 102 and the second portion 103 of the arrayed waveguide grating chip 101 are cut to have a slit 104, and the slit 104 is completely parallel with the flat slit 108 between the first portion 106 of the metal substrate and the second portion 107 of the metal substrate. And just above it.
  • the slit 104 between the two portions 102, 103 of the arrayed waveguide grating chip 101 should be as narrow as possible, such as 30 um or less.
  • a material having a refractive index matching the waveguide index of the arrayed waveguide grating chip 101 may be added to the slit 104 to further reduce optical loss at the slit 104.
  • the refractive index is close to 1.45.
  • the axial position and the straight portion of the line thereof are provided with through holes, and the temperature compensating rod 111 penetrates the through hole, one end of which is fixed to the first portion 106 of the metal base plate 105, and the other end is fixed at the other end.
  • the second portion 107 of the metal base plate 105 can be fixed by means of thread locking, adhesive curing or welding, or can be combined and fixed in various other ways.
  • Thermal expansion of temperature compensation rod 111 The expansion coefficient is different from the metal base plate 105, and is preferably larger than the thermal expansion coefficient of the metal base plate 105, and aluminum alloy, copper, stainless steel, or the like may be selected.
  • the distance between the spring structures 109 and 110 in the metal base plate 105 and the slits 104 after the fixed slit of the arrayed waveguide grating chip 101 should be minimized. The closer the distance is, the stronger the binding force to the longitudinal offset between the first portion 102 of the arrayed waveguide grating chip and the second portion 103 of the arrayed waveguide grating chip, and the more stable the reliability.
  • the metal base plate 205 may be cut from a unitary metal plate or may be spliced into a unit by a plurality of components.
  • the metal plate 205 is formed into two parts after the molding, that is, the first portion 206 and the second portion 207. There are straight slits 208 between the two portions 206, 207, and are connected by four spring or shrapnel structures 209, 210, 212, 213, wherein the spring structures 209 and 210 are symmetric with respect to the temperature compensating rod 211, the spring structure 212 and 213 are positionally symmetrical with respect to the temperature compensating rod 211.
  • the spring structure can be made into an arcuate structure as shown in Fig. 2, and other structures similar to this function can be made.
  • the entire metal base plate 205 is structurally integral.
  • An advantage of such an embodiment is that while the parallel movement is achieved structurally, a spring structure 209 is connected between the first portion 102 of the arrayed waveguide grating chip and the second portion 103 of the arrayed waveguide grating chip, further constraining the possibility of occurrence in the longitudinal direction.
  • the displacement and stability are greatly improved, that is, by disposing the slit 104 of the arrayed waveguide grating chip 101 above the spring structure 209, the displacement perpendicular to the direction of the metal base plate 205 can be better constrained and the metal can be better constrained.
  • the invention adopts a single integral bottom plate in structure, has simple processing and high surface flatness, and the arrayed waveguide grating chip is fixed on the bottom plate and does not need to be aligned again after being cut. Thereby, the risk of increased optical loss caused by poor alignment coupling is reduced, and the product qualification rate is greatly improved.
  • the spring structure is in a symmetrical state with respect to the temperature compensating rod, that is, the temperature compensating rod is symmetrically designed on both sides of the temperature compensating rod through the spring structure axis or the spring structure, so that the temperature compensating rod drives the two parts of the arrayed waveguide grating chip in the case of temperature change.
  • the movement still belongs to parallel movement.
  • the compensation effect will be nonlinear under the extreme temperature conditions, and the index will be degraded, and the stress of the substrate will be greatly increased at this time, due to the current array waveguide.
  • the grating chip is becoming more and more miniaturized, and the hidden dangers caused by the existing defects of the rotating mobile structure are becoming more and more obvious, and the parallel movement scheme adopted by the present invention solves this problem.
  • the center wavelength of the temperature-compensated arrayed waveguide grating has a range of -520 to +520 picometers in the ambient temperature range of -20 to +70 degrees Celsius, and the present invention provides no heat.
  • the center wavelength of the arrayed waveguide grating varies from -40 to +40 micrometers, which is a good compensation for environmental temperature changes.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

一种具有温度补偿的无热阵列波导光栅及其制作方法，该无热阵列波导光栅包括底板(105，205)、阵列波导光栅芯片(101)和温度补偿部件(111，211)；所述包括第一底板部分(106，206)和第二底板部分(107，207)；所述温度补偿部件(111，211)使得组成底板(105，205)的第一底板部分(106，206)和第二底板部分(107，207)能够在所述底板(105，205)所处平面内发生平行的相对位移；所述阵列波导光栅芯片(101)被切割为能够相互移动的第一芯片部分(102)和第二芯片部分(103)，所述第一芯片部分(102)和第二芯片部分(103)分别固定在所述第一底板部分(106，206)和第二底板部分(107，207)上。从而避免在垂直于底板(105，205)方向上相对位移，大大降低了损耗变化的风险，且具有插入损耗低、可以实现高斯或平坦型光谱、可以使用常规用于有热AWG封装的AWG芯片的特点。

Description

一种具有温度补偿的无热阵列波导光栅及其制作方法 技术领域
本发明涉及一种光通信器件，具体涉及一种实现温度补偿的无热阵列波导光栅(Athermal Arrayed Wavelength Gratings，简称AAWG或无热AWG)及其制作方法，本发明属于通信领域。
背景技术
WDM(Wavelength Division Multiplexing波分复用)系统是当前最常见的光层组网系统，通过复用与解复用实现多路信号传输。基于PLC(Planar Lightwave Circuit，平面光波线路)技术的AWG(Arrayed Wavelength Grating，阵列波导光栅)是WDM系统中一种重要的实现复用/解复用器件。但是硅基二氧化硅波导AWG芯片，其波导折射率对于温度比较敏感，当工作环境温度发生变化时，AWG芯片响应光谱中心波长会随之发生改变，基本呈线性关系，中心波长随温度的漂移约为0.011nm/℃，对于100GHz波长间隔或间隔更窄的DWDM系统而言，这种AWG是不适用的。为了将AWG的中心波长固定在目标值，不受工作环境温度的影响，一种方法是使用加热片和温控电路将芯片温度固定在比工作环境温度高的某一恒定值，称为有热AWG(Thermal AWG)。但这样做会相应增加了系统功耗，并需预留供电接口和监控接口，限制了使用的灵活性。
无热AWG则不使用加热片和温控电路，依靠自身的特殊材料结构或机械结构来实现AWG光谱中心波长不随工作环境温度变化而变化的目的。目前商用无热AWG大致分为两种方案，一种是在芯片波导区域填充一段高分子材料， 该材料折射率相对温度变化方向与二氧化硅折射率变化方向相反，从而抵消芯片本身的温度敏感性，如美国专利US 6304687所使用的技术方案。这种方法不足之处在于AWG芯片需要特殊设计和工艺处理，传统AWG芯片并不适用，且合适的高分子材料难以获得。另一方案即依靠机械结构来实现温度补偿的无热AWG，其实现原理是：在AWG芯片输入平面波导处切割，将芯片分离为两部分，用金属补偿杆连接输入波导部分，或者可以用光纤代替输入波导，在金属补偿杆热胀冷缩的驱动下改变芯片两部分相对位置来补偿波长随温度的漂移，这种方案具体实施方式很多，如美国专利US6826332所使用的技术方案。由于AWG芯片波导尺寸是微米级，且波长对于芯片两部分相对位置高度敏感，因此这种方案在各细节上都对工艺有极高要求。
发明内容
本发明的目的在于克服现有机械结构存在的缺陷，提供一种可以实现温度补偿的无热阵列波导光栅及其制作方法，包括：底板和设置在所述底板上的阵列波导光栅芯片和温度补偿部件；所述底板包括第一底板部分和第二底板部分，所述第一底板部分和第二底板部分通过弹性部件连接；
所述温度补偿部件的热膨胀系数与所述底板不同，并且所述温度补偿部件的两端分别与所述第一底板部分和第二底板部分固定连接，使得所述第一底板部分和第二底板部分能够在所述温度补偿部件的驱动下使得两者在所述底板所处平面内发生平行的相对位移；
所述阵列波导光栅芯片被切割为能够相互移动的第一芯片部分和第二芯片部分，所述第一芯片部分和第二芯片部分分别固定在所述第一底板部分和第二底板部分上。
在上述技术方案中，所述第一底板部分和第二底板部分之间设置有至少一条平直的底板狭缝；所述第一芯片部分和第二芯片部分之间具有芯片狭缝，所 述芯片狭缝与所述底板狭缝之一相平行对齐，并且该底板狭缝两端设置有所述弹性部件或者该芯片狭缝设置在其中一个所述弹性部件的上方位置处。
在上述技术方案中，所述第一芯片部分包括所述阵列波导光栅芯片的输入波导和一部分输入自由波导；所述第二芯片部分包括所述阵列波导光栅芯片的输出波导、输出自由波导、阵列波导和剩余输入自由波导；并且所述第一芯片部分的一部分输入自由波导与所述第二芯片部分的剩余输入自由波导之间间隔所述芯片狭缝相互对准。
在上述技术方案中，所述芯片狭缝小于等于30um。
在上述技术方案中，所述芯片狭缝之间填充有折射率与所述阵列波导光栅芯片的波导折射率匹配的材料。
在上述技术方案中，所述温度补偿部件为温度补偿杆，所述温度补偿杆从所述弹性部件的通孔中穿过，使得第一底板部分和第二底板部分不会发生垂直于所述底板方向上的相对位移。
在上述技术方案中，所述温度补偿部件为温度补偿杆，所述弹性部件沿所述温度补偿杆的长度方向两两对称设置，使得第一底板部分和第二底板部分不会发生垂直于所述底板方向上的相对位移。
在上述技术方案中，弹性部件为弓形的弹簧结构。
在上述技术方案中，在-20～+70摄氏度的环境温度变化区间内，所述无热阵列波导光栅的中心波长变化范围为-40～+40皮米。
本发明还提供一种制作具有温度补偿的无热阵列波导光栅的方法，包括步骤：
制作底板，所述底板包括第一底板部分和第二底板部分，所述第一底板部分和第二底板部分通过弹性部件连接，所述第一底板部分和第二底板部分之间设置有至少一条平直的底板狭缝；
将阵列波导光栅芯片固定设置在所述底板上，并且将所述阵列波导光栅芯 片的输入自由波导设置于其中一条底板狭缝之上；
沿该底板狭缝从所述阵列波导光栅芯片的输入自由波导的位置将所述阵列波导光栅芯片切割为能够相互移动的第一芯片部分和第二芯片部分，所述第一芯片部分和第二芯片部分分别固定在所述第一底板部分和第二底板部分上；
将热膨胀系数与所述底板不同的温度补偿部件的两端分别与所述第一底板部分和第二底板部分固定连接，使得所述第一底板部分和第二底板部分能够在所述温度补偿部件的驱动下使得两者在所述底板所处平面内发生平行的相对位移。
本发明取得了以下技术效果：
1、无需对AWG芯片进行加热，可以依靠自身的机械结构保证其中心波长基本不随环境温度的变化而变化，且具有插入损耗低、可以实现高斯或平坦型光谱、可以使用常规用于有热AWG封装的AWG芯片的特点。
2、AWG芯片基本保持完整，切分两部分粘接于同一块底板上，从而避免在垂直于金属底板方向上相对位移，大大降低了损耗变化的风险；因为底板结构可以做得比较厚，故不易受外力作用导致AWG指标发生变化。
3、芯片两部分相互之间采用平行移动方式，在工作温度范围过大的情况下不会出现底板应力过大和旋转角度的非线性增加。
4、可以在封装后当AWG中心波长发生变化时对AWG的中心波长进行微调，从而使得其波长符合产品要求，提高成品率。
5、本发明技术方案具有成本低、工艺简单的优点。
附图说明
图1、本发明第一种实施例的无热阵列波导光栅结构示意图；
图2、本发明第二种实施例的无热阵列波导光栅结构示意图从室温升温时 发生形变的局部示意图；
图3、未做温度补偿的阵列波导光栅器件与本发明中心波长随环境温度的变化曲线对比。
具体实施方式
为了便于本领域普通技术人员理解和实施本发明，下面结合附图及具体实施方式对本发明作进一步的详细描述。
图1是本发明第一种实施例的无热阵列波导光栅的结构示意图。如图1所示，阵列波导光栅芯片101固定在金属底板105上。阵列波导光栅芯片101包括阵列波导光栅芯片第一部分102和阵列波导光栅芯片第二部分103，阵列波导光栅芯片101的第一部分102和第二部分103可以通过将现有的阵列波导光栅芯片进行切割来获得，优先选择在现有的阵列波导光栅芯片的输入自由波导部分进行切割将其分割成能够相互独立移动的两个部分102、103。其中，阵列波导光栅芯片第一部分102包含输入波导和一部分输入自由波导，阵列波导光栅芯片第二部分103包含剩余输入自由波导、阵列波导、输出自由波导和输出波导。阵列波导光栅芯片第一部分102的一部分输入自由波导与阵列波导光栅芯片第二部分103的剩余输入自由波导相互对准。
金属底板105可由一块整体的金属板切割而成，也可由多个组件拼接成一整体。金属板105加工成型后大致分为两个部分，即第一部分106和第二部分107。第一部分106和第二部分107这两部分之间设置有平直的狭缝108，且在平直的狭缝108两端，第一部分106和第二部分107由两个弹簧或弹片结构109和110相连接。弹簧结构可制成如图1所示的弓形结构，也可制成其他类似具有该功能的结构，使得整个金属底板105在结构上是一个整体，而金属底板105 的第一部分106和第二部分107之间又可相对位移。对于衬底是硅的传统阵列波导光栅芯片101，金属底板105在材料上可选择与硅膨胀系数接近的金属材料，如铟钢、可伐等，以免在高低温环境下产生应力造成阵列波导光栅芯片101破损。
阵列波导光栅芯片101的两部分102、103分别粘贴固定在金属底板105对应位置的两部分106、107上，可选用膨胀系数与阵列波导光栅芯片101和金属底板105相似的硅胶粘接，胶体固化后不宜过硬，避免因温度变化所产生的应力导致阵列波导光栅芯片101破损，也不宜过软，使阵列波导光栅芯片101较容易产生与金属底板105的错位移动。
优先选择将未切割分开的阵列波导光栅芯片101整体与金属底板105固定后，在金属底板105上的狭缝108对应位置处对阵列波导光栅芯片101的输入自由波导进行切断分割，使得阵列波导光栅芯片第一部分102与阵列波导光栅芯片第二部分103分开，成为两个相对独立的、可产生相对位移的两部分。阵列波导光栅芯片101切割产生的第一部分102和第二部分103之间具有狭缝104，狭缝104与金属底板第一部分106和金属底板第二部分107之间的平直狭缝108完全平行，且在其正上方。为了减少切缝带来的光学损耗，阵列波导光栅芯片101两部分102、103之间的狭缝104应尽量窄，比如30um或更小。可在狭缝104中添加折射率与阵列波导光栅芯片101的波导折射率匹配的材料，进一步减小狭缝104处的光学损耗。该折射率接近1.45。
在金属底板105弹簧结构109和110中轴位置以及其连线的直线部分打有通孔，温度补偿杆111穿入通孔，其一端固定在金属底板105的第一部分106上，另一端固定在金属底板105的第二部分107上，固定方式可用螺纹锁紧、粘胶固化或焊接，也可以采用其他多种方式结合固定。温度补偿杆111的热膨 胀系数与金属底板105不同，优选大于金属底板105的热膨胀系数，可选用铝合金、铜、不锈钢等。
应尽量减少金属底板105中的弹簧结构109和110与阵列波导光栅芯片101固定切缝后的狭缝104的距离。距离越近则对阵列波导光栅芯片第一部分102与阵列波导光栅芯片第二部分103之间纵向偏移的束缚力越强，可靠性越稳定。
图2是本发明另一种实施例的无热阵列波导光栅的结构示意图。金属底板205可由一块整体的金属板切割而成，也可由多个组件拼接成一整体。金属板205加工成型后分为两个部分，即第一部分206和第二部分207。两部分206、207之间有平直的狭缝208，且由4个弹簧或弹片结构209、210、212、213相连接，其中弹簧结构209和210相对于温度补偿杆211位置对称，弹簧结构212和213相对于温度补偿杆211位置对称。弹簧结构可制成如图2所示的弓形结构，也可制成其他类似具有该功能的结构。整个金属底板205在结构上是一个整体。
这种实施例的优点在于，在结构上实现平行移动的同时，阵列波导光栅芯片第一部分102与阵列波导光栅芯片第二部分103之间有弹簧结构209连接，进一步地束缚了纵向上可能出现的位移，稳定性得到很大提高，即通过将阵列波导光栅芯片101的狭缝104设置于弹簧结构209的上方，能够更好地约束垂直于金属底板205方向上的位移以及更好地约束了金属底板205两个部分206、207之间可能发生的翻转。
本发明相对于其他的平行移动方案无热阵列波导光栅而言，在结构上采用单一整体的底板，加工简单，表面平面度高，阵列波导光栅芯片固定在底板上切分后无需再次对准，从而降低了对准耦合不佳造成光学损耗增大的风险，大大提高产品合格率。相对于其他的单一整体底板方案无热阵列波导光栅而言， 弹簧结构相对温度补偿杆处于对称状态，即温度补偿杆穿过弹簧结构轴心或弹簧结构在温度补偿杆两侧对称设计，使得在温度变化的情况下温度补偿杆带动阵列波导光栅芯片两部分相对移动仍属于平行移动。而在现有的一些旋转移动方案中，如果工作温度范围过宽，将导致在极限温度情况下补偿效果产生非线性，带来指标劣化，而且此时底板应力也会大大增加，由于目前阵列波导光栅芯片越来越小型化，现有的这种旋转移动结构缺陷带来的隐患会越来越明显，而本发明采用的平行移动方案则解决了这一问题。
图3示出了未做温度补偿的阵列波导光栅器件与本发明所提供的无热阵列波导光栅器件的中心波长随环境温度的变化曲线对比。以24摄氏度室温为基准，在-20～+70摄氏度的环境温度变化区间，未做温度补偿的阵列波导光栅器件的中心波长变化范围为-520～+520皮米，本发明所提供的无热阵列波导光栅器件的中心波长变化范围为-40～+40皮米，很好地实现了对环境温度变化的补偿。
虽然本发明已经详细地示出并描述了相关的特定的实施例参考，但本领域的技术人员能够应该理解，在不背离本发明的精神和范围内可以在形式上和细节上作出各种改变。这些改变都将落入本发明的权利要求所要求的保护范围。

Claims (10)

  1. 一种具有温度补偿的无热阵列波导光栅，包括：底板(105，205)和设置在所述底板(105，205)上的阵列波导光栅芯片(101)和温度补偿部件(111，211)，其特征在于：
    所述底板(105，205)包括第一底板部分(106，206)和第二底板部分(107，207)，所述第一底板部分(106，206)和第二底板部分(107，207)通过弹性部件(109，110，209、210、212、213)连接；
    所述温度补偿部件(111，211)的热膨胀系数与所述底板(105，205)不同，并且所述温度补偿部件(111，211)的两端分别与所述第一底板部分(106，206)和第二底板部分(107，207)固定连接，使得所述第一底板部分(106，206)和第二底板部分(107，207)能够在所述温度补偿部件(111，211)的驱动下使得两者在所述底板(105，205)所处平面内发生平行的相对位移；
    所述阵列波导光栅芯片被切割为能够相互移动的第一芯片部分(102)和第二芯片部分(103)，所述第一芯片部分(102)和第二芯片部分(103)分别固定在所述第一底板部分(106，206)和第二底板部分(107，207)上。
  2. 如权利要求1所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：所述第一底板部分(106，206)和第二底板部分(107，207)之间设置有至少一条平直的底板狭缝(108，208)；所述第一芯片部分(102)和第二芯片部分(103)之间具有芯片狭缝(104)，所述芯片狭缝(104)与所述底板狭缝(108，208)之一相平行对齐，并且该底板狭缝(108，208)两端设置有所述弹性部件(109，110)或者该芯片狭缝(104)设置在其中一个所述弹性部件(209)的上方位置处。
  3. 如权利要求2所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：所述第一芯片部分(102)包括所述阵列波导光栅芯片(101)的输入波导和一部分输入自由波导；所述第二芯片部分(103)包括所述阵列波导光栅芯片(101)的输出波导、输出自由波导、阵列波导和剩余输入自由波导；并 且所述第一芯片部分(102)的一部分输入自由波导与所述第二芯片部分(103)的剩余输入自由波导之间间隔所述芯片狭缝(104)相互对准。
  4. 如权利要求2-3中任一项所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：所述芯片狭缝(104)小于等于30um。
  5. 如权利要求2-4中任一项所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：所述芯片狭缝(104)之间填充有折射率与所述阵列波导光栅芯片(101)的波导折射率匹配的材料。
  6. 如权利要求1-5中任一项所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：所述温度补偿部件(111)为温度补偿杆，所述温度补偿杆从所述弹性部件(109，110)的通孔中穿过，使得第一底板部分(106)和第二底板部分(107)不会发生垂直于所述底板(105)方向上的相对位移。
  7. 如权利要求1-5中任一项所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：所述温度补偿部件(111)为温度补偿杆，所述弹性部件(209，210，212，213)沿所述温度补偿杆的长度方向两两对称设置，使得第一底板部分(206)和第二底板部分(207)不会发生垂直于所述底板(205)方向上的相对位移。
  8. 如权利要求1-7中任一项所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：弹性部件(109，110，209、210、212、213)为弓形的弹簧结构。
  9. 如权利要求1-8中任一项所述的一种具有温度补偿的无热阵列波导光栅，其特征在于：在-20～+70摄氏度的环境温度变化区间内，所述无热阵列波导光栅的中心波长变化范围为-40～+40皮米。
  10. 一种制作具有温度补偿的无热阵列波导光栅的方法，其特征在于包括步骤：
    制作底板(105，205)，所述底板(105，205)包括第一底板部分(106， 206)和第二底板部分(107，207)，所述第一底板部分(106，206)和第二底板部分(107，207)通过弹性部件(109，110，209、210、212、213)连接，所述第一底板部分(106，206)和第二底板部分(107，207)之间设置有至少一条平直的底板狭缝(108，208)；
    将阵列波导光栅芯片(101)固定设置在所述底板(105，205)上，并且将所述阵列波导光栅芯片(101)的输入自由波导设置于其中一条底板狭缝(108，208)之上；
    沿该底板狭缝(108，208)从所述阵列波导光栅芯片(101)的输入自由波导的位置将所述阵列波导光栅芯片(101)切割为能够相互移动的第一芯片部分(102)和第二芯片部分(103)，所述第一芯片部分(102)和第二芯片部分(103)分别固定在所述第一底板部分(106，206)和第二底板部分(107，207)上；
    将热膨胀系数与所述底板(105，205)不同的温度补偿部件(111，211)的两端分别与所述第一底板部分(106，206)和第二底板部分(107，207)固定连接，使得所述第一底板部分(106，206)和第二底板部分(107，207)能够在所述温度补偿部件(111，211)的驱动下使得两者在所述底板(105，205)所处平面内发生平行的相对位移。
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